Display substrate and display device

Abstract

A display substrate and a display device, relating to the technical field of display. The display substrate comprises: a base substrate, and a display area and a non-display area that are arranged on one side of the base substrate; the display area comprises a plurality of micro-cavity cushion layers which are stacked, the plurality of micro-cavity cushion layers including a first micro-cavity cushion layer and a second micro-cavity cushion layer, and the non-display area at least comprises the first micro-cavity cushion layer but does not comprise the second micro-cavity cushion layer, wherein the display area comprises first sub-pixels, second sub-pixels and third sub-pixels that are used for emitting light of different colors; the total thickness of the micro-cavity cushion layers in each first sub-pixel is d1; the total thickness of the micro-cavity cushion layers in each second sub-pixel is d2; the total thickness of the micro-cavity cushion layer in each third sub-pixel is d3; the total thickness of the micro-cavity cushion layers in the non-display area is h; the thickness of the second micro-cavity cushion layer is h2; and the variance value of the array (d1, d2, d3, h) is smaller than the variance value of the array (d1, d2, d3, h+h2).

Description

Display substrate and display device

[0001] Cross-reference to related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202410683392.X, filed on May 29, 2024, entitled “Display Substrate and Display Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0004] Organic light-emitting diodes (OLEDs) are active-matrix display devices that offer advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, wide color gamut, thinness, and customizability.

[0005] Overview

[0006] This disclosure provides a display substrate, including:

[0007] The substrate and a display area and a non-display area disposed on one side of the substrate, the display area including a plurality of microcavity pads stacked together, the plurality of microcavity pads including a first microcavity pad and a second microcavity pad, the non-display area including at least the first microcavity pad and excluding the second microcavity pad;

[0008] The display area includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel, the second sub-pixel, and the third sub-pixel are used to emit light of different colors. The total thickness of the microcavity pad in the first sub-pixel is d1, the total thickness of the microcavity pad in the second sub-pixel is d2, the total thickness of the microcavity pad in the third sub-pixel is d3, the total thickness of the microcavity pad in the non-display area is h, the thickness of the second microcavity pad is h2, and the variance of the first array (d1, d2, d3, h) is less than the variance of the second array (d1, d2, d3, h + h2).

[0009] In some embodiments, the plurality of microcavity pads further include a third microcavity pad, the thickness of the third microcavity pad being h3, and the thickness of the first microcavity pad being h1;

[0010] The non-display area also includes the third microcavity pad layer. In the non-display area, the third microcavity pad layer is stacked with the first microcavity pad layer, and the variance of the first array is less than the variance of the third array composed of (d1, d2, d3, h-h3).

[0011] In some embodiments, the total thickness of the microcavity pads in the non-display area is approximately equal to the sum of the thicknesses of the first microcavity pad and the third microcavity pad.

[0012] In some embodiments, the thickness of the third microcavity pad is greater than the thickness of the first microcavity pad and the thickness of the second microcavity pad.

[0013] In some embodiments, the thickness of the first microcavity pad is greater than the thickness of the second microcavity pad.

[0014] In some implementations, the total thickness of the microcavity pad in the first sub-pixel, the total thickness of the microcavity pad in the second sub-pixel, and the total thickness of the microcavity pad in the third sub-pixel are all different; and

[0015] The total thickness of the microcavity pad in the non-display area is approximately the same as the total thickness of the microcavity pad in the first sub-pixel, the total thickness of the microcavity pad in the second sub-pixel, or the total thickness of the microcavity pad in the third sub-pixel.

[0016] In some embodiments, the total thickness of the microcavity pad in the non-display area is approximately the same as the total thickness of the microcavity pad in the second sub-pixel; and

[0017] The total thickness of the microcavity pad in the second sub-pixel is greater than the total thickness of the microcavity pad in the third sub-pixel, but less than the total thickness of the microcavity pad in the first sub-pixel.

[0018] In some embodiments, the first microcavity pad is the microcavity pad disposed away from the substrate among the plurality of microcavity pads.

[0019] In some embodiments, the orthographic projection of the first microcavity pad layer on the substrate overlaps with the first sub-pixel, the second sub-pixel, the third sub-pixel, and the non-display area.

[0020] In some embodiments, the orthographic projection of the second microcavity pad layer on the substrate overlaps with the first sub-pixel, but does not overlap with the second sub-pixel, the third sub-pixel, or the non-display area.

[0021] In some embodiments, the orthographic projection of the third microcavity pad layer on the substrate overlaps with the first sub-pixel, the second sub-pixel, and the non-display area, but does not overlap with the third sub-pixel.

[0022] In some embodiments, the second microcavity pad, the third microcavity pad, and the first microcavity pad are stacked sequentially within the display area, with the second microcavity pad disposed close to the substrate.

[0023] In some implementations, the first sub-pixel is used to emit blue light, the second sub-pixel is used to emit red light, and the third sub-pixel is used to emit green light.

[0024] In some embodiments, the display area further includes:

[0025] A first electrode is disposed between the substrate and the plurality of microcavity pads; and

[0026] A transparent electrode is disposed on the side of the plurality of microcavity pads facing away from the substrate and is connected to the first electrode.

[0027] In some embodiments, the microcavity pad layer comprises an insulating material or a transparent conductive material.

[0028] This disclosure provides a display device, including:

[0029] The display substrate as described in any embodiment; and

[0030] A driving component, connected to the display substrate, is used to drive the display substrate to emit light.

[0031] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below.

[0032] Brief description of the attached diagram

[0033] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the scale in the drawings is for illustration only and does not represent the actual scale.

[0034] Figure 1 shows a schematic cross-sectional view of the first type of display substrate;

[0035] Figure 2 illustrates a schematic diagram of a planar structure of a display substrate;

[0036] Figure 3 illustrates the variance comparison results for four examples of display substrates;

[0037] Figure 4 illustrates a cross-sectional structural diagram of the second type of display substrate;

[0038] Figure 5 illustrates a cross-sectional structural diagram of the third type of display substrate;

[0039] Figure 6 illustrates, for example, the comparison of refractive index and extinction coefficient between silicon oxide and ITO;

[0040] Figure 7 illustrates an exemplary schematic diagram of the fabrication process of the first type of display substrate.

[0041] Detailed description

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0043] This disclosure provides a display substrate, as shown in FIG1. ​​The display substrate includes: a substrate 11, and a display area AA and a non-display area NA disposed on one side of the substrate 11. The display area AA includes a plurality of microcavity pads DC stacked together. The plurality of microcavity pads DC includes a first microcavity pad DC1 and a second microcavity pad DC2. The non-display area NA includes at least the first microcavity pad DC1 and does not include the second microcavity pad DC2.

[0044] As shown in Figure 2, the display area AA includes multiple sub-pixels PX, which include a first sub-pixel PX1, a second sub-pixel PX2, and a third sub-pixel PX3. The first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 are used to emit light of different colors.

[0045] For example, the first sub-pixel PX1 is used to emit blue light, the second sub-pixel PX2 is used to emit red light, and the third sub-pixel PX3 is used to emit green light.

[0046] As shown in Figure 1, the total thickness of the microcavity pad DC in the first sub-pixel PX1 is d1, the total thickness of the microcavity pad DC in the second sub-pixel PX2 is d2, the total thickness of the microcavity pad DC in the third sub-pixel PX3 is d3, the total thickness of the microcavity pad DC in the non-display area NA is h, and the thickness of the second microcavity pad DC2 is h2. The variance of the first array (d1, d2, d3, h) is less than the variance of the second array (d1, d2, d3, h + h2).

[0047] For example, as shown in g in FIG7, the display area AA further includes: a first electrode E1 disposed between the substrate 11 and the plurality of microcavity pads DC; and a transparent electrode ET disposed on the side of the plurality of microcavity pads DC away from the substrate 11 and connected to the first electrode E1. The first electrodes E1 located in different sub-pixels PX are separated from each other, and the transparent electrodes ET located in different sub-pixels PX are also separated from each other.

[0048] For example, as shown in g in FIG7, when the material of the microcavity pad DC is an insulating material, the first electrode E1 and the transparent electrode ET are connected through a via provided on the microcavity pad DC.

[0049] For example, the display area AA may further include a light-emitting layer (not shown in the figure) disposed on the side of the transparent electrode ET facing away from the substrate 11, and a second electrode (not shown in the figure) disposed on the side of the light-emitting layer facing away from the substrate 11. The light-emitting layer may include multiple light-emitting patterns located in different sub-pixels PX. Thus, in each sub-pixel PX, the first electrode E1, the transparent electrode ET, the light-emitting pattern, and the second electrode constitute the light-emitting device of that sub-pixel PX. The first electrode E1 is, for example, the anode of the light-emitting device, and the second electrode is, for example, the cathode of the light-emitting device.

[0050] For example, the first electrode E1 is a reflective electrode, and the second electrode is a semi-transparent and semi-reflective electrode. In this case, the light emitted by the light-emitting device resonates by reflecting back and forth within the cavity formed by the first electrode E1 and the second electrode, which can improve the luminous efficiency.

[0051] Since the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 are used to emit light of different colors, and the wavelengths of light of different colors are different, the cavity length required for light of different colors to resonate in the cavity is different.

[0052] For example, the total DC thickness of the microcavity pad in the first sub-pixel PX1, the total DC thickness of the microcavity pad in the second sub-pixel PX2, and the total DC thickness of the microcavity pad in the third sub-pixel PX3 are all different. Thus, by adjusting the total DC thickness of the microcavity pad in each sub-pixel PX, the cavity length can be adjusted, making the cavity formed by the first electrode E1 and the second electrode a strong microcavity, thereby allowing different colors of light to resonate within their respective cavities. Simulation results show that the luminous efficiency of the strong microcavity light-emitting device is approximately three times that of the weak microcavity light-emitting device. A weak microcavity light-emitting device refers to a device where light cannot resonate within the cavity formed by the first electrode E1 and the second electrode.

[0053] The inventors discovered that because the total DC thickness of the microcavity pad in the first sub-pixel PX1, the total DC thickness of the microcavity pad in the second sub-pixel PX2, and the total DC thickness of the microcavity pad in the third sub-pixel PX3 are different from each other, and because the microcavity pad has a height difference at the junction of the display area AA and the non-display area NA, the light-emitting device near the junction of the display area AA and the non-display area NA is prone to severe deformation, which in turn triggers a catastrophic effect.

[0054] In this disclosure, since the variance of the first array (d1,d2,d3,h) is less than the variance of the second array (d1,d2,d3,h+h2), by not setting the second microcavity pad DC2 in the non-display area NA, the variance of the thickness of the microcavity pad DC in the non-display area NA, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be reduced. This reduces the height difference of the microcavity pad at the junction of the display area AA and the non-display area NA, reduces the deformation of the light-emitting device at the junction of the display area AA and the non-display area NA, and effectively reduces the excitation effect.

[0055] In some embodiments, as shown in FIG1, the plurality of microcavity pads DC further includes a third microcavity pad DC3, the thickness of the third microcavity pad DC3 being h3, and the thickness of the first microcavity pad DC1 being h1. The non-display area NA also includes the third microcavity pad DC3. In the non-display area NA, the third microcavity pad DC3 and the first microcavity pad DC1 are stacked, and the variance of the first array is less than the variance of the third array composed of (d1, d2, d3, h-h3).

[0056] In other words, by setting a third microcavity pad DC3 in the non-display area NA, the variance of the thickness of the microcavity pad DC in the non-display area NA, the first sub-pixel PX1, the second sub-pixel PX2, and the third sub-pixel PX3 can be further reduced, thereby further reducing the height difference of the microcavity pad at the junction of the display area AA and the non-display area NA, reducing the deformation of the light-emitting device at the junction of the display area AA and the non-display area NA, and reducing the excitation effect.

[0057] For example, the total thickness of the microcavity pads DC in the non-display area NA is approximately equal to the sum of the thicknesses of the first microcavity pad DC1 and the third microcavity pad DC3. That is, h = h1 + h3.

[0058] Referring to Figure 3a, the variance values ​​for the four cases are compared. In the four cases, the thickness of the first microcavity pad DC1 is h1 = 450 angstroms, the thickness of the second microcavity pad DC2 is h2 = 260 angstroms, the thickness of the third microcavity pad DC3 is h3 = 790 angstroms, the total thickness of the microcavity pad DC in the first sub-pixel PX1 is d1 = 1500 angstroms, the total thickness of the microcavity pad DC in the second sub-pixel PX2 is d2 = 1240 angstroms, and the total thickness of the microcavity pad DC in the third sub-pixel PX3 is d3 = 450 angstroms.

[0059] In the first case, as shown in Figure 4, the non-display area NA includes a first microcavity pad DC1, a second microcavity pad DC2, and a third microcavity pad DC3. The total thickness of the microcavity pads DC in the non-display area NA is h = h1 + h2 + h3, and the variance of the calculated array (d1, d2, d3, h1 + h2 + h3) is 247025. In the second case, as shown in Figure 5, the non-display area NA includes a first microcavity pad DC1 and a second microcavity pad DC2. The total thickness of the microcavity pads DC in the non-display area NA is h = h1 + h2, and the variance of the calculated array (d1, d2, d3, h1 + h2) is 230566.667. In the third case, as shown in Figure 1, the non-display area NA includes a first microcavity pad DC1 and a third microcavity pad DC3. The total thickness of the microcavity pads DC in the non-display area NA is h = h1 + h3, and the variance of the calculated array (d1, d2, d3, h1 + h3) is 207158.333. In the fourth case, the non-display area NA includes a first microcavity pad DC1, and the total thickness of the microcavity pads DC in the non-display area NA is h = h1. The variance of the calculated array (d1, d2, d3, h1) is 293400.

[0060] As shown in Figure 3a, the variance of the array (d1,d2,d3,h1+h3) is smaller than that of the array (d1,d2,d3,h1+h2+h3), which is smaller than that of the array (d1,d2,d3,h1), which is smaller than that of the array (d1,d2,d3,h1), which is smaller than that of the array (d1,d2,d3,h2). In other words, when h = h1 + h3, the variance of the array (d1,d2,d3,h) is the smallest. This means that in the third case, when the non-display area NA includes the first microcavity pad DC1 and the third microcavity pad DC3, the height difference of the microcavity pad at the boundary between the display area AA and the non-display area NA can be minimized to the greatest extent.

[0061] It should be noted that the above variance values ​​can also be calculated based on the surface height difference between each sub-pixel PX and the microcavity pad DC in the non-display area NA, which is far from the substrate 11. The calculation results are shown in Figure 3b, and the conclusion is the same as above, so it will not be repeated here. In Figure 3b, △1 is the surface height difference between the microcavity pad DC in the first sub-pixel PX1 and the microcavity pad DC in the non-display area NA, △2 is the surface height difference between the microcavity pad DC in the second sub-pixel PX2 and the microcavity pad DC in the non-display area NA, and △3 is the surface height difference between the microcavity pad DC in the third sub-pixel PX3 and the microcavity pad DC in the non-display area NA. The average value is the average of △1, △2, and △3, and the variance is the variance of the array (△1, △2, △3). When calculating the height difference, the effect of over-etching depth was taken into account. That is, during the etching process of insulating layer 71 and each microcavity pad layer DC, the non-display area NA will have an over-etching depth of 100 angstroms.

[0062] For example, the thickness of the third microcavity pad DC3 is greater than the thickness of the first microcavity pad DC1 and the thickness of the second microcavity pad DC2, i.e., h3 > h1 and h3 > h2.

[0063] For example, the thickness of the first microcavity pad DC1 is greater than the thickness of the second microcavity pad DC2, i.e., h1 > h2.

[0064] For example, the total thickness of the microcavity pad DC in the non-display area NA is approximately the same as the total thickness of the microcavity pad DC in the first sub-pixel PX1, the second sub-pixel PX2, or the third sub-pixel PX3. That is, h = d1, or h = d2, or h = d3.

[0065] For example, the total thickness of the microcavity pad DC in the non-display area NA is approximately the same as the total thickness of the microcavity pad DC in the second sub-pixel PX2, and the total thickness of the microcavity pad DC in the second sub-pixel PX2 is greater than the total thickness of the microcavity pad DC in the third sub-pixel PX3, but less than the total thickness of the microcavity pad DC in the first sub-pixel PX1. That is, h = d2, and d3 < d2 < d1.

[0066] For example, as shown in FIG1, the first microcavity pad DC1 is the microcavity pad DC disposed away from the substrate 11 among a plurality of microcavity pads DC.

[0067] For example, as shown in FIG1, the orthographic projection of the first microcavity pad layer DC1 on the substrate 11 overlaps with the first sub-pixel PX1, the second sub-pixel PX2, the third sub-pixel PX3 and the non-display area NA.

[0068] In practice, after the film formation process of the first microcavity pad DC1 is completed, there is no need for a patterning process, thus simplifying the process steps.

[0069] For example, as shown in FIG1, the orthographic projection of the second microcavity pad layer DC2 on the substrate 11 overlaps with the first sub-pixel PX1, but does not overlap with the second sub-pixel PX2, the third sub-pixel PX3, or the non-display area NA.

[0070] For example, as shown in FIG1, the orthographic projection of the third microcavity pad layer DC3 on the substrate 11 overlaps with the first sub-pixel PX1, the second sub-pixel PX2 and the non-display area NA, but does not overlap with the third sub-pixel PX3.

[0071] For example, in the display area AA, the second microcavity pad DC2, the third microcavity pad DC3 and the first microcavity pad DC1 are stacked in sequence, and the second microcavity pad DC2 is disposed close to the substrate 11.

[0072] For example, as shown in FIG1, the microcavity pad DC in the first sub-pixel PX1 includes a second microcavity pad DC2, a third microcavity pad DC3 and a first microcavity pad DC1 stacked in sequence; the microcavity pad DC in the second sub-pixel PX2 includes a third microcavity pad DC3 and a first microcavity pad DC1 stacked in sequence; and the microcavity pad DC in the third sub-pixel PX3 includes a first microcavity pad DC1.

[0073] That is, d1 = h1 + h2 + h3, d2 = h1 + h3, d3 = h1.

[0074] For example, the microcavity pad DC includes an insulating material such as silicon oxide, or a transparent conductive material such as ITO.

[0075] As shown in Figure 6, since the refractive index and extinction coefficient of ITO are much higher than those of SiO, a certain proportion of blue light may be lost, ultimately affecting the brightness of white light. Therefore, using insulating materials such as silicon oxide in the microcavity pad DC can improve the brightness of white light.

[0076] The following describes the fabrication process of the display substrate shown in Figure 1, with reference to Figure 7, including the following steps:

[0077] Step 1: Provide a substrate 11, as shown in Figure 7a. The substrate 11 includes, for example, a pixel driving circuit PD located in each sub-pixel PX of the display area AA. The pixel driving circuit PD drives the light-emitting device to emit light.

[0078] Step 2: Using a series of patterning processes including film deposition, photoresist coating, exposure, development, and dry etching, a first electrode E1 located at different sub-pixels PX is formed on the substrate 11, as shown in Figure 7b. The material of the first electrode E1 is, for example, a titanium-aluminum alloy. The non-display area NA may also include an electrode ring R, which is connected to, for example, a second electrode. The electrode ring R is disposed in the same layer as the first electrode E1 and is made of the same material.

[0079] Step 3: Fill the gap between the first electrode E1 with an insulating layer 71. The surface of the insulating layer 71 facing away from the substrate 11 is approximately flush with the surface of the first electrode E1 facing away from the substrate 11, as shown in Figure 7c. In the specific fabrication process, a chemical vapor deposition process can be used to deposit a film on the display substrate shown in Figure 7b. The film thickness is greater than the thickness of the first electrode E1. Then, a grinding process is used to make the surface of the insulating layer 71 facing away from the substrate 11 approximately flush with the surface of the first electrode E1 facing away from the substrate 11. The grinding process can be, for example, a lateral height compensation (LHC) process, an etch-back process, or a chemical mechanical polishing (CMP) process.

[0080] Step 4: Apply silicon oxide using chemical vapor deposition. After exposure and development using a photomask, only retain the silicon oxide on the first sub-pixel PX1. Remove the silicon oxide in other locations using dry or wet etching processes to obtain the second microcavity pad DC2, as shown in d in Figure 7.

[0081] Step 5: Apply silicon oxide using chemical vapor deposition. After exposure and development using a photomask, remove the silicon oxide on the third sub-pixel PX3 using a dry or wet etching process. Leave the silicon oxide in other locations to obtain the third microcavity pad DC3, as shown in e of Figure 7.

[0082] Step 6: Apply silicon oxide using chemical vapor deposition to obtain the first microcavity pad DC1, as shown in f in Figure 7.

[0083] Step 7: Next, vias are fabricated on the first microcavity pad DC1 to connect the transparent electrode ET and the first electrode E1. Then, the transparent electrode ET and the pixel defining layer PDL are sequentially formed on the first microcavity pad DC1, as shown in g of Figure 7. The pixel defining layer PDL has an I-shaped cross-section perpendicular to the substrate 11, which further improves light efficiency. After step 7, the light-emitting layer and the second electrode can be fabricated sequentially to form the light-emitting device of the display substrate.

[0084] This disclosure provides a display device, including: a display substrate as provided in any embodiment; and a driving component connected to the display substrate for driving the display substrate to emit light.

[0085] Those skilled in the art will understand that the display device provided in this disclosure has the advantages of the display substrate of any of the above embodiments.

[0086] The display device disclosed herein can be any product or component with display function, such as a display module, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, in-vehicle display device, smartwatch, fitness wristband, personal digital assistant, etc.

[0087] In this disclosure, "multiple" means two or more, and "at least one" means one or more, unless otherwise expressly and specifically defined.

[0088] In this disclosure, the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this disclosure.

[0089] In this disclosure, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0090] The terms "an embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "example," "one example," "some examples," etc., used in this disclosure are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

[0091] In this disclosure, relational terms such as first and second are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0092] In this specification, "electrical connection" and "coupling" include situations where components are connected together by elements that have some electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0093] In this specification, the term "same-layer arrangement" refers to a structure formed by patterning two (or more) structures through the same patterning process, and their materials may be the same or different. For example, the precursors forming multiple structures in a same-layer arrangement may be made of the same material, while the final materials may be the same or different.

[0094] The polygons used in this specification are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc. They may have minor deformations due to tolerances, and may include chamfers, fillets, curved edges, and other variations.

[0095] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0096] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0097] The use of “for” or “configured to” in this disclosure implies an open and inclusive language that does not preclude applicability to or configuration to devices for performing additional tasks or steps.

[0098] As used in this disclosure, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0099] As used in this disclosure, "parallel," "perpendicular," "equal," and "flush" include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein an acceptable deviation range for approximate parallelism may be, for example, within 10° or 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein an acceptable deviation range for approximate perpendicularity may also be, for example, within 10° or 5°. "Equal" includes absolute equality and approximate equality, wherein an acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one. "Flush" includes absolute flush and approximate flush, wherein an acceptable deviation range for approximate flush may be, for example, a distance between the flushes being less than or equal to 5% of either one's dimension.

[0100] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0101] This disclosure describes exemplary embodiments with reference to cross-sectional views and / or plan views as idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown in this disclosure, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A display substrate, comprising: The substrate and a display area and a non-display area disposed on one side of the substrate, the display area including a plurality of microcavity pads stacked together, the plurality of microcavity pads including a first microcavity pad and a second microcavity pad, the non-display area including at least the first microcavity pad and excluding the second microcavity pad; The display area includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel, the second sub-pixel, and the third sub-pixel are used to emit light of different colors. The total thickness of the microcavity pad in the first sub-pixel is d1, the total thickness of the microcavity pad in the second sub-pixel is d2, the total thickness of the microcavity pad in the third sub-pixel is d3, the total thickness of the microcavity pad in the non-display area is h, the thickness of the second microcavity pad is h2, and the variance of the first array (d1, d2, d3, h) is less than the variance of the second array (d1, d2, d3, h + h2).

2. The display substrate according to claim 1, wherein, The plurality of microcavity pads also include a third microcavity pad, the thickness of the third microcavity pad being h3, and the thickness of the first microcavity pad being h1; The non-display area also includes the third microcavity pad layer. In the non-display area, the third microcavity pad layer is stacked with the first microcavity pad layer, and the variance of the first array is less than the variance of the third array composed of (d1, d2, d3, h-h3).

3. The display substrate according to claim 2, wherein, The total thickness of the microcavity pads in the non-display area is approximately equal to the sum of the thicknesses of the first microcavity pad and the third microcavity pad.

4. The display substrate according to claim 2, wherein, The thickness of the third microcavity pad is greater than the thickness of the first microcavity pad and the thickness of the second microcavity pad.

5. The display substrate according to claim 4, wherein, The thickness of the first microcavity pad is greater than the thickness of the second microcavity pad.

6. The display substrate according to claim 1, wherein, The total thickness of the microcavity pad in the first sub-pixel, the total thickness of the microcavity pad in the second sub-pixel, and the total thickness of the microcavity pad in the third sub-pixel are all different; and The total thickness of the microcavity pad in the non-display area is approximately the same as the total thickness of the microcavity pad in the first sub-pixel, the total thickness of the microcavity pad in the second sub-pixel, or the total thickness of the microcavity pad in the third sub-pixel.

7. The display substrate according to claim 6, wherein, The total thickness of the microcavity pad in the non-display area is approximately the same as the total thickness of the microcavity pad in the second sub-pixel; and The total thickness of the microcavity pad in the second sub-pixel is greater than the total thickness of the microcavity pad in the third sub-pixel, but less than the total thickness of the microcavity pad in the first sub-pixel.

8. The display substrate according to claim 1, wherein, The first microcavity pad is the microcavity pad that is located away from the substrate among the plurality of microcavity pads.

9. The display substrate according to claim 8, wherein, The orthographic projection of the first microcavity pad layer on the substrate overlaps with the first sub-pixel, the second sub-pixel, the third sub-pixel, and the non-display area.

10. The display substrate according to claim 1, wherein, The orthographic projection of the second microcavity pad layer on the substrate overlaps with the first sub-pixel, but does not overlap with the second sub-pixel, the third sub-pixel, or the non-display area.

11. The display substrate according to claim 2, wherein, The orthographic projection of the third microcavity pad on the substrate overlaps with the first sub-pixel, the second sub-pixel, and the non-display area, but does not overlap with the third sub-pixel.

12. The display substrate according to claim 2, wherein, Within the display area, the second microcavity pad, the third microcavity pad, and the first microcavity pad are stacked sequentially, with the second microcavity pad disposed close to the substrate.

13. The display substrate according to any one of claims 1 to 12, wherein, The first sub-pixel is used to emit blue light, the second sub-pixel is used to emit red light, and the third sub-pixel is used to emit green light.

14. The display substrate according to any one of claims 1 to 12, wherein, The display area also includes: A first electrode is disposed between the substrate and the plurality of microcavity pads; and A transparent electrode is disposed on the side of the plurality of microcavity pads facing away from the substrate and is connected to the first electrode.

15. The display substrate according to any one of claims 1 to 12, wherein, The microcavity padding layer comprises an insulating material or a transparent conductive material.

16. A display device, comprising: The display substrate as described in any one of claims 1 to 15; as well as A driving component, connected to the display substrate, is used to drive the display substrate to emit light.

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