Display substrate and manufacturing method therefor, and display device

Abstract

Provided in the present disclosure are a display substrate and a manufacturing method therefor, and a display device. The display substrate comprises a display area, a hole area and an isolation area, wherein the isolation area is located between the hole area and the display area. The isolation area comprises an electrically conductive isolation pillar, an insulating isolation layer and a cathode layer. A side face of the electrically conductive isolation pillar is provided with a recess. The insulating isolation layer is located on the side of the electrically conductive isolation pillar that faces away from base substrate of the display substrate, the orthographic projection of the electrically conductive isolation pillar on the base substrate being located within the orthographic projection of the insulating isolation layer on the base substrate. The cathode layer comprises a first cathode portion and a second cathode portion, wherein the first cathode portion is located on the side of the insulating isolation layer that faces away from the base substrate, at least part of the orthographic projection of the second cathode portion on the base substrate does not overlap the orthographic projection of the insulating isolation layer on the base substrate, and the first cathode portion and the second cathode portion are disconnected at the recess.

Description

Display substrate, manufacturing method thereof and display device

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410703394.0, filed on May 31, 2024, the contents of which are incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display, and in particular, to a display substrate, a manufacturing method thereof, and a display device. BACKGROUND

[0004] With the continuous development of display technology, the application field of display products is becoming more and more extensive, and the requirements of people for display products are also becoming higher and higher. In order to better realize full-screen display, in the related technology, the camera is arranged in the display area of the display product, that is, a through hole is formed in the display area, and the camera is arranged in the through hole. Although this arrangement is conducive to realizing full-screen display, it is easy to produce a hole black spot (English: Gray Dot in Screen Hole, abbreviated as: GDSH) on the display screen of the display product, thereby reducing the production yield of the display product. SUMMARY

[0005] The purpose of the present disclosure is to provide a display substrate, a manufacturing method thereof, and a display device.

[0006] In order to achieve the above-mentioned purpose, the present disclosure provides the following technical solutions:

[0007] The first aspect of the present disclosure provides a display substrate, comprising: a display area, a hole area, and an isolation area, at least part of the display area is located at the periphery of the hole area, and at least part of the isolation area is located between the hole area and the display area; the isolation area comprises:

[0008] A conductive isolation column, the side surface of the conductive isolation column has a notch;

[0009] An insulating isolation layer, the insulating isolation layer is located on the side of the conductive isolation column away from the substrate of the display substrate, and the orthographic projection of the conductive isolation column on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate;

[0010] A cathode layer, the cathode layer comprising a first cathode portion and a second cathode portion, the first cathode portion being located on a side of the insulating isolation layer facing away from the substrate, at least a portion of a footprint of the second cathode portion on the substrate not overlapping with a footprint of the insulating isolation layer on the substrate, the first cathode portion and the second cathode portion being disconnected at the notch.

[0011] Optionally, an edge portion of the insulating isolation layer towards a surface of the substrate has a slope angle a, a satisfying: a > 0°.

[0012] Optionally, a boundary of a footprint of the insulating isolation layer on the substrate at least partially overlaps with a boundary of a footprint of the conductive isolation column on the substrate.

[0013] Optionally, the display substrate further comprises: at least one functional structure, the functional structure being located in the isolation region, and at least a portion of the functional structure 20 being located on a side of the conductive isolation column facing the substrate, the functional structure forming a step difference on its periphery, a surface of the functional structure facing away from the substrate comprising a planar portion and an inclined portion;

[0014] A footprint of a boundary of the insulating isolation layer on the substrate overlaps with a footprint of the inclined portion on the substrate.

[0015] Optionally, a footprint of the insulating isolation layer on the substrate at least partially overlaps with a footprint of the planar portion on the substrate.

[0016] Optionally, a footprint of the planar portion on the substrate is located inside a footprint of the insulating isolation layer on the substrate.

[0017] Optionally, the display substrate comprises: at least two functional structures, the functional structures being adjacent to each other and having a groove therebetween, at least a portion of the insulating isolation layer being located in the groove.

[0018] Optionally, the conductive isolation column comprises a first partition layer, a second partition layer and a third partition layer which are sequentially stacked in a direction away from the substrate, a footprint of a boundary of the first partition layer on the substrate enclosing a footprint of the second partition layer on the substrate.

[0019] A footprint of a boundary of the first partition layer on the substrate enclosing a footprint of the third partition layer on the substrate; and / or, a footprint of the second partition layer on the substrate overlapping with a footprint of the third partition layer on the substrate.

[0020] Optionally, the display substrate comprises a source-drain metal layer and an organic planarization layer, the conductive isolation column is arranged in the same layer and the same material as the source-drain metal layer, and the insulating isolation layer is arranged in the same layer and the same material as the organic planarization layer.

[0021] Optionally, the isolation region surrounds the hole region, and the display region surrounds the isolation region; the display substrate further comprises a light-emitting functional layer, the light-emitting functional layer extends from the display region to the isolation region and is disconnected at the notch of the conductive isolation column.

[0022] Optionally, the functional structure comprises, in sequence from the direction away from the substrate substrate, a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, and a third insulating layer.

[0023] The second conductive pattern is located inside the orthographic projection of the first conductive pattern on the substrate substrate, and in the direction parallel to the substrate substrate, the first conductive pattern protrudes from the second conductive pattern by a first distance d, which satisfies: 0.5 μm≤d≤2 μm.

[0024] Based on the technical scheme of the above display substrate, the second aspect of the present disclosure provides a display device comprising the above display substrate.

[0025] Based on the technical scheme of the above display substrate, the third aspect of the present disclosure provides a manufacturing method of a display substrate, for manufacturing the above display substrate; the display substrate comprises a display region, a hole region, and an isolation region, at least part of the display region is located at the periphery of the hole region, and at least part of the isolation region is located between the hole region and the display region; the manufacturing method comprises:

[0026] In the isolation region, a conductive isolation column and an insulating isolation layer are manufactured; the side surface of the conductive isolation column has a notch; the insulating isolation layer is located on the side of the conductive isolation column away from the substrate substrate of the display substrate, and the orthographic projection of the conductive isolation column on the substrate substrate is located inside the orthographic projection of the insulating isolation layer on the substrate substrate;

[0027] A cathode layer is manufactured, the cathode layer comprises a first cathode part and a second cathode part, the first cathode part is located on the side of the insulating isolation layer away from the substrate substrate, at least part of the orthographic projection of the second cathode part on the substrate substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate substrate, and the first cathode part and the second cathode part are disconnected at the notch.

[0028] Optionally, the step of manufacturing a conductive isolation column and an insulating isolation layer in the isolation region specifically comprises:

[0029] a transition pattern of the isolation column is made;

[0030] An insulating isolation material layer is made on the side of the transition pattern of the isolation column away from the substrate substrate, and a patterning process is performed on the insulating isolation material layer to form an insulating isolation transition layer;

[0031] The transition pattern of the isolation column is patterned with the insulating isolation transition layer as a mask to form the conductive isolation column and the insulating isolation layer, and the edge portion of the insulating isolation layer toward the surface of the substrate substrate has a slope angle a, and a satisfies: a > 0°.

[0032] Optionally, the manufacturing method further comprises:

[0033] A conductive material layer is made on the side of the insulating isolation transition layer away from the substrate substrate;

[0034] The step of patterning the transition pattern of the isolation column with the insulating isolation transition layer as a mask specifically comprises:

[0035] An etching process is performed on the conductive material layer to form a conductive pattern, and over-etching is performed in the etching process to form the conductive isolation column and the insulating isolation layer.

[0036] Optionally, the display substrate comprises at least two functional structures, and the adjacent functional structures have a groove therebetween, and at least part of the insulating isolation layer is located in the groove.

[0037] After the conductive isolation column and the insulating isolation layer are made in the isolation region, a water washing process is performed. BRIEF DESCRIPTION OF DRAWINGS

[0038] The accompanying drawings, which are included to provide a further understanding of the present disclosure, constitute a part of the present disclosure, and the illustrative embodiments of the present disclosure and their descriptions serve to explain the present disclosure, and do not constitute improper limitations on the present disclosure. In the drawings:

[0039] FIGS. 1 to 6 are schematic diagrams of a first manufacturing process of a conductive isolation column and an insulating isolation layer according to an embodiment of the present disclosure;

[0040] FIGS. 7 to 12 are schematic diagrams of a second manufacturing process of a conductive isolation column and an insulating isolation layer according to an embodiment of the present disclosure;

[0041] FIG. 13 is a plan view of regions included in a display substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] In order to further illustrate the display substrate and the manufacturing method thereof and the display device provided by the embodiments of the present disclosure, the following will be described in detail with reference to the accompanying drawings.

[0043] Taking an organic light-emitting diode display product as an example, in order to avoid the organic light-emitting material layer near the through hole from becoming a transmission path for water vapor and oxygen to invade the inside of the display product, an isolation column can be arranged near the through hole, so that the organic light-emitting material layer is blocked by the isolation column, and the organic light-emitting material layer near the through hole is disconnected from the organic light-emitting material layer inside the display area, thereby avoiding the organic light-emitting material layer from becoming a transmission path for water vapor and oxygen to invade the inside of the display product.

[0044] Since the organic light-emitting material layer is formed after the organic light-emitting material layer is formed, the cathode layer is formed on the whole surface, the cathode signal is transmitted on the cathode layer, and a part of the cathode layer is overlapped with the isolation column. In the case where the isolation column has a conductive property, the isolation column also has an electric signal, so that when water vapor and alkaline ions invade the contact with the isolation column, corrosion occurs due to an electrochemical reaction. Since the isolation column is corroded, the display product structure in the encapsulation area of the through hole can be damaged, further causing water vapor to contact the organic light-emitting material layer inside the screen, and finally causing the hole black spot phenomenon.

[0045] Referring to FIGS. 5, 6, 11 to 13, the display substrate provided by the embodiment of the present disclosure includes a display area 61, a hole area 62, and an isolation area 63. At least part of the display area 61 is located at the periphery of the hole area 62, and at least part of the isolation area 63 is located between the hole area 62 and the display area 61. The isolation area 63 includes:

[0046] A conductive isolation column 30, the side surface of the conductive isolation column 30 has a notch;

[0047] An insulating isolation layer 40, the insulating isolation layer 40 is located on the side of the conductive isolation column 30 away from the substrate 10 of the display substrate, and the orthographic projection of the conductive isolation column 30 on the substrate 10 is located inside the orthographic projection of the insulating isolation layer 40 on the substrate 10.

[0048] A cathode layer 50, the cathode layer 50 includes a first cathode part 501 and a second cathode part 502. The first cathode part 501 is located on the side of the insulating isolation layer 40 away from the substrate 10, at least part of the orthographic projection of the second cathode part 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10, and the first cathode part 501 and the second cathode part 502 are disconnected at the notch.

[0049] Exemplarily, the isolation region 63 surrounds the hole region 62, and the display region 61 surrounds the isolation region 63; the display substrate further comprises a light-emitting functional layer EL, which extends from the display region 61 to the isolation region 63 and is disconnected at the notch of the conductive isolation column 30.

[0050] Exemplarily, the isolation region 63 comprises a conductive isolation column 30, which can be made of a metal material, but is not limited thereto. A projection of the conductive isolation column 30 on the substrate 10 at least partially surrounds a projection of the hole region 62 on the substrate 10; further, the projection of the conductive isolation column 30 on the substrate 10 can completely surround the projection of the hole region 62 on the substrate 10.

[0051] Exemplarily, the isolation region 63 comprises an insulating isolation layer 40, which is made of an inorganic insulating material or an organic insulating material.

[0052] Exemplarily, a projection of the conductive isolation column 30 on the substrate 10 coincides with a projection of the insulating isolation layer 40 on the substrate 10. Alternatively, a projection of a boundary of the insulating isolation layer 40 on the substrate 10 surrounds a projection of the conductive isolation column 30 on the substrate 10.

[0053] Exemplarily, the display substrate comprises a cathode layer 50, which comprises a portion located in the isolation region 63, the portion comprising a first cathode portion 501 and a second cathode portion 502 disconnected at the notch, the first cathode portion 501 being located on a surface of the insulating isolation layer 40 away from the substrate 10, and the second cathode portion 502 being located on a periphery of the first cathode portion 501, the second cathode portion 502 not being in contact with the insulating isolation layer 40.

[0054] Exemplarily, the display substrate further comprises a partition structure, which can be arranged between two adjacent conductive isolation columns 30, and is used to partition the second cathode portions 502 coupled to the two adjacent conductive isolation columns 30, respectively; the partition structure can also be arranged between a conductive isolation column 30 and a display region, and is used to partition the second cathode portions 502 coupled to the conductive isolation column 30 and a portion of the cathode layer located in the display region, respectively.

[0055] According to the specific structure of the display substrate, the display substrate provided by the embodiment of the present disclosure is configured as follows: the insulating isolation layer 40 is arranged on the side of the conductive isolation column 30 away from the substrate 10; the cathode layer 50 is arranged on the side of the insulating isolation layer 40 away from the substrate 10; the cathode layer 50 is divided into the first cathode part 501 and the second cathode part 502 at the notch of the conductive isolation column 30; the first cathode part 501 is located on the side of the insulating isolation layer 40 away from the substrate 10; and at least part of the orthographic projection of the second cathode part 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10.

[0056] Since the insulating isolation layer 40 has insulation and is located between the conductive isolation column 30 and the first cathode part 501, the insulating isolation layer 40 can insulate the conductive isolation column 30 and the first cathode part 501, avoid the communication between the first cathode part 501 and the second cathode part 502 through the conductive isolation column 30, and avoid the conductive isolation column 30 from receiving the electrical signal from the first cathode part 501. Therefore, in the display substrate provided by the embodiment of the present disclosure, by arranging the isolation region 63 to include the conductive isolation column 30 and the insulating isolation layer 40, the possibility of forming a conduction path between the conductive isolation column 30 and the cathode layer 50 for transmitting the electrical signal is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0057] As shown in FIG. 5, in some embodiments, the insulating isolation layer 40 has a slope angle a towards the edge part of the surface of the substrate 10, and a satisfies: a>0°.

[0058] For example, a satisfies: 0°<a<90°, but is not limited to this. For example, a can be further limited to satisfy: 20°<a<80°, 30°<a<70°, 40°<a<70°, etc.

[0059] For example, in the forming process of the insulating isolation layer 40, the shape of the insulating isolation layer 40 towards the surface of the substrate 10 is determined by the surface shape of the carrier bearing the insulating isolation layer 40. For example, the conductive isolation column 30 bears the insulating isolation layer 40, that is, the insulating isolation layer 40 is located on the surface of the conductive isolation column 30 away from the substrate 10. In this case, the surface shape of the conductive isolation column 30 away from the substrate 10 determines the shape of the insulating isolation layer 40 towards the surface of the substrate 10.

[0060] Exemplarily, the isolation edge portion of the conductive isolation column 30 has a slope angle a, and the edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 is located on the isolation edge portion, and the edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 can continue the topography of the isolation edge portion and also has the slope angle a.

[0061] Exemplarily, the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation column 30.

[0062] The above-mentioned setting that the edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 has a slope angle a>0° makes the boundary of the insulating isolation layer 40 located on the slope formed by the conductive isolation column 30, which is beneficial to increase the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 on the conductive isolation column 30 and the first cathode portion 501, and better ensuring that the conductive isolation column 30 and the first cathode portion 501 can be completely insulated, thereby improving the GDSH problem caused by electrochemical corrosion.

[0063] As shown in FIGS. 5, 6, 11 and 12, in some embodiments, the boundary of the orthographic projection of the insulating isolation layer 40 on the substrate 10 at least partially overlaps with the boundary of the orthographic projection of the conductive isolation column 30 on the substrate 10.

[0064] Exemplarily, the boundary of the orthographic projection of the insulating isolation layer 40 on the substrate 10 substantially overlaps with the boundary of the orthographic projection of the conductive isolation column 30 on the substrate 10. It should be noted that the substantial overlap is achieved as much as possible under the consideration of process errors.

[0065] When the display substrate is manufactured, the conductive isolation column 30 can be etched by taking the insulating isolation layer 40 as a mask, so that the boundary of the insulating isolation layer 40 is substantially flush with the boundary of the conductive isolation column 30. It should be noted that the substantial flush is achieved as much as possible under the consideration of process errors.

[0066] As shown in FIG. 1, FIG. 5, FIG. 6, FIG. 11 and FIG. 12, in some embodiments, the display substrate further comprises: at least one functional structure 20, the functional structure 20 is located in the isolation area 63, and at least part of the functional structure 20 is located on the side of the conductive isolation column 30 facing the substrate 10, the functional structure 20 forms a step difference at its periphery, and the surface of the functional structure 20 away from the substrate 10 comprises a planar portion 204 and an inclined surface portion 205.

[0067] The orthogonal projection of the boundary of the insulating isolation layer 40 on the substrate 10 overlaps with the orthogonal projection of the inclined surface portion 205 on the substrate 10.

[0068] For example, the functional structure 20 is arranged around the hole area 62, but is not limited thereto.

[0069] For example, the functional structure 20 comprises at least one film layer stacked in sequence away from the substrate 10, for example: the functional structure 20 comprises a first insulating layer, a first conductive pattern 201, a second insulating layer, a second conductive pattern 202 and a third insulating layer stacked in sequence away from the substrate 10; the first insulating layer, the first conductive pattern, the second insulating layer, the second conductive pattern and the third insulating layer can be formed simultaneously in the same patterning process as the corresponding film layer in the display area 61, without the need to increase additional patterning processes. For example, the first conductive pattern can be made of the same layer and material as the first gate metal layer in the display area 61, and the second conductive pattern can be made of the same layer and material as the second gate metal layer in the display area 61. It should be noted that 203 in the figure represents an insulating layer, including the first insulating layer, the second insulating layer and the third insulating layer, and the boundary of the insulating layer is not shown in the figure.

[0070] For example, the functional structure 20 is formed as a convex structure as a whole, which can generate a step difference at the periphery.

[0071] For example, the surface of the functional structure 20 away from the substrate 10 comprises a planar portion 204 and an inclined surface portion 205; the orthogonal projection of the inclined surface portion 205 on the substrate 10 surrounds the orthogonal projection of the planar portion 204 on the substrate 10, but is not limited thereto.

[0072] For example, the orthogonal projection of the boundary of the insulating isolation layer 40 on the substrate 10 overlaps with the orthogonal projection of the inclined surface portion 205 on the substrate 10, for example: the boundary of the insulating isolation layer 40 can be located in the middle region of the inclined surface portion 205, but is not limited thereto.

[0073] The display substrate provided by the above embodiment has the following advantages. By setting the boundary of the insulating isolation layer 40 on the substrate 10 to overlap the normal projection of the inclined surface portion 205 on the substrate 10, the edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 can have a slope angle a > 0°, and the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation column 30. This is conducive to increasing the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 on the conductive isolation column 30 and the first cathode portion 501, thereby better ensuring that the conductive isolation column 30 and the first cathode portion 501 can be completely insulated, and further improving the GDSH problem caused by electrochemical corrosion.

[0074] As shown in FIGS. 1-6, in some embodiments, the normal projection of the insulating isolation layer 40 on the substrate 10 at least partially overlaps the normal projection of the planar portion 204 on the substrate 10.

[0075] For example, the normal projection of the planar portion 204 on the substrate 10 is located inside the normal projection of the insulating isolation layer 40 on the substrate 10.

[0076] The above arrangement allows the conductive isolation column 30 and the insulating isolation layer 40 to cover at least part of the planar portion, and the boundary to be arranged on the inclined surface portion 205. The edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 can have a slope angle a > 0°, and the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation column 30. This is conducive to increasing the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 on the conductive isolation column 30 and the first cathode portion 501, thereby better ensuring that the conductive isolation column 30 and the first cathode portion 501 can be completely insulated, and further improving the GDSH problem caused by electrochemical corrosion.

[0077] As shown in FIGS. 1-6, in some embodiments, the functional structure includes a first insulating layer, a first conductive pattern 201, a second insulating layer, a second conductive pattern 202, and a third insulating layer, which are sequentially stacked in a direction away from the substrate 10;

[0078] The orthographic projection of the second conductive pattern 202 on the substrate 10 is located inside the orthographic projection of the first conductive pattern 201 on the substrate 10, and the first conductive pattern 201 protrudes from the second conductive pattern 202 by a first distance d in a direction parallel to the substrate 10, the first distance d satisfies: 0.5 μm≤d≤2 μm.

[0079] For example, d can take values: 0.7 μm, 1 μm, 1.5 μm, 1.7 μm, etc., but is not limited thereto.

[0080] For example, the boundary of the orthographic projection of the first conductive pattern 201 on the substrate 10 surrounds the orthographic projection of the second conductive pattern 202 on the substrate 10.

[0081] The above setting d satisfies: 0.5 μm≤d≤2 μm, so that the first conductive pattern 201 can protrude from the second conductive pattern 202 by 0.5 μm-2 μm in any direction around the periphery, which is conducive to forming a slope around the first conductive pattern 201 and the second conductive pattern 202, so that the functional structure has a bevel portion on the surface of the substrate facing away from the substrate.

[0082] As shown in FIGS. 7-12, in some embodiments, the display substrate comprises: at least two functional structures 20, the functional structures 20 adjacent to each other have a groove 70, and at least part of the insulating isolation layer 40 is located in the groove 70.

[0083] The above setting mode makes the conductive isolation column 30 and the insulating isolation layer 40 can cover at least part of the groove 70, and the boundary can be set at the bevel portion 205, so that the edge portion of the insulating isolation layer 40 towards the surface of the substrate 10 can have a slope angle, and the slope angle a>0°, so that the boundary of the insulating isolation layer 40 is located on the slope formed by the conductive isolation column 30, which is conducive to increasing the thickness of the edge portion of the insulating isolation layer 40, thereby effectively improving the isolation effect of the edge portion of the insulating isolation layer 40 on the conductive isolation column 30 and the first cathode portion 501, thereby better ensuring that the conductive isolation column 30 and the first cathode portion 501 can be completely insulated, thereby improving the GDSH problem caused by electrochemical corrosion.

[0084] As shown in FIGS. 1-6, in some embodiments, the conductive isolation column 30 comprises a first partition layer 301, a second partition layer 302 and a third partition layer 303 which are sequentially stacked in a direction away from the substrate 10, a projection on the substrate 10 of a boundary of the first partition layer 301 encloses a projection on the substrate 10 of the second partition layer 302; a projection on the substrate 10 of the first partition layer 301 overlaps a projection on the substrate 10 of the third partition layer 303.

[0085] As shown in FIGS. 7-12, in some embodiments, the conductive isolation column 30 comprises a first partition layer 301, a second partition layer 302 and a third partition layer 303 which are sequentially stacked in a direction away from the substrate 10, a projection on the substrate 10 of a boundary of the first partition layer 301 encloses a projection on the substrate 10 of the second partition layer 302;

[0086] a projection on the substrate 10 of the first partition layer 301 overlaps a projection on the substrate 10 of the third partition layer 303; and / or, a projection on the substrate 10 of the second partition layer 302 overlaps a projection on the substrate 10 of the third partition layer 303.

[0087] For example, the first partition layer 301 is made of metal Ti, the second partition layer 302 is made of metal Al, and the third partition layer 303 is made of metal Ti, but not limited thereto.

[0088] For example, the first partition layer 301 and / or the third partition layer 303 protrude from the edges of the second partition layer 302 to form notches on the side of the conductive isolation column 30.

[0089] In the case that at least part of the insulating isolation layer 40 is arranged in the trench 70, since the third partition layer 303 is attached to the insulating isolation layer 40, the edge part of the insulating isolation layer 40 has a slope angle, and thus the edge part of the third partition layer 303 also has the slope angle and is in a upwardly warped state without being supported below, so that the edge part of the third partition layer 303 falls off and the edge part of the insulating isolation layer 40 remains during the subsequent washing process. Since the edge part of the third partition layer 303 protrudes from the second partition layer 302, the organic light-emitting functional layer EL and the cathode layer 50 can be disconnected at the edge part, and the insulation between the first cathode part 501 and the conductive isolation column 30 can be better ensured after the edge part of the third partition layer 303 falls off, thereby better improving the GDSH problem caused by electrochemical corrosion.

[0090] In some embodiments, the display substrate includes a source-drain metal layer and an organic planar layer, the conductive isolation column 30 is arranged in the same layer and of the same material as the source-drain metal layer, and the insulating isolation layer 40 is arranged in the same layer and of the same material as the organic planar layer.

[0091] The above arrangement enables the conductive isolation column 30 and the source-drain metal layer to be formed simultaneously in the same patterning process, and the insulating isolation layer 40 and the organic planar layer to be formed simultaneously in the same patterning process. Therefore, in the display substrate provided by the above embodiments, the conductive isolation column 30 and the insulating isolation layer 40 can be formed without increasing the patterning process flow, thereby improving the GDSH without affecting the production capacity and cost.

[0092] The embodiments of the present disclosure also provide a display device including the display substrate provided by the above embodiments.

[0093] It should be noted that the display device can be any product or component having a display function, such as a television, a display, a digital photo frame, a mobile phone, a tablet computer, etc., and the display device further includes a flexible circuit board, a printed circuit board, a back plate, etc.

[0094] The display substrate provided by the above embodiment is provided with an insulating isolation layer 40 on the side of the conductive isolation column 30 away from the substrate 10, and a cathode layer 50 on the side of the insulating isolation layer 40 away from the substrate 10. The cathode layer 50 is divided into a first cathode part 501 and a second cathode part 502 at the notch of the conductive isolation column 30. The first cathode part 501 is located on the side of the insulating isolation layer 40 away from the substrate 10. At least part of the orthographic projection of the second cathode part 502 on the substrate 10 does not overlap with the orthographic projection of the insulating isolation layer 40 on the substrate 10. Since the insulating isolation layer 40 is insulating and is located between the conductive isolation column 30 and the first cathode part 501, the insulating isolation layer 40 can insulate the conductive isolation column 30 and the first cathode part 501, avoid the communication between the first cathode part 501 and the second cathode part 502 through the conductive isolation column 30, and avoid the conductive isolation column 30 receiving an electrical signal from the first cathode part 501. Therefore, in the display substrate provided by the above embodiment, by providing the isolation region 63 including the conductive isolation column 30 and the insulating isolation layer 40, the possibility of forming a conduction path between the conductive isolation column 30 and the cathode layer 50 transmitting an electrical signal is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0095] The display device provided by the embodiments of the present disclosure also has the above beneficial effects when including the above display substrate, which will not be described here.

[0096] The embodiments of the present disclosure also provide a manufacturing method of a display substrate, used for manufacturing the display substrate provided by the above embodiments. The display substrate includes a display region 61, a hole region 62, and an isolation region 63. At least part of the display region 61 is located on the periphery of the hole region 62. At least part of the isolation region 63 is located between the hole region 62 and the display region 61. The manufacturing method includes the following steps.

[0097] The conductive isolation column 30 and the insulating isolation layer 40 are manufactured in the isolation region 63. The side surface of the conductive isolation column 30 has a notch. The insulating isolation layer 40 is located on the side of the conductive isolation column 30 away from the substrate 10 of the display substrate. The orthographic projection of the conductive isolation column 30 on the substrate 10 is located inside the orthographic projection of the insulating isolation layer 40 on the substrate 10.

[0098] A cathode layer 50 is made, the cathode layer 50 includes a first cathode part 501 located on a side of the insulating isolation layer 40 facing away from the substrate base plate 10, and a second cathode part 502, a projection of the second cathode part 502 on the substrate base plate 10 at least partially does not overlap with a projection of the insulating isolation layer 40 on the substrate base plate 10, the first cathode part 501 and the second cathode part 502 are disconnected at the notch.

[0099] In the display substrate made by the manufacturing method provided in the embodiments of the present disclosure, the insulating isolation layer 40 is arranged on a side of the conductive isolation column 30 facing away from the substrate base plate 10, and the cathode layer 50 is arranged on a side of the insulating isolation layer 40 facing away from the substrate base plate 10, the cathode layer 50 is disconnected into the first cathode part 501 and the second cathode part 502 at the notch of the conductive isolation column 30, the first cathode part 501 is located on a side of the insulating isolation layer 40 facing away from the substrate base plate 10, and a projection of the second cathode part 502 on the substrate base plate 10 at least partially does not overlap with a projection of the insulating isolation layer 40 on the substrate base plate 10. Since the insulating isolation layer 40 has insulation and is located between the conductive isolation column 30 and the first cathode part 501, the insulating isolation layer 40 can insulate the conductive isolation column 30 and the first cathode part 501, avoid the communication between the first cathode part 501 and the second cathode part 502 through the conductive isolation column 30, and avoid the conductive isolation column 30 receiving an electrical signal from the first cathode part 501. Therefore, in the display substrate made by the manufacturing method provided in the embodiments of the present disclosure, by arranging the isolation region 63 to include the conductive isolation column 30 and the insulating isolation layer 40, the possibility of forming a conduction path between the conductive isolation column 30 and the cathode layer 50 transmitting an electrical signal is effectively reduced, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0100] As shown in FIGS. 1-12, in some embodiments, the step of making the conductive isolation column 30 and the insulating isolation layer 40 in the isolation region 63 specifically includes:

[0101] Making an isolation column transition pattern;

[0102] Making an insulating isolation material layer on a side of the isolation column transition pattern facing away from the substrate base plate 10, and performing a patterning process on the insulating isolation material layer to form an insulating isolation transition layer;

[0103] The insulating isolation transition layer is used as a mask to pattern the isolation column transition pattern, to form the conductive isolation column 30 and the insulating isolation layer 40. The edge portion of the surface of the insulating isolation layer 40 towards the substrate 10 has a slope angle a, and a satisfies: a > 0°.

[0104] An exemplary source-drain metal material layer is formed, and a patterning process is performed on the source-drain metal material layer to form the isolation column transition pattern and the conductive structure formed by the source-drain metal material layer in the display substrate. An exemplary insulating isolation transition layer on the substrate 10 is located inside the projection of the isolation column transition pattern on the substrate 10, and the boundary of the projection of the isolation column transition pattern on the substrate 10 surrounds the projection of the insulating isolation transition layer on the substrate 10.

[0105] An exemplary source-drain metal layer is formed by sequentially stacking a Ti film layer, an Al film layer, and a Ti film layer away from the substrate 10, but is not limited thereto.

[0106] An exemplary insulating isolation material layer is formed on the side of the isolation column transition pattern away from the substrate 10, and an exposure and development process is performed on the insulating isolation material layer to form the insulating isolation transition layer. For example, an organic insulating layer material is used to form the insulating isolation material layer, but is not limited thereto.

[0107] An exemplary conductive isolation column 30 and insulating isolation layer 40 are formed by etching the isolation column transition pattern using the insulating isolation transition layer as a mask. Due to the etching process, the boundary portion of the insulating isolation transition layer is etched away to form the insulating isolation layer 40, and then the conductive isolation column 30 is formed by etching using the insulating isolation layer 40 as a mask.

[0108] It should be noted that the thickness of the boundary portion of the formed insulating isolation layer 40 is greater than the thickness of the boundary portion of the insulating isolation transition layer. Due to the patterning process, the thickness of the boundary portion of the insulating isolation transition layer is thin, and the thickness of the boundary portion of the insulating isolation transition layer is less than the thickness of its adjacent portion, which will be the boundary portion of the insulating isolation layer 40 after the etching process. Therefore, the thickness of the boundary portion of the formed insulating isolation layer 40 is greater than the thickness of the boundary portion of the insulating isolation transition layer. It is worth noting that the edge portion of the insulating isolation layer 40 includes the boundary portion of the insulating isolation layer 40.

[0109] For example, after the conductive isolation pillar 30 and the insulating isolation layer 40 are formed, an anode layer is fabricated. During the etching process to form the anode layer, the etching solution will undergo a displacement reaction with the exposed portion of the Al film layer, forming a notch on the side of the conductive isolation pillar 30.

[0110] In the fabrication method provided in the above embodiments, the insulating isolation transition layer is used as a mask to etch the transition pattern of the isolation pillar. A self-alignment technique is adopted so that the boundary of the insulating isolation layer 40 is at least flush with the boundary of the conductive isolation pillar 30, thereby effectively achieving insulation between the conductive isolation pillar 30 and the second cathode portion 502, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0111] As shown in Figures 1 to 12, in some embodiments, the manufacturing method further includes:

[0112] A conductive material layer is formed on the side of the insulating transition layer opposite to the substrate 10.

[0113] The steps of constructing the transition pattern of the isolation pillar using the insulating isolation transition layer as a mask specifically include:

[0114] The conductive material layer is etched to form a conductive pattern; simultaneously, over-etching is performed in the same etching process to form the conductive isolation pillar 30 and the insulating isolation layer 40.

[0115] For example, the conductive material layer may include only the second source / drain metal layer, or it may include both the second source / drain metal layer and the third source / drain metal layer, but it is not limited to this.

[0116] For example, when etching the conductive material layer to form the conductive pattern, the etching time can be extended. While forming the conductive pattern, the insulating isolation transition layer is used as a mask to etch the isolation pillar transition pattern, thereby forming the conductive isolation pillar 30 and the insulating isolation layer 40.

[0117] In the manufacturing method provided in the above embodiments, no additional patterning process is required to form the conductive isolation pillar 30 and the insulating isolation layer 40, so that the boundary of the insulating isolation layer 40 can be at least flush with the boundary of the conductive isolation pillar 30, thereby effectively achieving insulation between the conductive isolation pillar 30 and the second cathode portion 502, thereby effectively improving the GDSH problem caused by electrochemical corrosion.

[0118] As shown in Figures 7 to 12, in some embodiments, the display substrate includes: at least two functional structures 20, with a trench 70 between adjacent functional structures 20, and at least a portion of the insulating isolation layer 40 located within the trench 70;

[0119] After the conductive isolation pillars 30 and the insulating isolation layer 40 are fabricated in the isolation area 63, a water washing process is performed.

[0120] With at least a portion of the insulating isolation layer 40 located within the trench 70, since the third partition layer 303 is attached to the insulating isolation layer 40, and the edge portion of the insulating isolation layer 40 has a slope angle, the edge portion of the third partition layer 303 also has the slope angle and is in an upward-curving state without support below. Thus, during subsequent water washing, the edge portion of the third partition layer 303 will fall off, while the edge portion of the insulating isolation layer 40 will remain. Because the edge portion of the third partition layer 303 protrudes beyond the second partition layer 302, it is still possible to ensure that both the organic light-emitting functional layer EL and the cathode layer 50 are disconnected at this point. Moreover, after the edge portion of the third partition layer 303 falls off, it can better ensure the insulation between the first cathode portion 501 and the conductive isolation pillar 30, thereby better improving the GDSH problem caused by electrochemical corrosion.

[0121] It should be noted that, in the embodiments of this disclosure, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0122] In the various method embodiments of this disclosure, the sequence numbers of each step are not intended to limit the order of the steps. For those skilled in the art, any changes in the order of the steps are within the scope of protection of this disclosure without any creative effort.

[0123] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments are basically similar to the product embodiments, so the description is relatively simple, and the relevant parts can be referred to the description of the product embodiments.

[0124] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connection,” “coupled,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0125] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0126] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0127] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display substrate, comprising: A display area, a hole area, and an isolation area, wherein at least a portion of the display area is located around the hole area, and at least a portion of the isolation area is located between the hole area and the display area; The isolation area includes: A conductive isolation post, wherein the side of the conductive isolation post has a notch; An insulating isolation layer is located on the side of the substrate opposite to the conductive isolation pillar, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate. The cathode layer includes a first cathode portion and a second cathode portion. The first cathode portion is located on the side of the insulating isolation layer facing away from the substrate. At least a portion of the orthographic projection of the second cathode portion on the substrate does not overlap with the orthographic projection of the insulating isolation layer on the substrate. The first cathode portion and the second cathode portion are disconnected at the notch.

2. The display substrate according to claim 1, wherein, The edge portion of the insulating layer facing the surface of the substrate has a slope angle α, where α > 0°.

3. The display substrate according to claim 2, wherein, The boundary of the orthographic projection of the insulating isolation layer onto the substrate at least partially overlaps with the boundary of the orthographic projection of the conductive isolation pillar onto the substrate.

4. The display substrate according to claim 2 or 3, wherein, The display substrate further includes: at least one functional structure located in the isolation region, and at least a portion of the functional structure located on the side of the conductive isolation pillar facing the substrate, the functional structure forming a step around its periphery, and the surface of the functional structure facing away from the substrate including a planar portion and a beveled portion; The orthographic projection of the boundary of the insulating layer on the substrate overlaps with the orthographic projection of the inclined portion on the substrate.

5. The display substrate according to claim 4, wherein, The orthographic projection of the insulating isolation layer on the substrate at least partially overlaps with the orthographic projection of the planar portion on the substrate.

6. The display substrate according to claim 5, wherein, The orthographic projection of the planar portion onto the substrate lies within the orthographic projection of the insulating layer onto the substrate.

7. The display substrate according to claim 4, wherein, The display substrate includes at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench.

8. The display substrate according to claim 1, wherein, The conductive isolation pillar includes a first isolation layer, a second isolation layer, and a third isolation layer stacked sequentially in a direction away from the substrate. The orthographic projection of the boundary of the third isolation layer on the substrate surrounds the orthographic projection of the second isolation layer on the substrate. The orthographic projection of the boundary of the first isolation layer on the substrate surrounds the orthographic projection of the second isolation layer on the substrate.

9. The display substrate according to claim 8, wherein, The first partition layer is made of titanium, the second partition layer is made of aluminum, and the third partition layer is made of titanium.

10. The display substrate according to claim 1, wherein, The display substrate includes a source / drain metal layer and an organic planarization layer. The conductive isolation pillars are disposed in the same layer and with the same material as the source / drain metal layer, and the insulating isolation layer is disposed in the same layer and with the same material as the organic planarization layer.

11. The display substrate according to claim 1, wherein, The isolation area surrounds the hole area, and the display area surrounds the isolation area; The display substrate further includes a light-emitting functional layer that extends from the display area to the isolation area and is broken at the notch of the conductive isolation pillar.

12. The display substrate according to claim 4, wherein, The functional structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, and a third insulating layer, which are sequentially stacked along a direction away from the substrate. The orthographic projection of the second conductive pattern on the substrate is located inside the orthographic projection of the first conductive pattern on the substrate. In a direction parallel to the substrate, the first conductive pattern protrudes from the second conductive pattern by a first distance d, which satisfies: 0.5μm≤d≤2μm.

13. A display device comprising a display substrate as claimed in any one of claims 1 to 12.

14. A method for manufacturing a display substrate, used to manufacture a display substrate as described in any one of claims 1 to 12; The display substrate includes: a display area, an aperture area, and an isolation area, wherein at least a portion of the display area is located around the aperture area, and at least a portion of the isolation area is located between the aperture area and the display area; the manufacturing method includes: Conductive isolation pillars and insulating isolation layers are fabricated in the isolation area; the side of the conductive isolation pillar has a notch; the insulating isolation layer is located on the side of the conductive isolation pillar facing away from the substrate of the display substrate, and the orthographic projection of the conductive isolation pillar on the substrate is located inside the orthographic projection of the insulating isolation layer on the substrate. A cathode layer is fabricated, the cathode layer comprising a first cathode portion and a second cathode portion, the first cathode portion being located on the side of the insulating isolation layer facing away from the substrate, at least a portion of the orthogonal projection of the second cathode portion on the substrate not overlapping the orthogonal projection of the insulating isolation layer on the substrate, and the first cathode portion and the second cathode portion being disconnected at the notch.

15. The method for manufacturing a display substrate according to claim 14, wherein, The steps of fabricating conductive isolation pillars and insulating isolation layers in the isolation region specifically include: Create the transition graphic for the isolation columns; An insulating isolation material layer is fabricated on the side of the isolation pillar transition pattern facing away from the substrate, and the insulating isolation material layer is patterned to form an insulating isolation transition layer. Using the insulating isolation transition layer as a mask, the transition pattern of the isolation pillar is patterned to form the conductive isolation pillar and the insulating isolation layer. The edge portion of the insulating isolation layer facing the surface of the substrate has a slope angle α, where α > 0°.

16. The method for manufacturing a display substrate according to claim 15, wherein, The manufacturing method further includes: A conductive material layer is formed on the side of the insulating transition layer opposite to the substrate. The steps of constructing the transition pattern of the isolation pillar using the insulating isolation transition layer as a mask specifically include: The conductive material layer is etched to form a conductive pattern; simultaneously, over-etching is performed in the same etching process to form the conductive isolation pillars and the insulating isolation layer.

17. The method for manufacturing a display substrate according to any one of claims 14 to 16, wherein, The display substrate includes at least two functional structures, with a trench between adjacent functional structures, and at least a portion of the insulating layer is located within the trench. After the conductive isolation pillars and insulating isolation layers are fabricated in the isolation area, a water washing process is performed.

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