Display substrate and manufacturing method therefor, and display apparatus

Abstract

Provided in the present disclosure are a display substrate and a manufacturing method therefor, and a display apparatus. The display substrate comprises: a display backplane; a pixel defining layer, which at least defines a plurality of pixel openings in a display area, wherein a first undercut partition structure is formed on side surfaces of at least some pixel openings; and a light-emitting element, which comprises a first electrode, a light-emitting layer and a second electrode, wherein the surface of the first electrode is partially exposed from the pixel openings, the light-emitting layer covers the side of the pixel defining layer that is away from the display backplane, the light-emitting layer is partitioned at the first undercut partition structure, and the second electrode covers the side of the light-emitting layer that is away from the display backplane. The first electrode comprises a first transparent conductive pattern, a metal conductive pattern and a second transparent conductive pattern, which are sequentially stacked in a direction that is away from the display backplane, wherein a side surface of the metal conductive pattern is covered by a protective film layer formed by at least one of a transparent conductive material and an organic material. The display substrate and the manufacturing method therefor, and the display apparatus of the present disclosure can improve the display quality.

Description

A display substrate, its manufacturing method, and a display device.

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202410660620.1, filed in China on May 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of display technology, and in particular to a display substrate, a method for manufacturing the same, and a display device. Background Technology

[0004] With the development of display technology, organic light-emitting diode (OLED) display products have occupied the high-end display product market in recent years due to their excellent picture quality and wide range of applications. As a result, users' demands for the display performance of OLED display products are also increasing. Summary of the Invention

[0005] This disclosure provides a display substrate and its manufacturing method, as well as a display device, which can improve display quality.

[0006] The technical solutions provided in this disclosure are as follows:

[0007] In a first aspect, embodiments of this disclosure provide a display substrate having a display area and a peripheral area located on at least one side of the display area; the display substrate includes:

[0008] Display back panel;

[0009] A pixel definition layer defines at least a plurality of pixel openings in the display area, and a first undercut partition structure is formed on the side surface of at least a portion of the pixel openings; and

[0010] A plurality of light-emitting elements are provided, wherein the effective light-emitting area of ​​each light-emitting element is located within the pixel opening. Each light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. The pixel defining layer is located on the side of the first electrode away from the display back panel, and a portion of the surface of the first electrode is exposed by the pixel opening. The light-emitting layer covers the side of the pixel defining layer away from the display back panel, and the light-emitting layer is interrupted at the first undercut partition structure. The second electrode covers the side of the light-emitting layer away from the display back panel.

[0011] The first electrode includes a first transparent conductive pattern, a metal conductive pattern and a second transparent conductive pattern stacked sequentially along a direction away from the display back panel, wherein the side surface of the metal conductive pattern is covered by a protective film layer formed of at least one of a transparent conductive material and an organic material.

[0012] For example, when the side surface of the metal conductive pattern is covered by a protective film layer formed of a transparent conductive material, the protective film layer is disposed in the same layer and of the same material as the first transparent conductive pattern, and the second transparent conductive pattern extends and covers the side surface of the metal conductive pattern to form the protective film layer.

[0013] For example, the pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. When the side of the metal conductive pattern is covered by a protective film layer formed of organic material, the main material of the first film layer includes organic material. The protective film layer is disposed in the same layer and of the same material as the first film layer. The first film layer extends and at least covers a portion of the side surface of the metal conductive pattern to form the protective film layer.

[0014] For example, the pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. At a position corresponding to the side surface of the pixel opening, the side surface of the first film layer is recessed relative to the side surface of the second film layer in a direction away from the pixel opening to form the first undercut partition structure.

[0015] For example, the pixel definition layer further includes a third film layer stacked between the first film layer and the second film layer, and at a position corresponding to the side surface of the pixel opening, the side surface of the third film layer is recessed relative to the side surface of the second film layer in a direction away from the pixel opening.

[0016] For example, the pixel definition layer further defines a partition opening located between two adjacent pixel openings, and a second undercut partition structure is formed on the side surface of the partition opening. The light-emitting layers in two adjacent light-emitting elements are also separated by the corresponding second undercut partition structure.

[0017] For example, the pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. At a position corresponding to the side surface of the partition opening, the side surface of the first film layer is recessed relative to the side surface of the second film layer in a direction away from the partition opening to form the second undercut partition structure.

[0018] For example, the display substrate further includes a first passivation layer and a second passivation layer located between the pixel definition layer and the display backplane. The first passivation layer is located on the side of the second passivation layer away from the display backplane, and the second passivation layer is provided with an isolation auxiliary opening. The isolation auxiliary opening and the orthographic projection of the isolation opening on the display backplane at least partially coincide, and the side surface of the isolation auxiliary opening is recessed relative to the side surface of the second film layer in a direction away from the isolation auxiliary opening.

[0019] For example, the first undercut partition structure is provided on the side surface of each pixel opening; or, the first undercut partition structure is provided on the side surface of some pixel openings, the first undercut partition structure is not provided on the side surface of some pixel openings, and the partition opening is provided between two adjacent pixel openings that are not provided with the first undercut partition structure.

[0020] For example, the display substrate includes a plurality of pixel units, each pixel unit including a first sub-pixel, a second sub-pixel, and a third sub-pixel for emitting different colors of light, wherein the pixel opening corresponding to the first sub-pixel is a first pixel opening, the pixel opening corresponding to the second sub-pixel is a second pixel opening, and the pixel opening corresponding to the third sub-pixel is a third pixel opening; wherein the opening area of ​​the first pixel opening is greater than the opening area of ​​either the second pixel opening or the third pixel opening, the side surface of the first pixel opening is provided with the first undercut partition structure, the side surfaces of the second pixel opening and the third pixel opening are not provided with the first undercut partition structure, and the partition opening is provided between any two of the first pixel opening, the second pixel opening, and the third pixel opening.

[0021] For example, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a red sub-pixel, and the third sub-pixel is a green sub-pixel.

[0022] For example, in the same pixel unit, the second sub-pixel, the third sub-pixel, and the first sub-pixel are arranged in a triangular pattern.

[0023] For example, the pixel definition layer further includes a peripheral pattern located in the peripheral area, the peripheral pattern including an extension pattern extending from the display area to the peripheral area; the film layer containing the first electrode is a first electrode layer, and the film layer containing the second electrode is a second electrode layer; the pattern of the first electrode layer further includes a transition electrode located in the peripheral area, the transition electrode being at least partially not covered by the extension pattern; in the peripheral area, the edge of the second electrode layer away from the display area extends from the display area to the peripheral area, and extends beyond the edge of the extension pattern away from the display area to overlap the transition electrode.

[0024] For example, a third undercut partition structure is formed on the surface of the extended pattern away from the display area; the display substrate further includes a fourth film layer, the main material of the fourth film layer being an organic material, the fourth film layer being located on the side of the pixel definition layer away from the display back panel, and the fourth film layer including a planar pattern, the planar pattern covering the side of the extended pattern away from the display back panel and completely covering the third undercut partition structure to planarize the third undercut partition structure; in the peripheral area, the second electrode layer conformally covers the side of the planar pattern away from the display area.

[0025] For example, in the peripheral area, the display substrate further includes at least one isolation dam; at least one of the peripheral pattern and the fourth film layer also includes an isolation pattern, the isolation pattern and the isolation dam being projected onto the display back panel in at least a partial overlap.

[0026] For example, the pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. The main material of the first film layer includes an organic material. At the edge of the extended pattern away from the display area, the second film layer completely covers the side surface of the first film layer.

[0027] Secondly, embodiments of this disclosure provide a display device including a display substrate as described above.

[0028] Thirdly, embodiments of this disclosure provide a method for manufacturing a display substrate, used to manufacture the display substrate as described above; the method includes the following steps:

[0029] Fabricate the display back panel;

[0030] A pixel definition layer and a light-emitting element are fabricated on the display back panel. The pixel definition layer defines at least a plurality of pixel openings in the display area. A first undercut partition structure is formed on the side surface of at least a portion of the pixel openings. The effective light-emitting area of ​​the light-emitting element is located within the pixel openings. The light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. The pixel definition layer is located on the side of the first electrode away from the display back panel, and a portion of the surface of the first electrode is exposed by the pixel openings. The light-emitting layer covers the side of the pixel definition layer away from the display back panel, and the light-emitting layer is partitioned at the first undercut partition structure. The second electrode covers the side of the light-emitting layer away from the display back panel. The first electrode includes a first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern stacked sequentially along a direction away from the display back panel. The side surface of the metal conductive pattern is covered by a protective film layer formed of at least one of a transparent conductive material and an organic material.

[0031] For example, the fabrication of a pixel definition layer and light-emitting elements on the display backplane specifically includes:

[0032] A first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern are sequentially formed on the display back panel to obtain the pattern of the first electrode, wherein the second transparent conductive pattern extends and covers the side surface of the metal conductive pattern to form the protective film layer.

[0033] The pixel definition layer is formed on the side of the first electrode away from the display back panel;

[0034] The light-emitting layer and the second electrode are sequentially formed on the side of the pixel definition layer away from the display back panel.

[0035] For example, the fabrication of a pixel definition layer and light-emitting elements on the display backplane specifically includes:

[0036] A first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern are sequentially formed on the display back panel to obtain the pattern of the first electrode;

[0037] A first film layer and a second film layer are sequentially formed on the side of the first electrode away from the display back panel, wherein the main material of the first film layer includes an organic material, and the portion of the second film layer covering the side surface of the metal conductive pattern is formed as the protective film layer.

[0038] The pixel definition layer is formed on the side of the first electrode away from the display back panel;

[0039] The light-emitting layer and the second electrode are sequentially formed on the side of the pixel definition layer away from the display back panel.

[0040] For example, creating a pixel definition layer on the display backplane specifically includes:

[0041] A first film layer and a second film layer are sequentially formed on the display back panel;

[0042] The first film layer and the second film layer are subjected to a first patterning process to form the peripheral pattern in the peripheral area. The peripheral pattern includes an extension pattern extending from the display area to the peripheral area, and a third undercut partition structure is formed on the surface of the extension pattern away from the display area.

[0043] A fourth film layer is formed on the side of the second film layer away from the display back panel, and the fourth film layer is patterned to obtain a pattern of the fourth film layer. The pattern of the fourth film layer includes a flat pattern, which covers the side of the extended pattern away from the display back panel and completely covers the third undercut partition structure to flatten the third undercut partition structure.

[0044] The first film layer and the second film layer are subjected to a second patterning process to form the pixel opening in the display area, wherein a first undercut partition structure is formed on at least a portion of the side surface of the pixel opening to obtain the pixel definition layer.

[0045] For example, the step of creating the pixel definition layer on the display backplane specifically includes:

[0046] A first film layer and a second film layer are sequentially formed on the display back panel to obtain the pixel definition layer, wherein the main material of the first film layer includes an organic material, and in the peripheral area, the second film layer completely covers the side surface of the first film layer on the side surface of the extended pattern away from the display area.

[0047] The beneficial effects of the embodiments disclosed herein are as follows:

[0048] The above solution, by setting pixel openings on the pixel definition layer and setting the first undercut isolation structure on at least part of the side surface of the pixel openings, can isolate the light-emitting layer to reduce electrical crosstalk between pixels. Simultaneously, the protective film layer at least covers the side surface of the metal conductive pattern of the first electrode; in other words, the protective film layer wraps around the side surface of the metal conductive pattern. The main material of the protective film layer can be at least one of transparent conductive material and organic material. Thus, after the first electrode is fabricated, when fabricating the first undercut isolation structure on the pixel definition layer, the protective film layer can protect the side surface of the metal conductive pattern, preventing metal oxidation and other phenomena, thereby reducing bulging and other problems at the side surface of the metal conductive pattern, and preventing the first electrode from being effectively isolated from the second electrode, thus preventing a short circuit between the cathode and anode. Attached Figure Description

[0049] Figure 1 shows one of the top views of a pixel unit in the display area of ​​the display substrate provided in this disclosure;

[0050] Figure 2 shows one of the cross-sectional views along A-A' in Figure 1, where the film layer on the side of the first electrode away from the display backplate is not shown;

[0051] Figure 3 shows a second cross-sectional view along A-A' in Figure 1, in which the film layer on the side of the first electrode away from the display backplate is not shown;

[0052] Figure 4 shows the third cross-sectional view along A-A' in Figure 1, where the film layer on the side of the first electrode away from the display backplate is not shown.

[0053] Figure 5 shows a partial cross-sectional structural diagram of the display area in the display substrate provided in this disclosure;

[0054] Figure 6 shows a second top view of a pixel unit in the display area of ​​the display substrate provided in this disclosure;

[0055] Figure 7 shows one of the cross-sectional structural diagrams of the peripheral area of ​​the display substrate other than the bonding side provided in this disclosure;

[0056] Figure 8 shows one of the cross-sectional structural diagrams of the anode conduction position in the bonding side peripheral region of the display substrate provided in this disclosure;

[0057] Figure 9 shows one of the cross-sectional structural diagrams of the cathode conduction position in the peripheral region of the bonding side of the display substrate provided in this disclosure;

[0058] Figure 10 shows a second schematic cross-sectional view of the peripheral area of ​​the display substrate other than the bonding side provided in this disclosure.

[0059] Figure 11 shows a second schematic diagram of the cross-sectional structure at the anode conduction position in the bonding side peripheral region of the display substrate provided in this disclosure;

[0060] Figure 12 shows a second schematic diagram of the cross-sectional structure at the cathode conduction position in the peripheral region of the bonding side of the display substrate provided in this disclosure;

[0061] Figures 13A to 13G are schematic diagrams of each step in the process of manufacturing the display substrate provided in this disclosure. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0063] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0064] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0065] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0066] Before providing a detailed description of the display substrate and its manufacturing method, as well as the display device, provided in the embodiments of this disclosure, the following description of the related technologies is given:

[0067] In related technologies, with the development of display technology, Organic Light Emitting Diode (OLED) has gradually occupied the high-end display product market in recent years due to its excellent picture quality and wide range of applications. RGB OLED display devices use three primary colors to achieve color display, including red sub-pixels, green sub-pixels, and blue sub-pixels, which emit red light (R), green light (G), and blue light (B) respectively, and are mixed according to a certain brightness ratio to synthesize different colors of light.

[0068] However, RGB OLED displays suffer from electrical crosstalk. The main reason for this crosstalk is the presence of functional material layers with high lateral carrier mobility within the OLED device, such as the charge generation layer (CGL). During OLED fabrication, open masks are typically used to create these functional material layers. Because these layers have a continuous planar structure, charges can move freely within the plane. This can easily lead to abnormal emission from pixels surrounding the currently emitting pixel, resulting in poor color gamut and electrical crosstalk, thus affecting the display's color gamut and overall display quality.

[0069] To improve the current utilization efficiency of OLEDs and reduce power consumption, compared to the traditional single pixel structure, the tandem OLED pixel structure connects multiple OLED devices in series through organic material layers to form a high-efficiency OLED device. Its advantages include higher device efficiency, lower current consumption, and longer lifespan. However, electrical crosstalk is more severe in tandem RGB OLED displays.

[0070] Compared to the single pixel structure, the tandem OLED pixel structure stacks two or more independent OLED light-emitting elements using charge-generating layers, driven by a shared power supply. Each OLED device includes a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL), a light emitting layer (EL), and an electron transport layer (ETL), sharing an anode and a cathode layer (CTD). Compared to the single pixel structure, the lateral current flow in the charge-generating layers of the tandem OLED pixel structure generates accompanying light emission, leading to more severe electrical crosstalk in tandem light-emitting devices.

[0071] Traditionally, to reduce electrical crosstalk, an electrical crosstalk partition (ECP) is fabricated on the OLED display substrate. This partition can separate the planar continuous functional material layers, thereby reducing crosstalk and effectively preventing short circuits between the anode and cathode in the light-emitting devices, thus improving display quality. However, OLED display substrates still suffer from the problem of open circuits between the anode and cathode of the light-emitting elements.

[0072] The inventors of this disclosure have discovered that one of the reasons for the above-mentioned problems is that: a light-emitting element generally includes a first electrode, a second electrode, and a light-emitting layer located between the first electrode and the second electrode. The first electrode is a stacked film layer including a transparent conductive layer and a metal conductive layer. When the partition structure is fabricated on the display substrate, the fabrication of the first electrode is completed. The partition structure is generally fabricated by masking an inorganic film layer. In the inorganic film layer preparation process, the sidewall of the first electrode is exposed, causing oxidation of the sidewall of the metal layer in the first electrode, resulting in bulging, which in turn leads to a short circuit between the anode and cathode.

[0073] To address the aforementioned issues, this disclosure provides a display substrate, a method for manufacturing the same, and a display device, which can reduce electrical crosstalk and prevent short circuits between the cathode and anode.

[0074] As shown in Figures 1 to 7, the display substrate provided in this embodiment has a display area AA and a peripheral area DB located on at least one side of the display area AA. The display substrate includes: a display backplate 100, a pixel definition layer 200, and a plurality of light-emitting elements 300.

[0075] The pixel definition layer 200 is located on the display back panel 100, and the pixel definition layer 200 defines at least a plurality of pixel openings 201 in the display area AA. The pixel openings 201 are used to accommodate the light-emitting element 300, and at least a portion of the side surface of the pixel openings 201 is formed with a first undercut partition structure 201A.

[0076] The effective light-emitting area of ​​the light-emitting element 300 is located within the corresponding pixel opening 201. The light-emitting element 300 includes a first electrode 310, a light-emitting layer 320, and a second electrode 330. The pixel definition layer 200 is located on the side of the first electrode 310 away from the display back panel 100, and at least part of the surface of the first electrode 310 away from the display back panel 100 is exposed by the pixel opening 201. The light-emitting layer 320 covers the side of the pixel definition layer 200 away from the display back panel 100, and the light-emitting layer 320 is blocked at the first undercut partition structure 201A. The second electrode 330 covers the side of the light-emitting layer 320 away from the display back panel 100.

[0077] The first electrode 310 includes a first transparent conductive pattern 311, a metal conductive pattern 312 and a second transparent conductive pattern 313 stacked sequentially along a direction away from the display back panel 100. The side surface of the metal conductive pattern 312 is covered by a protective film layer 314 formed of at least one of a transparent conductive material and an organic material.

[0078] In the above scheme, in the display area AA, by setting a pixel opening 201 on the pixel definition layer 200 and setting the first undercut partition structure 201A on at least a portion of the side surface of the pixel opening 201, the light-emitting layer 320 can be separated, thus separating the light-emitting layers 320 of different pixels to reduce electrical crosstalk between pixels and improve the color gamut; at the same time, the protective film layer 314 at least covers the side surface of the metal conductive pattern 312 of the first electrode 310. In other words, the protective film layer 314 wraps the side surface of the metal conductive pattern 312. The main material of the protective film layer 314 can be selected from at least one of transparent conductive material and organic material.

[0079] Thus, after the first electrode 310 is fabricated, when fabricating the first undercut partition structure 201A on the pixel definition layer 200, the protective film layer 314 can protect the side surface of the metal conductive pattern 312, preventing metal oxidation and other phenomena from occurring on the side surface of the metal conductive pattern 312, thereby reducing problems such as bulging at the side surface of the metal conductive pattern 312, and preventing the first electrode 310 from being effectively isolated from the second electrode 330, thus preventing the problem of a short circuit between the cathode and anode.

[0080] It should be noted that in some embodiments, the first electrode 310 may be an anode and the second electrode 330 may be a cathode. However, this is not a limitation.

[0081] Furthermore, it should be noted that the first transparent conductive pattern 311, the second transparent conductive pattern 313, and the transparent conductive material forming the protective film layer 314 can be transparent conductive oxides, such as ITO (indium tin oxide), IZO (indium zinc oxide), etc. However, it is not limited to these.

[0082] Furthermore, in the embodiments disclosed herein, there are no special requirements for the specific structure of the display back panel 100, and those skilled in the art can make flexible selections based on the specific product type and other actual conditions of the display substrate.

[0083] For example, in some embodiments, as shown in Figures 2 and 5, the display backplate 100 may include: a substrate 110; a buffer layer 140 disposed on the substrate 110; a thin-film transistor 130 disposed on the buffer layer 140, wherein the thin-film transistor 130 includes a semiconductor layer 134, a source 131, a gate 132, and a drain (SD) 133, and the specific structure of the thin-film transistor 130 may be a top-gate structure or a bottom-gate structure; various signal lines such as data signal lines, gate lines, power lines, and ground lines, which may be disposed on the same layer as the source or gate structure; and a planarization layer (PLN) 120 disposed on the side of the thin-film transistor 130 away from the substrate 110, providing a well-flat surface for the placement of the light-emitting element 300.

[0084] In some exemplary embodiments of this disclosure, as shown in FIG2, when the side surface of the metal conductive pattern 312 is covered by a protective film layer 314 formed of a transparent conductive material, the protective film layer 314 is disposed in the same layer and of the same material as the first transparent conductive pattern 311, and the second transparent conductive pattern 313 extends and covers the side surface of the metal conductive pattern 312 to form the protective film layer 314.

[0085] By adopting the above solution, by wrapping the side surface of the metal conductive pattern 312 with the second transparent conductive pattern 313 (Top ITO) located on the side of the metal conductive pattern 312 away from the display back panel 100, the second transparent conductive pattern 313 directly forms the protective film layer 314, thereby achieving the purpose of not exposing the metal conductive pattern 312 in the pixel definition layer 200 manufacturing process, and thus avoiding oxidation of the side surface of the metal conductive pattern 312.

[0086] It should be noted that, in the above embodiments, for example as shown in FIG2, the pixel definition layer 200 may include a first film layer 210 and a second film layer 220 stacked sequentially along a direction away from the display back panel 100. At the corresponding position on the side surface of the pixel opening 201, the side surface of the first film layer 210 is recessed relative to the side surface of the second film layer 220 in a direction away from the pixel opening 201 to form the first undercut partition structure 201A.

[0087] It should be noted that the side surface of the first film layer 210 is recessed relative to the side surface of the second film layer 220 in a direction away from the pixel opening 201. Specifically, the first film layer 210 has a first opening at the position corresponding to the pixel opening 201, and the second film layer 220 has a second opening at the position corresponding to the pixel opening 201. The orthogonal projection coverage area of ​​the first opening on the display back panel 100 is smaller than that of the second opening.

[0088] For example, the main materials of the first membrane layer 210 and the second membrane layer 220 can both be inorganic materials, or the main material of at least one of the first membrane layer 210 and the second membrane layer 220 can be organic materials, and there is no limitation on this.

[0089] It should be noted that the inorganic material in the pixel definition layer 200 can be selected from inorganic materials such as SiN (silicon nitride) and SiO (silicon oxide).

[0090] However, taking ITO as an example of the transparent conductive material in the first electrode 310, if SiN is selected as the inorganic material in the pixel definition layer 200, when SiN is prepared above the first electrode 310, due to the presence of reducing gas during the SiN film formation process, In (indium) is deposited on the surface of ITO, causing a decrease in the reflectivity of the first electrode 310. The deposited In will also cause a short circuit between the anode and cathode of the light-emitting element 300.

[0091] Therefore, in some embodiments, when the first film layer 210 stacked on the surface of the first electrode 310 away from the display backplate 100 in the pixel definition layer 200 is made of an inorganic material, SiO can be selected. However, it is not limited to this.

[0092] In the above embodiments, the protective film layer 314 can be directly formed from the first transparent conductive pattern 311. In other embodiments, the protective film layer 314 can also be formed by other film layers, such as:

[0093] In some other exemplary embodiments, as shown in FIG3, the pixel definition layer 200 includes a first film layer 210 and a second film layer 220 stacked sequentially along a direction away from the display back panel 100. When the side of the metal conductive pattern 312 is covered by a protective film layer 314 formed of an organic material, the main material of the first film layer 210 includes an organic material. The protective film layer 314 is disposed in the same layer and of the same material as the first film layer 210. The first film layer 210 extends and at least covers the side surface of the metal conductive pattern 312 (i.e., the side surface of the first electrode 310) to form the protective film layer 314. The side surface of the first film layer 210 is recessed relative to the side surface of the second film layer 220 in a direction away from the pixel opening 201 to form the first undercut partition structure 201A.

[0094] By employing the above-described solution, the first film layer 210 located on the side of the first electrode 310 away from the display backplate 100 is made of an organic material, and during fabrication, the first film layer 210 is wrapped around the side surface of the metal conductive pattern 312, so that the first film layer 210 is directly formed as the protective film layer 314. This achieves the goal of not exposing the metal conductive pattern 312 during the fabrication process of the pixel definition layer 200, thereby preventing oxidation of the side surface of the metal conductive pattern 312. For example, the organic material of the first film layer 210 can be a resin material composed of polyacrylate resin and polyimide resin.

[0095] It should be noted that, in this embodiment, for example, the main material of the second film layer 220 can be an inorganic material. In this way, the first film layer 210 can be formed on the first electrode 310 using an organic material first, and then the second film layer 220 can be formed using an inorganic material. This can prevent the second film layer 220 made of inorganic material from contacting the first electrode 310 and avoid short circuits between the first electrode 310 and the second electrode 330.

[0096] The second film layer 220 can be made of inorganic materials such as SiN (silicon nitride) or SiO (silicon oxide). For example, to avoid In (indium) deposition on the ITO surface, which would cause a decrease in the reflectivity of the first electrode 310, the second film layer 220 can be made of SiO. However, it is not limited to this.

[0097] In the above scheme, the protective film layer 314 is formed by directly wrapping the side surface of the metal conductive pattern 312 in the first electrode 310 with the first transparent conductive pattern 311 or the first film layer 210 in the pixel definition layer 200. In practical applications, the protective film layer 314 is not limited to this. For example, the protective film layer 314 can also be formed by simultaneously wrapping the side surface of the metal conductive pattern 312 with both the first transparent conductive pattern 311 and the first film layer 210 in the pixel definition layer 200; or, the protective film layer 314 can also be other film layers made separately.

[0098] In the embodiment shown in the figure, the pixel definition layer 200 is formed by stacking two film layers: the first film layer 210 and the second film layer 220. In other embodiments, the pixel definition layer 200 is not limited to being formed by stacking two film layers, for example:

[0099] In some other embodiments, as shown in FIG4, the pixel definition layer 200 further includes a third film layer 230 stacked between the first film layer 210 and the second film layer 220, and at a position corresponding to the side surface of the pixel opening 201, the side surface of the third film layer 230 is recessed relative to the side surface of the second film layer 220 in a direction away from the pixel opening 201.

[0100] In some exemplary embodiments of this disclosure, as shown in FIG1, FIG2 and FIG5, the pixel definition layer 200 further defines a partition opening 202 located between two adjacent pixel openings 201, and a second undercut partition structure 220A is formed on the side surface of the partition opening 202, and the light-emitting layers 320 in two adjacent light-emitting elements 300 are further separated by the corresponding second undercut partition structure 220A.

[0101] Using the above scheme, in the display area AA, the first undercut partition structure 201A is made on the side surface of the pixel opening 201 in the pixel definition layer 200, and the second undercut partition structure 220A is also made between at least two adjacent partition openings 202. In this way, by making two undercut partition structures to separate RGB pixels, electrical crosstalk between pixels of different colors can be further avoided and the color gamut can be improved.

[0102] For example, as shown in FIG2, the pixel definition layer 200 includes a first film layer (PDL1) 210 and a second film layer (PDL2) 220 stacked sequentially along a direction away from the display back panel 100. At a position corresponding to the side surface of the partition opening 202, the side surface of the first film layer 210 is recessed relative to the side surface of the second film layer 220 in a direction away from the partition opening 202 to form the second undercut partition structure 220A.

[0103] It should be noted that the side surface of the first film layer 210 is recessed relative to the side surface of the second film layer 220 in a direction away from the pixel opening 201. Specifically, the first film layer 210 has a third opening at the position corresponding to the partition opening 202, and the second film layer 220 has a fourth opening at the position corresponding to the partition opening 202. The orthogonal projection coverage area of ​​the third opening on the display back panel 100 is smaller than that of the fourth opening.

[0104] Furthermore, in some exemplary embodiments of this disclosure, as shown in FIG2, the display substrate further includes a first passivation layer (PVX1) 410 and a second passivation layer (PVX2) 420 located between the pixel definition layer 200 and the display back panel 100, wherein the first passivation layer 410 is located on the side of the second passivation layer 420 away from the display back panel 100.

[0105] The first passivation layer 410 may cover at least the entire display area AA. The first passivation layer 410 may serve as an etching barrier layer, ensuring that other film layers on the display backplate 100 located below the first passivation layer 410 are preserved and not completely etched away during the etching of the pixel definition layer 200. The first passivation layer 410 may be made of inorganic materials such as SiN and SiO, including but not limited to.

[0106] The second passivation layer 420 has an auxiliary opening for partitioning. The auxiliary opening for partitioning overlaps at least partially with the orthographic projection of the partition opening 202 onto the display back panel 100, and the side surface of the auxiliary opening for partitioning is recessed away from the side surface of the second film layer 220 relative to the auxiliary opening for partitioning. In this way, the second passivation layer 420 can supplement the partition height of the second undercut partition structure 220A in the direction perpendicular to the display back panel 100. The second passivation layer 420 can be made of inorganic materials such as SiN and SiO, but is not limited to them.

[0107] Furthermore, in some embodiments, the second electrode 330 can at least completely cover the display area AA, meaning the second electrode 330 is continuous and uninterrupted at the undercut partition structure. The isolation height of either the first undercut partition structure 201A or the second undercut partition structure 220A has a significant impact on the isolation of the high-mobility film layer within the light-emitting element 300. If the partition height is too low, it will not have an isolation effect; if the partition structure is too high, it will cause the second electrode 330 to be interrupted. Therefore, the partition height and shape need to be precisely controlled to effectively prevent the second electrode 330 from being broken and discontinuous.

[0108] The partition height of the first undercut partition structure 201A can depend on the thickness of each film layer in the pixel definition layer 200, and the partition height of the second undercut partition structure 220A can depend on the thickness of each film layer in the pixel definition layer 200 and the film thickness of the second passivation layer 420.

[0109] For example, the thickness of the first film layer 210 can be 5nm to 50nm, for example, the thickness of the first film layer 210 is 20nm; the thickness of the first film layer 210 can be 5nm to 200nm, for example, the thickness of the second film layer 220 is 40nm; the thickness of the second passivation layer 420 can be 5nm to 200nm, for example, the thickness of the second passivation layer 420 is 30nm.

[0110] Using the above solution, the partition height of the first undercut partition structure 201A and the second undercut partition structure 220A can achieve an effective partitioning effect without causing the second electrode 330 to be partitioned.

[0111] It should be understood that the thickness values ​​of the pixel definition layer 200 and the second passivation layer 420 are not limited to these.

[0112] In some exemplary embodiments, the first passivation layer 410 serves as an etching barrier layer, and its film thickness can be controlled within 1000 nm; the planarization layer 120 can be made of organic materials, and its film thickness can typically be prepared using Resin-type materials, with a thickness within 3 μm; the source and drain metal layers of the thin-film transistor 130130 can be stacked Ti / Al / Ti (titanium / aluminum / titanium) films, for example, the film thicknesses of Ti, Al, and Ti are 50 nm, 400 nm, and 50 nm, respectively, but are not limited thereto, and the thickness and material of the source and drain metal layers can also be adjusted according to the resistance; the first electrode 310 can adopt an ITO / Ag / ITO stacked structure, and the film thicknesses of ITO, Ag, and ITO can be 8 nm, 100 nm, and 8 nm, respectively, but are not limited thereto, and in practical applications, the thickness of the first electrode 310 can also be appropriately increased to utilize the protective film layer 314 to avoid oxidation of the side surface of the metal conductive pattern 312. It should be understood that the above is only an exemplary description of the materials and thicknesses of some film layers, and is not limited thereto.

[0113] Furthermore, in some exemplary embodiments of this disclosure, as shown in FIG1, the first undercut partition structure 201A is provided on the side surface of each pixel opening 201. The display substrate includes a plurality of pixel units, each pixel unit including a first sub-pixel, a second sub-pixel, and a third sub-pixel for emitting different colors of light. The first undercut partition structure 201A is provided on the side surface of the pixel opening 201 corresponding to each sub-pixel, and a second undercut partition structure 220A is provided between any two adjacent pixel openings 201.

[0114] In other embodiments of this disclosure, as shown in FIG6, the first undercut partition structure 201A is provided on the side surface of some of the pixel openings 201, while the first undercut partition structure 201A is not provided on the side surface of some of the pixel openings 201, and the partition opening 202 is provided between two adjacent pixel openings 201 without the first undercut partition structure 201A. Thus, the light-emitting layers 320 of some pixels can be separated by the first undercut partition structure 201A, and the light-emitting layers 320 of some pixels can be separated by the second undercut partition structure 220A.

[0115] In some embodiments of this disclosure, the display substrate includes a plurality of pixel units, each pixel unit including a first sub-pixel, a second sub-pixel, and a third sub-pixel for emitting different colors of light. The pixel opening 201 corresponding to the first sub-pixel is a first pixel opening, the pixel opening 201 corresponding to the second sub-pixel is a second pixel opening, and the pixel opening 201 corresponding to the third sub-pixel is a third pixel opening. The opening area of ​​the first pixel opening is larger than the opening area of ​​either the second pixel opening or the third pixel opening. The side surface of the first pixel opening is provided with a first undercut partition structure 201A. The side surfaces of the second pixel opening and the third pixel opening are not provided with the first undercut partition structure 201A, and the partition opening 202 is provided between any two of the first pixel opening, the second pixel opening, and the third pixel opening.

[0116] For example, the first sub-pixel is a blue sub-pixel, the second sub-pixel is a red sub-pixel, and the third sub-pixel is a green sub-pixel. Furthermore, within the same pixel unit, the second sub-pixel, the third sub-pixel, and the first sub-pixel are arranged in a triangular pattern.

[0117] Using the above scheme, the first undercut partition structure 201A is not provided on the side surface of the pixel opening 201 corresponding to the RG pixel, but is only provided on the side surface of the pixel opening 201 of the B pixel. The light-emitting layers 320 of the RG pixels are separated by the second undercut partition structure 220A. It should be understood that the above is only an example and is not limited to this in actual applications.

[0118] Furthermore, as shown in Figures 7 to 9, in some exemplary embodiments of this disclosure, the pixel definition layer 200 further includes a peripheral pattern 240 located in the peripheral area DB, the peripheral pattern 240 including an extension pattern 241 extending from the display area AA to the peripheral area DB; the film layer on which the first electrode 310 is located is a first electrode layer (Anode), and the film layer on which the second electrode 330 is located is a second electrode layer (Cathode) 330'; the pattern of the first electrode layer further includes a transition electrode 315 located in the peripheral area DB, the transition electrode 315 being at least partially not covered by the extension pattern 241; in the peripheral area DB, the side edge of the second electrode layer 330' away from the display area AA extends from the display area AA to the peripheral area DB, and extends beyond the side edge of the extension pattern 241 away from the display area AA to overlap the transition electrode 315.

[0119] Using the above scheme, in the peripheral area DB, the edge of the second electrode 330 away from the display area AA can extend into the peripheral area DB and cross the light-emitting layer 320 and the pixel definition layer 200, and connect to the transition electrode 315. The transition electrode 315 can connect to the VSS signal line to ensure that the VSS signal can be loaded to the second electrode 330.

[0120] In some exemplary embodiments, as shown in Figures 7 to 9, a third undercut partition structure 241A is formed on the surface of the extended pattern 241 away from the display area AA. Since the extended pattern 241 is the pattern of the pixel definition layer 200 in the peripheral area DB, the third undercut partition structure 241A can be formed in the same patterning process as the first undercut partition structure 201A.

[0121] Since the edge of the second electrode layer 330' away from the display area AA extends beyond the edge of the extended pattern 241 away from the display area AA and overlaps with the transition electrode 315, in order to prevent the second electrode layer 330' from being blocked by the third undercut partition structure 241A, as shown in Figures 7 to 9, in some embodiments, the display substrate further includes a fourth film layer 500. The main material of the fourth film layer 500 is an organic material. The fourth film layer 500 is located on the side of the pixel definition layer 200 away from the display back panel 100, and the fourth film layer 500 includes a flat pattern 510. The flat pattern 510 covers the side of the extended pattern 241 away from the display back panel 100 and completely covers the third undercut partition structure 241A to flatten the third undercut partition structure 241A. In the peripheral area DB, the second electrode layer 330' conformally covers the side of the flat pattern 510 away from the display area AA. In this way, the fourth film layer 500 can be used to wrap the third undercut partition structure 241A to ensure that the second electrode layer 330' does not break at the third undercut partition structure 241A.

[0122] Furthermore, in some embodiments of this disclosure, as shown in Figures 5 and 7, the display substrate further includes a thin-film encapsulation layer (TFE) 600, which covers the side of the light-emitting element 300 away from the display backplate 100. The thin-film encapsulation layer 600 may include an inorganic thin-film encapsulation layer 610 and an organic thin-film encapsulation layer 620.

[0123] After the light-emitting layer 320 is deposited, an inorganic thin-film encapsulation layer 610 can be formed on the display area AA and a certain area around it using an open thin-film encapsulation mask (TFE Open Mask). This prevents water vapor and oxygen from diffusing from the edge of AA into the interior of AA, thus avoiding failure of the light-emitting material. The organic thin-film encapsulation layer 620 can be an inkjet-printed film layer (IJP) formed by inkjet printing.

[0124] As shown in Figures 7 to 9, in some exemplary embodiments, the display substrate further includes at least one isolation dam 700 in the peripheral area DB, which may be formed by patterning on the planar layer. In the direction from the display area AA to the peripheral area DB, the isolation dam 700 is located on the side of the extended pattern 241 away from the display area AA. The isolation dam 700 serves to prevent the ink from diffusing towards the encapsulation edge of the display area AA during inkjet printing (IJP), thereby improving the display effect.

[0125] For example, as shown in Figures 7 to 9, the plurality of isolation barriers 700 include a first isolation barrier 710 (Dam1), a second isolation barrier 720 (Dam2), and a third isolation barrier 730 (Dam3) arranged sequentially along a first direction. The first direction F1 is the direction from the display area AA to the peripheral area DB.

[0126] In some embodiments, at least one of the peripheral pattern 240 and the fourth film layer 500 further includes an isolation pattern, the isolation pattern at least partially overlapping the orthographic projection of the isolation dam 700 onto the display back panel 100. The fourth film layer 500 may be the film layer containing the spacer (PS), with the flat pattern 510 formed simultaneously with the fabrication of the spacer. It is understood that in other embodiments, the fourth film layer 500 may also be another separately disposed film layer. Exemplarily, the isolation patterns on the fourth film layer 500 are a first spacer, a second spacer, and a third spacer.

[0127] In other exemplary embodiments, as shown in Figures 10 to 12, when the pixel definition layer 200 includes a first film layer 210 and a second film layer 220 stacked sequentially along a direction away from the display back panel 100, and the main material of the first film layer 210 includes an organic material, the second film layer 220 completely covers the side surface of the first film layer 210 at the edge of the extended pattern 241 away from the display area AA. By using the second film layer 220 to wrap the side surface of the first film layer 210 at the edge of the extended pattern 241 away from the display area AA, the second electrode 330 can be prevented from being interrupted at the edge of the extended pattern 241 away from the display area AA.

[0128] In some embodiments, as shown in Figures 7 to 9, a crack dam 800 is further provided on the display substrate in the peripheral area DB. The crack dam 800 is located on the side of the isolation dam 700 away from the display area AA. This crack dam 800 structure is used to slow down crack propagation, preventing or limiting crack expansion caused by external impact or stress on the display substrate, thereby improving the durability and reliability of the display substrate. Exemplarily, the crack dam 800 includes multiple cutting grooves, and the outer edge of the thin-film encapsulation layer does not extend beyond the inner edge of the crack dam 800. The multiple cutting grooves are used to prevent the encapsulation material of the thin-film encapsulation layer from overflowing to the edge.

[0129] In some embodiments, as shown in Figures 7 to 9, a vent hole 316 is provided on the adapter electrode 315. The vent hole 316 is used to facilitate the discharge of water vapor from the organic film layer on the side of the adapter electrode near the display back panel 100. The fourth film layer 500 also includes a shielding pattern 520 covering the vent hole 316. The shielding pattern is used to cover the vent hole 316 to prevent oxidation of the inner surface of the vent hole 316.

[0130] Taking the display substrate having four sides as an example, at least one of the four sides is a bonding side. The figure shows a schematic diagram of the peripheral area DB of the display substrate on the bonding side, and a schematic diagram of the peripheral area DB of the display substrate on the other sides excluding the bonding side.

[0131] In some embodiments, FIG7 illustrates the membrane distance design dimensions for the peripheral regions of the sides other than the bonding side, wherein the meanings of the dimension markings in FIG7 are as follows:

[0132] A represents the extension length of the light-emitting layer 320 from the display area AA in the direction from the display area AA to the peripheral area DB. A is greater than 0, that is, the light-emitting layer 320 needs to extend a certain distance from the display area AA to the peripheral area DB. For example, A can be about 500μm.

[0133] B represents the extension length of the second electrode layer 330' extending from the display area AA in the direction from the display area AA to the peripheral area DB. For example, B can be about 2105 μm.

[0134] C represents the overlap length between the second electrode layer 330' and the transition electrode 315 in the direction from the display area AA to the peripheral area DB. For example, C can be about 819.5 μm.

[0135] D represents the effective overlap length between the adapter electrode 315 and the VSS signal line in the direction from the display area AA to the peripheral area DB. D = D1 + D2. For example, D can be about 1495 μm, where D1 can be about 1455 μm and D2 can be about 40 μm.

[0136] E represents the linewidth of the VSS signal line in the direction from the display area AA to the peripheral area DB. For example, E can be about 1595μm.

[0137] H represents the distance between the third isolation dam 730 and the thin film encapsulation layer on the edge away from the display area AA in the direction from the display area AA to the peripheral area DB. For example, H can be greater than or equal to 110 μm, such as 195 μm.

[0138] J1 represents the distance between the first isolation dam 710 and the second isolation dam 720 in the direction from the display area AA to the peripheral area DB. For example, J1 can be about 40 μm.

[0139] J2 represents the distance between the second isolation dam 720 and the third isolation dam 730 in the direction from the display area AA to the peripheral area DB. For example, J2 can be about 40 μm.

[0140] K1, K2, and K3 represent the widths of the first isolation dam 710, the second isolation dam 720, and the third isolation dam 730 in the direction from the display area AA to the peripheral area DB, respectively. For example, any one of K1, K2, and K3 can be about 60 μm.

[0141] L represents the distance between the first isolation dam 710 and the second electrode layer 330' in the direction from the display area AA to the peripheral area DB. For example, L can be about 1500 μm.

[0142] M represents the distance between the third isolation dam 730 and the crack dam 800 in the direction from the display area AA to the surrounding area DB. For example, M can be about 411.25 μm.

[0143] N represents the distance between the thin film encapsulation layer and the crack dam 800 in the direction from the display area AA to the peripheral area DB. For example, N can be about 216.25 μm.

[0144] W represents the width of the cutting groove in the direction from the display area AA to the peripheral area DB. For example, W can be about 5 μm.

[0145] S represents the spacing between adjacent cutting channels in the direction from the display area AA to the peripheral area DB. For example, S can be about 5 μm.

[0146] P represents the width of the crack dam 800 in the direction from the display area AA to the surrounding area DB. For example, P can be about 25 μm.

[0147] Q represents the distance between the crack dam 800 and the edge of the display backplate 100 in the direction from the display area AA to the peripheral area DB. For example, Q can be about 203.75 μm.

[0148] R represents the width of the peripheral area DB in the direction from the display area AA to the peripheral area DB. For example, R can be about 4500μm.

[0149] T represents the aperture of the exhaust port 316. For example, T can be about 16 μm.

[0150] U represents the distance by which the edge of the organic thin film encapsulation layer 620 away from the display area AA extends beyond the edge of the second electrode layer 330' away from the display area AA in the direction from the display area AA to the peripheral area DB. For example, U can be about 100 μm.

[0151] In some embodiments, Figures 8 and 9 illustrate the design dimensions of the membrane distance on the bonding side, wherein the meanings of the dimension markings in Figures 8 and 9 are as follows:

[0152] A represents the extension length of the light-emitting layer 320 extending from the display area AA in the direction from the display area AA to the peripheral area DB. For example, A is about 500 μm.

[0153] B represents the extension length of the second electrode layer 330' extending from the display area AA in the direction from the display area AA to the peripheral area DB. For example, B is about 3605 μm.

[0154] C represents the overlap length between the second electrode layer 330' and the transition electrode 315 in the direction from the display area AA to the peripheral area DB. For example, C is approximately 819.5 μm.

[0155] H represents the distance between the third isolation dam 730 and the thin film encapsulation layer on the edge away from the display area AA in the direction from the display area AA to the peripheral area DB. For example, H ≥ 110 μm, such as about 195 μm.

[0156] J1 represents the distance between the first isolation dam 710 and the second isolation dam 720 in the direction from the display area AA to the peripheral area DB. For example, J1 is 40 μm.

[0157] J2 represents the distance between the second isolation dam 720 and the third isolation dam 730 in the direction from the display area AA to the peripheral area DB. For example, J2 is 40 μm.

[0158] K1, K2, and K3 represent the widths of the first isolation dam 710, the second isolation dam 720, and the third isolation dam 730 in the direction from the display area AA to the peripheral area DB, respectively. For example, K1, K2, and K3 are all 60 μm.

[0159] L represents the distance between the first isolation dam 710 and the second electrode layer 330' in the direction from the display area AA to the peripheral area DB. For example, L is 1500 μm.

[0160] M represents the distance between the third isolation dam 730 and the bonding pad (PAD) 900 in the direction from the display area AA to the peripheral area DB. For example, L is 695 μm.

[0161] N represents the distance between the thin film encapsulation layer and the film layer covering the bonding pad 900 in the direction from the display area AA to the peripheral area DB. For example, N is 400 μm.

[0162] W represents the width of the cutting groove in the direction from the display area AA to the peripheral area DB. For example, W is 5 μm.

[0163] S represents the spacing between adjacent cutting channels in the direction from the display area AA to the peripheral area DB. For example, S is 5 μm.

[0164] P represents the width of the crack dam 800 in the direction from the display area AA to the surrounding area DB. For example, P is 25 μm.

[0165] Q represents the distance between the crack dam 800 and the edge of the display backplate 100 in the direction from the display area AA to the peripheral area DB. For example, Q is 203.75 μm.

[0166] R represents the width of the peripheral area DB in the direction from the display area AA to the peripheral area DB. For example, R is 9000 μm.

[0167] T represents the aperture of the exhaust port 316; for example, T is 16 μm.

[0168] U represents the distance by which the edge of the organic thin film encapsulation layer 620 away from the display area AA extends beyond the edge of the second electrode layer 330' away from the display area AA in the direction from the display area AA to the peripheral area DB. For example, U is greater than 88 μm.

[0169] It should be understood that the above are merely examples, and in other embodiments, the graphic design of each film layer in the peripheral region DB is not limited to this.

[0170] This disclosure provides a display device including the display substrate provided in this disclosure. It should be noted that the display device can be any display device with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device may further include flexible circuit boards, printed circuit boards, and backplanes, but is not limited to these.

[0171] Furthermore, this disclosure also provides a method for manufacturing a display substrate, used to manufacture the display substrate in the embodiments of this disclosure. A schematic flowchart is shown. In some embodiments, the method for manufacturing the display substrate provided in this disclosure is performed sequentially from Figures 13A to 13G to obtain the display substrate provided in the embodiments of this disclosure.

[0172] Referring to Figures 13A to 13G, the method for manufacturing the display substrate of this disclosure includes the following steps:

[0173] Step S01: Fabricate the display back panel 100;

[0174] Step S02: A pixel definition layer 200 and a light-emitting element 300 are fabricated on the display back panel 100. The pixel definition layer 200 defines at least a plurality of pixel openings 201 in the display area AA. A first undercut partition structure 201A is formed on at least a portion of the side surface of the pixel openings 201. The effective light-emitting area of ​​the light-emitting element 300 is located within the pixel openings 201. The light-emitting element 300 includes a first electrode 310, a light-emitting layer 320, and a second electrode 330. The pixel definition layer 200 is located on the side of the first electrode 310 away from the display back panel 100, and a portion of the surface of the first electrode 310 is covered by the pixel openings. The aperture 201 is exposed, the light-emitting layer 320 covers the side of the pixel definition layer 200 away from the display back panel 100, and the light-emitting layer 320 is isolated at the first undercut partition structure 201A. The second electrode 330 covers the side of the light-emitting layer 320 away from the display back panel 100. The first electrode 310 includes a first transparent conductive pattern 311, a metal conductive pattern 312 and a second transparent conductive pattern 313 stacked sequentially along the direction away from the display back panel 100. The side surface of the metal conductive pattern 312 is covered by a protective film layer 314 formed of at least one of a transparent conductive material and an organic material.

[0175] In some exemplary embodiments, when the protective film layer 314 is formed by directly wrapping the side surface of the metal conductive pattern 312 with the second transparent conductive pattern 313, the above step S02 specifically includes:

[0176] Step S021: A first transparent conductive pattern 311, a metal conductive pattern 312, and a second transparent conductive pattern 313 are sequentially formed on the display back panel 100 to obtain the pattern of the first electrode 310, wherein the second transparent conductive pattern 313 extends and covers the side surface of the metal conductive pattern 312 to form the protective film layer 314.

[0177] Step S022: Form the pixel definition layer 200 on the side of the first electrode 310 away from the display back panel 100;

[0178] Step S023: The light-emitting layer 320 and the second electrode 330 are sequentially formed on the side of the pixel definition layer 200 away from the display back panel 100.

[0179] Furthermore, in some exemplary embodiments, when the protective film layer 314 is formed by the second transparent conductive pattern 313 directly wrapping the side surface of the metal conductive pattern 312, the step S02 above, in which the pixel definition layer 200 is formed on the display back panel 100, specifically further includes:

[0180] Step S0221: A first film layer 210 and a second film layer 220 are sequentially formed on the display back panel 100;

[0181] Step S0222: Perform a first patterning process on the first film layer 210 and the second film layer 220 to form the peripheral pattern 240 in the peripheral area DB. The peripheral pattern 240 includes an extension pattern 241 extending from the display area AA to the peripheral area DB, and a third undercut partition structure 241A is formed on the side surface of the extension pattern 241 away from the display area AA.

[0182] Step S0223: A fourth film layer 500 is formed on the side of the second film layer 220 away from the display back panel 100, and the fourth film layer 500 is patterned to obtain a pattern of the fourth film layer 500. The pattern of the fourth film layer 500 includes a flat pattern 510, which covers the side of the extended pattern 241 away from the display back panel 100 and completely covers the third undercut partition structure 241A to flatten the third undercut partition structure 241A.

[0183] Step S0224: Perform a second patterning process on the first film layer 210 and the second film layer 220 to form the pixel opening 201 in the display area AA, wherein at least a portion of the side surface of the pixel opening 201 is formed with a first undercut partition structure 201A, thereby obtaining the pixel definition layer 200.

[0184] In some exemplary embodiments, when the protective film layer 314 is formed by the first film layer 210 directly wrapping the side surface of the first electrode 310, the above step S02 specifically includes:

[0185] Step S021: A first transparent conductive pattern 311, a metal conductive pattern 312, and a second transparent conductive pattern 313 are sequentially formed on the display backplate 100 to obtain the pattern of the first electrode 310.

[0186] Step S022: A first film layer 210 and a second film layer 220 are sequentially formed on the side of the first electrode 310 away from the display backplate 100, wherein the main material of the first film layer 210 includes an organic material, and the portion of the second film layer 220 covering the side surface of the metal conductive pattern 312 is formed as the protective film layer 314.

[0187] Step S023: Form the pixel definition layer 200 on the side of the first electrode 310 away from the display back panel 100;

[0188] Step S024: The light-emitting layer 320 and the second electrode 330 are sequentially formed on the side of the pixel definition layer 200 away from the display back panel 100.

[0189] In some exemplary embodiments, when the protective film layer 314 is formed by the first film layer 210 directly wrapping the side surface of the first electrode 310, the above step S023 specifically includes: forming the first film layer 210 and the second film layer 220 sequentially on the display backplate 100 to obtain the pixel definition layer 200, wherein the main material of the first film layer 210 includes organic materials, and the second film layer 220 completely covers the side surface of the first film layer 210 at the peripheral area DB, on the side surface of the extended pattern 241 away from the display area AA.

[0190] The following points need to be explained:

[0191] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0192] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0193] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0194] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A display substrate, characterized by, The display substrate includes a display area and a peripheral area located on at least one side of the display area; the display substrate includes: Display back panel; A pixel definition layer defines at least a plurality of pixel openings in the display area, and a first undercut partition structure is formed on the side surface of at least a portion of the pixel openings; and A plurality of light-emitting elements are provided, wherein the effective light-emitting area of ​​each light-emitting element is located within the pixel opening. Each light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. The pixel defining layer is located on the side of the first electrode away from the display back panel, and at least a portion of the surface of the first electrode on the side away from the display back panel is exposed by the pixel opening. The light-emitting layer covers the side of the pixel defining layer away from the display back panel, and the light-emitting layer is interrupted at the first undercut partition structure. The second electrode covers the side of the light-emitting layer away from the display back panel. The first electrode includes a first transparent conductive pattern, a metal conductive pattern and a second transparent conductive pattern stacked sequentially along a direction away from the display back panel, wherein the side surface of the metal conductive pattern is covered by a protective film layer formed of at least one of a transparent conductive material and an organic material.

2. The display substrate of claim 1, wherein, When the side surface of the metal conductive pattern is covered by a protective film layer formed of a transparent conductive material, the protective film layer is disposed in the same layer and of the same material as the first transparent conductive pattern, and the second transparent conductive pattern extends and covers the side surface of the metal conductive pattern to form the protective film layer.

3. The display substrate of claim 1, wherein, The pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. When the side of the metal conductive pattern is covered by a protective film layer formed of organic material, the main material of the first film layer includes organic material. The protective film layer is disposed in the same layer and of the same material as the first film layer. The first film layer extends and at least covers a portion of the side surface of the metal conductive pattern to form the protective film layer. 4.The display substrate of claim 2 or 3, wherein, The pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. At the position corresponding to the side surface of the pixel opening, the side surface of the first film layer is recessed relative to the side surface of the second film layer in a direction away from the pixel opening to form the first undercut partition structure.

5. The display substrate of claim 4, wherein, The pixel definition layer further includes a third film layer stacked between the first film layer and the second film layer, and at the corresponding position on the side surface of the pixel opening, the side surface of the third film layer is recessed relative to the side surface of the second film layer in a direction away from the pixel opening. 6.The display substrate of claim 1, wherein, The pixel definition layer further defines a partition opening located between two adjacent pixel openings, and a second undercut partition structure is formed on the side surface of the partition opening. The light-emitting layers in two adjacent light-emitting elements are also separated by the corresponding second undercut partition structure. 7.The display substrate of claim 6, wherein, The pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. At the corresponding position on the side surface of the partition opening, the side surface of the first film layer is recessed relative to the side surface of the second film layer in a direction away from the partition opening to form the second undercut partition structure. 8.The display substrate of claim 7, wherein, The display substrate further includes a first passivation layer and a second passivation layer located between the pixel definition layer and the display backplane. The first passivation layer is located on the side of the second passivation layer away from the display backplane, and the second passivation layer is provided with an isolation auxiliary opening. The isolation auxiliary opening and the orthographic projection of the isolation opening on the display backplane at least partially coincide, and the side surface of the isolation auxiliary opening is recessed relative to the side surface of the second film layer in a direction away from the isolation auxiliary opening. 9.The display substrate of claim 6, wherein, Each pixel opening has the first undercut partition structure on its side surface; or, some pixel openings have the first undercut partition structure on their side surfaces, some pixel openings do not have the first undercut partition structure on their side surfaces, and there is a partition opening between two adjacent pixel openings that do not have the first undercut partition structure. 10.The display substrate of claim 9, wherein, The display substrate includes a plurality of pixel units, each pixel unit including a first sub-pixel, a second sub-pixel and a third sub-pixel for emitting different colors of light, the pixel opening corresponding to the first sub-pixel is a first pixel opening, the pixel opening corresponding to the second sub-pixel is a second pixel opening, and the pixel opening corresponding to the third sub-pixel is a third pixel opening; The opening area of ​​the first pixel opening is larger than the opening area of ​​either the second pixel opening or the third pixel opening. The side surface of the first pixel opening is provided with the first undercut partition structure. The side surfaces of the second pixel opening and the third pixel opening are not provided with the first undercut partition structure. The partition opening is provided between any two of the first pixel opening, the second pixel opening and the third pixel opening. 11.The display substrate of claim 10, wherein, The first sub-pixel is a blue sub-pixel, the second sub-pixel is a red sub-pixel, and the third sub-pixel is a green sub-pixel. 12.The display substrate of claim 10, wherein, In the same pixel unit, the second sub-pixel, the third sub-pixel, and the first sub-pixel are arranged in a triangular pattern. 13.The display substrate of claim 1, wherein, The pixel definition layer also includes a peripheral pattern located in the peripheral area, the peripheral pattern including an extension pattern extending from the display area to the peripheral area; the film layer containing the first electrode is a first electrode layer, and the film layer containing the second electrode is a second electrode layer; the pattern of the first electrode layer also includes a transition electrode located in the peripheral area, the transition electrode being at least partially not covered by the extension pattern; in the peripheral area, the edge of the second electrode layer away from the display area extends from the display area to the peripheral area, and extends beyond the edge of the extension pattern away from the display area to overlap the transition electrode. 14.The display substrate of claim 13, wherein, A third undercut partition structure is formed on the surface of the extended pattern away from the display area; the display substrate further includes a fourth film layer, the main material of the fourth film layer is an organic material, the fourth film layer is located on the side of the pixel definition layer away from the display back panel, and the fourth film layer includes a flat pattern, the flat pattern covers the side of the extended pattern away from the display back panel and completely covers the third undercut partition structure, so as to flatten the third undercut partition structure; in the peripheral area, the second electrode layer conformally covers the side of the flat pattern away from the display area. 15.The display substrate of claim 14, wherein, In the peripheral area, the display substrate further includes at least one isolation dam; at least one of the peripheral pattern and the fourth film layer also includes an isolation pattern, the isolation pattern and the isolation dam being projected onto the display back panel in at least partial overlap. 16.The display substrate of claim 13, wherein, The pixel definition layer includes a first film layer and a second film layer stacked sequentially along a direction away from the display back panel. The main material of the first film layer includes an organic material. At the edge of the extended pattern away from the display area, the second film layer completely covers the side surface of the first film layer.

17. A display device comprising: Includes the display substrate as described in any one of claims 1 to 16.

18. A manufacturing method of a display substrate, comprising: The method is used to manufacture a display substrate as described in any one of claims 1 to 16; the method includes the following steps: Fabricate the display back panel; A pixel definition layer and a light-emitting element are fabricated on the display back panel. The pixel definition layer defines at least a plurality of pixel openings in the display area. A first undercut partition structure is formed on the side surface of at least a portion of the pixel openings. The effective light-emitting area of ​​the light-emitting element is located within the pixel openings. The light-emitting element includes a first electrode, a light-emitting layer, and a second electrode. The pixel definition layer is located on the side of the first electrode away from the display back panel, and a portion of the surface of the first electrode is exposed by the pixel openings. The light-emitting layer covers the side of the pixel definition layer away from the display back panel and is partitioned at the first undercut partition structure. The second electrode covers the side of the light-emitting layer away from the display back panel. The first electrode includes a first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern stacked sequentially along a direction away from the display back panel. The side surface of the metal conductive pattern is covered by a protective film layer formed of at least one of a transparent conductive material and an organic material.

19. The method of claim 18, wherein, For fabricating the display substrate as described in claim 2, the step of fabricating a pixel definition layer and light-emitting elements on the display backplane specifically includes: A first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern are sequentially formed on the display back panel to obtain the pattern of the first electrode, wherein the second transparent conductive pattern extends and covers the side surface of the metal conductive pattern to form the protective film layer. The pixel definition layer is formed on the side of the first electrode away from the display back panel; The light-emitting layer and the second electrode are sequentially formed on the side of the pixel definition layer away from the display back panel.

20. The method of claim 18, wherein, For fabricating the display substrate as described in claim 3, the step of fabricating a pixel definition layer and light-emitting elements on the display backplane specifically includes: A first transparent conductive pattern, a metal conductive pattern, and a second transparent conductive pattern are sequentially formed on the display back panel to obtain the pattern of the first electrode; A first film layer and a second film layer are sequentially formed on the side of the first electrode away from the display back panel, and the first film layer and the second film layer are patterned to obtain the pixel definition layer. The main material of the first film layer includes organic materials, and the portion of the second film layer covering the side surface of the metal conductive pattern is formed as the protective film layer. The light-emitting layer and the second electrode are sequentially formed on the side of the pixel definition layer away from the display back panel.

21. The method of claim 18, wherein, The step of fabricating the pixel definition layer on the display backplane for fabricating the display substrate as described in claim 14 specifically includes: A first film layer and a second film layer are sequentially formed on the display back panel; The first film layer and the second film layer are subjected to a first patterning process to form the peripheral pattern in the peripheral area. The peripheral pattern includes an extension pattern extending from the display area to the peripheral area, and a third undercut partition structure is formed on the surface of the extension pattern away from the display area. A fourth film layer is formed on the side of the second film layer away from the display back panel, and the fourth film layer is patterned to obtain a pattern of the fourth film layer. The pattern of the fourth film layer includes a flat pattern, which covers the side of the extended pattern away from the display back panel and completely covers the third undercut partition structure to flatten the third undercut partition structure. The first film layer and the second film layer are subjected to a second patterning process to form the pixel opening in the display area, wherein a first undercut partition structure is formed on at least a portion of the side surface of the pixel opening to obtain the pixel definition layer.

22. The method of claim 18, wherein, The step of fabricating the pixel definition layer on the display backplane for fabricating the display substrate as described in claim 16 specifically includes: A first film layer and a second film layer are sequentially formed on the display back panel to obtain the pixel definition layer, wherein the main material of the first film layer includes an organic material, and in the peripheral area, the second film layer completely covers the side surface of the first film layer on the side surface of the extended pattern away from the display area.

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