Device having a carrier for chiplets and method therefor

Abstract

A device having a carrier, a plurality of chiplets disposed on the carrier, and an optical or electrical communication system, wherein at least some of the chiplets are configured to exchange data via the communication system.

Description

[0001] Description

[0002] title having a carrier for and procedures for this

[0003] State of the art

[0004] The disclosure relates to a device comprising a carrier for chiplets.

[0005] The disclosure further relates to a method for providing such a device.

[0006] Disclosure of the invention

[0007] Some examples relate to a device comprising a carrier, several chiplets arranged on the carrier, and an optical or electrical communication system, wherein at least some of the chiplets are configured to exchange data via the optical or electrical communication system. In some examples, this enables an efficient exchange of information or data between the chiplets and / or from at least one chiplet to at least one other device, or from at least one other device to at least one of the chiplets.

[0008] In some examples, the communication system is designed as an electrical, for example electronic, communication system, through which information can be exchanged, for example using electrical signals.

[0009] In some examples, the communication system is designed as an optical communication system, through which information can be exchanged, for example, using optical signals. For the sake of clarity, the following description of aspects and examples refers primarily to examples of the disclosure involving an optical communication system. However, in other examples, the aspects and characteristics mentioned below are transferable to an electrical communication system, e.g., without limitation of generality.

[0010] In some examples, the carrier is, for instance, an interposer or a substrate.

[0011] In some examples, at least one of the chiplets, for example some or all chiplets, is provided for with an optical receiver (e.g., in the case of the communication system being designed as an optical communication system) for receiving optical signals from the optical communication system. In some examples, the optical receiver is integrated into the respective chiplet.

[0012] In some examples relating to the design of the communication system as an electrical communication system, it may be provided, for example, that at least one of the chiplets, or perhaps some or all of them, has an electrical receiver for receiving electrical signals from the electrical communication system. In some examples, the electrical receiver is integrated into the respective chiplet.

[0013] In some examples (e.g., in the case of the design of the communication system as an optical communication system), it is provided that a source of optical signals is provided which is designed to transmit the optical signals via the optical communication system, wherein, for example, a) the source is arranged on the carrier, and / or wherein, for example, b) the source is arranged outside the carrier, for example, outside the device.

[0014] In some examples relating to the design of the communication system as an electrical communication system, it may be provided, for example, that a source of electrical signals is provided which is designed to transmit the electrical signals via the electrical communication system, wherein, for example, a) the source is arranged on the carrier, and / or wherein, for example, b) the source is arranged outside the carrier, for example, outside the device.

[0015] In some examples, the source may be provided in a chiplet, for example a dedicated one.

[0016] In some examples, the source can provide video data from one or more camera installations and / or send it via the optical or electrical communication system.

[0017] In some examples (e.g., in the case of an optical communication system), the device is provided for to have at least one first optical transmitter for transmitting optical signals via the optical communication system, wherein, for example, the at least one first optical transmitter is designed as a chiplet or integrated into at least one further chiplet. In contrast, in some examples relating to an electrical communication system, the device may, for example, have at least one electrical transmitter for transmitting electrical signals via the electrical communication system, wherein, for example, the at least one first electrical transmitter is designed as a chiplet or integrated into at least one further chiplet.

[0018] In some examples (e.g., when the communication system is designed as an optical communication system), the at least one first optical transmitting device is not integrated into a first number of chiplets, each of which, for example, has its own optical receiver. In other words, in some examples, the device is designed to have a first number of chiplets, each of which has its own optical receiver, integrated into the respective chiplet, but which do not have the optical transmitting device. Comparable features also apply in some examples when the communication system is designed as an electrical communication system. In some examples (e.g.,(In the case of the communication system being designed as an optical communication system) at least one further chiplet may also be provided, which has both an optical receiver device and an optical transmitter device.

[0019] In some examples (e.g., when the communication system is designed as an electrical communication system), at least one additional chiplet may be provided that includes both an electrical receiver and an electrical transmitter. In other examples (e.g., when the communication system is designed as an optical communication system), at least one of the several chiplets arranged on the substrate is configured to transmit optical signals via the optical communication system using at least one first optical transmitter. For example, the chiplets of the first set of chiplets, each of which has, for example, its own optical receiver but not, for example, its own optical transmitter, can use at least one first optical transmitter to transmit optical signals via the optical communication system.In some examples relating to the design of the communication system as an electrical communication system, it may be provided, for example, that at least one of the several chiplets arranged on the carrier is configured to transmit electrical signals via the electrical communication system by means of at least one first electrical transmitter. For example, the chiplets of the first set of chiplets, which each have, for example, their own electrical receiver, but do not have, for example, their own electrical transmitter, can use at least one first electrical transmitter to transmit electrical signals via the electrical communication system.

[0020] In some examples (e.g., in the case of an optical communication system), at least two of the several chiplets arranged on the substrate are configured to transmit optical signals via the optical communication system using the at least one first optical transmitter, where, for example, the at least one first optical transmitter can be used jointly by the at least two chiplets, for example, in time-division multiplexing. In contrast, in some examples relating to an electrical communication system, for example...It is provided that at least two chiplets of the several chiplets arranged on the carrier are designed to transmit electrical signals via the electrical communication system by means of the at least one first electrical transmitting device, wherein, for example, the at least one first transmitting device can be used jointly by the at least two chiplets, for example in a time-division multiplex operation.

[0021] In some examples (e.g., when the communication system is configured as an optical communication system), at least one chiplet has an electrical data connection to the at least one first optical transmitter. For example, a first chiplet has a first electrical data connection to the at least one first optical transmitter, and a second chiplet has a second electrical data connection to the at least one first optical transmitter. The first electrical data connection is different from the second. Similar configurations apply in some examples when the communication system is configured as an electrical communication system, where, accordingly, the first transmitter is configured as the first electrical transmitter.

[0022] In some examples (e.g., when the communication system is designed as an optical communication system), it is provided that at least one first optical transmitting device is arranged on the carrier. Comparable designs also apply in some examples when the communication system is designed as an electrical communication system, whereby, accordingly, the first transmitting device is designed as the first electrical transmitting device and is arranged on the carrier.

[0023] In some examples (e.g., in the case of the training of the

[0024] In a communication system designed as an optical communication system, it is provided that the at least one first optical transmitting device is arranged next to, for example, adjacent to, at least one of the chiplets. In some examples, this means that no further components, such as another chiplet, are arranged between the first optical transmitting device and the at least one chiplet. In some examples, this allows for an efficient connection of the at least one chiplet to the first optical transmitting device, for example, by means of the aforementioned first or second electrical data connection. Comparable considerations also apply in some examples when the communication system is designed as an electrical communication system.

[0025] In some examples (e.g., when the communication system is implemented as an optical communication system), the at least one first optical transmitter is arranged between two chiplets, for example, at least between two chiplets, i.e., at least approximately within a region of a virtual connecting line between the two chiplets. In some examples, this enables an efficient connection of the first optical transmitter to the two chiplets. Similar considerations apply in some examples when the communication system is implemented as an electrical communication system, where, accordingly, the first transmitter is designed as the first electrical transmitter and is arranged between two chiplets.

[0026] In some examples (e.g., when the communication system is implemented as an optical communication system), the at least one first optical transmitter is positioned between more than two chiplets, for example, between four chiplets. This means it is located approximately at the intersection of two virtual connecting lines between diagonally opposite pairs of the four chiplets. In some examples, this allows for an efficient connection of the first optical transmitter to the four chiplets. Similar considerations apply in some examples when the communication system is implemented as an electrical communication system. In some examples (e.g.,In the case of an optical communication system, the principle of placing the first optical transmitter between chiplets is also applicable to a different number of chiplets than the two or four mentioned above, for example, three or more than four. Similar considerations apply in some examples when the communication system is implemented as an electrical communication system.

[0027] In some examples (e.g., when the communication system is configured as an optical communication system), at least two chiplets are configured to share the at least one first optical transmitter, for example, by using it in time-division multiplexing. This allows, in some examples, for instance, a first chiplet of the at least two chiplets to use the optical transmitter in a first time domain to send information, such as data, via the optical communication system, and a second chiplet of the at least two chiplets to use the optical transmitter in a second time domain, different from the first, to send information, such as data, via the optical communication system.The principle of time-division multiplexing for the use of an optical transmitter by multiple chiplets can also be applied to more than two chiplets in further examples.

[0028] In some examples relating to the design of the communication system as an electrical communication system, it may be provided, for example, that at least two chiplets are configured to share the at least one first electrical transmitting device, for example, to use it in time-division multiplexing. Thus, in some examples, a first chiplet of the at least two chiplets can use the electrical transmitting device in a first time domain to send information, for example, data, via the electrical communication system, and a second chiplet of the at least two chiplets can use the electrical transmitting device in a second time domain, which differs from the first time domain, to send information, for example, data, via the electrical communication system.The principle of time-division multiplexing for the use of an electrical transmitter by multiple chiplets can also be applied to more than two chiplets in further examples.

[0029] In some examples (e.g., in the case of the communication system being designed as an optical communication system), the multiple chiplets can, for example, cyclically use the optical (or electrical, in the case of an electrical communication system) transmitting device for a predefined period, whereby in some examples, usage cycles assigned to different chiplets for the use of the optical (or electrical) transmitting device can be the same length or different lengths, for example, adaptable to a bandwidth requirement of a respective chiplet for transmitting via the optical (or electrical) communication system.

[0030] In some examples (e.g., when the communication system is implemented as an optical communication system), a protocol may be provided that controls access by multiple chiplets to a shared optical transmitter. Similar considerations apply in some examples when the communication system is implemented as an electrical communication system.

[0031] In some examples (e.g., when the communication system is designed as an optical communication system), it is stipulated that the optical communication system must include at least one optical transmission medium. Similar considerations apply in some examples when the communication system is designed as an electrical communication system, where the transmission medium is accordingly designed as an electrical transmission medium.

[0032] In some examples (e.g., in the case of the communication system being designed as an optical communication system), it is provided that the at least one optical transmission medium has at least one of the following elements and / or is designed as at least one of the following elements: a) optical conductor, for example optical fiber, or b) optically conductive substrate, for example glass substrate, or c) free-space transmission path, for example in an environmental medium or vacuum, or d) trench or channel, for example in a substrate or interposer, or e) fluid optical fiber.

[0033] In some examples (e.g., when the communication system is designed as an optical communication system), it is stipulated that at least some components of the optical communication system are arranged in the area of ​​the support, for example, a substrate and / or interposer, or are at least partially integrated into the support, for example, a substrate or an interposer. Similar considerations apply in some examples when the communication system is designed as an electrical communication system.

[0034] In some examples, at least some components are arranged one above the other, for example, with respect to a surface of the substrate. In some examples, several chiplets can be arranged on top of each other, i.e., stacked. In some examples (e.g., in the case of an optical communication system), components of the optical communication system (e.g., optical transmission medium) or components for the optical communication system (e.g., receiver and / or transmitter) can also be stacked together with at least one (e.g., another) chiplet. Comparable considerations also apply in some examples when the communication system is implemented as an electrical communication system.

[0035] In some examples (e.g., in the case of the communication system being designed as an optical communication system), it is provided that at least one component of the optical communication system, for example, the optical communication system itself, is arranged between two chiplets, for example, along a height coordinate that extends along a surface normal of a surface of the substrate. Comparable features also apply in some examples when the communication system is designed as an electrical communication system. Some examples relate to a product, for example, a control unit, for example, for a motor vehicle, comprising at least one device according to the disclosure.

[0036] Some examples refer to a vehicle, for example a motor vehicle, comprising at least one device according to the disclosure and / or at least one product according to the disclosure.

[0037] Some examples relate to a method for providing a device comprising a carrier, several chiplets arranged on the carrier, and an optical or electrical communication system, wherein at least some of the chiplets are configured to exchange data via the communication system, and wherein the method comprises: providing the carrier, arranging the several chiplets on the carrier, arranging the communication system, for example in the area of ​​at least some chiplets, for example on the carrier, and optionally, arranging at least one first transmitting device for transmitting signals via the communication system on the carrier.

[0038] In some examples, the communication system is provided to be an optical communication system, and the method comprises at least one of the following elements: a) establishing an electrical data connection between a chiplet and the at least one first optical transmitting device, or b) establishing an optical connection between an optical receiving device of at least one chiplet and at least one component of the optical communication system, or c) providing an interposer with at least one optical transmission medium integrated at least partially, for example completely, into the interposer, wherein, for example, the optical transmission medium comprises at least one of the following elements and / or is configured as at least one of the following elements: c1) optical conductor, for example optical fiber, or c2) optically conductive substrate, for example glass substrate, or c3) free-space transmission path.for example in an environmental medium or vacuum, or c4) trench or channel, for example in a substrate or interposer, or c5) fluid optical fiber, or d) filling a space area that at least partially surrounds at least one chiplet and / or at least one component of the optical communication system and / or the first optical transmitting device with an optical transmission medium, for example a fluid.

[0039] Some examples relate to a use of the device according to the disclosure and / or the product according to the disclosure and / or the vehicle according to the disclosure and / or the method according to the disclosure for at least one of the following elements: a) data exchange, for example optical or electrical data exchange, between several chiplets arranged on the substrate, or b) distribution of information to at least one chiplet, for example several chiplets arranged on the same substrate by means of optical or electrical data communication, or c) bridging comparatively large distances for comparatively fast, for example high-bit-rate, data transmission between several chiplets arranged on the same substrate, or d) increasing the range of a, for example comparatively fast, for example high-bit-rate, data transmission, for example compared to a PCIe system or a UCIe system.or e) providing a multi-chiplet system in which several chiplets each have their own optical or electrical receiver, for example integrated into the respective chiplet, and in which, for example, at least some chiplets share an optical or electrical transmitter, for example according to a time-division multiplexing operation, wherein, for example, the optical or electrical transmitter is not located in any of the chiplets, i.e., for example, outside the chiplets, or wherein, for example, the optical or electrical transmitter is located in another chiplet, for example, dedicated for transmitting optical or electrical signals.

[0040] Further features, applications, and advantages will become apparent from the following description of examples illustrated in the figures of the drawing. All described or illustrated features, individually or in any combination, constitute the subject matter of the invention, irrespective of their compilation in the claims or their cross-reference, and irrespective of their formulation or representation in the description or in the drawing.

[0041] The drawing shows: Fig. 1 schematically a block diagram,

[0042] Fig. 2 schematically shows a block diagram,

[0043] Fig. 3 schematically shows a block diagram,

[0044] Fig. 4 schematically shows a block diagram,

[0045] Fig. 5 schematically shows a simplified side view,

[0046] Fig. 6 schematically shows a simplified top view,

[0047] Fig. 7 schematically shows a block diagram,

[0048] Fig. 8 schematically shows a block diagram,

[0049] Fig. 9 schematically shows a simplified flowchart,

[0050] Fig. 10 schematically shows a simplified flowchart,

[0051] Fig. 11 schematically shows aspects of uses.

[0052] For the sake of clarity, the following description of aspects and examples refers primarily to examples from the disclosure involving an optical communication system and associated optical components (e.g., at least one optical transmitter and / or at least one optical receiver). However, in other examples, the aspects and features mentioned below can be applied, e.g., without limiting generality, to an electrical communication system that, instead of optical components, has corresponding electrical components (e.g., at least one electrical transmitter and / or at least one electrical receiver). In some examples, at least one optical communication system and at least one electrical communication system, each with associated components such as at least one transmitter and / or at least one receiver, can also be combined.Some examples, Fig. 1, relate to a device 100 comprising a carrier 102, several chiplets 104a, 104b, ... arranged on the carrier 102, e.g., on a first surface 102a of the carrier 102, and an optical communication system 106, wherein at least some of the chiplets 104a, 104b are configured to exchange data via the optical communication system 106. In some examples, this enables an efficient exchange of information or data between the chiplets 104a, 104b and / or from at least one chiplet 104a, 104b to at least one further device, see Fig. 2, external sink S-OS, or from at least one further device, see Fig. 2, internal source Q-OS and / or external source Q-OS', to at least one of the chiplets 104a, 104b.

[0053] In some examples, Fig. 1, the support 102 is, for example, an interposer or a substrate. In some examples, Fig. 1, the device 100 can also have at least one interposer (not shown) and a substrate 102.

[0054] In some examples, e.g., configuration 100a of Fig. 2, at least one of the chiplets, for example some or all chiplets 104a, 104b, ..., is provided for with an optical receiver RX for receiving optical signals from the optical communication system 106. In some examples, Fig. 2, the optical receiver RX is, for example, integrated into the respective chiplet 104a, 104b.

[0055] In some examples, Fig. 2, it is provided that at least one source Q-OS, Q-OS' of optical signals is provided which is configured to send the optical signals via the optical communication system 106, wherein, for example, a) the source Q-OS is arranged on the carrier 102, and / or wherein, for example, b) the source Q-OS' is arranged outside the carrier 102, for example, outside the device 100a.

[0056] In some examples, Fig. 2, the Q-OS source can be provided, for example, in a dedicated chiplet, which can also be arranged, for example, on the surface 102a (Fig. 1). In some examples, Fig. 2, the at least one Q-OS source can provide, for example, video data from one or more camera devices and / or other data sources (not shown) and / or send it via the optical communication system 106, for example, to at least one of the chiplets 104a, 104b, for example, for processing of the video data by at least one of the chiplets.

[0057] In some examples, see configuration 100b according to Fig. 3, it is provided that the device 100b has at least one first optical transmitting device TX-1 for transmitting optical signals via the optical communication system 106, wherein, for example, the at least one first optical transmitting device TX-1 is designed as a chiplet 105 or is integrated into at least one further chiplet 105.

[0058] In some examples, Fig. 3, the at least one first optical transmitter TX-1 is not integrated into a first number of chiplets 104a, 104b, ..., each of which, for example, has its own optical receiver RX. In other words, in some examples, Fig. 3, the device 100b has a first number of chiplets 104a, 104b, each of which has its own optical receiver RX, integrated, for example, into the respective chiplet 104a, 104b, but which do not have the optical transmitter TX-1 (or, for example, any other optical transmitter).

[0059] In some examples (not shown), at least one additional chiplet, e.g. on carrier 102, may also be provided, which has both an optical receiver device and an optical transmitter device.

[0060] In some examples, Fig. 3, it is provided that at least one chiplet 104a, 104b of the several chiplets arranged on the carrier 102 is configured to transmit optical signals via the optical communication system 106 by means of the at least one first optical transmitter TX-1. For example, the chiplets 104a, 104b, ... of the first number of chiplets, which each have, for example, their own optical receiver RX, but do not have, for example, their own optical transmitter, can use at least one first optical transmitter TX-1 to transmit optical signals via the optical communication system 106. In some examples, Fig.3, it is provided that at least two chiplets 104a, 104b of the several chiplets arranged on the carrier 102 are designed to transmit optical signals via the optical communication system 106 by means of the at least one first optical transmitter TX-1, wherein, for example, the at least one first optical transmitter TX-1 can be used jointly by the at least two chiplets 104a, 104b, for example in a time-division multiplex operation.

[0061] In some examples, Fig. 3, it is provided that at least one chiplet 104a, 104b has an electrical data connection to the at least one first optical transmitter TX-1, wherein, for example, a first chiplet 104a has a first electrical data connection DV-el-1 to the at least one first optical transmitter TX-1 and wherein, for example, a second chiplet 104b has a second electrical data connection DV-el-2 to the at least one first optical transmitter TX-1, wherein, for example, the first electrical data connection DV-el-1 is different, for example, separate, from the second electrical data connection DV-el-2.

[0062] In some examples, Fig. 3, it is provided that at least one first optical transmitting device TX-1 is arranged on the carrier 102.

[0063] In some examples, Fig. 3, the at least one first optical transmitter TX-1 is arranged next to, for example adjacent to, at least one of the chiplets, in Fig. 3 for example to chiplet 104b. In some examples, this means that no further components, for example no further (i.e., another) chiplet (e.g., chiplet 104a), are arranged between the first optical transmitter TX-1 and the at least one chiplet 104b. In some examples, this enables an efficient connection of the at least one chiplet 104b to the first optical transmitter TX-1, for example by means of the aforementioned, for example, first or second, electrical data connection DV-el-2. In some examples, see the device 100c according to Fig.4, it is provided that the at least one first optical transmitter TX-1 is arranged between two chiplets 104a, 104b, for example between at least two chiplets 104a, 104b, i.e., for example, at least approximately in a region B1 of a virtual connecting line between the two chiplets 104a, 104b. In some examples, this enables an efficient connection of the first optical transmitter TX-1 to the two chiplets 104a, 104b.

[0064] In some examples, see Fig. 6, the at least one first optical transmitter TX-1 is arranged between more than two chiplets, for example between four chiplets 104a, 104b, 104e, 104f, i.e., at least approximately in the area of ​​an intersection of two virtual connecting lines between diagonally opposite pairs 104a, 104f and 104b, 104e of the four chiplets. In some examples, this enables an efficient connection of the first optical transmitter TX-1 to the four chiplets 104a, 104b, 104e, 104f.

[0065] In some examples, the principle of arranging the first optical transmitter TX-1 between chiplets can also be applied to a different number of chiplets than the above examples of 2 or four chiplets, e.g. 3 or more than 4 chiplets.

[0066] In some examples, Fig. 4, at least two chiplets 104a, 104b are configured to share the at least one first optical transmitter TX-1, for example, in time-division multiplexing. Thus, in some examples, a first chiplet 104a of the at least two chiplets can use the first optical transmitter TX-1 in a first time domain to send information, for example, data, via the optical communication system 106 (e.g., to at least one other chiplet and / or an optional sink S-OS (Fig. 2)), and a second chiplet 104b of the at least two chiplets can, for example, use the first optical transmitter TX-1 in a second time domain, which differs from the first time domain, to send information, for example, data, via the optical communication system 106.The principle of time-division multiplexing for the use of an optical transmitter TX-1 by several chiplets 104a, 104b is also applicable to more than two chiplets in further examples, e.g. Fig. 6, in whose configuration 100e four chiplets 104a, 104b, 104e, 104f share a first optical transmitter TX-1, and in which four further chiplets 104c, 104d, 104g, 104h share a second optical transmitter TX-2.

[0067] In some examples, the multiple chiplets 104a, 104b, ... can, for example, cyclically use the optical transmitting device TX-1, TX-2 for a predefinable period of time, whereby in some examples the usage cycles assigned to different chiplets for the use of the optical transmitting device can be the same length or different lengths, for example adaptable to a bandwidth requirement of a respective chiplet for transmitting via the optical communication system 106.

[0068] In some examples, a protocol may be provided that controls access by multiple chiplets 104a, 104b to a shared optical transmitter TX-1.

[0069] In some examples, Fig. 1, it is provided that the optical communication system 106 has at least one optical transmission medium 106a.

[0070] In some examples, Fig. 1, it is provided that the at least one optical transmission medium 106a has at least one of the following elements and / or is designed as at least one of the following elements: a) optical conductor 106a-1, for example optical fiber, or b) optically conductive substrate 106a-2 (e.g. in the form of the support 102), for example glass substrate, or c) free-space transmission path 106a-3, for example in an ambient medium or vacuum, or d) trench or channel 106a-4, for example in a substrate or interposer, or e) fluid optical fiber 106a-5.

[0071] In some examples, Fig. 1, it is provided that at least some components 106a of the optical communication system 106 are arranged in the area of ​​the carrier 102, for example a substrate and / or interposer, for example at least partially integrated into the carrier 102, for example a substrate or an interposer.

[0072] In some examples, see configuration 100d according to Fig. 5, at least some components 104a, 104b, 104, 106, 106a-1 are arranged one above the other, for example, with respect to a surface 102a of the carrier 102. In some examples, several chiplets 104a, 104b can be arranged one above the other, i.e., stacked. In some examples, components 106a-1 of the optical communication system 106 (e.g., optical transmission medium 106a) or for the optical communication system (e.g., receiver RX (Fig. 1) and / or transmitter TX-1, TX-2) can also be stacked, e.g., together with at least one (e.g., another) chiplet.

[0073] In some examples, Fig. 5, at least one component 106a, 106a-1 of the optical communication system 106, for example the optical communication system 106 itself, is arranged between two chiplets 104a, 104b, for example along a height coordinate extending along a surface normal n1 of the surface 102a of the substrate 102. In some examples, this allows, for example, chiplets 104a, 104c, ..., 104b, ... of different layers of the stack configuration according to Fig. 5 to be efficiently connected to the optical communication system 106.

[0074] Fig. 6 shows a device 100e according to further examples already mentioned above. On the carrier 102 of the device 100e, for example, eight chiplets 104a, 104b, ..., 104h are arranged, each having its own, for example, integrated, optical receiver RX. An optical transmission medium 106a is arranged in a space RB between the chiplets 104a, 104b, ..., 104h, to which the receiver RX of the chiplets 104a, 104b, ..., 104h are connected, so that the chiplets 104a, 104b, ..., 104h can receive optical signals via the transmission medium 106a. For example, two optical transmitting devices TX-1 , TX-2 are arranged approximately in the middle between four chiplets 104a, 104b, 104e, 104f and 104c, 104d, 104g, 104h, which are also connected to the transmission medium 106a.

[0075] In some examples, the first optical transmitter TX-1, e.g. in a time-division multiplex operation, can be used by the chiplets 104a, 104b, 104e, 104f, wherein the chiplets 104a, 104b, 104e, 104f are each connected to the first optical transmitter TX-1 by, e.g. a dedicated electrical data connection, which is not shown in Fig. 6 for the sake of clarity.

[0076] In some examples, the second optical transmitter TX-2, e.g. in a time-division multiplex operation, can be used by the chiplets 104c, 104d, 104g, 104h, wherein the chiplets 104c, 104d, 104g, 104h are each connected to the second optical transmitter TX-2 by, e.g. a dedicated electrical data connection, which is not labelled in Fig. 6 for the sake of clarity.

[0077] In some examples, the optical transmitting devices TX-1, TX-2 can each be designed as (e.g., another) chiplet.

[0078] In some examples, the optical transmitting devices TX-1, TX-2 can be arranged on carrier 102, for example.

[0079] In some examples, aspects of a stacked arrangement according to Fig. 5 can also be combined with aspects of the arrangement according to Fig. 6.

[0080] Some examples, Fig. 7, relate to a product, for example a control unit, 10, for example for a motor vehicle 20 (Fig. 8), comprising at least one device 100 according to the disclosure.

[0081] Some examples, Fig. 8, relate to a vehicle, for example a motor vehicle, 20, comprising at least one device 100 according to the disclosure and / or at least one product 10 according to the disclosure.

[0082] Some examples, Fig. 9, relate to a method for providing a device 100 (Fig. 1) comprising a carrier 102, several chiplets 104a, 104b, ... arranged on the carrier 102, and an optical communication system 106, wherein at least some of the chiplets are configured to exchange data via the optical communication system, the method comprising: providing 200 the carrier 102, arranging 202 the several chiplets 104a, 104b, ... on the carrier 102, arranging 204 the optical communication system 106, for example in the area of ​​at least some chiplets 104a, 104b, ..., for example on the carrier 102, and optionally, arranging 206 at least one first optical transmitting device TX-1 for transmitting optical signals via the optical communication system 106 on the carrier 102.

[0083] In some examples, Fig. 10, the method is provided to include at least one of the following elements: a) establishing 210 an electrical data connection DV-el-1 between a chiplet 104a and the at least one first optical transmitter TX-1, or b) establishing 212 an optical connection between an optical receiver RX of at least one chiplet 104a and at least one component 106a of the optical communication system 106, or c) providing 214 an interposer IP with at least one optical transmission medium 106a integrated at least partially, for example completely, into the interposer IP, wherein, for example, the optical transmission medium 106a includes at least one of the following elements and / or is configured as at least one of the following elements: c1) optical conductor, for example optical fiber, or c2) optically conductive substrate, for example glass substrate, or c3) free-space transmission path.for example in an environmental medium or vacuum, or c4) trench or channel, for example in a substrate or interposer, or c5) fluid optical fiber, or d) filling 216 a spatial region RB (Fig. 6) that at least partially surrounds at least one chiplet and / or at least one component of the optical communication system and / or the first optical transmitting device with an optical transmission medium OM, for example a fluid.

[0084] Further aspects and examples are described below, which – in the case of further examples – can each be combined individually or in any combination with at least one of the aspects and / or examples described above.

[0085] In some examples, the principle according to the disclosure allows chiplets 104a, 104b, ... to be optically connected to each other, whereby, for example, the optical communication system 106 can be considered and / or configured as an optical network. In some examples, this enables a high bandwidth, e.g., for the exchange or forwarding of data via the optical network 106, as is usable, for example, for computer vision tasks where, for example, large amounts of data are transmitted in one direction, e.g., from a data source such as a camera, e.g., via a neural network (e.g., implemented on a first chiplet 104a) for data processing, and possibly further to decision-making instance(s) (e.g., implemented on a second chiplet 104b).

[0086] In some examples, Fig. 1, 2, 3, the chiplets 104a, 104b, ... each have an integrated optical receiver RX, but they do not have their own, e.g. integrated, transmitter TX-1.

[0087] In some examples, the optical transmitter TX-1 is provided, for example, in the form of a dedicated chiplet, e.g., with an integrated laser (e.g., "laser chiplet"), e.g., as a separate module; in other examples, however, it can also be part of another, e.g., larger, chiplet 105.

[0088] In some examples, Fig. 6, several chiplets 104a, 104b, 104e, 104f, e.g., in the immediate vicinity of transmitter TX-1, are connected to transmitter TX-1 via individual electrical data connections, e.g., "cable connections". This allows, in some examples, the avoidance of chiplet-wide electrical data buses.

[0089] In some examples, Fig. 6, a type of multiplexing can be implemented, be it temporal, frequency-wise, by modulation or any combination thereof, e.g., so that the optical network 106 can be used by several chiplets 104a, 104b, ... e.g., without collisions.

[0090] In some examples, it may be provided that a chiplet 104a, which wants to transmit data optically, waits until the optical transmission medium 106a is available (e.g., determined by monitoring any transmissions that may be taking place, e.g., using the receiving device RX), and then, when the optical transmission medium 106a is available, i.e., free, the chiplet 104a can, for example, use the nearest transmitting module TX-1 to transmit its data optically.

[0091] In some examples, all chiplets or devices connected to the network 106 can receive data, such as messages, transmitted via the optical transmission medium 106a. In other examples (not shown), a chiplet 104a can also be connected to multiple optical transmitters TX-1 and TX-2, for example, via appropriate electrical data connections (not shown). This allows the chiplet 104a further flexibility by enabling the selection of the optical transmitter TX-1 or TX-2.

[0092] In some examples, the implementation can be made more cost-effective by sharing the optical transmitting devices TX-1, TX-2 with several, e.g., neighboring, chiplets.

[0093] In some examples, the spatial arrangement, for example distribution, of the optical transmitting devices TX-1, TX-2 can be adapted to the actual needs of the chiplets 104a, 104b, ... involved.

[0094] In some examples, for instance an interface chiplet that houses several camera interfaces may have a dedicated optical transmitting device (e.g., a "TX module") (e.g., located next to the interface chiplet (or, in some examples, integrated into the interface chiplet)), while, for example, a watchdog chiplet may not be connected to the optical network 106 at all.

[0095] In some examples where several chiplets share an optical transmitter TX-1, manufacturing the device is more cost-effective and avoids, for example, long data paths with electrical connections, such as "cables". On the other hand, in some examples, an upstream direction (e.g., from a chiplet 104a to the optical communication system, e.g., network, 106) can be implemented locally, for example, by the optical receiver integrated into the chiplet 104a.

[0096] In some examples, the optical communication system 106, e.g. designed as an optical network, can use at least one wave-conducting fiber or another medium such as a glass substrate, on which in some examples at least some of the chiplets 104a, 104b, ... can be mounted.

[0097] In some examples, it is possible to use the optical

[0098] The optical signals associated with the communication system 106 can be transmitted through a gas such as air or a protective gas, or—if possible within a housing for the device—through a vacuum. In other words, in some examples, at least section by section, free-space transmission of the optical signals associated with the optical communication system 106 is also possible.

[0099] In some examples it is possible to form a waveguide in the form of a trench (e.g. "trench"), e.g. silicon trench, e.g. with suitable dimensions, e.g. on the carrier 102 and / or an, e.g. silicon, interposer.

[0100] In some examples, such as 3D packaging, it is possible to consider using a fluid, e.g., a clear, non-electrically conductive liquid, as an optical transmission medium, e.g., a liquid waveguide. In some examples, the fluid can be "installed" after the components, e.g., chiplets 104a, 104b, ..., have been stacked, meaning it can be introduced, for example, into a space around the chiplets 104a, 104b, ... and fill designated channels.

[0101] In some examples, Fig. 5, e.g., when a 3D stack of the device 100d consists of two layers (e.g., first layer chiplets 104a, 104c, second layer chiplet(s) 104b), the optical network 106 can be arranged, e.g., in the middle, i.e., between the two chiplet layers, so that chiplets 104a, 104b, 104c, ... of both chiplet layers can efficiently access the optical network 106.

[0102] Some examples, Fig. 11, relate to a use 300 of the device 100, 100a, 100b, 100c, 10Od, 10Oe according to the disclosure and / or the product 10 according to the disclosure and / or the vehicle 20 according to the disclosure and / or the method according to the disclosure for at least one of the following elements: a) optical data exchange 301 between several chiplets 104a, 104b, ... arranged on the carrier 102, or b) distributing 302 information to at least one chiplet, for example several chiplets arranged on the same carrier by means of optical data communication, or c) bridging 303 comparatively large distances for comparatively fast, for example high-bit-rate, data transmission between several chiplets 104a, 104b, ..., arranged on the same carrier 102, or d) increasing 304 a range (e.g."reach") of a, for example, comparatively fast, for example, high-bit-rate, data transmission, for example to a PCIe system or a UCIe system, or e) providing 305 a multi-chiplet system 1000 (Fig. 1) in which several chiplets each have their own optical receiver device, for example, integrated into the respective chiplet, and in which, for example, at least some chiplets share an optical transmitter device, for example according to a time-division multiplex operation, wherein, for example, the optical transmitter device is not located in any of the chiplets, i.e., for example, outside the chiplets, wherein, for example, the optical transmitter device is located in another chiplet 105, for example, dedicated for sending optical signals.

[0103] As mentioned above, the principle according to the disclosure includes both examples and embodiments with an optical communication system and, if applicable, one or more optical components, as well as examples with an electrical communication system and, if applicable, one or more electrical components. In this respect, the aspects described above apply, according to some examples relating to an optical communication system, to an electrical communication system in some other examples.

Claims

Claims 1. Device (100; 100a; 100b; 100c; 100d; 100e) comprising a carrier (102), several chiplets (104a, 104b, ...) arranged on the carrier (102) and an optical or electrical communication system (106), wherein at least some of the chiplets (104a, 104b) are configured to exchange data via the communication system (106).

2. Device (100; 100a; 100b; 100c; 100d; 100e) according to claim 1, wherein at least one of the chiplets (104a, 104b, ...), for example some or all chiplets (104a, 104b, ...), has a receiver device (RX) for receiving signals from the communication system (106), wherein, for example, the receiver device (RX) is configured as an optical receiver device or as an electrical receiver device.

3. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of the preceding claims, wherein a source (Q-OS; Q-OS') of optical or electrical signals, configured to transmit optical or electrical signals via the communication system (106), is provided, wherein, for example, a) the source (Q-OS) is arranged on the carrier (102), and / or wherein, for example, b) the source (Q-OS') is located outside the carrier (102), for example, outside the device (100; 100a; 100b; 100c; 10Od; 10Oe), is arranged.

4. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of the preceding claims, comprising at least one first transmitting device (TX-1) for transmitting signals via the communication system (106), wherein, for example, the at least one first transmitting device (TX-1) is designed as a chiplet or is integrated into at least one further chiplet (105), wherein, for example, the first transmitting device (TX-1) is designed as an optical transmitting device or as an electrical transmitting device.

5. Device (100; 100a; 100b; 100c; 100d; 10Oe) according to claim 4, wherein at least one chiplet (104a) of the several chiplets (104a, 104b, ...) arranged on the carrier (102) is configured to transmit signals via the communication system (106) by means of the at least one first transmitting device (TX-1).

6. Device (100; 100a; 100b; 100c; 100d; 10Oe) according to claim 4 or 5, wherein at least two chiplets (104a, 104b) of the several chiplets (104a, 104b, ...) arranged on the carrier (102) are configured to transmit signals via the communication system (106) by means of the at least one first transmitting device (TX-1), wherein, for example, the at least one first transmitting device (TX-1) can be used jointly by the at least two chiplets (104a, 104b), for example in a time-division multiplex operation.

7. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of claims 4 to 6, wherein at least one chiplet (104a, 104b, ...) has an electrical data connection (DV-el-1 , DV-el-2) to the at least one first transmitting device (TX-1), wherein, for example, a first chiplet (104a) has a first electrical data connection (DV-el-1) to the at least one first transmitting device (TX-1) and wherein, for example, a second chiplet (104b) has a second electrical data connection (DV-el-2) to the at least one first transmitting device (TX-1), wherein, for example, the first electrical data connection (DV-el-1) is different, for example, separate, from the second electrical data connection (DV-el-2).

8. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of claims 4 to 7, wherein the at least one first transmitting device (TX-1) is arranged on the carrier (102).

9. Device (100; 100a; 100b; 100c; 100d; 10Oe) according to at least one of claims 4 to 8, wherein the at least one first transmitting device (TX-1) is arranged next to, for example adjacent to, at least one of the chiplets (104a, 104b, ...).

10. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of claims 4 to 9, wherein the at least one first transmitting device (TX-1) is arranged between two chiplets (104a, 104b, ...).

11. Device (100; 100a; 100b; 100c; 100d; 10Oe) according to at least one of claims 4 to 9, wherein at least two chiplets (104a, 104b) are configured to share the at least one first transmitting device (TX-1), for example to use in a time-division multiplex operation.

12. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of the preceding claims, wherein the communication system (106) is an optical communication system and comprises at least one optical transmission medium (106a).

13. Device (100; 100a; 100b; 100c; 100d; 100e) according to claim 12, wherein the at least one optical transmission medium (106a) comprises at least one of the following elements and / or is configured as at least one of the following elements: a) optical conductor (106a-1), for example optical fiber, or b) optically conductive substrate (106a-2), for example glass substrate, or c) free-space transmission path (106a-3), for example in an ambient medium or vacuum, or d) trench or channel (106a-4), for example in a substrate or interposer, or e) fluid optical fiber (106a-5).

14. Device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of the preceding claims, wherein at least some components (104a, 104b, ..., 106, TX-1), for example with respect to a surface (102a) of the carrier (102), are arranged one above the other.

15. Device (100; 100a; 100b; 100c; 100d; 100e) according to claim 14, wherein at least one component (106a-1) of the communication system (106), for example the communication system (106), is arranged between two chiplets (104a, 104b), for example along a height coordinate extending along a surface normal (n1) of a surface (102a) of the carrier (102).

16. Product (10), for example control unit, for example for a motor vehicle (20), comprising at least one device (100; 100a; 100b; 100c; 10Od; 100e) according to at least one of the preceding claims.

17. Vehicle, for example motor vehicle, (20), comprising at least one device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of claims 1 to 15 and / or at least one product, for example control unit, (20) according to claim 16.

18. Method for providing a device (100; 100a; 100b; 100c; 100d; 100e) comprising a carrier (102), several chiplets (104a, 104b, ...) arranged on the carrier (102), and an optical or electrical communication system (106), wherein at least some of the chiplets (104a, 104b) are configured to exchange data via the communication system (106), the method comprising: providing (200) the carrier (102), arranging (202) the several chiplets (104a, 104b, ...) on the carrier (102), arranging (204) the communication system (106), for example in the area of ​​at least some chiplets (104a, 104b), for example on the carrier (102), and optionally, arranging (206) at least one first transmitting device (TX-1) for transmitting signals via the communication system (106) on the carrier (102).

19. The method of claim 18, comprising at least one of the following elements, wherein the communication system (106) is an optical communication system, and wherein the method comprises: a) establishing (210) an electrical data connection (DV-el-1) between a chiplet (104a) and the at least one first optical transmitting device (TX-1), or b) establishing (212) an optical connection between an optical receiving device (RX) of at least one chiplet (104a, 104b, ...) and at least one component (106a) of the optical communication system (106), or c) providing (214) an interposer (IP) with at least one optical transmission medium (106a) integrated at least partially, for example completely, into the interposer (IP), wherein, for example, the optical transmission medium (106a) has at least one of the following elements and / or is configured as at least one of the following elements: c1) optical conductor (106a-1), for example optical fiber, or c2) optically conductive substrate (106a-2), for example glass substrate, or c3) free-space transmission path (106a-. 3), for example in an environmental medium or vacuum, or c4) trench or channel (106a-4), for example in a substrate or interposer, or c5) fluid optical fiber (106a-5), or d) filling (216) a spatial region that at least partially surrounds at least one chiplet (104a) and / or at least one component of the optical communication system (106) and / or the first optical transmitting device (TX-1) with an optical transmission medium (OM), for example a fluid.

20. Use (300) of the device (100; 100a; 100b; 100c; 100d; 100e) according to at least one of claims 1 to 15 and / or of the product (10) according to claim 16 and / or of the vehicle (20) according to claim 17 and / or of the method according to at least one of claims 18 to 19 for at least one of the following elements: a) data exchange (301), for example optical or electrical data exchange, between several chiplets (104a, 104b, ...) arranged on the carrier (102), or b) distribution (302) of information to at least one chiplet (104a, 104b, ...), for example several chiplets (104a, 104b, ...) arranged on the same carrier (102) by means of optical or electrical data communication, or c) bridging (303) comparatively large distances for comparatively fast, for example high-bit-rate, data transmission between several chiplets (104a, 104b, ...) arranged on the same carrier (102), or d) increase (304) a range of, for example, a comparatively fast, for example, high-bit-rate, data transmission, for example to a PCIe system or a UCIe system, or (e) providing (305) a multi-chiplet system (1000) in which several chiplets (104a, 104b, ...) each have their own optical or electrical receiver (RX), for example, integrated into the respective chiplet (104a, 104b, ...), and in which, for example, at least some chiplets (104a, 104b, ...) share an optical or electrical transmitter (TX-1, TX-2), for example, according to a time-division multiplexing operation, wherein, for example, the optical or electrical transmitter (TX-1, TX-2) is not located in any of the chiplets (104a, 104b, ...), i.e., for example, outside the chiplets (104a, 104b, ...), wherein, for example, the optical or electrical transmitting device (TX-1 , TX-2) is arranged in a further chiplet 105, which is dedicated, for example, to transmitting optical or electrical signals.

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