Connector

The connector design addresses electromagnetic noise and interference by integrating shielding members that contact the circuit board and partition walls, enhancing signal integrity through continuous noise dissipation.

WO2025249170A1PCT designated stage Publication Date: 2025-12-04AUTONETWORKS TECH LTD +2
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Patent Information

Application Number
PCT/JP2025/017526
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-28
Filing Date
2025-05-14
Publication Date
2025-12-04

AI Technical Summary

Technical Problem

Existing connectors with multiple inner conductors suffer from unsuppressed electromagnetic noise and interference, such as crosstalk, due to gaps between circuit boards and shielding members.

Method used

A connector design featuring conductive shielding members that contact both the circuit board and partition walls, eliminating gaps between adjacent inner conductors, and are integrated with the outer conductor to form a continuous conductive path for electromagnetic noise dissipation.

Benefits of technology

The design effectively suppresses electromagnetic noise and interference by ensuring continuous contact with the circuit board, reducing crosstalk and improving signal integrity.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the present invention, the adverse effect of electromagnetic noise between adjacent inner conductors can be suppressed. A connector (1) comprises: a plurality of pairs of large inner conductors (70) and small inner conductors (170) for differential communication; a plurality of large dielectrics (60) and small dielectrics (160) to which the large inner conductors (70) and the small inner conductors (170) of each pair are respectively assembled; and an outer conductor (30) for accommodating the plurality of large dielectrics (60) and small dielectrics (160). The connector (1) is provided with an electrically conductive shielding member (80) which is arranged between a second connecting portion (72) of one pair of large inner conductors (70) assembled to one of the large dielectrics (60) and a second connecting portion (172) of another pair of small inner conductors (170) assembled to the small dielectric (160) adjacent to said large dielectric (60). The shielding member (80) is in contact with a ground circuit (104) of a circuit board (100).
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Description

connector

[0001] The present disclosure relates to connectors.

[0002] In connectors having multiple inner conductors, it is desirable to suppress crosstalk between the inner conductors. For example, a connector disclosed in Patent Document 1 includes an outer conductor, multiple dielectrics housed within the outer conductor, inner conductors attached to each dielectric, and a shielding member disposed between adjacent dielectrics within the outer conductor.

[0003] JP 2023-18176 A

[0004] However, in the connector configuration of Patent Document 1, gaps exist between the circuit board and the shielding member between vertically adjacent inner conductors. As a result, the adverse effects of electromagnetic noise between the inner conductors are not sufficiently suppressed, and there is a risk of electromagnetic interference such as crosstalk occurring between the inner conductors. The connector of the present disclosure was developed based on the above-mentioned circumstances, and aims to provide a connector that can suppress the adverse effects of electromagnetic noise between adjacent inner conductors.

[0005] The connector of the present disclosure comprises: a plurality of pairs of inner conductors for differential communication; a plurality of dielectrics to which the inner conductors of each pair are respectively assembled; and an outer conductor that houses the plurality of dielectrics, wherein the outer conductors have a plurality of accommodating chambers that accommodate a portion of the inner conductors of each pair; the inner conductors have a first connection portion that is housed in the accommodating chamber and connected to a mating inner conductor; and a second connection portion that is exposed to the outside of the accommodating chamber and connected to a circuit board; and a conductive shielding member is provided between the second connection portion of one pair of inner conductors assembled to one of the dielectrics and the second connection portion of the other pair of inner conductors assembled to another dielectric adjacent to the one of the dielectrics, and the shielding member is in contact with a ground circuit of the circuit board.

[0006] According to the present disclosure, a connector can be realized that can suppress the adverse effects of electromagnetic noise between adjacent inner conductors.

[0007] FIG. 1 is a perspective view of a connector of a first embodiment. FIG. 2 is an exploded perspective view of the connector of FIG. 1 as seen from the front side. FIG. 3 is an exploded perspective view of the connector of FIG. 1 as seen from the rear side. FIG. 4 is an exploded perspective view of the shielding member of FIGS. 2 and 3 as seen from the rear side. FIG. 5 is an exploded perspective view of the shielding member of FIGS. 2 and 3 as seen from the front side. FIG. 6 is a perspective view of the large terminal module of FIG. 1 as seen from the front side. FIG. 7 is a rear view of the connector of FIG. 1. FIG. 8 is a bottom view of the connector of FIG. 1. FIG. 9 is a cross-sectional view showing the A-A cross section of FIG. 7. FIG. 10 is a perspective view of the shielding member of a second embodiment as seen from the rear side. FIG. 11 is a perspective view showing the shielding member of FIG. 10 assembled to the outer conductor, partially in cross section. FIG. 12 is a side cross-sectional view of the connector of a third embodiment as seen from the left side. FIG. 13 is a perspective view of the shielding member of the third embodiment as seen from the rear side. FIG. 14 is a perspective view showing the shielding member of FIG. 13 assembled to the outer conductor, partially in cross section.

[0008] [Explanation of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described. (1) A connector comprising: a plurality of pairs of inner conductors for differential communication; a plurality of dielectrics to which the inner conductors of each pair are respectively attached; and an outer conductor accommodating the plurality of dielectrics, wherein the outer conductor has a plurality of accommodating chambers to accommodate a portion of the inner conductors of each pair, wherein the inner conductors have: a first connection portion that is housed in the accommodating chamber and connected to a mating inner conductor, and a second connection portion that is exposed to the outside of the accommodating chamber and connected to a circuit board, wherein a conductive shielding member is provided between the second connection portion of one pair of the inner conductors attached to one of the dielectrics and the second connection portion of the other pair of the inner conductors attached to another dielectric adjacent to the one of the dielectrics, and the shielding member is in contact with a ground circuit of the circuit board.

[0009] In the connector of (1), a shielding member is disposed between the second connection portions of two adjacent pairs of inner conductors, thereby suppressing the adverse effects of electromagnetic noise between the second connection portions of the two adjacent pairs of inner conductors. Furthermore, because the shielding member is in contact with the ground circuit of the circuit board, the current flowing through the shielding member can be released to the circuit board. Therefore, the connector can suppress the adverse effects of electromagnetic noise between adjacent inner conductors.

[0010] (2) The connector according to (1), wherein the shielding member has a plate portion, and the entire width of the plate portion is in contact with the circuit board.

[0011] The connector (2) does not have gaps between the shielding member and the circuit board between adjacent inner conductors, making it easier to suppress the adverse effects of electromagnetic noise between adjacent inner conductors compared to a configuration in which gaps exist.

[0012] (3) The connector according to (2), wherein the plate portion is in face-to-face contact with the circuit board.

[0013] The connector (3) is less likely to have gaps between the shielding member and the circuit board between adjacent inner conductors, making it easier to suppress the adverse effects of electromagnetic noise between adjacent inner conductors than in a configuration in which gaps exist.

[0014] (4) A connector described in any of (1) to (3), wherein the shielding member is arranged between the entire portion of the second connection portion of one pair that is accommodated in one of the dielectrics and the entire portion of the second connection portion of the other pair that is accommodated in the other dielectric.

[0015] The connector (4) can suppress the adverse effects of electromagnetic noise between the portions of each pair of second connecting portions housed in the dielectric.

[0016] (5) The connector according to any one of (1) to (4), wherein at least a portion of the accommodating chamber is partitioned by a partition wall, and the shielding member is in contact with the partition wall.

[0017] In the connector of (5), a partition wall of the outer conductor is provided between the first connection portions of two adjacent pairs of inner conductors, thereby suppressing the adverse effects of electromagnetic noise between the first connection portions of the two adjacent pairs of inner conductors. Furthermore, because the shielding member is in contact with the partition wall, no gap is created between the shielding member and the partition wall between the adjacent inner conductors, and the adverse effects of electromagnetic noise between the adjacent inner conductors can be suppressed compared to a configuration in which a gap exists.

[0018] (6) The connector according to (5), wherein the outer conductor has a slit formed in the partition wall, and a part of the shielding member is press-fitted into the slit.

[0019] The connector (6) can maintain a state in which the shielding member and the partition wall are in reliable contact with each other.

[0020] (7) The connector described in (6), wherein the shielding member has a second plate portion inserted into the slit and a protrusion protruding from the second plate portion, and the protrusion contacts the inner surface of the slit.

[0021] In the connector (7), the shielding member is prevented from coming off by the slit in the partition wall.

[0022] (8) The connector described in (7), wherein the shielding member has a first protrusion protruding from one plate surface of the second plate portion and a second protrusion protruding from the other plate surface of the second plate portion, the first protrusion and the second protrusion are arranged alternately in a direction parallel to the plate surface of the second plate portion, and the first protrusion and the second protrusion contact the inner surface of the slit.

[0023] In the connector (8), the elastic restoring force of the plate portion allows all of the projections to reliably contact the inner surface of the slit, ensuring sufficient contact pressure.

[0024] [Details of the embodiment of the present disclosure] [Example 1] Example 1 embodying the present disclosure will be described with reference to Figures 1 to 9. In this Example 1, with regard to the front-to-rear direction, the F direction in Figure 1 is defined as the front. The front is the direction in which the connector 1 is mated with the mating connector (not shown). With regard to the up-down direction, the H direction in Figure 1 is defined as the upward direction. With regard to the left-to-right direction, the R direction in Figure 1 is defined as the rightward direction.

[0025] A connector 1 according to the first embodiment is shown in FIG. 1. As shown in FIGS. 2 and 3, the connector 1 is configured by assembling a shield terminal 10 and a hood member 20. The hood member 20 is made of insulating synthetic resin. The hood member 20 is a single component having a base 21 and a tubular connecting portion 22. The base 21 is wall-shaped with its thickness oriented in the front-to-rear direction. A through-hole 23 is formed in the base 21, penetrating it in the thickness direction. The tubular connecting portion 22 protrudes forward from the outer periphery of the base 21 in the shape of a rectangular tube.

[0026] 2 and 3, the shield terminal 10 is configured by assembling an outer conductor 30, a pair of large terminal modules 40 arranged side by side, and a pair of small terminal modules 50 arranged side by side. The shield terminal 10 includes multiple pairs of inner conductors for differential communication (large inner conductors 70 and small inner conductors 170).

[0027] The outer conductor 30 is made of a conductive metal. The outer conductor 30 is a single die-cast component. The outer conductor 30 has a box-shaped main body 31 with open rear and bottom surfaces, and four connection ports 32 that protrude forward from the box-shaped main body 31 in a cylindrical shape. As shown in Figures 7 and 8 , the interior of the box-shaped main body 31 is divided into two left and right storage spaces 34 by a partition wall 33. As shown in Figure 2 , the four connection ports 32 are aligned vertically and horizontally. As shown in Figure 9 , the inner spaces of the connection ports 32 communicate with the storage space 34 via a central space 35.

[0028] As shown in FIG. 9 , the outer conductor 30 has an upper accommodating chamber 36 extending in the front-rear direction from the upper front end of the accommodating space 34 to the front end of the upper connection port 32. The inner space of the upper accommodating chamber 36 is composed of the inner space of the upper connection port 32 and an upper central space 35. The upper accommodating chamber 36 accommodates a fixing portion 61 of a large dielectric 60, which will be described later. The outer conductor 30 has a lower accommodating chamber 37 extending in the front-rear direction from the lower front end of the accommodating space 34 to the front end of the lower connection port 32. The inner space of the lower accommodating chamber 37 is composed of the inner space of the lower connection port 32 and the lower central space 35. The lower accommodating chamber 37 accommodates a fixing portion 161 of a small dielectric 160, which will be described later.

[0029] As shown in FIG. 7, left and right inner walls 31A constituting the storage space 34 of the box-shaped main body 31 are formed with recesses 31B recessed outward in the left-right direction.

[0030] As shown in FIG. 9 , the outer conductor 30 has a partition wall 38 that separates a portion of the pair of upper accommodating chambers 36 from a portion of the pair of lower accommodating chambers 37. Specifically, the partition wall 38 vertically separates the rear end portions of the pair of upper accommodating chambers 36 (portions rearward of the upper connection ports 32) from the rear end portions of the pair of lower accommodating chambers 37 (portions rearward of the lower connection ports 32). The partition wall 38 has a strip shape that is long in the left-right direction and is continuous with the left and right wall portions of the box-shaped main body 31. The wall surfaces of the partition wall 38 are perpendicular to the up-down direction. The front end of the partition wall 38 is continuous with the lower rear end of the upper connection port 32 and the upper rear end of the lower connection port 32.

[0031] A pair of slits 39 are formed in the partition wall 38, aligned on the left and right. The left slit 39 is visible in Figure 9. The slit 39 is recessed forward from the rear end of the partition wall 38. The slit 39 has a rectangular shape that is long in the left-right direction when viewed from the top-bottom direction. The lower edge of the slit 39 at the rear end of the partition wall 38 is located forward of the upper edge of the slit 39 at the rear end of the partition wall 38.

[0032] As shown in Figures 7 to 9, the outer conductor 30 is placed on a circuit board 100. The lower end of the box-shaped main body 31 is in contact with the circuit board 100. As shown in Figures 8 and 9, the circuit board 100 is formed with mounting holes 101 into which the large inner conductor 70 and the small inner conductor 170 described below are inserted. A conductive portion 102 is formed inside the mounting hole 101. An insulating portion 103 made of resist or the like is formed around the conductive portion 102.

[0033] <Large Terminal Module 40> As shown in Fig. 6, the large terminal module 40 is configured by assembling a large dielectric 60, a large inner conductor 70, and a shielding member 80. The large inner conductor 70 is assembled to the large dielectric 60. The large dielectric 60 is made of insulating synthetic resin. The large dielectric 60 is a single component having a fixing portion 61 and a guide portion 62. The fixing portion 61 is a solid portion that is elongated in the front-rear direction. A cross section of the fixing portion 61 perpendicular to the front-rear direction is an ellipse that is elongated in the left-right direction. As shown in Fig. 9, the fixing portion 61 is formed with a pair of left and right through holes 63 extending in the front-rear direction.

[0034] The guide portion 62 extends obliquely downward and rearward from the rear end of the fixed portion 61. A pair of left and right grooves 64 are formed in the guide portion 62, extending downward and rearward from the rear ends of the pair of through holes 63 of the fixed portion 61. The bottom surfaces of the grooves 64 are continuous with the bottom surfaces of the through holes 63 at an obtuse angle when viewed from the left and right. The grooves 64 are open rearward. The lower rear ends of the grooves 64 are open downward.

[0035] As shown in FIG. 9 , when the shield terminal 10 is placed on the circuit board 100 , the lower end of the large dielectric 60 (the lower end of the guide portion 62 ) is spaced apart from the upper surface of the circuit board 100 .

[0036] The large inner conductor 70 is made of a single, elongated metal plate and is formed as a single component by bending the metal plate in the same direction as its thickness. As shown in Fig. 9, the large inner conductor 70 has a first connecting portion 71, a second connecting portion 72, and a bent portion 73. The first connecting portion 71 is accommodated in the upper accommodating chamber 36 and connected to a mating inner conductor (not shown). The second connecting portion 72 is exposed to the outside of the lower accommodating chamber 36 and connected to the circuit board 100.

[0037] The first connecting portion 71 has an elongated shape extending in the front-rear direction. A narrow tab 74 is formed at the front end of the first connecting portion 71.

[0038] The second connecting portion 72 extends downward and rearward from the rear end of the first connecting portion 71. The upper end of the second connecting portion 72 and the rear end of the first connecting portion 71 are connected via a bent portion 73. When viewed from the left and right, the rear end of the first connecting portion 71 and the upper end of the second connecting portion 72 are connected at an obtuse angle. The second connecting portion 72 has a linear inclined portion 75 that forms the upper end portion of the second connecting portion 72, and a linear vertical portion 76 that forms the lower end portion of the second connecting portion 72. The vertical portion 76 is connected to the inclined portion 75 at an obtuse angle. The vertical portion 76 and the first connecting portion 71 form a right angle.

[0039] The shielding member 80 is electrically conductive. The shielding member 80 is a single component formed by bending a metal plate, and functions as an outer conductor. As shown in Figures 4 and 5 , the shielding member 80 has a base portion 81, a pair of side plate portions 82, an upper plate portion 83, and a lower plate portion 84. The shielding member 80 is assembled to the large dielectric 60 by press-fitting from the front. The base portion 81 is disposed so as to be in close contact with the front surface of the guide portion 62. The side plate portions 82 are disposed so as to be in close contact with both left and right outer surfaces of the guide portion 62.

[0040] The upper plate portion 83 corresponds to an example of a "second plate portion" in the present disclosure. The upper plate portion 83 extends forward from the upper edge of the base plate portion 81. The upper plate portion 83 is connected to the base plate portion 81 at an obtuse angle. The upper plate portion 83 is a rectangular plate that is long in the left-right direction.

[0041] The pair of side plate portions 82 extend rearward from the left and right edges of the base plate portion 81 at right angles to the base plate portion 81. The pair of side plate portions 82 face each other in parallel with a gap between them. The side plate portions 82 protrude rearward and below the base plate portion 81. A gap is formed between the side plate portions 82 and the lower plate portion 84.

[0042] A pair of first protrusions 85 and a pair of second protrusions 86 are formed on the upper plate portion 83. The first protrusions 85 and the second protrusions 86 correspond to an example of a "protrusion" in the present disclosure. The pair of first protrusions 85 protrude from one plate surface (upper surface) of the upper plate portion 83. The second protrusion 86 protrudes from the other plate surface (lower surface) of the upper plate portion 83. The pair of first protrusions 85 and second protrusions 86 are formed at a position slightly rearward of the center of the upper plate portion 83 in the front-to-rear direction.

[0043] The pairs of first protrusions 85 and second protrusions 86 are arranged alternately in a direction parallel to the plate surface of the upper plate portion 83. Specifically, the pairs of first protrusions 85 and second protrusions 86 are arranged alternately in the left-right direction. The second protrusion 86 is formed at the center of the upper plate portion 83 in the left-right direction. The pair of first protrusions 85 are formed at positions sandwiching the second protrusion 86 in the left-right direction.

[0044] The pair of first and second protrusions 85, 86 are formed by, for example, hammering. The first and second protrusions 85, 86 have a shape in which the amount of protrusion decreases toward the front. The rear ends of the first and second protrusions 85, 86 rise steeply in the vertical direction.

[0045] The lower plate portion 84 corresponds to an example of a "plate portion" in the present disclosure. The lower plate portion 84 extends vertically downward from the lower edge of the base plate portion 81. The lower plate portion 84 is connected to the base plate portion 81 at an obtuse angle. The lower plate portion 84 is a rectangular plate that is long in the left-right direction.

[0046] <Small-sized terminal module 50> As shown in Figures 2, 3, and 9, the small-sized terminal module 50 is configured by assembling a small-sized dielectric 160 and a small-sized inner conductor 170. The small-sized inner conductor 170 is assembled to the small-sized dielectric 160. The small-sized dielectric 160 is made of insulating synthetic resin. The small-sized dielectric 160 is a single component having a fixing portion 161 and a guide portion 162. The fixing portion 161 is a longitudinal solid portion that is long in the front-rear direction. A cross section of the fixing portion 161 perpendicular to the front-rear direction is an ellipse that is long in the left-right direction. As shown in Figure 9, the fixing portion 161 is formed with a pair of left and right through holes 163 that extend in the front-rear direction.

[0047] As shown in Figure 9, the guide portion 162 extends obliquely downward and rearward from the rear end of the fixed portion 161. A pair of left and right grooves 164 are formed in the guide portion 162, extending downward and rearward from the rear ends of the pair of through holes 163 of the fixed portion 161. The bottom surfaces of the grooves 164 are continuous with the bottom surfaces of the through holes 163 at an obtuse angle when viewed from the left and right. The grooves 164 are open rearward. The lower rear ends of the grooves 164 are open downward.

[0048] As shown in FIG. 9 , when the shield terminal 10 is placed on the circuit board 100 , the lower end of the small dielectric 160 (the lower end of the guide portion 162 ) is spaced apart from the upper surface of the circuit board 100 .

[0049] The small inner conductor 170 is made of a single, elongated metal plate and is a single component formed by bending the metal plate in the same direction as its thickness. As shown in Fig. 9, the small inner conductor 170 has a first connection portion 171, a second connection portion 172, and a bent portion 173. The first connection portion 171 has an elongated shape extending in the front-to-rear direction. A narrow tab 74 is formed at the front end of the first connection portion 171.

[0050] The second connecting portion 172 extends downward and rearward from the rear end of the first connecting portion 171. The upper end of the second connecting portion 172 and the rear end of the first connecting portion 171 are connected via a bent portion 173. When viewed from the left and right, the rear end of the first connecting portion 171 and the upper end of the second connecting portion 172 are connected at an obtuse angle. The second connecting portion 172 has a linear inclined portion 175 that forms the upper end portion of the second connecting portion 172, and a linear vertical portion 176 that forms the lower end portion of the second connecting portion 172. The vertical portion 176 is connected to the inclined portion 175 at an obtuse angle. The vertical portion 176 and the first connecting portion 171 form a right angle.

[0051] 9, the shielding member 80 is disposed between the large dielectric 60 and the small dielectric 160 adjacent to the large dielectric 60. Specifically, the substrate portion 81, the upper plate portion 83, and the lower plate portion 84 of the shielding member 80 are disposed between the large dielectric 60 and the small dielectric 160 adjacent to each other in the front-rear direction.

[0052] 9 , the shielding member 80 is disposed between the second connection portion 72 of one pair of large inner conductors 70 assembled in the large dielectric 60 and the second connection portion 172 of the other pair of small inner conductors 170 assembled in the small dielectric 160 adjacent to this large dielectric 60. Specifically, the shielding member 80 is disposed between the entire portion of the second connection portion 72 of one pair of large inner conductors 70 that is accommodated in the large dielectric 60 (the entire inclined portion 75 and the upper end of the vertical portion 76) and the entire portion of the second connection portion 172 of the other pair of small inner conductors 170 that is accommodated in the small dielectric 160 (the entire inclined portion 175 and the upper end of the vertical portion 176).

[0053] 9 , the base plate portion 81 of the shielding member 80 is parallel to the inclined portion 75 of the second connection portion 72 of the large inner conductor 70 and the inclined portion 175 of the second connection portion 172 of the small inner conductor 170. The lower plate portion 84 of the shielding member 80 is parallel to the vertical portion 76 of the second connection portion 72 of the large inner conductor 70 and the vertical portion 176 of the second connection portion 172 of the small inner conductor 170.

[0054] 9 , the upper plate portion 83 of the shielding member 80 is spaced downward from the lower surface of the fixed portion 61 and is disposed parallel to the first connecting portion 71 of the large inner conductor 70 and the first connecting portion 171 of the small inner conductor 170. The lower end of the lower plate portion 84 of the shielding member 80 protrudes downward further than the lower end of the guide portion 162 of the small dielectric 160 and the lower end of the guide portion 62 of the large dielectric 60.

[0055] 9 , the shielding member 80 is in contact with the partition wall 38. The upper plate portion 83 of the shielding member 80 is press-fitted into the slit 39 of the partition wall 38 of the outer conductor 30. The pair of first protrusions 85 of the shielding member 80 are wedged into the inner surface of the slit 39 (the upper wall that constitutes the slit 39). The second protrusions 86 are wedged into the inner surface of the slit 39 (the lower wall that constitutes the slit 39). There is no gap between the outer conductor 30 and the shielding member 80 in the directions (front-rear and up-down directions) in which the large dielectric 60 and the small dielectric 160 adjacent to this large dielectric 60 face each other.

[0056] 7, the pair of side plate portions 82 of the shielding member 80 are respectively inserted into the left and right recesses 31B of the box-shaped main body 31 of the outer conductor 30. The pair of side plate portions 82 of the shielding member 80 are respectively in contact with the left and right recesses 31B of the box-shaped main body 31 of the outer conductor 30. Specifically, the side plate portions 82 are in contact with the back wall of the recess 31B (walls perpendicular to the left-right direction), the side walls of the recess 31B (walls perpendicular to the back wall of the recess 31B), etc.

[0057] 7 and 9, the shielding member 80 is in contact with the circuit board 100. Specifically, as shown in Fig. 9, the lower end of the lower plate portion 84 of the shielding member 80 is in contact with the ground circuit 104 of the circuit board 100. The ground circuit 104 is disposed between a pair of insulating portions 103 arranged in the front and rear. The entire width (entire width in the left-right direction) of the lower end of the lower plate portion 84 of the shielding member 80 is in contact with the ground circuit 104. The lower end surface of the lower plate portion 84 of the shielding member 80 is in face-to-face contact with the ground circuit 104.

[0058] <Connector Assembly Process> Next, a description will be given of an example of the assembly process of the connector 1. The assembly process of the connector 1 is not limited to the following description.

[0059] First, two small inner conductors 170 are attached to the small dielectric 160 from the rear. Specifically, the first connecting portions 171 of the small inner conductors 170 are press-fitted into the through holes 163 of the guide portion 162 from the rear. At the same time, the second connecting portions 172 and the bent portions 173 are housed in the grooves 164 of the guide portion 162. In this way, two small dielectrics 160 each with two small inner conductors 170 attached are prepared.

[0060] 7 to 9, the small dielectric 160 with the small inner conductor 170 attached thereto is housed in the outer conductor 30. Specifically, the fixing portions 161 of the small dielectric 160 are press-fitted from the rear into each of the two lower housing chambers 36 of the outer conductor 30. The guide portions 162 of the two small dielectrics 160 are housed in the two housing spaces 34 on the left and right, respectively.

[0061] Next, two large inner conductors 70 are attached to the large dielectric 60 from the rear. Specifically, the first connecting portions 71 of the large inner conductors 70 are press-fitted from the rear into the through-holes 63 of the guide portion 62. At the same time, the second connecting portions 72 and the bent portions 73 are housed in the grooves 64 of the guide portion 62. In this way, two large dielectrics 60 each with two large inner conductors 70 attached are prepared.

[0062] Next, as shown in Fig. 6, the shielding member 80 is attached to each large dielectric 60 from the front. Specifically, the guide portion 62 of the large dielectric 60 is inserted between a pair of side plate portions 82, and the rear surface of the base portion 81 of the shielding member 80 is brought into contact with or close to the front surface of the large dielectric 60. Although not shown, the shielding member 80 and the large dielectric 60 may be provided with a structure for locking the two components together (such as a structure for fitting together). The upper plate portion 83 of the shielding member 80 is spaced from the lower surface of the fixing portion 61 and is arranged parallel to the first connecting portion 71 of the large inner conductor 70. The lower plate portion 84 of the shielding member 80 protrudes downward beyond the guide portion 62.

[0063] Next, as shown in FIGS. 7 to 9 , the large dielectric 60 with the large inner conductor 70 and shielding member 80 attached is housed in the outer conductor 30. Specifically, as shown in FIG. 9 , the fixing portion 61 of the large dielectric 60 is press-fitted from behind into each of the two upper housing chambers 36 of the outer conductor 30. At this time, the upper plate portion 83 of the shielding member 80 is press-fitted into the slit 39 of the partition wall 38 of the outer conductor 30. The pair of first protrusions 85 of the shielding member 80 bite into the upper wall that defines the slit 39. The second protrusion 86 bites into the lower wall that defines the slit 39. The guide portions 62 of the two large dielectrics 60 are housed in the two left and right housing spaces 34, respectively. The base portion 81, upper plate portion 83, and lower plate portion 84 of the shielding member 80 are arranged between the small dielectrics 160 and the large dielectrics 60 that are adjacent to each other in the front-to-rear direction. The lower end of the lower plate portion 84 protrudes downward beyond the lower ends of the small dielectrics 160 and the large dielectrics 60 .

[0064] 7 to 9, the shield terminal 10 is mounted on the circuit board 100. The lower end of the box-shaped main body 31 is attached to the circuit board 100. The large inner conductor 70 and the small inner conductor 170 are inserted into the mounting holes 101 and soldered to the signal electrical paths (not shown) of the circuit board 100. The lower end of the lower plate 84 of the shielding member 80 comes into contact with the ground circuit 104.

[0065] <Operation and Effect of First Embodiment> The connector 1 of the first embodiment includes multiple pairs of large inner conductors 70 and small inner conductors 170 for differential communication, multiple large dielectrics 60 and small dielectrics 160 to which each pair of large inner conductors 70 and small inner conductors 170 is respectively assembled, and an outer conductor 30 that accommodates the multiple large dielectrics 60 and small dielectrics 160. The outer conductor 30 has multiple upper accommodating chambers 36 that accommodate a portion of each pair of large inner conductors 70, and multiple lower accommodating chambers 37 that accommodate a portion of each pair of small inner conductors 170. The large inner conductor 70 has a first connecting portion 71 that is accommodated in the upper accommodating chamber 36 and connected to a mating inner conductor (not shown), and a second connecting portion 72 that is exposed outside the upper accommodating chamber 36 and connected to the circuit board 100. The small inner conductor 170 has a first connection portion 171 that is accommodated in the lower accommodating chamber 37 and connected to a mating inner conductor (not shown), and a second connection portion 172 that is exposed to the outside of the lower accommodating chamber 37 and connected to the circuit board 100. A conductive shielding member 80 is provided between the second connection portion 72 of one pair of large inner conductors 70 assembled to the large dielectric 60 and the second connection portion 172 of the other pair of small inner conductors 170 assembled to the small dielectric 160 adjacent to this large dielectric 60. The shielding member 80 is in contact with the ground circuit 104 of the circuit board 100.

[0066] This connector has a shielding member 80 disposed between the second connection portions 72 of adjacent pairs of large inner conductors 70 and the second connection portions 172 of adjacent pairs of small inner conductors 170, thereby suppressing the adverse effects of electromagnetic noise between the second connection portions 72 and 172. Furthermore, because the shielding member 80 is in contact with the ground circuit 104 of the circuit board 100, the current flowing through the shielding member 80 can be diverted to the circuit board 100. Therefore, the connector 1 can suppress the adverse effects of electromagnetic noise between adjacent pairs of large inner conductors 70 and small inner conductors 170. For example, the connector 1 can suppress the occurrence of electromagnetic interference, such as crosstalk, between adjacent pairs of large inner conductors 70 and small inner conductors 170. In other words, the connector 1 can improve crosstalk performance.

[0067] In the connector 1 of the first embodiment, the shielding member 80 has a lower plate portion 84 (plate portion). The entire width of the lower plate portion 84 contacts the circuit board 100, closing the gap between the lower plate portion 84 and the circuit board 100. In this connector 1, no gaps are created between the shielding member 80 and the circuit board 100 between adjacent pairs of large inner conductors 70 and small inner conductors 170. Compared to a configuration in which gaps exist, this makes it easier to suppress the adverse effects of electromagnetic noise between the shielding member 80 and the circuit board 100 between adjacent pairs of large inner conductors 70 and small inner conductors 170.

[0068] In the connector 1 of the first embodiment, the lower plate portion 84 is in face-to-face contact with the circuit board 100. In this connector 1, gaps are less likely to occur between the shielding member 80 and the circuit board 100 between adjacent pairs of large inner conductors 70 and small inner conductors 170, and compared to a configuration in which gaps exist, the adverse effects of electromagnetic noise between the shielding member 80 and the circuit board 100 between adjacent pairs of large inner conductors 70 and small inner conductors 170 can be more easily suppressed.

[0069] In the connector 1 of the first embodiment, the shielding member 80 is disposed between the entire portion of the second connecting portion 72 of one pair of large inner conductors 70 that is accommodated in the large dielectric 60 (the entire inclined portion 75 and the upper end of the vertical portion 76) and the entire portion of the second connecting portion 172 of the other pair of small inner conductors 170 that is accommodated in the small dielectric 160 (the entire inclined portion 175 and the upper end of the vertical portion 176). In this connector 1, the adverse effects of electromagnetic noise between the pair of second connecting portions 72 and the pair of second connecting portions 172 can be suppressed.

[0070] In the connector 1 of the first embodiment, a portion of the upper accommodating chamber 36 is partitioned by a partition wall 38, and a portion of the lower accommodating chamber 37 is partitioned by the partition wall 38. The shielding member 80 is in contact with the partition wall 38. In this connector 1, the partition wall 38 of the outer conductor 30 is provided between the first connecting portions 71 of adjacent pairs of large inner conductors 70 and the first connecting portions 171 of adjacent pairs of small inner conductors 170, thereby suppressing the adverse effects of electromagnetic noise between the first connecting portions 71 and the first connecting portions 171. Furthermore, because the shielding member 80 is in contact with the partition wall 38, no gap is created between the shielding member 80 and the partition wall 38 between adjacent pairs of large inner conductors 70 and the small inner conductors 170. This suppresses the adverse effects of electromagnetic noise between adjacent pairs of large inner conductors 70 and the small inner conductors 170 compared to a configuration in which a gap is present.

[0071] In the connector 1 of the first embodiment, the outer conductor 30 has a slit 39 formed in the partition wall 38. The upper plate portion 83 of the shielding member 80 is press-fitted into the slit 39. In this connector 1, the shielding member 80 and the partition wall 38 can be maintained in a state of reliable contact.

[0072] In the connector 1 of the first embodiment, the shielding member 80 has an upper plate portion 83 (second plate portion) that is inserted into the slit 39, and a first protrusion 85 (protrusion) and a second protrusion 86 (protrusion) that protrude from the upper plate portion 83. The first protrusion 85 and the second protrusion 86 contact the inner surface of the slit 39. In this connector 1, the shielding member 80 is prevented from coming out of the slit 39 of the partition wall 38.

[0073] In the connector 1 of the first embodiment, the shielding member 80 has a first protrusion 85 protruding from one plate surface (upper surface) of the upper plate portion 83 (second plate portion) and a second protrusion 86 protruding from the other plate surface (lower surface) of the upper plate portion 83. The first protrusions 85 and the second protrusions 86 are alternately arranged in a direction parallel to the plate surfaces of the plate portions. The first protrusions 85 and the second protrusions 86 contact the inner surface of the slit 39. In this connector 1, the upper plate portion 83 elastically deforms as the first protrusions 85 and the second protrusions 86 contact the inner surface of the slit 39, and the elastic restoring force of the upper plate portion 83 allows all of the protrusions to contact the inner surface of the slit 39, ensuring sufficient contact pressure.

[0074] [Example 2] Example 2 embodying the present disclosure will be described below with reference to Figures 10 and 11. The connector of Example 2 differs from Example 1 in the shape of the shielding member, but is otherwise the same. Note that the same components as Example 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0075] The connector of Example 2 includes a shielding member 280 shown in FIG. 10. A pair of third protrusions 285 are formed on the upper plate portion 83 of the shielding member 280. The third protrusions 285 correspond to an example of the "protrusions" of the present disclosure. The pair of third protrusions 285 protrude outward in the left-right direction from the center in the front-rear direction of the left and right edges of the upper plate portion 83. The third protrusions 285 are semicircular plate pieces when viewed from the top-bottom direction. The top and bottom surfaces of the third protrusions 285 are flush with the top and bottom surfaces of the upper plate portion 83.

[0076] 11 , a pair of third protrusions 285 of the shielding member 280 are respectively embedded in the inner surfaces of the slit 39 (the left and right wall portions that form the slit 39). No gap is generated between the outer conductor 30 and the shielding member 280 in the directions (front-back and up-down directions) in which the large dielectric 60 and the small dielectric 160 adjacent to this large dielectric 60 face each other.

[0077] Even with this configuration, since the shielding member 280 is in contact with the partition wall 38, no gaps are created between the shielding member 280 and the partition wall 38 between adjacent pairs of large inner conductors 70 and pairs of small inner conductors 170, and the adverse effects of electromagnetic noise between adjacent pairs of large inner conductors 70 and pairs of small inner conductors 170 can be suppressed compared to a configuration in which gaps exist.

[0078] Example 3 A third embodiment of the present disclosure will now be described with reference to Figures 12 to 14. The connector of Example 3 is different from Example 1 in that no slits are provided in the partition wall of the outer conductor and the shielding member does not contact the partition wall, but is otherwise the same as Example 1. Note that the same components as Example 1 are designated by the same reference numerals and detailed descriptions will be omitted.

[0079] The connector 301 of the third embodiment includes a shielding member 380 shown in Figures 12 to 14. The shielding member 380 has a configuration in which the upper plate portion 83 and the connecting portion between the base plate portion 81 and the upper plate portion 83 are removed from the shielding member 80 of the first embodiment.

[0080] 12, the partition wall 38 of the outer conductor 30 does not have the slits 39 of the first embodiment. The upper plate portion 83 of the shielding member 380 is spaced apart from the partition wall 38 of the outer conductor 30.

[0081] Even with this configuration, because the shielding member 380 is in contact with the circuit board 100, no gaps are created between the shielding member 380 and the circuit board 100 between adjacent pairs of large inner conductors 70 and pairs of small inner conductors 170. Compared to a configuration in which gaps exist, this configuration can suppress the adverse effects of electromagnetic noise between adjacent pairs of large inner conductors 70 and pairs of small inner conductors 170. Furthermore, because the shielding member 380 is in contact with the circuit board 100, the current flowing through the shielding member 380 can escape to the circuit board 100. Therefore, this connector 301 can suppress the adverse effects of electromagnetic noise between adjacent pairs of large inner conductors 70 and pairs of small inner conductors 170.

[0082] [Other Examples] The present invention is not limited to the examples described above and illustrated in the drawings, but is defined by the claims. The present invention includes the meaning equivalent to the claims and all modifications within the scope of the claims, including the following embodiments.

[0083] In the above-described first and second embodiments, the upper plate portion 83 of the shielding member is press-fitted into the slit 39 of the partition wall 38 of the outer conductor 30, but it may also be configured to contact the outer surface of the partition wall 38 without entering the slit 39.

[0084] In the above Examples 1-3, the pair of side plate portions 82 of the shielding member were in contact with the left and right inner walls 31A (more specifically, the recesses 31B) that form the storage space 34 of the box-shaped main body portion 31, but they do not have to be in contact with the box-shaped main body portion 31.

[0085] In the above Examples 1-3, the lower end of the lower plate portion 84 of the shielding member was in contact with the ground circuit 104 of the circuit board 100, but the lower end of the lower plate portion 84 of the shielding member may also be configured to be inserted into a through hole provided in the circuit board 100 and electrically connected to the circuit board 100.

[0086] In the above-described Examples 1-3, the first connecting portion 71 and the second connecting portion 72 of the large inner conductor 70 may extend in directions that form a right angle with each other. Also, the first connecting portion 171 and the second connecting portion 172 of the small inner conductor 170 may extend in directions that form a right angle with each other.

[0087] 1: Connector 10: Shield terminal 20: Hood member 21: Base 22: Cylindrical connection portion 23: Through hole 30: Outer conductor 31: Box-shaped main body 31A: Inner wall 31B: Recess 32: Connection port 33: Partition wall 34: Storage space 35: Central space 36: Upper storage chamber 37: Lower storage chamber 38: Partition wall 39: Slit 40: Large terminal module 50: Small terminal module 60: Large dielectric (dielectric) 61: Fixing portion 62: Guide portion 63: Through hole 64: Groove 70: Large inner conductor (inner conductor) 71: First connection portion 72: Second connection portion 73: Bent portion 74: Tab 75: Inclined portion 76: Vertical portion 80: Shielding member 81: Base plate portion 82: Side plate portion 83: Upper plate portion (second plate portion) 84: Lower plate portion (plate portion) 85: First projection (projection) 86: Second projection (projection) 100: Circuit board 101: Mounting hole 102: Conductive portion 103: Insulating portion 104: Ground circuit 160: Small dielectric (dielectric) 161: Fixing portion 162: Guide portion 163: Through hole 164: Groove 170: Small inner conductor (inner conductor) 171: First connecting portion 172: Second connecting portion 173: Bent portion 175: Inclined portion 176: Vertical portion 280: Shielding member 285: Third projection (projection) 301: Connector 380: Shielding member

Claims

1. A connector comprising: multiple pairs of inner conductors for differential communication; multiple dielectrics to which the inner conductors of each pair are respectively assembled; and an outer conductor accommodating the multiple dielectrics, wherein the outer conductor has multiple accommodating chambers to accommodate a portion of the inner conductors of each pair, and the inner conductors have: a first connection portion that is accommodated in the accommodating chamber and connected to the mating inner conductor, and a second connection portion that is exposed to the outside of the accommodating chamber and connected to a circuit board, wherein a conductive shielding member is provided between the second connection portion of the inner conductors of one pair assembled to one of the dielectrics and the second connection portion of the inner conductors of the other pair assembled to another dielectric adjacent to the one of the dielectrics, and the shielding member is in contact with the ground circuit of the circuit board.

2. The connector according to claim 1, wherein the shielding member has a plate portion, the entire width of the plate portion being in contact with the circuit board.

3. The connector according to claim 2, wherein the plate portion is in face-to-face contact with the circuit board.

4. A connector as described in any one of claims 1 to 3, wherein the shielding member is arranged between the entire portion of the second connection portion of one pair that is accommodated in one of the dielectrics and the entire portion of the second connection portion of the other pair that is accommodated in the other dielectric.

5. A connector according to any one of claims 1 to 3, wherein at least a portion of the accommodating chamber is partitioned by a partition wall, and the shielding member is in contact with the partition wall.

6. A connector as set forth in claim 5, wherein the outer conductor has a slit formed in the partition wall, and a portion of the shielding member is press-fitted into the slit.

7. A connector as described in claim 6, wherein the shielding member has a second plate portion inserted into the slit and a protrusion protruding from the second plate portion, the protrusion contacting the inner surface of the slit.

8. A connector as described in claim 7, wherein the shielding member has a first protrusion protruding from one plate surface of the second plate portion and a second protrusion protruding from the other plate surface of the second plate portion, the first protrusions and the second protrusions being arranged alternately in a direction parallel to the plate surface of the second plate portion, and the first protrusions and the second protrusions being in contact with the inner surface of the slit.

Citation Information

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