Electronic device production method

Abstract

An electronic device production method comprising: a step (a) for preparing a structure (100) including an adhesive film (50) that is provided with a base material layer (10), an adhesive resin layer (A) provided to a first surface (10A) side of the base material layer (10) and for provisionally fixing electronic components (70), and an adhesive resin layer (B) provided to a second surface (10B) side of the base material layer (10), said structure (100) further including electronic components (70) that are attached to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) that is attached to the adhesive resin layer (B) of the adhesive film (50); and a step (b) for sealing the electronic components (70) with sealing materials, wherein step (b) includes, in the stated order, a step (b-1) for covering the electronic components (70) with a first sealing material (60) and a step (b-2) for sealing the electronic components (70) covered with the first sealing material (60) with a second sealing material (65).

Description

Manufacturing method of electronic device

[0001] The present invention relates to a method for manufacturing an electronic device.

[0002] Fan-out packaging has been developed as a technology that can reduce the size and weight of electronic devices (e.g., semiconductor devices). One method for fabricating fan-out packages, called embedded wafer level ball grid array (eWLB), involves temporarily fixing multiple electronic components, such as semiconductor chips, spaced apart on an adhesive film attached to a support substrate, and then encapsulating the multiple electronic components together with an encapsulant. Here, the adhesive film must be adhered to the electronic components and the support substrate during the encapsulation process, and must be removed from the encapsulated electronic components together with the support substrate after encapsulation.

[0003] Techniques relating to a method for manufacturing such a fan-out type package include, for example, the technique described in Patent Document 1 (Japanese Patent Laid-Open No. 2011-134811).

[0004] Patent Document 1 describes a heat-resistant adhesive sheet for semiconductor device manufacturing that is used by adhering when resin-encapsulating a substrateless semiconductor chip, as a method for solving the problem of the chip not being held in place due to pressure during resin encapsulation and shifting from its designated position, or the problem of the package being damaged when the heat-resistant adhesive sheet for semiconductor device manufacturing is peeled off due to the hardening of the encapsulant or heat causing the encapsulant to become strongly adhesive to the chip surface. The heat-resistant adhesive sheet has a base layer and an adhesive layer, and the adhesive layer has an adhesive strength to SUS304 after lamination of 0.5 N / 20 mm or more, and hardens due to stimuli received before the resin encapsulation process is completed, so that the peel strength to the package is 2.0 N / 20 mm or less.

[0005] JP 2011-134811 A

[0006] When electronic components are placed on an adhesive film and sealed with a sealant, the electronic components may become misaligned (hereinafter also referred to as "misalignment of electronic components"). The present invention has been made in view of the above circumstances, and provides a method for manufacturing an electronic device that can suppress misalignment of electronic components during the sealing process.

[0007] The present inventors conducted extensive research to achieve the above-mentioned object. As a result, they discovered a method for manufacturing an electronic device in which the electronic components are temporarily fixed by covering them with an encapsulant, and then the chip is completely encapsulated by a general encapsulation method for electronic devices. They found that this method makes it possible to suppress misalignment of the electronic components during the encapsulation process, and thus completed the present invention.

[0008] [1] A method for manufacturing an electronic device, comprising: a step (a) of preparing a structure including: a base layer; an adhesive film including: an adhesive resin layer (A) provided on a first surface side of the base layer and for temporarily fixing an electronic component; and an adhesive resin layer (B) provided on a second surface side of the base layer; an electronic component attached to the adhesive resin layer (A) of the adhesive film; and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a step (b) of encapsulating the electronic component with a sealing material, wherein the step (b) includes, in this order, a step (b-1) of covering the electronic component with a first sealing material and a step (b-2) of encapsulating the electronic component covered with the first sealing material with a second sealing material. [2] The method for producing an electronic device according to [1] above, further comprising step (c) between steps (b-1) and (b-2), curing the first sealing material by one or more methods selected from the group consisting of light irradiation and heat treatment. [3] The method for producing an electronic device according to [1] or [2] above, wherein step (b-1) comprises covering the electronic component with the first sealing material using one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method. [4] The method for producing an electronic device according to any of [1] to [3] above, wherein step (b-2) comprises encapsulating the electronic component with the second sealing material using one or more methods selected from the group consisting of transfer molding, injection molding, compression molding, and cast molding. [5] The method for producing an electronic device according to any of [1] to [4] above, wherein the first sealing material comprises an epoxy resin-based sealing material. [6] The method for manufacturing an electronic device according to any one of [1] to [5] above, wherein the second sealing material comprises an epoxy resin-based sealing material. [7] The method for manufacturing an electronic device according to any one of [1] to [6] above, wherein the sealing temperature in step (b-1) is 10°C or higher and 45°C or lower. [8] The method for manufacturing an electronic device according to any one of [1] to [7] above, wherein the viscosity of the first sealing material, measured using a BF viscometer while stirring at a temperature of 25°C and a shear rate of 5 rpm, is 1 mPa s or higher and 400 Pa s or lower.[9] The method for manufacturing an electronic device according to any one of [1] to [8] above, wherein the viscosity of the second sealing material, measured using a BF viscometer while stirring at a temperature of 25°C and a shear rate of 5 rpm, is 0.1 Pa·s or more and 1000 Pa·s or less.

[10] The method for manufacturing an electronic device according to any one of [1] to [9] above, wherein the thickness of the first sealing material after covering the electronic components is 0.05 μm or more and 50 μm or less.

[11] The method for manufacturing an electronic device according to any one of [1] to

[10] above, wherein the thickness of the second sealing material after sealing the electronic components is 1 μm or more and 2 mm or less.

[12] The method for manufacturing an electronic device according to any one of [1] to

[11] above, comprising, after the step (b), a step (d) of peeling the support substrate from the structure by applying an external stimulus to the adhesive resin layer (B).

[13] The method for producing an electronic device according to

[12] above, further comprising, after step (d), step (e) of peeling the pressure-sensitive adhesive film from the electronic component.

[14] The method for producing an electronic device according to any one of [1] to

[13] above, wherein the pressure-sensitive adhesive resin layer (A) comprises a pressure-sensitive adhesive resin (A1).

[15] The method for producing an electronic device according to

[14] above, wherein the pressure-sensitive adhesive resin (A1) comprises one or more selected from the group consisting of (meth)acrylic pressure-sensitive adhesive resins, silicone pressure-sensitive adhesive resins, urethane pressure-sensitive adhesive resins, olefin pressure-sensitive adhesive resins, and styrene pressure-sensitive adhesive resins.

[16] The method for producing an electronic device according to

[14] or

[15] above, wherein the pressure-sensitive adhesive resin layer (A) further comprises a crosslinking agent (A2) having two or more crosslinkable functional groups per molecule.

[17] The method for producing an electronic device according to

[16] above, wherein the content of the crosslinking agent (A2) is 0.1 parts by mass or more and 15 parts by mass or less per 100 parts by mass of the pressure-sensitive adhesive resin (A1).

[18] The method for producing an electronic device according to any one of [1] to

[17] above, wherein the adhesive resin layer (B) contains a thermally expandable adhesive.

[19] The method for producing an electronic device according to

[18] above, wherein the thermally expandable adhesive is an adhesive whose adhesive strength is reduced or lost when heated at a temperature exceeding 150° C.

[20] The method for producing an electronic device according to any one of [1] to

[19] above, wherein the support substrate contains at least one selected from the group consisting of a stainless steel plate and a glass plate.

[21] The method for manufacturing an electronic device according to any one of [1] to

[20] above, wherein in step (a), the distance between the electronic components is 10 μm or more and 10 mm or less.

[22] The method for manufacturing an electronic device according to any one of [1] to

[21] above, wherein step (a) includes step (a-1) of attaching the pressure-sensitive adhesive film to the support substrate so that the pressure-sensitive adhesive resin layer (B) faces the support substrate.

[23] The method for manufacturing an electronic device according to

[22] above, wherein step (a) further includes step (a-2) of arranging the electronic component on the pressure-sensitive adhesive resin layer (A) of the pressure-sensitive adhesive film attached to the support substrate to obtain the structure.

[24] The method for manufacturing an electronic device according to any one of [1] to

[23] above, wherein the electronic device includes a fan-out package.

[0009] According to the present invention, it is possible to provide a method for manufacturing an electronic device that can suppress misalignment of electronic components during the sealing process.

[0010] Fig. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive film according to an embodiment of the present invention. Fig. 2 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention. Fig. 3 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention. Fig. 4 is a cross-sectional view schematically showing an example of a method for manufacturing an electronic device according to an embodiment of the present invention.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are given the same reference numerals and their explanations will be omitted where appropriate. Furthermore, the drawings are schematic and do not necessarily correspond to the actual dimensional ratios. In the specification, the upper and lower limit values ​​of numerical ranges can be arbitrarily combined unless otherwise specified. In the specification, "(meth)acrylic" means acrylic, methacrylic, or both acrylic and methacrylic.

[0012] <Method for Manufacturing Electronic Device> A method for manufacturing an electronic device according to this embodiment will now be described. Figures 2 to 4 are cross-sectional views that schematically show an example of a method for manufacturing an electronic device according to this embodiment. The method for manufacturing an electronic device of this embodiment includes a step (a) of preparing a structure 100 including: a base layer 10; an adhesive film 50 including an adhesive resin layer (A) provided on the first surface 10A of the base layer 10 and for temporarily fixing an electronic component; and an adhesive resin layer (B) provided on the second surface 10B of the base layer 10; an electronic component 70 attached to the adhesive resin layer (A) of the adhesive film 50; and a support substrate 80 attached to the adhesive resin layer (B) of the adhesive film 50; and a step (b) of sealing the electronic component 70 with a sealing material, wherein the step (b) includes a step (b-1) of covering the electronic component 70 with a first sealing material 60 and a step (b-2) of sealing the electronic component 70 covered with the first sealing material 60 with a second sealing material 65, in this order.

[0013] According to the method for manufacturing an electronic device of this embodiment, by covering the electronic components with a sealing material in advance and temporarily fixing the electronic components, it is possible to suppress misalignment of the electronic components during the sealing process. Furthermore, according to the method for manufacturing an electronic device of this embodiment, it is possible to suppress misalignment of the electronic components and wiring during rewiring processing, which is caused by moving the electronic components to a location different from the initial electronic component placement, and to prevent deterioration in reliability such as disconnection.

[0014] Conventional fan-out package manufacturing methods include placing electronic components, such as chips, spaced apart on double-sided tape attached to a substrate or on a temporary fixing material (e.g., adhesive, wax, etc.) formed on the substrate, and then enclosing them en bloc by flowing an encapsulant, such as epoxy resin, in a vacuum chamber using a compression or transfer method, or by laminating a sheet of encapsulant. In this process, electronic components are mounted on the double-sided tape or a temporary fixing material, such as an adhesive, and then the encapsulant is heated, melted, and flowed under high pressure to seal. This can lead to component misalignment due to thermal contraction and expansion of the double-sided tape or temporary fixing material, or to the electronic components being pushed laterally by the encapsulant and moving slightly. This component misalignment can result in the electronic components moving to a location different from their original location. As a result, wiring misalignment can occur during rewiring, leading to reduced reliability, such as broken wires. To address this issue, highly adhesive temporary fixing materials for securing electronic components to substrates have been developed. However, the peel force required to peel the double-sided tape or temporary fixing material from the substrate or electronic component increases, which can cause damage to the double-sided tape or temporary fixing material or adhesive residue. Furthermore, simply increasing the adhesive strength of the double-sided tape or temporary fixing material does not fundamentally improve the misalignment of electronic components. On the other hand, the electronic device manufacturing method of this embodiment temporarily fixes electronic components by covering them with a sealing material in advance, allowing the electronic components to be fixed before the compression process or transfer process, in which the sealing material is flowed at high temperature and high pressure to completely seal the electronic components. As described above, the electronic device manufacturing method of this embodiment can suppress misalignment of electronic components during the sealing process. Furthermore, the electronic device manufacturing method of this embodiment can suppress misalignment of electronic components and wiring during rewiring processing, which occurs when electronic components are moved to a location different from the initial electronic component placement, thereby preventing reliability degradation such as wire breakage.

[0015] Each step of the method for manufacturing an electronic device according to this embodiment will be described below.

[0016] [Step (a)] In step (a), a structure 100 is prepared, which includes a base layer 10, an adhesive film 50 including an adhesive resin layer (A) provided on the first surface 10A of the base layer 10 and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on the second surface 10B of the base layer 10, an electronic component 70 attached to the adhesive resin layer (A) of the adhesive film 50, and a support substrate 80 attached to the adhesive resin layer (B) of the adhesive film 50. The electronic component 70 may be one or more, but is usually more than one.

[0017] From the viewpoint of further suppressing displacement of the electronic components during the sealing process, the support substrate 80 preferably includes at least one type selected from the group consisting of a stainless steel substrate and a glass substrate.

[0018] The step (a) preferably includes a step (a-1) of adhering the adhesive film 50 onto the support substrate 80 so that the adhesive resin layer (B) faces the support substrate 80. A protective film called a separator may be adhered onto the adhesive resin layer (B), and the protective film can be peeled off to adhere the exposed surface of the adhesive resin layer (B) to the surface of the support substrate 80.

[0019] Preferably, step (a) further includes step (a-2) of obtaining the structure 100 by placing an electronic component 70 on the adhesive resin layer (A) of the adhesive film 50 adhered to the support substrate 80. Examples of the electronic component 70 include semiconductor chips such as ICs, LSIs, discrete devices, light-emitting diodes, and light-receiving elements, as well as semiconductor panels and semiconductor packages. The surface of the electronic component 70 has an uneven structure, for example, due to the presence of electrodes. Furthermore, when mounting an electronic device on a mounting surface, the electrodes are bonded to the electrodes formed on the mounting surface to form an electrical connection between the electronic device and the mounting surface (such as the mounting surface of a printed circuit board). Examples of electrodes include bump electrodes such as ball bumps, printed bumps, stud bumps, plated bumps, and pillar bumps. In other words, the electrodes are typically convex electrodes. These bump electrodes may be used alone or in combination of two or more types. The metal constituting the bump electrodes is not particularly limited, and examples include silver, gold, copper, tin, lead, bismuth, and alloys thereof. These metal species may be used alone or in combination of two or more.

[0020] The lower limit of the separation distance between the electronic components 70 is preferably 10 μm or more, more preferably 15 μm or more, even more preferably 20 μm or more, and even more preferably 25 μm or more. By having a separation distance equal to or greater than the above lower limit, the electronic components can be sealed individually more effectively in the sealing process. The upper limit of the separation distance between the electronic components 70 can be determined appropriately depending on the performance required of the electronic device, and is, for example, 10 mm or less, 1 mm or less, 100 μm or less, or 50 μm or less.

[0021] [Step (b)] In step (b), the electronic component 70 is sealed with the first sealing material 60. Step (b) includes, in this order, step (b-1) of covering the electronic component 70 with the first sealing material 60 and step (b-2) of sealing the electronic component 70 covered with the first sealing material 60 with the second sealing material 65.

[0022] (Step (b-1)) In step (b-1), the electronic component 70 is coated with the first sealing material 60. As a method for coating the electronic component 70 with the first sealing material 60, it is preferable to use one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method, and it is more preferable to use the 3D printer method. That is, step (b-1) of the method for manufacturing an electronic device of this embodiment preferably includes a step of coating the electronic component 70 with the first sealing material 60 using one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method, and it is more preferable to include a step of coating the electronic component 70 with the first sealing material 60 using the 3D printer method.

[0023] The 3D printer method is a method of coating the electronic component 70 with the first sealing material 60 by printing the first sealing material 60 onto the electronic component 70 using a 3D printer device. The spray method is a method of coating the electronic component 70 with the first sealing material 60 by spraying the sealing material in a fine mist onto the electronic component 70. The screen printing method is a method of coating the electronic component 70 with the first sealing material 60 by applying the sealing material to a screen mask and printing the first sealing material 60 onto the electronic component 70 using a squeegee. The inkjet method is a method of coating the electronic component 70 with the first sealing material 60 by spraying the sealing material from an inkjet head and printing the first sealing material 60 onto the electronic component 70.

[0024] Since step (b-1) includes the step of covering the electronic component 70 with the first sealing material 60 using the above method, it is possible to suppress misalignment of the electronic component during the sealing process. This is because the above method allows the sealing material to be covered on the electronic component at room temperature and normal pressure. The above method allows the sealing material to be covered on the electronic component without a heating process, thereby suppressing thermal contraction and expansion of double-sided tape and temporary fixing materials. Furthermore, after fixing the electronic component by covering it with the sealing material, a pressing process or transfer process in which the sealing material flows at high temperature and high pressure can be performed, thereby suppressing the lateral force applied to the electronic component by the sealing material. This makes it possible to suppress misalignment of the electronic component during the sealing process. Furthermore, it is possible to suppress misalignment of the electronic component and wiring during the rewiring process, which is caused by moving the electronic component to a location different from the initial electronic component placement, thereby preventing reliability degradation such as breakage.

[0025] As the first sealing material 60, any known sealing material having high insulating properties can be used. However, from the viewpoint of improving the affinity of the first sealing material 60 to the adhesive film 50 and enabling more uniform sealing of the electronic component 70, the first sealing material 60 preferably includes an epoxy resin-based sealing material. Examples of such epoxy resin-based sealing materials that can be used include the T693 / R4000 series, T693 / R1000 series, and T693 / R5000 series manufactured by Nagase ChemteX Corporation. The first sealing material 60 may be in a solid or liquid state. However, a liquid state is preferred from the viewpoint of enabling step (b-1) to be performed at low temperature and low pressure and further suppressing displacement of the electronic component during the sealing step.

[0026] The lower limit of the viscosity of the first sealing material 60 measured using a BF viscometer at a temperature of 25°C and a shear rate of 5 rpm while stirring is not particularly limited, but is, for example, 1 mPa·s or more, 10 mPa·s or more, 20 mPa·s or more, or 30 mPa·s or more. Furthermore, the upper limit of the viscosity of the first sealing material 60 measured using a BF viscometer at a temperature of 25°C and a shear rate of 5 rpm while stirring is preferably 400 Pa·s or less, more preferably 300 Pa·s or less, even more preferably 200 Pa·s or less, and even more preferably 100 Pa·s or less, from the viewpoint of further suppressing displacement of electronic components.

[0027] The lower limit of the thickness of the first sealing material 60 after covering the electronic component 70 is preferably 0.05 μm or more, more preferably 0.10 μm or more, and even more preferably 0.20 μm or more, from the viewpoint of further suppressing misalignment of the electronic component 70. Furthermore, the upper limit of the thickness of the first sealing material 60 after covering the electronic component 70 is preferably 50 μm or less, more preferably 30 μm or less, even more preferably 20 μm or less, even more preferably 10 μm or less, even more preferably 5 μm or less, even more preferably 3 μm or less, and even more preferably 1 μm or less, from the viewpoint of the work efficiency of step (b-1).

[0028] The lower limit of the sealing temperature in step (b-1) is preferably 10° C. or higher, more preferably 15° C. or higher, and even more preferably 20° C. or higher, from the viewpoint of the efficiency of the operation of step (b-1). The upper limit of the sealing temperature in step (b-1) is preferably 45° C. or lower, more preferably 40° C. or lower, even more preferably 35° C. or lower, and even more preferably 30° C. or lower, from the viewpoint of further suppressing misalignment of the electronic component. Note that the sealing temperature in this embodiment refers to the set temperature of the device used to seal the electronic component 70.

[0029] The lower limit of the sealing pressure in step (b-1) is preferably 30 kPa or more, more preferably 50 kPa or more, even more preferably 70 kPa or more, and even more preferably 90 kPa or more, from the viewpoint of improving the reliability of the electronic device. The upper limit of the sealing pressure in step (b) is preferably 150 kPa or less, more preferably 130 kPa or less, and even more preferably 110 kPa or less, from the viewpoint of further suppressing misalignment of the electronic component. It is more preferable that the sealing pressure in step (b-1) is atmospheric pressure. The sealing pressure in this embodiment refers to the set pressure in the device used to seal the electronic component 70.

[0030] (Step (b-2)) In step (b-2), the electronic component 70 coated with the first sealing material 60 is sealed with the second sealing material 65. As a method for sealing the electronic component 70 coated with the first sealing material 60 with the second sealing material 65, it is preferable to use one or more methods selected from the group consisting of transfer molding, injection molding, compression molding, and cast molding. That is, step (b-2) of the manufacturing method for an electronic device of this embodiment includes a step of sealing the electronic component 70 coated with the first sealing material 60 with the second sealing material 65 using one or more methods selected from the group consisting of transfer molding, injection molding, compression molding, and cast molding.

[0031] Any known sealing material having high insulating properties can be used as the second sealing material 65. However, from the viewpoint of improving the affinity of the second sealing material 65 to the first sealing material 60 and enabling more uniform sealing of the electronic component 70, the second sealing material 65 preferably includes an epoxy resin-based sealing material. Examples of such epoxy resin-based sealing materials that can be used include the T693 / R4000 series, T693 / R1000 series, and T693 / R5000 series manufactured by Nagase ChemteX Corporation. The second sealing material 65 may be in a solid or liquid state.

[0032] The lower limit of the viscosity of the second sealing material 65 measured using a BF viscometer while stirring at a temperature of 25°C and a shear rate of 5 rpm is not particularly limited, and is, for example, 1 mPa·s or more, 10 mPa·s or more, 20 mPa·s or more, or 30 mPa·s or more. Furthermore, the upper limit of the viscosity of the second sealing material 65 measured using a BF viscometer while stirring at a temperature of 25°C and a shear rate of 5 rpm is preferably 400 Pa·s or less, more preferably 300 Pa·s or less, even more preferably 200 Pa·s or less, and even more preferably 100 Pa·s or less, from the viewpoint of further suppressing displacement of electronic components.

[0033] The lower limit of the thickness of second sealing material 65 after covering electronic component 70 is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, even more preferably 20 μm or more, even more preferably 30 μm or more, even more preferably 40 μm or more, and even more preferably 50 μm or more, from the viewpoint of further suppressing misalignment of the electronic component. Furthermore, the upper limit of the thickness of second sealing material 65 after covering electronic component 70 is preferably 2 mm or less, more preferably 1 mm or less, even more preferably 500 μm or less, even more preferably 300 μm or less, even more preferably 200 μm or less, and even more preferably 100 μm or less, from the viewpoint of the work efficiency of step (b-1).

[0034] The lower limit of the total thickness of the first sealing material 60 and the second sealing material 65 after covering the electronic component 70 is preferably 1.05 μm or more, more preferably 1.50 μm or more, even more preferably 5.00 μm or more, even more preferably 10.00 μm or more, even more preferably 30.00 μm or more, and even more preferably 50.00 μm or more, from the viewpoint of further suppressing misalignment of the electronic component. Furthermore, the upper limit of the total thickness of the first sealing material 60 and the second sealing material 65 after covering the electronic component 70 is preferably 2.05 mm or less, more preferably 1.50 mm or less, even more preferably 1.00 mm or less, and even more preferably 0.50 mm or less, from the viewpoint of further suppressing misalignment of the electronic component.

[0035] [Step (c)] As shown in FIG. 3 , the method for manufacturing an electronic device according to this embodiment preferably further includes step (c) between steps (b-1) and (b-2), in which the first sealing material 60 is cured by one or two methods selected from the group consisting of light irradiation and heat treatment. In step (c), the first sealing material 60 in the structure 100 is cured by treating it with one or two methods selected from the group consisting of light irradiation and heat treatment. This fixes the electronic components and further suppresses misalignment of the electronic components. Furthermore, the method for manufacturing an electronic device according to this embodiment more preferably further includes step (c) in which the first sealing material 60 is cured by light irradiation, from the viewpoint of forming a structure while curing each layer at a time and further suppressing misalignment of the electronic components.

[0036] The light irradiation is preferably carried out by irradiating the first sealing material 60 with light such as ultraviolet light, thereby crosslinking and curing the first sealing material 60. The light source used here is not particularly limited, but it is preferable to use a light source capable of irradiating ultraviolet light containing wavelength components capable of exciting the photoinitiator, and it is more preferable to use a light source capable of irradiating ultraviolet light containing components with wavelengths of less than 300 nm. Examples of such light sources include high-pressure mercury lamps, low-pressure mercury lamps, metal halide lamps, and super UV lamps. The light irradiated by the light source may contain components with wavelengths of 300 nm or more. In the case of ultraviolet crosslinking, for example, a high-pressure mercury lamp is used to irradiate ultraviolet light with a dominant wavelength of 365 nm at an irradiation intensity of 10 to 350 mW / cm in an environment of 0 to 60°C. ２ UV dose 100-20,000 mJ / cm ２ By irradiating the first sealing material 60 under the above conditions, the first sealing material 60 can be crosslinked and cured.

[0037] The heat treatment preferably includes thermal crosslinking using an oven, thermal crosslinking using a hot plate, thermal crosslinking by infrared irradiation, etc. In the case of thermal crosslinking, the heating temperature is, for example, 100°C to 180°C, and the heat treatment time is, for example, 10 minutes to 180 minutes. It is preferable that the heating temperature does not exceed the temperature at which gas contained in the pressure-sensitive adhesive film 50 described below is generated or the temperature at which the heat-expandable microspheres thermally expand.

[0038] 4, the method for producing an electronic device according to the present embodiment preferably further includes, after step (b), step (d) of applying an external stimulus to the adhesive resin layer (B) to reduce the adhesive strength of the adhesive resin layer (B) and peeling the support substrate 80 from the structure 100. After sealing the electronic component 70, the support substrate 80 can be easily removed from the adhesive film 50 by, for example, heating the support substrate 80 to a temperature exceeding 150°C or a temperature exceeding 170°C to reduce the adhesive strength of the adhesive resin layer (B).

[0039] [Step (e)] As shown in Fig. 4 , the method for producing an electronic device according to the present embodiment preferably further includes, after step (d), step (e) of peeling the adhesive film 50 from the electronic component 70. This step results in the electronic device 200. Examples of methods for peeling the adhesive film 50 from the electronic component 70 include a mechanical peeling method and a method of reducing the adhesive strength of the surface of the adhesive film 50 before peeling.

[0040] (Other Processes) The method for manufacturing an electronic device of this embodiment may further include a process (f) of forming a wiring layer 310 and a bump 320 on the exposed surface of the obtained electronic device 200, as shown in FIG. 4, to obtain the electronic device 300.

[0041] The wiring layer 310 includes pads (not shown) that are external connection terminals formed on the outermost surface, and wiring (not shown) that electrically connects the exposed electronic components 70 to the pads. The wiring layer 310 can be formed by a conventionally known method and may have a multi-layer structure.

[0042] Then, bumps 320 are formed on the pads of the wiring layer 310, thereby obtaining the electronic device 300. Examples of the bumps 320 include solder bumps and gold bumps. Solder bumps can be formed, for example, by placing solder balls on pads that serve as external connection terminals of the wiring layer 310 and heating them to melt the solder (reflow). Gold bumps can be formed by methods such as ball bonding, plating, and Au ball transfer.

[0043] (Step (g)) As shown in Fig. 4, the method for manufacturing an electronic device according to this embodiment may further include step (g) of dicing the electronic device 300 to obtain a plurality of electronic devices 400. The dicing of the electronic device 300 can be performed by a known method.

[0044] <Adhesive Film> Next, the adhesive film 50 of this embodiment will be described. Fig. 1 is a cross-sectional view that schematically shows an example of the structure of an adhesive film 50 of this embodiment.

[0045] The adhesive film 50 of this embodiment comprises a base layer 10, an adhesive resin layer (A) provided on the first surface 10A side of the base layer 10 and for temporarily fixing electronic components, and an adhesive resin layer (B) provided on the second surface 10B side of the base layer 10.

[0046] The lower limit of the total thickness of the pressure-sensitive adhesive film 50 of this embodiment is preferably 10 μm or more, more preferably 20 μm or more, from the viewpoint of a balance between mechanical properties and handleability. The upper limit of the total thickness of the pressure-sensitive adhesive film 50 of this embodiment is preferably 1000 μm or less, more preferably 500 μm or less, from the viewpoint of a balance between mechanical properties and handleability.

[0047] Next, each layer constituting the adhesive film 50 of this embodiment will be described.

[0048] [Base Layer] The base layer 10 is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the pressure-sensitive adhesive film 50. The base layer 10 is not particularly limited, but examples thereof include a resin film. Examples of resins constituting the resin film include known thermoplastic resins. Examples include one or more selected from polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyamides such as nylon-6, nylon-66, and polymethaxylene adipamide; polyacrylate; polymethacrylate; polyvinyl chloride; polyvinylidene chloride; polyimide; polyetherimide; ethylene-vinyl acetate copolymer; polyacrylonitrile; polycarbonate; polystyrene; ionomer; polysulfone; polyethersulfone; and polyphenylene ether. Among these, from the viewpoint of an excellent balance of transparency, mechanical strength, price, etc., one or more selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide are preferred, and at least one selected from polyethylene terephthalate and polyethylene naphthalate is more preferred.

[0049] The base layer 10 may be a single layer or two or more layers. The resin film used to form the base layer 10 may be a stretched film or a uniaxially or biaxially stretched film, but from the viewpoint of improving the mechanical strength of the base layer 10, a uniaxially or biaxially stretched film is preferred.

[0050] The lower limit of the thickness of the substrate layer 10 is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more, from the viewpoint of obtaining good film properties. The upper limit of the thickness of the substrate layer 10 is preferably 500 μm or less, more preferably 300 μm or less, and even more preferably 250 μm or less, from the viewpoint of obtaining good film properties. The substrate layer 10 may be subjected to a surface treatment to improve adhesion to other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment, etc. may be performed.

[0051] [Adhesive Resin Layer (A)] The adhesive resin layer (A) is a layer provided on one surface of the base layer 10. The adhesive resin layer (A) is a layer that comes into contact with the surface of an electronic component to temporarily fix the electronic component when the electronic component is encapsulated with an encapsulant in the manufacturing process of an electronic device, for example.

[0052] The adhesive resin layer (A) preferably contains an adhesive resin (A1). The adhesive resin (A1) preferably contains one or more selected from the group consisting of (meth)acrylic adhesive resins (p), silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins. Among these, the (meth)acrylic adhesive resin (p) is preferred from the viewpoint of facilitating adjustment of adhesive strength.

[0053] The adhesive resin layer (A) may be a radiation-crosslinkable adhesive resin layer whose adhesive strength can be reduced by radiation. When the radiation-crosslinkable adhesive resin layer is irradiated with radiation, crosslinking occurs, significantly reducing the adhesive strength, making it easier to peel the adhesive film 50 from the electronic component. Examples of radiation include ultraviolet light, electron beams, and infrared light. As the radiation-crosslinkable adhesive resin layer, an ultraviolet-crosslinkable adhesive resin layer is preferred.

[0054] The (meth)acrylic adhesive resin (p) used in the adhesive resin layer (A) may be, for example, a copolymer containing a (meth)acrylic acid alkyl ester monomer unit (p1) and a monomer unit (p2) having a functional group capable of reacting with a crosslinking agent. In this embodiment, the (meth)acrylic acid alkyl ester refers to an acrylic acid alkyl ester, a methacrylic acid alkyl ester, or a mixture thereof.

[0055] The (meth)acrylic adhesive resin (p) of the present embodiment can be obtained, for example, by copolymerizing a monomer mixture containing a (meth)acrylic acid alkyl ester monomer (p1) and a monomer (p2) having a functional group capable of reacting with a crosslinking agent.

[0056] Examples of the monomer (p1) forming the (meth)acrylic acid alkyl ester monomer unit (p1) include (meth)acrylic acid alkyl esters having an alkyl group having about 1 to 12 carbon atoms. The monomer (p1) forming the (meth)acrylic acid alkyl ester monomer unit (p1) is preferably a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms. Specific examples include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, and 2-ethylhexyl methacrylate. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin (p) of this embodiment, the lower limit of the content of the (meth)acrylic acid alkyl ester monomer unit (p1) is preferably 10% by mass or more, more preferably 50% by mass or more, and even more preferably 85% by mass or more, based on the total amount of all monomer units in the (meth)acrylic adhesive resin (p) being 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing process.

[0047] In the (meth)acrylic adhesive resin (p) of the present embodiment, the upper limit of the content of the (meth)acrylic acid alkyl ester monomer unit (p1) is preferably 98.9% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (p) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components in the sealing step.

[0057] Examples of the monomer (p2) that forms the monomer unit (p2) having a functional group reactive with a crosslinking agent include acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, itaconic acid monoalkyl ester, mesaconic acid monoalkyl ester, citraconic acid monoalkyl ester, fumaric acid monoalkyl ester, maleic acid monoalkyl ester, glycidyl acrylate, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, tertiary-butylaminoethyl acrylate, and tertiary-butylaminoethyl methacrylate. The monomer (p2) that forms the monomer unit (p2) having a functional group reactive with a crosslinking agent is preferably acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, or the like. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin (p) of this embodiment, the upper limit of the content of the monomer unit (p2) is preferably 40% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (p) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 1% by mass or more.

[0058] The (meth)acrylic adhesive resin (p) of this embodiment may further contain, in addition to the monomer unit (p1) and the monomer unit (p2), a bifunctional monomer unit (p3) or a specific comonomer unit having surfactant properties (hereinafter referred to as a polymerizable surfactant). The polymerizable surfactant has the property of copolymerizing with the monomer (p1), the monomer (p2), and the monomer (p3), and also acts as an emulsifier when emulsion polymerization is performed.

[0059] Examples of the monomer (p3) forming the bifunctional monomer unit (p3) include allyl methacrylate, allyl acrylate, divinylbenzene, vinyl methacrylate, vinyl acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tetraethylene glycol di(meth)acrylate, and, for example, diacrylates or acrylates having both ends thereof. or dimethacrylates whose main chain structure is a propylene glycol type (for example, NOF Corporation, trade names: PDP-200, PDP-400, ADP-200, ADP-400), a tetramethylene glycol type (for example, NOF Corporation, trade names: ADT-250, ADT-850), or a mixture thereof (for example, NOF Corporation, trade names: ADET-1800, ADPT-4000).

[0060] In the (meth)acrylic adhesive resin (p) of this embodiment, the upper limit of the content of the monomer unit (p3) is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and even more preferably 5% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (p) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 0.1% by mass or more.

[0061] Examples of the polymerizable surfactant include those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON RN-10, RN-20, RN-30, RN-50, etc.), those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of an ammonium salt of a sulfate ester of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON HS-10, HS-20, HS-1025, etc.), and sulfosuccinic acid diesters having a polymerizable double bond in the molecule (manufactured by Kao Corporation; trade names: Latemul S-120A, S-180A, etc.). In the (meth)acrylic adhesive resin (p) of this embodiment, the upper limit of the content of the polymerizable surfactant is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and even more preferably 5% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (p) is taken as 100% by mass, from the viewpoint of further suppressing displacement of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 0.1% by mass or more.

[0062] The (meth)acrylic adhesive resin (p) of the present embodiment may further contain, as necessary, a monomer unit formed from a monomer having a polymerizable double bond, such as vinyl acetate, acrylonitrile, or styrene.

[0063] The polymerization reaction mechanism of the (meth)acrylic adhesive resin (p) of this embodiment may be radical polymerization, anionic polymerization, cationic polymerization, or the like. Taking into consideration the production cost of the (meth)acrylic adhesive resin (p), the influence of the functional groups of the monomers, and the influence of ions on the surface of electronic components, polymerization by radical polymerization is preferred. When polymerization is carried out by radical polymerization, the radical polymerization initiator may be selected from the group consisting of benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxydicarbonate, methyl ethyl ketone peroxide, t-butyl peroxyphthalate, t-butyl peroxybenzoate, di-t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butylperoxy-2-hexanoate, t-butyl peroxy, and the like. Examples of the peroxide include organic peroxides such as 2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, acetyl peroxide, isobutyryl peroxide, octanoyl peroxide, t-butyl peroxide, and di-t-amyl peroxide; inorganic peroxides such as ammonium persulfate, potassium persulfate, and sodium persulfate; and azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, and 4,4'-azobis-4-cyanovaleric acid.

[0064] When polymerization is carried out by emulsion polymerization, among these radical polymerization initiators, inorganic peroxides such as water-soluble ammonium persulfate, potassium persulfate, and sodium persulfate, and azo compounds having a carboxyl group in the molecule such as water-soluble 4,4'-azobis-4-cyanovaleric acid are preferred. Considering the influence of ions on the surface of electronic components, azo compounds having a carboxyl group in the molecule such as ammonium persulfate and 4,4'-azobis-4-cyanovaleric acid are more preferred, and azo compounds having a carboxyl group in the molecule such as 4,4'-azobis-4-cyanovaleric acid are particularly preferred.

[0065] The adhesive resin layer (A) of this embodiment preferably further contains, in addition to the adhesive resin (A1), a crosslinking agent (A2) having two or more crosslinkable functional groups per molecule. The crosslinking agent (A2) having two or more crosslinkable functional groups per molecule can be reacted with the functional groups of the adhesive resin (A1) to adjust the adhesive strength and cohesive strength. Examples of such crosslinking agents (A2) include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate triadduct of trimethylolpropane, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate; and trimethylolpropane-tri-β-aziridinylpropionate. Examples of suitable epoxy compounds include aziridine compounds such as tetramethylolmethane-tri-β-aziridinylpropionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate; tetrafunctional epoxy compounds such as N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane; and melamine compounds such as hexamethoxymethylolmelamine. These compounds may be used alone or in combination of two or more. Among these, it is preferable to use one or more compounds selected from epoxy compounds, isocyanate compounds, and aziridine compounds.

[0066] The content of the crosslinking agent (A2) is usually preferably within a range such that the number of functional groups in the crosslinking agent (A2) is not greater than the number of functional groups in the adhesive resin (A1). However, if necessary, an excess amount may be added when new functional groups are generated in the crosslinking reaction or when the crosslinking reaction is slow. The lower limit of the content of the crosslinking agent (A2) in the adhesive resin layer (A) is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, per 100 parts by mass of the adhesive resin (A1), from the viewpoint of improving the balance between the heat resistance and adhesive strength of the adhesive resin layer (A). The upper limit of the content of the crosslinking agent (A2) in the adhesive resin layer (A) is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, per 100 parts by mass of the adhesive resin (A1), from the viewpoint of improving the balance between the heat resistance and adhesive strength of the adhesive resin layer (A).

[0067] The adhesive resin layer (A) may contain additives such as plasticizers and tackifying resins as other components. When the adhesive resin layer (A) is a radiation-crosslinkable adhesive resin layer, it may contain various additives for radiation crosslinking. The total content of the adhesive resin (A1) and the crosslinking agent (A2) in the adhesive resin layer (A) is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass or more, based on 100% by mass of the entire adhesive resin layer (A). This further reduces adhesive residue on the electronic component when peeling the adhesive film from the electronic component. The upper limit is not particularly limited, but is, for example, 100% by mass or less.

[0068] The adhesive resin layer (A) may be a single layer or a multilayer. The lower limit of the thickness of the adhesive resin layer (A) is preferably 1 μm or more, more preferably 3 μm or more, from the viewpoint of improving adhesiveness and thermal peelability. The upper limit of the thickness of the adhesive resin layer (A) is preferably 100 μm or less, more preferably 50 μm or less, from the viewpoint of improving the handleability of the adhesive film 50.

[0069] The adhesive resin layer (A) can be formed, for example, by applying an adhesive to the substrate layer 10. The adhesive may be dissolved in a solvent and applied as a coating liquid, or may be applied as an aqueous emulsion, or the liquid adhesive may be applied directly. Among these, aqueous emulsion coating liquids are preferred. Examples of aqueous emulsion coating liquids include coating liquids prepared by dispersing (meth)acrylic adhesive resins (p), silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, styrene adhesive resins, etc. in water. An adhesive coating liquid dissolved in an organic solvent may also be used. The organic solvent is not particularly limited and may be appropriately selected from known solvents taking into account solubility and drying time. Examples of organic solvents include esters such as ethyl acetate and methyl acetate; ketones such as acetone and MEK; aromatic solvents such as benzene, toluene, and ethylbenzene; linear or cyclic aliphatic solvents such as heptane, hexane, and cyclohexane; and alcohols such as isopropanol and butanol. Ethyl acetate and toluene are preferred organic solvents. These solvents may be used alone or in combination of two or more.

[0070] The adhesive coating liquid can be applied using conventional coating methods such as a roll coater method, a reverse roll coater method, a gravure roll method, a bar coater method, a comma coater method, or a die coater method. The drying conditions for the applied adhesive are not particularly limited, but generally, drying is preferably performed for 10 seconds to 10 minutes at a temperature range of 80 to 200°C. Drying for 15 seconds to 5 minutes at 80 to 170°C is even more preferable. To sufficiently promote the crosslinking reaction between the crosslinker and the adhesive, the adhesive coating liquid may be heated at 40 to 80°C for approximately 5 to 300 hours after drying is complete.

[0071] The substrate layer 10 and the adhesive resin layer (A) may be formed by co-extrusion molding, or may be formed by laminating a film-like substrate layer 10 and a film-like adhesive resin layer (A). In the examples described later, the adhesive film is produced by first forming the adhesive resin layer (A) on the surface of a separator (release film), and then bonding the adhesive resin layer (A) to another layer.

[0072] [Adhesive Resin Layer (B)] The adhesive film 50 of this embodiment includes an adhesive resin layer (B) on the second surface 10B of the base layer 10, opposite the first surface 10A. The adhesive resin layer (B) is preferably a layer whose adhesive strength decreases with an external stimulus. This allows the adhesive film 50 to be easily peeled off from the support substrate by applying an external stimulus. Examples of adhesive resin layers (B) whose adhesive strength decreases with an external stimulus include heat-peelable adhesive resin layers whose adhesive strength decreases with heat, and light-peelable adhesive resin layers whose adhesive strength decreases with light such as radiation. Examples of methods for applying the external stimulus include light irradiation and heat treatment. Examples of heat-peelable adhesive resin layers include adhesive resins (B1) and heat-expandable adhesives that further contain a gas-generating component, heat-expandable adhesives containing heat-expandable microspheres that expand to reduce adhesive strength, and heat-expandable adhesives whose adhesive strength decreases due to a crosslinking reaction of the adhesive component with heat. Among these, from the viewpoint of further suppressing displacement of electronic components and further simplifying the manufacturing method, it is preferable that the adhesive film 50 of this embodiment contains a thermal expansion adhesive.

[0073] In the pressure-sensitive adhesive film 50 of this embodiment, the thermally expandable pressure-sensitive adhesive used in the pressure-sensitive adhesive resin layer (B) is preferably a pressure-sensitive adhesive whose adhesive strength decreases or is lost when heated at a temperature above 150°C, more preferably above 170°C. For example, a material can be selected that does not peel at temperatures below 150°C or below 170°C, but peels at temperatures above 150°C or above 170°C. Preferably, the pressure-sensitive adhesive film 50 has adhesive strength sufficient to prevent peeling from the support substrate during the manufacturing process of the electronic device. Here, the decrease or loss of adhesive strength due to heating at temperatures above 150°C or above 170°C can be evaluated, for example, by attaching the pressure-sensitive adhesive resin layer (B) side to a stainless steel plate, heat-treating at 140°C for 1 hour, and then heating at a temperature above 150°C or above 170°C for 2 minutes, and then measuring the peel strength from the stainless steel plate. The specific heating temperature when heating at a temperature exceeding 150°C or 170°C is set to a temperature higher than the temperature at which gas is generated or the temperature at which the heat-expandable microspheres thermally expand, and is appropriately set depending on the type of gas generated and the type of heat-expandable microspheres. In this embodiment, loss of adhesive strength refers to, for example, a 180° peel strength of less than 0.5 N / 25 mm measured at 23°C and a tensile speed of 300 mm / min.

[0074] Examples of gas-generating components that can be used in thermally expandable pressure-sensitive adhesives include azo compounds, azide compounds, and Meldrum's acid derivatives. Other examples include inorganic blowing agents such as ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium boron hydroxide, and various azides; water; fluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis(benzenesulfonyl)hydrazide; Other examples of organic blowing agents that can be used include hydrazine compounds such as p-toluenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide); semicarbazide compounds such as p-toluenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; and N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine and N,N'-dimethyl-N,N'-dinitrosoterephthalamide. The gas-generating component may be added to the adhesive resin (B1) or may be directly bonded to the adhesive resin (B1).

[0075] The heat-expandable microspheres used in heat-expandable pressure-sensitive adhesives can be, for example, microencapsulated blowing agents. Examples of such heat-expandable microspheres include microspheres in which a substance that easily gasifies and expands upon heating, such as isobutane, propane, or pentane, is encapsulated within an elastic shell. Examples of materials constituting the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. Heat-expandable microspheres can be produced, for example, by coacervation or interfacial polymerization. Heat-expandable microspheres can be added to adhesive resins.

[0076] The lower limit of the content of at least one selected from the gas-generating component and the heat-expandable microspheres can be appropriately set depending on the expansion ratio and adhesive strength reduction of the heat-peelable adhesive resin layer (B), and is not particularly limited. It is preferably 1 part by mass or more, more preferably 10 parts by mass or more, and even more preferably 12 parts by mass or more, per 100 parts by mass of the adhesive resin (B1) in the heat-peelable adhesive resin layer (B). The upper limit of the content of at least one selected from the gas-generating component and the heat-expandable microspheres is preferably 150 parts by mass or less, more preferably 130 parts by mass or less, and even more preferably 100 parts by mass or less, per 100 parts by mass of the adhesive resin (B1) in the heat-peelable adhesive resin layer (B). It is preferable to design the temperature at which gas is generated or the temperature at which the heat-expandable microspheres thermally expand are above 150°C or above 170°C.

[0077] Examples of the adhesive resin (B1) constituting the thermally expandable adhesive include (meth)acrylic resin (q), urethane resin, silicone resin, polyolefin resin, polyester resin, polyamide resin, fluorine resin, styrene-diene block copolymer resin, etc. Among these, (meth)acrylic resin (q) is preferred.

[0078] The (meth)acrylic resin (q) used in the adhesive resin layer (B) may be, for example, a copolymer containing a (meth)acrylic acid alkyl ester monomer unit (q1) and a monomer unit (q2) having a functional group capable of reacting with a crosslinking agent. In this embodiment, the (meth)acrylic acid alkyl ester refers to an acrylic acid alkyl ester, a methacrylic acid alkyl ester, or a mixture thereof.

[0079] The (meth)acrylic adhesive resin (q) of this embodiment can be obtained, for example, by copolymerizing a monomer mixture containing a (meth)acrylic acid alkyl ester monomer (q1) and a monomer (q2) having a functional group capable of reacting with a crosslinking agent.

[0080] Examples of the monomer (q1) that forms the (meth)acrylic acid alkyl ester monomer unit (q1) include (meth)acrylic acid alkyl esters having an alkyl group having about 1 to 12 carbon atoms. The monomer (q1) that forms the (meth)acrylic acid alkyl ester monomer unit (q1) is preferably a (meth)acrylic acid alkyl ester having an alkyl group having 1 to 8 carbon atoms. Specific examples include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, and 2-ethylhexyl methacrylate. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin (q) of this embodiment, the lower limit of the content of the (meth)acrylic acid alkyl ester monomer unit (q1) is preferably 10% by mass or more, more preferably 50% by mass or more, and even more preferably 85% by mass or more, based on the total amount of all monomer units in the (meth)acrylic adhesive resin (q) being 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing process.

[0043] In the (meth)acrylic adhesive resin (q) of the present embodiment, the upper limit of the content of the (meth)acrylic acid alkyl ester monomer unit (q1) is preferably 98.9% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (q) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components in the sealing step.

[0081] Examples of the monomer (q2) that forms the monomer (q2) having a functional group reactive with a crosslinking agent include acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid, fumaric acid, maleic acid, itaconic acid monoalkyl ester, mesaconic acid monoalkyl ester, citraconic acid monoalkyl ester, fumaric acid monoalkyl ester, maleic acid monoalkyl ester, glycidyl acrylate, glycidyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, tert-butylaminoethyl acrylate, and tert-butylaminoethyl methacrylate. The monomer (q2) that forms the monomer (q2) having a functional group reactive with a crosslinking agent is preferably acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, or the like. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin (q) of this embodiment, the upper limit of the content of the monomer unit (q2) is preferably 40% by mass or less, more preferably 20% by mass or less, and even more preferably 10% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (q) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 1% by mass or more.

[0082] The (meth)acrylic adhesive resin (q) of this embodiment may further contain, in addition to the monomer unit (q1) and the monomer unit (q2), a bifunctional monomer unit (q3) or a specific comonomer unit having surfactant properties (hereinafter referred to as a polymerizable surfactant). The polymerizable surfactant has the property of copolymerizing with the monomer (q1), the monomer (q2), and the monomer (q3), and also acts as an emulsifier when emulsion polymerization is performed.

[0083] Examples of the monomer (q3) forming the bifunctional monomer unit (q3) include allyl methacrylate, allyl acrylate, divinylbenzene, vinyl methacrylate, vinyl acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tetraethylene glycol di(meth)acrylate, and, for example, diacrylates or acrylates having both ends thereof. or dimethacrylates whose main chain structure is a propylene glycol type (for example, manufactured by Nippon Oil & Fats Corporation; trade names: PDP-200, PDP-400, ADP-200, ADP-400), a tetramethylene glycol type (for example, manufactured by Nippon Oil & Fats Corporation; trade names: ADT-250, ADT-850), or a mixture thereof (for example, manufactured by Nippon Oil & Fats Corporation; trade names: ADET-1800, ADPT-4000).

[0084] In the (meth)acrylic adhesive resin (q) of this embodiment, the upper limit of the content of the monomer unit (q3) is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and even more preferably 5% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (q) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 0.1% by mass or more.

[0085] Examples of the polymerizable surfactant include those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON RN-10, RN-20, RN-30, RN-50, etc.), those in which a polymerizable 1-propenyl group has been introduced into the benzene ring of an ammonium salt of a sulfate ester of polyoxyethylene nonylphenyl ether (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.; trade names: AQUALON HS-10, HS-20, HS-1025, etc.), and sulfosuccinic acid diesters having a polymerizable double bond in the molecule (manufactured by Kao Corporation; trade names: Latemul S-120A, S-180A, etc.). In the (meth)acrylic adhesive resin (q) of this embodiment, the upper limit of the content of the polymerizable surfactant is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, and even more preferably 5% by mass or less, when the total of all monomer units in the (meth)acrylic adhesive resin (q) is taken as 100% by mass, from the viewpoint of further suppressing misalignment of electronic components during the sealing step. The lower limit is not particularly limited, but is, for example, 0.1% by mass or more.

[0086] The (meth)acrylic adhesive resin (q) of the present embodiment may further contain, if necessary, a monomer unit formed from a monomer having a polymerizable double bond, such as vinyl acetate, acrylonitrile, or styrene.

[0087] The polymerization reaction mechanism of the (meth)acrylic adhesive resin (q) of this embodiment may be radical polymerization, anionic polymerization, cationic polymerization, or the like. Taking into consideration the production cost of the (meth)acrylic adhesive resin (q), the influence of the functional groups of the monomers, and the influence of ions on the surface of electronic components, polymerization by radical polymerization is preferred. When polymerization is carried out by radical polymerization, the radical polymerization initiator may be selected from the group consisting of benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 3,3,5-trimethylhexanoyl peroxide, di-2-ethylhexyl peroxydicarbonate, methyl ethyl ketone peroxide, t-butyl peroxyphthalate, t-butyl peroxybenzoate, di-t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butylperoxy-2-hexanoate, t-butyl peroxy, and the like. Examples of the peroxide include organic peroxides such as 2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, acetyl peroxide, isobutyryl peroxide, octanoyl peroxide, t-butyl peroxide, and di-t-amyl peroxide; inorganic peroxides such as ammonium persulfate, potassium persulfate, and sodium persulfate; and azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis-2-methylbutyronitrile, and 4,4'-azobis-4-cyanovaleric acid.

[0088] When polymerization is carried out by emulsion polymerization, among these radical polymerization initiators, inorganic peroxides such as water-soluble ammonium persulfate, potassium persulfate, and sodium persulfate, and azo compounds having a carboxyl group in the molecule such as water-soluble 4,4'-azobis-4-cyanovaleric acid are preferred. Considering the influence of ions on the surface of electronic components, azo compounds having a carboxyl group in the molecule such as ammonium persulfate and 4,4'-azobis-4-cyanovaleric acid are more preferred, and azo compounds having a carboxyl group in the molecule such as 4,4'-azobis-4-cyanovaleric acid are particularly preferred.

[0089] The adhesive resin layer (B) of this embodiment preferably further contains, in addition to the adhesive resin (B1), a crosslinking agent (B2) having two or more crosslinkable functional groups per molecule. The crosslinking agent (B2) having two or more crosslinkable functional groups per molecule is used to adjust the adhesive strength and cohesive strength by reacting with the functional groups of the adhesive resin (B1). Examples of such crosslinking agents (B2) include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate triadduct of trimethylolpropane, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate; and trimethylolpropane-tri-β-aziridinylpropionate. Examples of suitable epoxy compounds include aziridine compounds such as tetramethylolmethane-tri-β-aziridinylpropionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate; tetrafunctional epoxy compounds such as N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane; and melamine compounds such as hexamethoxymethylolmelamine. These compounds may be used alone or in combination of two or more. Among these, it is preferable to use one or more compounds selected from epoxy compounds, isocyanate compounds, and aziridine compounds.

[0090] The content of the crosslinking agent (B2) is usually preferably within a range such that the number of functional groups in the crosslinking agent (B2) is not greater than the number of functional groups in the adhesive resin (B1). However, if necessary, an excess amount may be added when new functional groups are generated in the crosslinking reaction or when the crosslinking reaction is slow. The lower limit of the content of the crosslinking agent (B2) in the adhesive resin layer (B) is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, per 100 parts by mass of the adhesive resin (B1), from the viewpoint of further suppressing misalignment of electronic components during the sealing process. Furthermore, the upper limit of the content of the crosslinking agent (B2) in the adhesive resin layer (B) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, per 100 parts by mass of the adhesive resin (B1), from the viewpoint of storage stability.

[0091] In order to improve adhesion to the support substrate, the adhesive resin layer (B) of this embodiment preferably contains a tackifier resin in addition to the adhesive resin (B1). Incorporation of a tackifier resin into the adhesive resin layer (B) is preferred because it facilitates adjustment of adhesion to the support substrate at around room temperature. The tackifier resin preferably has a softening point of 100°C or higher. Specific examples of tackifier resins include rosin-based resins such as rosin derivatives treated by esterification or the like; terpene-based resins such as α-pinene, β-pinene, dipentene, and terpene phenol-based resins; natural rosins such as gum-based, wood-based, and tall oil-based resins; petroleum resins obtained by hydrogenating, disproportionating, polymerizing, or maleating these natural rosins; and coumarone-indene resins.

[0092] Among these, those having a softening point in the range of 100 to 160°C are more preferred, and those in the range of 120 to 150°C are particularly preferred. Using a tackifier resin having a softening point within the above range not only reduces contamination and adhesive residue on the support substrate, but also enables further improved adhesion to the support substrate in a working environment. Furthermore, using a polymerized rosin ester-based tackifier resin as the tackifier resin not only reduces contamination and adhesive residue on the support substrate, but also improves adhesion to the support substrate in an environment of 80 to 130°C, and, in the case of a heat-expandable pressure-sensitive adhesive containing heat-expandable microspheres, enables easier peeling from the support substrate after the heat-expandable microspheres have expanded.

[0093] The blending ratio of the tackifier resin is not particularly limited, and may be appropriately selected so as to adjust the elastic modulus of the adhesive resin layer (B) within a desired predetermined numerical range. However, from the viewpoint of the elastic modulus and initial peel strength of the adhesive resin layer (B), the blending ratio of the tackifier resin is preferably 1 part by mass or more and 100 parts by mass or less per 100 parts by mass of the adhesive resin (B1). When the blending ratio of the tackifier resin is equal to or more than the lower limit per 100 parts by mass of the adhesive resin (B1), adhesion to the support substrate during operation tends to be improved. On the other hand, when the blending ratio is equal to or less than the upper limit per 100 parts by mass of the adhesive resin (B1), attachment to the support substrate at room temperature tends to be improved. In terms of adhesion to the support substrate and attachment at room temperature, it is more preferable that the blending ratio of the tackifier resin be 2 parts by mass or more and 50 parts by mass or less per 100 parts by mass of the adhesive resin (B1). Furthermore, the acid value of the tackifier resin is preferably 30 or less. If the acid value of the tackifier resin is equal to or less than the upper limit, adhesive residue tends to be less likely to be left on the support substrate when peeled off.

[0094] The adhesive resin layer (B) may contain additives such as plasticizers as other components. The lower limit of the total content of the adhesive resin (B1), crosslinking agent (B2), and tackifier resin in the adhesive resin layer (B), when the entire adhesive resin layer (B) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. Furthermore, when the adhesive resin layer (B) is composed of a heat-expandable adhesive, the lower limit of the total content of the adhesive resin (B1), crosslinking agent (B2), tackifier resin, gas-generating component, and heat-expandable microspheres in the adhesive resin layer (B), when the entire adhesive resin layer (B) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. The upper limit is not particularly limited, but is, for example, 100% by mass or less.

[0095] The adhesive resin layer (B) may be a single layer or a multilayer. For example, by laminating two or more layers with different degrees of expansion upon heating to form the adhesive resin layer (B), the adhesiveness and thermal peelability can be changed between one side and the other side of the adhesive resin layer (B). The lower limit of the thickness of the adhesive resin layer (B) is preferably 3 μm or more, more preferably 20 μm or more, from the viewpoint of improving the adhesiveness and thermal peelability. Furthermore, the upper limit of the thickness of the adhesive resin layer (B) is preferably 300 μm or less, more preferably 150 μm or less, from the viewpoint of improving the handleability of the adhesive film 50.

[0096] The adhesive resin layer (B) can be formed, for example, by applying an adhesive coating liquid onto the base layer 10, or by transferring the adhesive resin layer (B) formed on a separator onto the base layer 10. Conventional coating methods, such as roll coating, reverse roll coating, gravure roll coating, bar coating, comma coating, and die coating, can be used to apply the adhesive coating liquid. While there are no particular limitations on the drying conditions for the applied adhesive, drying at a temperature range of 80 to 200°C for 10 seconds to 10 minutes is generally preferred. Drying at 80 to 170°C for 15 seconds to 5 minutes is more preferred. To sufficiently promote the crosslinking reaction between the crosslinker and the adhesive, the adhesive coating liquid may be heated at 40 to 80°C for approximately 5 to 300 hours after drying. The base material layer 10 and the adhesive resin layer (B) may be formed by co-extrusion molding, or may be formed by laminating a film-like base material layer 10 and a film-like adhesive resin layer (B).

[0097] [Other Layers] The adhesive film 50 of the present embodiment may further include, for example, an irregularity-absorbing resin layer, an impact-absorbing layer, an easy-adhesion layer, or the like, between the base material layer 10 and the adhesive resin layer (A) or between the base material layer 10 and the adhesive resin layer (B), within a range that does not impair the effects of the present embodiment.

[0098] The method for manufacturing an electronic device according to this embodiment can be preferably used to manufacture an electronic device 400 including a fan-out package. That is, the electronic device 400 obtained by the method for manufacturing an electronic device according to this embodiment includes a fan-out package. In a fan-out package, terminals can be extended to the outside of the chip (fan out), so it can be used in applications where the number of terminals is large compared to the chip area. Furthermore, since a package substrate is not required, it can also be made thinner.

[0099] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0100] The present invention is not limited to the above-described embodiment, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0101] A: adhesive resin layer B: adhesive resin layer 10: base layer 10A: first surface 10B: second surface 50: adhesive film 60: first sealing material 65: second sealing material 70: electronic component 80: supporting substrate 100: structural body 200: electronic device 300: electronic device 310: wiring layer 320: bump 400: electronic device

Claims

1. A method for manufacturing an electronic device, comprising: a step (a) of preparing a structure comprising: a base layer; an adhesive film comprising: an adhesive resin layer (A) provided on a first surface of the base layer and for temporarily fixing an electronic component; and an adhesive resin layer (B) provided on a second surface of the base layer; an electronic component attached to the adhesive resin layer (A) of the adhesive film; and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a step (b) of encapsulating the electronic component with a sealing material, wherein the step (b) comprises, in this order, a step (b-1) of covering the electronic component with a first sealing material and a step (b-2) of encapsulating the electronic component covered with the first sealing material with a second sealing material.

2. The method for manufacturing an electronic device according to claim 1, further comprising, between step (b-1) and step (b-2), step (c) of curing the first sealing material by one or two methods selected from the group consisting of light irradiation and heat treatment.

3. The method for manufacturing an electronic device according to claim 1 or 2, wherein step (b-1) includes a step of covering the electronic component with the first sealing material using one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method.

4. The method for manufacturing an electronic device according to any one of claims 1 to 3, wherein step (b-2) includes a step of encapsulating the electronic component with the second encapsulant using one or more methods selected from the group consisting of transfer molding, injection molding, compression molding, and cast molding.

5. The method for manufacturing an electronic device according to any one of claims 1 to 4, wherein the first sealing material includes an epoxy resin-based sealing material.

6. The method for manufacturing an electronic device according to any one of claims 1 to 5, wherein the second sealing material includes an epoxy resin-based sealing material.

7. The method for manufacturing an electronic device according to any one of claims 1 to 6, wherein the sealing temperature in step (b-1) is 10°C or higher and 45°C or lower.

8. A method for manufacturing an electronic device according to any one of claims 1 to 7, wherein the viscosity of the first sealing material measured using a BF type viscometer while stirring at a temperature of 25°C and a shear rate of 5 rpm is 1 mPa·s or more and 400 Pa·s or less.

9. A method for manufacturing an electronic device according to any one of claims 1 to 8, wherein the viscosity of the second sealing material measured using a BF type viscometer at a temperature of 25°C and a shear rate of 5 rpm while stirring is 0.1 Pa·s or more and 1000 Pa·s or less.

10. The method for manufacturing an electronic device according to any one of claims 1 to 9, wherein the thickness of the first sealing material after covering the electronic components is 0.05 μm or more and 50 μm or less.

11. The method for manufacturing an electronic device according to any one of claims 1 to 10, wherein the thickness of the second sealing material after sealing the electronic components is 1 μm or more and 2 mm or less.

12. A method for manufacturing an electronic device according to any one of claims 1 to 11, comprising, after step (b), step (d) of peeling the support substrate from the structure by applying an external stimulus to the adhesive resin layer (B).

13. The method for manufacturing an electronic device according to claim 12, further comprising, after step (d), a step (e) of peeling the adhesive film from the electronic component.

14. The method for manufacturing an electronic device according to any one of claims 1 to 13, wherein the adhesive resin layer (A) contains an adhesive resin (A1).

15. The method for manufacturing an electronic device described in claim 14, wherein the adhesive resin (A1) comprises one or more selected from the group consisting of (meth)acrylic adhesive resins, silicone adhesive resins, urethane adhesive resins, olefin adhesive resins, and styrene adhesive resins.

16. The method for producing an electronic device according to claim 14 or 15, wherein the adhesive resin layer (A) further contains a crosslinking agent (A2) having two or more crosslinkable functional groups in one molecule.

17. The method for manufacturing an electronic device according to claim 16, wherein the content of the crosslinking agent (A2) is 0.1 parts by mass or more and 15 parts by mass or less per 100 parts by mass of the adhesive resin (A1).

18. The method for manufacturing an electronic device according to any one of claims 1 to 17, wherein the adhesive resin layer (B) contains a thermally expandable adhesive.

19. The method for manufacturing an electronic device according to claim 18, wherein the thermally expandable adhesive is an adhesive whose adhesive strength is reduced or lost when heated at a temperature exceeding 150°C.

20. The method for manufacturing an electronic device according to any one of claims 1 to 19, wherein the support substrate comprises at least one selected from the group consisting of a stainless steel plate and a glass plate.

21. The method for manufacturing an electronic device according to any one of claims 1 to 20, wherein in step (a), the distance between the electronic components is 10 μm or more and 10 mm or less.

22. A method for manufacturing an electronic device according to any one of claims 1 to 21, wherein step (a) includes step (a-1) of adhering the adhesive film onto the support substrate so that the adhesive resin layer (B) faces the support substrate.

23. The method for manufacturing an electronic device according to claim 22, wherein step (a) further comprises step (a-2) of obtaining the structure by arranging the electronic component on the adhesive resin layer (A) of the adhesive film attached to the support substrate.

24. The method for manufacturing an electronic device according to any one of claims 1 to 23, wherein the electronic device comprises a fan-out package.

Images