Light-emitting device package, manufacturing method therefor, and display device using same

Abstract

The present disclosure is applicable to a technical field related to display devices, and relates to, for example, a light-emitting device package using a light-emitting diode (LED), a manufacturing method therefor, and a display device using same. The present disclosure includes the steps of: forming a transmission layer that defines a unit package region; forming an adhesive layer on the transmission layer; transferring light-emitting devices onto the adhesive layer; forming a connection electrode for electrically connecting each of the light-emitting devices; forming an insulating layer that insulates at least a portion of the connection electrode; and forming a terminal part electrically connected to the connection electrode, wherein the connection electrode can include an extension connection electrode positioned to extend toward the end of the unit package region, or the terminal part includes an extension terminal part positioned to extend toward the end of the unit package region.

Description

Light-emitting device package, manufacturing method thereof, and display device using the same

[0001] The present invention is applicable to the technical field related to display devices, and relates to, for example, a light-emitting element package using an LED (Light Emitting Diode), a method for manufacturing the same, and a display device using the same.

[0002] In recent years, display devices with superior characteristics, such as thinness and flexibility, have been developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diode).

[0003] Meanwhile, a light-emitting diode (LED) is a semiconductor light-emitting device that is well known for converting electric current into light. Starting with the commercialization of a red LED using GaAsP compound semiconductors in 1962, it has been used as a light source for display images in electronic devices, including information and communication devices, along with green LEDs of the GaP:N series.

[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are used as pixels in display devices.

[0005] Compared to other display devices / panels, this type of LED technology boasts low power consumption, high brightness, and high reliability, and can be applied to flexible devices. Therefore, research institutes and companies have been actively researching this technology recently.

[0006] The LED display market is expanding with applications that leverage the high brightness and high reliability of LEDs. Signage displays are leading the market with these characteristics.

[0007] In such displays, LEDs can be manufactured in a package form that can be used as unit pixels.

[0008] To manufacture these packaged light sources, a large number of packages must be manufactured in a small area. Therefore, if inspection is performed using a conventional probe station equipped with a probe card, the physical movement of the probe card station can be time-consuming and increase manufacturing costs. Furthermore, the inspection process can increase the likelihood of package damage.

[0009] Therefore, a solution to these problems is required.

[0010] The present disclosure provides a light emitting device package capable of inspecting a plurality of light emitting device packages per probe pin, a method for manufacturing the same, and a display device using the same.

[0011] Accordingly, the present invention aims to provide a light-emitting device package, a method for manufacturing the same, and a display device using the same, which can increase the lifespan of a probe card by more than two times by reducing the number of probe pins required for inspection per package by half or less.

[0012] Meanwhile, it is an object of the present invention to provide a light-emitting device package capable of preventing damage to a package or package area due to probing, a method for manufacturing the same, and a display device using the same.

[0013] Furthermore, those skilled in the art will understand from the full intent of the specification and drawings that, according to other embodiments of the present invention, there may be additional technical problems not mentioned herein.

[0014] A method for manufacturing a light-emitting device package according to one embodiment of the present disclosure includes the steps of forming a transparent layer defining a unit package area; forming an adhesive layer on the transparent layer; transferring light-emitting devices onto the adhesive layer; forming a connecting electrode electrically connecting the light-emitting devices respectively; forming an insulating layer insulating at least a portion of the connecting electrode; and forming a terminal portion electrically connected to the connecting electrode, wherein the connecting electrode may include an extended connecting electrode positioned to extend toward an end of the unit package area, or the terminal portion may include an extended terminal portion positioned to extend toward an end of the unit package area.

[0015] A light-emitting device package according to one embodiment of the present disclosure may include: a transparent layer defining a unit package area; a light-emitting portion positioned adjacent to the transparent layer and including light-emitting elements forming a unit subpixel; a connecting electrode having a metal pattern shape connected to the light-emitting elements; an insulating layer insulating at least a portion of the connecting electrode; a terminal portion connected to the connecting electrode; and an extension connecting electrode positioned so as to extend from the connecting electrode to an end side of the unit package area or an extension terminal portion positioned so as to extend from the terminal portion to an end side of the unit package area.

[0016] A display device according to one embodiment of the present disclosure may include a light-emitting element package defining an individual pixel, wherein the light-emitting element package may include: a transparent layer defining a unit package area; a light-emitting portion positioned adjacent to the transparent layer and including light-emitting elements forming a unit subpixel; a connecting electrode having a metal pattern shape connected to the light-emitting elements; an insulating layer insulating at least a portion of the connecting electrode; a terminal portion connected to the connecting electrode; and an extension connecting electrode positioned so as to extend from the connecting electrode to an end of the unit package area or an extension terminal portion positioned so as to extend from the terminal portion to an end of the unit package area.

[0017] According to one embodiment of the present disclosure, the following effects are achieved.

[0018] According to an embodiment of the present disclosure, a plurality of light emitting device packages can be inspected per probe pin.

[0019] Therefore, the number of probe pins required for inspection per package can be reduced by more than half, thereby more than doubling the life of the probe card.

[0020] Additionally, the number of package areas or packages that can be inspected with the same number of probe pins is more than doubled, so the number of probe card movements can be reduced by half or less.

[0021] Meanwhile, if there is concern about damage to the package or package area during the inspection process (probing) using a probe card, damage to the package or package area due to probing can be prevented by avoiding the arrangement of the terminal portion or forming a separate common probing area.

[0022] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand the full scope of the specification and drawings.

[0023] FIG. 1 is a plan view showing a light-emitting device package according to one embodiment of the present disclosure.

[0024] FIGS. 2 to 7 are plan schematic diagrams showing a manufacturing process of a light emitting device package according to one embodiment of the present disclosure.

[0025] Figures 8 and 9 are planar schematic diagrams showing the inspection process of a light emitting element package according to a comparative example.

[0026] Figures 10 and 11 are schematic diagrams showing a process of inspecting a light emitting element package according to a comparative example using a probe card.

[0027] FIG. 12 is a schematic diagram showing a process for inspecting a light emitting device package according to one embodiment of the present disclosure using a probe card.

[0028] Fig. 13 is a planar schematic diagram showing a manufacturing process of a light-emitting element package according to a modified example of the present disclosure.

[0029] Fig. 14 is a planar schematic diagram showing the inspection position of the light emitting element package in the example of Fig. 13.

[0030] Fig. 15 is a planar schematic diagram showing a package manufactured through the manufacturing process of Figs. 1 to 7.

[0031] FIG. 16 and FIG. 17 are diagrams for comparing and explaining the inspection process of a light-emitting device package according to a comparative example and a light-emitting device package according to an embodiment of the present disclosure using 16 probe pins.

[0032] FIG. 18 and FIG. 19 are diagrams for comparing and explaining the inspection process of a light-emitting device package according to a comparative example and a light-emitting device package according to an embodiment of the present disclosure using 32 probe pins.

[0033] Figures 20 and 21 are schematic plan views showing variations of the extended connection electrode.

[0034] Figures 22 to 24 are schematic plan views showing variations of the extended terminal portion.

[0035] Figure 25 is a schematic diagram showing an example of a process for inspecting a light emitting element package area.

[0036] Figures 26 to 29 are schematic diagrams showing other examples of a process for inspecting a light emitting element package area.

[0037] Fig. 30 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to one embodiment of the present disclosure.

[0038] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably only for the convenience of writing the specification, and do not in themselves have distinct meanings or roles. In addition, when describing the embodiments disclosed in this specification, if it is determined that a specific description of a related known technology may obscure the gist of the embodiments disclosed in this specification, a detailed description thereof will be omitted. In addition, it should be noted that the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification by the attached drawings.

[0039] Furthermore, for the convenience of explanation, each drawing is described, but it is also within the scope of the present invention for a person skilled in the art to implement another embodiment by combining at least two drawings.

[0040] Additionally, when an element such as a layer, region or substrate is referred to as existing "on" another element, it will be understood that this may be directly on the other element, or that there may be intermediate elements in between.

[0041] The semiconductor light-emitting device mentioned in the specification includes LEDs, micro LEDs, etc., and may be used interchangeably.

[0042]

[0043] FIG. 1 is a plan view showing a light-emitting device package according to one embodiment of the present disclosure.

[0044] Referring to Fig. 1, a light-emitting device package (200) of a bottom emission type in which light is emitted in a downward direction is shown.

[0045] A light-emitting device package (200) according to one embodiment may include a light-emitting unit (260) including light-emitting devices (261, 262, 263) forming unit subpixels on a transparent layer (230) defining a unit package area (202; see FIG. 2).

[0046] The transparent layer (230) can form a light-emitting surface. For example, light emitted from the light-emitting portion (260) can be emitted through the transparent layer (230). The transparent layer (230) can be formed of at least one material selected from the group consisting of acrylic, epoxy, silicone, Teflon, silicone acrylic, and silicone epoxy composites.

[0047] For example, the transparent layer (230) may form a substrate, and a light-emitting portion (260) including light-emitting elements (261, 262, 263) may be provided on the substrate. Hereinafter, the transparent layer (230) and the substrate (230) will be described together.

[0048] As an exemplary embodiment, the light emitting portion (260) may be transferred and positioned on an adhesive layer (290) positioned on a transparent layer (230) (see FIG. 4).

[0049] On the transparent layer (230), connecting electrodes (271, 272, 273, 274) electrically connected to the light-emitting elements (261, 262, 263; 260) may be provided. These connecting electrodes (271, 272, 273, 274) may be made of a metal having excellent reflectivity.

[0050] The light-emitting element (260) may include a first light-emitting element (261), a second light-emitting element (262), and a third light-emitting element (263). For example, the first light-emitting element (261) may be a red light-emitting element (R), the second light-emitting element (262) may be a green light-emitting element (G), and the third light-emitting element (263) may be a blue light-emitting element (B). In some cases, at least one of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may include two or more light-emitting elements.

[0051] When the light-emitting element package (200) is used in a display device, each of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may correspond to an individual subpixel. The first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may together constitute a unit pixel.

[0052] The light emitting element (261, 262, 263) may be a mini LED having a size in millimeters or a micro LED having a size in micrometers.

[0053] The connecting electrode may include a first connecting electrode (271) connected to one electrode of the first light-emitting element (261), a second connecting electrode (272) connected to one electrode of the second light-emitting element (262), a third connecting electrode (273) connected to one electrode of the third light-emitting element (263), and a fourth connecting electrode (274) commonly connected to the other electrodes of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263).

[0054] At least a portion of the connecting electrodes (271, 272, 273, 274) may be insulated by an insulating layer (220; see FIG. 5).

[0055] A terminal portion (211, 212, 213, 214) may be provided on each of these connecting electrodes (271, 272, 273, 274). For example, the terminal portion (211, 212, 213, 214) may be positioned on a portion of the connecting electrode (271, 272, 273, 274) that is not covered by the insulating layer (220).

[0056] In this way, the surface where the light-emitting portion (260), the connecting electrodes (271, 272, 273, 274) and the terminal portions (211, 212, 213, 214) are located can be partially covered and flattened by the insulating layer (220). At this time, the terminal portions (211, 212, 213, 214) can be exposed to the outside. For example, the terminal portions (211, 212, 213, 214) can be electrically connected to the electrode pads (120) of the display device (10; see FIG. 30).

[0057] Each of the connecting electrodes (271, 272, 273, 274) may include a connecting portion (271a, 272a, 273a, 274a) connected to a terminal portion (211, 212, 213, 214). The terminal portions (211, 212, 213, 214) may be positioned in electrical contact with the connecting portions (271a, 272a, 273a, 274a). For example, the terminal portions (211, 212, 213, 214) may be connected by direct contact with the connecting portions (271a, 272a, 273a, 274a) or by a through-electrode.

[0058] Extension connecting electrodes (271b, 272b, 273b, 274b) that extend to the end side of the unit package area (202; see FIG. 2) can be connected to the connecting electrodes (271, 272, 273, 274).

[0059] As an exemplary embodiment, the extension connecting electrodes (271b, 272b, 273b, 274b) may be formed to extend diagonally with respect to the unit package area (202).

[0060] For example, each of the connecting electrodes (271, 272, 273, 274) may include an extended connecting electrode (271b, 272b, 273b, 274b) that is positioned to extend toward an end of the package (200). These extended connecting electrodes (271b, 272b, 273b, 274b) may be connected to neighboring extended connecting electrodes (271b, 272b, 273b, 274b) during the manufacturing process of the package (200) and may be used during the process of inspecting the package (200). For example, the extended connecting electrodes (271b, 272b, 273b, 274b) may be used to inspect the light emitting device package (200) using a probe card.

[0061] Meanwhile, as another example, terminal portions (211, 212, 213, 214) may be connected to extension terminal portions (211a, 212a, 213a, 214a; see Fig. 13) that extend toward the end of the unit package area (202; see Fig. 2).

[0062] As an exemplary embodiment, the extension terminal portions (211a, 212a, 213a, 214a) may be formed to extend diagonally with respect to the unit package area (202).

[0063] For example, each of the terminal portions (211, 212, 213, 214) may include an extension terminal portion (211a, 212a, 213a, 214a; see FIG. 13) that extends toward an end of the package (200). These extension terminal portions (211a, 212a, 213a, 214a) may be connected to neighboring extension terminal portions (211a, 212a, 213a, 214a) during the manufacturing process of the package (200) and may be used during the process of inspecting the package (200). For example, the extension terminal portions (211a, 212a, 213a, 214a) may be used to inspect the light emitting element package (200) using a probe card.

[0064] Although not shown, the light emitting element package (200) may further include a driving element that drives the light emitting elements (261, 262, 263; 260). The driving element may be a micro driver integrated circuit chip (Driver IC) that can selectively drive the light emitting elements (260). In this case, the driving element may be connected to at least one of the light emitting elements (261, 262, 263) and the connection electrodes (271, 272, 273, 274). A detailed description thereof will be omitted.

[0065] A light-emitting device package (200) according to one embodiment of the present disclosure includes a transparent layer (230) defining a unit package area (202; see FIG. 2), a light-emitting portion (260) positioned adjacent to the transparent layer (230) and including light-emitting elements (261, 262, 263) forming a unit subpixel, a connecting electrode (271, 272, 273, 274) having a metal pattern shape connected to the light-emitting elements (261, 262, 263), an insulating layer (220; see FIG. 5) insulating at least a portion of the connecting electrode (271, 272, 273, 274), a terminal portion (211, 212, 213, 214) connected to the connecting electrode (271, 272, 273, 274), and a connecting electrode (271, 272, 273, 274) may be configured to include an extended connection electrode (271b, 272b, 273b, 274b) positioned to extend from the end side of the unit package area (202) or an extended terminal portion (211a, 212a, 213a, 214a) positioned to extend from the terminal portion (211, 212, 213, 214) to the end side of the unit package area (202).

[0066] At least one of the transmission layer (230) and the insulation layer (220) may include a transparent insulation layer. For example, at least one of the transmission layer (230) and the insulation layer (220) may be formed of at least one material selected from the group consisting of acrylic, epoxy, silicone, Teflon, silicone acrylic, and silicone epoxy composites. For example, the transmission layer (230) may be provided by dispersing filler particles (not shown) using such a material as a binder.

[0067] For example, the refractive index of the transparent insulating layer forming at least one of the transparent layer (230) and the insulating layer (220) may be 1.5 or less.

[0068] One electrode (e.g., P-electrode) and the other electrode (e.g., N-electrode) of the light emitting element (261, 262, 263; 260) can be electrically connected to the first connecting electrode (271) to the fourth connecting electrode (274) by solder, respectively.

[0069] At least one of these connecting electrodes (271, 272, 273, 274) can be manufactured using a redistribution layer (RDL) process used in a semiconductor packaging process. Using this layer redistribution (RDL) process, the light-emitting elements (261, 262, 263) can be connected to the connecting electrodes (271, 272, 273, 274).

[0070] For example, the connecting electrodes (271, 272, 273, 274) can be connected by direct contact with the terminal portions (211, 212, 213, 214).

[0071]

[0072] FIGS. 2 to 7 are plan schematic diagrams showing a manufacturing process of a light emitting device package according to one embodiment of the present disclosure.

[0073] Hereinafter, a manufacturing process of a light emitting device package according to one embodiment of the present disclosure will be described step by step with reference to FIGS. 2 to 7.

[0074] Referring to FIG. 2, a substrate (201) is prepared. This substrate (201) can be manufactured using a transparent insulating layer. This substrate (201) corresponds to a transparent layer (230) through which light emitted from the light-emitting portion (260) described above passes. This transparent layer (230) can form a light-emitting surface of the light-emitting element package (200).

[0075] A plurality of unit package areas (202, 203, 204, 205) can be formed on the substrate (201). In FIG. 2 and below, four unit package areas (202, 203, 204, 205) are illustrated, but the present invention is not limited thereto, and a greater number of unit package areas can be formed. For example, a plurality of light-emitting device packages (200) can be manufactured together.

[0076] Referring to FIG. 3, an adhesive layer (290) may be formed on a substrate (transparent layer; 230). This adhesive layer (290) may include a transparent resin. For example, the adhesive layer (290) may be formed by applying a transparent resin layer.

[0077] Below, a drawing is attached and explained focusing on the unit package area (202) on one side.

[0078] Referring to FIG. 4, a light-emitting portion (260) including light-emitting elements (261, 262, 263) can be transferred onto an adhesive layer (290). As an exemplary embodiment, the light-emitting portion (260) can be located at the center of the adhesive layer (290) or the unit package area (202).

[0079] Thereafter, referring to FIG. 5, connecting electrodes (271, 272, 273, 274) electrically connected to each light-emitting element (261, 262, 263) can be formed. The connecting electrodes (271, 272, 273, 274) can include connecting portions (271a, 272a, 273a, 274a) for forming terminal portions (211, 212, 213, 214).

[0080] Extension connecting electrodes (271c, 272c, 273c, 274c) that extend to the end side of the unit package area (202) can be connected to the connecting electrodes (271, 272, 273, 274).

[0081] For example, extended connection electrodes (271c, 272c, 273c, 274c) may be connected to the corner sides of the connection portions (271a, 272a, 273a, 274a). These extended connection electrodes (271c, 272c, 273c, 274c) may extend outside the unit package area (202) and be connected to extended connection electrodes (271c, 272c, 273c, 274c) extending from neighboring unit package areas (203, 204, 205).

[0082] As an exemplary embodiment, the extension connecting electrodes (271b, 272b, 273b, 274b) may be formed to extend diagonally with respect to the unit package area (202).

[0083] These extended connection electrodes (271c, 272c, 273c, 274c) can be connected to the extended connection electrodes (271c, 272c, 273c, 274c) of the neighboring package regions (203, 204, 205) to form inspection electrodes. Therefore, the extended connection electrodes (271c, 272c, 273c, 274c) can be referred to as inspection electrodes.

[0084] At least a portion of the connecting electrodes (271, 272, 273, 274) may be insulated by an insulating layer (220;).

[0085] Referring to FIG. 6, terminal portions (211, 212, 213, 214) can be formed on connection portions (271a, 272a, 273a, 274a) of connection electrodes (271, 272, 273, 274). For example, terminal portions (211, 212, 213, 214) can be connected by direct contact with connection portions (271a, 272a, 273a, 274a) or by through-electrodes.

[0086] A terminal portion (211, 212, 213, 214) may be provided on each of these connecting electrodes (271, 272, 273, 274). For example, the terminal portion (211, 212, 213, 214) may be positioned on a portion of the connecting electrode (271, 272, 273, 274) that is not covered by the insulating layer (220).

[0087] In this way, the surface where the light emitting portion (260), the connecting electrodes (271, 272, 273, 274) and the terminal portions (211, 212, 213, 214) are located can be partially covered and flattened by the insulating layer (220). At this time, the terminal portions (211, 212, 213, 214) can be exposed to the outside.

[0088] As described above, the extension connection electrodes (271c, 272c, 273c, 274c) or the inspection electrodes (271c, 272c, 273c, 274c) can be used to inspect the light emitting device package (200) using a probe card.

[0089] Referring to Fig. 7, since neighboring package areas are connected to each other by extension connection electrodes (271c, 272c, 273c, 274c) or inspection electrodes (271c, 272c, 273c, 274c), more efficient inspection can be performed. For example, inspection of a package can be performed by contacting the probe of a probe card to the terminal portions (211, 212, 213, 214) indicated by X. In other words, inspection of multiple packages can be possible by contacting only one probe to one package. This will be described in detail later.

[0090] Figures 8 and 9 are planar schematic diagrams showing the inspection process of a light emitting element package according to a comparative example.

[0091] Figures 8 and 9 show examples of the manufacturing process of a light emitting device package (20) having a general terminal portion (21, 22, 23, 24).

[0092] The light-emitting element package (20) according to this comparative example includes a first light-emitting element (25), a second light-emitting element (26), and a third light-emitting element (27), and these light-emitting elements (25, 26, 27) are electrically connected to terminal portions (21, 22, 23, 24), respectively.

[0093] Although the connecting electrodes are omitted in FIGS. 8 and 9, the light emitting elements (25, 26, 27) can be connected to the terminal portions (21, 22, 23, 24) by the connecting electrodes, respectively. However, as in the present disclosure, an extended connecting electrode is not provided.

[0094] Referring to Fig. 9, the probe of the probe card can be brought into contact with the positions marked with X of the four terminal portions (21, 22, 23, 24) provided in each light emitting element package (20) to inspect the light emitting element packages (20).

[0095] Figures 10 and 11 are schematic diagrams showing a process of inspecting a light emitting element package according to a comparative example using a probe card.

[0096] Referring to FIG. 10, the probe card (300) includes a circuit board (PC board; 310) and probes (probe pins; 320) connected by solder (330).

[0097] In order to inspect the light emitting device package (20) of the structure described in FIGS. 8 and 9, four inspection pins are required per package (20) (RGB and common electrode).

[0098] However, inspecting high-precision, high-density packages requires a more efficient inspection method. For example, inspecting high-precision, high-density packages measuring on the order of 200 μm requires a more efficient inspection structure.

[0099] Referring to FIG. 11, the probing operation of the probe card (300) causes physical damage to the package (20) and the inspection probe pin (320).

[0100] For example, left-right movement may occur on the pad (terminal portion; 21) due to the up-and-down movement of the probe pin (320). At this time, after the pin (320) comes into contact with the pad (21), the pin (320) may move horizontally during the overdrive process, causing adhesion between the pin (320) and the pad (21).

[0101] Meanwhile, a stabilization time may be required before the pin (320) comes into contact again after being separated from the pad (21) by the vertical movement of the probe card (300).

[0102] In this process, physical damage may occur to the inspection probe pin (320).

[0103] However, in order to achieve reasonable manufacturing and maintenance costs for the probe card (300), the number of pins of the probe card (300) cannot be increased indiscriminately. The physical movement speed of the probe card (300), which takes a lot of time, increases the inspection time, thereby increasing the time and cost of the entire inspection process.

[0104] As shown in Fig. 9, since the probe of the probe card contacts the positions marked with X of the four terminal portions (21, 22, 23, 24) provided in each light emitting element package (20) to inspect the light emitting element packages (20), the distance between the two probe pins (320) can be adjusted to the distance (a) between the two terminal portions (21, 22).

[0105] FIG. 12 is a schematic diagram showing a process for inspecting a light emitting device package according to one embodiment of the present disclosure using a probe card.

[0106] Referring to FIG. 12, packages can be inspected by contacting a probe pin (320) to one terminal portion (e.g., 211) per unit package area (202) using a probe card (301). Accordingly, the distance between the probe pins (320) can be adjusted to the distance (b) between the terminal portions (211) on one side of the two package (202) areas.

[0107] In this way, in order to inspect the light emitting device package (20) according to the comparative example, one package (20) can be inspected per four probe pins (320) of the probe card (300). However, according to the embodiment of the present disclosure, four light emitting device packages (200) can be inspected per four probe pins (320). For example, four light emitting device package areas (202) can be inspected using four probe pins (320).

[0108] Therefore, the number of probe pins (320) required for inspection per package can be reduced by half or less, so that the lifespan of the probe card (301) can be increased by more than two times.

[0109] In addition, since the number of package areas (202) or packages (200) that can be inspected with the same number of probe pins (320) is increased by more than two times, the number of movements of the probe card (301) can be reduced to less than half.

[0110] Meanwhile, in a case where there is concern about damage to the package (200) or the package area (202) during the inspection process (probing) using the probe card (301), damage to the package (200) or the package area (202) due to probing can be prevented by avoiding the placement of the light emitting element (261, 262, 263) in one of the four terminal areas (211, 212, 213, 214) or by forming a separate common probing area.

[0111] Fig. 13 is a plan schematic diagram showing a manufacturing process of a light-emitting element package according to a modified example of the present disclosure. Fig. 14 is a plan schematic diagram showing an inspection position of the light-emitting element package in the example of Fig. 13.

[0112] Referring to FIG. 13, the terminal portions (211, 212, 213, 214) may include extended terminal portions (211a, 212a, 213a, 214a) positioned to extend toward the end of the unit package area (202).

[0113] As mentioned above, for example, each of the terminal portions (211, 212, 213, 214) may include an extension terminal portion (211a, 212a, 213a, 214a) positioned to extend toward the end of the package (200).

[0114] As an exemplary embodiment, the extension terminal portions (211a, 212a, 213a, 214a) may be formed to extend diagonally with respect to the unit package area (202).

[0115] These extension terminal portions (211a, 212a, 213a, 214a) can be used in the process of inspecting the package (200) by being connected to extension terminal portions (211a, 212a, 213a, 214a) connected to neighboring packages (200) during the manufacturing process of the package (200). For example, the extension terminal portions (211a, 212a, 213a, 214a) can be used to inspect the light emitting element package (200) using a probe card.

[0116] At this time, the connecting electrodes (271, 272, 273, 274) may not be provided with extended connecting electrodes (271c, 272c, 273c, 274c). In this case, when the extended terminal portions (211a, 212a, 213a, 214a) are provided, the connecting electrodes (271, 272, 273, 274) may not be provided with extended connecting electrodes (271c, 272c, 273c, 274c). However, in some cases, the extended connecting electrodes (271c, 272c, 273c, 274c) and the extended terminal portions (211a, 212a, 213a, 214a) may be provided together.

[0117] Referring to Fig. 14, since neighboring package areas are connected to each other by the extended terminal portions (211a, 212a, 213a, 214a), more efficient inspection can be performed. For example, inspection of a package can be performed by contacting the probe of a probe card to the terminal portions (211, 212, 213, 214) indicated by X. In other words, inspection of multiple packages can be possible by contacting only one probe to one package.

[0118] Fig. 15 is a planar schematic diagram showing a package manufactured through the manufacturing process of Figs. 1 to 7.

[0119] Referring to FIG. 15, the unit package area (202) can be separated into individual packages (200). In this way, each light emitting device package (200) can be manufactured by separating the unit package area (202). Each of these light emitting device packages (200) can have the same shape as that illustrated in FIG. 1.

[0120] In FIG. 15, the individual unit package area (202) is separated, and the extended connection electrodes (271b, 272b, 273b, 274b) can be positioned within the package area (202). For example, a portion of the extended connection electrodes (271c, 272c, 273c, 274c) positioned outside the package area (202) can be cut off, and the extended connection electrodes (271b, 272b, 273b, 274b) can be positioned within the package area (202).

[0121] Meanwhile, although not shown separately, some of the extension terminal portions (211a, 212a, 213a, 214a) may also be cut off so that the extension terminal portions (211a, 212a, 213a, 214a) are positioned within the package area (202).

[0122] FIG. 16 and FIG. 17 are diagrams for comparing and explaining the inspection process of a light-emitting device package according to a comparative example and a light-emitting device package according to an embodiment of the present disclosure using 16 probe pins.

[0123] Referring to Fig. 16, for example, in the case of a probe card (300) equipped with 16 probe pins, four packages (20, or package areas) can be inspected. In Fig. 16, the portions where the 16 probe pins are located are indicated by an X.

[0124] On the other hand, referring to Fig. 17, in the case of a probe card (301) equipped with 16 probe pins, 16 packages (200) or package areas (202) can be inspected. In Fig. 17, the portions where the 16 probe pins are located are indicated by an X. In this way, one probe pin can be located per package area (202) to perform inspection.

[0125] FIG. 18 and FIG. 19 are diagrams for comparing and explaining the inspection process of a light-emitting device package according to a comparative example and a light-emitting device package according to an embodiment of the present disclosure using 32 probe pins.

[0126] Referring to Fig. 18, for example, in the case of a probe card (300) equipped with 32 probe pins, 8 packages (20, or package areas) can be inspected. In Fig. 18, the portion where the 32 probe pins are located is indicated by an X.

[0127] On the other hand, referring to Fig. 19, in the case of a probe card (301) equipped with 32 probe pins, 32 packages (200) or package areas (202) can be inspected. In Fig. 19, the portions where the 32 probe pins are located are indicated by an X. In this way, one probe pin can be located per package area (202) to perform inspection.

[0128]

[0129] Figures 20 and 21 are schematic plan views showing variations of the extended connection electrode.

[0130] Referring to FIG. 20, the extension connection electrodes (271c, 272c, 273c, 274c) may include a vertical portion (271d) and a horizontal portion (271e) extending in the horizontal and vertical directions with respect to the unit package area (202).

[0131] Depending on the manufacturing process of the package (200), depending on factors such as the layout of the wiring, instead of the extended connection electrodes (271c, 272c, 273c, 274c) positioned diagonally in the package area (202), vertical portions (271d) and horizontal portions (271e) extending in the horizontal and vertical directions may be provided in each connection electrode (271, 272, 273, 274). These vertical portions (271d) and horizontal portions (271e) may be electrically connected to the vertical portions (271d) and horizontal portions (271e) extending in the neighboring package areas (203, 204, 205).

[0132] Such vertical portions (271d) and horizontal portions (271e) can perform the same function as the extended connection electrodes (271c, 272c, 273c, 274c) described above. Therefore, redundant descriptions are omitted.

[0133] Meanwhile, when the unit package area (202) is cut and separated into unit packages (200), the vertical portion (271d) and horizontal portion (271e) may be partially located on the border side of the unit package (200).

[0134] Referring to FIG. 21, a first contact portion (271f) through which external electrical contact is made may be provided between adjacent extension connection electrodes (271c, 272c, 273c, 274c) connected to extension connection electrodes (271c, 272c, 273c, 274c).

[0135] Accordingly, the unit package area (202) or the unit package (200) can be inspected through the first contact portion (271f). For example, the unit package area (202) or the unit package (200) can be inspected by contacting the probe pin with the first contact portion (271f). Accordingly, damage that may be inflicted on the terminal portions (211, 212, 213, 214) during the probing process can be prevented.

[0136] As shown, for stable contact of the probe pin, the first contact portion (271f) may have a larger area than the extension connection electrodes (271c, 272c, 273c, 274c).

[0137] For example, the first contact portion (271f) may be located at a central position between adjacent extension connection electrodes (271c, 272c, 273c, 274c).

[0138] Referring to FIG. 21, the first contact portion (271f) can be connected to extension connection electrodes (271c, 272c, 273c, 274c) located in four adjacent unit package areas (202, 203, 204, 205).

[0139] This first contact portion (271f) can perform the same function as the extended connection electrodes (271c, 272c, 273c, 274c) described above. Therefore, redundant descriptions are omitted.

[0140]

[0141] Figures 22 to 24 are schematic plan views showing variations of the extended terminal portion.

[0142] Referring to FIG. 22, as described above with reference to FIG. 13, the terminal portions (211, 212, 213, 214) may include extended terminal portions (211a, 212a, 213a, 214a) positioned to extend toward the end of the unit package area (202).

[0143] As mentioned above, for example, each of the terminal portions (211, 212, 213, 214) may be electrically connected and positioned on the connecting portions (271a, 272a, 273a, 274a).

[0144] Each of these terminal portions (211, 212, 213, 214) may include an extension terminal portion (211a, 212a, 213a, 214a) positioned to extend toward the end of the package (200).

[0145] At this time, the connecting electrodes (271, 272, 273, 274) may not be provided with extended connecting electrodes (271c, 272c, 273c, 274c). In this case, when the extended terminal portions (211a, 212a, 213a, 214a) are provided, the connecting electrodes (271, 272, 273, 274) may not be provided with extended connecting electrodes (271c, 272c, 273c, 274c).

[0146] Referring to FIG. 23, the terminal portions (211, 212, 213, 214) may include a vertical portion (211b) and a horizontal portion (211c) extending in the horizontal and vertical directions with respect to the unit package area (202).

[0147] Depending on the manufacturing process of the package (200), depending on factors such as the layout of wiring, instead of the extended terminal portions (211a, 212a, 213a, 214a) positioned diagonally in the package area (202), vertical portions (211b) and horizontal portions (211c) extending in the horizontal and vertical directions may be provided from each terminal portion (211, 212, 213, 214). These vertical portions (211b) and horizontal portions (211c) may be electrically connected to the vertical portions (211b) and horizontal portions (211c) extending from the neighboring package areas (203, 204, 205).

[0148] Such vertical portions (211b) and horizontal portions (211c) can perform the same function as the extended connection electrodes (271c, 272c, 273c, 274c) described above. Therefore, redundant descriptions are omitted.

[0149] Meanwhile, when the unit package area (202) is cut and separated into unit packages (200), the vertical portion (211b) and horizontal portion (211c) may be partially located on the edge side of the unit package (200).

[0150] Referring to FIG. 24, a second contact portion (211d) through which external electrical contact is made may be provided between adjacent extension terminal portions (211a, 212a, 213a, 214a) connected to extension terminal portions (211a, 212a, 213a, 214a).

[0151] Accordingly, the unit package area (202) or the unit package (200) can be inspected through the second contact portion (211d). For example, the unit package area (202) or the unit package (200) can be inspected by contacting the probe pin with the second contact portion (211d). Accordingly, damage that may be inflicted on the terminal portions (211, 212, 213, 214) during the probing process can be prevented.

[0152] As shown, for stable contact of the probe pin, the second contact portion (211d) may have a larger area than the extension terminal portions (211a, 212a, 213a, 214a).

[0153] For example, the second contact portion (211d) may be located at a central position between adjacent extension terminal portions (211a, 212a, 213a, 214a).

[0154] Referring to FIG. 24, the second contact portion (211d) can be connected to the extension terminal portions (211a, 212a, 213a, 214a) located in four adjacent unit package areas (202, 203, 204, 205).

[0155] This second contact portion (211d) can perform the same function as the extended connection electrodes (271c, 272c, 273c, 274c) described above. Therefore, redundant descriptions are omitted.

[0156]

[0157] Figure 25 is a schematic diagram showing an example of a process for inspecting a light emitting element package area.

[0158] Referring to FIG. 25, for example, when a package configuration is formed in a plurality of light emitting element package (202) areas such as FIG. 17, inspection can be performed on nine packages located in area A using a probe card (301).

[0159] Here, inspections can be performed sequentially for the package areas (202) indicated by B1 to B9 (inspection #1 to inspection #9). At this time, part C indicates the area to which a signal is applied.

[0160] First, in the inspection #1 process, a signal is applied by contacting the probe pin at the C portion of the four packages, and at this time, inspection of the package (200) corresponding to B1 can be performed.

[0161] Afterwards, in the inspection #2 process, the probe pin is moved one line lower than in the inspection #1 process, and a signal is applied by contacting the probe pin at the C part of the four packages, and at this time, the inspection of the package (200) corresponding to B2 can be performed.

[0162] Next, in the inspection #3 process, in the inspection #2 process, moving one line lower, the probe pins are brought into contact with the C portion of the four packages and a signal is applied, and at this time, the inspection of the package (200) corresponding to B3 can be performed.

[0163] Afterwards, in the inspection #4 process, in the inspection #1 process, moving one line to the right, the probe pin is brought into contact with the C portion of the four packages and a signal is applied, and at this time, the inspection of the package (200) corresponding to B4 can be performed.

[0164] Through this process, inspection of packages (200) located at B1 to B9 can be performed while moving the probing position. That is, inspection of nine packages (200) can be performed through the process of inspection #1 to inspection #9.

[0165] At this time, during the processes of inspection #1 to inspection #9, the probe pin can be maintained in contact with all 16 packages. During this process, the part (C) to which the signal is applied can be changed, and inspection of the package (200) can be performed.

[0166]

[0167] Figures 26 to 29 are schematic diagrams showing other examples of a process for inspecting a light emitting element package area.

[0168] The inspection of the package (200) described above with reference to FIG. 25 may correspond to an electrical inspection. That is, electrical characteristics such as short circuits, open circuits, and defects in light-emitting elements may be inspected.

[0169] For example, the electrical inspection may include inspection of the forward voltage (Vf) characteristics of each light emitting element (261, 262, 263), inspection of the reverse current (Ir) characteristics of each light emitting element (261, 262, 263), and inspection of the mutual short of each light emitting element (261, 262, 263).

[0170] In addition, optical inspection of the light emitting device package (200) can be performed simultaneously. Since the margin of the inspection process can be increased by at least one of the extension connection electrodes (271c, 272c, 273c, 274c) and the extension terminal portions (211a, 212a, 213a, 214a) of the package (200), optical inspection can be performed simultaneously with the electrical inspection of the package (200).

[0171] For example, referring to FIG. 26, in the inspection #1 process, a probe pin is brought into contact with the C portion of four packages to apply a signal, and at this time, an electrical inspection of the package (200) corresponding to D1 can be performed.

[0172] In addition, at intervals of a certain distance (for example, three package intervals) in the D1 area, a probe pin is brought into contact with the F portion of four packages to apply a signal, and at this time, an optical inspection of the package (200) corresponding to E1 can be performed.

[0173] Such optical inspection can inspect at least one of the spectrum of each light-emitting element (261, 262, 263), the dominant wavelength of each light-emitting element (261, 262, 263), the luminous flux of each light-emitting element (261, 262, 263), and the radiance of each light-emitting element (261, 262, 263).

[0174] Thereafter, referring to FIG. 27, in the inspection #2 process, in the inspection #1 process, moving one line downward, the probe pins are brought into contact with the C portion of the four packages and a signal is applied, and at this time, an electrical inspection of the package (200) corresponding to D2 can be performed.

[0175] In addition, in the D2 area, a probe pin is brought into contact with four packages at a certain distance apart (for example, three package intervals) at the F portion, and a signal is applied, and at this time, an optical inspection of the package (200) corresponding to E2 can be performed.

[0176] After the inspection is performed in this manner while moving downward, referring to FIG. 28, in the inspection #6 process, moving downward, the probe pins contact the C portion of the four packages to apply a signal, and at this time, an electrical inspection of the package (200) corresponding to D6 can be performed.

[0177] In addition, in the D6 region, a probe pin may be brought into contact with four packages at the F portion at intervals of a certain distance (for example, an interval of three packages), and a signal may be applied, and an optical inspection of the package (200) corresponding to E6 may be performed. At this time, since there is only one package on the lower side of the D6 region, an optical inspection may be performed at intervals of a certain distance (for example, an interval of three packages) on the upper side that has not been inspected.

[0178] Thereafter, referring to FIG. 29, in the inspection #9 process, a signal is applied by moving one line in the outward direction and making contact with the probe pin at the C portion of the four packages, and at this time, an electrical inspection of the package (200) corresponding to D9 can be performed.

[0179] In addition, a probe pin is brought into contact with four packages at a certain distance apart (for example, three package intervals) in the D9 area, and a signal is applied, and at this time, an optical inspection of the package (200) corresponding to E9 can be performed.

[0180] By this process, electrical inspection of the package (200) located at B1 to B9 can be performed while moving the probing position. In addition, optical inspection of the package (200) located at E1 to E9 can be performed simultaneously while moving the probing position.

[0181] That is, electrical and optical inspections can be performed on nine packages (200) through the process of inspection #1 to inspection #9.

[0182] At this time, during the processes of inspection #1 to inspection #9, the probe pin can be maintained in contact with all 16 packages. During this process, the part (C) to which the signal is applied can be changed, and inspection of the package (200) can be performed.

[0183]

[0184] Fig. 30 is a cross-sectional schematic diagram showing a display device using a light-emitting element package according to one embodiment of the present disclosure.

[0185] Fig. 30 shows an example of a display device (10) in which a light-emitting element package (200) according to one embodiment described above is used as a unit pixel.

[0186] Referring to FIG. 30, a display device (10) can be configured by arranging light emitting element packages (200) at regular intervals on a wiring board (100) including a substrate (110) on which wiring electrodes (120) are formed.

[0187] For example, the wiring electrode (120) and the terminal portions (211 to 214) of the light-emitting element package (200) can be electrically connected.

[0188]

[0189] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations can be made without departing from the essential characteristics of the present invention.

[0190] Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of ​​the present invention but to explain it, and the scope of the technical idea of ​​the present invention is not limited by these embodiments.

[0191] The scope of protection of the present invention should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

[0192] According to the present invention, a light emitting element package, a method for manufacturing the same, and a display device using the same can be provided.

Claims

1. A step of forming a permeable layer defining a unit package area; A step of forming an adhesive layer on the above-mentioned transparent layer; A step of transferring light-emitting elements onto the adhesive layer; A step of forming a connecting electrode that electrically connects each of the above light-emitting elements; A step of forming an insulating layer that insulates at least a portion of the above connecting electrode; and A step of forming a terminal portion electrically connected to the above connecting electrode is included, The above connecting electrode includes an extended connecting electrode positioned to extend toward the end side of the unit package area, or The terminal portion includes an extension terminal portion positioned so as to extend toward the end side of the unit package area. A method for manufacturing a light emitting device package.

2. In the first paragraph, the extended connection electrode extends outside the unit package area and is connected to an extended connection electrode extending from a neighboring unit package area. A method for manufacturing a light emitting device package.

3. In the first paragraph, the extension terminal portion extends outside the unit package area and is connected to an extension terminal portion extending from a neighboring unit package area. A method for manufacturing a light emitting device package.

4. In the first paragraph, the connecting electrode is located at a corner side of the unit package area, and the extended connecting electrode extends diagonally with respect to the unit package area. A method for manufacturing a light emitting device package.

5. In the first paragraph, the extended connection electrode includes a horizontal portion and a vertical portion extending in the horizontal and vertical directions with respect to the unit package area. A method for manufacturing a light emitting device package.

6. In the first paragraph, a first contact portion for making external electrical contact is provided between the adjacent extended connecting electrodes connected to the extended connecting electrodes. A method for manufacturing a light emitting device package.

7. In the 6th paragraph, the first contact portion has a larger area than the extended connection electrode. A method for manufacturing a light emitting device package.

8. In the first paragraph, the terminal portion is located at a corner side of the unit package area, and the extension terminal portion extends diagonally with respect to the unit package area. A method for manufacturing a light emitting device package.

9. In the first paragraph, the extension terminal portion includes a horizontal portion and a vertical portion extending in the horizontal and vertical directions with respect to the unit package area. A method for manufacturing a light emitting device package.

10. In the first paragraph, a second contact portion is provided between the adjacent extension terminal portions connected to the extension terminal portion, through which external electrical contact is made. A method for manufacturing a light emitting device package.

11. A permeable layer defining the unit package area; A light-emitting portion positioned adjacent to the above-mentioned transparent layer and including light-emitting elements forming unit subpixels; A connecting electrode having a metal pattern shape connected to the above light-emitting elements; An insulating layer that insulates at least a portion of the above connecting electrode; A terminal portion connected to the above connecting electrode; and An extended connecting electrode positioned to extend from the connecting electrode to the end side of the unit package area or an extended terminal portion positioned to extend from the terminal portion to the end side of the unit package area. Light emitting device package.

12. In the 11th paragraph, the connecting electrode is located at a corner side of the unit package area, and the extension connecting electrode extends diagonally with respect to the unit package area. Light emitting device package.

13. In the 11th paragraph, the extended connecting electrode includes a horizontal portion and a vertical portion extending in the horizontal and vertical directions with respect to the unit package area. Light emitting device package.

14. In the 11th paragraph, the terminal portion is located at a corner side of the unit package area, and the extension terminal portion extends diagonally with respect to the unit package area. Light emitting device package.

15. A display device including a light-emitting element package defining individual pixels, The above light emitting device package, A permeable layer defining the unit package area; A light-emitting portion positioned adjacent to the above-mentioned transparent layer and including light-emitting elements forming unit subpixels; A connecting electrode having a metal pattern shape connected to the above light-emitting elements; An insulating layer that insulates at least a portion of the above connecting electrode; A terminal portion connected to the above connecting electrode; and An extended connecting electrode positioned to extend from the connecting electrode to the end side of the unit package area or an extended terminal portion positioned to extend from the terminal portion to the end side of the unit package area. Display device.

Images