Processing apparatus

Abstract

A processing apparatus 110 comprises: a forming stage 112 that supports an article ST formed from a material M and can rotate in a predetermined rotation direction around a rotation axis; a crossing frame that is arranged above the forming stage and has a first frame 124-1 formed along a first straight line L1 passing through the rotation axis RX and a second frame 124-2 formed along a second straight line L2 passing through the rotation axis and different from the first straight line; a first device that is supported by the first frame, that can move along the first straight line, and that is used for forming the article; and a second device that is supported by the second frame, that can move along the second straight line, and that is used for forming the article.

Description

processing equipment

[0001] The present invention relates to a processing apparatus for forming a shaped object.

[0002] A processing device that performs additive manufacturing (AM) is known, in which a powdered modeling material is supplied to an area irradiated with an energy beam, the modeling material is melted by the energy beam, and the melted material is re-solidified, repeatedly stacking multiple structural layers (modeling layers) to form a model (see Patent Document 1). With such a modeling device, there is a demand for improving the surface precision of the modeled object.

[0003] Patent Document 1: U.S. Patent Application Publication No. 2016 / 0375521

[0004] The processing apparatus according to the present disclosure includes a modeling stage that supports a model to be formed from a material and is rotatable in a predetermined rotational direction around a rotation axis; an intersection frame that is arranged above the modeling stage and has a first frame formed along a first line that passes through the rotation axis and a second frame formed along a second line that passes through the rotation axis and is different from the first line; a first device that is supported by the first frame and movable along the first line and used to form the model; and a second device that is supported by the second frame and movable along the second line and used to form the model.

[0005] FIG. 1 is a partially cutaway perspective view showing a modeling apparatus according to an example embodiment. FIG. 2 is a plan view showing a stage mechanism of the modeling apparatus shown in FIG. 1. FIG. 3 is a cross-sectional view of the modeling apparatus shown in FIG. 1 as viewed in the +Y direction. FIG. 4 is a block diagram showing an example of a control system of the modeling apparatus. FIG. 5 is a diagram showing an example of an irradiation device shown in FIG. 4. FIG. 6(A) is a front view showing an example of a processing head, FIG. 6(B) is a cross-sectional view of FIG. 6(A) as viewed in the -X direction, and FIG. 7(C) is a plan view showing an example of a modeling region. FIGS. 7(A), 7(B), and 7(C) are plan views showing the process of gradually forming a model in a modeling region of a certain modeling layer, respectively. FIG. 7(D) is a plan view showing a state in which the modeling region is divided into upstream and downstream partial modeling regions. FIG. 8(A) is a flowchart showing an example of a basic modeling method, and FIG. 8(B) is a flowchart showing an example of a modeling method using measurement results from a utility head. Fig. 9(A) is a cross-sectional view showing a part of the process of forming a structure layer by the processing head, Fig. 9(B) is a cross-sectional view showing a part of the process of forming a structure by the processing head and a part of the planarization process by the planarization head, and Fig. 9(C) is a cross-sectional view showing a part of the process of measuring a surface shape by the utility head. Fig. 10 is a plan view showing examples of structures of various shapes that can be manufactured on the rotation stage of the modeling apparatus. Fig. 11(A) is a diagram showing a modified processing head, and Fig. 11(B) is a diagram showing another modified processing head. Fig. 12 is a plan view showing a stage mechanism of the modeling apparatus of the second embodiment. Fig. 13 is a cross-sectional view of the modeling apparatus of the second embodiment as viewed in the +Y direction.

[0006] First Embodiment A first embodiment will be described below as an example of an embodiment with reference to FIGS. 1 to 10 . In this embodiment, a three-dimensional object is shaped (manufactured or formed) by additive manufacturing (AM), which sequentially adds materials such as metal or synthetic resin, as in a 3D printer. Hereinafter, the additive manufacturing method will also be referred to as the AM method. In this embodiment, an example of processing using laser metal deposition (LMD) (hereinafter also referred to as the LMD method), which is one of the AM methods, directed energy deposition (DED), uses light such as laser light as an energy beam. The LMD method can also be referred to as direct metal deposition, direct energy deposition, laser cladding, laser powder deposition, laser additive manufacturing, or laser rapid forming.

[0007] FIG. 1 shows a modeling apparatus 10 comprising a 3D printer using the LMD method. FIG. 2 is a plan view of FIG. 1 , and FIG. 3 is a cross-sectional view of FIG. 1 . The positional relationships of the various components constituting the modeling apparatus 10 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. Hereinafter, the plane formed by the X and Y axes is assumed to be parallel to the horizontal plane, and the Z axis is assumed to be perpendicular to the horizontal plane. In this case, the direction parallel to the Z axis (Z direction) is parallel to the vertical direction, and -Z represents the downward vertical direction. The modeling apparatus 10 is installed on the surface of a rectangular, flat, plate-like member 6 that is approximately parallel to a plane including the X and Y axes (the XY plane), and is enclosed in a box-shaped, airtight chamber 8 (see FIG. 3 ). For example, a rare gas such as argon or an inert gas IG such as nitrogen is supplied into the chamber 8.

[0008] The modeling apparatus 10 can form a three-dimensional structure ST (an object having size in all three dimensions) on a workpiece W, which serves as a base (i.e., a base material) for forming the three-dimensional structure. When the workpiece W is a rotary stage 12 (or a translationally moving stage, etc.) described below, the modeling apparatus 10 can form the structure ST on the stage. When the workpiece W is an existing structure held on the stage, the modeling apparatus 10 can form the structure ST by adding a new structure to the existing structure. In this case, the modeling apparatus 10 may form a three-dimensional structure ST integrated with the existing structure. Alternatively, the modeling apparatus 10 may form a structure ST that can be separated from the existing structure, or may form a structure ST to repair a damaged portion of the existing structure. In the following description, the workpiece W is assumed to be an existing structure held on the rotary stage 12 described below. The workpiece W may be made of a material that can be melted by irradiation with processing light of a predetermined intensity or higher, similar to the modeling material M described below. The material may be the same as or different from the modeling material M. Although a metallic material or a resin material can be used as the material of the workpiece W, other materials may also be used. Examples of metallic materials include a material containing copper, a material containing tungsten, and a material containing stainless steel.

[0009] 1, the modeling apparatus 10 includes a processing head 32 for depositing structural layers on a workpiece W or a structure ST using the AM method, a planarization head 34 for planarizing the surfaces of the deposited structural layers, and first and second utility heads 36A and 36B for measuring, for example, the surface shape of the structural layers. As shown in FIG. 3, the processing head 32 supplies a mixture of a modeling material M and an inert gas IG from material nozzles 60A and 60B to a predetermined-shaped modeling area FA on the upper surface (modeling surface MS) of the workpiece W or the structure ST. The processing head 32 then melts the modeling material M on the modeling area FA with processing light EL1 and EL2 emitted from irradiation optical systems 50A and 50B, and re-solidifies the melted modeling material M to form a target structural layer. In this embodiment, the modeling area FA is, for example, a rectangular area elongated in a non-scanning direction (X direction) perpendicular to the relative movement direction (Y direction in FIG. 1) between the processing head 32 and the workpiece W. Furthermore, the planarizing head 34, for example, rotates a cutting tool 65 on the structure layer to cut off the convex portions of the structure layer, thereby planarizing the surface of the structure layer.

[0010] Here, planarizing the surface of the structure layer refers to a process of reducing the degree of surface irregularity after processing the surface of the structure layer with the planarizing head 34 compared to the degree of surface irregularity before processing the surface of the structure layer with the planarizing head 34 (simply put, planarizing the surface does not necessarily mean reducing the difference in height between the irregularities of the surface to zero, but also includes a process of reducing the difference in height between the irregularities of the surface). This degree of surface irregularity may also be referred to as surface roughness. The utility heads 36A and 36B may also be referred to as first and second additional heads. The number of utility heads is not limited to two, and only one, or three or more may be provided. When multiple utility heads are provided, they may be heads of different types (functions), as in this embodiment, or at least some of them may be heads of the same type (function). Although a utility head is not necessarily provided, in view of the fact that the molding apparatus 10 is required to have, for example, improved accuracy, time reduction, or efficiency, it is preferable to provide at least one of a head capable of performing processing (including the above-mentioned surface shape measurement) that should be performed between processing by the processing head 32 and planarization by the planarizing head 34, and a head capable of performing processing (including inspection) that should be performed after planarization by the planarizing head 34. Furthermore, when at least one utility head is provided, the utility head may be provided so as to be movable relative to each of the processing head 32 and the planarizing head 34, as in the present embodiment, or the positional relationship between the utility head and at least one of the processing head 32 and the planarizing head 34 may be constant (fixed). When the positional relationship between the utility head and at least one of the machining head 32 and the flattening head 34 is to be kept constant, for example, the utility heads 36A and 36B may be configured integrally with one of the machining head 32 and the flattening head 34, and the positional relationship between the utility head and one of the machining head 32 and the flattening head 34 may be kept fixed (constant), while the utility head may be made movable relative to only the other of the machining head 32 and the flattening head 34.

[0011] Furthermore, the modeling apparatus 10 includes a stage mechanism 20 for relatively moving the processing head 32, the flattening head 34, and the utility heads 36A and 36B and the workpiece W (or structure ST; the same applies below) in a direction parallel to the X-axis (X direction), the Y direction, and the Z direction. The stage mechanism 20 includes a rotary stage 12 that rotates the processing head 32, the flattening head 34, etc., and the workpiece W relatively around an axis parallel to the Z-axis (hereinafter also referred to as the θz direction), and a gate-type stage 18.

[0012] The gate-shaped stage 18 is capable of moving the machining head 32 and the planarizing head 34 relative to the workpiece W in the X and Z directions. Furthermore, the gate-shaped stage 18 is capable of moving the utility heads 36A, 36B relative to the workpiece W in the Y and Z directions. A cylindrical partition wall 16 is provided on the flat plate-like member 6 so as to surround the rotary stage 12, and a ring-shaped cover portion 16a is formed on the inner surface of the partition wall 16 so as to cover the outer periphery of the upper surface of the rotary stage 12. Note that in Figures 1 and 3, the partition wall 16 is shown in cross section.

[0013] 3, the processing head 32 supplies the modeling material M (e.g., a mixture with an inert gas IG) to the upper surface of the structure ST, and irradiates part of the modeling material M with the processing light EL1 and EL2, thereby melting and re-solidifying the modeling material M to form a pattern for the next structural layer on the structure ST. At this time, the modeling material Ma not used to form the pattern is accumulated on the upper surface of the cover portion 16a on the inner surface of the partition portion 16. Furthermore, if the surface of the structural layer of the structure ST has irregularities, the irregularities are removed with the rotating cutting tool 65 of the flattening head 34, and the removed modeling material Mb is accumulated on the upper surface of the cover portion 16a on the inner surface of the partition portion 16.

[0014] 2, a plurality of suction sections 55A, 55B, 55C, and 55D are provided on the outer surface of the partition section 16, each of which sucks up the powder of the modeling material M on the inner surface side of the partition section 16. By sucking the powder of the modeling materials Ma and Mb on the inner surface of the partition section 16 and the upper surface of the cover section 16a in FIG. 3 using the suction sections 55A to 55D, the powder of the modeling materials Ma and Mb can be recovered, and the recovered powder can be reused as the modeling material M as needed.

[0015] [Configuration of Stage Mechanism 20] An example configuration of the stage mechanism 20 will be described. In FIGS. 1 and 2, the disk-shaped rotary stage 12 of the stage mechanism 20 is mounted on a flat-plate member 6 and rotated, for example, in the θz direction, counterclockwise (or clockwise), by a rotation mechanism (not shown). A workpiece W is held on the upper surface of the rotary stage 12 via a disk-shaped plate 14 serving as a workpiece table. The gate-shaped stage 18 also includes two Z-axis guide members 22A, 22B parallel to the Z axis, which are installed on the flat-plate member 6 so as to sandwich the rotary stage 12 in the X direction, Z-direction drivers 28A, 28B driven in the Z direction along the Z-axis guide members 22A, 22B, and a cross-shaped guide 26 connecting the Z-direction drivers 28A, 28B. The Z-direction drivers 28A, 28B are driven so that the Z-direction positions (Z positions) of the Z-direction drivers 28A, 28B are the same. The cross-shaped guide 26 connects the Z-direction drive units 28A and 28B and has an X-axis guide member 24X that is parallel to the X-axis, and a Y-axis guide member 24Y that is perpendicular to the X-axis guide member 24X at the center of the X-axis guide member 24X and parallel to the Y-axis.

[0016] Further, X-direction drive units 30XA and 30XB are provided on the +X and -X sides of the X-axis guide member 24X, respectively, which are movable along the X direction, and the machining head 32 and the planarizing head 34 are supported on the bottom surfaces of the X-direction drive units 30XA and 30XB. Further, Y-direction drive units 30YA and 30YB are provided on the +Y and -Y sides of the Y-axis guide member 24Y, respectively, which are movable along the Y direction, and the utility heads 36A and 36B are supported on the bottom surfaces of the Y-direction drive units 30YA and 30YB, respectively. By synchronously driving the Z-direction drive units 28A and 28B in the Z direction along the Z-axis guide members 22A and 22B, the machining head 32, the planarizing head 34, and the utility heads 36A and 36B can be moved together in the Z direction relative to the workpiece W via the cross-shaped guide 26. Furthermore, by driving the X-direction drive units 30XA and 30XB in the X direction along the X-axis guide member 24X, the machining head 32 and the planarizing head 34 can be moved in the X direction relative to the workpiece W. Similarly, by driving the Y-direction drive units 30YA and 30YB in the Y direction along the Y-axis guide member 24Y, the utility heads 36A and 36B can be moved in the Y direction relative to the workpiece W. In other words, the stage mechanism 20 can move the machining head 32, the planarizing head 34, and the utility heads 36A and 36B relative to the workpiece W in three-dimensional directions including the X direction, Y direction, and Z direction.

[0017] In addition, when the gate-shaped stage 18 is configured to change the relative positions of the machining head 32, the planarizing head 34, and the utility heads 36A, 36B with respect to the workpiece W by driving the gate-shaped stage 18, the machining head 32, the planarizing head 34, and the utility heads 36A, 36B can be easily controlled so that they are at the same radial position relative to the center of the gate-shaped stage 18 and so that their Z positions are the same, thereby efficiently forming shapes on the workpiece W along the radial direction. In addition, the drive unit that moves the machining head 32, the planarizing head 34, and the utility heads 36A, 36B relative to the workpiece W is not limited to the gate-shaped stage 18, and may be, for example, a stage (hereinafter referred to as a separated stage) that combines a unit that drives the machining head 32 and the planarizing head 34 along a first rail installed above the rotary stage 12 and a unit that drives the utility heads 36A, 36B along a second rail installed above or below the first rail. Furthermore, any movement mechanism other than the rotary stage 12 can be used as the stage for moving the workpiece W, such as a two-dimensional stage (translation movement stage) that moves the workpiece W in the X and Y directions. The stage mechanism 20 can also be one that includes only one of the gate-type stage 18 (or separation stage) and the rotary stage 12 (or translation movement stage). It is also possible to fix the processing head 32, the planarizing head 34, and the utility heads 36A and 36B and use a relative movement unit that controls only the position of the workpiece W, and a mechanism that combines a rotary stage and a two-dimensional translation stage can also be used as the relative movement unit.

[0018] 4 shows an example of a control system of the molding apparatus 10. In FIG. 4, the control system includes a control unit 41 that controls the overall operation of the molding apparatus 10, and the control unit 41 includes an arithmetic device 40 and a storage device 42. An input / output device 44 and a display device 46 are connected to the control unit 41. The arithmetic device 40 may include at least one processor or multiple processors. In addition, the arithmetic device 40 may acquire (or download or read) a computer program 42a from a device (not shown) located outside the control unit 41 via a communication device. The downloaded computer program 42a may be stored in the storage device 42.

[0019] The storage device 42 includes at least one memory, such as a RAM, a ROM, a solid state drive (SSD), or a hard disk drive (HDD), that can store data and programs. The storage device 42 may store a computer program 42a, or may temporarily store data that is temporarily used by the calculation device 40 when the calculation device 40 is executing the computer program 42a. The storage device 42 may also include a non-transitory recording medium.

[0020] The control system also includes a stage mechanism drive device 64 controlled by the control unit 41. The stage mechanism drive device 64 is a drive mechanism including a position measurement system (e.g., multiple encoders) and a drive system (e.g., multiple motors) for driving the stage mechanism 20 including the rotary stage 12 and the gantry stage 18 in FIG. 1. In this embodiment, the processing head 32, the planarizing head 34, and the utility heads 36A and 36B each have Z-direction drive units 62A, 62B, 62C, and 62D that can individually control their relative positions in the Z direction with respect to the workpiece W. As a basic operation, the control unit 41 drives the stage mechanism 20 via the stage mechanism drive device 64 as follows.

[0021] As shown in FIG. 2 , if the center of the cross-shaped guide 26 in the X and Y directions is 24C, the processing head 32, the planarizing head 34, and the utility heads 36A and 36B are typically driven so that their distances from the center 24C are the same. As an example, the shaping area FA formed by the processing head 32 is a rectangular area that is elongated in the non-scanning direction (X direction). If the width of the shaping area FA in the X direction is b, when forming a structural layer on the structure ST, the processing head 32 and the planarizing head 34 are positioned at the farthest processable position in the radial direction from the center 24C of the cross-shaped guide 26. Then, by rotating the rotary stage 12 360 degrees while performing shaping by the processing head 32 and planarizing by the planarizing head 34, a structural layer is formed by the AM method in a first annular area of ​​width b in the radial direction at the farthest position from the center 24C on the structure ST, and the surface of the structural layer is planarized.

[0022] Then, the positions of the processing head 32 and the flattening head 34 are moved in the X direction (radial direction) by a width b toward the center 24C via the X-direction drive units 30XA and 30XB. Then, while the processing head 32 performs shaping and the flattening head 34 performs planarization, the rotary stage 12 is rotated 360 degrees. A structural layer is formed on the structure ST in a second annular region of radial width b inside the first region by the AM method, and the surface is flattened. By continuing this operation, structural layers are formed on the structure ST in the first, second, third, ..., nth annular regions by the AM method, and their planes are flattened. The nth annular region is the region where the processing head 32 and the flattening head 34 are closest to the center 24C of the cross-shaped guide 26. Therefore, the first structural layer is formed in the region of the plate 14 on the rotary stage 12, excluding the circular region 26D (the region where the processing head 32 cannot pass) (see FIG. 10 ) in the center of the plate 14. Thereafter, the Z positions of the processing head 32, the flattening head 34, and the utility heads 36A and 36B are raised via the Z direction drive units 28A and 28B of the stage mechanism 20, and the above-mentioned operations are repeated to form a second structural layer on top of the first structural layer.

[0023] [Configuration of Machining Head and Its Control System] Next, an example configuration of the machining head 32 and its control system will be described with reference to Fig. 4. The control system in Fig. 4 includes an irradiation device 51 that irradiates the workpiece W with processing light EL1 and EL2, a material supply unit 55 that supplies shaping material for additional processing on the workpiece W, and a Z-direction drive unit 62A that drives the machining head 32 in the Z direction relative to the workpiece W. The machining head 32 is made up of the irradiation device 51, a material nozzle 60 (described in detail below) in the material supply unit 55, and the Z-direction drive unit 62A.

[0024] The material supply unit 55 includes a material supply device 54, a gas supply device 56, a mixer 58, and a material nozzle 60. The material supply device 54 is a device capable of supplying a powder modeling material M. The modeling material M is not limited to a powder, and wire-like modeling material or gaseous modeling material may also be used. The modeling material M is a material that can be melted by irradiation with processing light EL1, EL2 of a predetermined intensity or higher. Examples of such modeling material M include metallic materials and resinous materials, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel. Furthermore, all or part of the modeling material recovered by the suction units 55A to 55D in FIG. 2 may be returned to the material supply device 54. This allows the modeling material not used in modeling to be reused.

[0025] The gas supply device 56 is a device capable of supplying a predetermined gas (gas). The mixer 58 is a device connected to the material supply device 54 and the gas supply device 56, and mixes the powdered modeling material M supplied from the material supply device 54 with the inert gas IG supplied from the gas supply device 56. In other words, the gas supply device 56 supplies a conveying gas (pressurized gas) for conveying the powdered modeling material M supplied from the material supply device 54 that is mixed in the mixer 58. As the conveying gas, for example, a purge gas consisting of an inert gas IG, such as nitrogen or a rare gas such as argon, injected to replace the gas in the chamber 8 can be used. Note that gases other than the inert gas IG can also be used as the conveying gas. The gas supply device 56 can be a cylinder containing the inert gas IG, or, if the inert gas IG is nitrogen, a nitrogen generator that generates nitrogen using air as a raw material.

[0026] The material nozzle 60 is capable of supplying the modeling material M to the processing head 32 inside the chamber 8. More specifically, the material nozzle 60 is connected to the mixer 58 and ejects (sprays, ejects, or sprays) the modeling material M transported by the pressurized gas onto the workpiece W. In other words, the material nozzle 60 supplies the modeling material M together with the transport gas. For this reason, the material nozzle 60 may also be referred to as a material supply member or supply device (material supply device). Furthermore, as shown in FIG. 6B as an example, the material nozzle 60 of this embodiment branches into first and second material nozzles 60A and 60B arranged to sandwich the modeling area FA in the scanning direction (Y direction). Furthermore, shield members 61A and 61B are provided to surround the material nozzles 60A and 60B from the outside. The shield members 61A and 61B prevent the modeling material M supplied from the material nozzles 60A and 60B into the processing head 32 from scattering around. The material nozzle 60 does not necessarily have to branch into two. Alternatively, the material nozzle 60 can branch into, for example, four nozzles arranged on either side of the build area FA in the X and Y directions, or three or more nozzles arranged in any other arrangement. A purge gas consisting of an inert gas IG from the gas supply device 56 may be supplied to the space surrounded by the shield members 61A and 61B. This reduces the oxygen concentration in the atmosphere surrounding the molten build material M, thereby improving the quality of the build object. The purge gas consisting of the inert gas IG from the gas supply device 56 only needs to be supplied around the molten portion of the build material M, so the purge gas may be supplied from outside the shield members 61A and 61B. When the purge gas is supplied locally around the molten portion of the build material M, the inert gas IG (purge gas) does not need to be supplied into the chamber 8.

[0027] 6A and 6B, the width of the printing area FA in the scanning direction (Y direction) is a, and the width in the non-scanning direction (X direction) is b. For example, the width a is approximately 2 mm, and the width b is approximately 100 mm. That is, for example, the width b of the printing area FA in the non-scanning direction is approximately 50 times the width a in the scanning direction. For ease of explanation, the width of the printing area FA in the scanning direction is depicted as being relatively wide in FIGS. 6C and 1 . Corresponding to the printing area FA that is elongated in the non-scanning direction, the ejection ports of the material nozzles 60A and 60B for the printing material M in this embodiment are rectangular (or may be elliptical, arc-shaped, etc.) that are elongated in the non-scanning direction.

[0028] 4, the material nozzle 60 is divided into n segments (n is an integer greater than or equal to 2) in the elongated direction, and each segment is provided with an opening / closing unit 60a that controls whether or not the modeling material M is ejected. The material nozzles 60A and 60B in FIG. 6B corresponding to the material nozzle 60 are also divided into n segments in the elongated non-scanning direction, and each segment is provided with an opening / closing unit (not shown) that controls whether or not the modeling material M is ejected (on or off). Hereinafter, a segment that ejects the modeling material M will be referred to as an "on" segment, and a segment that does not eject the modeling material M will be referred to as an "off" segment. Let the n segments of the material nozzles 60A and 60B be the first, second, ..., nth segments in the -X direction. For example, when the ith (i = 1 to n) segment of the material nozzle 60A is on, the ith segment of the material nozzle 60B will also be on. For example, the material nozzles 60A and 60B are controlled so that the on / off patterns of the multiple segments are the same. By controlling the opening / closing portions of the material nozzles 60A, 60B (portions corresponding to the opening / closing portion 60a of the material nozzle 60), the control unit 41 can control from which segment of the material nozzles 60A, 60B the modeling material M is supplied. The opening / closing portions of the material nozzles 60A, 60B may be provided midway through the flow path of each segment of the material nozzles 60A, 60B, or may be provided at openings provided at the tips of the material nozzles 60A, 60B.

[0029] 6C, the printing area FA is virtually divided into n partial printing areas FA1, FA2, ..., FAn in the non-scanning direction (X direction). The printing material spray area GSA, from which the material nozzles 60A and 60B spray the printing material M, includes the printing area FA and is slightly larger than the printing area FA. By controlling the pattern of segments to be turned on by the material nozzles 60A and 60B, the printing material M can be supplied only to any of 0 to n partial printing areas FA1 to FAn, including the portion where a pattern is to be formed. As a result, even if the printing area FA is elongated in the non-scanning direction, the printing material M is not supplied to the partial printing areas FAi (i = 1 to n) where a pattern is not to be formed, thereby improving the utilization efficiency of the printing material M.

[0030] 4, the control system of this embodiment includes two light sources 48A and 48B and an irradiation device 51. Instead of the two light sources 48A and 48B, a single light source or three or more light sources may be used. The light sources 48A and 48B are energy beam sources that emit at least one of infrared light, visible light, and ultraviolet light as the processing light EL1 and EL2. However, other types of light may be used as the processing light EL1 and EL2. The processing light EL1 and EL2 may include multiple pulsed lights (multiple pulse beams). The processing light EL1 and EL2 may be laser light. In this case, the light sources 48A and 48B may be at least one of a solid-state laser such as a semiconductor laser, a fiber laser, a CO2 laser, a YAG laser, and an excimer laser light source. However, the processing light EL1 and EL2 do not have to be laser light. The light sources 48A and 48B may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0031] The characteristics of the processing light EL1 emitted by light source 48A and the characteristics of the processing light EL2 emitted by light source 48B may be the same or different. These characteristics include, for example, wavelength (typically, a peak wavelength, which is the wavelength at which the intensity is greatest in the wavelength band of the processing light), wavelength band (typically, a range of wavelengths at which the intensity is equal to or greater than a certain value), intensity, and absorptivity (relative to the peak wavelength) in the workpiece W (or the object whose surface is the surface of which the shaping surface is formed). If a single light source is used instead of light sources 48A and 48B, the single light source may emit (supply) light of, for example, a broad wavelength band or multiple wavelengths. In this case, the light emitted from the single light source may be wavelength-divided to generate processing light EL1 and processing light EL2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

[0032] The irradiation device 51 is a device for emitting processing light EL1 and EL2 onto the forming surface and includes irradiation optical systems 50A and 50B and a focusing optical system 52. The irradiation optical systems 50A and 50B are optical systems for emitting the processing light EL1 and EL2, respectively. Specifically, the irradiation optical systems 50A and 50B are optically connected to light sources 48A and 48B that emit (generate) the processing light EL1 and EL2 via optical transmission members such as optical fibers or light guides.

[0033] Next, the configuration of the irradiation device 51 will be described with reference to Fig. 5. In Fig. 5, the irradiation device 51 includes a focusing optical system 52 that focuses processing light EL1 and EL2 and irradiates the workpiece W (printing area FA), and irradiation optical systems 50A and 50B that respectively cause processing light EL1 incident from light source 48A and processing light EL2 incident from light source 48B to enter the focusing optical system 52. Since the irradiation optical systems 50A and 50B are configured symmetrically with respect to a prism mirror 80 (described later) of the focusing optical system 52, only the configuration of the irradiation optical system 50A will be described.

[0034] The irradiation optical system 50A includes a collimator lens 74, a beam splitter 75, a galvanometer scanner 76, and a power meter 79. The processing light EL1 emitted from the light source 48A is incident on the collimator lens 74 and converted into parallel light. The processing light EL1 converted into parallel light by the collimator lens 74 is incident on the beam splitter 75, which is disposed obliquely with respect to the optical path of the incident processing light EL1. The beam splitter 75 is, for example, a parallel flat substrate made of a light-transmitting material such as glass or a prism that splits a portion of the incident light. A portion of the processing light EL1 incident on the beam splitter 75 passes through the beam splitter 75. The other portion of the processing light EL incident on the beam splitter 75 is reflected by the beam splitter 75.

[0035] The processing light EL1 that passes through the beam splitter 75 is incident on the galvanometer scanner 76. The galvanometer scanner 76 includes a focus control optical system 77 and a plurality of galvanometer mirrors 78. The processing light EL1 that passes through the beam splitter 75 is incident on the galvanometer mirror 78 via the focus control optical system 77. The focus control optical system 77 is an optical member that can change the focus position CP1 of the processing light EL1. Note that in this embodiment, the focus position CP of the processing light EL1 may refer to the focus position where the processing light EL1 is focused. The focus position CP1 of the processing light EL1 may refer to the convergence position where the processing light EL1 is most convergent in the irradiation direction (travel direction) of the processing light EL1.

[0036] Specifically, the focus control optical system 77 can change the focus position CP1 of the processing light EL1 along the irradiation direction of the processing light EL1 emitted from the irradiation device 51. The focus control optical system 77 can change the focus position CP1 of the processing light EL1 along the irradiation direction (approximately the Z direction) of the processing light EL1 that the irradiation device 51 irradiates onto the printing surface MS (e.g., the surface of the workpiece W or a structure layer). In the example shown in Fig. 5, the irradiation direction of the processing light EL1 is a direction intersecting with the printing surface MS, and the irradiation device 51 irradiates the processing light EL1 onto the printing surface MS from above the workpiece W, so the focus control optical system 77 can change the focus position CP1 of the processing light EL1 along the direction intersecting with the printing surface MS.

[0037] The focus control optical system 77 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL1. In this case, the focus control optical system 77 changes the focus position CP1 of the processing light EL1 by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 77 may also include a reflective optical element such as a mirror, and the focus position CP1 of the processing light EL1 may be changed by moving the reflective optical element.

[0038] The focus control optical system 77 changes the focus position CP1 of the processing light EL1, thereby changing the positional relationship (particularly the positional relationship in the Z direction) between the focus position CP1 of the processing light EL1 and the printing surface MS. The processing light EL1 emitted from the focus control optical system 77 is incident on a galvanometer mirror 78. The galvanometer mirror 78 deflects the processing light EL to change the emission direction of the processing light EL1 emitted from the galvanometer mirror 78. For this reason, the galvanometer mirror 78 may be referred to as a deflection scanning optical system. Note that, in order to control the focus of the processing light EL1, the workpiece W may be slightly moved in the Z direction or slightly tilted in combination with optical control.

[0039] The galvanometer mirror 78 includes, for example, an X-scanning mirror 78MX, an X-scanning motor 78AX, a Y-scanning mirror 78MY, and a Y-scanning motor 78AY. The processing light EL1 emitted from the focus control optical system 77 is incident on the X-scanning mirror 78MX along the Z direction, and the processing light EL1 incident on the X-scanning mirror 78MX is reflected toward the Y-scanning mirror 78MY. The Y-scanning mirror 78MY reflects the processing light EL1 incident on the Y-scanning mirror 78MY toward a first reflecting surface of the prism mirror 80 of the focusing optical system 52. Each of the X-scanning mirror 78MX and the Y-scanning mirror 78MY may also be referred to as a galvanometer mirror or a deflecting member.

[0040] The X-scan motor 78AX can swing or rotate the X-scanning mirror 78MX around a rotation axis along the Y-axis. In other words, the X-scanning mirror 78MX can change the deflection angle of the reflected processing light EL1. In this case, by swinging or rotating the X-scanning mirror 78MX, the processing light EL1 can scan in a direction perpendicular to the Y-axis (the X-direction on the printing surface MS). The Y-scan motor 78AY can swing or rotate the Y-scanning mirror 78MY around a rotation axis along the X-axis. In other words, the Y-scanning mirror 78MY can change the deflection angle of the reflected processing light EL1. In this case, by swinging or rotating the Y-scanning mirror 78MY, the processing light EL1 can scan in a direction perpendicular to the X-axis (the Y-direction on the printing surface MS).

[0041] The configuration of the irradiation optical system 50B is symmetrical to that of the irradiation optical system 50A, and the processing light EL2 emitted from the light source 48B is incident on the second reflecting surface of the prism mirror 80 of the focusing optical system 52 via the irradiation optical system 50B, reflected by the second reflecting surface, and incident on the printing surface MS. The processing light EL2 is incident on a focus position CP2 near the printing surface MS. The oscillation or rotation of the X scanning mirror 78MX of the irradiation optical system 50B allows the processing light EL2 to scan along the X direction on the printing surface MS, and the oscillation or rotation of the Y scanning mirror 78MY of the irradiation optical system 50B allows the processing light EL2 to scan along the Y direction on the printing surface MS.

[0042] Here, the maximum area over which the galvanometer mirrors 78 of the irradiation optical systems 50A and 50B can move the irradiation area of ​​the processing beams EL1 and EL2 on the printing surface MS while the positional relationship between the irradiation device 51 and the printing surface MS is fixed is defined as a processing unit area. The printing area FA in which the processing beams EL1 and EL2 can actually be scanned to perform printing is set within the processing unit area. The galvanometer scanner 76 functions as a scanning optical system (deflection scanning optical system) that scans the processing beams EL1 and EL2 on the printing surface MS (printing area FA).

[0043] The galvanometer scanner 76 does not necessarily have to include a focus control optical system 77. Even in this case, if the positional relationship between the irradiation optical systems 50A, 50B and the printing surface MS in the irradiation direction of the processing lights EL1, EL2 changes, the positional relationship between the focus positions CP1, CP2 (collectively referred to as focus positions CP) of the processing lights EL1, EL2 and the printing surface MS in the irradiation direction of the processing lights EL1, EL2 changes. Therefore, even if the galvanometer scanner 76 does not include the focus control optical system 77, the irradiation device 51 can change the positional relationship between the focus positions CP1, CP2 of the processing lights EL1, EL2 and the printing surface MS in the irradiation direction of the processing lights EL1, EL2. The printing apparatus 10 may change the positional relationship between the focus positions CP1, CP2 and the printing surface MS using, for example, the stage mechanism drive unit 64 or the Z-direction drive unit 62A instead of or in combination with the optical control described above.

[0044] In FIG. 5 , the processing light EL1 reflected by the beam splitter 75 in the irradiation optical system 50A is incident on a power meter 79 capable of detecting the intensity of the incident light. The power meter 79 detects the intensity of the processing light EL1 traveling along the optical path between the light source 48A and the galvanometer mirror 78. In this case, the power meter 79 can stably detect the intensity of the processing light EL1 without being affected by the deflection of the processing light EL1 by the galvanometer mirror 78. However, the location of the power meter 79 is not limited to the example shown in FIG. 5 . The power meter 79 may detect the intensity of the processing light EL along the optical path within the galvanometer mirror 78 or along the optical path between the galvanometer mirror 78 and the printing surface MS. The detection result of the power meter 79 is output to the control unit 41 shown in FIG. 4 . The power meter 79 may include, for example, a light-receiving element that detects the processing light EL1 as light or a heat-detecting element that detects the amount of heat generated by the processing light EL1.

[0045] 5, the focusing optical system 52 of the irradiation device 51 includes a prism mirror 80 and an fθ lens 81. The prism mirror 80 and the fθ lens 81 are integrated as the focusing optical system 52 so that their relative positions do not change. The prism mirror 80 reflects the processing light EL1 incident from the irradiation optical system 50A and the processing light EL2 incident from the irradiation optical system 50AB toward the fθ lens 81. The processing lights EL1 and EL2 that pass through the fθ lens 81 (the final optical element within the irradiation device 51) are irradiated onto the printing surface MS.

[0046] The fθ lens 81 (converging optical element) is an optical element that emits the processing beams EL1 and EL2 toward the printing surface MS and focuses the processing beams EL1 and EL2 on a focusing surface. The focusing surface of the fθ lens 81 may be set, for example, on the printing surface MS. In this case, the focusing optical system 52 has a projection characteristic of fθ. That is, the deflection amount of the processing beams EL1 and EL2 on the printing surface MS is determined approximately in proportion to the deflection angle of the processing beams EL1 and EL2 by the galvanometer mirror 78 in the irradiation optical systems 50A and 50B, making it easy to control the scanning positions of the processing beams EL1 and EL2 on the printing surface MS. However, the focusing optical system 52 may have a projection characteristic different from fθ. For example, the focusing optical system 52 may have a projection characteristic of f tan θ or f sin θ. The optical axis AX of the fθ lens 81 is parallel to the Z axis. As shown in FIG. 6A , the fθ lens 81 may be a telecentric optical system on the exit side (the side of the printing surface MS). In this case, the distance through which the processing beams EL1 and EL2 pass through the ejected printing material M is substantially constant regardless of the scanning position of the processing beams EL1 and EL2. Therefore, the degree of attenuation of the intensity of the processing beams EL1 and EL2 due to the printing material M is substantially constant regardless of the scanning position of the processing beams EL1 and EL2. On the other hand, the fθ lens 81 may be a non-telecentric optical system on the exit side (the side of the printing surface MS). In this case, the light intensity of the processing beams EL1 and EL2 may be changed depending on the scanning position or deflection angle of the processing beams EL1 and EL2, thereby making the light intensity of the processing beams EL1 and EL2 irradiated onto the printing surface MS substantially constant. Typically, the light intensity of the processing beams EL1 and EL2 may be increased as the scanning position of the processing beams EL1 and EL2 on the printing surface MS becomes farther from the optical axis of the fθ lens 81.

[0047] Note that the focusing optical system 52 does not need to include the fθ lens 81 if the light reflected from the prism mirror 80 can be focused on a focusing surface. In this case, the final optical element is the prism mirror 80, and the processing lights EL1 and EL2 reflected from the prism mirror 80 are irradiated onto the printing surface MS. The control unit 41 in Fig. 4 controls the galvanometer scanners 76 in the irradiation optical systems 50A and 50B, thereby controlling the irradiation positions (scanning positions) of the processing lights EL1 and EL2 to any positions in the printing area FA on the printing surface MS to which the printing material M has been supplied.

[0048] 7A to 7C are diagrams illustrating an example of a method for forming a structure layer pattern by scanning processing beams EL1 and EL2 in the X and Y directions on a shaping material M supplied to a shaping surface in this embodiment. Note that in FIGS. 7A to 7C, the length in the non-scanning direction (X direction) is shown as being shorter. In this case, the shaping area FA, which is elongated in the non-scanning direction (X direction) on the shaping surface, is divided into an upstream shaping area FAU and a downstream shaping area FAD, as shown in FIG. 1D, in the mechanical scanning direction (Y direction) in which the workpiece W is scanned relative to the machining head 32 on the rotary stage 12. If the width of the shaping area FA in the scanning direction (Y direction) is a, the widths of the upstream and downstream shaping areas FAU and FAD in the Y direction are each a / 2. 7A, the hatched processed portion ST1 of the structure layer is an area where the target pattern PA1 has already been formed by the processing head 32. The processed portion ST1 includes the downstream printing area FAD of the printing area FA and an area downstream of the downstream printing area FAD.

[0049] Next, let us consider the next processing section ST2 of the structural layer as the section where the processing beams EL1 and EL2 are scanned to form a pattern. The next processing section ST2 is connected to the processed section ST1 in the -Y direction and has a width of a / 2 in the Y direction. In the state shown in FIG. 7A, the next processing section ST2 is an area roughly corresponding to the upstream shaping area FAU with a width of a / 2, and the processing beams EL1 and EL2 have begun to partially form a pattern PA21. From the state shown in FIG. 7A, the shaping surface is scanned approximately (1 / 3)a in the Y direction, as shown in FIG. 7B. In this state, the next processing section ST2 with a width of a / 2 spans the downstream shaping area FAD and the upstream shaping area FAU, and a pattern PA22, which is larger than the pattern P21, is formed in the next processing section ST2.

[0050] Furthermore, the printing surface is scanned by (1 / 6)a in the Y direction from the state shown in Figure 7(B), and the printing surface is scanned by a / 2 in the Y direction from the state shown in Figure 7(A), resulting in the state shown in Figure 7(C). In this state, the next processing unit ST2, which has a width of a / 2, approximately coincides with the downstream printing area FAD, and the target pattern PA3 is printed in the next processing unit ST2. Then, in the state shown in Figure 7(C), the next next processing unit ST3, which is connected to the next processing unit ST2 (which is already a processed unit) in the -Y direction and has a width of a / 2 in the Y direction, approximately coincides with the upstream printing area FAU, and the target pattern is printed in the next processing unit ST3 while the next processing unit ST3 moves from the upstream printing area FAU to the downstream printing area FAD. In this way, the target pattern is formed on the processing section, which has a width of a / 2 in the Y direction on the printing surface, while it moves a distance of a / 2 from the upstream printing area FAU to the downstream printing area FAD, and the target pattern can be formed on the printing surface with simple control while the printing surface is mechanically scanned relative to the processing head 32.

[0051] 4, the machining head 32 includes an irradiation device 51 for emitting machining light beams EL1 and EL2, a material nozzle 60 (material nozzles 60A and 60B) of a material supply unit 55, and a Z-direction drive unit 62A that controls the position of the machining head 32 in the Z direction relative to the workpiece W. The Z-direction drive unit 62A controls the position of the machining head 32 in the Z direction relative to the X-direction drive unit 30XA within a predetermined range, for example, using a feed screw system or the like. The configurations of Z-direction drive units 62B to 62D, which will be described later, are similar to the configuration of the Z-direction drive unit 62A. The machining head 32 may further include light sources 48A and 48B and / or a mixer 58.

[0052] The processing head 32 is configured so that the irradiation device 21 and the material nozzle 60 are positioned integrally or at least within a predetermined distance. Therefore, the processing head 32 can supply the modeling material M to the irradiation position (modeling area FA) of the processing light EL1 and EL2 from the irradiation optical systems 50A and 50B using the material nozzle 60. The stage mechanism 20 and Z-direction drive unit 62A shown in FIG. 4 can control the position of the processing head 32 in the X, Y, and Z directions relative to the modeling surface, as well as the rotation angle in the θz direction. A drive mechanism may be provided that can control the rotation angle of the processing head 32 around the X axis (θx direction) and the Y axis (θy direction) relative to the modeling surface.

[0053] Next, the planarizing head 34 in FIG. 4 includes a rotary motor 64 that rotates a cutting tool 65 (see FIG. 3 ), a Z-direction drive unit 62B that controls the Z-direction position of the planarizing head 34 within a predetermined range relative to the X-direction drive unit 30XB, and a planarization control unit (not shown) that controls the Z-direction position of the cutting tool 65 via the Z-direction drive unit 62B using the surface shape (Z-position distribution) of the structure layer supplied from the control unit 41 to planarize the surface of the structure layer. Furthermore, the planarizing head 34 includes a load detection unit (not shown) that detects the load applied to the cutting tool 65, for example, from the drive current of the rotary motor 64. The planarization control unit controls the Z-direction position of the planarizing head 34 relative to the build surface via the Z-direction drive unit 62B, and rotates the cutting tool 65 to cut a portion of the convex portion of the build surface within a range in which the load detected by the load detection unit does not exceed a predetermined tolerance, thereby planarizing the build surface.

[0054] In this embodiment, a cutting device is used as the flattening head 34, but if the unevenness of the modeling surface formed by the processing head 32 (the difference between the lowest point of the concave surface and the highest point of the convex surface) is small, a polishing device that grinds the surface of the modeling surface with a grinder may be used as the flattening head 34. Furthermore, if the unevenness of the modeling surface formed by the processing head 32 is even smaller, an optical polishing device that irradiates the surface of the modeling surface with laser light to flatten the surface may be used as the flattening head 34.

[0055] The first utility head 36A also includes, as an example, a Z-direction driver 62C that controls the Z-direction position of the utility head 36A within a predetermined range relative to the Y-direction driver 30YA; a surface shape detector 66A that detects the distribution (surface shape) of Z-direction positions (Z positions) at multiple positions on the printing surface; and a cooling unit 68 that reduces the temperature of the printing surface that has increased in temperature after passing through the processing head 32. The surface shape detector 66A, for example, obliquely irradiates the printing surface with multiple detection beams, detects multiple reflected beams from the printing surface, detects Z positions at multiple positions on the printing surface, and interpolates the detected Z positions to obtain surface shape information for the printing surface. The obtained surface shape information is supplied to the flattening head 34 via the control unit 41. The flattening head 34 flattens the printing surface so that the surface shape (irregularity distribution) of the printing surface detected by the surface shape detector 66A is flattened. A detection device that projects a predetermined pattern onto the printing surface can also be used as the surface shape detector 66A.

[0056] The cooling unit 68 may be, for example, a blower that blows cooled inert gas IG onto the printing surface, or a piping mechanism that brings a pipe through which cooled liquid flows close to the printing surface. By cooling the printing surface with the cooling unit 68, the printing surface can be planarized with higher precision when it is planarized by the subsequent flattening head 34. The cooling unit 68 does not necessarily need to be provided in the utility head 36A. Furthermore, the measurement function and the cooling function do not necessarily have to be provided in the same utility head 36A, but may be provided in separate utility heads. Alternatively, the cooling unit 68 (cooling function) may be provided downstream of the processing head 32, integral with the processing head 32, to cool the workpiece W immediately after processing. Next, the second utility head 36B has, as an example, a Z-direction drive unit 62D that controls the Z-direction position of the utility head 36B within a predetermined range relative to the Y-direction drive unit 30YB, a surface shape detection unit 66B that detects the distribution of Z positions (surface shape) at multiple positions on the modeling surface, a defect detection unit 70 that detects defects in the pattern modeled on the modeling surface, and a heating unit 72 that pre-heats the temperature of the modeling surface facing the processing head 32.

[0057] The surface shape detection unit 66B has the same configuration as the surface shape detection unit 66A. Information on the surface shape determined by the surface shape detection unit 66B is supplied to the processing head 32 via the control unit 41. The processing head 32 controls the thickness distribution of the molding material M of the next structure layer according to the surface shape (irregularity distribution) of the molding surface detected by the surface shape detection unit 66B, thereby controlling the molding so that the surface after molding of the next structure layer is as flat as possible. This operation can further improve the surface precision of the surface of the structure.

[0058] The defect detection unit 70, for example, includes an imaging device that captures an image of the printing surface. It compares the image with, for example, a design pattern to detect defects and supplies the detection results to the control unit 41. For example, if a detected defect is large, the printing process can be stopped to prevent the printing of a structure that differs from the target shape. The heating unit 72 heats the printing surface using, for example, a heater. For example, the heating unit 72 heats the printing surface facing the processing head 32 to a temperature close to the melting temperature of the printing material M supplied to the printing area FA. This allows the printing material M to melt and easily perform printing even if the energy of the processing light EL1 and EL2 supplied from the processing head 32 to the printing material M is reduced. The defect detection unit 70 and the heating unit 72 do not necessarily need to be provided on the utility head 36B. As with the utility head 36A, the surface shape detection unit 66B, defect detection unit 70, and heating unit 72 of the utility head 36B may be provided separately on different utility heads. Furthermore, the heating unit 72 of the utility head 36AB may be provided integrally with the processing head 32 on the upstream side of the processing head 32. Furthermore, at least a portion of the utility heads 36A, 36B (e.g., the surface shape detection units 66A, 66B) may be provided integrally with the planarizing head 34.

[0059] [Description of the Molding Method] Next, an example of a basic molding method for molding the next structural layer on the workpiece W or the structure ST using the molding apparatus 10 of this embodiment will be described with reference to the flowchart of FIG. 8A . The operation at this time is controlled by the control unit 41 of FIG. 4 . In this embodiment, as shown in FIG. 1 , due to the rotation of the rotary stage 12, the workpiece W and the structure ST supported on the rotary stage 12 via the plate 14 rotate counterclockwise around an axis parallel to the Z axis (θz direction) relative to the processing head 32 and the flattening head 34. In other words, specific portions of the workpiece W and the structure ST move relative to the processing head 32 and the flattening head 34 in the θz direction. Also, as an example, the detection results of the utility heads 36A and 36B are not used. In other words, the utility heads 36A and 36B are not necessarily required when performing this basic molding operation. Also, as shown in FIG. 9A , a structure ST including four structural layers STA, STB, STC, and STD is formed on the workpiece W. 9A to 9C, the horizontal axis represents the rotation angle of the rotation stage 12 in the θz direction.

[0060] 8A , the Z-direction position (Z position) of the cross-shaped guide 26 is controlled via the Z-direction drivers 28A and 28B along the Z-axis guide members 22A and 22B, thereby optimizing the Z-direction positions of the machining head 32 and the planarizing head 34 relative to the structure ST. Furthermore, the X-direction positions of the machining head 32 and the planarizing head 34 are controlled via the X-direction drivers 30XA and 30XB along the X-axis guide member 24X, thereby setting the radial positions of the machining head 32 and the planarizing head 34 relative to the structure ST to the furthest positions possible for modeling. The distance from the center 24C of the cross-shaped guide 26 in FIG. 2 to the center of the machining head 32 and the distance from the center 24C to the center of the planarizing head 34 are set equal.

[0061] Furthermore, as necessary, the Z positions of the processing head 32 and the planarizing head 34 relative to the structure ST are individually controlled to optimal positions via the Z direction drive units 62A and 62B in Fig. 4. The Z position of the processing head 32 is set, for example, so that the focal positions of the processing lights EL1 and EL2 coincide with the surface (printing surface) of the structure ST, and the Z position of the planarizing head 34 is set, for example, so that the lower end of the cutting tool 65 contacts the target height of the structural layer to be formed on the surface of the structure ST.

[0062] In this state, as shown in FIG. 9A , a modeling material M is supplied from the material nozzles 60A and 60B of the processing head 32 to a modeling area FA on the surface of the structure ST (structural layer STD). The modeling area FA is scanned with processing light EL1 and EL2 emitted from the irradiation optical system 50A and 50B (irradiation device 51) to melt the modeling material M, and the melted modeling material M is then solidified. Through this additive manufacturing, a portion of the structural layer STE is formed on the surface of the structure ST. At this time, although the surface of the formed structural layer STE is designed to be flat (planar), in reality, some unevenness may remain on the surface of the structural layer STE. In the following description, it is assumed that some unevenness remains on the surface A of the structural layer STE. Note that the unevenness on the surface of the structural layer STE is exaggerated in FIGS. 9A to 9C.

[0063] In the next step 104, the tip of the structure layer STE manufactured by the processing head 32 is moved below the planarizing head 34 by the rotation of the rotary stage 12, as shown in FIG. 9B. Then, in step 106, the cutting tool 65 of the planarizing head 34 is rotated to remove the portion (convex portion) of the surface of the structure layer STE that is higher than the target surface (at least a part of that surface). This flattens the surface B of the structure layer STE. The operations of steps 102 to 106 are repeated until the rotary stage 12 has rotated 360 degrees.

[0064] In the next step 108, it is determined whether or not to form another structural layer. If another structural layer is to be formed, the operation returns to step 102. For example, the X-direction positions of the processing head 32 and the planarizing head 34 are controlled via the X-direction drive units 30XA and 30XB along the X-axis guide member 24X to move the radial position of the rotary stage 12 of the processing head 32 and the planarizing head 34 relative to the structure ST inward by the width b of the non-scanning direction of the fabrication area FA by the processing head 32. Thereafter, as described above, a structural layer (not shown) inside the structural layer STE is manufactured and planarized. If this operation is continued to manufacture the structural layer STE, and then a structural layer above the structural layer STE is manufactured, the Z-direction positions of the processing head 32 and the planarizing head 34 relative to the structure ST are raised by the Z-direction drive units 28A and 28B by the amount of the structural layer STE, and the operations of steps 102 to 106 are repeated.

[0065] When the formation of the structural layer is completed in step 108, the manufacturing of the structure is completed. According to this manufacturing method, after the structural layer STE is formed on the structure ST by the processing head 32, the surface of the structural layer STE is planarized by the planarization head 34, thereby improving the surface precision (e.g., flatness) of the surface of the structure manufactured by additive manufacturing. Furthermore, in this embodiment, the rotating stage 12 is used to rotate the workpiece W and the structure ST from below the processing head 32 toward below the planarization head 34, so that the formation of the structural layer STE by additive manufacturing with the processing head 32 and the planarization of the surface of the structural layer STE with the planarization head 34 can be performed continuously and efficiently without interrupting the movement of the structure ST.

[0066] Next, in the modeling apparatus 10 of this embodiment, the first utility head 36A is disposed in a section where the workpiece W (structure ST) moves from below the processing head 32 to below the planarizing head 34 by the rotating stage 12, and the second utility head 36B is disposed in a section where the workpiece W (structure ST) moves from below the planarizing head 34 to below the processing head 32 by the rotating stage 12. Hereinafter, an example of a modeling method for modeling the next structure layer on the workpiece W or the structure ST using the detection results from the utility heads 36A and 36B in the modeling apparatus 10 will be described with reference to the flowchart in FIG. 8(B). The operation at this time is also controlled by the control unit 41 in FIG. 4. Note that the operations of steps 112 and 114 in FIG. 8(B) are similar to the operations of steps 102 and 104 in FIG. 8(A), and therefore detailed description thereof will be omitted.

[0067] 1, in this embodiment, the workpiece W and structure ST supported on the rotary stage 12 via the plate 14 rotate in the counterclockwise θz direction relative to the processing head 32, the planarizing head 34, and the utility heads 36A and 36B due to the rotation of the rotary stage 12. Also, as shown in FIG. 9A, it is assumed that the structure ST including four structural layers STA to STD is formed on the workpiece W.

[0068] Then, in step 112, as shown in FIG. 9A, a modeling material M is supplied from the material nozzles 60A and 60B of the processing head 32 to a modeling area FA on the surface of the structure layer STD. The modeling area FA is scanned with processing light beams EL1 and EL2 emitted from the irradiation optical systems 50A and 50B (irradiation device 51) to melt the modeling material M, and the melted modeling material M is then solidified. This additive manufacturing process forms a structure layer STE on the surface of the structure ST. This process is described assuming that a certain degree of unevenness distribution remains on the surface A of the structure layer STE. In the next step 114, the tip of the structure layer STE manufactured by the processing head 32 passes below the first utility head 36A and moves below the planarization head 34 due to the rotation of the rotary stage 12, as shown in FIG. 9C.

[0069] Therefore, in step 116, the utility head 36A uses the surface shape detection unit 66A to measure the distribution of Z positions (surface shape) of the surface of the structural layer STE passing below, and supplies the measurement results to the planarizing head 34 via the control unit 41. In step 118, the planarizing head 34 cuts the higher portions of the surface of the structural layer STE while controlling the Z position of the cutting tool 65 via the Z-direction drive unit 62B so as to flatten the surface shape of the structural layer STE detected by the utility head 36A. This flattens the surface of the structural layer STE. Note that if the surface accuracy of the surface of the structural layer STE measured in step 116 falls within a predetermined tolerance range, the planarizing head 34 does not need to planarize the surface of the structural layer STE in step 118. In other words, when multiple structural layers are formed on the structure ST, the planarizing head 34 does not need to planarize the surfaces of all of the multiple structural layers, and only needs to planarize the surfaces of the structural layers whose surface flatness is particularly low. In step 116, the utility head 36A may further use the cooling unit 68 to lower the temperature of the surface of the structural layer STE.

[0070] In the next step 120, the surface of the structural layer STE planarized by the planarizing head 34 is moved downward toward the second utility head 36B by the rotation of the rotary stage 12, as shown in FIG. 9C. The utility head 36B then uses the surface shape detection unit 66B to measure the Z-position distribution (surface shape) of the planarized surface of the structural layer STE and supplies the measurement results to the control unit 41. In step 120, the utility head 36B may also use the defect detection unit 70 to detect defects in the pattern formed on the structural layer STE. Furthermore, the utility head 36B may heat the surface of the structural layer STE via the heating unit 72. In the next step 122, it is determined whether or not to form an additional structural layer. If not, the manufacturing process ends. On the other hand, if an additional structural layer is to be formed in step 122, a structural layer STF (not shown) is formed on the structural layer STE on the workpiece W.

[0071] In this case, the operation proceeds to step 124, and as an example, the control unit 41 causes the processing head 32 to additively manufacture a structural layer STF (not shown) on the structural layer STE so that the structural layer STF has an unevenness distribution that is the inverse of the unevenness distribution of the surface shape of the structural layer STE measured by the utility head 36B in step 120 (the unevenness distribution remaining after planarization by the planarization head 34). To achieve this, as an example, the amount of modeling material M supplied from the processing head 32 to the modeling area FA is reduced in the convex portions of the structural layer STE, and the amount of modeling material M supplied from the processing head 32 to the modeling area FA is increased in the concave portions of the structural layer STE. This improves the surface accuracy (flatness) of the surface of the structural layer STF formed on the structural layer STE. Furthermore, the surface shape of this structural layer STF is measured by the utility head 36A, and the surface of the structural layer STF is planarized by the planarization head 34 according to the measurement results, thereby further planarizing the surface of the structural layer STF.

[0072] According to this manufacturing method, the surface shape of the structural layer STE manufactured by the processing head 32 is measured by the utility head 36A, and the surface of the structural layer STE is planarized by the planarizing head 34 using this measurement result. As a result, the amount of cutting of the surface of the structural layer STE by the cutting tool 65 in the planarizing head 34 is reduced, thereby improving the surface precision of the structural layer STE. Furthermore, the utility head 36B measures the remaining unevenness distribution of the structural layer STE after planarization by the planarizing head 34, and when the processing head 32 forms the structural layer STF on the structural layer STE using this measurement result, the thickness distribution of the structural layer STF is controlled so as to offset the remaining unevenness distribution of the structural layer STE. As a result, the surface precision of the surface of the structural layer STF manufactured by the processing head 32 can be improved.

[0073] As described above, the forming apparatus 10 of this embodiment is a forming apparatus that forms a structure by stacking multiple structural layers on a workpiece W or a structure ST (object), and is equipped with a processing head 32 that supplies forming material M onto the object or forming surface MS to form a portion of the structural layer, a flattening head 34 that removes at least a portion of the surface of the structural layer, and a stage mechanism 20 (relative movement unit) that moves the processing head 32, the flattening head 34, and the object relatively.The forming apparatus 10 forms multiple structural layers of the forming material M on the object via the processing head 32, drives the stage mechanism 20 to move the processing head 32, the flattening head 34, and the object relatively so that the object moves from the processing head 32 side to the flattening head 34 side, and flattens the surface of at least one of the multiple structural layers via the flattening head 34.

[0074] In addition, the manufacturing method of this embodiment is a manufacturing method for forming a structure by stacking multiple structural layers on an object, and includes step 102 of supplying a manufacturing material M onto the object or the manufacturing surface MS via the processing head 32 to form multiple structural layers of the manufacturing material M on the object, step 104 of driving the stage mechanism 20 (relative movement unit) to move the processing head 32 and the flattening head 34 relative to the object so that the object moves from the processing head 32 side to the flattening head 34 side, and step 106 of flattening the surface by scraping at least a portion of the surface of at least one of the multiple structural layers via the flattening head 34.

[0075] According to this embodiment, after the machining head 32 forms a structural layer on the workpiece W or the build surface MS using additive manufacturing, the surface of the structural layer is planarized using the planarization head 34. This improves the surface accuracy of the structure when the object is built using additive manufacturing. In the above-described embodiment, when the machining head 32 and the workpiece W (or structure ST, etc.; the same applies below) are rotated relative to each other by the rotary stage 12 (relative movement in the θz direction), the machining head 32 forms the structural layer in a build area FA elongated in the non-scanning direction (X direction) perpendicular to the relative movement direction. In this way, by performing build in the build area FA elongated in the non-scanning direction while scanning the machining head 32 and the workpiece W relative to each other, the structural layer of the structure can be efficiently built on the workpiece W. Depending on the application, the shape of the build area FA may be, for example, an oval or square.

[0076] Furthermore, in the above-described embodiment, a cross-shaped guide 26 for moving the processing head 32 and the flattening head 34 in the X direction is installed above the rotary stage 12. For this reason, a circular region 26D with a diameter of φ2 is generated in the center of the plate 14 on the rotary stage 12 in Fig. 1 , through which the processing head 32 cannot pass, as shown in Fig. 10 . Furthermore, if the diameter of the largest circular region on the plate 14 (the plate 14 itself) is set to φ1, then a structure that can be formed by the modeling apparatus 10 in the above-described embodiment will have a shape that is inscribed in a circumference with a diameter of φ1 (the outer shape of the plate 14) and circumscribed by the circular region 26D with a diameter of φ2.

[0077] As an example, if the diameter φ1 is 1500 mm and the diameter φ2 is 300 mm, the outer shapes of structures that can be formed by the modeling apparatus 10 are, as shown in Fig. 10, a square 84A with widths of approximately 525 mm in the X and Y directions, a rectangle 84B with a width of 875 mm in the X direction and a width of 450 mm in the Y direction, a rectangle 84C with a width of 1250 mm in the X direction and a width of 250 mm in the Y direction, and a circle 84D with a diameter of 600 mm. Furthermore, the modeling apparatus 10 can simultaneously manufacture, by additive manufacturing, multiple structures that are located between the outer shape of the plate 14 and the circular region 26D and do not overlap each other.

[0078] In the above-described embodiment, the focal positions of the processing beams EL1 and EL2 of the processing head 32 are set, for example, on the printing surface MS. Alternatively, the focal positions of the processing beams EL1 and EL2 may be set at a position above and away from the printing surface MS, and the printing material M heading toward the printing surface MS may be melted at that position. The melted printing material M adheres to the printing surface MS and then re-solidifies. In the above-described embodiment, the stage mechanism 20 (relative movement unit) includes a rotary stage 12 and a gate-shaped stage 18. By rotating the workpiece W on the rotary stage 12 while performing printing with the processing head 32 and planarization with the flattening head 34, it is possible to continuously and efficiently form and planarize a structure. Note that the relative movement unit that moves the processing head 32, the flattening head 34, and the workpiece W relative to each other may also use any other movement mechanism, such as a translational movement mechanism that translates the workpiece W in the X, Y, and Z directions on the underside of a support unit that supports the processing head 32 and the flattening head 34.

[0079] Next, the machining head 32 of the modeling apparatus 10 in the above-described embodiment irradiates the modeling surface MS (modeling area FA) with the processing beams EL1 and EL2 in a direction substantially perpendicular to the axis (-Z direction). In contrast, consider a case in which the modeled object protrudes laterally (overhangs). In this case, as in the modified machining head 32A shown in FIG. 11A , at least one of the processing beams EL1 and EL2 may be irradiated laterally (in a direction substantially parallel to the X axis in FIG. 11A ) toward a tip portion 88a of the workpiece W or structure 88 that protrudes in the X direction. The machining head 32A shown in FIG. 11A includes irradiation optical systems 50A and 50B as irradiation devices, material nozzles 60A and 60B, prism-type reflecting members 86A and 86B that reflect the processing beams EL1 and EL2 emitted from the irradiation optical systems 50A and 50B laterally, and a holder 81A that holds the prism-type reflecting members 86A and 86B. 11A, the prism-type reflecting members 86A, 86B are arranged in a direction that intersects with the optical axis of the irradiation optical systems 50A, 50B and is aligned with the longitudinal direction of the openings of the material nozzles 60A, 60B. The processing beams EL1, EL2 from the irradiation optical systems 50A, 50B, passing through the prism-type reflecting members 86A, 86B, are directed toward the printing surface MS so as to be substantially transverse to the direction of travel of the processing beams EL1, EL2 traveling directly from the irradiation optical systems 50A, 50B toward the printing surface MS. These prism-type reflecting members 86A, 86B may also be referred to as beam deflecting members that change the direction of travel of the processing beams EL1, EL2 from the irradiation optical systems 50A, 50B. The beam deflecting members may be surface-reflecting mirrors. These prism-type reflecting members 86A, 86B as beam deflection members are arranged at positions that are part of the scanning range of the processing light EL1, EL2 from the irradiation optical systems 50A, 50B, and the processing light EL1, EL2 from the irradiation optical systems 50A, 50B can be switched between traveling along an optical path that does not pass through the prism-type reflecting members 86A, 86B (in the case of processing light EL1) and traveling along an optical path that passes through the prism-type reflecting members 86A, 86B (in the case of processing light EL2) depending on the scanning of the processing light EL1, EL2.Furthermore, since the prism-type reflecting members 86A and 86B are arranged at a position away from the center of the forming area FA in the longitudinal direction of the forming area FA, the attenuation of the processing light EL1 and EL2 from the prism-type reflecting members 86A and 86B by the forming material M can be reduced.

[0080] To manufacture the tip 88a of the structure 88 of this modified example by additive manufacturing, for example, a mixture of the modeling material M and the inert gas IG is supplied to the tip 88a from the material nozzles 60A and 60B. The modeling material M on the upper surface of the tip 88a is then irradiated with the processing light EL1 emitted from the irradiation optical system 50A. Meanwhile, for the modeling material M on the side surface (the surface in the +X direction) of the tip 88a, the processing light EL2 emitted from the irradiation optical system 50B is irradiated toward the prism-type reflecting member 86B, and the processing light EL2 transmitted through the prism-type reflecting member 86B is irradiated along the X axis onto the modeling material M on the side surface of the tip 88a. By using the processing head 32A in this manner, a model having a laterally protruding portion can be manufactured by additive manufacturing.

[0081] Also, as shown in FIG. 11B , assume that the printing surface of the structure 92 is approximately perpendicular to the horizontal plane. In this case, as shown in FIG. 11B , the printing head 32B can be supported on the bottom surface of the X-direction drive unit 30XA in FIG. 1 via a direction-changing support member 90 so that it faces approximately in the −X direction. In this modification, when a structure layer is formed on a printing surface MS that is approximately parallel to the plane containing the Y-axis and Z-axis of the structure 92 (the YZ plane), for example, a mixture of printing material M and inert gas IG is supplied to the printing surface MS from the material nozzles 60A and 60B, while the printing material M on the printing surface MS is irradiated with processing light EL1 and EL2 emitted from the irradiation optical systems 50A and 50B. This method allows a structure layer to be easily printed using additive manufacturing on a printing surface MS that is approximately perpendicular to the horizontal plane of the structure 92.

[0082] In the modeling apparatus 10 of the above-described embodiment, the stage mechanism 20 moves both the processing head 32 and the flattening head 34 and the target object. However, in the above-described embodiment and its modified examples, the stage mechanism 20 may move either the processing head 32 and the flattening head 34 or the target object. Alternatively, the stage mechanism 20 may move either the processing head 32 or the flattening head 34. Note that in the modeling apparatus 10 of the above-described embodiment, the stage mechanism 20 includes a gate-type stage 18 that is a Cartesian coordinate manipulator. However, the stage mechanism 20 of the above-described embodiment and its modified examples may include an articulated manipulator, typically a vertical articulated manipulator.

[0083] Furthermore, in the above-described embodiment of the modeling apparatus 10, processing of the modeling apparatus 10 is performed while the rotating stage 12 continuously rotates the workpiece W and the structure ST in one direction. However, the operation of the rotating stage 12 during processing of the modeling apparatus 10 may be intermittent, and the rotation direction is not limited to one direction. Furthermore, for example, if an XY stage is provided instead of the rotating stage 12, the stage may be driven to move little by little in the X or Y direction so that the trajectory of the workpiece W becomes step-like. Note that the processing head 32 and the flattening head 34 in the above-described embodiment of the modeling apparatus 10 are mounted on the same guide member (cross-shaped guide 26) via X-direction drive units 30XA and 30XB. However, the processing head 32 and the flattening head 34 may be mounted on different guide members so that the external force received by the target object from the flattening head 34 is not transmitted to the processing head 32. Furthermore, the processing head 32 and / or the flattening head 34 may be provided with an anti-vibration mechanism (such as a reaction frame or a countermass).

[0084] Furthermore, the modeling apparatus 10 of the above-described embodiment uses laser deposition deposition (LMD), a type of directed energy deposition (DED). The above-described embodiments and their modifications can also be applied to a case where a modeling apparatus using a directed energy deposition (DED) method other than LMD (e.g., a method in which the heat source is an arc plasma or an electron beam other than a laser beam) is used instead of the modeling apparatus 10. Furthermore, the configuration of the modeling apparatus 10 of the above-described embodiment is not limited to the above-described configuration, and any other configuration is possible. For example, a detection device that projects a light-dark pattern can also be used as the surface shape detection unit of the utility heads 36A and 36B.

[0085] Second Embodiment Hereinafter, a second embodiment will be described as an example of an embodiment. The modeling apparatus 110 of this embodiment models a model by the LMD method, similar to the modeling apparatus 10 of the first embodiment. In the description of the modeling apparatus 110, detailed description of the configuration common to the modeling apparatus 10 will be omitted.

[0086] The modeling apparatus 110 forms a structure ST from a modeling material M (material). The structure ST can also be called a model. For example, the modeling apparatus 110 can perform additive processing to sequentially form layers of the modeling material M on the workpiece W. The modeling apparatus 110 can also perform layer processing to process the formed layers of the modeling material M. The modeling apparatus 110 can also be called a processing apparatus.

[0087] Fig. 12 is a plan view showing a stage mechanism of the modeling apparatus 110 according to the second embodiment, and Fig. 13 is a cross-sectional view of the modeling apparatus 110 according to the second embodiment as viewed in the +Y direction. In Fig. 12, a virtual line HL indicates a position on the structure ST where additional processing or layer processing is performed.

[0088] The modeling apparatus 110 may be installed on a flat surface of a plate-like member 106 having a flat surface substantially parallel to the XY plane. The modeling apparatus 110 may be enclosed in a box-shaped, highly airtight chamber 108. An inert gas IG may be supplied to the inside of the chamber 108.

[0089] The modeling apparatus 110 has a rotation stage 112 installed on the flat surface of the plate-like member 106. The rotation stage 112 can rotate in a predetermined rotation direction RD around a rotation axis RX by a rotation mechanism (not shown). The rotation direction RD is the counterclockwise θz direction. The rotation direction RD may also be the clockwise θz direction. The structure ST is installed on the upper surface (+Z) of the rotation stage 112 via a plate 114. In other words, the rotation stage 112 supports the structure ST. The upper surface of the plate 114, or the upper surface of the rotation stage 112 on which no plate is installed, can also be referred to as the mounting surface of the rotation stage 112. The mounting surface of the rotation stage 112 may be a plane perpendicular to the rotation axis RX.

[0090] The molding apparatus 110 has a partition wall 116 surrounding the rotary stage 112 on the flat surface of the plate-like member 106. A ring-shaped cover portion 116a is formed on the inner surface (the rotary stage 112 side) of the partition wall 116 so as to cover the peripheral portion of the upper surface of the rotary stage 112.

[0091] The modeling apparatus 110 has a pair of Z-axis guide members 122A, 122B that are parallel to the Z-axis and installed on the flat surface of the plate-like member 106 so as to sandwich the rotary stage 112 in the X-direction. The modeling apparatus 110 also has Z-direction drive units 128A, 128B that are driven in the Z-direction along the Z-axis guide members 122A, 122B. The Z-direction drive units 128A, 128B may be driven so that their respective positions in the Z direction (Z positions) are the same value.

[0092] The modeling apparatus 110 is disposed above the rotary stage 112 and has an intersection frame including a first frame 124-1 and a second frame 124-2.

[0093] The first frame 124-1 is formed along a first straight line L1 that passes through the rotation axis RX, and is connected to the Z-direction driving units 128A and 128B. The first frame 124-1 is movable in the Z direction in response to the movement of the Z-direction driving units 128A and 128B in the Z direction.

[0094] The first straight line L1 is, for example, a line parallel to the X-axis. The first straight line L1 has a first region R1 and a second region R2, with the rotation axis RX as the boundary.

[0095] The second frame 124-2 is formed along a second straight line L2 that passes through the rotation axis RX and is different from the first straight line L1. The second frame 124-2 is connected to the first frame 124-1 on the rotation axis RX. The second frame 124-2 is movable in the Z direction together with the first frame 124-1 in response to movement of the Z-direction drive units 128A and 128B in the Z direction.

[0096] The second straight line L2 has a third region R3 and a fourth region R4, with the rotation axis RX as the boundary. The third region R3 is located downstream of the first region R1 in the direction of rotation RD. The fourth region R4 is located upstream of the first region R1 in the direction of rotation RD.

[0097] The angle α between the direction of the first line L1 from the rotation axis RX toward the first region R1 and the direction of the second line L1 from the rotation axis RX toward the third region R3 in the rotation direction RD may be an obtuse angle. The angle α can also be said to be the angle between the direction of extension of the first region and the direction of extension of the third region in the rotation direction RD, centered on the rotation axis RX.

[0098] The intersection frame of the modeling apparatus 110 may further include a third frame 124-3 formed along a third straight line that passes through the rotation axis RX and is different from the first straight line L1 and the second straight line L2. The third frame 124-3 is disposed between the second frame 124-2 and the first frame 124-1 in the rotation direction RD. The third frame 124-3 is connected to the first frame 124-1 on the rotation axis RX. The third frame 124-3 is movable in the Z direction together with the first frame 124-1 in response to movement of the Z-direction drive units 128A and 128B in the Z direction.

[0099] The molding apparatus 110 has first direction drive units 130-1A and 130-1B that are movable along a first straight line L1 (in other words, the extension direction of the first frame 124-1). The first direction drive unit 130-1A is provided at a position corresponding to the first region R1, and the first direction drive unit 130-1B is provided at a position corresponding to the second region R2. The first direction drive units 130-1A and 130-1B are movable in the Z direction together with the first frame 124-1 in accordance with the movement of the Z direction drive units 128A and 128B in the Z direction.

[0100] The molding apparatus has second-direction drive units 130-2A and 130-2B that are movable along a second straight line L2 (in other words, the extension direction of the second frame 124-2). The second-direction drive unit 130-2A is provided at a position corresponding to the third region R3, and the second-direction drive unit 130-2B is provided at a position corresponding to the fourth region R4. The second-direction drive units 130-2A and 130-2B are movable in the Z direction together with the second frame 124-2 in response to the movement of the Z-direction drive units 128A and 128B in the Z direction.

[0101] The modeling apparatus includes a third direction driver 130-3 that is movable along a third straight line L3 (in other words, the extension direction of the third frame 124-3). The third direction driver 130-3 is provided at a position corresponding to the area between the fourth region R4 and the first region R1 in the rotation direction RD. The third direction driver 130-3 is movable in the Z direction together with the third frame 124-3 in response to the movement of the Z direction drivers 128A and 128B in the Z direction.

[0102] The modeling apparatus 110 includes a first device and a second device each used to model a structure ST.

[0103] The first device may be an additive processing device 132 that sequentially forms layers of the modeling material M. The additive processing device 132 may have, for example, a processing head that supplies the modeling material M to the upper surface of the structure ST and irradiates it with processing light to melt and re-solidify the modeling material M, thereby forming layers of the modeling material M using the AM method.

[0104] The second device may be a layer processing device 134 that processes the layer of the building material M formed by the additive processing device 132. The layer processing device 134 may be a removal processing device that removes a portion of the layer of the building material M formed by the additive processing device 132. The removal processing device may have, for example, a planarization head that flattens the surface of the layer by contacting a rotating cutting tool with the layer of the building material M to remove protrusions formed on the surface of the layer. The removal processing device may also have a remelt head that irradiates the layer of the building material M with processing light to melt the building material M and remove a portion of the building material M. The removal processing device may also have an etching head that irradiates the layer of the building material M with processing light and dry-etches the building material M to remove a portion of the building material M.

[0105] The first device is supported by the first direction driver 130-1A. It can also be said that the first device is supported by the first frame 124-1. The first device is movable along the first straight line L1 in accordance with the movement of the first direction driver 130-1A along the first straight line L1. It can also be said that the first device is movable to a position corresponding to the first region R1 in accordance with the movement of the first direction driver 130-1A at a position corresponding to the first region R1. Furthermore, the first device is movable in the Z direction together with the first direction driver 130-1A in accordance with the movement of the Z direction drivers 128A and 128B in the Z direction.

[0106] The second device is supported by the second direction driver 130-2B. It can also be said that the second device is supported by the second frame 124-2. The second device is movable along the second straight line L2 in accordance with the movement of the second direction driver 130-2B along the second straight line L2. It can also be said that the second device is movable to a position corresponding to the fourth region R4 in accordance with the movement of the second direction driver 130-2B at a position corresponding to the fourth region R4. Furthermore, the second device is movable in the Z direction together with the second direction driver 130-2B in accordance with the movement of the Z direction drivers 128A and 128B.

[0107] In this embodiment, the angle β between the direction of the rotational direction RD, which is the direction from the rotation axis RX along the first straight line L1 toward the position where the first device can move (the position corresponding to the first region R1) to the direction of the rotation axis RX along the second straight line L2 toward the position where the second device can move (the position corresponding to the fourth region R4), is 279°. By making the angle β greater than 180°, it becomes easy to position other devices related to the shaping of the target position of the structure ST processed by the first device within the range of the angle β before the target position is processed by the second device. By making the angle β greater than 270°, the above-mentioned effect can be more reliably achieved.

[0108] The modeling apparatus 110 may include a first measuring device 136-1, a second measuring device 136-2, and a cooling device 136-3 as examples of utility heads.

[0109] The first measuring device 136-1 measures the height (Z value) in the direction along the rotation axis RX of the layer formed by the additive processing device 132. The first measuring device 136-1, for example, irradiates the structure ST with measurement light parallel to the rotation axis RX, receives the light reflected by the surface of the structure ST (the formed layer), and measures the height based on the time from when the measurement light is emitted until when the reflected light is received.

[0110] The first measurement device 136-1 is supported by a first direction driver 130-1B that is movable along a first straight line L1. It can also be said that the first measurement device 136-1 is supported by the first frame 124-1. The first measurement device 136-1 is movable along the first straight line L1 in accordance with the movement of the first direction driver 130-1B along the first straight line L1. It can also be said that the first measurement device 136-1 is movable to a position corresponding to the second region R2 in accordance with the movement of the first direction driver 130-1B at a position corresponding to the second region R2. Furthermore, the first measurement device 136-1 is movable in the Z direction together with the first direction driver 130-1B in accordance with the movement of the Z direction drivers 128A and 128B in the Z direction.

[0111] The second measuring device 136-2 measures the height (Z value) in the direction along the rotation axis RX of the layer processed by the layer processing device 134. The first measuring device 136-1, for example, irradiates the structure ST with measurement light parallel to the rotation axis RX, receives the light reflected by the surface of the structure ST (the formed layer), and measures the height based on the time from when the measurement light is emitted to when the reflected light is received. The second measuring device 136-2 may also be referred to as a third device.

[0112] The second measurement device 136-2 is supported by a third direction driver 130-3 that is movable along a third straight line L3. It can also be said that the second measurement device 136-2 is supported by the third frame 124-3. The second measurement device 136-2 is movable along the third straight line L3 in accordance with the movement of the third direction driver 130-3 along the third straight line L3. Furthermore, the second measurement device 136-2 is movable in the Z direction together with the third direction driver 130-3 in accordance with the movement of the Z direction drivers 128A and 128B in the Z direction.

[0113] The cooling device 136-3 cools the layer formed by the additive processing device 132. The cooling device 136-3 may cool the layer formed by the additive processing device 132, for example, by blowing gas onto the layer. The gas may be an inert gas IG supplied into the chamber 108.

[0114] The cooling device 136-3 is supported by a second direction driver 130-2A that is movable along the second straight line L2. It can also be said that the cooling device 136-3 is supported by the second frame 124-2. The cooling device 136-3 is movable along the second straight line L2 in accordance with the movement of the second direction driver 130-2A along the second straight line L2. It can also be said that the cooling device 136-3 is movable to a position corresponding to the third region R3 in accordance with the movement of the second direction driver 130-2A in the position corresponding to the third region R3. Furthermore, the cooling device 136-3 is movable in the Z direction together with the second direction driver 130-2A in accordance with the movement of the Z direction drivers 128A and 128B.

[0115] According to the molding apparatus 110 having such a configuration, various processing devices can be appropriately arranged above the rotary stage 112, and the structure ST can be efficiently molded.

[0116] At least some of the constituent elements of the above-described embodiments and modifications can be appropriately combined with at least some of the other constituent elements of the above-described embodiments and modifications. In addition, some of the constituent elements of the above-described embodiments and modifications may not be used.

[0117] The following supplementary notes are also disclosed in relation to the above-described embodiments. [Supplementary Note A1] A modeling apparatus comprising: a supply unit that supplies a modeling material toward a modeling region; an irradiation device including a scanning unit that scans an energy beam over at least a portion of the modeling material supplied to the modeling region; and a beam deflector that is provided in a portion of a scanning range of the energy beam and changes the direction of travel of the energy beam from the irradiation device to direct the energy beam toward the modeling region. [Supplementary Note A2] The modeling apparatus described in Supplementary Note A1, wherein the supply unit supplies the modeling material to the modeling region having a longitudinal direction in a first direction and a transverse direction in a second direction intersecting the first direction, and the beam deflector is provided at a position away from the center of the modeling region in the first direction. [Supplementary Note A3] The modeling apparatus described in Supplementary Note A2, wherein a positional relationship in the second direction between an object or a modeling surface and the supply unit is changed during at least a portion of a period during which the modeling material is supplied from the supply unit.

[0118] [Appendix B1] A modeling device that forms a structure by stacking multiple structural layers on an object, comprising: a processing head that supplies a modeling material onto the object or a modeling surface to form a portion of the structural layer; a planarizing head that scrapes at least a portion of the surface of the structural layer; and a relative movement unit that moves the processing head, the planarizing head, and the object relatively; the modeling device forms multiple structural layers of the modeling material on the object via the processing head; drives the relative movement unit to move the processing head, the planarizing head, and the object relatively so that the object moves from the processing head side to the planarizing head side; and planarizes the surface of at least one structural layer of the multiple structural layers via the planarizing head.

[0119] [Appendix B2] The molding apparatus described in Appendix B1, wherein the relative movement unit includes a first movement unit that moves the processing head and the flattening head together relative to the object, and a second movement unit that moves the processing head, the flattening head, and the object individually relative to each other.

[0120] [Appendix B3] The machining head is a molding device described in Appendix B1, which has: a supply unit that supplies the molding material to a molding region that is elongated in a non-scanning direction that intersects the relative movement direction between the machining head and the object on the surface of the object or the structure layer; and a scanning unit that scans an energy beam over at least a portion of the molding material supplied to the molding region.

[0121] [Appendix B4] The model-forming apparatus according to Appendix B3, wherein the supply unit of the processing head is capable of controlling whether or not to supply the modeling material for each of a plurality of partial modeling regions obtained by dividing the modeling region in the non-scanning direction.

[0122] [Appendix B5] The scanning unit of the processing head, when dividing the manufacturing area into a first area and a second area on the upstream and downstream sides along the relative movement direction, repeatedly scans the energy beam in the pattern formation area to perform manufacturing during a period in which a pattern formation area on the surface of the object or the structure layer corresponding to the first area passes through the manufacturing area along the relative movement direction, in the manufacturing device described in Appendix B3.

[0123] [Appendix B6] The modeling apparatus according to Appendix B1, wherein the planarizing head cuts or polishes at least a part of the surface of the structure layer.

[0124] [Appendix B7] The molding apparatus according to Appendix B1, wherein the relative movement unit has a height control unit that can control relative positions of the processing head and the flattening head, and the object in a direction perpendicular to a surface of the object.

[0125] [Appendix B8] The molding apparatus according to Appendix B1, wherein the relative movement unit includes: a rotation unit that rotates the processing head and the flattening head integrally relative to the object; and a radial movement unit that moves the processing head and the flattening head in a radial direction of the rotation unit.

[0126] [Appendix B9] The molding apparatus according to Appendix B1, wherein the relative movement unit includes a translation movement unit that moves the processing head and the flattening head integrally relative to the object in a first direction and a second direction perpendicular to each other.

[0127] [Appendix B10] A molding device described in any one of Appendices B1 to B9 above, comprising a first addition head that is positioned between the processing head and the planarizing head and measures the shape of the surface of the structure layer formed by the processing head using a measurement object when the relative movement unit is driven to move the object from the processing head side to the flattening head side, and the flattening head flattens the surface of at least one structure layer using the measurement result of the first addition head.

[0128] [Supplementary Note B11] The modeling apparatus according to Supplementary Note B10, wherein the first addition head has a cooling unit that cools the structure layer whose temperature has been increased by the processing head.

[0129] [Appendix B12] A molding device described in any one of Appendices B1 to B9 above, which is provided with a second additional head that is positioned between the flattening head and the processing head and measures the shape of the surface of the structure layer flattened by the flattening head using a measurement object when the object moves from the flattening head side to the processing head side by driving the relative movement unit, and the processing head controls the thickness distribution of the molding material of the structure layer using the measurement results of the second additional head.

[0130] [Appendix B13] The second addition head has at least one of an inspection unit that inspects the surface of the structure layer planarized by the flattening head for defects, and a heating unit that performs preliminary heating to form the structure layer with the processing head, in the molding device described in Appendix B12.

[0131] [Appendix B14] A modeling method for forming a structure by stacking multiple structural layers on an object, the modeling method comprising: supplying a modeling material onto the object or a modeling surface via a processing head to form multiple structural layers of the modeling material on the object; driving a relative movement unit to move the processing head and the flattening head relative to the object so that the object moves from the processing head side to the flattening head side; and planarizing the surface by scraping at least a portion of the surface of at least one of the multiple structural layers via the flattening head.

[0132] [Appendix B15] The molding method described in Appendix B14, wherein moving the processing head and the flattening head relative to the object includes: moving the processing head and the flattening head integrally relative to the object via a first moving unit; and moving the processing head and the flattening head individually relative to the object via a second moving unit.

[0133] [Appendix B16] The forming method described in Appendix B14, wherein forming multiple structural layers of the modeling material on the object via the processing head includes: supplying the modeling material to a modeling region on the surface of the object or the structural layer that is elongated in a non-scanning direction that intersects with the relative movement direction between the processing head and the object; and scanning an energy beam with at least a portion of the modeling material supplied to the modeling region.

[0134] [Appendix B17] The manufacturing method according to Appendix B16, wherein supplying the manufacturing material to the manufacturing region includes controlling whether or not to supply the manufacturing material for each of a plurality of partial manufacturing regions obtained by dividing the manufacturing region in the non-scanning direction.

[0135] [Appendix B18] The manufacturing method described in Appendix B16, wherein scanning the energy beam includes, when the manufacturing area is divided into a first area and a second area on the upstream and downstream sides along the relative movement direction, repeatedly scanning the energy beam in the pattern formation area to perform manufacturing during a period in which a pattern formation area on the surface of the object or the structure layer corresponding to the first area passes through the manufacturing area along the relative movement direction.

[0136] [Appendix B19] The modeling method according to Appendix B14, wherein planarizing the surface via the planarizing head includes cutting or polishing at least a portion of the surface.

[0137] [Appendix B20] The molding method described in Appendix B14, wherein driving the relative movement unit to move the processing head, the flattening head, and the object relative to each other includes controlling the relative positions of the processing head, the flattening head, and the object in a direction perpendicular to the surface of the object.

[0138] [Appendix B21] The molding method described in Appendix B14, wherein driving the relative movement unit to move the processing head, the flattening head, and the object relative to each other includes: rotating the processing head and the flattening head integrally relative to the object; and moving the processing head and the flattening head in a radial direction of the relative rotation.

[0139] [Appendix B22] The molding method described in Appendix B14, wherein driving the relative movement unit to move the processing head and the flattening head relative to the object includes moving the processing head and the flattening head integrally relative to the object in a first direction and a second direction perpendicular to each other.

[0140] [Appendix B23] The manufacturing method described in any one of Appendices B14 to B22 above, which includes measuring the shape of the surface of the structure layer formed by the processing head using a first addition head arranged between the processing head and the planarization head when the object moves from the processing head side to the planarization head side by driving the relative movement unit, and planarizing the surface of the structure via the planarization head includes planarizing the surface of the structure layer using the measurement result of the first addition head.

[0141] [Appendix B24] The modeling method according to Appendix B23, further comprising using the first addition head to cool the structure layer whose temperature has been increased by the processing head.

[0142] [Appendix B25] A modeling method described in any one of Appendices B14 to B22 above, comprising: driving the relative movement unit to measure the shape of the surface of the structure layer planarized by the planarizing head using a second additional head arranged between the planarizing head and the processing head when the object moves from the planarizing head side to the processing head side; and using the measurement results of the second additional head, the processing head controls the thickness distribution of the modeling material of the structure layer.

[0143] [Appendix B26] The second addition head performs at least one of defect inspection of the surface of the structure layer planarized by the planarization head and preliminary heating to form the structure layer by the processing head, in the manufacturing method described in Appendix B25.

[0144] It should be understood that those skilled in the art can make various changes, substitutions, and alterations thereto without departing from the spirit and scope of the present disclosure.

[0145] W...workpiece, EL1, EL2...processing light, M...modeling material, 10, 110...modeling device, 12, 112...rotating stage, 16, 116...partition wall section, 18...gate-type stage, 20...stage mechanism, 28A, 28B, 128A, 128B...Z-direction drive section, 30XA, 30XB...X-direction drive section, 30YA, 30YB...Y-direction drive section, 32...processing head, 34...flattening head, 34, 36A, 36B...utility head, 41...control unit, 51...irradiation device, 55...material supply unit, 60, 60A, 60B...material nozzle

Claims

1. A processing device comprising: a modeling stage that supports an object to be modeled from a material and is rotatable in a predetermined rotational direction around a rotation axis; an intersection frame that is arranged above the modeling stage and has a first frame that is formed along a first straight line that passes through the rotation axis, and a second frame that is formed along a second straight line that passes through the rotation axis and is different from the first straight line; a first device that is supported by the first frame and is movable along the first straight line and is used to model the object; and a second device that is supported by the second frame and is movable along the second straight line and is used to model the object.

2. The processing device according to claim 1, wherein the first device is an additive processing device that sequentially forms layers of the material, and the second device is a layer processing device that processes the layers of the material formed by the additive processing device.

3. A processing device as described in claim 2, wherein the angle between the direction of rotation on the first straight line from the rotation axis toward the position to which the additional processing device can move and the direction of rotation on the second straight line from the rotation axis toward the position to which the layer processing device can move is greater than 180°.

4. A processing device as described in claim 3, wherein the angle between the direction of rotation on the first straight line from the rotation axis toward the position to which the additional processing device can move and the direction of rotation on the second straight line from the rotation axis toward the position to which the layer processing device can move is greater than 270°.

5. The processing device described in any one of claims 2 to 4, wherein the first straight line has a first region and a second region with the rotation axis as the boundary, the second straight line has a third region and a fourth region with the rotation axis as the boundary, the third region is located downstream in the rotation direction as viewed from the first region, the fourth region is located upstream in the rotation direction as viewed from the first region, the additional processing device is movably provided to a position corresponding to the first region, and the layer processing device is movably provided to a position corresponding to the fourth region.

6. The processing device according to claim 5, wherein the layer processing device is a subtractive processing device that removes a portion of the layer of material formed by the additive processing device.

7. A processing device as described in claim 5 or 6, wherein the angle formed by the rotation direction from the direction from the rotation axis toward the first region on the first straight line to the direction from the rotation axis toward the third region on the second straight line is an obtuse angle.

8. A processing device according to any one of claims 5 to 7, wherein a first measuring device that measures the height of a layer formed by the additive processing device in a direction along the rotation axis is movably provided at a position corresponding to the second region.

9. A processing device according to any one of claims 5 to 8, wherein a cooling device for cooling the layer formed by the additional processing device is provided movably at a position corresponding to the third region.

10. The processing device according to claim 9, wherein the cooling device is a device that blows gas onto the layer formed by the additive processing device.

11. The processing apparatus according to any one of claims 2 to 10, wherein the intersection frame has a third frame formed between the second frame and the first frame in the rotation direction, the third frame passing through the rotation axis and along a third straight line different from the first straight line and the second straight line, and the processing apparatus further has a third device supported by the third frame and movable along the third straight line for use in forming the object.

12. The processing device according to claim 11, wherein the third device is a second measuring device that measures the height of the layer processed by the layer processing device in a direction along the rotation axis.

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