Embedded / encapsulated electronic device and method of production

Abstract

A device (1) comprises at least one embedded electronic device (3); and a shaped body (2) comprising a bulk material (4). The bulk material (4) at least partially is made of compressed thermoplastic foam particles (5), wherein the compressed thermoplastic foam particles (5) are attached to each other. The embedded electronic device (3) is at least partially encapsulated by the bulk material (4). In a method for manufacturing the device (1) an electronic device (3') and thermoplastic foam particles (5') are shaped into a predetermined shape (6) through a thermo-pressing process (T).

Description

[0001] EMBEDDED / ENCAPSULATED ELECTRONIC DEVICE AND METHOD OF PRODUCTION

[0002] This disclosure relates to devices having a shaped body and an embedded electronic device. Further, a method for manufacturing a respective device and uses are disclosed.

[0003] Shaped bodies are widely used as parts in industrial and consumer applications, e.g. to be used as packaging, exercise mats, body protectors, lining elements in automobile construction, sound and vibration dampers, footwear and the like. Sometimes, shaped bodies are molded parts are made of molded synthetic foam particles. It is sometimes desirable to attach information to the parts, e.g. for tracking purposes, indications for their use, identifying the part. Conventionally, labels are used that are attached to an outer surface of the part.

[0004] Electronic devices are versatile functional elements in today's life and may realize "intelligent labels", e.g. based on RFID technology, that allow for associating more complex data to a part. In an alternative approach, a molded part may form a case or housing for an electronic device.

[0005] In order to combine the properties of a body formed by a synthetic material and functions of an electronic device, e.g. a chip, the latter have been placed between laminates of plastic materials, inserted into preformed cavities or grooves within a bulk material, or attached to outer surfaces of the respective body. In general, thermal shaping processes of synthetic materials to implement a receptacle for the electronic chip or device require temperatures that may damage the chip or are detrimental to the functioning of the chip.

[0006] WO 2005 / 105404 A1 describes a molding method for expandible resin particles comprising polystyrene, wherein the expanded particles may have skin layers with a resin having a lower softening temperature than the expanded material. The block-molded material is formed into desired shapes by cutting.

[0007] CN 104 227 904 B describes an in-mold foaming method involving pre-expanded (foamed) polyurethane pellets that are compressed in a mold and subjected to a steam heat treatment. An RFID or a GPS chip is placed in a mold together with the pre-expanded pellets and then steam heated for forming a molded article having a chip at an outside surface.

[0008] CN 110 871 580 A describes a molded body made of thermoplastic polyurethane particles that are semi-foamed and thermally expanded by microwaves in a mold. The particles are bonded / welded together and may encapsulate a GPS tracking chip, which is however not responsive to microwave radiations. It is therefore an object of the present disclosure to provide for an improved device and / or method for combining a body that is at least partially formed of synthetic material with functions of an electronic device.

[0009] Hence, according to a first aspect a device comprising at least one embedded electronic device and a shaped body comprising a bulk material is disclosed. The bulk material is made of at least partially compressed thermoplastic foam particles, wherein the compressed thermoplastic foam particles are attached to each other. Further, the embedded electronic device is at least partially encapsulated by the bulk material.

[0010] According to a second aspect, a method for manufacturing a device, in particular according to the first aspect, is disclosed, wherein an electronic device and thermoplastic foam particles are shaped into a predetermined shape through a thermo-pressing process. During the thermopressing process, the electronic device is at least partially encapsulated by the thermoplastic foam particles.

[0011] In embodiments, the shaped body is obtained through a thermo-pressing process, and the compressed thermoplastic foam particles are in particular bonded to one another. One may consider the shaped body a molded body. In particular, the (compressed) thermoplastic foam particles are attached to each other or adhere to each other such that a compact - potentially sintered - body is formed. It is understood that the thermoplastic foam particles are slightly altered by the thermo-pressing process in terms of their shape and density, because the pressure acting on a (packed) bed of the particles may deform the relaxed initial particles into a compacted form where the particles are attached to each other.

[0012] In embodiments, the compressed thermoplastic foam particles are fused to each other.

[0013] In embodiments, the shaped body is obtained in a thermo-pressing process applied to expanded thermoplastic foam particles, preferably obtained in a steamless thermo-pressing process.

[0014] In embodiments, thermo pressing includes heating and pressing the expanded / foamed thermoplastic foam particles from both, the top and the bottom side, in a two-part mold without inserting an additional medium into the mold. It is understood that "expanded thermoplastic foam particles" refers to foamed particles comprising a thermoplastic material. In embodiments, the expanded thermoplastic foam particles may further expand within the mold during the thermo-pressing process. Examples of foamed thermoplastic particles may be fully expanded when they are placed into the mold and are only compressed during the thermo-pressing. One may contemplate of various thermoplastic materials being foamed as depicted below. In embodiments, the expanded thermoplastic foam particles are completely expanded, and do not further expand or foam upon an intake of thermal energy, e.g. heat. The expanded thermoplastic foam particles may be closed cell foam particles.

[0015] In embodiments, the at least partially compressed thermoplastic foam particles have a coating comprising a coating material, and the compressed thermoplastic foam particles are attached to each other by the coating material.

[0016] The coating may be a polymeric surface coating referring to a coating with a polymeric composition referred to as coating material. E.g. the coating material is bound to the particle surface as a distributed powder, patches, or a continuous shell-like layer, wherein the surface of the thermoplastic foam particles may be completely or partially covered with the polymeric composition.

[0017] In embodiments, the at least partially compressed thermoplastic foam particles are attached to each other by an adhesion material. An adhesion material may be liquid, viscous or solid material that may serve as an adhesive to hold the compressed thermoplastic foam particles together. For example, one may contemplate of a powder being placed between the thermoplastic particles and molten / softened and re-solidified and / or cured through a heating process.

[0018] It is advantage that coated thermoplastic foam particles form the bulk material and allow to encapsulate the electronic device which is thereby embedded. The thermoplastic foam particles are compressed and adhere to one another, e.g. through adhesive forces and / or cohesive forces. In a manufacturing process, the process parameters as to the temperature and / or pressure for a forming or shaping process to obtain a predefined shape can be adjusted such that the electronic device remains intact and properly functioning. The device may be referred to a form-shaped device.

[0019] In embodiments, the bulk, coating and / or adhesion material of the compressed thermoplastic foam particles adheres or sticks to the surface of the embedded electronic device, in particular the bulk material covering at least 50 % of the surface area of the embedded electronic device, preferably 70 %, even more preferred 100%. Further, using a bulk material in terms of the (uncompressed) thermoplastic foam particles to manufacture the shaped body, the embedded electronic device can be flexibly positioned within the volume occupied by the shaped body.

[0020] In embodiments, the embedded electronic device is attached to a positioning device within the interior of the shaped body. The positioning device may be used to position the electronic decide within a bed of thermoplastic particles and / or a mold during a manufacturing process and remains in the final product.

[0021] The thermoplastic foam particles can have a regular (round) or irregular shape. One may refer to the particles as beads or coated beads. The form of the particles / beads may change under the thermo-pressing process.

[0022] In embodiments, the compressed thermoplastic foam particles arise from a compaction or compression of a packed bed of relaxed of uncompressed thermoplastic foam particles in a container, e.g. a mold. For example, the initial volume of the packed bed is reduced to 20% to 60%, preferably to 30% to 60% and even more preferred to 35% to 60%.

[0023] Additionally or alternatively, a compression of the thermoplastic foam particles may be expressed in terms of a density of the packed bed prior and after compression. In embodiments, a density of the uncompressed particles is d1 and after thermoforming the shaped body, the density of the body is d2 in mass per volume. Then, a ratio rd=d2 / d1 is preferably between 1.5 and 4, in particular between 1.8 and 2.5. In embodiments, rd is 1.9 to 2.1. For example, a density of uncompressed particles and / or the packed bed is 100 g / l while the density of the shaped body including the chip is 200 g / l.

[0024] No flat internal interfaces between prefabricated structural elements, e.g. layers or building blocks, are present. The attached particles and irregular internal structure of the bulk may lead to a more stable and robust shaped body combining the properties of a structural element made of a foam material with functions of an electronic device, e.g. a chip.

[0025] Because the electronic device is truly embedded within the bulk and, potentially, fixedly coupled through the bulk, coating and / or adhesion material adhering to the surface of the electronic device, a removal of the electronic device from the whole device, in particular, from the "capsule" made of the bulk can be prevented. For example, in embodiments, the embedded electronic device is completely encapsulated by the bulk material. In addition, any desired form of the shaped body can be obtained in a molding process. Three- dimensional shapes containing undercuts and irregular shapes are feasible.

[0026] In embodiments, the shaped body comprises a cavity for receiving the embedded electronic device, wherein the shaped body has an access opening and a through-hole in a through-hole direction. The through-hole hole is communicatively coupled to the cavity, and a cross-sectional extension of the cavity in a direction perpendicular to the through-hole direction is larger than an extension of the through-hole in the same direction.

[0027] In a view along the through-hole direction, the embedded electronic device can be accessed, but one cannot remove the embedded electronic device. A removal through the through-hole and the access opening is not possible without, at least partially, destroying or damaging the shaped body by removal of bulk material.

[0028] It is understood that the volume occupied by the embedded electronic device corresponds to a cavity or hollow area of the bulk material in which the embedded electronic device is received within the shaped body. The expression bulk material in the context of the shaped body is to be interpreted as the material in the internal volume of the body. The bulk material is meant to fill the volume limited by the outermost - and potential inner - surfaces - of the body, and the surfaces of the electronic device embedded in the bulk material.

[0029] In embodiments, the bulk material of the device is a homogenous material wherein the compressed thermoplastic foam particles attached to one another by the coating and / or adhesion material form a matrix. A granularity of the bulk material is given by the sizes of the compressed thermoplastic foam particles. The sizes of the compressed thermoplastic foam particles may vary and can be chosen as a function of the use and purpose of the shaped body.

[0030] It is an advantage that only one forming process is required to embed the electronic device in the bulk material and contemporaneously defining the shape of the body, e.g. by providing a specific mold. Placing within the pre-body or encapsulating the electronic device such that thermoplastic foam particles surround the electronic device occurs prior to compressing and attaching the thermoplastic foam particles to one another for forming the bulk of the body. One may dispense with additional process steps of placing a chip into pre-shaped receptacles in a preformed body.

[0031] In embodiments, the compressed thermoplastic foam particles are directly attached to a surface of the embedded electronic device, in particular, the bulk-material, coating material and / or adhesion material may be resolidified and adheres to the surface. Hence, fixing the electronic device in the inner volume of the shaped body may occur through the coating material adhering to a surface of the electronic device.

[0032] It is understood that prior to the thermo-pressing processes the thermoplastic foam particles are in a relaxed or uncompressed state. By compressing and heating the thermoplastic foam particles, they are pressed to one another, the surface of the particles, e.g. the coating or adhesive in terms of the adhesion material, reacts, e.g. melts, and after a setting of the bulk, coating and / or adhesion material, the thermoplastic foam particles remain in their compressed state and are fixedly coupled to another. Hence, a compact body may be formed.

[0033] In embodiments, all outer surfaces of the shaped body are shaped through the thermo-pressing process with a mold. The surfaces of the obtained device then conform to the mold's shape. Preferably, no material removal occurs during the shaping / molding the body, e.g. by cutting, chipping or machining or cuts. One may, however, contemplate of including a deburring step for removing a flash.

[0034] In embodiments, the shaped body is a molded body, and the compressed thermoplastic foam particles are attached to each other by re-solidified bulk material, coating material and / or adhesion material. One may contemplate of a partial sintering process to have the thermoplastic foam particles or beads attached to each other.

[0035] In embodiments, a softening point of the bulk, coating and / or adhesion material is less than 160 °C, preferably, less than 140 °C, and even more preferred less than 120 °C. In embodiments, softening point of the bulk, coating and / or adhesion material is higher than 30 °C, preferably, higher than 40 °C, and even more preferred higher than 70 °C.

[0036] The softening temperature according to this disclosure may be considered, in case of amorphous thermoplastic coatings, the glass transition temperature determined by differential scanning calorimetry according to DIN EN ISO 11357-2 (2014), as so-called midpoint temperature. The glass transition temperature of the polymeric surface coating is the glass transition temperature obtained when evaluating the second heating curve (heating rate 20 K / min) after heating the polymeric coating material to 130 °C (holding time 1min) and cooling it with 20 K / min to - 80°C. If the polymeric coating has more than one glass transition at least one glass transition temperature is in the range from 30 to 130°C. If the polymeric coating is semicrystalline the softening temperature in the sense of the present invention means the melting temperature determined according to DIN EN ISO 11357-3 (2018) (melting temperature = peak temperature) by heating with 20 K / min after cooling to -80°C.

[0037] In embodiments the polymeric surface coating is thermoplastic and has a softening temperature preferably in the range from 30°C to 130°C

[0038] A softening point of the coating is preferably lower than a predetermined maximum temperature for the operation of the electronic device, e.g. according to a manufacturer's, specification of the electronic device. A temperature range or a maximum temperature exposure over a specific time period can be determined for the electronic device prior to encapsulating the respective electronic device by the bulk material.

[0039] Accordingly, the thermo-pressing process, in embodiments, is carried out at a temperature from 60 °C to 160 °C, preferably from 80 °C to 160 °C, more preferably from 90 °C to 140 °C, even more preferably from 100 °C to 140 °C.

[0040] Due to the physicochemical properties the deployed (compressed) thermoplastic foam particles with their optional coating and / or added adhesive, the thermo-pressing process can be conducted at relatively low temperatures, that do not damage, change the functional properties of, are harmful to or otherwise have a detrimental effect on the electronic device. In particular, the thermo-pressing process can be steam-less. Conducting a dry manufacturing process, in particular, allows to use delicate electronic devices, such as sensors, batteries, electro-mechanical devices, processing devices etc. to be embedded in the shaped body.

[0041] In embodiments, the expanded thermoplastic particles are compressed during the thermopressing process without being subjected to microwave or radio frequency radiation. Hence, the shaped body may be obtained in a steam less thermo-pressing process and / or a process where thermal radiation is imposed on the respective thermoplastic material through the walls of the mold. For example, one may contemplate of a molding process where heat is fed into the interior of the mold only by heated walls.

[0042] In embodiments, the expanded / relaxed / compressed thermoplastic foam particles and / or the coating and / or the added adhesives are made of materials that do not absorb microwaves and radio frequency waves.

[0043] In embodiments, the embedded electronic device comprises elements that at least partially reflect and / or absorb microwaves. The device and method for manufacturing according to the aspects of this disclosure are, in particular, suitable for embedding electronic devices that are damageable by microwaves.

[0044] In embodiments, the coating is obtained from a coating material dispersed in a fluid. For example, the coating material is obtained from a polyurethane (PUR) dispersion comprising polyurethane particles dispersed in a water solution.

[0045] In embodiments, the core material of the compressed or relaxed thermoplastic foam particles are thermoplastic elastomer particles, in particular thermoplastic polyurethane foam particles.

[0046] Thermoplastic foam particles according to the present invention are, in particular, polyurethane foam particles being expanded foam particles and belong to the group of particle foams, which are also referred to as foamed pellets, bead foams, particle foam, expanded thermoplastic elastomer particles or expanded thermoplastic polyurethane beads (E-TPU). Examples of methods for preparing particle foams and moldings (also referred to as molded article) made therefrom, based on thermoplastic polyurethanes or other thermoplastic elastomers, are described in WO 94 / 20568A1, WO 2007 / 082838 A1 , WO2017 / 030835 A1 , WO 2013 / 153190 A1 and WO 2010 / 010010 A1 , which are hereby incorporated by reference.

[0047] E-TPU is commercially available, e.g. marketed by BASF under the name Infinergy®. E-TPU particles represent mainly to fully closed-cell particle foam. Thermoplastic polyurethane (e.g. Elastollan®) is expanded resulting in a particle foam and can be processed on standard molding machines. E-TPU exhibits a closed particle surface, and the chemical nature of the used TPU, standard E-TPU grades also absorbs only low amounts of water. Like the TPU on which it is based, it can also be characterized by high breaking elongation, tensile strength and abrasion resistance, combined with good chemical resistance.

[0048] In embodiments, the coated thermoplastic foam particles are obtained in a preparation process comprising: bringing the thermoplastic foam particles into contact with an aqueous polyurethane dispersion, the polyurethane having a K-value according to DIN EN ISO 1628-1 2021 in the range from higher than 40 to lower than 100, preferably from 50 to 95, resulting in at least partly coated thermoplastic foam particles; and drying the coated thermoplastic foam particles. The aqueous polyurethane dispersion deployed in the preparation process can be prepared by methods known in the art, as for example, described in WO 2021 / 249749 A1 which is hereby incorporated by reference.

[0049] In embodiments, a size of the relaxed uncompressed initial thermoplastic foam particles, in terms of a diameter is between 1 mm and 20 mm.

[0050] In embodiments, a size of the compressed thermoplastic foam particles in terms of a diameter is between 1 mm and 20 mm.

[0051] The "size in terms of a diameter of a particle" can be considered to be the maximum distance between any two points on the surface of the particle, wherein the distance is measured between the points through the interior volume of the particle enclosed by its surface.

[0052] Foam particles or also foam beads or foam granules according to this disclosure, in particular, refers to a foam in the form of a lot of loose particles of the same chemical nature, the average length of the particles preferably being in the range of 1 to 20 mm, determined according to DS / ISO 13322-2: 2021. In the case of non-spherical, e.g., oval particles average length may refer to the longest dimension by length, e.g. determined by a 3D evaluation of the granules, for example by means of dynamic image analysis with an optical measuring device named “PartAn 3D”, Microtrac.

[0053] In embodiments, the electronic device and the thermoplastic foam particles have a same of similar sizes. The electronic device can be block-shaped and may have a maximum length, width and / or height being smaller than the diameter of the particles. Having small devices allow to attach the device to one or more particles, e.g. by the coating or a glue. This may facilitate a manufacturing process for the device.

[0054] The thermoplastic foam particles may have an average mass in the range of 0.1 to 50 mg, preferable in the range between 0.5 and 45 mg. The average mass can be determined as an arithmetic mean based on a sample size of 10 different particles wherein each particle is weighted three times.

[0055] The foam particles may have a bulk density of 20 g / l to 350 g / l, preferably 30 g / l to 250 g / l, more preferably 40 g / l to 200 g / l. The bulk density is, e.g., measured analogously to DIN ISO 60:1999, wherein the determination of the above values in contrast to the standard, a vessel with 10 I volume is used instead of a vessel with 0.1 I volume. For the foam particles with low density and large mass a measurement deploying only 0.1 I volume may lack accuracy.

[0056] In general, all kind of foamed particles can be used as "thermoplastic foam particles" as long as a thermoplastic outer shell exists. For example, shredded foam parts or polymeric foam waste material based on thermosetting, thermoplastic, or elastomeric polymers are candidates.

[0057] In embodiments, the thermoplastic foam particles are selected from the group consisting of styrene polymer foam particles, polyurethanes foam particles, polyamide foam particles, thermoplastic elastomer foam particles, polyolefine foam particles and mixtures thereof.

[0058] Potential thermoplastic elastomers for thermoplastic foam particles include, for example, thermoplastic polyurethanes (TPU), thermoplastic polyester elastomers (e.g., polyether esters and polyester esters), thermoplastic copolyamides (e.g., polyether copolyamides) or thermoplastic styrene-butadiene block copolymers.

[0059] It is also possible to use mixtures of different foam particles. In embodiments, the thermoplastic foam particles comprise at least two foam particles based on different polymers or different particle size.

[0060] Two or more foam particles in the sense of the present invention refers to a mixture of different lots of loose foam particles, wherein the lots differ in their chemical nature.

[0061] In principle, all types of foam particles can be mixed regardless of their thermal properties such as melting point or glass transition.

[0062] In embodiments, different thermoplastic foam particles are mixed. More preferably the foam particles comprise at least two thermoplastic foam particles selected from the group consisting of styrene polymer foam particles, polyamide foam particles, thermoplastic elastomer foam particles, polyolefin foam particles and mixtures thereof.

[0063] The thermoplastic foam particles described in this disclosure can be adapted by additives such as for example dyes, process aids, nucleating agents or stabilizers. The additives may be added during the generation of the precursor of the foam particles or during the foaming an / or molding step. A precursor is a polymer composition that is used as input material for foaming. In embodiments the compressed thermoplastic foam particles are semitransparent, and a bulk material between the surface of the electronic device and an outer surface has a transmittance of at least 20% at a wavelength of 500 nm.

[0064] In embodiments, the transmission properties of the bulk material between a light source embedded as an electronic device, and an outer surface is implemented such that an optical signal transmitted from the light source can be received outside of the shaped body. The optical signal may be implemented by infrared light or visible light in embodiments.

[0065] In embodiments, the compressed thermoplastic foam particles are particles of a moldable thermoplastic particle foam according to European patent application no. EP23182180.2, international patent application no. PCT / EP2024 / 083787, or international patent application no. PCT / EP2024 / 058199 treated in a thermo-pressing process, which are hereby incorporated by reference. In embodiments, the shaped body corresponds to the foam molded part according to international patent application no. PCT / EP2024 / 058199, which is hereby incorporated by reference.

[0066] In embodiments of the method for manufacturing, at least one of the following steps is carried out:

[0067] Producing and / or providing expanded thermoplastic foam particles; producing expanded thermoplastic foam particles having a coating comprising a coating material; providing expanded thermoplastic foam particles having a coating comprising a coating material; providing expanded thermoplastic foam particles and an adhesion material; providing an electronic device; placing the expanded thermoplastic foam particles and the electronic device in a mold; heating the expanded thermoplastic foam particles and the electronic device in the mold for shaping a shaped body; compressing the expanded thermoplastic foam particles and the electronic device in the mold for shaping a shaped body; cooling the mold and / or the shaped body; retrieving the device from the mold; fusing the thermoplastic foamed particles by supplying thermal energy, in particular through electromagnetic radiation or convection heat. generating device process data indicative of process parameters relating to the method for manufacturing; generating device data indicative of parameters relating to the embedded electronic device and / or the bulk material; storing the device process data and / or the device data in a memory comprised in the embedded electronic device.

[0068] In embodiments, placing the expanded thermoplastic foam particles includes forming a packed bed of relaxed thermoplastic foam particles in the mold.

[0069] In embodiments, the method includes the step of pressure loading the expanded thermoplastic foam particles, in particular prior to placing them into the mold.

[0070] In embodiments, pressure loading the expanded thermoplastic foam particles comprises at least one of the steps of: filling foamed / expanded thermoplastic particles into a pressure vessel; loading the foamed thermoplastic particles with a pressurized gas; conveying and / or placing the pressure-loaded foamed thermoplastic particles into the mold.

[0071] For example, loading the foamed particles with a pressurized gas refers to an overpressure treatment, e.g. at which the foamed particles are exposed to a pressure of 1.1 to 14 bar, preferably 1.5 to 8 bar. The duration of the overpressure treatment can be, for example, 20 min to 50 hours, preferably 0.5 hours to 24 hours and more preferably 1 to 8 hours at the afore-mentioned final overpressure.

[0072] In an embodiment, the pressure loading and / or overpressure treatment is carried out until the thermoplastic foam particles are saturated with the pressurized gas. The loading time which is needed to reach the saturation may be determined with a magnetic suspension balance.

[0073] Pressure loading the thermoplastic foam particles may increase the fusion between particles and the stability of the shaped body.

[0074] In embodiments, the method for manufacturing comprises at least one of the steps of: providing a positioning device; electronic device on the positioning device in the mold; placing the electronic device on the positioning device in the mold; placing the thermoplastic foam particles in the mold up to a predetermined filling level; placing the electronic device on the thermoplastic foam particles being placed in the mold up to the predetermined filling level; filling the mold with thermoplastic foam particles completely, in particular after placing the electronic device in the mold; placing the electronic device in between thermoplastic foam particles being placed in the mold, compacting or compressing the packed bed from an initial volume of the packed bed to 20% to 60%, preferably to 30% to 60% and even more preferred to 40% to 60%.

[0075] The mold may comprise a lower part and an upper part, wherein the upper part acts onto the uncompressed thermoplastic foam particles as a stamp. As a result, the filling of the thermoplastic foam particles is compacted.

[0076] The steps of placing the thermoplastic foam particles, electronic device and / or the positioning device may be carried out or assisted by a robotic device, implemented to pour bulk material (thermoplastic foam particles) into a container (mold) and / or to grab and place a feasible part (electronic device, positioning device) at a predetermined location. The separate actions or method steps may be implemented by dedicated robotic devices.

[0077] For example, the electronic device or microchip can be placed manually or automatically in the middle of the half-filled mold. Further thermoplastic particles or beads then cover it before compacting the packed bed of beads.

[0078] Alternatively, the microchip is inserted in an automated crack filling process. If the microchip is small enough, it can be moved into the mold with the beads already poured into.

[0079] In embodiments, the embedded electronic device comprises at least any one of: a battery, a transmitter, an antenna, a tracking device, a receiver, a processing device, a memory, a sensor device, a nearfield communication (NFC) tag, a light source, a localization device.

[0080] Because of the properties of the bulk material and the underlying manufacturing process parameters in terms of temperature and / or vapor exposure a variety of sensitive electronic devices can be used. Active or passive RFID or NFC tags, e.g. according to ISO / IEC 14443, ISO / IEC 15693 at the time of filing this application, allow for a wireless communication to and / or from an external device. Embedded sensor devices may capture data indicative of the manufacturing process and / or the use of the entire device in which it is embedded. A memory allows to store provide information on the device's history. A light source may be used to communicate through a partially transparent bulk material, e.g. according to a predetermined code.

[0081] In embodiments, the embedded electronic device comprises a memory containing data indicative of at least one of: a property of the bulk material, a property of the embedded electronic device, a property of the device. The property may be at least one of: a date of manufacture, a carbon footprint, a maximum / minimum temperature exposure, a recycling, a chemical composition of the coating, thermoplastic foam material, a location of the device, a history of properties, product identification codes, a serial number, a life-time, an expiry date for use, data relating to the user or owner of the device in terms of a name, date of birth, wedding date, date of purchase, medical data, ID number, emergency contact details, photos, a seller identification, a registration date of a song, an audio book, a patent identifier. Preferably, the data is indicative of physical or physicochemical properties of the device, the embedded electronic device, the bulk material, the thermoplastic foam and / or the coating material. Such properties may be rigidity, volume, mass, mass density, weight, porosity, form, shape, for example. The memory may further contain data including: image data, a photography, a non-functional token.

[0082] In embodiments, sensor devices are implemented as temperature, pressure, humidity, and / or acceleration sensors and generate sensor data indicative of the respective physical and / or physicochemical observable. The embedded electronic device can be implemented to store the sensor data and provide means to read out the sensor data by an external device.

[0083] One may contemplate of a plurality of electronic devices, e.g. to form an electronic circuit, being embedded in the bulk material, e.g. a battery, a memory and a processing device. In embodiments, the electronic device is implemented to execute computer readable instructions of a computer program. E.g. the electronic device is a programable microprocessor, a computing device, a smartphone, a laptop or notebook computer.

[0084] It is understood that when referring to an electronic chip or an embedded chip, throughout this disclosure an electronic device according to any of the before-mentioned embodiments is encompassed that may be embedded in the bulk material.

[0085] In embodiments, the bulk material and / or the shaped body is implemented to be comprised in one of a shoe sole, a tire, a floor or wall covering mat, a play ball, a structural element or part to mechanically support an object, packaging material. The term bulk material, in particular, refers to the chemical substance contained in the thermoplastic particles or the material they are formed of.

[0086] According to a further aspect of this disclosure, a system comprising a device according to the first aspect described above or below with respect to embodiments of the device and an external device is presented. The embedded electronic device is implemented to perform a wireless communication with the external device; and the external device is implemented to perform a wireless communication with the embedded electronic device.

[0087] For example, the embedded electronic device is communicatively coupled through a wireless link, radio frequency, visible light and / or infrared light with the external device. In embodiments, the wireless communication is based on NFC, Bluetooth, ZigBee or the like.

[0088] In embodiments the external device is a smart device having a wireless communication interface. One may contemplate of a smart phone executing an application (app) allowing to read from and / or write data into the memory of the embedded chip, to program the embedded chip, activate or deactivate functions of the chip, trigger predefined or preprogrammed responses or otherwise interact with the embedded chip.

[0089] According to yet another aspect of this disclosure a use of the device according to the first aspect described above or below with respect to embodiments of the device, to track the shaped body, is disclosed. Further, a use of the device as packaging, as a shock pad, as an inner or outer shoe sole, as floor covering, and / or automotive parts is suggested.

[0090] According to yet another aspect, a device, in particular according to the first aspect, produced by thermo-pressing process, is disclosed, wherein an electronic device is embedded in a shaped body formed by a bulk material comprising - in particular compressed - thermoplastic foam particles.

[0091] Further possible implementations or alternative solutions of the invention also encompass combinations - that are not explicitly mentioned herein - of features described above or below in regard to the embodiments. The person skilled in the art may also add individual or isolated aspects and features to the most basic form of the invention.

[0092] It is understood that the shaped body comprised in the device according to the first aspect its examples or embodiments may be manufactured according to the method according to the second aspect its examples or embodiments as disclosed in this application. Further embodiments, features and advantages of the present invention will become apparent from the subsequent description and dependent claims, taken in conjunction with the accompanying drawings, in which:

[0093] Fig. 1 shows an embodiment of a device including an embedded electronic device.

[0094] Fig. 2 shows details of the bulk material with compressed thermoplastic foam particles and an interface between the coating and the embedded electronic device in the device of Fig. 1.

[0095] Fig. 3 shows further embodiments of devices including an embedded electronic device;

[0096] Fig. 4 shows an embodiment of a system including a device of Figs. 1 or 3 and an external device.

[0097] Fig. 5 shows a flow diagram with method steps involved in a method for manufacturing a device of Fig. 1 or 3.

[0098] Fig. 6 illustrates method steps involved according to an embodiment of the production method of Fig. 5.

[0099] In the Figures, like reference numerals designate like or functionally equivalent elements, unless otherwise indicated.

[0100] Embodiments of embedded electronic devices

[0101] In Fig. 1 an embodiment of a device including an embedded electronic device is illustrated. The device 1 includes a shaped body 2 made of a bulk material 4, and an electronic device 3 that is embedded and surrounded by the bulk material. The embedded electronic device 3 is positioned in the interior of the volume occupied by the shape 6 of the shaped body 2. The embedded electronic device 3 fills a void or cavity 7 within the inner bulk material 4.

[0102] The bulk material 4 is formed by compressed thermoplastic foam particles 5 that are expressly indicated in Fig. 4 only in some sections. The interior volume of the shaped body 2 is homogenously filled by the compressed thermoplastic foam particles 5 adhering to each other. To this end, the thermoplastic foam particles 5 are coated with a coating material, and the shape 6 of the body 2 is defined through the mold in a thermo-pressing process. Under the influence of the temperature and pressure during the thermo-pressing process the coatings of attached particles react, e.g. merge, are welded, soften, potentially melt, and resolidify, and then stick together in a compressed state of the thermoplastic foam particles 5. Similarly, the compressed thermoplastic foam particles 5 stick to the surface of the embedded electronic device 3.

[0103] In alternative embodiments, the coating is dispensed, with and the compressed thermoplastic foam particles 5 adhere to each other by an added adhesion material, e.g. a glue, powder adhesive, or by partial sintering the bare foam particles 5 to one another. A combination of adhesive effects by a resolidified coating, the material of the thermoplastic particles themselves or an adhesion material can be contemplated.

[0104] Fig. 2 shows an enlarged detail of the bulk material 4 and an interface of the compressed thermoplastic foam particles 5 with a coating and a surface of the electronic device 3 in a schematic cross-sectional view. The core of the compressed thermoplastic foam particles 5 is illustrated as a dotted area and is assigned reference numeral 5A. The coating is depicted in bold black contours 5B. Apart from the compressed thermoplastic foam particles 5 being fixedly attached to one another the coating 5A also adheres to the surface 5A of the embedded electronic device 3.

[0105] As a result, a robust part in terms of the shaped-body device 1 is obtained, wherein the electronic device 3 can be chosen according to the intended use of the part 1 . The part or device 1 is a shaped piece according to a predetermined form or geometry and combines the mechanical properties of the chosen bulk material 4 and the technical functions of the employed chip or embedded electronic device. The part 1 is an integral part externally appearing as a shaped body.

[0106] For example, PU-coated TPE-beads can be used as (compressed) thermoplastic foam particles, and an NFC chip as embedded electronic device. One may also embed a plurality of chips, thereby combining several functions of electronic devices and / or circuits. Various applications can be contemplated, e.g: labeling the integral part with an "internal data sheet" through the NFC chip; attaching digital certificates certifying the part with respect to material properties or certified uses of the part in safety-regulated systems; tracking a production, use or movement history of the part; acquiring and providing sensor data to an external device; anti-counterfeiting measures through authenticity data written into the NFC chip at the manufacturer's site; storing security and safety data in an encrypted fashion; storing personal data relating to the user, owner or buyer. The mechanical and geometric properties of a device according to the invention can be determined by choosing appropriate bulk materials and electronics. Fig. 3 shows further embodiments of form-shaped devices with embedded chips wherein the position of the chip in relation to the bulk material is described.

[0107] Fig. 3A shows a device 10 having a completely encapsulated electronic chip 3. The bulk material of the shaped body 2 encloses the embedded chip 3 so that its entire surface is covered by the compressed thermoplastic foam particles (not expressly shown). A cavity 7 in the shaped body 2 is completely filled by the chip 3 and is indicated by a dotted line. The cavity 7 being void of bulk material is always occupied by the chip 3 throughout the production and lifetime of the form-shaped device 10. One cannot remove the chip 3 without altering or destroying the predefined shape of the form-shaped device 10.

[0108] Fig. 3B shows a device 11 having a partially encapsulated electronic chip 3. The shaped body 2 has a cavity 7 and an access opening 8 at an outer surface. The access opening 8 and the cavity 7, which is indicated by a dotted line, are communicatively coupled by a through-hole 9. The cavity 7 being void of bulk material is occupied by the chip 3 throughout the production and lifetime of the form-shaped device 10.

[0109] The cavity 7 in the shaped body 2 is filled by the chip 3 wherein a part of the chip 3 surface is exposed to the outside through the through-hole 9 and the access opening 8. The access opening 8 can be seen as a window which is free from bulk material. This window 8 allows for a direct haptic interaction with the embedded chip 3 or an improved communication if the bulk material attenuates a wireless communication with an external device (not shown). The chip 3 may comprise a plug interface or switches that are accessible through the window 8.

[0110] The through-hole 9 runs, in a normal direction d with respect to the surface of the shaped body 2 at the access opening 7, towards the cavity 7. The through-hole 9 has a cross-sectional extension E2 in a direction perpendicular to the through-hole direction d. If the through-hole 9 is implemented as a cylindrical bore hole the cross-sectional extension E2 corresponds to a diameter of the bore hole.

[0111] The cavity 7 has another cross-sectional extension E1 which is larger than the cross-sectional extension E2 of the through-hole 9. Along the through-hole 9 in the through-hole direction d, an undercut occurs at the boundary with the cavity 7. Thus, one cannot remove the chip 3 through the through-hole 9 and the access opening 8. One may interpret the cross-sectional extension the maximum distance between any two points on the contour of the hole in the respective cross-sectional plane, e.g. a circumference. Alternatively, one may interpret the cross-sectional extension as the surface area of the hole, void, cavity, opening or window in the respective cross-sectional plane.

[0112] As in the embodiment of Fig. 3A one cannot remove the chip 3 without altering or destroying the predefined shape of the form-shaped device 10.

[0113] Fig. 4 shows a system 100 comprising a form-shaped device 1 , e.g. implemented as any one of the before-described embodiments, and an external device 12. The embedded electronic device 3 and the external device 12 are configured to communicate with each other through a wireless link 13. Hence, a wireless data exchange may occur.

[0114] For example, the embedded electronic device 3 comprises an acceleration sensor, a position tracking device, a memory and an NFC chip, and the form shaped device is a show sole. The external device 12 is a smart device, e.g. a smart phone, having an NFC interface and executing an application or computer program. PU-coated TPE-beads can be used as (compressed) thermoplastic foam particles to obtain the specific shape of a shoe sole having desired mechanical properties regarding rigidity, weight, compressibility, color etc. The smart phone 12 runs a fitness app, and the sole acts as a fitness tracker in the sole of training shoes.

[0115] One may contemplate of other applications and configurations of the form-shaped device 1 and the external device 12, as indicated above.

[0116] Embodiments of production methods for a shaped body with embedded electronic devices Fig. 5 and 6 illustrate a production method for the form-shaped device according to embodiments. In the production of the device a thermo-pressing process is deployed.

[0117] In an optional preparatory step SO coated thermoplastic foam particles or beads are produced or prepared. Examples for the preparation of coated thermoplastic particles are depicted further below. Next, the coated thermoplastic particles are provided, e.g. as a bulk solid material in bags in step S1. In an alternative production method, non-coated thermoplastic particles and an optional adhesive material are provided in a step S1*. At the same time, in step S2 the electronic device to be embedded (a chip 3') is provided. Fig. 6A illustrates steps S1 and S2, wherein thermoplastic foam particles 5' having an optional coating are shown in their "normal" or relaxed state after preparation of the same. The thermoplastic foam particles 5' are loose and have bulk-good material characteristics and have a first specific mass per volume.

[0118] The steps S3, S4 and S5 implement a thermo-pressing process in order to obtain a formshaped device having a predetermined / predefined design. To this end, a mold 14 is provided (Fig. 6B), and in step S3 the thermoplastic foam particles 5' and the chip 3' are placed in the mold 14. The shape of the mold 14 corresponds to the shape of the predefined design and is filled with the particles 5'. The thermoplastic foam particles 5' form a (packed) particle bed within the lower part of the mold 14. The chip 3' is surrounded by the thermoplastic foam particles 5' in the mold 14 and an upper part of the mold 15 acting as a punch or stamp is implemented to compact the particle bed.

[0119] In embodiments, the lower part of the mold 14 is first half filled with thermoplastic foam particles 5', then the electronic device 3' is placed on the formed packed bed of thermoplastic foam particles 5', and as a final sub-step of placing the thermoplastic foam particles 5' and the electronic device 3' in the mold, the electronic device 3' is covered with further thermoplastic foam particles 5' so that a packed bed of thermoplastic foam particles 5' with the electronic device 3' being embedded and surrounded by uncompressed thermoplastic foam particles 5' occurs.

[0120] One may use a position device (not shown) to place the electronic device 3' in an empty mold at a predetermined position. The positioning device is a structural support for the electronic device 3'. The positioning device preferably does not prevent the thermoplastic foam particles from surrounding and / or attaching to the surfaces of the electronic device 3' when they are poured into the lower part of the mold 14. The positioning device can be a frame with legs, a scaffold, comprise a grid, wires etc. It can be fixed to the electronic device, e.g. acting as one or more legs or a pillar to support the electronic device within the mold at a predetermined height. During filling or placing the particles into the mold the device rests on the position device. The positioning device remains in the final product, i.e. the form-shaped device 1.

[0121] In order to obtain a compact and rigid body having the desired form, pressure and heat is applied to the filling of the mold 14 in step S4. A punch 15 closes the mold 14 and compresses the filling (the thermoplastic foam particles 5' and the embedded electronic device 3') illustrated in Fig. 6C. A heating (not shown) provides a temperature high enough to have the coatings of the thermoplastic foam particles 5' soften and / or melt. Alternatively, the surface of the bare thermoplastic foam particles 5' and / or the added adhesive soften. At the same time, the volume of the interior of the mold 15 is reduced thereby pressing the thermoplastic particles 5 and the chip 3 together. For example, the volume occupied by the initial packed particles bed is reduced to one half of its initial volume. As a result, the mass density of the form-shaped device 1 will be larger than the mass density of the raw thermoplastic foam particles 5' and, in particular, of the packed bed in the mold, for example by a factor of 1.5 to 3.

[0122] In some embodiments, the foamed particles 5' placed into the mold 14 may undergo a certain post-expansion during the thermo pressing T in response to the application of thermal energy.

[0123] Finally, in step S5 the mold is cooled down below the melting point of the coating material of the thermoplastic foam particles 5 (or the bulk material of the thermoplastic foam particles 5 and / or the adhesion material). The respective material resolidifies and leads to a stable attachment between the particles pressed together between the particles and the chip surfaces. As a result, the bulk material of the obtained shaped body has a higher specific mass per volume than the filling prior to step S4. The thermoplastic foam particles 5 may be considered fused to one another in the form-shaped body 2.

[0124] The form-shaped device 1 is then removed from the mold and can be used according to its intended purpose.

[0125] Due to the properties of the (coated) thermoplastic foam particles, the temperature can be kept below a critical temperature thereby not negatively affecting the chip in the mold during the thermo-pressing. Investigations of the applicant show that temperatures below 140 °C may be sufficient to produce a sufficiently rigid form-shaped device with an embedded chip, as is disclosed here-below in terms of examples.

[0126] In an alternative embodiment, the thermoplastic particles are pressure loaded prior to or during the thermo pressing process T. Preparing the thermoplastic elastomer particle foam molded / shaped body may then comprise the steps of:

[0127] (i) filling foamed thermoplastic particles 5' into a pressure vessel (not expressly shown in the drawings);

[0128] (ii) loading the foamed particles 5' with a pressurized gas in the range of from 1.1 to 14 bar;

[0129] (iii) conveying the pressure-loaded foamed thermoplastic particles 5' and the electronic device 3' into the mold 14 (step S4);

[0130] (iv) fusing the pressure-loaded foamed thermoplastic particles by supplying energy through electromagnetic radiation or convection heat (step S4). Loading the foamed particles with a pressurized gas in step (ii) refers to an overpressure treatment, at which the thermoplastic foamed particles 5' are exposed to a pressure of 1.1 to 14 bar, preferably 1.5 to 8 bar. The duration of the overpressure treatment can be, for example, 20 min to 50 hours, preferably 0.5 hours to 24 hours and more preferably 1 to 8 hours at the afore-mentioned final overpressure. The overpressure treatment is carried out until the thermoplastic foam particles 5' are saturated with the pressurized gas. The loading time which is needed to reach the saturation can be determined with a magnetic suspension balance. The gas is air, for example.

[0131] As a result, a shaped body with an embedded electronic device is obtained through a dry, steam less thermo pressing process that does not require irradiation of microwaves.

[0132] Preparation of dispersions for coating

[0133] Example 1 , Dispersion 1

[0134] 676 g of a polyesterdiol with an OH number of 45 (based on adipic acid and 1 ,4 butanediol) were reacted with 0,11 g titaniumtetrabutylate, 40 g isophorone diisocyanate (IPDI), 0.77 g N CO-terminated polycarbodiimid (Elastostab H02, BASF) at 60°C in 153 g dry acetone for 60 min. Then, 37.8 g 1 ,6-hexane diisocyanate (HDI) was added and the temperature raised to 74°C. The reaction is continued until the NCO-value is lower than 1 .25%. The mixture was diluted with 539 g acetone and cooled to 35-40°C. Then 22.4 g of aminoethyl ami- noethansulfonate sodium salt (50% in water) diluted with 22 g demineralized water was added within a period of 3 min, followed by 4.6 g isophorone diamine diluted in 23 g demineralized water also added within a period of 3 min. Before dispergation, 38.7 g of a 20% aqueous solution of alkyl polyethylene glycol ether made from a linear, saturated C16C18 fatty alcohol with 18 moles of ethylene oxide, 20% active (e.g., Lutensol AT18 from BASF) was added. In the next step, the dispergation of the produced compound with 463 g demineralized water was carried out by using an anchor stirrer over a period of 15 min. Immediately after the water feed, additionally 4 g of N-(2- aminoethyl)-ethanolamine solved in 30 g water was added during the dispergation. During dispergation an additional amount of 200 g demineralized water was added Water.

[0135] After the dispergation step, the acetone was removed by vacuum distillation with the help of two drops of defoamer (FoamStar PB 2724, BASF) and the solids content of the obtained semicrystalline dispersion adjusted to 50 wt%. The properties of the obtained dispersion are shown in Table 1. Viscosity is measured according to DIN EN ISO 3219-2:2021 (at 23°C and a shear rate of 250 s’ 1

[0136] The dispersions are dried in a mold at 40°C for 3 days and then at 23°C for 7 days. Thermal properties are measured by differential scanning calorimetry.

[0137] Glass-transition temperature (as the midpoint temperature of the second heating curve at a heating rate of 20 K / min), melting-points and enthalpy of fusion are determined according to DIN ISO 11357 (2018) (melting point = peak temperature) by heating with 20 K / min after cooling to -80°C; while enthalpy of fusion of the second run (Delta H2) is calculated from the area of second melting only; a) from a film at its untreated state (drying see above) -> Tm1 , Delta H1 b) after heating the polyurethane films to 130 °C, cooling with 20 K / min to -80°C; reheating with 20k / min-> Tm2 delta H2

[0138] The K-value was determined according to DIN EN ISO 1628-1 :2021

[0139] Table 1 :

[0140] Example 2, Dispersion 2

[0141] 1039 g of a polyesterdiol from Adipic acid and Isophthalic acid (molar ratio of 1 :1) and 1 ,6 g Hexanediol (molecular weight 2000 g / mol), 104,6 g of Dimethylolpropionic acid (DMPA) 186.8 g Butanediol-1 ,4 were reacted with 900 g isophorone diisocyanate (IPDI) in 530 g dry acetone in a pressurized reactor; starting at 50°C, increasing the temperature in 30 min to 90°C, then as 90°C is reached keeping the temperature constant for 8 h at 2.9 bar. After that, the obtained mixture was diluted with 1852 g acetone, cooled to 40°C and expanded to atmospheric pressure. The NCO-value was determined to 1.2%. Then 10.2 g of Isophoronediamine were added in a shot, followed by adding 81 g Diethylethanolamine (neutralization agent) within a period of 5 min. After 5 min stirring, the dispersion step was continued by adding 3567 g deionized water within a period of 37 min at 30°C, followed by an addition of 19.8 Diethylenetriamine diluted in 340 g deionized water within a period of 30 min. After that, the acetone was removed by vacuum distillation with the help of 0.23 g of defoamer (FoamStar PB 2724, BASF), resulting in Dispersion 2 with a solids content of 37.4%.

[0142] The properties of the obtained dispersion 2 are shown in Table 2.

[0143] Viscosity is measured according to DIN EN ISO 3219-2:2021 (at 23°C and a shear rate of 250 s’ 1

[0144] The dispersions are dried in a mold at 40°C for 3 days and then at 23°C for 7 days. Thermal properties are measured by differential scanning calorimetry.

[0145] Glass-transition temperature (as the midpoint temperature of the second heating curve at a heating rate of 20 K / min), melting-points and enthalpy of fusion are determined according to DIN ISO 11357 (2018) (melting point = peak temperature) by heating with 20 K / min after cooling to -80°C; while enthalpy of fusion of the second run (Delta H2) is calculated from the area of second melting only; a) from a film at its untreated state (drying see above) -> Tm1 , Delta H1 b) after heating the polyurethane films to 130 °C, cooling with 20 K / min to -80°C; reheating with 20k / min-> Tm2 delta H2

[0146] The K-value was determined according to DIN EN ISO 1628-1 :2021

[0147] Table 2

[0148] Example 3. Coating of e-ETPU single beads

[0149] 2W / W% of the polyurethane dispersion described in example Ex 1 and 8w / w% of the dispersion described in example Ex, 2 were mixed was mixed with E-TPLI beads (particles), made according to example 1 of WO 2013 / 153190 A1 having a bulk density 130 g / l and a particle weight of 27 mg with a Vollrath dissolver for 60 second at room temperature. Later the beads were let drying at RT on a Teflon foil, keeping attention to isolate them from each other. After a time of around 10 minutes the beads were collected. The coated beads are non-sticky, storage stable and can be collected without agglomeration.

[0150] Example 4 30g g of coated beads according to experiment 3 were placed in a preheated mold of dimension ((16.3x9.6x3.3) cm3(length, bright, depth), which was previously sprayed with a silicone-based release agent (Indrosil 2000) and preheated at a temperature of 120C. An NFC device "NFC Tag Sticker 888 Bytes" available from mmtrade on www.amazon.de was manually placed on top of the coated beads, afterwards further 35 g of coated beads according to experiment 3 were placed on top of the device, thus the mold was completely filed. The filled mold was covered with a mold lid (also sprayed with Indrosil 2000), which allows a compression / compactac- tion of 50%.

[0151] The beads were hot press for five minutes, afterward the mold was actively cooled with water for five minutes and demolded at a temperature of 40C.

[0152] In order to examine the functioning of the embedded NFC chip in the form-shaped part, a smart phone running the Android "NFC tools" app by wakdek, version 8.9, available from Google Play store at time of filing this application was deployed. Read and write processes from and to the NFC chip were faultless. Hence, the NFC chip subjected to the process parameters of the thermo-pressing remained undamaged and functioning.

[0153] Example 5:

[0154] The same hardware setup as in Example 4 and the same coated E-TPLI beads were used and the same molding procedure was repeated However, a more intense temperature was exercised. The mold of the heating press was preheated to 140 °C, the filling was compressed by 50 % in volume for 10 minutes at 140 °C. After cooling with cold water for five minutes, the molded form-shaped part was removed from the mold and tested.

[0155] In order to examine the functioning of the embedded NFC chip in the form-shaped part, a smart phone running the Android "NFC tools" app by wakdek, version 8.9, available from Google Play store at time of filing this application was deployed. Read and write processes from and to the NFC chip were examined and proved to be faultless. Hence, the NFC chip subjected to the process parameters of the thermo-pressing remained undamaged and functioning.

[0156] The mechanical properties of the two molded form-shaped parts were further examined. The results are shown in the below Table 3.

[0157] Table 3:

[0158]

[0159] The compression hardness was measured according to DIN ISO 3386.

[0160] The rebound according to DIN 53512: 2000-4. The form-shaped PUR foam plates with embedded NFC functionality show excellent mechanical properties.

[0161] Although the present invention is explained in terms of specific embodiments, one may contemplate of modifications. For example, one may contemplate of alternative mechanisms to have compressed particles stick to each other, e.g. by chemical reactions between coatings, adhesion materials or the outer shell materials of the particles. The potential coating may be applied to the beads of thermoplastic foam by alternative coating processes instead of applying a dispersion. In particular, the invention is not limited to the use of coated thermoplastic particles. Single aspects of the shapes, electronics and applications in the various embodiments shown can be combined and replaced. Reference signs:

[0162] 1 , 10, 11 device

[0163] 2 shaped body

[0164] 3 embedded electronic device

[0165] 3' electronic device to be embedded

[0166] 3A device surface

[0167] 4 bulk material

[0168] 5 compressed thermoplastic foam particles

[0169] 5' coated thermoplastic foam particles

[0170] 5A particle core

[0171] 5B coating

[0172] 6 shape of shaped body

[0173] 7 cavity in shaped body

[0174] 8 access opening

[0175] 9 through-hole

[0176] 12 external device

[0177] 13 wireless link

[0178] 14 mold

[0179] 15 punch

[0180] 100 system d through-hole direction

[0181] E1 extension of cavity

[0182] E2 extension of through-hole

[0183] 50 producing coated thermoplastic foam particles

[0184] 51 providing thermoplastic foam particles having a coating comprising a coating material

[0185] S1* providing thermoplastic foam particles and adhesion material

[0186] 52 providing an electronic device

[0187] 53 placing the thermoplastic foam particles and the electronic device in a mold

[0188] 54 compressing and heating the thermoplastic foam particles and the electronic device in the mold for shaping a shaped body

[0189] 55 cooling the mold and / or the shaped body

[0190] T thermo-pressing process

Claims

Claims1 . A device (1) comprising: at least one embedded electronic device (3); and a shaped body (2) comprising a bulk material (4) made of at least partially compressed thermoplastic foam particles (5), the compressed thermoplastic foam particles (5) being attached to each other, wherein the shaped body (2) is obtained in a thermo-pressing process applied to expanded thermoplastic foam particles (5); wherein the embedded electronic device (3) is at least partially encapsulated by the bulk material (4).

2. The device (1) of claim 1 , wherein the shaped body (2) is obtained in a steam less thermo-pressing process.

3. The device of claim 1 or 2, wherein the at least partially compressed thermoplastic foam particles (5) have a coating (5B) comprising a coating material, and the compressed thermoplastic foam particles (5) are attached to each other by the coating material.

4. The device of claim 3, wherein the coating (5B) is obtained from a coating material dispersed in a fluid, in particular, wherein the coating material is obtained from a polyurethane dispersion comprising polyurethane particles dispersed in a water solution.

5. The device of any one of claims 1 - 4, wherein the at least partially compressed thermoplastic foam particles (5) are attached to each other by an adhesion material.

6. The device of any one of claims 1 - 5, wherein the shaped body (2) is a molded body, the compressed thermoplastic foam particles (5) being attached to each other by re-solidified bulk material, coating material and / or adhesion material.

7. The device of any one of claims 1 - 6, wherein the embedded electronic device (3) is completely encapsulated by the bulk material (4); or the shaped body (2) comprises a cavity (7) for receiving the embedded electronic device (3), wherein the shaped body (2) has an access opening (8) and a through-hole (9) in a through-hole direction (d), the through-hole (9) being communicatively coupled to the cavity (7), and wherein a cross-sectional extension (E1) of the cavity in a direction perpendicular to the through-hole direction (d) is larger than an extension (E2) of the through-hole (9) in the same direction.

8. The device of any one of claims 1 - 7, wherein the compressed thermoplastic foam particles (5) are directly attached to a surface (3A) of the embedded electronic device (3), in particular, the bulk, coating and / or adhesion material being resolidified and adhering to the surface (3A).

9. The device of any one of claims 1 - 8, wherein a softening point of the bulk, coating and / or adhesion material is less than 160°C.

10. The device of any one of claims 1 - 9, wherein the embedded electronic device (3) comprises at least any one of: a battery, a transmitter, an antenna, a tracking device, a receiver, a processing device, a memory, a sensor device, a nearfield communication (NFC) tag, a localization device; and / or the bulk material (4) and / or the shaped body (2) is implemented to be comprised in one of a shoe sole, a tire, a floor or wall covering mat, a play ball, a structural element or part to mechanically support an object, packaging material.11 . The device of any one of claims 1 - 10, wherein the compressed thermoplastic foam particles (5) are semitransparent, and a bulk material between the surface of the electronic device (3) and an outer surface has a transmittance of at least 20% at a wavelength of 500 nm.

12. The device of any one of claims 1 - 11 , wherein the expanded thermoplastic foam particles (5) are particles made of expanded thermoplastic polyurethane.

13. The device of any one of claims 1 - 12, wherein the compressed thermoplastic foam particles (5) are particles of a moldable thermoplastic particle foam according to claims 1 - 14 of European patent application no. EP23182180.2 or claims 1 - 13 of international patent application no. PCT / EP2024 / 083787 treated by a thermo-pressing process.

14. The device of any one of claims 1 - 13, wherein the embedded electronic device (3) comprises a memory containing data indicative of a property of the bulk material.

15. The device of any one of claims 1 - 14, wherein the embedded electronic device (3) comprises a memory containing data indicative of at least one of: a property of the embedded electronic device, a property of the device.

16. The device of any one of claims 1 - 15, wherein the embedded electronic device (3) comprises a sensor device implemented to capture data indicative of the manufacturing process and / or the use of the device.

17. A System (100) comprising a device (1) of any one of claims 1 - 16, wherein the embedded electronic device (3) is implemented to perform a wireless communication (13) with an external device (12); and an external device (12) implemented to perform a wireless communication (13) with the embedded electronic device (3).

18. The system of claim 17, wherein the embedded electronic device (3) is communicatively coupled through a wireless link, radio frequency, visible light and / or infrared light with the external device (12).

19. A method for manufacturing a device of any one of claims 1 - 16, wherein an electronic device (3') and expanded thermoplastic foam particles (5') are shaped into a predetermined shape (6) through a thermo-pressing process (T), the electronic device (3) being at least partially encapsulated by the thermoplastic foam particles (5') during the thermo-pressing process (T).

20. The method of claim 19, wherein the thermo-pressing process (T), is a steam less thermopressing process.

21. The method of claim 19 or 20, wherein at least one of the following steps is carried out: producing (SO) expanded thermoplastic foam particles (5') having a coating (5B) comprising a coating material; providing (S1) expanded thermoplastic foam particles (5') having a coating (5B) comprising a coating material; providing (S1*) expanded thermoplastic foam particles (5*) and an adhesion material; providing (S2) an electronic device (3'); placing (S3) the expanded thermoplastic foam particles (5) and the electronic device (3') in a mold; heating (S4) the expanded thermoplastic foam particles (5) and the electronic device (3') in the mold for shaping a shaped body; compressing (S4) the expanded thermoplastic foam particles (5) and the electronic device (3') in the mold for shaping a shaped body; cooling (S5) the mold and / or the shaped body; retrieving the device (1) from the mold.

22. The method of any one of claims 19 - 21 , further comprising pressure loading the expanded thermoplastic foam particles (5).

23. The method of any one of claims 19 - 22, further comprising the steps of: generating device process data indicative of process parameters relating to the method for manufacturing and / or generating device data indicative of parameters relating to the embedded electronic device and / or the bulk material; and storing the device process data and / or the device data in a memory comprised in the embedded electronic device (3).

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