Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor

Abstract

A solid electrolytic capacitor (10) comprises: a capacitor element (20) that has an anode body (21) having a first lower surface (21a), an anode wire (22) a portion of which is embedded in the anode body (21) and the remainder protrudes from the first lower surface (21a), a dielectric layer (23) formed on a surface of the anode body (21), a solid electrolyte layer (24) covering at least a portion of the dielectric layer (23), and a cathode layer (25) covering at least a portion of the solid electrolyte layer (24) and having a second lower surface (25a); an exterior resin (31) that covers at least a portion of the capacitor element (20); an anode terminal (40) that has a first metal layer (41) connected to a protrusion end surface (22c) of the anode wire (22) and has a second metal layer (42) connected to the first metal layer (41), and that is exposed from the exterior resin (31); and a cathode terminal (50) that has a third metal layer (51) connected to the second lower surface (25a) and has a fourth metal layer (52) connected to the third metal layer (51), and that is exposed from the exterior resin (31).

Description

Solid electrolytic capacitor and method for manufacturing the same CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This disclosure claims the benefit of priority to Japanese Patent Application No. 2024-100797, filed June 21, 2024, in the Japan Patent Office, the entire contents of which are incorporated herein by reference. In addition, all references cited in this disclosure are specifically incorporated by reference in their entirety.

[0002] The present disclosure relates to a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor.

[0003] Conventionally, a solid electrolytic capacitor including a porous anode body and an anode wire partially embedded in the anode body has been known (for example, Patent Document 1). Patent Document 1 discloses "a chip capacitor including a capacitor element including an anode lead wire, on which a dielectric oxide film, a solid electrolyte layer, and a cathode lead layer are sequentially formed, and then the capacitor element is covered with a resin exterior and a terminal electrode is formed on the exterior surface, wherein the anode lead wire and the anode terminal electrode are electrically connected, and the cathode lead layer located on approximately the same plane as the surface from which the anode lead wire is led out is connected to the cathode terminal electrode."

[0004] Japanese Patent Application Laid-Open No. 2002-25860

[0005] In recent years, as electronic devices incorporating solid electrolytic capacitors have become smaller and faster, there has been a demand for lower impedance solid electrolytic capacitors, more specifically, for reduced equivalent series resistance (ESR) and equivalent series inductance (ESL) of solid electrolytic capacitors. In this situation, one of the objectives of the present disclosure is to reduce the ESR and ESL of solid electrolytic capacitors.

[0006] One aspect of the present disclosure relates to a solid electrolytic capacitor, the solid electrolytic capacitor including at least one capacitor element including: a porous anode body having a first lower surface; at least one anode wire partially embedded in the anode body and partially protruding from the first lower surface; a dielectric layer formed on a surface of the anode body; a solid electrolyte layer covering at least a portion of the dielectric layer; and a cathode layer covering at least a portion of the solid electrolyte layer and having a second lower surface; an exterior resin covering at least a portion of the capacitor element; at least one anode terminal including a first metal layer connected to an end surface of the anode wire and a second metal layer connected to the first metal layer and exposed from the exterior resin; and at least one cathode terminal including a third metal layer connected to the second lower surface and a fourth metal layer connected to the third metal layer and exposed from the exterior resin.

[0007] Another aspect of the present disclosure relates to a method for manufacturing a solid electrolytic capacitor, the method comprising the steps of: a first step of preparing an adhesive carrier having an adhesive layer on a support substrate; a second step of disposing the capacitor element on the adhesive carrier; a third step of forming an exterior resin on the adhesive carrier so as to cover at least a portion of the capacitor element; a fourth step of peeling the adhesive carrier to expose the tip end face of the anode wire and the second lower surface of the cathode layer of the capacitor element from the surface of the exterior resin; a fifth step of forming a dry-plated layer using a dry plating method, the dry-plated layer including portions corresponding to the first metal layer and the third metal layer; a sixth step of forming a wet-plated layer using a wet plating method, the wet-plated layer including portions corresponding to the second metal layer and the fourth metal layer; and a seventh step of patterning the dry-plated layer and the wet-plated layer to form the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer.

[0008] According to the present disclosure, the ESR and ESL of a solid electrolytic capacitor can be reduced.

[0009] 1A and 1B are diagrams schematically illustrating a solid electrolytic capacitor according to a first embodiment, where (a) is a front cross-sectional view, and (b) is a side cross-sectional view taken along line II.

[0023] Figures are diagrams for explaining a method for manufacturing the solid electrolytic capacitor according to the first embodiment, where (a) shows a first step, (b) shows a second step, and (c) shows a third step.

[0024] Figures are diagrams for explaining a method for manufacturing the solid electrolytic capacitor according to the first embodiment, where (a) shows a fourth step, (b) shows a fifth step, and (c) shows a sixth step.

[0025] Figures are diagrams for explaining a method for manufacturing the solid electrolytic capacitor according to the first embodiment, where (a) shows a seventh step, and (b) shows an eleventh step. A front cross-sectional view schematically illustrating a solid electrolytic capacitor according to a first modification of the first embodiment. A side cross-sectional view schematically illustrating a solid electrolytic capacitor according to a second modification of the first embodiment. A side cross-sectional view schematically illustrating a solid electrolytic capacitor according to a third modification of the first embodiment. A side cross-sectional view schematically illustrating a solid electrolytic capacitor according to the second embodiment. A front cross-sectional view schematically illustrating a solid electrolytic capacitor according to a third embodiment. 1 is a front cross-sectional view schematically showing a solid electrolytic capacitor of Embodiment 4; FIG. 2 is a front cross-sectional view schematically showing a solid electrolytic capacitor of a modified example of Embodiment 4; FIG. 3 is a front cross-sectional view schematically showing a solid electrolytic capacitor of Embodiment 5; FIG. 4 is a front cross-sectional view schematically showing a solid electrolytic capacitor of a modified example of Embodiment 5; FIG. 5 is a view for explaining a method for manufacturing a solid electrolytic capacitor of a modified example of Embodiment 5, where (a) shows the twelfth step, (b) shows the thirteenth step, and (c) shows the fourteenth step. FIG. 6 is a view for explaining a method for manufacturing a solid electrolytic capacitor of a modified example of Embodiment 5, where (a) shows the fifteenth step, (b) shows the eighth step, and (c) shows subsequent steps until completion. FIG. 7 is a front cross-sectional view schematically showing a solid electrolytic capacitor of Embodiment 6; FIG. 8 is a front cross-sectional view schematically showing a solid electrolytic capacitor of Embodiment 7; FIG. 9 is a front cross-sectional view schematically showing a solid electrolytic capacitor of Embodiment 8; FIG. 10 is a view for explaining a method for manufacturing a solid electrolytic capacitor of Embodiment 8, where (a) shows the fourth step, (b) shows the tenth step, and (c) shows the fifth and sixth steps. 13A and 13B are diagrams for explaining the method for manufacturing the solid electrolytic capacitor of the eighth embodiment, in which FIG. 13A shows the seventh step and FIG. 13B shows the eleventh step.

[0010] The novel features of the present invention are set forth in the appended claims, but the present invention, both in terms of structure and content, together with other objects and features of the present invention, will be better understood from the following detailed description taken in conjunction with the drawings.

[0011] The following describes examples of embodiments of a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor according to the present disclosure. However, the present disclosure is not limited to the examples described below. While specific numerical values ​​and materials are used in the following description, other numerical values ​​and materials may be used as long as the effects of the present disclosure are obtained. Note that the following description will be given assuming that the mounting surface of the solid electrolytic capacitor is the lower side.

[0012] (Solid Electrolytic Capacitor) A solid electrolytic capacitor according to the present disclosure includes at least one capacitor element, an exterior resin, at least one anode terminal, and at least one cathode terminal, the at least one anode terminal and the at least one cathode terminal being electrically insulated from each other.

[0013] At least one capacitor element includes an anode body, at least one anode wire, a dielectric layer, a solid electrolyte layer, and a cathode layer.

[0014] The anode body is a porous anode body having a first lower surface. The anode body is, for example, a porous sintered body having a generally rectangular parallelepiped shape obtained by sintering metal particles. The generally rectangular parallelepiped shape of the anode body means a shape having three pairs (i.e., six) of opposing main surfaces (i.e., six main surfaces including the first lower surface). One of the six main surfaces is the first lower surface, and the second lower surface and the pointed end surface (described later) face in the same direction as the first lower surface. Adjacent main surfaces may intersect with each other at an angle of 80° or more and 100° or less. The metal particles may be particles of a valve metal such as tantalum, titanium, or niobium. One type of metal particle may be used alone, or two or more types may be used in combination. The metal particles may also be an alloy of two or more metals. For example, an alloy containing a valve metal and silicon, vanadium, boron, or the like may be used. A compound containing a valve metal and a typical element such as nitrogen may also be used. The valve metal alloy contains a valve metal as a main component, for example, 50 atomic % or more of the valve metal.

[0015] At least one anode wire is partially embedded in the anode body and the remainder protrudes from the first lower surface of the anode body. The shape of the anode wire is not particularly limited and may be, for example, columnar or plate-shaped. The material of the anode wire is also not particularly limited and, in addition to the valve metals mentioned above, examples include copper, aluminum, and aluminum alloys. The anode body and the anode wire may be made of the same material or different materials. The anode wire has an embedded portion embedded in the anode body and a protruding portion protruding from the anode body.

[0016] The dielectric layer is a layer formed on the surface of the anode body. The dielectric layer is made of, for example, a metal oxide. Examples of methods for forming a layer containing a metal oxide on the surface of the anode body include a method of anodizing the surface of the anode body by immersing the anode body in a chemical conversion solution, a gas phase method such as an ALD method (Atomic Layer Deposition method), and a method of heating the anode body in an oxygen-containing atmosphere. The dielectric layer is not limited to a layer containing a metal oxide, and may be any layer having insulating properties.

[0017] The solid electrolyte layer is a layer that covers at least a portion of the dielectric layer. For example, a manganese compound or a conductive polymer is used. Examples of conductive polymers include polypyrrole, polythiophene, polyfuran, polyaniline, polyacetylene, polyphenylene, polyparaphenylene vinylene, polyacene, polythiophene vinylene, polyfluorene, polyvinyl carbazole, polyvinyl phenol, polypyridine, or derivatives of these polymers. These may be used alone or in combination. The conductive polymer may also be a copolymer of two or more monomers. Among these, polythiophene, polyaniline, polypyrrole, etc. are preferred because of their excellent conductivity. Among these, polypyrrole is preferred because of its excellent water repellency.

[0018] The solid electrolyte layer containing the conductive polymer is formed, for example, by polymerizing a raw material monomer on a dielectric layer or by applying a liquid containing the conductive polymer to the dielectric layer. The solid electrolyte layer is composed of one or more solid electrolyte layers. When the solid electrolyte layer is composed of two or more solid electrolyte layers, the composition and formation method (polymerization method) of the conductive polymer used in each layer may be different.

[0019] In this specification, polypyrrole, polythiophene, polyfuran, polyaniline, etc. refer to polymers having polypyrrole, polythiophene, polyfuran, polyaniline, etc. as their basic skeletons, respectively. Therefore, polypyrrole, polythiophene, polyfuran, polyaniline, etc. may also include their respective derivatives. For example, polythiophene includes poly(3,4-ethylenedioxythiophene).

[0020] Various dopants may be added to the polymerization liquid for forming the conductive polymer, or the solution or dispersion of the conductive polymer in order to improve the conductivity of the conductive polymer. The dopant is not particularly limited, but examples thereof include 1,5-naphthalenedisulfonic acid, 1,6-naphthalenedisulfonic acid, 1-octane sulfonic acid, 1-naphthalenesulfonic acid, 2-naphthalenesulfonic acid, 2,6-naphthalenedisulfonic acid, 2,7-naphthalenedisulfonic acid, 2-methyl-5-isopropylbenzenesulfonic acid, 4-octylbenzenesulfonic acid, 4-nitrotoluene-2-sulfonic acid, m-nitrobenzenesulfonic acid, n-octyl sulfonic acid, n-butanesulfonic acid, n-hexanesulfonic acid, o-nitrobenzenesulfonic acid, p-ethylbenzenesulfonic acid, trifluoromethanesulfonic acid, hydroxybenzenesulfonic acid, butylnaphthalenesulfonic acid, benzenesulfonic acid, polystyrenesulfonic acid, polyvinylsulfonic acid, methanesulfonic acid, and derivatives thereof. Examples of the derivatives include metal salts such as lithium salts, potassium salts, and sodium salts; ammonium salts such as methylammonium salts, dimethylammonium salts, and trimethylammonium salts; piperidium salts, pyrrolidium salts, and pyrrolinium salts.

[0021] The cathode layer is a layer covering at least a portion of the solid electrolyte layer and has a second lower surface. This second lower surface is also the lower surface of the capacitor element. The cathode layer may have a carbon layer formed on the solid electrolyte layer and a metal paste layer (e.g., a silver paste layer) formed on the carbon layer. The carbon layer is formed so as to cover at least a portion of the solid electrolyte layer. The carbon layer is made of a composition including a conductive carbon material such as graphite. The metal paste layer is made of a composition including, for example, silver particles and a resin. The configuration of the cathode layer is not limited to this, and may be any configuration that has a current collecting function.

[0022] The thickness of the cathode layer may be, for example, 1 μm or more and 100 μm or less. When the cathode layer includes a carbon layer and a metal paste layer, the thickness of the carbon layer may be, for example, 0.1 μm or more and 50 μm or less, and the thickness of the metal paste layer may be, for example, 1 μm or more and 50 μm or less. By providing such a very thin cathode layer, the ESR of the solid electrolytic capacitor can be effectively reduced.

[0023] The exterior resin covers at least a portion of the capacitor element. For example, at least a portion of the lower surface of the capacitor element (or the second lower surface of the cathode layer) may not be covered with the exterior resin. Examples of the exterior resin include epoxy resin, phenolic resin, silicone resin, melamine resin, urea resin, alkyd resin, polyurethane, polyimide, and unsaturated polyester. The exterior resin may contain a substance other than resin (such as an inorganic filler).

[0024] At least one anode terminal has a first metal layer and a second metal layer and is exposed from the exterior resin. The first metal layer is connected to the tip end surface of the anode wire (or the underside of the anode wire). The second metal layer is connected to the first metal layer. That is, the second metal layer is electrically connected to the anode wire of the capacitor element via the first metal layer.

[0025] At least one cathode terminal has a third metal layer and a fourth metal layer and is exposed from the exterior resin. The third metal layer is connected to the second lower surface of the cathode layer (or the lower surface of the capacitor element). The fourth metal layer is connected to the third metal layer. That is, the fourth metal layer is electrically connected to the cathode layer of the capacitor element via the third metal layer.

[0026] In the solid electrolytic capacitor having the above-described configuration, the anode terminal and the cathode terminal each have multiple metal layers and are electrically connected to the capacitor element without using a lead frame, thereby reducing the ESR and ESL of the solid electrolytic capacitor.

[0027] The capacitor element may have a convex portion formed at a connection portion between the cathode layer and the cathode terminal. The convex portion may protrude downward. Here, the lower surface of the convex portion constitutes at least a part of the second lower surface. When such a convex portion is present, the resin material flows into the peripheral area of ​​the convex portion when forming the exterior resin, thereby easily achieving electrical insulation between the anode terminal and the cathode terminal.

[0028] The protrusion length of the protrusions may be 100 μm or more and 2000 μm or less. By setting the protrusion length of the protrusions (i.e., the vertical length from the base end to the tip of the protrusions) within this range, it is possible to easily form an exterior resin around the peripheral region of the protrusions while suppressing an increase in size of the solid electrolytic capacitor.

[0029] The first metal layer and the third metal layer may each be a dry-plated layer. The second metal layer and the fourth metal layer may each be a wet-plated layer. The dry-plated layer is formed by a dry plating method, and the wet-plated layer is formed by a wet plating method. Dry plating methods include vacuum plating (PVD method) and chemical vapor deposition (CVD method). Vacuum plating (PVD method) includes sputtering, vacuum deposition, ion plating, etc. Wet plating methods include electroplating (e.g., electrolytic plating), electroless plating, chemical plating, and hot-dip plating. For example, sputtering may be used as the dry plating method, and electroplating may be used as the wet plating method.

[0030] The dry-plated layer may contain at least one metal material selected from the group consisting of Ti (titanium), Cr (chromium), and Ni (nickel). The wet-plated layer may contain at least one metal material selected from the group consisting of Cu (copper), Ni (nickel), Sn (tin), and Al (aluminum). For example, the dry-plated layer may contain Ti and the wet-plated layer may contain Cu. The dry-plated layer may be formed as a single layer or as multiple layers. For example, a thin Ti layer and a thin Cu layer may be formed by sputtering as the dry-plated layer. More specifically, the thin Ti layer may be formed first, followed by the formation of the thin Cu layer. In this case, a relatively thick wet-plated Cu layer may be formed by electrolytic plating on the sputtered layer of this two-layer structure.

[0031] The thickness of the dry-plated layer may be 100 nm or more and 3000 nm or less. The thickness of the wet-plated layer may be 3 μm or more and 500 μm or less. In this way, the dry-plated layer is very thin, whereas the wet-plated layer can be thick, resulting in the anode terminal and the cathode terminal being thick overall.

[0032] The at least one anode wire may include a plurality of anode wires, in which case the ESR of the solid electrolytic capacitor can be further reduced by increasing the thickness of the conductive path on the anode side.

[0033] The anode wire may be formed in a plate shape, in which case the conductive path on the anode side can be made thicker, thereby further reducing the ESR of the solid electrolytic capacitor.

[0034] The at least one capacitor element may include a plurality of capacitor elements, each having an anode wire connected to the same anode terminal, thereby increasing the total surface area of ​​the capacitor elements and improving the capacitance of the solid electrolytic capacitor.

[0035] The anode wire may have a first portion extending upward from the first lower surface and a second portion extending laterally from an upper end of the first portion. In this case, the anode wire has a curved shape inside the anode body. This can prevent the anode wire from coming out of the anode body. Furthermore, by increasing the volume of the anode wire, which has a relatively low resistivity, the ESR of the solid electrolytic capacitor can be further reduced. The extension direction of the first portion and the extension direction of the second portion may intersect at an angle of, for example, 60° or more and 120° or less, preferably 80° or more and 100° or less.

[0036] The at least one anode terminal may include a first anode terminal and a second anode terminal. The cathode terminal may be disposed between the first anode terminal and the second anode terminal. In this case, a three-terminal solid electrolytic capacitor having two anode terminals can be easily formed.

[0037] The at least one cathode terminal may include a first cathode terminal and a second cathode terminal. The anode terminal may be disposed between the first cathode terminal and the second cathode terminal. In this case, a three-terminal solid electrolytic capacitor having two cathode terminals can be easily formed.

[0038] The at least one capacitor element may include a first capacitor element and a second capacitor element. The at least one anode terminal may include a first anode terminal connected to the anode wire of the first capacitor element and a second anode terminal connected to the anode wire of the second capacitor element. The second lower surface of the cathode layer of the first capacitor element and the second lower surface of the cathode layer of the second capacitor element may be connected to the same cathode terminal. In this case, a three-terminal solid electrolytic capacitor having two anode terminals can be easily formed. Furthermore, the characteristics of the first capacitor element and the second capacitor element can be individually set as needed.

[0039] The at least one capacitor element may include a first capacitor element and a second capacitor element. The at least one cathode terminal may include a first cathode terminal connected to a second lower surface of the cathode layer of the first capacitor element and a second cathode terminal connected to a second lower surface of the cathode layer of the second capacitor element. The anode wire of the first capacitor element and the anode wire of the second capacitor element may be connected to the same anode terminal. In this case, a three-terminal solid electrolytic capacitor having two cathode terminals can be easily formed. Furthermore, the characteristics of the first capacitor element and the second capacitor element can be individually set as needed.

[0040] The capacitor element may have an insulating member disposed between the anode wire and the cathode layer to electrically insulate them. This configuration can prevent internal short circuits from occurring in the solid electrolytic capacitor. The insulating member may be made of a thermosetting resin such as an epoxy resin. The insulating member may be formed by applying a resin composition to the anode wire and curing it, or by fitting a resin ring around the anode wire.

[0041] The first and second metal layers may extend across one side of the exterior resin. The third and fourth metal layers may extend across another side of the exterior resin. With this configuration, when the solid electrolytic capacitor is solder-mounted on a substrate, a solder fillet is likely to be formed on the side, improving the bonding strength between the two. Furthermore, the mounting state can be easily checked, reducing mounting defects and connection failures.

[0042] (Method for manufacturing a solid electrolytic capacitor) The method for manufacturing a solid electrolytic capacitor according to the present disclosure is a method for manufacturing the above-described solid electrolytic capacitor, and includes a first step, a second step, a third step, a fourth step, a fifth step, a sixth step, and a seventh step.

[0043] In the first step, an adhesive carrier having adhesive properties is prepared. For example, the adhesive carrier may be a carrier sheet having a two-layer structure including a support substrate and an adhesive layer provided thereon. The support substrate may be flexible.

[0044] In the second step, the capacitor element is placed on the adhesive carrier, and at this time, the second lower surface of the cathode layer of the capacitor element may be brought into contact with the adhesive carrier, and the tip surface of the anode wire may be brought into contact with the adhesive carrier.

[0045] In the third step, an exterior resin is formed on the adhesive carrier so as to cover at least a portion of the capacitor element, while the second lower surface of the cathode layer of the capacitor element and the tip surface of the anode wire, which are in contact with the adhesive carrier, are not covered by the exterior resin.

[0046] In the fourth step, the adhesive carrier is peeled off to expose the tip end surface of the anode wire and the second lower surface of the cathode layer of the capacitor element from the exterior resin.

[0047] In the fifth step, a dry-plated layer including portions corresponding to the first metal layer and the third metal layer is formed using a dry plating method. The dry-plated layer may be a single layer or may include multiple layers.

[0048] In the sixth step, a wet-plated layer including portions corresponding to the second metal layer and the fourth metal layer is formed by a wet plating method. The wet-plated layer may be formed on the lower surface of the dry-plated layer.

[0049] In the seventh step, the dry-plated layer and the wet-plated layer are patterned to form a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer. The patterning method is not particularly limited. For example, the desired patterning may be achieved by using photolithography, which involves resist formation, exposure and development, and etching.

[0050] The method for manufacturing a solid electrolytic capacitor may further include an eighth step of cutting the anode wire so that the tip surface and the second lower surface are at the same height before the second step. The method for cutting the anode wire is not particularly limited, and may be, for example, press shearing, wire cutting using air nippers, or laser processing.

[0051] The method for manufacturing a solid electrolytic capacitor may further include a ninth step of forming a sealing resin to cover at least a portion of the exterior resin (particularly, a portion of the surface that was previously covered with the adhesive carrier). The type of sealing resin is not particularly limited, and may be, for example, a fluorine-containing resin. The sealing resin may cover at least a portion of the lower surface of the exterior resin.

[0052] The method for manufacturing a solid electrolytic capacitor may further include a tenth step between steps 4 and 5, in which portions of the exterior resin on both sides of the capacitor element are removed. By performing step 10, it is possible to form a dry plating layer on the portions corresponding to both sides of the capacitor element. A technique called half dicing can be used for this removal.

[0053] As described above, according to the present disclosure, the ESR and ESL of the solid electrolytic capacitor can be reduced by directly connecting the anode terminal and cathode terminal, each of which has a multi-layer structure, to the capacitor element.

[0054] An example of a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor according to the present disclosure will be described in detail below with reference to the drawings. The components and steps described above can be applied to the components and steps of the example solid electrolytic capacitor and method for manufacturing a solid electrolytic capacitor described below. The components and steps of the example solid electrolytic capacitor and method for manufacturing a solid electrolytic capacitor described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above-described embodiment. Among the components and steps of the example solid electrolytic capacitor and method for manufacturing a solid electrolytic capacitor described below, components and steps that are not essential to the solid electrolytic capacitor and method for manufacturing a solid electrolytic capacitor according to the present disclosure may be omitted. Note that the diagrams shown below are schematic and do not accurately reflect the shapes and numbers of actual components.

[0055] First Embodiment A first embodiment of the present disclosure will be described below. First, the configuration of a solid electrolytic capacitor 10 of this embodiment will be described, and then a method for manufacturing the solid electrolytic capacitor of this embodiment will be described.

[0056] 1, a solid electrolytic capacitor 10 of this embodiment is a two-terminal solid electrolytic capacitor including a capacitor element 20, an exterior resin 31, an anode terminal 40, and a cathode terminal 50. The anode terminal 40 and the cathode terminal 50 are electrically insulated from each other.

[0057] The capacitor element 20 includes an anode body 21 , an anode wire 22 , a dielectric layer 23 , a solid electrolyte layer 24 , and a cathode layer 25 .

[0058] The anode body 21 is a porous anode body having a first lower surface 21 a. The anode body 21 is a porous sintered body having a roughly rectangular parallelepiped shape obtained by sintering particles of a valve metal (tantalum in this example), but is not limited to this.

[0059] Anode wire 22 is partially embedded in anode body 21 and the remainder protrudes from first lower surface 21a of anode body 21. Anode wire 22 is formed in a generally cylindrical shape. Anode wire 22 is made of, but is not limited to, tantalum. Anode wire 22 has embedded portion 22a embedded in anode body 21 and protruding portion 22b protruding from anode body 21. Pointed end surface 22c of anode wire 22 (or the lower surface of protruding portion 22b) is located on the same plane as first lower surface 21a.

[0060] The dielectric layer 23 is a layer formed on the surface of the anode body 21. The dielectric layer 23 is made of a metal oxide (tantalum pentoxide in this example), but is not limited to this.

[0061] The solid electrolyte layer 24 is a layer that covers at least a part of the dielectric layer 23. The solid electrolyte layer 24 includes a conductive polymer (polypyrrole in this example), but is not limited to this.

[0062] Cathode layer 25 is a layer that covers at least a portion of solid electrolyte layer 24 and has second lower surface 25 a. Cathode layer 25 includes, but is not limited to, carbon layer 25 b formed on solid electrolyte layer 24 and metal paste layer 25 c formed on carbon layer 25 b.

[0063] Here, capacitor element 20 has protrusion 26 formed at the connection portion between cathode layer 25 and cathode terminal 50. Protrusion 26 protrudes downward, and the protrusion length is 100 μm or more and 2000 μm or less.

[0064] The exterior resin 31 covers at least a portion of the capacitor element 20. In this embodiment, the exterior resin 31 covers the capacitor element 20 except for the end surface 22c of the anode wire 22 and the second lower surface 25a. The exterior resin 31 is made of insulating resin (epoxy resin in this example).

[0065] The anode terminal 40 has a first metal layer 41 and a second metal layer 42, and is exposed from the exterior resin 31. The first metal layer 41 is connected to the tip end surface 22c of the anode wire 22. The first metal layer 41 is a dry-plated layer containing Ti, and has a thickness of 100 nm or more and 3000 nm or less. The second metal layer 42 is connected to the first metal layer 41. The second metal layer 42 is a wet-plated layer containing Cu, and has a thickness of 3 μm or more and 500 μm or less.

[0066] Cathode terminal 50 has third metal layer 51 and fourth metal layer 52, and is exposed from exterior resin 31. Third metal layer 51 is connected to second lower surface 25a of cathode layer 25. Third metal layer 51 is a dry-plated layer containing Ti, and has a thickness of 100 nm or more and 3000 nm or less. Fourth metal layer 52 is connected to third metal layer 51. Fourth metal layer 52 is a wet-plated layer containing Cu, and has a thickness of 3 μm or more and 500 μm or less.

[0067] (Method for Manufacturing Solid Electrolytic Capacitor) Next, a method for manufacturing the above-described solid electrolytic capacitor 10 will be described with reference to Figures 2 to 4. The method for manufacturing the solid electrolytic capacitor of this embodiment includes a first step, a second step, a third step, a fourth step, a fifth step, a sixth step, a seventh step, and an eleventh step.

[0068] In the first step, an adhesive carrier 100 having adhesiveness is prepared (FIG. 2(a)). The adhesive carrier 100 of this embodiment is composed of a carrier sheet having a two-layer structure including a flexible supporting substrate 101 and an adhesive layer 102 provided thereon.

[0069] In the second step, the capacitor element 20 is placed on the adhesive carrier 100 (FIG. 2(b)). At this time, the tip surface 22c of the anode wire 22 and the second lower surface 25a of the cathode layer 25 are brought into contact with the adhesive layer 102 of the adhesive carrier 100.

[0070] In the third step, an exterior resin 31 is formed on the adhesive carrier 100 so as to cover at least a portion of the capacitor element 20 ( FIG. 2(C) ). At this time, the tip surface 22 c of the anode wire 22 and the second lower surface 25 a of the cathode layer 25, which are in contact with the adhesive carrier 100, are not covered by the exterior resin 31.

[0071] In the fourth step, the adhesive carrier 100 is peeled off to expose the tip end surface 22c of the anode wire 22 and the second lower surface 25a of the cathode layer 25 of the capacitor element 20 from the exterior resin 31 (FIG. 3(a)).

[0072] In the fifth step, a dry plating method (sputtering in this example) is used to form a dry plated layer 60 including portions corresponding to the first metal layer 41 and the third metal layer 51 (FIG. 3(b)).

[0073] In the sixth step, a wet plating method (in this example, electroplating) is used to form a wet plating layer 70 on the underside of the dry plating layer 60, including portions corresponding to the second metal layer 42 and the fourth metal layer 52 (Figure 3(c)).

[0074] In the seventh step, the dry-plated layer 60 and the wet-plated layer 70 are patterned to form a first metal layer 41, a second metal layer 42, a third metal layer 51, and a fourth metal layer 52 (FIG. 4(a)). In the seventh step of this embodiment, the patterning is performed using photolithography.

[0075] In an eleventh step, a portion of the exterior resin 31 is removed to obtain the solid electrolytic capacitor 10 of this embodiment (FIG. 4B). The removal method is not particularly limited, and for example, a dicing method such as a blade dicing method or a laser ablation method can be used.

[0076] First Modification of First Embodiment A first modification of the first embodiment of the present disclosure will now be described. As shown in FIG. 5 , solid electrolytic capacitor 10 of this modification differs from the first embodiment in that it further includes sealing resin 32 that covers at least a portion of exterior resin 31. Sealing resin 32 of this modification covers the lower surface of exterior resin 31 except for the portions where anode terminal 40 and cathode terminal 50 are formed. Sealing resin 32 is made of an insulating and water-repellent resin.

[0077] In addition to the above-mentioned steps 1 to 7 and step 11, the manufacturing method of the solid electrolytic capacitor of this modified example further includes step 9 of forming sealing resin 32 that covers at least a portion of exterior resin 31 at any stage after step 4 of peeling off adhesive carrier 100.

[0078] Second Modification of First Embodiment A second modification of the first embodiment of the present disclosure will now be described. The solid electrolytic capacitor 10 of this modification differs from the first embodiment in that it includes a plurality of anode wires 22. Specifically, as shown in FIG. 6 , the capacitor element 20 of this modification includes two anode wires 22. Each anode wire 22 is connected to an anode terminal 40.

[0079] Third Modification of First Embodiment A third modification of the first embodiment of the present disclosure will now be described. The solid electrolytic capacitor 10 of this modification differs from the first embodiment in the shape of the anode wire 22. Specifically, as shown in FIG. 7 , the anode wire 22 of this modification is formed in a plate shape extending in the width direction of the solid electrolytic capacitor 10 (the left-right direction in FIG. 7 ).

[0080] Second Embodiment A second embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in the number of capacitor elements 20. Specifically, as shown in FIG. 8 , the solid electrolytic capacitor 10 of this embodiment includes two capacitor elements 20 arranged in parallel. The anode wire 22 of each capacitor element 20 is connected to the same anode terminal 40.

[0081] Embodiment 3 A third embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in the shape of the anode wire 22. Specifically, as shown in FIG. 9 , the anode wire 22 of this embodiment has a first portion 22d extending upward from the first lower surface 21a and a second portion 22e extending laterally (to the right in FIG. 9 ) from the upper end of the first portion 22d. The first portion 22d and the second portion 22e form the embedded portion 22a of the anode wire 22. The anode wire 22 of this embodiment is generally L-shaped when viewed from the front. The length of the second portion 22e (the horizontal length in FIG. 9 ) is greater than the length of the first portion 22d (the vertical length in FIG. 9 ), but this is not limited to this.

[0082] Embodiment 4 A fourth embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in that it is a three-terminal type having two anode terminals 40. Specifically, as shown in FIG. 10 , the solid electrolytic capacitor 10 of this embodiment has a capacitor element 20 with two anode wires 22. The solid electrolytic capacitor 10 includes a first anode terminal 40A connected to the protruding portion 22b of one anode wire 22, and a second anode terminal 40B connected to the protruding portion 22b of the other anode wire 22. A cathode terminal 50 is disposed between the first anode terminal 40A and the second anode terminal 40B.

[0083] A modification of the fourth embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this modification differs from the fourth embodiment in the configuration of the capacitor element 20. Specifically, as shown in FIG. 11 , the capacitor element 20 of this modification has an anode wire 22 that is formed in an angular U-shape when viewed from the front. In other words, the anode wire 22 has two first portions 22d extending upward from the first lower surface 21a of the anode body 21 and a second portion 22e connecting the upper ends of the two first portions 22d. The anode wire 22 also has two protrusions 22b. The solid electrolytic capacitor 10 includes a first anode terminal 40A connected to one of the protrusions 22b and a second anode terminal 40B connected to the other protrusion 22b. The cathode terminal 50 is disposed between the first anode terminal 40A and the second anode terminal 40B.

[0084] Embodiment 5 A fifth embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in that it is a three-terminal type having two cathode terminals 50. Specifically, as shown in FIG. 12 , the solid electrolytic capacitor 10 of this embodiment has a capacitor element 20 with two protrusions 26. The solid electrolytic capacitor 10 includes a first cathode terminal 50A connected to the lower surface of one of the protrusions 26 (i.e., a part of the second lower surface 25 a) and a second cathode terminal 50B connected to the lower surface of the other protrusion 26 (i.e., another part of the second lower surface 25 a). The anode terminal 40 is disposed between the first cathode terminal 50A and the second cathode terminal 50B.

[0085] A modification of the fifth embodiment of the present disclosure will now be described. As shown in Fig. 13 , the solid electrolytic capacitor 10 of this modification differs from the fifth embodiment in that the capacitor element 20 is provided between the anode wire 22 and the cathode layer 25 and includes an insulating member 80 that electrically insulates the anode wire 22 and the cathode layer 25.

[0086] As shown in FIGS. 14 and 15, the method for manufacturing the solid electrolytic capacitor of this modification includes a twelfth step, a thirteenth step, a fourteenth step, a fifteenth step, and an eighth step.

[0087] In the twelfth step, particles of a valve metal are molded and sintered so that a portion of the anode wire 22 is embedded therein to form the anode body 21, and then a dielectric layer 23 is formed on the surface of the anode body 21 (FIG. 14(a)).

[0088] In a thirteenth step, a solid electrolyte layer 24 is formed (FIG. 14B) so as to cover at least a part of the dielectric layer 23. The solid electrolyte layer 24 can be formed by a known method.

[0089] In a fourteenth step, a resin composition is applied to the protruding portion 22b of the anode wire 22 and then cured to form the insulating member 80 (FIG. 14(c)).

[0090] In a fifteenth step, the cathode layer 25 is formed (FIG. 15(a)) so as to cover at least a part of the solid electrolyte layer 24. The cathode layer 25 can be formed by a known method.

[0091] In the eighth step, the anode wire 22 and the insulating member 80 are cut so that the tip surface 22c of the anode wire 22 and the lower surface of the protrusion 26 (i.e., the second lower surface 25a) are at the same height (FIG. 15(b)).

[0092] Thereafter, the first to seventh steps and the eleventh step described in the first embodiment are carried out to obtain the solid electrolytic capacitor 10 of this modified example (FIG. 15(c)).

[0093] Sixth Embodiment A sixth embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in that it is a three-terminal capacitor having two anode terminals 40. Specifically, as shown in FIG. 16 , the solid electrolytic capacitor 10 of this embodiment includes a first capacitor element 20A, a second capacitor element 20B, a first anode terminal 40A connected to the anode wire 22 of the first capacitor element 20A, and a second anode terminal 40B connected to the anode wire 22 of the second capacitor element 20B. The lower surface (second lower surface 25 a) of the protruding portion 26 of the first capacitor element 20A and the lower surface (second lower surface 25 a) of the protruding portion 26 of the second capacitor element 20B are connected to the same cathode terminal 50. This cathode terminal 50 is disposed between the first anode terminal 40A and the second anode terminal 40B.

[0094] Seventh Embodiment A seventh embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in that it is a three-terminal type having two cathode terminals 50. Specifically, as shown in FIG. 17 , the solid electrolytic capacitor 10 of this embodiment includes a first capacitor element 20A, a second capacitor element 20B, a first cathode terminal 50A connected to the lower surface (second lower surface 25 a) of the convex portion 26 of the first capacitor element 20A, and a second cathode terminal 50B connected to the lower surface (second lower surface 25 a) of the convex portion 26 of the second capacitor element 20B. The anode wire 22 of the first capacitor element 20A and the anode wire 22 of the second capacitor element 20B are connected to the same anode terminal 40. This anode terminal 40 is disposed between the first cathode terminal 50A and the second cathode terminal 50B.

[0095] Embodiment 8 An eighth embodiment of the present disclosure will be described. The solid electrolytic capacitor 10 of this embodiment differs from the first embodiment in the configuration of the anode terminal 40 and the cathode terminal 50. Specifically, as shown in FIG. 18 , in the solid electrolytic capacitor 10 of this embodiment, the first metal layer 41 and the second metal layer 42 extend across one side surface of the exterior resin 31 (the left side surface in FIG. 18 ), and the third metal layer 51 and the fourth metal layer 52 extend across another side surface of the exterior resin 31 (the right side surface in FIG. 18 ). Note that in the illustrated example, the third metal layer 51 corresponding to the other side surface of the exterior resin 31 is not connected to the side surface of the cathode layer 25, but the third metal layer 51 may be connected to the side surface of the cathode layer 25.

[0096] As shown in FIGS. 19 and 20 , the method for manufacturing a solid electrolytic capacitor of this embodiment includes steps 1 to 3 (not shown), as well as steps 4, 10, 5, 6, 7, and 11.

[0097] In the fourth step, the adhesive carrier 100 (see Figure 2) is peeled off to expose the tip surface 22c of the anode wire 22 and the second lower surface 25a of the cathode layer 25 of the capacitor element 20 from the exterior resin 31 (Figure 19(a)).

[0098] In a tenth step, portions of exterior resin 31 on both sides of capacitor element 20 (both left and right sides in the illustrated example) are removed by half dicing (FIG. 19B).

[0099] In the fifth and sixth steps, a dry plating method (in this example, sputtering) is used to form a dry plating layer 60 including portions corresponding to the first metal layer 41 and the third metal layer 51, and then a wet plating method (in this example, electroplating) is used to form a wet plating layer 70 including portions corresponding to the second metal layer 42 and the fourth metal layer 52 on the surface of the dry plating layer 60 (Figure 19(c)).

[0100] In the seventh step, the dry-plated layer 60 and the wet-plated layer 70 are patterned to form a first metal layer 41, a second metal layer 42, a third metal layer 51, and a fourth metal layer 52 (FIG. 20(a)). In the seventh step of this embodiment, the patterning is performed using photolithography.

[0101] In step 11, the exterior resin 31 and the metal layers 41, 42, 51, and 52 are partially removed to obtain the solid electrolytic capacitor 10 of this embodiment ( FIG. 20( b) ). The removal method is not particularly limited, and for example, a dicing method such as a blade dicing method or a laser ablation method can be used. In step 11 of this embodiment, a portion of the upper side of the exterior resin 31 is removed by polishing.

[0102] <<Appendix>> The above embodiments disclose the following techniques. (Technology 1) A solid electrolytic capacitor comprising: at least one capacitor element including: a porous anode body having a first lower surface; at least one anode wire partially embedded in the anode body and partially protruding from the first lower surface; a dielectric layer formed on the surface of the anode body; a solid electrolyte layer covering at least a portion of the dielectric layer; and a cathode layer covering at least a portion of the solid electrolyte layer and having a second lower surface; an exterior resin covering at least a portion of the capacitor element; at least one anode terminal having a first metal layer connected to a protruding end surface of the anode wire and a second metal layer connected to the first metal layer, the anode terminal being exposed from the exterior resin; and at least one cathode terminal having a third metal layer connected to the second lower surface and a fourth metal layer connected to the third metal layer, the anode terminal being exposed from the exterior resin. (Technology 2) The solid electrolytic capacitor according to Technology 1, wherein the capacitor element has a protrusion formed at a connection site between the cathode layer and the cathode terminal. (Technology 3) The solid electrolytic capacitor according to Technology 2, wherein the protruding length of the convex portion is 100 μm or more and 2000 μm or less. (Technology 4) The solid electrolytic capacitor according to any one of Technology 1 to 3, wherein the first metal layer and the third metal layer are each dry-plated layers, and the second metal layer and the fourth metal layer are each wet-plated layers. (Technology 5) The solid electrolytic capacitor according to Technology 4, wherein the dry-plated layer contains at least one metal material selected from the group consisting of Ti, Cr, and Ni, and the wet-plated layer contains at least one metal material selected from the group consisting of Cu, Ni, Sn, and Al. (Technology 6) The solid electrolytic capacitor according to Technology 4 or 5, wherein the dry-plated layer has a thickness of 100 nm or more and 3000 nm or less, and the wet-plated layer has a thickness of 3 μm or more and 500 μm or less. (Technology 7) The solid electrolytic capacitor according to any one of Technologies 1 to 6, wherein the at least one anode wire includes a plurality of anode wires. (Technology 8) The solid electrolytic capacitor according to any one of Technologies 1 to 7, wherein the anode wire is formed in a plate shape.(Technology 9) The solid electrolytic capacitor according to any one of Technologies 1 to 8, wherein the at least one capacitor element includes a plurality of capacitor elements, and the anode wire of each of the plurality of capacitor elements is connected to the same anode terminal. (Technology 10) The solid electrolytic capacitor according to any one of Technologies 1 to 9, wherein the anode wire has a first portion extending upward from the first lower surface and a second portion extending laterally from an upper end of the first portion. (Technology 11) The solid electrolytic capacitor according to any one of Technologies 1 to 10, wherein the at least one anode terminal includes a first anode terminal and a second anode terminal, and the cathode terminal is disposed between the first anode terminal and the second anode terminal. (Technology 12) The solid electrolytic capacitor according to any one of Technologies 1 to 10, wherein the at least one cathode terminal includes a first cathode terminal and a second cathode terminal, and the anode terminal is disposed between the first cathode terminal and the second cathode terminal. (Technology 13) The solid electrolytic capacitor according to any one of Technologies 1 to 10, wherein the at least one capacitor element includes a first capacitor element and a second capacitor element, wherein the at least one anode terminal includes a first anode terminal connected to the anode wire of the first capacitor element and a second anode terminal connected to the anode wire of the second capacitor element, and the second lower surface of the cathode layer of the first capacitor element and the second lower surface of the cathode layer of the second capacitor element are connected to the same cathode terminal. (Technology 14) The solid electrolytic capacitor according to any one of Technologies 1 to 10, wherein the at least one capacitor element includes a first capacitor element and a second capacitor element, and the at least one cathode terminal includes a first cathode terminal connected to the second lower surface of the cathode layer of the first capacitor element and a second cathode terminal connected to the second lower surface of the cathode layer of the second capacitor element, and the anode wire of the first capacitor element and the anode wire of the second capacitor element are connected to the same anode terminal. (Technology 15) The solid electrolytic capacitor according to any one of Techniques 1 to 14, wherein the capacitor element has an insulating member provided between the anode wire and the cathode layer to electrically insulate them from each other.(Technology 16) The solid electrolytic capacitor according to any one of Technologies 1 to 15, wherein the first metal layer and the second metal layer extend across one side surface of the exterior resin, and the third metal layer and the fourth metal layer extend across another side surface of the exterior resin. a fourth step of peeling off the adhesive carrier to expose the tip end surface of the anode wire and the second lower surface of the cathode layer of the capacitor element from a surface of the exterior resin; a fifth step of forming a dry plated layer including portions corresponding to the first metal layer and the third metal layer by using a dry plating method; a sixth step of forming a wet plated layer including portions corresponding to the second metal layer and the fourth metal layer by using a wet plating method; and a seventh step of patterning the dry plated layer and the wet plated layer to form the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer. (Technology 18) The method for manufacturing a solid electrolytic capacitor according to Technology 17, further comprising an eighth step of cutting the anode wire so that the tip surface and the second lower surface are at the same height before the second step. (Technology 19) The method for manufacturing a solid electrolytic capacitor according to Technology 17 or 18, further comprising a ninth step of forming a sealing resin that covers at least a part of the exterior resin. (Technology 20) The method for manufacturing a solid electrolytic capacitor according to any one of Technology 17 to 19, further comprising a tenth step of removing portions of the exterior resin on both sides of the capacitor element between the fourth step and the fifth step.

[0103] While the present invention has been described in terms of presently preferred embodiments, such disclosure is not to be interpreted as limiting. Various changes and modifications will no doubt become apparent to those skilled in the art to which the present invention pertains upon reading the above disclosure. It is therefore intended that the appended claims be interpreted to cover all changes and modifications that do not depart from the true spirit and scope of the invention.

[0104] The present disclosure can be used for a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor.

[0105] 10: Solid electrolytic capacitor 20: Capacitor element 21: Anode body 21a: First lower surface 22: Anode wire 22a: Embedded portion 22b: Protruding portion 22c: Pointed end surface 22d: First portion 22e: Second portion 23: Dielectric layer 24: Solid electrolyte layer 25: Cathode layer 25a: Second lower surface 25b: Carbon layer 25c: Metal paste layer 26: Convex portion 20A: First capacitor element 20B: Second capacitor element 31: Exterior resin 32: Sealing resin 40: Anode terminal 41: First metal layer 42: Second metal layer 40A: First anode terminal 40B: Second anode terminal 50: Cathode terminal 51: Third metal layer 52: Fourth metal layer 50A: First cathode terminal 50B: Second cathode terminal 60: Dry plated layer 70: Wet plated layer 80: Insulating member 100: Adhesive carrier 101: Support substrate 102: Adhesive layer

Claims

1. A solid electrolytic capacitor comprising: at least one capacitor element including: a porous anode body having a first lower surface; at least one anode wire partially embedded in the anode body and partially protruding from the first lower surface; a dielectric layer formed on the surface of the anode body; a solid electrolyte layer covering at least a portion of the dielectric layer; and a cathode layer covering at least a portion of the solid electrolyte layer and having a second lower surface; an exterior resin covering at least a portion of the capacitor element; at least one anode terminal having a first metal layer connected to an end surface of the anode wire and a second metal layer connected to the first metal layer, the anode terminal being exposed from the exterior resin; and at least one cathode terminal having a third metal layer connected to the second lower surface and a fourth metal layer connected to the third metal layer, the cathode terminal being exposed from the exterior resin.

2. The solid electrolytic capacitor according to claim 1, wherein the capacitor element has a protrusion formed at the connection site between the cathode layer and the cathode terminal.

3. The solid electrolytic capacitor according to claim 2, wherein the protruding length of the convex portion is 100 μm or more and 2000 μm or less.

4. A solid electrolytic capacitor according to any one of claims 1 to 3, wherein the first metal layer and the third metal layer are each dry-plated layers, and the second metal layer and the fourth metal layer are each wet-plated layers.

5. The solid electrolytic capacitor according to claim 4, wherein the dry-plated layer contains at least one metal material selected from the group consisting of Ti, Cr, and Ni, and the wet-plated layer contains at least one metal material selected from the group consisting of Cu, Ni, Sn, and Al.

6. The solid electrolytic capacitor according to claim 4, wherein the thickness of the dry-plated layer is 100 nm or more and 3000 nm or less, and the thickness of the wet-plated layer is 3 μm or more and 500 μm or less.

7. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one anode wire comprises a plurality of anode wires.

8. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the anode wire is formed in a plate shape.

9. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one capacitor element includes a plurality of capacitor elements, and the anode wire of each of the plurality of capacitor elements is connected to the same anode terminal.

10. A solid electrolytic capacitor according to any one of claims 1 to 3, wherein the anode wire has a first portion extending upward from the first lower surface and a second portion extending laterally from an upper end of the first portion.

11. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one anode terminal includes a first anode terminal and a second anode terminal, and the cathode terminal is disposed between the first anode terminal and the second anode terminal.

12. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one cathode terminal includes a first cathode terminal and a second cathode terminal, and the anode terminal is disposed between the first cathode terminal and the second cathode terminal.

13. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one capacitor element includes a first capacitor element and a second capacitor element, the at least one anode terminal includes a first anode terminal connected to the anode wire of the first capacitor element and a second anode terminal connected to the anode wire of the second capacitor element, and the second lower surface of the cathode layer of the first capacitor element and the second lower surface of the cathode layer of the second capacitor element are connected to the same cathode terminal.

14. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the at least one capacitor element includes a first capacitor element and a second capacitor element, the at least one cathode terminal includes a first cathode terminal connected to the second lower surface of the cathode layer of the first capacitor element and a second cathode terminal connected to the second lower surface of the cathode layer of the second capacitor element, and the anode wire of the first capacitor element and the anode wire of the second capacitor element are connected to the same anode terminal.

15. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the capacitor element has an insulating member disposed between the anode wire and the cathode layer to electrically insulate them.

16. The solid electrolytic capacitor according to any one of claims 1 to 3, wherein the first metal layer and the second metal layer extend across one side surface of the exterior resin, and the third metal layer and the fourth metal layer extend across another side surface of the exterior resin.

17. A method for producing the solid electrolytic capacitor according to any one of claims 1 to 3, comprising: a first step of preparing an adhesive carrier having an adhesive layer on a supporting substrate; a second step of arranging the capacitor element on the adhesive carrier; a third step of forming the exterior resin on the adhesive carrier so as to cover at least a portion of the capacitor element; a fourth step of peeling off the adhesive carrier to expose the tip end face of the anode wire and the second lower surface of the cathode layer of the capacitor element from the surface of the exterior resin; a fifth step of forming a dry plated layer using a dry plating method, the dry plated layer including portions corresponding to the first metal layer and the third metal layer; a sixth step of forming a wet plated layer using a wet plating method, the wet plated layer including portions corresponding to the second metal layer and the fourth metal layer; and a seventh step of patterning the dry plated layer and the wet plated layer to form the first metal layer, the second metal layer, the third metal layer, and the fourth metal layer.

18. The method for manufacturing a solid electrolytic capacitor according to claim 17, further comprising, before the second step, an eighth step of cutting the anode wire so that the tip surface and the second lower surface are at the same height.

19. The method for manufacturing a solid electrolytic capacitor according to claim 17, further comprising a ninth step of forming a sealing resin that covers at least a portion of the exterior resin.

20. The method for manufacturing a solid electrolytic capacitor according to claim 17, further comprising a tenth step between the fourth step and the fifth step, of removing portions of the exterior resin on both sides of the capacitor element.

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