Camera module and electronic device comprising same

The camera module design addresses the challenge of integrating OIS and AF in compact spaces by allowing the OIS carrier to move perpendicular and the AF carrier to move parallel to the optical axis, enhancing functionality and reducing complexity.

WO2025263924A1PCT designated stage Publication Date: 2025-12-26SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2025/008204
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-14
Filing Date
2025-06-13
Publication Date
2025-12-26

AI Technical Summary

Technical Problem

As camera modules become smaller, implementing optical image stabilizer (OIS) and auto focus (AF) controls while minimizing structural interference between optical systems becomes challenging.

Method used

A camera module design incorporating a housing, OIS carrier, AF carrier, reflective member, and image sensor, where the OIS carrier moves perpendicular to the optical axis and the AF carrier moves parallel to it, reducing structural complexity.

Benefits of technology

This design reduces manufacturing costs and facilitates maintenance by minimizing structural complexity while maintaining OIS and AF functionality.

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Abstract

According to various embodiments of the present disclosure, a camera module is provided. The camera module comprises: a housing; a first lens unit having a first optical axis and including at least one lens element; an OIS carrier disposed in the housing so as to be movable with respect to the housing in the direction orthogonal to the first optical axis; an AF carrier which supports the first lens unit, and which is disposed on the OIS carrier so as to be movable with respect to the OIS carrier in a first direction parallel to the first optical axis; a reflective member disposed on the OIS carrier; and an image sensor for receiving light through the reflective member and the first lens unit.
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Description

Camera module and electronic device including same

[0001] The present disclosure relates to a camera module and an electronic device including the same.

[0002] The camera module may include an optical image stabilizer (OIS) and an auto focus (AF) controller.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] As camera modules become smaller, it can be difficult to implement OIS and AF controls while reducing interference between structures containing optical systems.

[0005] Embodiments of the present disclosure provide a camera module having an OIS and AF controller capable of reducing structural complexity in a restricted space and an electronic device including the same.

[0006] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present disclosure pertains from the description below.

[0007] According to various embodiments of the present disclosure, a camera module is provided, the camera module including a housing, a first lens unit, an optical imaging system (OIS) carrier, an autofocus (AF) carrier, a reflective member, and an image sensor. The first lens unit has a first optical axis. The first lens unit includes at least one lens element. The OIS carrier is disposed in the housing so as to be movable relative to the housing in a direction perpendicular to the first optical axis. The AF carrier is configured to support the first lens unit and is disposed in the OIS carrier so as to be movable in a first direction parallel to the first optical axis with respect to the OIS carrier. A reflective member is disposed in the OIS carrier. The image sensor is configured to receive light through the reflective member and the first lens unit.

[0008] According to various embodiments of the present disclosure, an electronic device is provided, comprising a housing and a camera module. The housing forms at least a portion of an outer surface of the electronic device. The camera module is positioned within the housing and is visually exposed through a camera area on the outer surface of the electronic device. The camera module includes a camera housing, a first lens unit, an optical imaging system (OIS) carrier, an autofocus (AF) carrier, a reflective member, and an image sensor. The first lens unit has a first optical axis and includes at least one lens element. The OIS carrier is disposed in the camera housing so as to be movable relative to the camera housing in a direction perpendicular to the first optical axis. The AF carrier is configured to support the first lens unit and is disposed in the OIS carrier so as to be movable in a first direction parallel to the first optical axis relative to the OIS carrier. A reflective member is disposed in the OIS carrier. The image sensor is configured to receive light through the reflective member and the first lens unit.

[0009] Camera modules and electronic devices including the same according to various embodiments of the present disclosure can reduce manufacturing costs and facilitate maintenance by providing OIS and AF controllers with reduced structural complexity.

[0010] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0011] The above and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0012] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described within the present disclosure.

[0013] FIG. 2 illustrates an electronic device according to various embodiments of the present disclosure.

[0014] FIG. 3A is a block diagram illustrating a configuration of a camera module included in an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 3b is a block diagram illustrating a camera module according to various embodiments of the present disclosure.

[0016] FIG. 3c is a diagram conceptually illustrating a configuration of an image sensor according to various embodiments of the present disclosure.

[0017] FIG. 4 is an exploded perspective view of a camera module according to various embodiments of the present disclosure.

[0018] FIG. 5 is a diagram illustrating a camera module according to various embodiments of the present disclosure.

[0019] FIG. 6 is a perspective view of a portion of a camera module according to various embodiments of the present disclosure.

[0020] FIG. 7 is a drawing showing a portion of a camera module according to various embodiments of the present disclosure.

[0021] FIG. 8 is a drawing showing a portion of a camera module according to various embodiments of the present disclosure.

[0022] FIG. 9 is a cross-sectional view of a portion of a camera module taken along line D-D' of FIG. 5, according to various embodiments of the present disclosure.

[0023] FIG. 10 is a cross-sectional view of a camera module taken along line E-E' of FIG. 5 according to various embodiments of the present disclosure.

[0024] FIG. 11 is a cross-sectional view of a camera module taken along line D-D' of FIG. 5 according to various embodiments of the present disclosure.

[0025] FIG. 12 is a perspective view of a portion of a camera module according to various embodiments of the present disclosure.

[0026] FIG. 13 is a perspective view of a portion of a camera module according to various embodiments of the present disclosure.

[0027] FIG. 14 is an exploded perspective view of a camera module according to various embodiments of the present disclosure.

[0028] FIG. 15 is a drawing showing a camera module according to various embodiments of the present disclosure.

[0029] FIG. 16 is a cross-sectional view of a portion of a camera module taken along line G-G' of FIG. 15, according to various embodiments of the present disclosure.

[0030] FIG. 17 is a cross-sectional view of a camera module taken along line H-H' of FIG. 15, according to various embodiments of the present disclosure.

[0031] FIG. 18 is a drawing showing a camera module according to various embodiments of the present disclosure.

[0032] Hereinafter, various embodiments of the present disclosure will be described in more detail. The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present disclosure as defined by the claims and their equivalents. While numerous specific details are included herein to aid understanding, they are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0033] The terms and words used in the following description and claims are not limited to their bibliographic meanings, but are merely used to ensure a clear and consistent understanding of the present disclosure by the inventors. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0034] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described within the present disclosure.

[0035] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in the present disclosure. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0036] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0037] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0038] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0039] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0040] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0041] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0042] FIG. 2 illustrates an electronic device (200) according to various embodiments of the present disclosure.

[0043] In various embodiments, an electronic device (200) (e.g., the electronic device (100) of FIG. 1) may include a processor (e.g., the processor (110) of FIG. 1), a display (e.g., the display (140) of FIG. 1), a memory (e.g., the volatile memory (121), the non-volatile memory (122) of FIG. 1), and / or at least one camera module (e.g., a camera including an image sensor (150) of FIG. 1). The processor may execute an application that supports a photographing function. In addition, the processor may execute at least one camera module and set and support a designated photographing mode so that at least one camera module can perform an operation intended by a user. An application associated with at least one camera module may be stored in the memory. At least one camera module may include at least one lens and at least one image sensor (e.g., the image sensor (150) of FIG. 1). For example, the electronic device (200) can obtain an image corresponding to a subject by using an image sensor (e.g., the image sensor (150) of FIG. 1) that converts light emitted from or reflected by the subject and transmitted through at least one lens into an electrical signal. For example, at least one camera module can include at least one of at least one first camera (231) or at least one second camera (232).

[0044] Referring to FIG. 2, a display (210) may be arranged on the front of an electronic device (200) according to various embodiments. In various embodiments, the display (210) may occupy most of the front of the electronic device (200). A mask area (220) may be arranged on the front of the electronic device (200) in which components that perform optical functions (e.g., a camera, a proximity sensor, or a distance sensor) are arranged. In various embodiments, the mask area (220) may include an area in which a black mask is arranged so that at least a portion of the screen is not output. In various embodiments, the display (210) is not limited to that illustrated in the drawing and may be formed in various ways. For example, the mask area (220) may include an area in which a black mask is arranged in the form of a notch adjacent to a portion of an edge of the front of the electronic device (200). For example, the display (210) may also form the front of the electronic device (200) without an area in which a black mask is arranged. If there is no area where a black mask is placed, a mask area (220) may be placed within an area where the display (210) is formed so that a component performing an optical function operates on the back of the display (210). However, the placement of the mask area (220) is not limited to the above-described example.

[0045] In various embodiments, at least one first camera (231) may be arranged on the front of the electronic device (200). In various embodiments, at least one first camera (231) may be visually exposed through a camera hole of the display (210). In various embodiments, at least one first camera (231) may include an under display camera (UDC) that is exposed through at least one micro-hole of the display (210). For example, when at least one first camera (231) is an UDC, at least one first camera (231) may not be visually exposed by the display (210). In the embodiment of FIG. 2, at least one first camera (231) is illustrated as being visually exposed through at least a portion within an area where the display (210) is arranged, at least one first camera (231) may also be visually exposed through a mask area (220). For example, a lens included in at least one first camera (231) may be visually exposed through at least a partially transparent area formed in the notch area. For example, at least one first camera (231) may be configured to move from the inside to the outside of the electronic device (200) such that the lens may be visually exposed.

[0046] In various embodiments, at least one first camera (231) may include multiple cameras. For example, referring to FIG. 2, the electronic device (200) may include multiple (e.g., two) first cameras, such as a first front camera and a second front camera. In various embodiments, the multiple cameras may be cameras of the same type with equivalent specifications (e.g., pixels or field of view (FOV)), but may also be implemented as cameras with different specifications. For example, the electronic device (200) may support functions related to a dual camera (e.g., depth measurement, auto focus (AF), face recognition, 3D selfie) through the two first cameras.

[0047] In various embodiments, at least one second camera (232) may be disposed on the rear of the electronic device (200). For example, the at least one second camera (232) may be exposed through at least one area (e.g., camera area (230)) of the rear cover (250). In various embodiments, the electronic device (200) may include a plurality of second cameras disposed on the rear of the electronic device (200). For example, referring to FIG. 2, the electronic device (200) may include a first rear camera, a second rear camera, and a third rear camera. In various embodiments, the first rear camera, the second rear camera, and the third rear camera may have different specifications. For example, at least some of the FOV, pixels, sensing wavelength band, aperture, whether optical zoom / digital zoom is supported, whether image stabilization function (e.g., optical image stabilization (OIS), digital image stabilization (DIS), electrical image stabilization (EIS)) is supported, and the type and arrangement of the lens assembly (or lens group) included in each camera may be different from each other of the first rear camera, the second rear camera, and the third rear camera. For example, the first rear camera may be a general camera (e.g., a camera with a narrower angle of view than the second rear camera), the second rear camera may be a camera for wide shooting, and the third rear camera may be a camera for telephoto shooting. At least two or more of the first rear camera, the second rear camera, and the third rear camera may have the same specifications. In the present disclosure, a description of a function or characteristic of the first camera may be applied to the second camera, and vice versa.

[0048] In various embodiments, various hardware or sensors (e.g., sensor (170) of FIG. 1) that assist in shooting, such as a flash (240), may be additionally placed in the electronic device (200). For example, a distance sensor (e.g., time of flight (TOF) sensor) for detecting the distance between a subject and the electronic device (200) may be further included in the camera area (230).

[0049] In various embodiments, a process of converting a raw image acquired through a camera module into a format that can be processed by a component within an electronic device (200) or a sub-component within a processor (110) may be performed in an ISP (e.g., an ISP (114) of FIG. 1) or an image sensor (e.g., an image sensor (150) of FIG. 1). In various embodiments, the process of processing data constituting a raw image may be performed in the ISP (114). In various embodiments, at least a part of the process of processing data constituting a raw image may be performed by a computational unit included in the image sensor (150).

[0050] The electronic device (200) may be implemented with one or more IC chips to perform various functions and operations disclosed in the present disclosure. For example, an application processor (AP) (e.g., processor (110) of FIG. 1), a central processing unit (CPU) (e.g., CPU (111) of FIG. 1), a graphics processing unit (GPU) (e.g., GPU (112) of FIG. 1), a neural processing unit (NPU) (e.g., NPU (113) of FIG. 1), an image signal processor (ISP) mounted on a camera module (e.g., ISP (114) of FIG. 1), a display driver IC (integrated circuit) (DDIC) for driving a display (e.g., display (140) of FIG. 1), or a hardware encoder included in the electronic device (200) may be used to implement various embodiments disclosed in the present disclosure. In the present disclosure, a processor may be understood to include at least one hardware processing circuit.

[0051] The electronic device (200) illustrated in FIG. 2 is an example and does not limit the form of the device to which the technical idea disclosed in the present disclosure is applied. The technical idea disclosed in the present disclosure may be applied to various user devices equipped with a camera module. For example, the technical idea disclosed in the present disclosure may be applied to an electronic device employing a flexible display (e.g., a foldable electronic device (e.g., a foldable type smartphone (191-2) of FIG. 1), a rollable (or slidable) electronic device (e.g., a rollable type smartphone (191-3))), a tablet (e.g., a tablet (192) of FIG. 1), or a laptop (e.g., a laptop (190) of FIG. 1).

[0052] For convenience of explanation, various embodiments are described below based on the electronic device (200) illustrated in FIG. 2.

[0053] FIG. 3A is a block diagram (300a) illustrating the configuration of a camera module included in an electronic device (200) (see FIG. 2) according to various embodiments of the present disclosure.

[0054] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 3A. All combinations of the features described below in connection with FIG. 3A may be considered to be encompassed by the present disclosure as specific examples.

[0055] In various embodiments, a camera module included in an electronic device (200) may include a lens assembly (301), an image sensor (303) (e.g., the image sensor (150) of FIG. 1), a sensor interface (I / F) (305), an ISP (311), a controller (315), an auto focus (AF) controller (309), a flash (317), and an optical image stabilizer (OIS) (323).

[0056] In various embodiments, light of an object incident through the lens assembly (301) may be converted into an electrical signal by the image sensor (303). The signal output from the image sensor (303) may be input to an image signal processor (ISP) (311) through a sensor interface (305). An infrared cut filter (IR cut filter) may be disposed on the upper surface of the image sensor (303). Light of an object passing through the lens assembly (301) may be partially filtered by the IR cut filter and then detected by the image sensor (303).

[0057] In various embodiments, the ISP (311) may perform operations related to an image signal output from the image sensor (303). The ISP (311) may include at least one of an ISP chain or a Pre-ISP. The ISP chain may mean, for example, a plurality of functional blocks connected to perform functions of the ISP. The ISP functional block may mean a unit of hardware and / or software that performs any one of the image signal processing functions. The ISP functional block may perform at least one of the image signal processing functions. For example, the functional block may perform at least one of the image signal processing functions of noise reduction, edge enhancement, gamma correction, or color interpolation. The ISP chain may be implemented as a chip having the structure of the ISP chain, or may be implemented as a software module executed by a processor (e.g., the processor (110) of FIG. 1). The ISP may perform image signal processing to obtain desired image data from an image signal. The Pre-ISP can perform operations related to image signals before performing image signal processing in the ISP chain. For example, auto white balance (AWB), auto exposure (AE) control, and auto focusing (AF) operations can be performed in the Pre-ISP. The ISP (311) can store data in the memory (313) or use data stored in the memory (313) to perform operations related to image signals.

[0058] In various embodiments, the ISP chain of the ISP (311) may process an image signal acquired through the image sensor (303). For example, the ISP chain may perform at least one of lens shading correction, dead pixel correction, noise control, tone curve adjustment, color correction and adjustment, edge enhancement, demosaicing, or remosaicing.

[0059] In various embodiments, the ISP (311) may be implemented as at least a part of a processor (e.g., processor (110) of FIG. 1) (or an integrated circuit) constituting the controller (315). However, the present invention is not limited thereto. In various embodiments, the ISP (311) may be implemented as a separate processor (or an integrated circuit). In various embodiments, the ISP (311) may be implemented through a computational unit included in the image sensor (303). In various embodiments, the ISP (311) may be distributed across multiple components (e.g., a computational unit of the image sensor (303), a separate processor, the controller (315)).

[0060] In various embodiments, the controller (315) may control the display (140) to display an execution screen of an application executed by the controller (315) or a screen stored in the memory (313). The memory (313) may include at least one recording (or storage) medium. For example, the memory (313) may include at least one of a volatile memory (121) such as a random access memory (RAM), a non-volatile memory (122) such as a flash memory, or a buffer memory.

[0061] In various embodiments, the OIS (323) may move at least a portion of the lens assembly (301) or the image sensor (303) in response to the movement of the electronic device (200) to eliminate or reduce shaking of the captured image. At least a portion of the lens assembly (301) or the image sensor (303) may move so as to offset the movement of the electronic device (200). In various embodiments, the OIS (323) may obtain information about the movement of the electronic device (200) through a motion sensor (321) (e.g., sensor (170) of FIG. 1). The motion sensor (321) may include, for example, a gyro sensor and / or an acceleration sensor.

[0062] In various embodiments, the AF controller (309) can adjust the distance between at least one lens of the lens assembly (301) and the image sensor (303) so that an image is formed on the image sensor (303) by light passing through the lens assembly (301). For example, the ISP (311) can determine a phase difference between pixels (or a phase difference between sub-pixels) from image data acquired through the image sensor (303). The controller (315) can control the AF controller (309) to adjust the focus based on the determined phase difference. However, the operating method of the AF controller (309) is not limited thereto. For example, the AF controller (309) can also perform focus adjustment based on a position of the lens assembly (301) or the image sensor (303) where an image exhibiting maximum contrast is acquired while moving the lens assembly (301) or the image sensor (303).

[0063] Hereinafter, various camera modules are described with reference to the attached drawings. Any one exemplary camera module may be interpreted as being included within the scope of various embodiments of the present disclosure by being a modification or variation of at least some of the components of any other camera module. With respect to the description of any one exemplary camera module, the same terminology and / or the same reference numerals may be used for components that are at least partially identical, similar, or related to components of any other exemplary camera module. In any two exemplary camera modules, two components that have the same terminology but different reference numerals may be understood to be substantially the same or have been modified or varied in form.

[0064] In the present disclosure, “disposed on XX” can be understood as disposed adjacent to XX, disposed in substantial contact with XX, or coupled to XX.

[0065] In the present disclosure, “located on XX” may be understood as being located adjacent to XX, positioned in substantial contact with XX, or coupled to XX.

[0066] In the present disclosure, when a first component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” a second component, it can be understood that it can be directly disposed, connected, or coupled to the second component, or that a third component can be disposed therebetween.

[0067] In the present disclosure, "ZZ between XX and YY" may be understood as ZZ being positioned in substantial contact with XX or YY, or ZZ being directly bonded to XX or YY. "ZZ between XX and YY" may be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ, and / or at least one component between YY and ZZ interposed therebetween. "ZZ between XX and YY" may be understood as at least one other component between XX and ZZ connecting XX and ZZ, and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0068] In the present disclosure, when the term "substantially" is used to define a structural part, the expression including the term "substantially" is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0069] In this disclosure, the term “and / or” may be understood to include any combination of one or more of the associated configurations that may be defined.

[0070] In this disclosure, the expression "comprising" means that a particular effect or result can be achieved within a certain tolerance, and that a person skilled in the art knows how to achieve the tolerance. It should be understood that terms such as "comprising" or "having" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0071] In the drawings of the present disclosure, the shapes, thicknesses, ratios, and / or dimensions of the components are only for the effective explanation of the technical contents and are not limited to the shapes, thicknesses, ratios, and / or dimensions shown.

[0072] The "comparative examples" mentioned in this disclosure are merely presented for comparison with embodiments of this disclosure and do not have antecedent status with respect to various embodiments of this disclosure.

[0073] FIG. 3b is a block diagram (300b) illustrating a camera module (3000) according to various embodiments of the present disclosure.

[0074] Referring to FIG. 3B, a camera module (3000) (e.g., the camera module of FIG. 3A) may include a lens assembly (3010) (e.g., the lens assembly (301) of FIG. 3A), a flash (3020) (e.g., the flash (317) of FIG. 3A), an image sensor (3030) (e.g., the image sensor (150) of FIG. 1 or the image sensor (303) of FIG. 3A), an image stabilizer (3040), a memory (3050) (e.g., a buffer memory) (e.g., the memory (313) of FIG. 3A), or an ISP (3060) (e.g., the ISP (114) of FIG. 1 or the ISP (311) of FIG. 3A). The lens assembly (3010) may collect light emitted from a subject that is a target of image capturing. The lens assembly (3010) may include one or more lenses. In various embodiments, the camera module (3000) may be implemented to include a plurality of lens assemblies (3010). In such a case, the camera module (3000) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (3010) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. The lens assembly (3010) may include, for example, a wide-angle lens or a telephoto lens.

[0075] According to various embodiments, the flash (3020) may emit light used to enhance light emitted or reflected from a subject. In various embodiments, the flash (3020) may include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (3030) may convert light emitted or reflected from a subject and transmitted through the lens assembly (3010) into an electrical signal, thereby acquiring an image corresponding to the subject. In various embodiments, the image sensor (3030) may include one image sensor selected from among image sensors having different properties, such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (3030) may be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0076] According to various embodiments, the image stabilizer (3040) may move at least one lens included in the lens assembly (3010) or the image sensor (3030) in a specific direction or control the operating characteristics of the image sensor (3030) (e.g., adjusting the read-out timing, etc.) in response to movement of the camera module (3000) or the electronic device (100) including the same (see FIG. 1). This allows compensating for at least some of the negative effects of the movement on the captured image. In various embodiments, the image stabilizer (3040) may detect such movement of the camera module (3000) or the electronic device (100) (see FIG. 1) by using a motion sensor (e.g., the motion sensor (321) of FIG. 3A) (e.g., a gyro sensor and / or an acceleration sensor) disposed inside or outside the camera module (3000). In various embodiments, the image stabilizer (3040) may be implemented as an optical image stabilizer. The memory (3050) may temporarily store at least a portion of the image acquired through the image sensor (3030) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) may be stored in the memory (3050), and a corresponding copy image (e.g., a low-resolution image) may be previewed through a display module (e.g., the display (140) of FIG. 1). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (3050) may be acquired and processed, for example, by the ISP (3060). In various embodiments, the memory (3050) may be configured as at least a portion of the memory (120) (see FIG. 1), or as a separate memory that operates independently therefrom.

[0077] According to various embodiments, the image stabilizer (3040) may include the OIS (323) of FIG. 3A.

[0078] According to various embodiments, the ISP (3060) may perform one or more image processing operations on an image acquired through the image sensor (3030) or an image stored in the memory (3050). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the ISP (3060) may perform control (e.g., exposure time control, read-out timing control, etc.) on at least one of the components included in the camera module (3000) (e.g., image sensor (3030)). An image processed by the ISP (3060) may be stored back in the memory (3050) for further processing or provided to an external component of the camera module (3000) (e.g., memory (e.g., memory (120) of FIG. 1), a display module (e.g., display (140) of FIG. 1), an external electronic device, or a server). In various embodiments, the ISP (3060) may include a processor (e.g., The ISP (3060) may be configured as at least a part of the processor (110) of FIG. 1), or may be configured as a separate processor that operates independently of the processor (e.g., the processor (110) of FIG. 1). When the ISP (3060) is configured as a separate processor from the processor (e.g., the processor (110) of FIG. 1), at least one image processed by the ISP (3060) may be displayed through a display module (e.g., the display (140) of FIG. 1)) by the processor (e.g., the processor (110) of FIG. 1) as is or after undergoing additional image processing.

[0079] According to various embodiments, the electronic device (100) (see FIG. 1) may be implemented to include a plurality of camera modules (3000), each having different properties or functions. In this case, for example, at least one of the plurality of camera modules may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules may be a front-facing camera, and at least another may be a rear-facing camera.

[0080] FIG. 3c is a diagram conceptually illustrating the configuration of an image sensor (150) (see FIG. 1) according to various embodiments of the present disclosure.

[0081] In various embodiments, the image sensor (150) (e.g., the image sensor (303) of FIG. 3A or the image sensor (3030) of FIG. 3B) may include a micro lens array (MLA) (331), a color filter array (CFA) (333), a light receiving unit (335), and a computation unit (337).

[0082] In various embodiments, the microlens array (331) may be arranged so that a light bundle (341) that passes through the lens assembly (e.g., the lens assembly (301) of FIG. 3A) and forms an image on the image sensor (150) is focused on a light-receiving element of the light-receiving unit (335). The light bundle (343) that passes through the microlens array (331) may have at least a portion of a wavelength outside a band corresponding to a specific color blocked as it passes through the color filter array (333). For example, the color filter array may be arranged at a position corresponding to a pixel of the image sensor (150). The light bundles (345) that pass through the color filter array (333) may be detected by a light-receiving element (e.g., a photodiode) of the light-receiving unit (335). The light receiving unit (335) may include a light receiving element (e.g., including a light receiving circuit) that generates a charge when receiving light and converts it into an electrical signal, and a circuit that selectively reads out the charge of the light receiving element. A circuit for digitizing the signal read out from the light receiving unit (335) or reducing noise may be further arranged between the light receiving unit (335) and the calculation unit (337).

[0083] In various embodiments, the operation unit (337) may perform an operation to process electrical data (or signal) (347) output from the light receiving unit (335). The operation unit (337) may output data obtained based on the operation result. The output of the operation unit (337) may be a sensor output (349) of the image sensor (150).

[0084] In various embodiments, the calculation unit (337) may perform an operation to calibrate the read data as an operation to process the electrical data (347). For example, the operation performed by the calculation unit (337) may include at least one of an operation to reduce a deviation difference between pixels due to optical characteristics or relative positions of sensors, an operation to reduce noise generated in an analog signal, an operation to remove a defect, an operation to perform remosaic, or an operation to apply to a specific application (e.g., a proximity sensor function, a timing adjustment function, a HDR (high dynamic range) tone mapping function).

[0085] In various embodiments, the electronic device (100) (e.g., the electronic device (200) of FIG. 2) may be configured such that the operation performed by the operation unit (337) is performed by another processor (e.g., the processor (110) of FIG. 1) (e.g., the application processor, CPU (111), GPU (112), NPU (113), ISP (1114) of FIG. 1). The sensor output (349) may be input to the processor (e.g., the processor (110) of FIG. 1) (e.g., the application processor, CPU (111), GPU (112), NPU (113), ISP (114) of FIG. 2) through an interface.

[0086] FIG. 4 is an exploded perspective view of a camera module (4) according to various embodiments of the present disclosure.

[0087] FIG. 5 is a drawing showing a camera module (4) according to various embodiments of the present disclosure.

[0088] FIG. 6 is a perspective view of a portion of a camera module (4) according to various embodiments of the present disclosure.

[0089] FIG. 7 is a drawing showing a part of a camera module (4) according to various embodiments of the present disclosure.

[0090] FIG. 8 is a drawing showing a part of a camera module (4) according to various embodiments of the present disclosure.

[0091] FIG. 9 is a cross-sectional view of a portion of a camera module (4) taken along line D-D' of FIG. 5 according to various embodiments of the present disclosure.

[0092] FIG. 10 is a cross-sectional view of a camera module (4) taken along line E-E' of FIG. 5 according to various embodiments of the present disclosure.

[0093] FIG. 11 is a cross-sectional view of a camera module (4) taken along line D-D' of FIG. 5 according to various embodiments of the present disclosure.

[0094] It is to be understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 4, 5, 6, 7, 8, 9, 10, and 11. All combinations of the features described below with respect to FIGS. 4, 5, 6, 7, 8, 9, 10, and 11 may be considered to be encompassed by the present disclosure as specific examples.

[0095] Referring to FIGS. 4, 5, 6, 7, 8, 9, 10, and 11, a camera module (also referred to as a camera assembly) (4) (e.g., the camera module of FIG. 3A or the camera module (3000) of FIG. 3B) may include a housing (41), a first lens unit (42), a second lens unit (43), a reflective member (44), an image sensor assembly (45), an optical image stabilization (OIS) carrier (46), a plurality of OIS balls (B1, B2, B3), an OIS driver (47), an AF carrier (48), a plurality of AF balls (B4, B5, B6), an AF driver (49), and / or a printed circuit board (PCB) (40).

[0096] According to various embodiments, a housing (also referred to as a camera housing, frame, frame structure, or framework) (41) may be a structural element for arranging and / or supporting other components of the camera module (4). The housing (41) may include, for example, a first housing (also referred to as a first frame, a first frame structure, or a first framework) (411) and a second housing (also referred to as a second frame, a second frame structure, or a second framework) (412).

[0097] According to various embodiments, the first housing (411) may include a first base (4111) and first, second, third, and fourth sides (4112, 4113, 4114, 4115) extending from or connected to the first base (4111). The first base (4111) may include, for example, a first planar portion that is substantially orthogonal to a second direction (②) (e.g., a direction parallel to the x-coordinate axis). The first side (4112) and the second side (4113) may be spaced apart from each other in a third direction (③) (e.g., a direction parallel to the y-coordinate axis) that is perpendicular to the second direction (②). The first side (4112) may include, for example, a first side wall (also referred to as a first side portion) that is orthogonal to the third direction (③). The second side (4113) may include, for example, a second side wall (also referred to as a second side portion) that is orthogonal to the third direction (③). The third side (4114) and the fourth side (4115) may be spaced apart from each other in a first direction (①) (e.g., a direction parallel to the z-coordinate axis) that is perpendicular to the second direction (②) and the third direction (③). The third side (4114) may include, for example, a third side wall (also referred to as a third side portion) that is orthogonal to the first direction (①). The third side (4114) may connect or extend the first side (4111) and the second side (4112). The fourth side (4115) may include, for example, a fourth side wall (also referred to as a fourth side portion) orthogonal to the first direction (①). The fourth side (4115) may connect or extend the first side (4111) and the second side (4112).

[0098] According to various embodiments, the first housing (411) may be formed of a non-metallic material or a metallic material.

[0099] According to various embodiments, the first housing (411) may include a conductive portion (e.g., an electrically conductive portion and / or a thermally conductive portion) comprising a metallic material, and / or a non-conductive portion comprising a non-metallic material.

[0100] According to various embodiments, the second housing (412) may include a second base (4121) and fifth, sixth, and seventh sides (4122, 4123, 4124) extending from or connected to the second base (4121). The second base (4121) may include, for example, a second planar portion substantially orthogonal to the second direction (②). The second base (4121) may be spaced apart from the first base (4111) of the first housing (411) in the second direction (②). The fifth side (4122) and the sixth side (4123) may be spaced apart from each other in the third direction (③). The fifth side (4122) may include, for example, a fifth side wall (also referred to as a fifth side portion) that is perpendicular to the third direction (③). The sixth side (4123) may include, for example, a sixth side wall (also referred to as a sixth side portion) that is perpendicular to the third direction (③). The first side (4112) and the second side (4113) of the first housing (411) may be positioned between the fifth side (4122) and the sixth side (4123) of the second housing (412). The fifth side (4122) may be positioned on the outside of the first housing (411) so as to face the first side (4112) of the first housing (411). The sixth side (4123) may be positioned on the outside of the first housing (411) to face the second side (4113) of the first housing (411). The seventh side (4124) may include, for example, a seventh side wall (also referred to as a seventh side portion) that is perpendicular to the first direction (①). The seventh side (4124) may connect or extend the fifth side (4122) and the sixth side (4123). The seventh side (4124) may be positioned on the outside of the first housing (411) to face the third side (4114) of the first housing (411).

[0101] According to various embodiments, the second housing (412) may be configured to provide electromagnetic shielding for components located within the housing (41). The second housing (412) may be formed of a metallic material for electromagnetic shielding. The second housing (412) may include, for example, a shield can.

[0102] According to various embodiments, the first lens unit (also referred to as the first lens assembly) (42) may include a first optical axis (also referred to as the first optical axis) (A1). The first optical axis (A1) may refer to, for example, an axis of symmetry of the first lens unit (42) through which light passes when the first lens unit (42) has rotational symmetry. The first optical axis (A1) may refer to, for example, a path of light that does not cause birefringence. The first optical axis (A1) may refer to, for example, an axis that does not optically differ even when the first lens unit (42) is rotated. The first optical axis (A1) may be parallel to the first direction (①). The first lens unit (42) may include one or more lens elements (also referred to as lenses). The first lens unit (42) may include, for example, first, second, and third lens elements (also referred to as first, second, and third lenses) (421, 422, 423) aligned with respect to the first optical axis (A1). The second lens element (422) may be positioned between the first lens element (421) and the third lens element (423). With respect to the second lens element (422), the first lens element (421) may be positioned in the positive direction of the z-coordinate axis, and the third lens element (423) may be positioned in the negative direction of the z-coordinate axis. The optical axes of the first, second, and third lens elements (421, 422, 423) may coincide with the first optical axis (A1). In a first direction (①) parallel to the first optical axis (A1), the first, second, and third lens elements (421, 422, 423) may be overlapped. The first lens element (421) may be positioned between the second lens element (422) and the image sensor (451). The third lens element (423) may be positioned between the second lens element (422) and the reflective member (44).

[0103] According to various embodiments, the first, second, and third lens elements (421, 422, 423) may have a symmetrical shape with respect to the first optical axis (A1). The first, second, and third lens elements (421, 422, 423) may be, for example, circular when viewed in a direction parallel to the first optical axis (A1), but are not limited thereto. The first, second, and third lens elements (421, 422, 423) may be formed (or provided) in various shapes including a focusing area for focusing light, and a border area extending around the focusing area.

[0104] According to various embodiments, the first, second, and third lens elements (421, 422, 423) of the first lens unit (42) may have different optical characteristics. At least two of the first, second, and third lens elements (421, 422, 423) may have different physical characteristics (e.g., shapes). For example, any one of the first, second, and third lens elements (421, 422, 423) may have positive refractive power, and any other one of the first, second, and third lens elements (421, 422, 423) may have negative refractive power. The number of lens elements included in the first lens unit (42) is not limited to the illustrated example. For example, the number of lens elements included in the first lens unit (42) may be 1 to 4. The first lens unit (42) may be formed (or provided) in a form in which one or more lens elements having positive refractive power and one or more lens elements having negative refractive power are combined.

[0105] According to various embodiments, one surface of the first lens element (421) facing the second lens element (422) and the other surface of the second lens element (422) facing the first lens element (421) may be at least partially non-parallel. One surface of the second lens element (422) facing the third lens element (423) and the other surface of the third lens element (423) facing the second lens element (422) may be at least partially non-parallel.

[0106] According to various embodiments, the first lens unit (42) may include a first air gap between the first lens element (421) and the second lens element (422). The first lens unit (42) may include a second air gap between the second lens element (422) and the third lens element (423). By combination of the first lens element (421), the second lens element (422), the third lens element (423), the first air gap, and the second air gap, the first lens unit (422) may have specific optical characteristics, such as transmission, reflection, and / or refraction.

[0107] According to various embodiments, although not separately illustrated, the first lens unit (42) may be provided (or formed) as a bonded lens. The first lens unit (42) may be provided (or formed) in a form in which the first and second lens elements (421, 422) and the second and third lens elements (422, 423) are bonded without an air gap. One surface of the first lens element (421) facing the second lens element (422) and the other surface of the second lens element (422) facing the first lens element (421) may be substantially parallel and bonded without an air gap. One surface of the second lens element (422) facing the third lens element (423) and the other surface of the third lens element (423) facing the second lens element (422) are substantially parallel and can be joined without an air gap.

[0108] According to various embodiments, although not shown separately, one surface of the first lens element (421) facing the second lens element (422) and the other surface of the second lens element (422) facing the first lens element (421) may be substantially parallel and joined without an air gap, and one surface of the second lens element (422) facing the third lens element (423) and the other surface of the third lens element (423) facing the second lens element (422) may be at least partially non-parallel and form an air gap.

[0109] According to various embodiments, one surface of the second lens element (422) facing the third lens element (423) and the other surface of the third lens element (423) facing the second lens element (422) can be joined substantially parallel and without an air gap, and one surface of the first lens element (421) facing the second lens element (422) and the other surface of the second lens element (422) facing the first lens element (421) can be at least partially non-parallel and form an air gap.

[0110] According to various embodiments, the first air gap between the first lens element (421) and the second lens element (422), and / or the second air gap between the second lens element (422) and the third lens element (423), can improve the resolution of light incident on the first lens unit (42) compared to a comparative example in which the first lens unit (42) is formed as a cemented lens.

[0111] According to various embodiments, the first lens unit (42) may include a first lens barrel (424) configured to support the first, second, and third lens elements (421, 422, 423). The first, second, and third lens elements (421, 422, 423) may be disposed in the first lens barrel (424). Supported by the first lens barrel (424), the relative positions between the first, second, and third lens elements (421, 422, 423) may be maintained. The first lens barrel (424) may be provided (or formed) in a cylindrical shape including a hollow portion. The focusing areas of the first, second, and third lens elements (421, 422, 423) may be positioned in the hollow portion of the first lens barrel (424).

[0112] According to various embodiments, the first lens unit (42) may be disposed or coupled to the AF carrier (48). The first lens barrel (424) of the first lens unit (42) may be disposed or coupled to the AF carrier (48). When the AF carrier (48) is moved relative to the OIS carrier (46) by the AF driving unit (49), the first lens unit (42) may be moved together with the AF carrier (48).

[0113] According to various embodiments, the first lens unit (42) may be defined as a first optical system.

[0114] According to various embodiments, the first lens unit (42) may be included in the lens assembly (301) of FIG. 3a or the lens assembly (3010) of FIG. 3b.

[0115] According to various embodiments, the second lens unit (also referred to as the second lens assembly) (43) may include a second optical axis (also referred to as the second optical axis) (A2). The second optical axis (A2) may refer to, for example, an axis of symmetry of the second lens unit (43) through which light passes when the second lens unit (43) has rotational symmetry. The second optical axis (A2) may refer to, for example, a path of light that does not cause birefringence. The second optical axis (A2) may refer to, for example, an axis that does not optically differ even when the second lens unit (43) is rotated. The second optical axis (A2) may be parallel to the second direction (②). The second lens unit (43) may include one or more lens elements (also referred to as lenses). The second lens unit (43) may include, for example, fourth, fifth, and sixth lens elements (also referred to as fourth, fifth, and sixth lenses) (431, 432, 433) aligned with respect to the second optical axis (A2). The fifth lens element (432) may be positioned between the fourth lens element (431) and the sixth lens element (433). With respect to the fifth lens element (432), the fourth lens element (431) may be positioned in the positive direction of the x-coordinate axis, and the sixth lens element (433) may be positioned in the negative direction of the x-coordinate axis. The optical axes of the fourth, fifth, and sixth lens elements (431, 432, 433) may coincide with the second optical axis (A2). In the second direction (②) parallel to the second optical axis (A2), the fourth, fifth, and sixth lens elements (431, 432, 433) can be overlapped. The sixth lens element (433) can be positioned between the fifth lens element (432) and the reflective member (44).

[0116] According to various embodiments, the fourth, fifth, and sixth lens elements (431, 432, 433) may have a symmetrical shape with respect to the second optical axis (A2). The fourth, fifth, and sixth lens elements (431, 432, 433) may be, for example, circular when viewed in a direction parallel to the second optical axis (A2), but are not limited thereto. The fourth, fifth, and sixth lens elements (431, 432, 433) may be formed (or provided) in various shapes including a focusing area for focusing light, and a border area extending around the focusing area.

[0117] According to various embodiments, the fourth, fifth, and sixth lens elements (431, 432, 433) of the second lens unit (43) may have different optical properties. At least two of the fourth, fifth, and sixth lens elements (431, 432, 433) may have different physical properties (e.g., shapes). For example, any one of the fourth, fifth, and sixth lens elements (431, 432, 433) may have positive refractive power, and any other one of the fourth, fifth, and sixth lens elements (431, 432, 433) may have negative refractive power. The number of lens elements included in the second lens unit (43) is not limited to the illustrated example. The second lens unit (43) can be formed (or provided) in a form in which one or more lens elements having positive refractive power and one or more lens elements having negative refractive power are combined.

[0118] According to various embodiments, one surface of the fourth lens element (431) facing the fifth lens element (432) and the other surface of the fifth lens element (432) facing the fourth lens element (431) may be at least partially non-parallel. One surface of the fifth lens element (432) facing the sixth lens element (433) and the other surface of the sixth lens element (433) facing the fifth lens element (432) may be at least partially non-parallel.

[0119] According to various embodiments, the second lens unit (43) may include a third air gap between the fourth lens element (431) and the fifth lens element (432). The second lens unit (43) may include a fourth air gap between the fifth lens element (432) and the sixth lens element (433). By combination of the fourth lens element (431), the fifth lens element (432), the sixth lens element (433), the third air gap, and the fourth air gap, the second lens unit (43) may have specific optical properties such as transmission, reflection, and / or refraction.

[0120] According to various embodiments, although not separately illustrated, the second lens unit (43) may be provided (or formed) as a bonded lens. The second lens unit (43) may be provided (or formed) in a form in which the fourth and fifth lens elements (431, 432) and the fifth and sixth lens elements (432, 433) are bonded without an air gap. One surface of the fourth lens element (431) facing the fifth lens element (432) and the other surface of the fifth lens element (432) facing the fourth lens element (431) are substantially parallel and may be bonded without an air gap. One surface of the fifth lens element (432) facing the sixth lens element (433) and the other surface of the sixth lens element (433) facing the fifth lens element (432) are substantially parallel and can be joined without an air gap.

[0121] According to various embodiments, although not shown separately, one surface of the fourth lens element (431) facing the fifth lens element (432) and the other surface of the fifth lens element (432) facing the fourth lens element (431) may be substantially parallel and joined without an air gap, and one surface of the fifth lens element (432) facing the sixth lens element (433) and the other surface of the sixth lens element (433) facing the fifth lens element (432) may be at least partially non-parallel and form an air gap.

[0122] According to various embodiments, one surface of the fifth lens element (432) facing the sixth lens element (433) and the other surface of the sixth lens element (433) facing the fifth lens element (432) can be joined substantially parallel and without an air gap, and one surface of the fourth lens element (431) facing the fifth lens element (432) and the other surface of the fifth lens element (432) facing the fourth lens element (431) can be at least partially non-parallel and form an air gap.

[0123] According to various embodiments, the third air gap between the fourth lens element (431) and the fifth lens element (432), and / or the fourth air gap between the fifth lens element (432) and the sixth lens element (433), can improve the resolution for light incident on the second lens unit (43) compared to a comparative example in which the second lens unit (43) is formed as a cemented lens.

[0124] According to various embodiments, the second lens unit (43) may include a second lens barrel (434) configured to support the fourth, fifth, and sixth lens elements (431, 432, 433). The fourth, fifth, and sixth lens elements (431, 432, 433) may be disposed in the second lens barrel (434). Supported by the second lens barrel (434), the relative positions between the fourth, fifth, and sixth lens elements (431, 432, 433) may be maintained. The second lens barrel (434) may be provided (or formed) in a cylindrical shape including a hollow portion. The focusing areas of the fourth, fifth, and sixth lens elements (431, 432, 433) may be positioned in the hollow portion of the second lens barrel (434).

[0125] According to various embodiments, the second lens unit (43) may be disposed or coupled to the OIS carrier (46). The second lens barrel (434) of the second lens unit (43) may be disposed or coupled to the OIS carrier (46). When the OIS carrier (46) is moved relative to the housing (41) by the OIS driving unit (47), the second lens unit (43) may be moved together with the OIS carrier (46). The second base (4121) of the second housing (412) may include a first opening (4101). The second lens unit (43) may pass through the first opening (4101). The first opening (4101) may have a width (e.g., diameter) that does not interfere with the movement of the second lens unit (43) when the OIS carrier (46) in which the second lens unit (43) is disposed moves relative to the housing (41). For example, in a direction perpendicular to the second optical axis (A2), the first diameter of the first opening (4101) may be larger than the second diameter of the second lens unit (43). In various embodiments, the lens barrel (434) of the second lens unit (43) may be configured to be raised or lowered relative to the first opening (4101) while in contact with a foreign matter shielding member, such as a brush, attached to the edge of the first opening (4101) so as to reduce the deterioration of camera performance or image quality due to foreign matter such as moisture or dust entering the interior of the camera module (4) through the first opening (4101).

[0126] According to various embodiments, the second lens unit (43) may be disposed or coupled to the second base (4121) of the second housing (412). The second lens barrel (434) of the second lens unit (43) may be coupled to the second base (4121) of the second housing (412). The second lens barrel (434) of the second lens unit (43) may be disposed or coupled to the first opening (4101) of the second base (4121) of the second housing (412). When the OIS carrier (46) moves with respect to the housing (41), the relative position between the second lens unit (43) and the OIS carrier (46) may change. In various embodiments, the first diameter of the first opening (4101) may be substantially equal to the second diameter of the second lens portion (43) in a direction orthogonal to the second optical axis (A2).

[0127] According to various embodiments, the second lens unit (43) may be defined as a second optical system.

[0128] According to various embodiments, the second lens unit (43) may be included in the lens assembly (301) of FIG. 3a or the lens assembly (3010) of FIG. 3b.

[0129] According to various embodiments, the reflective member (44) may be placed or coupled to the OIS carrier (46). In a first direction (①) parallel to the first optical axis (A1) of the first lens unit (42), the first lens unit (42) and the reflective member (44) may overlap. In a second direction (②) parallel to the second optical axis (A2) of the second lens unit (43), the second lens unit (43) and the reflective member (44) may overlap. The reflective member (44) can change the optical path (also referred to as the path of light travel) between the first lens unit (42) including the first optical axis (A1) and the second lens unit (43) including the second optical axis (A2) different from the first optical axis (A1) (e.g., orthogonal to the first optical axis (A1)) so that light passing through the second lens unit (43) can be focused and transmitted to the first lens unit (42). The reflective member (44) can be defined as a third optical system.

[0130] According to various embodiments, the reflective member (44) may include a prism. The reflective member (44) may include an incident surface (441), an exit surface (442), and a reflective surface (443). The incident surface (441) may face the second lens unit (43) (e.g., the sixth lens element (433) of the second lens unit (43)). The incident surface (441) may be, for example, perpendicular to the second optical axis (A2) of the second lens unit (43). The exit surface (442) may face the first lens unit (42) (e.g., the third lens element (423) of the first lens unit (42)). The exit surface (442) may be, for example, perpendicular to the first optical axis (A1) of the first lens unit (42). External light can pass through the second lens unit (43), then pass through the incident surface (441) of the reflective member (44), reach the reflective surface (443), be reflected by the reflective surface (443) of the reflective member (44), pass through the exit surface (442) of the reflective member (44), and reach the first lens unit (42). The reflective member (44) can be implemented so that the external light incident on the second lens unit (43) can be transmitted to the first lens unit (42) while reducing loss between the first lens unit (42) including the first optical axis (A1) and the second lens unit (43) including the second optical axis (A2).

[0131] According to various embodiments, the reflective member (44) may include a mirror. When the reflective member (44) is implemented as a mirror, the incident surface (441) and the exit surface (442) may be configured as virtual surfaces.

[0132] According to various embodiments, the reflective member (44) may be understood as a component included in a lens assembly (e.g., lens assembly (301) of FIG. 3A or lens assembly (3010) of FIG. 3B), or as a component separate from the lens assembly.

[0133] According to various embodiments, a camera module (4) including a first lens unit (42) (e.g., a first optical system), a second lens unit (43) (e.g., a second optical system), and a reflective member (44) (e.g., a third optical system) may provide (or form) a back focal length (BFL), a total top length (TTL), or an optical path length (OPL) capable of focusing an image at a high magnification (e.g., about 5x or more), for example, as a telephoto camera module. The optical system of the camera module (4) including the first lens unit (42), the second lens unit (43), and the reflective member (44) may secure a BFL, TTL, or OPL for a high magnification while making the camera module (4) slimmer. A camera module (4) including a first lens unit (42) having a first optical axis (A1), a second lens unit (43) having a second optical axis (A2) different from the first optical axis (A1), and a reflective member (44) for changing an optical path between the first lens unit (42) and the second lens unit (43) can be understood as a folded camera module.

[0134] According to various embodiments, the image sensor assembly (45) may include an image sensor (also referred to as an imaging element) (451) (e.g., image sensor (303) of FIG. 3A or image sensor (3030) of FIG. 3B), a flexible printed circuit board (FPCB) (452), and / or a support member (453). The image sensor (451) may receive external light through an optical system of a camera module (4) including a first lens unit (42), a second lens unit (43), and a reflective member (44) to generate an electrical signal (also referred to as an image signal). The image sensor (451) may include, for example, a photoelectric conversion element such as a CCD or a CMOS. An electrical signal generated by the image sensor (451) may be provided to the processor (110) (see FIG. 1) (e.g., the ISP (114) of FIG. 1, the ISP (311) of FIG. 3A, or the ISP (3060) of FIG. 3B) via the sensor interface (305) (see FIG. 3A) to be converted into image data. The image sensor (451) may include a light-receiving area (also referred to as an imaging area) configured to receive light and generate an electrical signal. The image sensor (451) may be electrically connected to a substrate assembly included in the electronic device (100) of FIG. 1 via an FPCB (452) (e.g., a part of the sensor interface (305) of FIG. 3A). According to various embodiments, the image sensor (451) may be disposed (e.g., surface-mounted) on the FPCB (452). A substrate assembly may include at least one printed circuit board and a plurality of electrical components arranged on the at least one printed circuit board. For example, some of the plurality of components included in the electronic device (100) of FIG. 1 may be included in the substrate assembly or electrically connected to the substrate assembly. The FPCB (452) may include, for example, a connector (4521) for electrically connecting to the substrate assembly.An electrical signal generated by the image sensor (451) may be transmitted to the processor (110) of FIG. 1 included in the substrate assembly through a flexible printed circuit board (452). The support member (453) may be configured to support the image sensor (451). According to various embodiments, a portion of the FPCB (452) on which the image sensor (451) is disposed (e.g., surface-mounted) may be disposed or coupled to the support member (453).

[0135] According to various embodiments, the image sensor assembly (45) may further include a filter (454). The filter (454) may be positioned or coupled to the support member (453) so as to face the image sensor (451). The filter (454) may be positioned between the second lens unit (43) and the image sensor (451). The filter (454) may include a bandpass filter (not shown separately) so that light of a specified frequency band (or a specified wavelength band) (e.g., a visible light band) may be incident on the light-receiving area of ​​the image sensor (451).

[0136] According to various embodiments, the filter (454) can block near infrared light of about 800 nm (nanometer) to about 900 nm.

[0137] According to various embodiments, the filter (454) may include an infrared blocking filter.

[0138] According to various embodiments, the light-receiving area of ​​the image sensor (451) of the image sensor assembly (45) may overlap with the first, second, and third lens elements (421, 422, 423) of the first lens unit (42) in a first direction (①) parallel to the first optical axis (A1) of the first lens unit (42). A support member (453) for supporting the image sensor (451) may be disposed or coupled to the housing (41). In various embodiments, the support member (453) for supporting the image sensor (451) may be coupled to the fourth side (4115) of the first housing (411). The fourth side (4115) of the first housing (411) may include a second opening (4102) that overlaps the image sensor (451) in a first direction (①) parallel to the first optical axis (A1) of the first lens unit (42). The second opening (4102) may be configured so that the fourth side (4115) does not interfere with external light passing through the second lens unit (43) and then having its light path changed by the reflective member (44) to proceed to the first lens unit (42).

[0139] According to various embodiments, the optical system of the camera module (4) including the first lens unit (42) (e.g., the first optical system), the second lens unit (43) (e.g., the second optical system), and the reflective member (44) (e.g., the third optical system) may be configured to focus external light incident on the second lens unit (43) onto a light-receiving area of ​​the image sensor (451). The optical system of the camera module (4) including the first lens unit (42), the second lens unit (43), and the reflective member (44) may be configured to secure or improve the resolution of image data generated in the light-receiving area by reducing the distribution of the position where light is focused (e.g., the peak point) in front of or behind the light-receiving area and distributing it in the light-receiving area.

[0140] According to various embodiments, the second lens unit (43) may be omitted. In various embodiments, the camera module (4) may include a transparent member (not shown separately) disposed in the first opening (4101) of the housing (41). In various embodiments, the camera module (4) may further include a filter (not shown separately) disposed in the first opening (4101) of the housing (41). The filter may include, for example, a bandpass filter so that light of a specified frequency band (or a specified wavelength band) (e.g., a visible light band) may be incident on the reflective member (44). The filter may block, for example, near-infrared rays of about 800 nm to about 900 nm. The filter may include, for example, an infrared blocking filter.

[0141] According to various embodiments, an OIS carrier (also referred to as a first movable member for OIS) (46) having a reflective member (44) disposed thereon may be movably disposed in a first housing (411). The first housing (411) has a space between a first base (4111), a first side (4112), a second side (4113), a third side (4114), and a fourth side (4115), and the OIS carrier (46) may be positioned in the space. In various embodiments, the OIS carrier (46) may be configured to be translationally moved in a second direction (②) and / or translationally moved in a third direction (③) with respect to the first housing (411). When shooting, the OIS carrier (46) having the reflective member (44) disposed thereon may be moved in the second direction (②) and / or the third direction (③) in response to shaking (or jitter), so that an image with secured or improved resolution can be acquired through the image sensor (451). For example, through shake compensation (e.g., shake offset) in which the OIS carrier (46) having the reflective member (44) disposed thereon moves in the second direction (②) and / or the third direction (③) in the opposite direction of shaking (or jitter), the image acquired through the image sensor (451) can be reduced from being blurred due to shaking.

[0142] According to various embodiments, the OIS balls (B1, B2, B3) may be disposed between the third side (4114) of the first housing (411) and the OIS carrier (46). The OIS balls (B1, B2, B3) may support sliding between the third side (4114) of the first housing (411) and the OIS carrier (46) so that the OIS carrier (46) may slide stably and smoothly (or softly) in the second direction (②) and / or the third direction (③) with respect to the first housing (411). When the OIS carrier (46) moves with respect to the first housing (411), the OIS balls (B1, B2, B3) may rotate to support sliding between the third side (4114) of the first housing (411) and the OIS carrier (46). The OIS balls (B1, B2, B3) may include, but are not limited to, a first ball (B1), a first ball (B2), and a third ball (B3).

[0143] According to various embodiments, the third side (4114) of the first housing (411) may include a first front ball support (601) corresponding to the first ball (B1), and the OIS carrier (46) may include a first rear ball support (701) corresponding to the first ball (B1). The first ball (B1) may be rotatably disposed between the first front ball support (601) of the third side (4114) and the first rear ball support (701) of the OIS carrier (46). The first front ball support (601) of the third side (4114) and the first rear ball support (701) of the OIS carrier (46) can support the rotation of the first ball (B1) when the OIS carrier (46) moves in the second direction (②) and / or the third direction (③) with respect to the first housing (411).

[0144] According to various embodiments, the first front ball support (601) of the third side (4114) may include a first front recess. The first front recess may have a depth extending in a direction (e.g., a negative direction of the z-coordinate axis) from the fourth side (4115) parallel to the first direction (①) toward the third side (4114). The first front recess may have a width in the third direction (③). The width of the first front recess in the third direction (③) may prevent the first ball (B1) from substantially moving in the third direction (③) with respect to the third side (4114). The first front recess may have a length extending in the second direction (②).

[0145] According to various embodiments, the first rear ball support (701) of the OIS carrier (46) may include a first rear recess (e.g., a first dimple). The first rear recess may include a portion of a spherical surface facing a portion of the first ball (B1) such that a portion of the first ball (B1) is inserted therein. The first rear recess may fix the position of the first ball (B1) while supporting rotation of the first ball (B1). The first rear recess may prevent the first ball (B1) from moving along an extended length of the first front ball support (601) (e.g., the first front recess) of the third side (4114) in the second direction (②).

[0146] According to various embodiments, the first front ball support (601) (e.g., the first front recess) of the third side (4114) may include a first opening (6011) that is open in a direction (e.g., in the positive direction of the x-axis) from the first base (4111) of the first housing (411) to the second base (4121) of the second housing (412). When a substrate assembly including a PCB (40), a first yoke (Y1), a first coil (C1), a second coil (C2), a third coil (C3), a fourth coil (C4), a fifth coil (C5), and a sixth coil (C6) is coupled to a first housing (411), and an OIS carrier (46) is placed in the first housing (411) due to magnetic attraction to the substrate assembly, a first ball insertion guide (801) (see FIG. 8) for inserting a first ball (B1) can be provided (or formed) by a combination of the first front ball support (601) of the third side (4114) and the OIS carrier (46). The first ball (B1) can be inserted into the first ball insertion guide (801) through the first opening (6011) and positioned between the first front ball support (e.g., first front recess) (601) of the third side (4114) and the first rear ball support (e.g., first rear recess) (701) of the OIS carrier (46).

[0147] According to various embodiments, the first front ball support (601) (e.g., the first front recess) of the third side (4114) and the first rear ball support (e.g., the first rear recess) (701) of the OIS carrier (46) may not overlap with the first hole (H1) formed in the third side (4114) corresponding to the first coil (C1) and the second coil (C2) when viewed in the first direction (①).

[0148] According to various embodiments, the third side (4114) of the first housing (411) may include a second front ball support (602) corresponding to the second ball (B2), and the OIS carrier (46) may include a second rear ball support (702) corresponding to the second ball (B2). The second ball (B2) may be rotatably disposed between the second front ball support (602) of the third side (4114) and the second rear ball support (702) of the OIS carrier (46). The second front ball support (602) of the third side (4114) and the second rear ball support (702) of the OIS carrier (46) can support the rotation of the second ball (B2) when the OIS carrier (46) moves in the second direction (②) and / or the third direction (③) with respect to the first housing (411).

[0149] According to various embodiments, the second front ball support (602) of the third side (4114) may include a second front recess. The second front recess may have a depth extending in a direction from the fourth side (4115) parallel to the first direction (①) toward the third side (4114) (e.g., in the negative direction of the z-coordinate axis). The second front recess may have a width in the third direction (③). The width of the second front recess in the third direction (③) may prevent the second ball (B2) from substantially moving in the third direction (③) with respect to the third side (4114). The second front recess may have a length extending in the second direction (②).

[0150] According to various embodiments, the second rear ball support (702) of the OIS carrier (46) may include a second rear recess (e.g., a second dimple). The second rear recess may include a portion of a spherical surface facing a portion of the second ball (B2) such that a portion of the second ball (B2) is inserted therein. The second rear recess may fix the position of the second ball (B2) while supporting rotation of the second ball (B2). The second rear recess may prevent the second ball (B2) from moving along an extended length of the second front ball support (602) (e.g., the second front recess) of the third side (4114) in the second direction (②).

[0151] According to various embodiments, the second front ball support (602) (e.g., the second front recess) of the third side (4114) may include a second opening (6021) that is open in a direction (e.g., in the positive direction of the x-axis) from the first base (4111) of the first housing (411) to the second base (4121) of the second housing (412). When a substrate assembly including a PCB (40), a first yoke (Y1), a first coil (C1), a second coil (C2), a third coil (C3), a fourth coil (C4), a fifth coil (C5), and a sixth coil (C6) is coupled to a first housing (411), and an OIS carrier (46) is placed in the first housing (411) due to a magnetic attraction to the substrate assembly, a second ball insertion guide (802) (see FIG. 8) for inserting a second ball (B2) can be provided (or formed) by a combination of the second front ball support (602) of the third side (4114) and the OIS carrier (46). The second ball (B2) can be inserted into the second ball insertion guide (802) through the second opening (6021) and positioned between the second front ball support (e.g., second front recess) (602) of the third side (4114) and the second rear ball support (e.g., second rear recess) (702) of the OIS carrier (46).

[0152] According to various embodiments, the second front ball support (602) (e.g., the second front recess) of the third side (4114) and the second rear ball support (e.g., the second rear recess) (702) of the OIS carrier (46) may not overlap with the first hole (H1) formed in the third side (4114) corresponding to the first coil (C1) and the second coil (C2) when viewed in the first direction (①).

[0153] According to various embodiments, a first ball support structure including a first front ball support (601) (e.g., a first front recess) of a third side (4114) and a first rear ball support (e.g., a first rear recess) (701) of an OIS carrier (46) may be provided (or formed) substantially symmetrically with a second ball support structure including a second front ball support (602) (e.g., a second front recess) of a third side (4114) and a second rear ball support (e.g., a second rear recess) (702) of an OIS carrier (46). In various embodiments, the first ball (B1) and the second ball (B2) may have substantially the same diameter.

[0154] According to various embodiments, the third side (4114) of the first housing (411) may include a third front ball support (603) corresponding to the third ball (B3), and the OIS carrier (46) may include a third rear ball support (703) corresponding to the third ball (B3). The third ball (B3) may be rotatably disposed between the third front ball support (603) of the third side (4114) and the third rear ball support (703) of the OIS carrier (46). The third front ball support (603) of the third side (4114) and the third rear ball support (703) of the OIS carrier (46) can support the rotation of the third ball (B3) when the OIS carrier (46) moves in the second direction (②) and / or the third direction (③) with respect to the first housing (411).

[0155] According to various embodiments, the third front ball support (603) of the third side (4114) may be provided (or formed) in a protruding form on the inner surface of the first hole (H1) of the third side (4114).

[0156] According to various embodiments, the third rear ball support (703) of the OIS carrier (46) may include a third rear recess (e.g., a third dimple). The third rear recess may include a portion of a spherical surface facing a portion of the third ball (B3) such that a portion of the third ball (B3) is inserted therein. The third rear recess may fix the position of the third ball (B3) while supporting the rotation of the third ball (B3).

[0157] According to various embodiments, the third side (4114) may include a third opening (6031). The third opening (6031) may be aligned with the third front ball support (603) in the second direction (②). When a substrate assembly including a PCB (40), a first yoke (Y1), a first coil (C1), a second coil (C2), a third coil (C3), a fourth coil (C4), a fifth coil (C5), and a sixth coil (C6) is coupled to a first housing (411), and an OIS carrier (46) is placed in the first housing (411) due to a magnetic attraction to the substrate assembly, a third ball insertion guide (803) (see FIG. 8) for inserting a third ball (B3) can be provided (or formed) by the combination of the substrate assembly, the third side (4114), and the OIS carrier (46). The third ball (B3) may be inserted into the third ball insertion guide (803) through the third opening (6031) and positioned between the third front ball support (603) of the third side (4114) and the third rear ball support (e.g., the third rear recess) (703) of the OIS carrier (46). In various embodiments, the third side (4114) of the first housing (411) includes a support (not shown separately) configured to support the third ball (B3) across the first hole (H1), replacing the third front ball support (603) and the third opening (6031), and the support may include a third front recess formed substantially identically to the first front recess corresponding to the first ball (B1). A third ball insertion guide (803) can be provided (or formed) by a combination of the support and the OIS carrier (46).

[0158] According to various embodiments, when viewed in the first direction (①), the third ball insertion guide (803) may be positioned between the first ball insertion guide (801) and the second ball insertion guide (802). The first ball insertion guide (801) and the second ball insertion guide (802) may be provided (or formed) substantially symmetrically with respect to the third ball insertion guide (803).

[0159] According to various embodiments, the first ball (B1), the second ball (B2), and the third ball (B3) may have substantially the same diameter.

[0160] According to various embodiments, the camera module (4) may include a first sub-ball (B31) (see FIG. 8) and / or a second sub-ball (B32) (see FIG. 8). The first sub-ball (B31) and the second sub-ball (B32) may be positioned in the third ball insertion guide (803). The first sub-ball (B31) and the second sub-ball (B32) may restrict the first ball (B1) from moving in the second direction (②) in the third ball insertion guide (803). The diameters of the first sub-ball (B31) and the second sub-ball (B32) may be smaller than the diameter of the first ball (B1). The number of sub-balls for restricting the first ball (B1) from moving in the second direction (②) in the third ball insertion guide (803) is not limited to two.

[0161] According to various embodiments, a retainer for fixing the relative positions between the first ball (B1), the second ball (B2), and the third ball (B3) may be disposed between the third side (4114) of the first housing (411) and the OIS carrier (46), or on the third side (4114) of the first housing (411) or the OIS carrier (46).

[0162] According to various embodiments, although not shown separately, the camera module (4) may include various sliding support structures (e.g., rollers or fluid bearings) implemented so that the OIS carrier (46) can be stably and smoothly (or softly) slid in the second direction (②) and / or the third direction (③) with respect to the first housing (411), without being restricted to the first ball (B1), the second ball (B2), and the third ball (B3).

[0163] According to various embodiments, the OIS driving unit (47) may be configured to provide a driving force to move the OIS carrier (46) relative to the first housing (411) under the control of the controller (315) of FIG. 3A. The OIS (323) of FIG. 3A may include the OIS driving unit (47).

[0164] According to various embodiments, the OIS driving unit (47) may be configured to move the OIS carrier (46) in a second direction (②) and / or a third direction (③) with respect to the first housing (411) through a force due to an electromagnetic force between a magnet and a coil.

[0165] According to various embodiments, the OIS driving unit (47) may include a first coil (C1), a second coil (C2), a first magnet (e.g., a first polarized magnet) (M1), a second magnet (e.g., a second polarized magnet) (M2), a first yoke (also referred to as a first magnetic conductor) (Y1), and / or a second yoke (also referred to as a second magnetic conductor) (Y2). The first coil (C1) and the second coil (C2) may be positioned in a first hole (H1) formed in a third side (4114) of the first housing (411). The first coil (C1) and the second coil (C2) may be arranged in a third direction (③). The first magnet (M1) may be arranged on the OIS carrier (46) so as to face the first coil (C1). The second magnet (M2) may be placed on the OIS carrier (46) to face the second coil (C2). The first magnet (M1) and the second magnet (M2) may be placed in a third direction (③). In the first direction (①), the first coil (C1) and the first magnet (M1) may overlap, and the second coil (C2) and the second magnet (M2) may overlap. The first yoke (Y1) may be positioned between the third side (4114) of the first housing (411) and the seventh side (4124) of the second housing (412). The first yoke (Y1) may be a plate including a magnetic material. The first yoke (Y1) may be supported by the third side (4114) of the first housing (411) and / or the seventh side (4124) of the second housing (412). The second yoke (Y2) may be arranged or coupled to the OIS carrier (46). The second yoke (Y2) may be positioned between the first and second magnets (M1, M2) and the reflective member (44). The second yoke (Y2) may be a plate including a magnetic material. In the first direction (①), the first yoke (Y1) and the second yoke (Y2) may overlap.The first coil (C1), the second coil (C2), the first magnet (M1), and the second magnet (M2) may be positioned between the first yoke (Y1) and the second yoke (Y2). In various embodiments, the first magnet (M1) and the second magnet (M2) may be disposed or coupled to the second yoke (Y2). Due to the attractive force exerted by the first magnet (M1) and the second magnet (M2) on the first yoke (Y1), the third side (4114) of the OIS carrier (46) and the first housing (411) may be supported by the first ball (B1), the second ball (B2), and the third ball (B3) to maintain a constant gap in the first direction (①). The second yoke (Y2) can form a magnetic circuit or magnetic path that controls the flow of the magnetic field formed from the first magnet (M1) and the second magnet (M2) and enhances the strength of the magnetic field. The second yoke (Y2) can control the flow of the magnetic field formed from the first magnet (M1) to concentrate the magnetic force on the first coil (C1), and can control the flow of the magnetic field formed from the second magnet (M2) to concentrate the magnetic force on the second coil (C2). The first yoke (Y1) can at least play a role in controlling the flow of the magnetic field formed from the magnets to enhance the strength of the magnetic field and / or to concentrate the magnetic force on the coil. The OIS driving unit (47) can move the OIS carrier (46) in a second direction (②) (e.g., in the positive or negative direction of the x-coordinate axis) with respect to the first housing (411) according to an electrical signal (e.g., a shake correction signal) provided to the first coil (C1) and the second coil (C2) while maintaining a gap between the first coil (C1) and the first magnet (M1) and a gap between the second coil (C2) and the second magnet (M2).An actuation structure configured to control the movement of a moving member (e.g., an OIS carrier (46)) in a direction perpendicular to the direction in which the coils and magnets are arranged by a force due to an electromagnetic force between the coils and magnets while maintaining a gap between the coils and magnets (e.g., a polarizing magnet) (e.g., between the first coil (C1) and the first magnet (M1), and / or between the second coil (C2) and the second magnet (M2)) may be defined as a 'first actuation structure'. The first actuation structure may be based on, for example, the Lorentz force according to Fleming's left hand rule. The combination of coils and magnets included in the first actuation structure may be implemented in one or more cases. The first drive structure may include a yoke (e.g., a first yoke (Y1) and / or a second yoke (Y2)) that can control the flow of a magnetic field formed from the magnet (e.g., by forming a magnetic field) to enhance the strength of the magnetic field and / or concentrate the magnetic force on the coil.

[0166] According to various embodiments, an integrated or single coil may be provided to replace the first coil (C1) and the second coil (C2), and an integrated or single magnet may be provided to replace the first magnet (M1) and the second magnet (M2).

[0167] According to various embodiments, the OIS driving unit (47) may include a third coil (C3), a fourth coil (C4), a third magnet (e.g., a first monopole magnet) (M3), and a fourth magnet (e.g., a second monopole magnet) (M4). The third coil (C3) may be positioned in a second hole (H2) formed in a first side (4112) of the first housing (411). The fourth coil (C4) may be positioned in a third hole (H3) formed in a second side (4113) of the first housing (411). The third coil (C3) and the fourth coil (C4) may be arranged in a third direction (③). The third magnet (M3) may be arranged in the OIS carrier (46) to face the third coil (C3). The fourth magnet (M4) may be placed on the OIS carrier (46) to face the fourth coil (C4). The third magnet (M3) and the fourth magnet (M4) may be placed in a third direction (③). The reflective member (44) may be positioned between the third magnet (M3) and the fourth magnet (M4). In the third direction (③), the third coil (C3) and the third magnet (M3) may overlap, and the fourth coil (C4) and the fourth magnet (M4) may overlap. The OIS driving unit (47) can change the distance between the third coil (C3) and the third magnet (M3) and the distance between the fourth coil (C4) and the fourth magnet (M4) according to an electrical signal (e.g., a shake correction signal) provided to the third coil (C3) and an electrical signal (e.g., a shake correction signal) provided to the fourth coil (C4), thereby moving the OIS carrier (46) in a third direction (③) (e.g., a positive direction or a negative direction of the y-coordinate axis) with respect to the first housing (411). For example, when the OIS carrier (46) moves in the positive direction of the y-coordinate axis with respect to the first housing (411), the distance (D1) (see FIG. 7) between the third coil (C3) and the third magnet (M3) may increase, and the distance (D2) (see FIG. 7) between the fourth coil (C4) and the fourth magnet (M4) may decrease.For example, when the OIS carrier (46) moves in the negative direction of the y-coordinate axis with respect to the first housing (411), the distance (D1) between the third coil (C3) and the third magnet (M3) may decrease, and the distance (D2) between the fourth coil (C4) and the fourth magnet (M4) may increase. A driving structure configured to control the movement of a moving member (e.g., the OIS carrier (46)) by changing the distance between the coils and the magnets in the direction in which the coils and the magnets are arranged by means of an electromagnetic force between the coils and the magnets (e.g., the third coil (C3) and the third magnet (M3), and / or the fourth coil (C4) and the fourth magnet (M4)) may be defined as a 'second driving structure'. The second drive structure may be based on, for example, Ampere's right-handed screw rule, where the coil acts like a magnet whose polarity is determined, and the magnetic strength of the magnet implemented as the coil is proportional to the current applied to the coil. The combination of the coil and the magnet included in the second drive structure may be implemented in one or more forms. The second drive structure may include a yoke (not shown separately) that can control the flow of a magnetic field formed from the magnet (e.g., by forming a magnetic path) to enhance the strength of the magnetic field and / or concentrate the magnetic force on the coil.

[0168] According to various embodiments, providing one second drive structure including a third coil (C3) and a third magnet (M3) and another second drive structure including a fourth coil (C4) and a fourth magnet (M4) can reduce a decrease in the driving force of the OIS drive unit (47), by compensating for (e.g., compensating for a decrease in force) an increase in the electromagnetic force due to an increase in the distance between the third coil (C3) and the third magnet (M3) by an increase in the electromagnetic force due to a decrease in the distance between the fourth coil (C4) and the fourth magnet (M4). Providing one second driving structure including a third coil (C3) and a third magnet (M3) and another second driving structure including a fourth coil (C4) and a fourth magnet (M4) can reduce the decrease in driving force of the OIS driving unit (47), by compensating for (e.g., compensating for the decrease in force) the decrease in electromagnetic force due to an increase in the distance between the fourth coil (C4) and the fourth magnet (M4) by compensating for (e.g., compensating for the decrease in force) the decrease in electromagnetic force due to a decrease in the distance between the third coil (C3) and the third magnet (M3).

[0169] According to various embodiments, the third coil (C3) and the third magnet (M3) may be omitted. The fourth coil (C4) and the fourth magnet (M4) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the third coil (C3) and the third magnet (M3).

[0170] According to various embodiments, the fourth coil (C4) and the fourth magnet (M4) may be omitted. The third coil (C3) and the third magnet (M3) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the fourth coil (C4) and the fourth magnet (M4).

[0171] According to various embodiments, the first ball (B1) and the second ball (B2) may be arranged in a third direction (③). The third ball (B3) may be positioned spaced apart from the center position between the first ball (B1) and the second ball (B2) in the second direction (②). The distance that the third ball (B3) is spaced apart from the first ball (B1) and the distance that the third ball (B3) is spaced apart from the second ball (B2) may be substantially the same. A structure in which the first ball (B1), the second ball (B2), and the third ball (B3) are arranged (e.g., an isosceles triangle arrangement structure) can provide a stable and balanced attractive force applied by the first magnet (M1) and the second magnet (M2) to the first yoke (Y1) so that the OIS carrier (46) can stably move in the second direction (②) and / or the third direction (③) with respect to the first housing (411) while reducing the OIS carrier (46) from being detached from the third side (4114) of the first housing (411). The position or number of balls arranged between the third side (4114) of the first housing (411) and the OIS carrier (46) is not limited to the illustrated example.

[0172] According to various embodiments, data regarding shaking (or tremor) may be transmitted from the motion sensor (321) of FIG. 3A (e.g., a shaking detection sensor) to the controller (315) of FIG. 3A (e.g., a micro control unit (MCU)). The motion sensor (421) of FIG. 3A may include a gyro sensor. The gyro sensor may be implemented as a MEMS type with low power and a small size using a semiconductor process, for example. The gyro sensor may collect shaking data at a maximum of about 6,600 times per second and provide the data to the controller (315) of FIG. 3A. The controller (315) of FIG. 3A can transmit a target signal to the OIS (323) of FIG. 3A to move the OIS carrier (46) in a direction opposite to the shaking, and the OIS (323) can move the OIS carrier (46) in a second direction (②) and / or a third direction (③) with respect to the first housing (411). The OIS (323) of FIG. 3A can include, for example, an OIS driver (47) and an OIS driver IC (driver integrated circuit) configured to transmit the target signal to the OIS driver (47).

[0173] According to various embodiments, in a no-load state where no electrical signal is provided to the first coil (C1), the second coil (C2), the third coil (C3), and the fourth coil (C4), the initial position of the OIS carrier (46) can be determined by the arrangement of the first magnet (M1), the second magnet (M2), and the first yoke (Y1).

[0174] According to various embodiments, in order to prevent collision and jointing between the OIS carrier (46) and the first housing (411) when the OIS carrier (46) moves in the second direction (②) and / or the third direction (③) with respect to the first housing (411), the camera module (4) may include an impact-resistant elastomer (not shown separately) disposed between the OIS carrier (46) and the first housing (411).

[0175] According to various embodiments, the OIS carrier (46) may include a first support (461) and a second support (462) extending from the first support (461). The first magnet (M1), the second magnet (M2), the third magnet (M3), the fourth magnet (M4), the second yoke (Y2), and the reflective member (44) may be supported by the first support (461). The first support (461) of the OIS carrier (46) may be implemented to support the reflective member (44) while not blocking the incident surface (441) and the exit surface (442) of the reflective member (44). The second support (462) of the OIS carrier (46) may support the AF carrier (48) on which the second lens unit (43) is arranged to translate in the first direction (①).

[0176] According to various embodiments, the AF carrier (also called a second moving member for AF) (48) on which the second lens unit (43) is arranged may be movably arranged relative to the OIS carrier (46). The AF carrier (48) may be configured to be translationally moved in a first direction (①) with respect to the OIS carrier (46). When shooting, by moving the AF carrier (48) in the first direction (①) (e.g., in the positive or negative direction of the z-coordinate axis), the distance (e.g., focal length) between the second lens unit (43) and the image sensor (451) may be adjusted so that light passing through the reflective member (44) is focused on the light-receiving area of ​​the image sensor (451).

[0177] According to various embodiments, the OIS carrier (46) may include a guide rail (not shown separately). The AF carrier (48) may be disposed on the guide rail, and the guide rail may be configured to guide the AF carrier (48) to move in a first direction (①) on the OIS caliper (46). In various embodiments, the guide rail may be configured to restrict the AF carrier (48) from moving away from the OIS carrier (46) in a direction other than the first direction (①).

[0178] According to various embodiments, the AF balls (B4, B5, B6) may be arranged between the AF carrier (48) and the OIS carrier (46). The AF balls (B4, B5, B6) may support sliding between the OIS carrier (46) and the AF carrier (48) so that the AF carrier (48) may slide stably and smoothly (or softly) in the first direction (①) with respect to the OIS carrier (46). The AF balls (B4, B5, B6) may include, but are not limited to, a fourth ball (B4), a fifth ball (B5), and a sixth ball (B6).

[0179] According to various embodiments, the AF carrier (48) may include a fourth ball support corresponding to the fourth ball (B4), a fifth ball support corresponding to the fifth ball (B5), and a sixth ball support corresponding to the sixth ball (B6). The fourth ball support may include, for example, a fourth groove or a fourth recess into which a portion of the fourth ball (B4) is inserted. The fourth ball support may support the rotation of the fourth ball (B4) while fixing the position of the fourth ball (B4). The fifth ball support may include, for example, a fifth groove or a fifth recess into which a portion of the fifth ball (B5) is inserted. The fifth ball support may support the rotation of the fifth ball (B5) while fixing the position of the fifth ball (B5). The sixth ball support may include, for example, a sixth groove or a sixth recess into which a portion of the sixth ball (B6) is inserted. The sixth ball support may fix the position of the sixth ball (B6) while supporting the rotation of the sixth ball (B6). In various embodiments, the fourth ball support, the fifth ball support, and the sixth ball support may be formed on the OIS carrier (46).

[0180] According to various embodiments, a retainer for fixing the relative positions between the fourth ball (B4), the fifth ball (B5), and the sixth ball (B6) may be placed in the OIS carrier (46) or the AF carrier (48) between the OIS carrier (46) and the AF carrier (48).

[0181] According to various embodiments, although not shown separately, the camera module (4) may include various sliding support structures (e.g., rollers or fluid bearings) implemented so that the AF carrier (48) can be stably and smoothly (or softly) slid in the first direction (①) relative to the OIS carrier (46), without being restricted to the fourth ball (B4), the fifth ball (B5), and the sixth ball (B6).

[0182] According to various embodiments, the AF driving unit (49) may be configured to provide a driving force to move the AF carrier (48) relative to the OIS carrier (46) under the control of the controller (315) of FIG. 3A. The AF controller (309) of FIG. 3A may include the AF driving unit (49). The controller (315) of FIG. 3A may transmit a target signal to move the AF carrier (48) to the AF controller (309) of FIG. 3A, and the AF controller (309) may move the AF carrier (48) relative to the OIS carrier (46) in a first direction (①). The AF controller (309) of FIG. 3A may include, for example, the AF driving unit (49) and an AF driver IC configured to transmit the target signal to the AF driving unit (49).

[0183] According to various embodiments, the AF driving unit (49) may be configured to move the AF carrier (48) in a first direction (①) with respect to the OIS carrier (46) through a force due to an electromagnetic force between the magnet and the coil. In various embodiments, the AF driving unit (49) may include a driving structure (e.g., a first driving structure) configured to control the movement of the moving member (e.g., the AF carrier (48)) in a direction perpendicular to the direction in which the coil and the magnet are arranged through a force due to an electromagnetic force between the coil and the magnet while maintaining a gap between the coil and the magnet (e.g., a polarized magnet).

[0184] According to various embodiments, the AF driving unit (49) may include a fifth coil (C5), a sixth coil (C6), a fifth magnet (e.g., a third polarization magnet) (M5), and a sixth magnet (e.g., a fourth polarization magnet) (M6). The fifth coil (C5) may be positioned in a fourth hole (H4) formed in a first side (4112) of the first housing (411). The sixth coil (C6) may be positioned in a fifth hole (H5) formed in a second side (4113) of the first housing (411). The fifth coil (C5) and the sixth coil (C6) may be arranged in a third direction (③). The fifth magnet (M5) may be arranged in the AF carrier (48) to face the fifth coil (C5). The sixth magnet (M6) can be arranged on the AF carrier (48) to face the sixth coil (C6). The fifth magnet (M5) and the sixth magnet (M6) can be arranged in the third direction (③). In the third direction (③), the fifth coil (C5) and the fifth magnet (M5) can overlap, and the sixth coil (C6) and the sixth magnet (M6) can overlap. The AF liquidator (49) can move the AF carrier (48) on which the second lens unit (43) is arranged in the first direction (①) with respect to the OIS carrier (46) through the force due to the electromagnetic force between the fifth coil (C5) and the fifth magnet (M5) and the force due to the electromagnetic force between the sixth coil (C6) and the sixth magnet (M6). The AF driving unit (49) may include a fifth yoke that can control the flow of a magnetic field formed from a fifth magnet (M5) (e.g., by forming a magnetic field) to increase the strength of the magnetic field and / or concentrate the magnetic force on the fifth coil (C5).

[0185] According to various embodiments, the AF driving unit (49) can be movably placed on the OIS carrier (46) by supporting the AF balls (B4, B5, B6) by the attractive force of the fifth magnet (M5) acting on the third yoke (not shown separately) disposed in the first housing (411) and the attractive force of the sixth magnet (M6) acting on the fourth yoke (not shown separately) disposed in the first housing (411).

[0186] According to various embodiments, the fifth coil (C5) and the fifth magnet (M5) may be omitted. The sixth coil (C6) and the sixth magnet (M6) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the fifth coil (C5) and the fifth magnet (M5).

[0187] According to various embodiments, the sixth coil (C6) and the sixth magnet (M6) may be omitted. The fifth coil (C5) and the fifth magnet (M5) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the sixth coil (C6) and the sixth magnet (M6).

[0188] According to various embodiments, in order to prevent collision and joint caused by the collision between the OIS carrier (46) and the AF carrier (48) when the AF carrier (48) moves in the third direction (③) with respect to the OIS carrier (46), the camera module (4) may include an impact-resistant elastomer (not shown separately) disposed between the OIS carrier (46) and the AF carrier (48).

[0189] According to various embodiments, the first coil (C1), the second coil (C2), the third coil (C3), the fourth coil (C4), the fifth coil (C5), and the sixth coil (C6) may be disposed on a PCB (40). The PCB (40) may be positioned between a first housing (411) and a second housing (412). The PCB (40) may include a first region (401), a second region (402), and a third region (403). The first region (401) may be positioned between a first side (4112) of the first housing (411) and a fifth side (4122) of the second housing (412). The second region (402) may be positioned between the second side (4113) of the first housing (411) and the sixth side (4123) of the second housing (412). The third region (403) may connect or extend the first region (401) and the second region (402) and may be positioned between the third side (4114) of the first housing (411) and the seventh side (4124) of the second housing (412). The PCB (40) may include, for example, an FPCB. The PCB (40) may be electrically connected to a substrate assembly included in the electronic device (100) of FIG. 1. The first coil (C1), the second coil (C2), the third coil (C3), the fourth coil (C4), the fifth coil (C5), and the sixth coil (C6) can be electrically connected to the processor (110) of FIG. 1 included in the substrate assembly through the PCB (40).

[0190] According to various embodiments, at least one of the sensor interface (305) of FIG. 3A, the ISP (311) (or the ISP (3060) of FIG. 3B), the controller (315), the motion sensor (321), the memory (313) (or the memory (3050) of FIG. 3B), and the flash (317) (or the flash (3020) of FIG. 3B) may be disposed on the PCB (40).

[0191] According to various embodiments, the controller (315) of FIG. 3A can transmit a target signal capable of moving the OIS carrier (46) in a second direction (②) with respect to the first housing (411) to the first coil (C1) and the second coil (C2) disposed on the PCB (40). The controller (315) of FIG. 3A can transmit a target signal capable of moving the OIS carrier (46) in a third direction (③) with respect to the first housing (411) to the third coil (C3) and the fourth coil (C4) disposed on the PCB (40).

[0192] According to various embodiments, the controller (315) of FIG. 3A can transmit a target signal that can move the AF carrier (48) in the first direction (①) with respect to the OIS carrier (46) to the fifth coil (C5) and the sixth coil (C6) arranged on the PCB (40).

[0193] According to various embodiments, the OIS carrier (48) may be implemented to be tiltable with respect to the housing (41). The camera module (4) may include a driving unit (not shown separately) configured to provide a driving force capable of rotating (or tilting) the OIS carrier (48) about an axis parallel to the first direction (①) with respect to the housing (41), for example, through a first driving structure or a second driving structure disposed between the housing (41) and the OIS carrier (48). A plurality of OIS balls (B1, B2, B3) disposed between the housing (41) and the OIS carrier (48) may support the rotational movement of the OIS carrier (48) with respect to the housing (41).

[0194] According to various embodiments, the second lens unit (43) may be implemented to be movable in the second direction (②) with respect to the housing (41). The camera module (4) may include a driving unit (not shown separately) configured to provide a driving force that can translate the second lens unit (43) in the second direction (②) with respect to the housing (41), for example, through a first driving structure or a second driving structure disposed between the housing (41) and the second lens barrel (434) of the second lens unit (43). The camera module (4) may include a ball guide structure (not shown separately) including a plurality of balls disposed between the housing (41) and the second lens barrel (434) of the second lens unit (43) to smoothly (or gently) support the second lens unit (43) from being moved in the second direction (②) with respect to the housing (41).

[0195] According to various embodiments, the second lens unit (43) may be implemented to be movable in the second direction (②) with respect to the OIS carrier (46). The camera module (4) may include a driving unit (not shown separately) configured to provide a driving force that can translate the second lens unit (43) in the second direction (②) with respect to the OIS carrier (46), for example, through a first driving structure or a second driving structure disposed between the OIS carrier (46) and the second lens barrel (434) of the second lens unit (43). The camera module (4) may include a ball guide structure (not shown separately) including a plurality of balls disposed between the OIS carrier (46) and the second lens barrel (434) of the second lens unit (43) to smoothly (or gently) support the second lens unit (43) from being moved in the second direction (②) with respect to the OIS carrier (46).

[0196] FIG. 12 is a perspective view of a portion of a camera module (4) according to various embodiments of the present disclosure.

[0197] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 12. All combinations of the features described below in connection with FIG. 12 may be considered to be encompassed by the present disclosure as specific examples.

[0198] Referring to FIG. 12, the camera module (4) may include a first lens unit (42), a second lens unit (43), an OIS carrier (46), an AF carrier (48), a first ball (B1), a second ball (B2), a third ball (B3) (see FIG. 4), a fourth ball (B4) (see FIG. 4), a fifth ball (B5) (see FIG. 4), a sixth ball (B6) (see FIG. 4), a first coil (C1), a second coil (C2), a first magnet (M1) (see FIG. 4), a second magnet (M2) (see FIG. 4), a fourth coil (C4), a fourth magnet (C4), a fifth coil (C5), and a fifth magnet (M5). Descriptions of some components that are the same as those in the previous embodiments may not be repeated.

[0199] According to various embodiments, the camera module (4) according to the embodiment of FIG. 12 omits the third coil (C3) and the third magnet (M3) compared to the camera module (4) according to the embodiment of FIG. 4. The fourth coil (C4) and the fourth magnet (M4) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the decrease in driving force due to the omission of the third coil (C3) and the third magnet (M3) compared to the embodiment of FIG. 4.

[0200] According to various embodiments, the camera module (4) according to the embodiment of FIG. 12 omits the sixth coil (C6) and the sixth magnet (M6) compared to the camera module (4) according to the embodiment of FIG. 4. The fifth coil (C5) and the fifth magnet (M5) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the sixth coil (C6) and the sixth magnet (M6) compared to the embodiment of FIG. 4.

[0201] According to various embodiments, an embodiment in which a drive structure for movement of an OIS carrier (46) including a fourth coil (C4) and a fourth magnet (M4) and a drive structure for movement of an AF carrier (48) including a fifth coil (C5) and a fifth magnet (M5) are provided on different sides of the camera module (5) can reduce or prevent mutual magnetic interference between magnets, compared to an embodiment in which a drive structure for movement of an OIS carrier (46) including a third coil (C3) and a third magnet (M3) and a drive structure for movement of an AF carrier (48) including a fifth coil (C5) and a fifth magnet (M5) are provided on the same side of the camera module (4). An embodiment in which a drive structure for movement of an OIS carrier (46) including a fourth coil (C4) and a fourth magnet (M4) and a drive structure for movement of an AF carrier (48) including a fifth coil (C5) and a fifth magnet (M5) are provided on different sides of the camera module (5) can reduce magnetic interference between magnets compared to an embodiment in which a drive structure for movement of an OIS carrier (46) including a fourth coil (C4) and a fourth magnet (M4) and a drive structure for movement of an AF carrier (48) including a sixth coil (C6) and a sixth magnet (M6) are provided on the same side of the camera module (4).

[0202] FIG. 13 is a perspective view of a portion of a camera module (4) according to various embodiments of the present disclosure.

[0203] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 13. All combinations of the features described below in connection with FIG. 13 may be considered to be encompassed by the present disclosure as specific examples.

[0204] Referring to FIG. 13, the camera module (4) may include a first housing (411), an OIS carrier (46) in which a reflective member (44) is disposed, an AF carrier (48) in which a second lens unit (43) (see FIG. 4) is disposed, a first coil (C1), a second coil (C2), a third coil (C3), a fourth coil (C4), a fifth coil (C5), a fifth coil (C6), a first magnet (M1), a second magnet (M2), a third magnet (M3), a fourth magnet (M4), a fifth magnet (M5), and / or a sixth magnet (M6). The camera module (4) may include OIS balls (B1, B2, B3). The camera module (4) may include a first sub-ball (B31) and / or a second sub-ball (B32). The camera module (4) may include AF balls (B4, B5, B6). Descriptions of some components that are the same as those in the previous embodiments may not be repeated.

[0205] According to various embodiments, the camera module (4) may have a driving structure (e.g., a first driving structure) configured to control movement of the OIS carrier (46) in a third direction (③) perpendicular to the first direction (①) in which the first coil (C1) and the first magnet (M1) are arranged by means of an electromagnetic force between the first coil (C1) and the first magnet (M1), while maintaining a gap between the first coil (C1) and the first magnet (e.g., a first polarized magnet) (M1). The camera module (4) may have a driving structure (e.g., a first driving structure) configured to control movement of the OIS carrier (46) in a third direction (③) perpendicular to the first direction (①) in which the second coil (C2) and the second magnet (M2) are arranged, by means of a force due to an electromagnetic force between the second coil (C2) and the second magnet (M2), while maintaining a gap between the second coil (C2) and the second magnet (M2). In various embodiments, an integral or single coil may be provided to replace the first coil (C1) and the second coil (C2), and an integral single magnet may be provided to replace the first magnet (M1) and the second magnet (M2).

[0206] According to various embodiments, a plurality of OIS balls (B1, B2, B3) may be positioned between a third side (4114) of the first housing (411) and an OIS carrier (46). A plurality of OIS balls (B1, B2, B3) may be positioned between the third side (4114) of the first housing (411) and the OIS carrier (46). The plurality of OIS balls (B1, B2, B3) may support sliding between the third side (4114) of the first housing (411) and the OIS carrier (46) so that the OIS carrier (46) may slide stably and smoothly (or softly) in the second direction (②) and / or the third direction (③) with respect to the first housing (411). The plurality of OIS balls (B1, B2, B3) may include, but are not limited to, a first ball (B1), a second ball (B2), and a third ball (B3).

[0207] According to various embodiments, the camera module (4) may include a third driving structure configured to control movement of a movable member (e.g., an OIS carrier (46)) in a direction perpendicular to the direction in which the coil and the magnet are arranged by a force due to an electromagnetic force between the coil and the magnet under a condition (or situation) in which a change in distance between the coil and the magnet (e.g., a polarized magnet) may occur. The third driving structure may be, for example, based on the Lorentz force according to Fleming's left-hand rule. The third driving structure may have a third driving structure configured to control movement of the OIS carrier (46) in a second direction (②) perpendicular to the third direction (③) in which the third coil (C3) and the third magnet (M3) are arranged by a force due to an electromagnetic force between the third coil (C3) and the third magnet (e.g., a fifth polarized magnet) (M3) under a condition in which a change in distance between the third coil (C3) and the third magnet (M3) may occur. The camera module (4) may have a third driving structure configured to control movement of the OIS carrier (46) in a second direction (②) perpendicular to the third direction (③) in which the fourth coil (C4) and the fourth magnet (M4) are arranged, through a force due to an electromagnetic force between the fourth coil (C4) and the fourth magnet (M4), under conditions in which a change in distance between the fourth coil (C4) and the fourth magnet (e.g., the sixth polarization magnet) (M4) may occur. The conditions under which a change in distance between the third coil (C3) and the third magnet (M3) can occur, and the conditions under which a change in distance between the fourth coil (C4) and the fourth magnet (M4) can occur, can be formed when the OIS carrier (46) moves in the third direction (③) by a first driving structure including a first coil (C1) and a first magnet (e.g., a first polarization magnet) (M1), and another first driving structure including a second coil (C2) and a second magnet (e.g., a second polarization magnet) (M2).

[0208] According to various embodiments, the third coil (C3) and the third magnet (M3) may be omitted. The fourth coil (C4) and the fourth magnet (M4) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the third coil (C3) and the third magnet (M3).

[0209] According to various embodiments, the fourth coil (C4) and the fourth magnet (M4) may be omitted. The third coil (C3) and the third magnet (M3) may be implemented in a larger size to secure a greater magnetic force in order to compensate for the reduction in driving force due to the omission of the fourth coil (C4) and the fourth magnet (M4).

[0210] According to various embodiments, the camera module (4) may have a driving structure configured to control movement of an AF carrier (48) having a second lens unit (43) (see FIG. 4) disposed in a first direction (①) with respect to an OIS carrier (46) through a force due to an electromagnetic force between a fifth coil (C5) and a fifth magnet (M5) and / or a force due to an electromagnetic force between a sixth coil (C6) and a sixth magnet (M6).

[0211] According to various embodiments, a plurality of AF balls (B4, B5, B6) may be arranged between the AF carrier (48) and the OIS carrier (46). The plurality of AF balls (B4, B5, B6) may support sliding between the OIS carrier (46) and the AF carrier (48) so that the AF carrier (48) may slide stably and smoothly (or softly) in the first direction (①) with respect to the OIS carrier (46). The plurality of AF balls (B4, B5, B6) may include, but are not limited to, a fourth ball (B4), a fifth ball (B5), and a sixth ball (B6).

[0212] FIG. 14 is an exploded perspective view of a camera module (14) according to various embodiments of the present disclosure.

[0213] FIG. 15 is a drawing showing a camera module (14) according to various embodiments of the present disclosure.

[0214] FIG. 16 is a cross-sectional view of a portion of a camera module (14) taken along line G-G' of FIG. 15 according to various embodiments of the present disclosure.

[0215] FIG. 17 is a cross-sectional view of a camera module (4) taken along line H-H' of FIG. 15 according to various embodiments of the present disclosure.

[0216] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIGS. 14, 15, 16, and 17. All combinations of the features described below in connection with FIGS. 14, 15, 16, and 17 may be considered to be encompassed by the present disclosure as specific examples.

[0217] Referring to FIGS. 14, 15, 16, and 17, a camera module (14) (e.g., the camera module of FIG. 3A or the camera module (3000) of FIG. 3B) may include a first housing (411), a second housing (412), a first lens unit (42), a second lens unit (43), a reflective member (44), an image sensor assembly (45) (see FIG. 4), an OIS carrier (46), a middle guide (1400), a plurality of OIS balls (B11, B12, B13, B14, B15, B16, B17, B18, B19), an OIS driver (47) (see FIG. 4), an AF carrier (48), a plurality of AF balls (B4, B5, B6), an AF driver (49) (see FIG. 4), and / or a PCB (40). Descriptions of some components that are identical to those in the previous examples may not be repeated.

[0218] According to various embodiments, the middle guide (1400) may be positioned between the third side (4114) of the first housing (411) and the OIS carrier (48). The plurality of OIS balls (B11, B12, B13, B14, B15, B16, B17, B18, B19) may include first to sixth OIS balls (B11, B12, B13, B14, B15, B16) positioned between the third side (4114) of the first housing (411) and the middle guide (1400), and seventh to ninth OIS balls (B17, B18, B19) positioned between the middle guide (1400) and the OIS carrier (46). Due to the attractive force of the first magnet (M1) and the second magnet (M2) acting on the first yoke (Y1), the third side (4114) of the first housing (411) and the middle guide (1400) can be supported by the first to sixth OIS balls (B11, B12, B13, B14, B15, B16) and maintained with a constant gap in the first direction (①). Due to the attractive force of the first magnet (M1) and the second magnet (M2) acting on the first yoke (Y1), the middle guide (1400) and the OIS carrier (46) can be supported by the seventh to ninth OIS balls (B17, B18, B19) and maintained with a constant gap in the first direction (①).

[0219] According to various embodiments, the middle guide (1400) may include a first portion (1410), a second portion (1420), and a third portion (1430). The first portion (1410) may be a first support bar extending in a third direction (③). The second portion (1410) may be a second support bar extending in a second direction (②) from one end of the first portion (1410). The third portion (1430) may be a third support bar extending in the second direction (②) from the other end of the first portion (1410). The second portion (1420) and the third portion (1430) may be arranged orthogonal to the first portion (1410) and spaced apart from each other in the third direction (③). The first magnet (M1) and the second magnet (M2) may face the first coil (C1) and the second coil (C2), respectively, through the second part (1420) and the third part (1430) of the middle guide (1400). In various embodiments, the first to fourth OIS balls (B11, B12, B13, B14) may be arranged in the second direction (②) and positioned between the third side (4114) of the first housing (411) and the second part (1420) of the middle guide (1400). In various embodiments, the fifth and sixth OIS balls (B15, B16) may be arranged in the second direction (②) and positioned between the third side (4114) of the first housing (411) and the third part (1430) of the middle guide (1400). In various embodiments, the seventh and eighth OIS balls (B17, B18) may be arranged in the second direction (②) and positioned between the second part (1420) of the middle guide (1400) and the OIS carrier (46). In various embodiments, the ninth OIS ball (B19) may be positioned between the third part (1430) of the middle guide (1400) and the OIS carrier (46).

[0220] According to various embodiments, the middle guide (1400) may enable the OIS carrier (46) to translate in the second direction (②) and / or the third direction (③) with respect to the first housing (411), but may reduce or prevent rotation about an axis parallel to the first direction (①).

[0221] According to various embodiments, the second portion (1420) of the middle guide (1400) may include a first guide rail (GL1) on which first to fourth OIS balls (B11, B12, B13, B14) are positioned. The first to fourth OIS balls (B11, B12, B13, B14) may be positioned in a plurality of first ball supports (e.g., grooves or recesses) (BS1) formed on a third side (4114) of the first housing (411). The plurality of first ball supports (BS1) may fix the positions of the first to fourth OIS balls (B11, B12, B13, B14). The first to fourth OIS balls (B11, B12, B13, B14) may be arranged in the second direction (②) between the plurality of first ball supports (BS1) and the first guide rail (GL1). The third part (1430) of the middle guide (1400) may include a second guide rail (GL2) on which the fifth and sixth OIS balls (B15, B16) are positioned. The fifth and sixth OIS balls (B15, B16) may be positioned in a plurality of second ball supports (e.g., grooves or recesses) (not shown) formed on the third side (4114) of the first housing (411). The plurality of second ball supports may fix the positions of the fifth and sixth OIS balls (B15, B16). The fifth and sixth OIS balls (B15, B16) can be arranged in the second direction (②) between a plurality of second ball supports and the second guide rail (GL2). The first guide rail (GL1) and the second guide rail (GL2) can guide the OIS carrier (46) to be supported by the first to sixth OIS balls (B11, B12, B13, B14, B15, B16) and to move in the second direction (②) with respect to the first housing (411).The first guide rail (GL1) and the second guide rail (GL2) can prevent the OIS carrier (46) from moving in a direction different from the second direction (②) with respect to the first housing (411).

[0222] According to various embodiments, the second part (1420) of the middle guide (1400) may include a third guide rail (GL3) on which the seventh OIS ball (B17) is positioned. The seventh OIS ball (B17) may be positioned in a third ball support (e.g., a groove or recess) (BS3) formed in the OIS carrier (46). The third ball support (BS3) may fix the position of the seventh OIS ball (B17). The seventh OIS ball (B17) may be positioned between the third ball support (BS3) and the third guide rail (GL3). The second part (1420) of the middle guide (1400) may include a fourth guide rail (GL4) on which the eighth OIS ball (B18) is positioned. The eighth OIS ball (B18) may be positioned in a fourth ball support (e.g., a groove or recess) (BS4) formed in the OIS carrier (46). The fourth ball support (BS4) may fix the position of the eighth OIS ball (B18). The eighth OIS ball (B18) may be positioned between the fourth ball support (BS4) and the fourth guide rail (GL4). The third part (1430) of the middle guide (1400) may include a fifth guide rail (not shown separately) on which the ninth OIS ball (B19) is positioned. The ninth OIS ball (B19) may be positioned in a fifth ball support (e.g., a groove or recess) (not shown separately) formed in the OIS carrier (46). The fifth ball support may fix the position of the ninth OIS ball (B19). The ninth OIS ball (B19) can be placed between the fifth ball support and the fifth guide rail. The third guide rail (GL3), the fourth guide rail (GL4), and the fifth guide rail can guide the OIS carrier (46) to be supported by the seventh to ninth OIS balls (B17, B18, B19) and to move in the third direction (③) with respect to the first housing (411).The third guide rail (GL3) and the fourth guide rail (GL4) can prevent the OIS carrier (46) from moving in a direction other than the third direction (③) with respect to the first housing (411).

[0223] FIG. 18 is a drawing showing a camera module (18) according to various embodiments of the present disclosure.

[0224] It is understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed in connection with FIG. 18. All combinations of the features described below in connection with FIG. 18 may be considered to be encompassed by the present disclosure as specific examples.

[0225] Referring to FIG. 18, a camera module (18) (e.g., the camera module of FIG. 3A or the camera module (3000) of FIG. 3B) may include a housing (1810) (e.g., the housing (41) of FIG. 4), a first lens unit (42), a second lens unit (43), an image sensor assembly (45), an OIS carrier (46), a plurality of OIS balls (e.g., the plurality of OIS balls (B1, B2, B3) of FIG. 4), an OIS driver (e.g., the OIS driver (47) of FIG. 4), an AF carrier (48), a plurality of AF balls (e.g., the plurality of AF balls (B4, B5, B6) of FIG. 4), an AF driver (e.g., the AF driver (49) of FIG. 4), a PCB (40), a first reflective member (e.g., the reflective member (44) of FIG. 4), and / or a second reflective member (1820). Descriptions of some components that are identical to those in the previous examples may not be repeated.

[0226] According to various embodiments, the image sensor (451) may be disposed in the housing (1810) such that the light-receiving area of ​​the image sensor (451) does not face the second lens unit (43). The second reflective member (1820) may be disposed on the inner wall of the housing (1810). The second reflective member (1820) may change the light path between the first lens unit (42) and the image sensor (451) so that light passing through the first lens unit (42) may be focused on the light-receiving area of ​​the image sensor (451). In FIG. 18, a red arrow indicates the light path. The second reflective member (1820) may be defined as a fourth optical system. The camera module (18) according to various embodiments may be, for example, a telephoto camera module, and may provide (or form) a BFL, TTL, or OPL capable of focusing an image at a high magnification (e.g., about 5x or more).

[0227] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) includes a housing (e.g., housing (41)), a first lens unit (e.g., first lens unit (42)), an OIS carrier (e.g., OIS carrier (46)), an AF carrier (e.g., AF carrier (48)), a reflective member (e.g., reflective member (44)), and an image sensor (e.g., image sensor (451)). The first lens unit has a first optical axis (e.g., the first optical axis (A1)) and includes at least one lens element. The OIS carrier is disposed in the housing so as to be movable relative to the housing in a direction orthogonal to the first optical axis (e.g., the second direction (②) and / or the third direction (③)). The AF carrier supports the first lens unit and is disposed in the OIS carrier so as to be movable in a first direction parallel to the first optical axis (e.g., the first direction (①)) relative to the OIS carrier. The reflective member is disposed in the OIS carrier. The image sensor is configured to receive light through a reflective member and a first lens unit.

[0228] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a plurality of first balls (e.g., a first ball (B1), a second ball (B2), and a third ball (B3)) disposed between a housing (e.g., a housing (41)) and an OIS carrier (e.g., an OIS carrier (46)). The camera module may include a plurality of second balls (e.g., a fourth ball (B4), a fifth ball (B5), and a sixth ball (B6)) disposed between an OIS carrier and an AF carrier (e.g., an AF carrier (48)).

[0229] According to various embodiments of the present disclosure, a camera module (e.g., camera module (14)) may include a middle guide (e.g., middle guide (1400)) positioned between a housing (e.g., housing (41)) and an OIS carrier (e.g., OIS carrier (46)). The camera module may include a plurality of first balls (e.g., first to sixth OIS balls (B11, B12, B13, B14, B15, B16)) positioned between the housing and the middle guide. The camera module may include a plurality of second balls (e.g., seventh to ninth OIS balls (B17, B18, B19)) positioned between the middle guide and the OIS carrier. The middle guide may include a first guide rail (e.g., first guide rail (GL1) and second guide rail (GL2)) on which the plurality of first balls are positioned. The first guide rail may be configured to guide the OIS carrier to move in a second direction (e.g., the second direction (②)) orthogonal to a first direction (e.g., the first direction (①)) with respect to the housing. The middle guide may include second guide rails (e.g., the third guide rail (GL3) and the fourth guide rail (GL4)) on which a plurality of second balls are positioned. The second guide rail may be configured to guide the OIS carrier to move in a third direction (e.g., the third direction (③)) orthogonal to the first direction and orthogonal to the second direction with respect to the housing.

[0230] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a second lens unit (e.g., a second lens unit (43)) disposed in a housing (e.g., a housing (41)). The second lens unit may have a second optical axis (e.g., a second optical axis (A2)) that is different from a first optical axis (e.g., a first optical axis (A1)). The second lens unit may include at least one lens element. The first lens unit (e.g., the first lens unit (42)) and a reflective member (e.g., a reflective member (44)) may overlap in a direction parallel to the first optical axis. The second lens unit and the reflective member may overlap in a direction parallel to the second optical axis (e.g., the second optical axis (A2)). An image sensor (e.g., an image sensor (451)) may be configured to receive light through the second lens unit, the reflective member, and the first lens unit.

[0231] According to various embodiments of the present disclosure, the second lens unit (e.g., the second lens unit (43)) may be configured to be movable in a direction parallel to the second optical axis (e.g., the second optical axis (A2)) with respect to the housing (e.g., the housing (41)). The camera module (e.g., the camera module (4)) may include a driving unit configured to provide a driving force for moving the second lens unit with respect to the housing.

[0232] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a second lens unit (e.g., a second lens unit (43)) disposed on an OIS carrier (e.g., an OIS carrier (46)). The second lens unit may have a second optical axis (e.g., a second optical axis (A2)) different from a first optical axis (e.g., a first optical axis (A1)). The second lens unit may include at least one lens element. The first lens unit (e.g., the first lens unit (42)) and a reflective member (e.g., a reflective member (44)) may overlap in a direction parallel to the first optical axis. The second lens unit and the reflective member may overlap in a direction parallel to the second optical axis. An image sensor (e.g., an image sensor (451)) may be configured to receive light through the second lens unit, the reflective member, and the first lens unit.

[0233] According to various embodiments of the present disclosure, the second lens unit (e.g., the second lens unit (43)) may be configured to be movable in a direction parallel to the second optical axis (e.g., the second optical axis (A2)) with respect to the OIS carrier (e.g., the OIS carrier (46)). The camera module (e.g., the camera module (4)) may include a driving unit configured to provide a driving force for moving the second lens unit with respect to the OIS carrier.

[0234] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include an OIS driving unit (e.g., OIS driving unit (47)) configured to provide a driving force for moving an OIS carrier (e.g., OIS carrier (46)) relative to a housing (e.g., housing (41)). The OIS driving unit may include a plurality of coils (e.g., a first coil (C1), a second coil (C2), a third coil (C3), and a fourth coil (C4)) disposed in the housing. The OIS driving unit may include a plurality of magnets (e.g., a first magnet (M1), a second magnet (M2), a third magnet (M3), and a fourth magnet (M4)) disposed in the OIS carrier to face the plurality of coils.

[0235] According to various embodiments of the present disclosure, at least one first coil (e.g., the first coil (C1) and the second coil (C2)) among a plurality of coils (e.g., the first coil (C1), the second coil (C2), the third coil (C3), and the fourth coil (C4)) and at least one first magnet (e.g., the first magnet (M1) and the second magnet (M2)) among a plurality of magnets (e.g., the first magnet (M1), the second magnet (M2), the third magnet (M3), and the fourth magnet (M4)) can be configured to provide a first driving force to move an OIS carrier (e.g., the OIS carrier (46)) in a second direction (e.g., the second direction (②)) orthogonal to a first direction (e.g., the first direction (①)) with respect to a housing (e.g., the housing (41)). At least one second coil (e.g., the third coil (C3) and the fourth coil (C4)) among the plurality of coils and at least one second magnet (e.g., the third magnet (M3) and the fourth magnet (M4)) among the plurality of magnets can be configured to provide a second driving force to move the OIS carrier in a third direction (e.g., the third direction (③)) orthogonal to the first direction and orthogonal to the second direction with respect to the housing (41).

[0236] According to various embodiments of the present disclosure, at least one first coil (e.g., the first coil (C1) and the second coil (C2)) and at least one first magnet (e.g., the first magnet (M1) and the second magnet (M2)) may face each other in a first direction (e.g., the first direction (①)). At least one second coil (e.g., the third coil (C3) and the fourth coil (C4)) and at least one second magnet (e.g., the third magnet (M3) and the fourth magnet (M4)) may face each other in a third direction (e.g., the third direction (③)).

[0237] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a first yoke (e.g., first yoke (Y1)) disposed in a housing (e.g., housing (41)). The camera module may include a second yoke (e.g., second yoke (Y2)) disposed in an OIS carrier (e.g., OIS carrier (46)). The camera module may include a plurality of balls (e.g., first ball (B1), second ball (B2), and third ball (B3)) disposed between the housing (e.g., housing (41)) and the OIS carrier. At least one first coil (e.g., first coil (C1) and second coil (C2)) and at least one first magnet (e.g., first magnet (M1) and second magnet (M2)) may be positioned between the first yoke (Y1) and the second yoke (Y2). Through the force of attraction between at least one first magnet and the first yoke, the OIS carrier can be movably positioned in the housing while being supported on a plurality of balls.

[0238] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include an AF driving unit (e.g., AF driving unit (49)) configured to provide a driving force for moving an AF carrier (e.g., AF carrier (48)) relative to an OIS carrier (e.g., OIS carrier (46)). The AF driving unit may include at least one coil (e.g., a fifth coil (C5) and a sixth coil (C6)) disposed in a housing (e.g., housing (41)). The AF driving unit may include at least one magnet (e.g., a fifth magnet (M5) and a sixth magnet (M6)) disposed in the AF carrier to face the at least one coil.

[0239] According to various embodiments of the present disclosure, the OIS carrier (46) may be configured to be rotatable relative to the housing (41) about an axis parallel to the first optical axis (A1). The camera module (4) may include a driving unit configured to provide a driving force for rotating the OIS carrier (46) relative to the housing (41).

[0240] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a second reflective member (e.g., second reflective member (1820)) disposed within a housing (e.g., housing (41)). A first lens unit (e.g., first lens unit (42)) may be positioned between the reflective member (e.g., reflective member (44)) and the second reflective member. An image sensor (e.g., image sensor (451)) may face the second reflective member. The image sensor may be configured to receive light through the reflective member (e.g., reflective member (44)), the first lens unit, and the second reflective member.

[0241] According to various embodiments of the present disclosure, a reflective member (e.g., reflective member (44)) may include a prism. The prism may include an incident surface (e.g., incident surface (441)), an exit surface (e.g., exit surface (442)) facing a first lens unit (e.g., first lens unit (42)), and a reflective surface (e.g., reflective surface (443)) that reflects light incident on the incident surface to the exit surface.

[0242] According to various embodiments of the present disclosure, an electronic device (e.g., electronic device (100)) is provided, wherein the electronic device includes a housing and a camera module (e.g., camera module (4)). The housing forms at least a portion of an outer surface of the electronic device. The camera module is positioned within the housing and is visually exposed through a camera area of ​​the outer surface of the electronic device. The camera module includes a camera housing (e.g., housing (41)), a first lens unit (e.g., first lens unit (42)), an OIS carrier (e.g., OIS carrier (46)), an AF carrier (e.g., AF carrier (48)), a reflective member (e.g., reflective member (44)), and an image sensor (e.g., image sensor (451)). The first lens unit has a first optical axis (e.g., first optical axis (A1)) and includes at least one lens element. The OIS carrier is arranged in the camera housing so as to be movable relative to the camera housing in a direction orthogonal to the first optical axis (e.g., the second direction (②) and / or the third direction (③)). The AF carrier supports the first lens unit and is arranged in the OIS carrier so as to be movable in a first direction parallel to the first optical axis (e.g., the first direction (①)) relative to the OIS carrier. A reflective member is arranged in the OIS carrier. The image sensor is configured to receive light through the reflective member and the first lens unit.

[0243] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a plurality of first balls (e.g., a first ball (B1), a second ball (B2), and a third ball (B3)) disposed between a camera housing (e.g., a housing (41)) and an OIS carrier (e.g., an OIS carrier (46)). The camera module may include a plurality of second balls (e.g., a fourth ball (B4), a fifth ball (B5), and a sixth ball (B6)) disposed between an OIS carrier and an AF carrier (e.g., an AF carrier (48)).

[0244] According to various embodiments of the present disclosure, a camera module (e.g., camera module (14)) may include a middle guide (e.g., middle guide (1400)) positioned between a camera housing (e.g., housing (41)) and an OIS carrier (e.g., OIS carrier (46)). The camera module may include a plurality of first balls (e.g., first to sixth OIS balls (B11, B12, B13, B14, B15, B16)) positioned between the camera housing and the middle guide. The camera module may include a plurality of second balls (e.g., seventh to ninth OIS balls (B17, B18, B19)) positioned between the middle guide and the OIS carrier. The middle guide may include a first guide rail (e.g., a first guide rail (GL1) and a second guide rail (GL2)) on which the plurality of first balls are positioned. The first guide rail may be configured to guide the OIS carrier to move in a second direction (e.g., the second direction (②)) orthogonal to a first direction (e.g., the first direction (①)) with respect to the camera housing. The middle guide may include a second guide rail (e.g., a third guide rail (GL3) and a fourth guide rail (GL4)) on which a plurality of second balls are positioned. The second guide rail may be configured to guide the OIS carrier to move in a third direction (e.g., the third direction (③)) orthogonal to the first direction and orthogonal to the second direction with respect to the camera housing.

[0245] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include a second lens unit (e.g., a second lens unit (43)) disposed in a camera housing (e.g., a housing (41)). The second lens unit may have a second optical axis (e.g., a second optical axis (A2)) that is different from a first optical axis (e.g., a first optical axis (A1)). The first lens unit (e.g., the first lens unit (42)) and a reflective member (e.g., a reflective member (44)) may overlap in a direction parallel to the first optical axis. The second lens unit and the reflective member may overlap in a direction parallel to the second optical axis. An image sensor (e.g., an image sensor (451)) may be configured to receive light through the second lens unit, the reflective member, and the first lens unit.

[0246] According to various embodiments of the present disclosure, a camera module (e.g., camera module (4)) may include an OIS driving unit (e.g., OIS driving unit (47)) configured to provide a driving force for moving an OIS carrier (e.g., OIS carrier (46)) relative to a camera housing (e.g., housing (41)). The OIS driving unit may include a plurality of first coils (e.g., a first coil (C1), a second coil (C2), a third coil (C3), and a fourth coil (C4)) disposed in the camera housing. The OIS driving unit may include a first plurality of magnets (e.g., a first magnet (M1), a second magnet (M2), a third magnet (M3), and a fourth magnet (M4)) disposed in the OIS carrier to face the plurality of first coils. The camera module may include an AF driving unit (e.g., an AF driving unit (49)) configured to provide a driving force for moving an AF carrier (e.g., an AF carrier (48)) relative to an OIS carrier. The AF driving unit may include at least one second coil (e.g., a fifth coil (C5) and a sixth coil (C6)) disposed in the camera housing. The AF driving unit may include at least one second magnet (e.g., a fifth magnet (M5) and a sixth magnet (M6)) disposed in the AF carrier so as to face the at least one second coil.

[0247] The embodiments disclosed in this disclosure and the drawings are merely examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be understood that the scope of the various embodiments of the present disclosure includes various modifications or variations in addition to the embodiments disclosed herein. Additionally, it should be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. For example, although the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, it is emphasized that some of these embodiments may be connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. For example, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

1. In the camera module (4), Housing (41); A first lens unit (42) having a first optical axis (A1) and including at least one lens element; An OIS carrier (46) arranged in the housing (41) so as to be movable relative to the housing (41) in a direction (②, ③) orthogonal to the first optical axis (A1); An AF carrier (48) configured to support the first lens unit (42) and arranged on the OIS carrier (46) so as to be movable in a first direction (①) parallel to the first optical axis (A1) with respect to the OIS carrier (46); A reflective member (44) placed on the above OIS carrier (46); and A camera module including an image sensor (451) configured to receive light through the reflective member (44) and the first lens unit (42).

2. In paragraph 1, A plurality of first balls (B1, B2, B3) arranged between the housing (41) and the OIS carrier (46); and A camera module further comprising a plurality of second balls (B4, B5, B6) arranged between the OIS carrier (46) and the AF carrier (48).

3. In paragraph 1, A middle guide (1400) positioned between the housing (41) and the OIS carrier (46); A plurality of first balls (B11, B12, B13, B14, B15, B16) arranged between the housing (41) and the middle guide (1400); and It further includes a plurality of second balls (B17, B18, B19) arranged between the middle guide (1400) and the OIS carrier (46), The above middle guide (1400) includes a first guide rail (GL1, GL2) on which the plurality of first balls (B11, B12, B13, B14, B15, B16) are positioned, and the first guide rail (GL1, GL2) is configured to guide the OIS carrier (46) to move in a second direction (②) orthogonal to the first direction (①) with respect to the housing (41), and A camera module in which the middle guide (1400) includes a second guide rail (GL3, GL4) on which the plurality of second balls (B17, B18, B19) are positioned, and the second guide rail (GL3, GL4) is configured to guide the OIS carrier (46) to move in a third direction (③) that is orthogonal to the first direction (①) and orthogonal to the second direction (②) with respect to the housing (41).

4. In paragraph 1, It further includes a second lens unit (43) disposed in the housing (41), having a second optical axis (A2) different from the first optical axis (A1), and including at least one lens element, The first lens portion (42) and the reflective member (44) overlap in a direction parallel to the first optical axis (A1), The second lens portion (43) and the reflective member (44) overlap in a direction parallel to the second optical axis (A2), and The above image sensor (451) is a camera module configured to receive light through the second lens unit (43), the reflective member (44), and the first lens unit (42).

5. In paragraph 4, The second lens unit (43) is configured to be movable in a direction parallel to the second optical axis (A2) with respect to the housing (41), and The camera module (4) further includes a driving unit configured to provide a driving force for moving the second lens unit (43) relative to the housing (41).

6. In paragraph 1, It further includes a second lens unit (43) disposed on the OIS carrier (46), having a second optical axis (A2) different from the first optical axis (A1), and including at least one lens element, The first lens portion (42) and the reflective member (44) overlap in a direction parallel to the first optical axis (A1), The second lens portion (43) and the reflective member (44) overlap in a direction parallel to the second optical axis (A2), and The above image sensor (451) is a camera module configured to receive light through the second lens unit (43), the reflective member (44), and the first lens unit (42).

7. In paragraph 6, The second lens unit (43) is configured to be movable in a direction parallel to the second optical axis (A2) with respect to the OIS carrier (46), and The camera module (4) further includes a driving unit configured to provide driving force for moving the second lens unit (43) relative to the OIS carrier (46).

8. In paragraph 1, It further includes an OIS driving unit (47) configured to provide a driving force for moving the OIS carrier (46) relative to the housing (41), and the OIS driving unit (47) comprises: A plurality of coils (C1, C2, C3, C4) arranged in the above housing (41); and A camera module including a plurality of magnets (M1, M2, M3, M4) arranged on the OIS carrier (46) facing the plurality of coils (C1, C2, C3, C4).

9. In paragraph 8, At least one first coil (C1, C2) among the plurality of coils (C1, C2, C3, C4) and at least one first magnet (M1, M2) among the plurality of magnets (M1, M2, M3, M4) are configured to provide a first driving force to move the OIS carrier (46) in a second direction (②) orthogonal to the first direction (①) with respect to the housing (41), and A camera module configured such that at least one second coil (C3, C4) among the plurality of coils (C1, C2, C3, C4) and at least one second magnet (M3, M4) among the plurality of magnets (M1, M2, M3, M4) provide a second driving force to move the OIS carrier (46) in a third direction (③) orthogonal to the first direction (①) and orthogonal to the second direction (②) with respect to the housing (41).

10. In paragraph 9, The at least one first coil (C1, C2) and the at least one first magnet (M1, M2) face each other in the first direction (①), and A camera module in which the at least one second coil (C3, C4) and the at least one second magnet (M3, M4) face each other in the third direction (③).

11. In paragraph 10, A first yoke (Y1) arranged in the above housing (41); A second yoke (Y2) arranged on the above OIS carrier (46); and Further comprising a plurality of balls (B1, B2, B3) arranged between the housing (41) and the OIS carrier (46), The at least one first coil (C1, C2) and the at least one first magnet (M1, M2) are positioned between the first yoke (Y1) and the second yoke (Y2), and A camera module in which the OIS carrier (46) is supported on the plurality of balls (B1, B2, B3) and is movably arranged in the housing (41) through the attractive force between the at least one first magnet (M1, M2) and the first yoke (Y1).

12. In paragraph 1, It further includes an AF driving unit (49) configured to provide a driving force for moving the AF carrier (48) relative to the OIS carrier (46), and the AF driving unit (49) comprises: At least one coil (C5, C6) arranged in the housing (41); and A camera module comprising at least one magnet (M5, M6) arranged on the AF carrier (46) facing at least one coil (C5, C6).

13. In paragraph 1, The OIS carrier (46) is configured to be rotatable relative to the housing (41) about an axis parallel to the first optical axis (A1), and The camera module (4) further includes a driving unit configured to provide driving force for rotating the OIS carrier (46) relative to the housing (41).

14. In paragraph 1, Further comprising a second reflective member (1820) arranged within the housing (41), The first lens portion (42) is positioned between the reflective member (44) and the second reflective member (1820), The image sensor (451) faces the second reflective member (1820), and The above image sensor (451) is a camera module configured to receive light through the reflective member (44), the first lens unit (42), and the second reflective member (1820).

15. In paragraph 1, The above reflective member (44) includes a prism, and A camera module including a prism including an incident surface (441), an exit surface (442) facing the first lens unit (42), and a reflection surface (443) that reflects light incident on the incident surface (441) to the exit surface (442).

Citation Information

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