Sound output device
By fixing the microphone and speaker to an independent bracket in the noise-canceling headphones to form an independent module, and using positioning slots and mounting slots to improve positioning reliability, the problem of existing headphones being unable to balance noise cancellation effect and sound quality is solved, achieving higher assembly precision and sound quality improvement.
Patent Information
- Application Number
- PCT/CN2025/087652
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-25
- Filing Date
- 2025-04-08
- Publication Date
- 2026-01-02
AI Technical Summary
Existing noise-canceling headphones suffer from a large number of internal components and limited space, making it difficult to balance noise cancellation and sound quality. Furthermore, their assembly and connection methods are complex, making it difficult to guarantee reliability and consistency.
The microphone and the first speaker are located on different surfaces and fixed on independent first brackets. The microphone and the speaker are fixed separately by the first brackets to form independent modules, which simplifies the assembly process. The positioning and fixing reliability are improved by positioning slots and mounting slots. The flexible circuit board is electrically connected to the speaker, which simplifies the assembly steps.
It improves the structural compactness and assembly precision of audio components, enhances the installation consistency and sound quality of audio components in the housing, simplifies the assembly process, and reduces complexity and cost.
Smart Images

Figure CN2025087652_02012026_PF_FP_ABST
Abstract
Description
Sound output device
[0001] The present application claims priority from the Chinese patent application No. 202421478721.9 filed on June 25, 2024, and entitled "Sound output device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD
[0002] The present application relates to the technical field of audio equipment, and in particular to a sound output device. BACKGROUND
[0003] With the development of true wireless stereo (TWS) earphones, users' demand for noise reduction effect and sound quality of earphones is also gradually increasing.
[0004] The existing noise reduction earphones are difficult to balance the noise reduction effect and sound quality due to the large number of internal components and the limitation of the internal space size of the earphones. The existing technology has a scheme of setting multiple sound emitting units to improve the sound quality, but also makes the assembly connection mode of the earphones complex, and the reliability and consistency are difficult to guarantee. SUMMARY
[0005] The purpose of the embodiments of the present application is to provide a sound output device.
[0006] In a first aspect, the present application provides a sound output device, comprising a shell, a first support, a microphone and a first loudspeaker, the shell having a containing space; the first support is fixed in the containing space of the shell, and the first support comprises a first surface and a second surface arranged back to back; the microphone is fixed to the first surface; and the first loudspeaker is fixed to the second surface.
[0007] In the present application, the second surface and the first surface are arranged back to back, that is, the included angle between the normal direction of the first surface (for an entity surface, the normal direction is from the inside of the entity to the outside) and the normal direction of the second surface is greater than 90°.
[0008] In one aspect, the microphone and the first speaker are located on different surfaces of the first support, the first support fixes the microphone and the first speaker, the microphone and the first speaker are fixed by the first support respectively, the first support has less influence on the size of the audio assembly in the first direction, which is conducive to reducing the size of the audio assembly in the first direction, thereby improving the compactness of the structure of the audio assembly. On the other hand, the microphone and the first speaker are located on different sides of the first support, the installation of the microphone and the first speaker does not affect each other, which facilitates the assembly of the microphone and the first speaker. In another aspect, the microphone, the first support and the first speaker can be assembled to form an independent module (audio assembly), and the influence of other components (such as the shell) of the sound output device (earphone) on the microphone, the first support and the first speaker can be basically ignored during assembly, and the space during assembly is larger, which is conducive to improving the accuracy and consistency when the module (audio assembly) is installed in the shell.
[0009] In the embodiment, since the microphone, the first support and the first speaker can be assembled to form an independent module (audio assembly), the influence of other components (such as the shell) of the sound output device (earphone) on the microphone, the first support and the first speaker can be basically ignored when the module is assembled into the shell, which is conducive to improving the accuracy and consistency when the module (audio assembly) is installed in the shell.
[0010] In some embodiments, the first support has a first mounting slot, the first surface is at least partially formed on the bottom surface of the first mounting slot, and at least part of the structure of the microphone is located in the first mounting slot.
[0011] The first support has a second mounting slot, the second surface is at least partially formed on the bottom surface of the second mounting slot, and at least part of the structure of the first speaker is located in the second mounting slot.
[0012] In one aspect, the size of the first mounting slot can be set corresponding to the size of the microphone. The size of the second mounting slot can be set corresponding to the size of the first speaker.
[0013] In the embodiment, by setting the first mounting slot, the first mounting slot can position and install the microphone. The microphone is generally small, and the first mounting slot is equivalent to wrapping at least part of the structure of the microphone. The slot structure of the first mounting slot can have more contact surfaces and larger contact area with the microphone, so that the fixation of the microphone is more reliable. By setting the second mounting slot, the second mounting slot can position and fix the first speaker.
[0014] In some embodiments, the first support has a positioning slot, the first speaker has a positioning part, the positioning part is protrudingly arranged, the positioning part is located in the positioning slot and fixedly connected with the slot wall of the positioning slot of the first support.
[0015] In the embodiment, the positioning groove is used for positioning the position of the first loudspeaker in the first support and connecting the first loudspeaker and the first support. The positioning part of the first loudspeaker is installed in the positioning groove, and the positioning part is a partial structure of the first loudspeaker. The volume of the positioning part and the volume of the positioning groove can be set to be small, so as to facilitate the selection of a suitable position of the first support to form the positioning groove and the selection of a suitable position of the first loudspeaker to form the positioning part, thereby further simplifying the structural design of the first support and the first loudspeaker.
[0016] In some embodiments, the first support is a cover structure, the first support includes a top portion and a side portion, the side portion surrounds the top portion, the first surface is formed on one side of the top portion, and the second surface is formed on the other side of the top portion; the first surface is parallel to the second surface, and the side portion extends away from the first surface.
[0017] For example, the first surface can be a plane, and the second surface can be a plane.
[0018] In the embodiment, the first surface is formed on one side of the top portion, the second surface is formed on the other side of the top portion, and the first surface is parallel to the second surface. Thus, the microphone and the first loudspeaker are connected to the two side surfaces of the top portion, respectively, and there is no gap between the microphone, the top portion, and the first loudspeaker in the first direction, so that the compactness of the audio assembly in the first direction is high, and the size of the audio assembly is small.
[0019] In some embodiments, the first support includes a main body portion and a fixing portion, the fixing portion is located between the first loudspeaker and the microphone, the first surface is formed on one side surface of the fixing portion, the second surface is formed on the other side surface of the fixing portion, and the fixing portion is embedded in the main body portion; the main body portion is made of plastic, and the fixing portion is a metal sheet.
[0020] In the embodiment, the fixing portion is made of a metal material, so that the fixing portion has high strength and a small thickness, thereby facilitating the thin design of the audio assembly. The main body portion is made of plastic, so as to reduce the weight of the main body portion and the first support, facilitate the molding of the main body portion, and reduce the manufacturing cost of the main body portion.
[0021] In some embodiments, the shell has a sound outlet, the first support and the shell form a sound outlet channel, the sound outlet communicates the sound outlet channel and the outside of the shell, and the first loudspeaker emits sound through the sound outlet channel; the microphone is located on the side of the first support facing the sound outlet, and the microphone is located in the sound outlet channel.
[0022] In the embodiment, the sound outlet channel is formed by the first support and the shell, the microphone is located in the sound outlet channel, the microphone is close to the sound outlet, the sound from the sound outlet directly enters the ear, the sound picked up by the microphone is closer to the sound actually heard by the ear, and thus the noise reduction of the sound output device (earphone) is facilitated. In addition, the microphone is fixed to the first support, that is, the microphone does not need to be fixed to the shell at the sound outlet, and thus the sound outlet channel at the sound outlet is not blocked, the sound outlet area of the sound outlet channel is larger, and thus the sound outlet effect is improved.
[0023] In some embodiments, the first surface faces the sound outlet, the first support has a first through hole, and the first loudspeaker has a sound outlet, and the first through hole is connected with the sound outlet and the sound outlet channel.
[0024] When the first loudspeaker is bonded to the first support, the adhesive can avoid the first through hole, so that the first through hole and the sound outlet are connected and the connection is sealed. The adhesive has the functions of bonding the first loudspeaker to the first support and sealing.
[0025] In the embodiment, on the one hand, the microphone can face the sound outlet, the sound output by the sound output device (earphone) can be picked up by the microphone, and the sound at the sound outlet can directly propagate to the microphone, the propagation path is simpler, and the microphone is facilitated to pick up sound. On the other hand, the first through hole is connected with the sound outlet and the sound outlet channel, the path between the sound outlet of the first loudspeaker and the sound outlet is basically a straight line, that is, the sound outlet channel structure of the first loudspeaker through the sound outlet is simple, the sound is less affected, the sound quality of the sound output device (earphone) is improved, and the simple sound outlet path is beneficial to simplify the structure of the sound output device (earphone).
[0026] In some embodiments, the first support has a fixing surface, and the fixing surface is fixedly connected with the shell. The fixing surface is a plane, and the fixing surface is perpendicular to the center line of the sound outlet.
[0027] In the embodiment, the fixing surface is a plane, which is beneficial to the forming of the fixing surface, thereby simplifying the manufacturing of the first support. The fixing surface is in contact with the mounting surface of the shell, which is beneficial to increasing the bonding area, thereby improving the reliability of the fixed connection. Since the fixing surface is connected with the shell, the stress direction of the fixing surface is parallel to the first direction, and the audio assembly can be mounted along the first direction during assembly, which is the same as the assembly direction of the components in the audio assembly, thereby reducing the assembly direction and facilitating the assembly process.
[0028] In some embodiments, the sound output device further comprises a second loudspeaker, the second loudspeaker is fixedly connected with the first support, and the first support, the first loudspeaker and the second loudspeaker are sequentially stacked.
[0029] In the embodiment, the first loudspeaker can be used for playing high-pitched sound, and the second loudspeaker can be used for playing low-pitched sound. Different frequency sounds are played through the first loudspeaker and the second loudspeaker respectively, which is conducive to exerting the respective characteristics of the first loudspeaker and the second loudspeaker, thereby improving the sound quality of the audio assembly. In addition, the second loudspeaker is also stacked along the first direction, and the arrangement direction of the microphone, the first support and the first loudspeaker is the same, so that the second loudspeaker is conveniently mounted on the first support.
[0030] In some embodiments, the first support is a cover structure, the second loudspeaker is mounted at the end of the first support, the first support and the second loudspeaker enclose a mounting space, and the first loudspeaker is located in the mounting space.
[0031] In the embodiment, the cross section of the second loudspeaker can be larger than the cross section of the first loudspeaker, and the end surface size of the second loudspeaker can be close to the size of the end of the first support. The end surface of the second loudspeaker closes the cover space of the first support and forms a mounting space, and the first loudspeaker is located in the mounting space.
[0032] In the embodiment, the first support is fixedly connected with the first loudspeaker and the second loudspeaker, and the first loudspeaker is wrapped by the first support and the second loudspeaker. On the one hand, the structure of the first support, the first loudspeaker and the second loudspeaker is more compact, and the space utilization is higher, thereby facilitating the miniaturization of the audio assembly. On the other hand, the first loudspeaker and the second loudspeaker are also facilitated to be fixedly connected with the first support.
[0033] In some embodiments, the first support includes a positioning column and a fixing column, and the end of the second loudspeaker facing the first support is provided with a positioning hole and a fixing hole. The positioning column and the positioning hole are clearance fitted, the fixing column is located in the fixing hole, and the fixing column and the fixing hole are bonded by a colloid.
[0034] In the embodiment, the shapes of the positioning column and the positioning hole can be adapted. For example, the positioning column can be a cylindrical column structure, and the positioning hole can be a circular hole structure. The diameter of the positioning column can be less than or equal to the diameter of the positioning hole. In addition, the size of the fixing column can be less than the size of the fixing hole, and the outer wall of the fixing column can be spaced from the inner wall of the fixing hole.
[0035] In the embodiment, the positioning hole and the positioning column are provided, thereby facilitating the positioning of the second loudspeaker on the first support when the second loudspeaker is mounted. In addition, the fixing hole and the fixing column are provided, and the second loudspeaker and the first support are bonded by a colloid, thereby making the connection of the second loudspeaker and the first support simpler and more reliable.
[0036] In some embodiments, the shell has a sound outlet, the first support and the shell enclose a sound outlet channel, and the sound outlet is in communication with the sound outlet channel and the outside of the shell; the first support has a second through hole, the first speaker and the second speaker are arranged at intervals, the interval space between the first speaker and the second speaker forms a rear cavity of the first speaker and forms a front cavity of the second speaker, and the second through hole is in communication with the front cavity of the second speaker and the sound outlet channel.
[0037] In the present embodiment, the front cavity of the second speaker is in communication with the second through hole, the second speaker is equivalent to emitting sound through the second through hole, the sound of the second speaker is transmitted to the second through hole through the front cavity, enters the sound outlet channel through the second through hole, and is transmitted to the outside of the shell. Among them, the second through hole is arranged on the first support, the area of the second through hole is easy to arrange larger, which is conducive to making the second speaker have a larger sound outlet area. In addition, the sound of the first speaker and the sound of the second speaker are both fixed on the first support, and the sound of the first speaker and the sound of the second speaker both pass through the first support to enter the sound outlet channel, which is conducive to simplifying the design of the sound channel of the first speaker and the second speaker in the sound output device (earphone).
[0038] In some embodiments, the second speaker includes a first sub-speaker and a second sub-speaker, the first sub-speaker and the second sub-speaker are fixedly connected, and the first sub-speaker and the second sub-speaker can emit sound respectively.
[0039] For example, the first sub-speaker is mainly used to emit mid-frequency sound, and the second sub-speaker is mainly used to emit low-frequency sound,
[0040] In the present embodiment, the first speaker and the second speaker can both emit sound, which is conducive to improving the sound quality of the sound output device (earphone); the first sub-speaker and the second sub-speaker are integrated into the second speaker, which can improve the integration of the first sub-speaker and the second sub-speaker, reduce the occupied space, and also can be assembled together into the sound output device (earphone), improving the assembly efficiency.
[0041] In some embodiments, the sound output device further includes a flexible circuit board, the flexible circuit board and the microphone are an integral structure, and the flexible circuit board is electrically connected with the first speaker and the second speaker.
[0042] In the present embodiment, since the flexible circuit board and the microphone are an integral structure, when the microphone is fixed to the first support, the step of electrically connecting the flexible circuit board with the first speaker and the second speaker can be performed synchronously, thereby simplifying the assembly step of the audio assembly.
[0043] In some embodiments, the flexible circuit board is located outside the microphone, the first support and the second speaker, the first speaker has a first wiring portion, the first support has a third through hole, the first wiring portion passes through the third through hole, and the first wiring portion is electrically connected to the flexible circuit board.
[0044] In the embodiment, the flexible circuit board is electrically connected to the microphone, the first speaker and the second speaker in a simple manner, the flexible circuit board can cover the outside of the microphone, the first support, the first speaker and the second speaker, and the flexible circuit board does not need to be additionally arranged, so that the installation of the flexible circuit board is simple and convenient.
[0045] In some embodiments, the sound output device further includes a second support and a battery, the second support is fixedly connected to the battery, the second support and the battery are located in the accommodation space, and the second support is fixedly connected to the shell; the first support, the second support and the battery are arranged along a first direction, the second support is located on a side of the first support away from the microphone, and the first direction is the arrangement direction of the microphone, the first support and the first speaker.
[0046] In the embodiment, the second support and the battery can be assembled into the accommodation space of the shell along the first direction, so that the assembly direction of the audio assembly is consistent, the complexity of assembly is reduced, the assembly steps of the sound output device (earphone) are simplified, and the assembly efficiency and assembly quality of the sound output device (earphone) are improved. BRIEF DESCRIPTION OF DRAWINGS
[0047] In order to illustrate the technical solutions in the embodiments or the background art of the present application, the drawings needed to be used in the embodiments or the background art of the present application will be described below.
[0048] FIG. 1 is a structural schematic diagram of an earphone according to an embodiment of the present application;
[0049] FIG. 2 is a structural schematic diagram of the earphone shown in FIG. 1 from another perspective;
[0050] FIG. 3 is an exploded structural schematic diagram of the audio assembly shown in FIG. 1 according to some embodiments;
[0051] FIG. 4 is an exploded structural schematic diagram of the shell shown in FIG. 1;
[0052] FIG. 5 is a cutaway schematic diagram of the shell shown in FIG. 1;
[0053] FIG. 6 is an exploded structural schematic diagram of the audio assembly shown in FIG. 3 according to some embodiments;
[0054] FIG. 7 is a structural schematic diagram of the first support shown in FIG. 6 according to some embodiments;
[0055] FIG. 8 is a structural schematic diagram of the first support shown in FIG. 7 from another perspective;
[0056] Fig. 9 is an exploded structural schematic view of the first bracket shown in Fig. 7 in some embodiments;
[0057] Fig. 10 is a structural schematic view of the first speaker shown in Fig. 6 in some embodiments;
[0058] Fig. 11 is a sectional view of a partial structure of the audio assembly shown in Fig. 3 in some embodiments;
[0059] Fig. 12 is a structural schematic view of the second speaker shown in Fig. 6 in some embodiments;
[0060] Fig. 13 is a sectional view of a partial structure of the audio assembly shown in Fig. 3 in some embodiments;
[0061] Fig. 14 is a sectional view of a partial structure of the audio assembly shown in Fig. 3 in some other embodiments;
[0062] Fig. 15 is a structural schematic view of the flexible circuit board and the microphone shown in Fig. 6;
[0063] Fig. 16 is a sectional view of a partial structure of the audio assembly shown in Fig. 3 in yet some other embodiments;
[0064] Fig. 17 is a sectional view of a partial structure of the earphone shown in Fig. 1 in some embodiments;
[0065] Fig. 18 is a sectional view of a partial structure of the earphone shown in Fig. 1 in some other embodiments;
[0066] Fig. 19 is a sectional view of the earphone shown in Fig. 1 in some embodiments;
[0067] Fig. 20 is a sectional view of the earphone shown in Fig. 1 in another perspective view;
[0068] Fig. 21 is an exploded structural schematic view of a partial structure of the audio assembly shown in Fig. 3 in some other embodiments. DETAILED DESCRIPTION
[0069] The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0070] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms “mounting”, “connecting” should be understood in a broad sense, for example, “connecting” can be detachably connecting, or can be non-detachably connecting; can be directly connecting, or indirectly connecting through an intermediate medium. “Multiple” means at least two.
[0071] The positional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", "top", "bottom", "side" and the like, are only the directions of the drawings, therefore, the positional terms used are for better and clearer illustration and understanding of the embodiments of the present application, and are not indicative or suggestive of the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0072] In the embodiments of the present application, the relative positional relationship mentioned, such as parallel, vertical, aligned and the like, are all in view of the current process level, and are not absolute strict limits, and a small amount of deviation is allowed, and approximately parallel, approximately vertical, approximately aligned and the like are all possible. For example, A is parallel to B, which means that A and B are parallel or approximately parallel, and the included angle between A and B can be between 0 degrees and 10 degrees. For example, A is vertical to B, which means that A and B are vertical or approximately vertical, and the included angle between A and B can be between 80 degrees and 100 degrees.
[0073] In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only for descriptive purposes, and cannot be understood as indicative or suggestive of relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.
[0074] The sound output device provided in the embodiments of the present application is used for sound output. For example, playing music, playing voice information or calling and the like. The sound output device can be earphones, players and the like. The sound output device 100 in the embodiment shown in FIG. 1 is described by taking earphones as an example. In which, the reference numerals of the earphones hereinafter all adopt the reference numerals of the sound output device 100.
[0075] Please refer to FIG. 1, which is a structural schematic diagram of the earphones 100 provided in the embodiments of the present application.
[0076] In some embodiments, the earphone 100 can be a wireless earphone or a wired earphone. When the earphone 100 is a wireless earphone, the earphone 100 can be communicatively connected with other electronic devices. The other electronic devices can be an earphone 100, a mobile phone, a watch, a tablet personal computer, a notebook computer, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, a VR helmet, or the like, which has a communication function. The earphone 100 of the embodiment shown in FIG. 1 is a wireless earphone, for example, a Bluetooth earphone. In an embodiment, the earphone 100 is a true wireless stereo (TWS) earphone. It should be noted that FIG. 1 only schematically shows one earphone 100 (i.e., the earphone 100 includes at least one earplug). In other embodiments, the earphone 100 can also include two earplugs, or more than two earplugs, which respectively provide sound for the left ear or the right ear.
[0077] In addition, the earphone 100 can be a semi-in-ear earphone, an in-ear earphone, or a headphone.
[0078] For the convenience of the following description, it is defined that the earphone 100 has opposite directions “top” and “bottom”, which correspond to the height direction of the earphone 100; the earphone 100 has opposite directions “left” and “right”, which correspond to the width direction of the earphone 100; and the earphone 100 has opposite directions “front” and “back”, which correspond to the thickness direction of the earphone 100. In the description of some embodiments, the direction “up” corresponds to the direction “top”, and the direction “down” corresponds to the direction “bottom”.
[0079] Please refer to FIG. 1 and FIG. 2, FIG. 2 is a structural schematic view of the earphone 100 shown in FIG. 1 from another perspective.
[0080] In some embodiments, the earphone 100 includes an ear cover 1001 and an ear stem 1002, the top of the ear stem 1002 is connected to the back side of the ear cover 1001. The outer surface of the earphone 100 is a smooth transition geometric curved surface. The ear stem 1002 can also be referred to as a handle, which is used to be held by a user to operate the earphone 100; the ear stem 1002 is generally in a straight rod structure. When the earphone 100 is an in-ear earphone, the ear cover 1001 can be used to plug into the ear of the user to fix the earphone 100.
[0081] Exemplarily, the earphone 100 can have a center plane 1003, and the central axis 1004 of the ear cover 1001 can be inclined relative to the center plane 1003. When the earphone 100 is used as a left earphone, the bottom end of the central axis 1004 of the ear cover 1001 can be deflected to the left relative to the center plane 1003, and the top end of the central axis 1004 of the ear cover 1001 can be deflected to the right relative to the center plane 1003. When the earphone 100 is used as a right earphone, the bottom end of the central axis 1004 of the ear cover 1001 can be deflected to the right relative to the center plane 1003, and the top end of the central axis 1004 of the ear cover 1001 can be deflected to the left relative to the center plane 1003. Exemplarily, the outer contour of the ear stem 1002 can be symmetrically arranged relative to the center plane 1003.
[0082] Exemplarily, the earphone 100 can have a sound outlet 1005, which can be formed on the ear cover 1001. A sound outlet 1006 can be formed on the sound outlet 1005, and the sound outlet 1006 is used for sound emission. The central axis 1004 of the ear cover 1001 can pass through the sound outlet 1005, and the central axis 1004 can coincide with the center line of the sound outlet 1006. For example, a plurality of sound holes 1007 are arranged at the sound outlet 1006, and the sound emitted from the inside of the earphone 100 can be emitted through the sound holes 1007 and propagated to the outside. The plurality of sound holes 1007 can be arranged in an array, but are not strictly limited thereto.
[0083] In some embodiments, the earphone 100 can further include a wearing detection module 1008. The wearing detection module 1008 can be mounted on the ear cover 1001 and exposed to the outside of the ear cover 1001.
[0084] Exemplarily, in some use scenarios, the earphone 100 can determine whether the user wears / detaches the earphone 100 through the wearing detection function, so as to automatically play / pause the music. In other use scenarios, if the user detaches the earphone 100 for a long time without wearing and without putting it back into the charging box, the earphone 100 will automatically hibernate / shut down to save power. In other use scenarios, in order to improve the experience of single-ear / double-ear use of the earphone 100, when both of the earphones 100 are worn, both of the earphones 100 play music, when one of the earphones 100 is detached and the other earphone 100 is worn, the earphone 100 in the non-wearing state stops playing music, and the earphone 100 in the wearing state continues to play, so as to realize seamless switching.
[0085] In some embodiments, the earphone 100 can have a control area 1009. The control area 1009 can be located on the ear stem 1002. The user can operate the earphone 100 by touching the control area 1009.
[0086] For example, in some use scenarios, the earphone 100 can detect different touch actions or operation actions of the user on the operation area 1009, and implement functions such as playing / pausing music, switching songs, adjusting volume, and smart voice wake-up, so that the earphone 100 can be used more conveniently and quickly, and the user experience can be improved.
[0087] In some other embodiments, the earphone 100 can further include a circuit assembly (not shown in the figure), which can be located in the ear stem 1002. For example, the circuit assembly can include a circuit board. A plurality of devices can be fixed on the circuit board. For example, a main control chip can be arranged on the main circuit board, and the main control chip can be a system on chip (SOC). The main control chip can integrate a plurality of circuits. The circuit assembly is electrically connected with other functional devices, modules, and the like of the earphone 100. For example, the circuit assembly can be electrically connected with the audio assembly in the following description, so as to control the working state of the audio assembly.
[0088] In some other embodiments, the earphone 100 can further include an antenna (not shown in the figure). The antenna can be located in the ear stem 1002. For example, the antenna is used to realize wireless communication between the earphone 100 and other terminals (such as a mobile phone, a tablet computer, and the like).
[0089] In some other embodiments of the present application, the earphone 100 can include more or fewer components than the above-described embodiments, or combine some components, or split some components, or different arrangement of components. The components of the earphone 100 can be realized by hardware, software, or a combination of software and hardware.
[0090] Please refer to FIG. 1 and FIG. 3, and FIG. 3 is an exploded structural schematic view of the earphone 100 shown in FIG. 1 in some embodiments.
[0091] In some embodiments, the earphone 100 can include a housing 10, an audio assembly 20, and a battery assembly 30.
[0092] For example, the housing 10 can serve as a fixed structure and a support structure of the earphone 100. The inner side of the housing 10 can be a hollow structure, and the inner side of the housing 10 forms an accommodation space 104. The audio assembly 20, the battery assembly 30, and the like can be fixedly installed in the accommodation space 104 of the housing 10. When the earphone 100 includes other components, the other components can be installed in the accommodation space 104 of the housing 10.
[0093] The shell 10 can include a first shell 101 and a second shell 102. The first shell 101 and the second shell 102 can be spliced to form the shell 10, and the first shell 101 and the second shell 102 can be fixedly connected to facilitate the molding of the shell 10 and the installation of other components of the earphone 100 on the shell 10. For example, the first shell 101 is fixed to the front side of the second shell 102, and the internal space of the first shell 101 communicates with the internal space of the second shell 102. When the earphone 100 is in a wearing state, the first shell 101 is used to face the user's ear, and the second shell 102 is connected to part of the structure of the first shell 101 and the first shell 101 to form the shell of the ear cap 1001, and the other part of the structure of the second shell 102 forms the shell of the ear stem 1002 of the earphone 100.
[0094] For example, the shell 10 can be provided with a vent hole 103, which can communicate the outside and the inside of the shell 10.
[0095] For example, the sound output part 1005 can be formed on the shell 10.
[0096] For example, the audio assembly 20 can be used for sound emission and sound collection. The audio assembly 20 can include a speaker and a microphone. The speaker can also be referred to as a "loudspeaker", which is used to convert an audio electrical signal into an acoustic signal, thereby realizing sound playing. The microphone is used to convert an acoustic signal into an electrical signal, thereby realizing sound pickup. The microphone can be mainly used to collect the sound output by the earphone 100 and convert it into an electrical signal to be transmitted to the master control chip for processing, so as to realize the functions of active noise reduction, voice call, call noise reduction, environmental sound mode, voice assistant wake-up, etc. of the earphone 100.
[0097] For example, the battery assembly 30 is used to supply power to the power-consuming components (such as the audio assembly 20) of the earphone 100. The battery assembly 30 can be electrically connected with the audio assembly 20, thereby supplying power to the audio assembly 20. For example, the battery assembly 30 can adopt a lithium battery, but is not limited thereto.
[0098] In this embodiment, when assembling the earphone 100, the audio assembly 20 can be first installed on the first shell 101, then the battery assembly 30 is installed on the second shell 102, and then the first shell 101 and the second shell 102 are spliced. At this time, when assembling the earphone 100, fewer modules need to be assembled, and the steps during assembly are also less, thereby improving the efficiency of assembly, and the consistency of the obtained earphone 100 is also better.
[0099] It can be understood that the microphone in the earphone 100 can also include a feed-forward microphone (not shown in the figure) for picking up external noise of the earphone 100, and can also include a sound collection microphone (not shown in the figure) for picking up the user's voice.
[0100] Please refer to FIG. 4 and FIG. 5, FIG. 4 is an exploded structural schematic diagram of the shell 10 shown in FIG. 1, and FIG. 5 is a cutaway schematic diagram of the shell 10 shown in FIG. 1.
[0101] In some embodiments, the first shell 101 can be a cover structure, and an inner side of the first shell 101 can form a first space.
[0102] For example, one end of the first shell 101 forms the sound outlet 1005, and the other end forms a first connecting interface 1011. The sound outlet 1005 can form a first channel 1012 on the inner side of the first shell 101, and the first channel 1012 can communicate the first space and the sound hole 1007. The first connecting interface 1011 can be substantially circular. From the sound outlet 1005 to the first connecting interface 1011, the cross-sectional area of the first shell 101 can first increase and then decrease. The first connecting interface 1011 can be provided with a first clamping portion 1013, and the first clamping portion 1013 can protrude towards the inner side of the first shell 101. In other embodiments, from the sound outlet 1005 to the first connecting interface 1011, the cross-sectional area of the first shell 101 can also first increase, and the present embodiment does not strictly limit this.
[0103] For example, one end of the first shell 101 forms the sound outlet 1005, and the other end forms a first connecting interface 1011. The sound outlet 1005 can form a first channel 1012 on the inner side of the first shell 101, and the first channel 1012 can communicate the first space and the sound hole 1007. The first connecting interface 1011 can be substantially circular. From the sound outlet 1005 to the first connecting interface 1011, the cross-sectional area of the first shell 101 can first increase and then decrease. The first connecting interface 1011 can be provided with a first clamping portion 1013, and the first clamping portion 1013 can protrude towards the inner side of the first shell 101. In other embodiments, from the sound outlet 1005 to the first connecting interface 1011, the cross-sectional area of the first shell 101 can also first increase, and the present embodiment does not strictly limit this.
[0104] In some embodiments, the second shell 102 can be a cover structure, and an inner side of the second shell 102 can form a second space.
[0105] For example, the second shell 102 can include a main shell 1021 and a rear cover 1022, and the main cover and the rear cover 1022 are fixedly connected. One end of the main shell 1021 forms a second connecting interface 1023, and the other end forms a third connecting interface 1024. The second connecting interface 1023 can be substantially circular, and the third connecting interface 1024 can be substantially rectangular. The rear cover 1022 can be substantially rectangular plate-shaped structure, and the shape of the rear cover 1022 can correspond to the shape of the third connecting interface 1024. For example, the rear cover 1022 can be fixed to the third connecting interface 1024 and close the third connecting interface 1024. The second connecting interface 1023 can be provided with a second clamping portion 1025.
[0106] In some embodiments, the first shell 101 and the second shell 102 are fixedly connected. At this time, the first space and the second space are communicated, thereby forming the accommodating space 104 of the shell 10, so as to facilitate the installation of other components (such as the audio assembly 20, the battery assembly 30, etc.) inside the shell 10. For example, the first abutting interface 1011 of the first shell 101 and the second abutting interface 1023 of the second shell 102 are abutted, and the first clamping portion 1013 and the second clamping portion 1025 are clamped, thereby fixedly connecting the first shell 101 and the second shell 102, so as to facilitate the disassembly of the first shell 101 and the second shell 102. In other embodiments, the first shell 101 and the second shell 102 can also be fixedly connected by adhesion.
[0107] Please refer to FIG. 6, which is an exploded structural schematic diagram of the audio assembly 20 shown in FIG. 3 in some embodiments.
[0108] In some embodiments, the audio assembly 20 can include a first support 1, a first loudspeaker 2, a microphone 3, and a flexible circuit board 4.
[0109] The first support 1 is used to fixedly install the first loudspeaker 2 and the microphone 3. The first loudspeaker 2 is used to play sound, and the second loudspeaker 5 is used to pick up sound. The flexible circuit board 4 is used to electrically connect the first loudspeaker 2 and the microphone 3, and is also used to be in communication connection with the circuit board, so that the circuit board communicates with the first loudspeaker 2 and the microphone 3, thereby enabling the first loudspeaker 2 to realize the sound playing function and enabling the microphone 3 to realize the sound picking up function.
[0110] In some embodiments, the audio assembly 20 can further include a second loudspeaker 5. The first support 1 is also used to fixedly install the second loudspeaker 5. The first support 1, the first loudspeaker 2, and the second loudspeaker 5 are sequentially stacked along a first direction. The first direction can be parallel to the central axis 1004. The second loudspeaker 5 can be electrically connected with the flexible circuit board 4. The second loudspeaker 5 is used to play sound. The first loudspeaker 2 and the second loudspeaker 5 are both used to play sound, at this time, the first loudspeaker 2 can be used to play high-pitched sound, and the second loudspeaker 5 can be used to play mid-low pitched sound. Different frequency sounds are played through the first loudspeaker 2 and the second loudspeaker 5 respectively, which is conducive to exerting the respective characteristics of the first loudspeaker 2 and the second loudspeaker 5, thereby being conducive to improving the sound quality of the audio assembly 20. Moreover, the second loudspeaker 5 is also stacked along the first direction, which is the same as the arrangement direction of the microphone 3, the first support 1, and the first loudspeaker 2, thereby facilitating the installation of the second loudspeaker 5 to the first support 1.
[0111] It can be understood that when the audio assembly 20 includes the first loudspeaker 2 but does not include the second loudspeaker 5, the first loudspeaker 2 can be a full-frequency loudspeaker, which is used to play full-frequency sound.
[0112] Please refer to FIG. 7 and FIG. 8, FIG. 7 is a structural schematic diagram of the first support 1 shown in FIG. 6 in some embodiments, and FIG. 8 is a structural schematic diagram of the first support 1 shown in FIG. 7 in another perspective view. The perspective view shown in FIG. 8 is the perspective view of FIG. 7 after being flipped over.
[0113] In some embodiments, the first support 1 can be substantially in a cover structure.
[0114] For example, the first support 1 can include a top portion 1a and a side portion 1b, and the top portion 1a and the side portion 1b are fixedly connected. The side portion 1b can be substantially in a ring shape, and the side portion 1b can be arranged around the top portion 1a. The top portion 1a is fixed to one end of the side portion 1b, and the other end of the side portion 1b forms an open port. The top portion 1a and the side portion 1b can enclose a cover space.
[0115] For example, the first support 1 can have a first mounting groove 11. The first mounting groove 11 can be formed on the outer side of the first support 1 and exposed on the outer surface of the first support 1. For example, the first mounting groove 11 can be formed on the side of the top portion 1a away from the cover space of the first support 1, so that the opening direction of the first mounting groove 11 is also away from the cover space. The first mounting groove 11 can be substantially in a rectangular groove structure, but is not strictly limited thereto.
[0116] For example, the first support 1 can have a second mounting groove 12. The second mounting groove 12 can be formed on the inner side of the first support 1. For example, the second mounting groove 12 can be formed on the side of the top portion 1a located in the cover space, so that the opening direction of the second mounting groove 12 is also away from the first mounting groove 11. The second mounting groove 12 can be substantially in a rectangular groove structure, but is not strictly limited thereto.
[0117] For example, the first support 1 can have a positioning groove 13. The positioning groove 13 can be formed on the inner side of the first support 1. For example, the positioning groove 13 can be formed on the side portion 1b. The number of the positioning grooves 13 can be multiple, and the multiple positioning grooves 13 can be arranged in a circumferential direction of the side portion 1b. For example, the number of the positioning grooves 13 can be three.
[0118] For example, the first support 1 can have a first surface 1c. The first surface 1c can be formed on one side of the top portion 1a. For example, the first surface 1c is at least partially formed on the bottom surface of the first mounting groove 11. The first surface 1c can be a flat surface, but is not strictly limited thereto. The first surface 1c can be used to fixedly connect the first speaker 2. The side portion 1b extends in a direction away from the first surface 1c.
[0119] Exemplarily, the first bracket 1 can have a second surface 1d. The second surface 1d is arranged opposite to the first surface 1c, i.e. the angle between the normal direction of the first surface 1c (for a solid surface, the normal direction is from the inside of the solid to the outside) and the normal direction of the second surface 1d is greater than 90°. The second surface 1d is formed on the other side of the top portion 1a. For example, the second surface 1d is formed on the bottom wall surface of the second mounting groove 12 of the top portion 1a, and the second surface 1d can be parallel to the first surface 1c. The second surface 1d can be a plane, but is not strictly limited thereto. The second surface 1d can be used to fix the first bracket 1 to the shell 10. In other embodiments, the second surface 1d can also be formed on the side portion 1b, which is not limited specifically herein.
[0120] Exemplarily, the first bracket 1 can have a fixing surface 14. For example, the fixing surface 14 can be formed by part of the surface of the top portion 1a. The fixing surface 14 can be connected to the side portion 1b. For example, the fixing surface 14 can be coplanar with the first surface 1c, so that the first surface 1c and the fixing surface 14 can be formed synchronously. In other embodiments, the fixing surface 14 and the first surface 1c can also be non-coplanar. The fixing surface 14 can be used to fix the first bracket 1 to the shell 10.
[0121] Exemplarily, the first bracket 1 can have a first through hole 15. For example, the first through hole 15 can pass through the top portion 1a of the first bracket 1. In some examples, the first through hole 15 can be a circular hole.
[0122] Exemplarily, the first bracket 1 can have a second through hole 16. The second through hole 16 can be formed at the connection between the top portion 1a and the side portion 1b. For example, the area of the second through hole 16 can be greater than the area of the first through hole 15. For example, the number of the second through holes 16 can be two, and the two second through holes 16 can be distributed on both sides of the first through hole 15.
[0123] Exemplarily, the first bracket 1 can have a third through hole 17. The third through hole 17 can pass through the first bracket 1. The third through hole 17 can be formed at the connection between the top portion 1a and the side portion 1b. The inner side of the first bracket 1 can be in communication with the space outside the first bracket 1 through the first through hole 15, the second through hole 16 and / or the third through hole 17, respectively.
[0124] Exemplarily, the first bracket 1 can have a positioning column 18. For example, the positioning column 18 can be formed on the end of the side portion 1b away from the top portion 1a. The positioning column 18 can be protruding. The positioning column 18 can have a substantially cylindrical structure. The number of the positioning columns 18 can be multiple, and the multiple positioning columns 18 can be arranged at intervals. The positioning column 18 can be used to position the relative position of the first bracket 1 and other components.
[0125] For example, the first bracket 1 can have a fixing column 19. For example, the fixing column 19 can be formed at one end of the side portion 1b away from the top portion 1a. The fixing column 19 can be protruding. The fixing column 19 can be substantially a rectangular column structure. In the present example, the fixing column 19 and the positioning column 18 can be used in cooperation. In which, the fixing column 19 can be used to fix the relative position of the first bracket 1 and other components.
[0126] In some examples, two fixing columns 19 can be respectively located at two sides of one positioning column 18, and the two fixing columns 19 and the one positioning column 18 can form a set of positioning and fixing structures. In some examples, the first bracket 1 can have multiple sets of positioning and fixing structures.
[0127] In the present example, the first bracket 1 forms a cover structure, which can form a cover space, thereby facilitating the installation of other components thereon, and enabling the first bracket 1 to have a lighter mass.
[0128] Please refer to FIG. 7 and FIG. 9, FIG. 9 is an exploded structural schematic diagram of the first bracket 1 in some embodiments of FIG. 7.
[0129] In some embodiments, the first bracket 1 can include a fixing portion 110 and a main body portion 111. In which, the fixing portion 110 and the main body portion 111 can be fixedly connected. In which, a part of structure of the fixing portion 110 is used to form the bottom wall of the first mounting slot 11. That is, the fixing portion 110 can form a part of structure of the top portion 1a, and the main body portion 111 can form the side portion 1b and another part of structure of the top portion 1a.
[0130] For example, the first through hole 15 can be formed in the fixing portion 110. In which, the surface of the fixing portion 110 exposed on the surface of the first bracket 1 can be smoothly connected with the surface of the main body portion 111, and can be coplanar, that is, the first surface 1c of the first bracket 1 can be formed by the surface of the fixing portion 110; and the fixing surface 14 of the first bracket 1 is formed by part of the surface of the main body portion 111 and part of the surface of the fixing portion 110.
[0131] For example, the second through hole 16, the third through hole 17 and the positioning slot 13 can be formed in the main body portion 111. The fixing column 19 and the positioning column 18 can be formed in the main body portion 111.
[0132] For example, the bottom wall of the first mounting slot 11 can be formed by the fixing portion 110, and the side wall of the first mounting slot 11 can be formed by the main body portion 111. The second mounting slot 12 can also be formed by the fixing portion 110 and the main body portion. It can be understood that the second surface 1d can be formed by part of the surface of the fixing portion 110.
[0133] For example, the main body 111 can have an embedding hole 1111 which penetrates the main body 111. The embedding hole 1111 can be an irregularly shaped hole, and the shape of the embedding hole 1111 can correspond to the shape of the fixing portion 110.
[0134] For example, the fixing portion 110 can have an embedding portion 1101 which is embedded in the main body 111. When the fixing portion 110 is fixedly connected to the main body 111, the fixing portion 110 covers the embedding hole 1111.
[0135] For example, the fixing portion 110 can have a fourth through hole 1102 which is used to position the fixing portion 110 when the fixing portion 110 and the main body 111 are integrally formed.
[0136] In some embodiments, the fixing portion 110 and the main body 111 can be an integrally formed structural member.
[0137] For example, the fixing portion 110 can be made of metal, and the main body 111 can be made of plastic. The fixing portion 110 can be embedded in the main body 111. For example, the fixing portion 110 can be a plate-shaped structure to facilitate molding. For example, the fixing portion 110 can be a metal sheet such as a steel sheet. The main body 111 can be formed by injection molding. The fixing portion 110 can be embedded in the injection mold. When the main body 111 is formed, the fixing portion 110 and the main body 111 can be integrally formed. In this example, the fixing portion 110 is made of metal material, which can make the fixing portion 110 have high strength and thin thickness, thereby facilitating the thin design of the audio assembly 20. The main body 111 is made of plastic material, which can facilitate reducing the weight of the main body 111, thereby reducing the weight of the first support 1. In addition, the main body 111 can be easily molded, and the manufacturing cost of the main body 111 can be reduced.
[0138] In other examples, the fixing portion 110 and the main body 111 can be integrally formed by using the same material. For example, the first support 1 can be formed by injection molding, thereby synchronously forming the fixing portion 110 and the main body 111.
[0139] In other embodiments, the fixing portion 110 and the main body 111 can also be separate structural members. The fixing portion 110 and the main body 111 can be assembled to form the first support 1.
[0140] Please refer to FIG. 10, which is a structural schematic diagram of the first loudspeaker 2 in some embodiments of FIG. 6.
[0141] In some embodiments, the first loudspeaker 2 can include a first main body 21 and a first wiring portion 22. The first wiring portion 22 is fixedly connected to the first main body 21.
[0142] The first body 21 is an example of a sound emitting structure of the first speaker 2. For example, the first body 21 can emit sound by vibrating a diaphragm. The present embodiment is not limited to the sound emitting structure and the sound emitting principle of the first speaker 2.
[0143] The first connecting part 22 is an example of a flexible part. The first connecting part 22 can deform and bend relative to the first body 21, so as to facilitate adjustment of the relative position of the first connecting part 22 and the first body 21.
[0144] The first connecting part 22 is an example of an electrically connecting part. The first connecting part 22 can be electrically connected to the first body 21. The first connecting part 22 can have a first soldering point 221. The first soldering point 221 is used to electrically connect other components to the first body 21. For example, the first soldering point 221 can be exposed on the first connecting part 22. The number of the first soldering point 221 can be two.
[0145] The first speaker 2 can have a positioning part 23, which is an example of a positioning part. The positioning part 23 can be formed on the first body 21. For example, the first body 21 can have a substantially cylindrical structure. The positioning part 23 can be located on the side surface of the first body 21. For example, the number of the positioning part 23 can be multiple. For example, the number of the positioning part 23 can be three. The three positioning parts 23 can be arranged along the circumference of the first body 21. The three positioning parts 23 can increase the number of the connection between the first speaker 2 and the first support 1, so as to improve the stability of the connection between the first speaker 2 and the first support 1.
[0146] The first speaker 2 can have a sound emitting port 24, which is an example of a sound emitting port. The sound emitting port 24 can be formed on the first body 21. The sound emitted by the first body 21 can be transmitted to the outside of the first speaker 2 through the sound emitting port 24. For example, the sound emitting port 24 can be formed on the surface of the first body 21. The sound emitting port 24 can be in communication with the inside of the first body 21.
[0147] Please refer to FIG. 11, which is a sectional view of the partial structure of the audio assembly 20 shown in FIG. 3 in some embodiments.
[0148] In some embodiments, the first speaker 2 can be fixedly installed on the first support 1. For example, the first speaker 2 can be bonded to the first support 1.
[0149] The first body 21 of the first speaker 2 can be located in the cover space of the first support 1.
[0150] The size of the second mounting groove 12 can correspond to the size of the first speaker 2. At least part of the structure of the first speaker 2 is located in the second mounting groove 12 and fixedly connected with the second mounting groove 12, thereby fixedly connected with the second surface 1d (see FIG. 8). The sound emitting port 24 can correspond to the first through hole 15, and the sound emitting port 24 can communicate with the first through hole 15. In this embodiment, by arranging the second mounting groove 12, the first speaker 2 can be positioned and fixedly mounted.
[0151] The positioning portion 23 of the first body 21 can be located in the positioning groove 13 of the first support 1, and the positioning groove 13 and the positioning portion 23 can be one-to-one corresponding connection. The positioning portion 23 can be bonded with the wall surface of the positioning groove 13, so that the fixation of the first support 1 and the first speaker 2 is more reliable. At this time, the positioning groove 13 is used for positioning the position of the first speaker 2 in the first support 1, and also used for connecting the first speaker 2 and the first support 1. The positioning portion 23 of the first speaker 2 is installed in the positioning groove 13, and the positioning portion 23 is a partial structure of the first speaker 2. The volume of the positioning portion 23 and the positioning groove 13 can be set smaller, thereby facilitating to select a suitable position of the first support 1 to open the positioning groove 13, and also facilitating to select a suitable position of the first speaker 2 to form the positioning portion 23, thereby further simplifying the structure design of the first support 1 and the first speaker 2.
[0152] For example, the first wiring portion 22 of the first speaker 2 can pass through the third through hole 17 and extend to the outside of the first support 1. Thus, when the first speaker 2 is installed in the first support 1, the first wiring portion 22 can be welded with other components.
[0153] In other embodiments, the first speaker 2 can also be fixed to the first support 1 by clamping or threaded connection of fasteners.
[0154] Referring to FIG. 12, FIG. 12 is a structural schematic view of the second speaker 5 in some embodiments of FIG. 6.
[0155] In some embodiments, the second speaker 5 can include a second body 51 and a second wiring portion 52. The second wiring portion 52 is fixedly connected with the second body 51.
[0156] For example, the second body 51 is a sound emitting structure of the second speaker 5. For example, the second body 51 can emit sound by vibrating the diaphragm.
[0157] In some examples, the second speaker 5 can include a first sub-speaker 53 and a second sub-speaker 54, the first sub-speaker 53 and the second sub-speaker 54 are fixedly connected, and the first sub-speaker 53 and the second sub-speaker 54 are capable of emitting sound respectively. Wherein, the first sub-speaker 53 and the second sub-speaker 54 can be arranged opposite to each other. The first sub-speaker 53 and the second sub-speaker 54 can both emit sound, and the first sub-speaker 53 and the second sub-speaker 54 can emit sound towards the same direction through internal channel design.
[0158] Wherein, the first sub-speaker 53 and the second sub-speaker 54 can emit sound simultaneously or independently. For example, the first sub-speaker 53 and the second sub-speaker 54 each have a diaphragm and emit sound through the respective diaphragm. For example, the first sub-speaker 53 and the second sub-speaker 54 can be connected into one body after being shaped respectively, forming the second speaker 5. For example, the first sub-speaker 53 and the second sub-speaker 54 can also reuse the structure of driving diaphragm such as magnet, coil, etc. The present example does not strictly limit the structure of the first sub-speaker 53 and the second sub-speaker 54. For example, the first sub-speaker 53 is mainly used to emit mid-frequency sound, and the second sub-speaker 54 is mainly used to emit low-frequency sound, but it is not limited thereto.
[0159] At this time, the first speaker 2 and the second speaker 5 can both emit sound, which is conducive to improving the sound quality of the earphone 100; the first sub-speaker 53 and the second sub-speaker 54 are integrated into the second speaker 5, which can improve the integration of the first sub-speaker 53 and the second sub-speaker 54, reduce the occupied space, and also can be assembled together into the earphone 100, improving the assembly efficiency.
[0160] In some examples, the second speaker 5 can be mainly used to emit mid-low frequency sound, to be used in cooperation with the first speaker 2. In other examples, the second speaker 5 can also be used to emit high-frequency sound, or to emit full-frequency sound. The present example does not strictly limit this.
[0161] For example, the second wiring part 52 can have flexibility, so that the second wiring part 52 can be deformed and bent relative to the second main body 51, thereby facilitating adjustment of the relative position of the second wiring part 52 and the second main body 51.
[0162] Exemplarily, the second wiring portion 52 can be electrically connected with the second main body 51. The second wiring portion 52 can have second soldering points 521. The second soldering points 521 are used to electrically connect with other components, so that the other components are electrically connected with the second main body 51. For example, the second soldering points 521 can be exposed on the second wiring portion 52. The number of the second soldering points 521 can be four; two of the second soldering points 521 are used to electrically connect with the first sub-speaker 53, and the other two of the second soldering points 521 are used to electrically connect with the second sub-speaker 54. Of course, in other embodiments, the number of the second soldering points 521 can be set according to the structure of the second speaker 5.
[0163] Exemplarily, the second main body 51 can have a substantially cylindrical structure. The second wiring portion 52 can be connected to the end face of the second main body 51 and partially fixed to the side face of the second main body 51. The second soldering points 521 can be exposed on the outer surface of the second wiring portion 52.
[0164] In some embodiments, the second speaker 5 can have positioning holes 55. Exemplarily, the positioning holes 55 can be arranged on the end face of the second main body 51. Exemplarily, the number of the positioning holes 55 can be multiple, and the multiple positioning holes 55 are arranged at intervals on the end face of the second main body 51. For example, the number of the positioning holes 55 can be two.
[0165] In some embodiments, the second speaker 5 can have fixing holes 56. Exemplarily, the fixing holes 56 can be arranged on the end face of the second main body 51. Exemplarily, the number of the fixing holes 56 can be multiple, and the multiple fixing holes 56 are arranged at intervals on the end face of the second main body 51. Some of the fixing holes 56 can be arranged adjacent to the positioning holes 55. For example, the number of the fixing holes 56 can be six. Two of the fixing holes 56 are arranged on the two sides of one of the positioning holes 55. The fixing holes 56 and the positioning holes 55 can also be arranged in other manners, and the embodiments are not limited in this regard.
[0166] Please refer to FIG. 13 and FIG. 14, FIG. 13 is a sectional view of the partial structure of the audio assembly 20 shown in FIG. 3 in some embodiments, and FIG. 14 is a sectional view of the partial structure of the audio assembly 20 shown in FIG. 3 in other embodiments. The sectional plane of FIG. 13 is parallel to the central axis 1004, and the sectional plane of FIG. 14 is perpendicular to the central axis 1004.
[0167] In some embodiments, the second speaker 5 can be fixedly mounted on the first support 1. For example, the second speaker 5 can be bonded to the first support 1. In this case, the first support 1, the first speaker 2 and the second speaker 5 are sequentially stacked along a first direction. In this case, the first direction can be parallel to the central axis 1004. At this time, the first speaker 2 and the second speaker 5 both belong to the audio assembly 20, and the first speaker 2 and the second speaker 5 can both produce sound, and the first speaker 2 and the second speaker 5 can be responsible for different frequencies of sound, thereby facilitating the improvement of the sound quality of the first speaker 2 and the second speaker 5, thereby improving the sound quality of the earphone 100.
[0168] For example, the second speaker 5 is mounted at the end of the first support 1, the first support 1 and the second speaker 5 enclose a mounting space, the first speaker 2 is located in the mounting space, and the first speaker 2 and the second speaker 5 are arranged in a spaced manner. In this case, the cross section of the second speaker 5 can be larger than the cross section of the first speaker 2, and the size of the end surface of the second speaker 5 can be close to the size of the end of the first support 1. The end surface of the second speaker 5 closes the cover space of the first support 1 and forms a mounting space, and the first speaker 2 is located in the mounting space. In this case, the first sub-speaker 53 of the second speaker 5 is located on the side that can face the first speaker 2. Since the mounting space can be in communication with the outside through the second through hole 16 (see FIG. 7) or the third through hole 17 of the first support 1, the sound of the first sub-speaker 53 can be transmitted to the outside of the first support 1 through the mounting space and the second through hole 16 or the third through hole 17.
[0169] In this example, the first support 1 fixedly connects the first speaker 2 and the second speaker 5, and the first speaker 2 is wrapped by the first support 1 and the second speaker 5. On the one hand, this can make the structure of the first support 1, the first speaker 2 and the second speaker 5 more compact, and the utilization of space is higher, thereby facilitating the miniaturization of the audio assembly 20. On the other hand, it can also facilitate the fixed connection of the first speaker 2 and the second speaker 5 to the first support 1.
[0170] For example, the positioning column 18 of the first support 1 and the positioning hole 55 of the second speaker 5 are in clearance fit, the fixing column 19 of the first support 1 is located in the fixing hole 56 of the second speaker 5, and the fixing column 19 and the fixing hole 56 are bonded by adhesive. The positioning column 18 and the positioning hole 55 can be adapted in shape, for example, the positioning column 18 can be a cylindrical column structure, the positioning hole 55 can be a circular hole structure, and the diameter of the positioning column 18 can be less than or equal to the diameter of the positioning hole 55. The size of the fixing column 19 can be less than the size of the fixing hole 56, and the outer wall of the fixing column 19 can be spaced from the inner wall of the fixing hole 56. The fixing column 19 and the fixing hole 56 can be different in shape or the same in shape. For example, the fixing column 19 and the fixing hole 56 can both be substantially rectangular column structures. The space between the fixing column 19 and the fixing hole 56 can be filled with adhesive, so that the fixing column 19 and the fixing hole 56 are fixedly connected, so that the second speaker 5 and the first support 1 are fixedly connected. The space between the fixing column 19 and the fixing hole 56 is beneficial to increase the bonding area of the adhesive therebetween, thereby improving the reliability of the bonding.
[0171] In the present example, by providing the positioning hole 55 and the positioning column 18, the positioning of the second speaker 5 on the first support 1 is facilitated when the second speaker 5 is installed. By providing the fixing hole 56 and the fixing column 19 and bonding by adhesive, the connection of the second speaker 5 and the first support 1 is simpler and more reliable.
[0172] For example, as described above, when the second speaker 5 includes the first sub-speaker 53 and the second sub-speaker 54, the first sub-speaker 53 and the second sub-speaker 54 can be arranged along the first direction, the first sub-speaker 53 can face the first speaker 2, and the second sub-speaker 54 can face away from the first speaker 2 relative to the first sub-speaker 53.
[0173] In other embodiments, the first support 1 and the second speaker 5 can also be fixedly connected by welding, clamping, or other connection methods.
[0174] Referring to FIG. 15, FIG. 15 is a structural schematic view of the flexible circuit board 4 and the microphone 3 shown in FIG. 6.
[0175] In some embodiments, the flexible circuit board 4 can include a main board portion 41, a first electrical connection portion 42, a second electrical connection portion 43, and a third electrical connection portion 44. The first electrical connection portion 42, the second electrical connection portion 43, and the third electrical connection portion 44 are fixedly connected to the main board portion 41.
[0176] For example, the first electrical connection portion 42 is fixedly connected to the main plate portion 41, the second electrical connection portion 43 is fixedly connected to the main plate portion 41, and the third electrical connection portion 44 is fixedly connected to the second electrical connection portion 43. The third electrical connection portion 44 is fixedly connected to the main plate portion 41 through the second electrical connection portion 43. The first electrical connection portion 42, the second electrical connection portion 43, and the third electrical connection portion 44 can be extended from the main plate portion 41.
[0177] It can be understood that the flexible circuit board 4 can have a circuit to transmit an electrical signal.
[0178] In some embodiments, the microphone 3 can convert a sound signal into an electrical signal output to pick up the sound. For example, the microphone 3 can be a feedback microphone 3, and the microphone 3 can be used to pick up the sound output by the earphone 100.
[0179] In some embodiments, the flexible circuit board 4 and the microphone 3 can be an integrally formed structure. The microphone 3 can be formed by a semiconductor process. When the microphone 3 is formed, the microphone 3 can be directly formed on the first electrical connection portion 42 of the flexible circuit board 4. After the microphone 3 is manufactured, the microphone 3 can be fixedly connected to the first electrical connection portion 42. Thus, the electrical connection between the microphone 3 and the flexible circuit board 4 is more reliable, and the fixing steps of the microphone 3 and the flexible circuit board 4 are reduced when the audio assembly 20 is assembled, thereby facilitating the assembly of the audio assembly.
[0180] Please refer to FIG. 16, which is a sectional view of part of the structure of the audio assembly 20 shown in FIG. 3 in some embodiments.
[0181] In some embodiments, the microphone 3 and the first speaker 2 can be fixed to the first support 1. For example, referring to FIG. 7, the microphone 3 can be fixed to the first mounting groove 11, so that the microphone 3 is fixed to the first surface 1c.
[0182] The size of the first mounting groove 11 can correspond to the size of the microphone 3. At least part of the structure of the microphone 3 is located in the first mounting groove 11. In this embodiment, the first mounting groove 11 can position and install the microphone 3. The microphone 3 is generally small, and the first mounting groove 11 can wrap at least part of the structure of the microphone 3. The groove structure of the first mounting groove 11 can have more contact surfaces and a larger contact area with the microphone 3, thereby more reliably fixing the microphone 3.
[0183] In the direction perpendicular to the central axis 1004, the microphone 3 avoids the first through hole 15 to avoid blocking the first through hole 15, so that the first through hole 15 can communicate with the outside of the first support 1.
[0184] In some embodiments, the flexible circuit board 4 can be electrically connected with the first speaker 2 and the second speaker 5. In this case, the second electrical connection part 43 can be welded with the two first welding points 221, and two welding points can be formed after welding. The third electrical connection part 44 can be welded with the four second welding points 521 of the second wiring part 52. At this time, since the flexible circuit board 4 and the microphone 3 are an integral structure, when the microphone 3 is fixed to the first support 1, the steps of electrically connecting the flexible circuit board 4 with the first speaker 2 and the second speaker 5 can be performed synchronously, thereby simplifying the assembly steps of the audio assembly 20.
[0185] In some embodiments, as described above, referring to FIG. 11, since the first wiring part 22 can pass through the third through hole 17 and extend to the outside of the first support 1, the flexible circuit board 4 can be welded with the first wiring part 22 outside the first support 1. Since the second speaker 5 is installed at the end of the first support 1, and the second wiring part 52 is located at the side of the second speaker 5, the second wiring part 52 is also located outside the first support 1, thereby facilitating the welding of the flexible circuit board 4 with the second wiring part 52 outside the first support 1. At this time, the electrical connection mode of the flexible circuit board 4 with the microphone 3, the first speaker 2 and the second speaker 5 is relatively simple, the flexible circuit board 4 can cover the outside of the microphone 3, the first support 1, the first speaker 2 and the second speaker 5, and the flexible circuit board 4 does not need to be arranged additionally, thereby facilitating the installation of the flexible circuit board 4.
[0186] In the embodiments of the present application, the microphone 3, the first support 1 and the first speaker 2 of the audio assembly 20 are stacked along the first direction.
[0187] At this time, on the one hand, the microphone 3 and the first speaker 2 are located at different sides of the first support 1, the first support 1 fixes the microphone 3 and the first speaker 2, the first support 1 fixes the microphone 3 and the first speaker 2 respectively, the first support 1 has little effect on the size of the audio assembly 20 in the first direction, which is conducive to reducing the size of the audio assembly 20 in the first direction, thereby improving the compactness of the structure of the audio assembly 20. On the other hand, the microphone 3 and the first speaker 2 are located at different sides of the first support 1, the installation of the microphone 3 and the first speaker 2 does not affect each other, thereby facilitating the assembly of the microphone 3 and the first speaker 2. On the other hand, the microphone 3, the first support 1 and the first speaker 2 can be assembled to form an independent module (the audio assembly 20), and the microphone 3, the first support 1 and the first speaker 2 can be assembled without considering the influence of other components (such as the shell 10) of the earphone 100 on the microphone 3, the first support 1 and the first speaker 2, thereby facilitating the assembly of the module (the audio assembly 20) in the shell 10.
[0188] With reference to FIGS. 5, 16 and 17, FIG. 17 is a sectional view of the partial structure of the earphone 100 shown in FIG. 1 in some embodiments.
[0189] In some embodiments, the audio assembly 20 can be installed in the accommodation space 104 of the housing 10. The first support 1 and the housing 10 enclose the sound outlet channel 105, which is in communication with the accommodation space 104 and the outside of the housing 10. At this time, the first loudspeaker 2 can propagate sound to the outside of the earphone 100 through the sound outlet channel 105, so that the earphone 100 can normally sound; and the microphone 3 can be located in the sound outlet channel 105 to facilitate sound pickup.
[0190] For example, the sound outlet channel 105 can be in communication with the outside through the sound outlet 1006, that is, the sound outlet 1006 is in communication with the sound outlet channel 105 and the space outside the housing 10; and the microphone 3 can be located on the side of the first support 1 facing the sound outlet 1006. At this time, since the sound outlet channel 105 is enclosed by the first support 1 and the housing 10, the microphone 3 is located in the sound outlet channel 105, the microphone 3 is closer to the sound outlet 1006, and the sound of the sound outlet 1006 will be directly transmitted to the human ear. The sound picked up by the microphone 3 is closer to the sound actually heard by the human ear, thus facilitating noise reduction of the earphone 100; and since the microphone 3 is fixed to the first support 1, that is, the microphone 3 does not need to be fixed to the housing 10 at the sound outlet 1006, thus not blocking the sound outlet channel 105 at the sound outlet 1006, facilitating the sound outlet channel 105 to have a larger sound outlet area, thus improving the sound outlet effect.
[0191] The first surface 1c can face the sound outlet 1006. The first through hole 15 can be in communication with the sound outlet 24 and the sound outlet channel. When the first loudspeaker 2 is bonded to the first support 1, the adhesive can avoid the first through hole 15, so that the first through hole 15 and the sound outlet 24 are in communication and the connection is sealed. The adhesive has the functions of bonding the first loudspeaker 2 to the first support 1 and sealing. At this time, on the one hand, the microphone 3 can face the sound outlet 1006, the sound emitted by the earphone 100 can be picked up by the microphone 3, and the sound at the sound outlet 1006 can be directly transmitted to the microphone 3, the transmission path is simpler, and this is conducive to sound pickup by the microphone 3. On the other hand, since the first through hole 15 is in communication with the sound outlet 24 and the sound outlet channel 105, the path between the sound outlet 24 of the first loudspeaker 2 and the sound outlet 1006 is basically a straight line, that is, the sound outlet channel 105 structure of the first loudspeaker 2 through the sound outlet 1006 is relatively simple, the influence on the sound is small, which is conducive to improving the sound quality of the earphone 100, and the simple sound outlet path is conducive to simplifying the structure of the earphone 100.
[0192] For example, the first surface 1c can be bonded to the mounting surface 1014 by an adhesive.
[0193] For example, the first surface 1c can be bonded to the mounting surface 1014 by an adhesive.
[0194] In the present embodiment, the microphone 3, the first support 1, and the first speaker 2 can be assembled into a separate module (the audio assembly 20) first, and when the module is assembled into the shell 10, the influence of other components of the earphone 100 (such as the shell 10) on the microphone 3, the first support 1, and the first speaker 2 can be basically ignored, which is conducive to improving the accuracy and consistency of the module (the audio assembly 20) installed in the shell 10.
[0195] In some embodiments, as described above, the first surface 1c is formed on one side of the top portion 1a, and the second surface 1d is formed on the other side of the top portion 1a; the first surface 1c is parallel to the second surface 1d. At this time, the microphone 3 and the first speaker 2 are connected to the two side surfaces of the top portion 1a, respectively, and the microphone 3, the top portion 1a, and the first speaker 2 are basically free of spacing in the first direction, so that the audio assembly 20 has a higher compactness in the first direction and a smaller size.
[0196] In some embodiments, when the audio assembly 20 further includes the second speaker 5, the second speaker 5 can also propagate sound to the outside of the earphone 100 through the sound outlet channel 105. Since the second speaker 5 is fixed to the first support 1, and the first support 1 is fixed to the shell 10, the second speaker 5 can be fixed to the shell 10 through the first support 1. The first support 1, the first speaker 2, and the second speaker 5 are stacked in the first direction in sequence.
[0197] At this time, the second speaker 5 can also be stacked along the first direction without adding a fixed component or the space occupied by the additional fixed component, which is conducive to improving the compactness of the audio assembly 20. In addition, since the second speaker 5 is also stacked along the first direction, when the second speaker 5 is installed, it can be positioned and fixed along the first direction, which is the same as the positioning and fixing direction of the first speaker 2, thereby reducing the complexity of the installation of the second speaker 5 and further reducing the assembly complexity of the audio assembly 20.
[0198] In some embodiments, as described above, the second speaker 5 is installed at the end of the first support 1, and the first support 1 and the second speaker 5 enclose an installation space, and the first speaker 2 is located in the installation space. At this time, the first support 1 covers the first speaker 2, and the first speaker 2 and the first support 1 multiplex the space in the first direction, and enable the first support 1 to be directly connected to the second speaker 5, which on one hand can make the structure of the first support 1, the first speaker 2 and the second speaker 5 more compact, and the utilization of space is higher, thereby being conducive to improving the miniaturization of the audio assembly 20; on the other hand, it can also facilitate the fixed connection of the first speaker 2 and the second speaker 5 to the first support 1.
[0199] Please refer to FIG. 3 and FIG. 18, which is a cross-sectional view of the partial structure of the earphone 100 shown in FIG. 1 in some other embodiments.
[0200] In some embodiments, the battery assembly 30 includes a second support 301 and a battery 302. The second support 301 is fixedly connected to the battery 302.
[0201] For example, the second support 301 can be an integrally formed structural member. The second support 301 can have a fixing groove 3011.
[0202] For example, the battery 302 can store electric power, and the battery 302 is used to supply power to the power-consuming components in the earphone 100, which are not exemplified one by one here. The battery 302 can have a substantially cylindrical structure to adapt to the shape of the earphone 100. The battery 302 can be fixedly installed in the fixing groove 3011.
[0203] In some embodiments, the second support 301 and the battery 302 of the battery assembly 30 can be located in the accommodation space 104 of the housing 10.
[0204] For example, the first support 1, the second support 301 and the battery 302 are arranged along the first direction, and the second support 301 is located on the side of the first support 1 away from the microphone 3. For example, when the earphone 100 comprises the second speaker 5, the second speaker 5, the second support 301 and the battery 302 can be arranged in sequence. In some examples, the second support 301 and the battery 302 can be sequentially assembled into the housing 10. In other examples, the second support 301 and the battery 302 can be assembled to form a battery assembly 30, and then assembled into the housing 10. The present examples do not strictly limit the assembly of the second support 301 and the battery 302.
[0205] In the present embodiment, the second support 301 and the battery 302 can be assembled into the accommodating space 104 of the housing 10 along the first direction, so as to be consistent with the assembly direction of the audio assembly 20, reduce the complexity of assembly, and simplify the assembly steps of the earphone 100, thereby improving the assembly efficiency and assembly quality of the earphone 100.
[0206] In the present embodiment, after the first housing 101 and the second housing 102 are butted and fixedly connected to form the housing 10, the microphone 3, the first support 1, the first speaker 2 and the second speaker 5 of the audio assembly 20 are all located in the mounting space of the housing 10, and the housing 10 supports and protects the above-mentioned components.
[0207] Please refer to FIG. 19 and FIG. 20, FIG. 19 is a cross-sectional view of the earphone 100 shown in FIG. 1 in some embodiments, and FIG. 20 is a cross-sectional view of the earphone 100 shown in FIG. 1 from another perspective. In the present embodiment, the cross-sectional plane of FIG. 19 and the cross-sectional plane of FIG. 20 are both parallel to the central axis 1004, and the cross-sectional plane of FIG. 19 and the cross-sectional plane of FIG. 20 are perpendicular to each other.
[0208] In some embodiments, in the earphone 100, for the first speaker 2, the sound outlet 24 of the first speaker 2 is connected with the first through hole 15 (please refer to FIG. 7). Thus, as shown by the dashed arrow in FIG. 19, the sound emitted by the first speaker 2 can enter the sound outlet channel 105 through the first through hole 15 from the sound outlet 24, and then propagate to the outside of the housing 10 through the sound outlet 1006.
[0209] In some embodiments, for the second speaker 5, the first speaker 2 is arranged apart from the second speaker 5, and a space between the first speaker 2 and the second speaker 5 forms a back cavity 26 of the first speaker 2 and forms a front cavity 57 of the second speaker 5. The second through hole 16 (see FIG. 7) is in communication with the front cavity 57 of the second speaker 5 and the sound outlet channel 105. At this time, as shown by the dashed arrow in FIG. 19, the front cavity 57 of the second speaker 5 is in communication with the second through hole 16, the second speaker 5 is equivalent to emitting sound through the second through hole 16, and the sound of the second speaker 5 is transmitted to the second through hole 16 through the front cavity 57, enters the sound outlet channel 105 through the second through hole 16, and is transmitted to the outside of the shell 10. In this case, the second through hole 16 is formed in the first support 1, and the area of the second through hole 16 is easily larger, which is conducive to making the second speaker 5 have a larger sound outlet area. In addition, the sound of the first speaker 2 and the sound of the second speaker 5 are both fixed to the first support 1, and the sound of the first speaker 2 and the sound of the second speaker 5 both pass through the first support 1 to enter the sound outlet channel 105, which is conducive to simplifying the design of the sound channel of the first speaker 2 and the second speaker 5 in the earphone 100.
[0210] It can be understood that the back cavity of the second speaker 5 can be in communication with the air vent 103 on the shell 10, and the specific communication structure is not strictly limited in this embodiment.
[0211] Referring to FIG. 21, FIG. 21 is an exploded structural schematic view of part of the structure of the audio assembly 20 shown in FIG. 3 in some other embodiments.
[0212] In some embodiments, the audio assembly 20 shown in FIG. 21 is different from the audio assembly 20 shown in FIG. 6 mainly in that the structures of the first support 1, the first speaker 2, and the second speaker 5 are different.
[0213] For example, the first support 1 can include a top portion 1a and a side portion 1b, and the side portion 1b is arranged around the top portion 1a. In this case, the top portion 1a can have a substantially rectangular structure, and the main body portion 111 can have a substantially circular ring structure. The specific structure of the first support 1 can be referred to the related description in the embodiments of FIGS. 7 to 9, and will not be described again in this embodiment.
[0214] For example, the first speaker 2 can have a substantially rectangular block structure. The first speaker 2 can be a mems (Micro Electro Mechanical Systems) speaker. The projection of the first speaker 2 in a first direction can be smaller than the projection of the top portion 1a in the first direction. The specific structure of the first speaker 2 can be referred to the related description in the embodiment of FIG. 10, and will not be described again in this embodiment. The first speaker 2 has a small volume, which is conducive to the miniaturization design of the audio assembly 20.
[0215] Exemplarily, the second speaker 5 can be a moving-coil single diaphragm speaker. In this case, the second speaker 5 can not be provided with a positioning hole, a fixing hole or the like.
[0216] In this embodiment, the assembling manner of the first support 1, the first speaker 2 and the second speaker 5 can refer to the related scheme in the embodiment of FIG. 13, and the embodiment will not be described herein.
[0217] It should be noted that, in the case of no conflict, the embodiments and the features in the embodiments in the present application can be combined with each other, and the features in different embodiments can be combined with each other, which are also within the protection scope of the present application, that is, the above-described multiple embodiments can also be combined with each other according to actual needs.
[0218] It should be noted that all the above-mentioned drawings are exemplary drawings of the present application, and do not represent the actual size of the product. The size ratio relationship between the components in the drawings is not regarded as a limitation on the actual product of the present application.
[0219] The above is only part of the embodiments and the implementation manners of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
A sound output device (100), characterized in that, include: The shell (10) has a receiving space (104); The first bracket (1) is fixed to the receiving space (104) of the housing (10), and the first bracket (1) includes a first surface (1c) and a second surface (1d) facing away from each other; Microphone (3), fixed to the first surface (1c); and The first loudspeaker (2) is fixed to the second surface (1d). The sound output device (100) according to claim 1 is characterized in that, The first bracket (1) has a first mounting groove (11), the first surface (1c) is at least partially formed on the bottom surface of the first mounting groove (11), and at least a portion of the structure of the microphone (3) is located in the first mounting groove (11); The first bracket (1) has a second mounting groove (12), the second surface (1d) is at least partially formed on the bottom surface of the second mounting groove (12), and at least a portion of the structure of the first speaker (2) is located in the second mounting groove (12). The sound output device (100) according to claim 2 is characterized in that, The first bracket (1) has a positioning groove (13), and the first speaker (2) has a positioning part (23). The positioning part (23) is protruding and located in the positioning groove (13), and is fixedly connected to the groove wall of the positioning groove (13). According to any one of claims 1 to 3, the first bracket (1) is a cover structure, the first bracket (1) includes a top (1a) and a side (1b), the side (1b) surrounds the top (1a), a first surface (1c) is formed on one side of the top (1a), and a second surface (1d) is formed on the other side of the top (1a); the first surface (1c) is parallel to the second surface (1d), and the side (1b) extends in a direction away from the first surface (1c). The sound output device (100) according to any one of claims 1 to 3 is characterized in that, The first bracket (1) includes a main body (111) and a fixing part (110). The fixing part (110) is located between the first speaker (2) and the microphone (3). The first surface (1c) is formed on one side surface of the fixing part (110), and the second surface (1d) is formed on the other side surface of the fixing part (110). The fixing part (110) is embedded in the main body (111). The main body (111) is made of plastic, and the fixing part (110) is a metal sheet. The sound output device (100) according to any one of claims 1 to 3 is characterized in that, The housing (10) has a sound outlet (1006), the first bracket (1) and the housing (10) form a sound outlet channel (105), the sound outlet (1006) connects the sound outlet channel (105) and the outside of the housing (10), and the first speaker (2) emits sound through the sound outlet channel (105); The microphone (3) is located on the side of the first bracket (1) facing the sound outlet (1006), and the microphone (3) is located in the sound outlet channel (105). The sound output device (100) according to claim 6 is characterized in that, The first surface (1c) faces the sound outlet (1006), the first bracket (1) has a first through hole (15), the first speaker (2) has a sound outlet (24), and the first through hole (15) connects the sound outlet (24) and the sound channel (105). The sound output device (100) according to claim 6 is characterized in that, The first bracket (1) has a fixing surface (14), which is fixedly connected to the housing (10); the fixing surface (14) is a plane and is perpendicular to the center line of the sound outlet (1006). The sound output device (100) according to any one of claims 1 to 3 is characterized in that, The sound output device (100) further includes a second speaker (5), which is fixedly connected to the first bracket (1). The first bracket (1), the first speaker (2), and the second speaker (5) are stacked in sequence. The sound output device (100) according to claim 9 is characterized in that, The first bracket (1) is a cover structure, the second speaker (5) is installed at the end of the first bracket (1), the first bracket (1) and the second speaker (5) form an installation space, and the first speaker (2) is located in the installation space. The sound output device (100) according to claim 9 is characterized in that, The first bracket (1) includes a positioning post (18) and a fixing post (19). The second speaker (5) is provided with a positioning hole (55) and a fixing hole (56) at the end facing the first bracket (1). The positioning post (18) and the positioning hole (55) are clearance-fitted. The fixing post (19) is located in the fixing hole (56), and the fixing post (19) and the fixing hole (56) are bonded together by adhesive. The sound output device (100) according to claim 9 is characterized in that, The housing (10) has a sound outlet (1006), the first bracket (1) and the housing (10) form a sound outlet channel (105), and the sound outlet (1006) connects the sound outlet channel (105) with the outside of the housing (10); The first bracket (1) has a second through hole (16), the first speaker (2) and the second speaker (5) are spaced apart, the space between the first speaker (2) and the second speaker (5) forms the rear cavity of the first speaker (2) and the front cavity of the second speaker (5), and the second through hole (16) connects the front cavity of the second speaker (5) and the sound outlet channel (105). The sound output device (100) according to claim 9 is characterized in that, The second speaker (5) includes a first sub-speaker (53) and a second sub-speaker (54), which are fixedly connected and can emit sound respectively. The sound output device (100) according to claim 9 is characterized in that, The sound output device (100) also includes a flexible circuit board (4), which is an integrally formed structural component with the microphone (3). The flexible circuit board (4) is electrically connected to the first speaker (2) and the second speaker (5). The sound output device (100) according to claim 14 is characterized in that, The flexible circuit board (4) is located outside the microphone (3), the first bracket (1) and the second speaker (5). The first speaker (2) has a first wiring portion (22), the first bracket (1) has a third through hole (17), the first wiring portion (22) passes through the third through hole (17), and the first wiring portion (22) is electrically connected to the flexible circuit board (4). The sound output device (100) according to any one of claims 1 to 3 is characterized in that, The sound output device (100) further includes a second bracket (301) and a battery (302), the second bracket (301) being fixedly connected to the battery (302), the second bracket (301) and the battery (302) being located in the receiving space (104), and the second bracket (301) being fixedly connected to the housing (10); The first bracket (1), the second bracket (301) and the battery (302) are arranged along a first direction. The second bracket (301) is located on the side of the first bracket (1) away from the microphone (3). The first direction is the arrangement direction of the microphone (3), the first bracket (1) and the first speaker (2).
Citation Information
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