Heat medium control device and control method for heat medium

Abstract

According to the present invention, first supply piping is connected to first piping for supplying a heat medium into a channel of a heat exchange member and supplies the heat medium at a first temperature into the channel via the first piping. First return piping is connected to second piping for discharging the heat medium in the channel and returns the heat medium that has flowed through the channel to a tank inside a first temperature control unit. Second supply piping is connected to the first piping and supplies the heat medium at a second temperature into the channel via the first piping. Second return piping is connected to the second piping and returns the heat medium that has flowed through the channel to a tank inside a second temperature control unit. A first switching unit switches the heat medium supplied to the first piping. A second switching unit switches the discharge destination of the heat medium discharged through the second piping. First bypass piping is provided between the second piping and the tank inside the first temperature control unit. A first valve is provided on the first bypass piping.

Description

Heat medium control device and heat medium control method

[0001] Various aspects and embodiments of the present disclosure relate to a heat medium control device and a heat medium control method.

[0002] For example, Patent Document 1 listed below discloses a heat medium control method including a flow rate control step and a supply stop step. In the flow rate control step, the flow rate of the heat medium is reduced while the heat medium is supplied from a temperature control unit that supplies a temperature-controlled heat medium into a flow path formed in a heat exchange element that exchanges heat with a temperature-controlled object. In the supply stop step, the supply of the heat medium into the flow path is stopped by controlling a supply valve provided in a supply pipe that connects the temperature control unit and the flow path of the heat exchange element.

[0003] Furthermore, for example, Patent Document 2 listed below discloses that two systems of temperature fluids are provided, and the temperatures of the low-temperature fluid and the high-temperature fluid are controlled so that the temperature of the electrostatic chuck 12 becomes a set temperature, and the fluids are mixed at a predetermined flow rate ratio and flowed through the electrostatic chuck 12.

[0004] JP 2020-120045 A JP 2013-105359 A

[0005] The present disclosure provides a heat medium control device and a heat medium control method that can suppress fluctuations in the temperature of a heat medium flowing through a flow path of a heat exchange member.

[0006] One aspect of the present disclosure is a heat medium control device including a first supply pipe, a first return pipe, a second supply pipe, a second return pipe, a first switching unit, a second switching unit, a first bypass pipe, and a first valve. The first supply pipe is connected to a first pipe for supplying a heat medium as a fluid into a flow path formed in a heat exchange member that exchanges heat with a temperature-controlled object, and is a pipe for supplying the heat medium at a first temperature from a first temperature control unit into the flow path via the first pipe. The first return pipe is connected to a second pipe for discharging the heat medium that has flowed in the flow path, and is a pipe for returning the heat medium that has flowed in the flow path to a tank in the first temperature control unit. The second supply pipe is connected to the first pipe and is a pipe for supplying the heat medium at a second temperature different from the first temperature from the second temperature control unit into the flow path via the first pipe. The second return pipe is connected to the second pipe and is a pipe for returning the heat medium that has flowed in the flow path to a tank in the second temperature control unit. The first switching unit switches the heat medium supplied to the first pipe between the heat medium flowing through the first supply pipe and the heat medium flowing through the second supply pipe. The second switching unit switches the destination of the heat medium discharged from the second pipe between the first return pipe and the second return pipe. The first bypass pipe is provided between the second pipe and a tank in the first temperature control unit. The first valve is provided on the first bypass pipe.

[0007] According to various aspects and embodiments of the present disclosure, fluctuations in the temperature of the heat medium flowing through the flow passages of the heat exchange member can be suppressed.

[0008] FIG. 1 is a diagram illustrating an example of the configuration of a capacitively coupled plasma processing apparatus. FIG. 2 is a diagram illustrating an example of the configuration of a temperature control device. FIG. 3 is a flowchart illustrating an example of a temperature control method. FIG. 4 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device. FIG. 5 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device. FIG. 6 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device. FIG. 7 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device. FIG. 8 is a diagram illustrating an example of a temperature change in a heat medium in a reference example. FIG. 9 is a diagram illustrating an example of a temperature change in a heat medium in this embodiment. FIG. 10 is a diagram illustrating another example of the configuration of a temperature control device. FIG. 11 is a diagram illustrating another example of the configuration of a temperature control device. FIG. 12 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device in another example. FIG. 13 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device in another example. FIG. 14 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device in another example. FIG. 15 is a diagram illustrating an example of a process for controlling a heat medium by a temperature control device in another example. FIG. 16 is a diagram illustrating another example of the configuration of a temperature control device. FIG. 17 is a diagram illustrating another example of the configuration of a temperature control device. Fig. 18 is a diagram showing another example of the configuration of a temperature control device. Fig. 19 is a diagram showing another example of the configuration of a temperature control device. Fig. 20 is a diagram showing another example of the configuration of a temperature control device. Fig. 21 is a diagram showing an example of a heat medium control process by a temperature control device in another example. Fig. 22 is a diagram showing an example of a heat medium control process by a temperature control device in another example. Fig. 23 is a diagram showing an example of a heat medium control process by a temperature control device in another example.

[0009] Hereinafter, embodiments of the disclosed heat medium control device and heat medium control method will be described in detail with reference to the drawings. Note that the disclosed heat medium control device and heat medium control method are not limited to the following embodiments.

[0010] When the set temperature of a temperature-controlled object is switched, the heat medium flowing through the flow path of the heat exchange element that exchanges heat with the temperature-controlled object is switched from a heat medium of a first temperature to a heat medium of a second temperature. In this case, the supply of the heat medium of the first temperature to the heat exchange element is stopped, and the supply of the heat medium of the second temperature to the heat exchange element is started.

[0011] However, immediately after the heat medium supplied to the flow paths of the heat exchange element is switched from the heat medium of the first temperature to the heat medium of the second temperature, the heat medium of the first temperature remains in the flow paths of the heat exchange element. Therefore, immediately after the heat medium supplied to the flow paths of the heat exchange element is switched from the heat medium of the first temperature to the heat medium of the second temperature, the heat medium of the first temperature remaining in the flow paths of the heat exchange element is returned to the tank storing the heat medium of the second temperature. As a result, the temperature in the tank storing the heat medium of the second temperature becomes different from the second temperature, and the temperature of the heat medium supplied to the flow paths of the heat exchange element becomes different from the second temperature. As a result, immediately after the heat medium supplied to the flow paths of the heat exchange element is switched from the heat medium of the first temperature to the heat medium of the second temperature, the temperature of the heat exchange element becomes unstable.

[0012] Therefore, the present disclosure provides a technique that can suppress fluctuations in the temperature of the heat medium flowing through the flow passages of the heat exchanger element.

[0013] An example of the configuration of a plasma processing system will be described below: Fig. 1 is a diagram for explaining an example of the configuration of a capacitively coupled plasma processing apparatus.

[0014] The plasma processing system includes a capacitively coupled plasma processing apparatus 1 and a controller 2. The capacitively coupled plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, a power supply 30, and an exhaust system 40. The plasma processing apparatus 1 also includes a substrate support 11 and a gas inlet. The gas inlet is configured to introduce at least one process gas into the plasma processing chamber 10. The gas inlet includes a showerhead 13. The substrate support 11 is disposed within the plasma processing chamber 10. The showerhead 13 is disposed above the substrate support 11. In one embodiment, the showerhead 13 forms at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the showerhead 13, a sidewall 10a of the plasma processing chamber 10, and the substrate support 11. The plasma processing chamber 10 has at least one gas inlet for supplying at least one processing gas to the plasma processing space 10s and at least one gas outlet for exhausting gas from the plasma processing space 10s. The plasma processing chamber 10 is grounded. The showerhead 13 and the substrate support 11 are electrically insulated from the housing of the plasma processing chamber 10.

[0015] The substrate support 11 includes a main body 111 and a ring assembly 112. The main body 111 has a central region 111a for supporting a substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The substrate W is an example of a temperature-controlled object. The annular region 111b of the main body 111 surrounds the central region 111a of the main body 111 in a plan view. The substrate W is disposed on the central region 111a of the main body 111, and the ring assembly 112 is disposed on the annular region 111b of the main body 111 so as to surround the substrate W on the central region 111a of the main body 111. Therefore, the central region 111a is also referred to as a substrate support surface for supporting the substrate W, and the annular region 111b is also referred to as a ring support surface for supporting the ring assembly 112.

[0016] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The base 1110 is an example of a heat exchange member. The conductive member of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is disposed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic electrode 1111b disposed within the ceramic member 1111a. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Note that the annular region 111b may also be provided by another member surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member. In this case, the ring assembly 112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 1111 and the annular insulating member. Furthermore, at least one RF / DC electrode coupled to an RF (Radio Frequency) power supply 31 and / or a DC (Direct Current) power supply 32 (described later) may be disposed within the ceramic member 1111a. In this case, the at least one RF / DC electrode functions as a lower electrode. When a bias RF signal and / or a DC signal (described later) is supplied to the at least one RF / DC electrode, the RF / DC electrode is also called a bias electrode. Note that the conductive member of the base 1110 and the at least one RF / DC electrode may function as multiple lower electrodes. Alternatively, the electrostatic electrode 1111b may function as a lower electrode. Therefore, the substrate support 11 includes at least one lower electrode.

[0017] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0018] The substrate support 11 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature adjustment module may include a heater, a heat medium, a flow path 1110a, or a combination thereof. A heat medium, such as a fluid such as brine or gas, flows through the flow path 1110a. A temperature control device 50 is connected to the flow path 1110a via pipes 50a and 50b. The heat medium, whose temperature is controlled by the temperature control device 50, is supplied into the flow path 1110a via pipe 50a. The heat medium flowing through the flow path 1110a is returned to the temperature control device 50 via pipe 50b. The temperature control device 50 is an example of a heat medium control device, the pipe 50a is an example of a first pipe, and the pipe 50b is an example of a second pipe.

[0019] In one embodiment, the flow passage 1110a is formed in the base 1110, and one or more heaters are disposed in the ceramic member 1111a of the electrostatic chuck 1111. The substrate support 11 may also include a heat transfer gas supply configured to supply a heat transfer gas to a gap between the backside of the substrate W and the central region 111a.

[0020] The showerhead 13 is configured to introduce at least one process gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and multiple gas inlets 13c. The process gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s from the multiple gas inlets 13c. The showerhead 13 also includes at least one upper electrode. In addition to the showerhead 13, the gas inlet may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 10a.

[0021] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one process gas from a corresponding gas source 21 to the showerhead 13 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply unit 20 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.

[0022] The power supply 30 includes an RF power supply 31 coupled to the plasma processing chamber 10 via at least one impedance matching circuit. The RF power supply 31 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates a plasma from at least one process gas supplied to the plasma processing space 10s. Therefore, the RF power supply 31 can function as at least a part of a plasma generating unit configured to generate a plasma from one or more process gases in the plasma processing chamber 10. Furthermore, by supplying a bias RF signal to the at least one lower electrode, a bias potential is generated on the substrate W, thereby attracting ion components in the formed plasma to the substrate W.

[0023] In one embodiment, the RF power supply 31 includes a first RF generating unit 31a and a second RF generating unit 31b. The first RF generating unit 31a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generating unit 31a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0024] The second RF generator 31b is coupled to at least one lower electrode via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generator 31b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0025] The power supply 30 may also include a DC power supply 32 coupled to the plasma processing chamber 10. The DC power supply 32 includes a first DC generator 32a and a second DC generator 32b. In one embodiment, the first DC generator 32a is connected to the at least one lower electrode and configured to generate a first DC signal. The generated first bias DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generator 32b is connected to the at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one upper electrode.

[0026] In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular, or combination thereof pulse waveform. In one embodiment, a waveform generator for generating the sequence of voltage pulses from the DC signal is connected between the first DC generator 32a and at least one lower electrode. Thus, the first DC generator 32a and the waveform generator constitute a voltage pulse generator. When the second DC generator 32b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulses may have either positive or negative polarity. Furthermore, the sequence of voltage pulses may include one or more positive voltage pulses and one or more negative voltage pulses within one period. The first and second DC generating units 32a and 32b may be provided in addition to the RF power supply 31, or the first DC generating unit 32a may be provided instead of the second RF generating unit 31b.

[0027] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is regulated by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0028] The control unit 2 processes computer-executable instructions that cause the plasma processing apparatus 1 to perform various processes described in this disclosure. The control unit 2 may be configured to control each element of the plasma processing apparatus 1 to perform various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the plasma processing apparatus 1. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The control unit 2 may be implemented by, for example, a computer 2a. The processing unit 2a1 may be configured to read a program from the storage unit 2a2 and execute the read program to perform various control operations. The program may be stored in the storage unit 2a2 in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 by the processing unit 2a1 for execution. The medium may be various storage media readable by the computer 2a or a communication line connected to the communication interface 2a3. The processing unit 2a1 may be a CPU (Central Processing Unit). The storage unit 2a2 may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface 2a3 may communicate with the plasma processing apparatus 1 via a communication line such as a local area network (LAN).

[0029] 2 is a diagram showing an example of the configuration of the temperature control device 50. The temperature control device 50 includes a first temperature control unit 51a, a second temperature control unit 51b, a pipe 52a, a pipe 52b, a pipe 53a, a pipe 53b, a first switching unit 54a, a second switching unit 54b, a first bypass pipe 55a, a second bypass pipe 55b, a first bypass valve 56a, and a second bypass valve 56b. The pipe 52a is an example of a first supply pipe, the pipe 52b is an example of a second supply pipe, the pipe 53a is an example of a first return pipe, and the pipe 53b is an example of a second return pipe.

[0030] The first temperature control unit 51a has a pump 510a, a heat exchanger 511a, and a tank 512a. The pump 510a pushes the heat medium stored in the tank 512a into the pipe 52a. The heat exchanger 511a adjusts the temperature of the heat medium flowing in via the pipe 53a to a first temperature and returns the heat medium to the tank 512a. The tank 512a stores the heat medium whose temperature has been adjusted to the first temperature by the heat exchanger 511a. The first temperature is, for example, 30°C.

[0031] The second temperature control unit 51b has a pump 510b, a heat exchanger 511b, and a tank 512b. The pump 510b pushes the heat medium stored in the tank 512b into the pipe 52b. The heat exchanger 511b adjusts the temperature of the heat medium flowing in via the pipe 53b to a second temperature and returns the heat medium to the tank 512b. The tank 512b stores the heat medium whose temperature has been adjusted to the second temperature by the heat exchanger 511b. The second temperature is, for example, 10°C.

[0032] Note that a pipe may be provided between the tank 512a and the tank 512b to connect the tank 512a and the tank 512b. This prevents the heat medium from leaking from the tank even if the heat medium in one of the tanks 512a and 512b overflows, as the overflowing heat medium flows into the other tank via the pipe.

[0033] The pipe 52a is connected to the pipe 50a via the first switching unit 54a, and supplies the heat medium, whose temperature has been controlled to a first temperature from the first temperature control unit 51a, via the first switching unit 54a and the pipe 50a into the flow path 1110a of the base 1110. The pipe 53a is connected to the pipe 50b via the second switching unit 54b, and returns the heat medium that has flowed through the flow path 1110a of the base 1110 to the tank 512a via the heat exchanger 511a.

[0034] The pipe 52b is connected to the pipe 50a via the first switching unit 54a, and supplies the heat medium, whose temperature has been controlled to the second temperature from the second temperature control unit 51b, via the first switching unit 54a and the pipe 50a into the flow path 1110a of the base 1110. The pipe 53b is connected to the pipe 50b via the second switching unit 54b, and returns the heat medium that has flowed through the flow path 1110a of the base 1110 to the tank 512b via the heat exchanger 511b.

[0035] The first switching unit 54a has a first supply valve 540a and a second supply valve 541a. One end of the first supply valve 540a is connected to the pipe 52a, and the other end of the first supply valve 540a is connected to the pipe 50a. One end of the second supply valve 541a is connected to the pipe 52b, and the other end of the second supply valve 541a is connected to the pipe 50a. The first switching unit 54a controls the first supply valve 540a and the second supply valve 541a to switch the heat medium supplied to the pipe 50a between the heat medium flowing through the pipe 52a and the heat medium flowing through the pipe 52b.

[0036] The second switching unit 54b has a first return valve 540b and a second return valve 541b. One end of the first return valve 540b is connected to the pipe 53a, and the other end of the first return valve 540b is connected to the pipe 50b. One end of the second return valve 541b is connected to the pipe 53b, and the other end of the second return valve 541b is connected to the pipe 50b. The second switching unit 54b controls the first return valve 540b and the second return valve 541b to switch the destination of the heat medium discharged from the pipe 50b between the pipe 53a and the pipe 53b.

[0037] One end of the first bypass pipe 55a is connected to the pipe 50b, and the other end of the first bypass pipe 55a is connected to the tank 512a. A first bypass valve 56a is provided on the first bypass pipe 55a. One end of the second bypass pipe 55b is connected to the pipe 50b, and the other end of the second bypass pipe 55b is connected to the tank 512b. A second bypass valve 56b is provided on the second bypass pipe 55b.

[0038] [Operation of Temperature Control Device 50] Fig. 3 is a flowchart showing an example of a temperature control method. The temperature control method illustrated in Fig. 3 is realized by the control unit 2 controlling each unit of the temperature control device 50. The example of Fig. 3 shows an operation of switching the heat medium flowing in the flow path 1110a from a heat medium of a first temperature to a heat medium of a second temperature while a heat medium of a first temperature is flowing in the flow path 1110a of the base 1110. An example of the temperature control method will be described below with reference to Figs. 4 and 6. The temperature control method illustrated in Fig. 3 is an example of a heat medium control method.

[0039] The temperature control method illustrated in Fig. 3 starts with a state in which a heat medium at a first temperature from first temperature control unit 51a is supplied into flow path 1110a via pipe 52a and returned to first temperature control unit 51a via pipe 53a, as shown in Fig. 4, for example. In the example of Fig. 4, first supply valve 540a and first return valve 540b are open, and the other valves are closed. In Fig. 4 and subsequent figures, valves drawn in white represent valves in an open state, and valves drawn in black represent valves in a closed state.

[0040] 4, the first supply valve 540a is closed (step S10), and the second supply valve 541a is opened (step S11). As a result, the first switching unit 54a switches the heat medium supplied to the pipe 50a from the heat medium flowing through the pipe 52a to the heat medium flowing through the pipe 52b. Steps S10 and S11 are an example of process (a).

[0041] Next, the first bypass valve 56a is opened (step S12), and the first return valve 540b is closed (step S13). As a result, for example, as shown in FIG. 5, the heat medium discharged from the flow path 1110a via the pipe 50b is returned to the tank 512a of the first temperature control unit 51a via the first bypass pipe 55a. Step S12 is an example of the process (b).

[0042] Then, it is determined whether a predetermined time has elapsed (step S14). The predetermined time in step S14 is the time required from when the supply of the heat medium at the second temperature into the flow path 1110a begins until the heat medium at the first temperature remaining in the flow path 1110a is gone from the flow path 1110a. If the predetermined time has not elapsed (step S14: No), the process shown in step S14 is executed again.

[0043] If the predetermined time has elapsed (step S14: Yes), the second return valve 541b is opened (step S15), and the first bypass valve 56a is closed (step S16). The temperature control method illustrated in Fig. 3 then ends. As a result, as shown in Fig. 6, for example, the heat medium at the second temperature supplied from the second temperature control unit 51b flows through the flow path 1110a of the base 1110 via the pipe 52b and is returned to the second temperature control unit 51b via the pipe 53b.

[0044] In addition, when a heat medium of a second temperature is flowing through the flow path 1110a of the base 1110, and the heat medium flowing through the flow path 1110a is switched from the heat medium of the second temperature to the heat medium of the first temperature, for example, the following control is performed.

[0045] 6, the second supply valve 541a is closed and the first supply valve 540a is opened, whereby the first switching unit 54a switches the heat medium supplied to the pipe 50a from the heat medium flowing through the pipe 52b to the heat medium flowing through the pipe 52a.

[0046] Next, the second bypass valve 56b is opened and the second return valve 541b is closed, so that the heat medium discharged through the pipe 50b is returned to the tank 512b of the second temperature control unit 51b through the second bypass pipe 55b, as shown in FIG.

[0047] Then, when the time required for the heat medium at the second temperature remaining in the flow path 1110a to disappear from the flow path 1110a has elapsed since the supply of the heat medium at the first temperature into the flow path 1110a began, the first return valve 540b is opened. Then, the second bypass valve 56b is closed. As a result, for example, as shown in FIG. 4 , the heat medium at the first temperature supplied from the first temperature control unit 51a flows through the flow path 1110a of the base 1110 via the pipe 52a and is returned to the tank 512a of the first temperature control unit 51a via the pipe 53a.

[0048] [Temperature Change of Heat Medium] FIG. 8 is a diagram showing an example of the temperature change of the heat medium in a reference example. FIG. 8 shows, as a reference example, the temperature change of the heat medium when using a temperature control device 50 that does not include the first bypass pipe 55a, the second bypass pipe 55b, the first bypass valve 56a, and the second bypass valve 56b. FIG. 8 shows the temperature of the heat medium flowing through the flow path 1110a near the pipe 50a (the temperature on the supply side) and the temperature of the heat medium flowing through the flow path 1110a near the pipe 50b (the temperature on the discharge side). In the example of FIG. 8, the heat medium at a first temperature (30°C) and the heat medium at a second temperature (10°C) are alternately supplied to the flow path 1110a of the base 1110 at a predetermined period.

[0049] In the reference example, during the period T1 in which the heat medium at the first temperature is supplied, immediately after the heat medium at the first temperature is supplied into the flow path 1110a, the heat medium at the second temperature remaining in the flow path 1110a is returned to the first temperature control unit 51a. Therefore, the heat exchanger 511a of the first temperature control unit 51a is unable to fully adjust the temperature of the heat medium to the first temperature, and the heat medium at a temperature lower than the first temperature is returned to the tank 512a. Therefore, the temperature of the heat medium in the tank 512a temporarily becomes lower than the first temperature, and the temperature of the heat medium supplied into the flow path 1110a also becomes lower than the first temperature.

[0050] Furthermore, during period T2 in which the heat medium at the second temperature is supplied, immediately after the heat medium at the second temperature is supplied into flow path 1110a, the heat medium at the first temperature remaining in flow path 1110a is returned to second temperature control unit 51b. Therefore, heat exchanger 511b of second temperature control unit 51b is unable to fully adjust the temperature of the heat medium to the second temperature, and heat medium at a temperature higher than the second temperature is returned into tank 512b. Therefore, the temperature of the heat medium in tank 512b temporarily becomes higher than the second temperature, and the temperature of the heat medium supplied into flow path 1110a also becomes higher than the second temperature.

[0051] Therefore, in the reference example shown in FIG. 8, the temperature fluctuates greatly immediately after switching the heat medium flowing through the flow path 1110a, and it takes time for the temperature of the heat medium to stabilize.

[0052] 9 is a diagram showing an example of the temperature change of the heat medium in this embodiment. Fig. 9 shows the temperature of the heat medium flowing in the flow path 1110a near the pipe 50a (temperature on the supply side) and the temperature of the heat medium flowing in the flow path 1110a near the pipe 50b (temperature on the discharge side). In the example of Fig. 9, the heat medium at a first temperature (30°C) and the heat medium at a second temperature (10°C) supplied to the flow path 1110a of the base 1110 are alternately switched at a predetermined interval.

[0053] In this embodiment, during the period T1 in which the heat medium at the first temperature is supplied, immediately after the heat medium at the first temperature is supplied to the flow path 1110a, the heat medium at the second temperature remaining in the flow path 1110a is returned to the second temperature control unit 51b via the second bypass pipe 55b. Therefore, the heat medium at the second temperature is not returned to the heat exchanger 511a of the first temperature control unit 51a. Therefore, the temperature of the heat medium in the tank 512a is stabilized at the first temperature, and the temperature of the heat medium supplied to the flow path 1110a is also quickly stabilized at the first temperature.

[0054] Furthermore, during period T2 in which the heat medium at the second temperature is supplied, immediately after the heat medium at the second temperature is supplied to flow path 1110a, the heat medium at the first temperature remaining in flow path 1110a is returned to first temperature control unit 51a via first bypass piping 55a. Therefore, the heat medium at the first temperature is not returned to heat exchanger 511b of second temperature control unit 51b. Therefore, the temperature of the heat medium in tank 512b is stabilized at the second temperature, and the temperature of the heat medium supplied to flow path 1110a is also quickly stabilized at the second temperature.

[0055] Therefore, as illustrated in Figure 9, in this embodiment, the temperature fluctuation immediately after switching the heat medium flowing in the flow path 1110a is reduced, and the temperature of the heat medium flowing in the flow path 1110a can be stabilized in a shorter period of time.

[0056] The embodiment has been described above. As described above, the heat medium control device (temperature control device 50) of the present embodiment includes a first supply pipe (pipe 52a), a first return pipe (pipe 53a), a second supply pipe (pipe 52b), a second return pipe (pipe 53b), a first switching unit (first switching unit 54a), a second switching unit (second switching unit 54b), a first bypass pipe (first bypass pipe 55a), and a first valve (first bypass valve 56a). The first supply pipe is connected to a first pipe (pipe 50a) for supplying a heat medium, which is a fluid, into a flow path (flow path 1110a) formed in a heat exchange member (base 1110) that exchanges heat with a temperature-controlled object (substrate W). The first supply pipe is a pipe for supplying a heat medium, whose temperature has been controlled to a first temperature, from a first temperature control unit (first temperature control unit 51a) into the flow path via the first pipe. The first return pipe is connected to a second pipe (pipe 50b) for discharging the heat medium that has flowed through the flow path and is a pipe for returning the heat medium that has flowed through the flow path to a tank (tank 512a) in the first temperature control unit. The second supply pipe is connected to the first pipe and is a pipe for supplying the heat medium, whose temperature has been controlled to a second temperature different from the first temperature, from a second temperature control unit (second temperature control unit 51b) into the flow path via the first pipe. The second return pipe is connected to the second pipe and is a pipe for returning the heat medium that has flowed through the flow path to the tank (tank 512b) in the second temperature control unit. The first switching unit switches the heat medium supplied to the first pipe to the heat medium flowing through the first supply pipe or the heat medium flowing through the second supply pipe. The second switching unit switches the destination of the heat medium discharged from the second pipe to the first return pipe or the second return pipe. The first bypass pipe has one end connected to the second pipe closer to the flow path than the connection between the first return pipe and the second return pipe, and the other end connected to a tank in the first temperature control unit. The first valve is provided on the first bypass pipe. This makes it possible to suppress fluctuations in the temperature of the heat medium flowing through the flow path of the heat exchange element.

[0057] The embodiment described above further includes a second bypass pipe (second bypass pipe 55 b) having one end connected to the second pipe closer to the flow path than the connection between the first return pipe and the second return pipe and the other end connected to a tank in the second temperature control unit, and a second valve (second bypass valve 56 b) provided on the second bypass pipe. This makes it possible to suppress fluctuations in the temperature of the heat medium flowing through the flow paths of the heat exchange element, even when the heat medium flowing through the flow paths of the heat exchange element is switched from a heat medium at the second temperature to a heat medium at the first temperature.

[0058] The above-described embodiment also relates to a method for controlling a heat medium in a heat medium control device, the method including steps (a) and (b). In step (a), while the heat medium supplied from the first temperature control unit is flowing through the flow path, the first switching unit switches the heat medium supplied to the first pipe from the heat medium flowing through the first supply pipe to the heat medium flowing through the second supply pipe. In step (b), the first valve is opened to return the heat medium discharged from the second pipe to the tank in the first temperature control unit via the first bypass pipe. This makes it possible to suppress temperature fluctuations of the heat medium flowing through the flow path of the heat exchange element.

[0059] [Others] The technology disclosed in the present application is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist thereof.

[0060] For example, in the above-described embodiment, the first bypass pipe 55a and the second bypass pipe 55b are connected to the pipe 50b, but the disclosed technology is not limited to this. As another example, as shown in Fig. 10, the pipe 550 may be connected to the pipe 50b, and the first bypass pipe 55a and the second bypass pipe 55b may be connected to the pipe 550. A valve 551 is provided in the pipe 550.

[0061] In the above-described embodiment, the first bypass pipe 55a and the second bypass pipe 55b are connected to the pipe 50b, but the disclosed technology is not limited to this. As another example, as shown in FIG. 11 , three-way valves may be used as the first return valve 540b and the second return valve 541b. In this case, the first bypass pipe 55a is connected to the second bypass pipe 55b, and the second bypass pipe 55b is connected to the first return valve 540b. Furthermore, the first bypass valve 56a and the second bypass valve 56b are not required.

[0062] The temperature control device 50 illustrated in Fig. 11 operates, for example, as follows. Hereinafter, as shown in Fig. 12, the operation starts with a state in which a heat medium at a first temperature supplied from a first temperature control unit 51a flows through a flow path 1110a of a base 1110 via a pipe 52a and is returned to the first temperature control unit 51a via a pipe 53a. In the example of Fig. 12, the first supply valve 540a is opened, and in the first return valve 540b, the valve connected to the pipe 50b and the valve connected to the pipe 53a are opened, and the other valves are closed.

[0063] 12, the first supply valve 540a is closed and the second supply valve 541a is opened. Then, in the second return valve 541b, the valve connected to the pipe 50b and the valve connected to the first bypass pipe 55a are opened, and the first return valve 540b is closed. As a result, for example, as shown in FIG. 13, the heat medium discharged through the pipe 50b is returned to the tank 512a of the first temperature control unit 51a through the first bypass pipe 55a.

[0064] Then, the system waits until a time elapses from when the supply of the heat medium at the second temperature into the flow path 1110a begins until the heat medium at the first temperature remaining in the flow path 1110a is completely removed from the flow path 1110a. Then, in the second return valve 541b, the valve connected to the pipe 53b is opened, and the valve connected to the first bypass pipe 55a is closed. As a result, for example, as shown in FIG. 14 , the heat medium at the second temperature supplied from the second temperature control unit 51b flows through the flow path 1110a of the base 1110 via the pipe 52b and is returned to the tank 512b of the second temperature control unit 51b via the pipe 53b.

[0065] When the heat medium flowing through flow path 1110a is switched from a heat medium of the second temperature to a heat medium of the first temperature, in the state shown in Fig. 14, second supply valve 541a is closed and first supply valve 540a is opened. Then, in first return valve 540b, the valve connected to pipe 50b and the valve connected to second bypass pipe 55b are opened, and second return valve 541b is closed. As a result, for example, as shown in Fig. 15, the heat medium discharged through pipe 50b is returned to tank 512b of second temperature control unit 51b through second bypass pipe 55b.

[0066] Then, the system waits until a time has elapsed from when the supply of the heat medium at the first temperature into the flow path 1110a begins until the heat medium at the second temperature remaining in the flow path 1110a is completely removed from the flow path 1110a. Then, in the first return valve 540b, the valve connected to the pipe 53a is opened, and the valve connected to the second bypass pipe 55b is closed. As a result, for example, as shown in FIG. 12 , the heat medium at the first temperature supplied from the first temperature control unit 51a flows through the flow path 1110a of the base 1110 via the pipe 52a and is returned to the tank 512a of the first temperature control unit 51a via the pipe 53a.

[0067] Furthermore, in the above-described embodiment, the heat medium remains in the first bypass pipe 55a from the time the first bypass valve 56a is closed until the first bypass valve 56a is opened again. Therefore, if the time between the time the first bypass valve 56a is closed and the time the first bypass valve 56a is opened again is long, the temperature of the heat medium remaining in the first bypass pipe 55a changes from the first temperature. If the temperature of the heat medium remaining in the first bypass pipe 55a changes from the first temperature, when the first bypass valve 56a is opened again, heat medium having a temperature different from the first temperature will flow from the first bypass pipe 55a into the tank 512a. This may cause the temperature of the heat medium in the tank 512a to fluctuate. The same applies to the second bypass pipe 55b.

[0068] 16 , a temperature adjustment unit 57a may be provided in the first bypass pipe 55a, and a temperature adjustment unit 57b may be provided in the second bypass pipe 55b. The temperature adjustment unit 57a adjusts the temperature of the heat medium remaining in the first bypass pipe 55a to a first temperature. The temperature adjustment unit 57b adjusts the temperature of the heat medium remaining in the second bypass pipe 55b to a second temperature. As a result, even when the first bypass valve 56a and the second bypass valve 56b are opened again, the heat medium at the first temperature flows into the tank 512a of the first temperature control unit 51a, and the heat medium at the second temperature flows into the tank 512b of the second temperature control unit 51b. This makes it possible to suppress fluctuations in the temperature of the heat medium in the tanks 512a and 512b.

[0069] Alternatively, as another example, as shown in Fig. 17, a gas supply unit 58 may be provided that supplies gas into a first bypass pipe 55a and a second bypass pipe 55b. In the example of Fig. 17, the gas supply unit 58 is connected to the first bypass pipe 55a via a pipe 580a and to the second bypass pipe 55b via a pipe 580b. A valve 581a is provided in the pipe 580a, and a valve 581b is provided in the pipe 580b.

[0070] 17 , when the first bypass valve 56a is closed, the valve 581a is opened and a gas such as dry air is supplied from the gas supply unit 58 into the first bypass pipe 55a. This purges the heat medium at the first temperature remaining in the first bypass pipe 55a. Therefore, even if the first bypass valve 56a is opened again, it is possible to suppress a change in the temperature of the heat medium in the tank 512a.

[0071] Even when the second bypass valve 56b is closed, the valve 581b is opened and a gas such as dry air is supplied from the gas supply unit 58 into the second bypass pipe 55b. This purges the heat medium at the second temperature remaining in the second bypass pipe 55b. Therefore, even when the second bypass valve 56b is opened again, it is possible to suppress a change in the temperature of the heat medium in the tank 512b.

[0072] In the above-described embodiment, the first bypass pipe 55a and the second bypass pipe 55b are connected to the pipe 50b, but the disclosed technology is not limited to this. As another example, as shown in Fig. 18, the first bypass pipe 55a and the second bypass pipe 55b may be connected to the pipe 50b via a pipe 550 and an intermediate tank 59. A valve 551 is provided in the pipe 550. The pipe 550 is an example of a third bypass pipe.

[0073] 18, the provision of intermediate tank 59 can suppress a sudden change in the liquid level of the heat medium in tank 512a and tank 512b. In addition, the provision of intermediate tank 59 can mitigate water hammer that occurs when valve 551, first bypass valve 56a, and second bypass valve 56b are opened and closed.

[0074] 18 , a temperature adjustment unit may be provided in the intermediate tank 59. In this case, the temperature adjustment unit adjusts the temperature of the heat medium remaining in the intermediate tank 59 to a first temperature before the first bypass valve 56a is opened. Also, the temperature adjustment unit adjusts the temperature of the heat medium remaining in the intermediate tank 59 to a second temperature before the second bypass valve 56b is opened. This makes it possible to suppress temperature changes of the heat medium in the tanks 512a and 512b.

[0075] Furthermore, when a temperature adjustment unit is provided in the intermediate tank 59, a gas supply unit that supplies gas to the pipe 550, the first bypass pipe 55a, and the second bypass pipe 55b may be provided. This makes it possible to purge the heat medium remaining in the pipe 550, the first bypass pipe 55a, and the second bypass pipe 55b, and to suppress changes in the temperature of the heat medium in the tanks 512a and 512b.

[0076] In the above-described embodiment, the second return valve 541b is opened and the first bypass valve 56a is closed after a predetermined time has elapsed since the supply of the heat medium at the second temperature into the flow path 1110a began. However, the disclosed technology is not limited to this. As another example, as shown in FIG. 19 , a temperature sensor 500 that measures the temperature of the heat medium flowing through the flow path 50b may be provided in the pipe 50b. In the example of FIG. 19 , the control unit 2 determines the timing to open the second return valve 541b and the timing to close the first bypass valve 56a based on the temperature of the heat medium measured by the temperature control device 50. The control unit 2 then controls the second return valve 541b and the first bypass valve 56a at the determined timings. This allows the second return valve 541b to be opened and the first bypass valve 56a to be closed when the heat medium at the first temperature has actually run out of the flow path 1110a.

[0077] 20 , a bypass pipe 520a may be provided between pipes 52a and 53a, and a bypass pipe 520b may be provided between pipes 52b and 53b. A valve 521a is provided in the bypass pipe 520a, and a valve 521b is provided in the bypass pipe 520b. The bypass pipe 520a is an example of a fourth bypass pipe, and the valve 521a is an example of a third valve.

[0078] 20, by opening valve 521a before closing first supply valve 540a, a portion of the heat medium flowing through pipe 52a flows into bypass pipe 520a, thereby mitigating water hammer when closing first supply valve 540a. Also, by opening valve 521b before closing second supply valve 541a, a portion of the heat medium flowing through pipe 52b flows into bypass pipe 520b, thereby mitigating water hammer when closing second supply valve 541a.

[0079] In the example of Fig. 20, when a heat medium at a first temperature circulates through the flow path 1110a of the base 1110, the valves are controlled as shown in Fig. 21. In the example of Fig. 21, the first supply valve 540a and the first return valve 540b are opened, and the heat medium at the first temperature circulates through the flow path 1110a. Also, the valve 521b is opened, and the heat medium at a second temperature circulates through the bypass pipe 520b.

[0080] 21 , when the heat medium flowing through flow path 1110a is switched from a heat medium at a first temperature to a heat medium at a second temperature, valve 521a is opened and first supply valve 540a is closed. By opening valve 521a, a portion of the heat medium flowing through pipe 52a flows into bypass pipe 520a. This reduces the heat medium flowing through first supply valve 540a, and alleviates water hammer when first supply valve 540a is closed.

[0081] Next, the second supply valve 541a is opened and the valve 521b is closed. By opening the second supply valve 541a, part of the heat medium flowing through the bypass pipe 520b flows into the pipe 50a via the pipe 52b. This reduces the heat medium flowing through the bypass pipe 520b, and alleviates the water hammer that occurs when the valve 521b is closed.

[0082] 22, consider a case where the first supply valve 540a is left open until the heat medium at the first temperature is depleted from the flow path 1110a. In this case, at the connection position A between the bypass pipe 520a and the pipe 53a, the heat medium passing through the first return valve 540b may not return to the first temperature control unit 51a. For example, the heat medium output from the pump 510a is pushed out at a predetermined pressure X and flows into the connection position A through the bypass pipe 520a. Meanwhile, the pressure of the heat medium flowing into the connection position A through the first return valve 540b is pushed out by the heat medium output from the pump 510b at pressure X, but due to pressure loss in the flow path 1110a, the pressure of the heat medium flowing into the connection position A is lower than pressure X.

[0083] Therefore, at connection position A, the heat medium passing through the first return valve 540b may stagnate in the pipe 52b without returning to the first temperature control unit 51a. If the heat medium stagnates in the pipe 52b, when the first return valve 540b is closed and the second return valve 541b is opened, the heat medium at the first temperature will flow into the second temperature control unit 51b through the pipe 53b, and the temperature of the heat medium in the tank 512b will fluctuate.

[0084] 20, when the second supply valve 541a is opened and the valve 521b is closed, the first bypass valve 56a is opened and the first return valve 540b is closed. As a result, as shown in FIG. 23, for example, the heat medium at the first temperature discharged from the pipe 50b is returned to the tank 512a via the first bypass pipe 55a. This makes it possible to suppress fluctuations in the temperature of the heat medium in the tank 512b.

[0085] When the heat medium flowing through the flow path 1110a is switched from the heat medium of the second temperature to the heat medium of the first temperature, the second bypass valve 56b is opened. As a result, the heat medium of the second temperature discharged from the pipe 50b is returned to the tank 512b via the second bypass pipe 55b. This makes it possible to suppress fluctuations in the temperature of the heat medium in the tank 512a.

[0086] In the above-described embodiment, the first switching unit 54a and the second switching unit 54b may be realized by a single three-way valve.

[0087] Although the above-described embodiments use a capacitively coupled plasma (CCP) as an example of the plasma source, the disclosed technology is not limited to this. For example, an inductively coupled plasma (ICP), a microwave-excited surface wave plasma (SWP), an electron cyclotron resonance plasma (ECP), or a helicon wave-excited plasma (HWP) may be used as the plasma source.

[0088] In addition, in the above-described embodiments, a plasma etching processing apparatus has been described as an example of the plasma processing apparatus 1, but the disclosed technology is not limited to this. In addition to etching apparatuses, the disclosed technology can also be applied to film forming apparatuses, modification apparatuses, cleaning apparatuses, and the like, as long as the apparatus uses a temperature-controlled heat medium to control the temperature of a temperature-control target such as a wafer W.

[0089] It should be noted that the disclosed embodiments are illustrative in all respects and should not be considered limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0090] Furthermore, the following supplementary notes are disclosed regarding the above-described embodiment.

[0091] (Supplementary Note 1) A first supply pipe connected to a first pipe for supplying a heat medium which is a fluid into a flow path formed in a heat exchange element which exchanges heat with a temperature-controlled object, and for supplying the heat medium at a first temperature from a first temperature control unit into the flow path via the first pipe; a first return pipe connected to a second pipe for discharging the heat medium which has flowed in the flow path, and for returning the heat medium which has flowed in the flow path to a tank in the first temperature control unit; a second supply pipe connected to the first pipe, and for supplying the heat medium at a second temperature which is different from the first temperature from a second temperature control unit into the flow path via the first pipe; a second return pipe connected to the second pipe, and for returning the heat medium which has flowed in the flow path to a tank in the second temperature control unit; and a first switching unit which switches the heat medium supplied to the first pipe between the heat medium flowing in the first supply pipe and the heat medium flowing in the second supply pipe. a second switching unit that switches a destination of the heat medium discharged from the second pipe to the first return pipe or the second return pipe, a first bypass pipe that is provided between the second pipe and a tank in the first temperature control unit, and a first valve that is provided on the first bypass pipe. (Supplementary Note 2) The heat medium control device according to Supplementary Note 1, further comprising: a second bypass pipe that has one end connected to the second pipe on the flow path side of a connection portion between the first return pipe and the second return pipe, and the other end connected to a tank in the second temperature control unit, and a second valve that is provided on the second bypass pipe. (Supplementary Note 3) The heat medium control device according to Supplementary Note 2, further comprising: a temperature adjustment unit that adjusts a temperature of the heat medium in the first bypass pipe and the second bypass pipe. (Supplementary Note 4) The heat medium control device according to Supplementary Note 2, further comprising a gas supply unit configured to purge the heat medium in the first bypass piping and the second bypass piping by supplying a gas into the first bypass piping and the second bypass piping.(Supplementary Note 5) The heat medium control device according to Supplementary Note 2, further comprising: a third bypass piping connected to the second piping; and an intermediate tank connected to the third bypass piping, wherein the first bypass piping is provided between the intermediate tank and a tank in the first temperature control unit, and the second bypass piping is provided between the intermediate tank and a tank in the second temperature control unit. (Supplementary Note 6) The heat medium control device according to Supplementary Note 5, further comprising a temperature adjustment unit that adjusts the temperature of the heat medium in the intermediate tank. (Supplementary Note 7) The heat medium control device according to Supplementary Note 5 or 6, further comprising a gas supply unit that is configured to purge the heat medium in the first bypass piping and the second bypass piping by supplying gas into the first bypass piping and the second bypass piping. (Supplementary Note 8) The heat medium control device according to any one of Supplementary Notes 1 to 7, further comprising: a sensor that measures the temperature of the heat medium flowing in the second piping; and a control unit that controls the second switching unit and the first valve in accordance with a change in the temperature of the heat medium measured by the sensor. (Supplementary Note 9) The heat medium control device according to any one of Supplementary Notes 1 to 8, further comprising: a fourth bypass pipe connected to the first supply pipe and the first return pipe; and a third valve provided on the fourth bypass pipe, wherein the third valve is controlled to return the heat medium supplied from the first temperature control unit to the first temperature control unit via the third bypass pipe and the first return pipe while the heat medium supplied from the second temperature control unit is being supplied into the flow path.(Supplementary Note 10) A first supply pipe connected to a first pipe for supplying a heat medium which is a fluid into a flow path formed in a heat exchange element which exchanges heat with a temperature-controlled object, and for supplying the heat medium at a first temperature from a first temperature control unit into the flow path via the first pipe; a first return pipe connected to a second pipe for discharging the heat medium which has flowed in the flow path, and for returning the heat medium which has flowed in the flow path to a tank in the first temperature control unit; a second supply pipe connected to the first pipe, and for supplying the heat medium at a second temperature which is different from the first temperature from a second temperature control unit into the flow path via the first pipe; a second return pipe connected to the second pipe, and for returning the heat medium which has flowed in the flow path to a tank in the second temperature control unit; and a first switching unit which switches the heat medium supplied to the first pipe between the heat medium flowing in the first supply pipe and the heat medium flowing in the second supply pipe. a second switching unit that switches a destination of the heat medium discharged from the second pipe to the first return pipe or the second return pipe; a first bypass pipe that is provided between the second pipe and a tank in the first temperature control unit; and a first valve that is provided on the first bypass pipe, the method comprising: (a) a step in which, while the heat medium supplied from the first temperature control unit is flowing in the flow path, the first switching unit switches the heat medium supplied to the first pipe from the heat medium flowing in the first supply pipe to the heat medium flowing in the second supply pipe; and (b) a step in which, by opening the first valve, the heat medium discharged from the second pipe is returned to the tank in the first temperature control unit via the first bypass pipe.

[0092] REFERENCE SIGNS LIST W substrate 1 plasma processing apparatus 10 plasma processing chamber 11 substrate support 111 main body 1110 base 1110a flow path 1111 electrostatic chuck 112 ring assembly 13 shower head 2 control section 20 gas supply section 30 power supply 31 RF power supply 32 DC power supply 40 exhaust system 50 temperature control device 50a piping 50b piping 500 temperature sensor 51a first temperature control section 51b second temperature control section 510 pump 511 heat exchanger 512 tank 52 piping 520 bypass piping 521 valve 53 piping 54a first switching section 540a first supply valve 541a second supply valve 54b second switching section 540b first return valve 541b second return valve 55a First bypass pipe 55b Second bypass pipe 550 Pipe 551 Valve 56a First bypass valve 56b Second bypass valve 57 Temperature adjustment unit 58 Gas supply unit 580 Pipe 581 Valve 59 Intermediate tank

Claims

1. A first supply pipe connected to a first pipe for supplying a heat medium as a fluid into a flow path formed in a heat exchange element that exchanges heat with a temperature-controlled object, the first supply pipe being for supplying the heat medium at a first temperature from a first temperature control unit into the flow path via the first pipe; a first return pipe connected to a second pipe for discharging the heat medium that has flowed through the flow path, the first return pipe being for returning the heat medium that has flowed through the flow path to a tank in the first temperature control unit; a second supply pipe connected to the first pipe being for supplying the heat medium at a second temperature different from the first temperature into the flow path via the first pipe from a second temperature control unit; a second return pipe connected to the second pipe being for returning the heat medium that has flowed through the flow path to a tank in the second temperature control unit; and a first switching unit for switching the heat medium supplied to the first pipe to the heat medium flowing through the first supply pipe or the heat medium flowing through the second supply pipe. a second switching unit that switches a destination of the heat medium discharged from the second piping between the first return piping and the second return piping; a first bypass piping that is provided between the second piping and a tank in the first temperature control unit; and a first valve that is provided on the first bypass piping.

2. The heat medium control device according to claim 1, further comprising: a second bypass pipe having one end connected to the second pipe on the flow path side of a connection portion between the first return pipe and the second return pipe and the other end connected to a tank in the second temperature control unit; and a second valve provided on the second bypass pipe.

3. The heat medium control device according to claim 2, further comprising a temperature adjusting unit that adjusts the temperature of the heat medium in the first bypass pipe and the second bypass pipe.

4. The heat medium control device according to claim 2, further comprising a gas supply unit configured to purge the heat medium in the first bypass piping and the second bypass piping by supplying gas into the first bypass piping and the second bypass piping.

5. The heat medium control device according to claim 2, further comprising: a third bypass pipe connected to the second pipe; and an intermediate tank connected to the third bypass pipe, wherein the first bypass pipe is provided between the intermediate tank and a tank in the first temperature control unit, and the second bypass pipe is provided between the intermediate tank and a tank in the second temperature control unit.

6. The heat medium control device according to claim 5, further comprising a temperature adjusting unit that adjusts the temperature of the heat medium in the intermediate tank.

7. The heat medium control device according to claim 5 or 6, further comprising a gas supply unit configured to purge the heat medium in the first bypass piping and the second bypass piping by supplying gas into the first bypass piping and the second bypass piping.

8. The heat medium control device according to claim 1, further comprising: a sensor that measures the temperature of the heat medium flowing through the second pipe; and a control unit that controls the second switching unit and the first valve in response to a change in the temperature of the heat medium measured by the sensor.

9. The heat medium control device according to claim 1, further comprising: a fourth bypass pipe connected to the first supply pipe and the first return pipe; and a third valve provided on the fourth bypass pipe, wherein the third valve is controlled to return the heat medium supplied from the first temperature control unit to the first temperature control unit via the fourth bypass pipe and the first return pipe while the heat medium supplied from the second temperature control unit is being supplied into the flow path.

10. A first supply pipe connected to a first pipe for supplying a heat medium as a fluid into a flow path formed in a heat exchange element that exchanges heat with a temperature-controlled object, the first supply pipe being for supplying the heat medium at a first temperature from a first temperature control unit into the flow path via the first pipe; a first return pipe connected to a second pipe for discharging the heat medium that has flowed through the flow path, the first return pipe being for returning the heat medium that has flowed through the flow path to a tank in the first temperature control unit; a second supply pipe connected to the first pipe being for supplying the heat medium at a second temperature different from the first temperature into the flow path via the first pipe from a second temperature control unit; a second return pipe connected to the second pipe being for returning the heat medium that has flowed through the flow path to a tank in the second temperature control unit; and a first switching unit for switching the heat medium supplied to the first pipe to the heat medium flowing through the first supply pipe or the heat medium flowing through the second supply pipe. a second switching unit that switches a destination of the heat medium discharged from the second pipe to the first return pipe or the second return pipe; a first bypass pipe that is provided between the second pipe and a tank in the first temperature control unit; and a first valve that is provided on the first bypass pipe, the method comprising: (a) a step in which, while the heat medium supplied from the first temperature control unit is flowing in the flow path, the first switching unit switches the heat medium supplied to the first pipe from the heat medium flowing in the first supply pipe to the heat medium flowing in the second supply pipe; and (b) a step in which, by opening the first valve, the heat medium discharged from the second pipe is returned to the tank in the first temperature control unit via the first bypass pipe.

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