Electronic device comprising molding member

Abstract

According to the present disclosure, an electronic device can be provided. The electronic device may comprise a housing having a rear plate, a display assembly arranged in the housing at the opposite side to the rear plate, and a molding member. The display assembly may comprise a display panel, a conductive layer arranged on a surface of the display panel, the surface facing the rear plate, and a flexible substrate. The flexible substrate may have a first region connected to the display panel, a second region arranged on the surface of the display panel, facing the rear plate, and a third region arranged between the first region and the second region and at least partially bent. The molding member may be arranged to surround at least a part of the third region of the flexible substrate and at least a part of the conductive layer, and have an inclined region at the edge region thereof.

Description

Electronic device including molded member

[0001] Examples of the present disclosure relate to electronic devices including molded members.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] According to the present disclosure, an electronic device may be provided. The electronic device may include a housing including a rear plate, a display assembly disposed on the housing opposite the rear plate, and a molding member. The display assembly may include a display panel, a conductive layer disposed on a side of the display panel toward the rear plate, and a flexible substrate. The flexible substrate may include a first region connected to the display panel, a second region disposed on the side of the display panel toward the rear plate, and a third region disposed between the first region and the second region, the third region being at least partially curved. The molding member may be disposed to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer, and may include an inclined region in an edge region.

[0005] According to the present disclosure, an electronic device may be provided. The electronic device may include a housing including a first housing and a second housing rotatably connected to the first housing, and a back plate disposed on a first rear surface of the first housing and a second rear surface of the second housing, a flexible display disposed in the housing, and a molding member. The flexible display may include a display panel, a conductive layer disposed on a side of the display panel toward the back plate, and a flexible substrate. The flexible substrate may include a first region connected to the display panel, a second region disposed on a side of the display panel toward the back plate, and a third region disposed between the first region and the second region, the third region being at least partially curved. The molding member may be disposed to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer, and may include an inclined region in an edge region.

[0006] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0008] FIG. 2 is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is a rear perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4A is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4b is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5A is a front perspective view illustrating a front plate, a display assembly, and a housing of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5b is a rear perspective view illustrating a front plate, a display assembly, and a housing of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6A is a drawing showing a display assembly and a molding member of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 6b is a drawing showing a display assembly and a molding member according to one embodiment of the present disclosure.

[0016] FIG. 7a is a cross-sectional side view taken along line A-A' of FIG. 6b according to one embodiment of the present disclosure.

[0017] FIG. 7b is a cross-sectional side view taken along line B-B' of FIG. 6b according to one embodiment of the present disclosure.

[0018] FIG. 7c is a cross-sectional side view taken along line B-B' of FIG. 6b according to one embodiment of the present disclosure.

[0019] FIG. 7d is an enlarged view of portion C of FIG. 6b according to one embodiment of the present disclosure.

[0020] FIG. 8A is a partial perspective view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0021] FIG. 8b is a cross-sectional side view taken along line D-D' of FIG. 8a according to one embodiment of the present disclosure.

[0022] FIG. 8C is a partial perspective view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the disclosure.

[0023] FIG. 8d is a cross-sectional side view taken along line E-E' of FIG. 8a according to one embodiment of the present disclosure.

[0024] FIG. 9A is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0025] FIG. 9B is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0026] FIG. 9C is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0027] FIG. 9D is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0028] FIG. 9E is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0029] FIG. 9F is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0030] FIG. 9g is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0031] FIG. 9h is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0032] FIG. 9i is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0033] FIG. 10A is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0034] FIG. 10B is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0035] FIG. 11A is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0036] FIG. 11B is a cross-sectional side view of a portion of an electronic device including a molding member and a portion of a display panel according to one embodiment of the present disclosure.

[0037] FIG. 12a is a drawing for explaining a molding process for manufacturing a molding member according to one embodiment of the present disclosure.

[0038] FIG. 12b is an enlarged view of portion F of FIG. 12a according to one embodiment of the present disclosure.

[0039] FIG. 12c is a perspective view illustrating a molding member according to one embodiment of the present disclosure.

[0040] FIG. 12d is a cross-sectional side view illustrating a molding member according to one embodiment of the present disclosure.

[0041] FIG. 13a is a perspective view illustrating a second molding portion formed according to one embodiment of the present disclosure.

[0042] FIG. 13b is a cross-sectional side view illustrating a second molding portion formed according to one embodiment of the present disclosure.

[0043] FIG. 13c is a perspective view illustrating a molding member formed according to one embodiment of the present disclosure.

[0044] FIG. 13d is a cross-sectional side view illustrating a molding member formed according to one embodiment of the present disclosure.

[0045] FIG. 14a is a drawing for explaining a thermal curing process of a molding member according to one embodiment of the present disclosure.

[0046] FIG. 14b is a drawing for explaining a photocuring process of a molding member according to one embodiment of the present disclosure.

[0047] FIG. 15 is a drawing showing a molding member manufactured according to one embodiment of the present disclosure.

[0048] FIG. 16A is a cross-sectional side view illustrating a molding member (370) disposed on a display assembly (301) according to one embodiment of the present disclosure.

[0049] FIG. 16b is a plan view of a molding member (370) according to one embodiment of the present disclosure. FIG. 16c is a plan view of a molding member (370) according to one embodiment of the present disclosure.

[0050] FIG. 16d is a plan view of a molding member (370) according to one embodiment of the present disclosure.

[0051] FIG. 16e is a plan view of a molding member (370) according to one embodiment of the present disclosure.

[0052] FIG. 17a is a drawing for explaining a molding member, a waterproof member, and an adhesive member according to one embodiment of the present disclosure.

[0053] FIG. 17b is a drawing for explaining a molding member, a waterproof member, and an adhesive member according to one embodiment of the present disclosure.

[0054] FIG. 17c is a drawing for explaining a molding member, a waterproof member, and an adhesive member according to one embodiment of the present disclosure.

[0055] FIG. 18A is a drawing showing a display assembly and a molding member of an electronic device according to one embodiment of the present disclosure.

[0056] FIG. 18b is a drawing showing a display assembly and a molding member according to one embodiment of the present disclosure.

[0057] FIG. 18c is a drawing showing a display assembly and a molding member according to one embodiment of the present disclosure.

[0058] FIG. 20A is a drawing showing a display assembly and a molding member of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0059] FIG. 20b is a drawing showing a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0060] FIG. 20c is a drawing showing a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0061] FIG. 21a is an enlarged view of portion G of FIG. 20a according to one embodiment of the present disclosure.

[0062] FIG. 21b is a drawing showing a display assembly, a molding member, and a waterproof member according to one embodiment of the present disclosure.

[0063] FIG. 22A is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0064] FIG. 22b is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0065] FIG. 22c is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0066] FIG. 23A is a drawing showing a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0067] FIG. 23b is a drawing showing a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0068] FIG. 23c is a drawing showing a display assembly and a molding member of an electronic device in a folded state according to one embodiment of the present disclosure.

[0069] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0070] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0071] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0072] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0073] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0074] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0075] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0076] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0077] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0078] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0079] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0080] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0081] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0082] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0083] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0084] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0085] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0086] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0087] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0088] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0089] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0090] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0091] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0092] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0093] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0094] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0095] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0096] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit one embodiment of the present disclosure. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0097] FIG. 2 is a perspective view illustrating the front side of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a perspective view illustrating the rear side of the electronic device illustrated in FIG. 2 according to an embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0098] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0099] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0100] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0101] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0102] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0103] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0104] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0105] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident on the first side (210A) (or front side) of the electronic device (101) through the display (201) within the electronic device (101). According to one embodiment, the first camera module (205) and / or the sensor module (204) may be arranged so as to be in contact with the external environment through a transparent area from the internal space of the electronic device (101) to the front plate (202) of the display (201). Additionally, some of the sensor modules (204) may be arranged so as to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device.

[0106] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIGS. 4A and 4B). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received by a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or processor (e.g., processor (180) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0107] The camera modules (205, 212, 213) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0108] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different properties (e.g., angles of view) or functions. For example, the electronic device (101) may include a plurality of camera modules (205, 212) each having a different angle of view, and the electronic device (101) may control the camera modules (205, 212) to change the angle of view of the camera modules (205, 212) operated in the electronic device (101) based on a user's selection. For example, at least one of the plurality of camera modules (205, 212) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (205, 212) may be a front camera, and at least another may be a rear camera. Additionally, the plurality of camera modules (205, 212) may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0109] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0110] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0111] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0112] FIG. 4A is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 4B is a rear exploded perspective view of the electronic device according to one embodiment of the present disclosure.

[0113] Referring to FIGS. 4A and 4B, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side structure (or side structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (211)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible printed circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).

[0114] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible printed circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.

[0115] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed within the electronic device (101) and connected to or formed integrally with the side structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing in opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.

[0116] In one embodiment, the support structure (221) and the side structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user on the exterior of the electronic device (101), for example, the side structure (222), the front plate (202), and / or the back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).

[0117] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4A and 4B. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).

[0118] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).

[0119] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0120] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first circuit board (240a) interposed therebetween.

[0121] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional printed circuit board (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.

[0122] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side structure (222).

[0123] FIG. 5A is a front perspective view illustrating a front plate, a display assembly, and a housing of an electronic device according to an embodiment of the present disclosure. FIG. 5B is a rear perspective view illustrating a front plate, a display assembly, and a housing of an electronic device according to an embodiment of the present disclosure. FIG. 6A is a view illustrating a display assembly and a molding member of an electronic device according to an embodiment of the present disclosure. FIG. 6B is a view illustrating a display assembly and a molding member according to an embodiment of the present disclosure. FIG. 7A is a side cross-sectional view taken along line A-A' of FIG. 6B according to an embodiment of the present disclosure. FIG. 7B is a side cross-sectional view taken along line B-B' of FIG. 6B according to an embodiment of the present disclosure. FIG. 7C is a side cross-sectional view taken along line B-B' of FIG. 6B according to an embodiment of the present disclosure. FIG. 7D is an enlarged view of portion C of FIG. 6B according to an embodiment of the present disclosure. FIG. 8A is a partial perspective view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 8B is a side cross-sectional view taken along line D-D' of FIG. 8A according to an embodiment of the present disclosure. FIG. 8C is a partial perspective view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 8D is a side cross-sectional view taken along line E-E' of FIG. 8A according to an embodiment of the present disclosure.

[0124] The housing (320), display assembly (301), and front plate (302) of the embodiments of FIGS. 5A to 7D may be referred to as the housing (220), display (201), and front plate (202) of the embodiments of FIGS. 2 to 4B.

[0125] In the present disclosure, a “first direction” may be referred to as a forward or front direction and may be understood as a +Z direction based on the attached drawings. In the present disclosure, a “second direction” may be referred to as a rearward or back direction, which is a direction opposite to the first direction, and may be understood as a -Z direction based on the attached drawings. In the present disclosure, a “first direction surface” may mean a surface facing the display assembly (301) (or a surface facing the display assembly (301)) (e.g., a +Z direction surface), and a “second direction surface” may mean a -Z direction surface or a surface facing the rear plate (e.g., the rear plate (211) of FIG. 4) (or a surface facing the rear plate) (e.g., a -Z direction surface).

[0126] Referring to FIGS. 5A to 7D , according to one embodiment, the electronic device (101) may include a housing (320), a display assembly (301), a front plate (302), and a molding member (370) surrounding a portion of the display assembly (301). Referring to FIGS. 6A to 7D , according to one embodiment, the electronic device (101) may further include a waterproof member (380) disposed on a second direction surface (e.g., a -Z direction surface) of the display assembly (301) and / or a second direction surface (e.g., a -Z direction surface) of the molding member (370).

[0127] In one embodiment, the housing (320) may include a support structure (321) and a side structure (322) disposed at an edge of the support structure (321). For example, the support structure (321) and the side structure (322) may be combined and referred to as a front case. In one embodiment, the support structure (321) may be provided at least in a flat shape. In one embodiment, the support structure (321) may be disposed within the electronic device (101) and connected to or formed integrally with the side structure (322). For example, the support structure (321) and / or the side structure (322) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (321) at least partially comprises a conductive material such as a metal, the side structure (322) or a portion of the support structure (321) may function as an antenna. The support structure (321) may include two faces facing in opposite directions. A display (201) may be placed on one of the two faces of the support structure (321), and a printed circuit board (e.g., printed circuit boards (240a, 240b) of FIGS. 4a and 4b) may be placed on the other face.

[0128] According to one embodiment, the display assembly (301) may be disposed in a space surrounded by the front plate (302) and the housing (320). According to one embodiment, the display assembly (301) may be disposed within the housing (320) so as to face a first direction (e.g., +Z direction or forward) or so that an image is visually displayed on a surface in the first direction. According to one embodiment, the display assembly (301) may include a first edge (301a) corresponding to an upper portion, a second edge (301b) corresponding to a lower portion disposed opposite the first edge (301a), a third edge (301c) and a fourth edge (301d) extending between the first edge (301a) and the second edge (301b) and facing opposite side ends disposed opposite to each other.

[0129] According to one embodiment, the display assembly (301) may include a display panel (317) including at least one display pixel(s) and a substrate electrically connected to the at least one display pixel(s), and at least one layer(s) laminated on one or both sides of the display panel (317) and a flexible substrate (315) extending from the display panel (317) and at least partially bendable. For example, the display assembly (301) may include a dielectric layer and / or an optical layer (e.g., an optical compensation film) laminated on a first direction side (+Z direction side) of the display panel (317).

[0130] Referring to FIG. 7C, according to one embodiment, the display assembly (301) may include a conductive layer (311) disposed on a second direction surface (e.g., a -Z direction surface) of the display panel (317). According to one embodiment, the conductive layer (311) may include a recessed region (311a) formed in an edge region of the second direction surface (e.g., a -Z direction surface). When the recessed region (311a) is included, as described below, a portion of a molding member (370) (e.g., a second molding portion (372)) may be disposed in the recessed region (311a). For example, the conductive layer (311) may include a metal layer such as copper or stainless steel. For example, the conductive layer (311) may include a metal plate and / or a metal frame. For example, a plurality of layers that provide light blocking, heat dissipation, and / or shielding functions may be disposed between the conductive layer and the display panel (317).

[0131] According to one embodiment, the display assembly (301) may include a shielding layer (312) disposed on a first direction side (e.g., a -Z direction side) of the conductive layer (311). For example, the shielding layer (312) may shield electromagnetic interference to the display assembly (301) caused by electrical / electronic components around the display assembly (301). It may also reinforce the rigidity of the display assembly (301) or protect the display assembly (301) from external impact.

[0132] In one embodiment, the flexible substrate (315) may include a first region (315a) electrically connected to the display panel (317), a second region (315b) disposed on a second-direction side (e.g., a -Z-direction side) of the display assembly (301) or a second-direction side (e.g., a -Z-direction side) of the conductive layer (311), and a third region (315c) extending between the first region (315a) and the second region (315b) and having at least a portion thereof bent. In one embodiment, the third region (315c) may face a side surface (e.g., a Y-axis side or an X-axis side surface) of the display assembly (301). For example, the third region (315c) may face a side wall of the housing (320) (or an inner surface of a side structure (322) of the housing (320).

[0133] According to one embodiment, the front plate (302) may be disposed on a first direction side (e.g., a +Z direction side) of the display panel (317). For example, the front plate (302) may be configured to be at least partially transparent and may be visually exposed to the outside of the electronic device (101) through the front plate (302). For example, the front plate (302) may include a display element layer including at least one pixel(s) and a TFT layer connected to the display element layer.

[0134] In one embodiment, the flexible substrate (315) may include a wiring layer (not shown) extending from the display panel (317). For example, the flexible substrate (315) may include wiring for a display, a touch sensor, a fingerprint sensor, a pressure sensor, an optical sensor, or an EMR sensor. As an example, the wiring layer of the flexible substrate (315) may include a display driver IC and / or a touch sensor panel IC (TSP-IC). For example, the wiring layer of the flexible substrate (315) may include a flexible printed circuit film or a chip on film (CIF) or tape carrier package having a driver chip. The wiring layer of the flexible substrate (315) can be electrically connected to a printed circuit board (e.g., a printed circuit board (340) of FIGS. 4A and 4B) on which a control circuit is arranged. When the wiring layer of the flexible substrate (315) includes a display driver IC, the display driver IC can be electrically connected to a control circuit of the circuit board (e.g., a printed circuit board (240a) of FIGS. 4A and 4B). The control circuit can be configured to receive and process image information including image data or an image control signal corresponding to a command for controlling the image data in conjunction with the display driver IC, so that visual information (e.g., text, an image, or an icon) is displayed on the display panel (317).

[0135] According to one embodiment, an optical member and / or a touch sensor panel may be mounted between the display element layer of the front plate (302) and the display panel (317), or within the display element layer. For example, the display panel (317) may be utilized as an output device that outputs a screen and also as an input device equipped with a touch screen function. If the display panel (317) has a touch screen function, an indium-tin oxide (ITO) film for detecting a user's contact position, etc. may also correspond to the touch sensor panel. For example, a dielectric layer may be disposed between the front plate (302) and the display panel (317).

[0136] According to one embodiment, the molding member (370) (e.g., the second portion (370b)) can be positioned to surround (or cover) at least a portion of the third region (315c) of the flexible substrate (315) and a portion of the conductive layer (311) of the display assembly (301).

[0137] In one embodiment, the molding member (370) can include a first portion (370a) disposed between the display assembly (301) and the support structure (321) and a second portion (370b) extending from the first portion (370a) and disposed between the side structure (322) and the display assembly (301). In one embodiment, the second portion (370b) (or a portion of the molding member (370) that surrounds at least a portion of the third region (315b) of the flexible substrate (315)) can be disposed on a portion of a second direction surface (-Z direction surface) facing inwardly of the housing (320) of the front plate (302).

[0138] In one embodiment, at least a portion of the molding member (370) (e.g., the first portion (370a)) can be disposed on a second direction surface (e.g., the -Z direction surface) of the display assembly (301) (e.g., the conductive layer). In one embodiment, the molding member (370) (e.g., the first portion (370a)) can be disposed to surround at least a portion of a recessed region (311a) of the conductive layer (311).

[0139] In one embodiment, at least a portion of the molding member (370) (e.g., the second portion (370b)) can be disposed around the third region (315c) and can be disposed to surround the third region (315c). The portion of the molding member (370) (e.g., the second portion (370b)) can be disposed between the third region (315c) and a side surface (e.g., a Y-axis direction or an X-axis direction surface) of the display assembly (301). For example, at least a portion of the molding member (370) (e.g., the second portion (370b)) can be disposed between the third region (315c) and a side wall of the housing (320) (or an inner surface of a side structure (322) of the housing (320).

[0140] Referring to FIGS. 6A to 7D , the waterproofing member (380) may be disposed on the second direction surface (e.g., the -Z direction surface) of the display assembly (301) and / or the second direction surface (e.g., the -Z direction surface) of the molding member (370). According to one embodiment, the waterproofing member (380) may be disposed between the display assembly (301) and the support structure (321). The waterproofing member (380) may be configured and disposed to waterproof internal electrical / electronic components of the electronic device (101) from moisture that has penetrated from the outside of the electronic device (101). For example, the waterproofing member (380) may waterproof the display assembly (301) from external moisture that has penetrated through the gap between the display assembly (301) and the housing (320).

[0141] Referring to FIGS. 6A and 6B , according to one embodiment, the waterproofing member (380) may be disposed along at least a portion of the edges (301a, 301b, 301c, 301d) of the display assembly (301). For example, referring to FIGS. 6A and 6B , the waterproofing member (380) is at least partially disposed along all of the edges (301a, 301b, 301c, 301d) of the display assembly (301), but the description of the present disclosure regarding the placement of the molding member (370) is illustrative and not limiting, and as an example, the molding member (370) may be disposed along at least a portion of the second edge (301b), at least a portion of the third edge (301c), and / or at least a portion of the fourth edge (301d). Referring to FIGS. 7b to 7d, according to one embodiment, the waterproofing member (380) may be positioned to cover at least a portion of the molding member (370).

[0142] Referring to FIGS. 7A to 7C , according to one embodiment, the first molding portion (371) may include a flat region (371a) and an inclined region (371b) extending from the flat region (371a) to eliminate a step difference with the surface of the conductive layer (311). For example, the inclined region (371b) is formed so that the first molding portion (371) can be connected or in contact with the surface of the conductive layer (311) without a step difference, thereby strengthening the adhesive force or fixing force of the first molding portion (371) to the surface of the conductive layer (311) compared to a case where the inclined region (371b) is not present.

[0143] According to one embodiment, the second molding part (372) can improve the formability, that is, the problem of the outermost part of the inclined region (371b) having a thin wall thickness (e.g., Z-direction thickness) at the outermost part (or edge part) where the inclined region (371b) of the first molding part (371) meets the conductive layer (311) during injection molding of the first molding part (371) that is, a defect in the shape of the outermost part of the inclined region (371b). In addition, the second molding part (372) can improve the problem of the outermost part being peeled off due to the thin wall thickness by adding thickness (e.g., Z-direction thickness) at the outermost part (or edge part) of the inclined region (371b) of the first molding part (371), and the adhesion or fixing force of the molding member (370) to the conductive layer (311) can be strengthened. For example, when the conductive layer (311) includes a recessed area (311a), a portion, such as a protrusion, accommodated in the recessed area (311a) of the second molding part (372) can have its adhesive force or fixing force to the conductive layer (311) of the second molding part (372) strengthened, and the peeling phenomenon of the second molding part (372) can be reduced or prevented.

[0144] Referring to FIGS. 7b, 8a and 8b, in one embodiment, the molding member (370) may include only the first molding portion (371) without the second molding portion (372).

[0145] Referring to FIGS. 7C, 8C, and 8D, in one embodiment, the molding member (370) may include a first molding portion (371) and a second molding portion (372) disposed in the recessed region (311a). Referring to FIGS. 8A to 8D, according to one embodiment, the molding member (370) may include a flat region (370a) and an inclined region (370b) extending from the flat region (370a). For example, the flat region (370a) may be closer to the edge of the display assembly (301) than the inclined region (370b). According to one embodiment, the inclined region (371b) of the molding member (370) may include a structure in which the height (or thickness in the Z-axis direction) decreases toward the recessed region (311a) or a portion around the recessed region (311a) of the second direction side (e.g., the -Z-direction side) of the conductive layer (311). In other words, the inclined region (371b) may have a shape in which the height (or thickness in the Z-axis direction) decreases as it gets farther from the edge of the display assembly (301).

[0146] According to one embodiment, the first molding portion (371) may be formed to have sufficient strength (e.g., hardness) to protect the third portion (315c) of the flexible substrate (315). According to one embodiment, the first material (or the first molding liquid) constituting the first molding portion (371) may be formed of a material having a higher hardness than the second material (or the second molding liquid) constituting the second molding portion (372). For example, based on the hardness measured by the Shore D method, the hardness of the first material may be about 70 to about 85, and the hardness of the second material may be about 40 to about 60. For example, the elastic modulus of the first material may exceed about 600 Mpa, and the elastic modulus of the second material may be about 600 Mpa or less. For example, the tensile strength of the first material may be about 32 to about 47, and the tensile strength of the second material may be about 8 to about 15.

[0147] FIG. 9A is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9B is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9C is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9D is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9E is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9F is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9G is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9H is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 9I is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 10A is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 10B is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 11A is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure. FIG. 11B is a side cross-sectional view of a portion of an electronic device including a molding member and a portion of a display panel according to an embodiment of the present disclosure.

[0148] Referring to FIG. 9A, according to one embodiment, the waterproof member (380) may include a waterproof layer (381), a first adhesive layer (382) disposed on one surface of the waterproof layer (381), and a second adhesive layer (383) disposed on the other surface of the waterproof member. For example, the first adhesive layer (382) and / or the second adhesive layer (383) may be omitted.

[0149] Referring to FIGS. 9A to 11B , according to one embodiment, the molding member (370) may include a planar region (370a) (e.g., the planar region (370a) of FIGS. 8B and 8D ) and an inclined region (370b) extending from the planar region (370a) (e.g., the inclined region (370b) of FIGS. 8B and 8D ). Referring to FIGS. 9A to 10C , according to one embodiment, when viewed in a first direction (e.g., the +Z-axis direction), at least a portion of the recessed region (311a) may at least partially overlap with the inclined region (371b). Referring to FIG. 9B , according to one embodiment, when viewed in the first direction (e.g., the +Z-axis direction), another portion of the recessed region (311a) may not at least partially overlap with the inclined region (371b).

[0150] Referring to FIGS. 9A to 9G, according to one embodiment, the recessed region (311a) of the conductive layer (311) may be a recess formed in a second direction surface (e.g., a -Z direction surface) facing the inside of the electronic device (101) of the conductive layer (311). Referring to FIGS. 9D, 10A, 10B, and 11E, the recessed region (311a) of the conductive layer (311) may be in the form of a hole penetrating from the second direction surface (e.g., a -Z direction surface) to the first direction surface (e.g., a +Z direction surface). The second molding portion (372) disposed in the recessed region (311a) may be formed by injection molding in the recessed region (311a) and thus may have a shape corresponding to the shape of the recessed region (311a).

[0151] Referring to FIG. 9E, according to one embodiment, the recessed region (311a) of the conductive layer (311) may include a first protruding structure (3113) formed on at least a portion of the surface of the recessed region (311a). According to one embodiment, the recessed region (311a) may include the first protruding structure (3113) formed on a surface (or a second direction surface or a surface facing the rear plate) (e.g., a -Z direction surface) facing the rear plate (e.g., the rear plate (211) of FIG. 4). For example, the first protruding structure (3113) may increase the bonding force between the second molding portion (372) and the surface of the recessed region (311a) in contact therewith, compared to a case where the surface of the recessed region (311a) in contact with the second molding portion (372) is formed without the protruding structure.

[0152] Referring to FIG. 9F, according to one embodiment, the conductive layer (311) may further include a second uneven structure (3114) formed on at least a portion of a surface in contact with the first molding portion (371). For example, the second uneven structure (3114) may increase the bonding force between the first molding portion (371) and the surface of the conductive layer (311) in contact therewith, compared to a case where the surface of the conductive layer (311) in contact with the first molding portion (371) (e.g., a portion of the second direction surface or the -Z direction surface) is formed without the uneven structure. Referring to FIG. 9F, according to one embodiment, the conductive layer (311) may include the first uneven structure (3113) and / or the second uneven structure (3114). According to one embodiment, the conductive layer (311) may include only the first protruding structure (3113) (e.g., see FIG. 9e) or may include only the second protruding structure (3114). Referring to FIG. 9g, according to one embodiment, the molding member (370) may further include a primer layer (PL) disposed, laminated, or applied on a surface in contact with the conductive layer (311). For example, in the present disclosure, the primer layer (PL) may be understood as a configuration included in the conductive layer (311). For example, the primer layer (PL) may be formed to bond, attach, or adhere a first direction surface (e.g., a +Z direction surface) of the molding member (370) to a surface (or a second direction surface or a surface facing the rear plate) (e.g., a -Z direction surface) of the recessed region (311a) facing the rear plate (e.g., the rear plate 211 of FIG. 4). According to one embodiment, the primer layer (PL) may be disposed on at least a portion of the surface (or the first direction surface (e.g., the +Z direction surface)) of the second molding portion (372) of the molding member (370) and / or the first direction surface (e.g., the +Z direction surface) of the first molding portion (371). For example, the primer layer (PL) may be formed to have a thickness (e.g., a Z-axis direction thickness) of about 35 μm or less, preferably about 30 μm or less.According to one embodiment, the primer layer (PL) can increase the adhesion of the first molding portion (371) and / or the second molding portion (372) of the molding member (370) to the conductive layer (311). For example, the conductive layer (311) can be made of a metal material (e.g., copper, stainless steel). For example, the primer layer (PL) can include a volatile component such as propan-2-ol or isopropyl acetate. For example, the primer layer (PL) can include about 97% to about 99% of propan-2-ol and about 1% to about 3% of titanium tetrabutanolate. For example, the primer layer (PL) can include isopropyl acetate, but the components of the primer layer (PL) are not limited.

[0153] Referring to FIGS. 9H and 9I, according to one embodiment, the molding member (370) may include only the first molding portion (371) and may not include the second molding portion (e.g., the second molding portion (372) of FIGS. 9A to 9G, FIGS. 10A and 10B). When the molding member (370) does not include the second molding portion (372), the conductive layer (311) may not include a recessed area (e.g., the recessed area (311a) of FIGS. 9A to 9G, FIGS. 10A and 10B) for accommodating the second molding portion (372).

[0154] Referring to FIG. 9H, according to one embodiment, the molding member (370) may further include a primer layer (PL) disposed, laminated, or applied on a surface in contact with the conductive layer (311). For example, in the present disclosure, the primer layer (PL) may be understood as a configuration included in the conductive layer (311). For example, the primer layer (PL) may be formed to bond, attach, or adhere a first direction surface (e.g., a +Z direction surface) of the molding member (370) to a surface (or a second direction surface or a surface facing the rear plate) (e.g., a -Z direction surface) of the conductive layer (311) facing the rear plate (e.g., the rear plate 211 of FIG. 4). According to one embodiment, the primer layer (PL) may be disposed on all or a portion of the first direction surface (e.g., a +Z direction surface) of the molding member (370) (or the first molding portion (371)). For example, the thickness of the primer layer (PL) may be formed to be about 35 μm or less, preferably about 30 μm or less (e.g., thickness in the Z-axis direction). According to one embodiment, when the molding member (370) further includes the primer layer (PL), the adhesion of the molding member (370) (or the first molding portion (371)) to the conductive layer (311) may be increased compared to when the primer layer (PL) is not present. For example, the conductive layer (311) may be made of a metal material (e.g., copper, stainless steel). For example, the primer layer (PL) may include a volatile component such as propan-2-ol or isopropyl acetate. For example, the primer layer (PL) may comprise about 97% to about 99% propan-2-ol and about 1% to about 3% titanium tetrabutanolate. For example, the primer layer (PL) may comprise isopropyl acetate, but the components of the primer layer (PL) are not limited.

[0155] Referring to FIGS. 10A and 10B , according to one embodiment, the recessed region (311a) of the conductive layer (311) may include a step structure. According to one embodiment, the recessed region (311a) may include a first recessed region (3111a) and a second recessed region (3112a) connected to the first recessed region (3111a) and forming a step structure together with the first recessed region (3111a). The second recessed region (3112a) may be disposed in a first direction (e.g., +Z direction) with respect to the first recessed region (3111a) and may be disposed farther from the first molding portion (371) than the first recessed region (3111a).

[0156] Referring to FIG. 10a, according to one embodiment, the second width (d2) of the second recessed region (3112a) may be smaller than the first width (d1) of the first recessed region (3111a) based on the width measured in the direction (e.g., the Y-axis direction) intersecting the first direction (e.g., the +Z direction) or the second direction (e.g., the -Z direction). Referring to FIG. 10b, according to one embodiment, the second width (d2) of the second recessed region (3112a) may be larger than the first width (d1) of the first recessed region (3111a) based on the width measured in the direction (e.g., the Y-axis direction) intersecting the first direction (e.g., the +Z direction) or the second direction (e.g., the -Z direction). For example, the second molding portion (372) disposed in the recessed area (311a) may be formed by injection molding in the recessed area (311a) and thus may have a shape corresponding to the shape of the recessed area (311a). According to one embodiment, the recessed area (311a) of the conductive layer (311) may include a second-first molding portion (372a) extending from the first molding portion (371) and a second-second molding portion (372b) extending from the second-first molding portion (372a).

[0157] Referring to FIGS. 11A and 11B , according to one embodiment, the recessed region (311a) of the conductive layer (311) may include an independent recessed region (311a-1) and a base recessed region (311a-2). According to one embodiment, the independent recessed region (311a-1) may be closer to the planar region (371a) of the first molding portion (371) than the base recessed region (311a-2). According to one embodiment, the independent recessed region (311a-1) may overlap the planar region (371a) and the inclined region (371b) of the first molding portion (371) with respect to the thickness direction (e.g., Z direction) of the electronic device. According to one embodiment, the base recess region (311a-2) may overlap with the inclined region (371b) of the first molding part (371) based on the thickness direction (e.g., Z direction) of the electronic device. According to one embodiment, the independent recess region (311a-1) may be spaced apart from the base recess region (311a-2). According to one embodiment, the independent recess region (311a-1) may include a plurality of independent recess regions (311a-1) that are spaced apart from each other. Referring to FIG. 11B, according to one embodiment, the base recess region (311a-2) may include a plurality of protrusions extending in the direction in which the independent recess region (311a-1) is arranged, and for example, the protrusions may be spaced apart from each other.

[0158] According to one embodiment, the width of the base recess region (311a-2) (e.g., d3 in FIG. 11A) may be greater than or equal to the width of the independent recess region (311a-1) (e.g., d4 in FIG. 11A). For example, the widths of the plurality of independent recess regions (311a-1) (e.g., d4 in FIG. 11A) may be set to be at least partially the same or different from each other. For example, the width of the independent recess region (311a-1) (e.g., d4 in FIG. 11A) may be set to become smaller or larger as it moves away from the base recess region (311a-2) (e.g., -Y direction), or may be set to have an arbitrary value without a certain rule. For example, the width of the independent recess region (311a-1) (e.g., d4 in FIG. 11a) can be arranged so that the density increases or decreases as it moves away from the base recess region (311a-2) (e.g., in the -Y direction).

[0159] Referring to FIG. 11b, according to one embodiment, the arrangement of the independent recessed regions (311a-1) may be, but is not limited to, sporadic, and may be arranged in at least partially regular patterns (e.g., a zigzag baton, a linear pattern, a grid pattern). According to one embodiment, the shape of a cross-section (e.g., a cross-section cut along the XY plane) of the independent recessed regions (311a-1) may include, but is not limited to, a polygonal shape such as a square, and may include, for example, a circular or irregular shape.

[0160] Referring to FIGS. 11A and 11B , according to one embodiment, the second molding portion (372) may include a second base molding portion (372-1) disposed in the base recess area (311a-2) and a second independent molding portion (372-2) disposed in the independent recess area (311a-1). According to one embodiment, the second base molding portion (372-1) and the second independent molding portion (372-2) may be formed of the same or different materials as the first molding portion (371). According to one embodiment, the second base molding portion (372-1) and the second independent molding portion (372-2) may be formed integrally with the first molding portion (371), and may be formed by double injection molding, for example. According to one embodiment, the width of the second base molding portion (372-1) (e.g., d3 in FIG. 11A) may be greater than the width of the independent recess region (311a-1) (e.g., d4 in FIG. 11A). For example, when the second molding portion (372) further includes the second independent molding portion (372-2) compared to when it includes only the second base molding portion (372-1), the adhesion or bonding force of the first molding portion (371) and / or the second molding portion (372) to the conductive layer (311) may be strengthened, and the phenomenon of the first molding portion (371) and / or the second molding portion (372) being peeled off from the conductive layer (311) may be reduced or prevented.

[0161] FIG. 12A is a diagram for explaining a molding process for manufacturing a molding member according to one embodiment of the present disclosure. FIG. 12B is an enlarged view of portion F of FIG. 12A according to one embodiment of the present disclosure. FIG. 12C is a perspective view for explaining a molding member according to one embodiment of the present disclosure. FIG. 12D is a side cross-sectional view for explaining a molding member according to one embodiment of the present disclosure. FIG. 13A is a perspective view for explaining a second molding part formed according to one embodiment of the present disclosure. FIG. 13B is a side cross-sectional view for explaining a second molding part formed according to one embodiment of the present disclosure. FIG. 13C is a perspective view for explaining a molding member formed according to one embodiment of the present disclosure. FIG. 13D is a side cross-sectional view for explaining a molding member formed according to one embodiment of the present disclosure. FIG. 14A is a diagram for explaining a thermal curing process of a molding member according to one embodiment of the present disclosure. FIG. 14b is a drawing for explaining a photocuring process of a molding member according to one embodiment of the present disclosure. FIG. 15 is a drawing showing a molding member manufactured according to one embodiment of the present disclosure.

[0162] FIGS. 12A to 15 are drawings for explaining a manufacturing process of a molding member (370) according to the embodiments described with reference to FIGS. 5A to 10C, according to one embodiment.

[0163] Referring to FIG. 12a, in one embodiment, the mold (10) may include a lower mold (11), an upper mold (12), and a mold cap (13). A portion of the mold cap (13) may be disposed in a space between the lower mold (11) and the upper mold (12), and a display assembly (301), which is an injection-molded object, may be disposed in the space between the lower mold (11) and the mold cap (13). Referring to FIG. 12b, a mold solution may be injected into the mold cap (13) in the direction of the arrow in FIG. 12b. The mold solution injected into the space between the lower mold (11) and the upper mold (12) through the mold cap (13) may be applied to a back surface (e.g., a second direction surface or a -Z direction surface based on FIG. 5a) and / or a side surface (e.g., an X-axis direction surface or a Y-axis direction surface based on FIG. 5a) of the display assembly (301).

[0164] FIGS. 12C and 12D are drawings showing an example in which the first molding portion (371) and the second molding portion (372) of the molding member (370) are formed of the same material. Referring to FIGS. 12C and 12D, according to one embodiment, the first molding portion (371) and the second molding portion (372) can be formed at one time by injecting the molding solution into the mold cap (13) as described above with reference to FIG. 12B. FIGS. 13A to 13C are drawings showing an example in which the first molding portion (371) and the second molding portion (372) of the molding member (370) are formed of different materials or different materials. Referring to FIGS. 13a to 13c, according to one embodiment, as described above with reference to FIG. 12b, a molding solution is first injected into the mold cap (13) to first form a second molding portion (372) in the recessed area (311a) (see FIG. 13b), and a molding solution is secondarily injected to form a first molding portion (371) integrally with the second molding portion (372) on the second molding portion (372) (see FIG. 13c).

[0165] Referring to Fig. 14a, heat may be applied to the molding solution applied to form the molding member (370) as shown in Figs. 12c to 13c to cure the molding solution. Referring to Fig. 14b, light may be applied to the molding solution applied to form the molding member (370) as shown in Figs. 12c to 13c to cure the molding solution. For example, either the heat curing process of Fig. 14a or the light curing process of Fig. 14b may be performed alone, or they may be performed sequentially or simultaneously regardless of the order. The heat-cured and / or light-cured molding member (370) may be provided in an integrated state on the display assembly (301) as shown in Fig. 15 after going through a cooling process.

[0166] FIG. 16A is a side cross-sectional view illustrating a molding member (370) disposed on a display assembly (301) according to one embodiment of the present disclosure. FIG. 16B is a plan view of the molding member (370) according to one embodiment of the present disclosure. FIG. 16C is a plan view of the molding member (370) according to one embodiment of the present disclosure. FIG. 16D is a plan view of the molding member (370) according to one embodiment of the present disclosure. FIG. 16E is a plan view of the molding member (370) according to one embodiment of the present disclosure.

[0167] The description of the display assembly (301), the molding member (370), and the waterproof member (380) described above with reference to FIGS. 5A to 10C may be applied identically or similarly to the display assembly (301), the molding member (370), and the waterproof member (380) of FIGS. 16A and 16B, and may not be described repeatedly below.

[0168] Referring to FIG. 16A, in one embodiment, the molding member (370) may include a first molding portion (371) and a second molding portion (372) extending from the first molding portion (371). For example, the first molding portion (371) and the second molding portion (372) may be formed substantially on the same plane on a surface facing the rear plate of the conductive layer (311) (e.g., the rear plate (211) of FIG. 4).

[0169] According to one embodiment, the molding member (370) may include a first planar region (3701a), a first inclined region (3701b) extending from the first planar region (3701a) and having a shape in which the height (or thickness in the Z-axis direction) decreases toward a portion of the conductive layer (311), a second planar region (3702a) extending from the first inclined region (3701b), and a second inclined region (3702b) extending from the second planar region (3702a) and having a shape in which the height (or thickness in the Z-axis direction) decreases toward the portion of the conductive layer (311).

[0170] In one embodiment (not shown), the inclined region (370b) may include a plurality of inclined regions (3701b, 3702b) that are inclined with respect to one another. For example, the inclined region (370b) may include a first inclined region (3701b) and a second inclined region (3702b). According to one embodiment, the first inclined region (3701b) may form a first angle (α1) with respect to a second direction plane (e.g., a -Z direction plane) of the conductive layer (311). According to one embodiment, the second inclined region (3702b) may form a second angle (α2) with respect to the second direction plane (e.g., a -Z direction plane) of the conductive layer (311), which is substantially the same as or different from the first angle (α1).

[0171] According to one embodiment, the interface of the first molding portion (371) and the second molding portion (372) may be located in the first inclined region (3701b). In other words, when the molding member (370) is viewed in the first direction (e.g., +Z direction), a portion of the first molding portion (371) and a portion of the second molding portion (372) may overlap the first inclined region (3701b).

[0172] Referring to FIG. 16b, according to one embodiment, when the molding member (370) is viewed in the first direction (e.g., +Z direction), the first molding portion (371) and the second molding portion (372) may be polygonal, such as a square, and referring to FIG. 16c, when the molding member (370) is viewed in the first direction (e.g., +Z direction), the second molding portion (372) may be formed in various shapes, such as a circle or an irregular shape, so that a large contact area of ​​the second molding portion (372) with respect to the conductive layer (311) may be provided.

[0173] Referring to FIGS. 16D and 16E , according to one embodiment, the first molding portion (371) and the second molding portion (372) may include coupling structures (3711, 3721) formed to interlock with each other at an interface where they contact each other. According to one embodiment, the first molding portion (371) may include a first coupling structure (3711) in the form of a concave portion, and the second molding portion (372) may include a second coupling structure (3721) in the form of a protrusion that interlocks with the first coupling structure (3711). For example, the first coupling structure (3711) may include a plurality of concave portions spaced apart from each other, and the second coupling structure (3721) may include a plurality of protrusions spaced apart from each other. The shapes of the first coupling structure (3711) and the second coupling structure (3721) can be formed in various ways, and for example, they can have a rectangular cross-section as in 16c, and can also have a wedge-shaped cross-section whose width increases as it goes in the direction in which the first molding part (371) is arranged as in the example of FIG. 16e. However, the shapes of the coupling structures (3711, 3721) are not limited, and for example, the first coupling structure (3721) may have a protruding shape and the second coupling structure (3721) may have a concave shape, or both the first coupling structure (3711) and the second coupling structure (3721) may include protruding and concave shapes.

[0174] FIG. 17A is a drawing for explaining a molding member, a waterproofing member, and an adhesive member according to one embodiment of the present disclosure. FIG. 17B is a drawing for explaining a molding member, a waterproofing member, and an adhesive member according to one embodiment of the present disclosure. FIG. 17C is a drawing for explaining a molding member, a waterproofing member, and an adhesive member according to one embodiment of the present disclosure.

[0175] The molding member (370) of FIGS. 17A to 17C may be referred to as the molding member (370) according to the embodiment described above with reference to FIGS. 5A to 16E. The waterproofing member (380) of FIGS. 17A to 17C may be referred to as the waterproofing member (380) according to the embodiment described above with reference to FIGS. 5A to 10B.

[0176] Referring to FIGS. 17A and 17B , in one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1-4B ) may include an adhesive member (390) disposed on at least a portion of a molding member (370). The waterproofing member (380) and / or the adhesive member (390) may be disposed to couple the molding member (370) to a support structure (e.g., the support structure (321) of FIG. 7A ) of a housing (e.g., the housing (320) of FIG. 7A ). For example, the adhesive member (390) may be disposed so as not to overlap the waterproofing member (380) when viewed in a first direction (e.g., the +Z axis direction). For example, the adhesive member (390) may be formed by applying an adhesive (e.g., a liquid or semi-solid) on the molding member (370) and a display assembly (e.g., the display assembly (301) of FIG. 7A ). For example, the waterproof member (380) may be a tape member having an adhesive layer formed on the surface (e.g., the first adhesive layer (382) and the second adhesive layer (383) of FIG. 8a). Referring to FIG. 17c, the adhesive member (390) may be omitted.

[0177] FIG. 18A is a diagram illustrating a display assembly and a molding member of an electronic device according to one embodiment of the present disclosure. FIG. 18B is a diagram illustrating a display assembly and a molding member according to one embodiment of the present disclosure. FIG. 18C is a diagram illustrating a display assembly and a molding member according to one embodiment of the present disclosure.

[0178] The description of the display assembly (301) and / or the molding member (370) of FIGS. 18A to 18C may be applied to the description of the assembly (301) and / or the molding member (370) of the embodiment of FIGS. 5A to 17C.

[0179] Referring to FIGS. 18A through 18C , according to one embodiment, the molding member (370) may be positioned along at least a portion of the edges (301a, 301b, 301c, 301d) of the display assembly (301). Referring to FIGS. 18A and 18B , according to one embodiment, the molding member (370) may be positioned along the entire edge of the display assembly (301). For example, the molding member (370) may be positioned along all or a portion of each of the first edge (301a), the second edge (301b), the third edge (301c), and the fourth edge (301d) of the display assembly (301).

[0180] The molding member (370) illustrated in FIGS. 18A and 18B may be formed entirely of a single material. Referring to FIG. 18B, according to one embodiment, the region(s) indicated by S in FIG. 18B may represent regions in which a recess region (311a) is formed in a second direction surface (e.g., a -Z direction surface) of the conductive layer (311). For example, the recess region (311a) may be a recess formed in a second direction surface (e.g., a -Z direction surface) of the conductive layer (311) facing the inside of the electronic device (101), or may be in the form of a hole penetrating from the second direction surface (e.g., a -Z direction surface) to the first direction surface (e.g., a +Z direction surface). According to one embodiment, a part of the molding member (370) may be disposed in the recess region (311a) disposed in the region indicated by S. For example, a part of the molding member (370) disposed in the recessed area (311a) may be in the form of a protrusion. For example, a part of the molding member (370) disposed in the recessed area (311a) may be formed by injection molding into the recessed area (311a) and may have a shape corresponding to the shape of the recessed area (311a). For example, a part of the second molding part (372) accommodated in the recessed area (311a), such as a protrusion, may have an enhanced adhesive force or fixing force to the conductive layer (311) of the second molding part (372), and a peeling phenomenon of the second molding part (372) may be reduced or prevented. For example, the elastic modulus of the second material may be about 600 Mpa or less. The molding member (370) illustrated in FIGS. 18A and 18B may be formed entirely of a single material. The molding member (370) illustrated in FIGS. 18a and 18b may be formed of a flexible material (or a second material). For example, the flexible material may be the same as the material forming the second molding portion (372) according to the embodiments described above with reference to FIGS. 7c to 11b.

[0181] Referring to FIG. 18c, according to one embodiment, at least a portion of the molding member (370) disposed along the second edge (301b) corresponding to the lower portion of the display assembly (301) may be disposed to surround a third portion (e.g., the third portion (315c) of FIG. 7a) of a flexible circuit board (e.g., the flexible circuit board (315) of FIG. 7a) of the display assembly (301) and may be made of a rigid material (or a first material). Referring to FIG. 18c, according to one embodiment, another portion of the molding member (370) disposed along the remaining portion of the second edge (301b) and portions disposed along the first edge (301a), the third edge (301c) and the fourth edge (301d) may be made of a flexible material (or a second material). Here, the rigid material forming part of the molding member (370) may have a greater hardness than the soft material, and for example, the third part (e.g., the third part (315c) of FIG. 7a) disposed on the inside may be formed to have sufficient strength (e.g., hardness) to protect against external impact. According to one embodiment, the first material (or first molding liquid) forming the first molding portion (371) may be formed of a material having a greater hardness than the second material (or second molding liquid) forming the second molding portion (372). For example, based on the hardness measured by the Shore D method, the hardness of the rigid material may be about 70 to about 85, and the hardness of the soft material may be about 40 to about 60. For example, the elastic modulus of the rigid material may be greater than about 600 Mpa, and the elastic modulus of the soft material may be less than or equal to about 600 Mpa. For example, the tensile strength of the rigid material may be about 32 to about 47, and the tensile strength of the soft material may be about 8 to about 15.

[0182] FIG. 19A and FIG. 19B are diagrams illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure. FIG. 19 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0183] The configuration of the electronic device (101) of FIGS. 19a to 19c may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1.

[0184] Referring to FIGS. 19A to 19C, the electronic device (101) may include a housing (403) for accommodating components of the electronic device (101) and a flexible display assembly (hereinafter, referred to as a flexible display (401)) disposed within a space formed by the housing (403). According to one embodiment, the housing (403) may be referred to as a foldable housing. According to one embodiment, the flexible display (401) may be referred to as a foldable display. The electronic device (101) may also be referred to as a foldable electronic device. The term "foldable electronic device" may refer to an electronic device that can be folded so that two different areas of the display face each other or face opposite to each other. Typically, in a foldable electronic device, the display is folded in a manner such that the two different regions face each other or are in opposite directions, and in actual use, the user can unfold the display so that the two different regions form a substantially flat surface.

[0185] According to one embodiment, the housing (403) may include a first housing (410) and a second housing (420) configured to rotate relative to the first housing (410).

[0186] According to one embodiment, the first housing (410) and / or the second housing (420) may form at least a portion of the exterior of the electronic device (101). According to one embodiment, the side on which the flexible display (401) is visually exposed may be defined as a front side (e.g., a first front side (410a) and a second front side (420a)) of the electronic device (101) and / or the housing (403). The side opposite to the front side may be defined as a back side (e.g., a first back side (410b) and a second back side (420b)) of the electronic device (101). The side surrounding at least a portion of the space between the front side and the back side may be defined as a side side (e.g., a first side side (410c) and a second side side (420c)) of the electronic device (101).

[0187] According to one embodiment, the first housing (410) may be rotatably connected to the second housing (420) using a hinge assembly including a hinge cover (430). For example, the first housing (410) and the second housing (420) may each be rotatably connected to the hinge assembly. Accordingly, the electronic device (101) may be variable between a folded state (e.g., FIG. 19c) and an unfolded state (e.g., FIGS. 19a and 19b). In the folded state, the first front surface (410a) may face the second front surface (420a), and in the unfolded state, a direction in which the first front surface (410a) faces may be substantially the same as a direction in which the second front surface (420a) faces. For example, in the unfolded state, the first front surface (410a) may be positioned substantially on the same plane as the second front surface (420a). In one embodiment, the second housing (420) may provide relative motion with respect to the first housing (410).

[0188] According to one embodiment, the first housing (410) and the second housing (420) are arranged on both sides with respect to the folding axis (H) as the center, and may have a shape that is overall symmetrical with respect to the folding axis (H). The angle between the first housing (410) and the second housing (420) may be changed depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state between the unfolded state and the folded state.

[0189] According to one embodiment, the electronic device (101) may include a hinge cover (430). At least a portion of the hinge cover (430) may be disposed between the first housing (410) and the second housing (420). According to one embodiment, the hinge cover (430) may be covered by a portion of the first housing (410) and the second housing (420) or may be exposed to the outside of the electronic device (101), depending on the state of the electronic device (101). According to one embodiment, the hinge cover (430) may protect the hinge assembly from external impact of the electronic device (101). According to one embodiment, the hinge cover (430) may be interpreted as a hinge housing for protecting the hinge assembly.

[0190] According to one embodiment, as illustrated in FIGS. 19a and 19b, when the electronic device (101) is in an unfolded state, the hinge cover (430) may be covered by the first housing (410) and the second housing (420) and may not be exposed. As another example, as illustrated in FIG. 19c, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (430) may be exposed to the outside between the first housing (410) and the second housing (420). As another example, when the first housing (410) and the second housing (420) are in an intermediate state where they are folded at a certain angle, the hinge cover (430) may be partially exposed to the outside between the first housing (410) and the second housing (420). However, in this case, the exposed area may be less than in the fully folded state. In one embodiment, the hinge cover (430) may include a curved surface.

[0191] In one embodiment, the flexible display (401) can visually provide information to an external party (e.g., a user) of the electronic device (101). The flexible display (401) can include, for example, a holographic device or a projector and a control circuit for controlling the device. In one embodiment, the flexible display (401) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0192] According to one embodiment, the flexible display (401) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the flexible display (401) may be formed to vary in response to the relative movement of the second housing (420) with respect to the first housing (410). According to one embodiment, the flexible display (401) may include a folding area (A3), a first display area (A1) disposed on one side (e.g., upper (+Y direction)) of the folding area (A3), and a second display area (A2) disposed on the other side (e.g., lower (-Y direction)). According to one embodiment, the folding area (A3) may be positioned above the hinge assembly. For example, at least a portion of the folding area (A3) may face the hinge assembly. According to one embodiment, the first display area (A1) may be disposed on the first housing (410), and the second display area (A2) may be disposed on the second housing (420). According to one embodiment, the flexible display (401) may be accommodated in the first housing (410) and the second housing (420).

[0193] However, the division of regions of the flexible display (401) illustrated in FIGS. 19a and 19b is exemplary, and the flexible display (401) may be divided into multiple regions (for example, four or more or two) depending on the structure or function.

[0194] Also, in the embodiments illustrated in FIGS. 19A and 19B, the areas of the flexible display (401) may be divided by a folding area (A3) extending parallel to the X-axis or a folding axis (A-axis), but in other embodiments, the flexible display (401) may be divided by areas based on other folding areas (e.g., a folding area parallel to the Y-axis) or other folding axes (e.g., a folding axis parallel to the Y-axis). According to one embodiment, the flexible display (401) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer configured to detect a magnetic field-type digital pen (e.g., a stylus pen).

[0195] According to one embodiment, the electronic device (101) may include a rear display (434). The rear display (434) may be arranged to face a different direction than the flexible display (401). For example, the flexible display (401) may be visually exposed through the front side (e.g., the first front side (410a) and / or the second front side (420a)) of the electronic device (101), and the rear display (434) may be visually exposed through the rear side (e.g., the first rear side (410b)) of the electronic device (101).

[0196] According to one embodiment, the electronic device (101) may include at least one camera module (404, 206) and a flash (408). According to one embodiment, the electronic device (101) may include a front camera module (404) exposed through a front side (e.g., a first front side (410a)) and / or a rear camera module (406) exposed through a rear side (e.g., a first rear side (410b)). The camera modules (404, 206) may include one or more lenses, an image sensor, a flash, and / or an image signal processor. The flash (408) may include a light emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101). The configuration of the front camera module (404) and / or the rear camera module (406) may be partially or entirely identical to the configuration of the camera module (180) of FIG. 1.

[0197] Although the electronic device (101) disclosed in FIGS. 19A to 19C has the appearance of a foldable electronic device, the present disclosure is not limited thereto. For example, the illustrated electronic device may be a part of a rollable electronic device or a bar-type or plate-type electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., a flexible display (401) of FIGS. 19A and 19B) is capable of bending deformation, such that at least a portion thereof may be wound or rolled, or may be accommodated inside a housing (e.g., a housing (410) of FIGS. 19A and 19B). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0198] Although the electronic device (101) disclosed in FIGS. 19A to 19C has the appearance of a foldable electronic device, the present invention is not limited thereto. For example, the illustrated electronic device may be a bar type, a plate type, or a rollable electronic device. The term "rollable electronic device" may refer to an electronic device in which a display (e.g., a flexible display (401) of FIG. 19C) is capable of bending deformation, such that at least a portion thereof can be wound or rolled, or can be accommodated inside a housing (e.g., a housing (403) of FIG. 19). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside.

[0199] FIG. 20A is a diagram illustrating a display assembly and a molding member of an electronic device in an unfolded state according to an embodiment of the present disclosure. FIG. 20B is a diagram illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 20C is a diagram illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 21A is an enlarged view of portion G of FIG. 20A according to an embodiment of the present disclosure. FIG. 21B is a diagram illustrating a display assembly, a molding member, and a waterproof member according to an embodiment of the present disclosure. FIG. 22A is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 22B is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 22C is a rear view illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 23A is a diagram illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 23B is a diagram illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure. FIG. 23C is a diagram illustrating a display assembly and a molding member of an electronic device in a folded state according to an embodiment of the present disclosure.

[0200] The flexible display (401) of FIGS. 20A to 23C may be referred to as a flexible display (401) (or flexible display assembly) according to the embodiment of FIGS. 19A to 19C.

[0201] Hereinafter, a flexible display (401) and a molding member (370) and / or a waterproof member (380) disposed thereon will be described with reference to FIGS. 20A to 23C. The flexible display (401), the housing (403), the molding member (470), and the waterproof member (380) according to the embodiments of FIGS. 20A to 23C may be referred to as the display assembly (301), the housing (320), the molding member (370), and the shielding member (380) according to the embodiments of FIGS. 5A to 18C. The description of the display assembly (301), the housing (320), the molding member (370), and the shielding member (380) according to the above-described embodiment with reference to FIGS. 5A to 18C may be applied to the flexible display (401), the housing (403), the molding member (470), and the waterproof member (380) according to the embodiment of FIGS. 20A to 23C, and may not be repeated hereinafter.

[0202] Referring to FIGS. 21A, 23B, and 23C, according to one embodiment, the first molding portion (471) may include an inclined region (471b) to eliminate a step difference with respect to the surface of the conductive layer (411). For example, the inclined region (471b) is formed so that the first molding portion (471) can be connected or in contact with the surface of the conductive layer (411) without a step difference, thereby strengthening the adhesion or fixing force of the first molding portion (471) to the surface of the conductive layer (411) compared to a case where the inclined region (471b) is not present.

[0203] Referring to FIG. 21B, the electronic device (e.g., the electronic device (101) of FIGS. 1 to 4B) may further include a waterproof member (480). As illustrated in FIG. 21B, a portion of the waterproof member (480) may be disposed on a second-direction surface (e.g., a -Z-direction surface) of the flexible display (401), and another portion may be disposed on a second-direction surface (e.g., a -Z-direction surface) of the molding member (470), but is not limited thereto. For example, the waterproof member (480) may be disposed to couple the molding member (470) to a support structure (e.g., a support structure (321) of FIG. 7A) of a housing (e.g., a housing (420) of FIG. 7A).

[0204] FIG. 22A may illustrate a flexible display (401) before a molding member (470) is applied according to one embodiment of the present disclosure. For example, referring to FIG. 22A, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 4B ) may include, in addition to the molding member (470), a molding region (460) positioned along at least a portion of an edge of the flexible display (401). However, the molding region (460) may be omitted.

[0205] FIGS. 22B, 22C, and 23A to 23B may illustrate a flexible display (401) to which a molding member (470) according to an embodiment of the present disclosure of FIG. 22A is applied. Referring to FIGS. 22B and 23A to 23B, according to an embodiment, the molding member (470) may include a first molding member (470-1) and a second molding member (470-2) formed of a different material from the first molding member (470-1) and at least a portion of which is connected to the first molding member (470-1). Referring to FIG. 22B and FIG. 23A to FIG. 23B, according to one embodiment, the first molding member (470-1) may be disposed at the lower end of the flexible display (401) (e.g., the second edge (301b) of FIG. 6A), and the second molding member (470-2) may be disposed at the upper end of the flexible display (401) (e.g., the first edge (301a) of FIG. 6A)) and / or both side ends (e.g., the third edge (301c), the fourth edge (301d) of FIG. 6A). For example, the second molding member (470-2) may be connected to the first molding member (470-1) or may be formed integrally with the first molding member (470-1).

[0206] Referring to FIG. 22c, according to one embodiment, the molding member (470) may include a first molding member (470-1) disposed at the lower end of the flexible display (401) (e.g., the second edge (401b) of FIG. 6a).

[0207] Referring to FIGS. 22B to 23B , according to one embodiment, the first molding member (470-1) may be formed such that a portion of the first molding member (470-1) surrounds a third portion (e.g., the third portion (315c) of FIG. 7A ) of a flexible substrate (e.g., the flexible circuit board (315) of FIG. 7A ). According to one embodiment, the first molding member (470-1) may be formed to have sufficient strength (e.g., hardness) to protect the third portion (e.g., the third portion (315c) of FIG. 7A ) of the flexible substrate (e.g., the flexible circuit board (315) of FIG. 7A ).

[0208] According to one embodiment, the first material (or first molding liquid) constituting the first molding member (470-1) may be made of a material having a higher hardness than the second material (or second molding liquid) constituting the second molding member (470-2). For example, based on the hardness measured by the Shore D method, the hardness of the first material may be about 70 to about 85, and the hardness of the second material may be about 40 to about 60. For example, the elastic modulus of the first material may exceed about 600 Mpa, and the elastic modulus of the second material may be about 600 Mpa or less. For example, the tensile strength of the first material may be about 32 to about 47, and the tensile strength of the second material may be about 8 to about 15.

[0209] The aspects of the present disclosure are intended to address at least the problems and / or shortcomings described above and provide at least the advantages described below. However, the problems addressed by the present disclosure are not limited to the aforementioned problems and may be varied without departing from the spirit and scope of the present disclosure.

[0210] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.

[0211] The molding member of the present disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0212] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0213] According to the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (220; 320; 403) including a rear plate (211), a display assembly (301; 401) disposed on the housing opposite the rear plate, and a molding member (370; 470). The display assembly may include a display panel (317), a conductive layer (311) disposed on a side of the display panel toward the rear plate, and a flexible substrate (315). The flexible substrate may include a first region (315a) connected to the display panel, a second region (315b) disposed on the side of the display panel toward the rear plate, and a third region (315c) disposed between the first region and the second region and having at least a portion of the third region bent. The molding member may be arranged to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer, and may include an inclined region (371b) in the edge region.

[0214] According to one embodiment, the conductive layer includes a recessed region (311a) formed in an edge region, and the molding member may be arranged to surround at least a portion of the recessed region. The inclined region may have a shape in which the height decreases toward a portion around the recessed region.

[0215] According to one embodiment, when viewed in a direction in which the display assembly is arranged relative to the rear plate, at least a portion of the recessed area may at least partially overlap the inclined area.

[0216] In one embodiment, another portion of the recessed area may not overlap the inclined area when viewed in a direction in which the display assembly is arranged relative to the rear plate.

[0217] According to one embodiment, the inclined region may include a first inclined region (3701b) forming a first angle (α1) with respect to the rear plate direction surface of the conductive layer, and a second inclined region (3702b) forming a second angle (α2) different from the first angle with respect to the rear plate direction surface of the conductive layer.

[0218] According to one embodiment, the recessed area may include a first recessed area (3111a) having a first width (d1), and a second recessed area (3112a) disposed toward a direction in which the display panel is disposed with respect to the first recessed area and having a second width (d2) smaller than the first width.

[0219] According to one embodiment, the recessed area may include a first recessed area (3111a) having a first width (d1), and a second recessed area (3112a) disposed in a direction in which the display panel is disposed with respect to the first recessed area and having a second width (d2) greater than the first width.

[0220] According to one embodiment, the second recessed region may be connected to the first recessed region and form a step structure together with the first recessed region.

[0221] According to one embodiment, the recessed region may include a hole formed through the conductive layer from the rear plate-facing side to the display panel-facing side of the conductive layer.

[0222] According to one embodiment, the conductive layer may include a protruding structure (3113, 3114) formed on a portion of the surface including the recessed area, or may further include a primer layer (PL) disposed between a portion of the conductive layer including the recessed area and the molding member.

[0223] According to one embodiment, the molding member may include a second molding portion (372) disposed in the recessed area and a first molding portion (371) extending from the second molding portion and having a harderness greater than that of the second molding portion and having the inclined area formed therein.

[0224] In one embodiment, a portion of the molding member may be disposed between a side wall of the housing and the third region so as to surround at least a portion of the third region of the flexible substrate.

[0225] According to one embodiment, the display assembly further comprises a front plate (202; 302) disposed on a surface facing the outside of the electronic device and at least partially transparent, wherein a portion of the molding member surrounding at least a portion of the third region of the flexible substrate may be disposed on a portion of the rear plate-facing surface of the front plate.

[0226] According to one embodiment, the housing includes a support structure (221) at least partially facing the display assembly and a side structure (222; 322) disposed at an edge of the support structure, and a portion of the molding member may be disposed between the side structure and the display assembly.

[0227] According to one embodiment, the molding member may further include a waterproof member (380; 480) attached to a portion of the rear plate-facing surface of the molding member and the rear plate-facing surface of the conductive layer.

[0228] According to one embodiment, the molding member may include a first molding member (370-1) including a portion that surrounds at least a portion of the third region of the flexible substrate, and a second molding member (370-2) having a lower hardness than the first molding member and positioned along at least a portion of an edge of the display assembly.

[0229] According to the present disclosure, an electronic device (101) may be provided. The electronic device may include a housing (403) including a first housing (410) and a second housing (420) rotatably connected to the first housing (410) and rear plates (413, 423) disposed on a first rear surface (410b) of the first housing and a second rear surface (420b) of the second housing, a flexible display (401) disposed in the housing, and a molding member (370; 470). The flexible display may include a display panel (317), a conductive layer (311) disposed on a surface of the display panel facing the rear plate, and a flexible substrate (315). The flexible substrate may include a first region (315a) connected to the display panel, a second region (315b) disposed on the rear plate-facing side of the display panel, and a third region (315c) disposed between the first region and the second region and having at least a portion of the third region bent. The molding member may be disposed to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer, and may include an inclined region (371b) in an edge region.

[0230] An electronic device comprising a molding member (370) arranged to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer and including an inclined region (371b) in an edge region.

[0231] According to one embodiment, the conductive layer may include a recessed region (311a) formed in an edge region. The molding member may be arranged to surround at least a portion of the recessed region. The inclined region may have a shape in which the height decreases toward a portion surrounding the recessed region.

[0232] According to one embodiment, the molding member may include a first molding member (370-1) including a portion that surrounds at least a portion of the third region of the flexible substrate, and a second molding member (370-2) having a lower hardness than the first molding member and positioned along at least a portion of an edge of the flexible display.

[0233] According to one embodiment, the flexible display includes a first display area (A1), a bending area (A3) including one end extending from the first display area, and a second display area (A2) extending from the other end of the bending area, and a portion of the second molding member may be disposed along both side ends extending between the one end and the other end of the bending area.

[0234] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0235] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0236] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0237] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0238] According to one embodiment, the method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0239] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Housing (220; 320; 403) including a back plate (211); A display assembly (301; 401) disposed on the opposite side of the rear plate in the housing, comprising a display panel (317), a conductive layer (311) disposed on the rear plate-facing side of the display panel, and a flexible substrate (315), wherein the flexible substrate comprises a first region (315a) connected to the display panel, a second region (315b) disposed on the rear plate-facing side of the display panel, and a third region (315c) disposed between the first region and the second region and at least a portion of which is bent; and An electronic device comprising a molding member (370; 470) arranged to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer and including an inclined region (371b) in an edge region.

2. In paragraph 1, The above-mentioned conductive layer includes a recessed region (311a) formed in an edge region, and the molding member is arranged to surround at least a portion of the recessed region. An electronic device wherein the above-mentioned inclined region is in a form in which the height decreases toward a portion around the above-mentioned recessed region.

3. In paragraph 2, An electronic device, wherein when viewed in a direction in which the display assembly is arranged with respect to the rear plate, at least a portion of the recessed area at least partially overlaps the inclined area.

4. In paragraph 2, An electronic device, wherein another portion of the recessed area does not overlap with the inclined area when viewed in the direction in which the display assembly is arranged with respect to the rear plate.

5. In any one of paragraphs 2 to 4, An electronic device, wherein the recessed area includes a first recessed area (3111a) having a first width (d1), and a second recessed area (3112a) disposed toward a direction in which the display panel is disposed with respect to the first recessed area and having a second width (d2) smaller than the first width.

6. In any one of paragraphs 2 to 4, An electronic device, wherein the recessed area includes a first recessed area (3111a) having a first width (d1), and a second recessed area (3112a) disposed in a direction in which the display panel is disposed with respect to the first recessed area and having a second width (d2) greater than the first width.

7. In paragraph 5 or 6, An electronic device wherein the second recessed area is connected to the first recessed area and forms a step structure together with the first recessed area.

8. In any one of paragraphs 2 to 7, An electronic device wherein the recessed area includes a hole formed through the conductive layer from the rear plate-facing side to the display panel-facing side of the conductive layer.

9. In any one of paragraphs 2 to 8, An electronic device wherein the conductive layer further comprises a surface-formed rough structure (3113, 3114) including the recessed area, or a primer layer (PL) disposed between a portion of the conductive layer including the recessed area and the molding member.

10. In any one of paragraphs 2 to 9, The above molding member comprises a second molding portion (372) arranged in the recess area; and An electronic device comprising a first molding portion (371) extending from the second molding portion, having a harderness greater than that of the second molding portion, and having the inclined region formed therein.

11. In any one of paragraphs 1 to 10, An electronic device, wherein the inclined region includes a first inclined region (3701b) forming a first angle (α1) with respect to the rear plate direction surface of the conductive layer and a second inclined region (3702b) forming a second angle (α2) different from the first angle with respect to the rear plate direction surface of the conductive layer.

12. In any one of paragraphs 1 to 11, An electronic device wherein a portion of the molding member is disposed between a side wall of the housing and the third region so as to surround at least a portion of the third region of the flexible substrate.

13. In paragraph 12, An electronic device further comprising a front plate (202; 302) disposed on a surface facing the outside of the electronic device of the display assembly and at least partially transparent, wherein a portion of the molding member surrounding at least a portion of the third region of the flexible substrate is disposed on a portion of the rear plate-facing surface of the front plate.

14. In any one of paragraphs 1 to 13, An electronic device further comprising a waterproof member (380; 480) attached to the rear plate-facing surface of the molding member and a portion of the rear plate-facing surface of the conductive layer.

15. In the electronic device (101), A housing (403) including a first housing (410), a second housing (420) rotatably connected to the first housing (410), and a rear plate (413, 423) disposed on a first rear surface (410b) of the first housing and a second rear surface (420b) of the second housing; A flexible display (401) disposed in the housing, comprising a display panel (317), a conductive layer (311) disposed on the rear plate-facing side of the display panel, and a flexible substrate (315), wherein the flexible substrate comprises a first region (315a) connected to the display panel, a second region (315b) disposed on the rear plate-facing side of the display panel, and a third region (315c) disposed between the first region and the second region and having at least a portion of which is bent; and An electronic device comprising a molding member (370) arranged to surround at least a portion of the third region of the flexible substrate and at least a portion of the conductive layer and including an inclined region (371b) in an edge region.

Images