Antenna module and electronic device comprising same

Abstract

This electronic device comprises: an antenna module; and a wireless communication circuit configured to communicate with an external electronic device through the antenna module. The antenna module comprises: an antenna; a first layer including a plurality of conductive patterns for adjusting the phase of a surface wave radiated from the antenna; a second layer including a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer; and a third layer including a ground area and a feed line for electrically connecting the antenna and the wireless communication circuit. The second layer is disposed between the antenna and the third layer.

Description

Antenna module and electronic device including the same

[0001] The present disclosure relates to an antenna module and an electronic device including the same.

[0002] An electronic device may include an antenna module for communicating with an external electronic device. The antenna module may be configured to receive a signal transmitted from the external electronic device and / or transmit a signal to the external electronic device. For example, the antenna module may include a holographic antenna. The antenna module may be disposed within a housing forming the exterior of the electronic device. The housing may be formed of a conductive material, such as metal.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is provided. The electronic device may include an antenna module. The electronic device may include a wireless communication circuit configured to communicate with an external electronic device via the antenna module. The antenna module may include an antenna, a first layer including a plurality of conductive patterns for controlling the phase of a surface wave radiated from the antenna, a second layer including a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer, and a third layer including a ground region and a feed line for electrically connecting the antenna and the wireless communication circuit. The second layer may be disposed between the antenna and the third layer.

[0005] An antenna module is provided. The antenna module may include an antenna. The antenna module may include a first layer including a plurality of conductive patterns for controlling the phase of a surface wave radiated from the antenna. The antenna module may include a second layer including a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer. The antenna module may include a third layer including a ground region and a feed line for a feed signal provided to the antenna. The second layer may be disposed between the antenna and the third layer.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2a illustrates an antenna module in one embodiment.

[0008] Figure 2b illustrates a unit cell of the antenna module of Figure 2a.

[0009] Figure 2c is a graph showing the reactance value of a unit cell according to the spacing between multiple conductive patterns.

[0010] FIG. 3 illustrates an electronic device and an antenna module disposed within the electronic device according to one embodiment.

[0011] FIG. 4A is a perspective view of an antenna module according to one embodiment.

[0012] FIG. 4b is an exploded perspective view of an antenna module according to one embodiment.

[0013] FIG. 4c is a cross-sectional view of an antenna module according to one embodiment taken along line A-A' of FIG. 4a.

[0014] Fig. 5a is a graph showing the reflection coefficient of an antenna module according to a comparative example that does not include AMC.

[0015] Figure 5b shows the radiation pattern of an antenna module according to a comparative example that does not include AMC.

[0016] FIG. 5c is a graph showing the reflection coefficient of an antenna module according to one embodiment including AMC.

[0017] FIG. 5d illustrates a radiation pattern of an antenna module according to one embodiment including an AMC.

[0018] FIG. 6A illustrates a unit cell of an antenna module according to one embodiment.

[0019] FIG. 6b illustrates an antenna module according to one embodiment, wherein the first layer is omitted.

[0020] Figure 7a illustrates changes in the radiation pattern of an antenna module according to the arrangement structure of multiple conductive patterns.

[0021] Figure 7b illustrates examples of antenna modules forming the radiation pattern illustrated in Figure 7a.

[0022] FIG. 8A illustrates an antenna module according to one embodiment.

[0023] Fig. 8b is a graph showing the reflection coefficient and transmission coefficient of the antenna module of Fig. 8a.

[0024] FIG. 9 illustrates an antenna module according to one embodiment.

[0025] FIGS. 10A and 10B illustrate shapes of conductive patterns of antenna modules according to various embodiments.

[0026] FIGS. 11A and 11B illustrate shapes of AMCs of antenna modules according to various embodiments.

[0027] FIG. 12 is a cross-sectional view of an antenna module according to one embodiment taken along line A-A' of FIG. 4a.

[0028] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] Fig. 2a illustrates an antenna module according to one embodiment. Fig. 2b illustrates a unit cell of the antenna module of Fig. 2a. Fig. 2c is a graph showing the reactance value of the unit cell according to the spacing between a plurality of conductive patterns.

[0052] Referring to FIG. 2A, an electronic device (e.g., the electronic device (101) of FIG. 1) according to one embodiment may include an antenna module (200). A wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) of the electronic device (101) may be configured to wirelessly communicate with an external electronic device using the antenna module (200). The wireless communication circuit may transmit a wireless signal to the external electronic device or receive a wireless signal from the external electronic device using the antenna module (200).

[0053] According to one embodiment, the antenna module (200) may include a holographic antenna. A holographic antenna is an antenna including a holographic metasurface (HM) for forming a beam (202) by controlling the phase of a surface wave (201).

[0054] According to one embodiment, an antenna module (200) (e.g., a holographic antenna) may include an antenna (210) and a substrate (220). The antenna (210) is a physical component that transmits and / or receives electromagnetic waves and may include a radiator, which is a conductive structure for radiating electromagnetic waves (e.g., surface waves (201)). The antenna (210) may radiate electromagnetic waves based on a feed signal provided from a wireless communication circuit through the substrate (220). In the case of a holographic antenna, the antenna (210) may be configured to radiate electromagnetic waves that propagate horizontally on the surface of the substrate (220) rather than radiating electromagnetic waves into space. The above electromagnetic wave may be referred to as a surface wave (201) from the perspective of propagating along the surface of the substrate (220), and the antenna (210) may be referred to as a surface wave launcher (SWL) from the perspective of radiating the surface wave (201). For example, the antenna (210) may include, but is not limited to, a dipole antenna, a monopole antenna, and a patch antenna.

[0055] According to one embodiment, the antenna module (200) may include a holographic meta surface. The holographic meta surface may be disposed on an outer surface of a substrate (220) through which a surface wave (201) propagates. The holographic meta surface may include a plurality of conductive patterns (230) having electrical conductivity. The plurality of conductive patterns (230) may be used to form a beam (202) by controlling the phase of a surface wave (201) radiated from the antenna (210).

[0056] According to one embodiment, the antenna (210) may be disposed at a central portion of the substrate (220). A surface wave (201) radiated from the antenna (210) may propagate from the central portion of the substrate (220) along the outer surface of the substrate (220) toward the edge of the substrate (220), like a leaky wave. A plurality of conductive patterns (230) may be disposed on the outer surface of the substrate (220) to have a constant period. The phase of the surface wave (201) may be changed when passing through the plurality of conductive patterns (230). The holographic antenna may be configured to form a beam (202) having directivity in a specified direction by adjusting the phase of the surface wave (201) through the plurality of conductive patterns (230) forming the holographic metasurface. The surface wave (201) may be referred to as a reference wave, and the beam (202) may be referred to as an object wave.

[0057] According to one embodiment, the antenna module (200) may include a plurality of unit cells (e.g., a plurality of unit cells (240) of FIG. 2B) defined by a plurality of conductive patterns (230) arranged to have a constant period. The plurality of unit cells (240) may have a rectangular parallelepiped shape, which is a basic block constituting the plurality of conductive patterns (230) and includes one conductive pattern for each of the plurality of unit cells (240). Depending on the position of each of the plurality of unit cells (240), the size of each conductive pattern of the plurality of conductive patterns (230) may be determined.

[0058] For example, in order to form a beam (202) having directivity in a specified direction from a surface wave (201), an electric field distribution may be set according to a position on the outer surface of a substrate (220) on which the surface wave (201) propagates. Each of a plurality of conductive patterns (230) may be arranged at a specified position based on a constant cycle. In order to form the electric field distribution, a target phase of the surface wave (201) for forming the electric field distribution may be set for each position of a plurality of unit cells (240). In order to adjust the phase of the surface wave (201) to the target phase set at the specified position, a specified reactance value may be assigned to each of the plurality of unit cells (240). Each of the plurality of conductive patterns (230) may be configured to have a size based on the reactance value.

[0059] Referring to FIG. 2B, each conductive pattern (e.g., conductive pattern (231)) of the plurality of conductive patterns (230) may have a size such that a corresponding unit cell (e.g., unit cell (241)) including the conductive pattern (231) has a designated reactance value. The phase of a surface wave (e.g., surface wave (201) of FIG. 2A) may be changed to a target phase at a corresponding position by each conductive pattern of the plurality of conductive patterns (230). According to one embodiment, a beam (e.g., beam (202) of FIG. 2A) having directivity in a designated direction at a position having the same phase may be formed. An antenna module (e.g., antenna module (200) of FIG. 2A) may be configured to transmit and / or receive a signal in a millimeter wave or terahertz frequency band via the beam (202). Holographic antennas can transmit and / or receive signals in high frequency bands, can precisely control the direction and intensity of signals, and can be small and lightweight, making them suitable for portable devices (e.g., smartphones).

[0060] According to one embodiment, the phase of the surface wave (201) can be controlled by a conductive pattern (231) included in a unit cell (241). The position of each of the plurality of conductive patterns (230) can be distinguished according to the position (e.g., position coordinates) of each of the plurality of unit cells (240). For each position of a plurality of unit cells (240), a target phase of a surface wave (201) for forming a beam (202) can be set. For example, at a position where a unit cell (241) is arranged, the phase of the surface wave (201) can be adjusted by a conductive pattern (231) included in the unit cell (241). Through phase adjustment at each position where a plurality of unit cells (240) are arranged, a beam (202) having directivity in a designated direction can be formed overall. A unit cell (241) including one conductive pattern (e.g., conductive pattern (231)) can have an approximately rectangular parallelepiped shape and can be in contact with four other surrounding unit cells (242, 243, 244, 245).

[0061] According to one embodiment, a first gap (g1) between an edge of a unit cell (241) and an edge of one conductive pattern (231) included in the unit cell (241) may correspond to half of a second gap (g2) between a plurality of conductive patterns (230). When the second gap (g2) between a plurality of conductive patterns (230) is g, the first gap (g1) between an edge of a unit cell (241) and an edge of a conductive pattern (231) may be referred to as g / 2. Depending on the resonance frequency of the signal, a reactance value of the unit cell (241) may be set to adjust the phase of the surface wave (201) to a target phase at a designated location.

[0062] Referring to FIG. 2C, a reactance value of a unit cell (e.g., a unit cell (241) of FIG. 2B) can be determined based on a second spacing (e.g., a second spacing (g2) of FIG. 2B) between a plurality of conductive patterns (e.g., a plurality of conductive patterns (230) of FIG. 2B). A graph (250) of FIG. 2C represents a reactance value of a unit cell according to the second spacing (g2) between a plurality of conductive patterns (230). The x-axis of the graph (250) represents the second spacing (g2) (unit: millimeter) between the plurality of conductive patterns (230), and the y-axis of the graph (250) represents the reactance value of the unit cell (unit: ohm). Referring to the graph (250) of FIG. 2c, as the second spacing (g2) between the plurality of conductive patterns (230) increases, the reactance value of the unit cell may approximately decrease. When an electric field distribution for forming a beam (e.g., beam (202) of FIG. 2a) having directivity in a specified direction is determined, a reactance value may be determined for each position of the plurality of unit cells (e.g., the plurality of unit cells (240) of FIG. 2b) based on the electric field distribution. When the reactance value of each of the plurality of unit cells (240) is determined, the second spacing (g2) between the plurality of conductive patterns (230) may be determined based on the reactance value. Since the second interval (g2) between the plurality of conductive patterns (230) corresponds to twice the first interval (g1) of FIG. 2B, the size of the conductive pattern (e.g., the conductive pattern (231) of FIG. 2B) included in the unit cell (241) can be determined.

[0063] As described above, the antenna module (e.g., the antenna module (200) of FIG. 2A) may be a holographic antenna configured to form a beam (e.g., the beam (202) of FIG. 2A) having directivity in a specified direction from a surface wave (e.g., the surface wave (201) of FIG. 2A) radiated from the antenna (e.g., the antenna (210) of FIG. 2A). A plurality of conductive patterns (e.g., the plurality of conductive patterns (230) of FIG. 2A) disposed on a surface of a substrate (e.g., the substrate (220) of FIG. 2A) may be configured to form the beam (202) by controlling the phase of the surface wave (201).

[0064] FIG. 3 illustrates an electronic device and an antenna module disposed within the electronic device according to one embodiment.

[0065] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a housing (303) that defines an exterior appearance of the electronic device (101). For example, the housing (303) may include an edge part that forms at least a portion of a side surface of the electronic device (101) and a cover plate (304) that forms at least a portion of a rear surface (e.g., a surface facing the -z direction) of the electronic device (101). The cover plate (304) may be referred to as a rear cover or a back cover in terms of forming at least a portion of the rear surface of the electronic device (101). For example, a display may be disposed on the opposite side of the cover plate (304).

[0066] According to one embodiment, components of the electronic device (101) may be disposed within the housing (303). For example, a printed circuit board (301) having at least one processor (e.g., processor (120) of FIG. 1), wireless communication circuitry (e.g., wireless communication module (192) of FIG. 1), and an antenna module (200) disposed thereon may be disposed within the housing (303). The antenna module (200) may include a holographic antenna as described with reference to FIGS. 2A, 2B, and 2C.

[0067] Any function or operation described herein may be processed by at least one processor (120). According to one embodiment, at least one processor (120) may include a processing circuit. At least one processor (120) may include, but is not limited to, an application processor (AP, e.g., a central processing unit (CPU)) and / or a communication processor (CP, e.g., a modem). At least one processor (120) may include a graphics processing unit (e.g., a GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless-fidelity (Wi-Fi) chip, a Bluetooth chip®, a global positioning system (GPS) chip, a near field communication (NFC) chip, connectivity chips, a sensor controller, a touch controller, a finger-print sensor controller, a display drive integrated circuit (DDI), an audio CODEC chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an integrated circuit (IC), or a similar circuit.

[0068] According to one embodiment, the housing (303) may be formed from a metal material for the durability, appearance quality, and ease of manufacturing of the electronic device (101). For example, the cover plate (304) exposed to the outside may be formed from a lightweight and durable metal material, such as titanium or aluminum. Since the metal material has electrical conductivity, electrical interaction may occur between the electronic components disposed within the housing (303) and the housing (303). For example, the antenna module (200) disposed within the housing (303) may be configured to radiate and / or receive a radio signal for wireless communication with an external electronic device. When the antenna module (200) is disposed to face the cover plate (304), the metal material forming the cover plate (304) may have an electromagnetic effect on the radiation pattern (302) formed by the antenna module (200). The above electromagnetic influence may deteriorate the communication performance of the antenna module (200) by interfering with the transmission and / or reception of wireless signals, causing distortion of the radiation pattern (302) formed by the antenna module (200), and causing noise.

[0069] According to one embodiment, the antenna module (200) may include a ground region (e.g., the ground region (331) of FIG. 4B) to reduce deterioration of communication performance. By the ground region (331), the noise due to the electromagnetic influence may be reduced. When the antenna module (200) includes the ground region (331), problems such as impedance mismatch, reduced efficiency of the antenna module (200) due to interference of the surface wave, and reduced bandwidth may occur as the ground region (331) is adjacent to an antenna configured to radiate a surface wave (e.g., the antenna (210) of FIG. 2A). For example, when an electromagnetic wave is reflected at the ground region (331), the phase of the reflected electromagnetic wave may cause interference with the surface wave.

[0070] An antenna module (200) according to one embodiment may include a plurality of artificial magnetic conductors (AMCs) (e.g., a plurality of artificial magnetic conductors (321) of FIG. 4B) disposed between the antenna (210) and the ground region (331) to reduce the influence of the ground region (331) on the antenna (210). The plurality of AMCs (321) may reduce the influence of the ground region (331). An antenna module (200) according to one embodiment may include a ground region (331) to reduce the deterioration of communication performance due to the housing (303), and may include a plurality of AMCs (321) to reduce the influence between the ground region (331) and the antenna (210).

[0071] Below, the structure of an antenna module (200) according to one embodiment is described.

[0072] Fig. 4a is a perspective view of an antenna module according to one embodiment. Fig. 4b is an exploded perspective view of an antenna module according to one embodiment. Fig. 4c is a cross-sectional view of an antenna module according to one embodiment taken along line A-A' of Fig. 4a.

[0073] Referring to FIG. 4A, the antenna module (200) may include the holographic antenna described with reference to FIGS. 2A, 2B, and 2C. The antenna module (200) may include a plurality of conductive patterns (230). The same reference numerals may be assigned to the same components as described above, and any redundant descriptions may be omitted.

[0074] In one embodiment, the antenna (210) may include a dipole antenna. In one embodiment, the dipole antenna may have an offset feed structure. For example, the dipole antenna may include a first conductive portion (211) and a second conductive portion (212). The dipole antenna may have a feed point (213) positioned at a position offset from a center portion between the first conductive portion (211) and the second conductive portion (212). By feeding the feed point (213), the dipole antenna may be configured to radiate a surface wave. For example, to match a 50 ohm impedance, the feed point (213) offset from the center portion may be fed.

[0075] Referring to FIG. 4B, an antenna module (200) according to one embodiment may include an antenna (210), a first layer (310), a second layer (320), and a third layer (330). The antenna module (200) may include a first substrate (e.g., the first substrate (221) of FIG. 4C) and a second substrate (e.g., the second substrate (222) of FIG. 4C) that are stacked on each other. The second substrate (222) may be stacked on the first substrate (221). The first layer (310), the second layer (320), and the third layer (330) may be layers of the first substrate (221) or the second substrate (222).

[0076] According to one embodiment, the antenna (210) may be configured to be powered by a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) and radiate surface waves. The antenna (210) may include, but is not limited to, a dipole antenna. For example, the antenna (210) may be disposed on the first layer (310). The surface waves radiated from the antenna (210) may propagate along the surface of the first layer (310).

[0077] According to one embodiment, the first layer (310) may include a plurality of conductive patterns (230) for phase control of surface waves radiated from the antenna (210). The plurality of conductive patterns (230) may form a holographic metasurface.

[0078] According to one embodiment, the plurality of conductive patterns (230) may be configured to form a beam having directivity in a designated direction by controlling the phase of the surface wave. As described above, in order to form the beam, if an electric field distribution is set for each position of the first layer (310), a target phase may be set for each position based on the electric field distribution. The sizes of the plurality of conductive patterns (230) may be set based on the target phase. Since the phase of the surface wave at a specific position changes over time, the amount of phase change may be different depending on a reference point in time for having the target phase at each position. According to one embodiment, the reference point in time may be set so that the conductive pattern arranged around the antenna (210) may have a relatively small size. When the size of the conductive pattern around the antenna (210) is small, the electromagnetic coupling between the antenna (210) and the conductive pattern may be reduced.

[0079] According to one embodiment, the second layer (320) may be disposed below the first layer (310) (e.g., in the -z direction). The second layer (320) may include a plurality of AMCs (321). An artificial magnetic conductor (AMC) is a metamaterial having properties similar to a perfect magnetic conductor (PMC) that does not exist in nature. An AMC has a high surface impedance at a specified frequency, thereby reflecting an electromagnetic wave of the same phase for a signal of a specified frequency. The plurality of AMCs (321) may have substantially the same shape. For example, the plurality of AMCs (321) may have a rectangular patch shape, but is not limited thereto.

[0080] According to one embodiment, the third layer (330) may include a ground region (331) and a feed line (332). The feed line (332) may electrically connect the antenna (210) and the wireless communication circuit. A feed signal provided from the wireless communication circuit may be provided to the antenna (210) through the feed line (332). The antenna module (200) may include a feed port (340) electrically connected to the wireless communication circuit. The feed line (332) may be configured to extend from the feed port (340) to the antenna (210) and electrically connect the feed port (340) and the antenna (210). For example, the feed line (332) may include a coplanar waveguide (CPW) disposed substantially on the same plane as the ground region (331). CPW can provide high space utilization, ease of manufacturing, low transmission loss, and excellent shielding performance as the signal line and ground area (331) are arranged on substantially the same plane.

[0081] According to one embodiment, a second layer (320) including a plurality of AMCs (321) may be disposed between the antenna (210) and the third layer (330). As the second layer (320) is disposed between the antenna (210) and the second layer (320) including the ground region (331), problems due to the proximity of the ground region (331) and the antenna (210) may be reduced. For example, the plurality of AMCs (321) may improve impedance matching of the antenna (210) and enable surface waves radiated from the antenna (210) to propagate entirely on the first layer (310). If the antenna module (200) does not include a plurality of AMCs (321), the gap between the antenna (210) and the ground area (331) must be increased to reduce performance degradation of the antenna module (200) due to the ground area (331), and thus the thickness of the antenna module (200) may become relatively thick. According to one embodiment, as the second layer (320) including a plurality of AMCs (321) is placed between the antenna (210) and the third layer (330), the thickness of the antenna module (200) may be formed relatively thin.

[0082] Referring to FIG. 4C, the antenna module (200) may include a first substrate (221) and a second substrate (222). For example, the second substrate (222) may be laminated on the first substrate (221). For example, the second substrate (222) may be attached to the top (e.g., in the +z direction) of the first substrate (221) via an adhesive layer (350). The first substrate (221) and the second substrate (222) may include a plurality of layers. The above-described first layer (310), second layer (320), and third layer (330) may be implemented as a plurality of layers of the first substrate (221) and / or a plurality of layers of the second substrate (222). For example, as illustrated in FIG. 4C, the first layer (310) including a plurality of conductive patterns (230) may be a layer disposed on the upper surface of the second substrate (222). The antenna (210) may be disposed on substantially the same plane as the first layer (310). For example, the antenna (210) may be positioned on the first layer (310) and may be disposed substantially parallel to the plurality of conductive patterns (230). The third layer (330) may be a layer disposed on the lower surface of the first substrate (221). The second layer (320) disposed between the first layer (310) and the third layer (330) may be disposed, for example, on the upper surface of the first substrate (221). However, the above-described structure is merely exemplary, and embodiments within the present disclosure are not limited thereto. Another embodiment of a structure different from the embodiment illustrated in FIG. 4c will be described later with reference to FIG. 12.

[0083] In one embodiment, the antenna (210) may include a dipole antenna. For example, the antenna (210) may be a dipole antenna including a first conductive portion (211) and a second conductive portion (212). The first substrate (221) and the second substrate (222) may include a feed line (e.g., the feed line (332) of FIG. 4B) included in the third layer (330) and a conductive via (360) connected to the dipole antenna. For example, the conductive via (360) may include a first conductive via (361) connecting the feed line (332) and the first conductive portion (211) and a second conductive via (362) connecting the feed line (332) and the second conductive portion (212). When a power supply signal is provided to the first conductive portion (211) and the second conductive portion (212) through the power supply line (332), a surface wave propagating along the first layer (310) can be radiated from the first conductive portion (211) and the second conductive portion (212). By adjusting the phase of the surface wave through the plurality of conductive patterns (230) arranged on the first layer (310), a beam having directivity in a designated direction can be formed. The antenna module (200) can be configured to transmit a wireless signal from an external electronic device or receive a wireless signal to an external electronic device through the beam.

[0084] According to one embodiment, the antenna module (200) includes a ground region (e.g., the ground region (331) of FIG. 4B) included in the third layer (330), and thus can reduce degradation of communication performance caused by the housing (e.g., the housing (303) of FIG. 3). Due to the ground region (331) included in the antenna module (200), distortion of the radiation pattern can be reduced and noise can be reduced. Since the ground region (331) is included in the antenna module (200), the antenna module (200) can include a plurality of AMCs (321) arranged between the antenna (210) and the ground region (331) to reduce interference between the antenna (210) and the ground region (331). The plurality of AMCs (321) can improve communication performance of the antenna module (200) by reducing interference between the antenna (210) and the ground region (331).

[0085] Fig. 5a is a graph showing the reflection coefficient of an antenna module according to a comparative example that does not include AMC. Fig. 5b shows the radiation pattern of an antenna module according to a comparative example that does not include AMC. Fig. 5c is a graph showing the reflection coefficient of an antenna module according to an embodiment that includes AMC. Fig. 5d shows the radiation pattern of an antenna module according to an embodiment that includes AMC.

[0086] As described above, an antenna module (e.g., antenna module (200) of FIG. 4A) according to one embodiment may include a ground area (e.g., ground area (331) of FIG. 4B) to reduce the influence of a housing (e.g., housing (303) of FIG. 3) of an electronic device (e.g., electronic device (101) of FIG. 3). As the ground area (331) and the antenna (e.g., antenna (210) of FIG. 4B) are adjacent to each other, the antenna module (200) may include a plurality of AMCs (e.g., a plurality of AMCs (321) of FIG. 4B) to reduce the influence of the ground area (331) on the antenna (210). A plurality of AMCs (321) arranged between the ground area (331) and the antenna (210) may be configured to reduce electromagnetic interaction between the antenna (210) and the ground area (331) by suppressing surface waves from propagating to the ground area (331) and shielding the influence of the ground area (331) on electromagnetic waves. If the antenna module (200) includes only the ground area (331) to reduce the influence of the housing (303), the gain of the antenna (210) may be reduced.

[0087] FIG. 5A is a graph (501) showing a reflection coefficient of an antenna module according to a comparative example that includes a ground region (331) and does not include an AMC. For example, the antenna module according to the comparative example may include a layer including a plurality of conductive patterns (230) and a layer including a ground region (331), and may not include a layer including an AMC. The x-axis of the graph (501) represents a frequency (unit: GHz), and the y-axis of the graph (501) represents an S-parameter (unit: dB (decibel)) of the antenna module according to the comparative example. The reflection coefficient is a parameter by which power provided to the antenna (210) along the feed line is not radiated but reflected, and the lower the reflection coefficient, the better the radiation performance of the antenna (210).

[0088] Referring to the graph (501) of FIG. 5A, for frequencies between about 12 GHz and about 15 GHz, the reflection coefficient of the antenna module according to the comparative example may be as high as about -3.40 dB or higher overall. Since the power provided to the antenna (210) of the antenna module according to the comparative example is not radiated through the antenna (210), the antenna module according to the comparative example may have a high reflection coefficient. The antenna module according to the comparative example may not be suitable for use in wireless communication with external electronic devices.

[0089] Referring to Fig. 5b, the radiation pattern (502) of the antenna module according to the comparative example may not have directivity and may have low gain. The radiation pattern (502) illustrated in Fig. 5b represents the radiation pattern of the antenna module according to the comparative example for a frequency of about 14 GHz. Referring to the radiation pattern (502), for a frequency band of about 14 GHz, the antenna module according to the comparative example may have a maximum gain of about -8.7 dBi (decibel isotropic).

[0090] As shown in the graph (501) of FIG. 5a and the radiation pattern (502) of FIG. 5b, as the ground area (331) is adjacent to the antenna (210), the impedance characteristics of the antenna (210) change, making impedance matching difficult, and the performance of the antenna module (200) may deteriorate due to distortion of the radiation pattern of the antenna (210) and power loss.

[0091] FIG. 5C is a graph (503) showing a reflection coefficient of an antenna module (e.g., antenna module (200) of FIG. 4A) according to one embodiment including a ground region (331) and an AMC. For example, the antenna module (200) according to one embodiment may include a first layer (e.g., first layer (310) of FIG. 4B) including a plurality of conductive patterns (230), a second layer (e.g., second layer (320) of FIG. 4B) including a plurality of AMCs (321), and a third layer (e.g., third layer (330) of FIG. 4B) including a ground region (331). The x-axis of the graph (503) represents a frequency (unit: GHz), and the y-axis of the graph (503) represents an S-parameter (unit: dB) of the antenna module according to a comparative example. Referring to the graph (503) of FIG. 5c, for frequencies between about 12 GHz and about 15 GHz, the reflection coefficient of the antenna module (200) according to one embodiment may be very low at about 13.5 GHz. For example, the reflection coefficient may be about -37 dB at a frequency of about 13.5 GHz. Since the antenna module (200) according to one embodiment exhibits a low reflection coefficient in a certain frequency range, it may be suitable for transmitting signals in the frequency range to external electronic devices.

[0092] Referring to FIG. 5d, the radiation pattern (504) of the antenna module according to the comparative example may have a high gain. The radiation pattern (504) illustrated in FIG. 5d represents the radiation pattern of the antenna module (200) according to one embodiment for a frequency of about 14 GHz. Referring to the radiation pattern (504), for a frequency band of about 14 GHz, the antenna module (200) may have a gain of up to about 5.3 dBi.

[0093] As shown in the graph (503) of FIG. 5c and the radiation pattern (504) of FIG. 5d, a plurality of AMCs (321) may be placed between the antenna (210) and the ground area (331) to reduce the deterioration of the communication performance of the antenna module (200) caused by the proximity of the ground area (331) to the antenna (210). The plurality of AMCs (321) may enable impedance matching of the antenna (210) by reducing the influence of the ground area (331) on the antenna (210), and may facilitate the radiation of power provided to the antenna (210). An antenna module (200) according to one embodiment can reduce deterioration of communication performance of the antenna module (200) due to a conductive material of a housing (303) by including a third layer (330) including a ground region (331), and at the same time reduce deterioration of communication performance of the antenna module (200) due to the ground region (331) by including a second layer (320) including a plurality of AMCs (321). An antenna module (200) according to one embodiment can provide improved communication performance.

[0094] FIG. 6A illustrates a unit cell of an antenna module according to one embodiment. FIG. 6B illustrates an antenna module according to one embodiment with the first layer omitted.

[0095] A plurality of conductive patterns (230) of an antenna module (200) according to one embodiment may have a layout structure for improving communication performance of the antenna module (200). Referring to FIG. 6A, a plurality of conductive patterns (230) arranged on a first layer (e.g., a first layer (310) of FIG. 4B) may be arranged to have a designated relative positional relationship with a plurality of AMCs (e.g., a plurality of AMCs (321) of FIG. 4B) arranged on a second layer (e.g., a second layer (320) of FIG. 4B).

[0096] The unit cell (600) illustrated in FIG. 6A may represent a layout structure of a plurality of conductive patterns (230) for a plurality of AMCs (321). The plurality of conductive patterns (230) may be arranged to have a constant period, and the unit cell (600) may be referred to as a basic block forming the constant period. Since the plurality of conductive patterns (230) are arranged to have a constant period, even if the plurality of conductive patterns (230) have different sizes, unit cells of a constant shape may be defined. Although one unit cell (600) is illustrated in FIG. 6A, a unit cell identical to the unit cell (600) may be defined for each of the plurality of conductive patterns (230).

[0097] According to one embodiment, the unit cell (600) is a basic block including one conductive pattern (e.g., conductive pattern (231)) among a plurality of conductive patterns (230) arranged on a first layer (310), and may be defined as a rectangular parallelepiped shape having a constant height, length, and width based on each of the conductive patterns. The first layer (310), the second layer (320), and the third layer (330) may be partially included within the unit cell (600). Within the present disclosure, the term 'sub-layer' may be used to indicate a portion of the first layer (310), a portion of the second layer (320), and a portion of the third layer (330) included within the unit cell (600). For example, a portion of the first layer (310) included within the unit cell (600) may be referred to as a first sub-layer (610). A part of the second layer (320) included in the unit cell (600) may be referred to as a second sub-layer (620). A part of the third layer (330) included in the unit cell (600) may be referred to as a third sub-layer (630).

[0098] Referring to FIG. 6a, a unit cell (600) may include four AMCs (640) and one conductive pattern (e.g., conductive pattern (231)). The one conductive pattern (231) within the unit cell (600) may overlap with vertices (641a, 642a, 643a, 644a) of the four AMCs (640).

[0099] For example, the unit cell (600) may include a first sub-layer (610) including one conductive pattern (231) among a plurality of conductive patterns (230) on a first layer (310). The unit cell (600) may include a second sub-layer (620) including four AMCs (640) overlapping one conductive pattern (231). For example, the unit cell (600) may include the second sub-layer (620) including a first AMC (641), a second AMC (642), a third AMC (643), and a fourth AMC (644) that are adjacent to each other. The first AMC (641), the second AMC (642), the third AMC (643), and the fourth AMC (644) may have substantially the same shape and may be spaced apart from each other.

[0100] For example, the first AMC (641), the second AMC (642), the third AMC (643), and the fourth AMC (644) may have a rectangular parallelepiped shape. Since the first AMC (641), the second AMC (642), the third AMC (643), and the fourth AMC (644) are adjacent to each other, the vertices of the first AMC (641), the second AMC (642), the third AMC (643), and the fourth AMC (644) may be adjacent to each other. For example, the first vertex (644a) of the first AMC (641), the second vertex (644b) of the second AMC (642), the third vertex (644c) of the third AMC (643), and the fourth vertex (644d) of the fourth AMC (644) may be adjacent to each other.

[0101] According to one embodiment, the unit cell (600) may include a third sub-layer (630) that is part of a third layer (330) that overlaps the first sub-layer (610) and the second sub-layer (620).

[0102] According to one embodiment, the conductive pattern (231) may be disposed on (e.g., in the +z direction) the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d). For example, when the first sub-layer (610) is viewed from above (e.g., when the first sub-layer (610) is viewed in the -z direction), the conductive pattern (231) may overlap the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d). Although one unit cell (600) is illustrated in FIG. 6A, all unit cells for a plurality of conductive patterns (230) may satisfy the above structure.

[0103] According to one embodiment, the size of the conductive pattern (231) included in the unit cell (600) may be based on a reactance value specified according to the position of the unit cell (600). The reactance value specified for the unit cell (600) may be referenced as a reactance value for adjusting the phase of the surface wave to a target phase. The position of the unit cell (600) may be referenced by a position coordinate assigned to a point (650) located at an equal distance from the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d) on the second sub-layer (620). The point (650) may correspond to the center of the unit cell (600) having a rectangular parallelepiped shape.

[0104] Referring to FIG. 6B, a plurality of unit cells having the same shape as the unit cell (e.g., the unit cell (600) of FIG. 6A) may have position coordinates assigned to points (e.g., the point (650) of FIG. 6A) located at the same distance from the vertices of four AMCs (e.g., the AMCs (640) of FIG. 6A), respectively. As in the example illustrated in FIG. 6B, when a plurality of AMCs (321) arranged in a 16×15 matrix are arranged, position coordinates from (1,1) to (15,14) may be assigned to each of the points. A conductive pattern (e.g., the conductive pattern (231) of FIG. 6A) may be arranged at each of the position coordinates.

[0105] According to one embodiment, when a surface wave is radiated from an antenna (210), the surface wave may propagate along the surface of a first layer (e.g., the first layer (310) of FIG. 4B). In order to form a beam having directivity in a specified direction from the surface wave, an electric field distribution may be set. In order to form the electric field distribution, a target phase may be determined for each position of the first layer (310) where the surface wave propagates. The target phase is a phase to be changed from the original phase of the surface wave, and if there is no phase adjustment, a beam having directivity cannot be formed because the surface wave propagates along the surface of the first layer (310). For example, in order to form the beam, a target phase may be determined for each position coordinate, and a reactance value may be calculated for each of a plurality of unit cells (e.g., the unit cell (600) of FIG. 6A) having different position coordinates in order to form the target phase. From the reactance value, the spacing between the plurality of conductive patterns (230) (e.g., the second spacing (e.g., the second spacing (g2) in FIG. 2B)) can be calculated, and thus, from the spacing between the edge of the unit cell (600) and the edge of the conductive pattern (e.g., the first spacing (g1) in FIG. 2B), the size of the conductive pattern can be determined. Since the size of the conductive pattern is determined according to the target phase for the position coordinates for forming the beam, the size of each of the plurality of conductive patterns (230) can be independent of each other.

[0106] An antenna module (200) according to one embodiment can improve communication performance through a plurality of conductive patterns (230) having the above-described arrangement structure.

[0107] Fig. 7a illustrates changes in the radiation pattern of an antenna module depending on the arrangement structure of multiple conductive patterns. Fig. 7b illustrates examples of antenna modules that form the radiation pattern illustrated in Fig. 7a.

[0108] As described above, a plurality of conductive patterns (e.g., a plurality of conductive patterns (230) of FIG. 4b) of an antenna module (e.g., an antenna module (200) of FIG. 4a) according to one embodiment may overlap vertices of four AMCs. Each conductive pattern of the plurality of conductive patterns (230) (e.g., a conductive pattern (231) of FIG. 6a) may overlap four vertices of four AMCs corresponding to the conductive pattern.

[0109] The radiation patterns illustrated in Fig. 7a indicate that the radiation patterns can be formed differently depending on the arrangement structure of the plurality of conductive patterns (230). The radiation patterns can be illustrated by connecting the gain values ​​of the antenna module (200) for 360 degrees, with the antenna module at the center. The antenna modules forming the radiation patterns illustrated in Fig. 7a are illustrated in Fig. 7b.

[0110] For example, the first radiation pattern (701) of FIG. 7A represents the radiation pattern of the antenna module (200) according to one embodiment illustrated in FIG. 7B. The antenna module (200) according to one embodiment may have a structure in which each conductive pattern of the plurality of conductive patterns (230) overlaps four vertices of four AMCs. As described above, the conductive patterns may be arranged on (e.g., in the +z direction) four adjacent vertices (e.g., the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d) of FIG. 6A).

[0111] For example, the second radiation pattern (702) of FIG. 7A represents the radiation pattern of the antenna module (711) according to the first comparative example illustrated in FIG. 7B. The antenna module (711) according to the first comparative example may have a structure in which each conductive pattern of the plurality of conductive patterns (230) overlaps two vertical sides of two AMCs among the plurality of AMCs (321). Referring to FIG. 7B, in the case of the antenna module (711) according to the first comparative example, the conductive patterns may be arranged on two vertical sides (e.g., sides in the y-axis direction) that are adjacent to each other (e.g., sides in the +z direction).

[0112] For example, the third radiation pattern (703) of FIG. 7A represents the radiation pattern of the antenna module (712) according to the second comparative example illustrated in FIG. 7B. The antenna module (712) according to the second comparative example may have a structure in which each conductive pattern of the plurality of conductive patterns (230) overlaps one AMC among the plurality of AMCs (321). Referring to FIG. 7B, in the case of the antenna module (712) according to the second comparative example, the conductive pattern may be placed on the AMC corresponding to the conductive pattern.

[0113] For example, the fourth radiation pattern (704) of FIG. 7A represents the radiation pattern of the antenna module (713) according to the third comparative example illustrated in FIG. 7B. The antenna module (713) according to the third comparative example may have a structure in which each conductive pattern of the plurality of conductive patterns (230) overlaps two horizontal sides of two AMCs among the plurality of AMCs (321). Referring to FIG. 7B, in the case of the antenna module (713) according to the third comparative example, the conductive patterns may be arranged on two adjacent horizontal sides (sides in the x-axis direction) (e.g., in the +z direction).

[0114] Comparing the radiation patterns illustrated in FIG. 7A, with respect to a main lobe having a directivity between about -30 degrees and about 30 degrees, the first radiation pattern (701) has a higher gain than the second radiation pattern (702), the third radiation pattern (703), and the fourth radiation pattern (704). For example, with respect to 0 degrees, the first radiation pattern (701) exhibits about 9 dBi, the second radiation pattern (702) exhibits about 7 dBi, the third radiation pattern (703) exhibits about 6 dBi, and the fourth radiation pattern (704) exhibits about -3 dBi. When comparing the radiation patterns, the antenna module (200) according to one embodiment has a higher gain than the antenna modules (200) according to the comparative example, and therefore, the antenna module (200) according to one embodiment can provide improved communication performance. Since electric and magnetic fields can be concentrated between the plurality of AMCs (321), electromagnetic waves can be efficiently radiated through conductive patterns overlapping the four AMCs. According to one embodiment, each conductive pattern of the plurality of conductive patterns (230) can be arranged on four vertices of the four AMCs, thereby providing improved communication performance.

[0115] Fig. 8a illustrates an antenna module according to one embodiment. Fig. 8b is a graph showing the reflection coefficient and transmission coefficient of the antenna module of Fig. 8a.

[0116] Although the antenna module (200) described above has been described as including a dipole antenna, embodiments of the present disclosure are not limited thereto. Referring to FIG. 8A, the antenna module (200) according to one embodiment may be configured to perform a multiple-input and multiple-output (MIMO) operation to increase data throughput. The antenna module (200) may include a plurality of conductive patches (810) for MIMO.

[0117] According to one embodiment, the antenna module (200) may include two or more feed ports. For example, the antenna module (200) may include a first conductive patch (811) and a second conductive patch (812) for MIMO that performs data transmission using a plurality of antennas. The first conductive patch (811) and the second conductive patch (812) may operate as a transmitting antenna and / or a receiving antenna. The antenna module (200) may include a first feed port electrically connected to the first conductive patch (811) and a second feed port electrically connected to the second conductive patch (812). The first feed port and the second feed port may be electrically connected to a printed circuit board (e.g., a printed circuit board (301) of FIG. 3) on which a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) is arranged. A plurality of conductive patterns (230) arranged on the first layer (310) of the antenna module (200) can be arranged so that a beam having a directivity in a specified direction can be formed from surface waves radiated from the first conductive patch (811) and the second conductive patch (812).

[0118] According to one embodiment, the first conductive patch (811) and the second conductive patch (812) can independently transmit and / or receive wireless signals. The first graph (831) of FIG. 8B represents a first reflection coefficient for the first conductive patch (811). The second graph (832) of FIG. 8B represents a second reflection coefficient for the second conductive patch (812). The third graph (833) of FIG. 8B represents a transmission coefficient for power input to the first feed port to be output from the second port. The x-axis of the graph (830) of FIG. 8B represents a frequency (unit: GHz), and the y-axis of the graph (830) represents an S-parameter (unit: dB).

[0119] Referring to FIG. 8B, the first graph (831) and the second graph (832) may have low reflection coefficients for frequencies between about 14 GHz and about 15 GHz. For example, the first graph (831) may have a reflection coefficient of about -28 dB at a frequency of about 14.2 GHz, and the second graph (832) may have a reflection coefficient of about -16 dB at a frequency of about 14.2 GHz. By virtue of the plurality of conductive patterns (230) on the first layer (310), each of the first conductive patch (811) and the second conductive patch (812) may operate as an antenna (210) radiator having a resonant frequency between about 14 GHz and about 15 GHz. Referring to the third graph (833), since it shows a transmission coefficient of about -18 dB to about -22 dB at a frequency between about 14 GHz and about 15 GHz, isolation between the first feed port and the second feed port may be possible at that frequency. According to one embodiment, since the interference between the first conductive patch (811) and the second conductive patch (812) is low and they may have the same resonant frequency, the antenna module (200) including the first conductive patch (811) and the second conductive patch (812) may be suitable for application to a MIMO system. The antenna module (200) may implement communication diversity by using the first conductive patch (811) and the second conductive patch (812) on a substrate (220) having a relatively narrow area (e.g., 20 mm × 20 mm), and thus space efficiency may be improved.

[0120] FIG. 9 illustrates an antenna module according to one embodiment.

[0121] Although the aforementioned antenna module (200) has been described as performing MIMO operation using two conductive patches (e.g., the first conductive patch (811) and the second conductive patch (812) of FIG. 8A), embodiments of the present disclosure are not limited thereto. Referring to FIG. 9, an antenna module (200) according to one embodiment may include four feed ports and four conductive patches (910).

[0122] According to one embodiment, the antenna module (200) may include a first conductive patch (911), a second conductive patch (912), a third conductive patch (913), and a fourth conductive patch (914). The first conductive patch (911), the second conductive patch (912), the third conductive patch (913), and the fourth conductive patch (914) may operate as a transmitting antenna and / or a receiving antenna. The antenna module (200) may include a first feed port electrically connected to the first conductive patch (911), a second feed port electrically connected to the second conductive patch (912), a third feed port electrically connected to the third conductive patch (913), and a fourth feed port electrically connected to the fourth conductive patch (914). The first feed port, the second feed port, the third feed port, and the fourth feed port may be electrically connected to a printed circuit board (220) on which a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) is arranged. The plurality of conductive patterns (230) arranged on the first layer (310) of the antenna module (200) may be arranged so that a beam having a directivity in a specified direction may be formed from surface waves radiated from the first conductive patch (911), the second conductive patch (912), the third conductive patch (913), and / or the fourth conductive patch (914). For example, two of the four conductive patches may operate as transmitting antennas (210), and the remaining two conductive patches may operate as receiving antennas (210), thereby implementing a 2×2 MIMO system through the antenna module (200).

[0123] When the electronic device (101) is a portable device (e.g., a smart phone), the size of the housing (303) may be limited. Since the internal space of the housing (303) is limited, the antenna module (200) can provide space efficiency by implementing communication diversity using the first conductive patch (911), the second conductive patch (912), the third conductive patch (913), and the fourth conductive patch (914) on a substrate (220) having a relatively narrow area (e.g., 20 mm × 20 mm).

[0124] FIGS. 10A and 10B illustrate shapes of conductive patterns of antenna modules according to various embodiments.

[0125] Each conductive pattern (231) of the plurality of conductive patterns (230) may have various shapes. For example, as illustrated in FIG. 4A, the conductive pattern (231) may have a rectangular shape, but is not limited thereto. Referring to FIG. 10A, the conductive pattern (231) may have a substantially circular shape. For example, the conductive pattern (231) may include a first portion (1010) and a second portion (1020) having a semicircular shape. The first portion (1010) and the second portion (1020) may be arranged to face each other. The arc portion (1011) of the first portion (1010) and the arc portion (1021) of the second portion (1020) may be opposite to each other, and the diameter portion (1012) of the first portion (1010) and the diameter portion (1022) of the second portion (1020) may face each other.

[0126] Referring to Fig. 10b, the conductive pattern (231) may have a shape in which some of the sides of the square are sunken toward the center. The shape of the conductive pattern (231) illustrated in Fig. 10b may be referred to as a clover shape, but is not limited thereto. In addition, the shape of the conductive pattern (231) may vary.

[0127] FIGS. 11A and 11B illustrate shapes of AMCs of antenna modules according to various embodiments.

[0128] Each AMC (1110) of the plurality of AMCs (e.g., the plurality of AMCs (321) of FIG. 4b) may have various shapes. For example, as illustrated in FIG. 4a, the AMC may have a rectangular shape, but is not limited thereto. Referring to FIG. 11a, the AMC (1110) may include a first portion (1111) having a rectangular ring shape, a second portion (1112) positioned inside the first portion (1111) and having a rectangular ring shape, and a third portion (1113) positioned inside the second portion (1112) and having a rectangular shape. The AMC (1110) illustrated in FIG. 11a illustrates the shape of one AMC, and a conductive pattern (231) may be disposed on four AMCs (321) illustrated in FIG. 11a. An AMC (1110) having the above shape may be suitable for an antenna module (200) supporting dual bands.

[0129] Referring to FIG. 11b, the AMC (1110) may be formed by a set of multiple portions having small sizes. Each of the multiple portions may include a body portion (1121) and multiple branch portions (1122) extending from the body portion (1121). In addition, the shape of the AMC (1110) may vary.

[0130] FIG. 12 is a cross-sectional view of an antenna module according to one embodiment taken along line A-A' of FIG. 4a.

[0131] Referring to FIG. 12, the antenna (210) may not be disposed substantially on the same plane as the first layer (310), which is the outermost layer. According to one embodiment, the antenna (210) may be positioned below (e.g., in the -z direction) the plurality of conductive patterns (230). For example, the antenna (210) may be positioned between the first layer (310) including the plurality of conductive patterns (230) and the third layer (330) including the ground region (331). Even if the antenna (210) is disposed below the plurality of conductive patterns (230), the phase of the surface wave radiated from the antenna (210) may be controlled by the plurality of conductive patterns (230). As the phase of the surface wave is controlled, a beam (e.g., an object wave) having directionality may be formed from the surface wave (e.g., a reference wave).

[0132] According to one embodiment, when the antenna (210) is positioned below the plurality of conductive patterns (230), the plurality of AMCs (321) may be positioned below the antenna (210) (e.g., in the -z direction) to reduce interference between the ground region (331) and the antenna (210). For example, the second layer (320) including the plurality of AMCs (321) may be positioned between the antenna (210) and the third layer (330). Even when the antenna (210) is positioned below the plurality of conductive patterns (230), the plurality of AMCs (321) may be positioned between the antenna (210) and the ground region (331) to reduce the influence of the ground region (331) on the antenna (210).

[0133] An electronic device (101) is provided. The electronic device (101) may include an antenna module (200). The electronic device (101) may include a wireless communication circuit configured to communicate with an external electronic device through the antenna module (200). The antenna module (200) may include an antenna (210), a first layer (310) including a plurality of conductive patterns (230) for controlling the phase of a surface wave radiated from the antenna (210), a second layer (320) including a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer (310), and a third layer (330) including a ground region (331) and a feed line (332) for electrically connecting the antenna (210) and the wireless communication circuit. The second layer (320) may be placed between the antenna (210) and the third layer (330).

[0134] According to one embodiment, the plurality of AMCs (321) may include a first AMC (641) including a first vertex (644a), a second AMC (642) including a second vertex (644b), a third AMC (643) including a third vertex (644c), and a fourth AMC (644) including a fourth vertex (644d). The first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d) may be adjacent to each other. The above plurality of conductive patterns (230) may include corresponding conductive patterns (231) that overlap the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d).

[0135] According to one embodiment, the antenna module (200) may include a plurality of unit cells. Each of the plurality of unit cells may include a first sub-layer (610) including a corresponding conductive pattern among the plurality of conductive patterns (230) on the first layer (310), a second sub-layer (620) including a first AMC (641), a second AMC (642), a third AMC (643), and a fourth AMC (644) overlapping the corresponding conductive pattern among the plurality of AMCs (321) on the second layer (320), and a third sub-layer (630) overlapping the first sub-layer (610) and the second sub-layer (620) among the third layer (330). The above-described conductive pattern may overlap the first vertex (644a) of the adjacent first AMC (641), the second vertex (644b) of the second AMC (642), the third vertex (644c) of the third AMC (643), and the fourth vertex (644d) of the fourth AMC (644).

[0136] According to one embodiment, each of the plurality of unit cells may have a position coordinate assigned to a point on the second layer (320) that is located at an equal distance from the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d). Each of the plurality of unit cells may have a reactance value assigned to the position coordinate in order to form a beam having directivity in a specified direction from the surface wave.

[0137] In one embodiment, the reactance value may be based on the phase of the surface wave at the position coordinates for forming the beam.

[0138] According to one embodiment, each of the plurality of conductive patterns (230) may have a size based on the reactance value.

[0139] According to one embodiment, the electronic device (101) may further include a housing (303) that at least partially defines the exterior of the electronic device (101) and is at least partially formed of a metal material. The antenna module (200) may be disposed within the housing (303).

[0140] According to one embodiment, the antenna module (200) may include a power supply port (340) electrically connected to the wireless communication circuit. The power supply line (332) may be configured to electrically connect the power supply port (340) and the antenna (210).

[0141] According to one embodiment, the feed line (332) may include a coplanar waveguide (CPW).

[0142] According to one embodiment, the antenna (210) may include a dipole antenna including a first conductive portion (211) and a second conductive portion (212).

[0143] According to one embodiment, the antenna (210) may include a feed point (213) offset from the center of the first conductive portion (211) and the second conductive portion (212) for impedance matching.

[0144] According to one embodiment, the antenna module (200) may include a first substrate (221) and a second substrate (222) laminated on the first substrate (221). The first layer (310) may be disposed on the upper surface of the second substrate (222). The third layer (330) may be disposed on the lower surface of the first substrate (221).

[0145] According to one embodiment, the antenna (210) may be positioned on the first layer (310) and arranged substantially parallel to the plurality of conductive patterns (230).

[0146] According to one embodiment, the antenna (210) may be disposed between the first layer (310) including the plurality of conductive patterns (230) and the third layer (330) including the ground region (331). The plurality of AMCs (321) may be disposed between the antenna (210) and the third layer (330).

[0147] According to one embodiment, the antenna (210) may include a plurality of conductive patches (810) for multiple-input and multiple-output (MIMO).

[0148] An antenna module (200) is provided. The antenna module (200) may include an antenna (210). The antenna module (200) may include a first layer (310) including a plurality of conductive patterns (230) for controlling the phase of a surface wave radiated from the antenna (210). The antenna module (200) may include a second layer (320) including a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer (310). The antenna module (200) may include a third layer (330) including a ground region (331) and a feed line (332) for a feed signal provided to the antenna (210). The second layer (320) may be disposed between the antenna (210) and the third layer (330).

[0149] According to one embodiment, the plurality of AMCs (321) may include a first AMC (641) including a first vertex (644a), a second AMC (642) including a second vertex (644b), a third AMC (643) including a third vertex (644c), and a fourth AMC (644) including a fourth vertex (644d). The first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d) may be adjacent to each other. The above plurality of conductive patterns (230) may include corresponding conductive patterns overlapping the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d).

[0150] According to one embodiment, the antenna module (200) may include a plurality of unit cells. Each of the plurality of unit cells may include a first sub-layer (610) including a corresponding conductive pattern among the plurality of conductive patterns (230) on the first layer (310), a second sub-layer (620) including a first AMC (641), a second AMC (642), a third AMC (643), and a fourth AMC (644) overlapping the corresponding conductive pattern among the plurality of AMCs (321) on the second layer (320), and a third sub-layer (630) overlapping the first sub-layer (610) and the second sub-layer (620) among the third layer (330). The conductive pattern may overlap the first vertex (644a) of the adjacent first AMC (641), the second vertex (644b) of the second AMC (642), the third vertex (644c) of the third AMC (643), and the fourth vertex (644d) of the fourth AMC (644). Each of the plurality of unit cells may have a position coordinate assigned to a point on the second layer (320) that is located at an equal distance from the first vertex (644a), the second vertex (644b), the third vertex (644c), and the fourth vertex (644d). Each of the plurality of unit cells may have a reactance value assigned to the position coordinate in order to form a beam having directivity in a specified direction from the surface wave. The above reactance value may be based on the phase of the surface wave at the position coordinates for forming the beam.

[0151] According to one embodiment, each of the plurality of conductive patterns (230) may have a size based on the reactance value.

[0152] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0153] Various embodiments of this document and the methods used therein

[0154] It should be understood that the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but rather encompass various modifications, equivalents, or alternatives of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding components from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0155] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0156] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0157] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0158] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, antenna module; and A wireless communication circuit configured to communicate with an external electronic device through the antenna module, The above antenna module, antenna, A first layer including a plurality of conductive patterns for controlling the phase of surface waves radiated from the antenna, A second layer comprising a plurality of artificial magnetic conductors (AMCs) and disposed below the first layer, and A third layer comprising a ground region and a feed line for electrically connecting the antenna and the wireless communication circuit, The second layer above, placed between the antenna and the third layer, Electronic devices.

2. In paragraph 1, The above multiple AMCs, A first AMC including the first vertex, A second AMC including the second vertex, A third AMC including a third vertex, and Including a fourth AMC including a fourth vertex, The above first vertex, the above second vertex, the above third vertex, and the above fourth vertex, adjacent to each other, The above multiple challenging patterns are: Including corresponding conductive patterns overlapping the first vertex, the second vertex, the third vertex, and the fourth vertex, Electronic devices.

3. In paragraph 1 or 2, The above antenna module, Contains multiple unit cells, Each of the above plurality of unit cells, A first sub-layer including a conductive pattern among the plurality of conductive patterns on the first layer, A second sub-layer including a first AMC, a second AMC, a third AMC, and a fourth AMC overlapping the corresponding conductive pattern among the plurality of AMCs on the second layer, and Among the third layers, a third sub-layer is included that overlaps the first sub-layer and the second sub-layer, The above challenge pattern is, Overlapping the first vertex of the first AMC, the second vertex of the second AMC, the third vertex of the third AMC, and the fourth vertex of the fourth AMC, Electronic devices.

4. In paragraph 3, Each of the above plurality of unit cells, Having position coordinates assigned to a point on the second layer located at the same distance from the first vertex, the second vertex, the third vertex, and the fourth vertex, Each of the above plurality of unit cells, In order to form a beam having a directivity in a specified direction from the surface wave, having a reactance value assigned to the position coordinates, Electronic devices.

5. In paragraph 4, The above reactance value is, Based on the phase of the surface wave at the position coordinates for forming the beam, Electronic devices.

6. In paragraph 4, Each of the above multiple challenging patterns is: Having a size based on the above reactance value, Electronic devices.

7. In any one of paragraphs 1 to 6, A housing comprising at least partially defining the exterior of the electronic device and at least partially formed of a metallic material, The above antenna module, placed within the above housing, Electronic devices.

8. In any one of paragraphs 1 to 7, The above antenna module, including a power supply port electrically connected to the wireless communication circuit; The above power supply line is, configured to electrically connect the above power supply port and the above antenna, Electronic devices.

9. In paragraph 8, The above power supply line is, Including CPW (coplanar waveguide), Electronic devices.

10. In any one of paragraphs 1 to 9, The above antenna, A dipole antenna comprising a first conductive portion and a second conductive portion, Electronic devices.

11. In paragraph 10, The above antenna, For impedance matching, including a feed point offset from the center of the first conductive portion and the second conductive portion, Electronic devices.

12. In any one of paragraphs 1 to 11, The above antenna module, First substrate, and Including a second substrate laminated on the first substrate, The above first layer is, is placed on the upper surface of the second substrate, The third layer above is, Placed on the lower surface of the first substrate, Electronic devices.

13. In paragraph 12, The above antenna, Positioned on the first layer, and substantially parallel to the plurality of conductive patterns, Electronic devices.

14. In any one of paragraphs 1 to 13, The above antenna, is disposed between the first layer including the plurality of conductive patterns and the third layer including the ground region, The above multiple AMCs, placed between the antenna and the third layer, Electronic devices.

15. In any one of paragraphs 1 to 14, The above antenna, Containing multiple challenging patches for MIMO (multiple-input and multiple-output), Electronic devices.

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