LED lamp bead structure and light source module
By incorporating a lens structure into the LED chip structure, the light emission angle of the chips is expanded, solving the problem of high cost caused by a small light emission angle and achieving a lower-cost backlight module design.
Patent Information
- Application Number
- PCT/CN2025/084480
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-02
- Filing Date
- 2025-03-24
- Publication Date
- 2026-01-08
AI Technical Summary
The existing POB LED chips have a small beam angle, which requires a denser arrangement in backlight products, increasing the number of chips used and thus increasing costs.
By incorporating a lens structure into the LED chip structure, the light emission distribution of the LED chip is altered, and the light emission angle of the chips is expanded, thereby reducing the number of chips and allowing for a sparser arrangement to achieve uniform brightness.
By increasing the light emission angle of the LED chips, the number of LED chips can be reduced, thereby lowering the cost of the backlight module.
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Figure CN2025084480_08012026_PF_FP_ABST
Abstract
Description
LED lamp bead structure and light source module
[0001] The present application claims priority to the Chinese patent application No. 202421552055.9, filed on July 02, 2024, and entitled "LED lamp bead structure and light source module", the whole content of which is incorporated herein by reference. TECHNICAL FIELD
[0002] The present application relates to the technical field of light sources, in particular to an LED lamp bead structure and a light source module. BACKGROUND
[0003] The current LED backlight structure is set in two technical routes of COB (Chip On Board, chip direct mounting technology) and POB (Package On Board, package device is pasted on the PCB substrate). POB becomes the mainstream due to its mature upstream packaging industry, high production yield, relatively low cost and other advantages. TECHNICAL PROBLEM
[0004] The common POB LED generally meets the Lambert distribution, and the light-emitting angle of the lamp bead is small. In the backlight product, more densely arranged lamp beads are needed to meet the uniformity of brightness, which leads to excessive use of lamp beads and high cost.
[0005] Therefore, the current technology still needs to be improved and improved. TECHNICAL SOLUTION
[0006] The present application provides an LED lamp bead structure and a light source module, which can increase the light-emitting angle of the lamp bead to alleviate the problem of high cost caused by the small light-emitting angle of the lamp bead.
[0007] The present application provides an LED lamp bead structure, comprising:
[0008] an LED chip;
[0009] a lead frame, the lead frame comprising a metal pad and a plastic support on the metal pad; the plastic support is provided with a cup cavity to expose the metal pad; the LED chip is mounted on the metal pad, and the cup cavity is filled with a glue layer to cover the LED chip;
[0010] a lens structure, the lens structure being arranged on the plastic support and covering the cup opening of the cup cavity.
[0011] In some embodiments, the LED lamp bead structure, the lens structure is connected with the plastic support by clamping.
[0012] In some embodiments, the LED lamp bead structure, the edge of the plastic support is provided with a protruding structure.
[0013] The lens structure is provided with a lens buckle matched with the protruding structure.
[0014] In the LED lamp bead structure in some embodiments, a positioning structure is arranged at the periphery of the cup opening in the plastic support.
[0015] The lens structure is provided with a positioning part matched with the positioning structure.
[0016] In the LED lamp bead structure in some embodiments, a positioning circular platform is arranged at the periphery of the cup opening in the plastic support.
[0017] The lens structure is provided with a stepped surface matched with the positioning circular platform.
[0018] In the LED lamp bead structure in some embodiments, a groove is arranged at the periphery of the cup opening in the plastic support.
[0019] The lens structure is provided with a convex part matched with the groove.
[0020] In the LED lamp bead structure in some embodiments, one or more positioning columns are arranged at the periphery of the cup opening in the plastic support.
[0021] The lens structure is provided with a positioning hole matched with the positioning column.
[0022] In the LED lamp bead structure in some embodiments, a concave cavity is formed on the side close to the LED chip in the lens structure.
[0023] The inner wall of the cavity is curved to form a light incident surface of the lens structure.
[0024] In the LED lamp bead structure in some embodiments, a concave pit is formed on the side away from the LED chip in the lens structure.
[0025] In the LED lamp bead structure in some embodiments, the cross section of the concave pit is circular, and the two opposite sides of the longitudinal section of the concave pit are curved.
[0026] In the LED lamp bead structure in some embodiments, the metal pad includes a first pad and a second pad, and the first pad and the second pad are separated by a through groove; the through groove is filled with plastic.
[0027] In the LED lamp bead structure in some embodiments, the LED chip is arranged on the first pad, the LED chip is electrically connected to the first pad through a first bonding wire, and the LED chip is electrically connected to the second pad through a second bonding wire.
[0028] In the LED lamp bead structure in some embodiments, the LED chip includes a first chip and a second chip, the first chip is arranged on the first pad, and the second chip is arranged on the second pad.
[0029] The first chip is electrically connected with the first pad through a first bonding wire, the second chip is electrically connected with the second pad through a second bonding wire, and the first chip is electrically connected with the second chip through a third bonding wire.
[0030] The embodiment of the application further provides a light source module, which comprises a PCB substrate, and a plurality of LED lamp bead structures are attached to the PCB substrate.
[0031] The LED lamp bead structure comprises:
[0032] An LED chip;
[0033] A lead frame, which comprises a metal pad and a plastic support located on the metal pad; the plastic support is provided with a cup cavity to expose the metal pad; the LED chip is attached to the metal pad, and a glue layer is filled in the cup cavity to cover the LED chip.
[0034] A lens structure, which is arranged on the plastic support and covers a cup opening of the cup cavity.
[0035] In the light source module in some embodiments, the lens structure is clamped and connected with the plastic support.
[0036] In the light source module in some embodiments, an edge of the plastic support is provided with a protruding structure.
[0037] The lens structure is provided with a lens buckle matched with the protruding structure.
[0038] In the light source module in some embodiments, the plastic support is provided with a positioning structure at the periphery of the cup opening.
[0039] The lens structure is provided with a positioning part matched with the positioning structure.
[0040] In the light source module in some embodiments, the plastic support is provided with a positioning circular platform at the periphery of the cup opening.
[0041] The lens structure is provided with a stepped surface matched with the positioning circular platform.
[0042] In the light source module in some embodiments, the plastic support is provided with a groove at the periphery of the cup opening.
[0043] The lens structure is provided with a convex part matched with the groove.
[0044] In the light source module in some embodiments, the plastic support is provided with one or more positioning columns at the periphery of the cup opening.
[0045] The lens structure is provided with a positioning hole matched with the positioning column. Advantages
[0046] This application provides an LED chip structure and a light source module. The LED chip structure includes an LED chip, a lead frame, and a lens structure. The lead frame includes metal pads and a plastic support on the metal pads. A cup cavity is provided in the plastic support, with the bottom of the cup cavity partially exposing the metal pads. The LED chip is mounted on the metal pads, and the cup cavity is filled with an adhesive layer to cover the LED chip. The lens structure is disposed on the plastic support and covers the opening of the cup cavity. In this application, the lens structure can alter the light emission distribution of the LED chip, thereby expanding the light emission angle of the LED chip structure. Therefore, when forming a backlight module, compared to LED chips with a small light emission angle, using a more sparsely arranged array of LED chips can achieve uniform brightness, thus reducing the number of LED chips and consequently lowering costs. Attached Figure Description
[0047] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.
[0048] Figure 1 is a schematic diagram of the LED lamp bead structure provided in the embodiment of this application.
[0049] Figure 2 is a schematic diagram of the first embodiment of the lead frame in the LED lamp bead structure provided in this application.
[0050] Figure 3 is a schematic diagram of the first embodiment of the lens structure in the LED lamp bead structure provided in this application.
[0051] Figure 4 is a schematic diagram of the second embodiment of the lens structure in the LED lamp bead structure provided in this application.
[0052] Figure 5 is a schematic diagram of the second embodiment of the lead frame in the LED lamp bead structure provided in this application.
[0053] Figure 6 is a schematic diagram of the third embodiment of the lens structure in the LED lamp bead structure provided in this application.
[0054] Figure 7 is a schematic diagram of the third embodiment of the lead frame in the LED lamp bead structure provided in this application.
[0055] 10, LED chip; 11, first chip; 12, second chip; 20, lead frame; 21, metal pad; 211, first pad; 212, second pad; 22, plastic support; 221, cup cavity; 222, positioning structure; 223, groove; 224, positioning column; 23, protruding structure; 25, plastic; 30, lens structure; 31, lens buckle; 32, positioning part; 33, positioning hole; 34, cavity; 341, light incident surface; 35, pit; 351, light exit surface; 36, protruding part; 40, glue layer; 51, first bonding wire; 52, second bonding wire; 53, third bonding wire. DETAILED DESCRIPTION
[0056] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0057] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features, so that the features with "first", "second" can explicitly or implicitly include one or more features, and in the description of the present application, the meaning of "multiple" is two or more than two, unless otherwise explicitly and specifically limited.
[0058] Please refer to Figs. 1 and 2, the present embodiment provides a LED lamp bead structure, which comprises a LED chip 10, a lead frame 20 and a lens structure 30; wherein the lead frame 20 comprises a metal pad 21 and a plastic support 22 located on the metal pad 21; the plastic support 22 is provided with a cup cavity 221, and the cup bottom of the cup cavity 221 is exposed to part of the metal pad 21; the LED chip 10 is attached to the metal pad 21, and the cup cavity 221 is filled with a glue layer 40 to cover the LED chip 10; the lens structure 30 is arranged on the plastic support 22 and covers the cup opening of the cup cavity 221. In the LED lamp bead structure of the present embodiment, the light distribution of the LED chip 10 can be changed by arranging the lens structure 30, so as to expand the light emitting angle of the LED lamp bead structure, and then when the LED lamp bead structure forms a backlight module, the number of LED lamp bead structures can be reduced, thereby facilitating cost reduction.
[0059] The lead frame 20 is a carrier of the chip and is a key structural member for realizing electrical connection between the internal circuit lead-out end of the chip and the external lead by means of a bonding material (gold wire, aluminum wire, copper wire) to form an electrical circuit and to play a role of a bridge for connecting with external wires.
[0060] In some embodiments, the glue layer 40 filled in the cup cavity 221 of the lead frame 20 is a glue layer 40 with fluorescent powder, that is, the cup cavity 221 is filled with glue mixed with fluorescent powder. The material of the fluorescent powder can be selected from aluminate such as YAG powder, silicate, nitride, sulfide such as KSF powder, and β-Sialon series materials. The material of the glue can be selected from silicone and silicone resin. In this embodiment, the light emitted by the LED chip 10 is subjected to first optical processing by the glue layer 40 and then subjected to second optical processing by the lens structure 30. The glue layer 40 serves as a primary lens, and the lens structure 30 serves as a secondary lens.
[0061] As an embodiment, the main material of the lens structure 30 can be selected from silicone.
[0062] In some embodiments, the lens structure 30 is connected to the plastic support 22 in a clamping manner. In this embodiment, the lens structure 30 is connected to the plastic support 22 in a clamping manner, and the lens structure 30 does not need to be fixed by glue during lens assembly, thereby effectively reducing the process of dispensing and curing and simplifying the process flow to reduce the cost.
[0063] As an embodiment, the edge of the plastic support 22 is provided with a protruding structure 23, and the lens structure 30 is provided with a lens buckle 31 matched with the protruding structure 23. During lens assembly, the lens buckle 31 can be directly clamped with the protruding structure 23 at the edge of the plastic support 22 to fix the lens structure 30 and the lead frame 20, thereby reducing the process of dispensing and curing and reducing the process cost.
[0064] In some embodiments, the plastic support 22 is provided with a positioning structure 222 at the periphery of the cup opening, and the lens structure 30 is provided with a positioning portion 32 matched with the positioning structure 222. In this embodiment, the positioning structure 222 is arranged in the plastic support 22, and the positioning portion 32 matched with the positioning structure 222 is arranged in the lens structure 30. During lens assembly, the lens structure 30 and the lead frame 20 can be quickly positioned, the positioning accuracy of the lens structure 30 and the lead frame 20 is improved, and the light type consistency is improved.
[0065] In some embodiments, the plastic support 22 is provided with a positioning circular platform at the periphery of the cup opening (as shown in FIG. 2); the lens structure 30 is provided with a stepped surface adapted to the positioning circular platform (as shown in FIG. 3); during lens assembly, the stepped surface of the lens structure 30 is directly attached to the surface of the positioning circular platform, and the positioning circular platform and the stepped surface realize the quick positioning of the lens structure 30 and the lead frame 20, improve the positioning accuracy of the lens structure 30 and the lead frame 20, and further improve the light type consistency.
[0066] Please refer to FIG. 4 and FIG. 5, in some embodiments, the plastic support 22 is provided with a groove 223 at the periphery of the cup opening; the lens structure 30 is provided with a protruding part 36 adapted to the groove 223. During lens assembly, the protruding part 36 in the lens structure 30 is directly placed in the groove 223 of the plastic support 22, realizing the quick positioning between the lens structure 30 and the lead frame 20, improving the positioning accuracy of the lens structure 30 and the lead frame 20, and further improving the light type consistency.
[0067] Please refer to FIG. 6 and FIG. 7, in some embodiments, the plastic support 22 is provided with one or more positioning columns 224 at the periphery of the cup opening; the lens structure 30 is provided with a positioning hole 33 adapted to the positioning column 224. During lens assembly, the positioning hole 33 in the lens structure 30 is directly attached to the positioning column 224 in the plastic support 22, so that the positioning column 224 can be inserted into the positioning hole 33, realizing the quick positioning between the lens structure 30 and the lead frame 20, improving the positioning accuracy of the lens structure 30 and the lead frame 20, and further improving the light type consistency.
[0068] Please continue to refer to FIG. 3, in some embodiments, the lens structure 30 is formed with a concave cavity 34 near one side of the LED chip 10; the inner wall of the cavity 34 is curved to form a light incident surface 341 of the lens structure 30; the side of the lens structure 30 near the LED chip 10 has an arch-shaped opening. The light emitted by the LED chip 10 passes through the glue layer 40 and is incident into the lens structure 30 through the light incident surface 341 of the lens structure 30, and the light emitted by the LED chip 10 is designed again by the lens structure 30, so as to expand the light emitting angle of the LED lamp bead structure.
[0069] In some embodiments, the lens structure 30 is formed with a pit 35 away from the LED chip 10; the wall surface of the pit 35 forms a light emitting surface 351 of the lens structure 30. In this embodiment, the pit 35 is provided to further improve the light emitting angle of the LED chip 10.
[0070] Specifically, the cross section of the concave pit 35 is circular, and two opposite sides of the longitudinal section of the concave pit 35 are curves, which are convex curves; thereby facilitating further expansion of the light emitting angle of the light of the LED chip 10 through the lens structure 30.
[0071] It should be noted that the light incident surface 341 and the light emitting surface 351 of the lens structure 30, the diameter and height of the lens structure 30 and other parameters in the embodiment can be designed according to the requirements of different light types, which are not limited in the present application.
[0072] Please continue to refer to FIG. 1, in some embodiments, the metal pad 21 includes a first pad 211 and a second pad 212, the first pad 211 and the second pad 212 are separated by a through slot; the through slot is filled with plastic 25 to insulate the first pad 211 and the second pad 212. Among them, the first pad 211 is a positive pad, and the second pad 212 is a negative pad.
[0073] Specifically, one LED chip 10 is arranged in each LED lamp bead structure, and the LED chip 10 can be arranged on the first pad 211, the positive electrode of the LED chip 10 is electrically connected to the first pad 211 through the first bonding wire 51, and the negative electrode of the LED chip 10 is electrically connected to the second pad 212 through the second bonding wire 52.
[0074] In some embodiments, multiple LED chips 10 can also be arranged in each LED lamp bead structure, for example, two LED chips 10 are arranged, and the LED chips 10 include a first chip 11 and a second chip 12 (as shown in FIG. 1). At this time, the first chip 11 is arranged on the first pad 211, and the second chip 12 is arranged on the second pad 212; wherein the positive electrode of the first chip 11 is electrically connected to the first pad 211 through the first bonding wire 51, the negative electrode of the second chip 12 is electrically connected to the second pad 212 through the second bonding wire 52, and the negative electrode of the first chip 11 is electrically connected to the positive electrode of the second chip 12 through the third bonding wire 53.
[0075] The embodiment of the present application also provides a backlight module, which includes a PCB substrate, and a plurality of LED lamp bead structures described above are attached to the PCB substrate; because the lens structure 30 is arranged in the LED lamp bead structure to form a secondary lens, the light emitting angle of the LED lamp bead structure can be effectively expanded, thereby reducing the amount of the LED lamp bead structure in the backlight module, and further reducing the cost of the backlight module. Since the LED lamp bead structure is described in detail above, it will not be repeated here.
[0076] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.
[0077] The LED lamp bead structure provided by the embodiments of the present application is described in detail above, and the principles and implementation manners of the present application are described by applying specific examples. The above embodiment descriptions are only used to help understand the technical solutions of the present application and the core ideas thereof. Those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. An LED lamp bead structure, wherein, The light source module comprises a PCB substrate, and a plurality of LED lamp bead structures are attached to the PCB substrate. The LED lamp bead structure comprises: An LED chip; A lead frame comprising a metal pad and a plastic support located on the metal pad; the plastic support is provided with a cup cavity to expose the metal pad; the LED chip is attached to the metal pad, and a glue layer is filled in the cup cavity to cover the LED chip; 2. The LED lamp bead structure of claim 1, wherein, A lens structure is arranged on the plastic support and covers the cup opening of the cup cavity.
3. The LED lamp bead structure of claim 2, wherein, The lens structure is snap-connected with the plastic support. An edge of the plastic support is provided with a protruding structure; 4. The LED lamp bead structure of claim 1, wherein, The lens structure is provided with a lens buckle matched with the protruding structure. A positioning structure is arranged on the periphery of the cup opening in the plastic support; 5. The LED lamp bead structure of claim 1, wherein, The lens structure is provided with a positioning part matched with the positioning structure. A positioning circular platform is arranged on the periphery of the cup opening in the plastic support; 6. The LED lamp bead structure of claim 1, wherein, The lens structure is provided with a stepped surface matched with the positioning circular platform. A groove is arranged on the periphery of the cup opening in the plastic support; 7. The LED lamp bead structure according to claim 1, wherein, The lens structure is provided with a convex part matched with the groove. One or more positioning columns are arranged on the periphery of the cup opening in the plastic support; 8. The LED lamp bead structure according to any one of claims 1-7, wherein, The lens structure is provided with a positioning hole matched with the positioning column. An inner recessed cavity is formed on one side of the lens structure close to the LED chip; 9. The LED lamp bead structure according to claim 8, wherein, The inner wall of the cavity is curved to form a light incident surface of the lens structure.
10. The LED lamp bead structure according to claim 9, wherein, A recess is formed on the side of the lens structure away from the LED chip.
11. The LED lamp bead structure of claim 10, wherein, The cross section of the recess is circular, and the two opposite sides of the longitudinal section of the recess are curved.
12. The LED lamp bead structure of claim 11, wherein, The metal pad comprises a first pad and a second pad, and the first pad and the second pad are separated by a through groove; the through groove is filled with plastic.
13. The LED lamp bead structure of claim 11, wherein, The LED chip is arranged on the first pad, and the LED chip is electrically connected to the first pad by a first bonding wire and electrically connected to the second pad by a second bonding wire. The LED chip comprises a first chip and a second chip, the first chip is arranged on the first pad, and the second chip is arranged on the second pad; 14. A light source module, wherein, The first chip is electrically connected to the first pad by a first bonding wire, the second chip is electrically connected to the second pad by a second bonding wire, and the first chip is electrically connected to the second chip by a third bonding wire. The light source module comprises a PCB substrate, and a plurality of LED lamp bead structures are attached to the PCB substrate. The LED lamp bead structure comprises: An LED chip; A lead frame comprising a metal pad and a plastic support located on the metal pad; the plastic support is provided with a cup cavity to expose the metal pad; the LED chip is attached to the metal pad, and a glue layer is filled in the cup cavity to cover the LED chip; 15. The light source module of claim 14, wherein, A lens structure is arranged on the plastic support and covers the cup opening of the cup cavity.
16. The light source module of claim 15, wherein, The lens structure is snap-connected with the plastic support. An edge of the plastic support is provided with a protruding structure; The lens structure is provided with a lens buckle matched with the protruding structure.
17. The light source module of claim 14, wherein, The plastic support is provided with a positioning structure at the periphery of the cup opening; The lens structure is provided with a positioning part matched with the positioning structure.
18. The light source module of claim 14, wherein, The plastic support is provided with a positioning circular platform at the periphery of the cup opening; The lens structure is provided with a stepped surface matched with the positioning circular platform.
19. The light source module of claim 14, wherein, The plastic support is provided with a groove at the periphery of the cup opening; The lens structure is provided with a convex part matched with the groove.
20. The light source module of claim 14, wherein, The plastic support is provided with one or more positioning columns at the periphery of the cup opening; The lens structure is provided with a positioning hole matched with the positioning column.
Citation Information
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