Integrated circuit lead frame

Abstract

The utility model provides an integrated circuit lead frame, and belongs to the technical field of electronic information industry. The integrated circuit lead frame comprises a lead frame and a plurality of integrated circuits arranged on the lead frame at equal intervals along the length direction of the lead frame, and is characterized in that a plurality of mounting areas corresponding to the plurality of integrated circuits are arranged on the surface of the lead frame, and the plurality of integrated circuits are respectively placed on the surfaces of the plurality of mounting areas; the pin ends of the integrated circuits are electrically connected with the lead end of the lead frame, a plurality of positioning assemblies are installed, the inner periphery of the positioning assemblies is larger than the outer periphery of the integrated circuits, and the positioning assemblies are connected with the surface of the lead frame through screws. Through cooperation of the fixing part, the plurality of pin reinforcing parts and the plurality of insulating gaskets, the problems that an existing integrated circuit lead frame is difficult to disassemble and easy to damage, and the integrated circuit and the lead frame are not easy to reuse can be effectively solved.

Description

Technical Field

[0001] This application relates to the field of electronic information industry technology, and more specifically, to an integrated circuit lead frame. Background Technology

[0002] Integrated circuits (ICs) are core components of modern electronic devices, and their packaging and interconnection technologies are crucial to the performance and reliability of these devices. The leadframe, a key component of IC packaging, plays a vital role in supporting the chip, providing electrical connections, and dissipating heat. Traditional IC leadframes typically use soldering to fix the IC pins to the leadframe. This process is simple and inexpensive, and has been widely used in the electronics manufacturing industry.

[0003] Currently, traditional soldering processes firmly bond the pins of integrated circuits (ICs) to the leadframe. When ICs need to be removed for repair, upgrades, or recycling, the solder must typically be heated to melt it before the IC can be separated from the leadframe. This process easily leads to thermal stress on the IC pins, causing deformation, breakage, or even damage to the chip itself. The risk of damage to the IC increases significantly, especially during repeated assembly and disassembly. Furthermore, the soldering process leaves solder residue on the leadframe surface, which is difficult to completely remove, affecting the surface quality and electrical performance of the leadframe. Therefore, traditional leadframes are typically for single use only, unable to be effectively recycled and reused, resulting in resource waste and environmental pollution. Utility Model Content

[0004] To overcome the above shortcomings, this application provides an integrated circuit lead frame to solve the problems mentioned in the background art, such as the difficulty in removing and the ease of damage to existing integrated circuit lead frames, and the difficulty in reusing integrated circuit lead frames.

[0005] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is as follows:

[0006] An integrated circuit lead frame includes a lead frame and a plurality of integrated circuits arranged at equal intervals along the length of the lead frame. The lead frame surface has a plurality of mounting areas corresponding to the plurality of integrated circuits. The plurality of integrated circuits are respectively placed on the surfaces of the plurality of mounting areas. The pins of the plurality of integrated circuits are electrically connected to the pins of the lead frame and are fitted with a plurality of positioning components. The inner circumference of the plurality of positioning components is larger than the outer circumference of the plurality of integrated circuits, and they are screwed to the surface of the lead frame.

[0007] Furthermore, the positioning component consists of a fixing component, several pin reinforcement components, and several insulating pads. The inner wall of the fixing component is in indirect contact with the pin end of the integrated circuit and is fixed to the surface of the lead frame with screws. The bottom ends of the several pin reinforcement components are equally spaced and pass through the surface of the fixing component to be tightly connected to the pin end of the integrated circuit. The several insulating pads are placed between the bottom ends of the several pin reinforcement components and the pin end of the integrated circuit.

[0008] Furthermore, the fixing component includes four threaded holes I, a mounting frame, four through holes, and four fixing screws. The lead frame has four threaded holes I on its surface, which are located at the four corners of the mounting area. The interior of the mounting frame is indirectly in contact with the pins of the integrated circuit, and the four corners of the frame have four through holes. The bottom ends of the four fixing screws are threadedly connected to the inner walls of the four threaded holes I through the four through holes.

[0009] Furthermore, the pin reinforcement component includes a threaded hole II and an adjusting screw. The mounting frame surface has the threaded hole II. The outer wall of the adjusting screw is threadedly connected to the inner wall of the threaded hole II, and the bottom end is provided with the insulating pad between it and the pin end of the integrated circuit.

[0010] Furthermore, the surface of the insulating pad is in contact with the bottom end of the adjusting screw, and the bottom end has an arc groove that is in contact with the top of the integrated circuit pin. The arc groove is larger than the width of the integrated circuit pin.

[0011] Furthermore, the lead frame surface is provided with a plurality of heat dissipation holes, which are respectively located on the surfaces of the plurality of mounting areas.

[0012] Furthermore, the lead frame has fixing holes at its four corners, through which it is installed in a predetermined position.

[0013] This utility model has the following beneficial effects:

[0014] 1. This utility model utilizes a screw-connected positioning component to secure integrated circuits, avoiding the high temperatures and stress associated with traditional soldering processes. When it is necessary to remove or replace an integrated circuit, simply unscrew the fixing screws, remove the mounting frame, and the integrated circuit can be easily removed without heating, thus avoiding the risk of integrated circuit pin deformation, breakage, or chip damage due to high temperatures. Similarly, installing new integrated circuits is also simple and quick; simply place the integrated circuit in the mounting area and secure it with screws. The operation is convenient and efficient.

[0015] 2. Because this invention avoids the soldering process, no solder residue remains on the surface of the lead frame, maintaining its cleanliness and integrity. This allows the lead frame to be reused multiple times, significantly reducing production costs and resource waste, aligning with the concept of green environmental protection.

[0016] 3. The fixing component and the pin reinforcement component of this utility model work together to effectively reinforce and protect the pins of the integrated circuit. The fixing component is tightly connected to the lead frame through a through hole and fixing screws, providing stable support. The pin reinforcement component uses adjusting screws to firmly press the insulating pad onto the pin, ensuring the reliability of the electrical connection between the integrated circuit pin and the lead frame lead. The arc groove design of the insulating pad can better adapt to the shape of the pin, increasing the contact area and further improving the stability and vibration resistance of the connection. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the integrated circuit lead frame structure provided in the embodiments of this application;

[0019] Figure 2 A schematic diagram of the mounting area structure on the surface of the lead frame provided in an embodiment of this application;

[0020] Figure 3 A schematic diagram of the positioning component structure provided for an embodiment of this application;

[0021] Figure 4 This is an exploded view of the positioning component provided in an embodiment of this application;

[0022] Figure 5 A schematic diagram of the arc groove structure of the insulating gasket provided in the embodiments of this application.

[0023] In the diagram: 1-lead frame; 2-integrated circuit; 3-mounting area; 4-positioning component; 5-heat dissipation hole; 6-fixing hole; 41-fixing component; 42-pin reinforcement component; 43-insulating pad; 411-threaded hole I; 412-mounting frame; 413-through hole; 414-fixing screw; 421-threaded hole II; 422-adjusting screw; 431-arc groove. Detailed Implementation

[0024] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0025] Example:

[0026] Please see Figure 1 , Figure 2 An integrated circuit lead frame includes a lead frame 1 and a plurality of integrated circuits 2 arranged at equal intervals along the length of the lead frame 1; fixing holes 6 are provided at the four corners of the surface of the lead frame 1.

[0027] The lead frame 1 is made of conductive material and coated with rigid plastic, and has lead ends. The lead frame 1 is used to mount and connect multiple integrated circuits 2.

[0028] In this configuration, several integrated circuits 2 are arranged at equal intervals along the length of the lead frame 1 and are placed on the surface of each mounting area 3. The pins of the integrated circuits 2 face downwards, ready to be electrically connected to the leads of the lead frame 1. The integrated circuits 2 employ existing technology in the field, and therefore will not be described in detail.

[0029] The fixing holes 6 are designed to ensure precise and stable installation of the lead frame 1 in a predetermined position. The fixing holes 6 are located at the four corners of the surface of the lead frame 1, one at each corner, for a total of four fixing holes 6. This arrangement ensures stable fixation of the lead frame 1 in all directions.

[0030] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 An integrated circuit lead frame includes a lead frame 1 with several mounting areas 3 corresponding to several integrated circuits 2 on its surface. The several integrated circuits 2 are respectively placed on the surface of the several mounting areas 3. The pins of the several integrated circuits 2 are electrically connected to the pins of the lead frame 1 and are equipped with several positioning components 4. The inner circumference of the positioning components 4 is larger than the outer circumference of the several integrated circuits 2 and is screwed to the surface of the lead frame 1. The positioning components 4 are composed of fixing components 41, several pin reinforcing components 42 and several insulating pads 43. The fixing components 41 include four threaded holes I 411, a mounting frame 412, four through holes 413 and four fixing screws 414. The pin reinforcing components 42 include threaded holes II 421 and adjusting screws 422. The bottom of the insulating pads 43 is provided with arc grooves 431. The surface of the lead frame 1 is provided with several heat dissipation holes 5.

[0031] The mounting areas 3 are arranged at equal intervals along the length of the lead frame 1. Each mounting area 3 has several heat dissipation holes 5 on its surface to improve the heat dissipation of the integrated circuit 2.

[0032] The positioning component 4 is used to fix the integrated circuit 2 onto the mounting area 3 on the surface of the lead frame 1. The positioning component 4 consists of a fixing component 41, several pin-reinforcing components 42, and several insulating pads 43. These components work together to achieve precise positioning, reinforcement, and insulation protection of the integrated circuit 2. The fixing component 41 includes four threaded holes I 411, located at the four corners of the mounting area 3. These four threaded holes I 411 match corresponding through holes 413 pre-drilled on the surface of the lead frame 1, used to fix the mounting frame 412 onto the lead frame 1 using fixing screws 414. The mounting frame 412 is the main body of the fixing component 41, and its interior indirectly contacts the pins of the integrated circuit 2, providing support and positioning for the integrated circuit 2. Four through holes 413 are respectively opened at the four corners of the surface of the mounting frame 412 for the fixing screws 414 to pass through. The through holes 413 allow the fixing screws 414 to pass through, fixing the fixing component 41 onto the lead frame 1. Four fixing screws 414 pass through four through holes 413 and are threaded into the inner walls of four threaded holes I 411 on the surface of the lead frame 1, thereby firmly fixing the fixing component 41 to the lead frame 1. The pin reinforcement component 42 is used to reinforce the pins of the integrated circuit 2. The pin reinforcement component 42 includes several threaded holes II 421 and an adjusting screw 422. The threaded holes II 421 are formed on the surface of the mounting frame 412 and are threaded into the outer wall of the adjusting screw 422. The outer wall of the adjusting screw 422 is threaded into the inner wall of the threaded hole II 421, and an insulating washer 43 is provided between its bottom end and the pin of the integrated circuit 2. By rotating the adjusting screw 422, the pressure on the pin of the integrated circuit 2 can be adjusted to achieve pin reinforcement and insulation protection. The insulating washer 43 is used to insulate the pin of the integrated circuit 2 and ensure good contact between the pin reinforcement component 42 and the pin. The surface of the insulating washer 43 is in close contact with the bottom end of the adjusting screw 422 to ensure force transmission. An arc groove 431 is formed at the bottom end of the insulating pad 43, and it fits against the top of the pin of the integrated circuit 2. The width of the arc groove 431 is greater than the width of the pin of the integrated circuit 2. This design ensures good contact between the insulating pad 43 and the top of the pin, while avoiding damage to the pin. The pressure of the pin reinforcement component 42 on the pin of the integrated circuit 2 can be easily adjusted by adjusting the screw 422 to accommodate integrated circuits 2 of different sizes and pin arrangements.

[0033] The heat dissipation holes 5 are located on the surface of the mounting area 3 of the lead frame 1. The mounting area 3 is used to mount the integrated circuit 2. By opening the heat dissipation holes 5 on the surface of the mounting area 3, the heat generated by the integrated circuit 2 can be dissipated more directly. The number and arrangement of the heat dissipation holes 5 can be designed according to actual needs. For example, multiple heat dissipation holes 5 can be evenly distributed on the surface of the mounting area 3 to maximize the heat dissipation area. Alternatively, a non-uniform distribution design can be adopted according to the heat generation and heat distribution of the integrated circuit 2, with more heat dissipation holes 5 in areas with higher heat generation. By rationally designing the position and number of heat dissipation holes 5, heat can be prevented from accumulating between the integrated circuit 2 and the lead frame 1, avoiding local overheating.

[0034] The working principle of this integrated circuit lead frame is as follows: In use, the integrated circuit 2 is first placed inside the mounting area 3 on the surface of the lead frame 1, so that the pin end of the integrated circuit 2 is in contact with the pin end on the surface of the lead frame 1. Then, the arc groove 431 of the insulating pad 43 is in contact with the pin end surface of the integrated circuit 2. The fixing screw 414 is threadedly connected to the inner wall of the threaded hole I 411 through the through hole 413 on the surface of the mounting frame 412, thereby fixing the mounting frame 412 to the surface of the lead frame 1. At this time, the bottom of the mounting frame 412 is in contact with the surface of the insulating pad 43. The adjusting screw 422 connected to the threaded hole II 421 is rotated so that its bottom end applies pressure to the surface of the insulating pad 43, thereby achieving the purpose of fixing the lead of the lead frame 1 to the pin end of the integrated circuit 2.

[0035] It should be noted that the specific model and specifications of integrated circuit 2 need to be selected and determined according to the actual specifications of the device. The specific selection and calculation method adopts the existing technology in this field, so it will not be described in detail here.

[0036] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An integrated circuit lead frame comprising a lead frame (1) and a plurality of integrated circuits (2) arranged on the lead frame (1) at equal intervals along the length of the lead frame (1), characterized in that: The lead frame (1) is provided with a plurality of mounting areas (3) corresponding to a plurality of integrated circuits (2), the plurality of integrated circuits (2) are placed on the plurality of mounting areas (3) respectively, the pin ends of the plurality of integrated circuits (2) are electrically connected with the lead ends of the lead frame (1), and a plurality of positioning assemblies (4) are mounted, the inner circumferences of the plurality of positioning assemblies (4) are greater than the peripheries of the plurality of integrated circuits (2), and the plurality of positioning assemblies (4) are screw-connected with the surface of the lead frame (1).

2. An integrated circuit leadframe according to claim 1, wherein, The positioning assembly (4) is composed of a fixing component (41), a plurality of pin reinforcing components (42) and a plurality of insulating washers (43), the inner wall of the fixing component (41) is indirectly in contact with the pin ends of the integrated circuit (2), and is screw-fixed on the surface of the lead frame (1), the bottom ends of the plurality of pin reinforcing components (42) are respectively and equidistantly penetrated through the surface of the fixing component (41) and are tightly connected with the pin ends of the integrated circuit (2), and the plurality of insulating washers (43) are arranged between the bottom ends of the plurality of pin reinforcing components (42) and the pin ends of the integrated circuit (2).

3. An integrated circuit leadframe according to claim 2, wherein, The fixing component (41) comprises four threaded holes I (411), a mounting frame (412), four through holes (413) and four fixing screws (414), the surface of the lead frame (1) is provided with four threaded holes I (411), the four threaded holes I (411) are respectively located at four corners of the mounting area (3), the inside of the mounting frame (412) is indirectly in contact with the pin ends of the integrated circuit (2), four through holes (413) are respectively formed at four corners of the surface of the mounting frame (412), and the bottom ends of the four fixing screws (414) are screw-connected with the inner walls of the four threaded holes I (411) through the interiors of the four through holes (413).

4. An integrated circuit leadframe according to claim 3, wherein, The pin reinforcing component (42) comprises a threaded hole II (421) and an adjusting screw (422), the surface of the mounting frame (412) is provided with the threaded hole II (421), the outer wall of the adjusting screw (422) is screw-connected with the inner wall of the threaded hole II (421), and the insulating washer (43) is arranged between the bottom end of the adjusting screw (422) and the pin end of the integrated circuit (2).

5. An integrated circuit leadframe according to claim 4, wherein, The surface of the insulating washer (43) is attached to the bottom end of the adjusting screw (422), the bottom end of the insulating washer (43) is provided with an arc groove (431), and the top of the pin end of the integrated circuit (2) is attached to the arc groove (431), and the arc groove (431) is greater than the width of the pin of the integrated circuit (2).

6. An integrated circuit leadframe according to claim 5, wherein, A plurality of heat dissipation holes (5) are formed in the surface of the lead frame (1), and the plurality of heat dissipation holes (5) are respectively located on the surfaces of the plurality of mounting areas (3).

7. An integrated circuit leadframe according to claim 6, wherein, A fixing hole (6) is formed at each corner of the surface of the lead frame (1), and the lead frame (1) is mounted at a predetermined position through the fixing hole (6).

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