Touch and display driver integrated chip and display apparatus

Abstract

The present disclosure provides a touch and display driver integrated chip and a display apparatus. The touch and display driver integrated chip comprises a touch display analog integrated circuit and a touch display digital integrated circuit stacked above the touch display analog integrated circuit, wherein the touch display analog integrated circuit and the touch display digital integrated circuit are directly bonded and connected by means of hybrid bonding; the touch display analog integrated circuit is provided with a plurality of bonding pads, the plurality of bonding pads are capable of being bonded and connected to a touch display panel, and the touch display analog integrated circuit comprises a touch analog circuit and a display analog circuit; the touch display digital integrated circuit comprises a touch digital circuit and a display digital circuit; the touch display analog integrated circuit and the touch display digital integrated circuit are packaged together to form a touch display integrated chip.

Description

Touch and display driver integration chip and display device

[0001] Cross Reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202410888283.1, filed on July 3, 2024, and entitled "Touch and display driver integration chip and display device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure relates to the technical field of display, in particular to a touch and display driver integration chip and display device. BACKGROUND

[0004] TDDI (Touch and Display Driver Integration) products have the advantages of high touch sensitivity, thinness, etc., and are widely used. With the continuous development of display technology, touch display devices have been widely used. Generally, the touch panel and the display panel in the touch display device are independently controlled by two chips, and the integration degree is low. SUMMARY

[0005] The present disclosure provides a touch and display driver integration chip, and the specific scheme is as follows:

[0006] The present disclosure provides a touch and display driver integration chip, and the specific scheme is as follows:

[0007] The touch and display analog integrated circuit and the touch and display digital integrated circuit stacked above the touch and display analog integrated circuit;

[0008] The touch and display analog integrated circuit and the touch and display digital integrated circuit are directly bonded and communicated through a hybrid bonding mode. The touch and display analog integrated circuit is provided with a plurality of binding pads, which can be connected with a touch and display panel. The touch and display analog integrated circuit includes a touch analog circuit and a display analog circuit. The touch and display digital integrated circuit includes a touch digital circuit and a display digital circuit. The touch and display analog integrated circuit and the touch and display digital integrated circuit are packaged together to form a touch and display integrated chip.

[0009] Optionally, in the present disclosure, a hybrid binding layer is further arranged between the touch and display analog integrated circuit and the touch and display digital integrated circuit. The touch and display analog integrated circuit is directly bonded and communicated with the touch and display digital integrated circuit through the hybrid binding layer.

[0010] Optionally, in the embodiments of the present disclosure, the touch display analog integrated circuit further comprises a first wafer, a plurality of through silicon vias are formed in the first wafer and extend through the thickness direction of the first wafer, the plurality of bonding pads are electrically connected with the touch display digital integrated circuit through conductive layers arranged in the plurality of through silicon vias, and the projection area of each bonding pad on the first wafer is greater than the projection area of the corresponding through silicon via on the first wafer.

[0011] Optionally, in the embodiments of the present disclosure, the touch display analog integrated circuit further comprises a metal layer directly electrically connected with the conductive layers arranged in the plurality of through silicon vias, and a top metal layer and a bonding metal layer located on the side of the hybrid bonding layer; the touch display analog integrated circuit is directly bonded with the corresponding metal layer in the touch display digital integrated circuit through the bonding metal layer. Optionally, in the embodiments of the present disclosure, the plurality of through silicon vias are respectively located on opposite sides of the touch display analog integrated circuit.

[0012] Optionally, in the embodiments of the present disclosure, the touch display analog integrated circuit comprises a first control unit, a plurality of touch signal input / output interfaces, a plurality of analog front ends, a source driving unit, a gamma correction unit, a gate driving unit, a power management unit, a storage unit, a protocol interface, and a first input / output interface.

[0013] Optionally, in the embodiments of the present disclosure, the plurality of analog front ends are divided into two groups of analog front ends, and the two groups of analog front ends are respectively arranged on the two sides of the first control unit along a first direction.

[0014] The gate driving unit, the plurality of touch signal input / output interfaces, the source driving unit, and the gamma correction unit are arranged on a first side of the first control unit along a second direction, and the second direction is orthogonal to the first direction.

[0015] The power management unit, the storage unit, the protocol interface, and the first input / output interface are arranged on a second side of the first control unit along the second direction.

[0016] The source driving unit is divided into two groups of source driving units, the gate driving unit is divided into two groups of gate driving units, and the plurality of touch signal input / output interfaces are divided into two groups of touch signal input / output interfaces; the two groups of source driving units are symmetrically distributed about the gamma correction unit, the two groups of touch signal input / output interfaces are symmetrically distributed about the gamma correction unit, the two groups of gate driving units are symmetrically distributed about the gamma correction unit, and on the same side of the gamma correction unit, the gate driving unit, the touch signal input / output interface, and the source driving unit are sequentially arranged in the direction close to the gamma correction unit.

[0017] Optionally, in the embodiments of the present disclosure, some of the plurality of through silicon vias are located on the side of the gate driving unit, the plurality of touch signal input / output interfaces, the source driving unit and the gamma correction unit away from the first control unit; and the other of the plurality of through silicon vias are located on the side of the power management unit, the storage unit, the protocol interface and the first input / output interface away from the first control unit.

[0018] Optionally, in the embodiments of the present disclosure, the touch display digital integrated circuit comprises a second control unit, a first voltage stabilizer, a first oscillator, a second input / output interface, a second voltage stabilizer, a second oscillator and a third input / output interface.

[0019] Optionally, in the embodiments of the present disclosure, the first voltage stabilizer, the first oscillator and the second input / output interface are located on the first side of the second control unit along a second direction, and the second voltage stabilizer, the second oscillator and the third input / output interface are located on the second side of the second control unit along the second direction.

[0020] Optionally, in the embodiments of the present disclosure, a sealing ring is further included, and the sealing ring is arranged around the plurality of through silicon vias.

[0021] Optionally, in the embodiments of the present disclosure, the sealing ring is arranged around the touch display analog integrated circuit and the touch display digital integrated circuit.

[0022] Optionally, in the embodiments of the present disclosure, the touch display digital integrated circuit further comprises a second wafer, and the thickness of the first wafer is less than the thickness of the second wafer.

[0023] Correspondingly, the embodiments of the present disclosure provide a display device, which comprises:

[0024] The touch and display driving integrated chip as in any of the above, and a touch display panel in electrical connection with the touch and display driving integrated chip.

[0025] Optionally, in the embodiments of the present disclosure, the touch and display driving integrated chip is in binding connection with the non-display area of the touch display panel.

[0026] Optionally, in the embodiments of the present disclosure, a flexible circuit board in electrical connection with the touch and display driving integrated chip is further included, and the flexible circuit board is located between the touch display panel and a mainboard. BRIEF DESCRIPTION OF DRAWINGS

[0027] FIG. 1 is a schematic structural diagram of a display device in the related art;

[0028] Fig. 2 is a schematic diagram of one of the structures of the touch and display driving integrated chip according to an embodiment of the present disclosure;

[0029] Fig. 3 is a schematic diagram of one of the lead-out structures of the bonding pads in the touch and display driving integrated chip according to an embodiment of the present disclosure;

[0030] Fig. 4 is a schematic diagram of one of the planar layouts of the touch and display driving integrated chip according to an embodiment of the present disclosure;

[0031] Fig. 5 is a schematic diagram of one of the planar layouts of the touch and display driving digital integrated circuit in the touch and display driving integrated chip according to an embodiment of the present disclosure;

[0032] Fig. 6 is a schematic diagram of the design principle of the touch and display driving integrated chip according to an embodiment of the present disclosure;

[0033] Fig. 7 is a flow chart of one of the processes for manufacturing the touch and display driving integrated chip shown in Fig. 2;

[0034] Fig. 8 is a flow chart of the process for directly connecting the touch and display driving analog integrated circuit and the touch and display driving digital integrated circuit by using the HB Process;

[0035] Fig. 9 is a schematic diagram of one of the distributions of the plurality of bonding pads in the touch and display driving integrated chip in the touch and display driving analog integrated circuit according to an embodiment of the present disclosure;

[0036] Fig. 10 is a schematic diagram of one of the structures of the display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] In order to make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. And the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict, if necessary. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of the present disclosure.

[0038] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning of such terms for a person skilled in the art to which the present disclosure pertains. The terms "first", "second" and similar terms used in the present disclosure do not denote any order, quantity or importance, but are used to distinguish different components. The terms "include", "contain" and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "inner", "outer", "upper", "lower" and the like only represent relative positional relationships, which can change when the absolute positions of the described objects change.

[0039] It should be noted that the sizes and shapes of the various drawings in the drawings do not reflect the true proportions, but only serve to illustrate the present disclosure. The same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout.

[0040] In the related art, the display module of the TDDI product is controlled by a display driver integrated circuit (DDIC), and the touch module is controlled by a touch integrated circuit (TIC). The DDIC and the TIC each include an analog circuit and a digital circuit. The integration of the analog circuit and the digital circuit can be improved by using an advanced process, thereby reducing the area of the DDIC and the TIC. In addition, the analog circuit of the TIC and the analog circuit of the DDIC can be integrated to form a touch analog & driver analog circuit integration (TDACI), and the digital circuit of the TIC and the digital circuit of the DDIC can be integrated to form a touch logical & driver logical circuit integration (TDLCI).

[0041] In practical applications, the TDACI can be bonded on the touch display panel by using a flexible screen packaging (Chip On Pi, COP) technology, the TDLCI can be packaged by using a ball grid array packaging (Ball Gate Array, BGA) technology, and the TDLCI can be disposed on a flexible circuit board by using a surface mount technology (Surface Mount Technology, SMT). A corresponding structural diagram is shown in FIG. 1, in which, the number 01 represents the TDACI, the number 02 represents the TDLCI, and the number 03 represents the flexible circuit board. The distance of the signal connection line between the TDACI and the TDLCI is very far, about more than 5 mm, and the signal time delay will be relatively serious, which will cause additional data transmission power consumption. In addition, the signal transmission can also suffer various noise interferences, such as reflection noise, crosstalk noise, synchronous switch noise, and electromagnetic interference noise. The transmission rate between the TDACI and the TDLCI cannot reach a higher speed due to the too long signal line.

[0042] Therefore, the embodiments of the present disclosure provide a touch and display driving integrated chip and a display device, which are used to stack the TDACI and the TDLCI together by using a 3D packaging method, to form a whole touch and display driving integrated chip, so as to reduce the area of the flexible circuit board, reduce the cost of the flexible circuit board, shorten the signal transmission distance between the TDACI and the TDLCI, reduce the data transmission time, and not suffer various noise interferences. The additional data transmission power consumption can be ignored.

[0043] As shown in FIG. 2, one of the structures of the touch and display driving integrated chip provided by the embodiments of the present disclosure is shown. Specifically, the touch and display driving integrated chip includes:

[0044] a touch display analog integrated circuit 10 and a touch display digital integrated circuit 20 stacked above the touch display analog integrated circuit 10.

[0045] The touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are directly bonded and communicated by using a hybrid bonding method. The touch display analog integrated circuit 10 is provided with a plurality of bonding pads 30, which can be bonded and connected with a touch display panel. The touch display analog integrated circuit 10 includes a touch analog circuit and a display analog circuit. The touch display digital integrated circuit 20 includes a touch digital circuit and a display digital circuit. The touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are packaged together to form a touch display integrated chip.

[0046] In a specific implementation process, the touch and display driving integrated chip includes a touch display analog integrated circuit 10 and a touch display digital integrated circuit 20 stacked above the touch display analog integrated circuit 10; wherein the touch display analog integrated circuit 10 includes a touch analog circuit and a display analog circuit, and the touch display digital integrated circuit 20 includes a touch digital circuit and a display digital circuit. For example, the touch analog circuit is an analog circuit part in the TIC, the display analog circuit is an analog circuit part in the DDIC, the touch digital circuit is a digital circuit part in the TIC, and the display digital circuit is a digital circuit part in the DDIC; accordingly, the touch display analog integrated circuit 10 can be TDACI, and the touch display digital integrated circuit 20 can be TDLCI.

[0047] Moreover, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are directly bonded and communicated through a hybrid bonding method. For example, the TDLCI and the TDACI are interconnected together through a hybrid bonding process (HB Process), so that the signal transmission distance between the TDLCI and the TDLCI is almost 0, greatly reducing the data transmission time and not suffering from various noise interference. In the actual preparation process, the hybrid bonding is also called direct bonding interconnection (DBI), which is a buffer-free, low-temperature bonding technology that can form electrical interconnection and bonded chips at the same time. In an exemplary embodiment, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be connected through pure physical lines for signal connection, and the connection lines can reach thousands of lines. For example, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be connected through a signal interface, such as a serial peripheral interface (SPI), a mobile industry processor interface (MIPI), an Internet service provider (ISP) protocol interface, etc.

[0048] In addition, the touch display analog integrated circuit 10 is provided with a plurality of bonding pads 30, which can be connected with the touch display panel. In this way, the signal transmission between the touch display analog integrated circuit 10 and the touch display panel is ensured. The specific number and distribution of the plurality of bonding pads 30 can be set according to actual application needs, which is not limited herein. Moreover, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are packaged together to form a touch display integrated chip. For example, the touch display analog integrated circuit 10 can be punched and wired to be electrically connected with the touch display digital integrated circuit 20, thereby providing the possibility of 3D integration of the touch and display driving integrated chip. In this way, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be stacked together by 3D packaging to form a whole touch and display driving integrated chip (i.e., TDDI IC), thereby providing the possibility of reducing the area of the flexible circuit board, reducing the cost of the flexible circuit board, and ensuring the area of the battery compartment.

[0049] In the embodiments of the present disclosure, the touch display analog integrated circuit 10 further includes a first wafer 40, and a plurality of through silicon vias 50 are formed through the thickness direction of the first wafer 40. The plurality of bonding pads 30 are electrically connected with the touch display digital integrated circuit 20 through a conductive layer arranged in the plurality of through silicon vias 50, and the projection area of each bonding pad 30 on the first wafer 40 is greater than the projection area of the corresponding through silicon via 50 on the first wafer 40.

[0050] Still in combination with FIG. 2, the touch display analog integrated circuit 10 further includes a first wafer 40, and a plurality of through silicon vias 50 are formed through the thickness direction of the first wafer 40. For example, 2-4 TSVs can correspond to one bonding pad 30. In the specific implementation process, the hole size, pitch, relative position on the first wafer 40, and corresponding relationship between the TSV and the bonding pad 30 of the TSV can be set according to the design guidance of the wafer factory. Moreover, the plurality of bonding pads 30 are electrically connected with the touch display digital integrated circuit 20 through a conductive layer arranged in the plurality of through silicon vias 50, and the projection area of each bonding pad 30 on the first wafer 40 is greater than the projection area of the corresponding through silicon via 50 on the first wafer 40. Since the TSV is usually small, the plurality of bonding pads 30 are arranged to be larger, thereby providing a guarantee for the subsequent electrical connection between the touch display analog integrated circuit 10 and the touch display panel.

[0051] Still in combination with the exemplary embodiment shown in FIG. 2, a re-distribution layer 60 (RDL) is further provided on the side of the first wafer 40 away from the touch display digital integrated circuit 20, through which a plurality of bonding pads 30 can be formed. In a specific implementation process, the IC circuit connection point positions (i.e. I / O pads) originally designed for the touch display analog integrated circuit 10 can be connected through the re-distribution layer 60, and the connection point positions can be changed through wafer-level metal wiring and bump processes, so that the IC can be adapted to different packaging forms. In this way, the electrical connection between the touch display panel and the touch display analog integrated circuit 10 can be achieved through the plurality of bonding pads 30.

[0052] In the embodiments of the present disclosure, the plurality of through silicon vias 50 are respectively located on opposite sides of the touch display analog integrated circuit 10.

[0053] As shown in FIG. 3 is a schematic diagram of one kind of lead-out structure of the bonding pad 30 in the touch display analog integrated circuit 10. In the exemplary embodiment shown in FIG. 3, regions Q1 and Q2 respectively represent the distribution regions of the TSVs. Two TSVs are connected with one bonding pad 30. Of course, the connection relationship between the TSVs and the bonding pad 30, the distribution of the TSVs, and the distribution of the bonding pad 30 can also be set according to actual application needs, which are not limited herein.

[0054] In the embodiments of the present disclosure, as shown in FIG. 4 is a schematic diagram of one kind of floor plan of the touch display analog integrated circuit 10. Specifically, the touch display analog integrated circuit 10 includes a first control unit 11, a plurality of touch signal input / output interfaces 12_1, 12_2, a plurality of analog front ends 13_1, 13_2, a source driving unit 14_1, 14_2, a gamma correction unit 15, a gate driving unit 16_1, 16_2, a power management unit 17, a storage unit 18, a protocol interface 19, and a first input / output interface 70.

[0055] In the embodiments of the present disclosure, still in combination with FIG. 4, the plurality of analog front ends are divided into two groups of analog front ends 13_1, 13_2, which are respectively arranged on the two sides of the first control unit 11 along a first direction;

[0056] The gate driving unit 16_1, 16_2, the plurality of touch signal input / output interfaces 12_1, 12_2, the source driving unit 14_1, 14_2, and the gamma correction unit 15 are arranged on a first side of the first control unit along a second direction, and the second direction is orthogonal to the first direction;

[0057] The power management unit 17, the storage unit 18, the protocol interface 19, and the first input / output interface 70 are disposed on a second side of the first control unit 11 along the second direction;

[0058] The source driving units are divided into two groups of source driving units 14_1, 14_2, the gate driving units are divided into two groups of gate driving units 16_1, 16_2, and the plurality of touch signal input / output interfaces are divided into two groups of touch signal input / output interfaces 12_1, 12_2. The two groups of source driving units 14_1, 14_2 are symmetrically distributed about the gamma correction unit 15, the two groups of touch signal input / output interfaces 12_1, 12_2 are symmetrically distributed about the gamma correction unit 15, and the two groups of gate driving units 16_1, 16_2 are symmetrically distributed about the gamma correction unit 15 on the same side of the gamma correction unit 15. The gate driving units, the touch signal input / output interfaces, and the source driving units are sequentially disposed in a direction close to the gamma correction unit 15.

[0059] It should be noted that, unless otherwise specified, the direction indicated by the arrow X in the figure is the first direction, and the direction indicated by the arrow Y is the second direction.

[0060] For example, the gate driving unit 16_1, the touch signal input / output interface 12_1, and the source driving unit 14_1 are sequentially distributed on one side of the gamma correction unit 15, and the gate driving unit 16_2, the touch signal input / output interface 12_2, and the source driving unit 14_2 are sequentially distributed on the other side of the gamma correction unit 15.

[0061] For example, the first control unit 11 can be a timing controller (TCON). The first control unit 11 is configured to control the touch signal, the output signal of the gate driving units 16_1, 16_2, the output signal of the source driving units 14_1, 14_2, and the like.

[0062] For example, the plurality of touch signal input / output interfaces 12_1, 12_2 can include a transport (Tx) interface and a receive (Rx) interface. In one example embodiment, the Tx electrode of the touch display panel can be voltage driven through the touch signal output interface 12_1, and the Rx electrode of the touch display panel can be signal driven through the touch signal input interface 12_2. For example, the Tx electrode and the Rx electrode can be touch electrodes disposed in the touch display panel, and the touch signal input / output interface can interface the touch signal from the touch display panel.

[0063] Exemplarily, the plurality of analog front ends 13_1, 13_2 can be analog front ends (AFE). The plurality of analog front ends 13_1, 13_2 can receive and process analog signals representing touch information. For example, the plurality of analog front ends 13_1, 13_2 can filter and amplify the initial touch signals.

[0064] Exemplarily, the gamma correction unit 15 can be a gamma voltage generator. In actual applications, the gamma voltage generator can be used to generate gamma voltages for gamma correction of signals in the circuit.

[0065] Exemplarily, the power management unit 17 can be a power management circuit integration (PMIC), the source driving units 14_1, 14_2 can be source ICs, and the gate driving units 16_1, 16_2 can be gate on array (GOA).

[0066] In the implementation, based on the display basic comprehensive power consumption, processing performance, data processing performance, IC factory design level, wafer factory process capability and other factors, the touch display analog integrated circuit 10 includes digital intellectual property (IP) and analog IP. For example, the first control unit 11 and the gate driving units 16_1, 16_2 are digital IP.

[0067] Still in combination with the exemplary embodiment shown in FIG. 4, some of the plurality of through silicon vias 50 (as shown in region Q1 in the figure) are located on the side of the gate driving units 16_1, 16_2, the plurality of touch signal input / output interfaces 12_1, 12_2, the source driving units 14_1, 14_2 and the gamma correction unit 15 away from the first control unit 11; the other part of the plurality of through silicon vias 50 (as shown in region Q2 in the figure) are located on the side of the power management unit 17, the storage unit 18, the protocol interface 19 and the first input / output interface 70 away from the first control unit 11. In this way, the 3D packaging of the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 is ensured, and the subsequent binding connection of the touch display analog integrated circuit 10 and the touch display panel is possible.

[0068] In the embodiments of the present disclosure, as shown in FIG. 5, a floor plan of the touch display digital integrated circuit 20 is shown. Specifically, the touch display digital integrated circuit 20 includes a second control unit 21, a first voltage stabilizer 22, a first oscillator 23, a second input / output interface 24, a second voltage stabilizer 25, a second oscillator 26, and a third input / output interface 27.

[0069] Still in combination with FIG. 5, the first voltage stabilizer 22, the first oscillator 23, and the second input / output interface 24 are located on a first side of the second control unit 21 along a second direction, and the second voltage stabilizer 25, the second oscillator 26, and the third input / output interface 27 are located on a second side of the second control unit 21 along the second direction.

[0070] For example, the second control unit 21 can be a TCON. For example, the second control unit 21 can include a display IP and a micro control unit (MCU), the display IP is used to control the display process, and the MCU is used to control the touch process. The display IP and the MCU are connected to each other and communicate, the MCU can read the touch display panel ID, display brightness, driving timing and other information in the display IP, and complete automatic adjustment of the driving frequency of the touch based on the above information, so as to avoid noise interference between the touch and the display. The MCU automatically adjusts the touch report point rate according to the display brightness, so as to reduce the touch power consumption. The MCU can also include a digital signal processor (DSP). The display IP can read the report point rate or touch operation information of the MCU, and automatically change the refresh rate of the display, so as to achieve the purpose of reducing the display power consumption.

[0071] For example, the first voltage stabilizer 22 and the second voltage stabilizer 25 can be a low dropout regulator (LDO). The second input / output interface 24 and the third input / output interface 27 can be a MIPI, can also be an ISP protocol interface, and can also be a SPI, which are not limited here.

[0072] It should be noted that, based on the factors of basic comprehensive power consumption, processing power consumption, data processing performance, design level of IC factory, process capability of wafer factory, etc., the touch display digital integrated circuit 20 includes digital IP and analog IP. For example, the first voltage stabilizer 22, the second voltage stabilizer 25, the second input / output interface 24, the third input / output interface 27, the first oscillator 23 and the second oscillator 26 can be analog IP. In addition, part of the digital IP and part of the analog IP included in the touch display digital integrated circuit 20 can be shared with the touch display analog integrated circuit 10, such as the first oscillator 23 and the second oscillator 26. The touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can reduce the chip area and the chip cost by sharing the digital IP and the analog IP.

[0073] In the embodiments of the present disclosure, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are directly bonded through the HB Process, and there is basically no IR drop. In the wafer design of the touch display digital integrated circuit 20, analog circuits such as voltage stabilizers and oscillators can be included or not, but signal connection pads (pads, i.e., bonding pads 30) need to be introduced to the TDACI chip.

[0074] It should be noted that, in the planar schematic diagrams shown in FIGS. 4 and 5, only the corresponding regions are provided with corresponding functional modules, and different functional modules correspond to different interface modules. The positional relationship between the functional modules can be set according to actual application needs, which is not limited herein.

[0075] In the embodiments of the present disclosure, as shown in FIG. 6, a design principle block diagram of the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 in the touch and display driving integrated chip is shown. Specifically, the touch display analog integrated circuit 10 includes a first control unit 5101, a touch signal output interface 5102, an analog front end 5103, a power management unit 5104, a source driving unit 5105, a gamma correction unit 5106, a first level conversion unit 5107, a charge pump 5108, a voltage stabilizer 5109, an oscillator 5110, a digital-to-analog converter 5111, a second level conversion unit 5112, a latch 5113, a row buffer 5114, a second protocol interface 5115, a communication interface 5116, a general input / output interface 5117, and an analog-to-digital converter 5118.

[0076] It should be noted that in the implementation process, the first control unit 5101, the touch signal output interface 5102, the analog front end 5103, the power management unit 5104, the source driving unit 5105, the gamma correction unit 5106, the voltage stabilizer 5109, the oscillator 5110, the second protocol interface 5115 and the like are similar to the foregoing description, and will not be described herein again.

[0077] For example, the first level conversion unit 5107 and the second level conversion unit 5112 are used for converting the voltage of the signal. The digital-to-analog converter 5111 is used for converting the digital signal to the analog signal. The analog-to-digital converter 5118 is used for converting the analog signal to the digital signal. The general input and output interface 5117 can be used as a backup interface to transmit the data signal. The charge pump 5108 can be a capacitive voltage transformer. The latch 5113 can be a data latch. The line buffer 5114 can be a line buffer used for storing the image data of each row of pixels.

[0078] Still in combination with FIG. 6, the initial touch signals S_t1, S_t2 are received via the touch signal output interface 5102 and the analog front end 5103, and after the processing of the first control unit 5101, the analog front end 5103 and the analog-to-digital converter 5118, the target touch signal S_t3 can be output via the communication interface 5116.

[0079] In addition, the first level conversion unit 5107 receives the initial gate driving signal S_gate1 from the touch display digital integrated circuit 20, and under the control of the charge pump 5108, the voltage stabilizer 5109 and the power management unit 5104, the first level conversion unit 5107 converts the level of the initial gate driving signal S_gate1 to output the target gate driving signal S_gate2. For example, the first level conversion unit 5107 can convert the voltage domain of the initial gate driving signal S_gate1, amplify the voltage of the initial gate driving signal S_gate1, so that the target gate driving signal S_gate2 output to the touch display panel has sufficient voltage to drive the touch display panel. It should be noted that the gate driving unit generating the initial gate driving signal S_gate1 can be a digital IP integrated on the touch display analog integrated circuit 10, as shown in FIG. 4. In FIG. 6, only part of the analog IPs included in the touch display analog integrated circuit 10 are shown, and the gate driving unit is not shown.

[0080] In addition, still in combination with FIG. 6, the second protocol interface 5115 receives the source control signal S_control1 and the display data signal S_dispaly1 data, which can sequentially pass through the row buffer 5114, the first control unit 5101, the latch 5113, the second level conversion unit 5112, the digital-to-analog converter 5111 and the source driving unit 5105, and output the source driving signal S_source.

[0081] In a specific implementation process, the row buffer 5114 can buffer the data of the nth row, so as to facilitate the reception of the data of the (n+1)th row. The latch 5113 can store the level of the display data signal. The second level conversion unit 5112 can convert the level of the display data signal, for example, increase the level of the display data signal.

[0082] In addition, the gamma correction unit 5106 can output a gamma voltage as a reference voltage. The source driving unit 5105 can divide the analog signal output by the digital-to-analog converter 5111 based on the gamma voltage provided by the gamma correction unit 5106 to obtain a data voltage signal Vdata. The data voltage signal Vdata can represent the gray value of a plurality of pixel points in the image data. The voltage stabilizer 5109 can output an initialization signal VINIT to the touch display panel, and the timing of the initialization signal VINIT is consistent with the timing of the target gate driving signal S_gate2. The initialization signal VINIT is output to the pixel array of the touch display panel.

[0083] It should be noted that the structure and signal processing flow of the touch display analog integrated circuit 10 shown in FIG. 6 are only illustrative, and the touch display analog integrated circuit 10 includes but is not limited to the above-mentioned IP. The structure and signal processing flow of the touch display analog integrated circuit 10 are not limited in the embodiments of the present disclosure.

[0084] Still in combination with FIG. 6, the touch display digital integrated circuit 20 includes a second control unit 6201, a storage unit 6202, a gate driving unit 6203, an oscillator 6204, a first protocol interface 6205, a second protocol interface 6206, a communication interface 6207, a communication interface 6208, a general input / output interface 6209, a general input / output interface 6210, a chroma compensation buffer 6211, a display buffer 6212, a power management unit 6213, a data controller 6214, a command controller 6215, a video protocol processing unit 6216, and a communication bus interface 6217. In a specific implementation, the second control unit 6201, the storage unit 6202, the gate driving unit 6203, the oscillator 6204, the first protocol interface 6205, the second protocol interface 6206, the communication interface 6207, the communication interface 6208, the general input / output interface 6209, the general input / output interface 6210, and the power management unit 6213 are similar to the descriptions of the related parts described above, and thus are not described again.

[0085] For example, the chroma compensation buffer 6211 is used to eliminate chroma unevenness in image data. The display buffer 6212 is used to buffer image data. The data controller 6214 can be Data Control, which is used to control the transmission of image data. The command controller 6215 can be Command Control (CMD CTL), which is used to control the processing command of image data. The video protocol processing unit 6216 processes image data based on the Video Electronics Standards Association (VESA) standard. The communication bus interface 6217 can be an Inter Integrated Circuit (I2C) or an Improved Inter Integrated Circuit (I3C).

[0086] In a specific implementation, the target touch signal S_t3 is received via the communication interface 6207, and the target touch signal S_t3 is processed by the second control unit 6201 and the command controller 6215, and the touch data signal D_touch is output via the communication bus interface 6217. In addition, the image data signal D_drive is received via the first protocol interface 6205, and the image data signal D_drive is processed by the chroma compensation buffer 6211, the display buffer 6212, the data controller 6214, the command controller 6215, and the video protocol processing unit 6216, and the gate control signal S_control2 is output, and the gate driving unit 6203 outputs the initial gate driving signal S_gate1 based on the gate control signal S_control2.

[0087] It should be noted that the gate drive unit 6203 is integrated in the touch display analog integrated circuit 10 in structure, and is a digital IP in function. The part IP belonging to the digital IP in the touch display digital integrated circuit 20 is shown in FIG. 6, and therefore the gate drive unit 6203 is shown in the touch display digital integrated circuit 20 in FIG. 6.

[0088] In a specific implementation process, the image data signal D_drive is processed through the chroma compensation buffer 6211, the display buffer 6212, the data controller 6214, the command controller 6215 and the video protocol processing unit 6216, and the source control signal S_control1 and the display data signal S_display data are output via the second protocol interface 6206.

[0089] In the embodiment of the present disclosure, the chroma compensation buffer 6211 can be electrically connected with the flash via the communication interface 6208, and information in the flash is acquired to eliminate the problem of chromaticity unevenness of the image data indicated by the data signal.

[0090] In the embodiment of the present disclosure, the general input and output interface 6209 and the general input and output interface 6210 can be used to transmit reset signals and interrupt signals and the like.

[0091] In the embodiment of the present disclosure, the power management unit 6213 is controlled by the host control unit 500. For example, the host control unit 500 is located on the mainboard.

[0092] It should be noted that the structure and signal processing flow of the touch display digital integrated circuit 20 shown in FIG. 6 are only illustrative, and the touch display digital integrated circuit includes but is not limited to the above-mentioned IP. The structure and signal processing flow of the touch display digital integrated circuit 20 are not limited in the present disclosure.

[0093] In the embodiment of the present disclosure, the touch and display drive integrated chip further comprises a sealing ring 80, the sealing ring 80 is arranged around the plurality of through silicon vias 50.

[0094] Still in combination with the exemplary embodiment shown in FIGS. 4 and 5, the sealing ring 80 is arranged around the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20. In this way, the anti-electro-static discharge (ESD) capability of the touch and display drive integrated chip is improved by the sealing ring 80.

[0095] In the embodiment of the present disclosure, the touch display digital integrated circuit 20 further comprises a second wafer 90, and the thickness of the first wafer 40 is less than the thickness of the second wafer 90.

[0096] Still in combination with the example shown in FIG. 2, the thickness of the second wafer 90 is about 170 μm, and the thickness of the first wafer 40 ranges from 3 μm to 10 μm. In this way, it is convenient for subsequent TSVs to be formed in the first wafer 40.

[0097] In the embodiment of the present disclosure, the touch and display driving integrated chip further comprises other film layer structures in addition to the above-mentioned film layers. Still in combination with the example shown in FIG. 2, the touch and display driving integrated chip further comprises a hybrid bonding layer 91 between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20, and the touch display analog integrated circuit 10 is directly bonded to the touch display digital integrated circuit 20 through the hybrid bonding layer 91. That is, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be directly bonded to each other through the hybrid bonding layer 91.

[0098] In addition, in the embodiment of the present disclosure, the touch display analog integrated circuit further comprises a metal layer directly electrically connected to the conductive layer in the plurality of TSVs 50, and a top metal layer 92 and a bonding metal layer 93 located on the side close to the hybrid bonding layer 91 in sequence; the touch display analog integrated circuit 10 is directly bonded to the corresponding metal layer in the touch display digital integrated circuit 20 through the bonding metal layer 93. That is, the touch display analog integrated circuit 10 further comprises a metal layer directly electrically connected to the conductive layer in the TSV, and a top metal layer 92 and a bonding metal layer 93 located on the side close to the hybrid bonding layer 91 in sequence, and the specific arrangement is shown in FIG. 2. Accordingly, the touch display digital integrated circuit 20 further comprises a bonding layer corresponding to the bonding metal layer 93 in the touch display analog integrated circuit 10, and a metal layer directly contacting the bonding layer, and of course, other film layers are further provided between the metal layer directly contacting the bonding layer and the second wafer, which are not limited herein. In FIG. 2, the ellipsis part in the touch display analog integrated circuit 10 represents other stack structures, and the specific arrangement can be implemented by referring to related technologies, which are not described in detail herein; the ellipsis part in the touch display digital integrated circuit 20 in FIG. 2 represents other stack structures, and the specific arrangement can be implemented by referring to related technologies, which are not described in detail herein. Exemplarily, a 1P5M (i.e. 1 layer of Poly layer and 5 layers of metal layer) process can be used to prepare the related film layers in the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20.

[0099] To better understand the inventive concept of the embodiments of the present disclosure, the specific manufacturing process of the touch and display driving integrated chip shown in FIG. 2 is explained in detail below in combination with the process flowcharts shown in FIG. 7 and FIG. 8. Among them, FIG. 7 is one of the process flowcharts for manufacturing the touch and display driving integrated chip shown in FIG. 2, and FIG. 8 is a process flowchart for directly interconnecting the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 by using the HB Process.

[0100] First, the related film layer structure of the touch display analog integrated circuit 10 is manufactured on the first wafer 40, and the related film layer structure of the touch display digital integrated circuit 20 is manufactured on the second wafer 90. Exemplarily, the thickness of the first wafer 40 and the second wafer 90 is 750 μm. Then, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are directly interconnected together by using the HB Process, and the specific implementation process is shown in FIG. 8. Correspondingly, the touch display digital integrated circuit 20 can be stacked on the touch display analog integrated circuit 10, which provides guarantee for the subsequent 3D packaging of the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20. In this way, the signal transmission distance between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 is almost 0, thereby greatly reducing the data transmission time and avoiding various noise interferences.

[0101] Then, the thickness of the first wafer 40 and the second wafer 90 is thinned. For example, the thickness of the second wafer 90 after the thinning is about 170 μm, so that the overall IC thickness of the touch and display driving integrated chip can reach the same level as the conventional DIC. For example, the thickness of the first wafer 40 after the thinning ranges from 3 μm to 10 μm. The thicker the wafer of the touch display analog integrated circuit 10, the more difficult the TSV process. The thinner thickness of the first wafer 40 facilitates the subsequent TSV process, but the thickness of the first wafer 40 cannot be too thin, otherwise the first wafer 40 will be at risk of breaking. Then, a TSV back via process is used to open holes in the first wafer 40, and a plurality of TSVs penetrating the thickness direction of the first wafer 40 are obtained. The size, spacing and relative position of the TSVs on the first wafer 40 can refer to the design guidance of the wafer factory. Then, a redistribution layer 60 is made on the side of the first wafer 40 away from the touch display digital integrated circuit 20, and a bump position is left, and a gold bump is arranged at the bump position, thereby forming a bonding bump pin (Bonding Bump Pin). For example, the distribution of the plurality of bonding bump pins 30 in the touch display analog integrated circuit 10 can also be as shown in FIG. 9, and the specific setting can be realized by referring to the related technology, which is not described in detail here. Then, wafer testing (CP Test) and final wafer cutting and other processes are performed, thereby obtaining the touch and display driving integrated chip as shown in FIG. 2.

[0102] In one of the example embodiments, the signal connection between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be pure physical line connection, and the connection lines can reach thousands. In this way, the signal attenuation and the data transmission power consumption can be relatively small. When the pure physical line connection is adopted, if the IP in the touch display digital integrated circuit 20 needs to be upgraded, the physical connection line between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 needs to be redesigned, and accordingly, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 both need to be redesigned and reflowed. If the resolution and the touch channel number supported by the touch display analog integrated circuit 10 change (mainly increase), the physical connection line between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 also needs to be redesigned, and accordingly, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 both need to be redesigned and reflowed. That is, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 cannot form a public IC, and the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 need thousands of physical connection lines, and the probability of HB process failure is greater. It should be noted that the so-called public IC can also be referred to as a public wafer, that is, the same version of the touch display digital integrated circuit 20 can correspond to multiple versions of the touch display analog integrated circuit 10, or the same version of the touch display analog integrated circuit 10 can correspond to multiple versions of the touch display digital integrated circuit 20.

[0103] In one example embodiment, the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be connected through a signal interface, for example, SPI, MIPI, ISP, etc. In this example embodiment, the number of connection lines between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 is only dozens, the number of HB connection interfaces between them is small, and the probability of HB Process failure is relatively small. In this example embodiment, if the IP of the touch display digital integrated circuit 20 is upgraded, only the touch display digital integrated circuit 20 needs to be redesigned and taped out, and the touch display analog integrated circuit 10 does not need to be designed and changed, and can be used as a public IC. If only the resolution or the number of touch channels changes, only the touch display analog integrated circuit 10 needs to be redesigned and taped out, and the touch display digital integrated circuit 20 does not need to be designed and changed, and can be used as a public IC. However, when using a signal interface connection, the signal attenuation and data transmission power consumption between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 are relatively large. In the specific implementation process, the connection mode between the touch display analog integrated circuit 10 and the touch display digital integrated circuit 20 can be set according to the actual application needs, which is not limited here.

[0104] It should be noted that when the touch display digital integrated circuit 20 is subsequently electrically connected to the main control unit 500 on the mainboard, the signal connection lines between the touch display digital integrated circuit 20 and the main control unit 500 can be led to the touch display analog integrated circuit 10 through HB Process, and then the signal connection lines between the touch display digital integrated circuit 20 and the main control unit 500 are led to the plurality of bonding pads 30 through the wiring in the touch display analog integrated circuit 10. Subsequently, the plurality of bonding pads 30 can be bonded on the touch display panel through the anisotropic conductive film (ACF) hot pressing process.

[0105] Based on the same disclosure concept, as shown in FIG. 10, the display device provided by the embodiment of the present disclosure also includes the touch and display driving integrated chip 100 described in any one of the above, and the touch display panel 200 electrically connected to the touch and display driving integrated chip 100.

[0106] In the embodiment of the present disclosure, the touch and display driving integrated chip 100 is bonded and connected to the non-display area B of the touch display panel 200.

[0107] In the embodiment of the present disclosure, the display device further includes a flexible circuit board 300 electrically connected to the touch and display driving integrated chip 100, and the flexible circuit board 300 is located between the touch display panel 200 and the mainboard 400.

[0108] In the implementation process, the display device includes a touch and display driving integrated chip 100, a touch display panel 200, a flexible circuit board 300 and a mainboard 400; wherein the touch display panel 200 includes a non-display area B and a display area A. For example, the display area is used for displaying a picture, and the touch and display driving integrated chip 100 is bound to the non-display area B of the touch display panel 200. The flexible circuit board 300 is located between the touch display panel 200 and the mainboard 400, and the aforementioned main control unit 500 can be arranged on the mainboard 400. For example, the touch and display driving integrated chip 100 can be bound to the touch display panel 200 by using an ACF hot pressing process. The flexible circuit board 300 can further be provided with a component area 600 and a wiring area. For example, the component area 600 can be provided with capacitors, resistors, transient voltage suppressors (TVS) and flash memories and the like.

[0109] In the embodiment of the present disclosure, since the touch and display driving integrated chip 100 is a chip formed by binding together the touch display analog integrated circuit and the touch display digital integrated circuit by using 3D packaging, the touch display digital integrated circuit will not occupy the area of the flexible circuit board 300, and compared with FIG. 1, the area of the flexible circuit board 300 in the embodiment of the present disclosure can be smaller.

[0110] It should be noted that the touch and display driving integrated chip 100 in the embodiment of the present disclosure is applicable to touch display products of various sizes, such as 7.0-inch products, 8.0-inch products and the like. In addition, the touch and display driving integrated chip 100 can support pure self-capacitance touch function, and can also support self-capacitance and mutual-capacitance integrated touch function, which is not limited herein.

[0111] Since the display device solves the problem by the similar principle as the aforementioned touch and display driving integrated chip 100, the implementation of the display device can refer to the implementation of the aforementioned touch and display driving integrated chip 100, and the repeated parts will not be described herein.

[0112] In the implementation process, the display device provided by the embodiment of the present disclosure can be an organic light emitting diode (OLED) display device, and can be specifically a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator or any product or component having a display function. Other essential components of the display device should be understood by those skilled in the art, and will not be described herein, and should not be regarded as a limitation on the present disclosure.

[0113] While the preferred embodiments of the disclosure have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the foregoing description. Therefore, the appended claims are intended to encompass within their scope all possible variations and modifications of the preferred embodiments of the disclosure.

[0114] It is apparent that those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations fall within the scope of the claims of the present disclosure and their equivalents, they are also intended to be encompassed by the present disclosure.​

Claims

1. A touch and display driver integrated chip, wherein, The application relates to a touch display analog integrated circuit and a touch display digital integrated circuit stacked above the touch display analog integrated circuit. The touch display analog integrated circuit and the touch display digital integrated circuit are directly bonded in communication through a hybrid bonding mode, the touch display analog integrated circuit is provided with a plurality of binding pads, the plurality of binding pads can be bound to a touch display panel, the touch display analog integrated circuit comprises a touch analog circuit and a display analog circuit, the touch display digital integrated circuit comprises a touch digital circuit and a display digital circuit, and the touch display analog integrated circuit and the touch display digital integrated circuit are packaged together to form a touch display integrated chip. The application further relates to a hybrid binding layer between the touch display analog integrated circuit and the touch display digital integrated circuit, and the touch display analog integrated circuit is directly bonded in communication with the touch display digital integrated circuit through the hybrid binding layer.

2. The integrated chip of claim 1, wherein, The touch display analog integrated circuit further comprises a first wafer, a plurality of through silicon vias are formed in the first wafer and penetrate the thickness direction of the first wafer, the plurality of binding pads are electrically connected to the touch display digital integrated circuit through conductive layers arranged in the plurality of through silicon vias, and the projection area of each binding pad on the first wafer is larger than the projection area of the corresponding through silicon via on the first wafer.

3. The integrated chip of claim 2, wherein, The touch display analog integrated circuit further comprises a metal layer directly electrically connected to the conductive layers in the plurality of through silicon vias, a top metal layer and a bonding metal layer arranged in sequence on the side close to the hybrid binding layer, and the touch display analog integrated circuit is directly bonded in communication with the corresponding metal layer in the touch display digital integrated circuit through the bonding metal layer.

4. The integrated chip of claim 3, wherein, The plurality of through silicon vias are respectively arranged on opposite sides of the touch display analog integrated circuit.

5. The integrated chip of claim 3 or 4, wherein, The touch display analog integrated circuit comprises a first control unit, a plurality of touch signal input and output interfaces, a plurality of analog front ends, a source driving unit, a gamma correction unit, a gate driving unit, a power management unit, a storage unit, a protocol interface and a first input and output interface.

6. The integrated chip of claim 5, wherein, The plurality of analog front ends are divided into two groups of analog front ends, and the two groups of analog front ends are respectively arranged on the two sides of the first control unit along a first direction.

7. The integrated chip of claim 6, wherein, The gate driving unit, the plurality of touch signal input and output interfaces, the source driving unit and the gamma correction unit are arranged on the first side of the first control unit along a second direction, and the second direction is orthogonal to the first direction. The power management unit, the storage unit, the protocol interface and the first input and output interface are arranged on the second side of the first control unit along the second direction. ​ The source driving unit is divided into two groups of source driving units, the gate driving unit is divided into two groups of gate driving units, and the plurality of touch signal input / output interfaces are divided into two groups of touch signal input / output interfaces. The two groups of source driving units are symmetrically distributed about the gamma correction unit, the two groups of touch signal input / output interfaces are symmetrically distributed about the gamma correction unit, and the two groups of gate driving units are symmetrically distributed about the gamma correction unit. On the same side of the gamma correction unit, the gate driving unit, the touch signal input / output interface, and the source driving unit are arranged sequentially along the direction close to the gamma correction unit.

8. The integrated chip of claim 6, wherein, A portion of the plurality of through-silicon vias are located on the side opposite to the first control unit of the gate driving unit, the plurality of touch signal input / output interfaces, the source driving unit, and the gamma correction unit; the other portion of the plurality of through-silicon vias are located on the side opposite to the first control unit of the power management unit, the storage unit, the protocol interface, and the first input / output interface.

9. The integrated chip of any of claims 1-4, 6-8, wherein, The touch display digital integrated circuit includes a second control unit, a first voltage regulator, a first oscillator, a second input / output interface, a second voltage regulator, a second oscillator, and a third input / output interface.

10. The integrated chip of claim 9, wherein, The first voltage regulator, the first oscillator, and the second input / output interface are located on the first side of the second control unit along the second direction, and the second voltage regulator, the second oscillator, and the third input / output interface are located on the second side of the second control unit along the second direction.

11. The integrated chip of claim 3 or 4, wherein, It also includes a sealing ring disposed around the plurality of through-silicon vias.

12. The integrated chip of claim 11, wherein, The sealing ring is arranged around the touch display analog integrated circuit and the touch display digital integrated circuit.

13. The integrated chip of claim 3, wherein, The touch display digital integrated circuit also includes a second wafer, wherein the thickness of the first wafer is less than the thickness of the second wafer.

14. A display device, wherein, include: The touch and display driver integrated chip as described in any one of claims 1-13, and the touch display panel electrically connected to the touch and display driver integrated chip.

15. The display device of claim 14, wherein, The touch and display driver integrated chip is bonded to the non-display area of ​​the touch display panel.

16. The display device of claim 15, wherein, It also includes a flexible circuit board electrically connected to the touch and display driver integrated chip, the flexible circuit board being located between the touch display panel and the motherboard.

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