Sensor control apparatus

Abstract

Provided is a sensor control apparatus, comprising a sensor assembly, an electronic assembly, and a connection assembly. The sensor assembly comprises a distal end portion for measuring a signal related to an analyte level, and a proximal end portion connected to the distal end portion and provided with a first contact point. The distal end portion is connected to the electronic assembly by means of the proximal end portion. The electronic assembly comprises an electronic device, a device housing configured for accommodating the electronic device, and a receiving portion formed in the device housing and configured for accommodating the connection assembly. The electronic device comprises a second contact point, a power supply module, and a switch module connected to the power supply module. The connection assembly comprises a connector and a trigger portion. The connector comprises a conductive portion configured for connecting the first contact point and the second contact point, and a sealing portion partially surrounding the conductive portion. At least a part of the trigger portion protrudes from the surface of the sealing portion distal to the sensor assembly. When the conductive portion is in contact with the second contact point, the trigger portion is in contact with the switch module and compresses the switch module. As such, the service life of a power source can be prolonged.

Description

Sensor control device TECHNICAL FIELD

[0001] The utility model relates to the field of biological medicine industry, especially relate to a sensor control device. BACKGROUND

[0002] Monitoring the glucose concentration or other analyte levels (such as blood ketone concentration or lactic acid concentration, etc.) of some users is crucial to their health. For example, for diabetic patients, if their own glucose concentration is not monitored, some complications may be caused due to the lack of timely control. For example, continuous glucose monitoring (CGM) systems have been widely used in the field of glucose control, and users can continuously monitor glucose, control glucose and reduce the occurrence of complications through the CGM system.

[0003] The medical devices for monitoring analyte levels described above need to be equipped with a power supply to maintain their daily work. During the period from the completion of the medical device to the first use by the user, the power supply may be consumed during standby, so that the power supply cannot provide sufficient power when the user uses the medical device. Currently, some solutions use magnetic field switches or NFC (Near Field Communication) activation devices to control the power supply. Such solutions generally use semiconductor devices to realize the switching function.

[0004] However, due to the existence of a certain leakage current in the off state of the semiconductor, the continuous leakage current can easily shorten the shelf life of the medical device. In addition, the semiconductor is easily affected by temperature, and in some cases, a large leakage current may be generated, thereby affecting the service life or reliability of the medical device. SUMMARY

[0005] The utility model is proposed in view of the above situation, and the purpose is to provide a sensor control device capable of improving the service life of the power supply.

[0006] To this end, the utility model provides a sensor control device, include: sensor component, electronic component and connecting component, sensor component includes the far end part for measuring and the signal related with analyte level and the near end part with first contact is connected with far end part, far end part is connected with electronic component through near end part, electronic component includes electronic device, the device housing for accommodating electronic device and the receiving part formed in device housing and used for accommodating connecting component, electronic device includes second contact, power module and switch module connected with power module, connecting component includes connector and trigger part, connector includes the conductive part for connecting first contact and second contact and the sealing part at least partially surrounds conductive part, at least a part of trigger part protrudes from the surface of sealing part far from sensor component side, when conductive part and second contact contact, trigger part and switch module contact and extrude switch module to make switch module in closed state, in this case, switch module realizes switch function based on the machine switch principle of contact and extrusion, and the state of switch module is controlled through the process of cleverly using sensor component and electronic component connection by trigger part, thereby can reduce leakage current through mechanical conduction, and can improve the service life of power supply. In addition, compared with using semiconductor device to control power supply conduction, can not rely on the device matched with semiconductor device, help to reduce cost.

[0007] In addition, in the sensor control device related to the utility model, optionally, the switch module includes a third contact, a fourth contact and a conductive piece; when the switch module is in an open state, the third contact is connected with the conductive piece, and the fourth contact is not in contact with the conductive piece; when the trigger part extrudes the conductive piece, the conductive piece is in contact with the fourth contact. In this case, the switch module can be in a closed state by making the conductive piece in contact with the fourth contact, which helps to simplify the conduction of the switch module.

[0008] In addition, in the sensor control device related to the utility model, optionally, the switch module includes a third contact, a fourth contact and a conductive piece; when the switch module is in an open state, the third contact is not in contact with the conductive piece, and the fourth contact is not in contact with the conductive piece; when the trigger part extrudes the conductive piece, the conductive piece is in contact with the third contact and the fourth contact. In this case, both contacts are not in contact with the conductive piece, which helps to reduce the possibility of mistakenly turning on the switch module when the control device is not in use.

[0009] In addition, in the sensor control device, optionally, the third contact and / or the fourth contact not in contact with the conductive member is / is are isolated from the conductive member by an insulating medium, and the insulating medium is in a gaseous state or a solid state. Thus, the contact and the conductive member can be easily isolated.

[0010] In addition, in the sensor control device, optionally, the switch module further comprises a first insulating member arranged between the conductive member and the fourth contact and supporting the conductive member, and when the trigger portion extrudes the conductive member, the conductive member moves along a space formed by the first insulating member and the third contact and towards the fourth contact to make the conductive member contact the fourth contact. In this case, the first insulating member isolates the conductive member and the fourth contact, and the risk of the conductive member being undesirably deformed to cause the switch module to be erroneously turned on can be reduced.

[0011] In addition, in the sensor control device, optionally, at least a portion of the trigger portion is a tapered geometric body. In this case, the conductive member can be extruded with relatively concentrated pressure, and the corresponding portion of the conductive member can be preferentially moved towards the fourth contact to make the portion contact the fourth contact.

[0012] In addition, in the sensor control device, optionally, the insulating medium between the fourth contact and the conductive member is in a gaseous state, and when the trigger portion extrudes the conductive member, the conductive member moves towards the fourth contact to make the conductive member contact the fourth contact. In this case, the gaseous insulating medium can make the conductive member easily contact the fourth contact, and the process is simpler than when other forms of insulating medium are arranged.

[0013] In addition, in the sensor control device, the electronic device further comprises a processing module, the switch module is arranged between the power module and the processing module, when the switch module is in the closed state, the processing module turns on the power module; or the electronic device further comprises a processing module and a power controller, the processing module comprises a processing controller, the power module is connected with the power controller and the processing module respectively, the switch module is arranged between the power module and the power controller, when the switch module is in the closed state, the power controller turns on the power module to change the input of the processing controller, when the input of the processing controller is changed, the processing module starts to work, when the processing module starts to work, the processing controller locks the power state of the power module; or the electronic device further comprises a processing module and a power controller connected with the power module, the processing module comprises a processing controller, the processing module is connected with the power module through the power controller, the switch module is arranged between the power module and the power controller, when the switch module is in the closed state, the power controller turns on the power module to change the input of the power controller, when the input of the power controller is changed, the power module starts to supply power to the processing module through the power controller, when the processing module is powered on, the processing controller locks the power controller. In this case, the switch module is arranged between the power module and the processing module, so that the power module can be controlled simply. In addition, the power module is connected with the power controller and the processing module respectively, the input of the processing controller is changed by the power controller, and then the processing module starts to work, so that the use of the power controller is not affected. In addition, the switch module is arranged between the power module and the power controller, the power module supplies power to the processing module by using the power controller as an intermediate device, so that the power controller is locked to avoid accidental shutdown during use, and the circuit design is relatively simple.

[0014] In addition, in the sensor control device, the switch module is arranged in the space formed by the plurality of second contacts, and the trigger part is arranged in the space formed by the plurality of conductive parts. Therefore, the trigger part can be contacted and pressed against the switch module when the sensor assembly and the electronic assembly are connected.

[0015] In addition, in the sensor control device, the trigger part is made of an insulating material. Therefore, the risk of misdirecting other devices during the pressing process of the switch module can be reduced.

[0016] In addition, in the sensor control device, the connecting assembly further comprises a supporting portion for supporting the connector, the trigger portion penetrates through the sealing portion and is fixed to the supporting portion, and the hardness of the supporting portion is greater than the hardness of the sealing portion. In this case, the supporting portion can increase the pressure of the trigger portion pressing the switch module, thereby facilitating the deformation of the switch module.

[0017] According to the utility model, a sensor control device capable of prolonging the service life of a power supply is provided. BRIEF DESCRIPTION OF DRAWINGS

[0018] The utility model will now be explained in further detail by way of example only with reference to the accompanying drawings.

[0019] Fig. 1 is a schematic diagram showing a monitoring environment of glucose concentration according to an example of the utility model.

[0020] Fig. 2 is an exemplary block diagram showing a control device according to an example of the utility model.

[0021] Fig. 3 is an assembly schematic diagram showing an electronic assembly and a connecting assembly according to an example of the utility model.

[0022] Fig. 4 is a structural schematic diagram showing a sensor assembly according to an example of the utility model.

[0023] Fig. 5A is a structural schematic diagram showing an electronic assembly according to an example of the utility model.

[0024] Fig. 5B is an assembly schematic diagram showing an electronic assembly according to an example of the utility model.

[0025] Fig. 6A is a cross-sectional schematic diagram showing a first embodiment of a switch module along AA' shown in Fig. 5A.

[0026] Fig. 6B is a cross-sectional schematic diagram showing a second embodiment of a switch module along AA' shown in Fig. 5A.

[0027] Fig. 7 is a schematic diagram showing a connecting assembly according to an example of the utility model.

[0028] Fig. 8 is a schematic diagram showing a connector according to an example of the utility model.

[0029] Fig. 9A is a schematic diagram showing a first embodiment of a shape of a trigger portion according to an example of the utility model.

[0030] Fig. 9B is a schematic diagram showing a second embodiment of a shape of a trigger portion according to an example of the utility model.

[0031] Fig. 10A is a schematic diagram showing a first embodiment of a target circuit controlled by a switch module according to the present application.

[0032] Fig. 10B is a schematic diagram showing a second embodiment of a target circuit controlled by a switch module according to the present application.

[0033] Fig. 10C is a schematic diagram showing a third embodiment of a target circuit controlled by a switch module according to the present application. DETAILED DESCRIPTION

[0034] Hereinafter, preferred embodiments of the present application will be described in detail with reference to the accompanying drawings. In the following description, the same components are designated by the same reference numerals, and overlapping descriptions will be omitted. In addition, the drawings are schematic diagrams, and the proportions of the sizes of the components with respect to each other or the shapes of the components, etc. can be different from the actual ones. It should be noted that the terms "comprise" and "have" and any variations thereof, such as a process, a method, a system, a product, or an apparatus including or having a series of steps or units, are not necessarily limited to those clearly listed steps or units, but can include or have other steps or units that are not clearly listed or inherent to the process, the method, the product, or the apparatus.

[0035] First, related terms involved in the present application will be introduced.

[0036] A "mechanical switch" can refer to a device that achieves the closed and open states of a circuit in the form of a physical machine. The on-off mode of the mechanical switch is to make the corresponding device contact or separate by external force (for example, by extrusion of the trigger part involved in the present application). In addition, the circuit can be closed by the mechanical switch, which can be referred to as mechanical conduction.

[0037] A sensor control device involved in the present application example can be used to collect and analyze signals related to the level of an analyte (hereinafter referred to as analyte signals), and the service life of the power supply can be improved by the switch module and the trigger part. Hereinafter, the sensor control device will be referred to as the control device. The control device involved in the present application example can also be referred to as a medical instrument or an analyte monitoring device, etc.

[0038] In some examples, for the analyte being glucose, the sensor assembly can be a glucose sensor, and the analyte level can be a glucose concentration. However, the glucose concentration is not limiting, and other body fluid components can be obtained by changing the sensor assembly, such as one or more of glucose, acetylcholine, amylase, bilirubin, cholesterol, chorionic gonadotropin, creatine kinase, creatine, creatinine, DNA, fructosamine, glutamine, growth hormone, hormones, ketones, lactic acid, oxygen, peroxide, prostate specific antigen, prothrombin, RNA, thyroid stimulating hormone, or troponin.

[0039] For convenience of description, some examples are described with the analyte being glucose, and the analyte level being a glucose concentration. It is noted that this does not limit the present application, and the relevant description is also applicable to other analyte levels, unless there is a contradiction.

[0040] Examples of the present application will be described in detail below with reference to the accompanying drawings. Fig. 1 is a schematic diagram showing a monitoring environment of a glucose concentration according to an example of the present application.

[0041] Referring to Fig. 1, the monitoring environment can include a control device 100 and a receiving device 900. The control device 100 can be configured to obtain analyte information of a host. The receiving device 900 can be configured to receive and process and / or display the analyte information. In some examples, the control device 100 can be coupled to the receiving device 900. In some examples, the control device 100 can be directly or indirectly communicatively coupled to the receiving device 900. The control device 100 can be communicatively coupled to the receiving device 900 via one or more communication links. For example, the communication links can include at least one of a proprietary wireless protocol, a wired communication link (e.g., serial communication), and a wireless communication link (e.g., Bluetooth). In other examples, the control device 100 can also operate as a standalone device and have the receiving device 900 integrated within itself.

[0042] Fig. 2 is an exemplary block diagram showing the control device 100 according to an example of the present application. Fig. 3 is an assembly diagram showing the electronic assembly 120 and the connection assembly 130 according to an example of the present application.

[0043] Referring to Fig. 2, in some examples, the control device 100 can include a sensor assembly 110, an electronic assembly 120, and a connection assembly 130. The sensor assembly 110 can be used to measure an analyte signal, the electronic assembly 120 can be used to receive the analyte signal, and the connection assembly 130 can be used to connect the sensor assembly 110 and the electronic assembly 120.

[0044] In some examples, at least a portion of the sensor assembly 110 can be implanted subcutaneously in the host, the electronics assembly 120 can be adhered to the body surface of the host, and at least a portion of the sensor assembly 110 can be electrically connected to the electronics assembly 120 via the connecting assembly 130. In some examples, the sensor assembly 110 can be removably assembled to the electronics assembly 120 via the connecting assembly 130. In such cases, the connecting assembly 130 and the electronics assembly 120 can be separately packaged before the connecting assembly 130 is assembled to the electronics assembly 120, facilitating separate sterilization of the sensor assembly 110 and the electronics assembly 120 by different means.

[0045] In addition, the connecting assembly 130 can be assembled to the inside or outside of the electronics assembly 120. In some examples, the connecting assembly 130 can be assembled to a receiving portion 122 (described later) of the electronics assembly 120, which can be located inside or outside of the electronics assembly 120. For example, the receiving portion 122 can be located on the outer surface or the inner surface of a device housing 123 (described later) of the electronics assembly 120.

[0046] In some examples, for the receiving portion 122 located outside of the electronics assembly 120, it can be convenient to detach the sensor assembly 110 from outside of the electronics assembly 120, which is suitable for the integrated electronics assembly 120. For example, FIG. 3 shows an example in which the receiving portion 122 is a cavity outside of the electronics assembly 120, it should be noted that this is not intended to limit the present application. In some examples, for the receiving portion 122 located inside of the electronics assembly 120, it can be convenient to detach the sensor assembly 110 when the electronics assembly 120 is opened, which is suitable for the split electronics assembly 120.

[0047] FIG. 4 is a schematic diagram showing the structure of the sensor assembly 110 according to an example of the present application.

[0048] Referring to FIG. 4, in some examples, the sensor assembly 110 can include a distal portion 111 and a proximal portion 112. The distal portion 111 can be used to measure an analyte signal, and the proximal portion 112 can be used to receive the analyte signal. The proximal portion 112 can be connected to the distal portion 111.

[0049] In some examples, the distal portion 111 can be connected to the electronics assembly 120 via the proximal portion 112. In some examples, the distal portion 111 can be placed subcutaneously in the host.

[0050] In some examples, the distal portion 111 can include a plurality of electrodes. In some examples, the plurality of electrodes can include a working electrode and a counter electrode. In some examples, for a glucose sensor, a sensing layer including glucose enzyme can be disposed on the working electrode, and the distal portion 111 placed under the skin can undergo an oxidation-reduction reaction with glucose in the body fluid through the glucose enzyme on the working electrode and form a loop with the counter electrode to generate a current signal (i.e., one of the analyte signals). In some examples, processing the current signal can obtain glucose concentration information.

[0051] In some examples, the plurality of electrodes of the distal portion 111 can further include a reference electrode. In some examples, the reference electrode can form a known and fixed potential difference with the body fluid. In this case, the potential difference between the working electrode and the body fluid can be measured through the potential difference between the reference electrode and the working electrode, and thus the voltage generated by the working electrode can be more accurately obtained.

[0052] Referring to FIG. 4, in some examples, the proximal portion 112 can have a first contact 1121, which can be used to connect with the electronic component 120. In some examples, the proximal portion 112 can be connected with the electronic component 120 through the connecting component 130. In some examples, the first contact 1121 can have a shape of a disc.

[0053] In some examples, the sensor component 110 can be made of a flexible material. Thus, it can better adapt to various environments (e.g., deployment environments).

[0054] In some examples, a part of the sensor component 110 can be accommodated in a puncture member. Thus, the sensor component 110 can be guided to be implanted under the skin of a host through the puncture member. In some examples, the puncture member can be installed in the connecting component 130.

[0055] FIG. 5A is a structural schematic diagram of the electronic component 120 involved in the examples of the present application. FIG. 5B is an assembly schematic diagram of the electronic component 120 involved in the examples of the present application.

[0056] As described above, in some examples, the electronic component 120 can receive the analyte signal measured by the sensor component 110. As an example, FIG. 5A is a schematic diagram of the electronic component 120 with the assembly space of the connecting component 130 located outside.

[0057] Referring to FIG. 5B, in some examples, the electronic component 120 can include an electronic device 121. The electronic device 121 can be configured to receive, process, and / or transmit the analyte signal. In some examples, the electronic device 121 can be a PCB (Printed Circuit Board).

[0058] Referring to FIGS. 5A and 5B, in some examples, the electronics 121 can include a second contact 1211. The second contact 1211 can be configured to connect with the first contact 1121 of the sensor assembly 110. In some examples, the number of the second contact 1211 and the first contact 1121 can be the same.

[0059] With continued reference to FIG. 5B, in some examples, the electronics 121 can include a power module 1212. The power module 1212 can provide electrical energy.

[0060] In some examples, the electronics 121 can include a processing module 1213. The processing module 1213 can be configured to receive the analyte signal. In some examples, the processing module 1213 can be further configured to process the analyte signal. In some examples, the processing module 1213 can also be configured to transmit the received analyte signal to the receiving device 900.

[0061] In some examples, the processing module 1213 can include a processing controller 12131 (described later). In some examples, the processing controller 12131 can control the power module 1212. In some examples, the processing controller 12131 can cooperate with a power controller 1215 (described later) to control the power module 1212.

[0062] With continued reference to FIGS. 5A and 5B, in some examples, the electronics 121 can include a switch module 1214. The switch module 1214 can be connected with the power module 1212. As such, the switch module 1214 can control the power module 1212. In some examples, the switch module 1214 can control the power module 1212 to provide power to the processing module 1213. Specifically, the switch module 1214 can cause the power module 1212 to provide electrical energy to the processing module 1213 or cause the power module 1212 to stop providing electrical energy to the processing module 1213.

[0063] In some examples, the switch module 1214 can have an open state and a closed state. In some examples, the state of the switch module 1214 can be controlled by the trigger portion 132 (described later). In some examples, the initial state of the switch module 1214 can be the open state. In some examples, the switch module 1214 can be switched from the initial open state to the closed state under the action of the trigger portion 132. In some examples, when the switch module 1214 is in the closed state, the sensor assembly 110 and the electronics assembly 120 can form an electrical connection.

[0064] In some examples, the switch module 1214 can be a mechanical switch. That is, the switch module 1214 can implement a switching function based on a physical mechanical form. In this case, by mechanically turning on, leakage current can be reduced, thereby improving the service life of the power supply. In addition, compared with using a semiconductor device to control the conduction of the power supply, it can not rely on devices cooperating with semiconductor devices (such as magnets), which helps to reduce costs.

[0065] FIG. 6A is a cross-sectional view showing the first embodiment of the switch module 1214 along AA' shown in FIG. 5A. FIG. 6B is a cross-sectional view showing the second embodiment of the switch module 1214 along AA' shown in FIG. 5A.

[0066] Referring to FIG. 6A, in some examples, the switch module 1214 can include a third contact 12141, a fourth contact 12142, and a conductive member 12143. The third contact 12141 and the fourth contact 12142 can physically disconnect the circuit between the device requiring electrical energy and the power supply module 1212. For example, the third contact 12141 and the fourth contact 12142 can physically disconnect a part of the circuit between the processing module 1213 and the power supply module 1212. The conductive member 12143 can close the physically disconnected circuit by physically contacting the third contact 12141 and the fourth contact 12142. In some examples, if the conductive member 12143 turns on the third contact 12141 and the fourth contact 12142, the power supply module 1212 can start to provide electrical energy to the processing module 1213. Hereinafter, the third contact 12141 and the fourth contact 12142 of the switch module 1214 are collectively referred to as switch contacts.

[0067] In some examples, at least one of the switch contacts of the switch module 1214 can not be in contact with the conductive member 12143 when the switch module 1214 is in the off state. In some examples, the third contact 12141 and / or the fourth contact 12142 not in contact with the conductive member 12143 can be isolated from the conductive member 12143 by an insulating medium. That is, the contact not requiring contact with the conductive member 12143 can be isolated from the conductive member 12143 by the insulating medium.

[0068] In some examples, the form of the insulating medium can be gaseous or solid. In this way, the contact and the conductive member 12143 are isolated. For example, the gaseous insulating medium can be air.

[0069] In some examples, the switch module 1214 can be pressed by the trigger portion 132 to be in the closed state. In some examples, the switch module 1214 can be disposed near the second contact 1211. Thus, it is facilitated to press the switch module 1214 to be in the closed state when the conductive portion 1311 contacts the second contact 1211. In some examples, the switch module 1214 can be disposed near the second contact 1211 in relation to the position of the trigger portion 132.

[0070] In some examples, the switch module 1214 can be disposed in the space formed by the plurality of second contacts 1211. Thus, it is facilitated to contact the trigger portion 132 disposed in the space formed by the plurality of conductive portions 1311. In addition, it is also facilitated to contact the trigger portion 132 and press the switch module 1214 when the sensor assembly 110 and the electronic assembly 120 are connected when the trigger portion 132 is disposed in the space formed by the plurality of conductive portions 1311. In some examples, the switch module 1214 can also be disposed around the space formed by the plurality of second contacts 1211.

[0071] In some examples, when the switch module 1214 is in the open state, the third contact 12141 can be connected with the conductive member 12143, and the fourth contact 12142 can not be in contact with the conductive member 12143. In this case, the switch module 1214 can be in the closed state by contacting the conductive member 12143 with the fourth contact 12142, and it is facilitated to make the switch module 1214 conductive. In some examples, when the trigger portion 132 presses the conductive member 12143, the conductive member 12143 can be in contact with the fourth contact 12142. Thus, the switch module 1214 can be in the closed state.

[0072] Referring to FIG. 6A, in some examples, when the switch module 1214 is in the open state, the third contact 12141 can be connected with the conductive member 12143, and the fourth contact 12142 can not be in contact with the conductive member 12143 and the form of the insulating medium therebetween can be gaseous, and when the trigger portion 132 presses the conductive member 12143, the conductive member 12143 can move towards the fourth contact 12142 to make the conductive member 12143 contact the fourth contact 12142. In this case, the conductive member 12143 can be easily contacted with the fourth contact 12142 by the gaseous insulating medium, and the process is simpler relative to disposing other forms of insulating medium.

[0073] For example, referring to FIG. 6A, the trigger portion 132 can press the conductive member 12143 downwards along the pressing direction D and contact the fourth contact 12142, where the insulating region A can be filled with air.

[0074] Referring to FIG. 6B, in some examples, when the switch module 1214 is in the off state, the third contact 12141 can be connected with the conductive piece 12143, and the fourth contact 12142 can be not in contact with the conductive piece 12143, and the form of the insulating medium therebetween can be solid.

[0075] Specifically, the switch module 1214 can include a first insulating piece 12144, which can be disposed between the conductive piece 12143 and the fourth contact 12142 and support the conductive piece 12143. When the trigger portion 132 presses the conductive piece 12143, the conductive piece 12143 can move along the space formed by the first insulating piece 12144 and the third contact 12141 and towards the fourth contact 12142 to make the conductive piece 12143 contact the fourth contact 12142. That is, the pressing of the trigger portion 132 can make the conductive piece 12143 deform downward along the space supported by the first insulating piece 12144 and contact the fourth contact 12142. In this case, by isolating the conductive piece 12143 and the fourth contact 12142 through the first insulating piece 12144, the risk of undesired deformation of the conductive piece 12143 leading to false conduction of the switch module 1214 can be reduced.

[0076] For example, referring to FIG. 6B, the trigger portion 132 can press the conductive piece 12143 downward along the pressing direction D, making the conductive piece 12143 deform, move towards the fourth contact 12142 along the side of the first insulating piece 12144 close to the third contact 12141 after being released from the support of the first insulating piece 12144, and further contact the fourth contact 12142.

[0077] In some examples, the hardness of the first insulating piece 12144 can be lower than that of the trigger portion 132. In this case, the first insulating piece 12144 is easy to deform, facilitating the movement of the conductive piece 12143 along the first insulating piece 12144. For example, the material of the first insulating piece 12144 can be foamed material or plastic with low hardness, etc. In some examples, the first insulating piece 12144 can also be formed by the way of point gluing and solidification.

[0078] In some examples, the conductive piece 12143 can not be in contact with the third contact 12141 and the fourth contact 12142 when the switch module 1214 is in the open state. Specifically, the third contact 12141 can not be in contact with the conductive piece 12143, and the fourth contact 12142 can not be in contact with the conductive piece 12143. In this case, neither of the two contacts is in contact with the conductive piece 12143, which helps to reduce the possibility of mistakenly turning on the switch module 1214 when the control device 100 is not in use. In some examples, the conductive piece 12143 can be in contact with the third contact 12141 and the fourth contact 12142 when the trigger portion 132 presses the conductive piece 12143. In this way, the switch module 1214 can be turned on.

[0079] In some examples, the conductive piece 12143 can be prevented from being in contact with the third contact 12141 and the fourth contact 12142 by providing two insulating pieces. Specifically, the switch module 1214 can include a second insulating piece and a third insulating piece, the second insulating piece can be provided between the conductive piece 12143 and the third contact 12141, and the third insulating piece can be provided between the conductive piece 12143 and the fourth contact 12142. The second insulating piece and the third insulating piece can support the conductive piece 12143, and when the trigger portion 132 presses the conductive piece 12143, the conductive piece 12143 can move along the space formed by the second insulating piece and the third insulating piece and towards the third contact 12141 and the fourth contact 12142 to make the conductive piece 12143 in contact with the third contact 12141 and the fourth contact 12142.

[0080] In some examples, the spatial relationship between the switch contacts and the conductive piece 12143 can be arranged in the direction in which the connection assembly 130 is installed into the electronic assembly 120. In this way, the state switching of the switch module 1214 can be achieved during the assembly process of the control device 100.

[0081] In some examples, the switch contacts can be made of a flexible conductive material. For example, the flexible conductive material can be conductive silicone.

[0082] In some examples, the conductive piece 12143 can have elastic or plastic properties. In this way, it is convenient to deform after being pressed to turn on the corresponding contacts. For example, the conductive piece 12143 can be a thin metal sheet or a spring.

[0083] As described above, a part of the switch contacts can be connected to the conductive piece 12143. In some examples, the switch contacts can be welded to the conductive piece 12143. In some examples, the switch contacts can be integral with the conductive piece 12143.

[0084] Referring back to FIG. 5B, in some examples, the electronic device 121 can include a power controller 1215. The power controller 1215 can cooperate with the switch module 1214 to control the power module 1212.

[0085] In some examples, the electronic device 121 can further include a sampling module. The sampling module can be configured to sample the electrode signals of the sensor assembly 110. In some examples, the electronic device 121 can further include a wireless communication module. The wireless communication module can be configured to communicate with an external device (e.g., the receiving device 900) to enable wireless data transmission.

[0086] With continued reference to FIG. 5B, in some examples, the electronic assembly 120 can include a receiving portion 122, which can be configured to receive the connection assembly 130. In some examples, the receiving portion 122 can be a recess formed on an exterior of the electronic assembly 120 (see FIG. 5A). In some examples, the receiving portion 122 can be a receiving cavity formed on an interior of the electronic assembly 120. In some examples, the receiving portion 122 can be formed on the device housing 123 (described later). That is, the device housing 123 can form a space that can receive the connection assembly 130.

[0087] In some examples, the receiving portion 122 can be a recess formed on an exterior of the device housing 123. In some examples, the recess can be formed by recessing the device housing 123 in a direction toward a thickness of the device housing 123 (see FIG. 5A). In some examples, on an edge of the recess, a locking structure can be provided that cooperates with the support portion 133 of the connection assembly 130. In some examples, the second contact 1211 of the electronic device 121 can be located within the recess.

[0088] In some examples, the receiving portion 122 can be a receiving cavity provided on an interior of the device housing 123. In some examples, the receiving cavity can be provided on a lower surface of the device housing 123. In some examples, the device housing 123 can include a base and an upper cover combined to the base, and the receiving portion 122 can be formed on an inner surface of the base. In some examples, for the receiving cavity provided on the interior of the device housing 123, the connection assembly 130 is received in the receiving portion 122 and the upper cover is combined to the base (i.e., the electronic assembly 120 is closed) to electrically connect the sensor assembly 110 to the electronic assembly 120. That is, the sensor assembly 110 can be electrically connected to the electronic assembly 120 when the connection assembly 130 is received in the receiving portion 122 and the upper cover is combined to the base. In some examples, the second contact 1211 of the electronic device 121 can be located on a surface of the electronic device 121 opposite to the receiving cavity.

[0089] With continued reference to FIG. 5B, in some examples, the electronics assembly 120 can include a device housing 123. The device housing 123 can be used to house the electronic device 121. That is, the electronic device 121 can be disposed inside the device housing 123.

[0090] With reference back to FIG. 5A, in some examples, the electronics assembly 120 can include a first engagement hole 124 that extends from a top surface to a bottom surface, and the axis of the sensor assembly 110 can pass through the first engagement hole 124 when the sensor assembly 110 is assembled with the electronics assembly 120. In this case, the piercing member is inserted through the first engagement hole 124 to puncture the subcutis, which facilitates the placement of the sensor assembly 110 under the skin. In some examples, where the receiving portion 122 is a receiving cavity disposed within the device housing 123, the first engagement hole 124 can not be necessary.

[0091] In some examples, a side of the electronics assembly 120 that is in contact with the skin can be provided with an adhesive. In this way, the electronics assembly 120 can be adhered to the skin surface of the host.

[0092] FIG. 7 is a schematic diagram illustrating a connection assembly 130 according to examples of the present disclosure. FIG. 8 is a schematic diagram illustrating a connector 131 according to examples of the present disclosure.

[0093] As mentioned above, in some examples, the connection assembly 130 can be used to provide electrical connections for the sensor assembly 110 and the electronics assembly 120. With reference to FIG. 7, in some examples, the connection assembly 130 can include a connector 131 that can be used to provide electrical connections for the sensor assembly 110 and the electronics assembly 120. In some examples, the connector 131 can also provide a waterproof seal.

[0094] With reference to FIG. 8, in some examples, the connector 131 can include a conductive portion 1311 and a sealing portion 1312. The conductive portion 1311 can be used to provide electrical connections for the sensor assembly 110 and the electronics assembly 120, and the sealing portion 1312 can be used to provide a waterproof seal for portions of the conductive portion 1311 that do not need to be electrically connected. In some examples, the sealing portion 1312 can also be used to electrically insulate portions of the conductive portion 1311 that do not need to be electrically connected.

[0095] In some examples, the conductive portion 1311 can be used to connect the first contacts 1121 and the second contacts 1211. In some examples, the conductive portion 1311 can have end portions 1311a that protrude out of the surface of the sealing portion 1312. In some examples, the two end portions 1311a of the conductive portion 1311 can be in contact with a corresponding number of the first contacts 1121 and a corresponding number of the second contacts 1211, respectively.

[0096] In some examples, for the conductive portion 1311 being an elastic material, the end portion 1311a of the conductive portion 1311 can be higher than the sealing ring 13121a (to be described later) of the sealing portion 1312. In this case, when the sealing portion 1312 is in a compressed state, the conductive portion 1311 is deformed under pressure, which can improve the tightness of the end portion 1311a of the conductive portion 1311 to the electronic component, and in turn can improve the reliability of the electrical connection.

[0097] In some examples, the number of the conductive portion 1311 can be multiple. For example, the number of the conductive portion 1311 can be 2, 3, or 4. In the embodiment shown in FIG. 8, the number of the conductive portion 1311 is 3. However, the examples of the present embodiment are not limited thereto, and the number of the conductive portion 1311 can be the same as the number of the first contact 1121 of the sensor assembly 110. That is, the multiple conductive portions 1311 can correspond to the multiple first contacts 1121. In some examples, the conductive portion 1311 can be columnar.

[0098] As described above, the connector 131 can include a sealing portion 1312. Referring to FIG. 8, in some examples, the sealing portion 1312 can at least partially surround the conductive portion 1311. In some examples, the sealing portion 1312 can surround the portion of the conductive portion 1311 that does not need to achieve electrical connection, to provide waterproof sealing and / or electrical insulation.

[0099] In some examples, the sealing portion 1312 can include a first seat body 13121, which can at least partially surround the conductive portion 1311 to expose the end portion 1311a of the conductive portion 1311. In some examples, the periphery of the first seat body 13121 can have a sealing ring 13121a higher than the exposed surface of the conductive portion 1311. That is, the outer ring of the first seat body 13121 has a raised fence. In some examples, two sealing rings 13121a can be respectively provided at both ends of the first seat body 13121. In this way, waterproof sealing can be provided for the corresponding electronic components at both ends, respectively.

[0100] In some examples, when the sensor assembly 110 is electrically connected to the electronic assembly 120, the first seat body 13121 with the sealing ring 13121a can provide waterproof sealing for the second contact 1211. In some examples, the first seat body 13121 with the sealing ring 13121a can also provide waterproof sealing for the first contact 1121.

[0101] With continued reference to FIG. 8, in some examples, the sealing portion 1312 can further include a second seat body 13122. In some examples, the first seat body 13121 and the second seat body 13122 can provide a housing space for the proximal end portion 112 of the sensor assembly 110. In some examples, the proximal end portion 112 of the sensor assembly 110 can be located between the first seat body 13121 and the second seat body 13122.

[0102] In some examples, the first seat body 13121 and the second seat body 13122 with the sealing ring 13121a can cooperate to provide a waterproof seal for the first contact 1121.

[0103] In some examples, the sealing portion 1312 can further include a seat body connecting portion 13123, which can be used to connect the first seat body 13121 and the second seat body 13122.

[0104] In some examples, the sealing portion 1312 can further include an extension portion, which can extend outwardly along a side wall of the sealing portion 1312 near the proximal end portion 112 of the sensor assembly 110. In some examples, the extension portion has a through hole, which can be used to cooperate with a protrusion of a fixing assembly to fix the connection assembly 130. In addition, the fixing assembly can be configured to allow the connector 131 to be disposed on a support portion 133 (to be described later).

[0105] In some examples, the conductive portion 1311 can be made of a first material, and the sealing portion 1312 can be made of a second material, which is different from the first material.

[0106] In some examples, the first material can include a conductive substance. In some examples, the first material can include silicone and a conductive substance. In some examples, the first material can be made by adding a conductive substance to silicone.

[0107] In some examples, the second material can be a non-conductive material. In some examples, the second material can be a non-conductive elastic material. That is, the sealing portion 1312 can be made of a non-conductive elastic material. In this case, the sealing portion 1312 made of an elastic material has the property of being deformed under pressure, which can improve the tightness of the relevant contact surface with the electronic component, thereby improving the sealing effect. In some examples, the second material can be non-conductive silicone.

[0108] Referring back to FIG. 7, in some examples, the connection assembly 130 can include a trigger portion 132. The trigger portion 132 can be used to control the state of the switch module 1214. In some examples, the trigger portion 132 can contact and press the switch module 1214 to put the switch module 1214 in the closed state when the conductive portion 1311 and the second contact 1211 are in contact. In this case, the switch module 1214 is a mechanical switch based on the physical mechanical form, and the contact between the conductive portion 1311 and the second contact 1211 puts the switch module 1214 in the closed state, which helps to achieve mechanical conduction while maintaining the existing structure of the control device 100.

[0109] As described above, in some examples, the trigger portion 132 can press the conductive part 12143 to move the conductive part 12143 towards the fourth contact 12142, and thus make the conductive part 12143 contact the fourth contact 12142. In some examples, the trigger portion 132 can press the conductive part 12143 to move the conductive part 12143 along the space formed by the first insulating part 12144 and the third contact 12141 and towards the fourth contact 12142, and thus make the conductive part 12143 contact the fourth contact 12142. In some examples, the trigger portion 132 can press the conductive part 12143, and thus make the conductive part 12143 contact the third contact 12141 and the conductive part 12143 contact the fourth contact 12142.

[0110] In some examples, the trigger portion 132 can be disposed on the connector 131. In some examples, the trigger portion 132 can be disposed on the sealing portion 1312. In this case, it is possible to facilitate the control of the switch module 1214 during the connection of the connection assembly 130 to the sensor assembly 110 and the electronic assembly 120, and further help to achieve mechanical conduction while maintaining the existing structure of the control device 100 (e.g., maintaining the product complexity and size substantially unchanged). In some examples, at least a part of the trigger portion 132 can protrude from the surface of the sealing portion 1312 away from the sensor assembly 110 (see FIG. 7). In this case, on the one hand, it is possible to provide waterproof sealing using the sealing space formed by the sealing portion 1312, and on the other hand, it is convenient to put the switch module 1214 in the closed state when the sensor assembly 110 and the electronic assembly 120 are assembled.

[0111] In some examples, the trigger portion 132 can be disposed on the surface of the sealing portion 1312 away from the sensor assembly 110. In some examples, the trigger portion 132 can penetrate the sealing portion 1312 and protrude from the surface of the sealing portion 1312 away from the sensor assembly 110.

[0112] In some examples, the trigger 132 can be provided in the connector 131 and fixed to the support 133 (to be described later). In some examples, the trigger 132 can penetrate the sealing portion 1312 and be fixed to the support 133. Specifically, the trigger 132 can penetrate the sealing portion 1312, wherein one end of the trigger 132 can protrude from the surface of the sealing portion 1312 on the side away from the sensor assembly 110, and the other end can be fixed to the support 133. In this case, the hardness of the support 133 is generally greater, and the pressure of the trigger 132 pressing the switch module 1214 can be increased by the support 133, thereby facilitating the deformation of the switch module 1214.

[0113] In some examples, for the case where the trigger 132 penetrates the sealing portion 1312, the sensor assembly 110 can avoid the trigger 132. For example, the proximal end portion 112 can avoid the axis of the trigger 132 or the proximal end portion 112 can have a space to avoid the axis of the trigger 132 passing through the space. In some examples, the space to avoid can be an avoiding hole.

[0114] With reference to FIG. 7, in some examples, the trigger 132 can be located in the space formed by the plurality of conductive portions 1311. In this way, the structure of the connection assembly 130 can be compact. In some examples, the trigger 132 can also be located outside the space formed by the plurality of conductive portions 1311. For example, the trigger 132 can be located around the space formed by the plurality of conductive portions 1311.

[0115] In some examples, the trigger 132 can be made of an insulating material. In this way, the risk of misdirecting other devices in the process of pressing the switch module 1214 can be reduced.

[0116] In some examples, the hardness of the trigger 132 can be greater than the hardness of the conductive part 12143 of the switch module 1214. In this way, it is helpful to form sufficient deformation when pressing the conductive part 12143.

[0117] FIG. 9A is a schematic diagram showing a first embodiment of the shape of the trigger 132 according to an example of the present application. FIG. 9B is a schematic diagram showing a second embodiment of the shape of the trigger 132 according to an example of the present application. In order to better describe the shape of the trigger 132, part of the structure of the connector 131 is also included in FIGS. 9A and 9B.

[0118] In addition, the shape of the trigger 132 can be any shape that can press the switch module 1214 to move at least part of the switch module 1214 in a desired direction, thereby causing the switch module 1214 to be in a closed state.

[0119] In some examples, at least a portion of the trigger portion 132 can include at least one of a square geometry (see FIG. 9A) and a tapered geometry (see FIG. 9B). In some examples, at least a portion of the trigger portion 132 can be one end of the trigger portion 132.

[0120] For example, the square geometry can be a cube or a cuboid. In addition, the tapered geometry can have a feature of gradually transitioning from a wider bottom to a narrower top. That is, the tapered geometry can have a tapered feature from wide to narrow. For example, the tapered geometry can be a conical structure or a wedge-shaped structure.

[0121] In some examples, the shape of at least a portion of the trigger portion 132 can be set according to the structure of the switch module 1214. For this purpose, the utility model also provides some examples.

[0122] As described above, in some examples, the trigger portion 132 can press the conductive piece 12143 so that the conductive piece 12143 can move towards the fourth contact 12142, thereby making the conductive piece 12143 contact the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a square geometry. In this case, the conductive piece 12143 can be pressed with relatively uniform pressure, facilitating the movement of the conductive piece 12143 as a whole towards the fourth contact 12142, thereby improving the possibility of contacting the fourth contact 12142.

[0123] In some examples, the trigger portion 132 can press the conductive piece 12143 so that the conductive piece 12143 moves along the space formed by the first insulating piece 12144 and the third contact 12141 and towards the fourth contact 12142, thereby making the conductive piece 12143 contact the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a tapered geometry. In this case, the conductive piece 12143 can be pressed with relatively concentrated pressure, facilitating the movement of the corresponding portion of the conductive piece 12143 towards the fourth contact 12142 in order to facilitate the contact between the portion and the fourth contact 12142.

[0124] In some examples, the trigger portion 132 can press the conductive piece 12143 so that the conductive piece 12143 contacts the third contact 12141 and the conductive piece 12143 contacts the fourth contact 12142. Preferably, at least a portion of the trigger portion 132 can be a square geometry. In this case, the conductive piece 12143 can be pressed with relatively uniform pressure, facilitating the movement of the conductive piece 12143 as a whole towards the third contact 12141 and the fourth contact 12142, thereby improving the possibility of contacting the third contact 12141 and the fourth contact 12142.

[0125] As described above, the trigger portion 132 can control the state of the switch module 1214. Specifically, when the sensor assembly 110 is not assembled with the electronic assembly 120 (e.g., when the control device 100 is on the shelf), the switch module 1214 located in the electronic assembly 120 can be in an open state (e.g., the conductive member 12143 is not in full contact with the switch contact); when the sensor assembly 110 is assembled with the electronic assembly 120 through the connecting assembly 130, the trigger portion 132 located in the connecting assembly 130 can start to contact and press the switch module 1214 as the connecting assembly 130 is assembled with the electronic assembly 120, and the switch module 1214 is deformed to be in a closed state (e.g., the conductive member 12143 is deformed to be in full contact with the switch contact) after being pressed.

[0126] Referring back to FIG. 7, in some examples, the connecting assembly 130 can further include a support portion 133, which can be used to support the connector 131. Specifically, the connector 131 can be accommodated in the electronic assembly 120 through the support portion 133. For example, the connector 131 can be accommodated in the receiving portion 122 of the electronic assembly 120 through the support portion 133. In some examples, the support portion 133 can at least partially surround the bottom of the connector 131.

[0127] In some examples, the support portion 133 can have a second engagement hole 1331, and the axis of the sensor assembly 110 can pass through the second engagement hole 1331. In some examples, when the connecting assembly 130 is embedded in the electronic assembly 120, the first engagement hole 124 of the electronic assembly 120 and the second engagement hole 1331 of the support portion 133 can communicate with each other. That is, when the connecting assembly 130 is embedded in the electronic assembly 120, the axis of the distal end portion 111 of the sensor assembly 110 can pass through the first engagement hole 124 of the electronic assembly 120 and the second engagement hole 1331 of the support portion 133.

[0128] In some examples, the support portion 133 can further include a structure capable of being fastened to the electronic assembly 120. Referring to FIG. 7, in some examples, the support portion 133 can further include a clamping portion 1332 arranged around the periphery. In addition, the receiving portion 122 of the electronic assembly 120 can also be formed in a shape matching the support portion 133 to be adapted to receive the support portion 133.

[0129] In some examples, the hardness of the support portion 133 can be greater than the hardness of the connector 131. In this case, when the connector 131 achieves the effect of some low-hardness materials (e.g., waterproof sealing), the support portion 133 can protect the connector 131.

[0130] In some examples, the hardness of the support portion 133 can be greater than the hardness of the sealing portion 1312 of the connector 131. In this case, when the trigger portion 132 is fixed to the support portion 133, the pressure of the trigger portion 132 extruding the switch module 1214 can be increased by the support portion 133, thereby facilitating the deformation of the switch module 1214.

[0131] As described above, the switch module 1214 has an open state and a closed state. The switch module 1214 can control a circuit (hereinafter referred to as a target circuit) between the power supply module 1212 and the processing module 1213. For this purpose, the utility model also provides some examples of controlling the target circuit through the switch module 1214. It should be noted that this does not limit the utility model, and the way of controlling the target circuit can be selected as needed.

[0132] FIG. 10A is a schematic diagram illustrating a first embodiment of controlling the target circuit through the switch module 1214 according to an example of the utility model. FIG. 10B is a schematic diagram illustrating a second embodiment of controlling the target circuit through the switch module 1214 according to an example of the utility model. FIG. 10C is a schematic diagram illustrating a third embodiment of controlling the target circuit through the switch module 1214 according to an example of the utility model. It should be noted that FIG. 10A, FIG. 10B and FIG. 10C show a part of the connection diagram related to the switch module 1214, and the omitted part can be set as needed.

[0133] Referring to FIG. 10A, in some examples, the switch module 1214 can be arranged between the processing module 1213 and the power supply module 1212. In this way, the control of the power supply module 1212 can be simplified. When the switch module 1214 is in the closed state, the processing module 1213 can turn on the power supply module 1212. That is, after the conductive part 12143 of the switch module 1214 is extruded, the power supply module 1212 can be directly turned on. In some examples, when the switch module 1214 is in the open state, the processing module 1213 can disconnect the connection with the power supply module 1212.

[0134] Referring to FIG. 10B and 10C, in some examples, the target circuit can be controlled by turning on the power supply module 1212 and the power supply controller 1215 through the switch module 1214.

[0135] As described above, in some examples, the processing module 1213 can include a processing controller 12131. In some examples, the processing controller 12131 can start working after detecting that the input of the power controller 1215 changes. In some examples, the processing controller 12131 can also lock the power state of the power module 1212 or lock the power controller 1215. In this case, it is able to make the processing module 1213 whether to be powered on or not independent of the power controller 1215 (i.e. not directly related to the state of the switch module 1214), and in turn, it is able to avoid the false shutdown in use.

[0136] In some examples, the power controller 1215 can make the input of the processing controller 12131 of the processing module 1213 change. Thus, after the power controller 1215 is turned on, the processing controller 12131 is able to identify the state change of the power controller 1215.

[0137] Referring to FIG. 10B, in some examples, the power module 1212 can be connected to the power controller 1215 and the processing module 1213 respectively, and the switch module 1214 can be arranged between the power module 1212 and the power controller 1215. When the switch module 1214 is in the closed state, the power controller 1215 turns on the power module 1212 to make the input of the processing controller 12131 change, and when the input of the processing controller 12131 changes, the processing module 1213 starts working. In this case, the power module 1212 is connected to the power controller 1215 and the processing module 1213 respectively, and the input of the processing controller 12131 is changed by the power controller 1215, and in turn, the processing module 1213 starts working, which helps to control not to be affected by the power controller 1215 in use.

[0138] In some examples, the processing module 1213 starting working can mean that the processing module 1213 is activated. For example, when the switch module 1214 is in the open state, the processing module 1213 can be in the state of shutdown or hibernation. When the switch module 1214 is in the closed state, the processing module 1213 can be activated through the power controller 1215 and the processing controller 12131. In some examples, when the processing module 1213 starts working, the electronic assembly 120 can form an electrical connection with the sensor assembly 110.

[0139] In some examples, when the power controller 1215 turns on the power module 1212, the pin level of the processing controller 12131 can be pulled high, and in turn, the input of the processing controller 12131 changes.

[0140] In some examples, the processing controller 12131 can lock the power state of the power module 1212 when the processing module 1213 starts working. That is, the processing controller 12131 can lock the power state to avoid false shutdown after the processing module 1213 starts working.

[0141] In some examples, the processing module 1213 can be connected to the power module 1212 through the power controller 1215. Referring to FIG. 10C, in some examples, the power controller 1215 can be connected to the power module 1212, the processing module 1213 can be connected to the power module 1212 through the power controller 1215, the switch module 1214 can be arranged between the power module 1212 and the power controller 1215, the power controller 1215 turns on the power module 1212 to change the input of the power controller 1215 when the switch module 1214 is in the closed state, and the power module 1212 can start supplying power to the processing module 1213 through the power controller 1215 when the input of the power controller 1215 changes. In this case, the switch module 1214 is arranged between the power module 1212 and the power controller 1215, the power module 1212 supplies power to the processing module 1213 through the power controller 1215 as an intermediate device, which helps to avoid false shutdown during use by locking the power controller 1215 and the circuit design is relatively simple.

[0142] In some examples, the pin level of the power controller 1215 can be pulled high when the power controller 1215 turns on the power module 1212, and then the input of the power controller 1215 changes.

[0143] In some examples, the processing controller 12131 can lock the power controller 1215 when the processing module 1213 is powered on. That is, the processing controller 12131 can lock the power controller 1215 to avoid false shutdown. In this case, the power controller 1215 can be independent of the state of the switch module 1214, and false shutdown during use can be avoided.

[0144] In some examples, the processing controller 12131 can detect the state of the power controller 1215, and lock the power controller 1215 when detecting that the input of the power controller 1215 changes.

[0145] The utility model discloses a control device 100, the trigger portion 132 is provided in connecting assembly 130, the switch module 1214 is provided in electronic assembly 120, when sensor assembly 110 and electronic assembly 120 are connected, trigger portion 132 contact and extrude switch module 1214 to make switch module 1214 be in closed state. In this case, switch module 1214 realizes switch function based on the machine switch principle of contact and extrusion, and the state of switch module 1214 is controlled through the process of cleverly using sensor assembly 110 and electronic assembly 120 connection by trigger portion 132, thereby through mechanical conduction, the leakage current can be reduced, and the service life of power supply can be improved. In addition, compared with using semiconductor device to control power supply conduction, it can not depend on the device cooperating with semiconductor device, and it is helpful to reduce the cost.

[0146] Although the utility model has been specifically described above in combination with the drawings and examples, it can be understood that the above description does not limit the utility model in any form. Those skilled in the art can deform and change the utility model according to the needs without deviating from the essential spirit and scope of the utility model, and these deformations and changes all fall within the scope of the utility model.

Claims

1. A sensor control device, characterized in that, The sensor assembly, the electronic assembly and the connecting assembly; the sensor assembly includes a distal part for measuring a signal related to an analyte level and a proximal part connected with the distal part and having a first contact, the distal part is connected with the electronic assembly through the proximal part; the electronic assembly includes electronic devices, a device housing for accommodating the electronic devices, and a receiving part formed in the device housing for accommodating the connecting assembly, the electronic devices include a second contact, a power module and a switch module connected with the power module; the connecting assembly includes a connector and a triggering part, the connector includes a conductive part for connecting the first contact and the second contact and a sealing part at least partially surrounding the conductive part, at least a part of the triggering part protrudes from the surface of the sealing part away from the sensor assembly side, when the conductive part and the second contact are in contact, the triggering part is in contact with the switch module and presses the switch module to make the switch module in a closed state. The switch module includes a third contact, a fourth contact and a conductive piece; when the switch module is in an open state, the third contact is connected with the conductive piece, the fourth contact is not in contact with the conductive piece, when the triggering part presses the conductive piece, the conductive piece is in contact with the fourth contact.

2. The sensor control device of claim 1, wherein The switch module includes a third contact, a fourth contact and a conductive piece; when the switch module is in an open state, the third contact is not in contact with the conductive piece, the fourth contact is not in contact with the conductive piece, when the triggering part presses the conductive piece, the conductive piece is in contact with the third contact and the conductive piece is in contact with the fourth contact.

3. The sensor control device of claim 1, wherein The third contact and / or the fourth contact not in contact with the conductive piece is / is are isolated from the conductive piece by an insulating medium, the insulating medium is in a gaseous or solid state.

4. The sensor control device according to claim 2 or 3, characterized in that The switch module further includes a first insulating piece, the first insulating piece is arranged between the conductive piece and the fourth contact and supports the conductive piece, when the triggering part presses the conductive piece, the conductive piece moves along the space formed by the first insulating piece and the third contact and towards the fourth contact to make the conductive piece in contact with the fourth contact.

5. The sensor control device of claim 2, wherein, At least a part of the triggering part is a tapered geometry.

6. The sensor control device of claim 5, wherein, The insulating medium between the fourth contact and the conductive piece is in a gaseous state, when the triggering part presses the conductive piece, the conductive piece moves towards the fourth contact to make the conductive piece in contact with the fourth contact.

7. The sensor control device of claim 2, wherein The electronic devices further include a processing module, the switch module is arranged between the power module and the processing module, when the switch module is in the closed state, the processing module turns on the power module; or 8. The sensor control device of claim 1, wherein, ​ The electronic device further comprises a processing module and a power supply controller, the processing module comprises a processing controller, the power supply module is connected to the power supply controller and the processing module respectively, the switch module is arranged between the power supply module and the power supply controller, when the switch module is in the closed state, the power supply controller turns on the power supply module to change the input of the processing controller, when the input of the processing controller is changed, the processing module starts to work, when the processing module starts to work, the processing controller locks the power supply state of the power supply module; or The electronic device further comprises a processing module and a power supply controller connected to the power supply module, the processing module comprises a processing controller, the processing module is connected to the power supply module through the power supply controller, the switch module is arranged between the power supply module and the power supply controller, when the switch module is in the closed state, the power supply controller turns on the power supply module to change the input of the power supply controller, when the input of the power supply controller is changed, the power supply module starts to supply power to the processing module through the power supply controller, when the processing module is powered on, the processing controller locks the power supply controller.

9. The sensor control device of claim 1, wherein, The switch module is arranged in a space formed by the plurality of second contacts, and the trigger part is arranged in a space formed by the plurality of conductive parts.

10. The sensor control device according to any one of claims 1 to 3, 5 to 9, characterized in that, The trigger part is made of insulating material.

11. The sensor control device according to any one of claims 1 to 3, 5 to 9, characterized in that, The connecting assembly further comprises a supporting part for supporting the connector, the trigger part penetrates through the sealing part and is fixed to the supporting part, the hardness of the supporting part is greater than the hardness of the sealing part. The switch module is arranged in a space formed by the plurality of second contacts, and the trigger part is arranged in a space formed by the plurality of conductive parts. The trigger part is made of insulating material. The connecting assembly further comprises a supporting part for supporting the connector, the trigger part penetrates through the sealing part and is fixed to the supporting part, the hardness of the supporting part is greater than the hardness of the sealing part.

Images