Method for producing film with adhesive, and film with adhesive
By forming and laminating pressure-sensitive adhesive layers with opposite thickness gradients, the method achieves a uniformly thick multilayered adhesive layer with reduced surface unevenness, addressing the thickness inconsistencies in existing production methods.
WO2026009517A1PCT designated stage Publication Date: 2026-01-08NITTO DENKO CORP
Patent Information
- Application Number
- PCT/JP2025/013522
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-05
- Filing Date
- 2025-04-02
- Publication Date
- 2026-01-08
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Figure JP2025013522_08012026_PF_FP_ABST
Abstract
The present invention provides a method for producing a film with an adhesive which has a multilayered adhesive layer having a substantially uniform thickness. A multilayered adhesive layer 5 is formed by: using a slot die coater to apply a first adhesive onto a film, so that a first adhesive layer 51 which has a thickness that gradually decreases in the width direction is formed; using a slot die coater to apply a second adhesive onto another film, so that a second adhesive layer 52 which has a thickness that gradually decreases in the width direction is formed; and bonding the first adhesive layer 51 and the second adhesive layer 52 together such that a thicker end part of the first adhesive layer 51 overlaps with a thinner end part of the second adhesive layer 52, and a thinner end part of the first adhesive layer 51 overlaps with a thicker end part of the second adhesive layer 52.
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Citation Information
Patent Citations
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