Electronic component integrated module, substrate with built-in module, and method for manufacturing electronic component integrated module

Abstract

This electronic component integrated module 1 is characterized by comprising: coated electronic components 10 each having a substantially rectangular parallelepiped shape, which includes end surfaces 11a, 11b facing each other in a first direction, side surfaces 11c, 11d facing each other in a second direction orthogonal to the first direction, and main surfaces 11e, 11f facing each other in a third direction orthogonal to the first direction and the second direction, and having, on the end surfaces 11a, 11b, an electronic component 11, which has an electrode terminal 13, and an insulating layer 14, which covers the surface of the electronic component 11; and an adhesive layer 20 for attaching the coated electronic components 10 to each other. The coated electronic components 10 are stacked in the second direction and / or the third direction via the adhesive layer 20.

Description

Electronic component integrated module, module-embedded substrate, and method of manufacturing electronic component integrated module

[0001] The present invention relates to an electronic component integrated module, a module-embedded substrate, and a method for manufacturing an electronic component integrated module.

[0002] A known method for mounting electronic components on a substrate is to drill holes in the substrate and embed the electronic components in the holes. For example, Patent Document 1 discloses an electronic component-embedded substrate that includes an insulator having an opening (hole) and an electronic component housed in the opening (hole).

[0003] Patent No. 7464205

[0004] However, in the method of drilling holes in a substrate and placing electronic components therein, as in Patent Document 1, there are circumstances in which the holes themselves must be designed to be larger than the electronic components to be mounted in the holes, and there is a limit to how small the spacing between holes can be made, making it impossible to sufficiently increase the mounting density of electronic components.

[0005] The present invention has been made to solve the above problems, and has an object to provide an electronic component integrated module that can increase the mounting density of electronic components. Another object of the present invention is to provide a module-embedded substrate that includes the electronic component integrated module of the present invention. Another object of the present invention is to provide a method for manufacturing an electronic component integrated module that can increase the mounting density of electronic components.

[0006] The electronic component integrated module of the present invention is characterized in that it has a substantially rectangular parallelepiped shape having end faces facing a first direction, side faces facing a second direction perpendicular to the first direction, and a main surface facing a third direction perpendicular to the first direction and the second direction, and includes coated electronic components having electronic components with electrode terminals on the end faces and insulating layers covering the surfaces of the electronic components, and adhesive layers bonding the coated electronic components to each other, and the coated electronic components are stacked in the second direction and / or the third direction via the adhesive layers.

[0007] The module-embedded substrate of the present invention is characterized by comprising a core substrate and the electronic component integrated module of the present invention housed in a cavity of the core substrate.

[0008] The method for manufacturing an electronic component integrated module of the present invention is characterized by including a coating step of producing a coated electronic component by coating, with an insulating material, the surface of an electronic component that is approximately rectangular and has end faces facing a first direction, side faces facing a second direction orthogonal to the first direction, and a main surface facing a third direction orthogonal to the first and second directions, and that has electrode terminals on the end faces; and a stacking step of stacking a plurality of the coated electronic components in the second direction and / or the third direction of the electronic component.

[0009] According to the present invention, it is possible to provide an electronic component integrated module that can increase the mounting density of electronic components. Further, according to the present invention, it is possible to provide a module-embedded substrate that includes the electronic component integrated module of the present invention. Furthermore, according to the present invention, it is possible to provide a method for manufacturing an electronic component integrated module that can increase the mounting density of electronic components.

[0010] FIG. 1A is a perspective view schematically illustrating an example of an electronic component constituting an electronic component integrated module. FIG. 1B is a perspective view schematically illustrating another example of an electronic component constituting an electronic component integrated module. FIG. 2A is a perspective view schematically illustrating an example of a coated electronic component constituting an electronic component integrated module. FIG. 2B is a perspective view schematically illustrating another example of a coated electronic component constituting an electronic component integrated module. FIG. 3 is a perspective view schematically illustrating an example of an electronic component integrated module. FIG. 4 is a cross-sectional view of the electronic component integrated module shown in FIG. 3 taken along line IV-IV. FIG. 5 is a cross-sectional view of the electronic component integrated module shown in FIG. 3 taken along line V-V. FIG. 6 is a cross-sectional view schematically illustrating another example of an electronic component integrated module. FIG. 7 is a perspective view schematically illustrating yet another example of an electronic component integrated module. FIG. 8 is a perspective view schematically illustrating yet another example of an electronic component integrated module. FIG. 9 is a perspective view schematically illustrating an example of a module-embedded substrate. FIG. 10 is a schematic diagram illustrating an example of a coating process. FIG. 11 is a schematic diagram illustrating an example of a lamination process. FIG. 12A is a schematic diagram showing an example of a lamination process using a jig. FIG. 12B is a schematic diagram showing an example of a lamination process using a jig. FIG. 12C is a schematic diagram showing an example of a lamination process using a jig. FIG. 12D is a schematic diagram showing an example of a lamination process using a jig. FIG. 13 is a schematic diagram showing another example of a lamination process. FIG. 14 is a schematic diagram showing a step of arranging coated electronic components in a mold in yet another example of a lamination process. FIG. 15 is a schematic diagram showing a step of injecting adhesive into a mold in yet another example of a lamination process. FIG. 16 is a schematic diagram showing a step of shaping a molded body in yet another example of a lamination process. FIG. 17 is a diagram showing an example of a step of arranging through conductors between coated electronic components in the lamination process. FIG. 18 is a diagram showing an example of a step of arranging reinforcing materials between coated electronic components in the lamination process. FIG. 19 is a diagram showing an example of a step of forming a coating layer on a main surface of a laminate. FIG. 20 is a diagram showing an example of a step of forming vias in a main surface of a laminate. FIG. 21 is a diagram showing an example of a process for forming external electrodes on the main surfaces of the laminate.

[0011] The following describes an electronic component integrated module, a module-embedded substrate, and a method for manufacturing an electronic component integrated module according to the present invention. Note that the present invention is not limited to the following configurations and may be modified as appropriate without departing from the spirit and scope of the present invention. Furthermore, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0012] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same or equivalent parts will be designated by the same reference numerals. In addition, the same elements will be designated by the same reference numerals in each drawing, and duplicate explanations will be omitted.

[0013] In this specification, terms indicating the relationship between elements (e.g., "parallel," "orthogonal," "opposite," etc.) and terms indicating the shapes of elements not only mean the literal strict form, but also mean a range that is substantially equivalent, for example, a range that includes a difference of about a few percent.

[0014] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. In the description of each embodiment, descriptions of matters common to the previously described embodiments will be omitted, and only differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0015] [Electronic Component Integrated Module] The electronic component integrated module of the present invention is characterized in that it has a substantially rectangular parallelepiped shape having end faces facing a first direction, side faces facing a second direction orthogonal to the first direction, and a main surface facing a third direction orthogonal to the first direction and the second direction, and includes coated electronic components having electronic components with electrode terminals on the end faces and insulating layers covering surfaces of the electronic components, and adhesive layers bonding the coated electronic components to each other, and the coated electronic components are stacked in the second direction and / or the third direction via the adhesive layers.

[0016] First, an example of an electronic component constituting an electronic component integrated module of the present invention will be described with reference to FIGS. 1A and 1B. FIG.

[0017] FIG. 1A is a perspective view schematically illustrating an example of an electronic component constituting an electronic component integrated module. As shown in FIG. 1A , electronic component 11 includes a substantially rectangular parallelepiped base body 12 and electrode terminals 13 provided on end surfaces of base body 12. Electronic component 11 has a first end face 11a and a second end face 11b facing in a first direction (the direction indicated by arrow X in FIG. 1A ), a first side face 11c and a second side face 11d facing in a second direction (the direction indicated by arrow Y in FIG. 1A ) perpendicular to first direction X, and a first main surface 11e and a second main surface 11f facing in a third direction (the direction indicated by arrow Z in FIG. 1A ) perpendicular to first direction X and second direction Y. Electrode terminals 13 are provided on first end face 11a and second end face 11b of electronic component 11, respectively. Of the first direction X, the second direction Y, and the third direction Z, the direction in which the dimension of the electronic component 11 is longest is also referred to as the longitudinal direction. The direction perpendicular to the longitudinal direction is also referred to as the width direction, and the direction perpendicular to the longitudinal and width directions is also referred to as the thickness direction. In the electronic component 11 shown in FIG. 1A , the first direction X is equal to the longitudinal direction, so it can be said that the electrode terminals are formed in the longitudinal direction, but the second direction Y or the third direction Z may also be equal to the longitudinal direction.

[0018] In the electronic component 11, the electrode terminals 13 extend from the first end face 11a or the second end face 11b of the electronic component 11 and are provided on parts of the first side face 11c, the second side face 11d, the first main face 11e, and the second main face 11f. The electrode terminals 13 provided on the first end face 11a of the electronic component 11 and the electrode terminals 13 provided on the second end face 11b are not in contact with each other on the first side face 11c, the second side face 11d, the first main face 11e, and the second main face 11f. Alternatively, the electrode terminals 13 may be provided only on the first end face 11a and the second end face 11b.

[0019] The type of electronic component may be any component having a substantially rectangular parallelepiped shape, and examples thereof include passive components such as capacitors (e.g., multilayer ceramic capacitors (MLCC)) and inductors.

[0020] The size (dimensions) of the electronic component is not particularly limited, but is preferably, for example, 0402 size, 0603 size, 1005 size, 1608 size, or 2012 size. The size (dimensions) of the electronic component may also be 0510 size or 0610 size. 0510 size and 0610 size electronic components are electronic components in which electrode terminals are formed on surfaces facing in the width direction of the electronic component rather than on surfaces facing in the longitudinal direction, and are also called LW-reversed electronic components because the dimensions in the longitudinal direction L and width direction W are reversed compared to normal electronic components.

[0021] 1B is a perspective view schematically illustrating another example of an electronic component constituting an electronic component integrated module. The electronic component shown in FIG. 1B is also an example of an LW-reversed electronic component.

[0022] The electronic component 16 shown in FIG. 1B includes an element body 17 having a substantially rectangular parallelepiped shape and electrode terminals 18 provided on each end surface of the element body 17 .

[0023] The electronic component 16 has a first end face 16a and a second end face 16b facing a first direction X, a first side face 16c and a second side face 16d facing a second direction Y perpendicular to the first direction X, and a first main face 16e and a second main face 16f facing a third direction Z perpendicular to the first direction X and the second direction Y. Electrode terminals 18 are provided on the first end face 16a and the second end face 16b of the electronic component 16, respectively. Of the first direction X, the second direction Y, and the third direction Z, the direction in which the dimension of the electronic component 16 is longest is also referred to as the longitudinal direction. In the electronic component 16 shown in FIG. 2 , the second direction Y is the longitudinal direction.

[0024] In the electronic component 16, the electrode terminals 18 extend from the first end face 16a or the second end face 16b of the electronic component 16 and are provided on parts of the first side face 16c, the second side face 16d, the first main face 16e, and the second main face 16f. The electrode terminals 18 provided on the first end face 16a of the electronic component 16 and the electrode terminals 18 provided on the second end face 16b are not in contact with each other on the first side face 16c, the second side face 16d, the first main face 16e, and the second main face 16f. Alternatively, the electrode terminals 18 may be provided only on the first end face 16a and the second end face 16b.

[0025] Next, an example of a coated electronic component that constitutes an electronic component integrated module will be described with reference to FIGS. 2A and 2B. FIG.

[0026] 2A is a perspective view schematically illustrating an example of a coated electronic component that constitutes an electronic component integrated module. As shown in Fig. 2A, the coated electronic component 10 is composed of an electronic component 11 and an insulating layer 14 that covers the surface of the electronic component 11. The electronic component 11 is the electronic component shown in Fig. 1A.

[0027] The surface of the electronic component 11 refers to all surfaces of the electronic component 11, i.e., the first end face 11a, the second end face 11b, the first side face 11c, the second side face 11d, the first main face 11e, and the second main face 11f. Therefore, the insulating layer 14 covers the first end face 11a, the second end face 11b, the first side face 11c, the second side face 11d, the first main face 11e, and the second main face 11f of the electronic component 11, and the electrode terminals 13 are also covered with the insulating layer 14. Because the surfaces of the electronic components 11 are insulated by the insulating layer 14, no short circuit occurs even if the coated electronic components 10 come into contact with each other.

[0028] 2B is a perspective view schematically illustrating another example of a coated electronic component constituting an electronic component integrated module. As shown in Fig. 2B, coated electronic component 15 is composed of electronic component 16 and insulating layer 19 that covers the surface of electronic component 16. Electronic component 16 is the electronic component shown in Fig. 1B.

[0029] In the coated electronic component 15, the insulating layer 19 covers the first end face 16a, the second end face 16b, the first side face 16c, the second side face 16d, the first main face 16e, and the second main face 16f of the electronic component 16, and the electrode terminals 18 are also covered with the insulating layer 19. Because the surfaces of the electronic components 16 are insulated by the insulating layer 19, no short circuit occurs even when the coated electronic components 15 come into contact with each other.

[0030] (Insulating Layer) Examples of insulating materials constituting the insulating layer include acrylic resins, silicone resins, polyurethane resins, epoxy resins, parylene resins, etc. Alternatively, the insulating layer may be formed using a commercially available coating agent.

[0031] The average thickness of the insulating layer is preferably 10 μm or more and 100 μm or less. The average thickness of the insulating layer is preferably less than the minimum dimension of the electronic component, and more preferably less than 1 / 10 and more preferably more than 1 / 100 of the minimum dimension of the electronic component. The average thickness of the insulating layer is preferably smaller than the minimum thickness of the adhesive layer described below. The thicknesses of the insulating layers on the first end face, second end face, first side face, second side face, first main face, and second main face of the electronic component may be different or the same. The average thickness of the insulating layer is determined by randomly selecting one covered electronic component from a cross section obtained by cutting the electronic component integrated module in a direction perpendicular to the first direction, and calculating the average thickness of the insulating layer for the selected covered electronic component from the area of ​​the insulating layer and the outer shape of the electronic component covered by the insulating layer. This process is repeated until the number of covered electronic components constituting the electronic component integrated module reaches 5% (the minimum number is 4), and the average thickness of the insulating layer for each electronic component is used as the average thickness of the insulating layer for the electronic component integrated module.

[0032] The thermal expansion coefficient of the insulating layer is preferably, for example, 5 ppm / °C or more and 50 ppm / °C or less.

[0033] In the electronic component integrated module of the present invention, the coated electronic components are stacked in a second direction and / or a third direction via an adhesive layer, and the second direction and the third direction, in which the coated electronic components are stacked via an adhesive layer, are both perpendicular to the first direction.

[0034] Fig. 3 is a perspective view schematically illustrating an example of an electronic component integrated module. The electronic component integrated module 1 shown in Fig. 3 is formed by stacking a plurality of coated electronic components 10 with adhesive layers 20 interposed therebetween. All of the coated electronic components 10 constituting the electronic component integrated module 1 are arranged so that their first direction X is aligned. The coated electronic components 10 are the coated electronic components 10 shown in Fig. 2A.

[0035] Of the surfaces of the electronic component integrated module 1, the surfaces facing the first direction X of the electronic component 11 are also referred to as main surfaces. The main surfaces 1a and 1b of the electronic component integrated module 1 are also parallel to the first end surface 11a and the second end surface 11b of the electronic component 11. External electrodes 50 are provided on the main surfaces 1a and 1b of the electronic component integrated module 1. Note that the main surfaces of the electronic component integrated module do not correspond to the main surfaces of the electronic components.

[0036] Among the surfaces of electronic component integrated module 1, surfaces perpendicular to the main surface are also referred to as side surfaces. The electronic component integrated module shown in Figure 3 has side surfaces 1c and 1d facing the second direction Y and side surfaces 1e and 1f facing the third direction Z.

[0037] Fig. 4 is a cross-sectional view of the electronic component integrated module shown in Fig. 3 taken along line IV-IV. As shown in Fig. 4, an adhesive layer 20 is provided between adjacent coated electronic components 10 in the third direction Z and between adjacent coated electronic components 10 in the second direction Y. In other words, it can be said that the multiple coated electronic components 10 are stacked in the third direction Z and the second direction Y via the adhesive layer 20. It can also be said that the coated electronic components 10 adjacent in the third direction Z and / or the second direction Y are bonded to each other by the adhesive layer 20.

[0038] Between the electronic components 11 that make up the coated electronic component 10 adjacent to each other in the second direction Y, there are an insulating layer 14 covering the surface of one electronic component 11, an insulating layer 14 covering the surface of the other electronic component 11, and an adhesive layer 20 provided between the coated electronic components 10. Therefore, the distance t Ｙ is the thickness of the insulating layer 14 covering the surface of one electronic component 11 (indicated by the double-headed arrow t in FIG. 4). Ｙ１ the thickness of the insulating layer 14 covering the surface of the other electronic component 11 (indicated by the double-headed arrow t Ｙ２ ), and the thickness of the adhesive layer 20 provided between the coated electronic components 10 (indicated by the double-headed arrow t Ｙ３ The length is expressed as the sum of the lengths indicated by

[0039] Between the electronic components 11 that constitute the coated electronic component 10 adjacent to each other in the third direction Z, there are an insulating layer 14 that covers the surface of one electronic component 11, an insulating layer 14 that covers the surface of the other electronic component 11, and an adhesive layer 20 that is provided between the coated electronic components 10. Therefore, the distance t Ｚ is the thickness of the insulating layer 14 covering the surface of one electronic component 11 (indicated by the double-headed arrow t in FIG. 4). Ｚ１ the thickness of the insulating layer 14 covering the surface of the other electronic component 11 (indicated by the double-headed arrow t Ｚ２ ), and the thickness of the adhesive layer 20 provided between the coated electronic components 10 (indicated by the double-headed arrow t Ｚ３ The length is expressed as the sum of the lengths indicated by

[0040] The adhesive layer 20 provided between the coated electronic components 10 adjacent in the second direction Y extends in the third direction Z. Therefore, the thickness of the adhesive layer 20 extending in the third direction Z is the thickness indicated by the double arrow t Ｙ３ Similarly, the adhesive layer 20 provided between the coated electronic components 10 adjacent to each other in the third direction Z extends in the second direction Y. Therefore, the thickness of the adhesive layer 20 extending in the second direction Y is indicated by the double-headed arrow t Ｚ３ The thickness t of the adhesive layer 20 extending in the third direction Z is Ｙ３ and the thickness t of the adhesive layer 20 extending in the second direction Y. Ｚ３ may be the same or different.

[0041] Note that while Figure 3 shows an electronic component integrated module 1 in which coated electronic components 10 shown in Figure 2A are stacked in the second direction and / or the third direction via adhesive layers 20, an electronic component integrated module in which coated electronic components 15 shown in Figure 2B are stacked in the second direction and / or the third direction via adhesive layers is also an electronic component integrated module of the present invention.

[0042] The minimum thickness of the adhesive layer is not particularly limited, but is preferably, for example, 10 μm or more and 100 μm or less. The minimum thickness of the adhesive layer is preferably equal to or less than the minimum dimension of the electronic component, and more preferably equal to or less than 1 / 10 and equal to or more than 1 / 100 of the minimum dimension of the electronic component. The minimum thickness of the adhesive layer is preferably greater than the average thickness of the insulating layer.

[0043] Examples of adhesive resins constituting the adhesive layer include acrylic resins, silicone resins, polyurethane resins, epoxy resins, and parylene resins. The adhesive resin constituting the adhesive layer may be a conventionally known adhesive. Alternatively, the adhesive layer may be formed using a commercially available potting agent. The adhesive resin may be the same material as the insulating material constituting the coated electronic component.

[0044] When the insulating material and the adhesive resin are different, the combination is preferably such that the glass transition temperature of the adhesive layer is equal to or lower than the glass transition temperature of the insulating layer. In other words, the glass transition temperature of the adhesive layer is preferably equal to or lower than the glass transition temperature of the insulating layer. Furthermore, the combination of the insulating material and the adhesive resin is preferably such that the Young's modulus of the adhesive layer is smaller than the Young's modulus of the insulating layer.

[0045] The insulating layer and the adhesive layer are formed (cured) at different times. Therefore, even if the insulating layer and the adhesive layer are composed of the same material, a physical interface is formed between them. This interface can be used as a boundary to distinguish the insulating layer and the adhesive layer. For example, different curing times can result in different refractive indices and reflectivities between the insulating layer and the adhesive layer. This can be used to distinguish the insulating layer and the adhesive layer. Furthermore, if the insulating layer and the adhesive layer contain different fillers, this can be used to distinguish the insulating layer and the adhesive layer. That is, the interface between the insulating layer and the adhesive layer can be confirmed, for example, by observing a cross section of the electronic component integrated module cut in a direction perpendicular to the first direction using a scanning electron microscope (SEM) or an optical microscope. The optical microscope may be a metallurgical microscope, a phase-contrast microscope, or a polarizing microscope. The contrast of the photograph (image) obtained by the above method may be adjusted as needed.

[0046] Fig. 5 is a cross-sectional view taken along line V-V of the electronic component integrated module shown in Fig. 3. As shown in Fig. 5, a coating layer 30 is formed on each of the first end face 10a and the second end face 10b of the coated electronic component 10. Via conductors 40 are provided so as to penetrate the insulating layer 14 and the coating layer 30 covering the end face of the electronic component 11 in the first direction X, and the external electrodes 50 and the electrode terminals 13 that overlap each other when viewed from the first direction X are electrically connected by the via conductors 40.

[0047] Note that the coating layer 30 is not essential. For example, when the coating layer 30 is not formed in the electronic component integrated module 1 shown in Fig. 5 , the external electrodes 50 are formed directly on the first end face 10a and the second end face 10b of the coated electronic component 10, and the electrode terminals 13 and the external electrodes 50 that overlap each other when viewed from the first direction X are preferably electrically connected by via conductors 40 that penetrate the insulating layer 14 that covers the end faces of the electronic component 11.

[0048] The arrangement of the coated electronic components in the electronic component integrated module is not limited to the above-described arrangement. For example, the arrangement of the coated electronic components in odd-numbered rows may be different from that in even-numbered rows.

[0049] 6 is a cross-sectional view schematically illustrating another example of an electronic component integrated module 2. The electronic component integrated module 2 shown in FIG. 6 is formed by stacking a total of 14 coated electronic components 10 in the second direction Y and the third direction Z with adhesive layers 20 interposed therebetween.

[0050] With regard to the coated electronic components 10 constituting the electronic component integrated module 2, when a group of coated electronic components having the same position in the third direction Z is defined as a coated electronic component group, the coated electronic component group can be divided into a coated electronic component group 140A that is the first row (hereinafter simply referred to as the first row) counting from the bottom and located furthest on the -Z direction side, a coated electronic component group 140B that is the second row (hereinafter simply referred to as the second row) counting from the bottom and located above (on the +Z direction side) the coated electronic component group 140A, a coated electronic component group 140C that is the third row (hereinafter simply referred to as the third row) counting from the bottom and located above (on the +Z direction side) the coated electronic component group 140B, and a coated electronic component group 140D that is the fourth row (hereinafter simply referred to as the fourth row) counting from the bottom and located furthest on the +Z direction side above (on the +Z direction) the coated electronic component group 140C.

[0051] The first-stage coated electronic component group 140A and the third-stage coated electronic component group 140C are each formed by bonding four coated electronic components 10 in the second direction Y via adhesive layers 20. The second-stage coated electronic component group 140B and the fourth-stage coated electronic component group 140D are each formed by bonding three coated electronic components 10 in the second direction Y via adhesive layers 20.

[0052] The coated electronic components 10 constituting the first-stage coated electronic component group 140A and the third-stage coated electronic component group 140C are positioned differently from the coated electronic components 10 constituting the second-stage coated electronic component group 140B and the fourth-stage coated electronic component group 140D in the second direction Y. Specifically, the centers in the second direction Y of the coated electronic components 10 constituting the second-stage coated electronic component group 140B and the fourth-stage coated electronic component group 140D are located at positions along the double-headed arrow d from the centers in the second direction Y of the coated electronic components 10 constituting the first-stage coated electronic component group 140A and the third-stage coated electronic component group 140C. ２ The distance is d. ２ is the distance between the centers of two coated electronic components 10 adjacent in the second direction Y in the first-stage coated electronic component group 140A and the third-stage coated electronic component group 140C (indicated by the double-headed arrow d in FIG. 6 ). １ Therefore, the positions in the second direction Y of the coated electronic components 10 constituting the first-stage group of coated electronic components 140A and the third-stage group of coated electronic components 140C are shifted by half the distance between the centers of the coated electronic components 10 adjacent in the second direction Y, and these positions become the positions in the second direction Y of the coated electronic components 10 constituting the second-stage group of coated electronic components 140B and the fourth-stage group of coated electronic components 140D.

[0053] As shown in Figure 6, by shifting the position of the coated electronic component 10 in the second direction Y using a group of coated electronic components that have different positions in the third direction Z, the length of the adhesive layer 20 that extends linearly in the third direction Z is shortened, thereby making it possible to suppress stress concentration in the adhesive layer 20 and peeling.

[0054] 6, the adhesive layer 20 may be provided in a location other than between adjacent coated electronic components 10 in the second direction Y or the third direction Z. In the electronic component integrated module 2 shown in FIG. 6, the adhesive layer 20 is also provided on the +Y-direction side surface of the coated electronic component 10 furthest in the +Y direction constituting the second-stage coated electronic component group 140B and on the −Y-direction side surface of the coated electronic component 10 furthest in the −Y direction. These adhesive layers 20 respectively constitute part of the side surfaces 2c and 2d of the electronic component integrated module 2. Furthermore, the adhesive layers 20 provided on the +Y-direction side surface of the +Y-direction side of the coated electronic component 10 furthest in the +Y direction and on the −Y-direction side surface of the −Y-direction side of the coated electronic component 10 furthest in the −Y direction constituting the fourth-stage coated electronic component group 140D respectively constitute part of the side surfaces 2d and 2e and part of the side surfaces 2c and 2e of the electronic component integrated module 2.

[0055] The dimensions (length dimensions) in the first direction of the electronic components constituting the electronic component integrated module are preferably the same, but may be different.

[0056] If the dimensions (length dimensions) in the first direction of the electronic components constituting the electronic component integrated module are not uniform, it is preferable to prevent unevenness from occurring on the main surface of the electronic component integrated module by adjusting the thickness of the insulating layer covering the end faces of the electronic components or by adjusting the thickness of the coating layer formed on the surface of the electronic component integrated module.

[0057] The dimensions in the second direction (width dimension) and the dimensions in the third direction (thickness dimension) of the electronic components constituting the electronic component integrated module may be the same or different. That is, electronic components of different dimensions may be combined and used in an electronic component integrated module. Furthermore, when electronic components with different width and thickness dimensions are used, the second and third directions of the electronic components do not need to be aligned. For example, the opposing surfaces of adjacent electronic components separated by an insulating layer and an adhesive layer may be side surfaces, main surfaces, or a side surface and a main surface.

[0058] Gaps that occur on the sides of the electronic component integrated module due to the width and / or thickness dimensions of the electronic components that make up the electronic component integrated module not being uniform, or the positions of the electronic components not being uniform in the second direction and / or third direction, may be filled with an adhesive layer.

[0059] The electronic components constituting the electronic component integrated module may all be of the same type, or may be a combination of different types of electronic components. Furthermore, in the case of electronic components with polarity, the polarity of all electronic components may be the same, or the polarity of some electronic components may be opposite. Furthermore, if the internal structure of electronic components is not symmetrical in the second direction or the third direction, electronic components adjacent in the second direction and / or the third direction may be arranged so that the internal structure in the second direction and / or the third direction is opposite.

[0060] The number of electronic components constituting the electronic component integrated module is preferably 4 or more and 5,000 or less.

[0061] The Young's modulus of the adhesive layer is preferably smaller than that of the electronic component, so that the thermal stress generated in the electronic component can be reduced.

[0062] The Young's modulus of the adhesive layer is preferably 1 GPa or more and 10 GPa or less. The Young's modulus of the electronic component is preferably 200 GPa or less. The Young's modulus of the adhesive layer and the electronic component can be measured by nanoindentation. If the Young's modulus cannot be measured by nanoindentation, it is measured using a surface acoustic wave method (SAW method). For example, the Young's modulus of MLCC is generally about 100 GPa or more and 200 GPa or less.

[0063] The thermal expansion coefficient of the adhesive layer is preferably 5 ppm / °C or more and 50 ppm / °C or less.

[0064] (Through Conductor) The adhesive layer may be provided with a through conductor that penetrates the adhesive layer in a first direction.

[0065] 7 is a perspective view schematically illustrating yet another example of an electronic component integrated module. The electronic component integrated module 3 illustrated in FIG. 7 includes an adhesive layer 20, and a through conductor 60 is provided therein, penetrating the adhesive layer 20 in a first direction X. The through conductor 60 penetrates the adhesive layer 20 and a coating layer 30 provided on the adhesive layer 20 in the first direction X, and is exposed on the main surfaces 3 a and 3 b of the electronic component integrated module 3. Therefore, the through conductor 60 functions as a through-hole conductor connecting the main surfaces 3 a and 3 b of the electronic component integrated module 3.

[0066] If the electronic component integrated module itself has through-hole conductors, there is no need to use a core substrate to ensure electrical continuity between the main surfaces, and therefore the electronic component integrated module can exhibit the same functionality as a conventional electronic component-embedded substrate (a module having a core substrate) even without a core substrate. In other words, the electronic component integrated module of the present invention does not need to have a core substrate.

[0067] There are no particular limitations on the positions at which the through conductors 60 are provided. In the electronic component integrated module 3 shown in Fig. 7 , the through conductors 60 are arranged at positions corresponding to corners of the coated electronic components 10 when viewed from the first direction X, but the through conductors 60 may be arranged, for example, between the coated electronic components 10 facing each other in the second direction Y or the third direction Z. Furthermore, the through conductors do not have to be arranged adjacent to all the coated electronic components.

[0068] Examples of the through conductor include a metal pin and a PHT (Plated Through Hall), among which a metal pin is preferred. A PHT is a through conductor formed by joining coated electronic components with an adhesive layer to form an assembly, forming a through hole that penetrates the adhesive layer in a first direction, and then plating the through hole.

[0069] The diameter of the through conductor is preferably 100 μm or more and 600 μm or less.

[0070] (Reinforcing Material) The adhesive layer may contain a reinforcing material containing a low-thermal expansion material having a thermal expansion coefficient smaller than that of the adhesive resin constituting the adhesive layer. By containing a reinforcing material in the adhesive layer, it is possible to adjust the thermal expansion coefficient of the entire electronic component integrated module and improve the mechanical strength of the electronic component integrated module.

[0071] Fig. 8 is a perspective view schematically illustrating yet another example of an electronic component integrated module. The electronic component integrated module 4 illustrated in Fig. 8 has a reinforcing material 70 disposed in an adhesive layer 20. The reinforcing material 70 is sheet-shaped and extends along the third direction Z, and is present in the adhesive layer 20 disposed between coated electronic components 10 adjacent to each other in the second direction Y. The reinforcing material 70 is not exposed on the main surfaces 4a and 4b of the electronic component integrated module 4. In other words, the reinforcing material 70 does not penetrate the coating layer 30 in the first direction X.

[0072] 8 shows the sheet-like reinforcing material 70 extending along the third direction Z, but the reinforcing material 70 may be in the form of a sheet extending along the second direction Y and present in the adhesive layer 20 arranged between the coated electronic components 10 adjacent to each other in the third direction Z. Furthermore, the reinforcing material 70 may not extend in the second direction Y and the third direction Z, but may be arranged intermittently between the coated electronic components 10 adjacent to each other in the second direction Y and between the coated electronic components 10 adjacent to each other in the third direction Z. Furthermore, the reinforcing material 70 may be arranged so as to cover the side surfaces of the electronic component integrated module.

[0073] Examples of low thermal expansion materials include glass and ceramic materials such as silicon nitride and alumina, with glass being preferred among these.

[0074] The reinforcing material may be any material containing a low thermal expansion material with a thermal expansion coefficient smaller than that of the adhesive resin constituting the adhesive layer, and its shape is not particularly limited. Examples of reinforcing materials include particles or fibers made of a low thermal expansion material, cloth made of fibers with a low thermal expansion coefficient, and plates made of a low thermal expansion material. When the low thermal expansion material is glass, examples of reinforcing materials include glass particles, glass fiber, glass cloth, and glass plate. When the low thermal expansion coefficient is alumina, examples of reinforcing materials include alumina particles and alumina fiber. Of these, glass plate and glass cloth are preferred.

[0075] The thickness of the reinforcing material is preferably 20 μm or more and 300 μm or less.

[0076] The volume ratio of the electronic components to the electronic component integrated module is preferably 80% or more and 95% or less.

[0077] The shortest distance between the electronic components in the second or third direction (the shortest distance between the electronic components facing each other with an insulating layer and an adhesive layer interposed therebetween) is preferably 10 μm or more and 300 μm or less.

[0078] [Module-embedded substrate] The module-embedded substrate of the present invention includes a core substrate and the electronic component integrated module of the present invention housed in a cavity of the core substrate. Because the module-embedded substrate of the present invention houses the electronic component integrated module of the present invention in the cavity of the core substrate, electronic components can be mounted at a high density.

[0079] In the module-embedded substrate of the present invention, it is preferable to house the electronic component integrated module of the present invention in the cavity so that the length direction of the electronic components that make it up coincides with the third direction of the core substrate.

[0080] 9 is a perspective view schematically illustrating an example of a module-embedded substrate 100. The module-embedded substrate 100 includes a core substrate 110 and an electronic component integrated module 1 housed in a cavity 120 of the core substrate 110.

[0081] The electronic component integrated module 1 is an electronic component integrated module of the present invention in which coated electronic components are stacked in a second direction and a third direction with adhesive layers interposed therebetween.

[0082] The space between electronic component integrated module 1 and the inner wall of cavity 120 may be filled with sealing resin 130. The sealing resin 130 filling the space between electronic component integrated module 1 and the inner wall of cavity 120 can be made of the same material as the insulating layer that covers the surface of the electronic component in the coated electronic component that constitutes the electronic component integrated module of the present invention, or the adhesive layer that bonds the coated electronic components together.

[0083] The core substrate 110 may have electronic components mounted thereon, or may have through-hole conductors formed thereon.

[0084] [Method for manufacturing electronic component integrated module] The method for manufacturing an electronic component integrated module of the present invention is characterized by including a coating step of producing a coated electronic component by coating, with an insulating material, the surface of an electronic component that is substantially rectangular, having end faces facing a first direction, side faces facing a second direction orthogonal to the first direction, and a main surface facing a third direction orthogonal to the first and second directions, and that has electrode terminals on the end faces; and a stacking step of stacking a plurality of the coated electronic components in the second direction and / or the third direction of the electronic component.

[0085] (Coating Step) In the coating step, the surface of the electronic component is coated with an insulating material to produce a coated electronic component.

[0086] As explained in the section on the electronic component integrated module of the present invention, the surface of an electronic component refers to all surfaces of the electronic component, i.e., the first end face, the second end face, the first side face, the second side face, the first main face, and the second main face. Therefore, by coating the surface of the electronic component with an insulating material and covering it with an insulating layer, a coated electronic component that constitutes the electronic component integrated module of the present invention can be obtained.

[0087] Fig. 10 is a schematic diagram showing an example of the coating step. As shown in Fig. 10, in the coating step, the surfaces of the electronic component 11 (first end face 11a, second end face 11b, first side face 11c, second side face 11d, first main face 11e, and second main face 11f) are coated with an insulating material to produce a coated electronic component 10. When the insulating material hardens, it becomes an insulating layer 14. Therefore, the coating step converts the electronic component 11 shown in Fig. 1A into the coated electronic component 10 shown in Fig. 2A.

[0088] In the coating step, the method for coating the surface of the electronic component 11 with the insulating material is not particularly limited, and examples thereof include dipping and spray coating.

[0089] As the insulating material for covering the surface of the electronic component, for example, the insulating material constituting the coated electronic component explained in the section on the electronic component integrated module of the present invention can be suitably used.

[0090] The thickness of the insulating material covering the surface of the electronic component is preferably 10 μm or more and 100 μm or less.

[0091] By covering the surfaces of the electronic components with an insulating material in the covering step, it is possible to prevent short circuits between the electronic components in the laminating step described below.

[0092] (Stacking Step) In the stacking step, a plurality of coated electronic components are stacked in the second direction and / or the third direction of the electronic components, thereby obtaining an electronic component integrated module in which a plurality of coated electronic components are stacked in the second direction and / or the third direction.

[0093] 11 is a schematic diagram showing an example of the lamination step. As shown in FIG. 11 , a total of 16 coated electronic components 10 are laminated, four in the second direction Y and four in the third direction Z, to obtain a laminate 1′ in which 16 coated electronic components are laminated in the second and third directions. The laminate 1′ is an electronic component integrated module obtained by the method for manufacturing an electronic component integrated module of the present invention.

[0094] In the stacking step, the coated electronic components may be stacked using a jig, etc. An example of the stacking step using a jig will be described with reference to Figures 12A, 12B, 12C, and 12D.

[0095] 12A, 12B, 12C, and 12D are schematic diagrams showing an example of a lamination process using a jig. As shown in Fig. 12A, a suction jig 210 has a recess 211 capable of accommodating a coated electronic component 10 on one surface and an air intake hole 212 on the other surface. The air intake hole 212 is a hole that penetrates from the other surface of the suction jig 210 to the recess 211. As shown in Fig. 12A, with the coated electronic component 10 accommodated in the recess 211 of the suction jig 210, gas within the recess 211 is sucked through the air intake hole 212 (the arrow in Fig. 12A indicates the state in which gas within the recess 211 is sucked), thereby fixing the coated electronic component 10 in the recess 211.

[0096] The method for accommodating the coated electronic component 10 in the recess 211 of the suction jig 210 is not particularly limited, but for example, the suction jig 210 may be swung to accommodate the coated electronic component 10 in the recess 211.

[0097] 12B, with the coated electronic components 10 fixed in the recesses 211, the suction jig 210 is moved onto an arbitrary plane (on the flat plate 220 in FIG. 12), and with the recesses 211 facing downward, the intake through the air intake holes 212 is stopped, thereby releasing the fixation of the coated electronic components 10. As a result, the coated electronic components 10 fall out of the recesses 211, and as shown in FIG. 12C, coated electronic components 10 corresponding in number and position to the recesses 211 of the suction jig 210 are placed at predetermined positions on the flat plate 220. The coated electronic components 10 arranged at this time are collectively referred to as a first-stage group of coated electronic components 140A.

[0098] 12A to 12C are repeated, so that a second-tier group of coated electronic components 140B can be stacked on top of a first-tier group of coated electronic components 140A, as shown in Fig. 12D. Note that, although the second-tier group of coated electronic components 140B is stacked directly on top of the first-tier group of coated electronic components 140A in Fig. 12D, the positions at which the coated electronic components 10 are arranged in the first and second tiers may be reversed.

[0099] By repeating the above procedure, a plurality of coated electronic components 10 can be stacked in the third direction Z.

[0100] The number of coated electronic components stacked in the stacking step is not particularly limited and may be, for example, 4 or more and 10,000 or less. Furthermore, a plurality of electronic component integrated modules may be obtained by cutting the stack after the stacking step.

[0101] For example, a laminate may be produced by stacking 100 coated electronic components in the third direction and 100 coated electronic components in the second direction, and then the laminate may be cut at positions that divide the laminate into 10 parts in the third direction and 10 parts in the second direction, to produce 100 electronic component integrated modules from 10,000 coated electronic components.

[0102] In the lamination step, the coated electronic components are preferably bonded together via an adhesive. By laminating a plurality of coated electronic components via the adhesive in the second direction and / or the third direction of the electronic components, an electronic component integrated module can be obtained in which a plurality of coated electronic components are bonded together via an adhesive layer. The electronic component integrated module in which a plurality of coated electronic components are laminated together via an adhesive layer is the electronic component integrated module of the present invention.

[0103] The adhesive resin described in the section on the electronic component integrated module of the present invention can be suitably used as the adhesive. A general potting agent may also be used as the adhesive. The adhesive layer is formed when the adhesive is cured. Therefore, the adhesive may contain a low-thermal expansion material that has a thermal expansion coefficient smaller than that of the adhesive resin after curing.

[0104] Fig. 13 is a schematic diagram showing another example of the lamination process. In the lamination process shown in Fig. 13, after the first layer of coated electronic components 140A is arranged, the coated electronic components that make up the coated electronic component group 140A are bonded with an adhesive to form a bonded body, and then the second layer of coated electronic components 140B is laminated. As a method for arranging the four coated electronic components in the second direction Y as shown in Fig. 13, for example, the suction jig 210 described with reference to Figs. 12A to 12D can be used.

[0105] 13, the lamination step may be performed by repeating the step of laminating and bonding some of the coated electronic components that make up the electronic component integrated module with an adhesive multiple times. Also, bonding of the coated electronic components with an adhesive may be performed multiple times.

[0106] 12A to 12D and 13, the method of placing the coated electronic components so that their first direction is parallel to the loading surface and stacking them along the second or third direction has been described, but in the stacking step, the coated electronic components may be placed so that their first direction is perpendicular to the loading surface and lined up on a plane along the second or third direction. An example of such a stacking step will be described with reference to FIGS. 14, 15, and 16.

[0107] 14 is a schematic diagram showing a step of arranging coated electronic components in a mold in yet another example of the stacking step. In the stacking step shown in Fig. 14, coated electronic components 10 are arranged in a space 85 in a mold 80 with a predetermined gap therebetween so that the first direction of the electronic components is perpendicular to the YZ plane that serves as the loading surface.

[0108] The method for placing the coated electronic component 10 in the space 85 in the mold 80 is not particularly limited, and for example, a suction jig or the like shown in FIGS. 12A to 12D may be used, a chip mounter or the like may be used, or a manipulator or the like may be used.

[0109] Fig. 15 is a schematic diagram showing a step of injecting an adhesive into a mold in yet another example of the lamination step. After aligning coated electronic components 10 in a mold 80 as shown in Fig. 15, adhesive is injected into the mold 80 and cured, thereby laminating multiple coated electronic components 10 via adhesive layers 20. When coated electronic components 10 are arranged at predetermined intervals as shown in Fig. 14, the adhesive penetrates into the gaps between the coated electronic components 10 and forms adhesive layers 20 that bond the coated electronic components 10 together.

[0110] The method for injecting the adhesive into the mold is not particularly limited, and for example, a dispenser may be used. Therefore, the adhesive used in the lamination process may be an adhesive resin suitable for the dispensing process. Examples of adhesive resins suitable for the dispensing process include thermosetting resins such as epoxy resins, silicone resins, urethane resins, and phenolic resins. In addition, adhesive resins with a viscosity of 1,000,000 Pa·s or less before curing can be said to be suitable for the dispensing process.

[0111] The method for curing the adhesive is not particularly limited, and may be photocuring, heat curing, curing using a curing agent, or curing by volatilizing a solvent.

[0112] After the adhesive layer 20 has hardened, the bonded body of the coated electronic component 10 may be removed from the mold 80, or the mold 80 may be cut at the position of the dashed line C as shown in FIG.

[0113] FIG. 16 is a schematic diagram showing a step of adjusting the shape of the bonded body in yet another example of the lamination step. By cutting the mold 80 at the position of the dashed-dotted line C shown in FIG. 15 , the electronic component integrated module 5 shown in FIG. 16 can be obtained. The method of obtaining the electronic component integrated module by cutting a portion of the mold eliminates the need for demolding and reduces stress on the electronic component integrated module during demolding. Furthermore, adjusting the shape of the remaining mold allows the external shape of the electronic component integrated module to be adjusted. The portion of the mold 81 remaining on the side of the electronic component integrated module 5 functions as a strength enhancer for improving the mechanical strength of the electronic component integrated module 5.

[0114] In the lamination step, the through conductors may be disposed between the coated electronic components.

[0115] 17 is a diagram showing an example of a step of arranging through conductors between coated electronic components in the lamination step. As shown in Fig. 17 , after covering a first-stage group of coated electronic components 140A with an adhesive layer 20, columnar through conductors 60 are arranged on the adhesive layer 20, and then a second-stage group of coated electronic components 140B is arranged, thereby enabling the columnar through conductors 60 to be arranged between the coated electronic components 10 that constitute the electronic component integrated module. As shown in Fig. 17 , by arranging the columnar through conductors 60 between the coated electronic components 10 in the lamination step, the through conductors 60 that penetrate between the main surfaces of the electronic component integrated module can be formed.

[0116] Although not shown, after the second-stage group of coated electronic components 140B is arranged, an adhesive layer 20 may be formed so as to cover the through conductors 60 and the second-stage group of coated electronic components 140B.

[0117] After the second-stage group of coated electronic components 140B is placed, if an adhesive layer 20 is formed to cover the through conductor 60 and the second-stage group of coated electronic components 140B, the through conductor 60 will be sandwiched between the adhesive layer 20 covering the first-stage group of coated electronic components 140A and the adhesive layer 20 covering the second-stage group of coated electronic components 140B, and will be placed in the adhesive layer 20.

[0118] The length of the through conductor 60 in the first direction X may be the same as the length of the coated electronic component 10 in the first direction X, or may be longer than the length of the coated electronic component 10 in the first direction X. If the length of the through conductor 60 in the first direction X is longer than the length of the coated electronic component 10 in the first direction X, the through conductor 60 will penetrate the coating layer even if a coating layer, which will be described later, is formed, making it easy to expose the through conductor 60 on the main surface (surface of the coating layer) of the electronic component integrated module.

[0119] 17 , the first-stage coated electronic component group 140A is covered with the adhesive layer 20, the through conductors 60 are placed on the adhesive layer 20, and then the second-stage coated electronic component group 140B is placed. However, the through conductors 60 may be placed before the first-stage coated electronic component group 140A is covered with the adhesive layer 20, and the coated electronic component group 140A together with the through conductors 60 may be covered with the adhesive layer 20. Alternatively, the placement of the coated electronic component group and the placement of the through conductors may be repeated alternately several times, and then the entire structure may be finally covered with adhesive. Any excess adhesive layer may be removed by cutting or the like during or after the lamination process.

[0120] In the lamination process, a reinforcing material may be placed between the coated electronic components.

[0121] 18 is a diagram showing an example of a step of arranging a reinforcing material between coated electronic components in the lamination step. As shown in FIG. 18 , after covering a first-stage group of coated electronic components 140A with an adhesive layer 20, a sheet-like reinforcing material 70 is placed on the adhesive layer 20, and then a second-stage group of coated electronic components 140B is placed in that state. This allows the reinforcing material 70 to be placed between the coated electronic components 10 that constitute the electronic component integrated module. When the reinforcing material 70 is placed between the coated electronic components 10, the characteristics (e.g., mechanical strength) of the electronic component integrated module can be improved.

[0122] Although not shown, after the second-tier group of coated electronic components 140B is arranged, an adhesive layer 20 may be formed so as to cover the sheet-like reinforcing material 70 and the second-tier group of coated electronic components 140B.

[0123] After the second-tier group of coated electronic components 140B is placed, if an adhesive layer 20 is formed to cover the sheet-like reinforcing material 70 and the second-tier group of coated electronic components 140B, the reinforcing material 70 will be sandwiched between the adhesive layer 20 covering the first-tier group of coated electronic components 140A and the adhesive layer 20 covering the second-tier group of coated electronic components 140B, and will be placed in the adhesive layer 20.

[0124] The reinforcing material 70 may be, for example, a glass plate or silica cloth.

[0125] (Electrode Forming Step) The method for producing an electronic component integrated module of the present invention may include an electrode forming step of forming external electrodes on the main surfaces of the obtained laminate (electronic component integrated module). Examples of the electrode forming step include a step of drilling holes in the main surfaces of the obtained laminate using a laser or the like, filling the holes with a conductive material to form via conductors, and then forming external electrodes to cover the via conductors.

[0126] Prior to the formation of the vias, a coating layer may be formed on the main surface of the laminate. The material for the coating layer may be the insulating material for the coated electronic component or the adhesive resin for the adhesive layer.

[0127] An example of a process for forming the external electrodes will be described with reference to FIGS.

[0128] 19 is a diagram showing an example of a process for forming a coating layer on the main surface of a laminate. As shown in Fig. 19 , first, a coating layer 30 is formed on the surface (main surface) facing the first direction X of an electronic component integrated module (also referred to here as a laminate) formed by stacking a plurality of coated electronic components 10 with adhesive layers 20 interposed therebetween. That is, the coating layer 30 is provided so as to cover the insulating layer covering the end faces (surfaces having electrode terminals) of the coated electronic components 10 that constitute the electronic component integrated module.

[0129] 20 is a diagram showing an example of a process for forming via conductors on the main surface of the laminate. Next, as shown in FIG. 20 , vias are formed that penetrate the coating layer 30 and the insulating layers that constitute the coated electronic component 10 in the first direction X, and the vias are filled with a conductive material to form via conductors 40. One end of the via conductor 40 is exposed on the surface of the coating layer 30, and the other end is in contact with an electrode terminal 13 provided on the first end surface 11 a or the second end surface 12 b of the electronic component 11 that constitutes the coated electronic component 10.

[0130] Examples of methods for forming vias include laser irradiation, etc. Examples of methods for filling vias with a conductive material include filling vias with a paste containing a conductive material and firing the paste, and plating vias.

[0131] Fig. 21 is a diagram showing an example of a process for forming external electrodes on the main surfaces of the laminate. Next, as shown in Fig. 21, external electrodes 50 are formed so as to cover the surfaces of the via conductors 40 exposed on the surface of the coating layer 30. The method for forming the external electrodes 50 is not particularly limited, but examples include a method of printing and firing a paste containing a conductive material, a plating process, etc.

[0132] By the above procedure, electronic component integrated module 1 having external electrodes 50 on main surfaces 1a and 1b can be obtained.

[0133] Instead of forming the external electrodes 50 described above, a rewiring layer may be formed. The rewiring layer can be formed by, for example, a subtractive method or a semi-additive method (SAP method). The subtractive method is a method in which a metal layer such as Cu is formed on the surface of a coating layer, and then a resist is formed on the surface of the metal layer and etched to remove excess metal layer, thereby forming a wiring layer. The semi-additive method is a method in which a resist is formed on the surface of a coating layer, and then a plating process or the like is performed to form a wiring layer only in the necessary areas.

[0134] This specification describes the following:

[0135] The present disclosure (1) is an electronic component integrated module comprising: a coated electronic component having a substantially rectangular parallelepiped shape with end faces facing a first direction, side faces facing a second direction perpendicular to the first direction, and a main surface facing a third direction perpendicular to the first direction and the second direction, the coated electronic component having electrode terminals on the end faces; and an insulating layer covering the surface of the electronic component; and an adhesive layer bonding the coated electronic components together, wherein the coated electronic components are stacked in the second direction and / or the third direction via the adhesive layer.

[0136] The present disclosure (2) is an electronic component integrated module according to the present disclosure (1), wherein, when viewed from the first direction, an external electrode is provided on the surface of the electronic component integrated module at a position that overlaps with the electrode terminal of the electronic component, and the electrode terminal and the external electrode that overlap each other when viewed from the first direction are electrically connected by a via conductor that penetrates the insulating layer that covers the end face of the electronic component.

[0137] The present disclosure (3) is the electronic component integrated module according to the present disclosure (1) or (2), wherein the Young's modulus of the adhesive layer is smaller than the Young's modulus of the electronic component.

[0138] The present disclosure (4) is an electronic component integrated module in any combination with any of the present disclosures (1) to (3), in which a through conductor is provided in the adhesive layer, penetrating the adhesive layer in the first direction.

[0139] The present disclosure (5) is the electronic component integrated module according to the present disclosure (4), in which the through conductor is a metal pin.

[0140] The present disclosure (6) is an electronic component integrated module in any combination with any of the present disclosures (1) to (5), in which a reinforcing material containing a low thermal expansion material having a thermal expansion coefficient smaller than that of the adhesive resin constituting the adhesive layer is disposed in the adhesive layer.

[0141] The present disclosure (7) is the electronic component integrated module according to the present disclosure (6), in which the low thermal expansion material is glass.

[0142] The present disclosure (8) is the electronic component integrated module according to the present disclosure (6) or (7), in which the reinforcing material is a glass plate or a glass cloth.

[0143] The present disclosure (9) is an electronic component integrated module in any combination with any of the present disclosures (1) to (8), in which the average thickness of the insulating layer and the minimum thickness of the adhesive layer are both equal to or less than the minimum dimension of the electronic component.

[0144] The present disclosure (10) is an electronic component integrated module in any combination with any of the present disclosures (1) to (9), wherein the average thickness of the insulating layer is smaller than the minimum thickness of the adhesive layer.

[0145] The present disclosure (11) is an electronic component integrated module in any combination with any of the present disclosures (1) to (10), in which the Young's modulus of the adhesive layer is smaller than the Young's modulus of the insulating layer.

[0146] The present disclosure (12) is an electronic component integrated module in any combination with any of the present disclosures (1) to (11), in which the glass transition temperature of the adhesive layer is equal to or lower than the glass transition temperature of the insulating layer.

[0147] The present disclosure (13) is a module-embedded substrate comprising a core substrate and an electronic component integrated module of any combination with any of the present disclosures (1) to (12) housed in a cavity of the core substrate.

[0148] The present disclosure (14) is a method for manufacturing an electronic component integrated module, comprising: a coating step of producing a coated electronic component by coating, with an insulating material, a surface of an electronic component that is approximately rectangular parallelepiped in shape and has end faces facing a first direction, side faces facing a second direction orthogonal to the first direction, and a main surface facing a third direction orthogonal to the first direction and the second direction, and that has electrode terminals on the end faces; and a stacking step of stacking a plurality of the coated electronic components in the second direction and / or the third direction of the electronic component.

[0149] The present disclosure (15) is the method for manufacturing an electronic component integrated module according to the present disclosure (14), wherein in the laminating step, the coated electronic components are laminated via an adhesive.

[0150] DESCRIPTION OF SYMBOLS 1, 2, 3, 4, 5 Electronic component integrated module 1a, 1b Main surface of electronic component integrated module 1c, 1d, 1e, 1f, 2c, 2d, 2e, 2f Side surface of electronic component integrated module 1' Laminate (electronic component integrated module) 10, 15 Coated electronic component 10a, 15a First end surface of coated electronic component 10b, 15b Second end surface of coated electronic component 10c, 15c First side surface of coated electronic component 10d, 15d Second side surface of coated electronic component 10e, 15e First main surface of coated electronic component 10f, 15f Second main surface of coated electronic component 11, 16 Electronic component 11a, 16a First end surface of electronic component 11b, 16b Second end surface of electronic component 11c, 16c First side surface of electronic component 11d, 16d Second side surface of electronic component 11e, 16e First main surface of electronic component 11f, 16f Second main surface of electronic component 12, 17 Element body 13, 18 Electrode terminal 14, 19 Insulating layer 20 Adhesive layer 30 Coating layer 40 Via conductor 50 External electrode 60 Through conductor 70 Reinforcing material 80 Mold 81 Part of mold 100 Module-embedded substrate 110 Core substrate 120 Cavity 130 Sealing resin 140A First-tier group of coated electronic components 140B Second-tier group of coated electronic components 140C Third-tier group of coated electronic components 140D Fourth-tier group of coated electronic components 210 Suction jig 211 Recess 212 Intake hole 220 Flat plate

Claims

1. An electronic component integrated module comprising: a coated electronic component having a generally rectangular parallelepiped shape with end faces facing in a first direction, side faces facing in a second direction perpendicular to the first direction, and a main surface facing in a third direction perpendicular to the first and second directions, the coated electronic component having electrode terminals on the end faces; an insulating layer covering the surface of the electronic component; and an adhesive layer bonding the coated electronic components together, wherein the coated electronic components are stacked in the second direction and / or the third direction via the adhesive layer.

2. The electronic component integrated module according to claim 1, wherein, when viewed from the first direction, external electrodes are provided on the surface of the electronic component integrated module at positions that overlap with the electrode terminals of the electronic components, and the electrode terminals and external electrodes that overlap when viewed from the first direction are electrically connected by via conductors that penetrate the insulating layer that covers the end faces of the electronic components.

3. The electronic component integrated module according to claim 1 or 2, wherein the Young's modulus of the adhesive layer is smaller than the Young's modulus of the electronic component.

4. An electronic component integrated module according to any one of claims 1 to 3, wherein the adhesive layer has a through conductor that penetrates the adhesive layer in the first direction.

5. The electronic component integrated module according to claim 4, wherein the through conductor is a metal pin.

6. An electronic component integrated module according to any one of claims 1 to 5, wherein a reinforcing material containing a low-thermal expansion material with a thermal expansion coefficient smaller than that of the adhesive resin constituting the adhesive layer is disposed in the adhesive layer.

7. The electronic component integrated module according to claim 6, wherein the low thermal expansion material is glass.

8. The electronic component integrated module according to claim 6 or 7, wherein the reinforcing material is a glass plate or glass cloth.

9. An electronic component integrated module according to any one of claims 1 to 8, wherein the average thickness of the insulating layer and the minimum thickness of the adhesive layer are both equal to or less than the minimum dimension of the electronic component.

10. The electronic component integrated module according to any one of claims 1 to 9, wherein the average thickness of the insulating layer is smaller than the minimum thickness of the adhesive layer.

11. The electronic component integrated module according to any one of claims 1 to 10, wherein the Young's modulus of the adhesive layer is smaller than the Young's modulus of the insulating layer.

12. The electronic component integrated module according to any one of claims 1 to 11, wherein the adhesive layer has a glass transition temperature lower than or equal to the glass transition temperature of the insulating layer.

13. A module-embedded substrate comprising: a core substrate; and an electronic component integrated module according to any one of claims 1 to 12 housed in a cavity of the core substrate.

14. A method for manufacturing an electronic component integrated module, comprising: a coating step of producing a coated electronic component by coating, with an insulating material, the surface of an electronic component that is approximately rectangular parallelepiped and has end faces facing in a first direction, side faces facing in a second direction perpendicular to the first direction, and a main surface facing in a third direction perpendicular to the first and second directions, and that has electrode terminals on the end faces; and a stacking step of stacking a plurality of the coated electronic components in the second direction and / or the third direction of the electronic component.

15. The method for manufacturing an electronic component integrated module according to claim 14, wherein in the laminating step, the coated electronic components are laminated via an adhesive.

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