Detection device and method for manufacturing detection device

Abstract

This detection device comprises: a first substrate which has a plurality of first terminals that are arranged in a first direction; and a second substrate which is a flexible substrate having an organic photodiode, a plurality of second terminals, and a plurality of wiring lines that connect the organic photodiode and the plurality of second terminals. The plurality of first terminals and the plurality of second terminals are crimped with an anisotropic conductive film, which contains conductive balls, being interposed therebetween. The wiring lines which are connected to the plurality of second terminals that are crimped to the plurality of first terminals are connected at one end side of the second terminals. At least one of the plurality of first terminals protrudes toward the second substrate side with respect to a peripheral part of the first terminal. Crimp marks of the conductive balls overlapping with each of the plurality of first terminals are within a crimping range that is separated from the reference end in a second direction. The second direction is orthogonal to the first direction, and extends along the plate surface of the first substrate. The reference end is on one end side of the second terminals crimped to the first terminals among the ends in the second direction of the first terminal that protrudes with respect to the peripheral part. The crimping range is located on the other end side of the second terminals with respect to the reference end.

Description

Detection device and method for manufacturing the detection device

[0001] The present invention relates to a detection device and a method for manufacturing a detection device.

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known (see, for example, Patent Document 1). Among such optical sensors, sensors having an organic photodiode (OPD) using an organic semiconductor material as an active layer are known.

[0003] Japanese Patent Application Laid-Open No. 2022-121297

[0004] In order to provide flexibility to an organic photodiode, a flexible substrate on which the organic photodiode is formed and a substrate on which a circuit connected to the organic photodiode is mounted are provided separately, and terminals on each substrate are crimped together. In such a configuration, the pressure applied during crimping can cause wiring cracks near the boundary between the terminals on the flexible substrate and the wiring connected to the terminals.

[0005] An object of the present invention is to provide a detection device that can suppress wiring cracks and a method for manufacturing the detection device.

[0006] A detection device according to one aspect of the present invention includes a first substrate having a plurality of first terminals arranged in a first direction, an organic photodiode, a plurality of second terminals, and a second substrate that is a flexible substrate having a plurality of wirings connecting the organic photodiode and the plurality of second terminals, wherein the plurality of first terminals and the plurality of second terminals are pressure-bonded with an anisotropic conductive film including conductive balls sandwiched therebetween, and the wirings connected to the plurality of first terminals and the plurality of second terminals pressure-bonded are connected to one end of the second terminal, and the plurality of first terminals are connected to one end of the second terminal. At least one of the terminals protrudes toward the second substrate relative to the peripheral portion of the first terminal, and the crimping marks of the conductive ball that overlap with each of the plurality of first terminals are within a crimping range away from a reference end in a second direction, the second direction being perpendicular to the first direction and extending along the plate surface of the first substrate, the reference end being the end of the first terminal in the second direction that protrudes relative to the peripheral portion, on the one end side of the second terminal that is crimped to the first terminal, and the crimping range is located on the other end side of the second terminal relative to the reference end.

[0007] A method for manufacturing a detection device according to one aspect of the present invention includes a first substrate having a plurality of first terminals arranged in a first direction, and a second substrate that is a flexible substrate having an organic photodiode, a plurality of second terminals, and a plurality of wirings connecting the organic photodiode and the plurality of second terminals, the method including a step of crimping the plurality of first terminals and the plurality of second terminals from the second substrate side with a crimping head in a state where an anisotropic conductive film including conductive balls is sandwiched between the first substrate and the plurality of second terminals, the wirings connected to the plurality of second terminals are connected to one end side of the second terminals, and at least one of the plurality of first terminals is connected to one end side of the second terminals. One protrudes from the peripheral portion of the first terminal toward the side where the second substrate is crimped to the first substrate, and the crimping range of the multiple first terminals and the multiple second terminals by the crimping head is located away from the reference end of the first terminal protruding from the peripheral portion in a second direction, the second direction being perpendicular to the first direction and extending along the plate surface of the first substrate, the reference end being the end of the first terminal protruding from the peripheral portion in the second direction that is on the one end side of the second terminal that is crimped to the first terminal, and the crimping range is located on the other end side of the second terminal with respect to the reference end.

[0008] FIG. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment, when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG. 1. FIG. 3 is a development view showing an example of the optical sensor of the detection device shown in FIG. 1. FIG. 4 is a diagram showing a schematic layered structure of the base portion 610 side and the terminal portion 620 side of the second substrate 21. FIG. 5 is a plan view showing a more enlarged view of the second substrate 21. FIG. 6 is a diagram showing a plan view and a cross-sectional view showing the configuration near the pressure-bonded portion between the film substrate pad 550 and the substrate pad 720. FIG. 7 is a diagram showing the positional relationship between the reference line 621, the reference line 622, and the reference line 626 according to a comparative example. FIG. 8 is a diagram comparing the changes in the configuration of the film substrate pad 550 and the vicinity of the film substrate pad 550 from a plan view before and after pressure-bonding of the film substrate pad 550 and the substrate pad 720 between the embodiment and the comparative example. Fig. 9 is a diagram showing a pressing process for pressing the film substrate pad 550 and the substrate pad 720 together by the pressure bonding head 900. Fig. 10 is a diagram showing a plan view and a cross-sectional view showing the configuration near the pressure-bonded portion of the film substrate pad 550 and the substrate pad 720 in Modification 1. Fig. 11 is a diagram showing a plan view and a cross-sectional view showing the configuration near the pressure-bonded portion of the film substrate pad 550 and the substrate pad 720 in Modification 2. Fig. 12 is a plan view showing the configuration near the pressure-bonded portion of the film substrate pad 550 and the substrate pad 720 in Modification 2, and is a diagram showing a part that is different from the "plan view" of Fig. 11.

[0009] Modes for carrying out the invention (embodiments) will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. The disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, elements similar to those described above with reference to the previous figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] In this specification and claims, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0011] (Embodiment) Fig. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment when a finger is placed inside the detection device as viewed from the side of the housing. Fig. 2 is a schematic cross-sectional view taken along line II-II shown in Fig. 1. Fig. 3 is a development view showing an example of the development of the optical sensor of the detection device shown in Fig. 1.

[0012] The detection device 1 shown in FIG. 1 is a ring-shaped device that can be attached to and detached from the human body, and is worn on a finger Fg of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, little finger, etc. The detection device 1 can detect biometric information about a living organism from the finger Fg on which it is worn. The finger Fg is an example of a measurement target. The measurement target is a living organism or a part of a living organism, and is a measurement target. The detection device 1 is made into a ring or wristband, making it easy for a user to carry. In the following description, it is assumed that the detection device 1 is used as a ring.

[0013] 2, the detection device 1 includes a housing 200, a light source 60, a first optical sensor 10A, and a second optical sensor 10B. The detection device 1 includes a battery (not shown) inside the housing 200 and is operated by power from the battery.

[0014] The housing 200 is formed in a ring shape (annular shape) that can be worn on a finger Fg and is a wearable member that is attached to a living body. In the example shown in FIG. 2 , the housing 200 includes a sealing film 210 and an exterior part 220. The sealing film 210 and the exterior part 220 are integrally formed into a ring shape. The sealing film 210 houses the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. inside. The sealing film 210 is formed in a ring shape using a housing material such as a transparent synthetic resin or silicone. The exterior part 220 has a surface of the housing 200 that covers the outer peripheral surface 210A of the sealing film 210. The exterior part 220 is formed in a ring shape using a material such as a metal or a non-transparent synthetic resin. The housing 200 houses a first substrate 70, on which the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. are mounted, inside the sealing film 210. The first substrate 70 is housed inside the housing 200 by, for example, forming the first substrate 70 into a ring shape in a mold and filling a filling material around the first substrate 70 to form the housing 200 .

[0015] 3 , the first substrate 70 is formed in a deformable band shape, and is formed into a ring shape by bringing one end 71 and the other end 72 close to or overlapping each other. The first substrate 70 has a first mounting area 73 and a second mounting area 74. The first mounting area 73 is an area where the light source 60 and the like are mounted. The second mounting area 74 is an area where the control circuit 122, the power supply circuit 123, and the like are mounted. The second substrate 21 is mounted on the first substrate 70 so as to straddle the vicinity of the light source 60 in the first mounting area 73.

[0016] In this embodiment, the first optical sensor 10A and the second optical sensor 10B are provided so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is arranged in the circumferential direction 200C with the first optical sensor 10A, the light source 60, and the second optical sensor 10B lined up in this order. By arranging the first optical sensor 10A and the second optical sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the first optical sensor 10A and the second optical sensor 10B can detect light emitted by the light source 60 over a wide range of the housing 200.

[0017] The second substrate 21 is an insulating substrate formed in a strip shape using, for example, a film-like synthetic resin such as PET (Poly Ethylene Terephthalate). The second substrate 21 is deformable and has the first optical sensor 10A and the second optical sensor 10B mounted thereon. The second substrate 21 can be bent in the third direction Dz. By being attached to the first substrate 70, the second substrate 21 positions the first optical sensor 10A and the second optical sensor 10B on both sides of the light source 60 in the circumferential direction 200C of the housing 200. The second substrate 21 has a first region 21A where the first optical sensor 10A is mounted and a second region 21B where the second optical sensor 10B is mounted. The second substrate 21 is formed as a single substrate having the first region 21A and the second region 21B.

[0018] 2 , the first substrate 70 is housed inside the housing 200 so that the surface on which the first optical sensor 10A, the second optical sensor 10B, and the light source 60 are mounted faces the inner circumferential surface 200B of the housing 200. If the first substrate 70 is translucent, the first optical sensor 10A, the second optical sensor 10B, and the light source 60 may be mounted on the back surface opposite the front surface. In this case, the light source 60 may be disposed so that it emits light toward the first substrate 70 and the light that has passed through the first substrate 70 is emitted toward the outside of the housing 200.

[0019] As shown in FIG. 2 , the light source 60 is provided inside the sealing film 210 of the housing 200 and is configured to be able to irradiate light toward a detection object such as a finger Fg worn on the ring-shaped housing 200. For example, an inorganic LED (Light Emitting Diode) or an organic EL (Organic Light Emitting Diode) is used as the light source 60. The light source 60 irradiates light of a predetermined wavelength. In this embodiment, the light source 60 has a plurality of light sources capable of irradiating near-infrared light, red light, and green light.

[0020] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include pulse waves, pulse rates, and blood vessel images of the finger or palm. That is, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects vascular patterns such as veins.

[0021] Each of the first optical sensor 10A and the second optical sensor 10B detects light emitted by the light source 60 and reflected by a finger Fg or the like, directly incident light, etc. The first optical sensor 10A and the second optical sensor 10B are organic photodiodes. The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end 61 of the light source 60 in the circumferential direction 200C of the housing 200. The second optical sensor 10B is provided on the housing 200 so as to be adjacent to the other end 62 of the light source 60 in the circumferential direction 200C of the housing 200.

[0022] As shown in FIG. 3 , the first optical sensor 10A and the second optical sensor 10B each have an organic photodiode OPD (see FIG. 4 ). Each of the first optical sensor 10A and the second optical sensor 10B has two electrodes 11 aligned along the circumferential direction 200C. The first optical sensor 10A and the second optical sensor 10B are mounted on a single second substrate 21 and electrically connected to the first substrate 70 via the second substrate 21. The second substrate 21 has a cutout portion 22 (see FIG. 4 ) between the first optical sensor 10A and the second optical sensor 10B in the circumferential direction 200C of the housing 200. In other words, the detection device 1 is a detection device that detects light using an organic photodiode OPD.

[0023] In the following description, the first direction Dx is a direction in a plane parallel to the second substrate 21. The second direction Dy is a direction in a plane parallel to the second substrate 21 and is the same direction as the circumferential direction 200C. In the embodiment, the first direction Dx and the second direction Dy are perpendicular to each other, but the intersection angle between the first direction Dx and the second direction Dy does not necessarily have to be strictly perpendicular, and the first direction Dx and the second direction Dy may intersect without being perpendicular. The third direction Dz is a direction perpendicular to the second direction Dy and the first direction Dx. The third direction Dz is a normal direction to the second substrate 21. The term "planar view" refers to the positional relationship when viewed from a direction perpendicular to the second substrate 21. The term "lateral" refers to a direction (such as the first direction Dx or the second direction Dy) that intersects with the third direction Dz.

[0024] In the following description, the second substrate 21 will be described by distinguishing between the base 610 side and the terminal portion 620 side. The base 610 side is the side on which organic photodiodes OPD (see FIG. 4 ) such as the first optical sensor 10A and the second optical sensor 10B are formed. The terminal portion 620 side is the side on which terminals 500 of wiring connected to the organic photodiodes OPD are formed. Furthermore, the boundary between the portion of the second substrate 21 on the base 610 side and the portion of the second substrate 21 on the terminal portion 620 side is indicated as a boundary line 600.

[0025] FIG. 4 is a diagram showing a schematic stacked structure on each of the base portion 610 side and the terminal portion 620 side of the second substrate 21. Note that FIG. 4 is merely a schematic diagram for specifically explaining the stacked structure, and the layout, shape, size, and other aspects of each component from a planar perspective are more accurately shown in FIG. 5 , which will be described later. A stacked structure constituting the organic photodiode OPD is formed on the base portion 610 side. Specifically, the organic photodiode OPD includes an active layer 301, a hole injection layer 302, and an electron injection layer 303. More specifically, the organic photodiode OPD has a stacked structure in which the hole injection layer 302 and the electron injection layer 303 sandwich the active layer 301 in the third direction Dz.

[0026] The characteristics (for example, voltage-current characteristics and resistance value) of the active layer 301 change depending on the light irradiated thereto. An organic material is used as the material of the active layer 301. The hole injection layer 302 is a so-called HIL (Hole Injection Layer). The electron injection layer 303 is a so-called EIL (Electron Injection Layer).

[0027] More specifically, the active layer 301 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed together. For example, low-molecular-weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butylic acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (rubrene: 5,6,11,12-tetraphenyltetracene), and PDI (perylene derivative) can be used as the active layer 301.

[0028] The active layer 301 can be formed using these low-molecular-weight organic materials by a vapor deposition (dry process). In this case, the active layer 301 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 301 can also be formed by a coating (wet process). In this case, the active layer 301 is made of a material that combines the above-mentioned low-molecular-weight organic material with a high-molecular-weight organic material. Examples of high-molecular-weight organic materials that can be used include P3HT (poly(3-hexylthiophene)) and F8BT (F8-alt-benzothiadiazole). The active layer 301 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0029] Furthermore, a conductive polymer such as a composite (PEDOT:PSS) made of poly(3,4-ethylenedioxythiophene) and polystyrene sulfonic acid (PSS) is used as the material for the hole injection layer 302. Furthermore, an alkali metal with a small work function, such as lithium (Li), is used as the material for the electron injection layer 303.

[0030] Although not shown in FIG. 4 , a hole transport layer may be further formed between the hole injection layer 302 and the active layer 301. Furthermore, an electron transport layer may be further formed between the active layer 301 and the electron injection layer 303. A metal oxide layer is used as the material for the hole transport layer. Examples of such metal oxide layers include tungsten oxide (WO3) and molybdenum oxide. For example, ethoxylated polyethyleneimine (PEIE) is used as the material for the electron transport layer. Furthermore, the hole transport layer and the electron transport layer are not limited to single-layer films, and may be formed as a laminated film including an electron blocking layer or a hole blocking layer.

[0031] The hole injection layer 302 abuts against the electrode 312 that functions as an anode. Specifically, the hole injection layer 302 includes a connection portion 3021. The connection portion 3021 is a part of the hole injection layer 302, and is formed to extend from the active layer 301 in the third direction Dz on a side of the active layer 301 and the electron injection layer 303. The connection portion 3021 abuts against the electrode 312, thereby causing the hole injection layer 302 to abut against the electrode 312.

[0032] The electron injection layer 303 is in contact with the electrode 11 that functions as a cathode. The electrode 11 is disposed to face the active layer 301 in the third direction Dz, with the electron injection layer 303 sandwiched between them.

[0033] The electrode 11 and the hole injection layer 302 are each connected to a conductive material layer that functions as a wiring. Specifically, the electrode 11 is connected to the wiring 331. The hole injection layer 302 is connected to the wiring base 3300. The wiring 331 and the wiring base 3300 are the same conductive material layer. This conductive material layer is formed of a light-transmitting conductive material such as indium tin oxide (ITO), but is not limited thereto and may be formed of other conductive materials. The wiring 331 and the wiring base 3300 are separated by an insulating layer 320. More specifically, the insulating layer 320 is interposed between the electrode layer including the electrode 11 and the electrode 312 and the conductive material layer including the wiring 331 and the wiring base 3300. This electrode layer is formed of a light-transmitting conductive material such as ITO. The insulating layer 320 has a through hole 391 formed therein for electrically connecting the electrode 11 and the wiring 331. The insulating layer 320 also has a through hole 392 formed therein for electrically connecting the electrode 312 and the wiring base 3300.

[0034] 4 , the wiring 331 extends to both the base 610 side and the terminal 620 side across the boundary line 600 so as to connect the base 610 side and the terminal 620 side. The insulating layer 320 also extends to both the base 610 side and the terminal 620 side.

[0035] A laminated structure for providing the terminal 500 is formed on the terminal portion 620 side. The terminal 500 is a conductive terminal connected to the wiring 331. Specifically, the terminal 500 is formed on one end side in the second direction Dy of the wiring 110 connected to the wiring 331 extending toward the terminal portion 620 side. The wiring 110 is in the same layer as the electrode layer including the electrode 11 and the electrode 312. An insulating layer 320 is interposed between the wiring 110 and the wiring 331, and a through hole 393 is provided to electrically connect the wiring 110 and the wiring 331.

[0036] It should be noted that when the term wiring portion 33 is used, it refers to a laminated structure included in the second substrate 21, as shown in FIG. 4, which is formed of a conductive material layer including wiring 331 and wiring base 3300, an insulating layer 320, and an electrode layer including electrode 11, electrode 312, and wiring 110.

[0037] A film substrate pad 550 is provided on one end of the wiring 110 in the second direction Dy. The film substrate pad 550 is laminated on one surface of the wiring portion 33, on the terminal portion 620 side of the second substrate 21. The film substrate pad 550 functions as the terminal 500 of the second substrate 21. Furthermore, the portion of the wiring 110 included in the wiring portion 33 where the film substrate pad 550 is not formed functions as the wiring connected to the terminal 500. The reference line 621 indicates the end position of the film substrate pad 550 on the wiring portion 33 side in the second direction Dy. In other words, the reference line 621 can be said to indicate the boundary between the area where the film substrate pad 550 is provided and the area where the film substrate pad 550 is not provided in the second direction Dy. Therefore, the reference line 621 can be said to indicate the boundary between the terminal 500 and the wiring connected to the terminal 500.

[0038] Although the wiring 331 shown in FIG. 4 is connected to the electrode 11 via a through hole 391, a plurality of components that function as wiring, such as the wiring 331, are provided on the second substrate 21.

[0039] Fig. 5 is a more enlarged plan view of the second substrate 21. As shown in Fig. 3 and Fig. 5, four electrodes 11 are provided on the second substrate 21. Specifically, two electrodes 11 are provided on each of the first optical sensor 10A and the second optical sensor 10B.

[0040] As shown in FIG. 5 , one of the four electrodes 11 is connected to a wiring portion 3311 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3312 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3313 via a through hole 391. Another of the four electrodes 11 is connected to a wiring portion 3314 via a through hole 391. The wiring portions 3311, 3312, 3313, and 3314 are each individual wirings 331. The wiring portion 3311 is connected to the through hole 391 on the base portion 610 side and to the terminal 504 on the terminal portion 620 side. The wiring portion 3312 is connected to the through hole 391 on the base portion 610 side and to the terminal 503 on the terminal portion 620 side. The wiring portion 3313 is connected to the through hole 391 on the base portion 610 side, and is connected to the terminal 509 on the terminal portion 620 side. The wiring portion 3314 is connected to the through hole 391 on the base portion 610 side, and is connected to the terminal 510 on the terminal portion 620 side. The terminals 503, 504, 509, and 510 are each an individual terminal 500.

[0041] The wiring base 3300 of the first optical sensor 10A is connected to the wiring portion 3310. The wiring base 3300 of the second optical sensor 10B is connected to the wiring portion 3315. The wiring portions 3310 and 3315 are each an individual wiring 331. The wiring portion 3310 is connected to the wiring base 3300 on the base portion 610 side and to the terminals 505 and 507 on the terminal portion 620 side. The wiring portion 3315 is connected to the wiring base 3300 on the base portion 610 side and to the terminal 511 on the terminal portion 620 side. The terminals 505, 507, and 511 are each an individual terminal 500. As described with reference to FIG. 4 , the electrode 312 abuts the wiring base 3300. Therefore, like the electrode 11, the electrode 312 is also connected to the terminal 500 via the wiring 331.

[0042] 4 , the wiring 331, the wiring base 3300, and the insulating layer 320 are in contact with one surface of the insulating layer 340. The other surface of the insulating layer 340 is in contact with the adhesive layer 350. The adhesive layer 350 is interposed between the insulating layer 340 and the structure-maintaining layer 360.

[0043] On one surface of the structure maintaining layer 360, an adhesive layer 350, an insulating layer 340, a conductive material layer including the wiring 331 and the wiring base 3300, an insulating layer 320, an electrode layer including the electrode 11, the electrode 312 and the wiring 110, an electron injection layer 303, an active layer 301, and a hole injection layer 302 are laminated in this order, thereby forming a main laminated structure including the organic photodiode OPD and a terminal 500 electrically connected to the organic photodiode OPD.

[0044] Furthermore, the second substrate 21 includes a configuration for structurally protecting and reinforcing the organic photodiode OPD. Specifically, the second substrate 21 includes an adhesive layer 410 and an additional structure-maintaining portion 450. The adhesive layer 410 is provided at the base 610 so as to cover the organic photodiode OPD from the hole injection layer 302 side. The additional structure-maintaining portion 450 has a structure in which an adhesive layer 430 and an insulating layer 420 are stacked on a structure-maintaining layer 440. The adhesive layer 430 is interposed between the structure-maintaining layer 440 and the insulating layer 420. The insulating layer 420 side of the additional structure-maintaining portion 450 abuts against the adhesive layer 410. The structure for structurally protecting and reinforcing the organic photodiode OPD is formed by forming an adhesive layer 410 to cover the organic photodiode OPD after the formation of the main laminated structure described above, and then adhering the additional structure maintaining portion 450 to the adhesive layer 410 with the insulating layer 420 facing the adhesive layer 410 side.

[0045] Note that the term "intermediate portion 400" refers to a laminated structure formed by the organic photodiode OPD and the adhesive layer 410. Therefore, it can be said that the second substrate 21 has a structure in which, when viewed from the additional structure-maintaining portion 450 side, the additional structure-maintaining portion 450, intermediate portion 400, wiring portion 33, insulating layer 340, adhesive layer 350, and structure-maintaining layer 360 are laminated in this order.

[0046] The insulating layer 340 and the insulating layer 420 are insulating layers and are formed using, for example, colorless and transparent polyimide (CPI). The adhesive layer 350 is an adhesive layer that bonds the insulating layer 340 and the structure-maintaining layer 360 together. The adhesive layer 430 is an adhesive layer that bonds the insulating layer 420 and the structure-maintaining layer 440 together. The adhesive layers 350 and 430 are formed using, for example, a translucent adhesive film (OCA: Optically Clear Adhesive). The structure-maintaining layer 360 and the structure-maintaining layer 440 are structural maintenance members and are formed using, for example, polyethylene terephthalate (PET: Poly Ethylene Terephthalate). The adhesive layer 410 is formed using, for example, an encapsulation adhesive.

[0047] 4. Unwired terminals 501, 502, and 512 shown in FIG. 5 have the same configuration as terminal 500, except that they are not connected to the configuration corresponding to wiring 331 shown in FIG.

[0048] The organic photodiode OPD is electrically connected to the control circuit 122 and the power supply circuit 123 provided on the first substrate 70 by pressure-bonding the terminal 500 of the second substrate 21 to the substrate pad 720 (see FIG. 6 etc.) formed on the first substrate 70. The configuration related to such pressure-bonding will be described below with reference to FIGS. 6 to 8.

[0049] FIG. 6 shows a plan view and a cross-sectional view illustrating the configuration near the pressure-bonded portion between the film substrate pad 550 and the substrate pad 720. The cross-sectional views in FIG. 6 and the later-described FIGS. 7, 9, 10, and 11 are cross-sectional views taken along the line A-A' in the plan views included in the respective figures. Hereinafter, unless otherwise specified, references to FIG. 6, etc. refer to FIGS. 6, 7, 9, 10, and 11. Note that in FIG. 6, etc., the plan view omits illustrations of the more detailed configuration of the second substrate 21, such as the intermediate portion 400, in order to focus on the description of the configuration of the terminal 500, particularly the film substrate pad 550, included in the second substrate 21. The more detailed configuration of the second substrate 21 in plan view is as shown in FIG. 5.

[0050] 6 and other drawings, terminals 500a, 500b, 500c, 500d, 500e, and 500f are assigned as reference numerals individually assigned to each of the multiple terminals 500. The terminals 500a, 500b, 500c, 500d, 500e, and 500f are six terminals 500 arranged in the first direction Dx, and are six of the terminals 503, 504, 505, 506, 507, 508, 509, 510, and 511 shown in FIG. 6 and other drawings illustrate the relationship between the six terminals 500 and the board pads 720 that are crimped to the six terminals 500, but other terminals 500 beyond the six are also crimped to the board pads 720 that are provided corresponding to the other terminals 500 in the same manner as the six terminals 500.

[0051] As described above, the second substrate 21 has a structure in which, as viewed from the additional structure-maintaining portion 450 side, the additional structure-maintaining portion 450, the intermediate portion 400, the wiring portion 33, the insulating layer 340, the adhesive layer 350, and the structure-maintaining layer 360 are laminated in this order. This is shown in cross-sectional views such as FIG. 6 . Furthermore, as shown in plan views such as FIG. 6 , each of the multiple terminals 500, such as terminals 500a, 500b, 500c, 500d, 500e, and 500f, is provided with a film substrate pad 550, as described with reference to FIG. 4 . The film substrate pad 550 is formed on one surface of the wiring portion 33, on the terminal portion 620 side of the second substrate 21.

[0052] As shown in cross-sectional views such as FIG. 6 , the substrate pad 720 has a laminated structure including a wiring portion 719, a terminal surface layer 721, and an intervening layer 730. The wiring portion 719 is a wiring formed on the first substrate 70 and is formed of, for example, copper. The terminal surface layer 721 is a thin-film conductor applied to the wiring portion 719 and is formed of, for example, copper or gold. The intervening layer 730 is an anisotropic conductive film applied to the terminal surface layer 721 and is made of, for example, an anisotropic conductive film (ACF). The intervening layer 730 includes a plurality of conductive balls 731. The conductive balls 731 are minute, particulate-like spheres having conductivity. The diameter of the conductive balls 731 is, for example, within the range of 3 μm to 10 μm.

[0053] The first substrate 70 has a structure in which multiple wiring layers and multiple insulating layers are alternately stacked. Specifically, as shown in the cross-sectional view of FIG. 6 and other figures, a conductive layer 703, an insulating layer 707, a conductive layer 704, an insulating layer 708, a conductive layer 705, an insulating layer 709, and a conductive layer 706 are stacked between the coverlays 701 and 702 in this order from the coverlay 701 side. The conductive layers 703, 704, 705, and 706 have the same configuration as the wiring portion 719, are conductive, and are formed using, for example, copper foil. The coverlays 701 and 702 and the insulating layers 707, 708, and 709 are insulating and are formed using, for example, polyimide.

[0054] A structure maintaining layer 711 is provided between the wiring portion 719 of the substrate pad 720 and the coverlay 701. The structure maintaining layer 711 is a thin film layer-like base material, and is formed using, for example, FR4 (Flame Retardant Type 4).

[0055] As shown in the plan views and cross-sectional views of FIG. 6 and the like, the substrate pad 720 is surrounded by a peripheral portion 800 from a plan view. The peripheral portion 800 is a notch (opening) formed by removing a portion of the conductive layer 710 and the resist 712 around the substrate pad 720. The conductive layer 710 is wiring formed on the opposite side of the coverlay 701 with the structure-maintaining layer 711 sandwiched therebetween. The resist 712 is an insulating layer formed on the opposite side of the conductive layer 710 from the structure-maintaining layer 711 with the conductive layer 710 sandwiched therebetween. The substrate pad 720 is formed by removing the conductive layer 710 and the resist 712 to form the peripheral portion 800 on one side of the first substrate 70 where the conductive layer 710 is exposed. In other words, the wiring portion 719 of the substrate pad 720 can be said to be a wiring portion physically separated from the conductive layer 710 by the formation of the peripheral portion 800.

[0056] As shown in plan views such as Fig. 6 , the arrangement of the multiple board pads 720 on the first substrate 70 corresponds to the arrangement of the multiple terminals 500 on the second substrate 21. That is, the pitch of the multiple terminals 500 lined up in one direction on the second substrate 21 corresponds to the pitch of the multiple board pads 720 lined up in one direction on the first substrate 70. The one direction here is, for example, the first direction Dx in Fig. 6 .

[0057] Note that some of the wiring portions 719 included in each of the multiple substrate pads 720 may be electrically connected to the conductive layer 710. In FIG. 6 and other drawings, the wiring portions 719 of the substrate pads 720 arranged to overlap the terminals 500c and 500e are electrically connected to the conductive layer 710. More specifically, the wiring portions of the substrate pads 720 arranged to overlap the terminals 500c and 500e are formed in a state of continuity with the conductive layer 710 by not removing the wiring portions at positions corresponding to the connection portions 718 shown in the cross-sectional views of FIG. 6 and other drawings when forming the peripheral portion 800. In other words, the wiring portions 719 of the substrate pads 720 arranged to overlap the terminals 500a, 500b, 500d, and 500f in FIG. 6 and other drawings are not electrically connected to the conductive layer 710.

[0058] Wiring portions 719 of substrate pads 720 arranged to overlap terminals 500a, 500b, 500d, and 500f are electrically connected to at least one of conductive layers 703, 704, 705, and 706 via through holes. Through holes 751, 752, 753, 754, and 755 shown in cross-sectional views such as Figure 6 are examples of such through holes, but the specific form of the through holes is not limited to that shown in Figure 6. It is arbitrary to connect wiring portion 719 of each of the multiple substrate pads 720 to any of multiple wires included in multiple wiring layers of first substrate 70.

[0059] Note that the first substrate 70 may also have a laminated structure of wiring layers and insulating layers formed on the coverlay 702 side similar to that on the coverlay 701 side. In cross-sectional views such as FIG. 6 , a structure-maintaining layer 711, a conductive layer 741, and a resist 743 are further laminated on the coverlay 702 side. The structure-maintaining layer 711 has the same configuration as the structure-maintaining layer 711. The conductive layer 741 has the same configuration as the conductive layer 710. The resist 743 has the same configuration as the resist 712. Note that in the embodiment, no notch like the peripheral portion 800 is formed in the laminated structure formed on the coverlay 702 side of the first substrate 70 by laminating the structure-maintaining layer 711, the conductive layer 741, and the resist 743.

[0060] When the film substrate pad 550 is viewed from the second substrate 21 side in a plan view, the conductive ball 731 can be seen after the film substrate pad 550 and the substrate pad 720 are pressed together.

[0061] When the second substrate 21 and the first substrate 70 are positioned such that the film substrate pad 550 and the substrate pad 720 are pressure-bonded to each other, the peripheral portion 800 is located on the terminal portion 620 side. Note that in Figure 6 and other figures, reference lines 611, 621, 622, 623, 624, 625, 626, and 627 along the first direction Dx are illustrated to show the positional relationship in the second direction Dy between the configuration of the second substrate 21 and the configuration of the first substrate 70. The reference line 611 indicates the end position of the second substrate 21 on the base portion 610 side. As described with reference to Figure 4, the reference line 621 indicates the end position of the film substrate pad 550 on the wiring portion 33 side among the end positions in the second direction Dy. As described above, the reference line 621 also indicates the boundary between the terminal 500 and the wiring connected to the terminal 500. Hereinafter, when one end side of the terminal 500 is described, it refers to the side where the wiring is connected to the terminal 500 , that is, the reference line 621 of the film substrate pad 550 .

[0062] In this embodiment, as shown in FIG. 6, the boundary line 600 and the position of the end of the board pad 720 on the boundary line 600 side in the second direction Dy coincide with each other.

[0063] The reference line 622 indicates one end position in the second direction Dy that is closer to the base 610 among the end positions in the range in which the conductive ball 731 can be seen after the film substrate pad 550 and the substrate pad 720 are pressed together. The reference line 623 indicates the other end position in the second direction Dy that is farther from the base 610 among the end positions in the range in which the conductive ball 731 can be seen after the film substrate pad 550 and the substrate pad 720 are pressed together. That is, the conductive ball 731 can be seen in the range between the reference lines 622 and 623 within the range in which the substrate pad 720 is located. The width in the second direction Dy between the reference lines 622 and 623 is smaller than the width of the substrate pad 720 in the second direction Dy. Furthermore, the width of the film substrate pad 550 in the second direction Dy is smaller than the width of the substrate pad 720 in the second direction Dy. In the embodiment, the width in the second direction Dy between the reference lines 622 and 623 is larger than the width in the second direction Dy of the film substrate pad 550, but this is not essential. The width in the second direction Dy between the reference lines 622 and 623 may be equal to or smaller than the width in the second direction Dy of the film substrate pad 550. It can be said that the space between the reference lines 622 and 623 indicates the distance between both ends in the second direction Dy of the conductive portion between the film substrate pad 550 and the substrate pad 720.

[0064] The reference line 624 indicates the end position of the second substrate 21 on the terminal portion 620 side. Here, the terminal 500 is located between the reference lines 621 and 624. The reference line 621 is defined as the end on one end side of the terminal 500. The reference line 628 is defined as the end on the other end side of the terminal 500. The side of the film substrate pad 550 closer to the reference line 624 side can be said to be the reference line 628 side (the other end side of the terminal 500). The reference line 625 indicates the end position of the peripheral portion 800 in the second direction Dy that is closer to the end position on the terminal portion 620 side of the second substrate 21 indicated by the reference line 624.

[0065] A reference line 626 indicates the position of one end of the board pad 720 in the second direction Dy. A reference line 627 indicates the position of one end of the board pad 720 in the second direction Dy. Here, one of the ends of the board pad 720, i.e., the end of the board pad 720 indicated by the reference line 626, is defined as the reference end. The reference end is on the side where the wiring portion 33 is located relative to the film board pad 550 that is pressure-bonded to the board pad 720, i.e., on the side of one end of the terminal 500 indicated by the reference line 621. Therefore, the reference end can be said to be the end of the board pad 720 in the second direction Dy that protrudes toward the second substrate 21 in the peripheral portion 800, on the side of one end of the terminal 500 that is pressure-bonded to the board pad 720.

[0066] In the embodiment, the reference line 621 and the reference line 626 overlap each other. That is, in the embodiment, the end position of the film substrate pad 550 in the second direction Dy, which is on the wiring portion 33 side, and one of the ends of the substrate pad 720 in the second direction Dy overlap each other in a plan view.

[0067] As shown in FIG. 6 , in this embodiment, the range indicated by the reference lines 622 and 623, i.e., the range in which the conductive ball 731 can be seen after the film substrate pad 550 and the substrate pad 720 are pressed together, is closer to the reference line 624 than the reference line 626. The range in which the conductive ball 731 can be seen after the film substrate pad 550 and the substrate pad 720 are pressed together corresponds to the range that receives the pressure caused by the pressure between the film substrate pad 550 and the substrate pad 720. More specifically, the range that receives this pressure is indicated by the pressure-bonding range 890. As described above, the reference line 626 indicates the position of the reference end. Therefore, in this embodiment, the pressure-bonding range 890 is spaced apart from the reference end in the second direction Dy. More specifically, in this embodiment, the pressure-bonding range 890 is closer to the reference line 624 than the reference line 626. As described above, the side of film substrate pad 550 closest to reference line 624 is the reference line 628 side (the other end side of terminal 500). Therefore, it can be said that crimping range 890 is located on the other end side (reference line 628 side) of terminal 500 that is crimped to substrate pad 720 having the reference end (reference line 626) with respect to the reference end.

[0068] This prevents the wiring 110 from breaking near the boundary between the area where the film substrate pad 550 is provided and the area where the film substrate pad 550 is not provided due to the pressure generated by the pressure applied between the film substrate pad 550 and the substrate pad 720. The distance between the reference line 622 and the reference line 626, i.e., the distance between the end position of one end closer to the base 610 in the second direction Dy within the range where the conductive ball 731 is visible after the film substrate pad 550 and the substrate pad 720 are pressure-bonded, and one of the ends of the substrate pad 720 in the second direction Dy, can be set to, for example, 100 μm. This distance can be changed as needed within a range that prevents breakage due to wiring cracks. A comparative example for explaining the prevention of such breakage in more detail will be described with reference to FIG. 7 .

[0069] 7 is a diagram showing the positional relationship between reference lines 621, 622, and 626 in a comparative example. As shown in FIG. 7 , in the comparative example, reference lines 621, 622, and 626 are at the same position in the second direction Dy. That is, the boundary line (hereinafter referred to as the pressure force boundary line) between the region where the pressure force for bonding film substrate pad 550 and substrate pad 720 is applied to second substrate 21 and the region where the pressure force is not applied to second substrate 21 overlaps with reference lines 621 and 626. When the pressure force boundary line and reference line 626 overlap in this way, a crack like crack 901 occurs that crosses wiring portion 33 in the first direction Dx near the boundary line between film substrate pad 550 and wiring portion 33. This is because, due to a step in the third direction Dz caused by the proximity of the substrate pad 720 to the peripheral portion 800, the pressing force for pressing the film substrate pad 550 and the substrate pad 720 together acts as a force that bends the wiring portion 33 in the portion where the film substrate pad 550 is not provided toward the peripheral portion 800. Note that the comparative example shown in FIG. 7 has the same width in the second direction Dy between the reference line 622 and the reference line 623 as the embodiment shown in FIG. 6. Therefore, in the comparative example, the position of the reference line 623 is also closer to the boundary line 600 than in the embodiment. The comparative example is similar to the embodiment except that the positions of the reference line 622 and the reference line 623 are different from those of the embodiment.

[0070] When a crack like crack 901 occurs that crosses the wiring portion 33 in the first direction Dx near the boundary line between the film substrate pad 550 and the wiring portion 33, the wiring 110 (see Figure 4) of the wiring portion 33 may break near the boundary line between the film substrate pad 550 and the wiring portion 33 that overlaps with the crack.

[0071] FIG. 8 is a diagram comparing the changes in the configuration of the film substrate pad 550 and its vicinity before and after compression bonding between the film substrate pad 550 and the substrate pad 720 in a plan view between the embodiment and the comparative example. "Before compression bonding" in FIG. 8 shows the film substrate pad 550 and its vicinity as viewed from the second substrate 21 side in a plan view before the film substrate pad 550 and the substrate pad 720 are compressed together. "Before compression bonding" is common to the embodiment and the comparative example. "After compression bonding (comparative example)" in FIG. 8 shows the film substrate pad 550 and its vicinity as viewed from the second substrate 21 side of the comparative example described with reference to FIG. 7 after the film substrate pad 550 and the substrate pad 720 are compressed together. "After compression bonding (embodiment)" in FIG. 8 shows the film substrate pad 550 and its vicinity as viewed from the second substrate 21 side of the embodiment described with reference to FIG. 6 after the film substrate pad 550 and the substrate pad 720 are compressed together.

[0072] As shown in "Before Compression" in Figure 8, when looking at the film substrate pad 550 and the area around the film substrate pad 550 from the second substrate 21 side in a plan view before the film substrate pad 550 and substrate pad 720 are compressed together, the conductive ball 731 cannot be seen through the film substrate pad 550.

[0073] 8 , when film substrate pad 550 and the vicinity thereof are viewed from the second substrate 21 side in a plan view after film substrate pad 550 and substrate pad 720 have been pressed together, conductive ball 731 can be seen through film substrate pad 550. This is because the pressing of film substrate pad 550 and substrate pad 720 causes film substrate pad 550 and intervening layer 730 to come into contact with each other, and further, intervening layer 730 including conductive ball 731 is crushed by the pressure of the pressing, causing conductive ball 731 to bite into film substrate pad 550.

[0074] Furthermore, the pressure applied when the film substrate pad 550 and the substrate pad 720 are pressed together may cause cracks to form around the film substrate pad 550 in a plan view. In the "After Press-Bonding (Comparative Example)" example in Fig. 8 , crack 901 is one such crack. Therefore, a crack included in crack 901 that crosses the wiring portion 33 in the first direction Dx near the boundary between the film substrate pad 550 and the wiring portion 33 may cause breakage of the wiring 110 (see Fig. 4 ) of the wiring portion 33.

[0075] On the other hand, in the "after compression bonding (embodiment)" state of FIG. 8 , no crack 901 occurs as a crack caused by the pressure of the compression bonding between the film substrate pad 550 and the substrate pad 720. Therefore, in the embodiment, such a crack does not cause the wiring 110 to break. Note that even in the "after compression bonding (embodiment)" state, a compression mark 902 occurs as a crack. The compression mark 902 is a compression mark on the terminal surface layer 721 that occurs along the overlapping area between the film substrate pad 550 and the substrate pad 720. The compression mark 902 does not include a crack that crosses the wiring portion 33 in the first direction Dx. Therefore, even if the compression mark 902 occurs as a crack, the crack does not cause the wiring 110 to break. Furthermore, as described above, in the embodiment, the range indicated by reference lines 622 and 623, i.e., the range in which conductive ball 731 can be seen after film substrate pad 550 and substrate pad 720 are pressed together, is closer to the other end of film substrate pad 550 than reference line 626. As a result, the position of pressure mark end 9021 on the boundary line 600 side of pressure mark 902 is closer to reference line 624 than reference line 626. Note that in the embodiment, the relationship that the range receiving the pressure due to the pressure caused by the pressure between film substrate pad 550 and substrate pad 720 is closer to reference line 624 than reference line 621 also holds.

[0076] 7 , a crimp mark 902, not a crack 901, occurs in the substrate pad 720 that overlaps the terminals 500c and 500e. This is because the presence of the connection portion 718 suppresses the occurrence of cracks that cross the wiring portion 33 in the first direction Dx. However, in the comparative example, a crack that crosses the wiring portion 33 in the first direction Dx occurs near the boundary between the wiring portion 33 and a film substrate pad 550 that overlaps the substrate pad 720 that does not have the connection portion 718 and has a wiring portion 719 that is not continuous with the conductive layer 710. This may cause the wiring 110 (see FIG. 4 ) of the wiring portion 33 to break. Specifically, a crack 901 that occurs near the film substrate pad 550 that overlaps the terminals 500a, 500b, 500d, and 500f in FIG. 7 may cause the wiring 110 (see FIG. 4 ) of the wiring portion 33 connected to these film substrate pads 550 to break.

[0077] As shown in "After Compression Bonding (Comparative Example)" in FIG. 8 , crack 901 is a groove-like compression mark formed around film substrate pad 550, and such a groove may break wiring 110. Such a groove is formed in substrate pad 720. In FIG. 7 , crack 901 is schematically illustrated as surrounding film substrate pad 550 in order to clearly show the relative positional relationship with film substrate pad 550, but in reality, crack 901 occurs as shown in "After Compression Bonding (Comparative Example)" in FIG. 8 . Similarly, compression mark 902 is actually formed in substrate pad 720 as shown in "After Compression Bonding (Embodiment)," and compression marks 902 and 903 shown in FIG. 10 and the like, which will be described later, are merely schematically illustrated as surrounding film substrate pad 550 in order to clearly show the relative positional relationship with film substrate pad 550.

[0078] In the above embodiment, the area subjected to the pressure caused by the pressure between the film substrate pad 550 and the substrate pad 720 is closer to the other end of the film substrate pad 550 than the boundary (reference line 622) between the area where the film substrate pad 550 is provided and the area where the film substrate pad 550 is not provided in the wiring section 33, thereby making it possible to suppress breakage of the wiring 110 due to cracks that may be caused by the pressure caused by the pressure. Such a pressure bonding method will be described with reference to FIG.

[0079] 9 is a diagram showing a pressing process for pressing the film substrate pad 550 and the substrate pad 720 together by the bonding head 900. The method for pressing the film substrate pad 550 and the substrate pad 720 together involves applying a pressing force 910 by the bonding head 900 from the opposite side of the first substrate 70 across the second substrate 21. That is, in the pressing process for pressing the film substrate pad 550 and the substrate pad 720 together, which is included in the manufacturing process of the detection device 1, the bonding head 900 applies the pressing force 910 for pressing the film substrate pad 550 and the substrate pad 720 together from the second substrate 21 side. In this embodiment, the bonding head is heated to approximately 240° C. when the pressing force 910 is applied.

[0080] It should be noted that at the time pressing force 910 is applied, film substrate pads 550 and substrate pads 720 are aligned from a planar perspective, as shown in the "plan view" of Fig. 9. The alignment of film substrate pads 550 and substrate pads 720 here refers to the alignment of film substrate pads 550 of second substrate 21 with substrate pads 720 of first substrate 70 so that the wiring of first substrate 70 that is to be connected in accordance with the design of detection device 1 is connected to each of the multiple terminals 500 that second substrate 21 has.

[0081] It is also assumed that the crimping head 900 is aligned as shown in the cross-sectional view and plan view of Figure 9 at the time the pressing force 910 is applied. The alignment of the crimping head 900 here satisfies both the first and second conditions. The first condition is that the position of the crimping head 900 in the second direction Dy is closer to the reference line 624 than the reference line 626. The second condition is that the crimping head 900 is positioned so as to overlap all of the multiple terminals 500 in a plan view.

[0082] After the alignment of the film substrate pad 550 and the substrate pad 720 and the alignment of the compression head 900 are completed, as shown in the "cross-sectional view" of Figure 9, the compression head 900 applies a pressing force 910 that presses the film substrate pad 550 against the substrate pad 720 from the opposite side of the first substrate 70, sandwiching the second substrate 21 therebetween, thereby compressing the film substrate pad 550 and the substrate pad 720. After the compression bonding of the film substrate pad 550 and the substrate pad 720 is completed, as described with reference to "After Compression Bonding (Embodiment)" of Figure 8, when the film substrate pad 550 and the vicinity of the film substrate pad 550 are viewed from the second substrate 21 side in a plan view, the conductive ball 731 becomes visible through the film substrate pad 550. Therefore, it can be said that the plan view of Figure 6 and the like shows the film substrate pad 550 and the substrate pad 720 after compression bonding, and the cross-sectional view of Figure 6 and the like shows the film substrate pad 550 and the substrate pad 720 before compression bonding.

[0083] The crimping head 900 is a member in which the width in the second direction Dy of one surface of the crimping head 900 facing the second substrate 21 when the film substrate pad 550 and the substrate pad 720 are crimped together is the same as the width between the reference lines 622 and 623, and the length in the first direction Dx of the one surface is long enough to cover all of the terminals 500 that are to be crimped to the substrate pad 720. The crimping head 900 shown in FIG. 9 is rectangular, but the specific shape of the crimping head 900 is not limited to this and may be any shape as long as it satisfies the particular requirements for the one surface. In other words, the width in the second direction Dy of one surface of the crimping head 900 facing the second substrate 21 when the film substrate pad 550 and the substrate pad 720 are crimped together determines the width between the reference lines 622 and 623 shown in FIG. 6 and other figures. Therefore, the width of the surface of the crimping head 900 in the second direction Dy is predetermined to correspond to the width between the reference line 622 and the reference line 623 required when crimping the film substrate pad 550 and the substrate pad 720 together.

[0084] Also, as shown in Figure 9, the reference line 623 (the position of the end of the crimping head 900 in the second direction Dy that is on the reference line 624 side) is between the reference line 626 and the reference line 627, and does not go over the reference line 627.

[0085] 9, the bonding head 900 is shown as a white rectangle to illustrate the configuration that overlaps with the bonding head 900 during bonding, but the bonding head 900 does not need to be light-transmitting. The material of the bonding head 900 is not particularly limited as long as it is a hard member that is suitable for bonding the film substrate pad 550 and the substrate pad 720 together, and it may also be light-blocking.

[0086] 6 and other figures except for FIG. 9, the position and shape of the crimping head 900 from a plan view during crimping is shown as a crimping range 890. Therefore, after crimping, the conductive ball 731 can be seen within the crimping range 890 from a plan view, and within the range where the film substrate pad 550 and the substrate pad 720 overlap.

[0087] In the embodiment, the substrate pad 720 provided on the first substrate 70 functions as a first terminal. Also, in the embodiment, the terminal 500 provided with the film substrate pad 550 on the second substrate 21 functions as a second terminal. Also, the pressure-bonding between the film substrate pad 550 and the substrate pad 720 corresponds to the pressure-bonding between the first terminal and the second terminal.

[0088] As described above, according to the embodiment, the detection device 1 includes a first substrate (first substrate 70) having a plurality of first terminals (substrate pads 720) arranged in a first direction (first direction Dx); a second substrate having an organic photodiode (organic photodiode OPD), a plurality of second terminals (terminals 500 provided with film substrate pads 550), and a plurality of wirings (wirings 110 included in wiring portion 33) connecting the organic photodiode and the plurality of second terminals. The plurality of first terminals and the plurality of second terminals are pressure-bonded to each other with an anisotropic conductive film (intermediate layer 730) including conductive balls (conductive balls 731) sandwiched therebetween. The wirings connected to the plurality of first terminals and the plurality of second terminals pressure-bonded to each other are connected to one end side (reference line 621 side) of the second terminal. At least one of the plurality of first terminals protrudes toward the second substrate from a peripheral portion (peripheral portion 800) of the first terminal. The crimping marks of the conductive ball overlapping each of the plurality of first terminals are located within a crimping range (crimping range 890) away from the reference end position (position indicated by reference line 626) in a second direction (second direction Dy). The second direction is perpendicular to the first direction and is a direction along the plate surface of the first substrate. The reference end is the end of the first terminal protruding from the peripheral portion in the second direction that is on the one end side of the second terminal crimped to the first terminal. The crimping range is located on the other end side (reference line 628 side) of the reference end.

[0089] This makes it possible to prevent wiring cracks from occurring in the wiring (wiring 110 included in wiring section 33) connected to the second terminal in the configuration of detection device 1 in which the first terminal (substrate pad 720) and the second terminal (terminal 500 provided with film substrate pad 550) are crimped together.

[0090] Furthermore, the crimping marks of the conductive balls (conductive balls 731) are within a crimping range (crimping range 890) that is spaced in the second direction (second direction Dy) from the position of the reference end (position indicated by reference line 626) of the first terminals (substrate pads 720) that protrude relative to the peripheral portion (peripheral portion 800), and are located between both ends of the first terminals (substrate pads 720) in the second direction (second direction Dy) (between reference lines 622 and 623). This makes it possible to suppress wiring cracks.

[0091] Furthermore, the position of the reference end (position indicated by reference line 626) and the position of the boundary between the second terminal (terminal 500 provided with film substrate pad 550) and the wiring (wiring 110 included in wiring portion 33) (position indicated by reference line 621) overlap in plan view. This makes it possible to suppress wiring cracks.

[0092] Further, a manufacturing method of the detection device 1 is a manufacturing method of a detection device (detection device 1) including: a first substrate (first substrate 70) having a plurality of first terminals (substrate pads 720) arranged in a first direction (first direction Dx); and a second substrate having an organic photodiode (organic photodiode OPD), a plurality of second terminals (terminals 500 provided with film substrate pads 550), and a plurality of wirings (wirings 110 included in wiring portion 33) connecting the organic photodiode and the plurality of second terminals, the manufacturing method including a step of crimping the plurality of first terminals and the plurality of second terminals with a crimping head (crimping head 900) from the second substrate side in a state where an anisotropic conductive film (intermediate layer 730) including conductive balls (conductive balls 731) is sandwiched therebetween; and the wirings connected to the plurality of second terminals are arranged on one end side (reference line 621 side) of the second terminals. ), at least one of the plurality of first terminals protrudes from a peripheral portion (peripheral portion 800) of the first terminal toward a side where the second substrate is crimped to the first substrate, and a crimping range of the plurality of first terminals and the plurality of second terminals by the crimping head (crimping range 890 corresponding to the crimping head 900) is located at a position away from a position of a reference end of the first terminal protruding from the peripheral portion (position indicated by a reference line 626) in a second direction (first direction Dx), the second direction being orthogonal to the first direction and extending along the plate surface of the first substrate, the reference end being an end of the first terminal protruding from the peripheral portion in the second direction that is on the one end side of the second terminal that is crimped to the first terminal, and the crimping range is located on the other end side (reference line 628 side) of the reference end.

[0093] This makes it possible to prevent wiring cracks from occurring in the wiring (wiring 110 included in wiring section 33) connected to the second terminal (terminal 500 provided with film substrate pad 550) even when the first terminal (substrate pad 720) and the second terminal (terminal 500 provided with film substrate pad 550) are crimped together.

[0094] Furthermore, in the manufacturing method of the detection device 1, the position of the reference end (position indicated by reference line 626) and the position of the boundary (position indicated by reference line 621) between the second terminal (terminal 500 provided with film substrate pad 550) that is crimped to the first terminal (substrate pad 720) that protrudes from the peripheral portion, and the wiring (wiring 110 included in wiring portion 33) overlap in a plan view. This makes it possible to suppress wiring cracks.

[0095] Furthermore, in the manufacturing method of the detection device 1, the position of the opposite end of the end of the crimping head (crimping head 900) in the second direction (second direction Dy) (position indicated by reference line 623) is located closer to the reference end than the position of the end of the first terminal (substrate pad 720) protruding from the peripheral part (peripheral part 800) that is located on the opposite side of the reference end in the second direction (position indicated by reference line 627). This makes it possible to suppress wiring cracks.

[0096] (Modifications) The embodiment has been described above with reference to Fig. 1 to Fig. 9. Below, modifications that are partially different from the embodiment will be described with reference to Fig. 10 to Fig. 12. In the description of the modifications, the same components as those in the embodiment will be assigned the same reference numerals and description thereof will be omitted.

[0097] (Modification 1) FIG. 10 is a plan view and a cross-sectional view showing the configuration of the vicinity of the pressure-bonded portion between the film substrate pad 550 and the substrate pad 720 in Modification 1. In FIG.

[0098] 10 , in Modification 1, reference line 621 is located closer to reference lines 624, 625, and 627 than reference line 626. As described above, Modification 1 is similar to the embodiment except for the points noted otherwise. In Modification 1, although pressure-bonding marks 902 may occur, such pressure-bonding marks 902 do not break the wiring 110 (see FIG. 4 ) of wiring portion 33, as described above.

[0099] 11 is a plan view and a cross-sectional view showing the configuration of the vicinity of the crimped portion between the film substrate pad 550 and the substrate pad 720 in Modification 2. Modification 2 differs from the embodiment and Modification 1 in that the reference line 627 and the reference line 623 overlap in a plan view. Therefore, in the manufacturing method of the detection device according to Modification 2, the position (position indicated by the reference line 627) of the end of the first terminal (substrate pad 720) protruding from the peripheral portion (peripheral portion 800) and located on the opposite side (on the side of the reference lines 624 and 625) in the second direction (second direction Dy) from the reference end (the end of the substrate pad 720 whose position is indicated by the reference line 626) overlaps in a plan view with the position (position indicated by the reference line 623) of the opposite end of the end of the crimping head (crimping head 900) in the second direction.

[0100] 12 is a plan view showing the configuration of the vicinity of the compression-bonded portion between the film substrate pad 550 and the substrate pad 720 in Modification 2, and is a view showing a state that is partially different from the "plan view" in FIG. 11. In Modification 2, as shown in FIG. 12, compression marks 902 and 903 may be generated, but these do not break the wiring 110 (see FIG. 4) of the wiring portion 33. The compression marks 903 are compression marks on the terminal surface layer 721 that are generated at the end of the substrate pad 720 in the second direction Dy, on the end side of the reference line 624. As described above, Modification 2 is similar to Modification 1, except for the points noted above.

[0101] According to variants 1 and 2, the position of the boundary between the second terminal (terminal 500 provided with film substrate pad 550) and the wiring (wiring 110 included in wiring section 33) (position indicated by reference line 621) is located on the opposite side (reference line 624 side) of the position of the reference end (position indicated by reference line 626).

[0102] In the above-described embodiment, the first substrate 70 is a flexible substrate, but the first substrate 70 may be a rigid substrate that does not have flexibility. The form of the detection device 1 is not limited to the ring-shaped form described with reference to Figures 1 and 2, and any form of device in which light detection by an organic photodiode OPD is expected may be applied.

[0103] Furthermore, in the above-described embodiment, the first optical sensor 10A and the second optical sensor 10B are provided, but the number of organic photodiodes OPD provided in the detection device is not limited to the number exemplified in the embodiment, and may be one or more.

[0104] The components of each of the above-described embodiments can be combined as appropriate. Furthermore, other effects and advantages brought about by the aspects described in the present embodiments that are obvious from the description in this specification or that can be conceived by a person skilled in the art are naturally understood to be brought about by the present invention.

[0105] 1 Detector 21 Second substrate 70 First substrate 500 Terminal 550 Film substrate pad 720 Substrate pad 730 Intervening layer 731 Conductive ball 800 Periphery OPD Organic photodiode

Claims

1. A flexible substrate comprising: a first substrate having a plurality of first terminals arranged in a first direction; and a second substrate which is a flexible substrate having an organic photodiode, a plurality of second terminals, and a plurality of wirings connecting the organic photodiode and the plurality of second terminals, wherein the plurality of first terminals and the plurality of second terminals are crimped with an anisotropic conductive film including conductive balls sandwiched therebetween, the wirings connected to the plurality of first terminals and the plurality of second terminals crimped are connected to one end of the second terminal, at least one of the plurality of first terminals protrudes toward the second substrate relative to the periphery of the first terminal, and crimping marks of the conductive balls overlapping with each of the plurality of first terminals are within a crimping range separated in a second direction from a reference end, the second direction being orthogonal to the first direction and extending along the plate surface of the first substrate, and the reference end being an end of the first terminal in the second direction protruding from the periphery, the end on the one end side of the second terminal crimped to the first terminal, The detection device, wherein the crimping range is located on the other end side of the second terminal with respect to the reference end.

2. The detection device according to claim 1, wherein the crimp mark is located between both ends of the first terminal in the second direction.

3. A detection device as described in claim 1 or 2, wherein the position of the reference end and the position of the boundary between the second terminal and the wiring overlap when viewed from the front on a plane along which the first direction and the second direction extend.

4. The detection device according to claim 1 or 2, wherein the boundary between the second terminal and the wiring is located on the other end side of the reference end.

5. A method for manufacturing a detection device comprising: a first substrate having a plurality of first terminals arranged in a first direction; and a second substrate which is a flexible substrate having an organic photodiode, a plurality of second terminals, and a plurality of wirings connecting the organic photodiode and the plurality of second terminals, the method comprising the steps of: crimping the plurality of first terminals and the plurality of second terminals from the second substrate side with a crimping head, with an anisotropic conductive film including conductive balls sandwiched therebetween; the wiring connected to the plurality of second terminals is connected to one end of the second terminal; at least one of the plurality of first terminals protrudes from a periphery of the first terminal toward a side where the second substrate is crimped to the first substrate; the crimping range of the plurality of first terminals and the plurality of second terminals by the crimping head is located at a position away from a reference end of the first terminal protruding from the periphery in a second direction; and the second direction is a direction perpendicular to the first direction and along the plate surface of the first substrate. a first end portion of the first terminal protruding from the peripheral portion in the second direction, the first end portion being an end portion of the second terminal that is crimped to the first terminal, and the crimping range being located on the other end side of the second terminal relative to the first end portion.

6. A method for manufacturing a detection device as described in claim 5, wherein the position of the reference end and the position of the boundary between the first terminal protruding from the peripheral portion, the second terminal crimped to the first terminal, and the wiring overlap when viewed from the front on a plane along which the first direction and the second direction extend.

7. A method for manufacturing a detection device as described in claim 5, wherein the position of the end of the crimping head in the second direction that is located on the one end side of the second terminal crimped by the crimping head and the position of the boundary between the second terminal and the wiring overlap when viewed from the front on a plane along which the first direction and the second direction extend.

8. A method for manufacturing a detection device as described in claim 5 or 7, wherein the position of the end of the first terminal that protrudes relative to the peripheral portion and is located on the opposite side of the reference end in the second direction and the position of the opposite end of the second direction ends of the crimping head overlap when viewed from the front on a plane along which the first direction and the second direction are aligned.

9. A method for manufacturing a detection device as described in claim 5 or 6, wherein the position of the end of the first terminal that protrudes relative to the peripheral portion and is located on the opposite side of the reference end in the second direction is such that the position of the opposite end of the second direction end of the crimping head is located on the reference end side.

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