Shielding member and electronic device comprising same

Abstract

An electronic device according to various embodiments of the present disclosure may be an electronic device including a card socket into which a card is inserted. The electronic device may comprise a printed circuit board on which the card socket and at least one electrical component are arranged. The electronic device may comprise at least one signal terminal formed in the card socket and configured to be electrically connectable to the card inserted into the card socket. The electronic device may comprise a shielding member disposed at a position adjacent to the card socket on one surface of the printed circuit board. The shielding member may include an upper surface formed to cover the at least one electrical component. The shielding member may include a shielding member extending from the upper surface toward the one surface of the printed circuit board and having a first side surface adjacent to the card socket. An opening may be formed in a region of the shielding member adjacent to the signal terminal of the first side surface.

Description

Shielding member and electronic device including same

[0001] Various embodiments of the present disclosure relate to electromagnetic shielding of electronic devices, and more particularly, to shielding members and electronic devices including the same.

[0002] Electronic devices include printed circuit boards (PCBs) on which various electrical components are arranged. For example, the PCB may include a card slot that accepts an integrated circuit (IC) card inserted into the electronic device. The IC card may include, for example, a subscriber identity module (SIM) card and / or a memory card.

[0003] A printed circuit board of an electronic device may include a shielding member (e.g., a shielding can) arranged to protect various electrical components arranged thereon from external electromagnetic interference (EMI) or to protect other electrical components from electromagnetic interference (EMI) generated by the electrical components. The shielding member may be arranged on the printed circuit board and grounded.

[0004] When reducing the size of a printed circuit board to reduce the size of an electronic device, the distance between components on the printed circuit board may become shorter. For example, the distance between a card socket and a shielding member may decrease. Accordingly, due to positional errors that occur when placing the card socket on the printed circuit board, the terminals (pins) of the card socket may come into electrical contact with the shielding member, which may cause defects and failures, such as short circuits and / or signal distortion, in the electronic device.

[0005] According to various embodiments of the present disclosure, an electronic device with reduced risk of short circuit in a card socket can be provided.

[0006] An electronic device according to various embodiments of the present disclosure may be an electronic device including a card socket into which a card is inserted. The electronic device may include a printed circuit board configured to have the card socket and at least one electrical component disposed thereon. The electronic device may include at least one signal terminal formed in the card socket and configured to be electrically connectable with the card inserted into the card socket. The electronic device may include a shielding member disposed at a position adjacent to the card socket on one surface of the printed circuit board. The shielding member may include an upper surface formed to cover the at least one electrical component. The shielding member may include a shielding member having a first side surface extending from the upper surface toward the one surface of the printed circuit board and adjacent to the card socket. The shielding member may have at least one opening formed in a region adjacent to the signal terminal on the first side surface.

[0007] A printed circuit board according to various embodiments of the present disclosure may include a card socket disposed on a surface of the printed circuit board and configured to receive a card. The printed circuit board may include at least one signal terminal formed in the card socket and configured to be electrically connectable with the card inserted into the card socket. The printed circuit board may include a shielding member disposed at a position adjacent to the card socket on one surface of the printed circuit board. The shielding member may include an upper surface formed to cover the at least one electrical component. The shielding member may include a shielding member having a first side extending from the upper surface toward the one surface of the printed circuit board and adjacent to the card socket. The shielding member may have at least one opening formed in a region adjacent to the signal terminal on the first side.

[0008] According to various embodiments of the present disclosure, an electronic device can be provided in which a portion of a shielding member adjacent to a signal terminal of a card socket is cut out, thereby reducing the area of ​​a printed circuit board by arranging the card socket and the shielding member adjacent to each other, and reducing the risk of a short circuit occurring with the signal terminal.

[0009] FIG. 1 is a block diagram of an exemplary electronic device capable of performing the operations described herein.

[0010] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0011] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present disclosure.

[0012] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0013] FIGS. 4A and 4B are plan views illustrating printed circuit boards of electronic devices according to various embodiments.

[0014] FIG. 5a is an enlarged view of a printed circuit board according to various embodiments.

[0015] FIG. 5b is an enlarged view of a printed circuit board according to various embodiments.

[0016] FIG. 5c is a cross-sectional perspective view of a printed circuit board according to various embodiments.

[0017] FIG. 5d is a perspective view of a shielding member according to various embodiments.

[0018] FIG. 6A is a plan view showing a printed circuit board according to various embodiments.

[0019] FIG. 6b is a side view illustrating a printed circuit board according to various embodiments.

[0020] FIG. 6c is a circuit diagram of a shift detection circuit according to various embodiments.

[0021] FIG. 1 is a block diagram of an exemplary electronic device (100) capable of performing the operations described in this document.

[0022] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable) type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are exemplary only and do not limit the implementations described or claimed in this document. The electronic device (100) may be referred to as a mobile device, a user device, a multi-function device, a portable device, or a server.

[0023] The electronic device (100) may include components including at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The above components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuitry, an antenna, a rechargeable battery, or an input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into one component.

[0024] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing. The processor (110) may include at least one electrical circuit and may individually or collectively perform distributed processing of instructions (or programs, data, etc.) stored in the memory (120). The processor (110) may include a processor assembly including one or more processing circuits. The processor (110) may include any processing circuit operative to control the performance and operations of one or more components (e.g., the memory (120), the display (140), the image sensor (150), the communication circuit (160), and / or the sensor (170)) of the electronic device (100). For example, the processor (110) (e.g., the application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor (110) may be implemented with multiple cores (or at least one core circuit), multiple chips, or multiple chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to individually and / or collectively perform various functions of the present disclosure. As a non-limiting example, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) that is different from the first chip of the electronic device (100).

[0025] For example, the processor (110) may include a central processing unit (CPU) (111), a graphics processing unit (GPU) (112), a neural processing unit (NPU) (113), an image signal processor (ISP) (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (CP) (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may further include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included within other components (e.g., at least a portion of memory (120), an interface (e.g., available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0026] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in the memory (120). The CPU (111) (or central processing circuit) may be configured to control components of the processor (110) based on the execution of instructions stored in the memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or artificial intelligence (AI) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). The ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through the image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). The display controller (115) (or display control circuit, or display processing unit (DPU)) may be configured to process an image acquired from the CPU (111), the GPU (112), the ISP (114), or the memory (120) (e.g., the volatile memory (121)) into a format suitable for the display (140). The memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). The storage controller (117) (or storage control circuit) may be configured to control reading data from the nonvolatile memory (122) and writing data to the nonvolatile memory (122).The CP (118) (communication processing circuit) may be configured to process data acquired from a component of the processor (110) into a format suitable for transmission to another electronic device via the communication circuit (160), or to process data acquired from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data about the state of the electronic device (100) and / or the state of the surroundings of the electronic device (100), acquired via the sensor (170), into a format suitable for the component of the processor (110).

[0027] The memory (120) may include one or more storage media (or one or more storage devices). For example, the memory (120) may include a memory assembly including one or more storage media. For example, the one or more storage media may include permanent memory (e.g., non-volatile memory (122)) such as a hard drive, flash memory, read-only memory (ROM), semi-permanent memory (e.g., volatile memory (121)) such as random access memory (RAM), any other suitable type of storage (or storage assembly), or any combination thereof. The memory (120) may include cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As a non-limiting example, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a subscriber identity module (SIM) card and / or a secure digital (SD) card) that may be repeatedly inserted into and removed from the electronic device (100).

[0028] For example, the memory (120) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plug-in (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, the memory (120) may store instructions callable by an application programming interface (API). For example, the memory (120) may store instructions within a library.

[0029] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0030] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0031] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0032] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (100)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (100)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0033] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0034] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0035] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0036] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (100) of FIG. 1 or may include various embodiments of the electronic device.

[0037] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (210C) may be formed by a side frame (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side frame (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0038] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side frame (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0039] According to one embodiment, the electronic device (200) may include at least one of a display (300), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0040] The display (300) may be visually exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (300) may be exposed through the front plate (202), which forms the first side (210A) and the first region (210D) of the side surface (210C). The display (300) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0041] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may include a tray member arranged through at least a portion of the side frame (218).

[0042] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (300) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0043] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0044] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (300). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (300).

[0045] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0046] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0047] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (300). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (300). In one embodiment, an area where the display (300) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (300) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (300) facing the sensor module may not require a perforated opening.

[0048] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0049] Referring to FIG. 3, the electronic device (200) may include a frame (301), a front plate (202) (e.g., a front cover), a display (300), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). At least one of the components of the electronic device (200) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or 2B, and any redundant description will be omitted below.

[0050] According to various embodiments, the frame (301) may include a side member (218) (e.g., the side frame (218) of FIGS. 2A and 2B) and an inner frame (2181a) (e.g., an extension member or a support member).

[0051] The inner frame (2181a) may be disposed inside the electronic device (200) and structurally connected to the side member (218) or formed integrally with the side member (218). The inner frame (2181a) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The inner frame (2181a) may have a display (300) connected to one surface and a substrate (240) connected to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. In some embodiments, the substrate (240) may include a card socket (2401) that accommodates various cards, such as a memory card (e.g., an SD card, an MMC card, a UFS card) and / or a subscriber identification module (SIM) card.

[0052] In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the inner frame (2181a), or the support bracket (260)) or may additionally include other components.

[0053] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card), or an audio connector.

[0054] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as the substrate (240), for example. The battery (250) may be integrally disposed within the electronic device (200). In one embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0055] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion of the side member (218) and / or the inner frame (2181a) or a combination thereof.

[0056] FIGS. 4A and 4B are plan views illustrating a printed circuit board (401) of an electronic device according to various embodiments.

[0057] FIG. 4b is a plan view showing a state in which the shielding member (420) and the socket housing (412) in FIG. 4a are removed.

[0058] Referring to FIGS. 4A and 4B , a printed circuit board (401) (e.g., the board (240) of FIG. 3 ) of an electronic device (e.g., the electronic device (100) of FIG. 1 , the electronic device (200) of FIGS. 2A to 3 ) may include a card socket (410) (e.g., the card socket (2401) of FIG. 3 ). The card socket (410) may be configured to accommodate various cards (e.g., IC cards such as a subscriber identification module (SIM) card and / or a memory (407) card) and electrically connect them with other electrical components of the electronic device. In various embodiments, the card socket (410) may be configured to directly accommodate a card, or to accommodate a card mounted on a member such as a tray. The printed circuit board (401) may include a socket area provided to accommodate the card socket (410), and the card socket (410) may be disposed on the socket area. The socket area may be formed with one or more conductive pads (e.g., signal pads (415) of FIG. 5b) configured to be bonded and electrically connected to the card socket (410) by means such as solder.

[0059] In various embodiments, the card socket (410) can accommodate one or more cards. For example, the card socket (410) can accommodate a memory (407) card and a SIM card, or can accommodate multiple SIM cards.

[0060] In various embodiments, the card socket (410) may include one or more signal terminals (413). The signal terminals (413) may be in electrical contact with the card to transmit and receive electrical signals to and / or transmit the status of the card to an electronic device in the form of electrical signals.

[0061] In various embodiments, the card socket (410) may include a socket body (411) and a socket housing (412) that at least partially surrounds the exterior of the socket body (411). In various embodiments, some of the signal terminals (413) may be positioned at the periphery of the socket body (411). Therefore, when designing the size of the socket housing (412) to secure space inside the electronic device, the signal terminals (413) may be partially exposed to the exterior of the socket housing (412).

[0062] The printed circuit board (401) may include a shielding member (420). The shielding member (420) may include a shielding member (420) (e.g., a shield can) that provides electromagnetic interference (EMI) shielding for various electrical components disposed on the printed circuit board (401), such as a processor (405) (e.g., AP (110) of FIG. 1) and / or memory (407) (e.g., memory (120) of FIG. 1). The shielding member (420) may include a conductive material (e.g., copper, stainless steel, aluminum, and / or a conductive film).

[0063] In various embodiments, the shielding member (420) may be positioned adjacent to the card socket (410), thereby reducing the area of ​​the printed circuit board (401) of the electronic device.

[0064] In various embodiments, the printed circuit board (401) may include a ground pad (421) for the shielding member (420). The ground pad (421) may be a conductor pad formed on the surface of the printed circuit board (401) (e.g., the surface facing the -z direction) such that the shielding member (420) is bonded thereto. The shielding member (420) may be bonded to the ground pad (421) by a bonding means such as solder and fixed on the printed circuit board (401). In addition, the shielding member (420) may be grounded through the ground pad (421) to provide EMI shielding. For example, the shielding member (420) may be bonded to the ground pad (421) by an SMT (surface mount technology) technique such as reflow soldering.

[0065] FIG. 5a is an enlarged view of a printed circuit board (401) according to various embodiments.

[0066] FIG. 5b is an enlarged view of a printed circuit board (401) according to various embodiments.

[0067] FIG. 5c is a cross-sectional perspective view of a printed circuit board (401) according to various embodiments.

[0068] FIG. 5d is a perspective view of a shielding member (420) according to various embodiments.

[0069] FIGS. 5a and 5b are enlarged views of the A portion of FIGS. 4a and 4b, respectively.

[0070] FIG. 5c is a cross-section taken along the B-B direction of FIG. 5a.

[0071] Referring to FIGS. 5A and 5B, the printed circuit board (401) may include a signal pad (415). The signal pad (415) may be a conductive pad formed on the printed circuit board (401) so that a signal terminal (413) is disposed thereon. The signal terminal (413) may be bonded to the signal pad (415) by a bonding means such as solder. In various embodiments, the signal pad (415) may be formed in an area of ​​the printed circuit board (401) where the signal terminal (413) is disposed. In various embodiments, the signal pad (415) may have an area larger than an area of ​​the signal terminal (413) on the printed circuit board (401). For example, the outer boundary of the signal pad (415) may be spaced apart from a bottom surface of the signal terminal (413) that is in contact with the signal pad (415) by a certain distance (e.g., D1 or D2 in the drawing).

[0072] The card socket (410) and the signal terminals (413) (e.g., the first signal terminal (413a) and the second signal terminal (413b)) arranged on the periphery of the signal card socket (410) may be arranged adjacent to the shielding member (420) on the periphery of the card socket (410).

[0073] In various embodiments, the signal pad (415) may be positioned offset relative to the signal terminal (413). The signal pad (415) may be positioned offset in the opposite direction of the shielding member (420) relative to the signal terminal (413). For example, the signal pad (415) may be formed to be larger by a first distance (D1) than the bottom surface of the signal terminal (413) in a direction from the signal terminal (413) toward the shielding member (420) (the -y direction in the drawing), and may be formed to be larger by a second distance (D2) than the bottom surface of the signal terminal (413) in an opposite direction from the signal terminal (413) toward the shielding member (420) (the y direction in the drawing). The first distance may be smaller than the second distance. That is, the signal pad (415) may have a dimension in the direction of the shielding member (420) that is smaller than the dimension in the direction opposite to the shielding member (420).

[0074] The card socket (410) can be placed on the printed circuit board (401) by surface mount technology (SMT), such as reflow soldering. During the reflow soldering process, the alignment of the card socket (410) with respect to the socket area on the printed circuit board (401) can be moved by the surface tension of the solder melted on the conductive pad, thereby being aligned with the socket area. For example, the position of the card socket (410) can be aligned so that the bottom surface of the signal terminal (413) of the card socket (410) of the solder is located inside the signal pad (415). By reducing the dimension of the signal pad (415) with respect to the shielding member (420), the risk of the signal terminal (413) moving toward the shielding member (420) during the reflow soldering process, thereby causing a short circuit, can be reduced.

[0075] Referring to FIGS. 5C and 5D , the shielding member (420) may include at least one opening (420a). The opening (420a) of the shielding member (420) may be a portion formed by cutting out a portion of a side surface (e.g., a side facing the y direction) of the shielding member (420). In various embodiments, the opening (420a) may be formed on a side surface of the shielding member (420) facing the signal terminal (413). In various embodiments, the opening (420a) may be formed by cutting out a portion of the side surface of the shielding member (420) that comes into contact with the printed circuit board (401).

[0076] In various embodiments, the size of the opening (420a) may be determined based on the sizes of the signal terminal (413) and the signal pad (415). For example, the length of the opening (420a) (e.g., the dimension in the x-axis direction) may be such that it does not come into contact with the signal pad (415). For example, the height of the opening (420a) (e.g., the dimension in the -z direction) may be such that it does not come into contact with the first signal terminal (413a) and / or the second signal terminal (413b). In various embodiments, the length of the opening (420a) may be 4 mm to 5 mm. The height of the opening (420a) may be 0.2 mm to 0.4 mm.

[0077] When the shielding member (420) and the card socket (410) are bonded (e.g., reflow soldering) on ​​the printed circuit board (401), there is a risk that the signal terminal (413) may come into contact with the shielding member (420) due to an error in the placement position and / or misalignment, thereby causing a short circuit. By forming an opening (420a) on the side of the shielding member (420) adjacent to the signal terminal (413), the risk of the signal terminal (413) coming into contact with the shielding member (420) can be reduced.

[0078] Referring again to FIG. 5b, a ground pad (421) is placed on the printed circuit board (401) so that the shielding member (420) is bonded and grounded, but the ground pad (421) may not be placed in a portion corresponding to the opening (420a) of the shielding member (420). Accordingly, the risk of the signal terminal (413) being short-circuited with the ground pad (421) can be reduced.

[0079] FIG. 6a is a plan view showing a printed circuit board (401) according to various embodiments.

[0080] FIG. 6b is a side view showing a printed circuit board (401) according to various embodiments.

[0081] FIG. 6c is a circuit diagram of a shift detection circuit (600) according to various embodiments.

[0082] Referring to FIGS. 6A and 6B, the printed circuit board (401) may include a socket housing pad (417). The socket housing pad (417) may be a conductive pad formed on a surface of the printed circuit board (401) such that the socket housing (412) is bonded and fixedly positioned on the printed circuit board (401). In some embodiments, the socket housing pad (417) may be electrically connected to a ground circuit of the electronic device to ground the socket housing (412).

[0083] In various embodiments, the socket housing pad (417) may be positioned to overlap the socket housing (412) in a direction in which the face of the printed circuit board (401) faces (e.g., in the -z direction). For example, the socket housing pad (417) may be positioned within the outer perimeter of the socket housing (412) when viewed in the direction in which the face of the printed circuit board (401) faces (in the -z direction).

[0084] As shown in FIG. 5b, when the card socket (410) is joined to the printed circuit board (401) by reflow soldering in a state where the signal pad (415) is arranged to be offset in the opposite direction (y direction) of the shielding member (420), the card socket (410) may be arranged to be offset in the direction in which the signal pad (415) is offset due to the surface tension of the molten solder. Accordingly, there is a risk that the card socket (410) may protrude outside the housing of the electronic device, or a defect may occur in which a card or tray inserted into the card socket (410) protrudes outside the electronic device. Therefore, as shown in FIGS. 6a and 6b, by positioning the socket housing pad (417) inside the outer boundary of the socket housing (412) so as to overlap with the socket housing (412), the degree to which the card socket (410) deviates from the designed position during reflow soldering can be reduced.

[0085] Referring again to FIGS. 6A to 6C, the printed circuit board (401) may include a guideline (601). The guideline (601) may be formed to be adjacent to the card socket (410). The guideline (601) may be positioned a predetermined distance (e.g., 0.1 mm) from the card socket (410) in each direction (e.g., x direction, -x direction, y direction, and / or -y direction) on the surface of the printed circuit board (401). For example, a first guideline (601a) may be positioned in the -y direction from the card socket (410) in the drawing, a second guideline (601b) may be positioned in the y direction from the card socket (410) in the drawing, a third guideline (601c) may be positioned in the -x direction from the card socket (410) in the drawing, and a fourth guideline (601d) may be positioned in the x direction from the card socket (410) in the drawing.

[0086] In various embodiments, the guideline (601) may be formed to be visually identifiable on the printed circuit board (401). For example, the guideline (601) may be formed by partially removing a coating layer (e.g., a solder mask layer) on the printed circuit board (401) to partially expose the conductor. The guideline (601) may be a reference line for verifying the alignment of the card socket (410) on the printed circuit board (401) by visual inspection or computer vision (e.g., automated optical inspection (AOI)).

[0087] In various embodiments, the guideline (601) may protrude from the printed circuit board. For example, the guideline (601) may be formed by stacking and protruding solder from the printed circuit board (401). As another example, the guideline (601) may include a member, such as a conductive foam gasket, attached to the printed circuit board (401).

[0088] In various embodiments, the guide (601) may be connected to a detection circuit. The detection circuit may be configured to change an electrical state when the card socket (410) and the guide (601) are in electrical contact. For example, the detection circuit may include a voltage source (602) that forms a predetermined potential difference, and the voltage source (602) may be electrically connected to the guide (601) and a processor (605) of the electronic device (e.g., AP (110) of FIG. 1, processor (405) of FIG. 4B). For example, the detection circuit may be electrically connected to a GPIO port of the processor (405). The detection circuit may also include other electrical components (e.g., resistors (603), inductors, capacitors) for overcurrent limiting and / or impedance matching.

[0089] When the card socket (410) is displaced from its original position, the socket housing (412) connected to the grounding electrode (604) comes into contact with at least one of the guidelines (601), and thus a conductive path can be formed from the voltage source (602) to the socket housing (412) through the guidelines (601). Accordingly, the electrical state of the processor (405) connected to the guidelines (601) of the detection circuit changes, and thereby an alignment defect of the card socket (410) can be detected.

[0090] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. In an electronic device including a card socket (410) into which a card is inserted, A printed circuit board (401) configured to have the card socket (410) and at least one electrical component arranged thereon; At least one signal terminal (413) formed in the card socket (410) and configured to be electrically connected to the card inserted into the card socket (410); and As a shielding member (420) placed adjacent to the card socket on one side of the printed circuit board (401), an upper surface formed to cover at least one electrical component; and A shielding member (420) extending from the upper surface in the direction of the one side of the printed circuit board (401) and having a first side adjacent to the card socket (410), The above shielding member (420) is an electronic device in which an opening (420a) is formed in an area adjacent to the signal terminal (413) of the first side.

2. In paragraph 1, Further comprising a ground pad (421) arranged to be in electrical contact with the shielding member (420) on the printed circuit board (401); An electronic device in which the ground pad (421) is not disposed in an area of ​​the printed circuit board (401) facing the opening (420a) of the first side.

3. In paragraph 1, The printed circuit board (401) further includes a signal pad (415) configured to be connected to at least one signal terminal (413), The signal pad (415) is an electronic device in which the distance (D1) between the end of the signal pad (415) facing the shielding member (420) and the signal terminal (413) is shorter than the distance (D2) between the end of the shielding member (420) facing the opposite direction and the signal terminal (413).

4. In paragraph 1, a socket housing (412) at least partially defining the periphery of the card socket (410) of the printed circuit board (401); and An electronic device further comprising a socket housing pad (417) disposed on the printed circuit board (401) and in contact with the socket housing (412).

5. In paragraph 4, An electronic device in which the socket housing pad (417) is positioned to overlap the socket housing (412) when viewed in the first direction on the printed circuit board (401).

6. In paragraph 1, An electronic device in which the printed circuit board (401) includes a guideline (601) positioned a predetermined distance from the outer edge of the card socket (410).

7. In paragraph 6, The above guideline (601) is an electronic device formed to be visually identifiable.

8. In paragraph 6, The printed circuit board (401) includes a conductor layer disposed on the one surface of the printed circuit board (401) and a coating layer applied on the conductor layer, The above guideline (601) is an electronic device formed by exposing the conductor layer on the one side of the printed circuit board (401).

9. In paragraph 6, The above guideline (601) is an electronic device having a conductive property and protruding from one side of the printed circuit board (401).

10. In paragraph 9, An electronic device in which the conductive protrusion is electrically connected to a shift detection circuit (600) configured to change an electrical state when the conductive protrusion is electrically connected to a ground electrode (604) of the electronic device.

11. In a printed circuit board (401) of an electronic device, A card socket (410) arranged on the surface of the printed circuit board (401) and configured to allow a card to be inserted; At least one signal terminal (413) formed in the card socket (410) and configured to be electrically connected to the card inserted into the card socket (410); and As a shielding member (420) positioned adjacent to the card socket on one side of the printed circuit board (401), an upper surface formed to cover at least one electrical component; and A shielding member (420) extending from the upper surface toward the one side of the printed circuit board (401) and having a first side adjacent to the card socket (410), The above shielding member (420) is a printed circuit board having an opening (420a) formed in an area adjacent to the signal terminal (413) on the first side.

12. In paragraph 11, Further comprising a ground pad (421) arranged to be in electrical contact with the shielding member (420) on the printed circuit board (401); A printed circuit board in which the ground pad (421) is not placed in an area of ​​the printed circuit board (401) facing the opening (420a) of the first side.

13. In paragraph 11, The printed circuit board (401) further includes a signal pad (415) configured to have at least one signal terminal (413) arranged thereon, The signal pad (415) is a printed circuit board in which the distance (D1) between the end of the signal pad (415) facing the shielding member (420) and the signal terminal (413) is shorter than the distance (D2) between the end of the shielding member (420) facing the opposite direction and the signal terminal (413).

14. In paragraph 11, a socket housing (412) at least partially defining the periphery of the card socket (410) of the printed circuit board (401); and A printed circuit board further comprising a socket housing pad (417) disposed on the printed circuit board (401) and in contact with the socket housing (412).

15. In paragraph 14, A printed circuit board in which the socket housing pad (417) is positioned to overlap the socket housing (412) when viewed in the first direction on the printed circuit board (401).

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