Processing system, processing method, and information processing method

Abstract

The present invention provides a processing system comprising: a processing device that performs lamination molding of a molded object by supplying a material along a processing path defined by a processing control program while irradiating said material with an energy beam; and a material supply device for conveying the material to the processing device, wherein the material supply device holds a plurality of types of materials as materials and uses conveyance control information representing at least one of the plurality of types of materials and a conveyance amount of the material as a basis to convey an amount of at least one type of material corresponding to the conveyance amount to the processing device. The processing system further comprises an information processing device whereby a command for controlling the processing device corresponding to a change in at least one of the type of material and the conveyance amount is added to the processing control program on the basis of the conveyance control information.

Description

Processing system, processing method, and information processing method

[0001] The present invention relates to the technical fields of a processing system, a processing method, and an information processing method for supplying material and laminating a shaped object.

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical challenges of such a processing system is to appropriately supply material.

[0003] US Patent Application Publication No. 2015 / 0191316

[0004] According to a first aspect, there is provided a processing system comprising: a processing device that supplies material along a processing path defined in a processing control program while irradiating an energy beam to additively manufacture a shaped object; and a material supply device that transports the material to the processing device, wherein the material supply device holds multiple types of material and, based on transport control information representing at least one of the multiple types of material and the transport amount of the material, transports at least one type of material at the transport amount to the processing device, and further comprises an information processing device that adds a command to the processing control program for controlling the processing device in response to changes in at least one of the type of material and the transport amount based on the transport control information.

[0005] According to a second aspect, a processing system is provided that includes a material supply device capable of transporting multiple types of materials at a predetermined ratio based on transport control information, and a processing device that performs additive manufacturing of a model by irradiating an energy beam on the multiple types of materials transported from the material supply device based on modeling control information, wherein the processing device has a notification sending device that notifies the material supply device upon completion of some of the additive manufacturing processes performed based on the modeling control information, and the material supply device controls to change the ratio of the multiple types of materials on the condition that it receives the notification.

[0006] According to a third aspect, there is provided a processing method including adding a command to a processing control program for controlling a processing device to additively manufacture a model by supplying at least one type of material out of a plurality of types of material along a processing path while irradiating an energy beam, for controlling the processing device in response to changes in the transport amount based on transport control information representing the transport amount of at least one type of material; transporting at least one type of material to the processing device based on the transport control information; and additively manufacturing the model by the processing device in accordance with the processing control program.

[0007] According to a fourth aspect, a processing method is provided for a processing system including a material supply device capable of transporting multiple types of material at a predetermined ratio based on transport control information, and a processing device that irradiates an energy beam and performs additive manufacturing using the multiple types of material transported from the material supply device based on modeling control information, the processing method including notifying the material supply device upon completion of a portion of the additive manufacturing performed based on the modeling control information, changing the ratio of the multiple types of material on the condition that the notification is received from the material supply device, and the processing device performing additive manufacturing using the multiple types of material at the changed ratio.

[0008] According to a fifth aspect, there is provided an information processing method including: acquiring a processing control program for controlling a processing device to additively manufacture a model by irradiating an energy beam while supplying a first material or a second material different from the first material along a processing path; adding a command to the processing control program for controlling the processing device in response to switching between the first material and the second material; and transmitting the processing control program with the added command to the processing device.

[0009] According to a sixth aspect, there is provided an information processing method for generating control information capable of controlling a processing device to perform additive manufacturing by irradiating an energy beam while supplying material, the information processing method including generating the control information to include a step of switching the material to be supplied between a first step of supplying a first material transported from a first material supply source to perform additive manufacturing, and a second step of supplying a second material transported from a second material supply source different from the first material supply source and different from the first material to perform additive manufacturing.

[0010] According to a seventh aspect, there is provided an information processing method including: acquiring a processing control program for controlling a processing device to additively manufacture a model by supplying at least one type of material from among a plurality of types of transported material along a processing path while irradiating it with an energy beam; and adding, to the processing control program, a command for controlling the processing device in response to changes in the transport amount, based on transport control information that specifies the transport amount of at least one type of material in accordance with the progress of the additive manufacturing.

[0011] According to an eighth aspect, there is provided an information processing method including: acquiring a processing control program for controlling a processing device to additively manufacture a model by irradiating an energy beam while supplying at least one type of material from a plurality of types of material transported from a material supply device; and adding, to the processing control program, a command for controlling the processing device to notify the material supply device when part of the additive manufacturing is completed, based on transport control information that specifies the amount of transport of at least one type of material according to the progress of the additive manufacturing.

[0012] FIG. 1 is a block diagram showing the configuration of a processing system of this embodiment. FIG. 2 is a cross-sectional view showing an overview of additive manufacturing performed by the processing apparatus of this embodiment. FIG. 3 is a schematic diagram showing the structure of a feeder included in a material supply source. FIG. 4 is an example of a material image. FIG. 5A is a graph showing the relationship between the area of ​​a material region and the conveyance amount. FIG. 5B is a graph showing the relationship between the area of ​​a material region after correction based on the density ratio and the conveyance amount. FIG. 6 is a sequence diagram showing information processing for additive manufacturing of this embodiment. FIG. 7 is an example of an input screen for conveyance control information. FIG. 8 is a schematic diagram explaining retraction of a processing head. FIG. 9 is a sequence diagram showing steps of additive manufacturing. FIG. 10A is a first cross-sectional view showing the process of additive manufacturing. FIG. 10B is a second cross-sectional view showing the process of additive manufacturing. FIG. 10C is a third cross-sectional view showing the process of additive manufacturing. FIG. 11A is a first cross-sectional view showing the process of forming a structural layer by a first modeling operation. FIG. 11B is a second cross-sectional view showing the process of forming a structural layer by the first modeling operation. 12A and 12B are first and second cross-sectional views illustrating a process of forming a structure layer by the second modeling operation;

[0013] Hereinafter, a processing system SYS that performs additive manufacturing (additive manufacturing) based on laser metal deposition (LMD) will be described with reference to the drawings. Additive manufacturing based on laser metal deposition is an additive manufacturing process that melts a manufacturing material M (material) supplied to a workpiece W with processing light EL (an energy beam in the form of light) to form a three-dimensional structure ST (model) that is integrated with the workpiece W or that can be separated from the workpiece W. Additive manufacturing based on laser metal deposition can also be considered additive manufacturing. The workpiece W can also be considered an object manufactured by additive manufacturing in the processing system SYS, or a target object for additive manufacturing.

[0014] In other words, the processing system SYS can be said to be a 3D printer that processes an object using additive processing technology. The additive processing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. The laser build-up welding method (LMD) may also be called DED (Directed Energy Deposition).

[0015] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (a direction perpendicular to the horizontal plane, essentially the up-down direction). The rotation directions (tilt directions) around the X-axis, Y-axis, and Z-axis are assumed to be the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be assumed to be the vertical direction. The XY plane may also be assumed to be horizontal.

[0016] (1) Configuration of the machining system SYS (1-1) Overall configuration of the machining system SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a block diagram showing the configuration of the machining system SYS of this embodiment. Figure 2 is a cross-sectional view showing an overview of additive manufacturing performed by the machining apparatus of this embodiment.

[0017] The processing system SYS includes a processing device 2 that performs additive manufacturing of a workpiece W (a molded object), a material supply device 7 that transports materials to be supplied to the processing device 2 for additive manufacturing, and an information processing device 8 that generates manufacturing control information including commands for controlling the processing device 2.

[0018] (1-2) Configuration of the processing device 2 The processing device 2 includes a stage unit 22 on which the workpiece W (molded object) is placed, a processing unit 21 that performs layering processing on the workpiece W, and a processing control unit 23 (control device) that controls the stage unit 22 and the processing unit 21.

[0019] (1-2-1) Configuration of the Stage Unit 22 The stage unit 22 includes a stage 31 and a stage drive mechanism 32. The stage 31 is disposed in the forming space FS inside the chamber CB of the processing device 2, and the workpiece W is placed thereon. For this reason, the stage 31 may be referred to as a mounting device. Specifically, the workpiece W is placed on a stage mounting surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed thereon. The stage 31 may also be capable of holding the workpiece W placed thereon. In this case, the stage 31 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like, to hold the workpiece W. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The holding tool may also be called a jig, a holder, a holding member, a mounting member, or a clamp.

[0020] In the processing system SYS according to this embodiment, the processing device 2 performs additive manufacturing on the workpiece W to form a three-dimensional structure ST as a molded object integrated with the workpiece W. The workpiece W is an object, i.e., a three-dimensional structure, and may be another three-dimensional structure molded by the processing device 2, i.e., an existing molded object. Furthermore, the three-dimensional structure ST molded integrally with the workpiece W may be separable from the workpiece W after molding. Additionally, in the processing system SYS according to this embodiment, the processing device 2 performs additive manufacturing on the workpiece W (three-dimensional structure ST) placed on the stage 31, but this is not limiting, and the stage 31 may be regarded as the workpiece W, and additive manufacturing may be performed on the stage 31.

[0021] The workpiece W may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, similar to the shaping material M described below, and may be the same as or different from the shaping material M. For example, a metallic material or a resinous material can be used as the material of the workpiece W, but other materials may also be used. Examples of metallic materials include materials containing copper, materials containing tungsten, and materials containing stainless steel.

[0022] The stage driving mechanism 32 is a driving mechanism including a driving source such as a motor that can move the stage 31. When the stage driving mechanism 32 moves the stage 31, the relative positional relationship between the processing head 24 (a condensing optical system 50 provided in the processing head 24), which will be described later, and the stage 31 (a workpiece W placed on the stage 31) changes. Therefore, the stage driving mechanism 32 functions as a position changing device (driving device) that can change the relative positional relationship between the stage 31 and the condensing optical system 50, respectively, and the stage 31 and the workpiece W. The stage driving mechanism 32 is configured to be able to move the stage 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction, for example.

[0023] (1-2-2) Configuration of the processing unit 21 The processing unit 21 includes an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 5 that supplies molding material for additional processing on the workpiece W, and a head drive mechanism 6.

[0024] (1-2-2-1) Configuration of the material supply unit 5 The material supply unit 5 can supply a powder modeling material M. The material supply unit 5, which supplies the powder modeling material M, can also be called a powder supply device. The modeling material M is not limited to a powder, but may be a wire-like modeling material or a gaseous modeling material. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, a metallic material or a resinous material can be used as such a modeling material M, but other materials may also be used. Examples of metallic materials include a material containing copper, a material containing tungsten, and a material containing stainless steel.

[0025] The material supply unit 5 includes a tube through which at least one of the modeling material M and a gas capable of transporting the modeling material M can pass during movement. The material nozzle 64, to which the modeling material M that has traveled inside the tube reaches, has an opening, and the modeling material M is supplied toward the workpiece W from this opening.

[0026] The material supply unit 5 can supply gas. The material supply unit 5 that supplies gas can also be referred to as a gas supply device. The material supply unit 5 may mix the powdered modeling material M with the gas. That is, the material supply unit 5 can transport the powdered modeling material M together with a transport gas (pressurized gas). As the transport gas, for example, a purge gas consisting of an inert gas such as nitrogen or argon, which is injected to replace the gas in the chamber CB, can be used. As a supply source of the transport gas, the material supply unit 5 can use a cylinder containing an inert gas, or, if the inert gas is nitrogen gas, a nitrogen gas generator that generates nitrogen gas using air as a raw material.

[0027] The material nozzle 64 is disposed in the modeling space FS inside the chamber CB of the processing system SYS, and is capable of supplying the modeling material M. More specifically, the material nozzle 64 injects (sprays, ejects, or sprays) the modeling material M transported by the pressurized gas onto the workpiece W. In other words, the material nozzle 64 supplies the modeling material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or a supply device (material supply device).

[0028] The material nozzle 64 is provided in the processing head 24. A material supply port 641 is formed in the material nozzle 64. The material supply port 641 may also be referred to as an opening.

[0029] (1-2-2-2) Configuration of Irradiation Unit 4 The irradiation unit 4 includes a light source unit 40 and an irradiation device 42. The light source unit 40 includes two light sources 41 (first light source, second light source) that are energy beam sources. The light source 41 is an energy beam source that emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (multiple pulse beams). The processing light EL may be laser light. In this case, the light source 41 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include a fiber laser, a CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 41 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0030] In the light source unit 40, the characteristics of the processing light EL#1 emitted by the first light source of the light sources 41 and the characteristics of the processing light EL#2 emitted by the second light source may be the same or different. The characteristics include, for example, wavelength (typically, a peak wavelength that is a wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1), wavelength band (typically, a range of wavelengths at which the intensity is equal to or greater than a certain value), intensity, and absorptance (with respect to the peak wavelength) in the workpiece W (or an object whose surface is the printing surface MS).

[0031] In the present embodiment, the processing device 2 (light source unit) has been described as having two light sources 41, but the present invention is not limited to this, and the processing device 2 may have two or more light sources or a single light source. For example, when using a single light source that emits (supplies) light of a wide wavelength band or multiple wavelengths, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 of different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

[0032] The irradiation device 42 is a device for emitting the processing light EL and is provided in the machining head 24. The irradiation device 42 includes an irradiation optical system (not shown) and a focusing optical system (not shown). The irradiation optical system is an optical system that transmits the processing light EL#1 incident from the first light source and the processing light EL#2 incident from the second light source to the focusing optical system. Specifically, the irradiation optical system is optically connected to the light source 41 that emits (generates) the processing light EL via an optical transmission member such as an optical fiber or a light pipe. The irradiation optical system has a polarizing member (e.g., a galvanometer mirror) that deflects the processing light EL, thereby changing the emission direction of the processing light EL. Such an irradiation optical system can also be said to be capable of scanning the workpiece W. The irradiation optical system may also have a power meter that can detect the intensity of the incident processing light EL. The focusing optical system is an optical system that focuses the light incident from the irradiation optical system and irradiates the workpiece W (printing surface MS).

[0033] The processing device 2, and thus the irradiation unit 4, has two light sources 41, which are optically connected via optical transmission members so that light emitted from the light sources 41 enters the irradiation device 42, and thus the irradiation optical system. In the following description, when there is no need to distinguish between the "processing light EL#1" generated by the first light source and the "processing light EL#2" generated by the second light source, they will be referred to as "processing light EL."

[0034] (1-2-2-3) Configuration of the Head Drive Mechanism 6 The head drive mechanism 6 is a drive mechanism including a drive source such as a motor that moves the machining head 24 under the control of the machining control unit 23 (described later). The machining head 24 is configured so that the irradiation device 42 and the material nozzle 64 are positioned integrally or at least within a predetermined distance. Therefore, the machining device 2 can supply the modeling material M via the material nozzle 64 to the irradiation position of the machining light EL by the irradiation device 42. When the head drive mechanism 6 moves the machining head 24, the relative positional relationship between the machining head 24 (the irradiation device 42 provided in the machining head 24) and the stage 31 (the workpiece W placed on the stage 31) changes, similar to when the stage drive mechanism 32 moves the stage 31. Therefore, the head drive mechanism 6 functions as a position changer (driver) that can change the relative positional relationship between the irradiation device 42 and the stage 31 and the workpiece W, respectively. The head driving mechanism 6 is configured to be able to move the processing head 24 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction, for example.

[0035] (1-2-3) Configuration of the processing control unit 23 The processing control unit 23 is a computer including an arithmetic unit (not shown) and a storage device (not shown). An output device (not shown), an input device (not shown), and a display device (not shown) are connected to the processing control unit 23. The arithmetic unit, the storage device, the output device, the input device, and the display device may be connected to one another.

[0036] The storage device includes at least one memory (not shown) capable of storing data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device may store a computer program and may temporarily store data used by a computing device (described later) when the computing device is executing the computer program. The storage device may store data to be stored long-term by the processing control unit 23. The storage device may include at least one of a random access memory (RAM), a read-only memory (ROM), a hard disk device, a magneto-optical disk device, a solid-state drive (SSD), and a disk array device. In other words, the storage device may include a non-transitory recording medium.

[0037] A computing device is hardware that includes at least one circuit (e.g., logic circuit, electronic circuit, or electrical circuit). For this reason, a computing device may also be referred to as processing circuitry.

[0038] The computing device includes at least one processor (one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Integrated Circuit). The processor may be realized by a group of circuits (for example, at least one of an electronic circuit and an electric circuit).

[0039] The arithmetic device loads a computer program including at least one of computer program code and computer program instructions. Having loaded the computer program, the arithmetic device is capable of executing predetermined operations defined in the computer program. The computer program may be expressed in binary code or text code. An example of a computer program expressed in text code is G-code, which expresses the operation of a machine tool in text in a predetermined format. The arithmetic device of the machining control unit 23 may load the G-code as a computer program that causes the machining device 2 to execute predetermined machining operations. The computer program that causes the machining device 2 to execute predetermined additive manufacturing can also be referred to as manufacturing control information. The computer program may be generated by the machining control unit 23, or may be generated by a device other than the machining device 2 included in the machining system SYS (e.g., the information processing device 8), or may be generated by a device external to the machining system SYS. The manufacturing control information may be a manufacturing control program that specifies a machining path along which additive manufacturing will be performed.

[0040] For example, the arithmetic device may read a computer program stored in a non-transitory computer-readable recording medium using a recording medium reader included in the machining control unit 23. The computer program read from the recording medium may be stored in a storage device. The recording medium for recording the computer program may include a device capable of recording a computer program (e.g., a general-purpose or dedicated device on which the computer program is implemented in an executable state in at least one of software and firmware). For example, the recording medium may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark) optical disk, magnetic medium such as magnetic tape, magneto-optical disk, semiconductor memory such as USB memory, and any other medium capable of storing a program.

[0041] Alternatively, the arithmetic device may acquire (download or read) the computer program via a communication device from a device (e.g., the material supply device 7 or the information processing device 8) located outside the processing control unit 23. The acquired computer program may be stored in a storage device.

[0042] The arithmetic device executes the loaded computer program. As a result, logical functional blocks for executing the processing to be performed by the machining control unit 23 (e.g., processing for controlling the operation of the machining device 2) are realized within the arithmetic device. Each process or function included in the computer program may be realized by a logical processing block realized within the arithmetic device when the arithmetic device (processor) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the arithmetic device, or may function as a controller or computer for realizing the logical functional blocks for executing the processing to be performed by the machining control unit 23. In other words, at least one processor included in the arithmetic device, together with a memory (recording medium) included in a storage device or the like, and the computer program are configured so that the machining control unit 23 performs the processing to be performed by the machining control unit 23.

[0043] The arithmetic device may generate control signals for controlling the operation of the machining device 2 as a result of executing a computer program using logical functional blocks realized within the arithmetic device. The arithmetic device may output the generated control signals to at least one of the machining unit 21 (particularly the light source 41 and the irradiation device 42), the material supply unit 5, and the stage unit 22 via an output device described below. At least one of the machining unit 21 and the stage unit 22 may operate based on the control signals output (generated) by the arithmetic device. In other words, the machining device 2 machines the workpiece W based on the control signals output (generated) by the arithmetic device.

[0044] A computational model that can be constructed by machine learning when the computational device executes a computer program may be implemented within the computational device. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters of the neural network (e.g., at least one of weights and biases). The computational device may control the operation of the machining device 2 using the computational model. That is, the operation of controlling the operation of the machining device 2 may include the operation of controlling the operation of the machining device 2 using the computational model. Note that the computational device may be implemented with a computational model that has been constructed by offline machine learning using training data. Furthermore, the computational model implemented in the computational device may be updated by online machine learning on the computational device. Alternatively, the computational device may control the operation of the machining device 2 using a computational model implemented in an external device (a device provided outside the machining control unit 23) in addition to or instead of the computational model implemented in the computational device.

[0045] An output device, an input device, and a display device are connected to the processing control unit 23. Note that the processing control unit 23 may be configured such that the arithmetic unit, the storage device, the output device, the input device, and the display device are connected to one another.

[0046] The output device is a device that outputs arbitrary information to the outside of the processing control unit 23. For example, the output device may output a signal (e.g., the above-mentioned control signal) indicating arbitrary information between the processing control unit 23 and a device external to the processing control unit 23 (e.g., at least one of the processing unit 21 (particularly the light source 41 and the irradiation device 42), the material supply unit 5, and the stage unit 22). For example, the output device may output a signal as arbitrary information via a communication network connecting the processing control unit 23 and a device external to the processing control unit 23 (e.g., at least one of the processing unit 21 (particularly the light source 41 and the irradiation device 42), the material supply unit 5, and the stage unit 22). In this case, the output device includes a communication device.

[0047] The output device may output any information to the outside of the processing control unit 23 using a medium other than a signal. For example, the output device may output information as sound. In this case, the output device may include an audio device (a so-called speaker) capable of outputting sound. For example, the output device may output information on paper. In this case, the output device may include a printing device (a so-called printer) capable of printing desired information on paper.

[0048] The processing control unit 23 may output a notification to another device (e.g., the material supply device 7) via an output device upon completion of a portion of the additive manufacturing processes performed based on the manufacturing control information. The notification upon completion of a portion of the additive manufacturing processes may be sent simultaneously with the completion of the portion of the additive manufacturing processes, or within a predetermined time range before or after the completion of the portion of the additive manufacturing processes. The completion of the portion of the additive manufacturing processes may be at a timing corresponding to a predetermined point on the processing path defined in the processing control program. An output device that outputs such a notification may also be referred to as a notification output device.

[0049] The input device is a device that accepts information input to the processing control unit 23 from outside the processing control unit 23. For example, the input device may include an operation device (e.g., at least one of a keyboard, a mouse, and a touch panel) that can be operated by a user of the processing control unit 23. In this case, the input device functions as a device that allows the user to input information. For example, the input device may include a recording medium reading device that can read information recorded as data on a recording medium that can be externally attached to the processing control unit 23.

[0050] Information input to the input device may be input to the arithmetic device. That is, the arithmetic device may acquire the information input to the input device. The arithmetic device may control the operation of the processing device 2 based on the information input to the input device. For example, the arithmetic device may generate a control signal for controlling the operation of the processing device 2 based on the information input to the input device.

[0051] As described above, when the output device includes a communication device, the communication device included in the output device may acquire (receive) information via the data bus or communication network in addition to or instead of outputting (transmitting) information via the data bus or communication network. In this case, the communication device included in the output device may be capable of functioning as an input device to which information is input via the data bus or communication network.

[0052] The display device is a display capable of displaying an image. The display device may display the image under the control of the arithmetic device. In this case, the arithmetic device may generate display control information for controlling the display device to display a desired image. The arithmetic device may output the generated display control information to the display device. The display device may receive input of the display control information generated by the arithmetic device. The display device may display the desired image based on the display control information generated by the arithmetic device. In this way, the arithmetic device may control the display device to display the desired image by outputting the generated display control information to the display device.

[0053] The processing control unit 23 having the above configuration may control (change) the intensity of the processing light EL based on the detection result of the power meter (detection result of the intensity of the processing light EL) input to the processing control unit 23. More specifically, the processing control unit 23 may control the intensity of the processing light EL so that the intensity of the processing light EL becomes a desired intensity. To control the intensity of the processing light EL, for example, the processing control unit 23 may control the light source 41 to change the intensity of the processing light EL emitted from the light source 41 based on the detection result of the power meter. This allows the processing device 2 to appropriately form a model on the printing surface MS by irradiating the printing surface MS with processing light EL having an appropriate intensity.

[0054] Alternatively, the processing control unit 23 may use the galvanometer mirror to control the head drive mechanism 6 that moves the processing head 24 and the stage drive mechanism 32 that moves the stage 31 so that the processing unit area PUA moves on the build surface MS during the period in which the irradiation area EA is moved within the processing unit area PUA. Specifically, for example, the processing control unit 23 may control at least one of the head drive mechanism 6 and the stage drive mechanism 32 so that the processing unit area PUA moves along a movement trajectory that intersects (or, in some cases, is perpendicular to) the movement direction (scanning direction) of the irradiation area EA within the processing unit area PUA. Conversely, the processing control unit 23 may control the galvanometer mirror to periodically move the irradiation area EA in the processing unit area PUA on the build surface MS along a scanning direction that intersects (or, in some cases, is perpendicular to) the movement trajectory of the movement of at least one of the head drive mechanism 6 and the stage drive mechanism 32.

[0055] In addition to the above, the processing control unit 23 may control the processing device 2, for example, the processing unit 21 (at least one of the processing head 24 and the head drive mechanism 6), the stage unit 22 (the stage drive mechanism 32), the light source 41, and the material supply unit 5. More specifically, the processing control unit 23 may control the emission mode of the processing light EL by the irradiation device 42. Examples of the emission mode include the on / off state of the processing light EL, the intensity of the processing light EL, and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed beams, the emission mode may include, for example, the pulsed beam emission duration, the pulsed beam emission cycle, and the ratio between the pulsed beam emission duration and the pulsed beam emission cycle (the so-called duty ratio). Additionally, the processing control unit 23 may control the optical system to change the beam irradiation position, the beam focal position, or otherwise manipulate the beam. Furthermore, the processing control unit 23 may control the movement mode of the processing head 24 by the head drive mechanism 6 and the movement mode of the stage 31 by the stage drive mechanism 32. The movement mode is, for example, the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the processing control unit 23 may control the supply mode of the modeling material M by the material nozzle 64. The supply mode is, for example, the supply amount (supply amount per unit time) and the supply timing (supply time).

[0056] The details of the molding operation performed by the processing device 2 will be described later.

[0057] (1-3) Configuration of the Material Supply Device 7 The material supply device 7 supplies the modeling material M to the processing device 2. That is, the modeling material M moves from the material supply device 7 to the processing device 2. The movement of the modeling material M from the material supply device 7 to the processing device 2 can also be referred to as transporting the modeling material M. The material supply device 7 includes multiple material supply sources 70 (a first material supply source 70-1 and a second material supply source 70-2). The material supply device 7 may have three or more material supply sources. Hereinafter, when it is not necessary to distinguish between the multiple material supply sources 70, they may be simply referred to as the "material supply source 70." The modeling material M moves from the material supply source 70 to the processing device 2 via a transport pipe 74.

[0058] At least one material supply source (e.g., first material supply source 70-1) of the multiple material supply sources 70 is communicatively connected to the processing device 2 and the information processing device 8. Furthermore, a material supply source (e.g., second material supply source 70-2) other than the at least one material supply source of the multiple material supply sources 70 is communicatively connected to the at least one material supply source (e.g., first material supply source 70-1). A material supply source (e.g., second material supply source 70-2) other than the at least one material supply source of the multiple material supply sources 70 may be communicatively connected to the processing device 2 and the information processing device 8. Here, "communicatively connected" refers to being connected via a wired or wireless communication network. Furthermore, "communicatively connected" may also refer to being able to have a recording medium on which data output by one device is recorded be readable by the other device.

[0059] (1-3-1) Configuration of material supply source 70 The material supply source 70 includes a transport control unit 71 (first transport control unit 71-1 in the first material supply source 70-1), a hopper 72 (first hopper 72-1 in the first material supply source 70-1), and a concentrator 73.

[0060] (1-3-1-1) Configuration of the hopper 72 The hopper 72 is a container capable of holding the modeling material M. The hopper 72 is equipped with a feeder 721 (first feeder 721-1 in the first hopper 72-1) capable of stably discharging the held modeling material M. The modeling material M moves from the feeder 721 to the concentrator 73 via a conveying pipe 74 (first conveying pipe 74-1 in the first material supply source 70-1).

[0061] 3 is a schematic diagram showing the structure of a feeder 721 included in the material supply source 70. The feeder 721 includes a screw 722 and a housing portion 723 that houses the screw 722.

[0062] The screw 722 is a rotating body that can rotate around a rotation axis. The accommodation portion 723 preferably has a cylindrical shape with an axis parallel to the rotation axis of the screw 722 as its center.

[0063] The modeling material M supplied from the hopper 72 to the feeder 721 is stored in a storage space SS between the screw 722 and the storage portion 723. The storage space SS is capable of storing the modeling material M. It can also be said that the storage space SS stores or holds the modeling material M.

[0064] The feeder 721 rotates the screw 722 at a predetermined speed to transport the modeling material M stored in the storage space SS from one side to the other in the axial direction of the screw 722. The modeling material M transported in the other axial direction by the rotation of the screw 722 is transported toward the processing device 2 by the compressed gas that flows in a direction intersecting the axial direction in the other axial direction. In this way, the modeling material M is transported stably from the material supply device 7 to the processing device 2, specifically, with the fluctuation rate of the transport amount (the amount of modeling material M transported per unit time) kept within ±10%, for example.

[0065] The feeder 721 can change the flow rate of the modeling material M by changing the rotation speed of the screw 722. The feeder 721 can also be called a flow rate changing unit that changes the flow rate of the modeling material M.

[0066] The feeder 721 may further include a camera 724 (imaging device) that captures an image of the modeling material M transported in the other axial direction by the rotation of the screw 722. The camera 724 may generate a material image representing the modeling material M transported in the other axial direction by the rotation of the screw 722 and further transported by the pressurized gas. The transport control unit 71, which will be described later, may estimate the transport amount of the modeling material to be transported based on the material image, and adjust the rotation speed of the screw 722 so as to reduce the difference between the estimated transport amount and the transport amount indicated in the transport control information (transport amount feedback, or POWFB).

[0067] FIG. 4 is an example of an ingredient image.

[0068] In the material image MI, the modeling material M, which is a powder and is transported by the compressed gas, is depicted as being darker near the central axis of the compressed gas flow, and is depicted as being lighter as it moves away from the central axis and from the feeder 721. In the material image MI of FIG. 4, the feeder 721 is located at the top of the drawing.

[0069] The material region MA in the material image MI, which corresponds to the modeling material M, is identified as a region in which the modeling material M is expressed at a predetermined density. The area of ​​the material region MA corresponds to the transport amount (flow rate) of the transported modeling material M. Therefore, the flow rate of the modeling material M can be estimated based on the area of ​​the material region MA in the material image MI.

[0070] For example, for each type of modeling material M, the area of ​​the material area MA for each flow rate is measured in advance and used as a reference area, and the flow rate of the modeling material M is estimated by comparing the area of ​​the material area MA in the material image MI with the reference area.

[0071] The reference area may be determined using a standard area determined for at least one type of standard material among the multiple types of building materials M. For example, the reference area may be determined based on the standard area and the ratio of the density of the standard material to the density of a type of building material M different from the standard material represented in the material image MI.

[0072] 5A is a graph showing the relationship between the area of ​​the material region MA and the conveyance amount, and FIG. 5B is a graph showing the relationship between the area of ​​the material region MA and the conveyance amount after correction based on the density ratio. In each of the graphs in FIG. 5A and FIG. 5B, the vertical axis represents the conveyance amount of powder, the horizontal axis represents the average area value of the material region MA, and the series shown in the graph correspond to types of modeling material M with different densities.

[0073] 5A shows that the relationship between the area of ​​the material region MA and the conveyance amount differs for each of the different density building materials M. The graph in Fig. 5B shows that by correcting the area of ​​the material region MA based on the ratio of the density of the standard material and the different type of building material M represented in the material image MI to the density of the standard material, the difference in the relationship between the area of ​​the material region MA and the conveyance amount for building materials M with different densities becomes smaller than before the correction.

[0074] (1-3-1-2) Configuration of the concentrator 73 The concentrator 73 consolidates the modeling material M transported from the hoppers 72 of the multiple material supply sources 70 via the transport pipes 74 (first transport pipe 74-1 in the first material supply source) and transports it toward the processing device 2 via the transport pipe 74 (consolidated transport pipe 74-0). When only one material supply source among the multiple material supply sources 70 transports the modeling material M, the concentrator 73 transports the modeling material M transported from the material supply source 70 directly toward the processing device 2. When at least two material supply sources among the multiple material supply sources 70 simultaneously transport the modeling material M, the concentrator 73 mixes the modeling material transported from the at least two material supply sources 70 and transports it toward the processing device 2.

[0075] The types of modeling materials M held in the hoppers 72 of at least two of the multiple material supply sources 70 are different. That is, the material supply device 7 can supply multiple types of modeling materials M.

[0076] The material supply sources 70 other than at least two of the multiple material supply sources 70 may hold the same type of modeling material M as the modeling material M held in the other material supply sources 70. For example, when the first hopper 72-1 holds a modeling material Ma and the second hopper 72-2 holds a modeling material Mb of a different type from the modeling material Ma, the modeling material Ma may be held in a third hopper (not shown) provided in a third material supply source (not shown).

[0077] Here, the type of modeling material M may refer to the type of raw material in a modeling material M composed of a single raw material, or the blend of raw materials in a modeling material M composed of multiple raw materials. In other words, a modeling material Mc in which materials a and b are blended in a 1:1 ratio and a modeling material Md in which materials a and b are blended in a 2:1 ratio can be said to be different types of modeling materials M.

[0078] 1, the concentrator 73 is provided only in the first material supply source 70-1 that is communicatively connected to the processing device 2 and the information processing device 8. However, the material supply source 70 that includes the concentrator 73 is not limited to the first material supply source 70-1, and may be provided in a material supply source 70 that is not communicatively connected to the processing device 2 and the information processing device 8, for example, the second material supply source 70-2. That is, the material supply device 7 may have multiple concentrators 73. In this case, a hierarchical structure is formed in which the modeling material M aggregated by a certain concentrator 73 is further aggregated by another concentrator 73.

[0079] (1-3-1-3) Configuration of the Transport Control Unit 71 The transport control unit 71 controls the amount of the modeling material M held in the hopper 72 transported from the material supply source 70 to a predetermined value.

[0080] The transport control unit 71 has the same hardware configuration as the processing control unit 23 included in the processing device 2. For simplicity of explanation, the description of the transport control unit 71 common to the processing control unit 23 will be omitted.

[0081] The transport control unit 71 acquires transport control information. The transport control information is information that represents the type of modeling material M set for the workpiece W to be processed and the transport amount of the modeling material M that the processing device 2 transports toward the workpiece W. In the transport control information, the type and transport amount of the modeling material M may be represented according to the progress of processing (additive manufacturing). The progress of processing (additive manufacturing) may be represented by the layer on which processing (additive manufacturing) is performed. The transport control information is generated according to input by a user via an input device (not shown) that the processing system SYS has. The input device may be provided in the information processing device 8, or may be provided in the processing device 2 or the material supply device 7.

[0082] The transport control unit 71 that acquires the transport control information may be a transport control unit 71 (master transport control unit) that is included in at least one of the multiple material supply sources 70 .

[0083] Among the multiple material supply sources 70, the transport control units (slave transport control units) other than the master transport control unit store in their own storage devices the type of modeling material M held in the hopper 72 of the corresponding material supply source 70. The master transport control unit stores in its storage device (material table) the material supply sources 70 corresponding to each slave transport control unit and the type of modeling material M held in the hopper 72 of the material supply source 70, in association with each other.

[0084] The correspondence between the material supply source 70 corresponding to each slave transport control unit and the type of modeling material M held in the hopper 72 of that material supply source 70 may be transmitted from each slave transport control unit to the master transport control unit, or may be set in the master transport control unit and distributed to each slave transport control unit.

[0085] Based on the acquired transport control information and material table, the master transport control unit controls each material supply source 70 so that the modeling material M is transported in a type and transport amount that corresponds to the position on the workpiece W where processing (additive manufacturing) is performed.

[0086] The master transport control unit may acquire the formation control information together with the transport control information. In this case, the master transport control unit transmits the acquired formation control information to the processing apparatus 2 (processing control unit 23).

[0087] The transport control unit 71 sets the rotation speed of the screw 722 in the feeder 721 based on the transport control information. By rotating the screw 722 at the set rotation speed, an amount of modeling material M corresponding to the transport amount indicated in the transport control information is transported from the material supply device 7 to the processing device 2. The amount of modeling material M transported per unit time from the material supply device 7 to the processing device 2 (transport amount) may be the same as the amount of modeling material M supplied per unit time by the processing device 2 to the workpiece W (supply amount). Furthermore, if the amount of modeling material M decreases during transport, the amount of modeling material M may be calculated by adding the amount of decrease during transport to the supply amount.

[0088] The master transport control unit may receive a predetermined notification from the processing device 2 via the receiving device. When the predetermined notification is received from the processing device 2, the master transport control unit performs control to change the ratio of the multiple types of modeling materials M. Specifically, in response to receiving the predetermined notification from the processing device 2, the master transport control unit changes the ratio of the multiple types of modeling materials M currently being transported in accordance with the transport control information to the ratio of the multiple types of modeling materials M indicated in the transport control information according to the next processing (additive manufacturing).

[0089] (1-4) Configuration of Information Processing Device 8 The information processing device 8 is a device capable of executing predetermined processing on the forming control information. The information processing device 8 is a device that executes predetermined processing on the forming control information, which is an example of a computer program, and can also be called a program processing device. The information processing device 8 can be implemented by a computer including, for example, a processor (not shown), a memory (not shown), a communication circuit (not shown), an input device (not shown), and an output device (not shown).

[0090] FIG. 6 is a sequence diagram showing information processing for lamination processing in this embodiment.

[0091] In the processing system SYS of this embodiment, when performing additive manufacturing, first, the information processing device 8 acquires modeling control information (step S81). The modeling control information is a computer program that causes the processing device 2 to execute a predetermined processing operation. The modeling control information may be a processing control program (e.g., G-code) that includes a definition of a processing path along which the processing device 2 performs additive manufacturing. The modeling control information may be simply referred to as control information, and may not include a definition of a processing path. The processing device 2 performs additive manufacturing in accordance with the modeling control information. The acquisition of modeling control information by the information processing device 8 may be reception of modeling control information generated by another device, or generation of modeling control information in response to input to an input device of the information processing device 8.

[0092] The information processing device 8 also acquires transport control information (step S82). The transport control information is information that indicates the type of modeling material M set for the workpiece W to be processed and the transport amount of the modeling material M that the processing device 2 supplies to the workpiece W. The information processing device 8 may acquire the transport control information by receiving transport control information generated by another device, or by generating the transport control information in response to input to an input device of the information processing device 8. The order in which steps S81 and S82 are executed is not limited to the order shown in this sequence diagram, and may be reversed or may be executed simultaneously.

[0093] 7 is an example of an input screen for transport control information. The transport control information may be generated based on information input according to the input screen IS shown in FIG.

[0094] On the input screen IS, the stages of additive manufacturing are arranged in the row direction, and multiple material supply sources 70, each holding multiple types of building materials M, are arranged in the column direction. That is, at the intersection of the row and column directions, it is possible to input the amount of building material M to be transported from a certain material supply source 70 at a certain stage of additive manufacturing. Note that on the input screen IS, the stages of additive manufacturing are represented by the layer on which additive manufacturing is performed. In this way, by specifying (changing the numerical value of) the layer on which additive manufacturing is performed on the input screen IS, the stage of additive manufacturing can be adjusted.

[0095] On the input screen IS, the type of modeling material M held in the material supply source 70 can be selected from a drop-down list. When a type of modeling material M is selected from the drop-down list, the density of that type of modeling material M is searched for and displayed. Also, on the input screen IS, a type of modeling material M not included in the drop-down list can be input by selecting the item "USER" from the drop-down list. When the item "USER" is selected from the drop-down list, the name and density of the desired modeling material M can be input.

[0096] On the input screen IS, it is possible to set whether or not to perform conveyance amount feedback (POWFB) for each material supply source 70. On the input screen IS, for a material supply source 70 that is set to perform conveyance amount feedback (POWFB: Y), it is possible to input the amount of powder to be conveyed (conveyance amount) at each stage of progress. On the input screen IS, for a material supply source 70 that is set not to perform conveyance amount feedback (POWFB: N), it is possible to input the number of rotations of the screw 722 for conveyance at each stage of progress. Note that for a material supply source 70 that is set to perform conveyance amount feedback, input of the number of rotations of the screw 72 is not accepted. Also, for a material supply source 70 that is set to perform conveyance amount feedback, input of the powder amount (conveyance amount) is not accepted.

[0097] On the input screen IS, a new progress stage of additive manufacturing can be added by pressing the "Add Row" button. Also, on the input screen IS, a new progress stage having the same transport amount as the transport amount from each material supply source 70 in the progress stage corresponding to the row can be created by pressing the "Copy" button.

[0098] The input screen IS allows the user to set a time (wait) for the additive manufacturing process to stop when transitioning from one (previous) stage to the next. This wait time corresponds to the time during which irradiation of the processing light EL is stopped and the modeling material M transported for the previous stage is supplied without being used in additive manufacturing. This time is preferably set appropriately depending on the length of the transport pipe 74 from the material supply device 7 to the processing device 2. The transport pipes 74 connecting the hoppers 72 and concentrators 73 of each material supply source 70 are preferably configured to have the same length. This configuration allows the time during which additive manufacturing is unnecessarily stopped to be shortened, even when a common stop time is applied to all material supply sources 70.

[0099] The input screen IS is configured to acquire modeling control information by pressing the "Import GCODE" button. For example, when the "Import GCODE" button is pressed, a dialog box is displayed in which a data file including a G-code, which is an example of modeling control information, can be selected.

[0100] Next, the information processing device 8 adds a command to the modeling control information based on the transport control information (step S83). The command added here is a command for controlling the processing device 2 in response to the change in the transport amount indicated in the transport control information. In the transport control information, the type of modeling material M and the transport amount may be set according to the progress of additive manufacturing, for example, according to the layer on which additive manufacturing is performed. In other words, the type of modeling material M and the transport amount may be changed according to the progress of additive manufacturing, for example, according to a change in the layer on which additive manufacturing is performed.

[0101] Based on the modeling control information and the transport control information, the information processing device 8 identifies a location where the transport amount of the modeling material M is changed in the additive manufacturing process represented by the modeling control information. For example, if the type of modeling material M and the transport amount thereof are set in the transport control information according to the layer where additive manufacturing is performed, the location where the process moves from the additive manufacturing process of a layer with a transport amount A to the additive manufacturing process of a layer with a transport amount B is identified as a location where the transport amount of the modeling material M is changed.

[0102] The information processing device 8 adds a command for controlling the processing device 2 in response to the change in the transport amount to the location where the identified transport amount of the modeling material M is changed. The command for controlling the processing device 2 in response to the change in the transport amount may include, for example, at least one of a command for causing the processing device 2 to stop additive manufacturing, a command for causing the processing device 2 to stop irradiating the processing light EL, a command for causing the processing device 2 to retract the processing head 24, and a command for causing the processing device 2 to continue supplying fluid regardless of whether the modeling material M is being transported from the material supply device 7.

[0103] FIG. 8 is a schematic diagram illustrating the retraction of the processing head 24. In FIG. 8, the processing head 24, which is disposed inside the chamber CB in the processing apparatus 2 that performs additive manufacturing shown in FIG. 2, is disposed outside the chamber CB. When the processing head 24 is retracted and disposed outside the chamber CB, additive manufacturing by the processing apparatus 2 is not performed. Note that the retracted position to which the processing head 24 is retracted can also be considered a position where movement of the processing head 24 makes additive manufacturing by the processing apparatus 2 impossible. The retracted position is not limited to outside the chamber CB, but may be inside the chamber CB. At the retracted position, the already transported modeling material M is supplied in a situation unrelated to additive manufacturing, so the retracted position may be above a recovery device (not shown) that recovers unused modeling material M.

[0104] By adding such a command to the modeling control information, the processing device 2 can perform control corresponding to the change in the transport amount. That is, the processing device 2 performs control to not perform additive manufacturing in response to the change in the transport amount. In the control not to perform additive manufacturing, by continuing the supply of fluid (pressurized gas) for supplying the modeling material M, the processing device 2 completes the supply of the modeling material M transported before the change in the transport amount in a state where it is not used for additive manufacturing, and then supplies the modeling material M after the change in the transport amount and resumes additive manufacturing. By operating the processing device 2 in this manner, the processing system SYS can suppress the influence of the modeling material M before the change in the transport amount on additive manufacturing after the change in the transport amount.

[0105] The information processing device 8 does not need to add the above-mentioned command to the modeling control information if the ratio of each type of modeling material M transported to the processing device 2 does not change due to a change in the transport amount. For example, suppose that in a certain process, 100 units of modeling material Ma and 100 units of modeling material Mb are transported per unit time, and in the next process, 80 units of modeling material Ma and 80 units of modeling material Mb are transported per unit time. In this case, although the transport amount of modeling material M changes, the ratio of each type of transported modeling material M does not change. In such a case, even if modeling material M transported before the change in the transport amount is transported after the change in the transport amount, there is essentially no impact. Therefore, by not adding the above-mentioned command to the modeling control information, the information processing device 8 can shorten the stop time of additive manufacturing due to such a command and speed up additive manufacturing.

[0106] The information processing device 8 transmits the forming control information to which the command has been added to the processing device 2 (step S84). In the information processing device 8, a communication circuit used to transmit the forming control information, which is a processing control program, to the processing device 2 may be referred to as a program transmission device.

[0107] 7 , the input screen IS may be configured to cause the information processing device 8 to transmit the forming control information to which the command has been added to the processing device 2 by pressing the “Send GCODE” button. In addition, the addition of the command to the forming control information may be executed in response to pressing the “Send GCODE” button.

[0108] The processing device 2 receives the modeling control information to which the command has been added from the information processing device 8 (Step S21). The processing device 2 performs additive manufacturing in accordance with the received modeling control information. The processing device 2 may transmit a signal to the information processing device 8 in accordance with the modeling control information.

[0109] The information processing device 8 transmits the transport control information to the material supply device 7 (step S85). After the additive manufacturing by the processing device 2 starts, the information processing device 8 may transmit the transport control information to the material supply device 7. For example, the information processing device 8 may transmit the transport control information to the material supply device 7 in response to receiving a signal from the processing device 2.

[0110] The material supply device 7 receives transport control information from the information processing device 8 (step S71).

[0111] The material supply device 7 transports the modeling material M to the processing device 2 in accordance with the received transport control information.

[0112] The information processing device 8 may transmit the transport control information and the modeling control information to which the command has been added to one of the devices included in the processing system SYS. For example, the information processing device 8 may transmit the transport control information and the modeling control information to which the command has been added to the material supply device 7. In this case, the material supply device 7 transmits the received modeling control information to the processing device 2.

[0113] 9 is a sequence diagram showing the steps of lamination processing. The state of the processing system SYS (the processing device 2 and the material supply device 7) transitions from the top to the bottom of the drawing with the passage of time.

[0114] In the processing system SYS, the material supply device 7 transports a first material among a plurality of types of modeling materials M (operation A71), and the processing device 2 performs additive manufacturing using the transported first material (operation A21). This state can be called a first process WP1.

[0115] In the processing system SYS, when a portion of the additive manufacturing is completed, the processing device 2 stops the additive manufacturing (more specifically, the additive manufacturing using the first material) (Operation A22). The processing device 2 also sends a notification to the material supply device 7 (Operation A23). Upon receiving the notification, the material supply device 7 stops conveying the first material and starts conveying a second material, which is different from the first material, from among the multiple types of modeling materials M (Operation A12). This state (or series of operations) can be referred to as the second process WP2.

[0116] In the processing system SYS, when a predetermined time has elapsed since the material supply device 7 continued to transport the second material, the processing device 2 performs additive manufacturing using the transported second material (operation A24). This state can be called a third process WP3.

[0117] By transitioning from the first process WP1 to the third process WP3 in this manner, the processing system SYS can appropriately perform additive manufacturing using multiple types of building materials M.

[0118] (2) Details of the Forming Operation Performed by the Processing Apparatus 2 As described above, the processing apparatus 2 forms the three-dimensional structure ST by performing additional processing based on the laser build-up welding method. Therefore, the processing apparatus 2 may form the three-dimensional structure ST by performing a forming operation in accordance with the laser build-up welding method.

[0119] The processing device 2 forms a three-dimensional structure ST on the workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided in the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used. To form the three-dimensional structure ST, the processing device 2 sequentially forms, for example, multiple structural layers SL arranged along the Z-axis direction.

[0120] The processing device 2 repeatedly performs operations for forming such a structural layer SL based on the three-dimensional model data of the three-dimensional structure ST under the control of the processing control unit 23. Specifically, before performing operations for forming the structural layer SL, the information processing device 8 first slices the three-dimensional model data at the layer pitch to create slice data. Note that the creation of the slice data may be performed by a computer different from the information processing device 8. The processing device 2 performs operations for forming the first structural layer SL-1 on the printing surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structural layer SL-1. Specifically, the processing control unit 23 acquires path information for printing the first structural layer SL-1, which is generated based on the slice data corresponding to the structural layer SL-1. Then, the processing control unit 23 controls the processing unit 21 and the stage unit 22 to print the first structural layer SL-1 based on the path information. As a result, the structural layer SL-1 is printed on the printing surface MS as shown in FIG. 10A. Thereafter, the processing device 2 sets the surface (upper surface) of the structure layer SL-1 as a new printing surface MS, and then prints a second structure layer SL-2 on the new printing surface MS. To print the structure layer SL-2, the processing control unit 23 first controls at least one of the head driving mechanism 6 and the stage driving mechanism 32 so that the processing head 24 moves along the Z axis relative to the stage 31. Specifically, the processing device 2 controls at least one of the head driving mechanism 6 and the stage driving mechanism 32 to move the processing head 24 toward the +Z side and / or move the stage 31 toward the −Z side so that the processing unit areas PUA#1 and PUA#2 are set on the surface of the structure layer SL-1 (the new printing surface MS). Thereafter, the processing device 2 controls the processing unit 21 and the stage unit 22 so that the structure layer SL-2 is printed on the structure layer SL-1 based on the slice data corresponding to the structure layer SL-2, in a manner similar to the operation for printing the structure layer SL-1. As a result, a structural layer SL-2 is formed as shown in Fig. 10B. Thereafter, the same operation is repeated until all structural layers SL that constitute the three-dimensional structure ST to be formed on the workpiece W are formed.As a result, as shown in FIG. 10C, a three-dimensional structure ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0121] The processing device 2 (mainly, the processing unit 21) selectively performs the following as the forming operations for forming each structure layer SL: (i) a first forming operation in which a forming material M is supplied to a molten pool MP formed by irradiating the forming surface MS with processing light EL to form a three-dimensional structure ST, and (ii) a second forming operation in which the forming material M is supplied to the forming surface MS by irradiating the forming surface MS with processing light EL to form a three-dimensional structure ST. The first forming operation and the second forming operation will be described below in order. (2-1) First forming operation

[0122] The first modeling operation is a modeling operation in which processing light EL is irradiated onto the modeling surface MS to form a molten pool MP on the modeling surface MS, and modeling material M is supplied to the formed molten pool MP (the position where the processing light EL is irradiated) to form a model on the modeling surface MS.

[0123] First, the operation of forming each structure layer SL by performing the first forming operation will be described with reference to FIGS. 11A and 11B . Under the control of the processing control unit 23, the processing device 2 moves at least one of the processing head 24 and the stage 31 so that a processing unit area PUA is set in a desired area on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. Then, the irradiation device 42 irradiates the processing unit area PUA with the processing light EL. At this time, the focus position CP of the processing light EL in the Z-axis direction may coincide with the forming surface MS or may be spaced apart from the forming surface MS. As a result, as shown in FIG. 11A , a molten pool MP is formed on each forming surface MS irradiated with the processing light EL. Furthermore, under the control of the processing control unit 23, the processing device 2 supplies the forming material M from the material nozzle 64. As a result, the forming material M is supplied to the molten pool MP.

[0124] The shaping material M supplied to the molten pool MP is melted by the energy from the processing light EL irradiated onto the molten pool MP. Alternatively, the shaping material M supplied to the molten pool MP is melted by the heat from the molten material that constitutes the molten pool MP. Even when the shaping material M is melted by the heat from the molten material that constitutes the molten pool MP, since the molten pool MP is formed by the energy of the processing light EL, the shaping material M can be considered to be melted by the energy of the processing light EL that formed the molten pool MP. In other words, the shaping material M is melted indirectly by the processing light EL via the molten pool MP formed by the processing light EL. In either case, the shaping material M is melted by the energy of the processing light EL.

[0125] Furthermore, the irradiation device 42 uses a galvanometer mirror to move the irradiation area EA (EA#1, EA#2) within the processing unit area PUA (PUA#1, PUA#2). That is, the irradiation device 42 uses a galvanometer mirror to scan the processing light EL within the processing unit area PUA. When the irradiation area EA moves and the processing light EL is no longer irradiated, the molten building material M cools and solidifies (coagulates). That is, as the irradiation area EA moves, the position where the molten pool MP is formed also moves. As a result, as shown in FIG. 11B , within the processing unit area PUA, a model made of the solidified building material M is deposited on the building surface MS as the irradiation area EA moves. After irradiating the manufacturing surface MS with processing light EL to form a molten pool MP (narrow sense) in this manner, manufacturing material M is supplied to the molten pool MP (narrow sense), the manufacturing material M melts, and forms a molten pool (broad sense) protruding from the manufacturing surface MS, and the molten pool (broad sense) is cooled and solidified to deposit a structure (structural layer SL) on the manufacturing surface MS.

[0126] Here, the processing control unit 23 may control the galvanometer mirror to deflect the processing light EL so that the irradiation area EA moves along a single scanning direction within the processing unit area PUA while the processing unit area PUA is stationary (not moving) on ​​the printing surface MS. In other words, the processing control unit 23 may deflect the processing light EL with the galvanometer mirror so that the irradiation area EA moves along the main scanning direction (single scanning direction) within a coordinate system defined based on the processing unit area PUA. In particular, the galvanometer mirror may deflect the processing light EL so that the irradiation area EA periodically moves back and forth along a single scanning direction within each processing unit area PUA. In other words, the galvanometer mirror may deflect the processing light EL so that the irradiation area EA scans in the main scanning direction within the processing unit area PUA, then shifts it in a sub-scanning direction perpendicular to the main scanning direction, and then scans the irradiation area EA again in the main scanning direction, repeating this process. In this case, the irradiation area EA may be repeatedly scanned from one side to the other along the main scanning direction, or may be alternately scanned from one side to the other and from the other side to the one side along the main scanning direction. The shape of the processing unit area PUA through which the irradiation area EA moves in this way may be a rectangle whose longitudinal direction is the movement direction of the irradiation area EA.

[0127] In addition, the processing control unit 23 may drive the head driving mechanism 6 and the stage driving mechanism 32 to move the processing head 24 and the workpiece W relative to each other, while periodically scanning the processing light EL with a galvanometer mirror, thereby periodically moving (deflecting) the irradiation area EA on the forming surface MS (wobbling operation).

[0128] 11A and 11B, for convenience of explanation, the object formed from the solidified shaping material M in the processing unit area PUA#1 is physically separated from the object formed from the solidified shaping material M in the processing unit area PUA#2. However, the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2.

[0129] During the period when the irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining device 2 may move at least one of the machining head 24 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the manufacturing surface MS. In other words, the machining device 2 may move the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2, respectively, and move the machining unit areas PUA#1 and PUA#2 on the manufacturing surface MS in parallel.

[0130] Alternatively, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining device 2 may not move the machining head 24 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 do not move on the manufacturing surface MS. In other words, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining head 24 and the stage 31 may be stationary. In this case, after the additional machining (manufacturing) within the machining unit areas PUA#1 and PUA#2 is completed, the machining device 2 may move at least one of the machining head 24 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 are set in another area on the manufacturing surface MS. In other words, the machining device 2 may move at least one of the machining head 24 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS after the additional machining (printing) in the machining unit areas PUA#1 and PUA#2 is completed. In this case, the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (the area where the additional machining will now be performed) may be adjacent to each other, or these areas may be partially overlapping or may not overlap.

[0131] The processing device 2 repeats a series of forming processes, including forming a molten pool MP by irradiating the processing unit area PUA with processing light EL, supplying a forming material M to the molten pool MP, melting the supplied forming material M, and solidifying the molten forming material M, while moving the processing unit area PUA along a movement trajectory on the forming surface MS. In this case, as the processing unit area PUA moves, a formed object that has a width along the direction intersecting the movement trajectory (X-axis direction) and extends along the Y-axis direction is formed on the forming surface MS.

[0132] As a result, a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the movement trajectory of the processing unit area PUA is formed. That is, a structure layer SL having a shape corresponding to the movement trajectory of the processing unit area PUA in plan view is formed.

[0133] The movement trajectory of the machining unit area PUA may be referred to as a machining path (tool path) or a machining route. In this case, the machining control unit 23 may move at least one of the machining head 24 and the stage 31 based on path information indicating the movement trajectory (path information indicating the machining path) so that the machining unit area PUA moves along the movement trajectory on the printing surface MS. (2-2) Second Printing Operation

[0134] In the first modeling operation described above, the processing device 2 melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the processing device 2 melts the modeling material M in the space between the material nozzle 64 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second modeling operation, the processing device 2 irradiates the modeling material M with the processing light EL in the space between the material nozzle 64 and the modeling surface MS to melt the modeling material M. Then, the processing device 2 supplies the molten modeling material M in the space between the material nozzle 64 and the modeling surface MS to the modeling surface MS, thereby modeling a model on the modeling surface MS. Therefore, in the second modeling operation, the processing device 2 does not need to irradiate the modeling surface MS with the processing light EL to form a molten pool MP.

[0135] In the second modeling operation, the processing device 2, under the control of the processing control unit 23, moves at least one of the processing head 24 and the stage 31 so that the molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structure layer SL, thereby modeling each structure layer SL. In the following explanation, an example will be given of a configuration in which the processing head 24 is moved so that the molten modeling material M is supplied to a desired area on the modeling surface MS, and a three-dimensional structure ST is modeled.

[0136] 12A , under the control of the processing control unit 23, the processing device 2 emits processing light EL from the irradiation device 42 and supplies the modeling material M from the material nozzle 64. As a result, the modeling material M is irradiated with the processing light EL in the space between the material nozzle 64 and the modeling surface MS.

[0137] Here, in the space between the material nozzle 64 and the printing surface MS, a surface that intersects (is perpendicular to) the direction in which the material nozzle 64 and the printing surface MS face each other (the Z-axis direction) is referred to as a material supply surface PL, and of the multiple material supply surfaces PL between the material nozzle 64 and the printing surface MS, a surface on which the processing light EL is irradiated onto the printing material M is referred to as a material irradiation surface ES. The processing device 2 irradiates the material irradiation surface ES with the processing light EL and supplies the printing material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing light EL irradiated onto the material irradiation surface ES not only passes through the material irradiation surface ES, but also the printing material M supplied to the material irradiation surface ES passes through the material irradiation surface ES. Note that because the printing material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

[0138] When the processing light EL is irradiated onto the modeling material M on the material-irradiated surface ES, the modeling material M melts on the material-irradiated surface ES. The modeling material M melted on the material-irradiated surface ES is supplied from the material-irradiated surface ES to the modeling surface MS. As a result, the modeling material M melted on the material-irradiated surface ES adheres to the modeling surface MS. The modeling material M supplied to the modeling surface MS then cools and solidifies (coagulates). As a result, as shown in FIG. 12B , a model made of the solidified modeling material M is deposited on the modeling surface MS.

[0139] The processing device 2 repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with the processing light EL, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 24 relative to the modeling surface MS. In particular, the processing device 2 repeats the series of modeling processes while moving the processing head 24 relative to the modeling surface MS along at least one of the X-axis and Y-axis directions. In this case, as the processing head 24 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 24 is formed on the modeling surface MS. As a result, a structure layer SL corresponding to a modeled object that is an aggregate of the melted and then solidified modeling material M is formed on the modeling surface MS. The structure layer SL corresponding to a aggregate of models formed on the modeling surface MS in a pattern corresponding to the movement trajectory of the processing head 24 is formed. In other words, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 24 in a planar view is formed.

[0140] When such a second-modeling operation is performed, the object (e.g., the workpiece W or the structure layer SL) having the modeling surface MS on its surface is rarely directly melted by the processing light EL. This shortens the time required for the molten modeling material M to cool and solidify. Therefore, the second-modeling operation requires less time to model the three-dimensional structure ST than the first-modeling operation, which is performed by forming a molten pool MP. In other words, the modeling speed of the second-modeling operation is faster than the modeling speed of the first-modeling operation, allowing the three-dimensional structure ST to be modeled quickly.

[0141] In this way, the second-modeling operation can form the three-dimensional structure ST at high speed, and therefore the second-modeling operation may be referred to as a modeling operation conforming to the extreme high speed application (EHLA). The second-modeling operation may also be considered to be a modeling operation conforming to the extreme high speed application (EHLA).

[0142] When the second modeling operation is performed, similarly to when the first modeling operation is performed, the processing device 2 may deflect the processing light EL using a galvanometer mirror. In this case, the processing device 2 may deflect the processing light EL using the galvanometer mirror to move the beam passing area PA through which the processing light EL passes within a virtual material irradiation surface ES that intersects with the Z-axis between the material nozzle 64 and the modeling surface MS.

[0143] In the above description, the processing device 2 irradiates the shaping material M with the processing light EL to melt the shaping material M. However, the processing device 2 may irradiate the shaping material M with any energy beam to melt the shaping material M. Examples of the any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0144] In the above description, the processing device 2 performs additional processing. However, the processing device 2 may perform removal processing in addition to additional processing. The removal processing may include irradiating the workpiece W with the processing light EL to remove a portion of the workpiece W. As an example, the processing device 2 may perform additional processing on the workpiece W using at least one of the processing lights EL#1 and EL#2, and then perform removal processing on the workpiece W that has undergone additional processing using at least one of the processing lights EL#1 and EL#2. As another example, the processing device 2 may perform additional processing on a first portion of the workpiece W using one of the processing lights EL#1 and EL#2, while performing removal processing on a second portion of the workpiece W that is different from the first portion using the other of the processing lights EL#1 and EL#2. In other words, the processing device 2 may perform additional processing and removal processing simultaneously. Note that if the processing device 2 does not need to perform additional processing and removal processing simultaneously, the processing device 2 may perform additional processing and removal processing using the same processing light EL.

[0145] The processing device 2 may perform a remelt process in addition to at least one of additive processing and subtractive processing. The remelt process may include melting the surface of the workpiece W to reduce the surface flatness of the workpiece W (reducing surface roughness or making the surface more flat). As an example, the processing device 2 may perform at least one of additive processing and subtractive processing on the workpiece W using at least one of the processing beams EL#1 and EL#2, and then perform a remelt process on the workpiece W (or a shaped object formed on the workpiece W by the additive processing) that has been subjected to at least one of additive processing and subtractive processing using at least one of the processing beams EL#1 and EL#2. As another example, the processing device 2 may perform at least one of additive processing and subtractive processing on a first portion of the workpiece W using one of the processing beams EL#1 and EL#2, while performing a remelt process on a second portion of the workpiece W that is different from the first portion using the other of the processing beams EL#1 and EL#2. That is, the processing device 2 may perform at least one of the additional processing and the removal processing and the remelt processing simultaneously. Note that, if the processing device 2 does not need to perform at least one of the additional processing and the removal processing and the remelt processing simultaneously, the processing device 2 may perform at least one of the additional processing and the removal processing and the remelt processing using the same processing light EL.

[0146] In the processing device 2, the processing unit 21 (processing head 24) may be attached to a robot (typically, an articulated robot). When the processing head 24 is moved by a robot, the head drive mechanism 6 may be the robot. For example, the processing unit 21 (processing head 24) may be attached to a welding robot for welding. For example, the processing unit 21 (processing head 24) may be attached to a self-propelled mobile robot. The self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or an AMR (Autonomous Mobile Robot), and a robot arm provided on the self-propelled device.

[0147] At least some of the constituent elements of each of the above-described embodiments can be appropriately combined with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated herein by reference.

[0148] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and processing systems, control devices, control methods, computer programs and recording media that involve such modifications are also included in the technical scope of the present invention.

[0149] SYS Machining system 2 Machining device 21 Machining unit 7 Material supply device 70 Material supply source 8 Information processing device W Workpiece M Molding material EL Machining light

Claims

1. A processing system comprising: a processing device that supplies material along a processing path defined by a processing control program while irradiating an energy beam to additively manufacture a model; and a material supply device that transports the material to the processing device, wherein the material supply device holds multiple types of material and transports the at least one type of material to the processing device at a transport amount based on transport control information that represents at least one type of material and the transport amount of the material, and further comprises an information processing device that adds a command to the processing control program to control the processing device in response to a change in at least one of the type of material and the transport amount based on the transport control information.

2. The processing system according to claim 1, wherein in the transport control information, the at least one type of material and the transport amount of the material are set according to the progress of the additive manufacturing.

3. The processing system according to claim 2, wherein in the transport control information, the at least one type of material and the transport amount of the material are set according to the layer on which the additive manufacturing is performed.

4. A processing system according to any one of claims 1 to 3, wherein the command includes a command to cause the processing device to stop the additive manufacturing.

5. A processing system according to any one of claims 1 to 4, wherein the command includes a command to cause the processing device to stop irradiating the energy beam.

6. A processing system according to any one of claims 1 to 5, wherein the processing device is equipped with a processing head having an irradiation optical system that irradiates the energy beam, and the command includes a command for the processing device to retract the processing head to a predetermined retract position.

7. The processing system according to any one of claims 1 to 6, wherein the processing device supplies the material together with a fluid, and the command includes a command to the processing device to continue supplying the fluid regardless of whether the material is being transported from the material supply device.

8. The processing system according to claim 7, wherein the processing device completes the supply of the material that was conveyed before the change in the conveyance amount by supplying the fluid.

9. A processing system according to any one of claims 1 to 8, wherein the information processing device does not add the command to the processing control program if the proportion of each type of material transported to the processing device does not change due to a change in the transport amount.

10. A processing system comprising: a material supply device capable of transporting multiple types of material at a predetermined ratio based on transport control information; and a processing device that performs additive manufacturing of a model by irradiating an energy beam onto the multiple types of material transported from the material supply device based on modeling control information, wherein the processing device has a notification sending device that notifies the material supply device upon completion of some of the additive manufacturing processes performed based on the modeling control information, and the material supply device controls to change the ratio of the multiple types of material on the condition that it receives the notification.

11. The processing system described in claim 10, further comprising: an information processing device that adds a command to the processing control program to control the processing device in response to changes in the ratio of the multiple types of materials in the object based on the transport control information, the information processing device that irradiates an energy beam while supplying material along a processing path defined in a processing control program in the manufacturing control information, and the material supply device that transports each of the multiple types of material so that the ratio of the multiple types of material in the object corresponds to the progress of the additive manufacturing, as indicated in the transport control information.

12. The processing system according to claim 11, wherein the information processing device includes a program transmission device that transmits the transport control information and the processing control program to the material supply device.

13. The processing system described in any one of claims 10-12, wherein the processing device irradiates the energy beam while supplying the multiple types of materials at a first ratio in accordance with the manufacturing control information; the processing device stops the additive manufacturing and notifies the material supply device upon completion of the additive manufacturing performed at the first ratio; the material supply device switches the ratio of the multiple types of materials from the first ratio to a second ratio different from the first ratio and supplies them, on the condition that it receives the notification; and the processing device irradiates the energy beam while supplying the multiple types of materials at the second ratio in accordance with the manufacturing control information.

14. A processing system according to any one of claims 10 to 13, wherein the notification sending device sends the notification simultaneously with completion of the part of the additive manufacturing.

15. The processing system according to any one of claims 1 to 14, further comprising an input device that accepts input of the transport amount of at least one of the plurality of types of material.

16. The processing system described in claim 15, wherein the material supply device comprises a material supply source that holds each of the plurality of types of material, and a rotating body that rotates about a rotation axis to transport a predetermined amount of material from the material supply source, and the input device accepts input of the transport amount by inputting the rotation speed of the rotating body.

17. A processing system as described in claim 16, wherein the material supply device is equipped with an imaging device that images the material transported by the rotating body, and the rotation speed of the rotating body is controlled based on the results of the imaging.

18. The processing system of claim 17, wherein the material supply device reduces the rotation speed when the area of ​​the material region corresponding to the material in the imaging result is larger than a reference area corresponding to the predetermined amount of the material, and increases the rotation speed when the area of ​​the material region is smaller than the reference area.

19. A processing system as described in claim 18, wherein the reference area is determined based on a standard area corresponding to the standard material in the imaging results when imaging the standard material transported by the rotating body, and the ratio of the density of the material to the density of the standard material.

20. A processing system according to any one of claims 1-19, wherein the types of materials are different from one another.

21. A processing method comprising: adding a command to a processing control program for controlling a processing device to additively manufacture a model by supplying at least one type of material out of multiple types of materials along a processing path while irradiating the device with an energy beam, for controlling the processing device in response to changes in the amount of material to be conveyed, based on transport control information representing the amount of material to be conveyed; transporting the at least one type of material to the processing device based on the transport control information; and additively manufacturing the model by the processing device in accordance with the processing control program.

22. A processing method using a processing system comprising a material supply device capable of transporting multiple types of material at a predetermined ratio based on transport control information, and a processing device that irradiates an energy beam based on modeling control information and performs additive manufacturing using the multiple types of material transported from the material supply device, the processing method comprising: notifying the material supply device upon completion of a portion of the additive manufacturing performed based on the modeling control information; changing the ratio of the multiple types of material on the condition that the material supply device receives the notification; and performing additive manufacturing using the multiple types of material in the changed ratio by the processing device.

23. An information processing method comprising: acquiring a processing control program for controlling a processing device to additively manufacture a model by irradiating an energy beam while supplying a first material or a second material different from the first material along a processing path; adding a command to the processing control program for controlling the processing device in response to switching between the first material and the second material; and transmitting the processing control program with the added command to the processing device.

24. An information processing method for generating control information capable of controlling a processing device to perform additive manufacturing by irradiating an energy beam while supplying material, the information processing method comprising generating the control information so as to include a step of switching the material to be supplied between a first step of supplying a first material transported from a first material supply source to perform the additive manufacturing, and a second step of supplying a second material transported from a second material supply source different from the first material supply source and different from the first material to perform the additive manufacturing.

25. An information processing method comprising: acquiring a processing control program for controlling a processing device to additively manufacture a model by irradiating an energy beam while supplying at least one type of material from among multiple types of transported materials along a processing path; and adding, to the processing control program, a command for controlling the processing device in response to changes in the transport amount, based on transport control information that specifies the transport amount of the at least one type of material in accordance with the progress of the additive manufacturing.

26. An information processing method comprising: acquiring a processing control program for controlling a processing device to additively manufacture a model by irradiating an energy beam while supplying at least one type of material from multiple types of material transported from a material supply device; and adding to the processing control program a command for controlling the processing device to notify the material supply device when part of the additive manufacturing process has ended, based on transport control information that specifies the amount of material transported in accordance with the progress of the additive manufacturing process.

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