Substrate processing system and information processing device

Abstract

A substrate processing system according to an aspect of the present disclosure comprises: a batch processing unit that collectively processes a plurality of substrates; a sheet processing unit that processes the substrates one by one; an interface unit that transfers the substrates from the batch processing unit to the sheet processing unit; and a control circuit that confirms a processing recipe. The interface unit has: a substrate holding part that holds the substrates; and a processing liquid supply unit that supplies, to an upper surface of the substrates held by the substrate holding part, a processing liquid for suppressing drying of said upper surface. The processing recipe includes a lyophilic / lyophobic setting unit and a processing liquid setting unit. The lyophilic / lyophobic setting unit has, as setting items, a lyophilic setting for processing a lyophilic substrate and a lyophobic setting for processing a lyophobic substrate. The processing liquid setting unit has, as setting items, a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid. The control circuit confirms the consistency between the settings of the lyophilic / lyophobic setting unit and the settings of the processing liquid setting unit.

Description

Substrate processing system and information processing device

[0001] The present disclosure relates to a substrate processing system and an information processing apparatus.

[0002] A substrate processing system is known that includes a batch processing unit, a single wafer processing unit, and an interface unit. The batch processing unit processes a lot containing multiple substrates at once. The single wafer processing unit processes each substrate in the lot one by one. The interface unit transfers substrates from the batch processing unit to the single wafer processing unit.

[0003] Japanese Patent Publication No. 2023-129235 Japanese Patent Publication No. 2023-121707 Japanese Patent Publication No. 2023-121571

[0004] The present disclosure provides a technique that can suppress a decrease in the availability of a substrate processing system.

[0005] A substrate processing system according to one aspect of the present disclosure includes a batch processing unit that processes multiple substrates at once, a single-wafer processing unit that processes the substrates one by one, an interface unit that transfers the substrates from the batch processing unit to the single-wafer processing unit, and a control circuit that checks a processing recipe, wherein the interface unit has a substrate holding unit that holds the substrate, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the processing recipe includes a lyophilic / lyophobic setting unit and a processing liquid setting unit, wherein the lyophilic / lyophobic setting unit has as setting items a lyophilic setting for processing a lyophilic substrate and a lyophobic setting for processing a lyophobic substrate, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the control circuit checks consistency between the setting of the lyophilic / lyophobic setting unit and the setting of the processing liquid setting unit.

[0006] According to the present disclosure, it is possible to suppress a decrease in the availability rate of a substrate processing system.

[0007] FIG. 1 is a schematic plan view showing a substrate processing system according to an embodiment. FIG. 2A is a plan view showing a second transfer table according to an embodiment, and FIG. 2B is a cross-sectional view showing the second transfer table according to an embodiment. FIG. 3 is a flowchart showing a substrate processing method according to an embodiment. FIG. 4 is a diagram showing an example of a processing recipe. FIG. 5 is a diagram showing another example of a processing recipe. FIG. 6 is a flowchart showing a recipe creation procedure according to a first example. FIG. 7 is a flowchart showing an example of a recipe confirmation process. FIG. 8 is a flowchart showing another example of a recipe confirmation process. FIG. 9 is a flowchart showing a recipe creation procedure according to a second example. FIG. 10 is a flowchart showing an example of a recipe confirmation process. FIG. 11 is a flowchart showing another example of a recipe confirmation process.

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding reference numerals are used to designate the same or corresponding members or components, and redundant descriptions will be omitted.

[0009] In the following description, an XYZ Cartesian coordinate system is used, but this coordinate system is defined for the purpose of explanation and does not limit the attitude of the substrate processing system 1. The XY plane view is referred to as a plan view, and when viewed from an arbitrary point, the positive side of the Z axis may be referred to as the upper side, and the negative side of the Z axis may be referred to as the lower side.

[0010] [Substrate Processing System] A substrate processing system 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic plan view showing the substrate processing system 1 according to an embodiment.

[0011] As shown in FIG. 1, the substrate processing system 1 includes a loading / unloading section 2 , a first interface section 3 , a batch processing section 4 , a second interface section 5 , a single wafer processing section 6 , and a control circuit 9 .

[0012] The loading / unloading section 2 serves as both a loading section and an unloading section, thereby enabling a reduction in size of the substrate processing system 1. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0013] The load port 21 is arranged on the negative side of the X-axis of the loading / unloading section 2. Multiple (e.g., four) load ports 21 are arranged along the Y-axis. The number of load ports 21 is not particularly limited. A cassette C is placed on the load port 21. The cassette C stores multiple (e.g., 25) substrates W. The cassette C is loaded into and unloaded from the load port 21. Inside the cassette C, the substrates W are held horizontally and at a second pitch P2 (P2 = N × P1) that is N times the first pitch P1 along the Z-axis. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0014] A plurality of stockers 22 (for example, four) are arranged along the Y axis at the center of the X axis of the load / unload section 2. A plurality of stockers 22 (for example, two) are arranged adjacent to the first interface section 3 along the Y axis on the positive side of the X axis of the load / unload section 2. The stockers 22 may be arranged in multiple tiers along the Z axis. The stockers 22 temporarily store cassettes C containing substrates W before cleaning processing, cassettes C that have been emptied after the substrates W have been removed, etc. The number of stockers 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface unit 3. The loader 23 is disposed on the positive side of the X-axis of the loading / unloading unit 2. A cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. A plurality of loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.

[0016] The cassette transport device 24 transports the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transport device 24 is, for example, an articulated transport robot.

[0017] The first interface section 3 is disposed on the positive side of the X-axis of the load / unload section 2. The first interface section 3 transports substrates W between the load / unload section 2, the batch processing section 4, and the single wafer processing section 6. The first interface section 3 includes a substrate transfer device 31, a lot formation section 32, and a first delivery table 33.

[0018] The substrate transfer device 31 transports substrates W between the cassette C placed on the loader 23, the lot formation unit 32, and the first transfer table 33. The substrate transfer device 31 is composed of a multi-axis (e.g., six-axis) arm robot, and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) that can hold a plurality of substrates W (e.g., 25 substrates W). The substrate holding arm 31a can assume any position and posture in three-dimensional space while holding substrates W with the holding claws.

[0019] The lot forming section 32 is disposed on the X-axis positive side of the first interface section 3. The lot forming section 32 holds a plurality of substrates W at a first pitch P1 and forms a lot L.

[0020] The first transfer table 33 is adjacent to the single wafer processing unit 6. The first transfer table 33 is arranged on the Y-axis positive side of the first interface unit 3. The first transfer table 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is delivered to the load / unload unit 2.

[0021] The batch processing unit 4 is disposed on the positive side of the X-axis of the first interface unit 3. The load / unload unit 2, the first interface unit 3, and the batch processing unit 4 are disposed in this order, from the negative side of the X-axis toward the positive side of the X-axis. The batch processing unit 4 processes a lot L including a plurality of substrates W (e.g., 50 or 100 substrates W) arranged at a first pitch P1 in a batch. One lot L is made up of substrates W in, for example, M cassettes C. M is a natural number equal to or greater than 2. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit 4 has a chemical liquid tank 41, a rinse liquid tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0022] The chemical liquid tank 41 and the rinse liquid tank 42 are arranged along the X-axis. For example, the chemical liquid tank 41 and the rinse liquid tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical liquid tank 41 and the rinse liquid tank 42 are also collectively referred to as a processing tank. The number of chemical liquid tanks 41 and rinse liquid tanks 42 is not limited to that shown in FIG. 1. For example, although one set of chemical liquid tank 41 and rinse liquid tank 42 is shown in FIG. 1, multiple sets of chemical liquid tanks 41 and rinse liquid tanks 42 may be used.

[0023] The chemical tank 41 stores a chemical in which the lot L is immersed. The chemical is, for example, a phosphoric acid aqueous solution (H ３ P.O. ４ ) The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film from the silicon oxide film and the silicon nitride film. The chemical solution is not limited to the phosphoric acid aqueous solution. The chemical solution may be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), a plating solution, or the like. The chemical solution may be for a stripping process or a plating process. The number of chemical solutions is not particularly limited, and multiple chemical solutions may be used.

[0024] The rinse liquid tank 42 stores a first rinse liquid in which the lot L is immersed. The first rinse liquid is pure water that removes chemicals from the substrates W, such as DIW (deionized water).

[0025] The first transport device 43 has a guide rail 43a and a first transport arm 43b. The guide rail 43a is disposed on the negative side of the Y axis relative to the processing tank. The guide rail 43a extends along the X axis from the first interface unit 3 to the batch processing unit 4. The first transport arm 43b moves along the guide rail 43a. The first transport arm 43b may move along the Z axis or rotate around the Z axis. The first transport arm 43b transports lots L in a batch between the first interface unit 3 and the batch processing unit 4.

[0026] The processing tool 44 receives and holds the lot L from the first transport arm 43b. The processing tool 44 holds the substrates W at a first pitch P1 along the Y axis, and holds each of the substrates W vertically.

[0027] The driving device 45 moves the processing tool 44 along the X-axis and the Z-axis. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then transfers the lot L to the first transport device 43.

[0028] Although the number of units including the processing tool 44 and the driving device 45 is one in this embodiment, there may be more than one. In the latter case, one unit immerses the lot L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the lot L in the first rinse solution stored in the rinse solution tank 42. In this case, the driving device 45 only needs to move the processing tool 44 along the Z axis, and does not need to move the processing tool 44 along the X axis.

[0029] The second interface unit 5 is disposed on the Y-axis positive side of the batch processing unit 4. The second interface unit 5 transports substrates W between the batch processing unit 4 and the single wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.

[0030] The immersion tank 51 is disposed outside the range of movement of the first transport arm 43b. For example, the immersion tank 51 is disposed at a position offset to the positive side of the Y axis relative to the processing tank. The immersion tank 51 stores a second rinse liquid in which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted up from the second rinse liquid by the third transport device 53. Because the substrate W is located below the surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the concave-convex pattern of the substrate W from collapsing.

[0031] The second transfer device 52 has a Y-axis driving device 52a, a Z-axis driving device 52b, and a second transfer arm 52c.

[0032] The Y-axis drive device 52a is disposed on the X-axis positive side of the second interface unit 5. The Y-axis drive device 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive device 52a moves the Z-axis drive device 52b and the second transfer arm 52c along the Y-axis. The Y-axis drive device 52a may include a ball screw.

[0033] The Z-axis driving device 52b is movably attached to the Y-axis driving device 52a. The Z-axis driving device 52b moves the second transfer arm 52c along the Z-axis. The Z-axis driving device 52b may include a ball screw.

[0034] The second transport arm 52c is movably attached to the Z-axis driver 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W at a first pitch P1 along the Y-axis, and holds each of the multiple substrates W vertically. The second transport arm 52c is moved along the Y-axis and Z-axis by the Y-axis driver 52a and Z-axis driver 52b. The second transport arm 52c is configured to be movable between multiple positions, including a transfer position, an immersion position, and a standby position.

[0035] The transfer position is a position where the lot L is transferred between the first transfer arm 43b and the second transfer arm 52c. The transfer position is on the negative side of the Y axis and the positive side of the Z axis.

[0036] The immersion position is a position where the lot L is immersed in the immersion tank 51. The immersion position is a position on the positive side of the Y axis and on the negative side of the Z axis from the delivery position.

[0037] The standby position is a position where the second transport arm 52c waits when the lot L is not being transferred or immersed in the immersion tank 51. The standby position is directly below the transfer position (negative side of the Z axis) and does not interfere with the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position simply by moving upward (positive side of the Z axis), improving throughput. The standby position may be the same position as the immersion position. In this case, particles that may be generated by the operation of the first transport device 43 can be prevented from adhering to the second transport arm 52c. The standby position may be a position directly above the immersion position (positive side of the Z axis). In this way, by setting the standby position at a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] The second transfer device 52 moves the second transfer arm 52c to the immersion position or the standby position while the first transfer device 43 is operating, thereby preventing contact between the first transfer arm 43b and the second transfer arm 52c.

[0039] The third transfer device 53 is a multi-axis (e.g., six-axis) arm robot having a third transfer arm 53a at its tip. The third transfer arm 53a has holding claws (not shown) capable of holding a single substrate W. The third transfer arm 53a can assume any position and posture in three-dimensional space while holding the substrate W with the holding claws. The third transfer device 53 transfers the substrate W between the second transfer arm 52c, which is in the immersion position, and the second transfer table 54. Since the immersion tank 51 is located outside the movement range of the first transfer arm 43b, the first transfer arm 43b and the third transfer arm 53a do not interfere with each other. This allows one of the first transfer device 43 and the third transfer device 53 to operate independently, regardless of the operating state of the other. Therefore, the first transfer device 43 and the third transfer device 53 can be operated at any timing, thereby shortening the time required to transport the substrate W. As a result, the productivity of the substrate processing system 1 is improved.

[0040] The third transport device 53 has an imaging unit 53b. The imaging unit 53b is attached to, for example, the third transport arm 53a. The imaging unit 53b images the top surface of the substrate W transported by the third transport arm 53a and acquires a first top surface image, which is an image of the top surface of the substrate W. The imaging unit 53b transmits the acquired first top surface image to the control circuit 9. The imaging unit 53b may include a camera and generate an image using the camera. The imaging unit 53b may include a laser light source and a camera and generate an image using a light-section method. The imaging unit 53b only needs to be able to image the top surface of the substrate W transported by the third transport arm 53a, and may be attached to a side wall, ceiling, etc. of the second interface unit 5. In the example of FIG. 1, there is one imaging unit 53b, but there may be two or more imaging units 53b. The imaging unit 53b does not necessarily have to be provided.

[0041] The second transfer table 54 is adjacent to the single wafer processing unit 6. The second transfer table 54 is arranged on the negative side of the X-axis of the second interface unit 5. The second transfer table 54 receives the substrate W from the third transport device 53 and temporarily stores it until it is transferred to the single wafer processing unit 6. The substrate W removed from the immersion bath 51 is placed on the second transfer table 54. It is preferable that the surface of the substrate W placed on the second transfer table 54 is wet with, for example, the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and collapse of the concave-convex pattern of the substrate W can be suppressed. The number of second transfer tables 54 may be one or more. Details of the second transfer table 54 will be described later.

[0042] The single wafer processing unit 6 is arranged on the negative side of the X axis of the second interface unit 5. The single wafer processing unit 6 is arranged on the positive side of the Y axis of the carry-in / out unit 2, the first interface unit 3, and the batch processing unit 4. The single wafer processing unit 6 processes substrates W one by one. The single wafer processing unit 6 has a fourth transport device 61, a liquid processing device 62, and a drying device 63.

[0043] The fourth transport device 61 includes a guide rail 61a, a fourth transport arm 61b, and an imaging unit 61c.

[0044] The guide rail 61a is disposed on the Y-axis negative side of the single wafer processing unit 6. The guide rail 61a extends along the X-axis in the single wafer processing unit 6.

[0045] The fourth transport arm 61b moves along the guide rail 61a. The fourth transport arm 61b rotates around the Z axis. The fourth transport arm 61b transports substrates W between the second transfer table 54, the liquid treatment device 62, the drying device 63, and the first transfer table 33. The number of fourth transport arms 61b may be one or more. In the latter case, the fourth transport device 61 transports multiple (e.g., five) substrates W at a time.

[0046] The imaging unit 61c is attached to the fourth transport arm 61b. The imaging unit 61c images the top surface of the substrate W transported by the fourth transport arm 61b and acquires a second top surface image, which is an image of the top surface of the substrate W. The imaging unit 61c transmits the acquired second top surface image to the control circuit 9. The imaging unit 61c may include a camera and generate an image using the camera. The imaging unit 61c may include a laser light source and a camera and generate an image using a light-section method. The imaging unit 61c may be attached to a side wall, ceiling, etc. of the single-wafer processing unit 6 as long as it can image the top surface of the substrate W transported by the fourth transport arm 61b. In the example of FIG. 1, there is one imaging unit 61c, but there may be two or more imaging units 61c. The imaging unit 61c does not necessarily have to be provided.

[0047] The liquid processing device 62 is disposed on the positive side of the X-axis and the positive side of the Y-axis of the single wafer processing device 6. The liquid processing device 62 is a single wafer processing device, and processes substrates W one by one with a processing liquid. The liquid processing device 62 is disposed in multiple stages (for example, three stages) along the Z-axis. This allows multiple substrates W to be processed simultaneously with the processing liquid. There may be multiple processing liquids, and for example, pure water such as DIW and a drying liquid having a surface tension lower than that of pure water. The drying liquid may be, for example, an alcohol such as IPA (isopropyl alcohol).

[0048] The drying device 63 is disposed adjacent to the liquid processing device 62 on the negative side of the X axis. In this case, the end face of the single wafer processing device 6 on the positive side of the Y axis can be disposed flush or approximately flush with the end face of the second interface unit 5 on the positive side of the Y axis. This results in almost no dead space, thereby reducing the footprint of the substrate processing system 1. In contrast, if the drying device 63 is disposed adjacent to the liquid processing device 62 on the positive side of the Y axis, the end face of the single wafer processing device 6 on the positive side of the Y axis would protrude beyond the end face of the second interface unit 5 on the positive side of the Y axis, potentially creating dead space. The drying device 63 is a single-wafer type and dries each substrate W one by one with a supercritical fluid. The drying devices 63 are disposed in multiple stages (e.g., three stages) along the Z axis. This allows multiple substrates W to be dried simultaneously.

[0049] Both the liquid processing apparatus 62 and the drying apparatus 63 do not have to be of the single wafer type; the liquid processing apparatus 62 may be of the single wafer type and the drying apparatus 63 of the batch type. The drying apparatus 63 may dry a plurality of substrates W all at once using a supercritical fluid. The number of substrates W processed all at once in the drying apparatus 63 may be equal to or greater than the number of substrates W processed all at once in the liquid processing apparatus 62, but may also be less. Apparatus other than the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single wafer processing apparatus 6.

[0050] The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the substrate processing system 1. The control circuit 9 controls the operation of the substrate processing system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0051] The control circuit 9 includes electronic circuits such as a CPU, a field programmable gate array (FPGA), or an application specific integrated circuit (ASIC), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0052] In the substrate processing system 1, the substrate W is transported to each section and processed in accordance with the processing recipe 100. For example, in accordance with the processing recipe 100, the substrate W is transported from the load / unload section 2 to the first interface section 3, the batch processing section 4, the second interface section 5, and the single wafer processing section 6 in that order, and then returned to the load / unload section 2. In the first interface section 3, the batch processing section 4, the second interface section 5, and the single wafer processing section 6, the substrate W is processed in accordance with the processing recipe 100, respectively. The processing recipe 100 will be described later.

[0053] [Second Delivery Table] The second delivery table 54 will be described with reference to Fig. 2. Fig. 2 is a diagram showing the second delivery table 54 according to the embodiment. Fig. 2(a) is a plan view, and Fig. 2(b) is a cross-sectional view. Fig. 2(b) corresponds to a cross-sectional view taken along line IIb-IIb in Fig. 2(a).

[0054] 2, the second transfer table 54 has a substrate holder 70 and a pure water supply unit 80. The pure water supply unit 80 is omitted from FIG.

[0055] The substrate holder 70 has a liquid receiving portion 71 and a plurality of pins 72. The liquid receiving portion 71 has a bottom plate 71a and a wall portion 71b. The bottom plate 71a has a disk shape. The wall portion 71b is provided in an annular shape on the bottom plate 71a. The plurality of pins 72 are provided on the bottom plate 71a. In the example of FIG. 2, there are three pins 72, but there may be four or more. A surface including the upper end of each pin 72 is horizontal. The upper end of each pin 72 is located higher than the upper end of the wall portion 71b. The plurality of pins 72 support the substrate W from below above the bottom plate 71a. A first liquid film LF1, which is a liquid film of the second rinse liquid, may be formed on the upper surface of the substrate W.

[0056] The pure water supply unit 80 has a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 discharges pure water supplied through the pure water supply line 82. A branch point 85 is provided in the pure water supply line 82, and the return line 83 is connected to the branch point 85. Even during periods when pure water is not being discharged from the nozzle 81, pure water flows through the portion of the pure water supply line 82 upstream of the branch point 85 and the return line 83. The pure water supply unit 80 configured in this manner supplies pure water to the upper surface of the substrate W. The pure water supply unit 80 is an example of a processing liquid supply unit.

[0057] [Operation of the Substrate Processing System] The operation of the substrate processing system 1 according to the embodiment, i.e., the substrate processing method, will be described with reference to Figures 1 and 3. Figure 3 is a flowchart showing the substrate processing method according to the embodiment. The process shown in Figure 3 is performed under the control of a control circuit 9.

[0058] First, a cassette C containing a plurality of substrates W is loaded into the load / unload section 2 and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and at a second pitch P2 (P2 = N x P1) along the Z axis. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0059] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. After the cassette C is transported to the loader 23, the cover thereof is opened by the cover opening / closing mechanism.

[0060] Next, the substrate transfer device 31 receives the substrates W accommodated in the cassette C (S1 in FIG. 3), and transports them to the lot formation unit 32.

[0061] Next, the lot formation unit 32 holds a plurality of substrates W at a first pitch P1 (P1=P2 / N) to form a lot L (S2 in FIG. 3). One lot L is made up of, for example, substrates W in M ​​cassettes C. Because the pitch between the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W to be processed at one time can be increased.

[0062] Next, the first transport device 43 receives the lot L from the lot formation unit 32 and transports it to the processing tool 44 .

[0063] Next, the processing tool 44 descends from above the chemical liquid tank 41, immerses the lot L in the chemical liquid, and performs chemical processing (S3 in FIG. 3). Thereafter, the processing tool 44 ascends to lift the lot L out of the chemical liquid, and then moves toward the negative side of the X axis above the rinse liquid tank 42.

[0064] Next, the processing tool 44 descends from above the rinse liquid tank 42 and immerses the lot L in the first rinse liquid, performing rinse liquid processing (S3 in FIG. 3). Thereafter, the processing tool 44 ascends to lift the lot L out of the first rinse liquid. Next, the first transfer device 43 receives the lot L from the processing tool 44 and transfers it to the second transfer device 52.

[0065] Next, the second transport arm 52c of the second transport device 52 moves in the positive direction of the Y axis and descends from above the immersion bath 51 to immerse the lot L in the second rinse liquid (S4 in FIG. 3). The substrates W in the lot L are held in the second rinse liquid until they are lifted up from the second rinse liquid by the third transport device 53. Because the substrates W are present below the surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrates W, preventing the concave-convex pattern of the substrates W from collapsing.

[0066] Next, the third transfer device 53 transfers the substrates W of the lot L held by the second transfer arm 52c in the second rinse liquid to the second transfer table 54. The third transfer device 53, for example, transfers the substrates W one by one to the second transfer table 54. On the second transfer table 54, pure water is discharged onto the upper surface of the substrate W to prevent the upper surface of the substrate W from drying out and causing the concave-convex pattern to collapse, and a second liquid film LF2, which is a liquid film of pure water, is formed.

[0067] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid processing device 62 .

[0068] Next, the liquid treatment device 62 treats the substrates W one by one with a liquid (S5 in FIG. 3). The liquid may be a plurality of liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, alcohol such as IPA. The liquid treatment device 62 supplies the pure water and the drying liquid in this order onto the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0069] Next, the fourth transport device 61 receives the substrate W from the liquid treatment device 62 and holds the substrate W horizontally with the film of drying liquid facing upward. The fourth transport device 61 transports the substrate W from the liquid treatment device 62 to the drying device 63.

[0070] Next, the drying device 63 dries the substrates W one by one with a supercritical fluid (S5 in FIG. 3). The drying liquid can be replaced with the supercritical fluid, and collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, single-wafer processing is performed rather than batch processing in order to reduce the size of the pressure-resistant container.

[0071] In this embodiment, the drying apparatus 63 is of a single-wafer type, but as described above, it may be of a batch type. The batch-type drying apparatus 63 dries a plurality of substrates W on which a liquid film has been formed all at once with a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch-type drying apparatus 63 has multiple transport arms.

[0072] In this embodiment, the drying device 63 dries the substrate W by supercritical drying, but the drying method is not particularly limited. Any drying method that can prevent the concavo-convex pattern of the substrate W from collapsing may be used, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the liquid treatment device 62 rotates the substrate W and uses centrifugal force to spin off the drying liquid from the substrate W, thereby removing the drying liquid from the top surface of the substrate W. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the periphery of the substrate W, and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, the supply position of a drying gas, such as nitrogen gas, may also be moved from the center of the substrate W toward the periphery of the substrate W to follow the supply position of the drying liquid.

[0073] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer table 33 .

[0074] Next, the substrate transfer device 31 receives the substrate W from the first transfer table 33 and stores it in the cassette C (S6 in FIG. 3). The cassette C is carried out from the carry-in / out section 2 with the plurality of substrates W stored therein.

[0075] Incidentally, when a substrate W is transported from the batch processing section 4 to the single wafer processing section 6 in the substrate processing system 1, pure water is discharged onto the upper surface of the substrate W on the second transfer table 54 to form a second liquid film LF2. At this time, if the upper surface of the substrate W loaded onto the second transfer table 54 is lyophobic (hydrophobic), the pure water discharged onto the upper surface of the substrate W may be repelled by the upper surface of the substrate W and may fall from the substrate W during transport. In this case, maintenance of the substrate processing system 1 is performed. This reduces the availability of the substrate processing system 1.

[0076] For example, when a monitor substrate having a silicon nitride film formed on its surface is etched with a phosphoric acid aqueous solution to evaluate the etching characteristics of the silicon nitride film, a part of lot L may include bare silicon substrates as dummy substrates. In this case, the top surfaces of some of the substrates in lot L may become lyophobic. This is because the top surfaces of the monitor substrates etched with a phosphoric acid aqueous solution become lyophilic (hydrophilic), while the top surfaces of the bare silicon substrates etched with a phosphoric acid aqueous solution become lyophobic. For example, if dummy substrates used in different processes are reused, the top surfaces of some of the substrates in lot L may become lyophobic. For example, if an irregular event occurs during the processing of product substrates, the top surfaces of the substrates may become lyophobic.

[0077] Below, we will explain a technology that can prevent pure water from falling from a substrate W having a lyophobic upper surface when the substrate W is transported from the batch processing unit 4 to the single-wafer processing unit 6, thereby preventing a decrease in the operating rate of the substrate processing system 1.

[0078] [Process Recipe] The process recipe 100 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a diagram showing an example of the process recipe 100. Fig. 5 is a diagram showing another example of the process recipe 100.

[0079] The process recipe 100 sets the details of the process to be performed on the substrate W in the substrate processing system 1. The process recipe 100 includes a hydrophilic / hydrophobic setting unit 110, a transfer sequence setting unit 120, a batch setting unit 130, a pure water setting unit 140, and a single wafer setting unit 150.

[0080] The hydrophilic / hydrophobic setting unit 110 is an item for setting the hydrophilic / hydrophobicity of the processing recipe 100. The hydrophilic / hydrophobic setting unit 110 has a hydrophilic setting and a hydrophobic setting as setting items. The hydrophilic setting is a setting for processing a hydrophilic substrate W. The hydrophobic setting is a setting for processing a hydrophobic substrate W. In the example of FIG. 4, the hydrophilic setting is set in the hydrophilic / hydrophobic setting unit 110. In the example of FIG. 5, the hydrophobic setting is set in the hydrophilic / hydrophobic setting unit 110. The hydrophilic / hydrophobic setting unit 110 is an example of a lyophilic / lyophobic setting unit. The hydrophilic setting is an example of a lyophilic setting, and the hydrophobic setting is an example of a lyophobic setting.

[0081] The transport sequence setting unit 120 is an item for setting the sequence in which the substrates W are transported in the substrate processing system 1. In the example of Figures 4 and 5, the sequence is set so that the substrates W are transported in the following order: load port 21, chemical liquid tank 41, rinse liquid tank 42, immersion tank 51, second transfer table 54, liquid treatment device 62, drying device 63, and load port 21.

[0082] The batch setting unit 130 is an item for setting the processing conditions of the batch processing unit 4. A batch setting unit 130 is provided for each processing tank. In the examples of FIGS. 4 and 5 , a batch setting unit 130a is provided for setting the processing conditions of the chemical tank 41, and a batch setting unit 130b is provided for setting the processing conditions of the rinse liquid tank 42. The batch setting unit 130a has, as a setting item, the type of chemical liquid stored in the chemical tank 41. In the example of FIG. 4 , a phosphoric acid aqueous solution is set as the chemical liquid stored in the chemical tank 41. In the example of FIG. 5 , DHF is set as the chemical liquid stored in the chemical tank 41. The batch setting unit 130b has, as a setting item, the type of first rinse liquid stored in the rinse liquid tank 42. In the examples of FIGS. 4 and 5 , pure water is set as the first rinse liquid stored in the rinse liquid tank 42.

[0083] The pure water setting unit 140 is an item for setting whether or not pure water is to be supplied by the pure water supply unit 80. The pure water setting unit 140 has setting items of supply setting and non-supply setting. The supply setting is a setting in which the pure water supply unit 80 supplies pure water to the substrate W held on the second delivery table 54 when the substrate W is transported from the batch processing unit 4 to the single wafer processing unit 6. The non-supply setting is a setting in which the pure water supply unit 80 does not supply pure water to the substrate W held on the second delivery table 54 when the substrate W is transported from the batch processing unit 4 to the single wafer processing unit 6. In the examples of FIGS. 4 and 5 , the supply setting is set in the pure water setting unit 140. The pure water setting unit 140 is an example of a processing liquid setting unit.

[0084] The single wafer setting unit 150 is an item for setting the processing conditions of the single wafer processing unit 6. The single wafer setting unit 150 has processing conditions of the liquid processing unit 62 and processing conditions of the drying unit 63 as setting items.

[0085] 4 and 5, the transfer order setting unit 120, the batch setting unit 130a, the batch setting unit 130b, the pure water setting unit 140, and the single wafer setting unit 150 are provided separately, but this is not limiting. For example, two or more of the transfer order setting unit 120, the batch setting unit 130a, the batch setting unit 130b, the pure water setting unit 140, and the single wafer setting unit 150 may be configured as a single setting unit. For example, the batch setting unit 130a and the batch setting unit 130b may be configured as a single setting unit. For example, the pure water setting unit 140 and the single wafer setting unit 150 may be configured as a single setting unit. For example, the batch setting unit 130a, the batch setting unit 130b, the pure water setting unit 140, and the single wafer setting unit 150 may be configured as a single setting unit.

[0086] 4 and 5, the single wafer setting unit 150 has, as setting items, the processing conditions of the liquid processing device 62 and the processing conditions of the drying device 63, but is not limited to this. For example, a setting unit having, as setting items, the processing conditions of the liquid processing device 62 and a setting unit having, as setting items, the processing conditions of the drying device 63 may be provided separately.

[0087] [Recipe Creation Procedure] A first example of a procedure for creating the process recipe 100 will be described with reference to Figures 6 to 8. Figure 6 is a flowchart showing the recipe creation procedure according to the first example.

[0088] In step S61, the operator sets the hydrophilic / hydrophobic setting unit 110. Specifically, the operator sets the hydrophilic / hydrophobic setting for the process recipe 100. In the example of Fig. 4, the hydrophilic setting is set by the operator. In the example of Fig. 5, the hydrophobic setting is set by the operator.

[0089] In step S62, the operator sets the transport sequence setting unit 120. Specifically, the operator sets the sequence in which the substrates W are transported in the substrate processing system 1. In the example of Figures 4 and 5, the operator sets the sequence in which the substrates W are transported: load port 21, chemical liquid tank 41, rinse liquid tank 42, immersion tank 51, second transfer table 54, liquid treatment device 62, drying device 63, and load port 21.

[0090] In step S63, the operator sets the batch setting unit 130. Specifically, the operator sets the processing conditions for the batch processing unit 4. In the examples of Figures 4 and 5, the operator sets the batch setting unit 130a that sets the processing conditions for the chemical liquid tank 41 and the batch setting unit 130b that sets the processing conditions for the rinse liquid tank 42.

[0091] In step S64, the operator sets the pure water setting unit 140. Specifically, the operator sets whether or not pure water is to be supplied by the pure water supply unit 80. In the examples of Fig. 4 and Fig. 5, the supply setting is set by the operator.

[0092] In step S65, the operator sets the single wafer setting unit 150. Specifically, the operator sets the processing conditions of the single wafer processing unit 6. In the examples of Figures 4 and 5, the operator sets the processing conditions of the liquid processing unit 62 and the processing conditions of the drying unit 63.

[0093] In step S66, the operator performs an operation to save the processing recipe 100, and the creation of the processing recipe 100 is completed.

[0094] 6, the case where steps S61, S62, S63, S64, and S65 are performed in this order has been described, but this is not limiting. Step S61 may also be performed midway between steps S62 and S65.

[0095] An example of a process for confirming the process recipe 100 (hereinafter referred to as a "recipe confirmation process") will be described with reference to Fig. 7. Fig. 7 is a flowchart showing an example of the recipe confirmation process. The recipe confirmation process shown in Fig. 7 is executed under the control of the control circuit 9.

[0096] In step S71, the control circuit 9 determines whether or not the process recipe 100 has been saved (step S66) in the recipe creation procedure of Fig. 6. If it is determined in step S71 that the process recipe 100 has been saved (YES in step S71), the control circuit 9 proceeds to step S72. If it is determined in step S71 that the process recipe 100 has not been saved (NO in step S71), the control circuit 9 returns the process to step S71.

[0097] In step S72, the control circuit 9 checks the consistency between the setting of the hydrophilic / hydrophobic setting unit 110 and the setting of the pure water setting unit 140. For example, as shown in Fig. 4, when the hydrophilic setting is set in the hydrophilic / hydrophobic setting unit 110 and the supply setting is set in the pure water setting unit 140, it is determined that the setting of the hydrophilic / hydrophobic setting unit 110 and the pure water setting unit 140 are consistent. For example, as shown in Fig. 5, when the hydrophobic setting is set in the hydrophilic / hydrophobic setting unit 110 and the supply setting is set in the pure water setting unit 140, it is determined that the setting of the hydrophilic / hydrophobic setting unit 110 and the pure water setting unit 140 are inconsistent.

[0098] If it is determined in step S72 that the setting of the hydrophilic / hydrophobic setting unit 110 is consistent with the setting of the pure water setting unit 140 (YES in step S72), the control circuit 9 proceeds to step S73. If it is determined in step S72 that the setting of the hydrophilic / hydrophobic setting unit 110 is not consistent with the setting of the pure water setting unit 140 (NO in step S72), the control circuit 9 proceeds to step S74.

[0099] In step S73, the control circuit 9 determines that the processing recipe 100 is valid, stores the processing recipe 100 in the storage unit 92, and ends the processing.

[0100] In step S74, the control circuit 9 determines that the processing recipe 100 is invalid, outputs an error signal, and ends the processing.

[0101] As described above, according to the embodiment, the control circuit 9 checks the consistency between the setting of the hydrophilic / hydrophobic setting unit 110 and the setting of the pure water setting unit 140. In this case, in the substrate processing system 1, it is possible to prevent a substrate W from being processed using a processing recipe 100 in which the setting of the hydrophilic / hydrophobic setting unit 110 is inconsistent with the setting of the pure water setting unit 140. This prevents the pure water supply unit 80 from supplying pure water to a substrate W having a hydrophobic upper surface. As a result, when a substrate W having a lyophobic upper surface is transported from the batch processing unit 4 to the single wafer processing unit 6, it is possible to prevent pure water from dripping from the substrate W, thereby suppressing a decrease in the operating rate of the substrate processing system 1.

[0102] Another example of the recipe confirmation process will be described with reference to Fig. 8. Fig. 8 is a flowchart showing another example of the recipe confirmation process. The recipe confirmation process shown in Fig. 8 is executed under the control of the control circuit 9.

[0103] In step S81, the control circuit 9 determines whether or not the process recipe 100 has been saved (step S66) in the recipe creation procedure of Fig. 6. If it is determined in step S81 that the process recipe 100 has been saved (YES in step S81), the control circuit 9 proceeds to step S82. If it is determined in step S81 that the process recipe 100 has not been saved (NO in step S81), the control circuit 9 returns the process to step S81.

[0104] In step S82, the control circuit 9 checks the consistency between the settings of the batch setting unit 130 and the pure water setting unit 140. For example, as shown in Fig. 4, if the batch setting unit 130a sets phosphoric acid aqueous solution as the chemical liquid to be stored in the chemical liquid tank 41 and the pure water setting unit 140 sets the supply setting, it is determined that the settings of the batch setting unit 130 and the pure water setting unit 140 are consistent. For example, as shown in Fig. 5, if the batch setting unit 130a sets DHF as the chemical liquid to be stored in the chemical liquid tank 41 and the pure water setting unit 140 sets the supply setting, it is determined that the settings of the batch setting unit 130 and the pure water setting unit 140 are inconsistent.

[0105] If it is determined in step S82 that the settings of the batch setting unit 130 and the pure water setting unit 140 are consistent with each other (YES in step S82), the control circuit 9 proceeds to step S83. If it is determined in step S82 that the settings of the batch setting unit 130 and the pure water setting unit 140 are not consistent with each other (NO in step S82), the control circuit 9 proceeds to step S84.

[0106] In step S83, the control circuit 9 determines that the processing recipe 100 is valid, stores the processing recipe 100 in the storage unit 92, and ends the processing.

[0107] In step S84, the control circuit 9 determines that the processing recipe 100 is invalid, outputs an error signal, and ends the processing.

[0108] As described above, according to the embodiment, the control circuit 9 checks the consistency between the settings of the batch setting unit 130 and the settings of the pure water setting unit 140. In this case, in the substrate processing system 1, it is possible to prevent a substrate W from being processed using a processing recipe 100 in which the settings of the batch setting unit 130 and the settings of the pure water setting unit 140 are inconsistent. This prevents the pure water supply unit 80 from supplying pure water to a substrate W having a hydrophobic upper surface. As a result, when a substrate W having a lyophobic upper surface is transported from the batch processing unit 4 to the single wafer processing unit 6, it is possible to prevent pure water from dripping from the substrate W, thereby suppressing a decrease in the operating rate of the substrate processing system 1.

[0109] 8 has been described as being for a case where there is one chemical tank 41, but if there are multiple chemical tanks 41, the control circuit 9 checks the consistency between the setting of the batch setting unit 130 associated with the chemical tank 41 in which the substrate W is to be treated last and the setting of the pure water setting unit 140. This is because the treatment in the last chemical tank 41 is likely to contribute to the surface condition of the substrate W.

[0110] 9 to 11, a second example of the procedure for creating the process recipe 100 will be described. Fig. 9 is a flowchart showing the recipe creation procedure according to the second example. The recipe creation procedure according to the second example differs from the recipe creation procedure according to the first example in that the control circuit 9 automatically sets the pure water setting unit 140 instead of the operator.

[0111] In step S91, the operator sets the hydrophilic / hydrophobic setting unit 110. Specifically, the operator sets the hydrophilic / hydrophobic setting for the process recipe 100. In the example of Fig. 4, the hydrophilic setting is set by the operator. In the example of Fig. 5, the hydrophobic setting is set by the operator.

[0112] In step S92, the operator sets the transport sequence setting unit 120. Specifically, the operator sets the sequence in which the substrates W are transported in the substrate processing system 1. In the example of Figures 4 and 5, the operator sets the sequence in which the substrates W are transported: load port 21, chemical liquid tank 41, rinse liquid tank 42, immersion tank 51, second transfer table 54, liquid treatment device 62, drying device 63, and load port 21.

[0113] In step S93, the operator sets the batch setting unit 130. Specifically, the operator sets the processing conditions for the batch processing unit 4. In the examples of Figures 4 and 5, the operator sets the batch setting unit 130a that sets the processing conditions for the chemical liquid tank 41 and the batch setting unit 130b that sets the processing conditions for the rinse liquid tank 42.

[0114] In step S94, the operator sets the single wafer setting unit 150. Specifically, the operator sets the processing conditions of the single wafer processing unit 6. In the example of Figures 4 and 5, the operator sets the processing conditions of the liquid processing unit 62 and the processing conditions of the drying unit 63.

[0115] In step S95, the operator performs an operation to save the processing recipe 100, and the creation of the processing recipe 100 is completed.

[0116] 9, the case where steps S91, S92, S93, and S94 are performed in this order has been described, but this is not limiting. Step S91 may also be performed midway between steps S92 and S94.

[0117] An example of the recipe confirmation process will be described with reference to Fig. 10. Fig. 10 is a flowchart showing an example of the recipe confirmation process. The recipe confirmation process shown in Fig. 10 is executed under the control of the control circuit 9.

[0118] In step S101, the control circuit 9 determines whether or not the process recipe 100 has been saved (step S95) in the recipe creation procedure of Fig. 9. If it is determined in step S101 that the process recipe 100 has been saved (YES in step S101), the control circuit 9 proceeds to step S102. If it is determined in step S101 that the process recipe 100 has not been saved (NO in step S101), the control circuit 9 returns the process to step S101.

[0119] In step S102, the control circuit 9 determines whether the setting of the hydrophilic / hydrophobic setting unit 110 is the lyophilic setting or the lyophobic setting. If it is determined in step S102 that the setting of the hydrophilic / hydrophobic setting unit 110 is the hydrophilic setting, the control circuit 9 proceeds to step S103. If it is determined in step S102 that the setting of the hydrophilic / hydrophobic setting unit 110 is the hydrophobic setting, the control circuit 9 proceeds to step S104.

[0120] In step S103, the control circuit 9 automatically sets the pure water setting unit 140 to the supply setting, and the process ends.

[0121] In step S104, the control circuit 9 automatically sets the pure water setting unit 140 to the non-supply setting, and the process ends.

[0122] As described above, according to the embodiment, the control circuit 9 automatically sets the pure water setting unit 140 in accordance with the setting of the hydrophilic / hydrophobic setting unit 110. In this case, in the substrate processing system 1, it is possible to prevent a substrate W from being processed using a processing recipe 100 in which the setting of the hydrophilic / hydrophobic setting unit 110 is inconsistent with the setting of the pure water setting unit 140. This prevents the pure water supply unit 80 from supplying pure water to a substrate W having a hydrophobic upper surface. As a result, when a substrate W having a lyophobic upper surface is transported from the batch processing unit 4 to the single wafer processing unit 6, it is possible to prevent pure water from dripping from the substrate W, thereby suppressing a decrease in the operating rate of the substrate processing system 1.

[0123] Another example of the recipe confirmation process will be described with reference to Fig. 11. Fig. 11 is a flowchart showing another example of the recipe confirmation process. The recipe confirmation process shown in Fig. 11 is executed under the control of the control circuit 9.

[0124] In step S111, the control circuit 9 determines whether or not the process recipe 100 has been saved (step S95) in the recipe creation procedure of Fig. 9. If it is determined in step S111 that the process recipe 100 has been saved (YES in step S111), the control circuit 9 proceeds to step S112. If it is determined in step S111 that the process recipe 100 has not been saved (NO in step S111), the control circuit 9 returns the process to step S111.

[0125] In step S112, the control circuit 9 determines whether the setting of the batch setting unit 130 is DHF. If it is determined in step S112 that the setting of the batch setting unit 130 is DHF (YES in step S112), the control circuit 9 proceeds to step S113. If it is determined in step S112 that the setting of the batch setting unit 130 is not DHF (NO in step S112), the control circuit 9 proceeds to step S114.

[0126] In step S113, the control circuit 9 automatically sets the pure water setting unit 140 to the non-supply setting, and the process ends.

[0127] In step S114, the control circuit 9 automatically sets the pure water setting unit 140 to the supply setting, and the process ends.

[0128] As described above, according to the embodiment, the control circuit 9 automatically sets the pure water setting unit 140 in accordance with the setting of the batch setting unit 130. In this case, in the substrate processing system 1, it is possible to prevent a substrate W from being processed using a processing recipe 100 in which the setting of the batch setting unit 130 is inconsistent with the setting of the pure water setting unit 140. This prevents the pure water supply unit 80 from supplying pure water to a substrate W having a hydrophobic upper surface. As a result, when a substrate W having a lyophobic upper surface is transported from the batch processing unit 4 to the single wafer processing unit 6, it is possible to prevent pure water from dripping from the substrate W, thereby suppressing a decrease in the operating rate of the substrate processing system 1.

[0129] 11 has been described as an example in which there is one chemical liquid tank 41, but if there are multiple chemical liquid tanks 41, the control circuit 9 sets the pure water setting unit 140 in accordance with the setting of the batch setting unit 130 associated with the chemical liquid tank 41 in which the substrate W is last to be processed. This is because the processing in the last chemical liquid tank 41 is likely to contribute to the surface condition of the substrate W.

[0130] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0131] In the above embodiment, the recipe confirmation process is performed by the control circuit 9 included in the substrate processing system 1, but the present disclosure is not limited to this. An information processing device provided separately from the substrate processing system 1 may also perform the recipe confirmation process.

[0132] This international application claims priority based on Japanese Patent Application No. 2024-109800, filed on July 8, 2024, the entire contents of which are incorporated herein by reference.

[0133] REFERENCE SIGNS LIST 1 substrate processing system 4 batch processing section 5 second interface section 6 single wafer processing section 9 control circuit 54 second transfer table 70 substrate holding section 80 pure water supply section 100 processing recipe 110 hydrophilic / hydrophobic setting section 140 pure water setting section W substrate

Claims

1. A substrate processing system comprising: a batch processing unit that processes a plurality of substrates at once; a single wafer processing unit that processes the substrates one by one; an interface unit that transfers the substrates from the batch processing unit to the single wafer processing unit; and a control circuit that checks a processing recipe, wherein the interface unit has a substrate holding unit that holds the substrate, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the processing recipe includes a lyophilic / lyophobic setting unit and a processing liquid setting unit, wherein the lyophilic / lyophobic setting unit has as setting items a lyophilic setting for processing a lyophilic substrate and a lyophobic setting for processing a lyophobic substrate, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the control circuit checks consistency between the setting of the lyophilic / lyophobic setting unit and the setting of the processing liquid setting unit.

2. The substrate processing system of claim 1, wherein the control circuit determines that there is an inconsistency between the setting of the lyophilic / lyophobic setting unit and the setting of the processing liquid setting unit when the lyophilic / lyophobic setting is set in the lyophilic / lyophobic setting unit and the supply setting is set in the processing liquid setting unit.

3. A substrate processing system comprising: a batch processing unit that processes a plurality of substrates at once; a single wafer processing unit that processes the substrates one by one; an interface unit that transfers the substrates from the batch processing unit to the single wafer processing unit; and a control circuit that checks a processing recipe, wherein the interface unit has a substrate holding unit that holds the substrates, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the batch processing unit has a chemical liquid tank in which the plurality of substrates are immersed for processing, the processing recipe includes a batch setting unit and a processing liquid setting unit, wherein the batch setting unit has as a setting item the type of chemical liquid to be stored in the chemical liquid tank, and the processing liquid setting unit has as setting items a supply setting that supplies the processing liquid and a non-supply setting that does not supply the processing liquid, and the control circuit checks consistency between the setting of the batch setting unit and the setting of the processing liquid setting unit.

4. The substrate processing system of claim 3, wherein the control circuit determines that there is an inconsistency between the setting of the batch setting unit and the setting of the processing liquid setting unit when the batch setting unit sets DHF as the type of chemical liquid stored in the chemical liquid tank and the supply setting is set in the processing liquid setting unit.

5. A substrate processing system comprising: a batch processing unit that processes a plurality of substrates collectively; a single wafer processing unit that processes the substrates one by one; an interface unit that transfers the substrates from the batch processing unit to the single wafer processing unit; and a control circuit that checks a processing recipe, wherein the interface unit has a substrate holding unit that holds the substrate, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the processing recipe includes a liquidphilic / lyophobic setting unit and a processing liquid setting unit, wherein the liquidphilic / lyophobic setting unit has as setting items a liquidphilic setting for processing a liquidphilic substrate and a liquidphobic setting for processing a liquidphobic substrate, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the control circuit automatically sets the processing liquid setting unit in accordance with the setting of the liquidphilic / lyophobic setting unit.

6. The substrate processing system according to claim 5, wherein the control circuit sets the non-supply setting in the processing liquid setting section when the lyophilic / lyophobic setting is set in the lyophilic / lyophobic setting section.

7. A substrate processing system comprising: a batch processing unit that processes a plurality of substrates collectively; a single wafer processing unit that processes the substrates one by one; an interface unit that transfers the substrates from the batch processing unit to the single wafer processing unit; and a control circuit that checks a processing recipe, wherein the interface unit has a substrate holding unit that holds the substrates, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the batch processing unit has a chemical liquid tank in which the plurality of substrates are immersed for processing, the processing recipe includes a batch setting unit and a processing liquid setting unit, wherein the batch setting unit has as a setting item the type of chemical liquid to be stored in the chemical liquid tank, and the processing liquid setting unit has as setting items a supply setting that supplies the processing liquid and a non-supply setting that does not supply the processing liquid, and the control circuit automatically sets the processing liquid setting unit in accordance with the setting of the batch setting unit.

8. The substrate processing system according to claim 7, wherein the control circuit sets the non-supply setting in the processing liquid setting unit when DHF is set in the batch setting unit as the type of chemical liquid to be stored in the chemical liquid tank.

9. The substrate processing system according to any one of claims 1 to 8, wherein the processing recipe includes a single wafer setting unit having processing conditions for the single wafer processing unit as setting items, and the single wafer setting unit includes the processing liquid setting unit.

10. The substrate processing system according to any one of claims 1 to 8, wherein the processing liquid is pure water.

11. An information processing device that checks a processing recipe used in a substrate processing system that includes a batch processing unit that processes multiple substrates collectively, a single wafer processing unit that processes the substrates one by one, and an interface unit that transfers the substrates from the batch processing unit to the single wafer processing unit, wherein the interface unit has a substrate holding unit that holds the substrate, and a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the processing recipe includes a lyophilic / lyophobic setting unit and a processing liquid setting unit, the lyophilic / lyophobic setting unit has as setting items a lyophilic setting for processing a lyophilic substrate and a lyophobic setting for processing a lyophobic substrate, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the information processing device checks consistency between the setting of the lyophilic / lyophobic setting unit and the setting of the processing liquid setting unit.

12. The information processing device according to claim 11, wherein when the lyophilic / lyophobic setting is set in the lyophilic / lyophobic setting unit and the supply setting is set in the processing liquid setting unit, the information processing device determines that there is no consistency between the setting of the lyophilic / lyophobic setting unit and the setting of the processing liquid setting unit.

13. An information processing device for checking a processing recipe used in a substrate processing system comprising a batch processing unit for processing multiple substrates collectively, a single wafer processing unit for processing the substrates one by one, and an interface unit for transferring the substrates from the batch processing unit to the single wafer processing unit, wherein the interface unit comprises a substrate holding unit for holding the substrates, and a processing liquid supply unit for supplying a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the batch processing unit has a chemical liquid tank for immersing the multiple substrates for processing, the processing recipe comprises a batch setting unit and a processing liquid setting unit, the batch setting unit has as a setting item the type of chemical liquid stored in the chemical liquid tank, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the information processing device checks consistency between the setting of the batch setting unit and the setting of the processing liquid setting unit.

14. The information processing device according to claim 13, wherein when the batch setting unit sets DHF as the type of chemical liquid to be stored in the chemical liquid tank and the supply setting is set in the processing liquid setting unit, the information processing device determines that there is an inconsistency between the setting of the batch setting unit and the setting of the processing liquid setting unit.

15. An information processing device for checking a processing recipe used in a substrate processing system comprising a batch processing section for processing a plurality of substrates collectively, a single wafer processing section for processing the substrates one by one, and an interface section for transferring the substrates from the batch processing section to the single wafer processing section, wherein the interface section has a substrate holding section for holding the substrate, and a processing liquid supply section for supplying a processing liquid to an upper surface of the substrate held by the substrate holding section to prevent the upper surface from drying, the processing recipe includes a lyophilic / lyophobic setting section and a processing liquid setting section, the lyophilic / lyophobic setting section having setting items of a lyophilic setting for processing a lyophilic substrate and a lyophobic setting for processing a lyophobic substrate, and the processing liquid setting section having setting items of a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the information processing device automatically sets the processing liquid setting section in accordance with the setting of the lyophilic / lyophobic setting section.

16. The information processing apparatus according to claim 15, wherein when the lyophilic / lyophobic setting is set by the lyophilic / lyophobic setting section, the information processing apparatus sets the non-supply setting by the processing liquid setting section.

17. An information processing device for checking a processing recipe used in a substrate processing system comprising a batch processing unit for processing multiple substrates collectively, a single wafer processing unit for processing the substrates one by one, and an interface unit for transferring the substrates from the batch processing unit to the single wafer processing unit, wherein the interface unit comprises a substrate holding unit for holding the substrates, and a processing liquid supply unit for supplying a processing liquid to an upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, the batch processing unit has a chemical liquid tank for immersing the multiple substrates in processing, the processing recipe comprises a batch setting unit and a processing liquid setting unit, the batch setting unit has as a setting item the type of chemical liquid stored in the chemical liquid tank, and the processing liquid setting unit has as setting items a supply setting for supplying the processing liquid and a non-supply setting for not supplying the processing liquid, and the information processing device automatically sets the processing liquid setting unit in accordance with the setting of the batch setting unit.

18. The information processing device according to claim 17, wherein when the batch setting section sets DHF as the type of chemical liquid to be stored in the chemical liquid tank, the non-supply setting is set by the processing liquid setting section.

19. An information processing apparatus according to any one of claims 11 to 18, wherein the processing recipe includes a single wafer setting section having processing conditions for the single wafer processing section as setting items, and the single wafer setting section includes the processing liquid setting section.

20. The information processing device according to any one of claims 11 to 18, wherein the processing liquid is pure water.

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