Adhesive tape for electronic component processing and production method for electronic component

The adhesive tape for electronic components addresses the issue of substrate cutting during water jet laser dicing by using a porous substrate with controlled laser absorption, ensuring high yield and quality through reduced laser absorption.

WO2026014030A1PCT designated stage Publication Date: 2026-01-15DAI NIPPON PRINTING CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
PCT/JP2025/016496
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-08
Filing Date
2025-05-01
Publication Date
2026-01-15

AI Technical Summary

Technical Problem

Conventional adhesive tapes for electronic components used in water jet laser dicing are prone to cutting or brittleness due to high laser absorption, especially when short-wavelength lasers are employed, which compromises the integrity and yield of the dicing process.

Method used

An adhesive tape with a porous substrate having a non-opening portion absorption coefficient of 30 cm⁻¹ or less for a predetermined laser wavelength, utilizing laser-transmitting materials and minimizing laser-absorbing materials to reduce laser absorption and prevent cutting during water jet laser processing.

Benefits of technology

The adhesive tape effectively suppresses substrate cutting during water jet laser processing, ensuring higher yield and quality by maintaining the integrity of the porous substrate, even with short-wavelength lasers.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure JP2025016496_15012026_PF_FP_ABST
    Figure JP2025016496_15012026_PF_FP_ABST
Patent Text Reader

Abstract

The present disclosure provides an adhesive tape for electronic component processing that includes a porous base material and an adhesive layer that is provided on a first surface of the porous base material. At non-opening portions of the porous base material, the absorption coefficient for the wavelength of a prescribed laser is no more than 30 cm-1.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Adhesive tape for fixing semiconductor wafer

    JP2005167042A

  • Adhesive sheet for water jet laser dicing

    JP2008117943A

  • Adhesive sheet for water jet laser dicing

    JP2008270505A

  • Semiconductor element manufacturing method

    JP2009164502A

  • Adhesive tape for laser dicing

    JP2023063640A