Electronic device

Abstract

This electronic device comprises: a support plate including a first surface, a second surface opposite to the first surface, and an opening formed in the second surface; a display at least partially supported by the first surface of the support plate; a battery at least partially supported by the second surface of the support plate and including a top surface facing the second surface of the support plate; a heat diffusion member arranged between the display and the battery such that at least a portion thereof is accommodated in the opening of the support plate; a wrapping member surrounding at least a portion of the battery and including a first wrapping portion adhered to the battery and a second wrapping portion not adhered to the battery; and an adhesive member adhering at least a portion of the heat diffusion member to a first area of the second wrapping portion.

Description

electronic devices

[0001] The present disclosure relates to an electronic device.

[0002] The electronic device may include a housing, a display, a battery, and a heat spreading member.

[0003] The housing can be formed to accommodate and support the display, the battery, and the heat spreading member.

[0004] The battery and heat dissipation member can be fixed to the housing.

[0005] An electronic device according to one or more embodiments of the present disclosure may include a support plate including a first surface, a second surface opposite the first surface, and an opening formed to penetrate the first surface and the second surface; a display supported at least in part by the first surface of the support plate; a battery supported at least in part by the second surface of the support plate and including an upper surface facing the second surface of the support plate; a heat spreading member disposed between the display and the battery such that at least a portion thereof is received in the opening of the support plate; a wrapping member surrounding at least a portion of the battery, the wrapping member including a first wrapping portion adhered to the battery and a second wrapping portion not adhered to the battery; and an adhesive member adhering at least a portion of the heat spreading member to a first area of ​​the second wrapping portion.

[0006] An electronic device according to one or more embodiments of the present disclosure may include: a support plate including a first surface, a second surface opposite the first surface, and an opening formed between the first surface and the second surface; a display supported at least in part by the first surface of the support plate; a battery including an upper surface facing the second surface of the support plate, the upper surface being supported at least in part by the second surface of the support plate; a heat spreading member disposed between the display and the battery such that at least a portion thereof is received in the opening of the support plate; a wrapping member surrounding at least a portion of the battery, the wrapping member including a first wrapping portion adhered to the battery and a second wrapping portion spaced apart from the upper surface of the battery; and an adhesive member adhering the at least a portion of the heat spreading member to a first area of ​​the second wrapping portion.

[0007] The above-described and other aspects, features, and advantages of the embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings. In the accompanying drawings:

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one or more embodiments of the present disclosure.

[0009] FIG. 2 is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0010] FIG. 3 is an exploded perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0011] FIG. 4 is a rear view of an electronic device according to one or more embodiments of the present disclosure.

[0012] FIG. 5 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0013] Fig. 6 is a rear view showing the electronic device of Fig. 5 with the battery removed.

[0014] FIG. 7 is a drawing for explaining the dimensional relationship of an electronic device according to one or more embodiments of the present disclosure.

[0015] FIG. 8 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0016] FIG. 9 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure subjected to a 45 degree rearward drop test.

[0017] FIG. 10 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure performing a bottom surface drop test.

[0018] FIG. 11 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure performing a drop test.

[0019] FIG. 12 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0020] FIG. 13 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0021] FIG. 14 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0022] FIG. 15 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0023] FIG. 16 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0024] FIG. 17 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0025] FIG. 18 is a diagram illustrating an electronic device according to one or more embodiments of the present disclosure.

[0026] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (130), a memory (120), an input module (150), an audio output module (140), a display module (140), an audio module (181), a sensor module (182), an interface (185), a connection terminal (186), a haptic module (183), a camera module (184), a power management module (172), a battery (171), a communication module (110), a subscriber identification module (187), or an antenna module (188). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (186)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (182), the camera module (184), or the antenna module (188)) may be integrated into one component (e.g., the display module (140)).

[0027] The processor (130) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (130) by executing, for example, software (e.g., a program (190)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (130) may store a command or data received from another component (e.g., a sensor module (182) or a communication module (110)) in a volatile memory (121), process the command or data stored in the volatile memory (121), and store the resulting data in a non-volatile memory (122). According to one embodiment, the processor (130) may include a main processor (131) (e.g., a central processing unit or an application processor) or a secondary processor (132) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (131) and a secondary processor (132), the secondary processor (132) may be configured to use less power than the main processor (131) or to be specialized for a specified function. The secondary processor (132) may be implemented separately from the main processor (131) or as a part thereof.

[0028] The auxiliary processor (132) may control at least a part of functions or states associated with at least one component (e.g., a display module (140), a sensor module (182), or a communication module (110)) of the electronic device (101), for example, on behalf of the main processor (131) while the main processor (131) is in an inactive (e.g., sleep) state, or together with the main processor (131) while the main processor (131) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (132) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (184) or a communication module (110)). In one embodiment, the auxiliary processor (132) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0029] The memory (120) can store various data used by at least one component (e.g., a processor (130) or a sensor module (182)) of the electronic device (101). The data can include, for example, software (e.g., a program (190)) and input data or output data for commands related thereto. The memory (120) can include a volatile memory (121) or a non-volatile memory (122).

[0030] The program (190) may be stored as software in the memory (120) and may include, for example, an operating system (193), middleware (192), or an application (191).

[0031] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (130)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The audio output module (160) can output audio signals to the outside of the electronic device (101). The audio output module (160) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0033] The display module (140) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (140) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (140) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0034] The audio module (181) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (181) can acquire sound through an input module (150), output sound through an audio output module (160), or an external electronic device (101) (e.g., an electronic device (102)) (e.g., a speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0035] The sensor module (182) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (182) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (185) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (101) (e.g., the electronic device (102)). In one embodiment, the interface (185) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (186) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (101) (e.g., the electronic device (102)). According to one embodiment, the connection terminal (186) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (183) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (183) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0039] The camera module (184) can capture still images and videos. According to one embodiment, the camera module (184) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (172) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (172) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0041] A battery (171) may power at least one component of the electronic device (101). In one embodiment, the battery (171) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (110) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (101) (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (110) may operate independently from the processor (130) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (110) may include a wireless communication module (1101) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1102) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1101) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (187).

[0043] The wireless communication module (1101) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1101) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1101) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1101) can support various requirements specified in the electronic device (101), the external electronic device (101) (e.g., the electronic device (104)), or the network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (1101) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0044] The antenna module (188) can transmit or receive signals or power to or from the outside (e.g., an external electronic device (101)). According to one embodiment, the antenna module (188) may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (188) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (110). A signal or power may be transmitted or received between the communication module (110) and the external electronic device (101) through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (188).

[0045] According to various embodiments, the antenna module (188) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0046] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (101) among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices (101) to perform the function or at least a part of the service instead of executing the function or service by itself or in addition. One or more external electronic devices (101) that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (104) or server (108) may be included in the second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] The electronic device (101) according to various embodiments disclosed in this document may be a device of various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device (101) according to the embodiments of this document is not limited to the aforementioned devices.

[0049] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. The various embodiments disclosed in this document and their features may be combined in various ways except in cases of incompatibility. The features of the embodiments may be rearranged, omitted, or additional features introduced without departing from the scope of the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0050] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0051] Various embodiments of the present document may be implemented as software (e.g., a program (190)) including one or more commands stored in a storage medium (e.g., an internal memory or an external memory) that can be read by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (130)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0052] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). 쪠 ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0053] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0054] FIG. 2 is a perspective view of an electronic device (101) according to one or more embodiments of the present disclosure. FIG. 3 is an exploded perspective view of an electronic device (101) according to one or more embodiments of the present disclosure. FIG. 4 is a rear view of an electronic device (101) according to one or more embodiments of the present disclosure.

[0055] Referring to FIGS. 2, 3, and 4, an electronic device (101) according to one or more embodiments of the present disclosure may include a housing (10) and a display (90).

[0056] The housing (10) defines a portion of the outer surface of the electronic device (101) and may include a space therein for accommodating and protecting electronic components.

[0057] For example, the housing (10) can be formed in a roughly rectangular shape.

[0058] According to one embodiment, the housing (10) may include a support plate (11) and a side member (12) surrounding the periphery of the support plate (11).

[0059] According to one embodiment, the support plate (11) may include a first side (111) and a second side (112) opposite to the first side (111). For example, the support plate (11) may include an opening (113). The opening (113) may be formed to penetrate the first side (111) and the second side (112), and the opening (113) may form a window penetrating the support plate (11) from the first side (111) to the second side (112) or vice versa. Furthermore, the opening / window (113) may be referred to as a through hole or an aperture. The window may be hollow or may include a component and / or a material. For example, the opening (113) may have a stepped structure. For example, the opening (113) may include a first wide portion that does not extend completely through the support plate (11) and a second narrow portion that is connected to the first wide portion and extends completely through the support plate (11). As another example, the first wide portion may not be a part of the opening (113) and may be considered a feature of the first face (111) (or the second face (112)), such that the first face (111) (or the second face (112)) may have a stepped structure around the perimeter of the opening (113).

[0060] According to one embodiment, the display (90) may be positioned on the front of the electronic device (101). For example, the display (90) may be supported at least in part by the first surface (111) of the support plate (11). Support of the display (90) may be provided by direct contact or adhesion with the first surface (111) of the support plate (11), or indirectly by at least one intermediate element.

[0061] According to one embodiment, the display (90) may be formed to visually transmit information to the outside of the electronic device (101). For example, the display (90) may be formed to output an image. For example, the display (90) may include a touch sheet, a polarizing sheet, a first adhesive layer between the touch sheet and the polarizing sheet, a display layer, an electromagnetic induction panel (e.g., a digitizer), and / or a heat dissipation sheet. For example, the display (90) may include a second adhesive layer installed in front of the touch sheet, or a printed circuit board, etc.

[0062] According to one embodiment, a window may be installed on the front of the display (90). The window may be formed of a transparent material, allowing a user to view the display (90) through the window. The transparent material of the window may be used to protect the display (90).

[0063] According to one embodiment, a heat spreading member (20) (or heat dissipation / sink member / element) may be partially or fully disposed between the support plate (11) and the display (90). At least a portion (23) of the heat spreading member (20) (see FIG. 5) may be accommodated in an opening (113) (see FIG. 5) of the support plate (11). The heat spreading member (20) may be supported by a first face (111) (see FIG. 5) of the support plate (11). For example, the remaining portion (24) (see FIG. 5) of the heat spreading member (20) that is not accommodated in the opening (113) may be supported by the first face (111) of the support plate (11). The heat spreading member (20) may be supported by the first face (111) of the support plate (11) in which the opening (113) is formed. For example, as illustrated in FIG. 5, the remaining portion (24) of the heat spreading member (20) may be supported by the lower portion of the step structure of the first surface (111) (i.e., the portion of the first surface (111) corresponding to the first wide portion of the opening (113).

[0064] According to one embodiment, the heat diffusion member (20) can be attached to the first side (111) of the support plate (11). The heat diffusion member (20) can be attached to the first side (111) of the support plate (11) by various methods. For example, the heat diffusion member (20) can be attached to the first side (111) of the support plate (11) by a double-sided tape (25).

[0065] According to one embodiment, referring to FIG. 3, the heat spreading member (20) may include a first heat spreading portion (21) and a second heat spreading portion (22). The first heat spreading portion (21) may be spaced apart from the second heat spreading portion (22). For example, when viewed from the top of the display (90), the first heat spreading portion (21) may be arranged to overlap the processor (130). For example, the first heat spreading portion (21) may be arranged above the processor (130) in the +Z-axis direction. When viewed from the top of the display (90), the second heat spreading portion (22) may be arranged to overlap the battery (30) (e.g., the battery (171) of FIG. 1) on one side (e.g., in the -Y-axis direction) of the first heat spreading portion (21). For example, the second heat diffusion portion (22) may be placed on the upper side of the battery (30) in the +Z-axis direction so that their footprints overlap each other.

[0066] According to one embodiment, the second heat spreading portion (22) may include at least a portion (23) accommodated within an opening (113) of the support plate (11).

[0067] According to one embodiment, the electronic device (101) may further include a heat transfer member (70). The heat transfer member (70) may be disposed between the display (90) and the support plate (11). For example, a portion of the heat transfer member (70) may overlap a heat diffusion member (20) installed on a first surface (111) of the support plate (11). For example, a portion of the heat transfer member (70) may be in contact with the heat diffusion member (20).

[0068] According to one embodiment, the heat transfer member (70) may be formed so as to transfer heat generated from the electronic component to the heat diffusion member (20). For example, the heat transfer member (70) may be formed so as to transfer heat generated from the processor (130) controlling the electronic device (101) to the heat diffusion member (20).

[0069] According to one embodiment, the heat transfer member (70) may be formed of graphite. However, this is merely an example, and the heat transfer member (70) is not limited thereto. The heat transfer member (70) may be formed of various materials as long as it can transfer heat generated from the electronic component to the heat diffusion member (20).

[0070] According to one embodiment, the electronic device (101) may include a lower cover (80). The lower cover (80) may be formed to cover the lower side of the housing (10). A camera module (184) may be positioned in the lower cover (80). The camera module (184) is accommodated in the housing (10), and a portion of the camera module (184) may be exposed to the outside through the lower cover (80).

[0071] According to one embodiment, the electronic device (101) may include a battery (30). For example, the battery (30) may be installed on the second side (112) of the support plate (11). The battery (30) may be positioned between the support plate (11) and the lower cover (80). The battery (30) may be attached to the second side (112) of the support plate (11).

[0072] According to one embodiment, the interior of the housing (10) may accommodate a printed circuit board and a connector installed on the printed circuit board. For example, the printed circuit board may include a flexible printed circuit board. For example, the connector may include a flexible printed circuit board connector.

[0073] According to one embodiment, a processor (130) controlling an electronic device (101) may be disposed on a printed circuit board. For example, the processor (130) may control a display (90), a camera module (184), or the like.

[0074] Hereinafter, with reference to FIGS. 5 and 6, the arrangement of the support plate (11), the heat diffusion member (20), or the battery (30) of the electronic device (101) according to one or more embodiments of the present disclosure will be described in detail.

[0075] FIG. 5 is a diagram illustrating an electronic device (101) according to one or more embodiments of the present disclosure. FIG. 6 is a rear view illustrating the electronic device (101) of FIG. 5 with the battery (30) separated.

[0076] Referring to FIG. 5, an electronic device (101) according to one or more embodiments of the present disclosure may include a support plate (11), a heat spreading member (20), and a battery (30). For reference, FIG. 5 shows a cross-sectional view taken along line AA of FIG. 4 with the display (90) and the lower cover (80) removed.

[0077] According to one embodiment, the support plate (11) may include a first side (111) and a second side (112). The second side (112) may be formed to be opposite to the first side (111). For example, the support plate (11) may include an opening (113). The opening (113) may be formed to penetrate the first side (111) and the second side (112), for example, at approximately the center of the support plate (11).

[0078] A display (90) may be placed on the first side (111) of the support plate (11). A battery (30) may be placed on the second side (112) of the support plate (11).

[0079] A heat diffusion member (20) may be installed on a first surface (111) of a support plate (11). The heat diffusion member (20) may be disposed between the display (90) and the support plate (11). At least a portion (23) of the heat diffusion member (20) may be accommodated in an opening (113) of the support plate (11). For example, at least a portion (23) of the heat diffusion member (20) may protrude into the opening (113). At least a portion (23) of the heat diffusion member (20) protruding into the opening (113) is referred to as a protrusion. The lower surface of the protrusion (23) may not protrude lower than the second surface (112) of the support plate (11). For example, a constant gap (G) may exist between the lower surface of the protrusion (23) and the second surface (112) of the support plate (11).

[0080] The heat diffusion member (20) may be supported by the first surface (111) of the support plate (11). For example, a portion (24) of the heat diffusion member (20) that is not accommodated in the opening (113) may be supported by the first surface (111) of the support plate (11). Hereinafter, the portion (24) of the heat diffusion member (20) that is not accommodated in the opening (113) is referred to as a support portion.

[0081] According to one embodiment, the support (24) of the heat diffusion member (20) may be provided around the protrusion (23).

[0082] According to one embodiment, the heat diffusion member (20) may be formed as a vapor chamber. However, the heat diffusion member (20) is not limited thereto. The heat diffusion member (20) may be formed in various structures as long as it is capable of diffusing heat.

[0083] The heat diffusion member (20) can be attached to the first surface (111) of the support plate (11). For example, the support portion (24) of the heat diffusion member (20) that is not accommodated in the opening (113) can be attached to the first surface (111) of the support plate (11). The support portion (24) of the heat diffusion member (20) can be attached to the first surface (111) of the support plate (11) by various methods. For example, the support portion (24) of the heat diffusion member (20) can be attached to the first surface (111) of the support plate (11) by a double-sided tape (25).

[0084] In one embodiment, the battery (30) may be disposed below the support plate (11). For example, the battery (30) may be disposed on the second surface (112) of the support plate (11). The battery (30) may be supported at least in part by the second surface (112) of the support plate (11). For example, support of the battery (30) may be provided by an intermediate material so that the battery (30) does not come into direct contact with the second surface (112).

[0085] According to one embodiment, when the battery (30) is placed on the second surface (112) of the support plate (11), the upper surface (31) of the battery (30) may be spaced apart from the protrusion (23) of the heat diffusion member (20) installed in the opening (13) of the support plate (11) by a certain distance (G2). Accordingly, when the battery (30) is placed on the second surface (112) of the support plate (11), a space (S) surrounded by the support plate (11) may be formed below the protrusion (23) of the heat diffusion member (20) installed in the opening (113) of the support plate (11).

[0086] According to one embodiment, the battery (30) may be formed in a roughly rectangular parallelepiped shape. For example, the battery (30) may include an upper surface (31), a lower surface (32), and side surfaces. The upper surface (31) of the battery (30) may face the second surface (112) of the support plate (11). The lower surface (32) of the battery (30) may be formed to be opposite to the upper surface (31). The side surfaces of the battery (30) may be formed to connect the upper surface (31) and the lower surface (32) of the battery (30). For example, the side surfaces of the battery (30) may include four side surfaces, namely, a first side surface, a second side surface, a third side surface, and a fourth side surface. The first side surface and the third side surface may be formed to face each other, and the second side surface and the fourth side surface may be formed to face each other. For example, the first side surface and the third side surface may be formed to have a longer length than the second side surface and the fourth side surface.

[0087] According to one embodiment, a wrapping member (40) may be arranged on the outer surface of the battery (30). The wrapping member (40) may be formed so as to separate the battery (30) from the support plate (11).

[0088] According to one embodiment, the wrapping member (40) may be formed in a thin film shape. For example, the wrapping member (40) may be formed as a film having a thickness (t) of about 0.02 mm. The wrapping member (40) may be formed of a plastic material such as polyethylene (PE).

[0089] According to one embodiment, the wrapping member (40) may be installed to surround at least a portion of the battery (30). For example, the wrapping member (40) may be installed to surround the upper surface (31), the first side (33), the third side (34), and the lower surface (32) of the battery (30). In the embodiment of FIG. 5, the wrapping member (40) may be installed to surround a portion of the lower surface (32), the first side (33), the upper surface (31), and the third side (34). For example, both ends of the wrapping member (40) may be arranged to surround the left and right portions of the lower surface (32) of the battery (30). For example, the central portion between the left and right portions of the lower surface (32) of the battery (30) may not have the wrapping member (40) arranged therein.

[0090] However, the method of installing the wrapping member (40) is not limited thereto. The wrapping member (40) may be arranged in various ways as long as it can separate the battery (30) from the support plate (11). For example, the wrapping member (40) may be arranged to surround the entire outer circumference of the battery (30).

[0091] According to one embodiment, the wrapping member (40) may include a first region (421), a second region (422), a third region (423), and a fourth region (424). For example, the first region (421) of the wrapping member (40) may be positioned on or adjacent to (i.e., with a gap) the upper surface (31) of the battery (30) and may face the opening (113) of the support plate (11). The second region (422) may be positioned on the upper surface (31) of the battery (30) and may not overlap the opening (113) of the support plate (11). The third region (423) may be positioned on a side surface of the battery (30). For example, the third region (423) may surround the first side surface (33) and the third side surface (34) of the battery (30). The fourth region (424) may be located on the lower surface (32) of the battery (30). For example, the fourth region (424) may surround the left and right portions of the lower surface (32) of the battery (30).

[0092] According to one embodiment, the wrapping member (40) may include a first wrapping portion (41) that is adhered to the battery (30) and a second wrapping portion (42) (e.g., a first region (421)) that is not adhered to the battery (30).

[0093] According to one embodiment, the first wrapping portion (41) may adhere the wrapping member (40) to the battery (30) so that the wrapping member (40) is not completely separated from the battery (30). The first wrapping portion (41) may be located on the lower surface (32) of the battery (30). Accordingly, the fourth region (424) of the wrapping member (40) may form the first wrapping portion (41).

[0094] The first wrapping portion (41) can be bonded to the lower surface (32) of the battery (30) using a wrapping adhesive (411). Various adhesives can be used as the wrapping adhesive (411). For example, a double-sided tape can be used as the wrapping adhesive (411).

[0095] In the embodiment of FIG. 5, the first wrapping portion (41) may be positioned on the left and right sides of the lower surface (32) of the battery (30). The left side of the first wrapping portion (41) may be attached to the left side of the lower surface (32) of the battery (30) by wrapping adhesive (411). The right side of the first wrapping portion (41) may be attached to the right side of the lower surface (32) of the battery (30) by wrapping adhesive (411).

[0096] The second wrapping portion (42) may be a portion of the wrapping member (40) that wraps the upper surface (31) and the side surface of the battery (30). For example, the second wrapping portion (42) may wrap the upper surface (31), the first side surface (33), and the third side surface (34) of the battery (30). Accordingly, the first region (421), the second region (422), and the third region (433) of the wrapping member (40) may form the second wrapping portion (42).

[0097] For example, there may be no adhesive between the second wrapping portion (42) and the battery (30). In one embodiment, a wrapping adhesive (not shown) having a weaker adhesive strength than the wrapping adhesive (411) may be placed between the second wrapping portion (42) and the battery (30).

[0098] According to one embodiment, the battery (30) can be attached (e.g., suspended) to the heat diffusion member (20) by a wrapping member (40) and an adhesive member (50). The adhesive member (50) can be positioned between the upper surface (31) of the battery (30) and the heat diffusion member (20). For example, the adhesive member (50) can be positioned between the wrapping member (40) and the heat diffusion member (20). The adhesive member (50) can be formed in a flat shape, for example. For example, a double-sided tape can be used as the adhesive member (50).

[0099] According to one embodiment, the adhesive member (50) may be formed of a plurality of adhesive portions. For example, as illustrated in FIG. 6, the adhesive member (50) may include a first adhesive portion (51) and a second adhesive portion (52) that are spaced apart from each other. The second adhesive portion (52) may be spaced apart from the first adhesive portion (51) in a direction substantially parallel to the support plate (11). Since the support plate (11) is arranged substantially parallel to the display (90), the first adhesive portion (51) and the second adhesive portion (52) may be spaced apart from each other in a direction substantially parallel to the display (90).

[0100] According to one embodiment, since the battery (30) is surrounded by the wrapping member (40), the adhesive member (50) can attach the wrapping member (40) to a portion of the heat diffusion member (20), for example, to the lower surface of the protrusion (23). The adhesive member (50) can be attached to the second wrapping portion (42) of the wrapping member (40). A portion of the second wrapping portion (42) where the adhesive member (50) is disposed is referred to as a first region (421). Accordingly, the adhesive member (50) can attach the first region (421) of the second wrapping portion (42) to at least a portion of the heat diffusion member (20).

[0101] According to one embodiment, when the heat diffusion member (20) and the battery (30) are pressed during the assembly process, the first area (421) of the second wrapping portion (42) can be attached to the lower surface of the heat diffusion member (20) by the adhesive member (50).

[0102] According to one embodiment, when the adhesive member (50) is placed on the protrusion (23) of the heat diffusion member (20), the lower surface of the adhesive member (50) may not protrude lower than the second surface (112) of the support plate (11). For example, a gap may exist between the lower surface of the adhesive member (50) and the second surface (112) of the support plate (11). For example, the thickness (T) of the adhesive member (50) may be smaller than the gap (G) between the protrusion (23) of the heat diffusion member (20) and the second surface (112) of the support plate (11).

[0103] According to one embodiment, the adhesive member (50) may be thicker than the thickness (t) of the wrapping member (40). For example, the thickness (T) of the adhesive member (50) may be about 0.05 mm.

[0104] According to one embodiment, when the second wrapping portion (42) of the wrapping member (40) is bonded to the heat spreading member (20) with the adhesive member (50), at least a portion of the second wrapping portion (42) may be spaced apart from the upper surface (31) of the battery (30). For example, the upper surface of the first region (421) of the second wrapping portion (42) may be positioned closer to the first surface (111) than to the second surface (112) of the support plate (11).

[0105] According to one embodiment, a portion of the battery (30) may be attached to the second surface (112) of the support plate (11). For example, a portion of the battery (30) that does not overlap the opening (113) of the support plate (11) may be attached to the second surface (112) of the support plate (11). Since the attachment of the battery (30) is accomplished by the second area (422) of the wrapping member (40), the upper surface (31) of the battery (30) may not directly contact the second surface (112) of the support plate (11).

[0106] According to one embodiment, the battery (30) can be attached to the second surface (112) of the support plate (11) by a sub-adhesive member (60). For example, the sub-adhesive member (60) can be positioned between the upper surface (31) of the battery (30) and the second surface (112) of the support plate (11). The sub-adhesive member (60) can be positioned between the second area (422) of the wrapping member (40) and the second surface (112) of the support plate (11), thereby attaching the second area (422) to the second surface (112).

[0107] Referring to FIG. 6, in one embodiment, the sub-adhesive member (60) may be disposed around the perimeter of the opening (113) of the support plate (11). For example, the sub-adhesive member (60) may be disposed to surround three sides of the opening (113). Accordingly, the sub-adhesive member (60) may be disposed around the perimeter of the adhesive member (50) disposed on the heat diffusion member (20) accommodated in the opening (113) of the support plate (11).

[0108] For example, a double-sided tape may be used as the sub-adhesive member (60). For example, the thickness of the sub-adhesive member (60) may be thinner than the thickness (T) of the adhesive member (50). Alternatively, the thickness of the sub-adhesive member (60) may be approximately the same as the thickness (T) of the adhesive member (50). For example, the sub-adhesive member (60) may be formed in a narrow strip shape.

[0109] Since the battery (30) is surrounded by the wrapping member (40), the sub-adhesive member (60) can attach the wrapping member (40) to the second surface (112) of the support plate (11). The sub-adhesive member (60) can be attached to the second area (422) of the wrapping member (40).

[0110] For example, a portion of the second wrapping portion (42) where the sub-adhesive member (60) is disposed may be referred to as a second region (422). In one embodiment, the second region (422) of the wrapping member (40) may not overlap with the opening (113) of the support plate (11). For example, the second region (422) of the wrapping member (40) may not face the opening (113) of the support plate (11). Accordingly, the sub-adhesive member (60) may adhere the second region (422) of the wrapping member (40) to a portion of the second surface (112) of the support plate (11).

[0111] For example, the second area (422) of the wrapping member (40) where the sub-adhesive member (60) is placed may be located around the first area (421) where the adhesive member (50) is installed.

[0112] According to one embodiment, the thickness (T) of the adhesive member (50) may be smaller than the gap (G1) between the lower surface of the protrusion (23) of the heat spreading member (20) and the second area (422) of the second wrapping portion (42) of the wrapping member (40) covering the upper surface (31) of the battery (30). For example, the thickness (T) of the adhesive member (50) may be smaller than a value obtained by subtracting the thickness (t) of the wrapping member (40) from the distance (G2) between the heat spreading member (20) and the upper surface (31) of the battery (30).

[0113] For example, the gap (G1) between the lower surface of the protrusion (23) of the heat diffusion member (20) and the second region (422) of the second wrapping portion (42) may be about 0.12 mm to about 0.15 mm. When the thickness (t) of the wrapping member (40) is about 0.02 mm, the gap (G2) between the lower surface of the protrusion (23) of the heat diffusion member (20) and the upper surface (31) of the battery (30) may be about 0.14 mm to about 0.17 mm. In this case, the thickness (T) of the adhesive member (50) may be about 0.05 mm.

[0114] Accordingly, when the first region (421) of the second wrapping portion (42) of the wrapping member (40) is attached to the protrusion (23) of the heat diffusion member (20) using the adhesive member (50), at least a portion of the first region (421) of the second wrapping portion (42) can be spaced apart from the upper surface (31) of the battery (30). For example, the first region (421) of the wrapping member (40) can be positioned closer to the protrusion (23) of the heat diffusion member (20) than the second region (422). For example, when the thickness (t) of the wrapping member (40) is about 0.02 mm and the thickness (T) of the adhesive member (50) is about 0.05 mm, the gap (or distance) (G3) between the lower surface of the first region (421) of the wrapping member (40) and the upper surface (31) of the battery (30) may be 0.07 mm to 0.10 mm.

[0115] According to one embodiment, when the first region (421) of the second wrapping portion (42) of the wrapping member (40) is attached to the protrusion (23) of the heat spreading member (20) by the adhesive member (50), the portion (425) between the first region (421) and the second region (422) of the wrapping member (40) can form an inclined surface (i.e., inclined with respect to the upper surface (31) of the battery (30) or the second region (422) of the wrapping member (40).

[0116] As a result of the second region (422) being attached to the second surface (112) of the support plate (11) and / or the first region (421) being attached to the protrusion (23) of the heat diffusion member (20), a tension can be applied to the portion (425) between the first region (421) and the second region (422) of the wrapping member (40). Accordingly, the battery (30) can be firmly fixed to the second surface (112) of the support plate (11) by the wrapping member (40).

[0117] In one embodiment, when the gap (G1) is less than about 0.12 mm, the tensile force acting between the first region (421) and the second region (422) of the wrapping member (40) may be small, which may reduce the effect of fixing the battery (30). In addition, when the gap (G1) is greater than about 0.15 mm, it may be difficult to minimize the thickness of the electronic device (101). Consequently, by providing the gap (G1) between about 0.12 mm and about 0.15 mm, a favorable balance can be achieved between the secure bonding of the battery (30) and the thickness of the battery array and the thickness of the electronic device (101). In addition, as described in more detail below, such a structural arrangement can reduce or prevent unintended contact between the battery (30) and the support plate (11) and / or the heat spreading member (20), which may occur when the electronic device (101) is dropped or subjected to other mechanical shocks.

[0118] An electronic device (101) according to one or more embodiments of the present disclosure having a structure as described above can overcome thickness variations of the support plate (11) and the heat diffusion member (20) that occur due to tolerances in the manufacturing process when manufacturing the support plate (11) and the heat diffusion member (20). In particular, the structure described above can accommodate such variations without affecting the overall structure or losing related advantages. This will be described in more detail below with reference to FIG. 7.

[0119] FIG. 7 is a drawing for explaining the dimensional relationship of an electronic device (101), and shows several problems that may occur in existing structures that are solved by embodiments of the present disclosure.

[0120] As an example, a case will be described where the design gap (hereinafter, space gap) (G1) between the lower surface of the protrusion (23) of the heat diffusion member (20) and the first area (421) of the second wrapping portion (42) located on the upper surface (31) of the battery (30) is 0.13 mm, the thickness (T1) of the support plate (11) is 0.27 ± 0.05 mm, the maximum value of the thickness (T2) of the heat diffusion member (20) is 0.27 mm, and the minimum value is 0.23 mm.

[0121] For example, when the thickness (T1) of the support plate (11) is maximum and the thickness (T2) of the heat diffusion member (20) is minimum, the actual space gap (G1) may be 0.22 mm (0.32 - 0.23 + 0.13). For example, when the thickness (T1) of the support plate (11) is minimum and the thickness (T2) of the heat diffusion member (20) is maximum, the actual space gap (G1) may be 0.08 mm (0.22 - 0.27 + 0.13).

[0122] When fixing the battery (30) with an adhesive member (50), the adhesive member (50) must be able to be compressed from 0.22 mm to 0.08 mm due to possible differences in the gap (G1). If the adhesive member (50) is a double-sided tape, a double-sided tape having such compression characteristics does not currently exist or is very difficult to manufacture.

[0123] In the electronic device (101) according to the present disclosure, the protrusion (23) of the heat diffusion member (20) and the first area (421) of the second wrapping portion (42) of the wrapping member (40) wrapping the battery (30) are joined using an adhesive member (50) having a thickness equal to or smaller than the minimum space gap (G1) (for example, T=0.05 mm), so that the wrapping member (40) is tensioned to compensate for the change in the actual space gap (G1). Therefore, the electronic device (101) according to one or more embodiments of the present disclosure can overcome the thickness deviation of the support plate (11) and the thickness deviation of the heat diffusion member (20) that occur during manufacturing without relying on an adhesive member having a compressive characteristic that is difficult to achieve.

[0124] In addition, the electronic device (101) according to one or more embodiments of the present disclosure can reduce the occurrence of damage to components contained inside the electronic device (101) when dropped due to the arrangement and attachment of the wrapping member (40) without considering other components.

[0125] FIG. 8 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0126] Referring to FIG. 8, an electronic device (101) according to one or more embodiments of the present disclosure may include a support plate (11), a heat spreading member (20), a battery (30), and a wrapping member (40).

[0127] The support plate (11), heat diffusion member (20), and battery (30) of the electronic device (101) according to the embodiment illustrated in FIG. 8 are substantially the same as those of the electronic device (101) described above, so redundant descriptions are omitted.

[0128] According to one embodiment, the wrapping member (40) may be arranged on the outer surface of the battery (30). The wrapping member (40) may be formed so as to separate the battery (30) from the support plate (11).

[0129] According to one embodiment, the wrapping member (40) may be formed in a thin film shape. For example, the wrapping member (40) may be formed as a film having a thickness (t) of about 0.02 mm. The wrapping member (40) may be formed of a plastic material such as polyethylene (PE).

[0130] According to one embodiment, the wrapping member (40) may be installed to surround at least a portion of the battery (30). For example, the wrapping member (40) may be installed to surround the upper surface (31), the first side (33), the third side (34), and the lower surface (32) of the battery (30). In the embodiment of FIG. 8, the wrapping member (40) may be installed to surround a portion of the lower surface (32), the first side (33), the upper surface (31), and the third side (34) of the battery (30). For example, both ends of the wrapping member (40) may be arranged to surround the left and right portions of the lower surface (32) of the battery (30). For example, the central portion between the left and right portions of the lower surface (32) of the battery (30) may not have the wrapping member (40) arranged therein.

[0131] According to one embodiment, the wrapping member (40) may include a first region (421), a second region (422), a third region (423), and a fourth region (424). For example, the first region (421) of the wrapping member (40) may be positioned on the upper surface (31) of the battery (30) and may face the opening (113) of the support plate (11). The second region (422) may be positioned on the upper surface (31) of the battery (30) and may not overlap with the opening (113) of the support plate (11). The third region (423) may be positioned on a side surface of the battery (30). For example, the third region (423) may surround the first side surface (33) and the third side surface (34) of the battery (30). The fourth region (424) may be positioned on the lower surface (32) of the battery (30). For example, the fourth region (424) may surround the left and right portions of the lower surface (32) of the battery (30).

[0132] According to one embodiment, the wrapping member (40) may include a first wrapping portion (41) that is adhered to the battery (30) and a second wrapping portion (42) that is not adhered to the battery (30).

[0133] According to one embodiment, the first wrapping portion (41) may adhere the wrapping member (40) to the battery (30) so that the wrapping member (40) adheres to the battery (30). For example, the first wrapping portion (41) may be positioned on a portion of the lower surface (32), the first side surface (33), the third side surface (34), and the upper surface (31) of the battery (30). Accordingly, the second region (422), the third region (423), and the fourth region (424) of the wrapping member (40) may form the first wrapping portion (41).

[0134] For example, the first wrapping portion (41) may include a second area (422) that does not overlap with the opening (113) of the support plate (11). The second area (422) of the first wrapping portion (41) may not overlap with the opening (113) of the support plate (11).

[0135] For example, the first wrapping portion (41) may include a third area (423) located on the side of the battery (30). The third area (423) of the first wrapping portion (41) may be located on the first side (33) and the third side (34) of the battery (30).

[0136] For example, the first wrapping portion (41) may include a fourth region (424) located on the lower surface (32) of the battery (30). The fourth region (424) of the first wrapping portion (41) may be located on the left and right portions of the lower surface (32) of the battery (30).

[0137] According to one embodiment, the first wrapping portion (41) can be bonded to the battery (30) by a wrapping adhesive (411). For example, the second region (422), the third region (423), and the fourth region (424) of the first wrapping portion (41) can be bonded to the battery (30) by the wrapping adhesive (411).

[0138] For example, the second area (422) of the first wrapping portion (41) can be attached to one area of ​​the upper surface (31) of the battery (30) by the wrapping adhesive (411). The third area (423) of the first wrapping portion (41) can be attached to the first side (33) and the third side (34) of the battery (30) by the wrapping adhesive (411). The fourth area (424) of the first wrapping portion (41) can be attached to the left and right areas of the lower surface (32) of the battery (30) by the wrapping adhesive (411).

[0139] According to one embodiment, various adhesives may be used as the wrapping adhesive (411). For example, double-sided tape may be used as the wrapping adhesive (411).

[0140] According to one embodiment, the second wrapping portion (42) may be a portion of the wrapping member (40) facing the opening (113) of the support plate (11). For example, the first region (421) of the wrapping member (40) may form the second wrapping portion (42).

[0141] For example, there may be no adhesive (411) between the second wrapping portion (42) and the battery (30). In one embodiment, a wrapping adhesive (not shown) having a weaker adhesive strength than the wrapping adhesive (411) may be placed between the second wrapping portion (42) and the battery (30).

[0142] According to one embodiment, the battery (30) may be attached to the heat diffusion member (20) by a wrapping member (40) and an adhesive member (50). The adhesive member (50) may be positioned between the upper surface (31) of the battery (30) and the heat diffusion member (20). For example, the adhesive member (50) may be positioned between the wrapping member (40) and the heat diffusion member (20). Since the adhesive member (50) is substantially the same as the adhesive member (50) according to the above-described embodiment, a duplicate description will be omitted.

[0143] Although FIG. 8 describes a case where the second region (422) and the third region (423) of the wrapping member (40) are attached to the battery (30) by the wrapping adhesive (411), the present disclosure is not limited thereto. In one embodiment, the second region (422) or the third region (423) of the wrapping member (40) may not be attached to the battery (30) by the wrapping adhesive (411). For example, the wrapping adhesive (411) may not exist between the second region (422) or the third region (423) of the wrapping member (40) and the battery (30).

[0144] Hereinafter, with reference to FIGS. 9, 10, and 11, movement of a battery (30) of an electronic device (101) according to one or more embodiments of the present disclosure when performing a drop test of the electronic device (101) will be described in detail. For reference, in FIGS. 9, 10, and 11, other components of the electronic device (101) are removed for convenience of illustration and description, and only the support plate (11), the heat diffusion member (20), and the battery (30) are illustrated.

[0145] FIG. 9 is a diagram illustrating an electronic device (101) according to one or more embodiments of the present disclosure subjected to a 45 degree rearward drop test.

[0146] Referring to Fig. 9, the battery (30) is surrounded by a wrapping member (40), and a first region (421) of the wrapping member (40) is attached to the lower surface of the heat diffusion member (20) by an adhesive member (50). In addition, a second region (422) of the wrapping member (40) is attached to a second surface (112) of the support plate (11) by a sub-adhesive member (60). At this time, a tensile force (F) is applied to a portion (425) between the first region (421) and the second region (422) of the wrapping member (40).

[0147] Accordingly, since the wrapping member (40) pulls the battery (30) toward the support plate (11) with a tensile force (F), when the electronic device (101) is dropped backward at a 45 degree angle as shown in FIG. 9, the movement of the battery (30) toward the lower cover (80) can be reduced.

[0148] Between the battery (30) and the lower cover (80), components such as a printed circuit board, a flexible printed circuit board, or a connector may be positioned. Therefore, if the battery (30) moves toward the lower cover (80) during a 45-degree backward drop test, components such as the printed circuit board, the flexible printed circuit board, or the connector may be damaged by the battery (30). However, an electronic device (101) according to one or more embodiments of the present disclosure can reduce the movement of the battery (30) toward the lower cover (80), thereby reducing damage to components such as the printed circuit board, the flexible printed circuit board, or the connector during a 45-degree backward drop test.

[0149] FIG. 10 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure performing a bottom surface drop test.

[0150] The bottom drop test is a test to check whether the battery (30) is damaged by colliding with the side member (12) of the housing (10) when the electronic device (101) is dropped.

[0151] Referring to Fig. 10, the battery (30) is surrounded by a wrapping member (40), and a first area (421) of a second wrapping portion (42) of the wrapping member (40) is attached to the lower surface of the heat diffusion member (20) by an adhesive member (50). In addition, a second area (422) of the wrapping member (40) is attached to a second surface (112) of the support plate (11) by a sub-adhesive member (60). At this time, a tensile force (F) is applied to a portion (425) between the first area (421) and the second area (422) of the wrapping member (40).

[0152] Accordingly, since the wrapping member (40) pulls the battery (30) toward the support plate (11) with a tensile force (F), when the electronic device (101) is dropped with its lower side facing downwards as shown in FIG. 10, the movement of the battery (30) toward the side member (12) of the housing (10) can be reduced. Accordingly, the impact force caused by the collision between the battery (30) and the side member (12) can be reduced, thereby reducing damage to the battery (30).

[0153] FIG. 11 is a diagram illustrating an electronic device (101) according to one or more embodiments of the present disclosure performing a rear drop test.

[0154] The rear drop test is a test to check whether the heat diffusion member (20) is damaged when the electronic device (101) is dropped.

[0155] Referring to Fig. 11, a first area (421) of a second wrapping portion (42) of a wrapping member (40) surrounding a battery (30) is attached to a protrusion (23) of a heat diffusion member (20) by an adhesive member (50), and a second area (422) of the wrapping member (40) can be attached to a second surface (112) of a support plate (11) by a sub-adhesive member (60). Accordingly, a space (S) can be formed between a protrusion (23) of a heat diffusion member (20) and a battery (30) by a certain distance. Only a part (24) of the heat diffusion member (20) that is not accommodated in the opening (113) of the support plate (11) can be in contact with the support plate (11).

[0156] Accordingly, as shown by the arrow in Fig. 11, when the electronic device (101) is dropped backward, the impact force is transmitted to the support plate (11) through the battery (30), and a portion of the impact transmitted to the support plate (11) can be transmitted to the heat diffusion member (20). Accordingly, since the impact force directly transmitted to the heat diffusion member (20) is small, damage to the heat diffusion member (20) can be reduced.

[0157] As described and illustrated with reference to FIGS. 9 to 11, the arrangement of the wrapping member (40) relative to the battery (30), the support plate (11), and the heat spreading member (20) serves to provide a kind of suspension device (via the tensile force F) for the battery (30) or a means (via the second surface (112)) for transmitting mechanical force from the battery (30) to the support plate (11) instead of the heat spreading member (20), thereby protecting one or more of the battery (30), the heat spreading member (20), and other internal components when the electronic device (101) is subjected to mechanical shock, such as may occur when the electronic device (101) is dropped.

[0158] Hereinafter, an electronic device (101) according to one or more embodiments of the present disclosure applied to different structures will be described in detail with reference to FIGS. 12, 13, 14, 15, 16, 17, and 18.

[0159] FIG. 12 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0160] Referring to FIG. 12, the size of the heat diffusion member (20) of the electronic device (101) according to one or more embodiments of the present disclosure may be larger than the heat diffusion member (20) of the embodiment illustrated in FIG. 5 described above. In this case, the size of the opening (113) of the support plate (11) may increase, and the width (W) of the support plate (11) around the opening (113) may narrow. Accordingly, it may be difficult to secure an area for attaching the sub-adhesive member (60) to the second surface (112) of the support plate (11).

[0161] In this case, as illustrated in Fig. 12, a shock-absorbing member (49) may be attached to the second area (422) of the wrapping member (40) surrounding the battery (30) facing the second side (112) of the support plate (11). Then, the thickness of the second area (422) of the wrapping member (40) may be thicker than the thickness of other parts of the wrapping member (40).

[0162] The shock-absorbing member (49) may be formed of a material capable of absorbing shock. The lower surface of the shock-absorbing member (49) has adhesive strength and can be attached to the second region (422) of the wrapping member (40). Since the upper surface of the shock-absorbing member (49) has no adhesive strength, the upper surface of the shock-absorbing member (49) may not be attached to the second surface (112) of the support plate (11).

[0163] Therefore, when the electronic device (101) is dropped with its lower surface facing downward, the shock-absorbing member (49) installed on the wrapping member (40) can absorb the shock applied to the support plate (11) by the battery (30).

[0164] As an example, the shock-absorbing member (49) may be formed integrally with the wrapping member (40). For example, a portion of the second region (422) of the wrapping member (40) corresponding to the shock-absorbing member (49) of FIG. 12 may be formed thicker to correspond to the shock-absorbing member (49).

[0165] FIG. 13 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0166] As another example, when the size of the heat diffusion member (20) is large and the width (W) of the second surface (112) of the support plate (11) is narrow, as shown in FIG. 13, nothing is placed between the second surface (112) of the support plate (11) and the wrapping member (40) of the battery (30), and the wrapping member (40) can directly contact the second surface (112) of the support plate (11).

[0167] For example, the second region (422) of the wrapping member (40) may contact the second surface (112) of the support plate (11). However, the second region (422) of the wrapping member (40) may not be adhered to the second surface (112) of the support plate (11). That is, no adhesive may exist between the second region (422) of the wrapping member (40) and the second surface (112) of the support plate (11).

[0168] FIG. 14 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0169] Referring to FIG. 14, an electronic device (101) according to one or more embodiments of the present disclosure has a structure of a support plate (11) that is different from that of the electronic device (101) according to the embodiment illustrated in FIG. 5.

[0170] According to one embodiment, the support plate (11) may include a first surface (111), a second surface (112) opposite to the first surface (111), and a recess (114) formed in the second surface (112). For example, the recess (114) may be formed concavely in the second surface (112) toward the first surface (111) and may be formed so as not to penetrate the support plate (11). In other words, a window / opening may be provided in the support plate (11) that partially extends from the second surface (112) to the first surface (111).

[0171] The support plate (11) can support a flexible display (90). For example, a flexible display (90) can be installed on the first surface (111) of the support plate (11).

[0172] The heat diffusion member (20) can be accommodated in the recess (114). The lower surface of the heat diffusion member (20) can be attached to the first area (421) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by an adhesive member (50).

[0173] The second side (112) of the support plate (11) can be attached to the second area (422) of the wrapping member (40) surrounding the battery (30) by a sub-adhesive member (60).

[0174] The battery (30), wrapping member (40), adhesive member (50), and sub-adhesive member (60) are substantially the same as the embodiment illustrated in FIG. 5 described above, so redundant descriptions are omitted.

[0175] FIG. 15 is a diagram illustrating an electronic device (101) according to one or more embodiments of the present disclosure. For reference, in FIG. 15, the display (90) is removed for convenience of illustration.

[0176] Referring to FIG. 15, an electronic device (101) according to one or more embodiments of the present disclosure may include a first housing (10-1), a second housing (10-2), a hinge (10-3), or a hinge housing (10-4).

[0177] The first housing (10-1) and the second housing (10-2) can be formed to support the display (90). The first housing (10-1) can accommodate a first portion of the display (90). The first portion of the display (90) can be placed on the first housing (10-1). The second housing (10-2) can accommodate a second portion of the display (90). The second portion of the display (90) can be placed on the second housing (10-2).

[0178] The first housing (10-1) may include a first support plate (11-1) (e.g., support plate (11)). For example, the support plate (11) may form at least a portion of the first housing (10-1). The second housing (10-2) may include a second support plate (11-2) (e.g., support plate (11)).

[0179] For example, a heat diffusion member (20) and a battery (30) may be placed in the first housing (10-1). The battery (30) may be placed on the lower side of the heat diffusion member (20) in a vertical direction from the ground in FIG. 15.

[0180] The first housing (10-1) and the second housing (10-2) can be connected by a hinge (10-3). The second housing (10-2) can be rotatably connected to the first housing (10-1) by the hinge (10-3).

[0181] The hinge housing (10-4) accommodates the hinge (10-3) and can be positioned between the first housing (10-1) and the second housing (10-2). The hinge housing (10-4) can be positioned below the hinge (10-3) so that the hinge (10-3) is not exposed to the outside.

[0182] A heat transfer member (70) may be positioned below the display (90). The heat transfer member (70) may be positioned across the first housing (10-1) and the second housing (10-2). For example, the heat transfer member (70) may be positioned to extend from the first housing (10-1) to the second housing (10-2) via the hinge (10-3).

[0183] A part of the heat transfer member (70) disposed in the first housing (10-1) may be in contact with the heat diffusion member (20). An electronic component that emits heat may be disposed below another part of the heat transfer member (70) disposed in the second housing (10-2) (in a direction perpendicular to the support plate (11) of FIG. 15). For example, a processor (130) that controls the electronic device (101) may be disposed below another part of the heat transfer member (70) disposed in the second housing (10-2) (in a direction perpendicular to the support plate (11) of FIG. 15). Accordingly, heat generated in the processor (130) disposed in the second housing (10-2) may be transferred to the heat diffusion member (20) disposed in the first housing (10-1) through the heat transfer member (70).

[0184] FIG. 16 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0185] Referring to FIG. 16, an electronic device (101) according to one or more embodiments of the present disclosure has a structure of a support plate (11) and a heat spreading member (20) different from that of the electronic device (101) according to the embodiment illustrated in FIG. 5.

[0186] According to one embodiment, the support plate (11) may include a first surface (111), a second surface (112) opposite to the first surface (111), and a recess (114) formed in the second surface (112). The recess (114) is formed to be concave from the second surface (112) of the support plate (11) toward the first surface (111), and may be formed so as not to penetrate the support plate (11). Accordingly, the bottom surface (114a) of the recess (114) may form a step with the second surface (112) of the support plate (11).

[0187] According to one embodiment, the heat diffusion member (20) may be formed inside the support plate (11). For example, the heat diffusion member (20) may be formed inside the support plate (11) corresponding to the recess (114). That is, the support plate (11) and the heat diffusion member (20) may be formed integrally.

[0188] The support plate (11) can support a flexible display (90). For example, a flexible display (90) can be installed on the first surface (111) of the support plate (11).

[0189] The bottom surface (114a) of the recess (114) of the support plate (11) can be attached to the first area (421) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by an adhesive member (50).

[0190] The second side (112) of the support plate (11) can be attached to the second area (422) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by the sub-adhesive member (60).

[0191] The battery (30), wrapping member (40), adhesive member (50), and sub-adhesive member (60) are substantially the same as the embodiment illustrated in FIG. 5 described above, so redundant descriptions are omitted.

[0192] FIG. 17 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0193] Referring to FIG. 17, the support plate (11) may include a first surface (111), a second surface (112) opposite to the first surface (111), an opening (113) penetrating the first surface (111) and the second surface (112), and an inner wall (116) extending from the second surface (112).

[0194] For example, the inner wall (116) may extend downward from the second side (112) of the support plate (11) and may be formed to surround at least a portion of the side surface of the battery (30). The side surface of the battery (30) may be bonded to the inner wall (116) by an additional adhesive member (63).

[0195] For example, the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) may include a third region (423) that wraps at least a portion of a side surface of the battery (30). The third region (423) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) may be bonded to the inner wall (116) of the support plate (11) by an additional adhesive member (63).

[0196] As illustrated in FIG. 17, the inner wall (116) may include a left inner wall (116) facing the left side of the battery (30) and a right inner wall (116) facing the right side of the battery (30). A third region (423) of the wrapping member (40) wrapping the left side of the battery (30) may be adhered to the left inner wall (116) by an additional adhesive member (63). A third region (423) of the wrapping member (40) wrapping the right side of the battery (30) may be adhered to the right inner wall (116) by an additional adhesive member (63).

[0197] For example, an adhesive may be used as the additional adhesive member (63).

[0198] As described above, by forming an inner wall (116) on the support plate (11) and attaching the battery (30) to the inner wall (116) with an additional adhesive member (63), separation of the battery (30) can be prevented or reduced when the electronic device (101) is dropped.

[0199] The heat diffusion member (20) can be accommodated in the opening (113) of the support plate (11). The lower surface of the heat diffusion member (20) can be attached to the first area (421) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by an adhesive member (50).

[0200] The second side (112) of the support plate (11) can be attached to the second area (422) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by the sub-adhesive member (60).

[0201] The battery (30), wrapping member (40), adhesive member (50), and sub-adhesive member (60) are substantially the same as those in the embodiment illustrated in FIG. 5 described above, so redundant descriptions are omitted.

[0202] FIG. 18 is a drawing showing an electronic device (101) according to one or more embodiments of the present disclosure.

[0203] Referring to FIG. 18, an electronic device (101) according to one or more embodiments of the present disclosure differs from the electronic device (101) according to the embodiment illustrated in FIG. 5 in that it does not include a heat spreading member (20).

[0204] According to one embodiment, the support plate (11) may include a first surface (111), a second surface (112) opposite to the first surface (111), and a recess (114) formed in the second surface (112). The recess (114) may be formed to be concave toward the first surface (111) in the second surface (112) and may be formed so as not to penetrate the support plate (11).

[0205] The support plate (11) can support a display (90) or a flexible display. For example, a display (90) can be installed on the first side (111) of the support plate (11).

[0206] The bottom surface (114a) of the recess (114) of the support plate (11) can be attached to the first area (421) of the second wrapping portion (42) of the wrapping member (40) surrounding the battery (30) by an adhesive member (50).

[0207] The second side (112) of the support plate (11) can be attached to the second area (422) of the wrapping member (40) surrounding the battery (30) by a sub-adhesive member (60).

[0208] The battery (30), wrapping member (40), adhesive member (50), and sub-adhesive member (60) are substantially the same as the embodiment illustrated in FIG. 5 described above, so redundant descriptions are omitted.

[0209] An electronic device (101) according to one or more embodiments of the present disclosure having a structure as described above can overcome a thickness deviation of a support plate (11) and a thickness deviation of a heat diffusion member (20) that may occur due to tolerances in a process used in manufacturing.

[0210] In addition, the electronic device (101) according to one or more embodiments of the present disclosure having the structure as described above can reduce the likelihood of damage to components housed inside the electronic device (101) when dropped. In particular, by using the wrapping member (40) to secure the battery (30) and utilizing the tensile force of a portion (425) of the wrapping member (40), the possibility of the battery (30) coming into contact with other components of the electronic device (101) when the electronic device (101) is dropped can be reduced. By securing the wrapping member (40) to the second surface (i.e., the lower surface) (112) of the support plate (11), the force transmitted to the heat diffusion member (20) when the electronic device (101) is dropped can be reduced.

[0211] While the present disclosure has been illustrated and described above with reference to various embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the present disclosure as defined by the appended claims and their equivalents.

[0212] An electronic device according to one or more embodiments of the present disclosure as described above (e.g., the electronic device (101) of FIGS. 4 and 5) comprises: a support plate (e.g., the support plate (11) of FIG. 5) including a first surface (e.g., the first surface (111) of FIG. 5), a second surface opposite to the first surface (e.g., the second surface (112) of FIG. 5), and an opening (e.g., the opening (113) of FIG. 5) formed to penetrate the first surface and the second surface); a display (e.g., the display (90) of FIGS. 1 and 2) supported at least in part by the first surface of the support plate; a battery (e.g., the battery (30) of FIG. 5) including an upper surface (e.g., the upper surface (31) of FIG. 5) facing the second surface of the support plate, at least in part supported by the second surface of the support plate; A heat spreading member (e.g., heat spreading member (20) of FIG. 5) disposed between the display and the battery such that at least a portion thereof is received in the opening of the support plate; a wrapping member (e.g., wrapping member (40) of FIG. 5) surrounding at least a portion of the battery and including a first wrapping portion (e.g., first wrapping portion (41) of FIG. 5) adhered to the battery and a second wrapping portion (e.g., second wrapping portion (42) of FIG. 5) not adhered to the battery; and an adhesive member (e.g., adhesive member (50) of FIG. 5) adheres the at least a portion of the heat spreading member to a first region (e.g., first region (421) of FIG. 5) of the second wrapping portion.

[0213] According to one or more embodiments of the present disclosure, at least a portion of the first region of the second wrapping portion may be spaced apart from the upper surface of the battery.

[0214] According to one or more embodiments of the present disclosure, the distance (G3) between the lower surface of the first region of the second wrapping portion and the upper surface of the battery may be 0.07 mm to 0.10 mm.

[0215] According to one or more embodiments of the present disclosure, the thickness (T) of the adhesive member may be less than a distance (G2) between the lower surface of the heat spreading member and the upper surface of the battery minus the thickness of the wrapping member.

[0216] According to one or more embodiments of the present disclosure, the thickness (T) of the adhesive member may be substantially thicker than the thickness (t) of the wrapping member.

[0217] According to one or more embodiments of the present disclosure, the wrapping member may include a second region (e.g., second region (422) of FIG. 5) that does not overlap the opening of the support plate.

[0218] According to one or more embodiments of the present disclosure, the electronic device may further include a sub-adhesive member that adheres one area of ​​the second surface of the support plate to the second area.

[0219] According to one or more embodiments of the present disclosure, the second region of the wrapping member may not be adhered to the second surface of the support plate.

[0220] According to one or more embodiments of the present disclosure, a shock absorbing member (e.g., shock absorbing member (49) of FIG. 5) may be installed between the second surface of the support plate and the second area of ​​the wrapping member.

[0221] According to one or more embodiments of the present disclosure, the battery may further include a lower surface opposite the upper surface, and a side surface connecting the upper surface and the lower surface. The support plate may further include an inner wall extending from the second surface and surrounding a portion of the side surface of the battery (e.g., the inner wall (116) of FIG. 17). The wrapping member may include a third region (e.g., the third region (423) of FIG. 17) surrounding at least a portion of the side surface of the battery. The electronic device may further include an additional adhesive member (e.g., the additional adhesive member (63) of FIG. 17) for adhering the third region to the inner wall.

[0222] According to one or more embodiments of the present disclosure, the battery may further include a lower surface opposite the upper surface and a side surface connecting the upper surface and the lower surface. The first wrapping portion of the wrapping member may be disposed on the lower surface, and the second wrapping portion may be disposed on the upper surface and the side surface.

[0223] According to one or more embodiments of the present disclosure, the battery may further include a lower surface opposite the upper surface, and a side surface connecting the upper surface and the lower surface. The first wrapping portion of the wrapping member may extend from the lower surface through the side surface to a portion of the upper surface that does not overlap the opening, and the second wrapping portion may be disposed on a portion of the upper surface that overlaps the opening.

[0224] According to one or more embodiments of the present disclosure, the adhesive member may include a first adhesive portion and a second adhesive portion spaced apart from the first adhesive portion in a direction substantially parallel to the display.

[0225] According to one or more embodiments of the present disclosure, the electronic device may further include a processor (e.g., processor (130) of FIG. 15). The heat spreading member may include a first heat spreading portion arranged to overlap the processor when viewed from an upper side of the display, and a second heat spreading portion extended from the first heat spreading portion and arranged to overlap the battery. The second heat spreading portion may form at least a portion received within the opening of the support plate.

[0226] According to one or more embodiments of the present disclosure, the electronic device may further include a heat transfer member (e.g., heat transfer member (70) of FIG. 15) disposed between the display and the heat spreading member. An area of ​​the heat transfer member may be substantially smaller than an area of ​​the display and substantially larger than an area of ​​the heat spreading member.

[0227] According to one or more embodiments of the present disclosure, the electronic device may further include a hinge (e.g., hinge (10-3) of FIG. 15); a first housing (e.g., first housing (10-1) of FIG. 15) for accommodating a first portion of the display; a second housing (e.g., second housing (10-2) of FIG. 15) rotatably connected to the first housing by the hinge and accommodating a second portion of the display; and a hinge housing (e.g., hinge housing (10-4) of FIG. 15) disposed between the first housing and the second housing and accommodating the hinge. The support plate may form at least a portion of the first housing. The heat transfer member may extend from the first housing to the second housing through at least one of the hinge or the hinge housing.

[0228] An electronic device according to one or more embodiments of the present disclosure as described above (e.g., the electronic device (101) of FIGS. 4 and 5) comprises: a support plate (e.g., the support plate (11) of FIG. 5) including a first surface (e.g., the first surface (111) of FIG. 5), a second surface opposite to the first surface (e.g., the second surface (112) of FIG. 5), and an opening (e.g., the opening (113) of FIG. 5) formed to penetrate the first surface and the second surface); a display (e.g., the display (90) of FIGS. 1 and 2) supported at least in part by the first surface of the support plate; a battery (e.g., the battery (30) of FIG. 5) including an upper surface (e.g., the upper surface (31) of FIG. 5) facing the second surface of the support plate, at least in part supported by the second surface of the support plate; A heat spreading member (e.g., heat spreading member (20) of FIG. 5) disposed between the display and the battery such that at least a portion thereof is received in the opening of the support plate; a wrapping member (e.g., wrapping member (40) of FIG. 5) surrounding at least a portion of the battery and including a first wrapping portion (e.g., first wrapping portion (41) of FIG. 5) adhered to the battery and a second wrapping portion (e.g., second wrapping portion (42) of FIG. 5) spaced apart from the upper surface of the battery; and an adhesive member (e.g., adhesive member (50) of FIG. 5) adheres the at least a portion of the heat spreading member to a first region (e.g., first region (421) of FIG. 5) of the second wrapping portion.

[0229] According to one or more embodiments of the present disclosure, no adhesive member may be disposed between at least a portion of the first area of ​​the second wrapping portion and the upper surface of the battery.

[0230] According to one or more embodiments of the present disclosure, the distance between the lower surface of the first region of the second wrapping portion and the upper surface of the battery may be 0.07 mm to 0.10 mm.

[0231] According to one or more embodiments of the present disclosure, the thickness (T) of the adhesive member may be less than a distance between the heat spreading member and the upper surface of the battery minus a thickness of the wrapping member.

Claims

1. A support plate including a first surface, a second surface opposite to the first surface, and an opening formed in the second surface; A display supported at least in part by the first surface of the support plate; A battery including an upper surface facing the second surface of the support plate, the upper surface being supported at least in part by the second surface of the support plate; A heat spreading member disposed between the display and the battery such that at least a portion thereof is received in the opening of the support plate; A wrapping member surrounding at least a portion of the battery, the wrapping member including a first wrapping portion that is adhered to the battery and a second wrapping portion that is not adhered to the battery; and An electronic device comprising an adhesive member that adheres at least a portion of the heat spreading member to a first area of ​​the second wrapping portion.

2. In paragraph 1, An electronic device, wherein at least a portion of the first region of the second wrapping portion is spaced apart from the upper surface of the battery.

3. In paragraph 1 or 2, An electronic device wherein the distance (G3) between the lower surface of the first region of the second wrapping portion and the upper surface of the battery is 0.07 mm to 0.10 mm.

4. In any one of the above clauses, An electronic device wherein the thickness (T) of the adhesive member is smaller than the difference between the distance (G2) between the lower surface of the heat diffusion member and the upper surface of the battery and the thickness of the wrapping member.

5. In any one of the above clauses, An electronic device wherein the thickness (T) of the adhesive member is substantially thicker than the thickness (t) of the wrapping member.

6. In any one of the above clauses, An electronic device wherein the wrapping member includes a second region disposed on an upper surface of the battery that does not overlap the opening of the support plate.

7. In paragraph 6, The electronic device further comprises a sub-adhesive member that adheres a section of the second surface of the support plate to the second area of ​​the wrapping member, or An electronic device wherein the second region of the wrapping member is not bonded to the second surface of the support plate.

8. In any one of the above clauses, The battery further includes a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface, The support plate further includes an inner wall extending from the second surface and surrounding a portion of the side surface of the battery, The wrapping member comprises a third region that surrounds at least a portion of the side surface of the battery, An electronic device, further comprising: an additional adhesive member for adhering the third region of the wrapping member to the inner wall of the support plate.

9. In any one of paragraphs 1 to 7, The battery further includes a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface, An electronic device wherein the first wrapping portion of the wrapping member is disposed on the lower surface, and the second wrapping portion is disposed on the upper surface and the side surface.

10. In any one of paragraphs 1 to 7, The battery further includes a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface, An electronic device wherein the first wrapping portion of the wrapping member extends from the lower surface through the side surface to a portion of the upper surface that does not overlap the opening, and the second wrapping portion is disposed at a portion of the upper surface that overlaps the opening.

11. In any one of the above clauses, An electronic device, wherein the adhesive member comprises a first adhesive portion and a second adhesive portion spaced apart from the first adhesive portion in a direction substantially parallel to the display.

12. In any one of the above clauses, Includes more processors, The heat spreading member includes a first heat spreading portion arranged to overlap the processor when viewed from the upper side of the display, and a second heat spreading portion extended from the first heat spreading portion and arranged to overlap the battery. An electronic device wherein said second heat spreading portion forms at least a portion of said second heat spreading portion that is accommodated within said opening of said support plate.

13. In any one of the above clauses, Further comprising a heat transfer member disposed between the display and the heat diffusion member; An electronic device wherein the area of ​​the heat transfer member is substantially smaller than the area of ​​the display and substantially larger than the area of ​​the heat spreading member.

14. In paragraph 13, hinge; A first housing accommodating a first portion of the display; A second housing rotatably connected to the first housing by the hinge and accommodating a second portion of the display; and Further comprising a hinge housing disposed between the first housing and the second housing and accommodating the hinge; The above support plate forms at least a portion of the first housing, An electronic device wherein the heat transfer member extends from the first housing to the second housing through at least one of the hinge or the hinge housing.

15. In any one of the above clauses, An electronic device wherein the opening of the support plate extends from the second surface of the support plate to the first surface of the support plate.

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