Modular device

Abstract

A modular device according to an embodiment of the present invention comprises: a base; a housing coupled to an upper side of the base; a main PCB inserted into the interior of the housing and including a plurality of terminals formed on at least one of the front surface and the rear surface thereof; a terminal block including a plurality of terminal pin modules in contact with the plurality of terminals, respectively; and one or more temperature compensation sensors mounted on at least one of the front surface and the rear surface of the main PCB to measure the temperature of a contact point at which the terminal pin module and the terminal come into contact with each other, wherein the plurality of terminals are spaced apart from each other in the longitudinal direction of the main PCB at an upper edge of the main PCB, and the one more temperature compensation sensors are located between two adjacent terminals.

Description

modular devices

[0001] The present invention relates to a modular device.

[0002] Modular devices are also called remote input / output devices, and in particular, input / output modules of industrial controllers such as PLCs (Programmable Logic Controllers) have a configuration that expands the controller's bus.

[0003] In particular, controllers such as field buses can be connected to various external devices such as sensors, loop controllers, PLCs, motors, and valves through input / output modules to exchange electrical signals.

[0004] A temperature compensation sensor is built into the modular device, which measures the temperature of the cold junction, defined as the point where the terminal of the main PCB and the terminal pin come into contact, and compensates for the thermal electromotive force of the sensor connected to the terminal.

[0005] The above temperature compensation sensor is mounted on the main PCB, and the closer it is to the cold junction, the higher the accuracy of temperature measurement at the cold junction.

[0006] Prior art: Korean Patent Publication No. 10-2021-0031759 (March 22, 2021)

[0007] Conventionally, temperature compensation sensors are located outside the terminal block. That is, the terminal block is mounted on the main PCB, and the terminal pins hidden inside the terminal block are in contact with the terminals of the main PCB, while the temperature compensation sensor is mounted at a point outside the terminal block. Therefore, the distance between the temperature compensation sensor and the cold junction is long, which reduces the temperature measurement accuracy.

[0008] In addition, since the temperature compensation sensor is placed adjacent to the chips mounted on the main PCB, there is a disadvantage in that the accuracy of the cold junction temperature measurement value is significantly reduced due to the influence of heat generated from the chips.

[0009] In addition, the main PCB is housed within a component defined as a housing, and the terminal block is coupled to the housing so that the terminal pins come into contact with the terminals of the main PCB. Here, as the number of terminal pins increases, the internal structure of the modular device becomes more refined, and as a result, poor contact between the terminal pins and the terminals occurs even with slight movements of the terminal block.

[0010] In addition, there is a disadvantage in that the terminal pins may vibrate due to product tolerance when the terminal block and housing are combined, resulting in poor contact.

[0011] According to an embodiment of the present invention for achieving the above object, a modular device comprises: a base; a housing coupled to an upper side of the base; a main PCB inserted into the interior of the housing and including a plurality of terminals formed on at least one of a front surface and a rear surface; a terminal block including a plurality of terminal pin modules each contacting the plurality of terminals; and one or more temperature compensation sensors mounted on at least one of the front surface and the rear surface of the main PCB for measuring a temperature of a contact point where the terminal pin modules and the terminals come into contact, wherein the plurality of terminals are spaced apart from an upper edge of the main PCB in a longitudinal direction of the main PCB, and the one or more temperature compensation sensors are positioned between two adjacent terminals.

[0012] The length from the upper part of the main PCB to the lower part of the terminal is characterized by being greater than the length from the upper part of the main PCB to the lower part of the temperature compensation sensor.

[0013] It is characterized in that a slit is formed in a shape that surrounds the temperature compensation sensor at the edge portion of the main PCB corresponding to the two adjacent terminals.

[0014] The above slit is characterized in that it extends from the edge of the main PCB toward the center of the main PCB and then bends or rounds to further extend along the lower edge of the temperature compensation sensor.

[0015] The terminal block further includes a terminal cover in which the plurality of terminal pin modules are fastened inside, and a terminal case in which the terminal cover is coupled inside, and the plurality of terminals and the one or more temperature compensation sensors are accommodated inside the terminal case while the terminal pins are coupled to the terminals.

[0016] A plurality of PCB guides extending from the lower end of the terminal cover to support the front and rear of the main PCB, the plurality of PCB guides extending between terminal pins adjacent in the longitudinal direction of the main PCB, the plurality of PCB guides including a first PCB guide extending in an area where the temperature compensation sensor is not present, and a second PCB guide extending in an area where the temperature compensation sensor is mounted, the second PCB guide being characterized in that it extends shorter than the first PCB guide so as not to interfere with the temperature compensation sensor.

[0017] The bottom surface of the terminal case has a slot into which the main PCB is inserted, and a sensor insertion hole is formed at the edge of the slot corresponding to the insertion position of the temperature compensation sensor, and the sensor insertion hole is characterized in that it is sunken or stepped from the edge of the slot toward the outside of the slot.

[0018] A modular device having the above configuration has the following effects.

[0019] First, since the temperature compensation sensor is mounted between the terminals of the main PCB, the distance between the cold junction and the temperature compensation sensor becomes closer than before, which has the advantage of significantly increasing the accuracy of the cold junction temperature measurement value.

[0020] Second, since the temperature compensation sensor is located further away from the chips mounted on the main PCB, it is less affected by the heat generation of the chips, which has the advantage of increasing the accuracy of the cold junction temperature measurement value.

[0021] Third, since a heat-blocking slit is formed in the main PCB in a form that surrounds the temperature compensation sensor, there is an advantage in that the phenomenon of heat conducted from the chips being transferred to the temperature compensation sensor can be minimized.

[0022] Fourth, the phenomenon of the terminal block swinging in the width direction is prevented by the joining groove formed on the side of the terminal block, the joining protrusion formed on the side of the housing, and the guide rib structure formed in the joining groove.

[0023] Fifth, a part of the insertion jaw protruding from the bottom of the terminal block is inserted into the insertion jaw receiving groove recessed at the end of the main PCB, thereby preventing the terminal block from shaking from the main PCB.

[0024] Sixth, since one side end of the insertion jaw is closed and the other side end is open, the shaking phenomenon between the terminal block and the housing and the reverse connection phenomenon of the terminal block can be prevented.

[0025] FIG. 1 is a front perspective view of a modular device according to an embodiment of the present invention.

[0026] Figure 2 is a rear perspective view of the modular device.

[0027] Figure 3 is an exploded perspective view of the modular device.

[0028] Figure 4 is a front view of a main PCB constituting a modular device according to an embodiment of the present invention.

[0029] Figure 5 is an enlarged view showing the state in which the upper terminals mounted on the main PCB are in contact with the terminal pin module.

[0030] Figure 6 is a front perspective view of a terminal case constituting a modular device according to an embodiment of the present invention.

[0031] Fig. 7 is a bottom view of the terminal case.

[0032] FIG. 8 is a cross-sectional view of a modular device taken along line 8-8 of FIG. 2.

[0033] Fig. 9 is a cross-sectional view of a terminal case cut along 9-9 of Fig. 2.

[0034] Figure 10 is a joint drawing of the terminal case and the main PCB.

[0035] Fig. 11 is a cross-sectional view of a terminal case cut along line 11-11 of Fig. 10.

[0036] FIG. 12 is a perspective view of a housing constituting a modular device according to an embodiment of the present invention.

[0037] Figure 13 is an enlarged view showing how the terminal block is attached to the housing.

[0038] FIG. 14 is a cross-sectional view of a modular device taken along line 14-14 of FIG. 13.

[0039] Hereinafter, a modular device according to an embodiment of the present invention will be described in detail with reference to the drawings.

[0040] FIG. 1 is a front perspective view of a modular device according to an embodiment of the present invention, FIG. 2 is a rear perspective view of the modular device, and FIG. 3 is an exploded perspective view of the modular device.

[0041] Referring to FIGS. 1 to 3, a modular device (10) according to an embodiment of the present invention includes a base (11) having a plurality of terminal pins mounted therein, a housing (12) coupled to the upper side of the base (11) and having an accommodation space formed therein, a main PCB (13) inserted into the accommodation space and coupled to the housing (12), and a terminal block (20) coupled to the upper end of the housing (12) and electrically connected to the main PCB (13).

[0042] In detail, the modular device (10) may further include an LED PCB (14) coupled to one side of the upper portion of the main PCB (13), a housing cover (15) covering the LED PCB (14), and a cover plate (16) coupled to the upper surface of the housing cover (15).

[0043] In addition, the terminal block (20) includes a terminal case (17) having one side joined to a side of the housing cover (15), a terminal cover (18) inserted into the inside of the terminal case (17), and a plurality of terminal pin modules (19) joined to the terminal cover (18). When the terminal cover (18) is inserted into the inside of the terminal case (17), the upper surface of the terminal cover (18) forms the upper surface of the terminal block (20). And, when the terminal block (20) is joined to the upper surface of the housing (12), the upper end of the main PCB (13) comes into contact with the terminal pin module (19).

[0044] FIG. 4 is a front view of a main PCB constituting a modular device according to an embodiment of the present invention.

[0045] Referring to FIG. 4, the main PCB (13) constituting the modular device (10) according to the embodiment of the present invention includes a substrate (131), a plurality of upper terminals (132) provided on the front and rear sides of the upper portion of the substrate (131), and a plurality of lower terminals (133) provided on the front and rear sides of the lower portion of the substrate (131).

[0046] In detail, the plurality of upper terminals (132) and lower terminals (133) are arranged at a predetermined interval from one end of the substrate portion (131) toward the other end. The upper terminals (132) and lower terminals (133) may be formed in a rectangular shape, but are not limited thereto.

[0047] The terminal pin module (19) contacts the upper terminal (132), and the terminal pins mounted inside the base (11) contact the lower terminal (133).

[0048] Among the plurality of upper terminals (132), a temperature compensation sensor (S) may be mounted between adjacent upper terminals (132). The temperature compensation sensor (S) is provided to measure the temperature of a cold junction, i.e., a point where a terminal pin (described later) constituting the terminal pin module (19) comes into contact with the upper terminal (132). The temperature compensation sensor (S) may be formed, for example, between the first and second upper terminals (132) and between the third and fourth upper terminals (132).

[0049] In addition, the length (L1) from the upper end of the substrate portion (131) to the lower end of the upper terminal (132) may be greater than the length (L2) from the upper end of the substrate portion (131) to the lower end of the temperature compensation sensor (S). In this way, by mounting the temperature compensation sensor (S) at a position as close as possible to the cold junction, the temperature of the cold junction can be measured more accurately.

[0050] In addition, since the temperature compensation sensor (S) is mounted at a position as far away as possible from a plurality of chips mounted in the central portion of the substrate (131), the phenomenon of the accuracy of the temperature measurement value of the cold junction deteriorating due to the influence of heat generated from the plurality of chips can be minimized.

[0051] A heat-blocking slit (134) may be formed in the substrate portion (131) corresponding to the area where the temperature compensation sensor (S) is mounted, i.e., between two adjacent upper terminals (132). The heat-blocking slit (134) is a space formed by cutting a portion of the substrate portion (131) to block heat spread from the chips from being transferred to the temperature compensation sensor (S). The heat-blocking slit (134) may be formed in a shape that extends downward from the upper end of the substrate portion (131) and surrounds the temperature compensation sensor (S). As an example, the heat-blocking slit (134) may include a smoothly rounded L-shaped or J-shaped slit.

[0052] When the terminal block (20) is coupled to the housing (12), the upper terminal (132) and the temperature compensation sensor (S) are inserted into the inside of the terminal case (17).

[0053] Meanwhile, an insertion jaw receiving groove (136) is formed on the upper end of the substrate portion (131), and the insertion jaw receiving groove (136) can suppress the phenomenon in which the terminal block (20) swings in the longitudinal direction of the modular device (10) due to vibration transmitted to the modular device (10). Here, the longitudinal direction of the modular device (10) means the direction from one end of the substrate portion (131) toward the other end in FIG. 4, that is, the left-right direction in FIG. 4. The insertion jaw receiving groove (136) will be described in more detail below with reference to the drawings.

[0054] Figure 5 is an enlarged view showing the state in which the upper terminals mounted on the main PCB are in contact with the terminal pin module.

[0055] Referring to FIG. 5, a terminal block (20) according to an embodiment of the present invention includes a terminal pin module (19) and a terminal cover (18).

[0056] In detail, the terminal pin module (19) includes a terminal pin (191) and a pin connector (192) connected to the upper end of the terminal pin (191). The terminal pin (191) includes a right pin that contacts an upper terminal (132) provided at the upper end of the front of the main PCB (13), and a left pin that contacts an upper terminal (132) provided at the upper end of the rear of the main PCB (13). In addition, the pin connector (192) is formed of a plate spring structure bent in a clip shape.

[0057] A jack insertion hole (183) is formed on the upper surface of the terminal cover (18), and a connector jack inserted through the jack insertion hole (183) deforms the pin connector (192) while applying pressure to the pin connector (192).

[0058] Additionally, two terminal pins (191) may be in contact with one upper terminal (132), but are not limited thereto.

[0059] At the bottom of the terminal cover (18), a PCB guide that supports the main PCB (13) extends, and the PCB guide includes a plurality of first PCB guides (181) and a plurality of second PCB guides (182). The plurality of first PCB guides (181) and the plurality of second PCB guides (182) may be formed alternately in the longitudinal direction of the terminal cover (18).

[0060] The first PCB guide (181) is formed with an insertion groove for inserting the upper end of the main PCB (13). On the other hand, the second PCB guide (182) is formed shorter than the first PCB guide (181) so as not to interfere with the temperature compensation sensor (S). Conventionally, the first and second PCB guides (181, 182) are extended to the same length, and a groove or slit is formed at the lower end for inserting the upper end of the main PCB (13).

[0061] However, in the case of the present invention, in order to avoid interference with the temperature compensation sensor (S), the second PCB guide (182) is designed to be shorter than the first PCB guide (181). In addition, the upper part of the main PCB (13), corresponding to the area between adjacent upper terminals (132), is inserted into the first PCB guide (181), so that the front and rear sides of the upper part of the main PCB (13) are supported by the first PCB guide (181).

[0062] In addition, when the terminal case (17) is completely connected to the housing (12), the line (K) passing through the lower end of the terminal case (17) is positioned at a point spaced downward from the lower end of the upper terminal (132) and the terminal pin (191), so that the temperature compensation sensor (S) and the heat blocking slit (134) are positioned inside the terminal case (17).

[0063] FIG. 6 is a front perspective view of a terminal case constituting a modular device according to an embodiment of the present invention, FIG. 7 is a bottom view of the terminal case, and FIG. 8 is a cross-sectional view of the modular device taken along line 8-8 of FIG. 2.

[0064] Referring to FIGS. 6 to 8, a terminal case (17) constituting a modular device (10) according to an embodiment of the present invention includes a case body (171) and an elastic lever (172) formed on one side of the case body (171).

[0065] The elastic lever (172) extends upward from the lower side of one side of the case body (171) and has a predetermined elasticity. In addition, as shown in Fig. 1, the elastic lever (172) is caught on the side of the housing cover (15) so that the terminal case (17) is stably coupled to the housing (17).

[0066] Meanwhile, a guide groove (173) is formed recessed in the other side of the case body (171), and a pair of guide ribs (174) are formed in the guide groove (173). According to an embodiment, the guide groove (173) may be formed recessed in the lower part of the other side of the case body (171), and a pair of guide ribs (174) may be formed in the guide groove (173). In detail, the pair of guide ribs (174) are formed parallel in the vertical direction at both edges of the guide groove (173). More specifically, the pair of guide ribs (174) may be formed at a point spaced rearward from the front surface of the case body (171) and a point spaced forward from the rear surface of the case body (171), respectively.

[0067] In addition, the lower end of the guide groove (173) is formed at a point spaced upward from the lower end of the case body (171). In addition, the portion connecting the lower end of the guide groove (173) and the lower end of the side portion of the case body (171) can be defined as a catch rib (175).

[0068] In addition, an insertion protrusion (176) protrudes to a predetermined height on the bottom surface of the case body (171). In detail, a slot (1761) through which the main PCB (13) passes is formed on the bottom surface of the case body (171), and the insertion protrusion (176) extends along the edge of the slot (1761). In more detail, the insertion protrusion (176) is bent and extends in a “ㄷ” shape along the front edge, one side edge, and the rear edge of the slot (1761). In addition, the insertion protrusion (176) is not formed on the other side edge of the slot (1761), but is open to form an avoidance groove (1763).

[0069] In addition, a bridge (177) connecting the insertion protrusions (176) facing each other may be formed inside the case body (171) corresponding to the approximate central portion of the slot (1761). In addition, a sensor passage hole (1762) (or sensor passage groove) may be formed in the portion where the temperature compensation sensor (S) is inserted.

[0070] The sensor passage hole (1762) is recessed from the front edge of the slot (1761) toward the front of the case body (171), and from the rear edge of the slot (1761) toward the rear of the case body (171). This is because the temperature compensation sensor (S) is mounted on both the front and rear of the main PCB (13).

[0071] According to this structure, the front-back width of the sensor passage hole (1762) is formed to be larger than the front-back width of the slot (1761). As a result, as shown in Fig. 8, when the upper end of the main PCB (13) is inserted into the case body (171), the temperature compensation sensor (S) passes through the sensor passage hole (1762) and is inserted into the case body (171), thereby preventing the phenomenon of damage due to interference with the edge of the slot (1761).

[0072] FIG. 9 is a longitudinal cross-sectional view of a terminal case cut along line 9-9 of FIG. 2, FIG. 10 is a joint drawing of a terminal case and a main PCB, and FIG. 11 is a longitudinal cross-sectional view of a terminal case cut along line 11-11 of FIG. 10.

[0073] First, referring to Fig. 9, a pin supporter (178) protrudes from each of the inner left and right sides of the terminal case (17).

[0074] In detail, the pin supporter (178) protrudes from the inner front and rear sides of the case body (171) corresponding to the coupling position of the terminal pin (191), respectively. In addition, the insertion protrusion (176) protrudes from one side edge of the slot (1761) formed on the bottom of the case body (171), and an avoidance groove (1763) is formed on the other side edge of the slot (1761). Here, the one side edge of the slot (1761) means the lower edge of the side where the elastic lever (172) is formed.

[0075] Referring to FIG. 10, the insertion jaw (176) protruding from one side edge of the slot (1761) is inserted into the insertion jaw receiving groove (136, see FIG. 4) that is sunken in one side edge of the upper portion of the main PCB (13), and the other side edge of the upper portion of the main PCB (13) is fitted into the avoidance groove (1763) that is sunken in the other side edge of the slot (1761).

[0076] In the past, since both side edges of the slot (1761) were open, the phenomenon of reverse coupling or incorrect coupling to the top of the main PCB (13) often occurred with the left and right sides of the terminal case (17) reversed. However, as shown in the present invention, one side edge of the slot (1761) is closed by the insertion jaw (176) and the other side edge is open, thereby preventing the phenomenon of reverse coupling or incorrect coupling between the terminal case (17) and the main PCB (13).

[0077] In addition, by inserting the insertion jaw (176) extending from the side end of the slot (1761) into the insertion jaw receiving groove (136) of the main PCB (13), the phenomenon of the terminal case (17) swinging in the direction of the arrow shown in the drawing due to vibration transmitted from the outside of the modular device (10) can be prevented.

[0078] In addition, the bridge (177) is inserted into the bridge groove (135) that is sunken in at the top of the main PCB (13), thereby preventing the terminal case (17) from swinging in the longitudinal direction of the main PCB (13) while being coupled to the main PCB (13).

[0079] Meanwhile, referring to Fig. 11, the pin supporter (178) protrudes from the inner surface of the front and rear portions of the terminal case (17) to press the end of the terminal pin (191) toward the main PCB (13).

[0080] In detail, a portion of the pin supporter (178) in contact with the terminal pin (191) protrudes obliquely from the top to the bottom toward the center of the case body (171), thereby pressing the terminal pin (191) toward the front and rear of the main PCB (13). As a result, not only is deformation of the terminal pin (191) prevented, but also the end of the terminal pin (191), specifically, the contact end that contacts the upper terminal (132) of the main PCB (13), strongly contacts the upper terminal (132), thereby preventing a poor contact phenomenon. The portion that protrudes obliquely toward the center of the case body (171) can be defined as a pressing portion.

[0081] FIG. 12 is a perspective view of a housing constituting a modular device according to an embodiment of the present invention, FIG. 13 is an enlarged view showing a terminal block coupled to the housing, and FIG. 14 is a cross-sectional view of the modular device taken along line 14-14 of FIG. 13.

[0082] Referring to FIG. 6 and FIGS. 12 to 14, the housing (12) includes a front portion (1211), a rear portion (1212), and left and right side portions (1213), and the upper and lower surfaces are open, and an accommodation space (1201) is formed inside.

[0083] In detail, a guide protrusion (122) is formed on one of the left and right sides of the housing (12), and a catch groove (123) is defined between the upper part of the housing (12) and the guide protrusion (122).

[0084] The side of the housing (12) where the guide protrusion (122) is formed can be defined as the portion where the side opposite to the side where the elastic lever (172) is formed among the sides of the terminal case (17) is joined. That is, the side of the terminal case (17) where the guide groove (173) and the guide rib (174) are formed is joined to one side of the housing (12).

[0085] In more detail, the guide protrusion (122) protrudes from the inner surface of the side portion (1213) of the housing (12), and protrudes from the front and rear ends of the side portion (1213), respectively.

[0086] In order to couple the terminal case (17) to the housing (12), the terminal case (17) is placed on the upper end of the housing (12) in an obliquely inclined state. Specifically, the terminal case (17) is moved so that the side end of the terminal case (17) where the guide groove (173) is formed is lower than the side end of the terminal case (17) where the elastic lever (174) is formed, and the guide groove (173) approaches the guide protrusion (122).

[0087] Then, after the guide protrusion (122) is inserted into the guide groove (173) of the terminal case (17), the other end of the terminal case (17) is lowered toward the upper end of the housing (12). Then, as shown in Fig. 13, the engaging rib (175) of the terminal case (17) is inserted into the engaging groove (123) of the housing (12).

[0088] In addition, the facing side surfaces of the pair of guide protrusions (122) are respectively in contact with the pair of guide ribs (174). That is, the pair of guide ribs (174) are located between the pair of guide protrusions (122), but are in contact with the side surfaces of the pair of guide protrusions (122). As a result, the phenomenon of the terminal case (17) swinging in the horizontal direction connecting the front and rear surfaces of the housing (12) due to the vibration transmitted to the modular device (10) is prevented. In addition, since the engaging rib (175) is inserted into the engaging groove (123) and the elastic lever (172) is coupled to the housing cover (15), the phenomenon of the terminal case (17) swinging in the longitudinal direction of the housing (12), that is, the horizontal direction connecting the left and right sides, is also prevented.

Claims

1. Base; A housing coupled to the upper side of the base; A main PCB inserted into the interior of the housing and including a plurality of terminals formed on at least one of the front and rear surfaces; A terminal block including a plurality of terminal pin modules each contacting the plurality of terminals; and Including one or more temperature compensation sensors mounted on at least one of the front and rear surfaces of the main PCB to measure the temperature of the contact point where the terminal pin module and the terminal come into contact, The above multiple terminals are, It is spaced apart from the upper edge of the main PCB in the longitudinal direction of the main PCB, The above one or more temperature compensation sensors, A modular device characterized by being positioned between two adjacent terminals.

2. In paragraph 1, A modular device characterized in that the length from the upper part of the main PCB to the lower part of the terminal is greater than the length from the upper part of the main PCB to the lower part of the temperature compensation sensor.

3. In paragraph 1, A modular device characterized in that a slit is formed in a shape that surrounds the temperature compensation sensor at the edge portion of the main PCB corresponding to the two adjacent terminals.

4. In paragraph 3, The above slit is, A modular device characterized in that it extends from the edge of the main PCB toward the center of the main PCB and is bent or rounded to further extend along the lower edge of the temperature compensation sensor.

5. In paragraph 1, The above terminal block, A terminal cover in which the above multiple terminal pin modules are fastened inside, The terminal cover further includes a terminal case coupled inside, A modular device characterized in that the plurality of terminals and the one or more temperature compensation sensors are accommodated inside the terminal case while the terminal pin is connected to the terminal.

6. In paragraph 5, At the bottom of the above terminal cover, a plurality of PCB guides extend to support the front and rear of the main PCB. The above plurality of PCB guides extend between adjacent terminal pins in the longitudinal direction of the main PCB, The above multiple PCB guides are: A first PCB guide extending from an area where there is no temperature compensation sensor, A second PCB guide extending from an area where the temperature compensation sensor is mounted is included, A modular device characterized in that the second PCB guide is extended shorter than the first PCB guide so as not to interfere with the temperature compensation sensor.

7. In paragraph 5, On the bottom of the above terminal case, there is a slot into which the main PCB is inserted, A sensor insertion hole is formed at the edge of the slot corresponding to the insertion position of the temperature compensation sensor, The above sensor insertion hole is, A modular device characterized in that the edge of the slot is recessed or stepped toward the outside of the slot.

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