A lower carrier enabling airflow

Abstract

Present invention relates to a lower carrier (1) placed on the bottom part of a cooker, onto which components belonging to the cooker are mounted, and which prevents heating of the components (such as components on a circuit board, etc.) by enabling airflow with the aid of a retaining portion (15) and a guiding portion (16).

Description

[0001] A LOWER CARRIER ENABLING AIRFLOW

[0002] Technical Field

[0003] The invention relates to a lower carrier that can be used in cookers.

[0004] More specifically, it relates to a lower carrier that enables airflow by means of a retaining portion and a guiding portion, thereby preventing heating by providing cooling of circuit boards, components on the circuit board, and other elements intended to be cooled.

[0005] State of the Art

[0006] A cooker is a household appliance used for cooking or heating food. Typically placed on a kitchen countertop or above the countertop, this device is used for food preparation (heating, cooking). Cookers come in various types, such as gas or electricity. In induction cookers, which are a type of electric cooker, lower carrier structures are used to accommodate components with different functions.

[0007] In induction cookers, the component (lower carrier) where electronic components and the fan are placed plays a critical role in the safe and efficient operation of the device. The lower carrier provides mechanical protection for electronic circuits and ensures durability against external factors. The lower carrier contributes to the uninterrupted operation of circuits by ensuring that electronic components remain in a fixed position. The lower carrier structure is expected to facilitate the overall assembly of the device and simplify its maintenance. Lower carriers significantly enhance the performance and durability of induction cookers.

[0008] In the design of the carrier where electronic components and the fan are placed in induction cookers, airflow is of great importance. Airflow ensures that the heat generated inside the device is effectively expelled, thereby preventing overheating of components. Designs that do not consider airflow hinder the efficient operation of the fan, leading to inadequate cooling. This causes electronic circuits to overheat, resulting in performance loss and damage to components. Inadequate airflow shortens the lifespan of the device and leads to malfunctions. As malfunctions increase, maintenance costs also rise. On the other hand, overheating can reduce energy efficiency, which increases the user's electricity bill. When airflow is not properly provided, the fan operates more, leading to higher noise levels. Therefore, optimizing airflow in the design of lower carriers that hold electronic components, fans, and other elements in induction cookers is of critical importance for the safe, efficient, and long- lasting operation of the device.

[0009] TR 2022 / 015507 discloses a system that provides long-lasting use by utilizing uniform, more practical, and superior composite materials instead of metal, plastic, and glass materials used in cookers.

[0010] EP2498577B1 discloses a carrier plate made of plastic that houses a circuit carrier equipped with electronic components and a metal cover structure detachably attached to the underside of the carrier plate. A latching element placed on the cover engages horizontally with a locking recess formed on the carrier plate and extends in a direction facing outward from the outer side of the bottom cover. The latching element is configured as a curved plate in the form of a spring tongue. The document provides a solution related to the fixation and attachment of the carrier plate but does not offer any solution for airflow.

[0011] TR 2021 / 021325 discloses a cooling device comprising a body defining a storage compartment and at least one control unit provided on an outward-facing outer wall surface of the body for controlling the operation of the cooling device. The document discloses the positioning of the tray in different locations.

[0012] As a result, considering the prior art and the drawbacks, there is a need for a lower carrier design that allows easy placement of electronic circuits, fans, and other components while providing airflow with high efficiency.

[0013] Object and Brief Description of the Invention

[0014] An object of the invention is to provide a lower carrier that can be used in cookers (stoves, ovens, etc.) and efficiently distribute airflow.

[0015] Another object of the invention is to provide a lower carrier that accommodates electronic circuits (circuit boards, etc.), fans, and other cooker components.

[0016] Another object of the invention is to prevent the heating of electronic components by enabling airflow.

[0017] Another object of the invention is to provide cooling of components intended to be cooled by enabling airflow. The invention is a lower carrier which is placed on the bottom part of a cooker, on which components belonging to the cooker are mounted, and configured to prevent the heating of the components by enabling airflow, and it comprises: at least one air duct formed on a second edge and a fourth edge, which enables the outlet of air generated by the fan and directed to the second board region, thereby generating airflow in the second board region and providing cooling of the components in the second board region, at least one retaining portion connected to a bottom surface and to the second edge, which blocks the leakage of air coming from the second board region to a first board region, prevents the exit of air entering into the first board region, and thus enables airflow within the first board region, providing cooling of the components in the first board region through the formed airflow, at least one guiding portion connected to the bottom surface, which directs the air generated by the fan toward the second board region, thereby enabling the cooling of components within the second board region, at least one air inlet formed between a fan edge and a guiding portion, which enables the transfer of the air generated by the fan into the first board region.

[0018] Present invention relates to a lower carrier placed on the bottom part of a cooker, onto which components belonging to the cooker are mounted, and which prevents heating of the components (such as components on a circuit board, etc.) by enabling airflow with the aid of a retaining portion and a guiding portion.

[0019] Brief Description of the Figures

[0020] Figure-1 A front, angled, perspective view of the lower carrier is provided.

[0021] Figure-2 Another front, angled, perspective view of the lower carrier is provided.

[0022] Figure-3 A front, angled, perspective view of the lower carrier and the components placed on the lower carrier is provided.

[0023] Figure-4 A front, angled, perspective view indicating the regions of the lower carrier is provided.

[0024] Figure-5 A front, angled, perspective view showing the components placed on the lower carrier is provided.

[0025] Figure-6 A top view indicating the airflow in the lower carrier is provided.

[0026] Figure-7 A top view indicating the components of the lower carrier is provided. Figure-8 A top view showing the components placed on the lower carrier is provided.

[0027] Figure-9 A rear, angled, perspective view showing the components placed on the lower carrier is provided.

[0028] Figure-10 A rear, angled, perspective view of the lower carrier is provided.

[0029] Reference Numerals

[0030] 1 Lower carrier

[0031] 2 Bottom surface

[0032] 10 First edge

[0033] 11 Second edge

[0034] 12 Third edge

[0035] 13 Fourth edge

[0036] 14 Air duct

[0037] 15 Retaining portion

[0038] 15.1 Retaining short edge

[0039] 15.2 Retaining long edge

[0040] 15.3 Air guiding opening

[0041] 16 Guiding portion

[0042] 16.1 Guiding short edge

[0043] 16.2 Guiding long edge

[0044] 16.3 Air inlet

[0045] 17 Fan region

[0046] 17.1 Fan edge

[0047] 17.2 Fan

[0048] 17.3 Blowing opening

[0049] 17.4 Cable clearance

[0050] 18 First board region

[0051] 18.1 Board holder

[0052] 19 Second board region

[0053] 19.1 Central edge

[0054] 20 Heat sink block

[0055] 20.1 MOSFET

[0056] 30 Filter board

[0057] 40 Control board

[0058] 40.1 Microprocessor

[0059] Detailed Description of the Invention

[0060] The invention relates to a lower carrier (1) that is placed on the bottom part of a cooker, onto which components belonging to the cooker are mounted, and which prevents heating of the components (such as circuit boards, components on the circuit board, etc.) by enabling airflow with the aid of a retaining portion (15) and a guiding portion (16). Cookers are devices generally used for cooking and heating food, and there are various types such as electricity, gas, induction, etc. The cooking stoves are mostly used in the kitchen areas of homes. In cases where cookers (such as induction cookers) contain components intended to be cooled (e.g., electronic boards), cooling systems are used. In some systems, a fan (17.2) can be used for cooling. When the fan (17.2) is used, the air blown by the fan (17.2) needs to be properly distributed within the lower carrier (1) where the components to be cooled are placed and, in particular, directed toward components that overheat excessively (e.g., microprocessor (40.1)). When proper airflow is not provided, components may fail due to high temperatures. Moreover, excessive heating of components can cause bending, warping, or melting of plastic parts, if present. Present invention ensures that airflow is directed to heated components and prevents air leakage between regions by using a retaining portion (15) and a guiding portion (16), thereby enabling the cooling process. In the preferred configuration of the invention, the cooker is an induction cooker.

[0061] Present invention fundamentally comprises: at least one bottom surface (2), at least one first edge (10), at least one second edge (11), at least one third edge (12), at least one fourth edge (13), at least one air duct (14), at least one retaining portion (15), at least one guiding portion (16), at least one fan region (17), at least one first board region (18), at least one second board region (19), at least one heat sink block (20), at least one filter board (30), and at least one control board (40). The retaining portion (15) comprises at least one retaining short edge (15.1) and at least one retaining long edge (15.2). The guiding portion (16) comprises at least one guiding short edge (16.1) and at least one guiding long edge (16.2).

[0062] The lower carrier (1) is configured in the geometry of a rectangular prism with an open top. The base of the lower carrier (1) is referred to as the bottom surface (2). The lower carrier (1) is preferably configured such that, when viewed from the top, it appears flat, and when viewed from the side, a specific triangular region is formed on the fourth edge (13) side by removing a section diagonally from the level of the fourth edge (13) at the bottom to the upper side of the end on the fourth edge (13) side. Preferably, various regions are formed in the lower carrier (1).

[0063] The air duct (14) is preferably configured to allow air exhaust, preferably at the end of the second edge (11) farther from the fan (17.2) and at both ends of the fourth edge (13), and preferably in a grille structure. The air duct (14) enables the outlet of air generated by the fan (17.2) and directed to the second board region (19), thereby generating airflow in the second board region (19) and providing cooling of the components in the second board region (19). In other preferred configurations of the invention, the number and positions of the air ducts (14) can be varied. The retaining portion (15) is preferably configured in a rectangular structure, with the short side of the rectangle referred to as the retaining short edge (15.1) and the long side of the rectangle referred to as the retaining long edge (15.2). The retaining portion (15) is preferably connected along a retaining short edge (15.1) at a certain angle to the second edge (11) near its middle section, and along a retaining long edge (15.2) to the bottom surface (2), blocking the leakage of air coming from the second board region (19) to a first board region (18), preventing the exit of air entering into the first board region (18), and thus enabling airflow within the first board region (18), providing cooling of the components in the first board region (18) through the formed airflow. The retaining portion (15) can be connected to the second edge (11) along the retaining short edge (15.1) at a certain angle, almost perpendicularly, or at a perpendicular angle.

[0064] The guiding portion (16) is preferably configured in a rectangular structure, either curved with a certain radius or flat at a specific angle to direct air. The curved structure ensures a smooth transition of the air blown by the fan (17.2) to the second board region (19) and directs the air particularly to the microprocessor (40.1) on the control board (40). In other words, the guiding portion (16), with its curved structure and placement angle, directs the air coming from the fan (17.2) to the microprocessor (40.1) on the control board (40) placed in the second board region (19), thereby enabling the cooling of the microprocessor (40.1). The structure of the guiding portion (16) (flat, curved, etc.) and the angle at which it is placed on the surface can affect its performance, and the guiding portion (16) can be placed on the bottom surface (2) at a desired angle. The short side of the curved rectangle is referred to as the guiding short edge (16.1), and the long side of the curved rectangle is referred to as the guiding long edge (16.2). The guiding portion (16) is preferably configured in a curved structure, with the guiding short edge (16.1) facing the second board region (19) and connected along the guiding long edge (16.2) to the bottom surface (2), directing the air generated by the fan (17.2) to the second board region (19), thereby providing cooling of the components in the second board region (19). The retaining portion (15) and the guiding portion (16) are preferably placed in the same direction. In the preferred configuration of the invention, the fan (17.2) is placed at a certain angle in the fan region (17).

[0065] The fan region (17) refers to the region where the fan (17.2) is placed and where airflow is generated with the aid of the fan (17.2). In the preferred configuration of the invention, the fan region (17) is the area enclosed by a fan edge (17.1). The fan edge (17.1) preferably starts from the direction aligned with the guiding portion (16), curves with a certain radius, passes through the corner where the first edge (10) and the third edge (12) meet, continues curving to the direction aligned with a central edge (19.1), extends parallel to the central edge (19.1) for a certain distance after passing it, and then terminates. Between the two ends of the fan edge (17.1), there is a blowing opening (17.3) with a gap structure that allows the air generated by the fan (17.2) to pass to other regions. The generated air passes through the blowing opening (17.3) to reach other board regions.

[0066] The first board region (18) refers to the region where the filter board (30) is placed. In the preferred configuration of the invention, the first board region (18) is the area enclosed between the first edge (10), the second edge (11), the retaining portion (15) and guiding portion (16) aligned in the same direction, and the fan edge (17.1) near the first board region (18). Preferably, the first board region (18) contains board holder (18.1) structures for placing and securing the filter board (30). In the preferred configuration of the invention, the first board region (18) includes four board holders (18.1) configured in an “L” geometry, facing each other to form a rectangular region. There is a distance between the end of the fan edge (17.1) on the side of the first board region (18) and the guiding portion (16), where a gap-structured air inlet (16.3) is configured. Part of the air generated by the fan (17.2) enters through the air inlet (16.3) to cool the filter board (30). The exit of the air entering the first board region (18) is provided through a cable clearance (17.4) at the corner where the first edge (10) and the third edge (12) intersect. A small portion of the air entering the first board region (18) is transferred to the second board region (19) through an air guiding opening (15.3) located between the retaining portion (15) and the guiding portion (16).

[0067] The second board region (19) refers to the region where the control board (40) is placed. In the preferred configuration of the invention, the second board region (19) is the area enclosed between the second edge (11), the fourth edge (13), the retaining portion (15) and guiding portion (16) aligned in the same direction, and the central edge (19.1). The central edge (19.1) is configured to extend from the fan region (17) to the fourth edge (13). The majority of the air generated by the fan (17.2) passes through the blowing opening (17.3) and is directed to the heat sink block (20) made of a material with high thermal conductivity, which is preferably placed adjacent and parallel to the central edge (19.1) along nearly the length of the central edge (19.1). Structures such as the MOSFET (20.1) in the heat sink block (20) are cooled by the air blown onto the heat sink block (20). The exit of the air blown onto the heat sink block (20) is provided through the air duct (14) located on the fourth edge (13) on the side of the central edge (19.1). The remaining portion of the air generated by the fan (17.2) passes through the blowing opening (17.3) and is directed to the control board (40) with the aid of the guiding portion (16). The directed air cools structures such as the microprocessor (40.1) on the control board (40). The exit of the air blown toward the microprocessor (40.1) is provided through the air duct (14) located on the fourth edge (13) on the side of the second edge (11) and the air duct (14) located on the second edge (11) on the side of the fourth edge (13). In the preferred configuration of the invention, the second board region (19) includes the board holder (18.1) structures configured in an “L” geometry and various other geometries to secure the control board (40).

[0068] In this specification, the orientation or positional relationships indicated by the terms "top" and "bottom" are based on the orientation or positional relationships shown in the figures and are solely for the clarity of the technical solution and ease of explanation. They do not imply or indicate that the specified device or component requires a specific orientation, is constructed, or operates in a specific direction, and therefore should not be understood as a limitation of the invention.

Claims

1. CLAIMS1. A lower carrier (1) which is placed on the bottom part of a cooker, on which components belonging to the cooker are mounted, and configured to prevent the heating of the components by enabling airflow, characterized in that it comprises:- at least one air duct (14) formed on a second edge (11) and a fourth edge (13), which enables the outlet of air generated by a fan (17.2) and directed to a second board region (19), thereby generating airflow in the second board region (19) and providing cooling of the components in the second board region (19),- at least one retaining portion (15) connected to a bottom surface (2) and to the second edge (11), which blocks the leakage of air coming from the second board region (19) to a first board region (18), prevents the exit of air entering into the first board region (18), and thus enables airflow within the first board region (18), providing cooling of the components in the first board region (18) through the formed air flow,- at least one guiding portion (16) connected to the bottom surface (2), which directs the air generated by the fan (17.2) toward the second board region (19), thereby enabling the cooling of components within the second board region (19),- at least one air inlet (16.3) formed between a fan edge (17.1) and a guiding portion (16), which enables the transfer of the air generated by the fan (17.2) into the first board region (18).

2. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one retaining portion (15) connected along a retaining short edge (15.1) at an almost perpendicular angle to the second edge (11).

3. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one air duct (14) configured as a grille.

4. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one guiding portion (16) with a curved structure that directs the air coming from the fan (17.2) to a microprocessor (40.1) on a control board (40) placed in the second board region (19), thereby enabling the cooling of the microprocessor (40.1).

5. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one air duct (14) configured at the end of a second edge (11) farther from the fan (17.2).

6. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one air duct (14) configured at both ends of the fourth edge (13).

7. The lower carrier (1) according to Claim 1 , characterized in that the bottom surface (2) comprises at least one board holder (18.1) configured in the first board region (18).

8. The lower carrier (1) according to Claim 1 , characterized in that the bottom surface (2) comprises at least one board holder (18.1) configured in the second board region (19).

9. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one fan (17.2) placed at an angle in the fan region (17).

10. The lower carrier (1) according to Claim 1 , characterized in that it comprises at least one central edge (19.1) configured to extend from the fan region (17) to the fourth edge (13).

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