Electronic device, driving method of electronic device, and computer-readable recording medium therefor

Abstract

Embodiments of the present disclosure relate to an electronic device, a driving method of the electronic device, and a computer-readable recording medium therefor. The electronic device may comprise: a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled to the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter; a memory (130) that stores instructions; and a processor (120).

Description

Electronic device, method of driving electronic device, and computer-readable recording medium therefor

[0001] Embodiments of the present disclosure relate to an electronic device, a method of driving the electronic device, and a computer-readable recording medium therefor.

[0002] With the advancement of digital technology, various types of electronic devices, such as smartphones, digital cameras, and / or wearable devices, are becoming widely used. Users can capture images using these electronic devices. For example, an electronic device may include at least one camera device (e.g., a camera module) and support the user's image capture through at least one camera device.

[0003] The thickness of a camera device incorporated into an electronic device is determined by the thickness of the image sensor and lens. Recently, camera devices in electronic devices have been increasing in thickness as their performance has become increasingly important. Consequently, camera devices form what is known as a "camera bump," which protrudes from one side of the electronic device. This bump has been identified as a factor that hinders the external design of the electronic device.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0005] Embodiments of the present disclosure can provide an electronic device capable of reducing the thickness of a camera device (e.g., a camera module) and obtaining high-quality images even in a low-light environment, a method for driving the electronic device, and a computer-readable recording medium therefor.

[0006] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0007] An electronic device (101) according to one embodiment of the present disclosure comprises a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, a memory (130) storing commands, and a processor (120), wherein the commands, when executed by the processor (120), cause the electronic device (101) to acquire N non-Bayer images photographing a subject using the plurality of lens assemblies (410), and perform binning processing on each of the N non-Bayer images (1110), thereby obtaining N binning images having a first resolution. By obtaining images (1120) and performing remosaic transformation on each of the N non-Bayer images (1110), N remosaic images having a second resolution greater than the first resolution are obtained, phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720) is obtained, and based on the phase difference data, pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410) are calculated, and the size of each of the N remosaic images (1130) is upscaled to a size corresponding to a specified resolution,The size of each of the N binning images (1120) may be upscaled to be the same as the size of each of the upscaled N re-mosaic images (1130), and an output image may be generated based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0008] In a driving method of an electronic device (101) according to one embodiment of the present disclosure, the electronic device (101) includes a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, and the driving method of the electronic device (101) includes an operation of acquiring N non-Bayer images photographing a subject using the plurality of lens assemblies (410), an operation of acquiring N binning images (1120) having a first resolution by performing binning processing on each of the N non-Bayer images (1110), and an operation of performing a binning process on each of the N non-Bayer images (1110). An operation of obtaining N remosaic images having a second resolution greater than the first resolution by performing remosaic transformation on the N non-Bayer images (1110), an operation of obtaining phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720), an operation of calculating pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410), an operation of upscaling the size of each of the N remosaic images (1130) to a size corresponding to a specified resolution,It may include an operation of upscaling the size of each of the N binned images (1120) to be the same as the size of each of the upscaled N re-mosaic images (1130), and an operation of generating an output image based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0009] In a non-transitory computer-readable medium storing instructions that cause the electronic device (101) to perform operations when executed by a processor (120) of the electronic device (101) according to one embodiment of the present disclosure, the electronic device (101) includes a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, and a driving method of the electronic device (101) comprises: an operation of acquiring N non-Bayer images of a subject by using the plurality of lens assemblies (410); An operation of obtaining N binned images (1120) having a first resolution by performing binning processing on each of the non-Bayer images (1110), an operation of obtaining N remosaic images having a second resolution greater than the first resolution by performing remosaic transformation on each of the N non-Bayer images (1110), an operation of obtaining phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720), an operation of calculating pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410), based on the phase difference data,It may include an operation of upscaling the size of each of the N re-mosaic images (1130) to a size corresponding to a specified resolution, an operation of upscaling the size of each of the N binning images (1120) to be the same as the size of each of the upscaled N re-mosaic images (1130), and an operation of generating an output image based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0010] According to embodiments of the present disclosure, the thickness of a camera device (e.g., a camera module) can be reduced, and high-quality images can be obtained even in a low-light environment.

[0011] In addition, various effects may be provided, either directly or indirectly, through this document.

[0012] Other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the accompanying drawings and the corresponding description.

[0013] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0014] FIG. 2 is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0015] FIG. 3 is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0016] FIG. 4 is a schematic perspective view of a camera module of an electronic device according to one embodiment.

[0017] Figure 5 is a schematic plan view of a camera module according to one embodiment.

[0018] Figure 6 is a flowchart illustrating a driving method of an electronic device according to one embodiment.

[0019] FIG. 7 is a conceptual diagram illustrating a method for an electronic device according to one embodiment to obtain phase difference data.

[0020] FIG. 8 is a conceptual diagram illustrating another method for an electronic device according to one embodiment to obtain phase difference data.

[0021] FIG. 9 is a drawing showing some pixels corresponding to the first lens assembly and some pixels corresponding to the second lens assembly.

[0022] FIG. 10 is an example for explaining how an electronic device according to one embodiment calculates pixel shift values.

[0023] FIG. 11 is an example for explaining how an electronic device according to one embodiment acquires a binning image.

[0024] FIG. 12 is an example for explaining how an electronic device according to one embodiment acquires a Bayer image.

[0025] FIG. 13 is an example of N binned images and N Bayer images generated by an electronic device according to one embodiment.

[0026] Figure 14 is an example of N upscaled binned images.

[0027] Figure 15 is an example of N upscaled Bayer images.

[0028] FIG. 16 is a flowchart illustrating a method for generating an output image when an electronic device is in an outdoor environment according to one embodiment.

[0029] FIG. 17 is a flowchart illustrating a method for generating an output image in a normal lighting environment by an electronic device according to one embodiment.

[0030] FIG. 18 is a flowchart illustrating a method for generating an output image in a low-light environment by an electronic device according to one embodiment.

[0031] Each of the embodiments described with reference to the drawings of the present disclosure can be independently configured as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each be independently configured. Each of the embodiments described with reference to the drawings of the present disclosure can operate independently as a single embodiment. For example, the embodiments of FIG. 1 and FIG. 2 can each operate independently.

[0032] At least two embodiments described with reference to the drawings of the present disclosure may be combined and configured. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and configured. At least two embodiments described with reference to the drawings of the present disclosure may be combined and operated. For example, at least a portion of the embodiment of FIG. 1 and at least a portion of the embodiment of FIG. 2 may be combined and operated.

[0033] When at least two embodiments described with reference to the drawings of the present disclosure are combined, at least some of the components and / or at least some of the operations included in each embodiment may be omitted. For example, when the embodiment of FIG. 1 and the embodiment of FIG. 2 are combined, at least some of the components and / or at least some of the operations included in the embodiment of FIG. 1 may be omitted, and at least some of the components and / or at least some of the operations included in the embodiment of FIG. 2 may be omitted.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to various embodiments disclosed in the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0057] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view of the front of an electronic device (101) (e.g., a mobile electronic device) according to various embodiments of the present disclosure. FIG. 3 is a perspective view of the rear of the electronic device (101) of FIG. 1 according to various embodiments of the present disclosure.

[0063] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment, the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the back plate (211) and comprises a metal and / or polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0064] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first side (210A) toward the back plate (211), at both ends of a long edge of the front plate (202). In the illustrated embodiment (see FIG. 2), the back plate (211) may include a second region (210E) that extends seamlessly from the second side (210B) toward the front plate (202), at both ends of the long edge. In some embodiments, the front plate (202) or the back plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second side (210B). In embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0065] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an input device (203) (e.g., the input module (150) of FIG. 1), an audio output device (207, 214) (e.g., the audio output module (155) of FIG. 1), a sensor module (204, 219) (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217), an indicator, and a connector (208). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0066] The display (201) may be exposed, for example, through an upper portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms a first area (210D) of a first surface (210A) and a side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first area (210D), and / or the second area (210E).

[0067] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (101) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0068] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor can be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (101) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0069] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (101), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (101).

[0070] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (101) may not include some or all of the mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0071] The indicator may be disposed, for example, on the first surface (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (101) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205). The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0072] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0073] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through a through-hole formed from the internal space of the electronic device (101) to the front plate (202) of the display (201). In another embodiment, some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, an area of ​​the display (201) facing the sensor module may not require a through-hole.

[0074] Fig. 4 is a schematic perspective view of a camera module (400) of an electronic device (101) according to one embodiment. Fig. 5 is a schematic plan view of a camera module (400) according to one embodiment.

[0075] Referring to FIGS. 4 and 5, a camera module (400) (e.g., the camera modules (205, 212) of FIGS. 2 and 3) of an electronic device (101) (e.g., the electronic device (101) of FIG. 1) according to one embodiment may be an array camera module in which a plurality of lens assemblies (410) are coupled to an image sensor (420). The array camera module can reduce the overall thickness compared to a general camera module in which one lens assembly is coupled to one image sensor (420). In the electronic device (101) according to one embodiment, since the camera module (400) is implemented as an array camera module, the camera module (400) can reduce a camera bump protruding from one surface of the electronic device (101).

[0076] According to one embodiment, the camera module (400) may be an array camera module in which m×n lens assemblies are coupled to one image sensor (420). Here, m and n may be the same or different. The electronic device (101) may simultaneously acquire m×n images of a subject from the m×n lens assemblies (410) of the camera module (400). For example, the lens assemblies (410) may be arranged on the image sensor (420) and may be arranged in an m×n matrix form. In the illustrated embodiment, the lens assemblies (410) are arranged in a 3×3 matrix form, but the present invention is not limited thereto.

[0077] According to one embodiment, the plurality of lens assemblies (410) may be divided into a first lens assembly (411) positioned at the center and a plurality of second lens assemblies (412) surrounding the first lens assembly (411). As described below, an image acquired by the first lens assembly (411) may be used as a reference image. In addition, images acquired by the plurality of second lens assemblies (412) may be used as reference images.

[0078] According to one embodiment, assuming that the camera module (400) includes N (where N is m×n) lens assemblies (410), an image captured of a subject using the camera module (400) may include N images having a size 1 / N of the size of the image sensor (420). Each of the N images may be an image of the subject captured from each of the lens assemblies (410).

[0079] According to one embodiment, the viewpoints of each of the N images of the subject captured by the camera module (400) may be different from each other depending on the different physical positions of the lens assemblies (410). In this way, the camera module (400) of the electronic device (101) according to one embodiment can simultaneously acquire images of multiple viewpoints using the plurality of lens assemblies (410). The images of multiple viewpoints acquired using the plurality of lens assemblies (410) can be used as input images for the electronic device (101) to generate a high-resolution output image.

[0080] According to one embodiment, the image sensor (420) coupled with the plurality of lens assemblies (410) may include a multi-pixel sensor (MPS) having a multi-pixel structure. The multi-pixel sensor may be an image sensor of a non-Bayer pattern (e.g., a non-Bayer sensor) that includes a combination of a plurality of pixels, such as 2x2, 3x3, or 4x4, that share the same color filter. For example, the image sensor (420) may include a first color filter, a second color filter, or a third color filter. The image sensor (420) may include a plurality of first color pixels (e.g., the first color pixels (720) of FIG. 7) overlapping a first color filter, a plurality of second color pixels (e.g., the second color pixels (710) of FIG. 7) overlapping a second color filter, or a plurality of third color pixels (e.g., the third color pixels (730) of FIG. 7) overlapping a third color filter. For example, the image sensor (420) may include 2×2, 3×3, or 4×4 first color pixels (720) arranged to overlap the first color filter. Additionally, the image sensor (420) may include 2×2, 3×3, or 4×4 second color pixels (710) arranged to overlap the second color filter. Additionally, the image sensor (420) may include 2x2, 3x3, or 4x4 third color pixels (730) arranged to overlap the third color filter.

[0081] According to one embodiment, an image sensor (420) including a multi-pixel sensor facilitates high-resolution sensing by maximizing the number of pixels. The image sensor (420) including a multi-pixel sensor can apply the effect of increasing the pixel size by performing binning between adjacent pixels. Therefore, the image sensor (420) including a multi-pixel sensor can facilitate high-resolution sensing and high-sensitivity sensing.

[0082] In various embodiments of the present disclosure, the images of multiple points of view acquired using a plurality of lens assemblies (410) are images acquired based on an image sensor (420) including a multi-pixel sensor, and are therefore defined as “N non-Bayer images.”

[0083] Figure 6 is a flowchart illustrating a driving method of an electronic device (101) according to one embodiment.

[0084] The operations illustrated in FIG. 6 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause the electronic device (101) (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 6.

[0085] At least some of the operations illustrated in FIG. 6 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 6.

[0086] According to one embodiment, at least some of the operations illustrated in FIG. 6 may be performed sequentially.

[0087] According to one embodiment, at least some of the operations illustrated in FIG. 6 can be performed in parallel (simultaneously).

[0088] Hereinafter, a driving method of an electronic device (101) according to one embodiment will be described with reference to FIG. 6.

[0089] In operation 601, an electronic device (e.g., the electronic device (101) of FIG. 1) according to an embodiment may acquire N non-Bayer images (e.g., non-Bayer images (1110) of FIG. 11) of a subject by using a plurality of lens assemblies (410) (e.g., the plurality of lens assemblies (410) of FIG. 5) coupled with an image sensor (420) (e.g., the image sensor (420) of FIG. 5). For example, assuming that a camera module (e.g., the camera module (400) of FIG. 4) includes N (where N is m×n) lens assemblies (410), an image captured by using the camera module (400) may be a non-Bayer output image including N non-Bayer images (1110) having a size 1 / N relative to the size of the image sensor (420).

[0090] In operation 603, the electronic device (101) according to one embodiment may obtain N binned images (e.g., the binned images (1120) of FIG. 11) by performing binning processing on each of the N non-Bayer images (1110). For example, it may be assumed that the camera module (400) includes nine lens assemblies (410) arranged in a 3×3 array, and the image sensor (420) includes 48MP (megapixel) formed by a combination of 2×pixels sharing the same color filter. In this case, the electronic device (101) may obtain a binned output image including nine binned images (1120) having a resolution of 1.33MP and enhanced brightness by performing the binning processing. Here, the nine binning images (1120) are high-sensitivity images that can have less noise in a low-light environment, and can be used to restore high-resolution images when the electronic device (101) is located in a normal light environment or a low-light environment. To this end, the electronic device (101) can crop the binning output image to generate nine binning images (1120).

[0091] According to one embodiment, the electronic device (101) may output any one binning image among the N binning images (1120) as a preview image. For example, the electronic device (101) may select any one binning image among the N binning images (1120) included in the binning output image, and crop the selected binning image from the binning output image. The electronic device (101) may upscale the cropped binning image to a size of a specified high resolution, and output the upscaled binning image as a preview image. According to one embodiment, when selecting any one binning image among the N binning images (1120), the electronic device (101) may select a first binning image corresponding to a first lens assembly (411) located at the center among the plurality of lens assemblies (410). According to various embodiments, when outputting the preview image, the electronic device (101) may omit an operation of upscaling the cropped binning image. For example, if the resolution of the cropped binning image is the same as or similar to the resolution of the display module (e.g., the display module (160) of FIG. 1), the electronic device (101) may omit the operation of upscaling the cropped binning image. According to various embodiments, the electronic device (101) may perform an operation of downscaling the cropped binning image instead of the operation of upscaling it when outputting the preview image. For example, if the resolution of the cropped binning image is greater than the resolution of the display module (e.g., the display module (160) of FIG. 1), the electronic device (101) may perform an operation of downscaling the cropped binning image.

[0092] In operation 605, the electronic device (101) according to one embodiment can obtain N Bayer images (e.g., remosaic images (1130) of FIG. 12) by performing remosaic transformation on each of N non-Bayer images (1110). For example, it can be assumed that the camera module (400) includes nine lens assemblies (410) arranged in a 3x3 array, and the image sensor (420) includes 48 MP formed by a combination of 2x pixels sharing the same color filter. In this case, the electronic device (101) can obtain a remosaic output image including nine remosaic images (1130) having a resolution of 5.33 MP by performing the remosaic transformation. Here, the nine re-mosaic images (1130) are high-resolution images compared to the binning images (1120), and can be used to restore high-resolution images when the electronic device (101) is located in an outdoor environment, a normal lighting environment, or a low-light environment. To this end, the electronic device (101) can crop the re-mosaic output image from the re-mosaic output image to generate the nine re-mosaic images (1130).

[0093] The term “remosaic image” as used in various embodiments of the present disclosure may be used interchangeably with terms such as “remosaic image.”

[0094] In operation 607, the electronic device (101) according to one embodiment may obtain phase difference data of each of N non-Bayer images (1110) using one micro lens (e.g., the first micro lens (702) of FIG. 7) overlapping with a plurality of first color pixels (720). According to one embodiment, the electronic device (101) may obtain phase difference data for AF (auto focus) from the N non-Bayer images (1110).

[0095] According to one embodiment, the camera module (400) may arrange one micro lens (e.g., 701, 702, 703 of FIG. 7) to correspond to pixels sharing the same color filter. For example, if the image sensor (420) is composed of a combination of 2x pixels sharing the same color filter, the camera module (400) may include one micro lens (e.g., 701, 702, 703 of FIG. 7) arranged per 2x pixels sharing the same color filter. Accordingly, the electronic device (101) can obtain phase difference data of each of the N non-Bayer images (1110) by using one micro lens (e.g., the first micro lens (702) of FIG. 7) overlapping a plurality of first color pixels (720), as well as one micro lens (e.g., the second micro lens (701) of FIG. 7) overlapping a plurality of second color pixels (710) and one micro lens (e.g., the third micro lens (703) of FIG. 7) overlapping a plurality of third color pixels (730).

[0096] According to one embodiment, as described with reference to FIG. 7, the electronic device (101) may compare a first partial image (e.g., the first partial image (741) of FIG. 7) obtained from pixels (e.g., the left pixels (721) among the first color pixels (720)) located in a first direction (e.g., the left direction) with respect to the center (e.g., 7021 of FIG. 7) of one micro lens (e.g., 701, 702, 703 of FIG. 7) and a second partial image (e.g., the second partial image (742) of FIG. 7) obtained from pixels (e.g., the right pixels (722) among the first color pixels (720)) located in a second direction opposite to the first direction (e.g., the right direction) with respect to the center (7021) of one micro lens. Based on the comparison result, the electronic device (101) may compare phase difference data (e.g., left and right) related to the phase difference in the first direction (or the second direction) with respect to the pixel. (Phase difference data of direction) can be obtained.

[0097] According to one embodiment, as described with reference to FIG. 8, the electronic device (101) can compare a first partial image (e.g., the first partial image (841) of FIG. 8) obtained from pixels (e.g., 851, 852 of FIG. 8) located in a first direction (e.g., the left direction) relative to the center (e.g., 7021 of FIG. 8) of one micro lens (e.g., 701, 702, 703 of FIG. 8), and a second partial image (e.g., the second partial image (842) of FIG. 8) obtained from pixels (e.g., 853, 854 of FIG. 8) located in a second direction (e.g., the right direction) opposite to the first direction relative to the center (7021) of one micro lens. The electronic device (101) may obtain phase difference data (e.g., left-right phase difference data) related to the phase difference in the first direction (or the second direction) as part of the phase difference data based on the result of comparing the first partial image (841) and the second partial image (842). According to one embodiment, the electronic device (101) may compare a third partial image (e.g., the third partial image (843) of FIG. 8) obtained from pixels (e.g., 852 and 853 of FIG. 8) located in a third direction (e.g., upward direction) perpendicular to the first direction with respect to the center (7021) of one micro lens, and a fourth partial image (e.g., the fourth partial image (844) of FIG. 8) obtained from pixels (e.g., 851 and 854 of FIG. 8) located in a fourth direction (e.g., downward direction) opposite to the third direction with respect to the center (7021) of one micro lens. The electronic device (101) can obtain phase difference data (e.g., phase difference data in the up-down direction) related to the phase difference in the third direction (or fourth direction) as part of the phase difference data based on the result of comparing the third partial image (843) and the fourth partial image (844).

[0098] The term "phase difference data" used in various embodiments of the present disclosure may be used interchangeably with terms such as phase detection data.

[0099] In operation 609, the electronic device (101) according to one embodiment may calculate pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to the first lens assembly (411) among the plurality of lens assemblies (410), based on phase difference data. For example, the pixel shift values ​​may be used for rectification to estimate a matching point of images to be synthesized when restoring a high-resolution image.

[0100] In operation 611, the electronic device (101) according to one embodiment can upscale the size of each of the N re-mosaic images (1130) to a size corresponding to a specified resolution. For example, the electronic device (101) can upscale each of the N re-mosaic images (1130) obtained by re-mosaic transformation to a size corresponding to a specified high resolution through bilinear interpolation.

[0101] In operation 613, the electronic device (101) according to one embodiment can upscale the size of each of the N binned images (1120) to be the same as the size of each of the upscaled N re-mosaic images (1130). For example, the electronic device (101) can upscale each of the N binned images (1120) obtained by the binning process to a size corresponding to a specified high resolution through bilinear interpolation. The size of each of the binned images (1120) is 1 / 4 times the size of each of the re-mosaic images (1130), assuming that the image sensor (420) is composed of a combination of 2×pixels sharing the same color filter. Therefore, the electronic device (101) can first upscale the binned images (1120) to a size 4 times larger to convert them to the same size as the re-mosaic images (1130). The electronic device (101) can convert the first upscaled binned images (1120) into a size corresponding to a specified high resolution by second upscaling them.

[0102] In operation 615, the electronic device (101) according to one embodiment may generate an output image based on at least some of the N upscaled re-mosaic images and the N upscaled binned images. The electronic device (101) according to one embodiment may detect external illuminance, and generate an output image using at least some of the N re-mosaic images and the N upscaled binned images based on the detected external illuminance. The electronic device (101) may perform rectification or synthesis on the re-mosaic images and / or the binned images in generating the final output image.

[0103] The term "alignment" used in various embodiments of the present disclosure refers to an operation performed based on pixel shift values, and may include a process of estimating a matching point for matching images. When an electronic device (101) restores a high-resolution image, the higher the accuracy of the alignment, which is the process of estimating a matching point, the higher the quality of the image can be obtained.

[0104] The term "synthesis" used in various embodiments of the present disclosure may refer to the process of generating a single image by calculating the average of images. According to one embodiment, the electronic device (101) may perform synthesis according to a weight that prioritizes clarity or a weight that prioritizes noise reduction when synthesizing images.

[0105] According to one embodiment, the electronic device (101) can detect the external illuminance of the electronic device (101) based on the exposure value of the camera module (400). According to various embodiments, when detecting the external illuminance, the electronic device (101) can obtain an illuminance value corresponding to the external illuminance through a separate illuminance sensor (e.g., the sensor module (176) of FIG. 1) rather than based on the exposure value.

[0106] According to one embodiment, the electronic device (101) can select at least some of the N aligned re-mosaic images (1130) and the N aligned binned images (1120) according to the detected external illuminance, and can align and / or synthesize the selected images to ultimately generate one output image. According to one embodiment, the electronic device (101) can classify the environment of the electronic device (101) into a general illuminance environment, an outdoor environment, or a low illuminance environment. The electronic device (101) can vary the method for generating the final output image depending on the classified environment of the electronic device (101). The operation of the electronic device (101) will be described in detail below with reference to FIGS. 16 to 18.

[0107] The term “output image” used in the present disclosure means a high-resolution image ultimately generated by the electronic device (101), and may be used interchangeably with terms such as “final image”, “high-resolution image”, etc.

[0108] FIG. 7 is a conceptual diagram illustrating a method for an electronic device (101) to obtain phase difference data according to one embodiment. FIG. 8 is a conceptual diagram illustrating another method for an electronic device (101) to obtain phase difference data according to one embodiment.

[0109] FIGS. 7 and 8 are plan views each illustrating a portion of an image sensor (420) (e.g., the image sensor (420) of FIG. 5), wherein first color pixels (720) overlapping a first color filter, second color pixels (710) overlapping a second color filter, and third color pixels (730) overlapping a third color filter are arranged. For example, in FIGS. 7 and 8, reference numeral 720 represents 2×3× or 4× first color pixels (720) arranged to share a first color filter. For example, in FIGS. 7 and 8, reference numeral 710 represents 2×3× or 4× second color pixels (710) arranged to share a second color filter. For example, in FIGS. 7 and 8, reference numeral 730 represents 2ⅹ3ⅹ or 4ⅹ third color pixels (730) arranged to share a third color filter.

[0110] FIGS. 7 and 8 each illustrate one microlens (e.g., a first microlens (702)) overlapping the first color pixels (720), one microlens (e.g., a second microlens (701)) overlapping the second color pixels (710), or one microlens (e.g., a third microlens (703)) overlapping the third color pixels (730).

[0111] Referring to FIGS. 7 and 8, an image sensor (420) (e.g., the image sensor (420) of FIG. 5) of a camera module (400) (e.g., the camera module (400) of FIG. 4) according to one embodiment may include 2×3× or 4× first color pixels (720) arranged to overlap a first color filter. In addition, the image sensor (420) may include 2×3× or 4× second color pixels (710) arranged to overlap a second color filter. In addition, the image sensor (420) may include 2×3× or 4× third color pixels (730) arranged to overlap a third color filter.

[0112] In one embodiment, the camera module (400) may arrange one micro lens (701, 702, 703) to correspond to pixels that share the same color filter. For example, if the image sensor (420) is composed of a combination of 2x pixels that share the same color filter, the camera module (400) may include one micro lens (701, 702, 703) arranged per 2x pixels that share the same color filter. Accordingly, the electronic device (101) can obtain phase difference data of each of the N non-Bayer images (1110) by using one micro lens (e.g., the first micro lens (702)) overlapping a plurality of first color pixels (720), as well as one micro lens (e.g., the second micro lens (701)) overlapping a plurality of second color pixels (710) and one micro lens (e.g., the third micro lens (703)) overlapping a plurality of third color pixels (730).

[0113] Referring to FIG. 7, an electronic device (101) according to one embodiment may compare a first partial image (741) obtained from pixels (e.g., left pixels among first color pixels (720)) located in a first direction (e.g., left direction) based on a center (7021) of one micro lens (701, 702, 703), and a second partial image (742) obtained from pixels (e.g., right pixels among first color pixels (720)) located in a second direction opposite to the first direction (e.g., right direction) based on the center (7021) of one micro lens. Based on the comparison result, the electronic device (101) may obtain phase difference data related to a left-right phase difference.

[0114] Referring to FIG. 8, according to one embodiment, the electronic device (101) can compare a first partial image (e.g., the first partial image (841) of FIG. 8) obtained from pixels (e.g., LT, LB of FIG. 8) located to the left (e.g., 851, 852 of FIG. 8) based on the center (7021) of one micro lens (701, 702, 703), and a second partial image (e.g., the second partial image (842) of FIG. 8) obtained from pixels (e.g., RT, RB of FIG. 8) located to the right (e.g., 853, 854 of FIG. 8) based on the center (7021) of one micro lens (701, 702, 703). The electronic device (101) can obtain a portion of phase difference data regarding the left-right direction (e.g., the first direction) based on the result of comparing the first partial image (841) and the second partial image (842). According to one embodiment, the electronic device (101) can compare a third partial image (e.g., the third partial image (843) of FIG. 8) obtained from pixels (e.g., LT, RT of FIG. 8) located in an upward direction based on the center (7021) of one micro lens (701, 702, 703) (e.g., 852, 853 of FIG. 8)) and a fourth partial image (e.g., the fourth partial image (844) of FIG. 8) obtained from pixels (e.g., LB, RB of FIG. 8) located in a downward direction based on the center (7021) of one micro lens (701, 702, 703) (e.g., 851, 854 of FIG. 8). The electronic device (101) can obtain a portion of phase difference data in the up-down direction (e.g., the third direction perpendicular to the first direction) based on the result of comparing the third partial image (843) and the fourth partial image (844).

[0115] Fig. 9 is a diagram illustrating some pixels corresponding to the first lens assembly and some pixels corresponding to the second lens assembly. For example, Fig. 9 describes phase difference data between pixels of a camera module (400) in which 3x3 lens assemblies (410) are coupled to an image sensor (420) and one micro lens is arranged in pixels that share the same color filter. For example, in Fig. 9, 411 represents a first lens assembly (411) (e.g., the first lens assembly (411) of Fig. 5) located at the center among the 3x3 lens assemblies (410) (e.g., the lens assemblies (410) of Fig. 5) or a corresponding area of ​​the first lens assembly (411). For example, in FIG. 9, 412 represents a second lens assembly (412) (e.g., the second lens assembly (412) of FIG. 5) or a corresponding area of ​​the second lens assembly (412) among the 3x3 lens assemblies (410).

[0116] In FIG. 9, a 2x2 micro lens is provided inside each lens assembly (411, 412), for example, the first lens assembly (411), and partial images (911, 912, 921, 922) are acquired from pixels corresponding to the 2x2 micro lens. However, this is only for convenience of explanation, and in reality, a larger number of pixels are provided inside each lens assembly (411, 412) than the illustrated example. For example, FIG. 9 illustrates pixels corresponding to a 2x2 micro lens, which is a part of the pixels of 48MP.

[0117] Referring to FIG. 9, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may acquire a first non-Bayer image through a first lens assembly (411) (e.g., the first lens assembly (411) of FIG. 5), and may acquire at least one phase difference data (d) in a left-right direction (e.g., the first direction) based on a result of comparing a first partial image (911) and a second partial image (912) of the acquired first non-Bayer image. At least one phase difference data acquired from the first non-Bayer image may be defined as reference phase difference data.

[0118] An electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may acquire a second non-Bayer image through a second lens assembly (412) (e.g., the second lens assembly (412) of FIG. 5), and may acquire at least one phase difference data (d) regarding a left-right direction (e.g., a first direction) based on a result of comparing a first partial image (921) and a second partial image (922) of the acquired second non-Bayer image, which may be substantially the same as the phase difference data (d) acquired by comparing a first partial image (911) and a second partial image (912) of the first non-Bayer image.

[0119] According to one embodiment, the phase difference data for the first non-Bayer image acquired from the sensor areas of the first lens assembly (411) and the second non-Bayer image acquired from the sensor areas of the second lens assembly (412) may have a phase difference of Δ. A difference (e.g., Δ) between the phase when the first lens assembly (411) views a subject and the phase when the second lens assemblies (412) view a subject occurs, and the difference (e.g., Δ) occurs due to a T value, which is a physical distance between the first lens assembly (411) and the second lens assembly (412). Here, the T value is a variable indicating the physical distance between the lens assemblies (410) and may be named “baseline distance.” The term “T value” as used in the present disclosure may mean the distance between the optical focus position of the first lens assembly (411) (e.g., the position where the image sensor’s image height is ‘0’) and the optical focus position of the second lens assembly (412) (e.g., the position where the image sensor’s image height is ‘0’).

[0120] According to one embodiment, the electronic device (101) may further perform an operation of obtaining a phase difference (Δ) by comparing a first non-Bayer image obtained from the sensor areas of the first lens assembly (411) with a second non-Bayer image obtained from the sensor areas of the second lens assembly (412), as an operation of obtaining phase difference data.

[0121] According to one embodiment, the electronic device (101) can calculate a Z value (e.g., target depth), which is a distance between the camera module (400) and the subject, based on calculating phase difference data (e.g., d, Δ in FIG. 9).

[0122] FIG. 10 is an example for explaining how an electronic device (101) according to one embodiment calculates pixel shift values.

[0123] Referring to FIG. 10, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) calculates a Z value (e.g., target depth) which is a distance between a camera module (400) (e.g., the camera module (400) of FIG. 4) and a subject, and then applies the calculated Z value and the T value which is a physical distance between lens assemblies (410) to a trigonometric proportion to calculate a pixel shift value for estimating a matching point between a first non-Bayer image (1011) and second non-Bayer images (1012).

[0124] FIG. 10 illustrates a pixel shift difference between a first non-Bayer image (1011) and second non-Bayer images (1012) acquired using a camera module (400) according to one embodiment, and a method for calculating a pixel shift value. FIG. 10 illustrates an electronic device (101) according to one embodiment comparing a specific part (e.g., a corner of a rear bumper of a car) of a specific object (e.g., a car) commonly included in the first non-Bayer image (1011) and the second non-Bayer images (1012), and calculating a pixel shift value between a specific pixel X_l of the first non-Bayer image (1011) and a specific pixel X_r of the second non-Bayer image (1012).

[0125] FIG. 11 is an example for explaining a method for an electronic device (101) to obtain a binning image according to one embodiment.

[0126] Referring to FIG. 11, an electronic device (101) according to an embodiment (e.g., the electronic device (101) of FIG. 1) may obtain N binned images (1120) by performing binning processing on each of N non-Bayer images (1110). For example, it may be assumed that an image sensor (420) (e.g., the image sensor (420) of FIG. 5) of a camera module (400) (e.g., the camera module (400) of FIG. 4) includes 48 MP configured as a combination of 2× pixels sharing the same color filter. In this case, the electronic device (101) may obtain a binned image in which a sensitivity ratio is improved by approximately two times by performing pixel average merge (i.e., binning processing) on ​​the 2× pixels sharing the color filter.

[0127] The size of each of the binning images (1120) is 1 / 4 times the size of the non-Bayer image, assuming that the image sensor (420) is composed of a combination of 2x pixels sharing the same color filter. The brightness of each of the binning images (1120) is twice the brightness of the non-Bayer image, assuming that the image sensor (420) is composed of a combination of 2x pixels sharing the same color filter. For example, a Gr image (720a) acquired from 2x Gr pixels is converted into a Gr binning image (720b) ​​of 1 / 4 the size and 2 times the brightness by binning. For example, an R image (710a) acquired from 2x R pixels is converted into an R binning image (710b) of 1 / 4 the size and 2 times the brightness by binning. For example, a B image (730a) acquired from 2x B pixels is converted into a B binning image (730b) of 1 / 4 size and 2x brightness through binning processing. For example, a Gb image (720a) acquired from 2x Gr pixels is converted into a Gb binning image (720b) ​​of 1 / 4 size and 2x brightness through binning processing.

[0128] FIG. 12 is an example for explaining a method for an electronic device (101) to acquire a Bayer image according to one embodiment.

[0129] An electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) can obtain N Bayer images by performing remosaic transformation on each of N non-Bayer images (1110). For example, it can be assumed that an image sensor (420) (e.g., the image sensor (420) of FIG. 5) of a camera module (400) (e.g., the camera module (400) of FIG. 4) includes 48 MP formed by a combination of 2×pixels sharing the same color filter. In this case, the electronic device (101) can obtain remosaic images (1130) converted into a Bayer pattern by performing remosaic transformation on the 2×pixels sharing the color filter.

[0130] For example, a Gr image (720a) obtained from 2x Gr pixels is converted into a BGGR or RGGB Bayer pattern image (710c, 720c, 730c) by re-mosaic transformation using 2x R pixels or 2x B pixels arranged around it. For example, a R image (710a) obtained from 2x R pixels is converted into a GRBG, BGGR, or RGGB Bayer pattern image (710c, 720c, 730c) by re-mosaic transformation using 2x Gr pixels or 2x B pixels arranged around it. For example, a B image (730a) obtained from 2x B pixels is converted into a Bayer pattern image (710c, 720c, 730c) of GRBG, BGGR, or RGGB by re-mosaic transformation using 2x Gr pixels or 2x R pixels arranged around it. For example, a Gr image (720a) obtained from 2x Gr pixels is converted into a Bayer pattern image (710c, 720c, 730c) of GRBG, BGGR, or RGGB by re-mosaic transformation using 2x R pixels or 2x B pixels arranged around it.

[0131] Fig. 13 is an example of N binned images (1310) and N re-mosaic images (1320) generated by an electronic device (101) according to one embodiment. Fig. 14 is an example of N upscaled binning images (1410). Fig. 15 is an example of N upscaled re-mosaic images (1510).

[0132] Referring to FIG. 13, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) generates N binning images (1310) and N remosaic images (1320) for restoration of a high-resolution image.

[0133] An electronic device (101) according to one embodiment can obtain N binned images (1310) by performing binning processing on each of N non-Bayer images (e.g., the non-Bayer image (1110) of FIG. 11). For example, it can be assumed that a camera module (400) (e.g., the camera module (400) of FIG. 4) includes nine lens assemblies (410) arranged in a 3×3 array, and an image sensor (420) (e.g., the image sensor (420) of FIG. 5) includes 48 MP formed by a combination of 2× pixels sharing the same color filter. In this case, the electronic device (101) can obtain a binned output image including nine binned images (1310) having a resolution of 1.33 MP and enhanced brightness by performing binning processing. The nine binning images (1310) may include a first binning image (1311) obtained by the first lens assembly (411) and second binning images (1312) obtained by the plurality of second lens assemblies (412). The electronic device (101) may obtain N binning images (1310) including the first binning image (1311) and the second binning images (1312) by cropping the binning output image.

[0134] An electronic device (101) according to one embodiment can obtain N Bayer images by performing remosaic transformation on each of N non-Bayer images (1110). For example, it can be assumed that a camera module (400) includes nine lens assemblies (410) arranged in a 3x3 array, and an image sensor (420) includes 48MP formed by a combination of 2x pixels sharing the same color filter. In this case, the electronic device (101) can obtain a remosaic output image including nine remosaic images (1320) having a resolution of 5.33MP by performing remosaic transformation. The nine re-mosaic images (1320) may include a first re-mosaic image (1321) acquired by the first lens assembly (411) and second re-mosaic images (1322) acquired by the plurality of second lens assemblies (412). The electronic device (101) may acquire N re-mosaic images (1320) including the first re-mosaic image (1321) and the second re-mosaic images (1322) by cropping the re-mosaic output image.

[0135] Referring to FIGS. 14 and 15, an electronic device (101) according to an embodiment can obtain re-mosaic images (1510) as illustrated in FIG. 15 by upscaling the size of each of N cropped re-mosaic images (e.g., re-mosaic images (1320) of FIG. 13) to a size corresponding to a specified resolution. For example, the electronic device (101) can obtain re-mosaic images (1510) upscaled to a size corresponding to a specified high resolution (e.g., a third resolution) by performing bilinear interpolation on each of N re-mosaic images (1320) obtained by re-mosaic transformation.

[0136] An electronic device (101) according to one embodiment can upscale the size of each of N cropped binning images (e.g., binning images (1310) of FIG. 13) to be the same as the size of each of N upscaled re-mosaic images (e.g., re-mosaic images (1320) of FIG. 13). For example, the electronic device (101) can obtain binning images (1410) upscaled to a size corresponding to a specified high resolution (e.g., a third resolution) by performing bilinear interpolation on each of N binning images (1310) obtained by binning processing. The size of each of the binning images (1310) is 1 / 4 times the size of each of the re-mosaic images (1320), assuming that the image sensor (420) is configured as a combination of 2×pixels sharing the same color filter. Accordingly, the electronic device (101) can first upscale the binned images (1310) to a size four times larger and convert them to the same size as the remosaic images (1320). The electronic device (101) can secondarily upscale the binned images that have been first upscaled to a size corresponding to a specified high resolution (e.g., a third resolution).

[0137] FIG. 16 is a flowchart illustrating a method for generating an output image when an electronic device (101) is in an outdoor environment according to one embodiment.

[0138] The operations illustrated in FIG. 16 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause the electronic device (101) (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 16.

[0139] At least some of the operations illustrated in FIG. 16 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 16.

[0140] According to one embodiment, at least some of the operations illustrated in FIG. 16 may be performed sequentially.

[0141] According to one embodiment, at least some of the operations illustrated in FIG. 16 can be performed in parallel (simultaneously).

[0142] Hereinafter, with reference to FIG. 16, a method for generating an output image when an electronic device (101) according to one embodiment is in an outdoor environment will be described.

[0143] In operation 1610, an electronic device (e.g., the electronic device (101) of FIG. 1) according to one embodiment may detect external illuminance of the electronic device (101). The electronic device (101) may detect the external illuminance of the electronic device (101) based on an exposure value of a camera module (e.g., the camera module (400) of FIG. 4). According to various embodiments, when detecting the external illuminance, the electronic device (101) may obtain an illuminance value corresponding to the external illuminance through a separate illuminance sensor (e.g., the sensor module (176) of FIG. 1) rather than based on the exposure value.

[0144] In operation 1620, the electronic device (101) according to one embodiment may generate an output image by aligning the N upscaled remosaic images based on pixel shift values ​​if the detected external illuminance is greater than or equal to the first reference illuminance. For example, if the external illuminance is greater than or equal to the first reference illuminance, the electronic device (101) may be considered to be located in an outdoor environment. In the case of an outdoor environment, the noise of the image captured through the camera module (400) is relatively low, and therefore, the need for high-sensitivity shooting is low. Therefore, the electronic device (101) according to one embodiment may not use the N binning images (e.g., the binning images 1410 of FIG. 14), which are high-sensitivity images, for image synthesis if the detected external illuminance is greater than or equal to the first reference illuminance. According to one embodiment, the electronic device (101) may omit operation 613 of FIG. 6, since it does not use the N binned images, which are high-sensitivity images, in the process of generating an output image if the detected external illuminance is greater than or equal to the first reference illuminance. According to one embodiment, the electronic device (101) may generate one output image by aligning the N remosaic images acquired as a result of operation 611 of FIG. 6, if the detected external illuminance is greater than or equal to the first reference illuminance.

[0145] FIG. 17 is a flowchart illustrating a method for generating an output image when an electronic device (101) is in a normal lighting environment according to one embodiment.

[0146] The operations illustrated in FIG. 17 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause an electronic device (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 17.

[0147] At least some of the operations illustrated in FIG. 17 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 17.

[0148] According to one embodiment, at least some of the operations illustrated in FIG. 17 may be performed sequentially.

[0149] According to one embodiment, at least some of the operations illustrated in FIG. 17 may be performed in parallel (simultaneously).

[0150] Hereinafter, with reference to FIG. 17, a method for generating an output image when an electronic device (101) (e.g., the electronic device (101) of FIG. 1) according to one embodiment is in a normal lighting environment will be described.

[0151] In operation 1710, an electronic device (101) according to an embodiment may detect external illuminance of the electronic device (101). The electronic device (101) may detect the external illuminance of the electronic device (101) based on an exposure value of a camera module (e.g., a camera module (400) of FIG. 4). According to various embodiments, when detecting the external illuminance, the electronic device (101) may obtain an illuminance value corresponding to the external illuminance through a separate illuminance sensor (e.g., a sensor module (176) of FIG. 1) rather than based on the exposure value.

[0152] In operation 1720, the electronic device (101) according to one embodiment may generate one reference re-mosaic image by aligning N aligned re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) if the detected external illuminance is less than the first reference illuminance and greater than or equal to the second reference illuminance. For example, if the external illuminance is less than the first reference illuminance and greater than or equal to the second reference illuminance, the electronic device (101) may be considered to be located in a normal illuminance environment. In this case, the electronic device (101) may align the N aligned re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) based on pixel shift values ​​to generate one re-mosaic image, i.e., the reference re-mosaic image.

[0153] In operation 1730, the electronic device (101) according to one embodiment may generate one reference binning image by aligning N sorted binning images (e.g., binning images (1410) of FIG. 14). When the electronic device (101) determines that it is located in a normal illumination environment, the electronic device (101) may generate one binning image, i.e., a reference binning image, by aligning the N sorted binning images (e.g., binning images (1410) of FIG. 14) based on pixel shift values.

[0154] In operation 1740, the electronic device (101) according to one embodiment can generate an output image by synthesizing a reference re-mosaic image and a reference binning image. The electronic device (101) according to one embodiment can obtain an output image with low noise and ultra-high resolution by synthesizing a reference binning image generated by aligning high-sensitivity binning images (e.g., binning images (1410) of FIG. 14) and a reference re-mosaic image generated by aligning high-resolution re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15).

[0155] FIG. 18 is a flowchart illustrating a method for generating an output image when an electronic device (101) is in a low-light environment according to one embodiment.

[0156] The operations illustrated in FIG. 18 may be performed by instructions stored in a memory (130) (e.g., the memory (130) of FIG. 1). For example, when the instructions are executed by a processor (120) (e.g., the processor (120) of FIG. 1), the instructions may cause the electronic device (101) (e.g., the electronic device (101) of FIG. 1) to perform the operations illustrated in FIG. 18.

[0157] At least some of the operations illustrated in FIG. 18 may be omitted. At least some of the operations mentioned with reference to other drawings in this disclosure may be additionally inserted before or after at least some of the operations illustrated in FIG. 18.

[0158] According to one embodiment, at least some of the operations illustrated in FIG. 18 may be performed sequentially.

[0159] According to one embodiment, at least some of the operations illustrated in FIG. 18 may be performed in parallel (simultaneously).

[0160] Hereinafter, with reference to FIG. 18, a method for generating an output image in an electronic device (101) according to one embodiment in a low-light environment will be described.

[0161] In operation 1810, an electronic device (e.g., the electronic device (101) of FIG. 1) according to one embodiment may detect external illuminance of the electronic device (101). The electronic device (101) may detect the external illuminance of the electronic device (101) based on an exposure value of a camera module (e.g., the camera module (400) of FIG. 4). According to various embodiments, when detecting the external illuminance, the electronic device (101) may obtain an illuminance value corresponding to the external illuminance through a separate illuminance sensor (e.g., the sensor module (176) of FIG. 1) rather than based on the exposure value.

[0162] In operation 1820, the electronic device (101) according to one embodiment can generate N composite images by synthesizing N re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) and N binning images (e.g., binning images (1410) of FIG. 14) if the detected external illuminance is less than the second reference illuminance. For example, the electronic device (101) can synthesize N re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) and N binning images (e.g., binning images (1410) of FIG. 14) in a one-to-one manner. The electronic device (101) can generate a first composite image by synthesizing a first re-mosaic image among N re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) and a first binning image among N binning images (e.g., binning images (1410) of FIG. 14). The electronic device (101) can generate a second composite image by synthesizing a second re-mosaic image among N re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) and a second binning image among N binning images (e.g., binning images (1410) of FIG. 14). The electronic device (101) can generate a third composite image by synthesizing a third re-mosaic image among N re-mosaic images (e.g., re-mosaic images (1510) of FIG. 15) and a third binning image among N binning images (e.g., binning images (1410) of FIG. 14). The electronic device (101) can generate a fourth composite image, a fifth composite image, a sixth composite image, a seventh composite image, an eighth composite image, and a ninth composite image in a manner similar to the description described above.

[0163] According to one embodiment, the second reference illuminance may be set to a value lower than the first reference illuminance. For example, if the external illuminance is lower than the second reference illuminance, the electronic device (101) may be considered to be located in a low-light environment. In a low-light environment, the noise in the image captured through the camera module (400) is relatively high, and therefore, the need for high-sensitivity shooting is high. In this case, the electronic device (101) may first synthesize N re-mosaic images (1510) and N binning images (1410) in a one-to-one manner. According to one embodiment, the electronic device (101) may first synthesize N re-mosaic images (1510) and N binning images (1410) in a one-to-one manner, thereby preferentially reducing noise in the images used to generate the output image.

[0164] In operation 1830, the electronic device (101) according to one embodiment can generate one output image by aligning the generated N composite images based on pixel shift values. The electronic device (101) according to one embodiment can obtain a high-quality output image with less noise in a low-illuminance environment where the external illuminance is lower than the second reference illuminance.

[0165] An electronic device (101) according to one embodiment of the present disclosure comprises a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, a memory (130) storing commands, and a processor (120), wherein the commands, when executed by the processor (120), cause the electronic device (101) to acquire N non-Bayer images photographing a subject using the plurality of lens assemblies (410), and perform binning processing on each of the N non-Bayer images (1110), thereby obtaining N binning images having a first resolution. By obtaining images (1120) and performing remosaic transformation on each of the N non-Bayer images (1110), N remosaic images having a second resolution greater than the first resolution are obtained, phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720) is obtained, and based on the phase difference data, pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410) are calculated, and the size of each of the N remosaic images (1130) is upscaled to a size corresponding to a specified resolution,The size of each of the N binning images (1120) may be upscaled to be the same as the size of each of the upscaled N re-mosaic images (1130), and an output image may be generated based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0166] The above commands, when executed by the processor (120), may cause the electronic device (101) to obtain the phase difference data by comparing a first partial image obtained from first color pixels (720) located in a first direction relative to the center of one micro lens and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction relative to the center of one micro lens, and obtaining the phase difference data based on the result of the comparison.

[0167] The above instructions, when executed by the processor (120), may cause the electronic device (101) to generate the output image by detecting external illuminance of the electronic device (101) and, if the detected external illuminance is greater than or equal to a first reference illuminance, aligning the upscaled N remosaic images (1130) to generate one output image.

[0168] The above instructions, when executed by the processor (120), may cause the electronic device (101) to detect external illuminance of the electronic device (101) as an operation for generating the output image, and if the detected external illuminance is less than a first reference illuminance and greater than or equal to a second reference illuminance, generate one reference re-mosaic image by aligning the upscaled N re-mosaic images (1130), generate one reference binning image by aligning the upscaled N binning images (1120), and generate the output image by synthesizing the reference re-mosaic image and the reference binning image.

[0169] The above instructions, when executed by the processor (120), may cause the electronic device (101) to detect external illuminance of the electronic device (101) as an operation for generating the output image, and if the detected external illuminance is less than a second reference illuminance, generate N composite images by synthesizing the upscaled N re-mosaic images (1130) and the upscaled N binning images (1120) in a one-to-one manner, and generate one output image by aligning the generated N composite images.

[0170] The above instructions, when executed by the processor (120), cause the electronic device (101) to obtain the phase difference data, by comparing a first partial image obtained from first color pixels (720) located in a first direction relative to the center of one micro lens and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction relative to the center of one micro lens, and obtaining a part of the phase difference data with respect to the first direction or the second direction based on a result of comparing the first partial image and the second partial image, and comparing a third partial image obtained from first color pixels (720) located in a third direction perpendicular to the first direction relative to the center of one micro lens and a fourth partial image obtained from first color pixels (720) located in a fourth direction opposite to the third direction relative to the center of one micro lens, and based on a result of comparing the third partial image and the fourth partial image, It is possible to obtain a portion of the phase difference data with respect to the third direction or the fourth direction perpendicular to the first direction.

[0171] The above instructions, when executed by the processor (120), may cause the electronic device (101) to further perform an operation of obtaining the phase difference data by comparing images obtained from a plurality of sensor areas corresponding to the plurality of lens assemblies.

[0172] The first lens assembly (411) is a lens assembly located at the center among the plurality of lens assemblies (410), and the second lens assemblies (412) can be arranged to surround the first lens assembly (411).

[0173] A driving method of an electronic device (101) according to an embodiment of the present disclosure, wherein the electronic device (101) includes a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, and the driving method of the electronic device (101) includes an operation of acquiring N non-Bayer images that capture a subject using the plurality of lens assemblies (410), an operation of acquiring N binning images (1120) having a first resolution by performing binning processing on each of the N non-Bayer images (1110), and an operation of performing a binning process on each of the N non-Bayer images (1110). An operation of obtaining N remosaic images having a second resolution greater than the first resolution by performing remosaic transformation, an operation of obtaining phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720), an operation of calculating pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410), an operation of upscaling the size of each of the N remosaic images (1130) to a size corresponding to a specified resolution,It may include an operation of upscaling the size of each of the N binned images (1120) to be the same as the size of each of the upscaled N re-mosaic images (1130), and an operation of generating an output image based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0174] The operation of acquiring the phase difference data may include an operation of comparing a first partial image acquired from first color pixels (720) located in a first direction based on the center of one micro lens and a second partial image acquired from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens, and an operation of acquiring the phase difference data based on the result of the comparison.

[0175] The operation of generating the output image may include an operation of detecting external illuminance of the electronic device (101), and an operation of generating one output image by aligning the N upscaled remosaic images (1130) if the detected external illuminance is greater than or equal to a first reference illuminance.

[0176] The operation of generating the output image may include an operation of detecting external illuminance of the electronic device (101), and if the detected external illuminance is less than a first reference illuminance and greater than or equal to a second reference illuminance, an operation of generating one reference re-mosaic image by aligning the upscaled N re-mosaic images (1130), an operation of generating one reference binning image by aligning the upscaled N binning images (1120), and an operation of generating the output image by synthesizing the reference re-mosaic image and the reference binning image.

[0177] The operation of generating the output image may include an operation of detecting external illuminance of the electronic device (101), and if the detected external illuminance is less than a second reference illuminance, an operation of generating N composite images by synthesizing the upscaled N re-mosaic images (1130) and the upscaled N binning images (1120) in a one-to-one manner, and an operation of generating one output image by aligning the generated N composite images.

[0178] The operation of obtaining the phase difference data includes: an operation of comparing a first partial image obtained from first color pixels (720) located in a first direction based on the center of the one micro lens, and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction based on the center of the one micro lens; an operation of obtaining a part of the phase difference data with respect to the first direction or the second direction based on a result of comparing the first partial image and the second partial image; an operation of comparing a third partial image obtained from first color pixels (720) located in a third direction perpendicular to the first direction based on the center of the one micro lens, and a fourth partial image obtained from first color pixels (720) located in a fourth direction opposite to the third direction based on the center of the one micro lens; and an operation of obtaining a part of the phase difference data with respect to the third direction or the fourth direction perpendicular to the first direction based on a result of comparing the third partial image and the fourth partial image. May include actions.

[0179] The operation of obtaining the phase difference data may include an operation of obtaining the phase difference by comparing images obtained from a plurality of sensor areas corresponding to the plurality of lens assemblies.

[0180] The first lens assembly (411) is a lens assembly located at the center among the plurality of lens assemblies (410), and the second lens assemblies (412) can be arranged to surround the first lens assembly (411).

[0181] In a non-transitory computer-readable medium storing instructions that cause the electronic device (101) to perform operations when executed by a processor (120) of the electronic device (101) according to one embodiment of the present disclosure, the electronic device (101) includes a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter, and a driving method of the electronic device (101) comprises: an operation of acquiring N non-Bayer images of a subject by using the plurality of lens assemblies (410); An operation of obtaining N binned images (1120) having a first resolution by performing binning processing on each of the non-Bayer images (1110), an operation of obtaining N remosaic images having a second resolution greater than the first resolution by performing remosaic transformation on each of the N non-Bayer images (1110), an operation of obtaining phase difference data representing a phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720), an operation of calculating pixel shift values ​​representing a distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410), based on the phase difference data,It may include an operation of upscaling the size of each of the N re-mosaic images (1130) to a size corresponding to a specified resolution, an operation of upscaling the size of each of the N binning images (1120) to be the same as the size of each of the upscaled N re-mosaic images (1130), and an operation of generating an output image based on at least some of the upscaled N re-mosaic images (1130) and / or the upscaled N binning images (1120).

[0182] The operation of acquiring the phase difference data may include an operation of comparing a first partial image acquired from first color pixels (720) located in a first direction based on the center of one micro lens and a second partial image acquired from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens, and an operation of acquiring the phase difference data based on the result of the comparison.

[0183] The operation of generating the output image may include an operation of detecting external illuminance of the electronic device (101), and an operation of generating one output image by aligning the N upscaled remosaic images (1130) if the detected external illuminance is greater than or equal to a first reference illuminance.

[0184] The operation of generating the output image may include an operation of detecting external illuminance of the electronic device (101), and if the detected external illuminance is less than a first reference illuminance and greater than or equal to a second reference illuminance, an operation of generating one reference re-mosaic image by aligning the upscaled N re-mosaic images (1130), an operation of generating one reference binning image by aligning the upscaled N binning images (1120), and an operation of generating the output image by synthesizing the reference re-mosaic image and the reference binning image.

Claims

1. In an electronic device (101), A camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter; Memory (130) for storing commands; and Includes a processor (120), The above commands, when executed by the processor (120), cause the electronic device (101) to: Acquire N non-Bayer images of a subject using the above multiple lens assemblies (410), By performing binning processing on each of the N non-Bayer images (1110), N binning images (1120) having a first resolution are obtained, By performing a remosaic transformation on each of the N non-Bayer images (1110), N remosaic images having a second resolution greater than the first resolution are obtained, Obtain phase difference data representing the phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720), Based on the phase difference data, pixel shift values ​​representing the distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410) are calculated, Upscaling the size of each of the above N re-mosaic images (1130) to a size corresponding to a specified resolution, Upscaling the size of each of the N binned images (1120) to be the same as the size of each of the N upscaled remosaic images (1130), Generating an output image based on at least some of the above upscaled N re-mosaic images (1130) and / or the above upscaled N binned images (1120), Electronic device (101).

2. In paragraph 1, The above commands, when executed by the processor (120), cause the electronic device (101) to obtain the phase difference data. A first partial image obtained from first color pixels (720) located in a first direction based on the center of one micro lens and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens are compared, and Based on the above comparison results, to obtain the phase difference data, Electronic device (101).

3. In paragraph 1 or 2, The above commands, when executed by the processor (120), cause the electronic device (101) to generate the output image. Detecting the external illuminance of the above electronic device (101), and If the detected external illuminance is greater than or equal to the first reference illuminance, one output image is generated by aligning the N upscaled remosaic images (1130). Electronic device (101).

4. In paragraph 1 or 2, The above commands, when executed by the processor (120), cause the electronic device (101) to generate the output image. Detecting the external illuminance of the above electronic device (101), and If the detected external illuminance is less than the first reference illuminance and greater than or equal to the second reference illuminance, one reference remosaic image is generated by aligning the N upscaled remosaic images (1130), Generating one reference binning image by aligning the above upscaled N binning images (1120), and Generating the output image by synthesizing the reference remosaic image and the reference binning image. Electronic device (101).

5. In paragraph 1 or 2, The above commands, when executed by the processor (120), cause the electronic device (101) to generate the output image. Detecting the external illuminance of the above electronic device (101), and If the detected external illuminance is less than the second reference illuminance, N composite images are generated by synthesizing the upscaled N remosaic images (1130) and the upscaled N binning images (1120) in a one-to-one manner, and Generating one output image by aligning the N synthetic images generated above, Electronic device (101).

6. In paragraph 1, The above commands, when executed by the processor (120), cause the electronic device (101) to obtain the phase difference data. A first partial image obtained from first color pixels (720) located in a first direction based on the center of one micro lens and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens are compared, Based on the result of comparing the first partial image and the second partial image, a part of the phase difference data with respect to the first direction or the second direction is acquired, A third partial image obtained from first color pixels (720) located in a third direction perpendicular to the first direction based on the center of the one micro lens, and a fourth partial image obtained from first color pixels (720) located in a fourth direction opposite to the third direction based on the center of the one micro lens are compared, Based on the result of comparing the third partial image and the fourth partial image, a part of the phase difference data in the third direction or the fourth direction perpendicular to the first direction is acquired. Electronic device (101).

7. In paragraph 1, The above commands, when executed by the processor (120), cause the electronic device (101) to obtain the phase difference data. Further performing an operation of obtaining a phase difference by comparing images obtained from a plurality of sensor areas corresponding to the plurality of lens assemblies, Electronic device (101).

8. In paragraph 1, The above first lens assembly (411) is a lens assembly located at the center among the plurality of lens assemblies (410), The second lens assemblies (412) are arranged to surround the first lens assembly (411). Electronic device (101).

9. In a driving method of an electronic device (101), The electronic device (101) includes a camera module (400) including an image sensor (420) and a plurality of lens assemblies (410) coupled with the image sensor (420), wherein the image sensor (420) includes a plurality of first color pixels (720) overlapping a first color filter, a plurality of second color pixels (710) overlapping a second color filter, and a plurality of third color pixels (730) overlapping a third color filter. The driving method of the above electronic device (101) is: An operation of acquiring N non-Bayer images of a subject by using the above plurality of lens assemblies (410), An operation of obtaining N binned images (1120) having a first resolution by performing binning processing on each of the N non-Bayer images (1110), An operation of obtaining N remosaic images having a second resolution greater than the first resolution by performing a remosaic transformation on each of the N non-Bayer images (1110). An operation of obtaining phase difference data representing the phase difference of each of the N non-Bayer images (1110) generated by one micro lens overlapping the plurality of first color pixels (720); An operation of calculating pixel shift values ​​representing the distance between pixels corresponding to a first lens assembly (411) among the plurality of lens assemblies (410) and pixels corresponding to second lens assemblies (412) located around the first lens assembly (411) among the plurality of lens assemblies (410), based on the phase difference data; An operation of upscaling the size of each of the above N re-mosaic images (1130) to a size corresponding to a specified resolution, An operation of upscaling the size of each of the N binned images (1120) to be the same as the size of each of the N upscaled remosaic images (1130), and An operation of generating an output image based on at least some of the N upscaled remosaic images (1130) and / or the N upscaled binned images (1120), method.

10. In paragraph 9, The operation of acquiring the above phase difference data is: An operation of comparing a first partial image obtained from first color pixels (720) located in a first direction based on the center of one micro lens, and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens, and Based on the above comparison result, including an operation of obtaining the phase difference data, method.

11. In paragraph 9 or 10, The action of generating the above output image is: An operation of detecting external illumination of the above electronic device (101), and If the detected external illuminance is greater than or equal to the first reference illuminance, an operation of generating one output image by aligning the upscaled N remosaic images (1130) is included. method.

12. In paragraph 9 or 10, The action of generating the above output image is: An operation of detecting external illumination of the above electronic device (101), and If the detected external illuminance is less than the first reference illuminance and greater than or equal to the second reference illuminance, an operation of generating one reference remosaic image by aligning the N upscaled remosaic images (1130). An operation of generating one reference binning image by aligning the above upscaled N binning images (1120), and An operation of generating the output image by synthesizing the reference remosaic image and the reference binning image, method.

13. In paragraph 9 or 10, The action of generating the above output image is: An operation of detecting external illumination of the above electronic device (101), and If the detected external illuminance is less than the second reference illuminance, an operation of generating N composite images by synthesizing the upscaled N remosaic images (1130) and the upscaled N binning images (1120) in a one-to-one manner, and An operation of generating one output image by aligning the N generated synthetic images, method.

14. In paragraph 9, The operation of acquiring the above phase difference data is: An operation of comparing a first partial image obtained from first color pixels (720) located in a first direction based on the center of one micro lens, and a second partial image obtained from first color pixels (720) located in a second direction opposite to the first direction based on the center of one micro lens, An operation of obtaining a portion of the phase difference data in the first direction or the second direction based on a result of comparing the first partial image and the second partial image; An operation of comparing a third partial image obtained from first color pixels (720) located in a third direction perpendicular to the first direction with respect to the center of one micro lens, and a fourth partial image obtained from first color pixels (720) located in a fourth direction opposite to the third direction with respect to the center of one micro lens, and An operation of obtaining a part of the phase difference data in the third direction or the fourth direction perpendicular to the first direction based on the result of comparing the third partial image and the fourth partial image, method.

15. In paragraph 9, The operation of acquiring the above phase difference data is: An operation of obtaining a phase difference by comparing images obtained from a plurality of sensor areas corresponding to the plurality of lens assemblies, method.

Images