Electronic device comprising battery structure for heat dissipation

Abstract

An electronic device according to an embodiment may comprise: a printed circuit board including an electronic component; and a battery. The battery may comprise: a metal can case including a plate and a cover formed of a first metal material; and an electrode assembly disposed in the metal can case. The plate may comprise: a first layer formed of a second metal material; and a second layer formed of at least a first metal material, disposed on the first layer, and facing the electrode assembly. The thermal conductivity of the second metal material may be greater than the thermal conductivity of the first metal material so as to disperse heat generated by the electronic component and transferred through a thermally conductive member that is in thermal contact with the plate.

Description

Electronic device including a battery structure for heat dissipation

[0001] The present disclosure relates to an electronic device including a battery structure for heat dissipation.

[0002] Electronic devices may include electronic components to provide various functions. Electronic devices may include batteries to power the electronic components. As the electronic device operates, heat may be generated from the electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a printed circuit board including electronic components, and a battery. The battery may include a metal can case including a plate and a cover formed from a first metal material, and an electrode assembly disposed within the metal can case. The plate may include a first layer formed from a second metal material, and a second layer formed from at least the first metal material, disposed on the first layer, and facing the electrode assembly. The thermal conductivity of the second metal material may be greater than the thermal conductivity of the first metal material so as to disperse heat generated by the electronic component and transferred through a heat conducting member in thermal contact with the plate.

[0005] An electronic device is disclosed. The electronic device may include a heat-generating component, a bracket disposed on the heat-generating component, and a battery spaced from the heat-generating component. The battery may include a case fastened to the bracket, an electrode assembly disposed within the case and including one or more first electrodes and one or more second electrodes having a different polarity from the one or more first electrodes, a first tab extending from the one or more first electrodes of the electrode assembly through the case and to the exterior of the battery, a second tab extending from the one or more second electrodes of the electrode assembly through the case and to the exterior of the battery, and an insulating cover disposed within the case and including a first through-hole penetrated by the first tab and a second through-hole penetrated by the second tab and spaced apart from the first through-hole. The insulating cover may electrically isolate the first tab and the second tab from the case.

[0006] An electronic device is disclosed. The electronic device may include a heat-generating component, a bracket disposed on the heat-generating component, and a battery spaced apart from the heat-generating component. The battery may include a case including a first plate facing the bracket and a second plate coupled to the first plate, and an electrode assembly disposed within the case. The thermal conductivity of the first plate may be greater than the thermal conductivity of the second plate. The first plate may include a first metal layer forming at least a portion of an outer surface of the case, a second metal layer forming at least a portion of an inner surface of the case, and a third metal layer disposed between the first metal layer and the second metal layer. The thermal conductivity of the third metal layer may be greater than the thermal conductivity of the first metal layer and the thermal conductivity of the second metal layer. However, the present invention is not limited thereto, and the first plate may be formed as a single layer for weight reduction, or may include a structure in which any one of the first metal layer, the second metal layer, and / or the third metal layer is omitted. For example, the second metal layer in contact with the second plate may be made of a material having substantially the same melting point during welding or substantially the same material to facilitate welding of the two metals forming the second plate and the second metal layer, respectively. If the two metals are different materials, a coating may be formed on at least one of the two metals.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] Figure 2 is a block diagram of a power management module and battery of an exemplary electronic device.

[0009] Figure 3a is a drawing showing an exemplary electronic device.

[0010] Figure 3b is an exploded perspective view of an exemplary electronic device.

[0011] Figure 4a illustrates a portion of an exemplary electronic device.

[0012] Figures 4b and 4c illustrate a battery of an exemplary electronic device.

[0013] FIG. 5 is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 4a.

[0014] FIG. 6A is a top plan view of a battery of an exemplary electronic device.

[0015] Figures 6b, 6c, 6d, and 6e illustrate the internal structure of an exemplary electronic device.

[0016] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0017] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0018] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0019] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0020] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0021] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0022] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0023] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0024] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0025] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0026] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0027] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0028] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0029] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0030] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0031] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0032] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0033] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0034] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0035] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0036] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0037] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0038] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In addition, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0039] Figure 2 is a block diagram of a power management module and battery of an exemplary electronic device.

[0040] Referring to FIG. 2, the power management module (188) may include a charging circuit (210), a power regulator (220), or a power gauge (230). The charging circuit (210) may charge the battery (189) using power supplied from an external power source for the electronic device (101). According to one embodiment, the charging circuit (210) may select a charging method (e.g., normal charging or rapid charging) based on at least some of the type of the external power source (e.g., power adapter, USB, or wireless charging), the amount of power that can be supplied from the external power source (e.g., about 20 watts or more), or the properties of the battery (189), and may charge the battery (189) using the selected charging method. The external power source may be connected to the electronic device (101) by a wire, for example, through a connection terminal (178), or may be connected wirelessly through an antenna module (197).

[0041] The power regulator (220) can generate a plurality of powers having different voltages or different current levels by adjusting the voltage level or current level of the power supplied from, for example, an external power source or a battery (189). The power regulator (220) can adjust the power of the external power source or the battery (189) to a voltage or current level suitable for each component included in the electronic device (101) or each component of some of the components. According to one embodiment, the power regulator (220) can be implemented in the form of an LDO (low drop out) regulator or a switching regulator. The power gauge (230) can measure usage status information for the battery (189) (e.g., capacity, number of charge / discharge cycles, voltage, or temperature of the battery (189).

[0042] The power management module (188) can determine charging state information (e.g., lifespan, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheat, short circuit, or expansion) related to charging of the battery (189) based at least in part on the measured usage state information, for example, using the charging circuit (210), the voltage regulator (220), or the power gauge (230). The power management module (188) can determine whether the state of the battery (189) is normal or abnormal based at least in part on the determined charging state information. If the state of the battery (189) is determined to be abnormal, the power management module (188) can adjust the charging of the battery (189) (e.g., reducing the charging current or voltage, or stopping the charging). According to one embodiment, at least some of the functions of the power management module (188) can be performed by an external control device (e.g., the processor (120)).

[0043] The battery (189) may include a battery protection circuit module (PCM) (240). The battery protection circuit (240) may perform one or more of various functions (e.g., a pre-cut function) to prevent performance degradation and / or damage to the battery (189). The battery protection circuit (240) may additionally or alternatively be configured as at least a part of a battery management system (BMS) that may perform various functions including cell balancing, capacity measurement of the battery, charge / discharge cycle measurement, temperature measurement, or voltage measurement.

[0044] For example, at least a portion of the usage status information or the charging status information of the battery (189) may be measured using a corresponding sensor (e.g., a temperature sensor) among the sensor modules (276), a power gauge (230), or a power management module (188). For example, the corresponding sensor (e.g., a temperature sensor) among the sensor modules (176) may be included as part of the battery protection circuit (240), or may be placed near the battery (189) as a separate device. However, the embodiments supported by the present disclosure are not limited thereto.

[0045] Figure 3a is a drawing showing an exemplary electronic device.

[0046] Referring to FIG. 3A, the electronic device (101) may include a housing (300) that forms the exterior of the electronic device (101). For example, the housing (300) may include a front surface (300A), a rear surface (300B), and a side surface (300C) that surrounds a space between the front surface (300A) and the rear surface (300B). The housing (300) may also refer to a structure that forms at least a portion of the front surface (300A), the rear surface (300B), and / or the side surface (300C).

[0047] The electronic device (101) may include a substantially transparent front plate (302). The front plate (302) may form at least a portion of the front surface (300A). The front plate (302) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0048] The electronic device (101) may include a substantially opaque back plate (311). The back plate (311) may form at least a portion of the back surface (300B). The back plate (311) may be formed of a coated and / or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing materials.

[0049] The electronic device (101) may include a side bezel structure (or side member) (318). The side bezel structure (318) may be coupled with the front plate (302) and / or the back plate (311) to form at least a portion of the side surface (300C) of the electronic device (101). For example, the side bezel structure (318) may form the entire side surface (300C) of the electronic device (101), or, for another example, the side bezel structure (318) may form the side surface (300C) of the electronic device (101) together with the front plate (302) and / or the back plate (311).

[0050] Unlike the illustrated example, when the side surface (300C) of the electronic device (101) is partially formed by the front plate (302) and / or the rear plate (311), the front plate (302) and / or the rear plate (311) may include a region that extends seamlessly from its edge portion toward the rear plate (311) and / or the front plate (302). The extending region of the front plate (302) and / or the rear plate (311) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0051] The side bezel structure (318) may include metal and / or polymer. The back plate (311) and the side bezel structure (318) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but are not limited thereto. For example, the back plate (311) and the side bezel structure (318) may be formed as separate components and / or may include different materials.

[0052] The electronic device (101) may include at least one of a display (301), an audio module (303, 304, 307), a sensor module (not shown), a camera module (305, 312, 313), a key input device (317), a light-emitting element (not shown), and / or a connector hole (308). The electronic device (101) may omit at least one of the above components (e.g., the key input device (317) or the light-emitting element (not shown)), or may additionally include other components.

[0053] The display (301) may be visually exposed through a significant portion of the front plate (302). For example, at least a portion of the display (301) may be visible through the front plate (302) forming the front surface (300A). The display (301) may be disposed on the back surface of the front plate (302).

[0054] The outer shape of the display (301) may be formed to be substantially the same as the outer shape of the front plate (302) adjacent to the display (301). In order to expand the area where the display (301) is visually exposed, the gap between the outer shape of the display (301) and the outer shape of the front plate (302) may be formed to be substantially the same.

[0055] The display (301) (or the front surface (300A) of the electronic device (101)) may include a screen display area (301A). The display (301) may provide visual information to a user through the screen display area (301A). In the illustrated example, when the front surface (300A) is viewed from the front, the screen display area (301A) is depicted as being positioned on the inside of the front surface (300A) and spaced apart from the outer edge of the front surface (300A), but is not limited thereto. In one embodiment, when the front surface (300A) is viewed from the front, at least a portion of an edge part of the screen display area (301A) may substantially coincide with an edge part of the front surface (300A) (or the front plate (302)).

[0056] The screen display area (301A) may include a sensing area (301B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (301A) includes the sensing area (301B)" may be understood to mean that at least a portion of the sensing area (301B) may overlap the screen display area (301A). For example, the sensing area (301B) may be an area capable of displaying visual information by the display (301) like other areas of the screen display area (301A) and additionally capable of acquiring the user's biometric information (e.g., fingerprint). The sensing area (301B) may also be formed on the key input device (317).

[0057] The display (301) may include an area where a first camera (305) is positioned. An opening may be formed in the area of ​​the display (301), and the first camera (305) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (300A). In this case, the screen display area (301A) may surround at least a portion of an edge part of the opening. The first camera (305) (e.g., an under display camera (UDC)) may be positioned below the display (301) so as to overlap the area of ​​the display (301). In this case, the display (301) may provide visual information to the user through the area, and additionally, the first camera (305) may acquire an image corresponding to a direction facing the front (300A) through the area of ​​the display (301).

[0058] The display (301) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0059] The audio module (303, 304, 307) may include a microphone hole (303, 304) and a speaker hole (307).

[0060] The microphone holes (303, 304) may include a first microphone hole (303) formed in a portion of the side (300C) and a second microphone hole (304) formed in a portion of the rear (300B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (303, 304). The microphone may include multiple microphones to detect the direction of the sound.

[0061] The second microphone hole (304) formed in a portion of the rear surface (300B) may be positioned adjacent to the camera module (305, 312, 313). For example, the second microphone hole (304) may acquire sound according to the operation of the camera module (305, 312, 313). However, the present invention is not limited thereto.

[0062] The speaker hole (307) may include an external speaker hole (307) and a call receiver hole (not shown). The external speaker hole (307) may be formed in a part of the side surface (300C) of the electronic device (101). The external speaker hole (307) may be implemented as a single hole with the microphone hole (303). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (300C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (307) in the side surface (300C). For example, with reference to the illustration in FIG. 3A, the external speaker hole (307) may be formed in the side surface (300C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (300C) corresponding to the upper portion of the electronic device (101). However, this is not limited thereto, and the call receiver hole may be formed in a location other than the side (300C). For example, the call receiver hole may be formed by a spaced space between the front plate (302) (or display (301)) and the side bezel structure (318).

[0063] The electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (307) and / or a call receiver hole (not shown).

[0064] A sensor module (not shown) can generate an electrical signal or data value corresponding to an internal operating state of an electronic device (101) or an external environmental state. For example, the sensor module can include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] The camera module (305, 312, 313) may include a first camera (305) positioned to face the front (300A) of the electronic device (101), a second camera (312) positioned to face the rear (300B), and a flash (313).

[0066] The second camera (312) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (312) is not necessarily limited to including multiple cameras and may include a single camera.

[0067] The first camera (305) and the second camera (312) may include one or more lenses, image sensors, and / or image signal processors.

[0068] The flash (313) may include, for example, a light-emitting diode or a xenon lamp. Three or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0069] The key input device (317) may be positioned on the side (300C) of the electronic device (101). The electronic device (101) may not include some or all of the key input devices (317), and the key input devices (317) that are not included may be implemented in another form, such as soft keys, on the display (301).

[0070] A connector hole (308) may be formed on a side surface (300C) of the electronic device (101) to accommodate a connector of an external device. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (308). The electronic device (101) may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0071] The electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (300A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. The light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (305). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0072] Figure 3b is an exploded perspective view of an exemplary electronic device.

[0073] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0074] Referring to FIG. 3b, the electronic device (101) may include a frame structure (340), a first printed circuit board (350), a second printed circuit board (352), a cover plate (360), and a battery (370).

[0075] The frame structure (340) may include a side bezel structure (318) forming an exterior of the electronic device (101) (e.g., side surface (300C) of FIG. 3A) and a support portion (343) extending inwardly from the side bezel structure (318). The frame structure (340) may be disposed between the display (301) and the rear plate (311). The side bezel structure (318) of the frame structure (340) may surround a space between the rear plate (311) and the front plate (302) (and / or the display (301)), and the support portion (343) of the frame structure (340) may extend from the side bezel structure (318) within the space.

[0076] The frame structure (340) may support or accommodate other components included in the electronic device (101). For example, a display (301) may be disposed on one side of the frame structure (340) facing one direction (e.g., +z direction), and the display (301) may be supported by a support portion (343) of the frame structure (340). For example, a first printed circuit board (350), a second printed circuit board (352), a battery (370), and a second camera (312) may be disposed on the other side of the frame structure (340) facing the opposite direction (e.g., -z direction). The first printed circuit board (350), the second printed circuit board (352), the battery (370), and the second camera (312) may be respectively mounted in recesses defined by the side bezel structure (318) and / or the support portion (343) of the frame structure (340).

[0077] The first printed circuit board (350), the second printed circuit board (352), and the battery (370) may be respectively coupled to the frame structure (340). For example, the first printed circuit board (350) and the second printed circuit board (352) may be fixedly disposed to the frame structure (340) through a coupling member such as a screw. For example, the battery (370) may be fixedly disposed to the frame structure (340) through an adhesive member (e.g., double-sided tape). In other words, the battery (370) may be attached, fixed, or otherwise fixed to the frame structure (340) using an adhesive, mechanical, or chemical attachment method. However, the present invention is not limited to the above-described examples.

[0078] The cover plate (360) may be placed between the first printed circuit board (350) and the back plate (311). The cover plate (360) may be placed on the first printed circuit board (350). For example, the cover plate (360) may be placed on a surface of the first printed circuit board (350) facing the -z direction.

[0079] The cover plate (360) may at least partially overlap the first printed circuit board (350) with respect to the z-axis. In other words, when viewing the device along the z-axis from the side of the first printed circuit board (350) with a line of sight perpendicular to both the cover plate (360) and the first printed circuit board (350), the first printed circuit board (350) covers at least a portion of the cover plate (360). The cover plate (360) may cover at least a portion of the first printed circuit board (350). Through this, the cover plate (360) may protect the first printed circuit board (350) from physical impact or prevent a connector coupled to the first printed circuit board (350) from being detached.

[0080] The cover plate (360) may be fixedly positioned on the first printed circuit board (350) through a joining member (e.g., a screw), or may be joined to the frame structure (340) together with the first printed circuit board (350) through the joining member.

[0081] The display (301) may be placed between the frame structure (340) and the front plate (302). For example, the front plate (302) may be placed on one side (e.g., in the +z direction) of the display (301), and the frame structure (340) may be placed on the other side (e.g., in the -z direction).

[0082] The front plate (302) can be combined with the display (301). For example, the front plate (302) and the display (301) can be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0083] The front plate (302) may be coupled with the frame structure (340). For example, the front plate (302) may include an outer portion extending outside the display (301) when viewed in the z-axis direction, and may be coupled to the frame structure (340) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (302) and the frame structure (340) (e.g., side bezel structure (318)). However, the present invention is not limited to the above-described examples.

[0084] The first printed circuit board (350) and / or the second printed circuit board (352) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically and / or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. The first printed circuit board (350) and the second printed circuit board (352) may be operatively and / or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0085] The battery (370) may power at least one component of the electronic device (101). For example, the battery (370) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (370) may be disposed substantially on / within the same plane as the first printed circuit board (350) and / or the second printed circuit board (352).

[0086] The electronic device (101) may include an antenna module (not shown). The antenna module may be positioned between the rear plate (311) and the battery (370). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0087] A first camera (305) (e.g., a front camera) may be positioned on at least a portion of a frame structure (340) (e.g., a support portion (343)) such that the lens can receive external light through a portion of the front plate (302) (e.g., the front (300A) of FIG. 3A) (e.g., the camera area (337)).

[0088] A second camera (312) (e.g., a rear camera) may be positioned between the frame structure (340) and the rear plate (311). The second camera (312) may be electrically connected to the first printed circuit board (350) via a connecting member (e.g., a connector). The second camera (312) may be positioned such that the lens can receive external light through the camera area (384) of the rear plate (311) of the electronic device (101).

[0089] The camera area (384) may be formed on the surface of the rear plate (311) (e.g., the rear surface (300B) of FIG. 3A). The camera area (384) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (312). At least a portion of the camera area (384) may protrude from the surface of the rear plate (311) by a predetermined height. However, the present invention is not limited thereto, and the camera area (384) may also form a substantially same plane as the surface of the rear plate (311).

[0090] The housing of the electronic device (101) (e.g., the housing (300) of FIG. 3A) may refer to a configuration or structure of a structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (302), the frame structure (340), and / or the rear plate (311) that form the exterior of the electronic device (101) may be referred to as the housing (300) of the electronic device (101).

[0091] Figure 4a illustrates a portion of an exemplary electronic device. Figures 4b and 4c illustrate a battery of the exemplary electronic device.

[0092] Referring to FIGS. 4A, 4B, and 4C, the electronic device (101) may include an electronic component (401), a bracket (400) (e.g., the frame structure (340) of FIG. 3B), and a battery (370).

[0093] The bracket (400) may support a display of the electronic device (101) (e.g., the display (301) of FIG. 3A) and / or structures disposed under the display (301) to support the display (301). The bracket (400) may, for example, form at least a portion of the exterior of the housing (300). For example, the bracket (400) may provide a space for accommodating electronic components within the electronic device (101). At least some of the electronic components may be electrically connected to the display (301). For example, the bracket (400) may include aluminum or titanium, but embodiments supported by the present disclosure are not limited thereto.

[0094] For example, at least a portion of the bracket (400) may be positioned below the display (301) of the electronic device (101). For example, at least a portion of the electronic components of the electronic device (101) may be mounted or arranged on the bracket (400). For example, the bracket (400) may define one side facing the display (301) and the other side opposite the one side. Some of the electronic components of the electronic device (101), for example, electronic components that are larger in volume than other electronic components (e.g., the battery (370) or the printed circuit boards (350, 352)), may be positioned on the other side of the bracket (400) for the display (301). For example, the bracket (400) may include a peripheral portion (or a side bezel structure (318) of FIG. 3A) surrounding the electronic components of the electronic device (101). However, the embodiments supported by the present disclosure are not limited thereto.

[0095] The bracket (400) may include a partition wall (403). For example, the partition wall (403) may protrude from the bracket (400) to define a space for accommodating electronic components. For example, the partition wall (403) may support the battery (370) by coming into contact with the battery (370). By supporting the battery (370), the partition wall (403) may reduce the battery (370) from moving or being detached from the bracket (400) due to external impact. For example, the partition wall (403) may be at least partially disposed between the battery (370) and the first printed circuit board (350). The battery (370) may be isolated or separated from the first printed circuit board (350) by the partition wall (403). However, the embodiments supported in the present disclosure are not limited thereto.

[0096] The battery (370) may be mounted on or attached to the bracket (400). The battery (370) may be supported by the bracket (400). The battery (370) may be placed in the internal space of the housing (300) formed by the bracket (400) (or the partition wall (403)). For example, since the battery (370) has a relatively large volume, it may be attached to the other side of the bracket (400) opposite to the side facing the display (301). For example, the battery (370) may be configured to be rechargeable for driving the electronic device (101) and / or electronic components within the electronic device (101). However, the embodiments supported in the present disclosure are not limited thereto.

[0097] A first printed circuit board (350) may be placed on a bracket (400). Electronic components for driving and / or performing functions of the electronic device (101) may be combined with the first printed circuit board (350). For example, the first printed circuit board (350) may be placed on the bracket (400) together with a battery (370). For example, the first printed circuit board (350) may be connected to the battery (370) to supply power to the electronic device (101) and / or electronic components within the electronic device (101) through the battery (370). For example, a power management integrated circuit (PMIC) (or a power management module (188) of FIG. 1) in a first printed circuit board (350) may be connected to a battery (370) via a flexible printed circuit board (FPCB) to supply power to the electronic device (101). For example, the first printed circuit board (350) may be disposed adjacent to the battery (370) for connection to the battery (370). The first printed circuit board (350) may be disposed, for example, on one surface of the bracket (400) together with the battery (370). For example, the first printed circuit board (350) may be disposed along the battery (370) or next to the battery (370). However, the embodiments supported in the present disclosure are not limited thereto.

[0098] In one embodiment, a second printed circuit board (352) may be mounted on a bracket (400). The second printed circuit board (352) may be spaced apart from the first printed circuit board (350), for example. For example, the second printed circuit board (352) may be disposed along the battery (370) or next to the battery (370). For example, the battery (370) may be disposed between the first printed circuit board (350) and the second printed circuit board (352). However, the embodiments supported by the present disclosure are not limited thereto, and the second printed circuit board (352) may be omitted.

[0099] An electronic component (401) disposed on a first printed circuit board (350) can emit (transmit) heat while the electronic device (101) is being operated. For example, the electronic component (401) may be a processor of the electronic device (101) that generates relatively large amounts of heat (e.g., the processor (120) of FIG. 1). For example, the electronic component (401) may be disposed on one surface of the first printed circuit board (350). The camera module (380) coupled to the first printed circuit board (350) (e.g., the camera module (180) of FIG. 1, or the rear cameras (312, 313) of FIG. 3A) may be arranged so that the cameras (e.g., the second camera (312) and / or the flash (313) of FIG. 3A) disposed on the camera module (380) face the opposite direction of the bracket (400) (e.g., the -Z-axis direction of FIG. 3B). For example, the electronic component (401) may perform data processing or calculations as the electronic device (101) operates. The electronic component (401) may emit (transmit) heat to the periphery of the electronic component (401) as it performs data processing or calculations. The electronic component (401) may be referred to as a heat generating component or a heat generating body in that it is an element that generates heat, but the embodiments supported by the present disclosure are not limited thereto. The electronic device (101) may require a heat dissipation structure using a battery (370) to reduce damage to the electronic component (401) and / or one or more other electronic components around the electronic component (401) due to heat emitted (transmitted) from the electronic component (401).

[0100] According to one embodiment, the battery (370) may be separated from the electronic component (401). The battery (370) may include a case (410) fastened to the bracket (400), and an electrode assembly (420) disposed within the case (410).

[0101] The case (410) can form the exterior of the battery (370). For example, the case (410) can accommodate internal components of the battery (370) (e.g., electrode assembly (420)). The case (410) can protect the internal components of the battery (370) disposed within the case (410) from external impact. For example, the case (410) can be detachably coupled to the bracket (400) (e.g., via a fastener (620) of FIG. 6b) or detachably attached to the bracket (400) (e.g., via an adhesive member (570) of FIG. 5). For example, the case (410) can receive at least a portion of the heat transferred from the electronic component (401) to the bracket (400) by being fastened to the bracket (400). The case (410) may function as a heat sink for the electronic component (401) by dissipating at least a portion of the heat. For example, the case (410) may be a pouch-type case as illustrated in FIG. 4C, but the embodiments supported by the present disclosure are not limited thereto, and for example, the case (410) may include a cylindrical-type case or a square-type case.

[0102] For example, the case (410) may include a first plate (411) facing the bracket (400), and a second plate (412) coupled to the first plate (411). For example, the first plate (411) may be a portion of the case (410) that is attached to the bracket (400) or coupled to the bracket (400). For example, the second plate (412) may have a recess (415) formed therein for accommodating the electrode assembly (420) of the battery (370). The second plate (412) may be coupled to the first plate (411) to surround the electrode assembly (420) together with the first plate (411). However, the embodiments supported in this document are not limited thereto. For example, although not shown, as illustrated in FIG. 5, the second plate (412) of the case (410) may be formed with holes for passing lead tabs (431, 441) that are connected to electrode tabs (432, 442) extending from the electrode assembly (420). Through the holes, the tabs (430, 440) of the battery (370) may be drawn out of the battery (370) through the insulating cover (450). However, the embodiments supported in the present disclosure are not limited thereto.

[0103] The electrode assembly (420) may include a plurality of electrodes for supplying power to the electronic device (101) (or electronic components within the electronic device (101). For example, the electrode assembly (420) may include one or more first electrodes (421) and one or more second electrodes (422) having a different polarity than the one or more first electrodes (421). For example, the electrode assembly (420) may include one or more separators (423) interposed between the one or more first electrodes (421) and the one or more second electrodes (422). For example, the one or more first electrodes (421) may be referred to as anodes of the electrode assembly (420). The one or more second electrodes (422) may be referred to as cathodes having a different polarity than the one or more first electrodes (421). The electrode assembly (420) may be provided through stacking in which anodes (421a, 421b) and cathodes (422a, 422b, 422c) are alternately stacked as illustrated in FIG. 4c, but the embodiments supported by the present disclosure are not limited thereto, and for example, the electrode assembly (420) may be provided through winding in which electrode stacks in which anodes, cathodes, and separators therebetween are combined are rolled. Unlike FIG. 4b, when the electrode assembly (420) has an irregular shape, the shape of the electrode assembly (420) may be provided through a stacking process. Unlike the winding process, the above stacking process can easily process the shape of the electrode assembly (420) by processing and stacking the shapes of one or more first electrodes (421), one or more second electrodes (422), and one or more separators (423) and then joining the electrode tabs (432, 442).

[0104] The electrode assembly (420) may include an electrode substrate and an electrode active material layer coated on the electrode substrate.

[0105] For example, each of the cathodes (422a, 422b, 422c) may include a cathode substrate and a cathode active material layer coated on the cathode substrate. The cathode substrate may be configured to collect electrons generated in the cathode active material layer according to an electrochemical reaction or to provide electrons required for the electrochemical reaction to the cathode active material layer. For example, the cathode substrate may be configured to be electrically connected to an external circuit of the battery (370) so as to provide electrons generated in the cathode active material layer to the external circuit during discharge or to provide electrons supplied through the external circuit to the cathode active material layer during charge. For example, the cathode substrate may include copper. The cathode substrate may be implemented in the form of a copper thin film, but the embodiments supported in this document are not limited thereto.

[0106] For example, each of the anodes (421a, 421b) may include a cathode substrate and a cathode active material layer. The cathode substrate may be connected to an external circuit of the battery (370) to supply electrons generated during a charging or discharging process to the outside or inside of the cathode active material layer. For example, the cathode substrate may be electrically connected to the external circuit of the battery (370) to provide electrons generated in the cathode active material layer to the external circuit during charging, or to provide electrons supplied through the external circuit to the cathode active material layer during discharging. For example, the cathode substrate may include aluminum. The cathode substrate may be implemented in the form of an aluminum thin film, but the embodiments supported in this document are not limited thereto.

[0107] For example, the separators (423a, 423b, 423c, 423d) may be disposed between a positive electrode of one or more of the first electrodes (421) and a negative electrode of one or more of the second electrodes (422), respectively. For example, the one or more separators (423) may provide a passage through which lithium ions may pass. The one or more separators (423) may prevent physical contact (or direct electrical short) between the one or more first electrodes (421) and the one or more second electrodes (422) having different electrical characteristics.

[0108] The battery (370) may include a first tab (430) extending from one or more first electrodes (421) through the case (410) to the exterior of the battery (370), and a second tab (440) extending from one or more second electrodes (422) through the case (410) to the exterior of the battery (370). For example, the first tab (430) and the second tab (440) may extend from an electrode assembly of the battery (370) through the case (410) to the exterior of the battery (370), thereby being electrically connected to a circuit external to the battery (370) (e.g., a circuit on a first printed circuit board (250)) or electrically connected to another battery, thereby forming a battery module or a battery pack. For example, the first tab (430) may electrically connect one or more first electrodes (421) of the electrode assembly (420) to electronic components and / or circuits for power supply on the first printed circuit board (250) external to the battery (370). The second tab (440) may electrically connect one or more second electrodes (422) of the electrode assembly (420) to electronic components and / or circuits for power supply on the first printed circuit board (250) external to the battery (370). The electronic components and / or circuits for power supply may include, but are not limited to, a power management circuit, a charging circuit (e.g., the charging circuit (210) of FIG. 2), a power input pad, and / or a battery connector.

[0109] Although not shown, the battery (370) may include an electrolyte disposed within the case (410). The electrolyte may provide a path through which lithium ions may move between one or more first electrodes (421) and one or more second electrodes (422). For example, the electrolyte may include a liquid electrolyte or a gel electrolyte. During charging, lithium ions may be deintercalated from the positive electrode active material layer and may move to the negative electrode active material layer through the electrolyte and one or more separators (423). The lithium ions that have moved to the negative electrode active material layer may be intercalated into the negative electrode active material layer as a reduction reaction occurs. Electrons generated during the deintercalation of lithium ions may move to the negative electrode active material layer through the external circuit. For example, when the battery (370) is discharged, lithium ions inserted into the negative electrode active material layer are desorbed and ionized into the electrolyte, and the ionized lithium ions can move to the positive electrode active material layer through the electrolyte and one or more separators (423). Electrons generated in the negative electrode active material layer by the desorbing lithium ions can move to the positive electrode active material layer through the external circuit. Lithium ions can be inserted into the positive electrode active material layer by meeting electrons to cause a reduction reaction. When the battery (370) is discharged, electrons passing through the external circuit can do work.

[0110] Since the battery (370) receives at least a portion of the heat emitted (transmitted) from the electronic component (401) through the bracket (400), the performance of the battery (370) may be degraded by the heat. In particular, if heat is transferred to some of the tabs (430, 440) directly connected to the active material in the electrode assembly (420), the performance of the battery (370) may be degraded by swelling caused by a chemical reaction of the active material. For example, if the tabs (430, 440) extending from the electrode assembly (420) are connected to or directly contact the case (410), heat may be transferred to the inside of the electrode assembly (420) connected to the tabs (430, 440), which may deteriorate the performance of the battery (370). A battery (370) that does not have a structure that guides the positions of the tabs (430, 440) connected to the active material of the electrode assembly (420) while electrically isolating the tabs (430, 440) and the case (410) may be disadvantageous in improving thermal stability. According to at least one embodiment of the present disclosure provided herein, the battery (370) includes a structure that improves the thermal stability of the battery (370) by electrically isolating the tabs (430, 440) connected to the active material of the electrode assembly (420) and the case (410) while guiding the positions of the tabs (430, 440). This structure can be described with reference to, for example, FIGS. 4B and 5 .

[0111] According to one embodiment, the battery (370) may include an insulating cover (450) disposed within the case (410) and including a first through hole (451) penetrated by the first tab (430) and a second through hole (452) penetrated by the second tab (440) and spaced apart from the first through hole (451). The insulating cover (450) may electrically isolate the first tab (430) and the second tab (440) from the case (410).

[0112] For example, the insulating cover (450) can be attached to the inner surface (410b) of the case (410). The insulating cover (450) can separate the tabs (430, 440) from the inner surface (410b) by partially covering the tabs (430, 440). For example, the insulating cover (450) can be placed between the electrode assembly (420) and the inner surface (410b) of the case (410). The insulating cover (450) can be coupled to the tabs (430, 440) extending from the electrode assembly (420) by passing the tabs (430, 440) through the insulating cover. The insulating cover (450) may guide the position of the tabs (430, 440) within the case (410) by being coupled with the tabs (430, 440) or reduce movement of the tabs (430, 440). For example, the insulating cover (450) may include a material having relatively low thermal conductivity (e.g., polyethylene, silicone, rubber, etc.) to thermally and / or electrically insulate the tabs (430, 440) from the case (410). However, the embodiments supported in the present disclosure are not limited thereto.

[0113] For example, the first through hole (451) can provide a passage for the first tab (430) to extend to the outside of the case (410) by passing the first tab (430) therethrough. The second through hole (452) can provide a passage for the second tab (440) to extend to the outside of the case (410) by passing the second tab (440) therethrough. The through holes (451, 452) can guide the positions of the tabs (430, 440) by being spaced apart from each other so that the tabs (430, 440) are spaced apart from each other without shorting each other. In order to maintain the distance between the tabs (430, 440), the insulating cover (450) can have a structure that allows the tabs (430, 440) to pass through simultaneously. Alternatively, the insulating cover (450) penetrated by the tabs (430, 440) may be formed separately in a structure that allows the tabs (430, 440) to pass through each other and be fixed to each other, thereby implementing a shape similar to the insulating cover (450) formed as a single unit.

[0114] The first tab (430) may include a first lead tab (431) that penetrates through a first through hole (451) of the case (410) and the insulating cover (450) and is at least partially exposed to the outside of the battery (370), and a first electrode tab (432) that is connected to the first lead tab (431) within the case (410). The second tab (440) may include a second lead tab (441) that penetrates through a second through hole (452) of the case (410) and the insulating cover (450) and is at least partially exposed to the outside of the battery (370), and a second electrode tab (442) that is connected to the second lead tab (441) within the case (410). The insulating cover (450) may guide a position between the first lead tab (431) and the second lead tab (441).

[0115] For example, the lead tabs (431, 441) may be connected to the electrode tabs (432, 442), respectively, by passing through the case (410) and the insulating cover (450). For example, the lead tabs (431, 441) may be electrically connected to a circuit outside the battery (370) or to another battery, respectively, to form a battery module or a battery pack. For example, the lead tabs (431, 441) may include a conductive material (e.g., metal) so that power may be transmitted through the lead tabs (431, 441).

[0116] For example, the first lead tab (431) may include a first connecting portion (431a) positioned outside the battery (370), and a second connecting portion (431b) extending from the first connecting portion (431a) through the case (410) and the first through-hole (451) of the insulating cover (450) toward the first electrode tab (432) within the case (410). The second lead tab (432) may include a third connecting portion (441a) positioned outside the battery (370) together with the first connecting portion (431a), and a fourth connecting portion (441b) extending from the third connecting portion (441a) through the case (410) and the second through-hole (452) of the insulating cover (450) toward the second electrode tab (442) within the case (410). The connecting portions (431b, 441b) of the lead tabs (431, 441) that are respectively connected to the electrode tabs (432, 442) by penetrating the case (410) and the insulating cover (450) can be thermally and / or electrically insulated from the case (410) through the insulating cover (450). The insulating cover (450) is formed as a single body to include through holes (451, 452) for passing the connecting portions (431b, 441b), thereby guiding the positions of the lead tabs (431, 441) so that the lead tabs (431, 441) are aligned with or coupled to the corresponding electrode tabs (432, 442), and preventing short circuits between the tabs (430, 440).

[0117] For example, the first electrode tab (432) may be formed by stacking and / or joining positive electrode tabs (432a, 432b) extending from positive electrodes (421a, 421b). The second electrode tab (442) may be formed by stacking and / or joining negative electrode tabs (442a, 442b, 442c) extending from negative electrodes (422a, 422b, 422c). For example, the first electrode tab (432) may be joined to the second connecting portion (431b) of the first lead tab (431) that penetrates the insulating cover (450) inside the case (410). The second electrode tab (442) can be coupled with the fourth connecting portion (441b) of the second lead tab (441) that penetrates the insulating cover (450) within the case (410). For example, the electrode tabs (432, 442) can be at least partially bent so as to be coupled with the corresponding lead tabs (431, 441), respectively. For example, the electrode tabs (432, 442) can be electrically connected to the corresponding lead tabs (431, 441), respectively (e.g., through welding), but the embodiments supported in this document are not limited thereto, and the electrode tabs (432, 442) can be coupled to the corresponding lead tabs (431, 441), respectively, through various processes.

[0118] For example, when discharging the battery (370), power provided from the electrode assembly (420) can be sequentially provided to the external circuit of the battery (370) connected to the lead tabs (431, 441) through the electrode tabs (432, 442) and the lead tabs (431, 441). When charging the battery (370), power provided from the charging device can be sequentially transferred to the electrode assembly (420) through the lead tabs (431, 441) and the electrode tabs (432, 442).

[0119] The battery (370) may include one or more insulators (460) disposed along an outer surface (410a) of the case (410). For example, the battery (370) may include a first insulator (461) interposed between the case (410) and a first lead tab (431), and a second insulator (462) interposed between the case (410) and a second lead tab (441). For example, the first insulator (461) may be disposed at least partially between the first plate (411) and the second plate (412) of the case (410), thereby electrically and / or thermally insulating the second connection portion (431b) of the first lead tab (431) from the case (410). The second insulator (462) may be disposed between the first plate (411) and the second plate (412), at least partially together with the first insulator (461), to electrically and / or thermally insulate the fourth connecting portion (432b) of the second lead tab (432) from the case (410). However, the arrangement of one or more insulators (460) is not limited to the embodiments supported by the present disclosure. For example, the first insulator (461) may be attached to the outer surface (410a) of the case (410) and partially wrap the first lead tab (431), thereby electrically and / or thermally insulating the first lead tab (431) from the case (410). The second insulator (462) is attached to the outer surface (410a) of the case (410) and partially wraps the second lead tab (432) to electrically and / or thermally insulate the second lead tab (432) from the case (410).

[0120] The battery (370) of the electronic device (101) includes an insulating cover (450) and one or more insulators (460) that electrically and / or thermally insulate the tabs (430, 440) electrically connected to the external circuit of the battery (370) from the case (410), as described above, thereby improving the thermal stability of the battery (370) against heat transferred from the electronic component (401) to the case (410) and reducing corrosion (e.g., galvanic corrosion) due to a chemical reaction between the case (410) and the bracket (400). In addition to the structure of the battery (370) for insulating the tabs (430, 440) from the case (410), the absence of a structure of the case (410) of the battery (370) and / or a structure around the battery (370) in the electronic device (101) reduces the heat. This may be detrimental to improving heat dissipation performance. According to at least one embodiment of the present disclosure given herein, such a structure is provided. The structure is illustrated by the exemplary illustration in FIG. 5.

[0121] FIG. 5 is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 4a.

[0122] Referring to FIG. 5, the electronic device (101) may include an electronic component (401), a printed circuit board (510) on which the electronic component (401) is mounted (e.g., the first printed circuit board (250) of FIG. 3b), a bracket (400) on which the printed circuit board (510) is placed, or a battery (370) spaced apart from the electronic component (401). The battery (370) may include a case (410) fastened to the bracket (400), an electrode assembly (420) disposed within the case, a first tab (430) extending from the electrode assembly (420) through the case (410) to the outside of the battery (370), a second tab (e.g., the second tab (440) of FIG. 4b) extending from the electrode assembly (420) through the case (410) to the outside of the battery (370), and an insulating cover (450) disposed within the case (410) and including a first through hole (e.g., the first through hole (451) of FIG. 4b) penetrated by the first tab (430) and a second through hole (e.g., the second through hole (452) of FIG. 4b) penetrated by the second tab (440) and spaced apart from the first through hole (451). The insulating cover (450) may electrically isolate the first tab (430) and the second tab (440) from the case (410). However, the embodiments supported by the present disclosure are not limited thereto, and the electronic device (101) and / or the battery (370) exemplarily illustrated and described in FIG. 5 may include structures and / or configurations (e.g., one or more first electrodes (421) connected to the first tab (430), one or more second electrodes (422) connected to the second tab (440)) exemplarily illustrated and described in FIGS. 4A to 4C. Hereinafter, redundant descriptions of configurations having the same reference numerals as illustrated and described in FIGS. 4A to 4C may be omitted.

[0123] According to one embodiment, the case (410) may include a first metal layer (501) that at least partially forms an outer surface (410a) of the case (410), a second metal layer (502) that at least partially forms an inner surface (410b) of the case (410), and a third metal layer (503) that is disposed between the first metal layer (501) and the second metal layer (502). The thermal conductivity of the third metal layer (503) may be greater than the thermal conductivity of the first metal layer (501) and the thermal conductivity of the second metal layer (502). In other words, the thermal conductivity of the third metal layer (503) may be greater than either the thermal conductivity of the first metal layer (501) or the thermal conductivity of the second metal layer (502).

[0124] For example, the first metal layer (501) may be a layer that is coupled to the bracket (400) of the case (410) or attached onto the bracket (400). The first metal layer (501) may be the outermost layer of the case (410) that forms the exterior of the case (410). For example, the outer surface (410a) of the case (410) that is at least partially formed by the first metal layer (501) may be in contact with the first surface (400a) of the bracket (400) facing the battery (370) or may be attached onto the first surface (400a). For example, the first metal layer (501) may have higher rigidity than the second metal layer (502) and / or the third metal layer (503) in order to reduce damage to the case (410) due to external impact, but the embodiments supported in the present disclosure are not limited thereto. In other words, higher stiffness may mean that the layers have different thicknesses, different densities, and / or different mechanical strengths. For example, the first metal layer (501) may have lower reactivity than the second metal layer (502) and the third metal layer (503) to reduce corrosion of the case (410), although the embodiments supported by the present disclosure are not limited thereto. In other words, reactivity may refer to chemical reactivity or the tendency of a material to participate in a chemical or electrochemical reaction.

[0125] For example, the second metal layer (502) may be a layer that surrounds internal components of the battery (370), such as the electrode assembly (420) or the electrolyte. The second metal layer (502) may be an innermost layer that forms a space for the internal components of the battery (370). For example, the second metal layer (502) may be electrically and / or thermally insulated from the tabs (430, 440) by an insulating cover (450), as exemplarily described in FIGS. 4A to 4C . The insulating cover (450) may be attached or seated on an inner surface (410b) of the case (410) that is at least partially formed by the second metal layer (502). For example, the second metal layer (502) may have a higher rigidity than the third metal layer (503) between the second metal layer (502) and the first metal layer (501) to support internal components of the battery (370), but the embodiments supported in this document are not limited thereto.

[0126] For example, the third metal layer (503) may be interposed or formed between the first metal layer (501) and the second metal layer (502). The third metal layer (503) may be formed from a metal having different thermal and / or mechanical properties from the first metal layer (501) and the second metal layer (502). For example, the thermal resistance of the third metal layer (503) may be smaller than the thermal resistance of the first metal layer (501) and the thermal resistance of the second metal layer (502). For example, the heat transfer coefficient of the third metal layer (503) may be larger than the heat transfer coefficient of the first metal layer (501) and the heat transfer coefficient of the second metal layer (502). However, the embodiments supported in the present disclosure are not limited thereto. The case (410) includes a first metal layer (501), a second metal layer (502), and a third metal layer (503) having relatively high thermal conductivity therebetween, thereby reducing damage to internal components of the battery (370) (e.g., electrode assembly (420)) caused by heat transferred from the electronic component (401) to the case (410), improving the heat dissipation performance of the battery (370) against the heat, and also improving space efficiency.

[0127] For example, the first metal layer (501) and the second metal layer (502) may each include stainless steel. For example, the third metal layer (503) may include copper. However, the embodiments supported by the present disclosure are not limited thereto. For example, at least one of the metal layers (501, 502, 503) may be omitted. For example, the first metal layer (501) may be omitted. The third metal layer (503) may be, for example, a metal coating. However, the embodiments are not limited thereto.

[0128] For example, the case (410) may include a first plate (411) facing the bracket (400), and a second plate (412) coupled to the first plate (411). The thermal conductivity of the first plate (411) may be greater than the thermal conductivity of the second plate (412). For example, the first plate (411) may be formed from a metal having different thermal and / or mechanical properties from those of the second plate (412). For example, the thermal resistance of the first plate (411) may be less than the thermal resistance of the second plate (412). For example, the heat transfer coefficient of the first plate (411) may be greater than the heat transfer coefficient of the second plate (412). However, the embodiments supported in the present disclosure are not limited thereto.

[0129] For example, the stack structure of the metal layers (501, 502, 503) may be formed on the first plate (411) among the first plate (411) and the second plate (412). For example, the first plate (411) may include a first metal layer (501) forming a part of an outer surface (410a) of the case (410), a second metal layer (502) forming a part of an inner surface (410b) of the case (410), and a third metal layer (503) disposed between the first metal layer (501) and the second metal layer (502). However, the embodiments supported in the present disclosure are not limited thereto. The case (410) of the battery (370) is formed so that the thermal conductivity of the first plate (411) attached to the bracket (400) is greater than the thermal conductivity of the second plate (412) coupled to the first plate (411), thereby improving the heat dissipation performance of the battery (370) for heat transferred from the electronic component (401) to the case (410) through the bracket (400).

[0130] In one embodiment, the first connecting portion (411a) of the first plate (411) that is connected to the second plate (412) may be formed from substantially the same metal material as the second connecting portion (412a) of the second plate (412) that is connected to the first plate (411). For example, the second plate (412) may be formed from substantially the same metal material as the second metal layer (502) of the first plate (411) that defines the first connecting portion (411a) that is connected to the second plate (412). For example, the second metal layer (502) of the second plate (412) and the second connecting portion (412a) that is connected to the second metal layer (502) may be formed from stainless steel. For example, the second metal layer (502) and the second plate (412) coupled with the second metal layer (502) may be formed integrally from stainless steel, but the embodiment is not limited thereto. Since the portions where the first plate (411) and the second plate (412) are coupled to each other are formed from substantially the same metal, the case (410) can reduce damage to one of the plates (411, 412) due to different thermal conductivities caused by heat transferred from the electronic component (401) to the case (410).

[0131] For example, the first plate (411) and the second plate (412) may be made of different metals or may be metal layers with different compositions. Different metal layers may refer to stacks of physically different metals or substantially identical metals with different surface treatments. Different surface treatments may refer to corroding the surface of a metal to increase its thermal resistance or coating it with a metal with high thermal conductivity.

[0132] Unlike the illustrated embodiment, the case (410) may be formed integrally from a copper alloy. For example, as exemplarily illustrated in FIG. 4C, the first plate (411) and the second plate (412) may be provided by processing a circular plate formed from a copper alloy. However, the embodiments supported by the present disclosure are not limited thereto, and the case (410) may be formed integrally from a metal and / or alloy having relatively high thermal conductivity with respect to the bracket (400), thereby improving the heat dissipation performance of the battery (370).

[0133] For example, the electronic component (401) may be placed on one side (510a) of the printed circuit board (510) facing the bracket (400). The electronic device (101) may include a shield can (520) placed on the one side (510a) and surrounding the electronic component (401). For example, the shield can (520) may include an opening (525) formed over the electronic component (401). For example, the shield can (520) may be coupled to one side (510a) of the printed circuit board (510) to which the electronic component (401) is coupled, thereby shielding the electronic component (401). The opening (525) of the shield can (520) may overlap with the electronic component (401) when viewed from above (e.g., when viewed in the +z direction). The opening (525) may allow one or more first heat-conducting members (530) attached to the electronic component (401) to pass therethrough. For example, the opening (525) may be a path for at least a portion of heat emitted (transmitted) from the electronic component (401) to be emitted through one or more first heat-conducting members (530) disposed on the electronic component (401).

[0134] For example, the shield can (520) may be connected to the ground within the electronic device (101). For example, the shield can (520) may be electrically connected to the ground of the electronic device (101) through the printed circuit board (510). By being connected to the ground, the shield can (520) may emit electromagnetic waves emitted from the electronic component (401) to the ground. For example, one or more other electronic components (402) may be coupled to the other side (510b) of the printed circuit board (510) opposite to the side (510a) on which the electronic component (401) is coupled. The shield can (520) may, for example, reduce degradation of the performance of one or more other electronic components (402) around the electronic component (401) due to the electromagnetic waves by emitting the electromagnetic waves to the ground.

[0135] For example, the electronic device (101) may include a shielding sheet (540) that is attached to a shield can (520) and covers an opening (525) of the shield can (520), and one or more first thermally conductive members (530) that are interposed between the electronic component (401) and the shielding sheet (540) through the opening (525). For example, the shielding sheet (540) may be disposed between the shield can (520) and the bracket (400) (or the vapor chamber (550)). The shielding sheet (540) may be in contact with the one or more first thermally conductive members (530) that pass through the opening (525). The shielding sheet (540) may shield the electronic component (401) together with the shield can (520) by covering the opening (525). For example, the shielding sheet (540) may be electrically connected to the shield can (520) by including a conductive material. The shielding sheet (540) may be configured to transmit electromagnetic waves emitted from the electronic component (401) to the shield can (520) connected to the ground, but the embodiment is not limited thereto.

[0136] For example, one or more first heat-conducting members (530) may be attached on the electronic component (401). The one or more first heat-conducting members (530) may be interposed between the electronic component (401) and the shielding sheet (540). The one or more first heat-conducting members (530) may be in contact with the shielding sheet (540) through the opening (525) of the shield can (520). For example, the one or more first heat-conducting members (530) may be in contact with the electronic component (401) and the shielding sheet (540). For example, the one or more first heat-conducting members (530) may transfer at least a portion of the heat emitted (transferred) from the electronic component (401) to the shielding sheet (540) and / or the bracket (400) on the one or more first heat-conducting members (530) through conductive heat transfer. For example, one or more first heat conductive members (530) can be attached to the shielding sheet (540) and secured between the shielding sheet (540) and the electronic component (401).

[0137] For example, one or more first thermally conductive members (530) can penetrate at least a portion of an opening (525) of a shield can (520). For example, one or more first thermally conductive members (530) can be attached to a shielding sheet (540) covering the opening (525) by passing through the opening (525). For example, one or more first thermally conductive members (530) can provide a path for heat emitted (transferred) from the electronic component (401) through the opening (525) to be transferred to the shielding sheet (540) and the vapor chamber (550). For example, one or more first thermally conductive members (530) can include a material having a relatively high thermal conductivity. The one or more first thermally conductive members (530) may be referred to as a TIM (thermal interface material) in that they are interposed between the electronic component (401) and the shielding sheet (540), but are not limited thereto. The electronic device (101) includes one or more first thermally conductive members (530) that transfer at least a portion of the heat emitted (transmitted) from the electronic component (401) through the opening (525) of the shielding can (520) to the shielding sheet (540) and / or the vapor chamber (550), thereby reducing degradation of the performance of the electronic component (401) surrounded by the shielding can (520) due to the heat emitted (transmitted) from the electronic component (401).

[0138] For example, the bracket (400) may include a slit (405) formed on the battery (370). The electronic device (101) may include a vapor chamber (550) disposed on the bracket (400) and covering the slit (405), and one or more second heat-conducting members (560) at least partially interposed between the vapor chamber (550) and the case (410) of the battery (370) through the slit (405).

[0139] For example, the slit (405) of the bracket (400) may face the first plate (411) of the case (410) attached to the bracket (400). The slit (405) may be formed between the vapor chamber (550) and the first plate (411). For example, the slit (405) may provide a passage for a heat transfer path from the vapor chamber (550) to the case (410).

[0140] For example, the vapor chamber (550) may be disposed on a second surface (400b) opposite to the first surface (400a) of the bracket (400) to which the electronic component (401) and the battery (370) are attached. The vapor chamber (500) may be attached, for example, on the second surface (400b), to receive heat emitted (transferred) from the electronic component (401) through conductive heat transfer. For example, the vapor chamber (550) may receive at least a portion of the heat emitted (transferred) from the electronic component (401) through the bracket (400). The vapor chamber (550) may reduce damage to the electronic component (401) caused by the heat by diffusing the received heat. For example, the vapor chamber (550) may transfer at least a portion of the heat received through the bracket (400) to the case (410) of the battery (370) through the slit (405) (or one or more second heat conducting members (560) interposed between the vapor chamber (550) and the case (410) through the slit (405). However, the embodiments supported by the present disclosure are not limited thereto, and although not shown, at least a portion of the vapor chamber (550) may be disposed over the electronic component (401) so as to at least partially overlap the electronic component (401).

[0141] For example, one or more second heat-conducting members (560) may be attached to the bracket (400) to cover the slit (405) of the bracket (400), and may include a heat-dissipating sheet (561) in contact with the case (410), and a heat-dissipating material (562) disposed between the vapor chamber (550) and the heat-dissipating sheet (561) to fill the slit (405). For example, the heat-dissipating sheet (561) may be attached to a first surface (400a) of the bracket (400) facing the battery (370). The heat-dissipating sheet (561) may be surrounded by, for example, an adhesive member (570) for attaching the battery (370) to the first surface (400a). For example, the heat dissipation material (562) can fill the space between the heat dissipation sheet (561) and the vapor chamber (550). The heat dissipation material (562) can occupy the slit (405) of the bracket (400) by being interposed between the heat dissipation sheet (561) and the vapor chamber (550). For example, as illustrated, when the battery (370) is pressed onto the bracket (400) through the adhesive member (570), the heat dissipation sheet (561) can be compressed toward the vapor chamber (550) by the case (410) of the battery (370). The heat dissipation material (562) between the heat dissipation sheet (561) and the vapor chamber (550) can occupy the space (or slit (405)) between the vapor chamber (550) and the heat dissipation sheet (561) by being diffused by the compressed heat dissipation sheet (561). However, the embodiments supported in the present disclosure are not limited thereto.The electronic device (101) forms a heat transfer path from the electronic component (401) to the battery (370) and includes various components for heat dissipation (e.g., one or more first heat-conducting members (530), a shielding sheet (540), a bracket (400), a slit (405), a vapor chamber (550), or one or more second heat-conducting members (560)), thereby improving the heat dissipation performance of the electronic device (101) for heat emitted (transferred) from the electronic component (401).

[0142] Figure 6a is a top plan view of a battery of an exemplary electronic device. Figures 6b, 6c, 6d, and 6e illustrate the internal structure of the exemplary electronic device.

[0143] Referring to FIGS. 6A, 6B, 6C, 6D, and 6E, the electronic device (101) may include an electronic component (401), a bracket (400) disposed on the electronic component (401), or a battery (370) spaced apart from the electronic component (401). The battery (370) may include a case (410) fastened to the bracket (400), an electrode assembly (420) disposed within the case, a first tab (430) extending from the electrode assembly (420) through the case (410) to the outside of the battery (370), a second tab (e.g., the second tab (440) of FIG. 4b) extending from the electrode assembly (420) through the case (410) to the outside of the battery (370), and an insulating cover (450) disposed within the case (410) and including a first through hole (e.g., the first through hole (451) of FIG. 4b) penetrated by the first tab (430) and a second through hole (e.g., the second through hole (452) of FIG. 4b) penetrated by the second tab (440) and spaced apart from the first through hole (451). The above insulating cover (450) can electrically isolate the first tab (430) and the second tab (440) from the case (410).However, the embodiments supported by the present disclosure are not limited thereto, and the electronic device (101) and / or battery (370) exemplarily illustrated and described in FIGS. 6A to 6D may include structures and / or configurations exemplarily illustrated and described in FIGS. 4A to 5 within a non-contradictory range (e.g., one or more first electrodes (421) connected to the first tab (430), one or more second electrodes (422) connected to the second tab (440), a slit (405), metal layers (501, 502, 503) of the case (410), a printed circuit board (510), a shield can (520), one or more first heat-conducting members (530), a shielding sheet (540), a vapor chamber (550), one or more second heat-conducting members (560), or an adhesive member (570)). Hereinafter, redundant descriptions of configurations having the same reference numerals as those illustrated and described in FIGS. 4a to 5 may be omitted.

[0144] According to one embodiment, the case (410) of the battery (370) may include a flange (610) formed along an edge of the case (410). For example, the flange (610) may protrude from a portion of the case (410) to increase an area for the case (410) to be coupled to the bracket (400). For example, the flange (610) may be formed on the first plate (411) among the first plate (411) and the second plate (412) of the case (410), but the embodiments supported by the present disclosure are not limited thereto, and the flange (610) may be formed through a portion where the first plate (411) and the second plate (412) are coupled to or overlap each other.

[0145] In one embodiment, the flange (610) may include one or more holes (611) penetrating the flange. For example, referring to FIG. 6A, the one or more holes (611) may include a plurality of holes (611a, 611b, 611c, 611d) formed along an edge of the case (410). Referring to FIGS. 6B and 6D, the electronic device (101) may include a fastener (620) penetrating the one or more holes (611) and coupled to the bracket (400) such that the case (410) comes into contact with the bracket (400). For example, the fastener (620) can be coupled to the bracket (400) through one or more holes (611), thereby pressing the case (410) (or the flange (610) of the case (410)) to the bracket (400). For example, unlike as illustrated in FIG. 5, since the case (410) is coupled to the bracket (400) through the fastener (620), the adhesive member (570) for attaching the battery (370) to the bracket (400) can be omitted. By omitting the adhesive member (570), the case (410) (or the first plate (411)) of the battery (370) can be brought into direct contact with the bracket (400) through the fastener (620). By the above contact, the case (410) can improve the heat dissipation performance of the electronic device (101) by receiving heat from the bracket (400) through conductive heat transfer. For example, the fastener (620) can fix the case (410) to the bracket (400) by including bolts (621, 622) that are respectively coupled to one or more holes (611), but the embodiment is not limited thereto, and the electronic device (101) can improve the heat dissipation performance of the electronic device (101) by bringing the case (410) into contact with the bracket (400) through various fastening members that couple the case (410) to the bracket (400) through the flange (610).

[0146] In one embodiment, the fastener (620) may at least partially overlap the printed circuit board (510). For example, at least a portion of the flange (610) may be disposed on the printed circuit board (510) (e.g., in the +z-axis direction). The fastener (620) (or the first bolt (621)) coupled to the at least a portion of the flange (610) may be disposed on the printed circuit board (510) such that the printed circuit board (510) may at least partially overlap the printed circuit board (510) when viewed from above (e.g., when viewed in the +z-direction). However, the embodiments supported by the present disclosure are not limited thereto. The fastener (620) may be disposed to at least partially overlap the printed circuit board (510), thereby providing additional space within the electronic device (101) to secure the capacity of the battery (370) between the battery (370) and the printed circuit board (510).

[0147] The first plate (411) of the case (410) may have a higher thermal conductivity, i.e., a higher thermal conductivity, than the bracket (400). For example, the bracket (400) may be formed of a material or structure having a relatively higher rigidity than the case (410) of the battery (370) in order to protect electronic components (e.g., electronic components (401)) mounted on the bracket (400). The case (410) may be formed of a material having a relatively higher thermal conductivity than the bracket (400) in order to diffuse heat transferred from the bracket (400). However, the embodiments supported in the present disclosure are not limited thereto.

[0148] Referring to FIGS. 6C and 6D , the electronic device (101) may include a coil (630) used for wireless charging of the battery (370) that is at least partially disposed within the slit (405) of the bracket (400) instead of the vapor chamber (550) as illustrated in FIGS. 5 and 6B . The case (410) of the battery (370) may be configured to form a heat transfer path from the coil (630) to the bracket (400). For example, the coil (630) may be configured to receive power from an external source of the electronic device (101) (e.g., from the electronic device (102) of FIG. 1 ). The coil (630) may supply power to the battery (370) through the power transmitted from the external source. For example, the coil (630) may include a near field communication (NFC) antenna for wireless communication. For example, the coil (630) may be configured to receive information from an external electronic device (102) to the electronic device (101) or to transmit information from the electronic device (101) to the external electronic device (102) via magnetic secure transmission. However, the embodiments supported by the present disclosure are not limited thereto.

[0149] For example, at least a portion of the coil (630) may be accommodated within the slit (405) of the bracket (400). For example, the coil (630) may be in direct and / or indirect contact with the case (410) of the battery (370) through the slit (405), or may be attached to the case (410). Heat emitted (transmitted) from the coil (630) may be transferred to the case (410) that is in contact with and / or attached to the coil (630). The case (410) may dissipate the heat by transferring the heat transferred from the coil (630) to the bracket (400) coupled with the case (410). However, the embodiments supported in the present disclosure are not limited thereto. The battery (370) (or the case (410) of the battery (370)) can improve the heat dissipation performance of the electronic device (101) by diffusing heat transferred from the electronic component (401) and / or the coil (630) together with the bracket (400) and provide a space for accommodating the coil (630).

[0150] Referring to FIG. 6C, the electronic device (101) may, unlike as illustrated in FIG. 5, instead of the adhesive member (570), include one or more third thermally conductive members (650) that attach the case (410) to the bracket (400) and at least partially surround the coil (630). The one or more third thermally conductive members (650) may be configured to form a heat transfer path from the coil (630) to the bracket (400). For example, the one or more third thermally conductive members (650) may be interposed between the first plate (411) of the case (410) and the bracket (400). Heat transferred from the electronic component (401) to the bracket (400) may be spread to the first plate (411) (or the case (410)) through the one or more third thermally conductive members (650). For example, heat transferred from the coil (630) to the first plate (411) (or case (410)) may be spread to the bracket (400) through the third heat-conducting members (650). For example, one or more of the third heat-conducting members (650) may include a heat-dissipating tape or a heat-dissipating gel, and may be interposed between the case (410) and the bracket (400) together with the adhesive member (570) of FIG. 5, unlike the illustrated embodiment, but the embodiments supported in the present disclosure are not limited thereto.

[0151] Referring to FIG. 6e, the case (410) of the battery (370) can be fixed on the bracket (400) via the third heat-conducting member (650) and the fastener (620). However, the embodiments supported in the present disclosure are not limited thereto.

[0152] The heat dissipation structure using the battery (370) and structures around the battery (370) illustrated and described in FIGS. 6A to 6E is merely exemplary, and the electronic device (101) according to the examples supported by the present disclosure may include a combination of the structures and / or configurations included in the examples illustrated and described in FIGS. 6A to 6D within a non-contradictory range.

[0153] As described above, an electronic device (e.g., electronic device (101) of FIG. 1) may include a printed circuit board (e.g., printed circuit board (510) of FIG. 5) including electronic components (e.g., processor (120) of FIG. 1, electronic components (401) of FIG. 4a), and a battery (e.g., battery (189) of FIG. 1, battery (370) of FIG. 3b). The battery may include a metal can case (e.g., case (410) of FIG. 4c) including a plate (e.g., first plate (411) of FIG. 4c) and a cover formed from a first metal material (e.g., second plate (412) of FIG. 4c), and an electrode assembly (e.g., electrode assembly (420) of FIG. 4c) disposed within the metal can case. The plate may include a first layer formed from a second metal material (e.g., the third metal layer (503) of FIG. 5), and a second layer formed from at least the first metal material and disposed on the first layer and facing the electrode assembly (e.g., the second metal layer (502) of FIG. 5). In other words, the second layer may be positioned between the first layer and the electrode assembly, with a first surface thereof in physical contact with the electrode assembly and a second surface thereof in physical contact with the first layer. The thermal conductivity of the second metal material may be greater than the thermal conductivity of the first metal material so as to dissipate heat generated by the electronic component and transferred through a heat conducting member in thermal contact with the plate. The cover may be joined to the plate by welding the second layer of the plate.

[0154] For example, the electrode assembly may include first electrodes (e.g., one or more first electrodes (421) of FIG. 4c), second electrodes having a different polarity with respect to the first electrodes (e.g., one or more second electrodes (422) of FIG. 4c), first electrode tabs extending from the first electrodes within the metal can case (e.g., first electrode tabs (432) of FIG. 4c), and second electrode tabs extending from the second electrodes within the metal can case (e.g., second electrode tabs (442) of FIG. 4c). The electronic device may further include an insulating cover (e.g., insulating cover (450) of FIG. 4c) disposed within the metal can case and insulating the first electrode tabs and the second electrode tabs from the metal can case.

[0155] For example, the insulating cover may include a first through hole (e.g., a first through hole (451) of FIG. 4C) aligned with the first electrode tab, and a second through hole (e.g., a second through hole (452) of FIG. 4C) aligned with the second electrode tab and spaced apart from the first through hole. The electronic device may further include a first lead tab (e.g., a first lead tab (441) of FIG. 4C) that penetrates the metal can case and the first through hole and is guided by the first through hole to be connected to the first electrode tab within the metal can case, and a second lead tab (e.g., a second lead tab (442) of FIG. 4C) that penetrates the metal can case and the second through hole and is guided by the second through hole to be connected to the second electrode tab within the metal can case.

[0156] For example, the plate may further include a third layer (e.g., the first metal layer (501) of FIG. 5) that at least partially forms an outer surface of the case (e.g., the outer surface (410a) of FIG. 4b), and the second layer may be disposed between the first layer and the third layer. The rigidity of the third layer may be greater than the rigidity of the first layer.

[0157] For example, the third layer may be formed from at least the first metal material. The first metal material may include stainless steel, and the second metal material may include copper.

[0158] For example, the thermally conductive member may include a thermally conductive bracket (e.g., bracket (400) of FIG. 4A) disposed over the printed circuit board and the battery, and a vapor chamber (e.g., vapor chamber (550) of FIG. 5) disposed on the thermally conductive bracket so as to be at least partially adjacent to the battery. In other words, the bracket may be at least partially disposed over, under, or on a side of the battery. The vapor chamber may be configured to diffuse heat received from the thermally conductive bracket to the metal can case.

[0159] For example, the thermally conductive bracket may include a slit (e.g., slit (405) of FIG. 5) formed between the vapor chamber and the plate of the metal can case. The thermally conductive member may further include a heat dissipating material (e.g., heat dissipating material (562) of FIG. 5) interposed between the vapor chamber and the plate through the slit.

[0160] For example, the heat conducting member may further include a heat dissipation sheet (e.g., heat dissipation sheet (561) of FIG. 5) attached to the plate of the metal can case and pressurizing the heat dissipation material so that the heat dissipation material is positioned between the vapor chamber and the plate within the slit.

[0161] For example, the first metal material forming the cover may include a copper alloy.

[0162] For example, the cover may include a recess (e.g., recess (415) in FIG. 4c) that forms an internal space for accommodating the electrode assembly.

[0163] For example, the metal can case may include a flange (e.g., flange (610) of FIG. 6A) formed along an edge of the metal can case and including a hole (e.g., hole (611) of FIG. 6A). The electronic device may further include a fastener (e.g., fastener (620) of FIG. 6B) that penetrates the hole and is coupled to a portion of the heat-conducting member such that the metal can case comes into contact with the portion of the heat-conducting member.

[0164] For example, the fastener may at least partially overlap the printed circuit board.

[0165] For example, the thermally conductive member may include a thermally conductive bracket including a slit formed adjacent to the battery. In other words, the slit may be at least partially disposed above, below, or on a side of the battery. The electronic device may further include a coil (e.g., coil 630 of FIG. 6C) at least partially disposed within the slit and used for wireless charging of the battery. The metal can case may be configured to form a heat transfer path from the coil to the bracket.

[0166] For example, the thermally conductive member may further include a thermally conductive adhesive (e.g., one or more third thermally conductive members (650) of FIG. 6c) configured to attach the metal can case to the bracket, at least partially surround the coil, and form the heat transfer path.

[0167] For example, the thermally conductive member may further include a thermally conductive sheet (e.g., a shielding sheet (540) of FIG. 5) that is at least partially interposed between the electronic component and the thermally conductive bracket.

[0168] As described above, an electronic device (e.g., electronic device (101) of FIG. 1) may include a heat-generating component (e.g., processor (120) of FIG. 1, electronic component (401) of FIG. 4a), a bracket (e.g., frame structure (340) of FIG. 3b, bracket (400) of FIG. 4a) disposed on the heat-generating component, and a battery (e.g., battery (189) of FIG. 1, or battery (370) of FIG. 3b) spaced apart from the heat-generating component. The battery comprises a case (e.g., case (410) of FIG. 4a) fastened to the bracket, an electrode assembly (e.g., electrode assembly (420) of FIG. 4b) disposed within the case and including one or more first electrodes (e.g., one or more first electrodes (421) of FIG. 4c), and one or more second electrodes (e.g., one or more second electrodes (422) of FIG. 4c) having a different polarity from the one or more first electrodes, a first tab (e.g., first tab (430) of FIG. 4b) extending from the one or more first electrodes of the electrode assembly through the case and to the outside of the battery, a second tab (e.g., second tab (440) of FIG. 4b) extending from the one or more second electrodes of the electrode assembly through the case and to the outside of the battery, and a first through hole (e.g., first through hole of FIG. 4b) disposed within the case and penetrated by the first tab. The insulating cover may include a first through hole (451) and a second through hole (e.g., the second through hole (452) of FIG. 4B) that is spaced apart from the first through hole and is penetrated by the second tab (e.g., the second through hole (451) of FIG. 4B). The insulating cover may electrically isolate the first tab and the second tab from the case.

[0169] For example, the first tab may include a first lead tab (e.g., the first lead tab (431) of FIG. 4B) that penetrates the case and the first through hole and is at least partially exposed to the outside of the battery, and a first electrode tab (e.g., the first electrode tab (432) of FIG. 4B) that is connected to the first lead tab within the case. The second tab may include a second lead tab (e.g., the second lead tab (441) of FIG. 4B) that penetrates the case and the second through hole and is at least partially exposed to the outside of the battery, and a second electrode tab (e.g., the second electrode tab (442) of FIG. 4B) that is connected to the second lead tab within the case. The insulating cover may guide a position between the first lead tab and the second lead tab.

[0170] For example, the battery may further include a first insulator (e.g., the first insulator (461) of FIG. 4B) interposed between the case and the first lead tab, and a second insulator (e.g., the second insulator (462) of FIG. 4B) interposed between the case and the second lead tab.

[0171] For example, the case may include a first metal layer (e.g., the first metal layer (501) of FIG. 5) that at least partially forms an outer surface of the case (e.g., the outer surface (410a) of FIG. 4b), a second metal layer (e.g., the second metal layer (502) of FIG. 5) that at least partially forms an inner surface of the case (e.g., the inner surface (410b) of FIG. 4b), and a third metal layer (e.g., the third metal layer (503) of FIG. 5) that is disposed between the first metal layer and the second metal layer. The thermal conductivity of the third metal layer may be greater than the thermal conductivity of the first metal layer and the thermal conductivity of the second metal layer.

[0172] For example, the first metal layer and the second metal layer may include stainless steel. The third metal layer may include copper.

[0173] For example, the case may be formed integrally from a copper alloy.

[0174] For example, the case may include a first plate facing the bracket (e.g., the first plate (411) of FIG. 4C), and a second plate (e.g., the second plate (412) of FIG. 4C) coupled to the first plate and including a recess (e.g., the recess (415) of FIG. 4C) for receiving the electrode assembly. The thermal conductivity of the first plate may be greater than the thermal conductivity of the second plate.

[0175] For example, a portion of the first plate that is connected to the second plate may be formed from substantially the same metallic material as a portion of the second plate that is connected to the first plate.

[0176] For example, the case may include a flange (e.g., a flange (610) of FIG. 6A) formed along an edge of the case and including a hole (e.g., one or more holes (611) of FIG. 6A). The electronic device may further include a fastener (e.g., a fastener (620) of FIG. 6B) that penetrates the hole and is coupled to the bracket such that the case is brought into contact with the bracket.

[0177] For example, the electronic device may further include a printed circuit board (e.g., the first printed circuit board (350) of FIG. 3b, the printed circuit board (510) of FIG. 5) on which the heat generating component is mounted. The fastener may at least partially overlap the printed circuit board.

[0178] For example, the bracket may include a slit formed adjacent to the battery (e.g., slit (405) of FIG. 5). The electronic device may include a vapor chamber disposed on the bracket and covering the slit (e.g., vapor chamber (550) of FIG. 5), and one or more first thermally conductive members (e.g., one or more second thermally conductive members (560) of FIG. 5) at least partially interposed between the vapor chamber and the case through the slit.

[0179] For example, the one or more first heat-conducting members may include a heat-dissipating sheet (e.g., a heat-dissipating sheet (561) of FIG. 5) attached to the bracket so as to cover the slit and in contact with the case, and a heat-dissipating material (e.g., a heat-dissipating material (562) of FIG. 5) disposed between the vapor chamber and the heat-dissipating sheet so as to fill the slit.

[0180] For example, the bracket may include a slit formed adjacent to the battery. The electronic device may further include a coil (e.g., coil (630) of FIG. 6C) at least partially disposed within the slit and used for wireless charging of the battery. The case may be configured to form a heat transfer path from the coil to the bracket.

[0181] For example, the electronic device may further include one or more second thermally conductive members (e.g., one or more third thermally conductive members (650) of FIG. 6C) configured to attach the case to the bracket, at least partially surround the coil, and form the heat transfer path.

[0182] For example, the electronic device may further include one or more third heat-conducting members (e.g., one or more first heat-conducting members (530) of FIG. 5) interposed at least partially between the heat-generating component and the bracket.

[0183] An electronic device according to the above may include a heat-generating component, a bracket disposed on the heat-generating component, and a battery spaced apart from the heat-generating component. The battery may include a case including a first plate facing the bracket and a second plate coupled to the first plate, and an electrode assembly disposed within the case. The first plate may include a first metal layer forming at least partially an outer surface of the case, a second metal layer forming at least partially an inner surface of the case, and a third metal layer disposed between the first metal layer and the second metal layer. A thermal conductivity of the third metal layer may be greater than a thermal conductivity of the first metal layer and a thermal conductivity of the second metal layer. A thermal conductivity of the second metal material may be greater than a thermal conductivity of the first metal material to dissipate heat generated by the electronic component, which is transmitted through a thermally conductive member in thermal contact with the plate. In other words, the thermal conductivity of the second metallic material may be greater than the thermal conductivity of the first metallic material, wherein the second material may be configured for the purpose of dissipating heat generated by the electronic component by transferring heat through the thermally conductive member in thermal contact with the plate. In other words, the thermal conductivity of the second metallic material may be greater than the thermal conductivity of the first metallic material, wherein the first layer may be configured for the purpose of dissipating heat generated by the electronic component by transferring heat through the thermally conductive member in thermal contact with the plate.

[0184] For example, the second plate may be formed from substantially the same metal material as the second metal layer connected to the second plate.

[0185] For example, the first metal layer and the second metal layer may include stainless steel. The third metal layer may include copper.

[0186] For example, the bracket may include a slit formed adjacent to the battery. The electronic device may further include a coil, at least partially disposed within the slit, used for wireless charging of the battery. The case may be configured to form a heat transfer path from the coil to the bracket.

[0187] For example, the case may include a flange formed along an edge of the case and including a hole. The electronic device may further include a fastener that penetrates the hole and is coupled to the bracket so that the case is in contact with the bracket, and a printed circuit board on which the heat-generating component is mounted. The fastener may at least partially overlap the printed circuit board.

[0188] For example, the thermally conductive member may further include a heat dissipation sheet attached to the plate of the metal can case, which presses the heat dissipation material so that the heat dissipation material is positioned between the vapor chamber and the plate within the slit.

[0189] For example, the thermally conductive member may further include a thermally conductive bracket including a slit formed over the battery.

[0190] The electronic device may include an insulating cover disposed within the metal can case and electrically isolating the first electrode tab and the second electrode tab from the metal can case, the insulating cover including a first through hole aligned with the first electrode tab and a second through hole spaced apart from the first through hole and aligned with the second electrode tab.

[0191] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0192] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0193] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0194] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0195] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0196] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), A printed circuit board (510) including electronic components (120; 401); and Includes battery (189; 370), The above battery (189; 370) is A metal can case (410) comprising a plate (411) and a cover (412) formed from a first metal material and bonded to the plate; and It includes an electrode assembly (420) placed within the metal can case (410), The above plate (411) is A first layer (503) formed from a second metal material; and A second layer (502) formed from at least a first metal material, disposed on said first layer, and facing said electrode assembly (420), The thermal conductivity of the second metal material is: The heat generated by the electronic component (120; 401) and transmitted through the heat conducting member in thermal contact with the plate (411) is greater than the thermal conductivity of the first metal material, The above cover is joined to the plate by welding with the second layer of the plate, Electronic device (101).

2. In paragraph 1, The above electrode assembly (420) is First electrodes (421); Second electrodes (422) having a different polarity from the first electrodes (421); A first electrode tab (432) extending from the first electrodes (421) within the metal can case (410); and Including a second electrode tab (442) extending from the second electrodes (422) within the metal can case (410), Further comprising an insulating cover (450) disposed within the metal can case (410) and insulating the first electrode tab (432) and the second electrode tab (442) from the metal can case (410). Electronic device (101).

3. In paragraph 2, The above insulating cover (450) is a first through hole (451) aligned with the first electrode tab (432); and A second through hole (452) aligned with the second electrode tab (442) and spaced apart from the first through hole (451), A first lead tab (431) that penetrates the metal can case (410) and the first through hole (451) and is connected to the first electrode tab (432) within the metal can case (410) by being guided by the first through hole (451); and Further comprising a second lead tab (441) that penetrates the metal can case (410) and the second through hole (452) and is connected to the second electrode tab (442) within the metal can case (410) by being guided by the second through hole (452). Electronic device (101).

4. In any one of paragraphs 1 to 3, The above plate (411) is Further comprising a third layer (501) at least partially defining the outer surface (410a) of the case (410), wherein the second layer (503) is disposed between the first layer (502) and the third layer (501), The stiffness of the third layer (501) is Greater than the stiffness of the first layer (503) above, Electronic device (101).

5. In paragraph 4, The above third layer (501) is formed from at least the first metal material, The above first metal material is, Contains stainless steel, The above second metal material is, containing copper, Electronic device (101).

6. In any one of paragraphs 1 to 5, The above heat conducting member is, A thermally conductive bracket (340; 400) placed on the printed circuit board (510) and the battery (189; 370); and a vapor chamber (550) disposed on the thermally conductive bracket (340; 400) so as to be at least partially adjacent to the battery (189; 379); The above vapor chamber (550) is configured to spread the heat received from the above thermal conductive bracket (340; 400) to the above metal can case (410). Electronic device (101).

7. In paragraph 6, The above thermal conductive bracket (340; 400) is Including a slit (405) formed between the vapor chamber (550) and the plate (411) of the metal can case (410), The above heat conducting member is, Further comprising a heat dissipation material (562) interposed between the vapor chamber (550) and the plate (411) through the slit (405). Electronic device (101).

8. In paragraph 7, The above heat conducting member is, Further comprising a heat dissipation sheet (561) attached to the plate (411) of the metal can case (410) and pressurizing the heat dissipation material (562) so that the heat dissipation material (562) is positioned between the vapor chamber (550) and the plate (411) within the slit (405). Electronic device (101).

9. In any one of paragraphs 1 to 8, The first metal material forming the cover (412) is Containing copper alloy, Electronic device (101).

10. In any one of paragraphs 1 to 9, The above cover (412) is, Including a recess (415) forming an internal space for accommodating the electrode assembly (420). Electronic device (101).

11. In any one of paragraphs 1 to 10, The above metal can case (410) is It is formed along the edge of the metal can case (410) and includes a flange (610) including a hole (611), The above electronic device (101) is, Further comprising a fastener (620) that penetrates the hole (611) and is coupled to a part of the heat conducting member so that the metal can case (410) comes into contact with the part of the heat conducting member. Electronic device (101).

12. In paragraph 11, The above fastener (620) is, At least partially overlapping with the above printed circuit board (350; 510), Electronic device (101).

13. In any one of paragraphs 1 to 12, The above heat conducting member is, A thermally conductive bracket (340; 400) comprising a slit (405) formed adjacent to the battery (189; 370), The above electronic device (101) is, It further includes a coil (630) which is at least partially disposed within the slit (405) and is used for wireless charging of the battery (189; 370). The above metal can case (410) is configured to form a heat transfer path from the coil (630) to the bracket (340; 400). Electronic device (101).

14. In paragraph 13, The above heat conducting member is, Attaching the metal can case (410) to the bracket (340; 400), further comprising a thermally conductive adhesive (650) configured to at least partially surround the coil (630) and form the heat transfer path. Electronic device (101).

15. In paragraph 13, The above heat conducting member is, Further comprising a thermally conductive sheet (540) at least partially interposed between the electronic component (120; 401) and the thermally conductive bracket (340; 400). Electronic device (101).

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