Rear cover, structural member and electronic device

Abstract

The present application relates to the technical field of electronic devices, and provides a rear cover, a structural member, and an electronic device, capable of solving the problem in the related art that a rear cover is prone to damage due to low strength at a recess. The rear cover is used for an electronic device, and comprises a cover body, an appearance decorative layer and an appearance structural member. The cover body is made of an organic fiber composite material, and has a first surface and a second surface which are arranged opposite to each other, wherein the first surface is provided with a recess formed by mold pressing. The appearance decorative layer covers the portion of the first surface around the recess. The appearance structural member is arranged in the recess. The present application can be used in mobile phones.

Description

Rear cover, structural member and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202421774553.8, filed on July 24, 2024, and entitled "Rear cover, structural member and electronic device", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic devices, in particular to a rear cover, a structural member and an electronic device. BACKGROUND

[0003] The rear cover (also known as the battery cover) is a structural component covering the back side of an electronic device, which mainly serves to protect the internal components of the electronic device and to beautify the decoration. With the development of electronic technology, electronic devices are developing towards thinness, which puts higher requirements on the selection of rear cover materials. How to design the rear cover to meet the requirements of low density and high strength has become one of the important topics in the industry. SUMMARY

[0004] Embodiments of the present application provide a rear cover, a structural member and an electronic device to solve the problem of low strength of the rear cover at the position of the cavity in the related art, which is prone to damage.

[0005] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide a rear cover for an electronic device, comprising a cover body, an appearance decoration layer and an appearance structural member; the cover body is an organic fiber composite material cover body, the cover body has a first surface and a second surface arranged oppositely, the first surface is provided with a cavity pressed out by a mold; the appearance decoration layer covers the first surface at the periphery of the cavity; and the appearance structural member is arranged in the cavity.

[0007] The rear cover provided by the embodiments of the present application has the cavity pressed out by the mold on the cover body, so that the depth of the cavity is controlled by the size of the mold itself. Since the size of the mold itself has high precision, the depth of the pressed cavity can be ensured to have high precision, thereby ensuring the strength of the weak area between the cavity and the second surface of the cover body, avoiding the above-mentioned weak area being pierced in the process of assembling the appearance structural member, and further facilitating to improve the structural reliability of the rear cover.

[0008] In some embodiments of the first aspect, the cover body comprises a base body and a plurality of organic fiber layers embedded in the base body in the thickness direction of the base body, at least one of the organic fiber layers has a curved area, and the curved area is located at the position of the cavity. In this way, the structural strength and impact resistance of the rear cover at the cavity can be improved.

[0009] In some embodiments of the first aspect, the curved region comprises a first curved region, the first curved region is located between the cavity and the second surface, and is curved away from the side of the appearance decoration layer. In this way, the structural strength and impact resistance of the weak region between the cavity and the second surface of the cover body can be improved.

[0010] In some embodiments of the first aspect, a slit is arranged on the first curved region, the slit penetrates the first curved region in the thickness direction. In this way, the slit can release the stress of the organic fiber layer caused by the mold extrusion, and reduce the resistance of the first curved region of the organic fiber layer to the mold extrusion.

[0011] In some embodiments of the first aspect, the at least one organic fiber layer has a relief opening for the cavity to pass through; the curved region comprises a second curved region, the second curved region is located at the edge of the relief opening. In this way, the structural strength and impact resistance of the cover body at the edge of the cavity can be improved.

[0012] In some embodiments of the first aspect, the organic fiber layer is one of a PI fiber layer, a PBO fiber layer, and an aramid fiber layer; and the matrix is a resin matrix. In this way, the weight of the rear cover can be reduced, and the strength and rigidity of the rear cover can be improved.

[0013] In some embodiments of the first aspect, the organic fiber layer is a UHMWPE fiber layer; and the matrix is a resin matrix. In this way, the weight of the rear cover can be reduced.

[0014] In some embodiments of the first aspect, a fillet is arranged at the junction of the cavity bottom wall of the cavity and the cavity side wall of the cavity; and the radius of the fillet ranges from 0.1 mm to 0.25 mm. In this way, the fillet can not only avoid occupying too much space in the cavity, but also avoid stress concentration at the junction of the cavity bottom wall and the cavity side wall of the cavity.

[0015] In some embodiments of the first aspect, a receiving portion is arranged on the cavity bottom wall of the cavity; and the receiving portion is a receiving through hole penetrating the second surface, and the receiving through hole is used for the components on the circuit board inside the electronic device to extend into. In this way, the size of the rear cover and the components in the thickness direction of the rear cover can be overlapped, which is beneficial to reducing the thickness of the electronic device.

[0016] In some embodiments of the first aspect, a receiving portion is arranged on the cavity bottom wall of the cavity; and the receiving portion is a receiving groove, and the receiving groove is used for the protruding structure on the appearance structure to extend into. In this way, the receiving groove plays a positioning role for the appearance structure, thereby facilitating the installation of the appearance structure at the target position.

[0017] In some embodiments of the first aspect, a convex rib is arranged on the cavity bottom wall, the convex rib is used to support the appearance structure, the convex rib divides the cavity bottom wall into a first region and a second region, the first region is provided with the accommodating portion, and the second region is provided with a bonding portion, the bonding portion bonds the appearance structure and the cavity bottom wall. In this way, the convex rib plays a blocking role and can block the uncured bonding portion from flowing to the position of the accommodating portion to block the accommodating portion.

[0018] In the second aspect, the embodiments of the present application provide a structure for manufacturing a back cover of an electronic device, comprising a cover body and an appearance decoration layer; the cover body is an organic fiber composite cover body, the cover body has a first surface and a second surface arranged oppositely, the first surface is provided with a concave cavity pressed out by a mold; the appearance decoration layer covers the first surface, and the appearance decoration layer has a covering area, the covering area is located at the position of the concave cavity and covers the cavity opening of the concave cavity.

[0019] The structure in the embodiments of the present application has the same beneficial effects as the back cover in the first aspect, which will not be described here again.

[0020] In some embodiments of the second aspect, the cover body comprises a base body and a plurality of organic fiber layers embedded in the base body along the thickness direction of the base body, at least one of the organic fiber layers has a curved region, and the curved region is located at the position of the concave cavity.

[0021] In some embodiments of the second aspect, the curved region comprises a first curved region, the first curved region is located between the concave cavity and the second surface, and is curved away from the appearance decoration layer.

[0022] In some embodiments of the second aspect, a slit is arranged on the first curved region, the slit penetrates the first curved region along the thickness direction.

[0023] In some embodiments of the second aspect, at least one of the organic fiber layers has a relief opening for the concave cavity to pass through, and the curved region comprises a second curved region, the second curved region is located at the edge of the relief opening.

[0024] In some embodiments of the second aspect, the organic fiber layer is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and a UHMWPE fiber layer; and the base body is a resin base body.

[0025] In some embodiments of the second aspect, a fillet is arranged at the joint between the cavity bottom wall of the concave cavity and the cavity side wall of the concave cavity; the radius of the fillet ranges from 0.1 mm to 0.25 mm.

[0026] In some embodiments of the second aspect, a protective piece is detachably arranged in the cavity, and the protective piece has a supporting surface located at the cavity opening, and the covering area is arranged on the supporting surface. In this way, the protective piece can support the appearance decoration, so that the appearance decoration layer can cover the cavity. Meanwhile, the protective piece can also protect the structure in the cavity from being damaged by subsequent processes.

[0027] In some embodiments of the second aspect, a convex rib is arranged on the cavity bottom wall of the cavity, and the convex rib is used to support the protective piece. In this way, the convex rib can raise the height of the protective piece relative to the cavity bottom wall, which is conducive to reducing the weight of the protective piece.

[0028] In the third aspect, the embodiments of the present application provide a back cover for an electronic device, which is formed by the structural piece of any one of the embodiments of the second aspect.

[0029] The back cover in the embodiments of the present application has the same beneficial effects as the structural piece in the second aspect, and thus will not be described here again.

[0030] In the fourth aspect, the embodiments of the present application provide an electronic device, which includes a display screen, a middle frame, and the back cover of the first aspect or the third aspect. The display screen is arranged on one side of the middle frame, and the back cover is arranged on the other side of the middle frame.

[0031] The electronic device in the embodiments of the present application has the same beneficial effects as the back cover in the first aspect or the third aspect, and thus will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0032] FIG. 1 is a structural schematic diagram of the back side of an electronic device in the related art;

[0033] FIG. 2 is an A-A sectional view of the back cover of the electronic device shown in FIG. 1;

[0034] FIG. 3 is a sectional view of another back cover in the related art at a cavity;

[0035] FIG. 4 is a structural schematic diagram of the back side of an electronic device (mobile phone) in the first embodiment of the present application;

[0036] FIG. 5 is a B-B sectional view of the electronic device shown in FIG. 4;

[0037] FIG. 6 is a partial enlarged view of the back cover of the electronic device in FIG. 5;

[0038] FIG. 7 is a top view of the back cover shown in FIG. 6 after the appearance structure piece is removed;

[0039] FIG. 8 is a partial enlarged view of FIG. 6;

[0040] FIG. 9 is a sectional view of another back cover of the electronic device in the first embodiment of the present application at a concave cavity;

[0041] FIG. 10 is a schematic diagram of a manufacturing process of the back cover of the electronic device in the first embodiment of the present application;

[0042] FIG. 11 is a schematic diagram of the structure of the back side of an electronic device (a mobile phone) in the second embodiment of the present application;

[0043] FIG. 12 is a C-C sectional view of the electronic device shown in FIG. 11;

[0044] FIG. 13 is an enlarged view of a part of the back cover of the electronic device in FIG. 12;

[0045] FIG. 14 shows a schematic diagram of a manufacturing process of the back cover of the electronic device in the second embodiment of the present application. DETAILED DESCRIPTION

[0046] The technical solutions in some embodiments of the present application will be described below in detail with reference to the accompanying drawings.

[0047] The back cover is a structural component covering the back side of an electronic device (such as a mobile phone, a tablet computer, etc.), which not only protects the internal circuit and components, but also affects the appearance design, hand feeling, and durability of the electronic device. With the development of electronic technology, the electronic device is developing towards thinness, and higher requirements are put forward for the selection of the back cover material. How to design the back cover to meet the requirements of low density and high strength has become one of the important topics in the industry.

[0048] As shown in FIGS. 1 and 2, FIG. 1 is a schematic diagram of the structure of the back side of an electronic device in the related art, and FIG. 2 is a A-A sectional view of the back cover of the electronic device shown in FIG. 1. The back cover 100 of the electronic device includes a cover body 1, an appearance decoration layer 2, and an appearance structural member 3.

[0049] The cover body 1 is an inorganic fiber composite material cover body, which includes a base body 11 and a plurality of (three in the figure) inorganic fiber layers 12 embedded in the inside of the base body 11. The plurality of inorganic fiber layers 12 are arranged along the thickness direction Z of the base body 11. The inorganic fiber layer 12 can be a glass fiber layer, a carbon fiber layer, etc.

[0050] The base body 11 has a first surface 10a and a second surface 10b arranged opposite to each other. The appearance decoration layer 2 covers the first surface 10a. The outer surface of the appearance decoration layer 2 is provided with a concave cavity 14. The concave cavity 14 is located at one side edge (for example, the lower edge, i.e., the side edge of the back cover 100 away from the camera) of the back cover 100 and penetrates through the appearance decoration layer 2 and part of the cover body 1. As shown in FIGS. 1 and 2, the concave cavity 14 is a LOGO slot, and the appearance structural member 3 is a LOGO.

[0051] The rear cover 100 is manufactured by the following steps: M1, manufacturing the cover body 1 by a hot-pressing process; M2, covering the appearance decoration layer 2 on the first surface 10a of the cover body 1; M3, removing part of the appearance decoration layer 2 and part of the cover body 1 by numerical control machining to form the concave cavity 14.

[0052] The rear cover 100 in the related art, the cover body 1 is made of inorganic fiber composite material, because the density of the inorganic fiber composite material is high, so that the weight of the rear cover 100 is large, which cannot meet the development requirement of thin and light electronic equipment.

[0053] In order to solve the above problems, as shown in FIG. 3, the related art provides another rear cover 100 of an electronic equipment, the main difference between the rear cover 100 shown in FIG. 3 and the rear cover 100 in FIG. 2 is that the cover body 1 of the rear cover 100 shown in FIG. 3 is made of organic fiber composite material, which is described as follows: the cover body 1 of the rear cover 100 includes a base body 11 and a plurality of (three shown in the figure) organic fiber layers 13 embedded in the inside of the base body 11, and the plurality of organic fiber layers 13 are arranged along the thickness direction Z of the base body 11.

[0054] The rear cover 100 is manufactured by the following steps: N1, manufacturing the cover body 1 by a hot-pressing process; N2, covering the appearance decoration layer 2 on the first surface 10a of the cover body 1; N3, removing part of the appearance decoration layer 2 and part of the cover body 1 by laser cutting (the organic fiber composite material has high toughness and cannot be machined by a tool) to form the concave cavity 14.

[0055] However, the depth of the concave cavity 14 formed by laser cutting is difficult to accurately control, which is easy to cause too much cutting material, so that the strength of the weak area between the concave cavity 14 and the second surface 10b of the cover body 1 is reduced, and then the above-mentioned weak area is easily penetrated by the appearance structure 3 in the process of assembling the appearance structure 3 in the concave cavity 14, thereby reducing the structural reliability of the rear cover 100.

[0056] Therefore, the embodiment of the present application provides a rear cover, a structure and an electronic equipment, by setting the concave cavity pressed out by the mold on the cover body of the rear cover, the depth of the concave cavity can be accurately controlled, thereby ensuring the strength of the weak area between the concave cavity and the second surface of the cover body, which is beneficial to improve the structural reliability of the rear cover.

[0057] The electronic equipment in the embodiment of the present application can be a mobile phone, a tablet computer, a wearable device (such as a smart watch) and the like, and the electronic equipment in the embodiment of the present application will be specifically introduced below taking a mobile phone as an example, and other types of electronic equipment can be set by referring to the structure of the mobile phone embodiment, which will not be repeated here.

[0058] As shown in FIG. 4 and FIG. 5, FIG. 4 is a structural schematic diagram of the back side of the electronic device (mobile phone) in the first embodiment of the present application, and FIG. 5 is a B-B sectional view of the electronic device shown in FIG. 4. The electronic device comprises a display screen 200, a middle frame 300 (also referred to as a front shell or a front frame), a back cover 100, and a camera module 500. The display screen 200 is arranged on one side of the middle frame 300, and the back cover 100 is arranged on the other side of the middle frame 300.

[0059] In some embodiments, as shown in FIG. 5, the display screen 200 and the middle frame 300 enclose a first accommodating space 410, and electronic devices such as a mainboard (not shown in the figure) are arranged in the first accommodating space 410. The mainboard is electrically connected to the display screen 200 through a flexible circuit board. The display screen 200 can be a liquid crystal display screen 200 or an OLED (Organic Light-Emitting Diode) display screen 200, which is not limited here.

[0060] The back cover 100 and the middle frame 300 enclose a second accommodating space 420, and the camera module 500 is arranged in the second accommodating space 420. The camera module 500 comprises a camera 510 and a connecting circuit board 520 electrically connected to the camera 510. The connecting circuit board 520 is electrically connected to the mainboard. The light inlet end of the camera 510 is arranged opposite to a camera window 6 arranged on the back cover 100, so as to ensure that the camera 510 can receive light emitted by a subject outside the electronic device.

[0061] The camera 510 can be arranged in one or multiple numbers. For example, as shown in FIG. 4 and FIG. 5, the number of the camera 510 is three, and the three cameras 510 are arranged side by side. The back cover 100 is provided with a camera window 6 at a position corresponding to each camera 510.

[0062] Of course, the positional relationship between the display screen 200, the middle frame 300, the back cover 100, the mainboard, and the camera module 500 of the electronic device is not limited to the above, and other arrangements can be adopted according to actual conditions, which is not limited here.

[0063] As shown in FIG. 5 and FIG. 6, FIG. 6 is a partial enlarged view of the back cover 100 of the electronic device shown in FIG. 5. The back cover 100 comprises a cover body 1, an appearance decoration layer 2, and an appearance structural member 3. The cover body 1 is an organic fiber composite material cover body, and has a first surface 10a and a second surface 10b arranged opposite to each other. The first surface 10a is provided with a concave cavity 14 pressed out through a mold. The appearance decoration layer 2 covers the first surface 10a around the concave cavity 14. The appearance structural member 3 is arranged in the concave cavity 14.

[0064] The rear cover 100 in the embodiment of the present application, since the cover body 1 is provided with the concave cavity 14 pressed by the mold, the depth of the concave cavity 14 is controlled by the size of the mold itself, since the size of the mold itself has high precision, thus the depth of the pressed concave cavity 14 has high precision, thereby ensuring the strength of the weak area between the concave cavity 14 and the second surface 10b of the cover body 1, avoiding the above-mentioned weak area being penetrated in the process of assembling the appearance structure 3, and thereby facilitating to improve the structural reliability of the rear cover 100.

[0065] In addition, the cover body 1 is provided with the concave cavity 14 pressed by the mold, thus the concave cavity 14 is not easy to produce debris in the forming process, thereby facilitating the concave cavity 14 to form the clean cover body 1. Meanwhile, the concave cavity 14 has little influence on the appearance of the cover body 1 after forming, thereby facilitating to improve the yield of the appearance of the rear cover 100.

[0066] The concave cavity 14 can be a groove, a hole, or a structure combining a groove and a hole, which is not limited here. As shown in FIGS. 4, 5 and 6, the appearance structure 3 is a logo (i.e. LOGO), and the concave cavity 14 is a logo groove (i.e. LOGO groove). Of course, it is not limited to this, the appearance structure 3 can also be other appearance parts, for example, the appearance structure 3 can also be a decorative sheet, and the concave cavity 14 is a decorative groove; for another example, the appearance structure 3 can also be a metal sheet (for example, a steel sheet), and the concave cavity 14 is a metal sheet accommodating groove.

[0067] In some embodiments, as shown in FIGS. 4 and 5, the concave cavity 14 is arranged at the position of the camera window 6 on the cover body 1. Of course, the concave cavity 14 is not limited to being arranged at the position of the camera window 6, but can also be arranged at other positions on the cover body 1, such as the lower left corner, the lower right corner, the upper right corner, etc. of the cover body 1.

[0068] In some embodiments, as shown in FIG. 6, the cover body 1 includes a base body 11, and a plurality of organic fiber layers 13 embedded in the base body 11 along the thickness direction Z of the base body 11, at least one of the organic fiber layers 13 has a bending area 131, and the bending area 131 is located at the position of the concave cavity 14. The bending area 131 is formed in the process of forming the concave cavity 14 due to the extrusion of the mold on the organic fiber layer 13.

[0069] In the cover body 1, one organic fiber layer 13 can have the bending area 131, or a plurality of organic fiber layers 13 can have the bending area 131. For example, as shown in FIG. 6, the number of the organic fiber layers 13 is three, and along the direction away from the appearance decorative layer 2, the three organic fiber layers 13 are organic fiber layer 13a, organic fiber layer 13b and organic fiber layer 13c respectively, and the organic fiber layer 13a and the organic fiber layer 13b both have the bending area 131.

[0070] In this embodiment, since the at least one organic fiber layer 13 has the bending area 131, when the rear cover 100 around the cavity 14 is subjected to external force, such as assembling the appearance structural member 3, the bending area 131 can well disperse the stress, thereby improving the structural strength and the impact resistance of the rear cover 100 at the cavity 14, and further improving the structural reliability of the rear cover 100.

[0071] In some embodiments, as shown in Fig. 6, the bending area 131 includes a first bending area 131a, which is located between the cavity 14 and the second surface 10b and is bent away from the appearance decorative layer 2. Since the first bending area 131a is located between the cavity 14 and the second surface 10b, when the rear cover 100 around the cavity 14 is subjected to external force, such as assembling the appearance structural member 3, the first bending area 131a can well disperse the stress of the weak area between the cavity 14 and the second surface 10b, thereby improving the structural strength and the impact resistance of the weak area, so that the above-mentioned weak area is not easily penetrated in the process of assembling the appearance structural member 3, and further improving the structural reliability of the rear cover 100.

[0072] In some embodiments, as shown in Fig. 6, the first bending area 131a is provided with a slit 132, which penetrates the first bending area 131a along the thickness direction Z of the base body 11. By providing the slit 132, in the process of extruding the cover body 1 to form the cavity 14 by the mold, the slit 132 can release the stress of the organic fiber layer 13 caused by the extrusion of the mold, thereby reducing the resistance of the organic fiber layer 13 of the first bending area 131a to the extrusion of the mold, so that the formation of the cavity 14 is more smooth.

[0073] In some embodiments, as shown in Fig. 6, the first bending area 131a is provided with a slit 132, which penetrates the first bending area 131a along the thickness direction Z of the base body 11. By providing the slit 132, in the process of extruding the cover body 1 to form the cavity 14 by the mold, the slit 132 can release the stress of the organic fiber layer 13 caused by the extrusion of the mold, thereby reducing the resistance of the organic fiber layer 13 of the first bending area 131a to the extrusion of the mold, so that the formation of the cavity 14 is more smooth.

[0074] In some embodiments, as shown in Fig. 8, which is a partial enlarged view of Fig. 6, the intersection between the cavity bottom wall 141 of the cavity 14 and the cavity side wall 142 of the cavity 14 is provided with a rounded corner 143; the radius of the rounded corner 143 ranges from 0.1 mm to 0.25 mm; wherein the rounded corner 143 is an arc formed at the intersection between the cavity bottom wall 141 of the cavity 14 and the cavity side wall 142 of the cavity 14.

[0075] In this way, the radius of the chamfer 143 can be prevented from being too large or too small. If the radius of the chamfer 143 is too large, the chamfer 143 will squeeze the space in the cavity 14, which will reduce the effective space in the cavity 14 and is not conducive to the optimal arrangement of the structure in the cavity 14. If the radius of the chamfer 143 is too small, stress concentration will occur at the joint of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14, which will cause damage. It has been found through research that when the radius of the chamfer 143 is in the range of 0.1 mm to 0.25 mm, the chamfer 143 can neither excessively occupy the space in the cavity 14 nor cause stress concentration at the joint of the cavity bottom wall 141 and the cavity side wall 142 of the cavity 14.

[0076] The cavity bottom wall 141 of the cavity 14 is specifically an inner wall opposite the cavity opening of the cavity 14, and the cavity side wall 142 of the cavity 14 is specifically an inner wall provided at the edge of the cavity bottom wall 141 and extending toward the cavity opening.

[0077] In some embodiments, as shown in FIG. 9, which is a sectional view of another back cover 100 at the cavity 14 of an electronic device according to the first embodiment, the at least one organic fiber layer 13 has an avoiding opening 133 for the cavity 14 to pass through, and the curved area 131 includes a second curved area 131b located at the edge of the avoiding opening 133.

[0078] In the cover body 1, one organic fiber layer 13 can have an avoiding opening 133, or multiple organic fiber layers 13 can have avoiding openings 133, which can be determined by the depth of the cavity 14. For example, as shown in FIG. 9, the number of organic fiber layers 13 is three, and along the direction away from the appearance decoration layer 2, the three organic fiber layers 13 are organic fiber layer 13a, organic fiber layer 13b, and organic fiber layer 13c, and the organic fiber layer 13a has an avoiding opening 133. The second curved area 131b is located at the edge of the avoiding opening 133 of the organic fiber layer 13a.

[0079] In this embodiment, since the second curved area 131b is located at the edge of the avoiding opening 133, when the back cover 100 around the cavity 14 is subjected to an external force, such as when the appearance structure 3 is assembled, the second curved area 131b can well disperse the stress at the edge of the cavity 14, which is conducive to improving the structural strength and impact resistance of the cover body 1 at the edge of the cavity 14, so that the cover body 1 at the edge of the cavity 14 is not easily damaged.

[0080] In some embodiments, as shown in FIGS. 6 and 9, the base body 11 is a resin base body.

[0081] In some embodiments, as shown in FIGS. 6 and 9, the organic fiber layer 13 is a PI (Polyimide; polyimide) fiber layer. The PI fiber layer has the characteristics of small density, high modulus, etc. By so arranging, the weight of the back cover 100 can be reduced, and the strength and rigidity of the back cover 100 can be improved.

[0082] In some embodiments, as shown in FIGS. 6 and 9, the organic fiber layer 13 is a PBO (Poly-p-phenylene benzobisoxazole; poly-p-phenylene benzobisoxazole) fiber layer. The PBO fiber layer has the characteristics of small density, high modulus, etc. By so arranging, the weight of the back cover 100 can be reduced, and the strength and rigidity of the back cover 100 can be improved.

[0083] In some embodiments, as shown in FIGS. 6 and 9, the organic fiber layer 13 is an aramid fiber layer. The aramid fiber layer has the characteristics of small density, high modulus, etc. By so arranging, the weight of the back cover 100 can be reduced, and the strength and rigidity of the back cover 100 can be improved.

[0084] In some embodiments, as shown in FIGS. 6 and 9, the organic fiber layer 13 is a UHMWPE (ultra-high molecular weight polyethylene; ultra-high molecular weight polyethylene) fiber layer. The UHMWPE fiber layer has the characteristics of small density, high modulus, etc. By so arranging, the weight of the back cover 100 can be reduced.

[0085] The above-mentioned organic fiber layer 13 can be an organic fiber woven layer, such as an organic fiber cloth.

[0086] In some embodiments, as shown in FIGS. 6 and 7, the cavity bottom wall 141 of the cavity 14 is provided with a receiving portion 144, which is a receiving groove for the protruding structure 31 on the appearance structure 3 to extend into. By so arranging, the receiving groove plays a role of positioning the appearance structure 3 by extending the protruding structure 31 on the appearance structure 3 into the receiving groove, thereby facilitating the installation of the appearance structure 3 at the target position.

[0087] In some embodiments, as shown in FIGS. 6 and 7, the receiving groove is a square groove, and the protruding structure 31 is a square column. However, the receiving groove can also be a circular groove, and the protruding structure 31 can also be a circular column.

[0088] In some embodiments, as shown in FIGS. 6 and 7, the cavity bottom wall 141 of the cavity 14 is provided with a convex rib 145 for supporting the appearance structure 3, the convex rib 145 divides the cavity bottom wall 141 into a first region 141a and a second region 141b, the first region 141a is provided with a receiving portion 144, and the second region 141b is provided with an adhesive portion 4 for bonding the appearance structure 3 to the cavity bottom wall 141. In this way, the convex rib 145 plays a blocking role, which can block the uncured adhesive portion 4 from flowing to the position of the receiving portion 144 to block the receiving portion 144; at the same time, the convex rib 145 also plays a supporting role for the appearance structure 3, which raises the height of the appearance structure 3 relative to the cavity bottom wall 141, so that the appearance structure 3 does not need to be designed to be so thick, which is beneficial to reduce the weight of the appearance structure 3, and further beneficial to reduce the weight of the back cover 100.

[0089] The adhesive portion 4 can be a dispensing adhesive, and one or more dispensing adhesives can be provided (as shown in FIG. 7), which is not limited here.

[0090] Of course, the cavity bottom wall 141 of the cavity 14 can also not be provided with the convex rib 145 and the receiving portion 144, and an adhesive layer is provided between the appearance structure 3 and the cavity bottom wall 141 to fix the appearance structure 3 in the cavity 14.

[0091] As shown in FIG. 10, which is a schematic diagram of the manufacturing process of the back cover 100 of the electronic device in the first embodiment of the present application. The manufacturing method of the back cover 100 includes the following steps:

[0092] S1, as shown in (1) of FIG. 10, a cavity 14 is pressed on the cover body 1 by a mold;

[0093] The cover body 1 can be manufactured by the following steps: S11, three organic fiber layers 13 are respectively pre-impregnated with epoxy resin to form three pre-impregnated materials; S12, the three pre-impregnated materials are stacked and pressed to form the cover body 1. For example, the three pre-impregnated materials can be formed into the cover body 1 by hot pressing, mold pressing, vacuum bag, vacuum tank, etc.

[0094] S2, as shown in (2) of FIG. 10, a protection piece 5 is arranged in the cavity 14, so that the support surface 51 of the protection piece 5 is located at the cavity opening of the cavity 14.

[0095] As shown in (2) of FIG. 10, the protection piece 5 can be a sheet structure, for example, the protection piece 5 can be a PET (Polyethylene terephthalate; polyethylene terephthalate) protection sheet; but it is not limited to this, the protection piece 5 can also be provided in other structures according to actual conditions.

[0096] S3, as shown in (3) of FIG. 10, the appearance decoration layer 2 is covered on the first surface 10a of the cover body 1 and the supporting surface 51 of the protection piece 5;

[0097] In some embodiments, the appearance decoration layer 2 can be a decorative paint layer, which is covered on the first surface 10a and the supporting surface 51 by a spraying process. The decorative paint layer can be a piano paint layer, a frosted paint layer, a matte paint layer, a gradient paint layer, a textured paint layer, etc.

[0098] In other embodiments, the appearance decoration layer 2 can be a coating layer, which is covered on the first surface 10a and the supporting surface 51 by a plating process. The coating layer can be a scratch-resistant coating layer, a fingerprint-resistant coating layer, an anti-reflection coating layer, etc.

[0099] S4, as shown in (4) of FIG. 10, the appearance decoration layer 2 covering the recessed cavity 14 is removed, and the protection piece 5 is moved out of the recessed cavity 14. The appearance decoration layer 2 covering the recessed cavity 14 can be removed by laser cutting.

[0100] S5, as shown in (5) of FIG. 10, the appearance structure piece 3 is arranged in the recessed cavity 14.

[0101] FIG. 11 is a structural schematic diagram of the back side of an electronic device (mobile phone) in a second embodiment of the present application, FIG. 12 is a C-C sectional view of the electronic device shown in FIG. 11, and FIG. 13 is a partial enlarged view of the back cover 100 of the electronic device in FIG. 12. The main difference between the back cover 100 shown in FIGS. 11-13 and the back cover 100 shown in FIGS. 4-9 is that the structure of the accommodating part 144 in the recessed cavity 14 and the number of the organic fiber layer 13 in the cover body 1 are different, which will be described in detail as follows:

[0102] As shown in FIGS. 11, 12 and 13, the cavity bottom wall 141 of the recessed cavity 14 is provided with the accommodating part 144, which is an accommodating through hole penetrating through the second surface 10b, and the accommodating through hole is used for the electronic device internal component 600 on the circuit board to extend into. By arranging the accommodating part 144, the accommodating part 144 plays a role of avoiding the electronic device internal component 600 on the circuit board, so that the back cover 100 and the component 600 overlap in the thickness direction Z of the back cover 100, which is conducive to reducing the thickness of the electronic device.

[0103] As shown in FIG. 12, the circuit board can be a connecting circuit board 520 connected with the camera 510, and the component 600 can be an infrared temperature sensor, which is used for measuring the ambient temperature of the electronic device and the temperature of the surrounding objects. The appearance structure piece 3 is made of infrared light transmission material, such as aluminate glass, germanate glass, etc. Of course, the component 600 is not limited to the infrared temperature sensor, but can also be other components, such as a photoelectric sensor.

[0104] In some embodiments, as shown in FIG. 13, the number of organic fiber layers 13 is two, and the two organic fiber layers 13 are organic fiber layer 13a and organic fiber layer 13b respectively in the direction away from the appearance decoration layer 2, and the organic fiber layer 13a has a curved area 131.

[0105] As shown in FIG. 14, FIG. 14 shows a schematic diagram of the manufacturing process of the back cover 100 of the electronic device in the second embodiment of the present application. The manufacturing method of the back cover 100 includes the following steps:

[0106] P1, as shown in (1) of FIG. 14, a concave cavity 14 is pressed on the cover body 1 by a mold;

[0107] Wherein, the cover body 1 can be manufactured by the following steps: P11, two organic fiber layers 13 are respectively pre-impregnated with epoxy resin to form two pre-impregnated materials; P12, the two pre-impregnated materials are stacked and set by applying pressure to form the cover body 1. For example, the two pre-impregnated materials can form the cover body 1 by processes such as hot pressing, mold pressing, vacuum bag, vacuum tank, etc.

[0108] P2, as shown in (2) of FIG. 14, the appearance decoration layer 2 is covered on the first surface 10a of the cover body 1; wherein, the appearance decoration layer 2 covers the concave cavity 14; the appearance decoration layer 2 can be a synthetic leather layer, such as a raw leather layer, so that the back cover 100 can present a leather appearance.

[0109] P3, as shown in (3) of FIG. 14, the appearance decoration layer 2 covering the concave cavity 14 is removed; wherein, the appearance decoration layer 2 covering the concave cavity 14 can be removed by laser cutting.

[0110] P4, as shown in (4) of FIG. 10, a containing part 144 is formed on the cavity bottom wall 141 of the concave cavity 14 by a laser forming process.

[0111] P5, as shown in (5) of FIG. 10, the appearance structure 3 is arranged in the concave cavity 14.

[0112] As shown in (3) of FIG. 10 and (2) of FIG. 14, the present application also provides a structure for manufacturing the back cover 100 of the electronic device, which includes a cover body 1 and an appearance decoration layer 2, the cover body 1 is an organic fiber composite material cover body 1, the cover body 1 has a first surface 10a and a second surface 10b arranged oppositely, the first surface 10a is provided with a concave cavity 14 pressed by a mold; the appearance decoration layer 2 is covered on the first surface 10a, and the appearance decoration layer 2 has a covering area 21 located at the position of the concave cavity 14 and covering the cavity opening of the concave cavity 14.

[0113] In some embodiments, as shown in (3) of FIG. 10, a protection piece 5 is detachably arranged in the cavity 14, and the protection piece 5 has a support surface 51 located at the cavity opening of the cavity 14, and the covering area 21 is arranged on the support surface 51. By arranging the protection piece 5, the protection piece 5 can support the appearance decoration layer 2, so that the appearance decoration layer 2 can cover the cavity 14. At the same time, the protection piece 5 can also protect the structure in the cavity 14, so as to avoid damage to the structure in the cavity 14 caused by subsequent processes.

[0114] In some embodiments, as shown in (3) of FIG. 10, a protection piece 5 is detachably arranged in the cavity 14, and the protection piece 5 has a support surface 51 located at the cavity opening of the cavity 14, and the covering area 21 is arranged on the support surface 51. By arranging the protection piece 5, the protection piece 5 can support the appearance decoration layer 2, so that the appearance decoration layer 2 can cover the cavity 14. At the same time, the protection piece 5 can also protect the structure in the cavity 14, so as to avoid damage to the structure in the cavity 14 caused by subsequent processes.

[0115] In some embodiments, as shown in (3) of FIG. 10, a convex rib 145 is arranged on the cavity bottom wall 141 of the cavity 14, and the convex rib 145 is used to support the protection piece 5. In this way, the convex rib 145 can raise the height of the protection piece 5 relative to the cavity bottom wall 141, so that the protection piece 5 does not need to be designed to be so thick, which is beneficial to reduce the weight of the protection piece 5, and further beneficial to reduce the weight of the structural member.

[0116] As for other structural features of the structural member, specific reference can be made to the description of the same features in the rear cover 100 embodiments described above, and will not be repeated here.

[0117] As shown in (5) of FIG. 10 and (5) of FIG. 14, the present application also provides a rear cover 100 made of the structural member in the above embodiments.

[0118] In some embodiments, as shown in (5) of FIG. 10, the rear cover 100 is formed by removing the covering area 21 of the appearance decoration layer 2 of the structural member in the above embodiments, and moving the protection piece 5 out of the cavity 14. In other embodiments, as shown in (5) of FIG. 14, the rear cover 100 is formed by removing the covering area 21 of the appearance decoration layer 2 of the structural member in the above embodiments.

[0119] As for the specific structure of the rear cover 100, specific reference can be made to the description above, and will not be repeated here.

[0120] The type of section line in the drawings of the present application is to distinguish different components, and should not be understood as a limitation on the material of the components. The drawings of the present application are to show the structure composition, and are not shown in the actual product proportion.

[0121] Although the description of the application will be introduced in combination with some embodiments, it does not mean that the features of the application are limited to the embodiments. On the contrary, the purpose of introducing the embodiments in the application is to cover other options or modifications that can be extended based on the claims of the application. In order to provide a deep understanding of the application, many specific details will be included in the above description. The application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the application, some specific details will be omitted in the description. It should be noted that the embodiments and features in the embodiments in the application can be combined with each other without conflict.

[0122] In the embodiments of the application, the terms "first", "second" are only used for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features.

[0123] In the embodiments of the application, "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can represent three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are a "or" relationship.

[0124] In the description of the embodiments of the application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, for example, "connecting" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium. The orientation language mentioned in the embodiments of the application, such as "up", "down", "left", "right", "inner", "outer" and the like, is only the direction of the drawing, therefore, the orientation language used is to better, more clearly illustrate and understand the embodiments of the application, and is not to indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation of the embodiments of the application. "Multiple" means at least two.

[0125] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A back cover for an electronic device, characterized in that, The back cover comprises: a cover body (1) made of organic fiber composite material, the cover body (1) having a first surface (10a) and a second surface (10b) arranged oppositely, the first surface (10a) being provided with a concave cavity (14) pressed out by a mold; an appearance decoration layer (2) covering the first surface (10a) around the concave cavity (14); and an appearance structure (3) arranged in the concave cavity (14).

2. The back cover according to claim 1, wherein the cover body (1) comprises a base body (11) and a plurality of organic fiber layers (13) embedded in the base body (11) along a thickness direction (Z) of the base body (11), at least one of the organic fiber layers (13) having a curved region (131) located at a position of the concave cavity (14).

3. The back cover according to claim 2, wherein the curved region (131) comprises a first curved region (131a) located between the concave cavity (14) and the second surface (10b) and curved away from the appearance decoration layer (2).

4. The back cover according to claim 3, wherein the first curved region (131a) is provided with a slit (132) penetrating the first curved region (131a) along the thickness direction (Z).

5. The back cover according to any one of claims 2-4, wherein at least one of the organic fiber layers (13) has an avoiding opening (133) for the concave cavity (14) to pass through, and the curved region (131) comprises a second curved region (131b) located at an edge of the avoiding opening (133).

6. The back cover according to any one of claims 2-5, wherein the organic fiber layer (13) is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and an UHMWPE fiber layer; and the base body (11) is a resin base body.

7. The back cover according to any one of claims 1-6, wherein a chamfer (143) is arranged at a joint between a cavity bottom wall (141) of the concave cavity (14) and a cavity side wall (142) of the concave cavity (14); and a radius of the chamfer (143) ranges from 0.1 mm to 0.25 mm.

8. The back cover according to any one of claims 1-7, wherein a receiving portion (144) is arranged on the cavity bottom wall (141) of the concave cavity (14); the receiving portion (144) is a receiving through hole penetrating the second surface (10b) and used for a component (600) on a circuit board inside the electronic device to extend into; or the receiving portion (144) is a receiving groove used for a protruding structure (31) on the appearance structure (3) to extend into.

9. The back cover according to claim 8, wherein The cavity bottom wall (141) is provided with a convex rib (145) for supporting the appearance structure (3), the convex rib (145) divides the cavity bottom wall (141) into a first area (141a) and a second area (141b), the first area (141a) is provided with the accommodating part (144), and the second area (141b) is provided with an adhesive part (4) for bonding the appearance structure (3) and the cavity bottom wall (141).

10. A structural member for making a back cover of an electronic device, characterized by, Comprise: A cover body (1) made of organic fiber composite material, the cover body (1) has a first surface (10a) and a second surface (10b) arranged oppositely, the first surface (10a) is provided with a concave cavity (14) pressed out by a mold; An appearance decoration layer (2) covering the first surface (10a), the appearance decoration layer (2) has a covering area (21) located at the position of the concave cavity (14) and covering the cavity opening of the concave cavity (14).

11. The structure of claim 10, wherein The cover body (1) comprises a base body (11) and a plurality of organic fiber layers (13) embedded in the base body (11) along the thickness direction (Z) of the base body (11), at least one of the organic fiber layers (13) has a curved area (131) located at the position of the concave cavity (14).

12. The structure of claim 11, wherein The curved area (131) comprises a first curved area (131a) located between the concave cavity (14) and the second surface (10b) and curved away from the appearance decoration layer (2).

13. The structure of claim 12, wherein The first curved area (131a) is provided with a slit (132) penetrating through the first curved area (131a) along the thickness direction (Z).

14. The structure of any one of claims 11-13, wherein At least one of the organic fiber layers (13) has an avoiding opening (133) for the concave cavity (14) to pass through, and the curved area (131) comprises a second curved area (131b) located at the edge of the avoiding opening (133).

15. The structure of any one of claims 11-14, wherein The organic fiber layer (13) is one of a PI fiber layer, a PBO fiber layer, an aramid fiber layer, and an UHMWPE fiber layer; and the base body (11) is a resin base body (11).

16. The structure of any one of claims 10-15, wherein A fillet (143) is arranged at the joint of the cavity bottom wall (141) and the cavity side wall (142) of the cavity (14); the radius of the fillet (143) ranges from 0.1mm to 0.25mm.

17. The structural member according to any one of claims 10-16, characterized in that, A protective member (5) is detachably arranged in the cavity (14), the protective member (5) has a supporting surface (51), the supporting surface (51) is located at the cavity opening of the cavity (14), and the covering area (21) is arranged on the supporting surface (51).

18. The structural member according to claim 17, characterized in that, A convex rib (145) is arranged on the cavity bottom wall (141) of the cavity (14), and the convex rib (145) is used for supporting the protective member (5).

19. A back cover for an electronic device, the back cover comprising: The structural member is formed by any one of claims 10-18.

20. An electronic device, comprising: A display screen (200), a middle frame (300), and the back cover (100) according to any one of claims 1-9 and 19 are included, the display screen (200) is arranged on one side of the middle frame (300), and the back cover (100) is arranged on the other side of the middle frame (300).

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