Curable composition and electronic component device

Abstract

[Problem] To provide a curable composition containing a biomass-derived material. [Solution] A curable composition containing a curable component derived from biomass.

Description

Curable composition and electronic component device

[0001] The present disclosure relates to curable compositions and electronic component devices.

[0002] In the field of element encapsulation of electronic component devices such as transistors, integrated circuits (ICs), and large-scale integrations (LSIs), resin encapsulation has traditionally been mainstream from the standpoints of productivity, cost, etc., and curable compositions containing epoxy resins have been widely used. The reason curable compositions containing epoxy resins are used is because epoxy resins have an excellent balance of various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to insert products.

[0003] Underfill materials are widely used as encapsulants in bare-chip mounted electronic component devices such as COB (Chip on Board), COG (Chip on Glass), and TCP (Tape Carrier Package). Furthermore, in electronic component devices (flip chips) in which electronic components such as semiconductor elements are directly bump-connected to a wiring substrate made of ceramic, glass epoxy resin, glass imide resin, polyimide film, or the like, epoxy resin compositions are used as underfill materials to fill gaps between the bump-connected electronic components and the wiring substrate. Underfill materials play an important role in protecting electronic components from temperature, humidity, and external mechanical forces.

[0004] In order to provide an encapsulating epoxy resin composition having excellent moisture-resistant adhesive strength and low stress, and an electronic component device having elements encapsulated therewith and having high reliability (moisture resistance and thermal shock resistance), an encapsulating epoxy resin composition containing (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler, as well as an electronic component device having elements encapsulated with this encapsulating epoxy resin composition have been disclosed (see, for example, Patent Document 1).

[0005] Japanese Patent Application Laid-Open No. 2001-270976

[0006] Regarding the use of fossil resources, there are issues such as resource depletion and the carbon dioxide (CO ) generated during incineration.２ ) is a concern for global warming. Therefore, we must reduce the use of fossil resources and CO2 derived from fossil resources. ２ From the perspective of reducing emissions, there is a growing movement to replace fossil fuel resources with carbon-neutral biomass-derived materials (bioplastics).

[0007] An object of the present disclosure is to provide a curable composition containing a biomass-derived material and an electronic component device containing the cured product.

[0008] Specific means for achieving the above object are as follows. <1> A curable composition containing a biomass-derived curable component. <2> The curable composition according to <1>, wherein the curable component contains a biomass-derived epoxy resin. <3> The curable composition according to <2>, wherein the biomass-derived epoxy resin contains a biphenyl-type epoxy resin. <4> The curable composition according to <2> or <3>, wherein the biomass-derived epoxy resin has a biomass content of 15% or more. <5> The curable composition according to any one of <1> to <4>, further containing an inorganic filler. <6> The curable composition according to <5>, wherein the content of the inorganic filler is 60% by volume to 90% by volume based on the total amount of the curable composition. <7> The curable composition according to any one of <1> to <6>, which is used for sealing an electronic component. <8> An electronic component device comprising a support member, an electronic component placed on the support member, and a cured product of the curable composition according to <7> that seals the electronic component.

[0009] According to the present disclosure, it is possible to provide a curable composition containing a biomass-derived material and an electronic component device containing the cured product thereof.

[0010] 1A is a schematic plan view showing the electrode structure on one surface of a test piece used in measuring the volume resistivity according to this example, and FIG. 1B is a schematic plan view showing the electrode structure on the other surface of the test piece used in measuring the volume resistivity according to this example.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0012] In the present disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, particles corresponding to each component may include multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0013] <Curable Composition> The curable composition of the present disclosure contains a biomass-derived curable component. The curable composition of the present disclosure contains a biomass-derived material, and can contribute to carbon neutrality.

[0014] (Biomass-derived curable component) The curable composition of the present disclosure contains a biomass-derived curable component. Examples of the biomass-derived curable component include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, vinyl resins, polyimide resins such as maleimide resins, polyamide resins, polyamideimide resins, silicone resins, and (meth)acrylic resins. The curable composition may contain only one type of biomass-derived curable component, or may contain two or more types.

[0015] The biomass-derived curable component may include a biomass-derived epoxy resin.

[0016] Examples of biomass-derived epoxy resins include epoxy resins obtained by epoxidizing biomass-derived alcohols, biomass-derived phenols, biomass-derived carboxylic acids, etc. Examples of biomass-derived alcohols include glucose, sorbitol, glycerin, polyglycerin, propanediol, butanediol, isosorbide, etc. Examples of biomass-derived phenols include tannic acid, quercetin, cardanol, lignin-derived substances, etc. Examples of biomass-derived carboxylic acids include carboxylic acids obtained by oxidizing the above biomass-derived alcohols, etc. Biomass-derived epoxy resins can be obtained by epoxidizing the above alcohols, etc. Methods for epoxidizing the above alcohols, etc. are not particularly limited, and conventionally known methods can be used.

[0017] Specific examples of biomass-derived epoxy resins include Denacol from Nagase ChemteX Corporation. Further examples include various materials that are scheduled to be marketed by Sakata Inx Corporation, Mitsubishi Chemical Corporation, Mitsui Chemicals, Inc., and the like.

[0018] The biomass-derived epoxy resin preferably contains a biphenyl-type epoxy resin.

[0019] The biomass degree of the biomass-derived curable component, preferably the biomass degree of the biomass-derived epoxy resin, is preferably 15% or more, more preferably 20% or more, and even more preferably 25% or more. The upper limit of the biomass degree of the biomass-derived curable component is not particularly limited, and may be 80% or less, 60% or less, or 50% or less.

[0020] In this disclosure, the biomass content (%) refers to a value measured by ASTM (American Standard Test Method) D6866-21, Method B. Specifically, it is as follows: The sample to be measured is chemically converted into carbon dioxide, and the generated carbon dioxide is further reduced to graphite. This graphite is ionized, １２ C. １３ C and １４ The rate of C is measured by an accelerator. １４ From the measurement results obtained, the ratio of C is measured. １４ C / １２ C) × 100, and this value is taken as the biomass degree (%). １４ C means plant-derived carbon; １２ C means carbon not derived from plants (e.g., petroleum-derived carbon).

[0021] The curable composition of the present disclosure may contain a non-biomass-derived curable component (also referred to as "other curable component") in addition to a biomass-derived curable component. The biomass content of the other curable component may be 5% or less, 1% or less, or even 0%.

[0022] In the curable composition of the present disclosure, the ratio of the biomass-derived curable component to the total amount of the curable components may be 20% by mass to 100% by mass, 30% by mass to 90% by mass, or 50% by mass to 80% by mass.

[0023] In the curable composition of the present disclosure, the ratio of the biomass-derived epoxy resin to the total amount of epoxy resins may be 20% by mass to 100% by mass, 30% by mass to 90% by mass, or 50% by mass to 80% by mass. When the ratio of the biomass-derived epoxy resin to the total amount of epoxy resins is 20% by mass or more, the curable composition tends to have excellent temperature cycle resistance and moisture absorption properties.

[0024] Examples of the other curable component include epoxy resins, phenolic resins, melamine resins, urea resins, unsaturated polyester resins, alkyd resins, urethane resins, vinyl resins, polyimide resins such as maleimide resins, polyamide resins, polyamideimide resins, silicone resins, (meth)acrylic resins, etc. The curable composition may contain only one type of other curable component, or may contain two or more types.

[0025] The other curable component may contain an epoxy resin other than the biomass-derived epoxy resin (also referred to as other epoxy resin). Examples of other epoxy resins include so-called fossil resource-derived epoxy resins. Specific examples of such epoxy resins include novolac epoxy resins obtained by epoxidizing a novolac resin obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst; triphenylmethane epoxy resins obtained by epoxidizing a triphenylmethane phenolic resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde and salicylaldehyde under an acidic catalyst; and copolymers obtained by epoxidizing a novolac resin obtained by co-condensing the above phenolic compound and naphthol compound with an aldehyde compound under an acidic catalyst. diphenylmethane-type epoxy resins which are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins which are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins which are diglycidyl ethers of stilbene-based phenolic compounds; sulfur-containing epoxy resins which are diglycidyl ethers of bisphenol S, etc.; epoxy resins which are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins which are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which active hydrogen atoms bonded to nitrogen atoms of aniline, diaminodiphenylmethane, isocyanuric acid, etc. are substituted with glycidyl groups; and dicyclopentadiene-type epoxy resins obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenolic compound.Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are produced by epoxidizing an intramolecular olefin bond; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenolic resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenolic resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenolic resins; and dicyclopentadiene-modified phenolic resins, which are glycidyl ethers of dicyclopentadiene-modified phenolic resins. Examples of suitable epoxy resins include pentadiene-modified epoxy resins, cyclopentadiene-modified epoxy resins which are glycidyl ethers of cyclopentadiene-modified phenolic resins, polycyclic aromatic ring-modified epoxy resins which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins, naphthalene-type epoxy resins which are glycidyl ethers of naphthalene ring-containing phenolic resins, halogenated phenol novolac-type epoxy resins, hydroquinone-type epoxy resins, trimethylolpropane-type epoxy resins, linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid, and aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Epoxidized acrylic resins are also suitable as epoxy resins. These other epoxy resins may be used alone or in combination of two or more.

[0026] The curable composition of the present disclosure may contain a biomass-derived epoxy resin and other epoxy resins, or may contain a biomass-derived biphenyl-type epoxy resin and a biphenyl-type epoxy resin other than the biomass-derived epoxy resin (also referred to as other biphenyl epoxy resins).

[0027] When the curable composition of the present disclosure contains a biomass-derived biphenyl-type epoxy resin, the content of the biomass-derived biphenyl-type epoxy resin may be 30% by mass to 100% by mass, 50% by mass to 90% by mass, or 60% by mass to 80% by mass relative to the total amount of biphenyl-type epoxy resins (total of biomass-derived biphenyl-type epoxy resins and other biphenyl epoxy resins).

[0028] The epoxy equivalent (molecular weight / number of epoxy groups) of the biomass-derived epoxy resin or the epoxy equivalent of other epoxy resins is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq. When two or more epoxy resins are used in combination, the epoxy equivalent of the mixture of two or more epoxy resins is preferably within the above range. In the present disclosure, the epoxy equivalent of the epoxy resin is a value measured by a method in accordance with JIS K 7236:2009.

[0029] (Curing Agent) When the curable composition of the present disclosure contains a biomass-derived epoxy resin, the curable composition may contain a curing agent. Examples of the curing agent include an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, and an active ester compound.

[0030] The curing agent may be a biomass-derived curing agent or a non-biomass-derived curing agent.

[0031] The biomass degree of the biomass-derived curing agent is preferably 15% or more, more preferably 20% or more, and even more preferably 25% or more. The upper limit of the biomass degree of the biomass-derived curing agent is not particularly limited, and may be 80% or less, 60% or less, or 50% or less.

[0032] Examples of the curing agent include an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, an active ester compound, etc. The curing agent may be used alone or in combination of two or more kinds.

[0033] When two or more curing agents are used in combination, all of the curing agents may be biomass-derived curing agents, or a biomass-derived curing agent may be used in combination with a non-biomass-derived curing agent.

[0034] Examples of hardeners other than those derived from biomass include hardeners derived from so-called fossil resources.

[0035] The biomass content of the non-biomass-derived curing agent may be 5% or less, 1% or less, or 0%.

[0036] Specific examples of the amine curing agent include aromatic amine curing agents having one aromatic ring, such as m-phenylenediamine, 2,3-diaminotoluene, 2,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl-2,6-diaminotoluene, and 2,4-diaminoanisole; 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-methylenebis(2-ethylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 3,4'-diaminodiphenylmethane; aromatic amine curing agents having two aromatic rings, such as 3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane and 3,3',5,5'-tetraethyl-4,4'-diaminodiphenylmethane; hydrolysis condensates of aromatic amine curing agents; aromatic amine curing agents having a polyether structure, such as polytetramethylene oxide di-p-aminobenzoate and polytetramethylene oxide di-para-aminobenzoate; condensates of aromatic diamines and epichlorohydrin; and reaction products of aromatic diamines and styrene.

[0037] Examples of acid anhydride curing agents include phthalic anhydride, maleic anhydride, methyl himic anhydride, himic anhydride, succinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, chlorendic anhydride, methyltetrahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride maleic acid adduct, benzophenonetetracarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride having multiple alkyl groups obtained by Diels-Alder reaction from maleic anhydride and a diene compound, and various cyclic acid anhydrides such as dodecenyl succinic anhydride.

[0038] Examples of phenolic curing agents include novolak resins obtained by condensing or co-condensing at least one selected from the group consisting of phenolic compounds (e.g., phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F) and naphthol compounds (e.g., α-naphthol, β-naphthol, and dihydroxynaphthalene) with an aldehyde compound (e.g., formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde) under an acidic catalyst; phenol-aralkyl resins; biphenyl-aralkyl resins; and naphthol-aralkyl resins. Further examples of phenolic curing agents include the biomass-derived phenols described above.

[0039] The type of active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with epoxy groups. Examples of active ester compounds include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esterified products of heterocyclic hydroxy compounds. Examples of active ester compounds include ester compounds obtained from at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid and at least one of an aliphatic hydroxy compound and an aromatic hydroxy compound. Ester compounds containing an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds containing an aromatic compound as a polycondensation component tend to have excellent heat resistance due to the presence of an aromatic ring. Specific examples of active ester compounds include aromatic esters obtained by the condensation reaction of an aromatic carboxylic acid with a phenolic hydroxyl group. Among these, aromatic esters are preferred which are obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group, using as raw materials a mixture of an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms on the aromatic ring of benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, diphenylsulfonic acid, etc. have been substituted with carboxy groups, a monohydric phenol in which one hydrogen atom on the aromatic ring has been substituted with a hydroxyl group, and a polyhydric phenol in which 2 to 4 hydrogen atoms on the aromatic ring have been substituted with hydroxyl groups. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.

[0040] In the curable composition of the present disclosure, the content of the curing agent is not particularly limited, and the ratio of the equivalent number of the functional group of the curing agent (for example, an amino group in the case of an amine-based curing agent, a phenolic hydroxyl group in the case of a phenol-based curing agent, an acid anhydride group in the case of an acid anhydride-based curing agent, or an ester group in the case of an active ester compound) to the equivalent number of the epoxy resin (equivalent number of curing agent / equivalent number of epoxy resin) is preferably set in the range of 0.6 to 1.4, more preferably in the range of 0.7 to 1.3, and even more preferably in the range of 0.8 to 1.2.

[0041] The curable composition of the present disclosure may further contain an inorganic filler. The type of inorganic filler is not particularly limited. Specific examples include inorganic materials such as silica (e.g., fused silica, crystalline silica), glass, alumina, aluminum nitride, boron nitride, talc, clay, mica, titanium oxide, calcium titanate, strontium titanate, and barium titanate. An inorganic filler having a flame-retardant effect may also be used. Examples of inorganic fillers having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides (e.g., magnesium-zinc composite hydroxide), and zinc borate.

[0042] Among inorganic fillers, silica such as fused silica is preferred from the viewpoint of reducing the linear expansion coefficient, and alumina is preferred from the viewpoint of high thermal conductivity. Boron nitride is preferred from the viewpoint of reducing the dielectric loss tangent. One type of inorganic filler may be used alone, or two or more types may be used in combination. The inorganic filler may be in the form of powder, beads obtained by spheroidizing powder, fiber, etc.

[0043] The average particle diameter of the inorganic filler is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 50 μm, and more preferably 0.5 μm to 30 μm. When the volume average particle diameter is 0.2 μm or more, an increase in viscosity of the curable composition tends to be further suppressed. When the volume average particle diameter is 50 μm or less, the ability to fill narrow gaps tends to be further improved. The volume average particle diameter of the inorganic filler refers to the value measured as the volume average particle diameter (D50) using a laser diffraction scattering particle size distribution measuring device.

[0044] The volume average particle diameter of the inorganic filler in the curable composition or its cured product can be measured by a known method. For example, the inorganic filler is extracted from the curable composition or cured product using an organic solvent, nitric acid, aqua regia, or the like, and then thoroughly dispersed using an ultrasonic disperser or the like to prepare a dispersion. Using this dispersion, the volume average particle diameter of the inorganic filler can be measured from the volume-based particle size distribution measured using a laser diffraction / scattering particle size distribution analyzer. Alternatively, the cured product can be embedded in a transparent epoxy resin or the like, polished, and the resulting cross-section observed using a scanning electron microscope to obtain the volume average particle size distribution. Furthermore, the volume average particle diameter of the inorganic filler can also be measured by continuously observing two-dimensional cross-sections of the cured product using an FIB device (focused ion beam SEM) or the like, followed by three-dimensional structural analysis.

[0045] From the viewpoint of the flowability of the curable composition, the particle shape of the inorganic filler is preferably spherical rather than angular, and the particle size distribution of the inorganic filler is preferably wide.

[0046] The content of the inorganic filler is not particularly limited and may be appropriately set depending on the application of the curable composition. For example, the content of the inorganic filler may be 60% by volume to 90% by volume, or 70% by volume to 85% by volume, based on the total amount of the curable composition.

[0047] (Mold Release Agent) The curable composition of the present disclosure may contain a mold release agent from the viewpoint of obtaining good mold releasability during molding. The mold release agent is not particularly limited, and conventionally known ones can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of mold release agent may be used alone, or two or more types may be used in combination. The mold release agent may be a biomass-derived release agent or a fossil resource-derived release agent.

[0048] When the curable composition of the present disclosure contains a release agent, the content of the release agent is preferably 1 part by mass to 30 parts by mass, more preferably 5 parts by mass to 25 parts by mass, and even more preferably 7 parts by mass to 20 parts by mass, per 100 parts by mass of the curable component. When the amount of the release agent is 1 part by mass or more per 100 parts by mass of the curable component, sufficient release properties tend to be obtained. When the amount is 30 parts by mass or less, better adhesion tends to be obtained. The content of the release agent is preferably 0.01 parts by mass to 10 parts by mass, more preferably 0.1 parts by mass to 5 parts by mass, per 100 parts by mass of the epoxy resin and the curing agent combined. When the amount of the release agent is 0.01 parts by mass or more per 100 parts by mass of the epoxy resin and the curing agent combined, sufficient release properties tend to be obtained. When the amount is 10 parts by mass or less, better adhesion tends to be obtained.

[0049] (Curing Accelerator) The curable composition of the present disclosure may contain a curing accelerator as needed. The type of curing accelerator is not particularly limited and can be selected depending on the type of curable component, the desired properties of the curable composition, etc. The curing accelerator may be a biomass-derived curing accelerator or a fossil resource-derived curing accelerator.

[0050] Examples of the curing accelerator include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and the addition of maleic anhydride to these compounds, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone. compounds having intramolecular polarization obtained by adding a compound having a π bond, such as a quinone compound or diazophenylmethane; cyclic amidinium compounds such as the tetraphenylborate salt of DBU, the tetraphenylborate salt of DBN, the tetraphenylborate salt of 2-ethyl-4-methylimidazole, and the tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the above tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines such as ethylphosphine and phenylphosphine, secondary phosphines such as dimethylphosphine and diphenylphosphine, and tertiary phosphines such as triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkyl alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, and tris(benzyl)phosphine; phosphine compounds such as complexes of the organic phosphines with organic borons; and the organic phosphines or the phosphine compounds, which may be combined with maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone. quinone compounds such as 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and anthraquinone, and compounds having intramolecular polarization obtained by adding a compound having a π bond such as diazophenylmethane; a compound having intramolecular polarization, which is obtained by reacting a halogenated phenol compound such as 1-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, or 4-bromo-4'-hydroxybiphenyl with the halogenated phenol compound, followed by a dehydrohalogenation step;Examples of the curing accelerator include tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylborate, and salts of tetra-substituted phosphonium with phenolic compounds; salts of tetraalkylphosphonium with partial hydrolysates of aromatic carboxylic acid anhydrides; phosphobetaine compounds; and adducts of phosphonium compounds with silane compounds. One type of curing accelerator may be used alone, or two or more types may be used in combination.

[0051] Among these, the curing accelerator is preferably a curing accelerator containing an organic phosphine. Examples of the curing accelerator containing an organic phosphine include the above-mentioned organic phosphines, phosphine compounds such as complexes of the above-mentioned organic phosphines and organoborons, and compounds having intramolecular polarization formed by adding a compound having a π bond to the above-mentioned organic phosphines or the above-mentioned phosphine compounds. Among these, particularly suitable curing accelerators include triphenylphosphine, an adduct of triphenylphosphine and a quinone compound, an adduct of tributylphosphine and a quinone compound, and an adduct of tri-p-tolylphosphine and a quinone compound.

[0052] When the curable composition contains a curing accelerator, the amount thereof is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent). When the amount of the curing accelerator is 0.1 parts by mass or more per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent), the composition tends to cure well in a short time. When the amount of the curing accelerator is 30 parts by mass or less per 100 parts by mass of the curable component (or the total of the epoxy resin and curing agent), the curing speed is not too fast, and a good molded product tends to be obtained.

[0053] (Stress Relaxant) The curable composition of the present disclosure may contain a stress relaxation agent. By including a stress relaxation agent, warpage of the package and the occurrence of package cracks can be further reduced. Examples of stress relaxation agents include commonly used known stress relaxation agents (flexibilizers). Specific examples include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based elastomers; indene-styrene-coumarone copolymers; triphenylphosphine oxide; and organic phosphorus compounds such as phosphate esters; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. The stress relaxation agent may be derived from biomass or fossil resources. One type of stress relaxation agent may be used alone, or two or more types may be used in combination. Examples of silicone-based stress relaxation agents include those having an epoxy group, those having an amino group, and those modified with polyether, and silicone compounds such as silicone compounds having an epoxy group and polyether-based silicone compounds are more preferred.

[0054] From the viewpoint of the dielectric loss tangent, the stress relaxation agent preferably contains at least one of an indene-styrene-coumarone copolymer and triphenylphosphine oxide.

[0055] When the curable composition contains a stress relaxation agent, the amount thereof is, for example, preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent). When the stress relaxation agent contains at least one of an indene-styrene-coumarone copolymer and triphenylphosphine oxide, the amount thereof is, for example, preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0056] From the viewpoint of dielectric loss tangent, the content of the silicone-based stress relaxation agent is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less, particularly preferably 5% by mass or less, and extremely preferably 0.5% by mass or less, relative to the entire curable composition. The lower limit of the content of the silicone-based stress relaxation agent is not particularly limited, and may be 0% by mass or 0.1% by mass.

[0057] [Various Additives] In addition to the components described above, the curable composition of the present disclosure may contain various additives such as a coupling agent, an ion trapping agent, a flame retardant, a colorant, and an ultraviolet absorber, as exemplified below. The curable composition of the present disclosure may contain various additives known in the technical field as needed, in addition to the additives exemplified below.

[0058] (Coupling Agent) The curable composition of the present disclosure may contain a coupling agent. From the viewpoint of improving the adhesion between the curable component (or the epoxy resin and the curing agent) and the inorganic filler, the curable composition preferably contains a coupling agent. Examples of the coupling agent include known coupling agents such as silane-based compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, and disilazane, titanium-based compounds, aluminum chelate-based compounds, and aluminum / zirconium-based compounds.

[0059] When the curable composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of the inorganic filler. When the amount of the coupling agent is 0.05 parts by mass or more per 100 parts by mass of the inorganic filler, adhesiveness tends to be further improved. When the amount of the coupling agent is 5 parts by mass or less per 100 parts by mass of the inorganic filler, moldability of the package tends to be further improved.

[0060] (Ion trapping agent) The curable composition of the present disclosure may contain an ion trapping agent. When the curable composition is used to seal electronic components, it is preferable that the curable composition contain an ion trapping agent from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of an electronic component device including the sealed electronic components. The ion trapping agent is not particularly limited, and conventionally known ion trapping agents can be used. Specific examples include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion trapping agents may be used alone or in combination of two or more. Among these, hydrotalcites represented by the following general formula (A) are preferred.

[0061] Mg （１－Ｘ） Al Ｘ (OH) ２ (CO ３ ) Ｘ／２ ・mH ２ O ……(A) (0<X≦0.5, m is a positive number)

[0062] When the curable composition contains an ion trapping agent, the content thereof is not particularly limited as long as it is an amount sufficient to trap ions such as halogen ions. For example, the content of the ion trapping agent is preferably 0.1 to 30 parts by mass, and more preferably 0.3 to 1 part by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0063] (Flame Retardant) The curable composition of the present disclosure may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Specific examples include organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, and metal hydroxides. The flame retardants may be used alone or in combination of two or more.

[0064] When the curable composition contains a flame retardant, the amount thereof is not particularly limited as long as it is an amount sufficient to obtain the desired flame retardant effect. For example, the amount of the flame retardant is preferably 1 to 30 parts by mass, and more preferably 2 to 20 parts by mass, per 100 parts by mass of the curable component (or the total of the epoxy resin and the curing agent).

[0065] (Colorant) The curable composition of the present disclosure may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose, etc. One type of colorant may be used alone, or two or more types may be used in combination.

[0066] (Organic Solvent) The curable composition of the present disclosure may contain an organic solvent from the viewpoint of reducing viscosity. In particular, when using an epoxy resin and curing agent that are solid at 25°C, it is preferable to blend an organic solvent in order to obtain a curable composition that is liquid at 25°C. The organic solvent is not particularly limited, and examples thereof include alcohol-based solvents such as methyl alcohol, ethyl alcohol, propyl alcohol, and butyl alcohol; ketone-based solvents such as acetone and methyl ethyl ketone; glycol ether-based solvents such as ethylene glycol ethyl ether, ethylene glycol methyl ether, ethylene glycol butyl ether, propylene glycol methyl ether, dipropylene glycol methyl ether, propylene glycol ethyl ether, and propylene glycol methyl ether acetate; lactone-based solvents such as γ-butyrolactone, δ-valerolactone, and ε-caprolactone; amide-based solvents such as dimethylacetamide and dimethylformamide; and aromatic solvents such as toluene and xylene. One type may be used alone, or two or more types may be used in combination. The organic solvent may be a biomass-derived organic solvent or a fossil resource-derived organic solvent. Among these, organic solvents having a boiling point of 170° C. or higher are preferred from the viewpoint of avoiding the formation of bubbles due to sudden evaporation when the curable composition, which is liquid at 25° C., is cured.

[0067] The content of volatile components including organic solvents and the like is not particularly limited as long as it is to an extent that bubbles are not formed when the liquid curable composition is cured, and is preferably 5% by mass or less, more preferably 1% by mass or less, and even more preferably 0.1% by mass or less, based on the total mass of the liquid curable composition. In the present disclosure, the volatile content of the curable composition is calculated by heating the curable composition at 180°C for 30 minutes and based on the weight difference before and after heating.

[0068] (Method for Preparing Curable Composition) The method for preparing the curable composition is not particularly limited. When the curable composition is solid at 25°C, a common method includes thoroughly mixing predetermined amounts of components using a mixer or the like, melt-kneading the mixture using a mixing roll, extruder, or the like, cooling, and pulverizing. More specifically, a method includes stirring and mixing predetermined amounts of the components, kneading the mixture using a kneader, roll, extruder, or the like that has been preheated to 70°C to 140°C, cooling, and pulverizing. When the curable composition is liquid at 25°C, the composition can be obtained, for example, by stirring, melting, mixing, dispersing, or the like predetermined amounts of the components, either collectively or separately, while optionally applying a heat treatment. The apparatus for mixing, stirring, dispersing, or the like of the components is not particularly limited, and examples thereof include a mortar and pestle mill equipped with a stirrer, a heating device, or the like, a three-roll mill, a ball mill, a planetary mixer, a bead mill, and the like.

[0069] (Use of Curable Composition) The use of the curable composition is not particularly limited. For example, the curable composition may be used for sealing electronic components, for producing adhesive films such as dicing films and die bonding films, or for producing laminates such as copper-clad laminates.

[0070] <Electronic Component Device> When the curable composition of the present disclosure is used to seal an electronic component, the electronic component device of the present disclosure includes a support member, an electronic component placed on the support member, and a cured product of the curable composition sealing the electronic component. Examples of the electronic component device include a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, on which electronic components (active elements such as semiconductor chips, transistors, diodes, and thyristors, passive elements such as capacitors, resistors, and coils, antennas, etc.) are mounted, and the resulting electronic component region is sealed with the curable composition (e.g., a high-frequency device).

[0071] In the electronic component device of the present disclosure, if necessary, another electronic component may be disposed on the surface of the support member opposite to the surface on which the electronic component is disposed. The other electronic component may be sealed with the curable composition, another resin composition, or may not be sealed.

[0072] (Method for manufacturing an electronic component device) The method for manufacturing an electronic component device of the present disclosure includes a step of placing an electronic component on a support member and a step of encapsulating the electronic component with the curable composition described above. The method for carrying out each of the above steps is not particularly limited, and can be carried out by a general method. Furthermore, the types of support member and electronic component used in manufacturing the electronic component device are not particularly limited, and support members and electronic components commonly used in manufacturing electronic component devices can be used.

[0073] Methods for encapsulating electronic components using a curable composition that is solid at 25°C include low-pressure transfer molding, injection molding, and compression molding. Among these, low-pressure transfer molding is common. When using a curable composition that is liquid at 25°C, a post-insertion method may be used in which, after connecting the electronic component and a support member, the curable composition penetrates into the gap between the electronic component and the support member by utilizing capillary action. Alternatively, a pre-application method may be used in which the curable composition is first applied to the support member, and then, when connecting the electronic component to the support member by thermocompression bonding, the connection of the electronic component and the support member and the curing reaction of the curable composition are simultaneously carried out.

[0074] The present disclosure will be specifically described below using examples, but the scope of the present disclosure is not limited to these examples.

[0075] The components shown below were mixed in the blending ratios (parts by mass) shown in Table 1 to prepare curable compositions of Examples and Comparative Examples.

[0076] Epoxy resin 1: biphenyl aralkyl type epoxy resin, epoxy equivalent 274 g / eq, biomass degree 0% Epoxy resin 2: biphenyl type epoxy resin, epoxy equivalent 192 g / eq, biomass degree 0% Epoxy resin 3: biphenyl type epoxy resin, epoxy equivalent 192 g / eq, biomass degree 27%

[0077] Curing agent 1: phenol aralkyl type phenol resin, hydroxyl group equivalent 156 g / eq. Curing agent 2: melamine modified phenol resin, reactive group equivalent 120 g / eq. Curing agent 3: polyaralkyl phenol resin, reactive group equivalent 175 g / eq.

[0078] Curing accelerator: triphenylphosphine / 1,4-benzoquinone adduct; Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane; Coupling agent 2: 3-glycidoxypropyltrimethoxysilane; Coupling agent 3: tetrasulfideditriethoxysilane; Wax: Montan acid ester wax; Colorant: carbon black; Ion trapping agent: compound represented by the above general formula (A); Stress relaxation agent 1: indene-styrene-coumarone copolymer; Stress relaxation agent 2: triarylphosphine oxide; UV absorber: triazine-based UV absorber

[0079] Inorganic filler 1: silica particles, volume average particle size: 19.9 μm Inorganic filler 2: silica particles, volume average particle size: 12 nm

[0080] The volume-average particle size of each inorganic filler was a value obtained by the following measurement. Specifically, the inorganic filler was first added to a dispersion medium (water) in an amount ranging from 0.01% by mass to 0.1% by mass, and the mixture was dispersed in a bath-type ultrasonic cleaner for 5 minutes. Five milliliters of the resulting dispersion was poured into a cell, and the particle size distribution was measured at 25°C using a laser diffraction / scattering particle size distribution analyzer (HORIBA, Ltd., LA920). The particle size at an integrated value of 50% (volume basis) in the resulting particle size distribution was taken as the volume-average particle size.

[0081] The biomass ratios shown in Table 1 are relative to the total amount of the curable composition.

[0082]

[0083] The curable compositions prepared in the examples and comparative examples were used to measure the following physical properties, and the results are shown in Tables 2 to 4.

[0084] (Melt Viscosity) The curable composition was heated to melt it, and the melt viscosity (ηFT, unit: Poise) at 175° C. was measured using a Koka type flow tester with a test force of 10 kgf.

[0085] (Gel Time) The gel time of the curable composition was measured using a Curastometer manufactured by JSR Trading Co., Ltd. Measurement was performed at 180°C using 3 g of the curable composition using a Curastometer manufactured by JSR Trading Co., Ltd., and the time until the torque curve rose was taken as the gel time (seconds).

[0086] (Water Absorption) Using the curable composition, a φ50 × 3 mm disk-shaped test piece was prepared by molding using a transfer molding machine under the following conditions: mold temperature 175°C, molding pressure 6.9 MPa, and curing time 150 seconds. Post-curing was performed at 175°C for 5 hours. The water absorption (%) of the test piece was then determined after 20 hours of treatment under pressure cooker test conditions (2 atmospheres (0.2 MPa) / 121°C / 100% RH).

[0087] (Molding Shrinkage) The curable composition was molded using a transfer molding machine under conditions of a molding temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to obtain a plate-shaped molded product (length 127 mm, width 12.7 mm, thickness 6.4 mm). The molding shrinkage A (%) was calculated using the following formula from the mold cavity length D at 25°C, which had been measured in advance, and the molded product length d at room temperature (25°C). Molding shrinkage A (%) = ((D - d) / D) × 100

[0088] The curable composition was molded using a transfer molding machine under conditions of a molding temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to obtain a plate-shaped molded product (127 mm long, 12.7 mm wide, 6.4 mm thick). The molded product was post-cured at 175°C for 5 hours to obtain a plate-shaped cured product. The mold shrinkage B (%) was calculated using the following formula from the previously measured mold cavity length D at 25°C and the length d of the cured product at room temperature (25°C): Mold shrinkage B (%) = ((D - d) / D) x 100

[0089] (Spiral Flow) Spiral flow was measured by using a spiral flow measurement mold conforming to EMMI-1-66 to mold the curable composition under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds, and determining the flow distance (cm).

[0090] (Volume Resistivity) Using a mold capable of molding a disk-shaped test piece having a diameter of 100 mm and a thickness of 3 mm, the curable composition obtained above was molded using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds, and then post-cured at 175°C for 5 hours to prepare a test piece. Using a mask seal and conductive silver paint, a surface electrode consisting of an inner circular portion 2 and an outer circular portion 4 was formed on one side of the obtained test piece 10 as shown in FIG. 1(A). Similarly, a back electrode 6 as shown in FIG. 1(B) was formed on the other side of the test piece 10. The test piece 10 with the electrode formed thereon was placed in an environment of 25°C, 100°C, or 150°C, and the value of the volume resistivity meter was read 1 minute after application of a voltage of 500 V. The volume resistivity was calculated using the following formula (1): Volume resistivity (Ω·cm) = (πd ２ / 4t) × (Rv) Formula (1) d: outer diameter of inner circle of surface electrode = 5.0 (cm) t: thickness of test piece = 0.3 (cm) Rv: volume resistance value (MΩ) π: circumference constant = 3.14

[0091] (Volume Resistivity After Moisture Absorption) The same test specimen as that used in the above-mentioned measurement of volume resistivity was used, and this test specimen was treated for 20 hours under pressure cooker test conditions (2 atmospheres (0.2 MPa) / 121°C / 100% RH). After the treatment, water droplets were wiped off the surface of the test specimen, and the specimen was placed in an environment of 25°C. The value of the volume resistivity meter was read 1 minute after application of a voltage of 500 V. The volume resistivity after moisture absorption was calculated using the above formula (1).

[0092] (Temperature Cycle Test) A) Two types of lead frames were selected, the materials being (1) Cu (SPOT Ag) and (2) PPF (Cu core, Ni-Pd plated with Au flash treatment). Using a curable composition, an SOP-28L type package with external dimensions of 7.6 mm length, 18 mm width, and 2.3 mm thickness and equipped with a silicon chip (2.2 mm length, 3.2 mm width, 0.37 mm thickness) was produced in a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds. B) Two types of lead frames were selected: (1) Cu (SPOT Ag) and (2) PPF (Cu core, Ni-Pd plated with Au flash treatment). Using the curable composition, SOP-8L type packages with external dimensions of 3.9 mm length, 4.9 mm width, and 1.5 mm thickness were fabricated using a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds. These packages were equipped with a silicon chip (1.5 mm length, 2.6 mm width, and 0.37 mm thickness). These packages were fabricated using a total of four types of packages: (1) and (2) of A) above, and (1) and (2) of B) above. Post-curing was performed at 175°C for 5 hours. The fabricated samples were subjected to a 1000-hour temperature cycle test, with one cycle consisting of holding at -55°C for 5 minutes, 150°C for 5 minutes, and 55°C for 5 minutes. The presence or absence of cracks was observed using an ultrasonic microscope (device name: Nordson Sonoscan) after 100 hours (h), 250 hours, 500 hours, 750 hours, and 1000 hours. The results are shown in Table 3.

[0093] (Reflow Resistance Test) A) Two types of lead frames were selected, with the materials being (1) Cu (SPOT Ag) and (2) PPF (Cu core, Ni-Pd plated with Au flash treatment). Using a curable composition, an SOP-28L type package with external dimensions of 7.6 mm length, 18 mm width, and 2.3 mm thickness and equipped with a silicon chip (2.2 mm length, 3.2 mm width, 0.37 mm thickness) was produced in a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds. B) Two types of lead frames were selected, (1) Cu (SPOT Ag) and (2) PPF (Cu core, Ni-Pd plated with Au flash treatment), and the curable composition was used in a transfer molding machine under conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds to produce SOP-8L type packages with external dimensions of 3.9 mm length, 4.9 mm width, and 1.5 mm thickness, equipped with a silicon chip (1.5 mm length, 2.6 mm width, 0.37 mm thickness). Test samples were produced using a total of four types of packages: (1) and (2) of A) above and (1) and (2) of B) above. Post-curing was performed at 175°C for 5 hours. The prepared samples were heat-treated in a heating furnace at 125°C for 24 hours, then left at 60°C and 60% RH for 40 hours or at 85°C and 60% RH for 168 hours, and then heated three times in a reflow furnace at a furnace temperature of 260°C for a heating time of 15 minutes, and the presence or absence of cracks was observed using an ultrasonic microscope (device name: Nordson Sonoscan). The results are shown in Table 4.

[0094] Regarding B / A in Tables 3 and 4, A indicates the number of packages subjected to the test, and B indicates the number of packages in which cracking was observed. The smaller the B value, the better the temperature cycle characteristics. "-" in the tables means that no data is available.

[0095]

[0096]

[0097]

[0098] As shown in Tables 3 and 4, it was confirmed that Examples 1 and 2 tended to have fewer packages in which cracks were observed in the temperature cycle test and moisture absorption test than Comparative Example 1. Therefore, Examples 1 and 2 were superior to Comparative Example 1 in cycle characteristics and moisture absorption properties.

Claims

A curable composition comprising a biomass-derived curable component. 　 The curable composition of claim 1 , wherein the curable component comprises a biomass-derived epoxy resin. 　 The curable composition according to claim 2 , wherein the biomass-derived epoxy resin comprises a biphenyl-type epoxy resin. 　 The curable composition according to claim 2, wherein the biomass-derived epoxy resin has a biomass content of 15% or more. 　 The curable composition of claim 1 further comprising an inorganic filler. 　 The curable composition according to claim 5, wherein the content of the inorganic filler is 60% by volume to 90% by volume based on the total amount of the curable composition. 　 The curable composition according to any one of claims 1 to 6, which is used for sealing electronic parts. 　 An electronic component device comprising: a support member; an electronic component placed on the support member; and a cured product of the curable composition according to claim 7 that seals the electronic component.

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