Display substrate and preparation method therefor, and display device

Abstract

A display substrate and a preparation method therefor, and a display device. The display substrate comprises a display region (100), a hole region (300) located within the display region (100), and an encapsulation region (200) located between the display region (100) and the hole region (300), wherein the encapsulation region (200) comprises at least one isolation structure (2) disposed on a substrate (101), and a functional layer (31), the functional layer (31) being disposed on the side of the at least one isolation structure (2) away from the substrate (101); and the functional layer (31) is provided with at least one hollowed-out region (32), with at least part of the hollowed-out region (32) being located on the side of the at least one isolation structure (2) close to the display region (100).

Description

Display substrate, preparation method thereof and display device TECHNICAL FIELD

[0001] The present document relates to, but is not limited to, the technical field of display, in particular to a display substrate, a preparation method thereof and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) and quantum dot light emitting diode (QLED) are active light emitting display devices, which have the advantages of self-luminous, wide viewing angle, high contrast, low power consumption, extremely high response speed, lightness, flexibility, low cost, etc. With the continuous development of display technology, flexible display devices with OLED or QLED as light emitting devices and controlled by thin film transistors (TFT) have become the mainstream products in the current display field.

[0003] The light emitting device of an active matrix organic light emitting diode (AMOLED) is an organic light emitting diode, and the AMOLED drives the OLED by driving thin film transistors to generate driving current.

[0004] SUMMARY

[0005] The following is a summary of the subject matter of the detailed description herein. This summary is not intended to limit the scope of the claims.

[0006] In one aspect, the present disclosure provides a display substrate, comprising a display area, a hole area located in the display area, and an encapsulation area located between the display area and the hole area, the encapsulation area comprising at least one isolation structure disposed on a substrate and a functional layer disposed on a side of the at least one isolation structure away from the substrate, the functional layer being provided with at least one hollow area, at least part of the hollow area being located on a side of the at least one isolation structure close to the display area.

[0007] In an exemplary embodiment, the at least one hollow area is located between the sidewall of the at least one isolation structure and the functional layer.

[0008] In an exemplary embodiment, the at least one hollow area exposes a side of the at least one isolation structure away from the substrate, and sidewalls of opposite sides of the at least one isolation structure.

[0009] In an exemplary embodiment, the at least one hollowed region is located between adjacent isolation structures, and the at least one hollowed region is provided with the functional layer between side walls of the adjacent isolation structures.

[0010] In an exemplary embodiment, the encapsulation region comprises at least two isolation structure groups provided on the substrate and spaced apart along a direction parallel to the substrate, and each isolation structure group comprises at least two isolation structures, and the at least one hollowed region is located between two adjacent isolation structure groups.

[0011] In an exemplary embodiment, the at least one hollowed region exposes at least two isolation structures and a region between the at least two isolation structures.

[0012] In an exemplary embodiment, the shape of the hollowed region comprises a ring shape.

[0013] In an exemplary embodiment, the display region comprises a light emitting device provided on the substrate and an inorganic encapsulation layer provided on a side of the light emitting device away from the substrate, the light emitting device comprises a first electrode, a light emitting layer and a second electrode stacked in sequence along a direction away from the substrate, and the functional layer comprises a second electrode material.

[0014] In an exemplary embodiment, the functional layer further comprises at least one of a light emitting layer material and an inorganic encapsulation layer material.

[0015] In an exemplary embodiment, the functional layer comprises at least two functional patterns, one functional pattern is located between two adjacent isolation structures, and the hollowed region is provided between two adjacent functional patterns.

[0016] In an exemplary embodiment, the functional patterns are provided one by one in the regions between the at least two isolation structures.

[0017] In an exemplary embodiment, the at least one hollowed region exposes a side surface of the functional layer, and the exposed side surface of the functional layer is a plane perpendicular to the substrate.

[0018] In an exemplary embodiment, the at least one hollowed region exposes a side surface of the functional layer, and the exposed side surface of the functional layer is a stepped surface.

[0019] In an exemplary embodiment, a cross-sectional shape of the at least one isolation structure in a direction perpendicular to the substrate comprises an I-shaped cross section, or a side surface of a cross section of the at least one isolation structure in a direction perpendicular to the substrate comprises a flat surface.

[0020] In an exemplary embodiment, the at least one isolation structure comprises a first dielectric layer, a second dielectric layer and a third dielectric layer stacked in sequence away from the substrate, at least part of the side surface of the third dielectric layer protrudes relative to the side surface of the second dielectric layer, forming an undercut structure.

[0021] In an exemplary embodiment, the isolation structure comprises a conductive material.

[0022] In an exemplary embodiment, the display area comprises a transistor disposed on the substrate, the transistor comprises a source-drain electrode, the at least one isolation structure is located in the same film layer as the source-drain electrode and adopts the same material.

[0023] In an exemplary embodiment, the display area comprises a transistor disposed on the substrate, the transistor comprises a source-drain electrode and a gate disposed on the side of the source-drain electrode close to the substrate, the at least one isolation structure is provided with a conductive pattern on the side close to the substrate, the conductive pattern overlaps the orthographic projection of the at least one isolation structure on the substrate, the conductive pattern is located in the same film layer as the gate and adopts the same material.

[0024] In an exemplary embodiment, the orthographic projection of the functional layer and the at least one isolation structure on the substrate on the side away from the substrate does not overlap; or, the orthographic projection of the functional layer and the at least one isolation structure on the substrate on the side away from the substrate exists overlap.

[0025] In another aspect, the present disclosure also provides a preparation method of a display substrate, the display substrate comprises a display area, a hole area located in the display area and an encapsulation area located between the display area and the hole area, the preparation method of the display substrate comprises:

[0026] forming at least two isolation structures on the substrate, the at least two isolation structures are arranged at intervals along the direction parallel to the substrate;

[0027] forming a functional layer on the side of the at least two isolation structures away from the substrate;

[0028] forming at least one hollow area in the functional layer, at least part of each hollow area is located on the side of the at least one isolation structure close to the display area.

[0029] In an exemplary embodiment, forming at least one hollow area in the functional layer comprises:

[0030] forming at least one hollow area in the functional layer by using a patterned etching process.

[0031] In an exemplary embodiment, forming at least one hollow area in the functional layer comprises:

[0032] forming at least one hollow region in the functional layer using a half-tone mask process.

[0033] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0034] forming at least one hollow region in the functional layer using a photolithography process.

[0035] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0036] forming a functional layer comprising at least one hollow region using a patterning process.

[0037] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0038] forming at least one hollow region in the functional layer using a laser etching process.

[0039] In an exemplary embodiment, forming a functional layer on a side of the at least two isolation structures away from the substrate comprises:

[0040] forming a light emitting material layer on a side of the at least two isolation structures away from the substrate;

[0041] forming a second electrode material layer and an inorganic encapsulation material layer on a side of the light emitting material layer away from the substrate in sequence, the second electrode material layer and the inorganic encapsulation material layer forming the functional layer;

[0042] or, forming a light emitting material layer, a second electrode material layer and an inorganic encapsulation material layer on a side of the at least two isolation structures away from the substrate in sequence, the light emitting material layer, the second electrode material layer and the inorganic encapsulation material layer forming the functional layer;

[0043] or, forming a light emitting material layer on a side of the at least two isolation structures away from the substrate;

[0044] forming a second electrode material layer on a side of the light emitting material layer away from the substrate, the second electrode material layer forming the functional layer.

[0045] In an exemplary embodiment, before forming the at least two isolation structures on the substrate, further comprising:

[0046] forming at least one conductive layer on the substrate, the conductive layer forming a gate electrode in the display area, the conductive layer forming a conductive pattern in the encapsulation area;

[0047] The at least two isolation structures are formed on a side of the conductive pattern away from the substrate, and at least one of the isolation structures overlaps a normal projection of the conductive pattern on the substrate.

[0048] In an exemplary embodiment, comprising:

[0049] At least two isolation structure groups are formed on a substrate, each of the isolation structure groups comprising at least two isolation structures arranged at intervals along a direction parallel to the substrate, and a flat area provided between adjacent two isolation structures;

[0050] A light-emitting layer material is formed on a side of the at least two isolation structure groups away from the substrate;

[0051] A second electrode material is formed on a side of the light-emitting layer material away from the substrate;

[0052] A hollowed-out area is formed in the second electrode material, and the hollowed-out area overlaps a normal projection of the flat area between adjacent two isolation structure groups on the substrate.

[0053] In another aspect, the present disclosure also provides a display device comprising any of the display substrates described above.

[0054] Other aspects can become apparent from a consideration of the drawings and detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0055] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, which together with the detailed description, serve to explain the technical solutions of the present disclosure, but do not constitute a limitation on the technical solutions of the present disclosure.

[0056] FIG. 1 is a cross-sectional view of a display device;

[0057] FIG. 2 is a plan view of a display substrate according to an embodiment of the present disclosure;

[0058] FIG. 3 is a plan view of a display area of a display substrate according to the present disclosure;

[0059] FIG. 4 is a cross-sectional view of a display substrate according to an embodiment of the present disclosure;

[0060] FIG. 5 is a plan view of a functional layer of a display substrate according to an embodiment of the present disclosure;

[0061] FIG. 6 is a cross-sectional view of an isolation structure of a display substrate according to an embodiment of the present disclosure;

[0062] FIGS. 7a-7e are schematic views of a preparation process of a display substrate according to an embodiment of the present disclosure;

[0063] FIG. 8 is a cross-sectional view of another display substrate according to an embodiment of the present disclosure;

[0064] FIG. 9 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0065] FIG. 10 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0066] FIG. 11 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0067] FIG. 12 is a schematic diagram of a manufacturing process of another display substrate according to an embodiment of the present disclosure;

[0068] FIG. 13 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0069] FIG. 14 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0070] FIG. 15 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure;

[0071] FIG. 16 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0072] In order to make the objectives, technical solutions and advantages of the present disclosure clearer, below will be a detailed description of the embodiments of the present disclosure in conjunction with the drawings. Note that the embodiments can be implemented in multiple different forms. One of ordinary skill in the art can easily understand that the manners and contents can be changed into various forms without departing from the spirit and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. The embodiments in the present disclosure and the features in the embodiments can be combined with each other arbitrarily without conflict.

[0073] The proportions of the drawings in the present disclosure can be used as a reference in the actual process, but are not limited thereto. For example, the width-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display substrate and the number of sub-pixels in each pixel are also not limited to the number shown in the drawings. The drawings described in the present disclosure are only schematic diagrams, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0074] The ordinal numbers "first", "second", "third", etc. in the specification are set to avoid confusion of the constituent elements, and are not intended to be limited in terms of quantity.

[0075] In this specification, terms of "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicating the positional or directional relationship of components are used to describe the positional relationship of components with reference to the drawings for the convenience of explanation and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting on the present disclosure. The positional relationship of components is appropriately changed according to the direction in which each component is described. Therefore, it is not limited to the words described in the specification, and can be appropriately changed according to the situation.

[0076] In this specification, unless explicitly defined and limited otherwise, the terms "mount", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate, or communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0077] In this specification, a transistor refers to an element including at least a gate electrode, a drain electrode, and a source electrode. The transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain electrode) and the source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to a region through which current mainly flows.

[0078] In this specification, the first electrode can be a drain electrode, and the second electrode can be a source electrode, or the first electrode can be a source electrode, and the second electrode can be a drain electrode. In the case of using a transistor with opposite polarity or in the case of changing the direction of current in the circuit during operation, the functions of "source electrode" and "drain electrode" are sometimes exchanged with each other. Therefore, in this specification, "source electrode" and "drain electrode" can be exchanged with each other, and "source terminal" and "drain terminal" can be exchanged with each other.

[0079] In this specification, "electrically connected" includes the case where components are connected together through an element having some electrical action. The element having some electrical action is not particularly limited as long as it can transmit and receive an electrical signal between the components to be connected. Examples of the element having some electrical action include not only electrodes and wiring but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0080] In the present specification, "parallel" refers to a state in which two straight lines form an angle of -10° or more and 10° or less, and thus also includes a state in which the angle is -5° or more and 5° or less. In addition, "perpendicular" refers to a state in which two straight lines form an angle of 80° or more and 100° or less, and thus also includes a state in which the angle is 85° or more and 95° or less.

[0081] In the present specification, "film" and "layer" can be replaced with each other. For example, "conductive layer" can be replaced with "conductive film" at times. Similarly, "insulating film" can be replaced with "insulating layer" at times.

[0082] In the present specification, a triangle, a rectangle, a trapezoid, a pentagon, or a hexagon, etc. are not strictly so, and can be an approximate triangle, rectangle, trapezoid, pentagon, or hexagon, etc. There can be some small deformation due to a tolerance, there can be a lead angle, an arc edge, and deformation, etc.

[0083] In the present disclosure, "about" refers to not strictly limited boundaries, allowing values within the range of process and measurement errors.

[0084] FIG. 1 is a cross-sectional view of a display device. As shown in FIG. 1, the display device includes a display area 100', an encapsulation area 200', and a hole area 300', the hole area 300' is located in the display area 100', and the encapsulation area 200' is located between the display area 100' and the hole area 300', which is an annular area surrounding the hole area 300'. The display area 100' includes a pixel driving circuit and a light emitting device disposed on a substrate, the pixel driving circuit includes an active layer and a conductive layer disposed on a side of the active layer away from the substrate, the conductive layer includes at least one source-drain electrode 1', the at least one source-drain electrode 1' is a three-film layer structure, and the light emitting device includes a first electrode, a light emitting layer, and a second electrode. The encapsulation area 200' includes at least one isolation structure 2' disposed on the substrate 101', and a light emitting layer material 5' disposed on a side of the isolation structure 2' away from the substrate 101' and a second electrode material 6' disposed on a side of the light emitting layer material 5' away from the substrate 101', the isolation structure 2' is provided with an undercut structure, and the light emitting layer material 5' and the second electrode material 6' are both disconnected at the undercut structure. The isolation structure 2' and the source-drain electrode 1' are located in the same film layer and can be made of the same material by the same preparation process.

[0085] It has been found by the inventors of the present application that the isolation structure 2' in the encapsulation area 200' of the display device has poor isolation effect on the light emitting layer material 5' and the second electrode material 6', and the second electrode material 6' overlaps with the side wall of the isolation structure 2', so that the disconnected second electrode material 6' can be electrically connected through the isolation structure 2', leading to electrochemical corrosion due to water and oxygen intrusion, and further leading to the display problem of Grow Dark Spots in Hole in the hole area of the display device.

[0086] The display substrate provided by the present disclosure includes a display area, a hole area located in the display area, and an encapsulation area located between the display area and the hole area, the encapsulation area includes at least one isolation structure disposed on a substrate and a functional layer disposed on a side of the at least one isolation structure away from the substrate, the functional layer is provided with at least one hollow area, and at least part of the hollow area is located on a side of the at least one isolation structure close to the display area.

[0087] The display substrate of the present disclosure is illustrated below through some exemplary embodiments.

[0088] FIG. 2 is a schematic plan view of a display substrate according to an embodiment of the present disclosure. As shown in FIG. 2, in a plane parallel to the display substrate, the display substrate includes a display area 100, an encapsulation area 200, and a hole area 300, the hole area 300 is located in the display area 100, and the encapsulation area 200 is located between the display area 100 and the hole area 300, and is an annular area surrounding the hole area 300. The position of the hole area 300 in the display area 100 is not limited, and the shape is also not limited, which can be an oval shape as shown in FIG. 1, or a circular shape or a square shape, a rhombus shape, or other polygonal shapes.

[0089] In an exemplary embodiment, the display area 100 can include a driving circuit layer disposed on a substrate and a light-emitting structure layer disposed on a side of the driving circuit layer away from the substrate, the driving circuit layer can include a pixel driving circuit, and the pixel driving circuit can include a plurality of transistors and a storage capacitor. The light-emitting structure layer can include a plurality of light-emitting units, and each light-emitting unit can include at least a light-emitting device, the light-emitting device can include a first electrode, an organic light-emitting layer, and a second electrode, the first electrode is connected to the pixel driving circuit, the organic light-emitting layer is connected to the first electrode, and the second electrode is connected to the organic light-emitting layer, and the organic light-emitting layer emits light of a corresponding color under the driving of the first electrode and the second electrode. The encapsulation area 200 includes at least one isolation structure, and the isolation structure is used to isolate the organic light-emitting layer and the second electrode. The structure film layer in the hole area 300 is removed, and various devices such as a camera and a sensor are installed.

[0090] In an exemplary embodiment, the organic light-emitting layer can include an emission layer (EML) and any one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0091] FIG. 3 is a schematic diagram of a planar structure of a display area of a display substrate according to the present disclosure. As shown in FIG. 3, the display area of the display substrate can include a plurality of pixel units P arranged in a matrix manner, at least one of the plurality of pixel units P including a first sub-pixel P1 emitting first color light, a second sub-pixel P2 emitting second color light, and a third sub-pixel P3 emitting third color light, the first sub-pixel P1, the second sub-pixel P2, and the third sub-pixel P3 each including a pixel driving circuit and a light emitting device. The pixel driving circuit in each of the sub-pixels is connected to a scan signal line and a data signal line, respectively, and is configured to receive a data voltage transmitted by the data signal line under the control of the scan signal line and output a corresponding current to the light emitting device. The light emitting device in each of the sub-pixels is connected to the pixel driving circuit in the corresponding sub-pixel, and is configured to emit light of a corresponding brightness in response to the current output by the pixel driving circuit in the corresponding sub-pixel.

[0092] In exemplary embodiments, the first sub-pixel P1 can be a red sub-pixel emitting red (R) light, the second sub-pixel P2 can be a blue sub-pixel emitting blue (B) light, and the third sub-pixel P3 can be a green sub-pixel emitting green (G) light.

[0093] In exemplary embodiments, the shape of the sub-pixel can be any one or more of a triangle, a square, a rectangle, a diamond, a trapezoid, a parallelogram, a pentagon, a hexagon, and other polygons, and can be arranged in a horizontal side-by-side manner, a vertical side-by-side manner, an X shape, a cross shape, a triangle shape, a square shape, a diamond shape, or a delta shape, without being limited in the present disclosure.

[0094] FIG. 4 is a schematic diagram of a cross-sectional structure of a display substrate according to an embodiment of the present disclosure. FIG. 4 can be a cross-sectional view of the display substrate along the A-A' direction in FIG. 2. As shown in FIG. 4, the display substrate can include a display area 100, an encapsulation area 200, and a hole area 300. The encapsulation area 200 is disposed between the display area 100 and the hole area 300. In a direction perpendicular to the display substrate, the display substrate can include a first insulating layer 102 disposed on a substrate 101, a second insulating layer 105 disposed on a side of the first insulating layer 102 away from the substrate 101, a third insulating layer 106 disposed on a side of the second insulating layer 105 away from the substrate 101, a fourth insulating layer 107 disposed on a side of the third insulating layer 106 away from the substrate 101, a conductive layer disposed on a side of the fourth insulating layer 107 away from the substrate 101, an organic medium layer 103 disposed on a side of the conductive layer away from the substrate 101, a light-emitting layer material 5 disposed on a side of the organic medium layer 103 away from the substrate 101, a second electrode material 6 disposed on a side of the light-emitting layer material 5 away from the substrate 101, a first inorganic encapsulation layer 7 disposed on a side of the second electrode material 6 away from the substrate 101, a second inorganic encapsulation layer 8 disposed on a side of the first inorganic encapsulation layer 7 away from the substrate 101, and a third inorganic encapsulation layer 9 disposed on a side of the second inorganic encapsulation layer 8 away from the substrate 101. The first insulating layer 102 can serve as a buffer layer, the second insulating layer 105 can serve as a first gate insulating layer, the third insulating layer 106 can serve as a second gate insulating layer, the fourth insulating layer 107 can serve as an interlayer dielectric layer, and the organic medium layer 103 can serve as a planarization layer.

[0095] In an example embodiment, the substrate 101 can be a flexible substrate, for example, the material of the substrate 101 can be polyimide (PI). The substrate 101 can also be a composite of multiple layers of materials, for example, the substrate 101 can include a bottom film layer, a pressure-sensitive adhesive layer, a first polyimide layer, and a second polyimide layer stacked in sequence.

[0096] In an example embodiment, the first insulating layer 102 is located in the display area 100, the encapsulation area 200, and the hole area 300. The second insulating layer 105, the third insulating layer 106, and the fourth insulating layer 107 are stacked in a direction away from the substrate, forming a stacked structure located in the display area 100 and the encapsulation area 200. The second insulating layer 105, the third insulating layer 106, and the fourth insulating layer 107 in the hole area 300 are etched and removed, exposing the first insulating layer 102 in the hole area 300.

[0097] In the example embodiment, the conductive layer includes at least one source-drain electrode 1 and at least one isolation structure 2. The at least one source-drain electrode 1 is located in the display area 100, and the at least one source-drain electrode 1 can be a single-film layer structure or a multi-film layer structure. For example, the source-drain electrode 1 can be a three-film layer structure, and the source-drain electrode 1 can include a first metal layer, a second metal layer, and a third metal layer arranged in sequence away from the substrate. The first metal layer and the third metal layer can both include titanium, and the second metal layer can include aluminum. The source-drain electrode 1 can include at least one of a connection electrode, a power signal line (VDD signal line or VSS signal line), and a gate line.

[0098] In the example embodiment, the at least one isolation structure 2 is located in the encapsulation area 200. For example, the encapsulation area 200 can be provided with at least two isolation structures 2, and the at least two isolation structures 2 are located between the display area 100 and the hole area 300 and are arranged in sequence away from the substrate.

[0099] In the example embodiment, the isolation structure 2 can be a single-film layer structure or a multi-film layer structure. For example, the isolation structure 2 can be a three-film layer structure, and the isolation structure 2 can include a first dielectric layer, a second dielectric layer, and a third dielectric layer arranged in sequence away from the substrate. The first dielectric layer and the third dielectric layer can both include titanium, and the second dielectric layer can include aluminum.

[0100] In the example embodiment, the isolation structure 2 can be located in the same film layer as the source-drain electrode 1 and include the same material and be prepared by the same preparation process, thereby simplifying the process and reducing the production cost.

[0101] In some embodiments, the isolation structure can be located in the same film layer as the source-drain electrode and include different materials and be prepared by different preparation processes. Alternatively, the isolation structure can be located in different film layers from the source-drain electrode of the display area and include the same or different materials.

[0102] The display substrate of the example embodiment can prevent the crack of the encapsulation area 200 from spreading and enhance the strength of the encapsulation area 200.

[0103] In the example embodiment, the isolation structure 2 is provided with at least one undercut structure 2-1 configured to separate the light-emitting layer material 5 and the second electrode material 6 of the encapsulation area 200.

[0104] In the example embodiment, the organic dielectric layer 103 is located in the display area 100, and the organic dielectric layer 103 in the encapsulation area 200 and the hole area 300 is etched and removed. The organic dielectric layer 103 covers the surface of the at least one source-drain electrode 1 away from the substrate and covers the side surface of the at least one source-drain electrode 1.

[0105] In an example embodiment, the light-emitting layer material 5 is located in the display region 100 and the encapsulation region 200, and the light-emitting layer material 5 in the hole region 300 is etched and removed. The light-emitting layer material 5 covers the surface of the organic medium layer 103 away from the substrate side of the display region 100, and the side of the organic medium layer 103 close to the encapsulation region 200. The light-emitting layer material 5 in the encapsulation region 200 exposes at least one surface of the isolation structure 2 away from the substrate side. The light-emitting layer material 5 in the encapsulation region 200 includes at least two light-emitting layer material patterns 5-1, and the at least two light-emitting layer material patterns 5-1 are arranged in parallel to the substrate direction. There is one isolation structure 2 between the adjacent two light-emitting layer material patterns 5-1, and the isolation structure 2 includes a first side wall close to the display region 100 and a second side wall away from the display region 100. One of the adjacent two light-emitting layer material patterns 5-1 close to the display region 100 is in contact with the first side wall of the isolation structure 2, and the other of the adjacent two light-emitting layer material patterns 5-1 away from the display region 100 is in contact with the second side wall of the isolation structure 2.

[0106] In an example embodiment, the second electrode material 6 is disposed on the side of the light-emitting layer material 5 away from the substrate and in contact with the light-emitting layer material 5, and the first inorganic encapsulation layer 7 is disposed on the side of the second electrode material 6 away from the substrate and in contact with the second electrode material 6. The second electrode material 6 and the first inorganic encapsulation layer 7 are sequentially stacked along the direction away from the substrate to form a functional layer 31. The functional layer 31 is located in the display region 100 and the encapsulation region 200, and the functional layer 31 in the hole region 300 is etched and removed. The functional layer 31 in the encapsulation region 200 includes at least two functional patterns 31-1 and a hollow region 32 between the adjacent two functional patterns 31-1. The functional layer 31 material in the hollow region 32 is etched and removed.

[0107] In the example embodiment, the hollow region 32 is arranged one-to-one with the isolation structure 2, and the hollow region 32 is located between two adjacent functional patterns 31-1. The orthographic projection of the hollow region 32 on the substrate 101 covers the orthographic projection of the corresponding isolation structure 2 on the substrate 101. The hollow region 32 includes a middle region, a first edge region located on one side of the middle region close to the display area 100, and a second edge region located on one side of the middle region away from the display area 100. The orthographic projection of the middle region of the hollow region 32 on the substrate 101 covers the orthographic projection of the corresponding isolation structure 2 on the substrate 101, and exposes the surface of the corresponding isolation structure 2 away from the substrate 101. The first edge region of the hollow region 32 is located between the side wall of the corresponding isolation structure 2 close to the display area 100 and the adjacent isolation structure 2, and exposes the side wall of the corresponding isolation structure 2 close to the display area 100. The second edge region of the hollow region 32 is located between the side wall of the corresponding isolation structure 2 away from the display area 100 and the adjacent isolation structure 2, and exposes the side wall of the corresponding isolation structure 2 away from the display area 100.

[0108] In the example embodiment, the functional pattern 31-1 is located between two adjacent isolation structures 2. At least two functional patterns 31-1 are arranged in parallel to the direction of the substrate 101 and are located between the display area 100 and the hole area 300. A hollow region 32 is arranged between two adjacent functional patterns 31-1. The hollow region 32 exposes the side walls of the two adjacent functional patterns 31-1, and the side walls of the functional pattern 31-1 exposed by the hollow region 32 are perpendicular to the plane of the substrate. The side walls of the functional pattern 31-1 and the adjacent isolation structure 2 are separated by the hollow region 32, so that the functional pattern 31-1 is not in contact with the side walls of the isolation structure 2.

[0109] In some embodiments, the side surface of part of the inorganic encapsulation material in the functional pattern is recessed relative to the side surface of the second electrode material, forming a stepped shape.

[0110] In the example embodiment, the orthographic projection of the functional pattern 31-1 on the substrate does not overlap with the orthographic projection of the adjacent isolation structure 2 on the substrate.

[0111] The display substrate according to the embodiments of the present disclosure separates the functional layer from the side wall of the isolation structure 2 through the hollow region, prevents the conductive film layer (for example, the second electrode material) in the functional layer from being electrically connected to the isolation structure 2, ensures that the conductive film layer in the encapsulation area is completely de-energized, avoids the problem of electrochemical corrosion caused by incomplete de-energization of the conductive film layer in the encapsulation area, and effectively improves the reliability of the display substrate.

[0112] In an example embodiment, the second inorganic encapsulation layer 8 is disposed on the side of the first inorganic encapsulation layer 7 away from the substrate 101 and in contact with the first inorganic encapsulation layer 7. The second inorganic encapsulation layer 8 is located in the display area 100 and the encapsulation area 200, and the second inorganic encapsulation layer 8 in the hole area 300 is etched and removed. The orthographic projection of the second inorganic encapsulation layer 8 on the substrate covers the orthographic projection of each hollow area 32 and each functional pattern 31-1 on the substrate, the second inorganic encapsulation layer 8 covers the surface of each isolation structure 2 exposed by each hollow area 32, and covers the surface exposed by each functional pattern 31-1, which includes the side surface of the functional pattern 31-1 close to the display area 100, the side surface away from the display area 100, and the top surface away from the substrate. The second inorganic encapsulation layer 8 can ensure that external water vapor cannot enter the light-emitting device and encapsulate the area exposed by each hollow area 32. The second inorganic encapsulation layer 8 can include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiOxNy).

[0113] In an example embodiment, the third inorganic encapsulation layer 9 is disposed on the side of the second inorganic encapsulation layer 8 away from the substrate 101 and in contact with the second inorganic encapsulation layer 8. The third inorganic encapsulation layer 9 is located in the display area 100 and the encapsulation area 200, and the third inorganic encapsulation layer 9 in the hole area 300 is etched and removed. The orthographic projection of the third inorganic encapsulation layer 9 on the substrate covers the orthographic projection of each hollow area 32 and each functional pattern 31-1 on the substrate, and the third inorganic encapsulation layer 9 can ensure that external water vapor cannot enter the light-emitting device and encapsulate the area exposed by each hollow area 32. The third inorganic encapsulation layer 9 can include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiOxNy).

[0114] FIG. 5 is a schematic diagram of the planar structure of the functional layer of a display substrate according to an example embodiment of the present disclosure. FIG. 5 can be an enlarged view of the functional layer at position a in FIG. 2. In an example embodiment, as shown in FIG. 5, the functional layer 31 of the encapsulation area 200 includes at least two functional patterns 31-1 and a hollow area 32 located between the two adjacent functional patterns 31-1. The hollow area 32 is disposed one-to-one with the isolation structure 2, and the orthographic projection of the hollow area 32 on the substrate 101 covers the orthographic projection of the corresponding isolation structure 2 on the substrate 101, exposing the surface of the isolation structure 2 away from the substrate, the sidewall of the isolation structure 2 close to the display area 100, and the sidewall of the isolation structure 2 away from the display area 100.

[0115] In an example embodiment, in a direction parallel to the display substrate, the isolation structure 2 can be annular, located between the display area 100 and the hole area 300 and surrounding the hole area 300. The shape of the isolation structure 2 can include an ellipse, a circle, or a polygon such as a square or a diamond. The isolation structure 2 can have a shape substantially the same as that of the encapsulation area 200.

[0116] In an example embodiment, the hollow region 32 can be annular in shape in a direction parallel to the display substrate, located between the display area 100 and the hole area 300, and surrounding the hole area 300. The shape of the hollow region 32 can include an ellipse, a circle, or a polygon such as a square or a diamond. The hollow region 32 can have substantially the same shape as the encapsulation area 200.

[0117] FIG. 6 is a schematic diagram of a cross-sectional structure of an isolation structure of a display substrate according to an example embodiment of the present disclosure. FIG. 6 can be a cross-sectional view of the isolation structure of FIG. 4. As shown in FIG. 6, in a direction perpendicular to the display substrate, the isolation structure 2 includes a first dielectric layer 21, a second dielectric layer 22, and a third dielectric layer 23 stacked in sequence away from the substrate, and at least one side surface of the third dielectric layer 23 extends relative to a side surface of the second dielectric layer 22 to form an undercut structure 2-1. For example, both side surfaces of the third dielectric layer 23 in a direction parallel to the substrate extend relative to both side surfaces of the second dielectric layer 22 in a direction parallel to the substrate to form the undercut structure 2-1.

[0118] In an example embodiment, the second dielectric layer 22 has a trapezoidal shape in a cross-section perpendicular to the substrate, and the first dielectric layer 21 and the third dielectric layer 23 each have a rectangular shape in a cross-section perpendicular to the substrate.

[0119] In an example embodiment, the first dielectric layer 21 and the third dielectric layer 23 each include a metal compound, such as titanium nitride. The third dielectric layer 23 includes a metal, such as aluminum or silver.

[0120] The display substrate according to an example embodiment of the present disclosure can separate the light-emitting layer material 5 and the second electrode material 6 by the undercut structure 2-1 of the isolation structure 2, prevent cracks from occurring in the encapsulation area 200, and enhance the strength of the encapsulation area 200.

[0121] In some embodiments, the isolation structure can not have an undercut structure, and the side surface of the isolation structure in a cross-section perpendicular to the substrate includes a flat surface. The light-emitting layer material and the second electrode material on the encapsulation area can not be separated at the isolation structure. The display substrate according to an example embodiment of the present disclosure can separate the light-emitting layer material and the second electrode material by the hollow region, and prevent the flow of charges between the light-emitting layer material and the second electrode material.

[0122] In an example embodiment, the display substrate of the present disclosure can include a packaging structure layer disposed on the side of the second electrode material 6 away from the substrate. The packaging structure layer includes a first inorganic packaging layer 7, an organic packaging layer, a second inorganic packaging layer 8, and a third inorganic packaging layer 9 disposed in sequence in the direction away from the substrate. In the direction parallel to the display substrate, the packaging region 200 can include, in sequence in the direction away from the display region 100, a wire winding region, an inner isolation region, a barrier wall region, and an outer isolation region; the wire winding region includes various leads, the inner isolation region includes at least one first isolation structure, the barrier wall region includes at least one barrier wall, and the outer isolation region includes at least one second isolation structure. The first inorganic packaging layer 7, the organic packaging layer, the second inorganic packaging layer 8, and the third inorganic packaging layer 9 of the packaging structure layer all extend to the inner isolation region and cover the at least one first isolation structure in the inner isolation region; the organic packaging layer of the packaging structure layer is blocked by the at least one barrier wall in the barrier wall region, and the at least one barrier wall prevents the organic packaging layer from overflowing to the outer isolation region; the first inorganic packaging layer 7, the second inorganic packaging layer 8, and the third inorganic packaging layer 9 of the packaging structure layer all extend to the outer isolation region and cover the at least one second isolation structure in the outer isolation region, and the organic packaging layer of the packaging structure layer is blocked by the barrier wall region and does not overflow to the outer isolation region.

[0123] In an example embodiment, the functional layer 31 of the present disclosure can be located in at least one of the inner isolation region and the outer isolation region, for example, the functional layer of the present disclosure can be located in the outer isolation region, and the functional pattern of the functional layer is disposed between adjacent second isolation structures in the outer isolation region.

[0124] In some embodiments, the functional layer of the present disclosure can also be located in the inner isolation region, and the functional pattern of the functional layer is disposed between adjacent first isolation structures in the inner isolation region. The present disclosure will not be repeated here.

[0125] The preparation process of the display substrate is exemplarily illustrated below. The "patterning process" in the present disclosure includes coating photoresist, mask exposure, development, etching, stripping photoresist and the like for metal material, inorganic material or transparent conductive material, and includes coating organic material, mask exposure and development and the like for organic material. The deposition can adopt any one or more of sputtering, evaporation, chemical vapor deposition, the coating can adopt any one or more of spraying, spin coating and inkjet printing, and the etching can adopt any one or more of dry etching and wet etching, which are not limited in the present disclosure. The "thin film" refers to a thin film of a certain material on a substrate by deposition, coating or other processes. If the "thin film" does not need a patterning process in the whole preparation process, the "thin film" can also be referred to as a "layer". If the "thin film" needs a patterning process in the whole preparation process, it is referred to as a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern". The "A and B are arranged in the same layer" in the present disclosure refers to that A and B are formed at the same time by the same patterning process. The "thickness" of the film layer refers to the size of the film layer in the direction perpendicular to the display substrate. In the exemplary embodiments of the present disclosure, "the orthographic projection of B is within the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" refers to that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0126] In the exemplary embodiments, the preparation process of the display substrate can include the following operations.

[0127] (101) forming an isolation structure.

[0128] In the example embodiment, forming the isolation structure can include sequentially forming the first insulating layer 102, the second insulating layer 105, the third insulating layer 106, and the fourth insulating layer 107 on the substrate 101, the first insulating layer 102 being located in the display area 100, the packaging area 200, and the hole area 300, the second insulating layer 105, the third insulating layer 106, and the fourth insulating layer 107 all being located in the display area 100 and the packaging area 200, the second insulating layer 105, the third insulating layer 106, and the fourth insulating layer 107 in the hole area 300 being etched and removed; then, on the side of the fourth insulating layer 107 away from the substrate 101, the first conductive film is patterned to form at least one source-drain electrode 1 in the display area 100, to form at least two isolation structures 2 in the packaging area 200, and to etch and remove the first conductive film in the hole area 300; then, the organic medium layer 103 is formed on the side of the at least one source-drain electrode 1 in the display area 100 away from the substrate 101 to cover the at least one source-drain electrode 1, and the organic medium layer 103 in the packaging area 200 and the hole area 300 is etched and removed, as shown in FIG. 7a.

[0129] In the example embodiment, the isolation structure 2 is provided with an undercut structure on the opposite two side walls.

[0130] (102) Forming a light-emitting layer material.

[0131] In the example embodiment, forming the light-emitting layer material can include: on the substrate formed with the aforementioned pattern, depositing a light-emitting layer film located in the display area 100, the packaging area 200, and the hole area 300, and through a patterning process, forming the light-emitting layer material 5 in the display area 100 and the packaging area 200 by etching and removing the light-emitting layer film in the hole area 300. The light-emitting layer material 5 in the display area 100 covers the side of the organic medium layer 103 away from the substrate, the light-emitting layer material 5 in the packaging area 200 covers the side of the fourth insulating layer 107 exposed in the packaging area 200 away from the substrate 101, and the side of the isolation structure 2 away from the substrate 101, and the light-emitting layer material 5 in the packaging area 200 is interrupted at the undercut structure of the isolation structure 2, as shown in FIG. 7b.

[0132] In the exemplary embodiment, the light-emitting layer material 5 is interrupted at the undercut structure of the isolation structure 2, and the light-emitting layer material 5 includes a first material portion 51 and a second material portion 52, which are disconnected from each other at the undercut structure. The first material portion 51 of the light-emitting layer material 5 is disposed on the fourth insulating layer 107 exposed away from the substrate 101 and in contact with the fourth insulating layer 107, and an isolation structure 2 is disposed between adjacent first material portions 51, with the side wall of the isolation structure 2 near the display area 100 in contact with the adjacent first material portions 51 and the side wall of the isolation structure 2 away from the display area 100 in contact with the adjacent first material portions 51; the second material portion 52 of the light-emitting layer material 5 is disposed on the surface of the isolation structure 2 away from the substrate and in contact with the isolation structure 2.

[0133] (103) Forming a second electrode material.

[0134] In the exemplary embodiment, forming the second electrode material can include: on the substrate on which the aforementioned pattern is formed, depositing a second conductive film located in the display area 100, the encapsulation area 200, and the hole area 300, and through a patterning process, forming the second electrode material 6 located in the display area 100 and the encapsulation area 200 from the second conductive film, and etching away the second electrode material 6 in the hole area 300. The second electrode material 6 covers the light-emitting layer material 5 away from the substrate in the display area 100 and the encapsulation area 200, and the second electrode material 6 in the encapsulation area 200 is interrupted at the undercut structure of the isolation structure 2, as shown in FIG. 7c.

[0135] In the exemplary embodiment, the second electrode material 6 is interrupted at the undercut structure of the isolation structure 2, and the second electrode material 6 includes a first conductive portion 61 and a second conductive portion 62, which are disconnected from each other at the undercut structure. The first conductive portion 61 of the second electrode material 6 is located on the first material portion 51 of the light-emitting layer material 5 away from the substrate and in contact with the first material portion 51, and an isolation structure 2 is disposed between adjacent first conductive portions 61, with the side wall of the isolation structure 2 near the display area 100 in contact with the adjacent first conductive portions 61 and the side wall of the isolation structure 2 away from the display area 100 in contact with the adjacent first conductive portions 61; the second conductive portion 62 of the second electrode material 6 is disposed on the surface of the second material portion 52 of the light-emitting layer material 5 away from the substrate and in contact with the second material portion 52.

[0136] (104) Forming a first inorganic encapsulation layer.

[0137] In an example embodiment, forming the first inorganic encapsulation layer can include: on the substrate with the aforementioned pattern formed, depositing a first inorganic thin film on the display region 100, the encapsulation region 200, and the hole region 300, and through a patterning process, making the first inorganic thin film form the first inorganic encapsulation layer 7 on the display region 100 and the encapsulation region 200, and the first inorganic encapsulation layer 7 on the hole region 300 being etched and removed, as shown in FIG. 7d. Wherein the second electrode material 6 and the first inorganic encapsulation layer 7 are stacked with each other to form a functional layer.

[0138] In an example embodiment, the first inorganic encapsulation layer 7 is not blocked at the undercut structure of the isolation structure 2, and the first inorganic encapsulation layer 7 is a continuous film layer covering the display region 100 and the encapsulation region 200.

[0139] (105) Forming a hollowed-out region.

[0140] In an example embodiment, forming the hollowed-out region can include: on the substrate with the aforementioned pattern formed, using a patterned etching process, etching the functional layer 31 including the second electrode material 6 and the first inorganic encapsulation layer 7 in the encapsulation region 200, so that at least two hollowed-out regions 32 are formed in the functional layer 31, and the second electrode material 6 and the first inorganic encapsulation layer 7 in each hollowed-out region 32 are etched and removed. Each hollowed-out region 32 is arranged one-to-one corresponding to the isolation structure 2, and the orthographic projection of the hollowed-out region 32 on the substrate 101 covers the orthographic projection of the corresponding isolation structure 2 on the substrate 101, the edge region of the hollowed-out region 32 close to the display region 100 exposes at least part of the side of the corresponding isolation structure 2 close to the display region 100, the edge region of the hollowed-out region 32 away from the display region 100 exposes at least part of the side of the corresponding isolation structure 2 away from the display region 100, and the middle region of the hollowed-out region 32 exposes the surface of the corresponding isolation structure 2 away from the substrate. The functional pattern 31-1 between adjacent hollowed-out regions 32 is included in the functional layer 31, and the functional pattern 31-1 is insulated from the side wall of the isolation structure 2 by the hollowed-out region 32; the second material portion and the second conductive portion on the surface of the isolation structure 2 away from the substrate are etched and removed, as shown in FIG. 7e.

[0141] In some embodiments, the light-emitting layer material, the second electrode material, and the first inorganic encapsulation material are stacked to form a functional layer. An etching process can be used to etch the functional layer including the light-emitting layer material, the second electrode material, and the first inorganic encapsulation material in the encapsulation region, so that a hollowed-out region is formed in the functional layer.

[0142] The preparation method of the display substrate in the embodiments of the present disclosure forms the hollow region separating the side wall of the isolation structure and the functional pattern by etching the functional layer 31, prevents the electrically conductive film layer (for example, the second electrode material) in the functional pattern from being electrically connected with the isolation structure, ensures that the electrically conductive film layer in the packaging area is completely powered off, avoids the problem of electrochemical corrosion caused by incomplete power-off of the electrically conductive film layer in the packaging area, and effectively improves the reliability of the display substrate.

[0143] FIG. 8 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 8 can be a cross-sectional view in the A-A' direction of FIG. 2. As shown in FIG. 8, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is basically the same as that shown in FIG. 7e, except that the second electrode material 6 and the first inorganic packaging layer 7 are stacked with each other to form the functional layer 31. The functional layer 31 includes at least two functional patterns 31-1 and a hollow region 32 located between the adjacent two functional patterns 31-1. The hollow region 32 is arranged one-to-one with the isolation structure 2, and the orthogonal projection of the hollow region 32 on the substrate 101 covers the orthogonal projection of the corresponding isolation structure 2 on the substrate 101. The hollow region 32 exposes the surface of the isolation structure 2 away from the substrate, the side wall of the isolation structure 2 close to the display area 100, and the side wall of the isolation structure 2 away from the display area 100. The hollow region 32 exposes the side surface of the functional pattern 31-1 adjacent thereto, and the exposed side surface of the functional pattern 31-1 is stepped.

[0144] In an example embodiment, the first inorganic packaging layer 7 of the functional pattern 31-1 includes a first inorganic part and a second inorganic part arranged in sequence in the direction away from the substrate. The side surface of the second inorganic part on the opposite side in the direction parallel to the substrate is recessed in the direction parallel to the substrate compared with the side surface of the first inorganic part on the opposite side in the direction parallel to the substrate, forming a step. The orthogonal projection of the second inorganic part on the substrate is located in the orthogonal projection of the first inorganic part on the substrate.

[0145] In an example embodiment, the preparation process of the display substrate according to the embodiment can include the following operations.

[0146] (201) forming an isolation structure.

[0147] The step (201) of forming an isolation structure in the preparation process of the display substrate according to the embodiment is basically the same as the step (101) of forming an isolation structure in the preparation process of the display substrate shown in FIG. 4.

[0148] (202) forming a light-emitting layer material.

[0149] The step (202) of forming a light-emitting layer material in the preparation process of the display substrate according to the embodiment is basically the same as the step (102) of forming a light-emitting layer material in the preparation process of the display substrate shown in FIG. 4.

[0150] (203) Forming a second electrode material.

[0151] The step (203) of forming a second electrode material in the preparation process of the substrate in this embodiment is substantially the same as the step (103) of forming a second electrode material in the preparation process of the substrate in the embodiment shown in FIG. 4.

[0152] (204) Forming a first inorganic encapsulation layer.

[0153] The step (204) of forming a first inorganic encapsulation layer in the preparation process of the substrate in this embodiment is substantially the same as the step (104) of forming a first inorganic encapsulation layer in the preparation process of the substrate in the embodiment shown in FIG. 4.

[0154] (205) Forming a hollowed-out region.

[0155] In an exemplary embodiment, forming a hollowed-out region can include: on the substrate on which the aforementioned pattern is formed, using a half-tone mask process, etching the functional layer 31 including the second electrode material 6 and the first inorganic encapsulation layer 7 in the encapsulation region 200, so as to form at least two hollowed-out regions 32 in the functional layer 31, each of which is arranged in correspondence with the isolation structure 2, and the second electrode material 6 and the first inorganic encapsulation layer 7 in each of the hollowed-out regions 32 are etched and removed. Each of the hollowed-out regions 32 is arranged in correspondence with the isolation structure 2, and the orthographic projection of the hollowed-out region 32 on the substrate 101 covers the orthographic projection of the isolation structure 2 corresponding thereto on the substrate 101. The edge region of the hollowed-out region 32 close to the display region 100 exposes at least part of the side surface of the isolation structure 2 corresponding thereto close to the display region 100, the edge region of the hollowed-out region 32 away from the display region 100 exposes at least part of the side surface of the isolation structure 2 corresponding thereto away from the display region 100, and the middle region of the hollowed-out region 32 exposes the surface of the isolation structure 2 corresponding thereto away from the substrate. The functional layer 31 includes a functional pattern 31-1 between adjacent hollowed-out regions 32, and the functional pattern 31-1 is insulated from the side wall of the isolation structure 2 by the hollowed-out region 32; the second material portion and the second conductive portion on the surface of the isolation structure 2 away from the substrate are etched and removed, as shown in FIG. 8.

[0156] FIG. 9 is a schematic view of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 9 can be a cross-sectional view of the display substrate in the direction of A-A' in FIG. 2. As shown in FIG. 9, in a direction perpendicular to the display substrate, the structure of the display substrate according to an embodiment of the present disclosure is substantially the same as that shown in FIG. 7e, except that the functional layer 31 is formed by sequentially stacking the light-emitting layer material 5, the second electrode material 6, and the first inorganic encapsulation layer 7 in the encapsulation region 200 in a direction away from the substrate 101, and the functional layer 31 is provided with a hollow region 32 in which the light-emitting layer material 5, the second electrode material 6, and the first inorganic encapsulation layer 7 are etched and removed, the hollow region 32 covers the orthogonal projection of all the isolation structures 2 and the region between adjacent isolation structures 2 on the substrate, and exposes all the isolation structures 2 and the region between adjacent isolation structures 2. The hollow region 32 exposes the side surface of the functional layer 31, and the exposed side surface of the functional layer 31 is perpendicular to the plane of the substrate.

[0157] In some embodiments, the functional layer is provided with at least two hollow regions, each of which covers the orthogonal projection of at least two isolation structures 2 and the region between the at least two isolation structures 2 on the substrate, and exposes the at least two isolation structures 2 and the region between the at least two isolation structures 2.

[0158] In an exemplary embodiment, the preparation process of the display substrate according to the present embodiment can include the following operations.

[0159] (301) Forming an isolation structure.

[0160] The step (301) of forming an isolation structure in the preparation process of the display substrate according to the present embodiment is substantially the same as the step (101) of forming an isolation structure in the preparation process of the display substrate shown in FIG. 4.

[0161] (302) Forming a light-emitting layer material.

[0162] The step (302) of forming a light-emitting layer material in the preparation process of the display substrate according to the present embodiment is substantially the same as the step (102) of forming a light-emitting layer material in the preparation process of the display substrate shown in FIG. 4.

[0163] (303) Forming a second electrode material.

[0164] The step (303) of forming a second electrode material in the preparation process of the display substrate according to the present embodiment is substantially the same as the step (103) of forming a second electrode material in the preparation process of the display substrate shown in FIG. 4.

[0165] (304) Forming a first inorganic encapsulation layer.

[0166] The step (304) of the preparation process of the substrate of the embodiment forms the first inorganic encapsulation layer, which is substantially the same as the step (104) of the preparation process of the substrate of the embodiment shown in FIG. 4.

[0167] (305) Forming a hollow region.

[0168] In the example embodiment, forming the hollow region can include: on the substrate on which the pattern is formed, using a patterned etching process, etching the functional layer 31 including the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 in the encapsulation area 200, so as to form a hollow region 32 in the functional layer 31, the orthogonal projection of the hollow region 32 on the substrate covering the orthogonal projection of all the isolation structures 2 and the area between adjacent isolation structures 2 on the substrate, and the hollow region 32 exposing all the isolation structures 2 and the area between adjacent isolation structures 2, as shown in FIG. 9.

[0169] FIG. 10 is a schematic diagram of the cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 10 can be a cross-sectional view in the A-A' direction of FIG. 2. As shown in FIG. 10, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 7e, except that the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 stacked in the encapsulation area 200 along the direction away from the substrate 101 form the functional layer 31, and the functional layer 31 is provided with a hollow region 32, the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 in the hollow region 32 are etched and removed, the orthogonal projection of the hollow region 32 on the substrate covers the orthogonal projection of all the isolation structures 2 and the area between adjacent isolation structures 2 on the substrate, and the hollow region 32 exposes all the isolation structures 2 and the area between adjacent isolation structures 2. The hollow region 32 exposes the side of the functional layer 31, and the exposed side of the functional layer 31 is in a stepped shape.

[0170] In the example embodiment, the preparation process of the display substrate according to the embodiment can include the following operations.

[0171] (401) Forming an isolation structure.

[0172] The step (301) of the preparation process of the substrate of the embodiment forms the isolation structure, which is substantially the same as the step (101) of the preparation process of the substrate of the embodiment shown in FIG. 4.

[0173] (402) Forming a light-emitting layer material.

[0174] The step (302) of the preparation process of the substrate of the embodiment forms the light-emitting layer material, which is substantially the same as the step (102) of the preparation process of the substrate of the embodiment shown in FIG. 4.

[0175] (403) forming a second electrode material.

[0176] The step (303) of forming a second electrode material in the preparation process of the substrate in this embodiment is substantially the same as the step (103) of forming a second electrode material in the preparation process of the substrate in the embodiment shown in FIG. 4.

[0177] (404) forming a first inorganic encapsulation layer.

[0178] The step (304) of forming a first inorganic encapsulation layer in the preparation process of the substrate in this embodiment is substantially the same as the step (104) of forming a first inorganic encapsulation layer in the preparation process of the substrate in the embodiment shown in FIG. 4.

[0179] (405) forming a hollowed-out region.

[0180] In an example embodiment, forming a hollowed-out region can include: on the substrate on which the aforementioned pattern is formed, using a half-tone mask process, etching the functional layer 31 including the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 in the encapsulation region 200, so as to form a hollowed-out region 32 in the functional layer 31, the orthogonal projection of the hollowed-out region 32 on the substrate covering the orthogonal projection of all the isolation structures 2 and the regions between all the adjacent isolation structures 2 on the substrate, the hollowed-out region 32 exposing all the isolation structures 2 and the regions between all the adjacent isolation structures 2, as shown in FIG. 10.

[0181] FIG. 11 is a schematic diagram of the cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 11 can be a cross-sectional view in the A-A’ direction in FIG. 2. As shown in FIG. 11, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 7e, except that the second electrode material 6 in the encapsulation region 200 forms a functional layer 31, the functional layer 31 is provided with a hollowed-out region 32, the second electrode material 6 in the hollowed-out region 32 is etched away, the orthogonal projection of the hollowed-out region 32 on the substrate covers the orthogonal projection of all the isolation structures 2 and the regions between all the adjacent isolation structures 2 on the substrate, and the hollowed-out region 32 exposes all the isolation structures 2 and the regions between all the adjacent isolation structures 2. The first inorganic encapsulation layer 7 covers all the isolation structures 2 and the regions between all the adjacent isolation structures 2 exposed by the hollowed-out region 32. The second material portion 52 of the light-emitting layer material 5 is arranged on the side of the isolation structure 2 away from the substrate.

[0182] In an example embodiment, the preparation process of the display substrate according to the embodiment of the present disclosure can include the following operations.

[0183] (501) forming an isolation structure.

[0184] The step (501) of the preparation process of the substrate in this embodiment is substantially the same as the step (101) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0185] (502) Forming a light-emitting layer material.

[0186] The step (502) of the preparation process of the substrate in this embodiment is substantially the same as the step (102) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0187] (503) Forming a hollowed-out region.

[0188] In an exemplary embodiment, forming the hollowed-out region can include: on the substrate on which the aforementioned pattern is formed, depositing a second conductive thin film located in the display area 100, the encapsulation area 200, and the hole area 300, and through a patterning process, making the second conductive thin film form a second electrode material 6 located in the display area 100 and the encapsulation area 200, and the second electrode material 6 in the hole area 300 is etched and removed. The second electrode material 6 in the encapsulation area 200 includes a hollowed-out region 32 that exposes all the isolation structures 2, the second material portion 52 of the light-emitting layer material 5 arranged on the isolation structures 2, and the first material portion 51 of the light-emitting layer material 5 on the region between all the adjacent isolation structures 2, as shown in FIG. 12.

[0189] (504) Forming a first inorganic encapsulation layer.

[0190] In an exemplary embodiment, forming the first inorganic encapsulation layer can include: on the substrate on which the aforementioned pattern is formed, depositing a first inorganic thin film located in the display area 100, the encapsulation area 200, and the hole area 300, and through a patterning process, making the first inorganic thin film form a first inorganic encapsulation layer 7 located in the display area 100 and the encapsulation area 200, and the first inorganic encapsulation layer 7 in the hole area 300 is etched and removed, and the first inorganic encapsulation layer 7 in the encapsulation area 200 covers all the isolation structures 2 exposed by the hollowed-out region 32, the second material portion 52 of the light-emitting layer material 5 arranged on the isolation structures 2, and the first material portion 51 of the light-emitting layer material 5 on the region between all the adjacent isolation structures 2, as shown in FIG. 11.

[0191] FIG. 13 is a schematic view of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 13 can be a cross-sectional view of the display substrate in the direction of A-A' in FIG. 2. As shown in FIG. 13, in a direction perpendicular to the display substrate, the structure of the display substrate according to an embodiment of the present disclosure is substantially the same as that shown in FIG. 7e, except that the light-emitting layer material 5 and the second electrode material 6 in the encapsulation region 200 form a functional layer 31, the functional layer 31 is provided with at least two hollow regions 32, each hollow region 32 is provided in one-to-one correspondence with the isolation structure 2, and the light-emitting layer material 5 and the second electrode material 6 in each hollow region 32 are etched and removed. Each hollow region 32 is provided in one-to-one correspondence with the isolation structure 2, the orthographic projection of the hollow region 32 on the substrate 101 covers the orthographic projection of the corresponding isolation structure 2 on the substrate 101, the edge region of the hollow region 32 close to the display region 100 exposes at least part of the side of the corresponding isolation structure 2 close to the display region 100, the edge region of the hollow region 32 away from the display region 100 exposes at least part of the side of the corresponding isolation structure 2 away from the display region 100, and the middle region of the hollow region 32 exposes the surface of the corresponding isolation structure 2 away from the substrate. The functional layer 31 includes a functional pattern 31-1 between adjacent hollow regions 32, the functional pattern 31-1 is insulated from the side wall of the isolation structure 2 by the hollow region 32, and the second material portion and the second conductive portion on the surface of the isolation structure 2 away from the substrate are etched and removed, as shown in FIG. 13.

[0192] In an example embodiment, the preparation process of the display substrate according to an embodiment of the present disclosure can include the following operations.

[0193] (601) Forming an isolation structure.

[0194] The step (301) of forming an isolation structure in the preparation process of the display substrate according to an embodiment of the present disclosure is substantially the same as the step (101) of forming an isolation structure in the preparation process of the display substrate shown in FIG. 4.

[0195] (602) Forming a light-emitting layer material.

[0196] The step (302) of forming a light-emitting layer material in the preparation process of the display substrate according to an embodiment of the present disclosure is substantially the same as the step (102) of forming a light-emitting layer material in the preparation process of the display substrate shown in FIG. 4.

[0197] (603) Forming a second electrode material.

[0198] The step (303) of forming a second electrode material in the preparation process of the display substrate according to an embodiment of the present disclosure is substantially the same as the step (103) of forming a second electrode material in the preparation process of the display substrate shown in FIG. 4.

[0199] (604) Forming a hollow region.

[0200] In the example embodiment, forming the hollowed-out region can include: on the substrate on which the aforementioned pattern is formed, etching the functional layer 31 including the light-emitting layer material 5 and the second electrode material 6 in the encapsulation region 200 by using a laser etching process, so that at least two hollowed-out regions 32 are formed in the functional layer 31, and the light-emitting layer material 5 and the second electrode material 6 in each hollowed-out region 32 are etched and removed.

[0201] (605) forming a first inorganic encapsulation layer.

[0202] In the example embodiment, forming the first inorganic encapsulation layer can include: on the substrate on which the aforementioned pattern is formed, depositing a first inorganic thin film located in the display region 100, the encapsulation region 200 and the hole region 300, and by using a patterning process, making the first inorganic thin film form the first inorganic encapsulation layer 7 located in the display region 100 and the encapsulation region 200, the first inorganic encapsulation layer 7 in the hole region 300 is etched and removed, and the first inorganic encapsulation layer 7 in the encapsulation region 200 covers the exposed isolation structure 2 and the functional pattern 31-1 between adjacent isolation structures 2 in the hollowed-out region 32, as shown in FIG. 13.

[0203] FIG. 14 is a schematic diagram of a cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 14 can be a cross-sectional view in the A-A' direction of FIG. 2. As shown in FIG. 14, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is basically the same as that shown in FIG. 7e, except that the functional layer 31 is formed by sequentially stacking the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 in the encapsulation region 200 in the direction away from the substrate 101, that the hollowed-out region 32 is provided in the functional layer 31, that the light-emitting layer material 5, the second electrode material 6 and the first inorganic encapsulation layer 7 in the hollowed-out region 32 are etched and removed, that the hollowed-out region 32 covers the orthographic projection of all the isolation structures 2 and the orthographic projection of the region between all the adjacent isolation structures 2 on the substrate, and that the hollowed-out region 32 exposes all the isolation structures 2 and the region between all the adjacent isolation structures 2.

[0204] In the example embodiment, the second inorganic encapsulation layer and the third inorganic encapsulation layer in the display substrate according to the embodiment of the present disclosure cover all the isolation structures 2 exposed by the hollowed-out region 32 and all the regions between adjacent isolation structures 2 exposed by the hollowed-out region 32.

[0205] In the example embodiment, the preparation process of the display substrate according to the embodiment of the present disclosure can include the following operations.

[0206] (701) forming an isolation structure.

[0207] The step (301) of the preparation process of the substrate in this embodiment is substantially the same as the step (101) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0208] (702) Forming a light-emitting layer material.

[0209] The step (302) of the preparation process of the substrate in this embodiment is substantially the same as the step (102) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0210] (703) Forming a second electrode material.

[0211] The step (303) of the preparation process of the substrate in this embodiment is substantially the same as the step (103) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0212] (704) Forming a first inorganic encapsulation layer.

[0213] The step (304) of the preparation process of the substrate in this embodiment is substantially the same as the step (104) of the preparation process of the substrate in the embodiment shown in FIG. 4.

[0214] (705) Forming a hollowed-out region.

[0215] In the exemplary embodiment, forming the hollowed-out region can include: on the substrate on which the aforementioned pattern is formed, using a photolithography process, etching the functional layer 31 including the light-emitting layer material 5, the second electrode material 6, and the first inorganic encapsulation layer 7 in the encapsulation region 200, so as to form a hollowed-out region 32 in the functional layer 31, the orthogonal projection of the hollowed-out region 32 on the substrate covering the orthogonal projection of all the isolation structures 2 and the region between all the adjacent isolation structures 2 on the substrate, and the hollowed-out region 32 exposing all the isolation structures 2 and the region between all the adjacent isolation structures 2, as shown in FIG. 14.

[0216] FIG. 15 is a schematic diagram of the cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 15 can be a cross-sectional view in the A-A' direction in FIG. 2. As shown in FIG. 15, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is substantially the same as that of the embodiment shown in FIG. 7e, except that the encapsulation region 200 further includes at least one conductive pattern 41, the conductive pattern 41 is located on the side of the isolation structure 2 close to the substrate 101, and the orthogonal projection of the conductive pattern 41 on the substrate overlaps with the orthogonal projection of the isolation structure 2 on the substrate.

[0217] The display substrate of the embodiments of the present disclosure can increase the vertical distance from the surface of the substrate side to the side of the isolation structure 2 away from the substrate by the conductive pattern 41, and improve the isolation effect of the isolation structure 2.

[0218] In the example embodiments, the conductive pattern 41 is arranged one-to-one with the isolation structure 2, and each conductive pattern 41 is located on the side of the corresponding isolation structure 2 close to the substrate 101.

[0219] In the example embodiments, the display area 100 can include a gate electrode, and the conductive pattern 41 is located in the same film layer as the gate electrode and is made of the same material.

[0220] FIG. 16 is a schematic diagram of the cross-sectional structure of another display substrate according to an embodiment of the present disclosure. FIG. 16 can be a cross-sectional view in the A-A' direction of FIG. 2. As shown in FIG. 16, in the direction perpendicular to the display substrate, the structure of the display substrate according to the embodiment of the present disclosure is basically the same as that shown in FIG. 7e, except that the encapsulation area 200 includes at least two isolation structure groups arranged along a direction parallel to the substrate and spaced apart from each other, and each isolation structure group includes at least two isolation structures 2. The light-emitting layer material 5, the second electrode material 6, and the first inorganic encapsulation layer 7 in the encapsulation area 200 are sequentially stacked along a direction away from the substrate 101 to form a functional layer 31, and the functional layer 31 is provided with at least one hollow area 32 located between two adjacent isolation structure groups. The side of the hollow area 32 close to the display area 100 is provided with at least part of the functional layer 31 between the side of the adjacent isolation structure 2 close to the display area 100, and the side of the hollow area 32 away from the display area 100 is provided with at least part of the functional layer 31 between the side of the adjacent isolation structure 2 away from the display area 100.

[0221] In the example embodiments, the surface of the isolation structure 2 away from the substrate is provided with a second material portion 52 of the light-emitting layer material 5, and a second conductive portion 62 of the second electrode material 6 is arranged on the side of the second material portion 52 away from the substrate, and the second conductive portion 62 wraps the exposed surface of the second material portion 52.

[0222] On the other hand, the present disclosure also provides a preparation method of a display substrate, the display substrate including a display area, a hole area located in the display area, and an encapsulation area located between the display area and the hole area, the preparation method of the display substrate including:

[0223] forming at least two isolation structures on a substrate, the at least two isolation structures being arranged along a direction parallel to the substrate and spaced apart from each other;

[0224] forming a functional layer on the side of the at least two isolation structures away from the substrate;

[0225] At least one hollow region is formed in the functional layer, at least part of each hollow region is located on the side of the at least one isolation structure close to the display area.

[0226] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0227] At least one hollow region is formed in the functional layer by using a patterned etching process.

[0228] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0229] At least one hollow region is formed in the functional layer by using a half-tone mask process.

[0230] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0231] At least one hollow region is formed in the functional layer by using a photolithography process.

[0232] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0233] The functional layer comprising at least one hollow region is formed by using a patterning process.

[0234] In an exemplary embodiment, forming at least one hollow region in the functional layer comprises:

[0235] At least one hollow region is formed in the functional layer by using a laser etching process.

[0236] In an exemplary embodiment, forming a functional layer on the side of the at least two isolation structures away from the substrate comprises:

[0237] A light-emitting material layer is formed on the side of the at least two isolation structures away from the substrate;

[0238] A second electrode material layer and an inorganic encapsulating material layer are sequentially formed on the side of the light-emitting material layer away from the substrate, the second electrode material layer and the inorganic encapsulating material layer form the functional layer;

[0239] Alternatively, a light-emitting material layer, a second electrode material layer and an inorganic encapsulating material layer are sequentially formed on the side of the at least two isolation structures away from the substrate, the light-emitting material layer, the second electrode material layer and the inorganic encapsulating material layer form the functional layer;

[0240] Alternatively, a light-emitting material layer is formed on the side of the at least two isolation structures away from the substrate;

[0241] A second electrode material layer is formed on a side of the light-emitting material layer away from the substrate, and the second electrode material layer forms the functional layer.

[0242] In an example embodiment, before forming the at least two isolation structures on the substrate, further comprising:

[0243] At least one conductive layer is formed on the substrate, the conductive layer forms a gate electrode in the display area, and the conductive layer forms a conductive pattern in the encapsulation area.

[0244] The at least two isolation structures are formed on a side of the conductive pattern away from the substrate, and at least one of the isolation structures overlaps a normal projection of the conductive pattern on the substrate.

[0245] In an example embodiment, the method for manufacturing the display substrate comprises:

[0246] At least two isolation structure groups are formed on the substrate, each isolation structure group comprises at least two isolation structures arranged at intervals along a direction parallel to the substrate, and a flat area is arranged between adjacent two isolation structures.

[0247] A light-emitting layer material is formed on a side of the at least two isolation structure groups away from the substrate.

[0248] A second electrode material is formed on a side of the light-emitting layer material away from the substrate.

[0249] A hollow region is formed in the second electrode material, and the hollow region overlaps a normal projection of the flat area between adjacent two isolation structure groups on the substrate.

[0250] The present disclosure also provides a display device comprising the aforementioned display substrate. The display device can be any product or component with display function, such as a mobile phone, a wearable device, an AR or VR display device, a vehicle-mounted display device, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc., and the embodiments of the present disclosure are not limited thereto.

[0251] Although the embodiments of the present disclosure are described above, the above description is only for the purpose of facilitating understanding of the present disclosure, and is not intended to limit the present disclosure. Any person skilled in the art can make any modifications and changes in the form and details without departing from the spirit and scope of the present disclosure. The patent protection scope of the present disclosure shall be subject to the scope defined by the appended claims.

Claims

1. A display substrate, comprising a display area, an aperture area located in the display area, and an encapsulation area located between the display area and the aperture area, the encapsulation area comprising at least one isolation structure disposed on a base and a functional layer disposed on a side of the at least one isolation structure away from the base, the functional layer being provided with at least one hollowed-out region, at least part of the hollowed-out region being located on a side of the at least one isolation structure close to the display area. 2.The display substrate of claim 1, wherein, The at least one hollowed-out region is located between a side wall of the at least one isolation structure and the functional layer. 3.The display substrate of claim 1, wherein, The at least one hollowed-out region exposes a side of the at least one isolation structure away from the base and side walls of opposite sides of the at least one isolation structure. 4.The display substrate of claim 1, wherein, The at least one hollowed-out region is located between adjacent isolation structures, and the functional layer is disposed between the at least one hollowed-out region and side walls of the adjacent isolation structures. 5.The display substrate of claim 1, wherein, The encapsulation area comprises at least two isolation structure groups disposed on the base and spaced apart along a direction parallel to the base, each isolation structure group comprising at least two isolation structures, and the at least one hollowed-out region is located between two adjacent isolation structure groups. 6.The display substrate of claim 1, wherein, The at least one hollowed-out region exposes at least two isolation structures and a region located between the at least two isolation structures. 7.The display substrate of claim 1, wherein, The shape of the hollowed-out region comprises a ring shape. 8.The display substrate according to any one of claims 1 to 7, wherein The display area comprises a light-emitting device disposed on the base and an inorganic encapsulation layer disposed on a side of the light-emitting device away from the base, the light-emitting device comprising a first electrode, a light-emitting layer and a second electrode stacked in sequence along a direction away from the base, and the functional layer comprises a second electrode material. 9.The display substrate of claim 8, wherein, The functional layer further comprises at least one of a light-emitting layer material and an inorganic encapsulation layer material.

10. The display substrate according to any one of claims 1 to 7, wherein The functional layer comprises at least two functional patterns, one functional pattern being located between two adjacent isolation structures, and the hollowed-out region being disposed between two adjacent functional patterns.

11. The display substrate according to any one of claims 1 to 7, wherein The functional patterns are one-to-one correspondingly disposed in regions between the at least two isolation structures.

12. The display substrate according to any one of claims 1 to 7, wherein The at least one hollowed-out region exposes a side of the functional layer, and the exposed side of the functional layer is a plane perpendicular to the base.

13. The display substrate according to any one of claims 1 to 7, wherein The at least one hollowed-out region exposes a side of the functional layer, and the exposed side of the functional layer is a stepped surface.

14. The display substrate according to any one of claims 1 to 7, wherein A cross-sectional shape of the at least one isolation structure in a direction perpendicular to the base comprises an H shape, or a side of a cross section of the at least one isolation structure in the direction perpendicular to the base comprises a flat surface.

15. The display substrate according to any one of claims 1 to 7, wherein The at least one isolation structure comprises a first dielectric layer, a second dielectric layer and a third dielectric layer stacked in sequence away from the base, at least part of a side of the third dielectric layer protruding relative to a side of the second dielectric layer to form an undercut structure.

16. The display substrate according to any one of claims 1 to 7, wherein The isolation structure comprises a conductive material.

17. The display substrate according to any one of claims 1 to 7, wherein The display area comprises a transistor disposed on the base, the transistor comprising a source-drain electrode, the at least one isolation structure and the source-drain electrode being located in the same film layer and adopting the same material.

18. The display substrate according to any one of claims 1 to 7, wherein The display region comprises a transistor disposed on the substrate, the transistor comprises a source-drain electrode and a gate electrode disposed on a side of the source-drain electrode close to the substrate, and the at least one isolation structure is provided with a conductive pattern on a side close to the substrate, the conductive pattern overlaps with a normal projection of the at least one isolation structure on the substrate, the conductive pattern and the gate electrode are located in the same film layer and are made of the same material.

19. The display substrate according to any one of claims 1 to 7, wherein The normal projection of the functional layer and the at least one isolation structure on the substrate on a side away from the substrate does not overlap; or the normal projection of the functional layer and the at least one isolation structure on the substrate on a side away from the substrate exists overlap.

20. A preparation method of a display substrate, the display substrate comprising a display region, a hole region located in the display region, and an encapsulation region located between the display region and the hole region, the preparation method of the display substrate comprising: forming at least two isolation structures on a substrate, the at least two isolation structures are arranged at intervals along a direction parallel to the substrate; forming a functional layer on a side of the at least two isolation structures away from the substrate; forming at least one hollow region in the functional layer, at least part of each hollow region is located on a side of the at least one isolation structure close to the display region.

21. The method of manufacturing the display substrate according to claim 20, wherein forming at least one hollow region in the functional layer comprises: forming at least one hollow region in the functional layer by using a patterned etching process.

22. The method of manufacturing the display substrate according to claim 20, wherein, forming at least one hollow region in the functional layer comprises: forming at least one hollow region in the functional layer by using a half-tone mask process.

23. The method of manufacturing the display substrate according to claim 20, wherein forming at least one hollow region in the functional layer comprises: forming at least one hollow region in the functional layer by using a photoetching process.

24. The method of manufacturing the display substrate according to claim 20, wherein forming at least one hollow region in the functional layer comprises: forming a functional layer comprising at least one hollow region by using a patterning process.

25. The method of manufacturing the display substrate according to claim 20, wherein, forming at least one hollow region in the functional layer comprises: forming at least one hollow region in the functional layer by using a laser etching process.

26. The method of manufacturing the display substrate according to claim 20, wherein forming a functional layer on a side of the at least two isolation structures away from the substrate comprises: forming a light-emitting material layer on a side of the at least two isolation structures away from the substrate; forming a second electrode material layer and an inorganic encapsulation material layer on a side of the light-emitting material layer away from the substrate in sequence, the second electrode material layer and the inorganic encapsulation material layer form the functional layer; or, forming a light-emitting material layer, a second electrode material layer and an inorganic encapsulation material layer on a side of the at least two isolation structures away from the substrate in sequence, the light-emitting material layer, the second electrode material layer and the inorganic encapsulation material layer form the functional layer; or, forming a light-emitting material layer on a side of the at least two isolation structures away from the substrate; forming a second electrode material layer on a side of the light-emitting material layer away from the substrate, the second electrode material layer forms the functional layer.

27. The method of producing a display substrate according to claim 20, wherein Before forming at least two isolation structures on a substrate, further comprising: forming at least one conductive layer on the substrate, the conductive layer forms a gate electrode in the display region, and the conductive layer forms a conductive pattern in the encapsulation region; forming the at least two isolation structures on a side of the conductive pattern away from the substrate, at least one of the isolation structures overlapping a footprint of the conductive pattern on the substrate.

28. The manufacturing method of display substrate according to claim 20, comprising: forming at least two isolation structure groups on the substrate, each of the isolation structure groups comprising at least two isolation structures arranged at intervals along a direction parallel to the substrate, and a flat area provided between adjacent two isolation structures; forming a light-emitting layer material on a side of the at least two isolation structure groups away from the substrate; forming a second electrode material on a side of the light-emitting layer material away from the substrate; forming a hollowed-out area in the second electrode material, the hollowed-out area overlapping a footprint of the flat area between adjacent two isolation structure groups on the substrate.

29. A display device comprising the display substrate according to any one of claims 1 to 19.

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