Method for temperature management of a 3D measuring system, 3D measuring system, method for providing a 3D measuring system, and computer program

Abstract

The invention relates to a method for temperature management, in particular for thermal stabilisation, of a 3D measuring system which is designed to optically detect three-dimensional (3D) objects in the surroundings and to determine therefrom a digital three-dimensional image of the objects, wherein the 3D measuring system has one or more temperature sensors for detecting temperature values at one of the plurality of points of the 3D measuring system, characterised in that a temperature model of the 3D measuring system or at least individual system components of the 3D measuring system is provided, wherein the temperature model describes the thermal behaviour of the 3D measuring system or parts thereof, wherein on the basis of the temperature model and taking into consideration the temperature values measured by means of the temperature sensor or temperature sensors, temperature data at different points of the 3D measuring system are spatially and / or temporally predicted.

Description

[0001] Method for temperature management of a 3D measurement system, 3D measurement system, method for providing a 3D measurement system and computer program

[0002] The invention relates to a method for temperature management, in particular for thermal stabilization, of a 3D measuring system configured to optically detect three-dimensional (3D) objects in the environment and to determine a digital three-dimensional image of the objects from this detection. The 3D measuring system has one or more temperature sensors for detecting temperature values ​​at one or more locations within the 3D measuring system. The invention further relates to a 3D measuring system with multiple system components and one or more temperature sensors, as well as a temperature management device configured to carry out such a method. The invention also relates to a method for providing a 3D measuring system with multiple system components and a computer program.

[0003] Such a 3D measuring system can be, for example, an optical measuring system, such as a fringe projection system. Such a 3D measuring system is described, for example, in DE 20 2016 004 550 U1.

[0004] Such 3D measurement systems have temperature-sensitive components that must be in a thermally stable state to perform precise, calibrated measurements. Accordingly, these 3D measurement systems have a warm-up period after being switched on. During this warm-up period, no 3D measurements can yet be performed using the 3D measurement system. During the warm-up period, the system components are switched on, and a sensor temperature level is established depending on the ambient temperature. The 3D measurement system can then enter a standby mode. For this to work, it is advantageous if the ambient temperature and the calibration temperature of the 3D measurement system are close to each other. Performing measurements with the 3D measurement system at varying ambient temperatures, especially outside a predefined temperature range, is often only possible with limitations such as frequent recalibration.

[0005] If the 3D measurement system is in a thermally stable state, it can switch to measurement mode, in which, for example, the light projection occurs at full power. In measurement mode, the power consumption of the system components may increase compared to standby mode. To keep the temperature level as constant as possible in measurement mode, the fan speeds of the 3D measurement system can be increased and / or decreased during the measurement; that is, temperature control can be achieved by controlling the fans.

[0006] There are 3D measurement systems with sensors that have a duty cycle. After a measurement sequence, a cooling period is applied so that the sensor returns to its standby temperature. If the sensor temperature rises too high, it may need to be recalibrated, or one may have to wait until the sensor reaches a suitable temperature for use again.

[0007] Depending on the design of the temperature management of a 3D measurement system, one or more of the following disadvantages may occur:

[0008] 1. High energy consumption

[0009] 2. Reduction in the service life of certain system components due to thermal effects

[0010] 3. Extended measurement times due to required cooling times to limit heat input

[0011] 4. Requirement of a constant ambient temperature in the measurement environment during a measurement cycle.

[0012] The invention is based on the objective of improving such 3D measurement systems in order to minimize one or more of the aforementioned disadvantages.

[0013] This task is solved in a method of the type mentioned above by having a temperature model of the 3D measurement system or at least of individual system components of the 3D measurement system. The temperature model describes the thermal behavior of the 3D measurement system or parts thereof. Based on the temperature model and taking into account the temperature values ​​measured by the temperature sensor(s), temperature data at various locations within the 3D measurement system are predicted spatially and / or temporally. Using such a temperature model, the temperature behavior of the 3D measurement system can be virtually modulated during operation, for example, by means of a simulation computer program that cyclically calculates the temperature model. In this way, a significantly more precise determination of temperature values ​​on and within the 3D measurement system is possible, particularly at a significantly larger number of locations within the 3D measurement system.

[0014] Furthermore, temporal prediction is possible, allowing, for example, a reduction in the warm-up time of the 3D measurement system. It also becomes possible to design the entire 3D measurement system for a lower operating temperature, thus protecting system components by reducing thermal stress. This also minimizes the frequency of recalibrations due to thermal effects. Measurement times can also be reduced, as cooling times can be shortened or eliminated entirely. The temperature model can be created using suitable modeling software, such as Modelica.

[0015] Spatial temperature prediction allows the temperature model to determine temperatures at points within the 3D measurement system that are not equipped with temperature sensors. Temporal temperature prediction allows the temperature model to predict temperatures and / or temperature changes at various locations within the 3D measurement system over time.

[0016] The temperature model can, for example, be a digital temperature model that is cyclically calculated by a computer to determine the temperature data. The temperature model has as input at least the temperature values ​​measured by the temperature sensor(s) and can also have as further input one or more of the temperature data determined by the temperature model in a previous iteration. In this way, the temperature data determined by the temperature model can be fed back as input, so to speak, recursively. The method according to the invention, and in particular the temperature model, can be implemented without finite element models or finite element calculations, so that the computational effort and thus the computation time for a calculation of the temperature model can be minimized. The temperature model can, for example,The 3D measurement system is modeled by inserting thermal resistors, thermal capacitances, or other thermal substitute components between the simulated system components. The 3D measurement system can determine the digital three-dimensional image of the objects, for example, in the form of a 3D point cloud. Temperature management in the previously described method can be implemented, for example, by a temperature management device that incorporates the temperature model.

[0017] According to an advantageous embodiment of the invention, the temperatures at one or more points of the 3D measurement system are stabilized to predetermined setpoints based on the temperature data determined by the temperature model. This is achieved by controlling and / or regulating system components of the 3D measurement system. In this way, individual points of the 3D measurement system can be selectively stabilized to desired temperature setpoints. This can be accomplished, for example, by selectively switching system components on or off and / or regulating the power consumed by the system components.

[0018] The temperature model allows for the description of system components of the 3D measurement system, various operating modes of the 3D measurement system, external parameters of the 3D measurement system such as the ambient temperature, a defined set of measurement points where a temperature sensor is located, and all relevant thermal connections between these elements. The system components modeled in the temperature model can include, in particular, heat sources, heat sinks and / or heat transfers, and thermal conductors. The system operating parameters can include, for example, the fan speed of one or more fans, the operating power of one or more cooling elements (Peltier elements), the operating power of one or more heating elements, and other operating parameters.This includes operating streams as well as information about planned measurement sequences to be carried out with the 3D measurement system and / or information about planned movements of a robot with which the 3D measurement system can be moved.

[0019] The external parameters can include, for example, the air temperature, the humidity, other heat sources and / or heat sinks in the environment such as air currents or robots that emit heat.

[0020] Thermal connections can be, for example, connections where heat is transferred by radiation, convection, thermally conductive materials, heat pipes, fans, and / or other elements. Using the temperature model, one or more of the previously described system components, such as fan speeds, Peltier currents, etc., can be controlled to thermally stabilize the 3D measurement system.

[0021] Using the temperature model, the dynamic and / or quasi-static internal thermal state of the 3D measurement system can be inferred from the measured temperature values.

[0022] Spatial prediction enables temperature control of individual system components, such as a DMD, using the temperature model, even in locations where no temperature sensor is present or cannot be installed. The temperature model allows for targeted control of the 3D measurement system, enabling more precise direct or indirect cooling and / or heating of the respective system components. Indirect cooling / heating means that components not directly connected to a cooling or heating element can also be cooled or heated via the temperature control loops.

[0023] Inverting the temperature model enables particularly efficient thermal stabilization of the 3D measurement system. The model can therefore be used to selectively influence the temperature of the 3D measurement system or parts thereof. For example, a target temperature can be specified at one or more points within the 3D measurement system, and the temperature management can be carried out using the inverted temperature model or an iterative process to achieve the desired target temperature at that point or those points.

[0024] According to an advantageous embodiment of the invention, the temperature model is modified, in particular parameterized and / or calibrated, during the operation of the 3D measurement system by evaluating the temperature values ​​measured by the temperature sensor(s), the temperature data determined by the temperature model, and / or other input data. In this way, the temperature model can be continuously optimized automatically, making its predictions even more precise. Furthermore, the temperature model can adapt to the changing thermal properties of certain system components over the lifetime of the 3D measurement system. For example, this function can automatically identify which details in the 3D measurement system are relevant and require their own parameters. The temperature model can, for example, be self-modifying, i.e., have an integrated modification function.It can also be modified by an external modification function. This modification function can, for example, include ML (Machine Learning) and / or AI (Artificial Intelligence) algorithms.

[0025] According to an advantageous embodiment of the invention, the temperatures of system components relevant for the calibration of the 3D measurement system are thermally stabilized by means of the temperature model. In this way, the required recalibrations of the 3D measurement system can be significantly reduced. For example, light projection components and / or cameras of the 3D measurement system can be thermally stabilized in this way.

[0026] According to an advantageous embodiment of the invention, one or more system components of the 3D measurement system are predictively heated or cooled using the temperature model in order to reach a desired target temperature in a reduced time. This reduces the time required to reach standby mode, i.e., the time to reach standby mode is accelerated by shortening the warm-up time. This is achieved using the dynamic temperature behavior described by the temperature model and the ability to design the system for a lower operating temperature level using the temperature model.

[0027] According to an advantageous embodiment of the invention, the ambient temperature of the 3D measurement system is measured, and the measured ambient temperature values ​​are fed to the temperature model as input. The temperature management of the 3D measurement system is then carried out using the temperature model, taking the measured ambient temperature values ​​into account. In this way, the 3D measurement system can be brought to a desired target temperature particularly effectively and quickly using the temperature model. Furthermore, the 3D measurement system can be used more efficiently even at elevated ambient temperatures or with temperature gradients, and requires fewer recalibration procedures.

[0028] According to an advantageous embodiment of the invention, the temperature model also incorporates thermal influences of future, planned measurements of the 3D measurement system as input variables and uses them for temperature management. For this purpose, data about the planned measurements, stored in a memory, can be fed into the temperature model and processed by the model to perform temperature management. To integrate the data about the planned measurements, the temperature model can be extended with a processing function adapted for this purpose. In many cases, for example, the course and duration of heat input into the 3D measurement system are known or can be estimated relatively accurately. For example, optimization of the 3D measurement system's travel paths, optimization of the measurement modes, and predictive temperature control can be implemented.This approach enables model-based thermal optimization of the planned measurements, resulting in high thermal stability. Furthermore, it saves time and improves the quality of the measurement results.

[0029] According to an advantageous embodiment of the invention, the next required calibration of the 3D measurement system is predicted using the temperature model. This also saves time and improves the quality of the measurement results. It is thus possible to know early on when a measurement break for calibration is necessary. Such measurement breaks can then be better used for the thermal stabilization of the 3D measurement system. In particular, this allows for better planning of the measurement sequence.

[0030] According to an advantageous embodiment of the invention, the 3D measurement system has a temperature management device that compensates for temperature-dependent changes in the calibration parameters of the 3D measurement system. The temperature management device uses temperature data, determined at least by the temperature model, as input data for compensating the temperature-dependent changes in the calibration parameters. Because the temperature model and the temperature management device can also take the temperature-dependent changes in the calibration parameters into account, correct measurement results can be obtained even if the calibration is no longer fully valid. The temperature management device can be implemented as an additional software function. In particular, a partial behavior of the 3D measurement system is often known and can be compensated for algorithmically in this way.This also allows for improved measurement quality and a reduced number of calibrations. Furthermore, a wider temperature range can be used for the 3D measurement system.

[0031] According to an advantageous embodiment of the invention, a specified temperature behavior of the 3D measurement system is compared with the temperature data determined by the temperature model, and a condition assessment of the 3D measurement system is performed based on this comparison. In this way, the 3D measurement system can be monitored throughout its service life. For example, health monitoring of the 3D measurement system or individual system components can be performed; that is, aging processes, the failure of system components, or their potential damage can be predicted, and corresponding indications of necessary maintenance or repairs can be provided. It is also possible to perform a final inspection of a newly manufactured 3D measurement system using this function, i.e., to check whether the actual temperature distribution in the 3D measurement system corresponds to a known typical temperature distribution.

[0032] The aforementioned task is also solved by a 3D measurement system with several system components and one or more temperature sensors, wherein the 3D measurement system has at least one temperature management device that interacts with a temperature model of the 3D measurement system or at least individual system components of the 3D measurement system, and wherein the temperature management device is configured to carry out a temperature management method of the type described above. The advantages described above can also be realized in this way. For example, the temperature data TD determined by the temperature model can be supplied to the temperature management device as input data.

[0033] The temperature model can be stored, for example, as computer-readable data in a part of the 3D measurement system, the temperature management unit, or another device. The temperature management unit can be integrated into the 3D measurement system, for example, by being structurally incorporated into a unit containing the optical components of the 3D measurement system. Alternatively, the temperature management unit can be structurally separate, for example, in the form of a separate computer, such as a dedicated personal computer.

[0034] In a further embodiment of the invention, the described temperature model of the 3D measurement system or its system components can also be advantageously used in the provision or development of the 3D measurement system. For example, during the development process, a simulation computer program can be used to thermally simulate the 3D measurement system in real-world operation using the temperature model. Based on the simulation results, system components of the 3D measurement system can be optimized with regard to thermal stabilization during real-world operation, and / or the temperature management and / or operating modes of the 3D measurement system can be optimized. Thus, a thermally improved real-world 3D measurement system can be manufactured based on the simulation results.

[0035] Advantageously, the same temperature model used in the previously described method for determining the operating time of the 3D measurement system can be employed here. This allows for the optimization of the 3D measurement system's development with minimal effort, enabling the targeted adjustment of individual heat or cold sources, for example, regarding their positioning within the 3D measurement system, their operating parameters such as power consumption, or their design. For instance, the cooling or heating capacity and thermal insulation can be dimensioned, and the optimization can also include the ability to reduce or switch off system components using a holistic control system. This allows, for example, a standby mode for the 3D measurement system in which certain system components are switched off or operated at reduced power, particularly the projection unit and possibly the cameras.

[0036] According to an advantageous embodiment of the invention, the 3D measurement system is optimized for faster attainment of a ready-to-use mode by means of a simulation computer program, thereby shortening the warm-up time and using the dynamic temperature behavior described by the temperature model. This allows the 3D measurement system to be ready for use more quickly in real-world operation.

[0037] According to an advantageous embodiment of the invention, the 3D measuring system is designed for a reduced operating temperature level using a simulation computer program and a temperature model. This has the advantage that the individual system components of the 3D measuring system are subjected to less stress due to the reduced temperature input, resulting in a longer service life.

[0038] According to an advantageous embodiment of the invention, the 3D measuring system is designed for an expanded usable ambient temperature range, within which it can be used without recalibration, by means of a simulation computer program using the temperature model. This makes the 3D measuring system more universally applicable, even in ambient temperature ranges that were previously problematic for such systems. The aforementioned problem is also solved by a computer program equipped with program code for carrying out a method of the type described above, when the computer program is executed on a computer.

[0039] Where a computer is mentioned, it may be configured to run a computer program, e.g., in the sense of software. The computer may be a standard commercial computer, e.g., a PC, laptop, notebook, tablet, or smartphone, or a microprocessor, microcontroller, or FPGA, or a combination of such elements.

[0040] The invention is explained in more detail below with reference to exemplary embodiments and drawings.

[0041] They show

[0042] Figure 1 shows a 3D measurement system with its system components,

[0043] Figure 2 shows a model of the thermal behavior of the 3D measurement system, Figure 3 shows a temperature model of a part of the 3D measurement system, and Figure 4 shows a temperature management system for the 3D measurement system.

[0044] The 3D measuring system 1 shown in Figure 1 has a housing 12, e.g., an aluminum housing. The 3D measuring system 1 has a projection unit 2, 3, which includes an arrangement of light sources 2, e.g., LEDs or laser diodes, and an angled beam guiding element 3. Furthermore, an image generation unit 4 is present. Two cameras 6, 8 are arranged on a beam 5 in a fixed relative orientation, and a projector lens 7 is positioned between the cameras 6, 8. Light from the projection unit 2, 3 can be emitted into the environment via the projector lens 7, e.g., a striped pattern. The housing 12 has transparent panels 13 on the front, allowing light to pass through the front panel 13 of the housing 12 at this point. Electronic circuit boards 11 are located in the rear part of the housing 12, which are configured for controlling and powering the individual components and for communication with an external computer.Furthermore, cooling systems 9, 10 are arranged in this area, which may include, for example, Peltier elements, aluminum blocks as heat sinks, heat pipes, finned heat exchangers, and / or fans. These components are installed in the housing 12. Openings for the heat pipes and the projection unit 2, 3 may be located in the rear of the housing 12, and possibly also openings to allow air exchange with the environment. The projection unit 2, 3 is the component of the 3D measurement system that emits light into the environment via the projector lens 7, generating, for example, a striped pattern required for three-dimensional surface measurement.

[0045] The light sources 2 of the projection unit can be integrated into a copper block. The beam guide element 3 transforms the individual beams of the light sources 2 into a homogeneous beam and directs them to the image generation unit 4. The image generation unit 4 can be a metal block containing various components such as a digital mirror device (DMD) or a liquid crystal display (LCD) for generating the fringe pattern, one or more Peltier elements, and / or one or more prisms or mirrors.

[0046] As can be seen in Figure 1, temperature sensors, marked with a "T", are attached to various points on the 3D measuring system and its components. These temperature sensors measure temperature values ​​at different locations, which can then be used in the temperature model described below. Various components, such as the DMD or LCD, are particularly temperature-sensitive and must not overheat. Excessive thermal stress significantly reduces their lifespan and also leads to mechanical stress, which can, for example, impair the adjustability of the individual micromirrors.

[0047] The main heat dissipation from the system to the environment occurs via the heat exchangers with downstream fans in the cooling systems 9 and 10. To ensure continuous operation of the measuring system at constant temperatures, protecting the individual components from overheating is crucial. For this purpose, a model of the thermal behavior of the 3D measuring system 1 is proposed, as illustrated by Figure 2. The modeling can be carried out, for example, by dividing the 3D measuring system 1 into subcomponents for modeling purposes and determining the thermal relationships between the individual subcomponents and with the environment, capturing them in a respective sub-model.Figure 2 shows that the thermal relationships between the components can be separately recorded and modeled with regard to the different heat transfer modes such as convection (abbreviated: KO), conduction (abbreviated: WL), and radiation (abbreviated: WS) in order to create a particularly accurate temperature model. Figure 2 shows, as examples, the following modeled subcomponents: the housing 12 (abbreviated: G), the beam 5 (abbreviated: B), the projection unit 2, 3 with the image generation unit 4 (abbreviated: PE), the air in the sensor (abbreviated: A), and the environment (abbreviated: U).

[0048] Using the modeling described in Figure 2, a thermal model is then determined with the help of a thermal equivalent circuit, as shown in Figure 3. Figure 3 shows an example section of the complete thermal model, where the thermal relationships in the projection unit 2, 3 and the image generation unit 4 are modeled. The thermal capacitances of the individual components are represented by circuit symbols that correspond to capacitors in electrical circuit diagrams. The thermal resistances of the different heat conduction modes are represented by circuit symbols that correspond to resistors in electrical circuit diagrams.The equivalent circuit diagram formed in this way is then calculated in a computer program, taking into account the input variables, in particular the values ​​of the temperature sensors T, similar to an electrical circuit diagram, and temperature data are spatially and / or temporally predicted as output variables in the 3D measurement system 1.

[0049] Figure 4 illustrates the temperature management process of the 3D measurement system 1. The 3D measurement system 1 is shown, and its temperature values ​​TW, determined by temperature sensors T, are fed to the temperature model 40. Within the temperature model 40, the described calculations determine temperature data TD, for example, future temperatures at specific locations within the 3D measurement system and / or temperature data TD at locations within the 3D measurement system 1 where no temperature sensors T are present. The temperature data TD is fed to a temperature management unit 41, which evaluates this temperature data TD and generates control signals for various components of the 3D measurement system 1. These control signals can be used, for example, to switch fans, Peltier elements, and other components of the 3D measurement system on or off, or to regulate their power consumption.These control signals are determined by the temperature management device 41 in such a way that the desired temperature management of the 3D measurement system 1 is achieved, in particular the stabilization of the temperatures of certain system components at predetermined setpoints. Some or all of the temperature data TD determined by the temperature model 40 can also be provided to the temperature model 40 as new input variables via a feedback loop 42.

[0050] *****

Claims

Patent claims:

1. A method for temperature management, in particular for thermal stabilization, of a 3D measurement system (1) configured to optically detect three-dimensional (3D) objects in the environment and to determine a digital three-dimensional image of the objects from this detection, wherein the 3D measurement system (1) has one or more temperature sensors (T) for detecting temperature values ​​(TW) at one or more locations of the 3D measurement system (1), characterized in that a temperature model (40) of the 3D measurement system (1) or at least individual system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) of the 3D measurement system (1) is provided, wherein the temperature model (40) describes the thermal behavior of the 3D measurement system (1) or parts thereof.where, based on the temperature model (40) and taking into account the temperature values ​​(TW) measured by means of the temperature sensor (T) or temperature sensors (T), temperature data (TD) are spatially and / or temporally predicted at various points of the 3D measurement system (1).

2. Method according to claim 1, characterized in that, based on the temperature data (TD) determined by the temperature model (40), the temperatures at one or more points of the 3D measuring system (1) are stabilized to predetermined setpoints by controlling and / or regulating system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) of the 3D measuring system (1).

3. Method according to one of the preceding claims, characterized in that the temperature model (40) is modified, in particular parameterized and / or calibrated, by evaluating the temperature values ​​(TW) measured by means of the temperature sensor (T) or temperature sensors (T) during the operating time of the 3D measurement system (1), the temperature data (TD) determined by the temperature model (40) and / or other input data.

4. Method according to one of the preceding claims, characterized in that the temperatures of system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) relevant for the calibration of the 3D measuring system (1) are thermally stabilized by means of the temperature model (40).

5. Method according to one of the preceding claims, characterized in that by means of the temperature model (40) one or more system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11 , 12) of the 3D measuring system (1) are predictively heated or cooled in order to reach a desired target temperature in a reduced time.

6. Method according to one of the preceding claims, characterized in that the ambient temperature of the 3D measuring system (1) is measured and the measured ambient temperature values ​​are supplied to the temperature model (40) as an input variable, wherein the temperature management of the 3D measuring system (1) is carried out by means of the temperature model (40) taking into account the measured ambient temperature values.

7. Method according to one of the preceding claims, characterized in that the temperature model (40) also takes into account thermal influence factors of future, planned measurements of the 3D measurement system (1) as input variables and uses them for temperature management.

8. Method according to one of the preceding claims, characterized in that the next required calibration of the 3D measuring system (1) is predicted using the temperature model (40).

9. Method according to one of the preceding claims, characterized in that the 3D measuring system (1) has a temperature management device (41) by which a temperature-dependent change of calibration parameters of the 3D measuring system (1) is compensated, wherein the temperature management device (41) uses as input data at least temperature data (TD) determined by the temperature model (40) for the compensation of the temperature-dependent change of calibration parameters.

10. Method according to one of the preceding claims, characterized in that a specified temperature behavior of the 3D measurement system (1) is compared with the temperature data (TD) determined by the temperature model (40) and a condition assessment of the 3D measurement system (1) is carried out on the basis of the comparison.

11. 3D measuring system (1) with several system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) and one or more temperature sensors (T), wherein the 3D measuring system (1) has at least one temperature management device (41) which interacts with a temperature model (40) of the 3D measuring system (1) or at least individual system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) of the 3D measuring system (1), wherein the temperature management device (41) is configured to carry out a method for temperature management according to one of the preceding claims.

12. Method for providing a 3D measurement system (1) with several system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12), characterized in that the 3D measurement system (1) is simulated in real operation by means of a temperature model (40) using a simulation computer program and, based on the simulation results, system components (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12) of the 3D measurement system (1) are optimized with regard to thermal stabilization in the real operation of the 3D measurement system (1) and / or the temperature management and / or operating modes of the 3D measurement system (1) are optimized.

13. Method according to claim 12, characterized in that the 3D measuring system (1) is optimized by means of the simulation computer program for a faster achievement of a ready mode by shortening the warm-up time with the help of the dynamic temperature behavior described by the temperature model (40).

14. Method according to claim 12 or 13, characterized in that the 3D measuring system (1) is designed for a reduced temperature level at the operating point using the simulation computer program and the temperature model (40).

15. Method according to one of claims 12 to 14, characterized in that the 3D measuring system (1) is designed for an increased usable ambient temperature range in which the 3D measuring system (1) can be used without recalibration by means of the simulation computer program using the temperature model (40).

16. Computer program equipped with program code means for carrying out the method according to one of claims 12 to 15, when the computer program is executed on a computer. *****

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