BMS manufacturing system, BMS manufacturing method, and battery manufacturing system

Abstract

According to some embodiments, a battery management system (BMS) manufacturing system comprises: a coating device configured to apply a coating material to a BMS circuit including circuit components mounted on a circuit board; a curing device configured to irradiate the surface of the BMS circuit with curing light to cure the coating material; and a test device configured to perform a functional test of the BMS circuit to cause the BMS circuit to generate heat in order to thermally treat a portion of the coating material that is not exposed to the curing light.

Description

BMS manufacturing system, BMS manufacturing method and battery manufacturing system

[0001] Cross-citation with related applications

[0002] This application claims the benefit of priority to Republic of Korea Patent Application No. 10-2024-0100851, filed July 30, 2024, the entire contents of which are incorporated herein by reference.

[0003] Technology field

[0004] The embodiments disclosed in this document relate to a BMS manufacturing system, a BMS manufacturing method, and a battery manufacturing system.

[0005] Recently, active research and development has been conducted on secondary batteries. The term "secondary battery" refers to a rechargeable battery, encompassing both conventional Ni / Cd and Ni / MH batteries, as well as recent lithium-ion batteries. Among secondary batteries, lithium-ion batteries can boast higher energy densities than conventional Ni / Cd and Ni / MH batteries. They can be manufactured in small and lightweight designs, making them highly versatile power sources for mobile devices. Recently, their use has expanded to include power sources for electric vehicles, attracting attention as a next-generation energy storage medium.

[0006] A battery management system (BMS) can be utilized to control the charging and discharging operations of battery cells and perform various management functions. A BMS circuit can be manufactured by mounting BMS components on a circuit board and then applying a polymer coating material to the components. The coating material applied to the BMS circuit can be cured using UV irradiation or other methods. Curing the coating material may require separate heat treatment or natural drying, which can increase the manufacturing time of the BMS circuit.

[0007] The purpose of the embodiments disclosed in this document includes providing a BMS manufacturing system, a BMS manufacturing method, and a battery manufacturing system capable of performing curing of a coating material using a functional inspection step to improve the manufacturing efficiency of a BMS circuit.

[0008] The technical objectives of the embodiments disclosed in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the descriptions below.

[0009] According to some embodiments, a BMS manufacturing system includes a coating device configured to apply a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board; a curing device configured to irradiate curing light onto a surface of the BMS circuit to cure the coating material; and an inspection device configured to perform a functional inspection of the BMS circuit to perform a heat treatment on a portion of the coating material that is not exposed to the curing light, thereby causing heat generation in the BMS circuit.

[0010] According to some embodiments, the coating material comprises a photoinitiator and the curing light comprises ultraviolet light.

[0011] According to some embodiments, the photoinitiator applied to the upper surface of the circuit components is directly exposed to the ultraviolet light, and the photoinitiator applied to the side and lower surfaces of the circuit components is partially exposed to the ultraviolet light.

[0012] According to some embodiments, the circuit components include a first component having a height-to-area ratio exceeding a first reference value and a second component having an area-to-height ratio exceeding a second reference value.

[0013] According to some embodiments, the coating material applied to the side of the first component and the coating material applied to the lower surface of the second component are further cured by heat generation from the BMS circuit.

[0014] According to some embodiments, the functional test comprises at least one of a first test for a cell balancing function of the BMS circuit and a second test for a full computation function of the BMS circuit.

[0015] According to some embodiments, the BMS manufacturing system further includes a transport device configured to sequentially transport the BMS circuit to a battery packaging device via the coating device, the curing device, and the inspection device.

[0016] According to some embodiments, a method for manufacturing a BMS includes the steps of applying a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board through a coating device; irradiating a curing light on a surface of the BMS circuit to cure the coating material through a curing device; and performing a function test of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to the curing light through an inspection device, thereby causing heat generation of the BMS circuit.

[0017] According to some embodiments, the coating material comprises a photoinitiator and the curing light comprises ultraviolet light.

[0018] According to some embodiments, the photoinitiator applied to the upper surface of the circuit components is directly exposed to the ultraviolet light, and the photoinitiator applied to the side and lower surfaces of the circuit components is partially exposed to the ultraviolet light.

[0019] According to some embodiments, the circuit components include a first component having a height-to-area ratio exceeding a first reference value and a second component having an area-to-height ratio exceeding a second reference value.

[0020] According to some embodiments, the coating material applied to the side of the first component and the coating material applied to the lower surface of the second component are further cured by heat generation from the BMS circuit.

[0021] According to some embodiments, the functional test comprises at least one of a first test for a cell balancing function of the BMS circuit and a second test for a full computation function of the BMS circuit.

[0022] According to some embodiments, the BMS manufacturing method further includes a step of sequentially transporting the BMS circuit to a battery packaging device through the coating device, the curing device, and the inspection device via a transport device.

[0023] According to some embodiments, a battery manufacturing system includes a printing device configured to form a battery management system (BMS) circuit by mounting circuit components on a circuit board; a BMS manufacturing system configured to apply a coating material to the BMS circuit, irradiate a curing light on a surface of the BMS circuit to harden the coating material, and perform a heat treatment on a portion of the coating material that is not exposed to the curing light to perform a functional test of the BMS circuit to cause heat generation of the BMS circuit; and a packaging device configured to package the BMS circuit that has passed the functional test together with a battery.

[0024] According to embodiments disclosed in this document, a BMS manufacturing system, a BMS manufacturing method, and a battery manufacturing system can be provided that can perform curing of a coating material using a functional inspection step to improve manufacturing efficiency of a BMS circuit.

[0025] The technical effects according to the embodiments disclosed in this document are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art according to the disclosure of this document.

[0026] FIG. 1 illustrates elements constituting a battery manufacturing system according to some embodiments.

[0027] FIG. 2 illustrates elements constituting a BMS manufacturing system according to some embodiments.

[0028] Figures 3 and 4 illustrate a conventional technique for applying a coating material to a BMS circuit and curing it.

[0029] FIGS. 5 and 6 illustrate a method of further curing an uncured coating material using heat generated by a functional test of a BMS circuit according to some embodiments.

[0030] FIG. 7 illustrates steps constituting a BMS manufacturing method according to some embodiments.

[0031] Hereinafter, embodiments described in this document are described with reference to the attached drawings. However, this is not intended to limit the disclosure of this document to specific embodiments, and it should be understood that various modifications, equivalents, and / or alternatives of the embodiments described in this document are included.

[0032] The embodiments and terminology used in this document are not intended to limit the technical features described in this document to a specific embodiment, but should be understood to encompass various modifications, equivalents, or alternatives of the embodiment. In connection with the description of the drawings, similar reference numerals may be used to refer to similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise.

[0033] In this document, the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", "first", "second", "A", "B", "(a)", or "(b)" may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order) unless specifically stated otherwise.

[0034] In this document, when a component (e.g., a first component) is referred to as being “connected,” “coupled,” or “connected,” with or without the terms “functionally” or “communicatively,” or “coupled” or “connected,” it means that the component can be connected to the other component directly (e.g., wired or wirelessly), or indirectly (e.g., via a third component).

[0035] The methods according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory, CD-ROM), or may be distributed online (e.g., downloaded or uploaded) through an application store or directly between two user devices. In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0036] According to the embodiments disclosed in this document, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to the embodiments disclosed in this document, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to the embodiments disclosed in this document, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0037] FIG. 1 illustrates elements constituting a battery manufacturing system according to some embodiments.

[0038] Referring to FIG. 1, the battery manufacturing system (100) may include a printing device (110), a BMS manufacturing system (120), and a packaging device (130). However, the present invention is not limited thereto, and some components may be omitted from the battery manufacturing system (100), or other components may be further included in the battery manufacturing system (100).

[0039] A battery manufacturing system (100) can manufacture a battery pack. The battery manufacturing system (100) can perform packaging of a BMS circuit and a battery to produce a battery pack. The BMS circuit can be manufactured by a printing device (110) and a BMS manufacturing system (120).

[0040] The printing device (110) can generate a printed circuit using a PCB printing technique. The printed circuit can include circuit components mounted on a circuit board. The BMS manufacturing system (120) can perform post-processing on the printed circuit to generate the BMS circuit. The post-processing on the printed circuit can include conformal coating processing, curing processing for the coating material, etc. Once the BMS circuit is completed, the packaging device (130) can package the BMS circuit and the battery to form a battery pack.

[0041] FIG. 2 illustrates elements constituting a BMS manufacturing system according to some embodiments.

[0042] Referring to FIG. 2, the BMS manufacturing system (120) may include a coating device (121), a curing device (122), and an inspection device (123). However, the present invention is not limited thereto, and some components may be omitted from the BMS manufacturing system (120), or other components may be further included in the BMS manufacturing system (120).

[0043] The coating device (121) can perform conformal coating on the BMS circuit. Conformal coating may involve coating components mounted on a circuit board with a coating material, such as a polymer, to protect the components and ensure smooth operation. The coating device (121) may include means for spraying, brushing, or depositing a coating solution.

[0044] The curing device (122) can cure the coating material applied to the circuit board and circuit components of the BMS circuit. The curing device (122) can irradiate light such as ultraviolet (UV) rays to the coating material to induce a chemical reaction in the coating material, thereby increasing the hardness of the coating material. The curing device (122) can include a structure such as a lamp or light source for irradiating light such as ultraviolet (UV) rays.

[0045] The inspection device (123) can perform a test on the functions of the BMS circuit. The BMS circuit is mounted on a battery pack and can measure the status of battery cells to generate battery data. The BMS circuit can perform various processes on the battery data to perform charge / discharge control, battery cell balancing, battery cell status diagnosis, and battery status index calculation. Whether the functions of the BMS circuit are operating normally can be tested by the inspection device (123). According to an embodiment, heat may be generated from the circuit board and circuit components by performing a function test of the BMS circuit, and this heat may be used to further cure the coating material that has not yet been cured. The inspection device (123) may include a control means and / or a processing means for directing the operation of the BMS circuit.

[0046] A coating device (121) may be configured to apply a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board. The coating device (121) may include a means for applying the coating material, through which the coating material may be sprayed, brushed, or deposited on the circuit board and circuit components. The coating of the coating device (121) may be a conformal coating for protecting a printed circuit board (PCB). The coating material may be acrylic, polyurethane, silicone, urethane, epoxy, or a combination thereof.

[0047] The curing device (122) may be configured to irradiate curing light onto the surface of the BMS circuit to cure the coating material. The curing device (122) may include a lamp, a light source, or the like for generating light of a specific frequency, and may use the same to irradiate the curing light onto the coating material. The curing light may induce a reaction in the coating material, thereby changing its arrangement structure, physical properties, etc. When the curing light is irradiated, the hardness and strength of the coating material may increase.

[0048] The inspection device (123) may be configured to perform a functional test of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to curing light, thereby causing heat generation in the BMS circuit. When the functional test is performed on the BMS circuit, circuit components of the BMS circuit may perform computational tasks, which may cause heat to be generated from the circuit board and circuit components. Portions of the coating material that are not directly exposed to curing light may not yet be fully cured, which may be further cured by the heat generation of the BMS circuit. In an embodiment, the functional test on the BMS circuit may be performed at a higher level than that of a typical product test, which may cause the BMS circuit to emit a greater amount of heat.

[0049] According to an embodiment, the coating material may include a photoinitiator, and the curing light may include ultraviolet light. The ultraviolet (UV) light can supply energy to the photoinitiator of the coating material, and the photoinitiator can convert monomers or oligomers among the coating components that have not yet become polymers into polymers. The conformal coating technique using the photoinitiator and UV light can shorten the time required for coating curing, thereby achieving high productivity. Meanwhile, since the conformal coating technique does not use diluents, solvents, etc., it can be classified as an environmentally friendly coating technique.

[0050] In an embodiment, the photoinitiator applied to the upper surface of the circuit components may be directly exposed to UV light, and the photoinitiator applied to the side and lower surfaces of the circuit components may be partially exposed to UV light. To enhance the efficiency of the curing process using UV light, the UV lamp / light source may irradiate UV light in a single, predetermined direction. Therefore, unlike the upper surface of the circuit components, which is directly exposed to UV light, the coating material applied to the side and lower surfaces may be incompletely cured.

[0051] In an embodiment, the circuit components may include a first component having a height-wise extension type in which a height-to-area ratio exceeds a first reference value and a second component having an area-wise extension type in which a height-to-area ratio exceeds a second reference value. The efficiency of curing by UV light may vary depending on the structure or shape of the circuit components. The first component having a relatively large height or the second component having a relatively large area may have a region that is not exposed to UV light, and in these cases, some of the coating material may remain uncured. In an embodiment, the first component may include a capacitor element or the like structurally having a large height-to-area ratio, and the second component may include an MCU chip, a processor chip, or the like configured with a large area for high cooling efficiency.

[0052] According to an embodiment, the coating material applied to the side surface of the first component and the coating material applied to the lower surface of the second component can be further cured by heat generated by the BMS circuit. When the functional test is performed, the BMS circuit can perform computational processing, and the computational processing can generate heat from the substrate and components of the BMS circuit. This heat generation can replace a thermal curing process and / or a natural drying process that are separately performed to completely cure the uncured coating material. In other words, it may be possible to omit the thermal curing process and / or the natural drying process by utilizing the heat generated during the functional test.

[0053] In an embodiment, the functional test may include at least one of a first test for the cell balancing function of the BMS circuit and a second test for the full computation function of the BMS circuit. The functional test may include a type of test that causes heat generation of the circuit board and circuit components. For example, the cell balancing function and the full computation function may generate a large amount of heat, and thus, these tests may be utilized for additional curing of the coating material. In an embodiment, the functional test for the BMS circuit may be performed at a higher level than a typical shipping performance test and may cause a higher level of heat generation.

[0054] According to an embodiment, the BMS manufacturing system (120) may further include a transport device configured to sequentially transport the BMS circuit to the battery packaging device (130) via the coating device (121), the curing device (122), and the inspection device (123). For example, the transport device may include a transport means such as a conveyor belt and / or a gripping means such as a robot arm. When additional curing of the uncured coating material is completed along with the functional inspection in the inspection device (123), the BMS circuit may be transported to the packaging device (130) instead of being transported to the heat treatment device or the natural drying device. That is, the heat treatment process and / or the natural drying process may be omitted as the inspection device (123) performs the additional drying.

[0055] Figures 3 and 4 illustrate a conventional technique for applying a coating material to a BMS circuit and curing it.

[0056] Referring to FIG. 3, a conventional technique for applying a coating material to a BMS circuit and curing the same may be illustrated. The coating material (340) may be applied to the first component (320), the second component (330), and the circuit board (350), and a UV lamp (310) may cure the coating material (340).

[0057] The uncured material (360) may not be directly exposed to the curing light of the UV lamp (310). The uncured material (360) may be present on the side of the first part (320) and the bottom of the second part (330). Conventional techniques may additionally perform a thermal curing treatment and / or a natural drying treatment prior to the packaging process to perform additional curing on the uncured material (360).

[0058] Referring to FIG. 4, a conventional technique for applying a coating material to a BMS circuit and curing the same may be illustrated. The conventional technique may sequentially perform PCB printing (410), coating (420), UV curing (430), thermal curing (440), functional testing (450), and packaging (460).

[0059] PCB printing (410) may include solder print work, solder paste inspection (SPI) work, surface-mount technology (SMT), reflow work, and automated optical inspection (AOI). Conventional techniques may include thermal curing (440) between UV curing (430) and functional inspection (450). Alternatively, conventional techniques may include a natural drying process instead of thermal curing (440). Conventional natural drying processes may typically take a long time, such as 7 to 14 days at room temperature, which may significantly reduce manufacturing efficiency. On the other hand, the BMS manufacturing system (120) may not include thermal curing (440) and / or natural drying processes.

[0060] FIGS. 5 and 6 illustrate a method of further curing an uncured coating material using heat generated by a functional test of a BMS circuit according to some embodiments.

[0061] Referring to FIG. 5, a method for further curing an uncured coating material using heat generated through a functional test of a BMS circuit may be illustrated. An uncured portion of the coating material (530) applied to the side of the first component (510) or the lower surface of the second component (520) may be further cured by heat generated by the circuit board (540) and / or circuit components.

[0062] Functional testing may be essential to determine whether the basic functions of the BMS circuit are operating normally. If certain functions of the BMS circuit, such as cell balancing or MCU full computation, that may increase the ambient temperature are utilized, subsequent thermal curing can be performed simultaneously on areas that remain uncured after UV curing. This can reduce the manufacturing cycle time of the BMS circuit because it does not require additional processing.

[0063] Referring to FIG. 6, the operation sequence of the BMS manufacturing system (120) may be illustrated. The BMS manufacturing system (120) may perform coating (620), UV curing (630), and functional inspection (640) on a BMS circuit produced by PCB printing (610), and packaging (650) may be performed on the BMS circuit that has undergone the functional inspection (640).

[0064] In the BMS manufacturing system (120), the functional test (640) can be performed simultaneously with additional curing of the uncured coating material. The functional test (640) can perform subsequent thermal curing without separate curing equipment or facilities by implementing a self-heating function in software. This can reduce the number of processes and lower equipment investment costs. The software-based self-heating function does not affect the performance of the BMS circuit and can be performed within the functional test of the EOL (end of line) stage. The self-heating function can be performed within the normal operating temperature range. For example, the self-heating function can be performed at a temperature of approximately 60 degrees within the normal operating temperature range.

[0065] FIG. 7 illustrates steps constituting a BMS manufacturing method according to some embodiments.

[0066] Referring to FIG. 7, the BMS manufacturing method (700) may include steps (710) to (730). However, the present invention is not limited thereto, and some steps may be omitted or other general steps may be added, and the steps of the BMS manufacturing method (700) may be executed in a different order than the illustrated order.

[0067] The BMS manufacturing method (700) may be composed of steps that are processed in a time-series manner in the BMS manufacturing system (120). Therefore, even if the content is omitted below, the content described above for the BMS manufacturing system (120) may be equally applied to the BMS manufacturing method (700).

[0068] Steps (710) to (730) of the BMS manufacturing method (700) can be performed by the coating device (121), the curing device (122), and the inspection device (123) of the BMS manufacturing system (120).

[0069] In step (710), the BMS manufacturing system (120) can perform a step of applying a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board through a coating device.

[0070] In step (720), the BMS manufacturing system (120) can perform a step of irradiating curing light onto the surface of the BMS circuit to cure the coating material through a curing device.

[0071] In step (730), the BMS manufacturing system (120) may perform a function test of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to curing light through an inspection device, thereby causing heat generation in the BMS circuit.

[0072] According to an embodiment, the BMS manufacturing method (700) may be implemented in the form of a computer program stored on a computer-readable storage medium. That is, the computer program may include instructions for implementing the BMS manufacturing method (700), and the instructions of the program may be stored on a computer-readable storage medium. The computer program may include a mobile application.

[0073] According to an embodiment, the computer-readable storage medium may include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs, DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute computer program instructions such as ROMs, RAMs, flash memories, and the like. The computer program instructions may include machine language codes generated by a compiler and high-level language codes that can be executed by a computer using an interpreter, etc.

[0074] The terms "include," "comprise," or "have" used herein, unless otherwise specifically stated, imply that the corresponding component may be included, and therefore should be interpreted to include other components rather than to exclude other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the embodiments disclosed in this document pertain, unless otherwise defined. Commonly used terms, such as terms defined in dictionaries, should be interpreted to be consistent with their contextual meaning in the relevant art, and shall not be interpreted in an idealized or overly formal sense, unless explicitly defined in this document.

[0075] The above description is merely an illustrative description of the technical idea disclosed in this document, and those skilled in the art to which the embodiments disclosed in this document pertain may make various modifications and variations without departing from the essential characteristics of the embodiments disclosed in this document. Therefore, the embodiments disclosed in this document are not intended to limit the technical idea of ​​the embodiments disclosed in this document, but to explain it, and the scope of the technical idea disclosed in this document is not limited by these embodiments. The protection scope of the technical idea disclosed in this document should be interpreted by the claims below, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of rights of this document.

Claims

1. A coating device configured to apply a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board; A curing device configured to irradiate curing light onto the surface of the BMS circuit to cure the coating material; and A BMS manufacturing system comprising an inspection device configured to induce heat generation of the BMS circuit by performing a functional inspection of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to the curing light.

2. In paragraph 1, The above coating material contains a photoinitiator, A BMS manufacturing system wherein the above curing light includes ultraviolet light.

3. In paragraph 2, The photoinitiator applied to the upper surface of the above circuit components is directly exposed to the ultraviolet light, A BMS manufacturing system in which a photoinitiator applied to the side and bottom surfaces of the circuit components is partially exposed to the ultraviolet light.

4. In paragraph 3, A BMS manufacturing system, wherein the circuit components include a first component having a height-wise extension type in which a height-to-area ratio exceeds a first reference value and a second component having an area-wise extension type in which a height-to-area ratio exceeds a second reference value.

5. In paragraph 4, A BMS manufacturing system, wherein the coating material applied to the side of the first component and the coating material applied to the lower surface of the second component are additionally hardened by heat generation from the BMS circuit.

6. In paragraph 1, A BMS manufacturing system, wherein the functional test includes at least one of a first test for a cell balancing function of the BMS circuit and a second test for a full computation function of the BMS circuit.

7. In paragraph 1, A BMS manufacturing system further comprising a transport device configured to sequentially transport the BMS circuit to a battery packaging device via the coating device, the curing device, and the inspection device.

8. A step of applying a coating material to a battery management system (BMS) circuit including circuit components mounted on a circuit board through a coating device; A step of irradiating curing light onto the surface of the BMS circuit to cure the coating material through a curing device; and A method for manufacturing a BMS, comprising a step of performing a functional test of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to the curing light through an inspection device, thereby causing heat generation in the BMS circuit.

9. In paragraph 8, The above coating material contains a photoinitiator, A method for manufacturing a BMS, wherein the curing light comprises ultraviolet light.

10. In paragraph 9, The photoinitiator applied to the upper surface of the above circuit components is directly exposed to the ultraviolet light, A method for manufacturing a BMS, wherein the photoinitiator applied to the side and bottom surfaces of the circuit components is partially exposed to the ultraviolet light.

11. In paragraph 10, A method for manufacturing a BMS, wherein the circuit components include a first component having a height-wise extension type in which a height-to-area ratio exceeds a first reference value and a second component having an area-wise extension type in which a height-to-area ratio exceeds a second reference value.

12. In paragraph 11, A method for manufacturing a BMS, wherein the coating material applied to the side of the first component and the coating material applied to the lower surface of the second component are additionally hardened by heat generation from the BMS circuit.

13. In paragraph 8, A method for manufacturing a BMS, wherein the functional test includes at least one of a first test for a cell balancing function of the BMS circuit and a second test for a full computation function of the BMS circuit.

14. In paragraph 8, A method for manufacturing a BMS, further comprising the step of sequentially transporting the BMS circuit to a battery packaging device through the coating device, the curing device, and the inspection device via a transport device.

15. A printing device configured to form a battery management system (BMS) circuit by mounting circuit components on a circuit board; A BMS manufacturing system configured to apply a coating material to the BMS circuit, irradiate curing light on the surface of the BMS circuit to harden the coating material, and perform a functional inspection of the BMS circuit to perform heat treatment on a portion of the coating material that is not exposed to the curing light, thereby causing heat generation of the BMS circuit; and A battery manufacturing system comprising a packaging device configured to package the BMS circuit that has passed the above functional test together with the battery.

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