Systems and method for large-scale optical manufacturing

Abstract

The problem of large-scale optical manufacturing of microstructures that does not require the use of alignment marks patterned onto a surface (100) is addressed by the systems and methods disclosed herein. The systems (201) and methods utilize at least one line sensor to detect scattered and / or reflected measurement light from a first portion of the surface (100), e.g.. from microstructures located within the first portion of the surface (100), and to determine a position and / or orientation of the first portion of the surface (100). The systems (201) and methods then use the determined position and / or orientation to move and / or rotate an irradiation module (210) and / or the surface (100) based on the position and / or orientation. The irradiation module (100) then directs processing light (212) to a second portion of the surface (100) to thereby form microstructures in the second portion of the surface (100).

Description

SYSTEMS AND METHOD FOR LARGE-SCALE OPTICAL MANUFACTURINGCROSS-REFERENCE

[0001] The present application claims priority to U.S. Provisional Patent Application No. 63 / 678,505, filed August 1 , 2024, entitled “SYSTEMS AND METHODS FOR TARGESCALE OPTICAL MANUFACTURING,” which is entirely incorporated herein by reference for all purposes.BACKGROUND OF THE INVENTION

[0002] Optical systems, such as laser systems, may be utilized to perform manufacturing operations. For example, laser systems may be used to ablate, bum, or etch material from the surface of an object in order to produce three-dimensional (3D) patterns in the object. Such systems find use in manufacturing a variety of patterns for a variety of applications. For example, such systems may be used to pattern surfaces with aerodynamic riblets. Such riblets may reduce aerodynamic drag on surfaces such as the wings, fuselage, or propeller of an aircraft, or the blades of a wind or gas turbine. The systems may also be used to pattern other micro-structures. However, the surface area on which such micro-structures are to be patterned often greatly exceeds a field-of-view (FOV) of the optical system used to pattern the micro-structures. The FOV may be expanded using a variety of optical components such as lenses and telescopes, but this reduces the spatial resolution and limits the microstructures that can be produced. Thus, it is often necessary to sub-divide the surface area into a plurality of regions and to pattern the micro-structures on each region. For instance, riblets on nearby regions should be aligned to maximize aerodynamic efficiency, which requires precise alignment of the optical system to each region.BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings.

[0004] FIG. 1A shows a schematic depicting an exemplary' surface comprising a first region containing a first set of riblets and a second region on which a second set of riblets is to be patterned.

[0005] FIG. IB shows a schematic depicting an exemplary surface comprising the first region containing the first set of riblets and the second region containing a second set of riblets.

[0006] FIG. 2A shows a schematic depicting an exemplary' system for large-scaleoptical manufacturing that does not require the use of alignment marks patterned onto a surface.

[0007] FIG. 2B shows a schematic depicting a first exemplary embodiment of the system depicted in FIG. 2A.

[0008] FIG. 2C shows a schematic depicting an XZ plane view of an irradiation module of the system depicted in FIG. 2B.

[0009] FIG. 2D shows a schematic depicting a YZ plane view of the irradiation module of the system depicted in FIG. 2B.

[0010] FIG. 2E shows a schematic depicting a second exemplary embodiments of the system depicted in FIG. 2A.

[0011] FIG. 3 A shows a schematic depicting a first exemplary measurement module for use with the systems and methods described herein.

[0012] FIG. 3B shows an exemplary' optical signal detected by the first line sensor or the second line sensor depicted in FIG. 3A.

[0013] FIG. 3C shows an exemplary optical signal detected by the third line sensor or the fourth line sensor depicted in FIG. 3A.

[0014] FIG. 4 shows a schematic depicting a second exemplary' measurement module for use with the systems and methods described herein.

[0015] FIG. 5 shows a schematic depicting a third exemplary' measurement module for use with the systems and methods described herein.

[0016] FIG. 6A shows a schematic depicting a fourth exemplary measurement module for use with the systems and methods described herein, when the fourth exemplary measurement module is used to write a first set of riblets in a first region of a surface.

[0017] FIG. 6B shows a schematic depicting a fourth exemplary' measurement module for use with the systems and methods described herein, when the fourth exemplary measurement module is used to write a second set of riblets in a second region of a surface.

[0018] FIG. 6C shows a schematic depicting a fourth exemplary measurement module for use with the systems and methods described herein, when the fourth exemplary measurement module is used to write a third set of riblets in a third region of a surface.

[0019] FIG. 6D shows a schematic depicting a fourth exemplary measurement module for use with the systems and methods described herein, when the fourth exemplary measurement module is used to write a fourth set of riblets in a fourth region of a surface.

[0020] FIG. 7 shows a flowchart depicting a first exemplary' method for large-scale optical manufacturing that does not require the use of alignment marks patterned onto a surface.

[0021] FIG. 8 shows a flowchart depicting a second exemplary method for large-scaleoptical manufacturing that does not require the use of alignment marks patterned onto a surface.

[0022] FIG. 9 shows a block diagram of a computer system used in some embodiments to perform portions of methods for large-scale optical manufacturing described herein.DETAILED DESCRIPTION

[0023] The invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and / or a processor, such as a processor configured to execute instructions stored on and / or provided by a memory coupled to the processor. In this specification, these implementations, or any other form that the invention may take, may be referred to as techniques. In general, the order of the steps of disclosed processes may be altered within the scope of the invention. Unless stated otherwise, a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task. As used herein, the term ‘"processor” refers to one or more devices, circuits, and / or processing cores configured to process data, such as computer program instructions.

[0024] A detailed description of one or more embodiments of the invention is provided below along with accompanying figures that illustrate the principles of the invention. The invention is described in connection with such embodiments, but the invention is not limited to any embodiment. The scope of the invention is limited only by the claims and the invention encompasses numerous alternatives, modifications and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the invention. These details are provided for the purpose of example and the invention may be practiced according to the claims without some or all of these specific details. For the purpose of clarity, technical material that is known in the technical fields related to the invention has not been described in detail so that the invention is not unnecessarily obscured.

[0025] As used herein, the term “or” shall convey both disjunctive and conjunctive meanings, unless any such meaning is impossible. For instance, the phrase “A or B” shall be interpreted to include element A alone, element B alone, and the combination of elements A and B, unless any such meaning is impossible. Similarly, the phrase “A, B, or C” shall be interpreted to include element A alone, element B alone, element C alone, the combination of elements A and B but not C. the combination of elements A and C but not B. the combination of elements B and C but not A, and the combination of elements A, B, and C, unless any suchmeaning is impossible.

[0026] Unless otherwise specified, a range of values, when recited, includes both the upper and lower limits of the range, as well as any sub-ranges therebetween. Unless indicated otherwise, terms such as “first,” “second,” etc. are only used to distinguish one element from another. For example, one node could be termed a “first node” and similarly, another node could be termed a “second node.” or vice versa.

[0027] Unless indicated otherwise, the term “about,” “thereabout.” “approximately,” etc. means that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and / or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error, and the like, and other factors known to those of skill in the art. Spatially relative terms, such as “below,” “beneath,” “lower,” “above,” and “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature, as illustrated in the FIGs. It should be recognized that the spatially relative terms are intended to encompass different orientations in addition to the orientation depicted in the FIGs. For example, if an object in the FIGs. is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. An object may be otherwise oriented (e.g.. rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0028] Recent advances in optical manufacturing systems allow the use of short, high- power optical pulses to ablate, bum, or etch material from the surface of an obj ect in order to produce three-dimensional (3D) patterns in the object. Such systems find use in manufacturing a variety of patterns for a variety of applications. For example, such systems may be used to pattern surfaces with aerodynamic riblets. Such riblets may reduce aerodynamic drag on surfaces such as the wings, fuselage, or propeller of an aircraft, or the blades of a wind or gas turbine. The systems may also be used to pattern other micro-structures.

[0029] However, the surface area on which such micro-structures are to be patterned often greatly exceeds a field-of-view (FOV) of the optical system used to pattern the microstructures. The FOV may be expanded using a variety of optical components such as lenses and telescopes, but this reduces the spatial resolution and limits the micro-structures that can be produced. Thus, it is often necessary' to sub-divide the surface area into a plurality' of regions and to pattern the micro-structures on each region. For instance, riblets on nearby regions should be aligned to maximize aerodynamic efficiency, which requires precise alignment ofthe optical system to each region.

[0030] Previous methods and systems have solved this issued by patterning alignment marks onto each region. However, this requires the optical system to be used to pattern and find the alignment marks, increasing the time required to pattern the surface and reducing throughput. Moreover, such alignment marks can suffer from patterning errors or degradation, reducing micro-structure patterning accuracy.

[0031] Accordingly, the problem of large-scale optical manufacturing of microstructures that does not require the use of alignment marks patterned onto a surface is addressed by the systems and methods for large-scale optical manufacturing disclosed herein. The systems and methods utilize a measurement module comprising at least one line sensor to receive scattered and / or reflected light from at least a portion of a surface and to determine a position and / or orientation of the portion of the surface relative to an irradiation module. The irradiation module processes a plurality of regions on the surface to, for instance, ablate, bum, or etch microstructures (such as riblets) into each region of the surface. The measurement module then uses information contained within the scattered and / or reflected light to ensure that the microstructures are properly aligned between the various regions. For instance, the measurement module may be configured to determine a first position and / or orientation of a first set of riblets in a first region of the plurality' of regions. A movement module may then move and / or rotate the irradiation module and / or the surface in order to permit the irradiation module to direct light to ablate, bum, or etch a second set of riblets from a second region of the plurality of regions. Such a process may be repeated a plurality of times to form riblets or other microstructures on any number of regions to, for instance, pattern an entire surface with riblets or microstructures.

[0032] FIGs. 1A-1B depict the problem to be solved using the systems and methods disclosed herein. FIG. 1A shows a schematic depicting an exemplary' surface 100 comprising a first region 110 containing a first set of riblets 112 and a second region 120 on which a second set of riblets is to be patterned. In some embodiments, the surface 100 comprises a wing of an aircraft. In some embodiments, the surface 100 comprises a fuselage of an aircraft. In some embodiments, the surface 100 comprises a propeller of an aircraft. In some embodiments, the surface 100 comprises a tail of an aircraft. In some embodiments, the surface 100 comprises a blade of a wind turbine. In some embodiments, the surface 100 comprises a blade of a gas turbine. In the example shown, the first set of riblets 112 are depicted as aligned along an x- axis of the page. Note that neither the first region 110 nor the second region 120 contains any temporary or permanent alignment marks in or on the first region 1 10 or the second region.Thus, the position and / or orientation of the first region 110 (and thus the surface 100) must be determined in order to ensure that the second set of riblets is properly formed in the second region 120. The systems and methods described herein recognize that the first set of riblets 112 can provide information about such a position and / or orientation.

[0033] FIG. IB shows a schematic depicting an exemplar}' surface 100 comprising the first region 110 containing the first set of riblets 112 and the second region 120 containing a second set of riblets 122. In the example shown, both the first set of riblets 112 and the second set of riblets 122 are depicted as aligned along the x-axis of the page. That is, the first set of riblets 112 and the second set of riblets 122 have been aligned to form a substantially continuous set of riblets that are aligned in a substantially similar direction and / or orientation. The systems and methods described herein describe how to form such substantially continuous sets of riblets, or how to go from the situation depicted in FIG. 1A (lacking the second set of riblets) to the situation depicted in FIG. IB (in which the second set of riblets has been formed).

[0034] Although FIGs. 1A-1B depict only two regions in which two sets of riblets are formed, the systems and methods described herein may be used to generate any number of sets of riblets in any number of regions. In some embodiments, the systems and methods described herein are used to formulate a plurality of sets of riblets in a plurality of regions. For instance, the systems and methods described herein may be used to formulate at least about 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, or more sets of riblets in at least about 2, 3, 4, 5,6, 7, 8. 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, or more regions, at most about 100, 90, 80,70, 60, 50, 40, 30, 20, 10, 9, 8, 7, 6, 5, 4, 3, or 2 sets of riblets in at most about 100, 90, 80, 70,60, 50, 40, 30, 20, 10, 9, 8, 7, 6, 5, 4, 3, or 2 regions, or a number of sets of riblets in a number of regions that is within a range defined by any two of the preceding values. In some embodiments, the plurality of regions are arranged in a line (i.e.. with regions having neighboring regions only along the x-axis depicted in FIGs. 1 A-1B or along the y-axis depicted in FIGs. 1A-1B). In some embodiments, the plurality of regions are arranged in a two- dimensional (2D) array (i.e., with regions having neighboring regions along the x-axis depicted in FIGs. 1A-1B and along the y-axis depicted in FIGs. 1A-1B).

[0035] FIG. 2A shows a schematic depicting an exemplary system 200 for large-scale optical manufacturing that does not require the use of alignment marks patterned onto a surface. In the example shown, the system 200 comprises an irradiation module 210. In some embodiments, the irradiation module 210 is configured to direct irradiation light 212 to a surface 100. In some embodiments, the surface 100 comprises the surface 100 described herein with respect to FIGs. 1A-1B. In some embodiments, the surface 100 comprises a plurality ofregions (not depicted in FIG. 2A). In some embodiments, each region is configured to support microstructures (such as riblets) ablated, burned, or etched therefrom. In some embodiments, each region comprises at least one coat of paint (such as at least one pigmented or nonpigmented coat of paint, at least one base coat of paint, at least one top coat of paint, or at least one clear coat of paint). In some embodiments, the irradiation module 210 is configured to direct the processing light 212 to the regions to ablate, bum, or etch the at least one coat of paint to thereby form the microstructures. In some embodiments, the irradiation module 210 comprises at least one first light source (not shown in FIG. 2A) configured to direct the processing light 212 to the surface 100. In some embodiments, the at least one first light source comprises at least one laser light source configured to direct laser light to the surface 100.

[0036] In some embodiments, two adjacent sets of riblets (such as the first and second sets of riblets described herein with respect to FIGs. 1 A-1B) may partially overlap (i.e., an end of one riblet of the first set of riblets may overlap with an end of one riblet of the second set of riblets). Such partial overlap may occur, for instance, due to slight (e.g., micron or sub-micron) optical misalignments. Using the same optical power for the processing light 212 could thus result in excessive ablation, burning, or etching in the portion of the two sets of riblets which overlap. Thus, in some embodiments, the irradiation module 210 is configured to vary the optical power of the processing light 212 between a first optical power and a second optical power. In some embodiments, the first optical power is used when ablating, burning, or etching non-overlapping portions of two adjacent sets of riblets. In some embodiments, the second optical power is used when ablating, burning, or etching overlapping portions of the two adjacent sets of riblets. In some embodiments, the first and second optical powers are chosen such that a first level of ablation, burning, or etching the non-overlapping portions of the first and second sets of riblets is substantially equal to a second level of ablation, burning, or etching in the overlapping portion. For instance, in some embodiments, the second optical power is lower than the first optical power. In some embodiments, using a lower optical power when ablating, burning, or etching the overlapping portions reduces the likelihood of excessive ablation, burning, or etching in the overlapping portion. In some embodiments, a ratio between the first optical power and the second optical power is at least about 2, 3, 4. 5, 6, 7. 8, 9, 10, or more, at most about 10, 9, 8, 7, 6, 5, 4, 3, or 2, or within a range defined by any two of the preceding values. In some embodiments, the overlapping portion has a length of at least about 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, or more of the length of a riblet, at most about 10%. 9%, 8%, 7%. 6%, 5%, 4%. 3%, 2%, 1% of the length of a riblet, or a portion of the length of a riblet that is within a range defined by any two of the preceding values. In someembodiments, the overlapping region has a length at least about 100 micrometers (pm), 200 pm, 300 pm, 400 pm, 500 pm, 600 pm, 700 pm, 800 pm, 900 pm, 1 millimeter (mm). 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, or more, at most about 10 mm, 9 mm, 8 mm, 7 mm, 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, 1 mm, 900 pm, 800 pm, 700 pm, 600 pm, 500 pm, 400 pm, 300 pm, 200 pm, 100 pm, or less, or a length that is within a range defined by any two of the preceding values. The use of two different optical powers may also permit the intentional overlapping of adjacent sets of riblets. Such intentional overlapping may substantially reduce the likelihood of gaps between adjacent sets of riblets, thereby increasing riblet efficiency.

[0037] In some embodiments, the irradiation module 210 is configured to direct measurement light 214 to the surface 100. In some embodiments, the measurement light 214 is scattered and / or reflected from at least a portion of the surface 100 (such as a region of the surface 100, as described herein) to form scattered and / or reflected measurement light 216. In some embodiments, the irradiation module 210 comprises at least one second light source (not shown in FIG. 2 A) configured to direct the measurement light 214 to the surface 100.

[0038] In the example shown, irradiation module 210 is configured to direct the processing light 212 and the measurement light 214 at an angle to a normal to the surface 100. In some embodiments, the angle is at least about 0 degrees, 5 degrees, 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, or 45 degrees, 50 degrees, 55 degrees, 60 degrees. 65 degrees, 70 degrees, 75 degrees. 80 degrees, 85 degrees, or more, at most about 85 degrees, 80 degrees, 75 degrees, 70 degrees, 65 degrees, 60 degrees, 55 degrees, 50 degrees, 45 degrees, 40 degrees, 35 degrees, 30 degrees, 25 degrees, 20 degrees, 15 degrees, 10 degrees. 5 degrees, or less, or within a range defined by any two of the preceding values.

[0039] In the example shown, the system 200 comprises a measurement module 220. In some embodiments, the measurement module 220 is configured to receive the scattered and / or reflected measurement light 216 from the portion of the surface 100. In some embodiments, the measurement module 220 is configured to determine a position and / or orientation of the portion of the surface 100 relative to the irradiation module 210 based on the scattered and / or reflected measurement light, as described herein. In some embodiments, the measurement module is configured to determine a first position and / or orientation of a first set of riblets (such as the first set of riblets 112 described herein with respect to FIGs. 1A-1B) ablated, burned, or etched from a first region (such as the first region 110 described herein with respect to FIGs. 1A-1B) of a plurality of regions on the surface 100. In some embodiments, the measurement module 220 comprises at least one line sensor (not shown in FIG. 2A) configuredto receive the scattered and / or reflected measurement light 216. In some embodiments, the at least one line sensor is associated with a frame rate of at least about 1 kilohertz (kHz). 2 kHz,3 kHz, 4 kHz, 5 kHz, 6 kHz, 7 kHz, 8 kHz, 9 kHz, 10 kHz, 20 kHz, 30 kHz, 40 kHz, 50 kHz, 60 kHz, 70 kHz, 80 kHz, 90 kHz, 100 kHz, or more, at most about 100 kHz, 90 kHz, 80 kHz, 70 kHz, 60 kHz, 50 kHz, 40 kHz, 30 kHz, 20 kHz, 10 kHz, 9 kHz, 8 kHz, 7 kHz, 6 kHz, 5 kHz,4 kHz, 3 kHz, 2 kHz, 1 kHz, or less, or a frame rate that is within a range defined by any two of the preceding values. In some embodiments, the measurement module 220 comprises 2 line sensors (as depicted in FIG. 4), 3 line sensors, 4 line sensors (as depicted in FIG. 3A, FIG. 5, and FIG. 6), or more line sensors. In some embodiments, the measurement module 220 comprises any of measurement modules 300, 400, 500, and 600 described herein with respect to FIG. 3A, FIG. 4, FIG. 5, and FIG. 6 respectively.

[0040] In the example shown, the system 200 comprises a movement module 230. In some embodiments, the movement module 230 is configured to move and / or rotate the irradiation module 210 and / or the surface 100 based on the position and / or the orientation of the portion of the surface 100 determined by the measurement module 220. In some embodiments, the movement module 230 is configured to move and / or rotate the irradiation module 210 and / or the surface 100 based on the first position and / or orientation of the first set of riblets (such as the first set of riblets 112 described herein with respect to FIGs. 1A-1B) ablated, burned, or etched from the first region (such as the first region 110 described herein with respect to FIGs. 1A-1B) of the plurality of regions on the surface 100. In some embodiments, the movement module 230 is configured to move and / or rotate the irradiation module 210 and / or the surface 100 in order to permit the irradiation module 210 to direct the processing light 212 to ablate, bum, or etch a second set of riblets (such as the second set of riblets 122 described herein with respect to FIG. IB) from a second region (such as the second region 110 described herein with respect to FIGs. 1A-1B) of the plurality of regions. In some embodiments, the movement module 230 is configured to move and / or rotate the irradiation module 210 and / or the surface 100 such that the first and second sets of riblets are aligned in a substantially similar direction (e g., both along the x-axis as depicted in FIG. IB).

[0041] Although FIG. 2A describes the irradiation module 210 as containing the second light source (and thus directing the measurement light 214 to the surface 100), the person having ordinary skill in the art will recognize that other configurations are possible. For instance, the measurement module 220 may contain the second light source (and thus direct the measurement light 214 to the surface 100) instead of the irradiation module 210.

[0042] FIG. 2B shows a schematic depicting a first exemplary embodiment 201 of thesystem depicted in FIG. 2A. In the example shown in FIG. 2B, the embodiment 201 includes an irradiation module 210 configured to direct irradiation light 212 toward an object surface 100. The irradiation light 212 may be referred to as processing light. In some embodiments, the irradiation module 210 is configured to direct measurement light 214 to the surface 100, as described herein. In some embodiments, the measurement light 214 is scattered and / or reflected from at least a portion of the surface 100 (such as a region of the surface 100, as described herein) to form scattered and / or reflected measurement light 216. The embodiment 201 may also comprise a measurement module 220, a movement module 230, and a tracker 240.

[0043] FIG. 2C shows a schematic depicting an XZ plane view of the irradiation module 210 of the embodiment 201 depicted in FIG. 2B. FIG. 2D shows a schematic depicting a YZ plane view of the irradiation module 210 of the embodiment 201 depicted in FIG. 2B. As shown in FIGs. 2C-2D, the irradiation module 210 may be equipped with a light irradiation device 2100 that irradiates the irradiation light 212 as a processing light onto the surface 100 of an object. The irradiation device 2100 may be equipped with a metrology frame 218 mounting a measurement device (which may be part of a measurement module 220 described herein). The metrology frame 218 may be equipped with first, second, third, and fourth line lasers 2231, 2232, 2233, and 2234, respectively, for forming a line-shaped irradiation area on the surface 100. Additionally, the metrology7frame 218 may be equipped with first, second, third, and fourth line sensors 2241, 2242, 2243, and 2244, respectively, for measuring laser lines projected onto the surface 100 by the line lasers 2231, 2232, 2233. and 2234. Further depicted is a topology sensor 225 for measuring a topology of the surface 100. In the example shown in FIGs. 2C 2D, the topology' sensor 225 is attached to the metrology' frame 218.

[0044] As will be described in more detail below, the line sensors 2241, 2242, 2243, and 2244 capture images of laser lines projected by the line lasers 2231, 2232, 2233, and 2234 and detect ends of regions with riblets formed on the surface 100. In some embodiments, a two- dimensional image sensor may be used instead of the line sensors 2241, 2242, 2243, and 2244. Furthermore, instead of laser lines, patterns of different shapes, such as a cross pattern, may be projected onto the surface 100.

[0045] Returning to the description of FIG. 2B. the measurement module 220 may include a laser marker 221 for forming a line-shaped irradiation area or a line on the surface 100. This laser marker 221 may be installed on a floor FL by a post 222.

[0046] The embodiment 201 may be equipped with a tracker 240 that irradiates the laser marker 221 with measurement light 241 to measure its position and / or orientation, thereby detecting the line on the surface 100. For example, the tracker 240 can irradiate lasermarker 221 with measurement light 241 to measure its position and / or orientation thereby determining a relative position and / or orientation, with respect to the surface 100, of a laser line projected onto the surface 100 by the laser marker 221. The tracker 240 may measure a position and / or orientation of the irradiation module 210 by irradiating the irradiation module 210 or a reflector attached to the irradiation module 210 with measurement light 242.

[0047] Instead of or in addition to projecting laser lines onto the surface 100 by the laser marker 221, a line or line-shaped mark may be provided on the surface 100. The line or line-shaped mark may take the form of tape on the surface 100.

[0048] Furthermore, instead of projecting laser lines onto the surface 100 by the laser marker 221, a pattern having a shape different from a line pattern, for example a cross pattern, may be projected onto the surface 100.

[0049] The embodiment 201 may include a movement module 230 configured to move the irradiation module 210 and a part of the measurement module 220. The movement module 230 may include a robot arm 231 that moves the irradiation module 210 as an end effector. The robot arm 231 may also be provided with a moving device 232 that moves the robot arm 231 on the floor FL. The moving device 232 may be equipped with an autonomous mobile robot (AMR) or an automated guide vehicle (AGV).

[0050] FIG. 2E shows a schematic depicting a second exemplary embodiment 202 of the system depicted in FIG. 2A. The embodiment 202 depicted in FIG. 2E differs from the embodiment 201 depicted in FIG. 2B in that the laser marker 221 that is part of the measurement module 220 is mounted on the object surface 100 by the post 222.

[0051] FIG. 3A shows a schematic depicting a first exemplary' measurement module 300 for use with the systems and methods described herein. In the example shown, the measurement module 300 is used to detect a position and / or orientation of a first set of riblets 112 in a first region 110 of a surface 100 and to permit the systems and methods described herein to accurately position and / or orient a second set of riblets (not shown in FIG. 3A) in a second region 120 of the surface 100. In some embodiments, the measurement module 300 comprises a first line sensor 310. a second line sensor 320, a third line sensor 330, and a fourth line sensor 340. In some embodiments, the first line sensor 310, second line sensor 320. third line sensor 330, and fourth line sensor 340 have any frame rate described herein with respect to FIG. 2A. In some embodiments, the first line sensor 310 and the second line sensor 320 are arranged substantially parallel to the first set of riblets 112 (i.e., parallel to the x-axis as depicted in FIG. 3 A). Thus, in some embodiments, the first line sensor 310 and the second line sensor 320 are configured to detect x coordinates at which one or more riblets of the first set of riblets112 end. For instance, as depicted in FIG. 3A, the first line sensor 310 is configured to detect an x coordinate at which one riblet of the first set of riblets 112 ends and the second line sensor 320 is configured to detect an x coordinate at which a different riblet of the first set of riblets 112 ends. In some embodiments, the third line sensor 330 and the fourth line sensor 340 are arranged substantially perpendicular to the first line sensor 310 and the second line sensor 320 (i.e., parallel to the y-axis as depicted in FIG. 3 A). Thus, in some embodiments, the third line sensor 330 and the fourth line sensor 340 are configured to detect y coordinates at which the first set of riblets ends (i.e., an upper edge and a lower edge of the first set of riblets 112). The x coordinates detected by the first line sensor 310 and the second line sensor 320 and the y coordinates detected by the third line sensor 330 and the fourth line sensor 340 can also be used to detect rotations about the z-axis, which can be corrected using the movement module 230 described herein with respect to FIG. 2A.

[0052] In some embodiments, the measurement module 300 further comprises 1, 2, 3, or 4 lenses (such as 1, 2, 3, or 4 cylindrical lens, not shown in FIG. 3A) located between the surface 100 and any 1, 2, 3. or 4 of the first line sensor 310, the second line sensor 320, the third line sensor 330, and the fourth line sensor 340. In some embodiments, the lenses are configured to direct light from multiple riblets of the first set of riblets to any 1, 2, 3, or 4 of the first line sensor 310, the second line sensor 320, the third line sensor 330, and the fourth line sensor 340. In some embodiments, the lenses are configured to increase the signal-to-noise ratio or fidelity of measurements by averaging measurements from multiple riblets of the first set of riblets 1 12.

[0053] FIG. 3B shows an exemplary' optical signal detected by the first line sensor 310 or the second line sensor 320 depicted in FIG. 3A. As shown in FIG. 3B, pixels from the first line sensor 310 or the second line sensor 320 that detect light scattered or reflected from the first set of riblets 112 register a first optical signal, such as the low optical signal depicted in FIG. 3B. Pixels from the first line sensor 310 or the second line sensor 320 that detect light scattered or reflected from outside the first region 110 (such as from the second region 120) register a second optical signal different from the first optical signal, such as the high optical signal depicted in FIG. 3B. A right edge of the first set of riblets 112 can thus be detected by determining at which pixel the optical signal switches from a low value to a high value. For instance, the slope from the optical signal detected by the first line sensor 310 or the second line sensor 320 may be calculated and a maximum value of the slope may be determined. The pixel at which the maximum value of the slope is obtained may be interpreted as the edge of the first set of riblets 1 12. Generally, any edge finding procedure may be applied to the opticalsignal detected by the first line sensor 310 or the second line sensor 320.

[0054] FIG. 3C shows an exemplary optical signal detected by the third line sensor 330 or the fourth line sensor 340 depicted in FIG. 3A. As shown in FIG. 3C, pixels from the third line sensor 330 or the fourth line sensor 340 that detect light scattered or reflected from the first set of riblets 112 register a third optical signal, such as the oscillating optical signal depicted in FIG. 3C. Pixels from the third line sensor 330 or the fourth line sensor 340 that detect light scattered or reflected from outside the first region 110 register a fourth optical signal different from the third optical signal, such as the high optical signal depicted in FIG. 3C. An upper and lower edge of the first set of riblets 112 can thus be detected by determining at which pixel the optical signal switches from an oscillating value to a high value. Generally, any edge finding procedure may be applied to the optical signal detected by the third line sensor 330 or the fourth line sensor 340.

[0055] FIG. 4 shows a schematic depicting a second exemplary measurement module 400 for use with the systems and methods described herein. In the example shown, the measurement module 400 is used to detect a position and / or orientation of a first set of riblets 112 in a first region 110 of a surface 100 and to permit the systems and methods described herein to accurately position and / or orient a second set of riblets (not shown in FIG. 4) in a second region 120 of the surface 100. In some embodiments, the measurement module 400 comprises a first line sensor 410 and a second line sensor 420. In some embodiments, the first line sensor 410 and second line sensor 420 have any frame rate described herein with respect to FIG. 2A. In some embodiments, the first line sensor 410 and the second line sensor 420 are arranged at an angle to the first set of riblets 112 (i.e., at an angle to the x-axis as depicted in FIG. 4). In some embodiments, the angle is at least about 15 degrees, 20 degrees, 25 degrees, 30 degrees. 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, or more, at most about 75 degrees, 70 degrees, 65 degrees, 60 degrees, 55 degrees, 50 degrees, 45 degrees, 40 degrees, 35 degrees, 30 degrees, 25 degrees, 20 degrees, 15 degrees, or less, or within a range defined by any two of the preceding values, such as between about 30 degrees and about 35 degrees, about 30 degrees and about 40 degrees, about 30 degrees and about 45 degrees, about 30 degrees and about 50 degrees, about 30 degrees and about 55 degrees, about 30 degrees and about 60 degrees, about 35 degrees and about 40 degrees, about 35 degrees and about 45 degrees, about 35 degrees and about 50 degrees, about 35 degrees and about 55 degrees, about 35 degrees and about 60 degrees, about 40 degrees and about 45 degrees, about 40 degrees and about 50 degrees, about 40 degrees and about 55 degrees, about 40 degrees and about 60 degrees, about 45 degrees and about 50 degrees, about45 degrees and about 55 degrees, about 45 degrees and about 60 degrees, about 50 degrees and about 55 degrees, about 50 degrees and about 60 degrees, or about 55 degrees and about 60 degrees. Thus the angles of the first line sensor 410 and the second line sensor 420 relative to the first set of riblets 112 can vary. It can be said that the first line sensor 410 and the second line sensor 420 are at an angle so as to cross to the first set of riblets. In some embodiments, the angle is about 45 degrees. Thus, in some embodiments, the first line sensor 410 and the second line sensor 420 are configured to detect both the x coordinates and the y coordinates at which one or more riblets of the first set of riblets 112 end. Thus, in some embodiments, the first line sensor 410 and the second line sensor 420 are configured to detect an upper edge of the first set of riblets 112, a lower edge of the first set of riblets 112, and at least one end of at least one riblet of the first set of riblets 112. In comparison with the first measurement module 300 depicted in FIG. 3A, the second measurement module 400 utilizes fewer line sensors, reducing hardware cost and complexity.

[0056] FIG. 5 shows a schematic depicting a second exemplary measurement module 400 for use with the systems and methods described herein. In the example shown, the measurement module 500 is used to detect a position and / or orientation of a first set of riblets 112 in a first region 110 of a surface 100 and to permit the systems and methods described herein to accurately position and / or orient a second set of riblets (not shown in FIG. 5) in a second region 120 of the surface 100. In some embodiments, the measurement module 500 comprises a first line sensor 510, a second line sensor 520, a third line sensor 530, and a fourth line sensor 540. In some embodiments, the first line sensor 510, second line sensor 520, third line sensor 530, and fourth line sensor 540 have any frame rate described herein with respect to FIG. 2A. In some embodiments, the first line sensor 510, the second line sensor 520. the third line sensor 530, and the fourth line sensor 540 are arranged at an angle to the first set of riblets 112 (i.e., at an angle to the x-axis as depicted in FIG. 5). In some embodiments, the angle is any angle described herein with respect to FIG. 4. Thus, in some embodiments, at least two of the first line sensor 510, the second line sensor 520, the third line sensor 530, and the fourth line sensor 540 are configured to detect both the x coordinates and the y coordinates at which one or more riblets of the first set of riblets 112 end. Thus, in some embodiments, at least two of the first line sensor 510, the second line sensor 520, the third line sensor 530, and the fourth line sensor 540 are configured to detect an upper edge of the first set of riblets 112, a lower edge of the first set of riblets 112, and at least one end of at least one riblet of the first set of riblets 112. In comparison with the second measurement module 400 depicted in FIG. 4, the third measurement module 500 permits flexibility in thedirection in which the second set of riblets is formed on the second region 120 of the surface 100. That is, the first line sensor 510 and second line sensor 520 can be used when the second set of riblets is formed from right to left (i.e., along the -x direction) and the third line sensor 530 and fourth line sensor 540 can be used when the second set of riblets is formed from left to right (i.e., along the +x direction). The use of line sensors that are oriented on the opposite side of the second region 120 from which riblet formation may prevent sensor saturation resulting from secondary emission processes dunng the formation of the second set of riblets. In some embodiments, the angles of the first to fourth line sensors 510-540 may be different from one another. In such cases, the angles of at least two of the first to fourth line sensors 510-540 may be the same. One or more line sensors of the first to fourth line sensors 510- 540 may be replaced with a plurality of line sensors having different angles.

[0057] FIG. 6A shows a schematic depicting a fourth exemplary measurement module 600 for use with the systems and methods described herein, when the fourth exemplary measurement module 600 is used to write a first set of riblets in a first region 110 of a surface 100. In the example shown, the measurement module 600 comprises a first line sensor 610, a second line sensor 620, a third line sensor 630. and a fourth line sensor 640. In some embodiments, the first line sensor 610, second line sensor 620, third line sensor 630, and fourth line sensor 640 have any frame rate described herein with respect to FIG. 2A. In some embodiments, a line 650 is directed along a direction that is substantially perpendicular to a direction in which the first set of riblets is to be formed (i.e.. the line 650 is directed substantially parallel to the y-axis as depicted in FIG. 6 A). In some embodiments, the line 650 is projected by a line laser (not shown in FIG. 6A). In some embodiments, the line 650 is formed by a line of tape or other adhesive material. In some embodiments, the first line sensor 610 and the second line sensor 620 are configured to detect a position and / or orientation of the measurement module 600 with respect to a desired position and / or orientation of the first set of riblets. In some embodiments, the first line sensor 610 and the second line sensor 620 are arranged substantially perpendicular to the longitudinal direction of the projected line 650 (as shown in FIG. 6A). In some embodiments, the position and / or orientation of the measurement module 600 is altered (e.g.. by the movement module 230 described herein with respect to FIG. 2A) based on the measured position and / or orientation. For instance, in some embodiments, the position and / or orientation of the measurement module 600 is altered such that the first line sensor 610. the second line sensor 620, the third line sensor 630, and the fourth line sensor 640 are substantially parallel to the direction in which the first set of riblets is to be ablated, burned, or etched (i.e., the first, second, third, and fourth line sensors 610, 620, 630, and 640 aredirected substantially parallel to the x-axis as depicted in FIG. 6A). In some embodiments, the third line sensor 630 is arranged substantially perpendicular to the leading edge of the processed area as the first set of riblets is being formed. As depicted in FIG 6A, the edge of the processed area is extending along the y-direction.

[0058] FIG. 6B shows a schematic depicting the fourth exemplary' measurement module 600, when the fourth exemplary measurement module 600 is used to write a second set of riblets in a second region 120 of the surface 100. In the example shown, a line 650 is directed along a direction that is substantially perpendicular to a direction in which the second set of riblets is to be formed (i.e., parallel to the y-axis as depicted in FIG. 6B). In some embodiments, the first line sensor 610 and the second line sensor 620 are configured to detect a position and / or orientation of the measurement module 600 with respect to a desired position and / or orientation of the second set of riblets. In some embodiments, the position and / or orientation of the measurement module 600 is altered (e.g., by the movement module 230 described herein with respect to FIG. 2A) based on the measured position and / or orientation. For instance, in some embodiments, the position and / or orientation of the measurement module 600 is altered such that the first line sensor 610, the second line sensor 620, the third line sensor 630, and the fourth line sensor 640 are substantially parallel to the direction in which the second set of riblets is to be ablated, burned, or etched (i.e., the first, second, third, and fourth line sensors 610, 620, 630, and 640 are directed substantially parallel to the x-axis as depicted in FIG. 6B). In some embodiments, the fourth line sensor 640 is arranged substantially perpendicular to the leading edge of the processed area as the second set of riblets is being formed. As depicted in FIG. 6B, the edge of the processed area is extending along the y-direction.

[0059] FIG. 6C shows a schematic depicting the fourth exemplary' measurement module 600, when the fourth exemplary measurement module 600 is used to write a third set of riblets in a third region 130 of the surface 100. In some embodiments, the first line sensor 610 and the second line sensor 620 are configured to detect a position and / or orientation of the second set of riblets (not show n in FIG. 6C) previously formed in the second region 120 of the surface 100. In some embodiments, the position and / or orientation of the measurement module 600 is altered (e.g., by the movement module 230 described herein with respect to FIG. 2A) based on the measured position and / or orientation. For instance, in some embodiments, the position and / or orientation of the measurement module 600 is altered such that the first line sensor 610. the second line sensor 620, the third line sensor 630, and the fourth line sensor 640 are substantially parallel to the direction in which the third set of riblets is to be ablated, burned, or etched (i.e., the first, second, third, and fourth line sensors 610, 620, 630, and 640 aredirected substantially parallel to the x-axis as depicted in FIG. 6C). In some embodiments, the first line sensor 610 and the second line sensor 620 are arranged substantially perpendicular to the leading edge of the processed area as the third set of riblets is being formed. As depicted in FIG. 6C, the edge of processed area is extending along the y-direction.

[0060] FIG. 6D shows a schematic depicting the fourth exemplary' measurement module 600, when the fourth exemplary measurement module 600 is used to write a fourth set of riblets in a fourth region 140 of the surface 100. In some embodiments, the first line sensor 610 and the second line sensor 620 are configured to detect a position and / or orientation of the first set of riblets (not shown in FIG. 6D) previously formed in the first region 110 of the surface 100. In some embodiments, the position and / or orientation of the measurement module 600 is altered (e.g., by the movement module 230 described herein with respect to FIG. 2A) based on the measured position and / or orientation. For instance, in some embodiments, the position and / or orientation of the measurement module 600 is altered such that the first line sensor 610, the second line sensor 620, the third line sensor 630, and the fourth line sensor 640 are substantially parallel to the direction in which the fourth set of riblets is to be ablated, burned, or etched (i.e.. the first, second, third, and fourth line sensors 610, 620. 630. and 640 are directed substantially parallel to the x-axis as depicted in FIG. 6D). In some embodiments, the first line sensor 610 and the second line sensor 620 are arranged substantially perpendicular to the leading edge of the processed area as the fourth set of riblets is being formed. As depicted in FIG. 6D, the edge of processed area is extending along the y-direction.

[0061] In some embodiments, the first line sensor 610 is separated from the second line sensor 620 by a first vertical distance, the third line sensor 630 is separated from the fourth line sensor 640 by a second vertical distance, and the first line sensor 610 and second line sensor 620 are separated from the first line sensor 630 and the fourth line sensor 640 by a first horizontal distance. In some embodiments, the second vertical distance is larger than the first vertical distance. In some embodiments, the first and second vertical distances are larger than a vertical extent of the first region 110, the second region 120, the third region 130, and the fourth region 140. In some embodiments, the first horizontal distance is approximately equal to a horizontal extent of the first region 110, the second region 120, the third region 130, and the fourth region 140.In the embodiment show n in FIGS 6A-6D, one or more of the first to fourth line sensors 610-640 may be removed. For example, the fourth line sensor 640 may be removed (the measurement module 600 may have the first, second, and third line sensors). In this case, the position of the third line sensor 630 in the y-axis direction may be aligned withthe position of the first line sensor 610 in the y-axis direction.When the tracker (e.g. tracker 240) is combined with the embodiment of Figures 6A-6D, the alignment results obtained by the line sensors 610-640, of the measurement module 600, may be changed based on the results of the detection of the position of the laser marker by the tracker.

[0062] FIG. 7 shows a flowchart depicting a first exemplary method 700 for large-scale optical manufacturing that does not require the use of alignment marks patterned onto a surface. In the example shown, an irradiation module is used to project processing light and measurement light to a portion of a surface of an object at 710. In some embodiments, the irradiation module comprises irradiation module 210 described herein with respect to FIG. 2A. In some embodiments, the object comprises any object described herein with respect to FIGs. 1A, IB, and 2A.

[0063] At 720, a measurement module comprising at least one line sensor is used to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to the irradiation module based on the scattered and / or reflected measurement light. In some embodiments, the measurement module comprises measurement module 220 described herein with respect to FIG. 2A.

[0064] At 730, a movement module is used to move and / or rotate the irradiation module and / or the surface based on the position and / or orientation. In some embodiments, the movement module comprises movement module 230 described herein with respect to FIG. 2A.

[0065] FIG. 8 shows a flowchart depicting a second exemplary' method 800 for large- scale optical manufacturing that does not require the use of alignment marks patterned onto a surface. In the example shown, measurement light is directed to a first region of a surface of an object at 810. In some embodiments, the measurement light is directed to the first region by the irradiation module 210 (or the measurement module 220) described herein with respect to FIG. 2A. In some embodiments, the first region and the surface comprise any first region and surface described herein with respect to FIGs. 1A, IB, and 2.

[0066] At 820. at least one line sensor is used to receive scattered and / or reflected measurement light from at least a portion of the surface to thereby determine a position and / or orientation of at least one edge of a first set of microstructures ablated, burned, or etched from the first region. In some embodiments, the at least one line sensor is contained in measurement module 220 described herein with respect to FIG. 2A. In some embodiments, the at least one line sensor comprises 1, 2, 3, 4, or more line sensors, as described herein with respect to FIGs.3, 4, 5, and 6. In some embodiments, the first set of microstructures comprises any first set of riblets described herein with respect to FIGs. 1A, IB, or 2. In some embodiments, the position and / or orientation of the at least one edge is determined as described herein with respect to FIGs. 3, 4, 5, and 6.

[0067] At 830, processing light is directed to a second region of the surface. In some embodiments, the processing light is directed to the second region by the irradiation module 210 described herein with respect to FIG. 2A. In some embodiments, the second region comprises any second region described herein with respect to FIGs. 1 A, IB, or 2A.

[0068] At 840, the processing light is used to ablate, bum, or etch a second set of microstructures from the second region based on the position and / or orientation of the at least one edge.

[0069] Additionally, systems are disclosed that can be used to perform the method 700 of FIG. 7, the method 800 of FIG. 8, or any of operations 710, 720, and 730 or 810, 820, 830, and 840 described herein. In some embodiments, the systems comprise one or more processors and memory coupled to the one or more processors. In some embodiments, the one or more processors are configured to implement one or more operations of method 700 or 800. In some embodiments, the memory is configured to provide the one or more processors with instructions corresponding to the operations of method 700 or 800. In some embodiments, the instructions are embodied in a tangible computer readable storage medium.

[0070] FIG. 9 is a block diagram of a computer system 900 used in some embodiments to perform portions of methods for large-scale optical manufacturing described herein (such as operation 710, 720, or 730 of method 700 as described herein with respect to FIG. 7 or operation 810, 820, 830, or 840 of method 800 as described herein with respect to FIG. 8). In some embodiments, the computer system may be utilized as a component in systems for large- scale optical manufacturing described herein. FIG. 9 illustrates one embodiment of a general purpose computer system. Other computer system architectures and configurations can be used for carrying out the processing of the present invention. Computer system 900, made up of various subsystems described below, includes at least one microprocessor subsystem 901. In some embodiments, the microprocessor subsystem comprises at least one central processing unit (CPU) or graphical processing unit (GPU). The microprocessor subsystem can be implemented by a single-chip processor or by multiple processors. In some embodiments, the microprocessor subsystem is a general purpose digital processor which controls the operation of the computer system 900. Using instructions retrieved from memory 904, the microprocessor subsystem controls the reception and manipulation of input data, and the outputand display of data on output devices.

[0071] The microprocessor subsystem 901 is coupled bi-directionally with memory 804, which can include a first primary storage, typically a random access memoiy (RAM), and a second primary storage area, typically a read-only memory (ROM). As is well known in the art, primary storage can be used as a general storage area and as scratch-pad memory, and can also be used to store input data and processed data. It can also store programming instructions and data, in the form of data objects and text objects, in addition to other data and instructions for processes operating on microprocessor subsystem. Also as well known in the art, primary storage typically includes basic operating instructions, program code, data and objects used by the microprocessor subsystem to perform its functions. Primary storage devices 904 may include any suitable computer-readable storage media, described below, depending on whether, for example, data access needs to be bi-directional or uni-directional. The microprocessor subsystem 901 can also directly and very rapidly retrieve and store frequently needed data in a cache memory (not shown).

[0072] A removable mass storage device 905 provides additional data storage capacity for the computer system 900, and is coupled either bi-directionally (read / write) or unidirectionally (read only) to microprocessor subsystem 901. Storage 905 may also include computer-readable media such as magnetic tape, flash memory7, signals embodied on a carrier wave, PC-CARDS, portable mass storage devices, holographic storage devices, and other storage devices. A fixed mass storage 909 can also provide additional data storage capacity. The most common example of mass storage 909 is a hard disk drive. Mass storage 905 and 909 generally store additional programming instructions, data, and the like that typically are not in active use by the processing subsystem. It will be appreciated that the information retained within mass storage 905 and 909 may be incorporated, if needed, in standard fashion as part of primary storage 904 (e.g., RAM) as virtual memory.

[0073] In addition to providing processing subsystem 901 access to storage subsystems, bus 906 can be used to provide access other subsystems and devices as well. In the described embodiment, these can include a display monitor 908, a network interface 907, a keyboard 902, and a pointing device 903, as well as an auxiliary input / output device interface, a sound card, speakers, and other subsystems as needed. The pointing device 903 may be a mouse, stylus, track ball, or tablet, and is useful for interacting w ith a graphical user interface.

[0074] The network interface 907 allows the processing subsystem 901 to be coupled to another computer, computer network, or telecommunications network using a network connection as show n. Through the network interface 907, it is contemplated that the processingsubsystem 901 might receive information, e g., data objects or program instructions, from another network, or might output information to another network in the course of performing the above-described method steps. Information, often represented as a sequence of instructions to be executed on a processing subsystem, may be received from and outputted to another network, for example, in the form of a computer data signal embodied in a carrier wave. An interface card or similar device and appropriate software implemented by processing subsystem 901 can be used to connect the computer system 900 to an external network and transfer data according to standard protocols. That is, method embodiments of the present invention may execute solely upon processing subsystem 901, or may be performed across a network such as the Internet, intranet networks, or local area networks, in conjunction with a remote processing subsystem that shares a portion of the processing. Additional mass storage devices (not shown) may also be connected to processing subsystem 901 through network interface 907.

[0075] An auxiliary I / O device interface (not shown) can be used in conjunction with computer system 900. The auxiliary I / O device interface can include general and customized interfaces that allow the processing subsystem 901 to send and, more typically, receive data from other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognizers, biometrics readers, cameras, portable mass storage devices, and other computers.

[0076] In addition, embodiments of the present invention further relate to computer storage products with a computer readable medium that contains program code for performing various computer-implemented operations. The computer-readable medium is any data storage device that can store data which can thereafter be read by a computer system. The media and program code may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well known to those of ordinary skill in the computer software arts. Examples of computer-readable media include, but are not limited to, all the media mentioned above: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROM disks; magneto-optical media such as floptical disks; and specially configured hardware devices such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs). and ROM and RAM devices. The computer-readable medium can also be distributed as a data signal embodied in a carrier wave over a network of coupled computer systems so that the computer-readable code is stored and executed in a distributed fashion. Examples of program code include both machine code, as produced, for example, by a compiler, or files containing higher level code that may be executed using an interpreter. The computer system shown in FIG. 9 is but an example of a computer systemsuitable for use with the invention. Other computer systems suitable for use with the invention may include additional or fewer subsystems. In addition, bus 908 is illustrative of any interconnection scheme serving to link the subsystems. Other computer architectures having different configurations of subsystems may also be utilized.

[0077] The systems and methods described herein align riblets on nearby regions without patterned alignment marks on each region. Accordingly, the systems and methods described herein do not require finding the alignment marks and do not require patterning alignment marks on the surface. As a result, throughput is increased. However, the systems and methods described herein may be used in combination with systems and methods that do use such alignment marks.

[0078] Although the systems and methods described herein refer to the formation of microstructures and / or riblets by ablation, burning, or etching, the systems and methods may utilize other techniques to form the microstructures and / or riblets. For instance, the systems and methods may use photolithographic techniques to form the microstructures and / or riblets. Thus, the systems and methods may, for instance, direct patterned light to a photosensitive material (such as a positive photoresist or negative photoresist) coating the surfaces described herein. The patterned light may be directed to regions on the surface to form photopattemed microstructures (such as photopattemed riblets) on each region and the systems and methods described herein may be utilized to ensure that the photopattemed microstructures are properly aligned across the regions. The photosensitive material may then be developed (e.g.. by using a chemical photoresist developer). The surface may then be etched (e.g., using a wet chemical etchant or reactive ion etchant) to form the microstructures and / or riblets.RECITATION OF EMBODIMENTS

[0079] Embodiment 1. A system comprising: an irradiation module configured to direct processing light and measurement light to a surface of an object; a measurement module comprising at least one line sensor configured to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to the irradiation module based on the scattered and / or reflected measurement light; and a movement module configured to move and / or rotate the irradiation module and / or the surface based on the position and / or orientation.

[0080] Embodiment 2. The system of Embodiment 1. wherein the surface comprises aplurality of regions, each region configured to support microstructures ablated, burned, or etched therefrom.

[0081] Embodiment 3. The system of Embodiment 2, wherein the microstructures comprise riblets.

[0082] Embodiment 4. The system of Embodiment 3, wherein each region comprises at least one coat of paint and wherein the irradiation module is configured to direct the processing light to ablate, bum, or etch the at least one coat of paint to thereby form the riblets.

[0083] Embodiment 5. The system of Embodiment 3 or 4, wherein the measurement module is configured to determine a first position and / or orientation of a first set of riblets ablated, burned, or etched from a first region of the plurality of regions.

[0084] Embodiment 6. The system of Embodiment 5, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface based on the first position and / or orientation.

[0085] Embodiment 7. The system of Embodiment 5 or 6, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface in order to permit the irradiation module to direct the processing light to ablate, bum. or etch a second set of riblets from a second region of the plurality of regions.

[0086] Embodiment 8. The system of Embodiment 7, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface such that the first and second sets of riblets are aligned in a substantially similar direction.

[0087] Embodiment 9. The system of any one of Embodiments 1-8, wherein the irradiation module comprises a first light source configured to direct the processing light to the surface and a second light source configured to direct the measurement light to the surface.

[0088] Embodiment 10. The system of Embodiment 9, wherein the first and / or second light source comprises a laser light source configured to direct laser light to the surface.

[0089] Embodiment 11. The system of Embodiment 10, wherein the laser light source comprises a line laser light source configured to direct line laser light to the surface.

[0090] Embodiment 12. The system of any one of Embodiments 1-11. wherein the at least one line sensor is associated with a frame rate of at least 1 kilohertz (kHz).

[0091] Embodiment 13. The system of any one of Embodiments 5-12, wherein the measurement module comprises first, second, third, and fourth line sensors, wherein the first and second line sensors are arranged substantially parallel to a riblet of the first set of riblets, and wherein the third and fourth line sensors are arranged substantially perpendicular to thefirst and second line sensors.

[0092] Embodiment 14. The system of Embodiment 13, wherein the first and second line sensors are configured to detect one or more ends of one or more riblets of the first set of riblets and wherein the third and fourth line sensors are configured to detect an upper edge and a lower edge of the first set of riblets.

[0093] Embodiment 15. The system of Embodiment 13 or 14, further comprising at least one cylindrical lens located between the surface and at least one of the first, second, third, and fourth line sensors, the cylindrical lens configured to direct light from multiple riblets of the first set of riblets to at least one of the first, second, third, and fourth line sensors.

[0094] Embodiment 16. The system of any one of Embodiments 5-12, wherein the measurement module comprises first and second line sensors, and wherein each of the first and second line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

[0095] Embodiment 17. The system of Embodiment 16, wherein the first and second line sensors are configured to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more riblets of the first set of riblets.

[0096] Embodiment 18. The system of any one of Embodiments 5-12, wherein the measurement module comprises first, second, third, and fourth line sensors, and wherein each of the first, second, third, and fourth line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

[0097] Embodiment 19. The system of Embodiment 18, wherein at least two of the first, second, third, and fourth line sensors are configured to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more riblets of the first set of riblets.

[0098] Embodiment 20. The system of any one of Embodiments 7-12, wherein the irradiation module is configured to direct first light having a first optical power to the surface when ablating, burning, or etching a non-overlapping portion of the first set of riblets and a non-overlapping portion of the second set of riblets and to direct second light having a second optical power when ablating, burning, or etching an overlapping portion of the first and second sets of riblets, wherein the first and second optical powers are chosen such that a first level of ablation, burning, or etching the non-overlapping portions of the first and second sets of riblets is substantially equal to a second level of ablation, burning, or etching in the overlappingportion.

[0099] Embodiment 21. A method comprising: using an irradiation module to direct processing light and measurement light to a surface of an object; using a measurement module to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to the irradiation module based on the scattered and / or reflected measurement light; and using a movement module to move and / or rotate the irradiation module and / or the surface based on the position and / or orientation.

[0100] Embodiment 22. The method of Embodiment 21. wherein the surface comprises a plurality of regions, each region configured to support microstructures ablated, burned, or etched therefrom.

[0101] Embodiment 23. The method of Embodiment 22, wherein the microstructures comprise riblets.

[0102] Embodiment 24. The method of Embodiment 23, wherein each region comprises at least one coat of paint and wherein the irradiation module is configured to direct the processing light to ablate, bum, or etch the at least one coat of paint to thereby form the riblets.

[0103] Embodiment 25. The method of Embodiment 23 or 24, further comprising using the measurement module to determine a first position and / or orientation of a first set of riblets ablated, burned, or etched from a first region of the plurality of regions.

[0104] Embodiment 26. The method of Embodiment 25, further comprising using the movement module to move and / or rotate the irradiation module and / or the surface based on the first position and / or orientation.

[0105] Embodiment 27. The method of Embodiment 25 or 26, further comprising using the movement module to move and / or rotate the irradiation module and / or the surface in order to permit the irradiation module to direct the processing light to ablate, bum, or etch a second set of riblets from a second region of the plurality of regions.

[0106] Embodiment 28. The method of Embodiment 27, further comprising using the movement module to move and / or rotate the irradiation module and / or the surface such that the first and second sets of riblets are aligned in a substantially similar direction.

[0107] Embodiment 29. The method of any one of Embodiments 21-28, wherein the irradiation module comprises a first light source configured to direct the processing light to thesurface and a second light source configured to direct the measurement light to the surface.

[0108] Embodiment 30. The method of Embodiment 29, wherein the first and / or second light source comprises a laser light source configured to direct laser light to the surface.

[0109] Embodiment 31. The method of Embodiment 30, wherein the laser light source comprises a line laser light source configured to direct line laser light to the surface.

[0110] Embodiment 32. The method of any one of Embodiments 21-31, wherein the at least one line sensor is associated with a frame rate of at least 1 kilohertz (kHz).

[0111] Embodiment 33. The method of any one of Embodiments 25-32, wherein the measurement module comprises first, second, third, and fourth line sensors, wherein the first and second line sensors are arranged substantially parallel to a riblet of the first set of riblets, and wherein the third and fourth line sensors are arranged substantially perpendicular to the first and second line sensors.

[0112] Embodiment 34. The method of Embodiment 33, further comprising using the first and second line sensors to detect one or more ends of one or more riblets of the first set of riblets and wherein the third and fourth line sensors are configured to detect an upper edge and a lower edge of the first set of riblets.

[0113] Embodiment 35. The method of Embodiment 33 or 34, further comprising using at least one cylindrical lens located betw een the surface and at least one of the first, second, third, and fourth line sensors to direct light from multiple riblets of the first set of riblets to at least one of the first, second, third, and fourth line sensors.

[0114] Embodiment 36. The method of any one of Embodiments 25-32, wherein the measurement module comprises first and second line sensors, and wherein each of the first and second line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

[0115] Embodiment 37. The method of Embodiment 36, further comprising using the first and second line sensors to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more riblets of the first set of riblets.

[0116] Embodiment 38. The method of any one of Embodiments 25-32, wherein the measurement module comprises first, second, third, and fourth line sensors, and wherein each of the first, second, third, and fourth line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

[0117] Embodiment 39. The method of Embodiment 38, further comprising using at least two of the first, second, third, and fourth line sensors to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more ribletsof the first set of riblets.

[0118] Embodiment 40. The method of any one of Embodiments 27-32, further comprising using the irradiation module to direct first light having a first optical power to the surface when ablating, burning, or etching a non-overlapping portion of the first set of riblets and a non-overlapping portion of the second set of riblets and to direct second light having a second optical power when ablating, burning, or etching an overlapping portion of the first and second sets of nblets, wherein the first and second optical powers are chosen such that a first level of ablation, burning, or etching the non-overlapping portions of the first and second sets of riblets is substantially equal to a second level of ablation, burning, or etching in the overlapping portion.

[0119] Embodiment 41. A method comprising: directing measurement light to a first region of a surface of an object; and using at least one line sensor to receive scattered and / or reflected measurement light from at least a portion of the surface to thereby determine a position and / or orientation of at least one edge of a first set of microstructures ablated, burned, or etched from the first region.

[0120] Embodiment 42. The method of Embodiment 41. further comprising: directing processing light to a second region of the surface; and using the processing light to ablate, bum, or etch a second set of microstructures from the second region based on the position and / or orientation of the at least one edge.

[0121] Embodiment 43. A system comprising: a first light source configured to direct processing light to a surface of an object; a second light source configured to direct measurement light to the surface of the obj ect; at least one line sensor configured to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to the irradiation module based on the scattered and / or reflected measurement light; and a robot arm configured to move and / or rotate the irradiation module and / or the surface as an end effector based on the position and / or orientation.

[0122] Embodiment 44. A method comprising: directing processing light to a surface of an object using a first light source; directing measurement light to the surface of the object using a second light source; receiving scattered and / or reflected measurement light from at least a portion of the surface using at least one line sensor;determining a position and / or orientation of the portion of the surface relative to an irradiation module based on the scattered and / or reflected measurement light; and moving and / or rotating the irradiation module and / or the surface using a robot arm as an end effector based on the determined position and / or orientation.

Claims

CLAIMS1. A system comprising: an irradiation module configured to direct processing light to a surface of an object; a measurement module comprising at least one line sensor configured to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to the irradiation module based on the scattered and / or reflected measurement light; and a movement module configured to move and / or rotate the irradiation module and / or the surface based on the position and / or orientation.

2. The system of claim 1, wherein the surface comprises a plurality of regions, each region configured to support microstructures ablated, burned, or etched therefrom, and wherein the measurement module is configured to determine a first position and / or orientation of a first set of riblets ablated, burned, or etched from a first region of the plurality of regions.

3. The system of claim 2, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface based on the first position and / or orientation.

4. The system of claim 2 or 3, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface in order to permit the irradiation module to direct the processing light to ablate, bum, or etch a second set of riblets from a second region of the plurality7of regions.

5. The system of claim 4, wherein the movement module is configured to move and / or rotate the irradiation module and / or the surface such that the first and second sets of riblets are aligned in a substantially similar direction.

6. The system of any one of claims 1-5, wherein the irradiation module is further configured to direct measurement light to the surface of the object and wherein the irradiation module comprises a first light source configured to direct the processing light to the surface and a second light source configured to direct the measurement light to the surface.

7. The system of any one of claims 1-5, wherein the irradiation module comprises a first light source configured to direct the processing light to the surface and wherein the measurement module comprises a second light source configured to direct the measurement light to the surface.

8. The system of claims 6 or 7, wherein the first and / or second light source comprises a line laser light source configured to direct line laser light to the surface.

9. The system of any one of claims 1-8, wherein the at least one line sensor is associated with a frame rate of at least 1 kilohertz (kHz).

10. The system of any one of claims 2-9, wherein the measurement module comprises first, second, third, and fourth line sensors, wherein the first and second line sensors are arranged substantially parallel to a riblet of the first set of riblets, and wherein the third and fourth line sensors are arranged substantially perpendicular to the first and second line sensors.

11. The system of claim 10, wherein the first and second line sensors are configured to detect one or more ends of one or more riblets of the first set of riblets and wherein the third and fourth line sensors are configured to detect an upper edge and a lower edge of the first set of riblets.

12. The system of any one of claims 2-11, wherein the measurement module comprises first and second line sensors, and wherein each of the first and second line sensors is arranged at an angle that is not parallel to the first set of riblets.

13. The system of any one of claims 2-12, wherein the measurement module comprises first and second line sensors, and wherein each of the first and second line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

14. The system of claim 12 or 13, wherein the first and second line sensors are configured to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more riblets of the first set of riblets.

15. The system of any one of claims 2-14, wherein the measurement module comprises first, second, third, and fourth line sensors, and wherein each of the first, second, third, and fourth line sensors is arranged at an angle that is not parallel to the first set of riblets.

16. The system of any one of claims 2-15, wherein the measurement module comprises first, second, third, and fourth line sensors, and wherein each of the first, second, third, and fourth line sensors is arranged at a substantially 45 degree angle to a riblet of the first set of riblets.

17. The system of claim 15 or 16, wherein at least two of the first, second, third, and fourth line sensors are configured to detect an upper edge of the first set of riblets, a lower edge of the first set of riblets, and one or more ends of one or more riblets of the first set of riblets.

18. The system of any one of claims 4-17, wherein the irradiation module is configured to direct a first light having a first optical power to the surface when ablating, burning, or etching a non-overlapping portion of the first set of riblets and a non-overlapping portion of the second set of riblets and to direct a second light having a second optical power when ablating, burning, or etching an overlapping portion of the first and second sets of riblets, wherein the first and second optical powers are chosen such that a first level of ablation, burning, or etching the non-overlapping portions of the first and second sets of riblets is substantially equal to a second level of ablation, burning, or etching in the overlapping portion.

19. A system comprising: a first light source configured to direct processing light to a surface of an object; a second light source configured to direct measurement light to the surface of the object; at least one line sensor configured to receive scattered and / or reflected measurement light from at least a portion of the surface and to determine a position and / or orientation of the portion of the surface relative to an irradiation module based on the scattered and / or reflected measurement light; and a robot arm configured to move and / or rotate the irradiation module as an end effector based on the position and / or orientation.

20. The system of claim 19, wherein the line sensor includes at least two line sensors configured to receive a line beam projected on the surface of the object from the second light source.

21. The system of claim 20, wherein the at least two line sensors are arranged at an angle that is not parallel to the line beam projected on the surface.

22. The system of claim 20 or 21, wherein the first light source is configured to direct processing light to a plurality of regions on the surface of the object and to form a plurality of processed regions.

23. The system of claim 22, wherein the line sensor is configured to receive and / or reflect measurement light from the plurality of processed regions.

24. The system of claim 23, wherein the at least two line sensors are arranged at an angle that is not parallel to the edges of the processed regions.

25. The system of any one of claims 22 to 24, wherein the first light source is configured to form a group of processed regions aligned along a first direction.

26. The system of claim 25, wherein the first light source is configured to form a group of processed regions aligned along the first direction next to the group of processed regions aligned along the first direction.

27. A method comprising: forming a line on a surface of an object; detecting the line on the surface of the object with at least one line sensor; determining a position and / or orientation of the line relative to an irradiation module; moving and / or rotating the irradiation module to permit the irradiation module to direct a processing light onto at least a portion of the surface based on the position and / or orientation of the line; irradiating the processing light onto a first portion of the surface from the irradiation module thereby forming a first processed region; detecting an edge of the first processed region with the line sensor; moving and / or rotating the irradiation module based on detecting the edge; and irradiating the processing light onto a second portion of the surface from the irradiation module thereby forming a second processed region.

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