Multi-chip use photonic radar
By integrating photonic and electronic semiconductor chips on a printed circuit board with separate manufacturing processes, the radar head assembly achieves reduced size and improved manufacturing efficiency in photonic radar systems.
Patent Information
- Application Number
- PCT/EP2025/072494
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-07
- Filing Date
- 2025-08-05
- Publication Date
- 2026-02-12
AI Technical Summary
Existing photonic radar systems require high technological effort and resource inefficiency in manufacturing due to the integration of both photonic and electronic semiconductor circuits, which limits the scalability and size of the radar head units.
The integration of photonic and electronic semiconductor chips on a printed circuit board, allowing for separate manufacturing processes tailored to each type of chip, enabling smaller feature sizes for electronic components and reducing thermal stress through separate cooling mechanisms.
This approach reduces the overall size of the radar head assembly, optimizes material consumption, and enhances manufacturing efficiency by leveraging different semiconductor technologies for photonic and electronic components.
Smart Images

Figure EP2025072494_12022026_PF_FP_ABST
Abstract
Description
[0001] Description
[0002] Photonic radar with multi-chip usage
[0003] The invention relates to radar head devices designed as transmitter and / or receiver modules of photonic radar systems, which are used for environmental detection, in particular of vehicles, and in particular to the circuit design of the radar head devices.
[0004] In a photonic radar system, the radar signal information to be transmitted is generated in a central station, and the acquired radar echo information is evaluated in the central station. The transmission of the radar signal information to be transmitted and the acquired radar echo information is carried out optically using an optical carrier signal onto which the transmitted radar signal information and the acquired radar echo information are modulated.
[0005] A radar head unit configured as a transmitter module converts the transmitted radar signal information into an electromagnetic radar signal and transmits it via an antenna coupled to it. A radar head unit configured as a receiver module receives the reflected electromagnetic radar signal via an antenna coupled to the radar head unit. The receiver module extracts the radar echo information from this signal and modulates it onto the carrier signal for transmission back to the central station.
[0006] To achieve high angular resolution, photonic radar systems typically incorporate a multitude of radar head units, configured as transmitter and / or receiver modules, spaced apart from one another in an arrangement known as an antenna array. The achievable resolution is essentially determined by the geometric size, i.e., the dimensions, of the antenna array. The generation of all transmitted radar signal information and the evaluation of all acquired radar echo information are performed simultaneously at the central station. An optical carrier signal is used for signal transmission from the central station to the
[0007] Internal radar head units and vice versa enable the signals to be transmitted in a phase-locked manner. When this is used, it is referred to as coherent evaluation.
[0008] Photonic radar systems of the type mentioned above are known from the prior art. Since the signal transmission between the central station and the corresponding radar head is optical, each radar head requires a photonic semiconductor circuit. The emitted electromagnetic radar signal, however, lies in a frequency range for which electronic semiconductor circuits are required for processing, e.g., amplification.
[0009] DE 102017 221 257 A1 describes an example of such a radar system.
[0010] DE 10 2016210 771 B3 also shows a radar system with optical signal transmission, however, at least some of the antenna installations are only indirectly connected to the central station via other antenna installations.
[0011] From DE 102022 201 447 A radar sensor devices are known in which the transmitting and / or receiving devices comprise circuits with at least one organic electronic component.
[0012] Electronically-photonically cointegrated chips or semiconductor circuits (EPICs) are known from the prior art. These are monolithic and comprise photonic devices in regions with silicon on an insulator (silicon-on-insulator) and electronic devices in regions with solid-state silicon (bulk silicon) on a wafer.
[0013] The technological effort required to manufacture these EPIC chips is very high.
[0014] The invention is based on the objective of creating radar head devices for photonic radar systems and photonic radar systems that are simpler, and in particular more resource-efficient, to manufacture.
[0015] The problem is solved according to the invention by a radar head assembly with the features of claim 1 and a radar system with the features of claim 10. Advantageous embodiments are described in the dependent claims.
[0016] INTERNAL The invention is based on the idea of coupling a photonic semiconductor chip with an electronic semiconductor chip on a printed circuit board. The two semiconductor chips can then be manufactured in separate processes. This makes it possible to use the optimal manufacturing technology for each type of semiconductor chip, i.e., for both photonic and electronic semiconductor chips. Since the optical wavelengths of photonic semiconductor devices limit the feature size, the structures of electronic devices can be made much smaller. This leads, among other things, to a significant reduction in the consumption of semiconductor material, as the electronic semiconductor circuits can be produced with much smaller feature sizes. The optimal technologies can be used for each required feature size.Furthermore, scaling effects can be used, since both photonic semiconductor chips for signal transmission via optical carrier signals and electronic chips for processing electromagnetic signals in the gigahertz range are used in other technical fields, such as telecommunications.
[0017] A radar head assembly for a photonic radar system is created, in which signal transmission between a central station and the radar head assembly takes place by means of a modulated carrier signal transmitted via at least one optical transmission medium, comprising a printed circuit board, an integrated photonic semiconductor circuit coupled to the printed circuit board and an integrated electronic semiconductor circuit coupled to the printed circuit board, characterized in that the integrated photonic semiconductor circuit comprises at least one photonic coupling element for coupling an optical signal into the integrated photonic semiconductor circuit and a signal output, and the integrated photonic semiconductor circuit is arranged on the printed circuit board such that the signal output of the integrated photonic semiconductor circuit is coupled to a signal input of the integrated electronic semiconductor circuit.
[0018] Furthermore, a photonic radar system with a central station and at least one radar head of the type mentioned above is created, wherein the central station is configured to generate the radar signal information to be transmitted and to modulate an optical carrier signal according to the radar signal information to be transmitted and to evaluate the detected radar echo information, which is provided by the at least one
[0019] INTERNAL radar head unit is modulated onto the optical carrier signal provided by the central station or another optical carrier signal provided by the central station, wherein the at least one radar head unit is connected to the at least one radar head unit by means of at least one optical transmission medium.
[0020] By separating the integrated photonic semiconductor circuitry from the integrated electronic semiconductor circuitry, the thermal stress on the optical components can be significantly reduced. Furthermore, cooling of the electronic components of the integrated electronic semiconductor circuitry can be achieved more effectively. Heat dissipation can occur, for example, via the circuit board. Alternatively, a heat sink can be coupled only to the integrated electronic semiconductor circuitry.
[0021] An integrated semiconductor circuit is a circuit integrated onto a wafer. Such an integrated semiconductor circuit is also referred to as a chip, integrated chip, or semiconductor circuit chip.
[0022] Preferably, the integrated photonic semiconductor circuit and the integrated electronic semiconductor circuit are manufactured using different semiconductor technologies. For example, the electronic semiconductor circuit can be manufactured using a CMOS process with silicon as the semiconductor material, whereas the photonic semiconductor circuit is formed using organic components.
[0023] Similarly, different processes adapted to the different structure sizes can be used.
[0024] In particular, this allows for a reduction in the overall size of the radar head assembly, since the electronic components can be manufactured with much smaller feature sizes than photonic components.
[0025] The radar head assembly can be designed as a transmitter module and / or as a receiver module.
[0026] In one embodiment, the conversion of the signal information transmitted by the central station, in particular the radar signal information to be transmitted, into an electrical signal takes place in the integrated photonic semiconductor circuit. Any integrated electronic semiconductor circuit can be combined with such an integrated photonic semiconductor circuit. One embodiment thus provides that the
[0027] INTERNAL integrated photonic semiconductor circuit comprises a photodiode connected to an electrical signal output and wherein the signal coupling of the integrated photonic semiconductor circuit with a signal input of the integrated electronic semiconductor circuit is formed by means of a conductive connection on the printed circuit board.
[0028] The integrated electronic semiconductor circuit for a transmitter module preferably comprises a frequency multiplier circuit coupled to the signal input and an amplifier circuit, the amplifier circuit being coupled to an antenna output. In such an embodiment, the radar signal information to be transmitted can be generated in the central unit at a frequency that is a factor lower than the frequency actually used to radiate the radar signal and modulated onto the carrier signal. This reduces the bandwidth required on the optical transmission path as well as for the conversion from the optical to the electrical signal. A first frequency doubling preferably occurs during the conversion from the optical to the electrical signal.
[0029] To ensure a return transmission to the central station, one embodiment provides that the integrated photonic semiconductor circuit comprises an electronically controllable optical modulator circuit connected to an electrical modulation signal input, wherein a photonic output of the optical modulator circuit is photonically connected to another photonic coupling element and a photonic input of the optical modulator circuit is photonically connected to the at least one photonic coupling element or another photonic coupling element.
[0030] Preferably, a radar head assembly designed as a receiver module receives, on the one hand, the carrier signal with the modulated radar signal information to be transmitted. This carrier signal is converted into an electronic signal by the integrated photonic semiconductor circuit in order to convert the information contained in a radar echo into an intermediate frequency by means of a mixing process in the integrated electronic semiconductor circuit. In one embodiment, an additional optical carrier signal is provided to the integrated photonic semiconductor circuit of such a receiver module and coupled into the integrated photonic semiconductor circuit via a further optical coupling circuit. This optical carrier signal is then fed to an optical modulator circuit, which modulates the radar echo information provided by the integrated electronic semiconductor circuit onto the additional optical carrier signal.The modulated additional optical carrier signal is transmitted via the additional coupling device to the.
[0031] The central internal unit is decoupled from the integrated photonic semiconductor circuit. One embodiment therefore provides that the integrated photonic semiconductor circuit comprises an electronically controllable optical modulator circuit connected to an electrical modulation signal input, wherein a photonic output of the modulator circuit is photonically connected to a further photonic coupling element and a photonic input of the modulator circuit is photonically connected to the at least one photonic coupling element or to a further photonic coupling element.
[0032] The integrated photonic semiconductor circuit thus preferably includes a further optical coupling element to couple an optical carrier signal from another optical transmission medium into the integrated photonic semiconductor circuit and to direct it to the modulator circuit, and to couple the modulated optical carrier signal out of the photonic semiconductor circuit.
[0033] In a radar head assembly designed as a receiver module, the integrated electronic semiconductor circuit preferably comprises an antenna input, an input amplifier circuit and a mixer circuit, wherein the antenna input is connected to an input of the input amplifier circuit and an input amplifier circuit output is connected to an input of the mixer circuit, and the signal input is connected to another input of the mixer circuit and a mixer circuit output is connected to an electrical signal output of the integrated electronic semiconductor circuit.
[0034] In an alternative embodiment, the optical carrier signal of the transmission medium is coupled into the integrated photonic semiconductor circuit and passed through it. The electrical conversion takes place only on the integrated electronic semiconductor circuit, whose signal input is configured as a converter, in particular a photodiode. In this embodiment, the integrated electronic semiconductor circuit is aligned with respect to the integrated photonic semiconductor circuit so that the optical signal exiting the photonic semiconductor circuit is directed towards the signal input configured as a converter, in particular a photodiode. A portion of the optical signal can also be routed to an optical modulator circuit within the integrated photonic semiconductor circuit in this embodiment.
[0035] INTERNAL In this alternative configuration, the signal input of the integrated electronic semiconductor circuit is thus designed as a converter, in particular as a photodiode. With this alternative, a complete separation of the electronic components from the photonic components is achievable; however, precise alignment of the integrated photonic semiconductor circuit and the electronic semiconductor circuit on the circuit board is required.
[0036] The invention is explained in more detail below with reference to a drawing.
[0037] Fig. 1 shows a schematic setup of a photonic radar designed as a MIMO radar;
[0038] Figures 2a to 2c show an arrangement of the radar head devices designed as transmitter and / or receiver modules on a motor vehicle;
[0039] Fig. 3 shows a schematic view of a module designed as a transmitter module.
[0040] Radar head assembly;
[0041] Fig. 4 shows a schematic view of a receiver module.
[0042] Radar head assembly;
[0043] Fig. 5 shows a schematic view of another module designed as a transmitter module.
[0044] Radar head assembly;
[0045] Fig. 6 shows a schematic view of another module designed as a receiver module.
[0046] Radar head assembly; and
[0047] Fig. 7 shows a schematic view of yet another radar head assembly designed as a receiver module.
[0048] Figure 1 schematically depicts a photonic radar system 100. This system comprises a central station 200 and a plurality of radar head units 300, 300-n, configured as transmitter and / or receiver modules. The central station 200 and radar head units 300, 300-n are each individually coupled via two optical fibers 401, 401-n, 501, 501-n. The optical fibers 401, 401-n serve as transmission media 400 for transmitting optical signals from the central station 200 to the
[0049] INTERNAL radar head units 300, 300-n. The optical fibers 501, 501-n serve as return transmission media 500. Additionally, the radar head units 300, 300-n are preferably connected to the central station 200 via an electronic control line 460 and an electronic return line 560. The electronic control line 460 and the electronic return line 560 can be configured as a bus system. Alternatively or additionally, the individual radar head units 300, 300-n can each be configured with an individual control line 460 and an individual electronic return line 560.
[0050] For the sake of simplicity, in the embodiment described here, it is assumed that all radar head units 300, 300-n are coupled to a transmission medium 400, 400-n and a return transmission medium 500. Radar head units designed only as transmitter modules are generally not coupled to a return transmission medium. Radar head units designed as receiver modules can also be coupled to an additional optical transmission medium, through which a further optical carrier signal can be supplied for return transmission. These simplifications also apply to the other embodiments described here. Radar head units can therefore have only one or three optical connections without this affecting the described solution.
[0051] Lowercase letters -n ... stand for natural numbers to indicate countability and distinguishability of the corresponding objects.
[0052] In the illustrated embodiment, the central station 200 is configured to generate radar signal information for transmission, wherein, in the illustrated example, this occurs at a frequency eight times lower than the transmission of a radar signal via an antenna 350, 350-n of one of the radar head units 300, 300-n configured as transmitter modules. For this purpose, the central station 200 comprises a control unit 210, which controls a coherent light source 220, preferably configured as a laser. In an environment detection operating state, radar signal information is modulated onto the at least one optical carrier signal generated by the laser 220 via a modulation unit 230. The radar signal information is, for example, a frequency-modulated continuous wave (FMCW) signal intended for transmission, divided by a factor of eight.The modulation device 230 is, for example, designed as a Mach-Zehnder modulator (MZM). The optical signal is transmitted via an optical control device 240 to a...
[0053] The internal distribution device 250 is forwarded. In the illustrated embodiment, the distribution device 250 comprises a one-to-multiple distribution device 251. This transmits the at least one carrier signal coupled to the single input 252 to the radar head devices 300, 300-n via the corresponding transmission media 400, 400-n, which are connected to the multiple outputs 255, 255-n. The transmission media 400, 400-n are the optical waveguides 401, 401-n, i.e., preferably optical fibers 402, 402-n.
[0054] The radar head units 300, 300-n each have a fiber input 305, 305-n, to which the fiber 402-n coming from the central station 200 is connected. The at least one optical carrier signal with the modulated and transmitted radar signal information is coupled into the radar head unit 300, 300-n.
[0055] In the radar head assembly 300, 300-n, the fiber input 305, 305-n is optically coupled to a fiber output 395, 395-n, so that at least part of the optical signal transmitted to the radar head assembly 300, 300-n via the fiber 402, 402-n serving as the transmission medium 400, 400-n is transmitted back to the central station 200 via the fiber 502, 502-n serving as the return transmission medium 500, 500-n. It is understood that this feedback is omitted in transmitter modules that do not have a return transmission medium. The fiber 502, 502-n serving as the return transmission medium 500, 500-n is connected to the corresponding fiber output 395, 395-n and the detection device 260 of the central station 200.
[0056] The transmitted optical signal can be converted into an electronic signal in the radar head unit 300, 300-n, whereby the radar signal information is separated from the at least one carrier signal. The radar signal information is typically amplified and often its frequency is also multiplied in the radar head unit 300, 300-n, and then emitted as electromagnetic radiation from the corresponding antenna 350, 350-n of the radar head unit 300, 300-n as a radar signal.
[0057] The electromagnetic radiation reflected by an object in the vicinity is also received as a radar echo signal by an antenna 350, 350-n of one of the radar head units 300, 300-n or by several antennas 350, 350-n of several radar head units 300, 300-n. In a mixing process, radar echo information is usually derived from the radar echo signal and generated and processed as an intermediate frequency signal, and then the at least transmitted by the radar head unit 300, 300-n
[0058] INTERNAL modulates an optical carrier signal according to the radar echo information and transmits it back to the central station 200 via the corresponding return transmission medium 500, 500-n.
[0059] In the central station 200, the radar echo information is separated from the at least one optical carrier signal and converted into an electrical signal in a detection unit 260 during conversion into an electronic signal. The radar echo information received via the various return transmission media 500, 500-n is evaluated together in a processing unit 270 of the central station 200 to determine the distance, relative velocity, and relative angular position of individual objects in the environment. Upon transmission to the processing unit 270, electrical signals can be digitized in a digitizing unit 280 and pre-processed in a processing unit 290, for example, by undergoing a Fourier transform, which can be implemented in special modules.
[0060] Figures 2a to 2c schematically illustrate a possible distribution of the radar head units with their antennas on a motor vehicle 1000. This enables almost 360° environmental detection with high angular resolution.
[0061] In Fig. 2a, the vehicle 1000 is shown schematically from its front 1002 (Fig. 2a), in Fig. 2b from its left side 1004, and in Fig. 2c from its rear 1006. The right side of the vehicle is not shown here, but is preferably designed analogously to the left side 1004.
[0062] The diagram shows schematic small antenna symbols 1100, which indicate the positions of radar head units. On the front 1002 of the vehicle 1000, these are arranged, for example, at intervals between them, on a lower edge 1012 of a windshield 1010 and on a left side edge 1014 of the windshield (viewed from the front), essentially vertically spaced apart. Additionally, radar head units 1100 are also arranged horizontally spaced apart along a front bumper 1020.
[0063] On the left side 1004 of the vehicle 1000, shown in Fig. 2b, radar head devices 1100 are horizontally spaced apart from each other along a sill 1050, as well as radar head devices 1100 also horizontally spaced apart from each other along
[0064] INTERNAL a roof edge 1030 is arranged. In addition, radar head units are spaced essentially vertically apart from each other along a B-pillar 1040.
[0065] On the rear side 1006, shown in Fig. 2c, the antenna symbols 1100, representing the radar head devices, are arranged horizontally spaced apart from each other along the rear bumper 1070 and horizontally and vertically spaced apart from each other along a lower side edge 1064 of the rear window 1060 along the left side edge 1066 of the rear window 1060 as seen from the rear.
[0066] The operating state of the environmental detection system is only simplified and briefly presented here and is known to those skilled in the art for a photonic radar system with a plurality of radar head devices designed as transmitting and / or receiving modules.
[0067] One embodiment of the radar head assembly as a transmitter module or as a receiver module is explained by way of example with reference to the following figures. It is also possible to combine components of the embodiments described here as examples to form radar head assemblies configured as both transmitter and receiver modules. The radar head assemblies are characterized by the fact that they comprise separately designed integrated semiconductor circuits (chips) for photonic components and electronic components.
[0068] Figure 3 schematically shows a radar head assembly 300 designed as a transmitter module. This includes a printed circuit board 600. An integrated photonic semiconductor circuit 700 and an integral electronic semiconductor circuit 800 are arranged on the printed circuit board 600 and are functionally coupled to each other by means of the printed circuit board 600.
[0069] The integrated photonic semiconductor circuit 700 comprises a photonic coupling element 710 for coupling an optical signal into the integrated photonic semiconductor circuit 700. The optical signal is guided to the photonic integrated semiconductor circuit 700 via a fiber 402. The photonic coupling element, together with a fiber holder (not shown), forms the fiber input 305 (see Fig. 1). The integrated photonic semiconductor circuit 700 further comprises a converter device 730, preferably designed as a photodiode 720, for converting an optical signal into an electrical signal. The converter device 730 is coupled to a signal output 740. In particular, the carrier signal generated by a central unit, onto which radar signal information to be transmitted is modulated, is transmitted via the fiber 402, which is used as the transmission medium 400.
[0070] The signal is coupled internally into the integrated photonic semiconductor circuit 700. During conversion to the electrical signal, only the modulated radar signal information to be transmitted is converted into the electrical signal and, depending on the modulation method used, preferably already frequency-doubled.
[0071] The signal output 740 of the integrated photonic semiconductor circuit is coupled to a signal input 810 of the integrated electronic semiconductor circuit 800 by means of the circuit board 600. In the variant designed as a transmitter module, the integrated electronic semiconductor circuit 800 schematically comprises a frequency multiplier 820 and an amplifier circuit 830, which is connected to a transmitter output 840. A transmitter antenna 900 is provided at or connected to the transmitter output 840.
[0072] Figure 4 schematically depicts a radar head assembly 300 designed as a receiver module. An integrated photonic semiconductor circuit 700' and an integrated electronic semiconductor circuit 800' are arranged on the circuit board 600 and coupled to each other for signal transmission. The integrated photonic semiconductor circuit 700' includes a photonic coupling element 710 for coupling an optical signal into the integrated photonic semiconductor circuit 700'.
[0073] The integrated photonic semiconductor circuit 700' comprises, in addition to the components described above with the embodiment according to Fig. 3, a further photonic coupling element 750 for coupling in and out a further carrier signal after it has been modulated in an optical modulator circuit 760 within the integrated photonic semiconductor circuit 700'. The further optical carrier signal is also generated by the central station and transmitted to the integrated photonic semiconductor circuit 700' via a further fiber 402. The radar echo information modulated onto the further optical carrier signal in the optical modulator circuit 760 is provided as an electrical echo signal at an echo signal input 770.
[0074] The associated integrated electronic semiconductor circuit 800' comprises an input amplifier circuit 860 coupled to an antenna input 850. A receiver antenna 920 is coupled to the antenna input 850. A received reflected radar signal is amplified in the input amplifier circuit 860 and converted into a radar echo signal with an intermediate frequency by means of a mixer circuit 870. In order to derive the echo information in the mixer, this signal is combined with the received and amplified reflected signal.
[0075] The radar signal is received at an internal signal input 872, and the emitted radar signal information is provided at a reference input 871. This radar signal information is then converted into an electrical signal and provided to the integrated electronic semiconductor circuit 800' at its signal input 810. The radar echo signal is output at an echo signal output 880.
[0076] The emitted radar signal information is separated from the carrier signal in the integrated photonic semiconductor circuit 700' analogously, as described above in connection with Fig. 3, and converted into an electrical signal.
[0077] The integrated electronic semiconductor circuit 800' and the integrated photonic semiconductor circuit 700' are preferably fabricated using different semiconductor processes. In particular, the feature sizes of the components of both integrated semiconductor circuits differ. While the photonic components have feature sizes on the order of the optical wavelength of the carrier signal, the feature sizes of the electronic components are significantly smaller. Overall, this allows for a reduction in the overall size.
[0078] Figure 5 schematically shows another radar head assembly designed as a receiver module. This differs from the embodiment already described in Figure 4 in that this radar head assembly has an optical ring line 780. A portion of the optical carrier signal coupled to the photonic coupling element 710 in the integrated photonic semiconductor circuit 700 is fed to the converter unit 730, designed as a photodiode 720, and converted into an electrical signal, which is then made available at the electrical signal output 740. During the conversion, the transmitting radar signal information is separated from the carrier signal.
[0079] In addition, a portion of the single optical carrier signal is also fed into the optical modulator circuit 760. In the optical modulator circuit 760, the echo signal information supplied to the echo signal input 770 by means of an electrical echo signal is modulated onto the single carrier signal for return transmission to the central station. The single carrier signal modulated with the radar echo information is then coupled out of the integrated photonic semiconductor circuit 700 via the further optical coupling element 750 and coupled into a return transmission medium 500 in the form of an optical waveguide 501 designed as a fiber 502.
[0080] INTERNAL Figure 6 schematically shows another radar head assembly 300 designed as a receiver module. This differs from the one shown in Figure 3 in that, in the integrated electronic semiconductor circuit, the electrical signal input of the embodiment according to Figure 3 is formed by a converter device 812, preferably designed as a photodiode 811.
[0081] The integrated photonic semiconductor circuit is adapted and configured to output the carrier signal coupled to the photonic coupling element 701 at its output 740, which is configured as an optical output 741. The optical carrier signal is preferably focused and output by the integrated photonic semiconductor circuit 700'". The integrated electronic semiconductor circuit 800 is arranged on the circuit board 600 relative to the integrated photonic semiconductor circuit 700' such that the output focused carrier signal reaches the signal input 810 of the electronic semiconductor circuit 800', which is configured by means of a photodiode 811. The photodiode 811 serves as a converter 812 to convert the radar signal information into an electrical signal.
[0082] Figure 7 shows a further embodiment of a radar head assembly 300 designed as a receiver module, in which the integrated photonic semiconductor circuit 700 and the integrated electronic semiconductor circuit 800 are configured analogously to the embodiment according to Figure 6 with regard to providing the transmitted radar signal information. In this embodiment as well, the integrated photonic semiconductor circuit 700 comprises an optical signal output 741 and no converter device 730. The integrated electronic semiconductor circuit 800 has a photodiode 811 configured as a converter device 812.
[0083] The integrated photonic semiconductor circuits and integrated electronic semiconductor circuits shown are highly simplified. It is understood that the individual embodiments may include further components. The essential point is that each radar head assembly has at least one integrated photonic semiconductor circuit and one integrated electronic semiconductor circuit, which are designed separately and combined into a single unit for signal transmission via a printed circuit board.
[0084] INTERNAL Reference List
[0085] 100 photonic radar systems
[0086] 200 Central Station
[0087] 210 Control unit
[0088] 220 Light source (laser)
[0089] 230 Modulation unit
[0090] 240 optical control unit
[0091] 250 distribution equipment
[0092] 251 One-to-multiple distribution device
[0093] 252 Single input
[0094] 255, 255-n Multiple output 260 Detection device 270 Calculation unit 280 Digitization device
[0095] 290 Processing unit
[0096] 300, 300-n radar head assembly
[0097] 305, 305-n fiber input
[0098] 350, 350-n antenna
[0099] 395, 395-n fiber output
[0100] 400, 400n transmission medium
[0101] 401, 401n optical fiber
[0102] 402, 402-n fiber
[0103] 450, 450-n further transmission medium 460 electronic control line
[0104] 500, 500-n return transmission medium
[0105] 501, 501 -n optical fiber
[0106] 502, 502-n fiber
[0107] 550, 550-n further return transmission medium 560 electronic return path 600 printed circuit board 700, 700' integrated photonic semiconductor circuit
[0108] 710 photonic coupling element 720 photodiode
[0109] INTERNAL 730 converter unit
[0110] 740 electrical signal output
[0111] 741 optical output
[0112] 750 additional photonic coupling elements
[0113] 760 optical modulator
[0114] 770 Echo signal input
[0115] 780 optical ring main
[0116] 800, 800' integrated electronic semiconductor circuit
[0117] 810 electrical signal input
[0118] 811 Photodiode
[0119] 812 Converter device
[0120] 820 Frequency Multiplier
[0121] 830 amplifier circuit
[0122] 840 transmitter output
[0123] 850 Antenna input
[0124] 860 input amplifier circuit
[0125] 870 mixer circuit
[0126] 880 Echo signal output
[0127] 900 transmitter antenna
[0128] 920 receiver antenna
[0129] 1000 motor vehicles
[0130] 1002 Front
[0131] 1004 Left side
[0132] 1006 reverse
[0133] 1100 Antenna symbol
[0134] 1010 Windscreen
[0135] 1012 bottom edge
[0136] 1014 left side edge
[0137] 1020 front bumper
[0138] 1030 Roof edge
[0139] 1040 B-pillar
[0140] 1050 sills
[0141] 1060 Rear window
[0142] 1064 lower side edge
[0143] 1070 rear bumper
[0144] 1100 Antenna symbol
[0145] INTERNAL
Claims
Patent claims 1. Radar head assembly (300, 300-n) for a photonic radar system, in which signal transmission between a central station and the radar head assembly (300, 300-n) is effected by means of a modulated carrier signal transmitted via at least one optical transmission medium, comprising a printed circuit board (600'), an integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700) coupled to the printed circuit board (600') and an integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "", 800) coupled to the printed circuit board (600'), characterized in that the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700) includes at least one photonic coupling element for coupling an optical signal. the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) and a signal output (740), and the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) on the circuit board (600') is arranged such that the signal output (740) of the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) is coupled to a signal input of the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "",800 ).
2. Radar head assembly (300, 300-n) according to claim 1 , characterized in that the radar head assembly (300, 300-n) is designed as a transmitter module and / or as a receiver module.
3. Radar head assembly (300, 300-n) according to claim 1 or 2, characterized in that the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) and the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "",800 ) are manufactured using different semiconductor process technologies.
4. Radar head assembly (300, 300-n) according to one of the preceding claims, characterized in that the integrated photonic semiconductor circuit (700, 700', 700", RNAL 700"', 700 "",700 ) and the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "",800 ) are formed using various semiconductor materials.
5. Radar head device (300, 300-n) according to claim 1 or 2, characterized in that the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) comprises a photodiode which is connected to an electrical signal output (740) and wherein the signal coupling of the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "",700 ) with a signal input of the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "",800 ) is formed by means of a conductive connection on the circuit board (600').
6. Radar head assembly (300, 300-n) according to one of the preceding claims, characterized in that the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "", 800 ) comprises a frequency multiplication circuit coupled to the signal input and an amplifier circuit (830), wherein the amplifier circuit (830) is coupled to an antenna output.
7. Radar head device (300, 300-n) according to one of the preceding claims, characterized in that the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700 ) comprises an electronically controllable optical modulator circuit which is connected to an electrical modulation signal input, wherein a photonic output of the modulator circuit is photonically connected to a further photonic coupling element and a photonic input of the modulator circuit is photonically connected to the at least one photonic coupling element or a further photonic coupling element.
8. Radar head assembly (300, 300-n) according to one of the preceding claims, characterized in that the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700 ) comprises a further optical coupling circuit to couple an optical carrier signal of a further optical medium into the integrated photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700 ) and to direct it to the modulation circuit, and to couple the modulated optical carrier signal out of the photonic semiconductor circuit (700, 700', 700", 700'", 700 "", 700 ). RNAL - 19 - 9. Radar head assembly (300, 300-n) according to one of the preceding claims, characterized in that the integrated electronic semiconductor circuit (800, 800', 800", 800"', 800 "", 800 ) comprises an antenna input, an input amplifier circuit (860) and a mixer circuit (870), wherein the antenna input is connected to an input of the input amplifier circuit (860) and an input amplifier circuit output is connected to an input of the mixer circuit (870), and the signal input is connected to another input of the mixer circuit (870) and a mixer circuit output is connected to an electrical echo signal output of the integrated electronic semiconductor circuit (800, 800', 800", 800'", 800 "", 800 ).
10. Photonic radar system with a central station and at least one radar head assembly according to any one of claims 1 to 9, wherein the central station is configured to generate the radar signal information to be transmitted and to modulate an optical carrier signal according to the radar signal information to be transmitted and to evaluate the detected radar echo information, which is modulated by the at least one radar head assembly onto the optical carrier signal provided by the central station or another optical carrier signal provided by the central station, wherein the at least one radar head assembly is connected to the at least one radar head assembly by means of at least one optical transmission medium. RNAL
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