Plate stack, plate heat exchanger having a plate stack, and method for producing a plate stack

Abstract

The invention relates to a plate stack (32) for a plate heat exchanger (10) for transferring thermal energy between two fluids (24, 26), having a plurality of embossing plates (44) arranged parallel to one another and a plurality of wall elements (88) arranged between the embossing plates (44), - wherein each of the embossing plates (44) has a structured transfer region (74) with an undulating profile (76) and a flat plate edge region (78) framing the transfer region (74); - wherein the plate edge region (78) is formed in a plate plane (70) of the respective embossing plate (44) and the undulating profile (76) of the transfer region (74) protrudes at least on one side beyond the plate plane (70); - wherein the undulating profiles (76) of adjacent transfer regions (74) have different profiles and are mutually supported in a support plane (96) on a plurality of wave crests (100), - wherein in each case two adjacent embossing plates (44) delimit a flow cavity (34, 92, 94) in a fluid-tight manner in the stacking direction (46), and wherein in each case at least two wall elements (88) fastened to the adjacent plate edge regions (78) delimit a flow cavity (34, 92, 94) in a fluid-tight manner perpendicularly to the stacking direction (46); - wherein the wall elements (88) of two adjacent embossing plates (44) extend between at least one inflow opening (58, 62) and at least one outflow opening (60, 64) of the respective flow cavity (34, 92, 94). The invention relates to a plate heat exchanger (10) and to a method (122) for producing a plate stack (32).

Description

[0001] - 1 - 08.08.2025

[0002] SP14032PCT

[0003] Applicant: smk Systeme metall kunststoff gmbh & co. kg

[0004] At the SMK roundabout 1

[0005] 70794 Filderstadt-Bonlanden

[0006] Germany

[0007] Representative:

[0008] KOHLER. SCHMID FURNITURE

[0009] patent attorneys

[0010] limited liability partnership

[0011] Gropiusplatz 10 70563 Stuttgart Germany

[0012] Plate stacks, plate heat exchangers with a plate stack, and methods for producing a plate stack

[0013] Background of the invention

[0014] The invention relates to a stack of plates for a plate heat exchanger. The invention also relates to a plate heat exchanger with a stack of plates and a method for manufacturing a stack of plates.

[0015] Such plate stacks and plate heat exchangers are used, for example, in conjunction with so-called solid oxide fuel cells (SOCs). SOCs are high-temperature fuel cells that typically operate at a temperature of 800–1000°C and exhibit particularly high efficiency at this temperature. When operating in power generation mode, the fuel cell is referred to as a SOFC system (solid oxide fuel cell). When hydrogen is produced in the fuel cell using electrical energy, it is called a SOEC application (solid oxide electrolyzer cell). Operating these systems requires a high temperature level in the fuel cell stack. [The following appears to be unrelated and possibly a separate document: smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 2 - 08.08.]The high thermal energy present in the exhaust gas streams of the stack, as seen in 2025, is transferred via the plate heat exchanger to the fresh gas streams entering the stack. Only through this energy recovery can the exceptionally high overall efficiency of the SOC system be achieved.

[0016] Conventional plate heat exchangers often feature a flow channel for an energy-emitting fluid and a separate flow channel for an energy-absorbing fluid. These flow channels run within the plate heat exchanger between the inlet and outlet openings and are typically separated by several heat-conducting plates. The heat-conducting plates transfer thermal energy from the energy-emitting to the energy-absorbing fluid. To maximize energy transfer, the heat-conducting plates are often made with significantly larger dimensions. However, this reduces the structural rigidity of the plate heat exchanger, leading to deformation and consequently altering the flow behavior within the heat exchanger.

[0017] Furthermore, the demand for weight reduction in plate heat exchangers is increasing, which typically leads to a reduction in the thickness of the heat-conducting plates. This further reduces the structural rigidity of the plate heat exchanger. Additionally, with decreasing material thickness of the heat-conducting plates, the risk of thermal distortion during brazing or welding of the plates increases.

[0018] The risk of thermal distortion when attaching heat-conducting plates to each other or within a plate heat exchanger is therefore often circumvented in the prior art by spot fixing. Spot fixing reduces the heat input into the heat-conducting plates, which effectively counteracts thermal distortion, but reduces the tightness at the connection points. A small amount of leakage is accepted in favor of a lower overall weight. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 3 - 08.08.2025

[0019] It is an object of the invention to provide a plate heat exchanger which has a reduced overall weight and high structural stiffness while maintaining high fluid tightness.

[0020] Description of the invention

[0021] This problem is solved according to the invention by a stack of plates having the features of claim 1. The problem is further solved by a plate heat exchanger having the features of claim 12. The problem is also solved by a method having the features of claim 14. The dependent claims describe preferred embodiments of the invention.

[0022] According to the invention, a stack of plates is provided.

[0023] The plate stack is suitable and designed for use in a plate heat exchanger. Typically, the plate stack is designed to transfer thermal energy between two or more fluids.

[0024] A fluid is understood to be a flowing or convective medium, both preceding and following the process. The fluids can be gaseous or liquid. In other words, the stack of plates can be designed to transfer thermal energy between liquids and / or gases.

[0025] Preferably, the plate stack is suitable for use in plate heat exchangers in conjunction with fuel cells. In particular, the plate stack is designed for guiding fluids, especially gases, at temperatures of 700 °C or more, preferably 800 °C or more. In particular, the plate stack is designed for guiding fluids, especially gases, at temperatures of at most 1100 °C or less, preferably 1000 °C or less.

[0026] The stack of plates has several embossing plates arranged parallel to each other.

[0027] The embossing plates typically extend mainly in a smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 4 - 08.08.2025

[0028] Plate plane. In other words, the embossing plates often have a considerable surface area compared to their plate thickness. The embossing plates are preferably formed from a blank sheet by embossing or stamping. This ensures particularly fast and high-quality production of the embossing plates, especially with thin ones.

[0029] The thickness of the blank plate, or the thickness of the embossing plates without considering possible forming and deformation, is typically 0.2 millimeters or less, preferably 0.15 millimeters or less, and particularly preferably 0.1 millimeters or less. This allows the plate stack to be produced with low weight and good heat transfer performance.

[0030] Each of the embossing plates features a structured transfer area with a corrugated profile. A corrugated profile has proven particularly advantageous for flow guidance along the transfer area. The corrugated profile of the transfer area projects beyond the plate plane on at least one side. In other words, the corrugated profile has an extent, or shape, perpendicular to the plate plane.

[0031] The structured transfer area of ​​each embossing plate can have at least two profile sections with different profiles. In other words, an embossing plate can have different structures within the transfer area. For example, the corrugated profile can have a different profile in a first profile section than in a second profile section. Preferably, the profile sections differ by their profile orientation. By creating different profile orientations within the transfer area, flow guidance and thus the transfer of thermal energy can be improved. Furthermore, different profiles or profile orientations increase the stiffness of the embossing plate and thus the structural stiffness of the plate stack. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 5 - 08.08.2025

[0032] According to the invention, the corrugated profiles of transmission areas of adjacent embossing plates have different profiles. The profiles can differ, for example, in the number of waves, wave crests, wave spacings, and / or wave amplitudes. Different profiles ensure that the corrugated profiles support each other without obstructing or preventing flow between them. Preferably, the adjacent transmission areas differ from each other in the profile shape of their corrugated profiles. The corrugated profiles of the adjacent transmission areas typically project from the respective plate plane up to a common support plane, with the wave crests of the corrugated profiles contacting each other at specific points within this support plane.In other words, the corrugated profiles support each other, with the fluid flowing through the space between the plates being forced to flow around the contacting corrugated profiles. This creates a plate flow path that crosses the support plane multiple times between the adjacent embossed plates, further improving the transfer of thermal energy.

[0033] Furthermore, each embossing plate has a plate edge that frames the transfer area. This plate edge is typically flat. In other words, the plate edge lies within the plane of the respective embossing plate. A flat, or even, plate edge enables particularly fast and reliable stacking of the embossing plates.

[0034] The stack of plates also features several wall elements. These wall elements are arranged between the embossing plates. The wall elements are typically rib-like or have an elongated extension.

[0035] The material thickness of the wall elements in the stacking direction is typically 5 millimeters or less, preferably 1.5 millimeters or less, and particularly preferably 1.0 millimeter or less. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 6 - 08.08.2025

[0036] The wall thickness of the wall elements, extending parallel to the plane of the plate and transverse to its longitudinal extent, is typically at least 6 millimeters, preferably at least 8 millimeters, and particularly preferably at least 10 millimeters. Furthermore, the wall thickness is typically at most 16 millimeters, preferably at most 14 millimeters, and particularly preferably at most 12 millimeters. The specified wall thicknesses facilitate the joining of the wall elements.

[0037] According to the invention, the wall elements are attached to the edge region of the adjacent embossing plates. Preferably, only one wall element is arranged between the adjacent embossing plates in the stacking direction. In other words, the distance between the adjacent embossing plates in the stacking direction is equal to the material thickness of the wall elements.

[0038] At the plate edges of adjacent embossing plates, two or more wall elements are typically formed in one plane. The number of wall elements can depend on the number of inlet and outlet openings to be formed between the adjacent embossing plates. Typically, the wall elements extend along the plate edges from an inlet opening to an outlet opening. For example, if one inlet opening and one outlet opening are provided, two wall elements are typically arranged between the embossing plates.

[0039] According to the invention, two adjacent embossing plates and the wall elements arranged between them form a flow cavity. The flow cavity is fluid-tightly bounded in the stacking direction by the embossing plates. Furthermore, the flow cavity is fluid-tightly bounded perpendicular to the stacking direction by at least two wall elements attached to the adjacent edge regions. Openings for inflow and outflow are formed in the wall between the wall elements. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 7 - 08.08.2025

[0040] In summary, the invention proposes a plate stack for a heat exchanger which exhibits high structural rigidity through mutual support of the transfer areas and the formation of a solid edge region with reduced material thickness of the embossed plates. Furthermore, a fluid-tight connection between the different material thicknesses without gaps can be achieved through a specific stacking arrangement of the embossed plates and the wall elements. This allows for the provision of a plate heat exchanger without any unintentional fluid leakage.

[0041] In a preferred embodiment of the plate stack, the embossing plates and the wall elements are made of the same material, in particular a nickel-based alloy or high-temperature-resistant stainless steel. A plate stack designed in this way offers particular advantages with regard to the connectability, especially weldability, of the embossing plates to the wall elements, as well as its use in high-temperature applications.

[0042] In a preferred embodiment of the plate stack, the embossing plates and the wall elements are fluid-tightly welded together. This allows a plate stack with particularly high structural stiffness combined with high fluid tightness to be provided.

[0043] A preferred embodiment of the plate stack is one in which the embossing plates are hexagonal, octagonal, or diamond-shaped. In other words, the embossing plates each have a hexagonal, octagonal, or diamond-shaped plate contour. Preferably, the embossing plates are designed as regular hexagons or regular octagons. The aforementioned designs of the embossing plates have proven to be particularly advantageous with regard to high structural rigidity. Furthermore, such a design allows for the flexible use of the plate stack in various plate heat exchangers.

[0044] In a preferred embodiment of the plate stack, the at least one inlet opening and the at least one outlet opening are formed on opposite sides of the respective flow cavity. This allows for a particularly extensive flow path in the inter-plate area, resulting in more effective thermal energy transfer.

[0045] A preferred embodiment of the plate stack is one in which the support planes are parallel to the plate planes of the adjacent embossing plates. This simplifies the stacking process. Furthermore, it promotes the uniform or identical design of the embossing plates, thereby increasing the number of identical parts and reducing manufacturing costs.

[0046] A preferred embodiment of the plate stack provides that the corrugated profile of each embossing plate projects beyond the respective plate plane on both sides. Preferably, the corrugated profile extends to the same extent on both sides of the plate plane. This makes stacking particularly easy. Furthermore, the use of identical parts is further facilitated.

[0047] A further preferred embodiment of the plate stack is one in which the transfer area of ​​each embossing plate has a continuous corrugated profile with a consistent profile shape. In other words, the transfer area of ​​the embossing plates has a uniform structure, or exclusively a corrugated profile. By forming a continuous corrugated profile, structural stresses in the plate stack can be prevented, thereby minimizing distortion.

[0048] In a preferred embodiment of the plate stack, the embossing plates are identical. In other words, the plate stack is formed exclusively from one type of embossing plate. This makes the production of the plate stack particularly cost-effective.

[0049] A further preferred embodiment of the plate stack is one in which the embossing plates are rotationally symmetrical, in particular rotationally symmetrical by 180 degrees. Preferably, the embossing plates are rotationally symmetrical about an axis of rotation perpendicular to the plate plane and / or about an axis of rotation lying in the plate plane. This allows for a different smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 9 - 08.08.2025

[0050] The profile of the adjacent transfer areas is achieved by rotating or flipping the embossing plates.

[0051] A further development of the plate stack involves the embossing plates forming first and second flow cavities, with the first and second flow cavities alternating in the stack direction. This enables particularly efficient transfer of thermal energy between the fluids.

[0052] The first flow cavities are preferably arranged in a cross-counterflow configuration relative to the second flow cavities. This further increases the transfer of thermal energy.

[0053] The problem underlying the invention is further solved by a plate heat exchanger. The plate heat exchanger is designed for transferring thermal energy between two fluids.

[0054] The plate heat exchanger comprises a stack of plates as described above and below. The plate heat exchanger also includes a housing. The housing is designed to provide a fluid-tight seal for the inlet and outlet openings of the plate stack. Typically, the housing has several openings, each fluidically connected to a respective inlet or outlet opening. Preferably, the housing has connection ports for attaching pipes.

[0055] The plate stack can, for example, be arranged within the housing, or in particular, be completely enclosed within the housing. Typically, the housing forms a receiving section for the plate stack. This receiving section is preferably designed to increase the structural rigidity of the plate heat exchanger. A receiving section enables the rapid arrangement of the plate stack within the housing. Preferably, the plate stack is used to create a fluid-tight seal around the inlet openings and smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 10 - 08.08.2025

[0056] The outlet opening is welded to the housing, particularly using suitable sealants.

[0057] Preferably, the casing of the plate heat exchanger is cuboid in shape. Particularly in combination with an octagonal, hexagonal, or rhomboid plate stack, this creates flow sections that facilitate flow integration with adjacent components of the plate heat exchanger. Preferably, these flow sections are designed as nozzles or diffusers, depending on the flow direction.

[0058] In a preferred embodiment of the plate heat exchanger, the plate stack forms part of the casing. In other words, the plate stack is formed into the plate heat exchanger by attaching further casing components. Typically, fluid-tight sides of the plate stack form a casing wall of the plate heat exchanger. This allows for savings in weight as well as material and manufacturing costs.

[0059] Preferably, the casing sections that define the flow paths are attached to the plate stack to form the cuboid shape of the plate heat exchanger, in particular by welding. The casing sections can, for example, be pyramidal and / or prismatic. Typically, the casing openings and / or connection ports are arranged or formed on the casing sections.

[0060] The stack of plates is preferably arranged between two, in particular rectangular, housing cover plates positioned in front of and behind the stack in the stacking direction, with the housing cover plates projecting perpendicularly beyond the stack of plates. Typically, angled housing sections are attached between the housing cover plates and to the stack of plates to form the housing. This ensures a particularly fluid-tight and process-reliable design of the plate heat exchanger.

[0061] The problem underlying the invention is further solved by a method.

[0062] The method is designed for producing a plate stack as described above and below, in particular for producing a plate heat exchanger as described above and below. In other words, the method comprises the relevant steps required to form the plate stack or the plate heat exchanger.

[0063] The procedure includes at least the following procedural steps:

[0064] In process step a) of the process, embossing plates are layered or stacked by arranging wall elements on an edge region of an embossing plate and subsequently placing another embossing plate on top of the wall elements, or arranging another embossing plate against the wall elements. Process step a) can be repeated several times to achieve a predetermined stack height.

[0065] In the preferred case of rotationally symmetrical embossing plates, it is provided during stacking that the next embossing plate is rotated relative to the embossing plate below, in particular by 180 degrees, in order to create different profile profiles in the adjacent transfer areas.

[0066] The embossing plates are preferably provided before the start of process step a). Providing them may include producing the embossing plates.

[0067] A subsequent process step b) of the process involves arranging clamping elements in the inlet and outlet openings to be formed. The clamping elements serve to maintain a distance between the embossing plates in the plate edge areas where no smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 12 - 08.08.2025

[0068] Wall elements are arranged. In addition, the clamping elements serve to press the adjacent embossing plates against the wall elements of the neighboring flow cavities.

[0069] Step c) of the process involves clamping the layered embossing plates by applying a clamping force perpendicular to the embossing plates. Applying this clamping force ensures that the embossing plates bear against the wall elements across their entire surface, thus enabling a reliable, fluid-tight fastening process.

[0070] In a subsequent process step d) of the process, the embossing plates are attached to the wall elements by fluid-tight welding. The welding is preferably carried out by means of laser beam welding. Typically, welded joints are formed as weld seams, with the laser beam directed radially to the stacking direction in the plane of the plates onto the points to be joined between the respective embossing plate and the respective wall element.

[0071] In a preferred embodiment of the method, the additional process step e) is provided, in which the clamping elements are removed. By removing the clamping elements, the inlet openings and / or outlet openings can be designed with less resistance, thereby reducing the pressure loss of the plate stack.

[0072] A preferred embodiment of the method involves fixing the wall elements to the embossing plates in process step a) before placing the next embossing plate. Fixing ensures the correct position of the wall elements on the embossing plate. Fixing before placing the next embossing plate can be achieved by forming a radially outward-facing stop, for example, by positioning a production die at the transfer area. This allows the fixing process to be carried out with particular process reliability and automatically. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 13 - 08.08.2025

[0073] In a preferred embodiment of the process, process step a) involves layering embossing plates with wall elements fixed to them. The wall elements can be fixed to the embossing plates in a previous process step and exist as a structural unit in process step a). This allows for particularly fast and simple stacking by placing them against a circumferential stop.

[0074] The method can provide that process steps a) to e) are carried out to form a partial stack of plates. A partial stack of plates can, for example, comprise a predetermined number of embossing plates. The predetermined number of embossing plates is typically at least 30, preferably 40, and at most 60, preferably 50, embossing plates. The method can provide that two or more partial stacks of plates are joined together in the stacking direction to form a complete stack of plates. A complete stack of plates can, for example, comprise 100, typically 200, embossing plates. This allows the method to be applied in a particularly modular manner, enabling the cost-effective production of plate heat exchangers with a large number of embossing plates.

[0075] In a particular embodiment of the method, an additional process step f) of the method can be used to form the plate heat exchanger by forming the housing on the plate stack. Alternatively or additionally, the plate heat exchanger can be formed by arranging the plate stack in the housing. This process step can include fixing the plate stack in the housing. Typically, the plate stack is permanently fixed in the housing using suitable sealing materials, preferably by welding it to the housing.

[0076] Preferably, process step f) involves attaching housing components to the plate stack. A housing component is understood to be a component that completes the housing of the plate heat exchanger. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 14 - 08.08.2025

[0077] Housing components can include, for example, the housing cover plates and / or the housing sections that define the flow sections.

[0078] Particularly preferably, process step f) involves fastening the housing cover plates to the stack of plates in the stacking direction, both in front of and behind the stack. Subsequently, the housing components completing the housing, in particular the angled housing sections, can be fastened.

[0079] Further advantages of the invention will become apparent from the description and the drawing. Likewise, the features mentioned above and those described in more detail below can each be used individually or in any combination according to the invention. The embodiments shown and described are not to be understood as an exhaustive list, but rather serve as examples for illustrating the invention.

[0080] Detailed description of the invention and drawing

[0081] Fig. 1 shows a plate heat exchanger with a casing and a stack of plates in a perspective view.

[0082] Fig. 2 shows a housing of the plate heat exchanger for receiving a stack of plates in a cutaway perspective view.

[0083] Fig. 3 shows a stack of plates with embossing plates arranged side by side in a perspective view.

[0084] Fig. 4 shows two embossing plates and several wall elements for arrangement between the embossing plates in an exploded view.

[0085] Fig. 5 shows a partial section of a stack of plates in a side view on wall openings of the flow cavities.

[0086] Fig. 6 schematically shows the structure of the plate stack in a sectional side view through the wall openings of the flow cavities. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 15 - 08.08.2025

[0087] Fig. 7 schematically shows the structure of the stack of plates in a cut side view through a wall section of the stack of plates without wall openings.

[0088] Fig. 8 schematically shows a stack of plates arranged in a manufacturing device during production.

[0089] Fig. 9 schematically shows a method for manufacturing a stack of plates for a plate heat exchanger.

[0090] Fig. 1 shows a plate heat exchanger 10 in a perspective view.

[0091] The plate heat exchanger 10 has a housing 12. The housing 12 comprises several, here four, housing openings 14, with two of the housing openings 14 being formed on a side of the plate heat exchanger 10 facing away from the viewer.

[0092] Typically, two housing openings 14 are configured as inlet openings 16, 18 and two of the housing openings 14 as outlet openings 20, 22. The arrangement of the inlet openings 16, 18 and outlet openings 20, 22 is to be understood as an example and may vary depending on the application.

[0093] A typical application of the plate heat exchanger 10 is its use as a cross-counterflow heat exchanger. In operation of the plate heat exchanger 10 used in this manner, a first fluid 24, for example, an energy-releasing fluid, can flow into the plate heat exchanger 10 via the inlet opening 16, traverse the plate heat exchanger 10 along a first flow path 26, and exit the plate heat exchanger 10 via the outlet opening 20. A second fluid 28, for example, an energy-absorbing fluid, can flow into the plate heat exchanger 10 via the inlet opening 18 in a similar manner, traverse the plate heat exchanger 10 along a second flow path 30, and exit the plate heat exchanger 10 via the outlet opening 22. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 16 - 08 / 08 / 2025

[0094] When used as a cross-counterflow heat exchanger, the first flow direction (indicated by the arrow direction) along the first flow path 26 of the first fluid 24 is essentially opposed to a second flow direction (indicated by the arrow direction) along the second flow path 30 of the second fluid 28. The flow paths 26 and 30 typically intersect in a top view of the plate heat exchanger 10. The flow paths 26 and 30 are fluidically separated from each other. In other words, there is no mixing of the fluids 24 and 28.

[0095] The housing 12 can, as shown, be partially formed by a stack of plates 32. As shown, the stack of plates 32 forms several housing wall sections 33 of the housing 12. The stack of plates 32 is, as shown, octagonal and fluidically connected to the housing openings 14. The stack of plates 32 has fluidically separated flow channels or flow cavities 34 (see Fig. 4), which allow the fluids 24 and 28 to flow through the stack of plates 32 without mixing.

[0096] The housing 12 is cuboid in shape and comprises several, here four, housing sections 12a-d and two housing cover plates 35. As shown, the housing cover plate 35 facing the viewer is partially cut away to better illustrate the housing structure. The stack of plates 32 is arranged between the housing cover plates 35. The housing plates 35 are, as shown, essentially rectangular and therefore project laterally beyond the octagonal stack of plates 32 at their corners. The housing sections 12a-d are attached between the housing cover plates 35 and, together with the housing wall sections 33, complete the housing 12 in the circumferential direction. As shown, the housing sections 12a-d are angled.

[0097] The manufacturing of the illustrated plate heat exchanger 10 typically involves providing the plate stack 32 followed by attaching the housing cover plates 35 and housing sections 12a-d. The components are typically welded together to be fluid-tight. This allows for the provision of a cost-effective, structurally rigid, fluid-tight, and lightweight plate heat exchanger 10.

[0098] Fig. 2 shows a housing 12 of a plate heat exchanger 10 for receiving a stack of plates 32 in a perspective top view with housing openings 14.

[0099] The housing 12, as shown, is cuboid in shape and can be provided as a separate unit. The housing 12 can, for example, be a housing 12 already in operation or a housing 12 optimized for a specific installation space. This makes retrofitting existing plate heat exchangers with a plate stack 32 particularly easy.

[0100] Alternatively, the plate heat exchanger 10 can be provided with the housing 12 as a separate unit. This allows for a further increase in structural rigidity. The housing 12 typically has a receiving section 36 for the plate stack 32 (see Figs. 1, 3, 5-7). The receiving section 36 preferably forms a common housing volume 40 with flow sections 38. The flow sections 38 are preferably not affected by the arrangement of a plate stack 32 and, particularly in corner regions of the housing 12, form a flowable connection between the plate stack 32 and the housing openings 14.

[0101] The flow sections 38 are fluidically connected to the housing openings 14. Depending on the application of the plate heat exchanger 10, the geometric design of the flow sections 38 allows them to be used as a diffuser or as a nozzle, which further promotes the flow through the plate heat exchanger 10.

[0102] The housing openings 14 are formed, as shown, into connection spigots 42, which protrude laterally from the housing 14. This allows for the simple and quick connection of pipes (not shown). The position of smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 18 - 08.08.2025

[0103] The connection nozzle 42 can be located in different positions within the respective flow section 38. Typically, the position of the connection nozzle 42 is adapted to the available installation space depending on the application.

[0104] The receiving section 36 is preferably designed to be adaptable to a stack of plates 32. Preferably, the receiving section 36 of a provided housing 12 is adapted to a stack of plates 32 by using suitable sealing materials (not shown). This allows the housing 12 and the stack of plates 32 to be used for a variety of applications, requiring only the adaptation of the sealing materials. The structural rigidity of the plate heat exchanger 10 is ensured by the stack of plates, thus reliably preventing deformation.

[0105] Fig. 3 shows a perspective view of a stack of plates 32 for a plate heat exchanger 10 (see Fig. 1).

[0106] The plate stack 32 constitutes a manufacturing unit and can be formed into a plate heat exchanger 10 by attaching housing sections 12a-d (see Fig. 1). Alternatively, the plate stack 32 can be arranged as a continuous structure in the housing 12 (see Fig. 2).

[0107] The stack of 32 panels can be manufactured and tested as a single unit. Manufacturing defects, such as potential leaks, can be detected and rectified early on, thereby increasing manufacturing quality.

[0108] The plate stack 32 is suitable and designed for transferring thermal energy between at least two fluids 24, 28. Transferring thermal energy between two fluids 24, 28 is typically the main application of plate heat exchangers 10. Furthermore, the SMK Systeme Metall Kunststoff GmbH & Co. KG SP14032PCT - 19 - 08.08.2025

[0109] The stack of plates 32 is designed to transfer thermal energy to another fluid 24, 28 or several other fluids 24, 28.

[0110] The stack of plates 32 has several, here a large number, embossing plates 44 arranged parallel to one another. The embossing plates 44 are stacked in the stacking direction 46. For the sake of clarity, only two embossing plates 44 are marked with a reference symbol.

[0111] The stack of plates 32 has an octagonal stack contour 48 as shown. Alternatively, the stack contour 48 can be hexagonal or rhomboid. This allows for a streamlined design of the housing 12 with a simple external geometry.

[0112] The plate stack 32 has, as shown, a first inlet side 50 for the first fluid 24 to flow into the plate stack 32 and a first outlet side 52 for the first fluid 24 to flow out of the plate stack 32. The first outlet side 52 is located on a side of the plate stack 32 facing away from the viewer. Furthermore, the plate stack 32 has, as shown, a second inlet side 54 for the second fluid 28 to flow into the plate stack 32 and a second outlet side 56 for the second fluid 28 to flow out of the plate stack 32. The outlet sides 52 and 56 are located on a side of the plate stack 32 facing away from the viewer.

[0113] When the housing 12 is formed on or with the plate stack 32, or when the plate stack 32 is arranged in the housing 12, the inlet sides 50, 54 and the outlet sides 52, 56 are fluidically connected to the respective housing opening 14 (see Fig. 2). Leakage between the inlet sides 50, 54 and / or the outlet sides 52, 56 is effectively prevented by suitable sealing materials (not shown) and / or fluid-tight fastening, in particular welding, of the components. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 20 - 08.08.2025

[0114] The first inlet side 50 has several, here a plurality, first inlet openings 58, each of which is fluidically connected to a first outlet opening 60 formed on the first outlet side 52. The second inlet side 54 also has several, here a plurality, second inlet openings 62, each of which is fluidically connected to a second outlet opening 64 formed on the second outlet side 56. The outlet openings 60 and 64 are formed on a side of the plate stack 32 facing away from the viewer. For the sake of clarity, only one first inlet opening 58, one second inlet opening 62, one first outlet opening 60, and one second outlet opening 64 are provided with a reference numeral.

[0115] The plate stack 32 also has fluid-tight sides 66, which, as shown, are formed between the inlet sides 50, 54 and the outlet sides 52, 56. The fluid-tight sides 66 reliably prevent the escape of fluids 24, 28 and increase the structural stiffness of the plate stack 32.

[0116] Fig. 4 shows a partial section 68 of the stack of plates 32 for a better explanation of the stack structure in an exploded view.

[0117] Section 68 shows two embossing plates 44 arranged side by side in the stacking direction 46. The embossing plates 44 extend essentially in a plane 70. The planes 70 of the embossing plates 44 are typically aligned parallel to each other when the embossing plates 44 are stacked together.

[0118] The embossing plates 44 each have an octagonal plate contour 72, as shown in the illustration. In other words, the embossing plates 44 can be designed as octagons. Alternatively, the embossing plates can have a hexagonal or rhomboid plate contour 72. In other words, the embossing plates 44 can alternatively be designed as hexagons or rhomboids. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 21 - 08.08.2025

[0119] Each of the embossing plates 44 has a structured transfer area 74 with a corrugated profile 76 and a flat plate edge area 78 framing the transfer area 74. The transfer area 74 is designed for the transfer of thermal energy. By forming a corrugated profile 76, the structural stiffness of the embossing plates 44 can be increased. In addition, the surface area of ​​the transfer area 74 can be enlarged, thereby increasing heat transfer. Furthermore, by forming the corrugated profile 76, a flow along the embossing plates 44 can be created that promotes heat transfer.

[0120] As shown, the structured transfer area 74 of an embossing plate 44 can have a single profile section 80. The profile section 80 preferably has a consistently uniform profile, in particular a uniform profile progression 84. This effectively prevents material stresses within the plate stack 32.

[0121] The transmission areas 74 of the adjacent embossing plates 44 have different corrugated profiles 76, namely different profile paths 84, 86. As shown, the corrugated profiles 76 of the adjacent embossing plates 44 are rotated 90 degrees relative to each other. This allows point contact to be formed between the corrugated profiles 76. The point contact enables flow through the space between the plates and also causes the transmission areas 74 to support each other. This results in a particularly high structural stiffness of the plate stack 32.

[0122] The plate edge region 78 of each embossing plate 44 is formed in the plate plane 70 of the respective embossing plate 44. In other words, the plate edge region 78 is flat, which improves the joinability of the embossing plate 44. The wave-shaped profile 76 of the transfer area 74 of an embossing plate 44 projects at least on one side beyond the plate plane 70, or the plate edge region 78, in and / or opposite to the smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 22 - 08.08.2025

[0123] Stacking direction 46. Preferably, the wave-shaped profile 76 projects on both sides beyond the plate plane 70 or the plate edge area 78.

[0124] Section 68 also shows several wall elements 88. The wall elements 88 are arranged between two adjacent embossing plates 44 at the plate edge regions 78 facing the respective adjacent embossing plate 44. Typically, the wall elements 88 are permanently attached to the embossing plates 44, preferably welded to the plate edge regions 78.

[0125] In a preferred embodiment, the embossing plates 44 and the wall elements 88 are made of the same material, in particular a nickel-based alloy or a high-temperature-resistant stainless steel. This allows for a particularly reliable fastening or welding of the wall elements 88 to the embossing plates 44, which on the one hand promotes structural rigidity and on the other hand extends the service life of the plate stack 32, especially at high temperatures.

[0126] The wall elements 88 extend between at least one of the inlet openings 58, 62 and at least one of the outlet openings 60, 64. In other words, the inlet openings 58, 62 and / or the outlet openings 60, 64 are formed by recesses in the wall elements 88. It is possible to form several inlet openings 58, 62 and / or several outlet openings 60, 64 by arranging more than two wall elements 88 between the adjacent embossing plates 44.

[0127] A flow cavity 34 is formed by arranging two embossing plates 44, which are attached to one another via wall elements 88 arranged in the plate edge region 78. The flow cavity 34 is bounded in the stacking direction 46 by the embossing plates 44 and perpendicular to the stacking direction 46 by the wall elements 88. The flow cavity 34 can be opened by at least one inlet opening 58, 62 and at least one outlet opening 60. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 23 - 08.08.2025

[0128] 64 fluidically connected with the environment of the plate stack 32, or with a flow guide of the housing 12 (see Fig. 1, 2).

[0129] In a preferred embodiment, the embossing plates 44 are identical. This increases the number of identical parts produced in the stack of plates 32. As shown, the identical embossing plates 44 can be arranged rotated relative to each other, here 180 degrees around the stacking direction 46, within the stack of plates 32. In other words, the embossing plates 44 can be rotationally symmetrical by 180 degrees. This allows the different profile profiles 84, 86 of the adjacent transmission areas 74, and thus the support of the corrugated profiles 76 against each other, which promotes structural stability, to be maintained.

[0130] Preferably, a first flow cavity 92 is formed by arranging the wall elements 88, which is characterized by the orientation of the first inlet openings 58 and the first outlet openings 60. The first outlet opening 60 is concealed by the embossing plate 44 in Fig. 2. More preferably, a second flow cavity 94 is formed by arranging wall elements 88, which is characterized by the orientation of the second inlet openings 62 and the second outlet openings 64.

[0131] Typically, at least one inlet opening 58, 62 and at least one outlet opening 60, 64 are formed on opposite sides of the respective flow cavity 34. This allows the flow path between the openings to be lengthened and the heat transfer to take place over a longer period.

[0132] The plate stack 32 preferably has several, in particular a plurality, first flow cavities 92, wherein the first inlet openings 58 and the first outlet openings 60 are identically oriented in each first flow cavity 92. Typically, the first inlet openings 58 form the first inlet side 50 (see Fig. 3) and the first outlet openings 60 form the first outlet side 52 (see Fig. 3) of the plate stack 32. Alternatively or additionally, the plate stack 32 preferably has several, in particular a smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 24 - 08.08.2025

[0133] A plurality of second flow cavities 94 are provided, wherein the second inlet openings 62 and the second outlet openings 64 are identically oriented in every second flow cavity 94. Typically, the second inlet openings 62 form the second inlet side 54 (see Fig. 3) and the second outlet openings 64 form the second outlet side 56 (see Fig. 3) of the plate stack 32.

[0134] Preferably, the stack of plates 32 has a first flow cavity 92 and a second flow cavity 94 alternating in the stacking direction 46. The fluids 24, 28 (see Figs. 1, 3) thus flow through the stack of plates 32 divided into several, in particular a plurality, flow cavities 34, wherein the energy-releasing fluid, for example fluid 24, is always surrounded by two energy-absorbing fluids, for example fluid 28, in adjacent flow cavities 34. This allows for particularly efficient heat transfer.

[0135] Furthermore, preferably the flow cavities 92, 94 are aligned to each other in a cross-counterflow principle, which makes the heat transfer even more effective.

[0136] Fig. 5 shows a stack of plates 32 in a side view of an inlet side 50, 54. The description can be used analogously to explain the outlet sides 52, 56.

[0137] The embossing plates 44 are arranged in the stacking direction 46 with wall elements 88 positioned between them, forming the plate stack 32. The corrugated profiles 76 of the embossing plates 44 are visible in the area of ​​the inlet openings 58, 62. For clarity, only two corrugated profiles 76 of adjacent embossing plates 44 and one of the inlet openings 58, 62 are labeled with a reference symbol.

[0138] As shown, the corrugated profiles 76 project in and against the stacking direction 46 over the embossing plates 44. The maximum extent of the corrugated profiles 76 reaches up to a common support plane 96. Due to the different profile directions 84, 86, several support points 98 are formed between the corrugated profiles 76 in the support plane 96. In other words, the profile directions 76 support each other at several wave crests 100. For clarity, only one support point 98 and three wave crests 100 are labeled. By pressing the corrugated profiles 76 against each other, the embossing plates 44 are clamped against each other, thereby increasing the structural stiffness of the plate stack 32.

[0139] As shown, the stack of plates 32 can comprise first embossing plates 44a and second embossing plates 44b. The first embossing plates 44a and the second embossing plates 44b can be stacked in various combinations. Preferably, the first embossing plates 44a and the second embossing plates 44b are arranged alternately in the stack of plates 32. In other words, first embossing plates 44a have only second embossing plates 44b as adjacent embossing plates 44, and second embossing plates 44b have only first embossing plates 44a as adjacent embossing plates 44. This further improves heat transfer between the fluids 24, 28 (see Figs. 1, 3).

[0140] Typically, first embossing plates 44a form first flow cavities 92 with second embossing plates 44b adjacent in the stacking direction 46, and second embossing plates 44b form second flow cavities 94 with first embossing plates 44a adjacent in the stacking direction 46.

[0141] The first embossing plates 44a are typically identical. The second embossing plates 44b are typically identical. Preferably, the first embossing plates 44a are identical to the second embossing plates 44b, but are arranged differently oriented in the plate stack 32.

[0142] Fig. 6 schematically shows a stack of plates 32 in a sectional view of the first inlet side 50. The explanations for Fig. 6 can be applied analogously to the second inlet side 54 (see Fig. 3) and the outlet sides 52, 56.

[0143] As shown, the stack of plates 32 comprises several, here six, embossing plates 44, which are fastened to one another by wall elements 88 arranged between the respective plate edge regions 78 of the embossing plates 44. The inlet side 50 has initial inlet openings 58, which are formed by recesses in the plate edge region 78 of the wall elements 88. For the sake of clarity, only two embossing plates 44, two plate edge regions 78, and one wall element 88 are provided with a reference numeral.

[0144] The embossing plates 44 extend predominantly in the plane of the plate 70. The plate edge regions 78 are formed in the plane of the plate 70 of the respective embossing plate 44. The corrugated profile 76 of the transfer area 74 of the embossing plates 44 projects on both sides of the plane of the plate 70 by a projection 102 up to the support plane 96. The projection corresponds to a maximum deflection of the corrugated profile 76, with the points of maximum deflection being designated as wave crests 100 (see Fig. 5). For clarity, only one plane of the plate 70, one transfer area 74, one corrugated profile 76, and one projection 102 are provided with a reference numeral.

[0145] Preferably, the support planes 96 are formed parallel to the plate planes 70 of the adjacent embossing plates 44, as shown.

[0146] The overhang 102 preferably corresponds to half of a material thickness 104 of the wall elements 88. This allows the embossing plates 44 to be stacked particularly quickly and easily. For the sake of clarity, only one material thickness 104 is designated with a reference symbol.

[0147] In an alternative design, the support plane 96 can be aligned with the plate plane 70. Typically, the wave-shaped smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 27 - 08.08.2025

[0148] In this case, profile 76 projects beyond the plate plane 70 on one side. Preferably, the projection 102 is equal to the material thickness 104 of the wall elements 88.

[0149] The embossing plates 44 form flow cavities 92, 94. For illustration, the fluidically connected subcavities 106 of a first flow cavity 92 and the fluidically connected subcavities 108 of a second flow cavity 94 are shown in Fig. 6. For clarity, only five subcavities 106, 108 are labeled with a reference numeral.

[0150] Fluid 24 and fluid 28 flowing through the partial cavities 106 and 108, respectively (see Figs. 1, 3), is forced to deflect in the area of ​​the contacting corrugated profiles 76. This creates a plate flow path that crosses the support plane 96 multiple times. This has a particularly favorable effect on the transferable thermal energy between the fluids 24 and 28.

[0151] As shown, the embossing plates 44 and the wall elements 88 are fluid-tightly welded together. For this purpose, during the production of the plate stack 32, welded joints 110, in particular weld seams, are formed in the direction of the plate planes 70 between the wall elements 88 and the embossing plates 44. This effectively prevents the escape of fluids 24, 28. For clarity, only two welded joints 110 are indicated with a reference numeral.

[0152] During the production of the plate stack 32, clamping elements 112 are typically arranged in the area of ​​the inlet openings 58 to be formed. The clamping elements 112 allow the embossing plates 44 to be clamped instead of the wall elements 88, thus enabling reliable fastening or welding of the embossing plates 44 to the wall elements. The clamping elements 112 can be designed for optimized flow. This allows the clamping elements 112 to remain in the plate stack 32 after production. Preferably, the clamping elements 112 are removed after production of the plate stack 32, thereby reducing the flow resistance of the inlet openings 58, 62 and outlet openings 60, 64.

[0153] Fig. 7 schematically shows a stack of plates 32 in a cutaway partial view of one of the fluid-tight sides 66.

[0154] As shown, the stack of plates 32 comprises several, here six, embossing plates 44, which are fastened to one another by wall elements 88 arranged between the respective plate edge regions 78 of the embossing plates 44. The fluid-tight side 66 has no openings. For the sake of clarity, only two embossing plates 44, two plate edge regions 78, and one wall element 88 are provided with a reference numeral.

[0155] As shown, the embossing plates 44 and the wall elements 88 are fluid-tightly welded together over the entire fluid-tight side 66. For this purpose, during the production of the plate stack 32, weld connections 110, in particular weld seams, are formed in the direction of the plate planes 70 between the wall elements 88 and the embossing plates 44. This effectively prevents the escape of fluids 24, 28.

[0156] For the sake of clarity, only two welded joints 110 are marked with a reference symbol.

[0157] Fig. 8 schematically shows a stack of plates 32 in a sectional view during production in a manufacturing device 114. The illustration shows one inlet side 54. However, the explanations for Fig. 8 can be applied analogously to the second inlet side 54 (see Fig. 3), the outlet sides 52, 56 (see Fig. 3), and the fluid-tight sides 66 (see Fig. 3).

[0158] The stack of plates 32 comprises six embossing plates 44, which are arranged in the manufacturing device 114. Wall elements 88 and clamping elements 112 are arranged between the embossing plates 44. Typically, the wall elements 88 and / or clamping elements 112 are loosely arranged between the embossing plates 44. Alternatively, it can be provided that the smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 29 - 08.08.2025

[0159] Wall elements 88 and / or clamping elements 112 are fixed to the embossing plates 44 to prevent slippage during production.

[0160] The manufacturing device 114 comprises several clamping jaws 116, as shown in the illustration. The clamping jaws 116 are typically arranged in the stacking direction 46 in front of and behind the embossing plates 44 of the plate stack 32. The manufacturing device 116 is designed, by means of the clamping jaws 116, to apply clamping forces 118 that act in and against the stacking direction 46. This ensures that the embossing plates 44 are pressed flat against the wall elements 88.

[0161] The clamping elements 112 are typically designed to be elastically deformable and, in an unloaded state, preferably have a clamping element thickness 120 that is greater than the material thickness 104 (see Fig. 6) of the wall elements 88. This allows a clamping force to be exerted by the clamping elements 112 on the adjacent embossing plates 44, thus causing the corresponding embossing plates 44 to press against adjacent wall elements 88 when the manufacturing device 114 is clamped. This enables the embossing plates 44 to press against the wall elements 88 over a flat area in the region of the inlet openings 58 (see Figs. 3, 6).

[0162] The clamping elements 112 can, for example, be designed as leaf springs with a wave-like profile. This ensures that the clamping elements 112 can be allowed to flow through them.

[0163] Preferably, the manufacturing device 114 includes the clamping elements 112. This allows manufacturing to be carried out particularly quickly and reliably.

[0164] Typically, the permanent joining of the components takes place in a clamped state of the embossing plates 44 with the wall elements 88 in the manufacturing device 114. For this purpose, as shown, a laser beam 121 from a processing device can be directed in the plate plane 70, or at a slight angle to the plate plane 70, onto the point to be joined. As a result of the action of the laser beam 121, the weld joint 110 is formed. The same procedure is followed for all contact points between the embossing plates 44 and the wall elements 88.

[0165] Fig. 9 schematically shows a method 122 for producing a stack of plates 32 (see Figs. 1, 3-8).

[0166] Procedure 122 includes at least the following procedural steps:

[0167] In process step 124 of process 122, the embossing plates 44 (see Figs. 3-8) are layered by arranging wall elements 88 on a plate edge area 78 of an embossing plate 44 and placing another embossing plate 44 on top. In other words, a stack of plates 32 is formed by alternately and layer by layer arranging embossing plates 44 and wall elements 88.

[0168] The embossing plates 44 and the wall elements 88 are preferably manufactured in advance and prepared for layering. The embossing plates 44 and / or the wall elements 88 are preferably manufactured by die-cutting or cutting from a blank sheet. The embossing plates 44 are further preferably produced by embossing the plate edge region 78 (see Figs. 4, 6, 7) and / or the corrugated profile 76 (see Figs. 4, 5, 6) of the transfer area 74 (see Figs. 4, 6) into the blank sheet. Embossing and die-cutting are particularly preferably carried out in a single processing step.

[0169] Preferably, rotationally symmetrical embossing plates 44 are used in the layering process, wherein adjacent embossing plates 44 are rotated, in particular by 180 degrees around the stacking direction 46 (see Figs. 3, 4, 5, 7), to the embossing plate 44 lying below in the stacking direction 46.

[0170] Process step 124 can involve fixing the wall elements 88 to the embossing plates 44 before placing the next embossing plate 44. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 31 - 08.08.2025

[0171] This effectively prevents the wall elements 88 from slipping.

[0172] Preferably, process step 124 involves layering embossing plates 44 with wall elements 88 fixed to them. In other words, prefabricated building units, consisting of an embossing plate 44 and at least two wall elements 88, can be layered. The wall elements 88 are fixed only to the embossing plates 44. Fluid-tight fastening typically takes place in a subsequent process step.

[0173] A further process step 126 of process 122 provides for the arrangement of clamping elements 112 in the inlet openings 58, 62 (see Figs. 4, 6) and outlet openings 60, 64 (see Fig. 4) to be formed.

[0174] In a further process step 128 of process 122, the stacked embossing plates 44 are clamped by applying a clamping force 118 (see Fig. 8) perpendicular to the embossing plates 44. In other words, the clamping force 118 is applied to the embossing plates 44 in and against the stacking direction 46.

[0175] Typically, the clamping force 118 is applied as surface pressure to the embossing plates 44. In other words, the clamping force 118 is preferably applied uniformly over the entire embossing plate 44, or over the plate edge area 78 and the transmission area 74. This can be achieved by using clamping jaws 116 (see Fig. 8).

[0176] A further process step 130 of process 122 involves fluid-tight welding of the embossing plates 44 to the wall elements 88. Fluid-tight welding typically involves forming a weld seam along the entire plate contour 72 (see Fig. 4), or the entire circumference of the embossing plate 44. This reliably prevents leakage. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 32 - 08.08.2025

[0177] In a preferred embodiment, process step 132 of process 122 can provide for the removal of the clamping elements 112. The clamping elements 112 are removed as soon as the embossing plates 44 have been welded to the wall elements 88. By removing the clamping elements 112, the inlet openings 58, 62 and the outlet openings 60, 64 can be opened, or the flow resistance reduced.

[0178] In a particular embodiment, method 122 can include an additional process step 134, in which the plate heat exchanger 10 is formed by forming the housing 12 on the plate stack 32 and / or by arranging the plate stack 32 in the housing 12. Process step 134 can include fastening, in particular welding, the plate stack 32 in a housing 12. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 33 - 08.08.2025

[0179] List of symbols

[0180] 10 plate heat exchangers; 64 second outlet openings;

[0181] 12 Housing; 35 66 fluid-tight side;

[0182] 12a-d Housing section; 68 Partial cutout; 14 Housing opening; 70 Plate plane;

[0183] 16 Entrance opening; 72 Plate contour;

[0184] 18 Entry opening; 74 Transmission range;

[0185] 20 Exit opening; 40 76 wave-shaped profile;

[0186] 22 Outlet opening; 78 Plate edge area; 24 First fluid; 80 Profile section;

[0187] 26 First flow path; 82 Profile section;

[0188] 28 second fluid; 84 profile progression;

[0189] 30 Second flow path; 45 86 Profile progression;

[0190] 32 Plate stack; 88 Wall element; 33 Housing wall section; 92 First flow cavity;

[0191] 34 flow cavity; 94 second flow cavity;

[0192] 35 Housing cover plate; 96 Support level;

[0193] 36 Recording section; 50 98 Base;

[0194] 38 Flow section; 100 Wave crest; 40 Casing volume; 102 Overhang;

[0195] 42 connection spigots; 104 material thickness;

[0196] 44 embossing plate; 106 partial cavity;

[0197] 44a first embossing plate; 108 partial cavity;

[0198] 44b second embossing plate; 110 welded joint; 46 stacking direction; 112 clamping element;

[0199] 48 Stack contour; 114 Manufacturing device;

[0200] 50 First inlet side; 116 Clamping jaw;

[0201] 52 first outlet side; 60 118 tension force;

[0202] 54 Second inlet side; 120 Clamping element thickness; 56 Second outlet side; 121 Laser beam;

[0203] 58 first inlet opening; 122 process;

[0204] 60 First outlet opening; 124-134 Process step.

[0205] 62 second inlet opening; smk Systeme metall kunststoff gmbh & co. kg SP14032PCT

Claims

- 34 - 08.08.2025 Patent claims 1. Stack of plates (32) for a plate heat exchanger (10) for transferring thermal energy between two fluids (24, 26), comprising several embossing plates (44) arranged parallel to each other and several wall elements (88) arranged between the embossing plates (44), - wherein each of the embossing plates (44) has a structured transfer area (74) with a wave-shaped profile (76) and a flat plate edge area (78) framing the transfer area (74); - wherein the plate edge area (78) is formed in a plate plane (70) of the respective embossing plate (44) and the wave-shaped profile (76) of the transfer area (74) projects at least on one side beyond the plate plane (70); - wherein the wave-shaped profiles (76) of adjacent transmission areas (74) have different profiles, preferably different profile paths (84, 86), and support each other in a support plane (96) at several wave crests (100), - wherein two adjacent embossing plates (44) each fluid-tightly define a flow cavity (34, 92, 94) in the stacking direction (46) and wherein at least two wall elements (88) attached to the adjacent plate edge regions (78) each fluid-tightly define a flow cavity (34, 92, 94) perpendicular to the stacking direction (46); - wherein the wall elements (88) of two adjacent embossing plates (44) extend between at least one inlet opening (58, 62) and at least one outlet opening (60, 64) of the respective flow cavity (34, 92, 94).

2. Stack of plates (32) according to claim 1, wherein the embossing plates (44) and the Wall elements (88) made of the same material, in particular from smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 35 - 08.08.2025 nickel-based alloy or high-temperature-resistant stainless steel.

3. Stack of plates (32) according to claim 1 or 2, wherein the embossing plates (44) and the wall elements (88) are fluid-tight welded together.

4. Stack of plates (32) according to one of the preceding claims, wherein the embossing plates (44) are designed as a hexagon, an octagon or a diamond shape.

5. Stack of plates (32) according to one of the preceding claims, wherein the at least one inlet opening (58, 62) and the at least one outlet opening (60, 64) are formed on opposite sides of the respective flow cavity (34, 92, 94).

6. Stack of plates (32) according to one of the preceding claims, wherein the support planes (96) are formed parallel to the plate planes (70) of the adjacent embossing plates (44).

7. Stack of plates (32) according to one of the preceding claims, wherein the wave-shaped profile (76) of each embossing plate (44) projects beyond the plate plane (70) on both sides.

8. Stack of plates (32) according to one of the preceding claims, wherein the transmission area (74) of each embossing plate (44) has a continuous wave-shaped profile (76) with a constant profile direction (84, 86).

9. Stack of plates (32) according to one of the preceding claims, wherein the embossing plates (44) are identically designed. smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 36 - 08.08.2025 10. Stack of plates (32) according to one of the preceding claims, wherein the embossing plates (44) are rotationally symmetric, in particular rotationally symmetric 180 degrees.

11. Stack of plates (32) according to one of claims 9 or 10, wherein the embossing plates (44) form first flow cavities (92) and second flow cavities (94), wherein the first flow cavities (92) are formed alternately in the stacking direction (46).

12. Plate heat exchanger (10) for transferring thermal energy between two fluids (24, 28), comprising a housing (12) and a stack of plates (32) according to one of the preceding claims.

13. Plate heat exchanger (10) according to claim 12, wherein the plate stack (32) partially forms the housing (12).

14. Method (122) for producing a stack of plates (32) according to any one of claims 1 to 13, in particular for producing a plate heat exchanger (10) according to claim 14, comprising the method steps: a) layering (124) of embossing plates (44) by arranging wall elements (88) on a plate edge region (78) of an embossing plate (44) and placing another embossing plate (44) on top; b) arranging (126) clamping elements (112) in inlet openings (58, 62) and outlet openings (60, 64) to be formed; c) clamping (128) the layered embossing plates (44) by applying a clamping force (118) perpendicular to the embossing plates (44); d) fluid-tight welding (130) of the embossing plates (44) with the wall elements (88).

15. The method of claim 14, comprising the additional Procedure step: e) Removal of the clamping elements (112). smk Systeme metall kunststoff gmbh & co. kg SP14032PCT - 37 - 08.08.2025 16. Method according to claim 14 or 15, wherein in method step a) the wall elements (88) are fixed to the embossing plates (44) before the further embossing plate (44) is placed.

17. Method (122) according to claim 16, wherein in process step a) layering of embossing plates (44) with wall elements (88) fixed thereto takes place.

18. Method (122) according to any one of claims 14 to 17, comprising the additional process step f), in which the formation (134) of the plate heat exchanger (10) is carried out by forming the housing (12) on the plate stack (32) and / or by arranging the plate stack (32) in the housing (12). smk Systeme metall kunststoff gmbh & co. kg SP14032PCT

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