Detection device and detection system

Abstract

Provided are a detection device and a detection system that are capable of optimizing an acquisition condition for vital data. The detection device comprises: a plurality of photodiodes that are provided inside a ring-shaped housing and arranged in the circumferential direction of the housing; a light source that emits light to the plurality of photodiodes; and a control circuit that controls a drive current to be supplied to the light source and acquires vital data on the basis of detection values output from the plurality of photodiodes. The plurality of photodiodes include a first photodiode and a second photodiode provided on both sides of the light source in the circumferential direction. The control circuit acquires vital data obtained at least when the difference value between a detection value from the first photodiode and a detection value from the second photodiode is within a prescribed range.

Description

Detection device and detection system

[0001] The present invention relates to a detection device and a detection system.

[0002] Optical sensors capable of detecting fingerprint patterns and vein patterns are known (see, for example, Patent Document 1). Such optical sensors are incorporated into a ring-shaped housing that can be worn on a user's finger or arm, and are used to acquire vital data, which is biological information such as pulse waves.

[0003] Japanese Patent Application Laid-Open No. 2009-32005

[0004] In the above-mentioned conventional technology, the strength of the vital data acquired varies depending on the position of the device, which can make it difficult to monitor the user's physical condition over time. For this reason, a system that can optimize the conditions for acquiring vital data is desired.

[0005] The present disclosure aims to provide a detection device and a detection system that can optimize conditions for acquiring vital data.

[0006] A detection device according to one aspect of the present disclosure has a ring-shaped housing that can be attached to a living body and acquires vital data of a user, the detection device comprising: a plurality of photodiodes arranged inside the housing and aligned in a circumferential direction of the housing; a light source that irradiates the plurality of photodiodes with light; and a control circuit that controls a drive current supplied to the light source and acquires vital data based on detection values ​​output from the plurality of photodiodes, wherein the plurality of photodiodes include a first photodiode and a second photodiode arranged on both sides of the light source in the circumferential direction, and the control circuit acquires vital data when at least a difference value between the detection value of the first photodiode and the detection value of the second photodiode is within a predetermined range.

[0007] A detection system according to one aspect of the present disclosure includes the detection device and a terminal device that controls acquisition of vital data by the detection device.

[0008] FIG. 1 is a schematic diagram illustrating an example of the appearance of a detection device according to an embodiment, when a finger is placed inside the detection device, as viewed from the side of the housing. FIG. 2 is a cross-sectional view taken along line II-II' in FIG. 1. FIG. 3 is a development view illustrating an example of a development of a flexible substrate of the detection device according to an embodiment. FIG. 4 is a plan view illustrating an example of the configuration of the sensor substrate shown in FIG. 3. FIG. 5 is a cross-sectional view taken along line V-V' in FIG. 4. FIG. 6 is a cross-sectional view taken along line VI-VI' in FIG. 4. FIG. 7 is a block diagram illustrating an example of the configuration of a detection system according to an embodiment. FIG. 8 is a circuit diagram illustrating an example of the configuration of a detection circuit. FIG. 9 is a timing waveform diagram illustrating an example of the operation of the detection device according to an embodiment. FIG. 10 is a sequence diagram illustrating the flow of vital data acquisition operations in the detection system according to an embodiment. FIG. 11 is a flowchart illustrating an example of vital data acquisition processing in the detection device according to an embodiment. FIG. 12 is a sub-flowchart illustrating an example of an attachment determination processing. FIG. 13A is a conceptual diagram illustrating an example of the magnitude relationship between the detection values ​​of the photodiodes when a first determination processing is performed. FIG. 13B is a conceptual diagram illustrating an example of the magnitude relationship between the detection values ​​of the photodiodes when a second determination processing is performed. Fig. 13C is a conceptual diagram showing an example of the magnitude relationship between the detection values ​​of the photodiodes when the third determination process is performed. Fig. 14 is a sub-flowchart showing an example of the first determination process. Fig. 15 is a sub-flowchart showing an example of the second determination process. Fig. 16 is a sub-flowchart showing an example of the third determination process. Fig. 17 is a sub-flowchart showing an example of the vital data generation process. Fig. 18 is a sub-flowchart showing an example of the initial current setting process. Fig. 19 is a sub-flowchart showing an example of the first detection process. Fig. 20 is a sub-flowchart showing an example of the second detection process.

[0009] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially identical. Furthermore, the components described below can be combined as appropriate. Furthermore, the disclosure is merely an example, and appropriate modifications that a person skilled in the art can easily conceive while maintaining the gist of the invention are naturally included within the scope of the present invention. Furthermore, for clarity of explanation, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment. However, these are merely examples and are not intended to limit the interpretation of the present invention. Furthermore, in this specification and each figure, elements similar to those described above with reference to the previous figures may be designated by the same reference numerals, and detailed descriptions may be omitted as appropriate.

[0010] In the present disclosure, when expressing an aspect of placing another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both a case in which another structure is placed directly on top of a certain structure so as to be in contact with the certain structure, and a case in which another structure is placed above a certain structure via yet another structure.

[0011] Fig. 1 is a schematic diagram showing an example of the appearance of a detection device according to an embodiment when a finger is placed inside the detection device as viewed from the side of a housing. Fig. 2 is a cross-sectional view taken along line II-II' of Fig. 1.

[0012] As shown in FIG. 1 , the detection device 1 according to the embodiment is a wearable device in the form of a ring that can be attached to or detached from the human body, such as a smart ring. The detection device 1 is attached to, for example, a finger Fg of the human body to be measured. The finger Fg may include the thumb, index finger, middle finger, ring finger, little finger, etc. The detection device 1 acquires vital data, which is information related to a living body, from the finger Fg on which the detection device 1 is attached. The detection device 1 may also be configured to be built into, for example, a wristwatch or a wristband.

[0013] 2, the detection device 1 includes a housing 200, a light source 60, a first optical sensor 10A, a second optical sensor 10B, and a flexible printed circuit board 70. The detection device 1 includes a battery (not shown) inside the housing 200 and operates on power from the battery.

[0014] The housing 200 is formed in a ring shape (annular shape) that can be worn on a finger Fg, and is a wearing member that is worn on a living body. As shown in Fig. 2, the housing 200 includes a first housing 210 and a second housing 220. The housing 200 is formed in a ring shape by integrating the first housing 210 and the second housing 220.

[0015] The first housing 210 is a member that comes into contact with the human body on which the housing 200 is worn. The first housing 210 houses the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. The first housing 210 is formed in a ring shape from a housing material such as a transparent synthetic resin or silicone.

[0016] The second housing 220 has a surface of the housing 200 that covers the outer peripheral surface 210A of the first housing 210. The second housing 220 is formed in a ring shape from a material such as metal or non-transparent synthetic resin. The housing 200 accommodates a flexible printed circuit board 70, on which the light source 60, the first optical sensor 10A, the second optical sensor 10B, etc. are mounted, inside the first housing 210. The flexible printed circuit board 70 is accommodated inside the housing 200 by, for example, forming the housing 200 in a ring shape in a mold and filling the surrounding area with a filling material.

[0017] In this embodiment, the first optical sensor 10A and the second optical sensor 10B are provided so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is arranged in the circumferential direction 200C with the first optical sensor 10A, the light source 60, and the second optical sensor 10B lined up in this order. By arranging the first optical sensor 10A and the second optical sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the first optical sensor 10A and the second optical sensor 10B can detect light emitted by the light source 60 over a wide range of the housing 200.

[0018] Each of the first optical sensor 10A and the second optical sensor 10B detects light emitted by the light source 60 and reflected by a finger Fg or the like, directly incident light, etc. The first optical sensor 10A and the second optical sensor 10B are organic photodiodes (OPDs). The first optical sensor 10A is provided on the housing 200 so as to be adjacent to one end 61 of the light source 60 in the circumferential direction 200C of the housing 200. The second optical sensor 10B is provided on the housing 200 so as to be adjacent to the other end 62 of the light source 60 in the circumferential direction 200C of the housing 200.

[0019] As shown in FIG. 2 , the light source 60 is provided inside the first housing 210 of the housing 200 and is configured to be able to irradiate light toward the finger Fg wearing the housing 200. For example, an inorganic light emitting diode (LED) or an organic light emitting diode (OLED) is used as the light source 60. The light source 60 irradiates light of a predetermined wavelength. In this embodiment, the light source 60 has multiple light sources so as to be able to irradiate near-infrared light, red light, and green light. However, the present invention is not limited to this, and the light source 60 may have a light source of at least one color.

[0020] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect a fingerprint by detecting the shape of the projections and recesses on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first optical sensor 10A and the second optical sensor 10B. This allows the detection device 1 to detect information about a living body inside the finger Fg. Examples of information about a living body include pulse waves, pulse rates, and blood vessel images of the finger or palm. That is, the detection device 1 may be configured as a fingerprint detection device that detects fingerprints, or a vein detection device that detects vascular patterns such as veins.

[0021] 3 is a development view showing an example of development of the flexible substrate of the detection device according to the embodiment. As shown in FIG. 3, the flexible printed circuit board 70 is formed in a deformable band shape, and is formed into a ring shape by bringing one end 71 and the other end 72 close to each other or connecting them. The flexible printed circuit board 70 has a first mounting area 73 and a second mounting area 74. The first mounting area 73 is an area where the light source 60 and the like are mounted. The second mounting area 74 is an area where the control circuit 51, the power supply circuit 52, and the like are mounted.

[0022] The sensor board 21 is mounted on the flexible printed circuit board 70 so as to straddle the vicinity of the light source 60 in the first mounting area 73. The first optical sensor 10A, the second optical sensor 10B, etc. are mounted on the sensor board 21. The sensor board 21 is an insulating board, and is formed, for example, in a strip shape using a film-like resin or the like, making it a deformable board. The sensor board 21 is provided inside the housing 200 and curves to fit the shape of the housing 200. The flexible printed circuit board 70 electrically connects the first optical sensor 10A and the second optical sensor 10B on the sensor board 21, the light source 60, and the control circuit 51.

[0023] 2 , the flexible printed circuit board 70 is housed inside the housing 200 so that the surface on which the first optical sensor 10A, the second optical sensor 10B, and the light source 60 are mounted is located on the inner periphery of the housing 200. If the flexible printed circuit board 70 is translucent, the first optical sensor 10A, the second optical sensor 10B, and the light source 60 may be mounted on the side facing the outer periphery of the ring, opposite to the side facing the inner periphery of the ring. In this case, the light source 60 may be disposed so that it emits light toward the flexible printed circuit board 70 and that the light that has passed through the flexible printed circuit board 70 is emitted toward the side facing the inner periphery of the housing 200.

[0024] Next, the detailed configuration of the sensor substrate will be described with reference to Fig. 4. Fig. 4 is a plan view showing an example of the configuration of the sensor substrate shown in Fig. 3. Fig. 4 shows a plan view of the sensor substrate 21 when it is developed into a flat plate.

[0025] In the following description, the first direction Dx is a direction in a plane parallel to the sensor substrate 21. The second direction Dy is a direction in a plane parallel to the sensor substrate 21, and is a direction perpendicular to the first direction Dx. The second direction Dy may intersect the first direction Dx without being perpendicular to it. The third direction Dz is a direction perpendicular to the first direction Dx and the second direction Dy. The third direction Dz is the normal direction of the sensor substrate 21. Furthermore, "planar view" refers to the positional relationship when viewed from a direction perpendicular to the sensor substrate 21.

[0026] As shown in FIG. 4 , the sensor board 21 has a cutout portion 22 between both ends in the circumferential direction 200C of the housing 200, i.e., in the longitudinal direction (first direction Dx) of the sensor board 21. The sensor board 21 has a plurality of first optical sensors 10A mounted on one end 21A of the cutout portion 22, and a plurality of second optical sensors 10B mounted on the other end 21B of the cutout portion 22. In other words, the cutout portion 22 is located between the first optical sensors 10A and the second optical sensors 10B in the first direction Dx. The terminal portion 40 is provided at one end 21A of the sensor board 21 in the longitudinal direction. The terminal portion 40 supplies power from a power supply circuit 52 (see FIG. 3 ) to the first optical sensors 10A and the second optical sensors 10B.

[0027] The sensor substrate 21 also includes a connecting portion 23 corresponding to the portion where the cutout portion 22 is provided. The connecting portion 23 contacts the cutout portion 22 and connects the region of the sensor substrate 21 where the first optical sensor 10A is provided and the region of the sensor substrate 21 where the second optical sensor 10B is provided. This allows the region of the sensor substrate 21 where the first optical sensor 10A is provided and the region of the sensor substrate 21 where the second optical sensor 10B is provided to be integrally formed.

[0028] The light source 60 is disposed in an area overlapping with the cutout portion 22. The cutout portion 22 is formed over a distance in the first direction Dx that is longer than the length of the light source 60. The cutout portion 22 is formed over a distance in the second direction Dy that is longer than the length of the light source 60 and shorter than the length (width) of the sensor substrate 21. This allows the cutout portion 22 of the sensor substrate 21 to secure a space for disposing the light source 60.

[0029] Next, the configurations of the first optical sensor 10A and the second optical sensor 10B will be described with reference to Figures 4 to 6. Figure 5 is a cross-sectional view taken along line VV' in Figure 4. Figure 6 is a cross-sectional view taken along line VI-VI' in Figure 4.

[0030] 4, the first optical sensor 10A has a stacked configuration in which two lower electrodes 11 aligned in the first direction Dx are covered by one upper electrode 15A. The second optical sensor 10B has a stacked configuration in which two lower electrodes 11 aligned in the first direction Dx are covered by one upper electrode 15B. The upper electrode 15 includes the upper electrode 15A of the first optical sensor 10A and the upper electrode 15B of the second optical sensor 10B. The upper electrodes 15A and 15B have rectangular surfaces and are independent electrodes that are not electrically connected.

[0031] The first power supply electrode 25A and the second power supply electrode 25B are provided on the sensor substrate 21 and extend along the second direction Dy. The first power supply electrode 25A is provided between one end 21A of the sensor substrate 21 and the first optical sensor 10A in the first direction Dx. The second power supply electrode 25B is provided between the other end 21B of the sensor substrate 21 and the second optical sensor 10B in the first direction Dx. The first power supply electrode 25A is electrically connected to a terminal 40 of the sensor substrate 21 via a first wiring 26A, and receives a power supply potential from a power supply circuit 52 (see FIG. 3 ) via the terminal 40. The second power supply electrode 25B is electrically connected to a terminal 40 of the sensor substrate 21 via a second wiring 26B, and receives a power supply potential from the power supply circuit 52 via the terminal 40.

[0032] The upper electrode 15A of the first optical sensor 10A is connected to the first power supply electrode 25A via the conductive material 24 and is electrically connected to the terminal 40 via the first wiring 26A connected to the first power supply electrode 25A. The upper electrode 15B of the second optical sensor 10B is connected to the second power supply electrode 25B via the conductive material 24 and is electrically connected to the terminal 40 via the second wiring 26B connected to the second power supply electrode 25B. As a result, the upper electrode 15A and the upper electrode 15B are each supplied with power from the independent power systems of the first power supply electrode 25A and the second power supply electrode 25B. The conductive material 24 is made of a conductive material and covers the entire surface of the first power supply electrode 25A or the second power supply electrode 25B, electrically connecting the first power supply electrode 25A to the upper electrode 15A and the second power supply electrode 25B to the upper electrode 15B. The upper electrode 15A and the first power supply electrode 25A, and the upper electrode 15B and the second power supply electrode 25B may be directly connected without the conductive material 24 therebetween.

[0033] The third wiring 26C connects each of the lower electrodes 11 of the first optical sensor 10A and the second optical sensor 10B to a terminal 40 provided on the sensor substrate 21. The third wiring 26C connected to the lower electrode 11 of the first optical sensor 10A is connected to the terminal 40 through a region along one of the long sides of the sensor substrate 21 (the lower long side in FIG. 4 ). The third wiring 26C connected to the lower electrode 11 of the second optical sensor 10B is connected to the terminal 40 through a region along the other of the long sides of the sensor substrate 21 (the upper long side in FIG. 4 ) and the connecting portion 23. The multiple third wirings 26C are connected to the detection circuit 48 (see FIG. 7 ) via the terminal 40 and signal lines of the flexible printed circuit board 70. In other words, the detection circuit 48 (see FIG. 7 ) is electrically connected to the lower electrodes 11 of the first optical sensor 10A and the second optical sensor 10B via the signal lines.

[0034] The first power supply electrode 25A and the second power supply electrode 25B are supplied with a power supply potential from a power supply circuit 52 via the terminal portion 40, and supply the power supply potential to the upper electrode 15A and the upper electrode 15B. In the example shown in Fig. 4, the first power supply electrode 25A and the second power supply electrode 25B are formed in a substantially rectangular shape extending in the second direction Dy in a plan view, and have the same area (size).

[0035] As shown in FIG. 5, the photodiode PD constituting the first optical sensor 10A is provided on the sensor substrate 21 via an insulating layer 27.

[0036] The third wiring 26C is provided on the upper surface of the sensor substrate 21. The third wiring 26C is formed, for example, of a metal wiring, and is formed of a material having better conductivity than the lower electrode 11 of the first optical sensor 10A. The third wiring 26C is provided in a layer between the sensor substrate 21 and the photodiode PD in the third direction Dz. The third wiring 26C is electrically connected to the terminal portion 40 on the sensor substrate 21 (see FIG. 4 ). Note that the third wiring 26C may be formed, for example, in the same layer as the lower electrode 11, or may be formed of metal. The insulating layer 27 is provided on the sensor substrate 21, covering the third wiring 26C. The insulating layer 27 may be an inorganic insulating film or an organic insulating film.

[0037] The photodiode PD is provided as a sensor element on the insulating layer 27. The photodiode PD has a lower electrode 11, a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15 (upper electrode 15A). In the photodiode PD, the lower electrode 11, the lower buffer layer 12, the active layer 13, the upper buffer layer 14, and the upper electrode 15 are stacked in this order in a third direction Dz perpendicular to the sensor substrate 21.

[0038] The lower electrode 11 is made of a light-transmitting conductive material such as ITO (Indium Tin Oxide).

[0039] The characteristics (for example, voltage-current characteristics and resistance value) of the active layer 13 change depending on the light irradiated thereto. An organic material is used as the material of the active layer 13. Specifically, the active layer 13 has a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed. For example, a low-molecular organic material, C ６０ (fullerene), PCBM (phenyl C ６１Phenyl C61-butyric acid methyl ester), CuPc (Copper Phthalocyanine), F １６ CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), PDI (a derivative of perylene), or the like can be used.

[0040] The active layer 13 can be formed by a vapor deposition (dry process) using these low molecular weight organic materials. In this case, the active layer 13 is formed by, for example, CuPc and F １６ CuPc laminated film or rubrene and C ６０ The active layer 13 may be a laminated film of the above-mentioned low molecular weight organic material and high molecular weight organic material. The active layer 13 may also be formed by a coating process (wet process). In this case, the active layer 13 is made of a material that combines the above-mentioned low molecular weight organic material and high molecular weight organic material. Examples of high molecular weight organic materials that can be used include P3HT (poly(3-hexylthiophene)) and F8BT (F8-alt-benzothiadiazole). The active layer 13 may be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0041] The lower buffer layer 12 and the upper buffer layer 14 are provided to facilitate the holes and electrons generated in the active layer 13 reaching the lower electrode 11 or the upper electrode 15. One of the lower buffer layer 12 and the upper buffer layer 14 is a hole transport layer. The other of the lower buffer layer 12 and the upper buffer layer 14 is an electron transport layer. The material of the hole transport layer is a metal oxide layer. As the metal oxide layer, tungsten oxide (WO ３ ), molybdenum oxide, etc. The material of the electron transport layer is ethoxylated polyethyleneimine (PEIE).

[0042] The materials and manufacturing methods of the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 are merely examples, and other materials and manufacturing methods may be used. For example, the lower buffer layer 12 and the upper buffer layer 14 are not limited to single-layer films, and may be formed as multilayer films including an electron blocking layer and a hole blocking layer.

[0043] The upper electrode 15 is provided on the upper buffer layer 14. The upper electrode 15 is continuously formed over the entire photodiode PD of the first optical sensor 10A. In other words, the upper electrode 15 is continuously provided over the multiple photodiodes PD. The upper electrode 15 faces the multiple lower electrodes 11, with the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 sandwiched between them. The upper electrode 15 is formed of a light-transmitting conductive material such as ITO or IZO. A portion of the end of the upper surface 15a of the upper electrode 15 is electrically connected to a conductive material 24. The conductive material 24 is electrically connected to a first power supply electrode 25A and supplies a power supply potential from the first power supply electrode 25A to the upper electrode 15.

[0044] The sealing film 90 is provided on the upper electrode 15. The sealing film 90 is made of an inorganic film such as a silicon nitride film or an aluminum oxide film, or a resin film such as acrylic. The sealing film 90 is not limited to a single layer, but may be a laminated film of two or more layers combining the inorganic film and the resin film. The sealing film 90 effectively seals the photodiode PD and can prevent moisture from entering from the upper surface side. In this embodiment, the photodiode PD is configured to protect the terminal portion 40, the sensor substrate 21, etc. by covering the sealing film 90 to a part of the terminal portion 40 with a resin 91.

[0045] As shown in FIG. 6 , the two lower electrodes 11 of the second optical sensor 10B are provided in a different region of the sensor substrate 21 from the lower electrodes 11 of the first optical sensor 10A. The lower electrodes 11 are covered with a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15B. The photodiode PD constituting the second optical sensor 10B has the same configuration as the photodiode PD of the first optical sensor 10A. That is, the photodiode PD of the second optical sensor 10B has a lower electrode 11, a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15B. In this embodiment, the first optical sensor 10A and the second optical sensor 10B are organic photodiodes.

[0046] In the second optical sensor 10B, a portion of an end of the upper surface 15a of the upper electrode 15 is electrically connected to the conductive material 24, and the conductive material 24 is electrically connected to the second power supply electrode 25B. In the second optical sensor 10B, a power supply potential is supplied from the second power supply electrode 25B to the upper electrode 15. In the second optical sensor 10B, a sealing film 90 is provided on the upper electrode 15, the conductive material 24, etc., so that the photodiode PD is well sealed.

[0047] Next, an example of a detection method of the detection system 100 according to the embodiment will be described. FIG. 7 is a block diagram showing an example configuration of the detection system according to the embodiment. As shown in FIG. 7 , the detection system 100 according to the embodiment includes the above-described detection device 1 and a terminal device 2. In the present disclosure, the terminal device 2 is a portable terminal device owned by a user of the detection device 1. In the detection system 100 according to the embodiment, the terminal device 2 controls the acquisition of vital data in the detection device 1. The detection device 1 receives a vital data acquisition command transmitted from the terminal device 2 and performs a vital data acquisition operation.

[0048] The control circuit 51 controls the detection operations of the photodiode PD and the light source 60. The control circuit 51 also acquires the sensor output So output from the detection circuit 48 in response to the current (photocurrent Id) output from the photodiode PD.

[0049] The control circuit 51 includes a detection drive circuit 53, a data processing circuit 56, a memory circuit 57, and a transmission / reception circuit 58. The detection drive circuit 53 outputs various signals such as a start control signal STV, a clock signal CK, and a read control signal CH (see FIG. 9 ) to control the detection operation of the photodiode PD. The detection drive circuit 53 also outputs a power supply control signal CL to the power supply circuit 52 to supply a drive power supply VDD_ORG and a light source drive power supply VLED to the photodiode PD and the light source, respectively.

[0050] The detection drive circuit 53 can vary various conditions such as the frame rate, the drive current ILED supplied to the light source 60, and the length of the readout period INT.

[0051] Furthermore, the data processing circuit 56 performs predetermined processing on the sensor output So obtained from the detection circuit 48. A specific example of the processing in the data processing circuit 56 will be described later.

[0052] The memory circuit 57 temporarily stores the sensor output So and the processing results of the data processing circuit 56. The memory circuit 57 also stores various conditions related to the detection operation of the detection device 1. Specifically, various conditions such as the frame rate at which one frame is detected, the length of the readout period INT of the detection circuit 48, and the drive current ILED supplied to the light source 60 are stored in advance in the memory circuit 57.

[0053] The transmission / reception circuit 58 is a component that transmits and receives vital data acquisition commands and vital data to and from the terminal device 2 via wireless communication such as Bluetooth (registered trademark) or Wi-Fi (registered trademark). The detection device 1 and the terminal device 2 may communicate wirelessly via a predetermined network such as a mobile communication network. Alternatively, the control device 300 and the lighting device 1 may be connected via a wired connection and communicate via a wired connection.

[0054] 8 is a circuit diagram showing an example of the configuration of the detection circuit. As shown in Fig. 8, four photodiodes PD1, PD2, PD3, and PD4 are connected to the detection circuit 48. Of the four photodiodes PD1, PD2, PD3, and PD4, for example, the photodiodes PD1 and PD2 form a first optical sensor 10A (see Fig. 4), and the photodiodes PD3 and PD4 form a second optical sensor 10B (see Fig. 4).

[0055] The detection circuit 48 includes a plurality of connection switches SSW1, SSW2, SSW3, and SSW4, operational amplifiers 63a and 63b, transistors Tr1 and Tr2, and A / D conversion circuits 64a and 64b. The power supply circuit 52 includes constant current sources 65a and 65b.

[0056] In the following description, when it is not necessary to distinguish between the multiple photodiodes PD1, PD2, PD3, and PD4, they will simply be referred to as photodiodes PD. When it is not necessary to distinguish between the multiple connection switches SSW1, SSW2, SSW3, and SSW4, they will simply be referred to as connection switches SSW. The operational amplifiers 63a and 63b, transistors Tr1 and Tr2, and A / D conversion circuits 64a and 64b may also be simply referred to as operational amplifier 63, transistor Tr, and A / D conversion circuit 64, respectively.

[0057] A drive power supply VDD_ORG is supplied from a power supply circuit 52 to the cathodes of the multiple photodiodes PD1, PD2, PD3, and PD4. The anodes of the photodiodes PD1, PD2, PD3, and PD4 are connected to one end of connection switches SSW1, SSW2, SSW3, and SSW4, respectively. The other end of either connection switch SSW1 or SSW3 is connected to the inverting input of an operational amplifier 63a and the source of transistor Tr1. The other end of either connection switch SSW2 or SSW4 is connected to the inverting input of an operational amplifier 63b and the source of transistor Tr2. The drains of transistors Tr1 and Tr2 are connected to A / D conversion circuits 64a and 64b, respectively. However, for example, the drains of transistors Tr1 and Tr2 may be connected to a power supply potential via resistors, and both ends of the resistors may be measured by the A / D conversion circuits 64a and 64b, respectively. As a result, the A / D conversion circuits 64a and 64b output to the control circuit 51 a sensor output So corresponding to the current (photocurrent Id) output from the photodiodes PD1, PD2, PD3, and PD4.

[0058] More specifically, connection switches SSW1 and SSW3, an operational amplifier 63a, a transistor Tr1, and an A / D conversion circuit 64a are provided corresponding to the two photodiodes PD1 and PD3. The photodiodes PD1 and PD3 connected to the A / D conversion circuit 64a are switched depending on whether the connection switches SSW1 and SSW3 are on (connected state) or off (disconnected state). When one of the connection switches SSW1 and SSW3 is on, the other of the connection switches SSW1 and SSW3 is off.

[0059] Corresponding to the two photodiodes PD2 and PD4, connection switches SSW2 and SSW4, an operational amplifier 63b, a transistor Tr2, and an A / D conversion circuit 64b are provided. The photodiodes PD2 and PD4 connected to the A / D conversion circuit 64b are switched by turning the connection switches SSW2 and SSW4 on and off. When one of the connection switches SSW2 and SSW4 is on, the other of the connection switches SSW2 and SSW4 is off.

[0060] In the following description, the circuit configuration corresponding to the photodiodes PD1 and PD3 will be described. However, the circuit configuration corresponding to the photodiodes PD1 and PD3 is the same as the circuit configuration corresponding to the photodiodes PD2 and PD4. The description of the circuit configuration corresponding to the photodiodes PD1 and PD3 can also be applied to the circuit configuration corresponding to the photodiodes PD2 and PD4.

[0061] As shown in FIG. 8, the operational amplifier 63 and the transistor Tr are connected between the A / D conversion circuit 64 and the connection switches SSW1 and SSW3 connected to the photodiodes PD1 and PD3.

[0062] One end of each of the connection switches SSW1 and SSW3 is connected to the anodes of the photodiodes PD1 and PD3, respectively. The other ends of the connection switches SSW1 and SSW3 are connected to the inverting input (-) of the operational amplifier 63 and the source of the transistor Tr. That is, the inverting input (-) of the operational amplifier 63 is connected to the photodiodes PD1 and PD3 via the connection switches SSW1 and SSW2. A reference potential VREF is supplied to the non-inverting input (+) of the operational amplifier 63 from the power supply circuit 52. The output of the operational amplifier 63 is connected to the gate of the transistor Tr.

[0063] The transistor Tr is a source-follower transistor. The source of the transistor Tr is connected to the inverting input (−) of the operational amplifier 63 and is also connected to a reference potential (e.g., ground potential GND) via a constant current source 65. The drain of the transistor Tr is connected to the A / D conversion circuit 64.

[0064] The A / D conversion circuit 64 performs signal processing such as A / D conversion based on the current flowing through the drain of the transistor Tr and outputs the sensor output So. In other words, the detection circuit 48 is a current detection circuit that measures the current flowing through the drain of the transistor Tr. The detection circuit 48 is not limited to the A / D conversion circuit 64 and may be configured to include other signal processing circuits, etc.

[0065] With this configuration, for example, when the connection switch SSW1 is on and the connection switch SSW3 is off, the photodiode PD1 is connected to the A / D conversion circuit 64 via the connection switch SSW1, the operational amplifier 63, and the transistor Tr. Also, the photodiode PD3 is disconnected from the transistor Tr and the A / D conversion circuit 64. Due to an imaginary short of the operational amplifier 63, the anode of the photodiode PD1 becomes the same reference potential VREF as the non-inverting input (+).

[0066] The drive power supply VDD_ORG has a potential higher than the reference potential REF. As a result, when the connection switch SSW1 is turned on, the photodiode PD1 is reverse-bias driven. At this time, when light is irradiated onto the photodiode PD1, a photocurrent Id flows from the photodiode PD1 to the constant current source 65. Because the bias current PDBIAS of the constant current source 65 is constant, the current flowing to the drain of the transistor Tr is the bias current PDBIAS minus the photocurrent Id. In other words, the A / D conversion circuit 64 outputs a sensor output So corresponding to the photocurrent Id output from the photodiode PD1. In other words, if the output current flowing to the drain of the transistor Tr is Io, then Io = PDBIAS - Id. The bias current PDBIAS is a preset constant current.

[0067] Similarly, when the connection switch SSW1 is off and the connection switch SSW3 is on, the photodiode PD3 is connected to the A / D conversion circuit 64 via the connection switch SSW3, the operational amplifier 63, and the transistor Tr. Furthermore, the photodiode PD1 is disconnected from the A / D conversion circuit 64. Due to an imaginary short in the operational amplifier 63, the anode of the photodiode PD3 is at the same reference potential VREF as the non-inverting input (+). This causes the photodiode PD3 to be reverse-biased. Similarly, a current Io corresponding to the light irradiating the photodiode PD3 flows through the drain of the transistor Tr. In other words, the A / D conversion circuit 64 outputs a sensor output So corresponding to the photocurrent Id output from the photodiode PD3.

[0068] 8, the photodiodes PD1 and PD3 connected to the operational amplifier 63, the transistor Tr, and the A / D conversion circuit 64 are switched in a time-division manner by turning on and off the connection switches SSW1 and SSW3. Therefore, the detection device 1 can reduce the circuit size compared to when the operational amplifier 63, the transistor Tr, and the A / D conversion circuit 64 are provided corresponding to each of the photodiodes PD1 and PD3. Furthermore, the detection device 1 can improve the degree of detection flexibility by, for example, performing detection using light of different wavelengths corresponding to each of the photodiodes PD1 and PD3.

[0069] 9 is a timing waveform diagram showing an example of the operation of the detection device according to the embodiment. In the example shown in FIG. 9, the detection drive circuit 53 outputs a start control signal STV of a high level voltage at time t1, and detection of one frame (1F) begins. One frame (1F) is the period required to detect the photocurrent Id output from each of the photodiodes PD1, PD2, PD3, and PD4.

[0070] At time t2, the detection drive circuit 53 sets the start control signal STV to a low-level voltage. This starts measurement of one frame (1F). At time t3, a predetermined period after time t2, the readout period INT of the photodiodes PD1 and PD2 begins. That is, at time t3, the detection drive circuit 53 outputs high-level voltage readout control signals CH1 and CH2, turning on the connection switches SSW1 and SSW2. Also at time t3, the detection drive circuit 53 supplies a drive current ILED to the light source 60, turning on the light source 60.

[0071] As a result, during the readout period INT, the photodiodes PD1 and PD2 are connected to the operational amplifiers 63a and 63b via the connection switches SSW1 and SSW2, respectively. During the readout period INT, a photocurrent Id corresponding to the light irradiated on the photodiodes PD1 and PD2 flows, and the detection circuit 48 outputs a sensor output So corresponding to the photocurrent Id.

[0072] At time t4, the readout period INT for photodiodes PD1 and PD2 ends. At time t5, a predetermined period after time t4, the readout period INT for photodiodes PD3 and PD4 begins. That is, at time t5, the detection drive circuit 53 outputs high-level voltage readout control signals CH3 and CH4, turning on the connection switches SSW3 and SSW4. Also at time t5, the detection drive circuit 53 supplies a drive current ILED to the light source 60, turning on the light source 60.

[0073] As a result, during the readout period INT, the photodiodes PD3 and PD4 are connected to the operational amplifiers 63a and 63b via the connection switches SSW3 and SSW4, respectively. During the readout period INT, a photocurrent Id corresponding to the light irradiated to the photodiodes PD3 and PD4 flows, and the detection circuit 48 outputs a sensor output So corresponding to the photocurrent Id.

[0074] At time t6, the readout period INT of the photodiodes PD3 and PD4 ends, and detection of one frame (1F) is completed. After time t7, detection of the next frame (1F) is repeatedly executed.

[0075] A specific example of a vital data acquisition operation by the detection system 100 according to the embodiment will be described below. Fig. 10 is a sequence diagram illustrating the flow of a vital data acquisition operation in the detection system according to the embodiment. Note that in the following description, the sensor output So for each of the photodiodes PD1, PD2, PD3, and PD4 output from the detection circuit 48 is also referred to as a detection value Raw.

[0076] When the user of the detection device 1 operates the terminal device 2 to start acquiring vital data (step S001), the terminal device 2 transmits a vital data acquisition command (step S002) to the detection device 1. At this time, in the vital data acquisition process described below, if the drive current setting value set at the time of the previous vital data acquisition is stored, the terminal device 2 reads out the drive current setting value and transmits it together with the vital data acquisition command (step S002a).

[0077] When the detecting device 1 receives the vital data acquisition command transmitted from the terminal device 2, the detecting device 1 executes a vital data acquisition process shown in Fig. 11 (step S003). Fig. 11 is a flowchart showing an example of the vital data acquisition process in the detecting device according to the embodiment.

[0078] In the vital data acquisition process shown in Fig. 11, the control circuit 51 first executes a process for determining whether the detection device 1 is being worn (step S100). Fig. 12 is a sub-flowchart showing an example of the process for determining whether the detection device 1 is being worn. This example illustrates an example in which the light emission patterns of the first light source 60a and the second light source 60b, which emit green light, are changed to obtain the detection values ​​Raw for each of the photodiodes PD1, PD2, PD3, and PD4, and the wearing state is determined.

[0079] 13A is a conceptual diagram showing an example of the magnitude relationship between the detection values ​​of the photodiodes when the first determination process is performed. FIG. 13B is a conceptual diagram showing an example of the magnitude relationship between the detection values ​​of the photodiodes when the second determination process is performed. FIG. 13C is a conceptual diagram showing an example of the magnitude relationship between the detection values ​​of the photodiodes when the third determination process is performed. In FIGS. 13A, 13B, and 13C, the horizontal axis represents the positional relationship between the photodiodes PD1, PD2, PD3, and PD4 and the first light source 60a and the second light source 60b in the circumferential direction, and the vertical axis represents the levels of the detection values ​​of the photodiodes PD1, PD2, PD3, and PD4.

[0080] In the attachment determination process shown in Fig. 12, the control circuit 51 first executes a first determination process (step S110). Fig. 14 is a sub-flowchart showing an example of the first determination process.

[0081] In the first determination process shown in FIG. 14, the control circuit 51 turns on the first light source 60a (step S111) and determines whether the detection value Raw1 of the photodiode PD1 is less than the detection value Raw2 of the photodiode PD2 (step S112).

[0082] If the detection value Raw1 of photodiode PD1 is less than the detection value Raw2 of photodiode PD2 (step S112; Yes), the control circuit 51 then determines whether the detection value Raw3 of photodiode PD3 is greater than the detection value Raw4 of photodiode PD4 (step S113).

[0083] If the detection value Raw3 of the photodiode PD3 is greater than the detection value Raw4 of the photodiode PD4 (step S113; Yes), the control circuit 51 then determines whether the detection value Raw3 of the photodiode PD3 is greater than or equal to half the detection value Raw1 of the photodiode PD1 (step S114).

[0084] If the detection value Raw3 of the photodiode PD3 is equal to or greater than half the detection value Raw1 of the photodiode PD1 (step S114; Yes), the process returns to the attachment determination process shown in FIG.

[0085] If the detection value Raw1 of the photodiode PD1 is equal to or greater than the detection value Raw2 of the photodiode PD2 (step S112; No), if the detection value Raw3 of the photodiode PD3 is equal to or less than the detection value Raw4 of the photodiode PD4 (step S113; No), or if the detection value Raw3 of the photodiode PD3 is less than half the detection value Raw1 of the photodiode PD1 (step S114; No), the control circuit 51 determines that the attachment position of the detection device 1 is inappropriate (step S115), and returns to the attachment determination process shown in FIG. 12.

[0086] Returning to the wearing determination process shown in Fig. 12, if the wearing position of the detection device 1 is not determined to be inappropriate in the first determination process (Fig. 12, step S110) shown in Fig. 14 (step S116; No), the control circuit 51 then executes a second determination process (step S120). Fig. 15 is a sub-flowchart showing an example of the second determination process.

[0087] In the second determination process shown in FIG. 15, the control circuit 51 turns on the second light source 60b (step S121), and determines whether the detection value Raw1 of the photodiode PD1 is less than the detection value Raw2 of the photodiode PD2 (step S122).

[0088] If the detection value Raw1 of photodiode PD1 is less than the detection value Raw2 of photodiode PD2 (step S122; Yes), the control circuit 51 then determines whether the detection value Raw3 of photodiode PD3 is greater than the detection value Raw4 of photodiode PD4 (step S123).

[0089] If the detection value Raw3 of the photodiode PD3 is greater than the detection value Raw4 of the photodiode PD4 (step S123; Yes), the control circuit 51 then determines whether the detection value Raw2 of the photodiode PD2 is greater than or equal to half the detection value Raw4 of the photodiode PD4 (step S124).

[0090] If the detection value Raw2 of the photodiode PD2 is equal to or greater than half the detection value Raw4 of the photodiode PD4 (step S124; Yes), the process returns to the attachment determination process shown in FIG.

[0091] If the detection value Raw1 of the photodiode PD1 is equal to or greater than the detection value Raw2 of the photodiode PD2 (step S122; No), if the detection value Raw3 of the photodiode PD3 is equal to or less than the detection value Raw4 of the photodiode PD4 (step S123; No), or if the detection value Raw2 of the photodiode PD2 is less than half the detection value Raw4 of the photodiode PD4 (step S124; No), the control circuit 51 determines that the attachment position of the detection device 1 is inappropriate (step S125), and returns to the attachment determination process shown in FIG. 12.

[0092] Returning to the wearing determination process shown in Fig. 12, if the wearing position of the detection device 1 is not determined to be inappropriate in the second determination process (Fig. 12, step S120) shown in Fig. 15 (step S126; No), the control circuit 51 then executes a third determination process (step S130). Fig. 16 is a sub-flowchart showing an example of the third determination process.

[0093] In the third judgment process shown in Figure 16, the control circuit 51 turns on the first light source 60a and the second light source 60b (step S131) ​​and determines whether the detection value Raw1 of the photodiode PD1 is less than the detection value Raw2 of the photodiode PD2 (step S132).

[0094] If the detection value Raw1 of photodiode PD1 is less than the detection value Raw2 of photodiode PD2 (step S132; Yes), the control circuit 51 then determines whether the detection value Raw3 of photodiode PD3 is greater than the detection value Raw4 of photodiode PD4 (step S133).

[0095] If the detection value Raw3 of the photodiode PD3 is greater than the detection value Raw4 of the photodiode PD4 (step S133; Yes), the control circuit 51 then determines whether the detection value Raw2 of the photodiode PD2 is greater than or equal to the detection value Raw3 of the photodiode PD3 (step S134).

[0096] If the detection value Raw2 of the photodiode PD2 is equal to or greater than the detection value Raw3 of the photodiode PD3 (step S134; Yes), the control circuit 51 subsequently determines whether the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is less than half of the detection value Raw2 of the photodiode PD2 (step S135). If the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is less than half of the detection value Raw2 of the photodiode PD2 (step S135; Yes), the control circuit 51 sets the photodiode PD2 as a detection value acquisition target in the vital data generation process (step S200) (step S136), and returns to the wearing determination process shown in FIG.

[0097] If the detection value Raw2 of the photodiode PD2 is less than the detection value Raw3 of the photodiode PD3 (step S134; No), the control circuit 51 subsequently determines whether the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is less than half the detection value Raw3 of the photodiode PD3 (step S137). If the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is less than half the detection value Raw3 of the photodiode PD3 (step S137; Yes), the control circuit 51 sets the photodiode PD3 as a detection value acquisition target in the vital data generation process (step S200) (step S138), and returns to the attachment determination process shown in FIG.

[0098] If the detection value Raw1 of the photodiode PD1 is equal to or greater than the detection value Raw2 of the photodiode PD2 (step S132; No), if the detection value Raw3 of the photodiode PD3 is equal to or less than the detection value Raw4 of the photodiode PD4 (step S133; No), if the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is equal to or greater than half the detection value Raw2 of the photodiode PD2 (step S135; No), or if the difference between the detection value Raw2 of the photodiode PD2 and the detection value Raw3 of the photodiode PD3 is equal to or greater than half the detection value Raw3 of the photodiode PD3 (step S137; No), the control circuit 51 determines that the attachment position of the detection device 1 is inappropriate (step S139), and returns to the attachment determination process shown in FIG. 12.

[0099] Returning to the wearing determination process shown in FIG. 12, if the wearing position of the detection device 1 is not determined to be inappropriate in the third determination process (FIG. 12, step S130) shown in FIG. 16 (step S140; No), the process returns to the vital data acquisition process shown in FIG. 11.

[0100] If the wearing position of the detection device 1 is determined to be inappropriate in the first determination process (FIG. 12, step S110) shown in FIG. 14 (step S116; Yes), if the wearing position of the detection device 1 is determined to be inappropriate in the second determination process (FIG. 12, step S120) shown in FIG. 15 (step S126; Yes), or if the wearing position of the detection device 1 is determined to be inappropriate in the third determination process (FIG. 12, step S130) shown in FIG. 16 (step S140; Yes), the control circuit 51 transmits a command to instruct the terminal device 2 to re-wear the detection device 1 (step S141), and returns to the vital data acquisition process shown in FIG. 11.

[0101] 11 , if a command to instruct the terminal device 2 to reattach the detection device 1 is transmitted in the attachment determination process (FIG. 12, step S139) (step S142; Yes), the vital data acquisition process ends. Upon receiving the command to instruct the terminal device 2 to reattach the detection device 1, the terminal device 2 notifies the user of information urging the user to reattach the detection device 1 (step S004).

[0102] Specifically, a method for notifying the user of information urging the user to reattach the detection device 1 in the terminal device 2 may be, for example, to display image information urging the user to reattach the detection device 1 on a display panel of the terminal device 2. Furthermore, a method for notifying the user of information urging the user to reattach the detection device 1 in the terminal device 2 may be, for example, to output audio information urging the user to reattach the detection device 1 from a speaker of the terminal device 2.

[0103] In the present embodiment, when the wearing determination process ( FIG. 12 ) of the detection device 1 is performed, the light emission patterns of the first light source 60a and the second light source 60b, which emit green light, are changed to acquire the detection values ​​Raw for each of the photodiodes PD1, PD2, PD3, and PD4, and the wearing state is determined. However, this is not limiting. Any other suitable embodiment may be used as long as the process proceeds to the vital data generation process ( FIG. 17 ) when the difference between the detection values ​​of the two photodiodes located on both sides of the light source in the circumferential direction is within a predetermined range. Furthermore, the light source 60 may emit light of any color other than green light when performing the wearing determination process of the detection device 1. In particular, in an embodiment in which a pulse wave is generated as vital data, the light source 60 may emit light of, for example, red light or near-infrared light when performing the wearing determination process of the detection device 1. In this case, in the third determination process shown in FIG. 16 , the photodiode PD1 or the photodiode PD4 may be set as the target for obtaining the detection value in the vital data generation process (step S200).

[0104] In the attachment determination process (FIG. 12, step S139), if a command to instruct the terminal device 2 to reattach the detection device 1 has not been transmitted (step S142; No), the control circuit 51 subsequently executes a vital data generation process (step S200). FIG. 17 is a sub-flowchart showing an example of the vital data generation process. Note that this example illustrates an aspect in which a pulse wave is generated by acquiring time-series values ​​of the detection value Raw (hereinafter also referred to as "time domain data RawTS") as vital data.

[0105] In the vital data generation process shown in Fig. 17, the control circuit 51 first determines whether or not the drive current set value Iset has been received from the terminal device 2 (step S201). If the drive current set value Iset has not been received (step S201; No), the control circuit 51 executes an initial current setting process (step S210). Fig. 18 is a sub-flowchart showing an example of the initial current setting process.

[0106] In the initial current setting process shown in FIG. 18, the control circuit 51 sets the initial value of the initial setting current Iinit to half the maximum value Imax that can be set as the drive current ILED (step S211), sets the initial setting current Iinit as the drive current ILED (step S212), and acquires the time domain data RawTS of the photodiode PD2 (or PD3) that has been set as the detection value acquisition target in the vital data generation process (step S200) in the third determination process (see FIG. 16) of the attachment determination process S100 (step S213).

[0107] The control circuit 51 determines whether the time domain data RawTS is less than the maximum value Rawmax that can be obtained by the detection circuit 48 (step S214), and if the time domain data RawTS has reached the maximum value Rawmax that can be obtained by the detection circuit 48 (step S214; No), it sets the initial setting current Iinit to half its value (step S215) and repeats the processing from step S212 onwards.

[0108] If the time domain data RawTS is less than the maximum value Rawmax that can be acquired by the detection circuit 48 (step S214; Yes), the process returns to the vital data generation process shown in Fig. 17, and then the first detection process is executed (step S220). Fig. 19 is a sub-flowchart showing an example of the first detection process.

[0109] In the first detection process shown in FIG. 19, the control circuit 51 performs a Fourier transform process (here, an FFT (Fast Fourier Transform) process) on the time domain data RawTS acquired in step S213 of the initial current setting process (FIG. 18), extracts frequency band components (e.g., 0.5 Hz to 3 Hz) corresponding to the pulse wave as pulse wave components, and generates vital data S (step S221), and temporarily stores the generated vital data S in the memory circuit 57 as the previous value Spv (step S222).

[0110] Next, the control circuit 51 determines whether or not the value obtained by adding ΔI to the driving current ILED is equal to or less than the maximum value Imax that can be set as the driving current ILED (step S223).

[0111] If the value obtained by adding ΔI to the drive current ILED is equal to or less than the maximum value Imax that can be set as the drive current ILED (step S223; Yes), the control circuit 51 adds ΔI to the drive current ILED (step S224), acquires the time domain data RawTS (step S225), and determines whether the acquired time domain data RawTS is less than the maximum value Rawmax that can be acquired by the detection circuit 48 (step S226).

[0112] If the time domain data RawTS has not reached the maximum value Rawmax that can be obtained by the detection circuit 48 (step S226; Yes), the control circuit 51 extracts the pulse wave component from the time domain data RawTS obtained in step S225 to generate vital data S (step S227), and determines whether the generated vital data S is less than the previous value Spv of the vital data (step S228).

[0113] If the vital data S generated in step S227 is equal to or greater than the previous vital data value Spv (step S228; No), the currently generated vital data S is temporarily stored in the memory circuit 57 as the previous value Spv, and the current drive current ILED is temporarily stored in the memory circuit 57 as the drive current set value Iset (step S229), and the processing from step S223 onwards is repeatedly executed. Then, if the vital data S generated in step S227 is less than the previous vital data value Spv (step S228; Yes), the previous vital data value Spv is temporarily stored in the memory circuit 57 as the maximum vital data value Smax (step S230), and the processing returns to the vital data generation processing shown in FIG.

[0114] If the value obtained by adding ΔI to the drive current ILED exceeds the maximum value Imax that can be set as the drive current ILED (step S223; No), or if the time domain data RawTS reaches the maximum value Rawmax that can be acquired by the detection circuit 48 (step S226; No), the process returns to the vital data generation process shown in FIG. 17.

[0115] Returning to the vital data generation process shown in Fig. 17, if the maximum value Smax of the vital data is temporarily stored in the memory circuitry 57 in step S229 of the first detection process (Fig. 19) (step S231; Yes), the control circuit 51 then executes the second detection process (step S240). Fig. 20 is a sub-flowchart showing an example of the second detection process.

[0116] In the second detection process shown in FIG. 20, the control circuit 51 temporarily stores the vital data S generated in step S227 of the first detection process (FIG. 19) in the memory circuit 57 as the previous value Spv (step S241), and determines whether the value obtained by subtracting ΔI from the drive current ILED is equal to or greater than the minimum value Imin that can be set as the drive current ILED (step S242).

[0117] If the value obtained by subtracting ΔI from the drive current ILED is equal to or greater than the minimum value Imin that can be set as the drive current ILED (step S242; Yes), the control circuit 51 subtracts ΔI from the drive current ILED (step S243), acquires the time domain data RawTS (step S244), and determines whether the acquired time domain data RawTS is greater than the minimum value Rawmin that can be acquired by the detection circuit 48 (step S245).

[0118] If the time domain data RawTS has not reached the minimum value Rawmin that can be obtained by the detection circuit 48 (step S245; Yes), the control circuit 51 extracts the pulse wave component from the time domain data RawTS obtained in step S244 to generate vital data S (step S246), and determines whether the generated vital data S is less than the previous value Spv of the vital data (step S247).

[0119] If the vital data S generated in step S246 is equal to or greater than the previous vital data value Spv (step S247; No), the currently generated vital data S is temporarily stored in the memory circuit 57 as the previous value Spv, and the current drive current ILED is temporarily stored in the memory circuit 57 as the drive current set value Iset (step S248), and the processing from step S242 onwards is repeatedly executed. Then, if the vital data S generated in step S246 is less than the previous vital data value Spv (step S246; Yes), the previous vital data value Spv is temporarily stored in the memory circuit 57 as the maximum vital data value Smax (step S249), and the processing returns to the vital data generation processing shown in FIG.

[0120] If the value obtained by subtracting ΔI from the drive current ILED falls below the minimum value Imin that can be set as the drive current ILED (step S242; No), or if the time domain data RawTS reaches the minimum value Imin that can be acquired by the detection circuit 48 (step S245; No), the process returns to the vital data generation process shown in FIG. 17.

[0121] Returning to the vital data generation process shown in Fig. 17, if the maximum value Smax of the vital data is not temporarily stored in the memory circuitry 57 in step S230 of the first detection process (Fig. 19) (step S231; No), or if the maximum value Smax of the vital data is not temporarily stored in the memory circuitry 57 in step S249 of the second detection process (Fig. 20) (step S250; No), the control circuit 51 transmits a command to instruct the terminal device 2 to remeasure the vital data (step S252), and the process returns to the vital data acquisition process shown in Fig. 11, where it ends. Upon receiving the remeasurement command transmitted from the detection device 1, the terminal device 2 notifies the user of information urging the user to remeasure the vital data (step S005).

[0122] Specifically, a method for notifying the user of information urging the user to remeasure the vital data in the terminal device 2 may be, for example, to display image information urging the user to remeasure the vital data on a display panel of the terminal device 2. Furthermore, a method for notifying the user of information urging the user to remeasure the vital data in the terminal device 2 may be, for example, to output audio information urging the user to remeasure the vital data from a speaker of the terminal device 2.

[0123] In step S249 of the second detection process (FIG. 20), if the maximum value Smax of the vital data is temporarily stored in the memory circuitry 57 (step S250; Yes), the control circuit 51 transmits the maximum value Smax of the vital data temporarily stored in the memory circuitry 57 to the terminal device 2. At this time, the control circuit 51 transmits the drive current setting value Iset temporarily stored in the memory circuitry 57 in step S229 of the first detection process (FIG. 19) or step S248 of the second detection process (FIG. 20) together with the vital data (step S251).

[0124] The terminal device 2 stores the drive current set value Iset transmitted from the detection device 1 together with the vital data (step S006).

[0125] In step S201 of the vital data generation process (FIG. 17), if the drive current setting value Iset is received from the terminal device 2 (step S201; Yes), the control circuit 51 does not proceed to the initial current setting process (step S210), but instead applies the drive current setting value Iset received from the terminal device 2 as the drive current ILED (step S202) and acquires the time domain data RawTS (step S203).

[0126] Then, the control circuit 51 extracts the pulse wave component from the time domain data RawTS acquired in step S203 to generate vital data S (step S203), and transmits the generated vital data S to the terminal device 2 (step S204).

[0127] In the vital data acquisition operation in the detection system 100 according to the embodiment described above and the vital data acquisition process in the detection device 1, in the first vital data acquisition operation and vital data acquisition process in which the drive current set value Iset is not stored in the terminal device 2, the drive current ILED optimized to maximize the intensity of the vital data is set as the drive current set value Iset and stored in the terminal device 2. Then, in subsequent vital data acquisition operations and vital data acquisition processes in which the drive current set value Iset is stored in the terminal device 2, the vital data is acquired by applying the drive current set value Iset optimized in the first vital data acquisition operation and vital data acquisition process.

[0128] This allows for time-dependent management of the user's physical condition. Specifically, for example, by providing a temperature sensor in the detection device 1, it is possible to acquire time-dependent changes in the user's physical condition by correlating the user's body temperature with the pulse wave. Furthermore, for example, by understanding changes in the amplitude of the pulse wave over time, more detailed physical condition management is possible.

[0129] Although preferred embodiments of the present invention have been described above, the present invention is not limited to such embodiments. The contents disclosed in the embodiments are merely examples, and various modifications are possible without departing from the spirit of the present invention. Appropriate modifications made without departing from the spirit of the present invention naturally fall within the technical scope of the present invention. At least one of various omissions, substitutions, and modifications of components can be made without departing from the gist of each of the above-described embodiments and modifications.

[0130] REFERENCE SIGNS LIST 1 Detection device 2 Terminal device 10A First optical sensor 10B Second optical sensor 11 Lower electrode 12 Lower buffer layer 13 Active layer 14 Upper buffer layer 15, 15A, 15B Upper electrode 21 Sensor substrate 48 Detection circuit 51 Control circuit 52 Power supply circuit 53 Detection drive circuit 56 Data processing circuit 57 Memory circuit 60 Light source 60a First light source 60b Second light source 63, 63a, 63b Operational amplifier 64, 64a, 64b A / D conversion circuit 65, 65a, 65b Constant current source 70 Flexible printed circuit board 100 Detection system 200 Housing ILED Drive current INT Readout period Iset Drive current set value PD, PD1, PD2, PD3, PD4 Photodiodes

Claims

A detection device having a ring-shaped housing that can be attached to a living body and that acquires vital data of a user, a plurality of photodiodes provided inside the housing and arranged in a circumferential direction of the housing; a light source that irradiates the plurality of photodiodes with light; a control circuit that controls a drive current supplied to the light source and acquires vital data based on detection values ​​output from the plurality of photodiodes; Equipped with The plurality of photodiodes include a first photodiode and a second photodiode provided on both sides of the light source in the circumferential direction; The control circuit acquiring vital data when at least a difference value between the detection value of the first photodiode and the detection value of the second photodiode is within a predetermined range; Detection device. 　 The light source includes one or more light sources that emit any one of near-infrared light, red light, and green light. The detection device according to claim 1 . 　 The vital data includes a pulse wave of the user. The detection device according to claim 1 . 　 A detection device according to any one of claims 1 to 3; a terminal device that controls acquisition of vital data in the detection device; having Detection system. 　 The control circuit The drive current is changed to acquire the vital data, and the drive current at which the vital data is maximized is transmitted to the terminal device as a drive current setting value. The detection system of claim 4 . 　 The terminal device storing the drive current setting value received from the detection device; When transmitting a vital data acquisition command to the detection device, the drive current setting value is read and transmitted together with the vital data acquisition command. The detection system of claim 5 . 　 The control circuit acquiring the vital data by applying the drive current setting value received from the terminal device; The detection system of claim 6 . 　 The terminal device When receiving from the control circuit information indicating that the difference value between the detection value of the first photodiode and the detection value of the second photodiode is outside a predetermined range, the control circuit notifies the user of information urging the user to reattach the photodiode. The detection system of claim 4 . 　 The terminal device When receiving a notification from the control circuit that the vital data could not be acquired, the control circuit notifies the user of information urging the user to reacquire the vital data. The detection system of claim 4 .

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