Epoxy resin composition, cured product, and semiconductor device

Abstract

Provided is an epoxy resin composition in which a void is less likely to be generated after molding. Moreover, provided are: a cured product of said epoxy resin composition; a semiconductor device comprising said cured product; and a method for manufacturing said semiconductor device.　This epoxy resin composition comprises an epoxy resin (A), a curing accelerator (B), and an inorganic filling material (C), and satisfies expression (V).　Expression (V): Viscosity (1)×viscosity (2)≤500 The viscosity (1) is the viscosity (Pa∙s) of the epoxy resin composition at 25ºC. The viscosity (2) is the viscosity (Pa∙s) of the epoxy resin composition at 150ºC.

Description

Epoxy resin composition, cured product, and semiconductor device

[0001] The present invention relates to an epoxy resin composition, a cured product, a semiconductor device, and a method for producing a semiconductor device.

[0002] Many semiconductor elements, such as integrated circuits, that make up semiconductor devices are used in a state where they are encapsulated with an encapsulant. There are several methods for encapsulating semiconductor elements, one of which is known as compression molding. Compression molding involves placing a liquid or granular resin encapsulant into a mold, heating and melting it as needed, and compressing and molding it. This method is suitable for producing relatively large molded products. In recent years, compression molding has been increasingly used to encapsulate semiconductor elements. This is due in part to the widespread use of wafer-level chip-size packaging technology. This technology involves compression molding using an encapsulant (compression molding material) at the wafer stage, hardening it to encapsulate multiple semiconductor elements at once, and then separating them into individual pieces.

[0003] Conventional curable resin compositions used for encapsulating semiconductor elements by compression molding have generally been solid (e.g., granular) compositions. However, in recent years, with the development of new compression molding techniques, liquid curable resin compositions have increasingly been used. Such liquid curable resin compositions are called liquid compression molding (LCM) materials. Liquid epoxy resin compositions are used as LCM materials from the viewpoint of balancing various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness.

[0004] As semiconductor devices and electronic components become more sophisticated, LCM materials are required to have high reliability. For example, the presence of voids in the cured LCM material (encapsulant) can reduce the reliability of semiconductor devices. Therefore, LCM materials are required to be less likely to generate voids when cured.

[0005] It is known that when encapsulating semiconductor devices and the like with an LCM material, voids occur in areas where the LCM material is not sufficiently filled. Therefore, to prevent voids, an LCM material that is less likely to leave unfilled areas (i.e., exhibits high fillability) is required. For example, Patent Document 1 proposes a liquid LCM material containing an epoxy resin, a curing agent, an inorganic filler, a silane coupling agent, etc., to ensure high reliability in compression molding.

[0006] JP 2013-10940 A

[0007] However, even the LCM material described in Patent Document 1 has not been able to solve the problem of voids occurring in the sealed body after molding (sealing).

[0008] Therefore, an object of the present invention is to provide an epoxy resin composition that is less likely to generate voids after molding. It is also an object of the present invention to provide a cured product of the epoxy resin composition, a semiconductor device including the cured product, and a method for manufacturing the semiconductor device. Hereinafter, "voids after molding" may be simply referred to as "voids."

[0009] As a result of extensive research into achieving the above object, the present inventors have found that the problem can be solved by using an epoxy resin composition in which the product of the viscosity at 25°C and the viscosity at 150°C falls within a certain range. The present invention was completed based on these findings.

[0010] That is, the present invention provides an epoxy resin composition comprising an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C), which satisfies the following formula (V): Viscosity (1) × Viscosity (2) ≦ 500 (V), where Viscosity (1): Viscosity (Pa s) of the epoxy resin composition at 25°C, and Viscosity (2): Viscosity (Pa s) of the epoxy resin composition at 150°C.

[0011] The epoxy resin composition preferably contains, as the inorganic filler (C), an inorganic filler (C1) that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms.

[0012] The silane coupling agent (S1) preferably has a reactive functional group.

[0013] The silane coupling agent (S1) is a compound represented by the following formula (I): [In formula (I), n is an integer of 4 to 15. R １ ~R ３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. ４ is a group containing a reactive functional group.]

[0014] The glass transition temperature Tg is preferably 130° C. or lower.

[0015] The epoxy resin composition preferably has a viscosity of 10 to 1000 Pa·s at 25°C and a viscosity of 0.1 to 0.7 Pa·s at 150°C.

[0016] The content of the inorganic filler (C1) relative to the epoxy resin composition (100% by mass) is preferably 65 to 90% by mass.

[0017] The amount of the silane coupling agent (S1) used for surface treatment of the inorganic filler (C1) is preferably 0.5 to 2.5% by mass.

[0018] The epoxy resin composition is preferably a liquid compression molding material.

[0019] The present invention also provides a cured product of the above epoxy resin composition.

[0020] The present invention also provides a semiconductor device comprising the above-mentioned cured product.

[0021] The present invention also provides a semiconductor device comprising: a support; a semiconductor element mounted on the support; and the cured product that encapsulates the semiconductor element.

[0022] The present invention also provides a method for manufacturing a semiconductor device, which includes the steps of: supplying the epoxy resin composition onto a laminate including a support and a semiconductor element mounted on the support; filling a gap between the support and the semiconductor element with the epoxy resin composition to form a molded body; and curing the molded body to encapsulate the semiconductor element, thereby obtaining an encapsulated body.

[0023] The epoxy resin composition of the present invention is less likely to produce voids after molding, and therefore semiconductor devices comprising a cured product of the epoxy resin composition exhibit high reliability.

[0024] FIG. 1 is a diagram for explaining one embodiment of the method for manufacturing a semiconductor device of the present invention; FIG. 2 is a diagram for explaining another embodiment of the method for manufacturing a semiconductor device of the present invention; FIG. 3 is a diagram for explaining "Evaluation 5: Measurement of voids"; FIG. 4 is a diagram corresponding to evaluation A in "Evaluation 5: Measurement of voids"; FIG. 5 is a diagram corresponding to evaluation B in "Evaluation 5: Measurement of voids"; and FIG. 6 is a diagram corresponding to evaluation C in "Evaluation 5: Measurement of voids".

[0025] <Epoxy Resin Composition> The epoxy resin composition of the present invention contains an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C), and satisfies the following formula (V): Viscosity (1) × Viscosity (2) ≦ 500 (V), where Viscosity (1): Viscosity (Pa s) of the epoxy resin composition at 25°C, and Viscosity (2): Viscosity (Pa s) of the epoxy resin composition at 150°C.

[0026] The epoxy resin composition may contain, as the inorganic filler (C), an inorganic filler (C1) that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms. The epoxy resin composition may also contain a coupling agent (D).

[0027] In the above formula (V), the value of viscosity (1) x viscosity (2) is not particularly limited as long as it is 500 or less, but is preferably 480 or less, more preferably 450 or less, more preferably 400 or less, even more preferably 300 or less, and particularly preferably 200 or less. Also, for example, it is preferably 30 or more. In other words, the value of viscosity (1) x viscosity (2) is preferably 30 to 500. When the value calculated by formula (V) is within the above range, the generation of voids can be further reduced.

[0028] Although it is not clear why the occurrence of voids can be reduced by keeping the value calculated by formula (V) within the above range, the following is presumed: In compression molding, the LCM material is compression molded as it is heated from a room temperature range (e.g., 25°C) to a high temperature range (e.g., 150°C), and therefore, by maintaining a low viscosity state from the room temperature range to the high temperature range, it is possible to seal objects such as semiconductors without gaps, and it is thought that voids in the cured product (sealed body) can be suppressed.

[0029] More specifically, the viscosity (1) in the above formula (V) is the viscosity of the epoxy resin composition measured using an HB-DV viscometer at 25°C and 10 rpm, and even more specifically, the viscosity of the epoxy resin composition at 25°C measured by the method described in the Examples. More specifically, the viscosity (2) is the viscosity of the epoxy resin composition at 150°C measured using a dynamic viscoelasticity device under conditions of a measurement frequency of 10 Hz, a strain of 0.5, a gap of 0.5 mm, and a measurement frequency of 1 second, and even more specifically, the viscosity of the epoxy resin composition at 150°C measured by the method described in the Examples.

[0030] Epoxy Resin (A) The epoxy resin composition contains the epoxy resin (A), which can impart high electrical insulation to the cured product. The number of epoxy groups in the epoxy resin (A) is not particularly limited as long as it is one or more, but it is preferably two or more (i.e., a polyfunctional epoxy resin). The epoxy resin (A) can be used alone or in combination of two or more.

[0031] The epoxy resin (A) may be liquid or solid at room temperature (25° C.), but is preferably liquid from the viewpoint of the viscosity of the epoxy resin composition. A solid epoxy resin can also be preferably used when it is used in combination with a liquid epoxy resin to form a liquid mixture.

[0032] The epoxy resin (A) is not particularly limited, and examples thereof include bisphenol type epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, and bisphenol AF type epoxy resins, bixylenol type epoxy resins, cyclohexane type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, and anthracene type epoxy resins. , glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, cresol novolac type epoxy resins, biphenyl type epoxy resins, fluorene type epoxy resins, biphenyl aralkyl epoxy resins, aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylmethane type epoxy resins, aminophenol type epoxy resins, and silicone-modified epoxy resins.

[0033] The epoxy resin (A) can be classified into aromatic epoxy resins and aliphatic epoxy resins. Examples of aromatic epoxy resins include bisphenol-type epoxy resins such as bisphenol A-type epoxy resins such as 2,2-bis(4-glycidyloxyphenyl)propane, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, and bisphenol AF-type epoxy resins; novolac-type epoxy resins such as naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, and cresol novolac-type epoxy resins; fluorene-type epoxy resins; biphenyl aralkyl epoxy resins; diepoxy resins having a phenyl group such as p-tert-butylphenyl glycidyl ether and 1,4-phenyldimethanol diglycidyl ether; biphenyl-type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; aminophenol-type epoxy resins such as diglycidyl aniline, diglycidyl toluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine; naphthalene-type epoxy resins; and epoxy resins having a plant-derived skeleton. Examples of aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl glycidyl ethers (e.g., butyl glycidyl ether, 2-ethylhexyl glycidyl ether) and alkenyl glycidyl ethers (e.g., vinyl glycidyl ether, allyl glycidyl ether); difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers (e.g., alkylene glycol diglycidyl ether, polytetramethylene glycol diglycidyl ether), and alkenylene glycol diglycidyl ether; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols, such as trimethylolpropane, pentaerythritol, and dipentaerythritol (e.g., trimethylolpropane triglycidyl ether, pentaerythritol (tri- or tetra-)glycidyl ether, and dipentaerythritol (tri-, tetra-, penta-, or hexa-)glycidyl ether).

[0034] Among these, from the viewpoint of reducing voids, the epoxy resin (A) preferably contains at least one selected from the group consisting of bisphenol-type epoxy resins such as bisphenol F-type epoxy resins, aminophenol-type epoxy resins, and aliphatic epoxy resins such as polyalkylene glycol diglycidyl ethers.

[0035] Specific examples of liquid epoxy resins include "YDF-8170" (bisphenol F type epoxy resin), "YDF-8125" (bisphenol A type epoxy resin), "ZX-1658" and "ZX-1658GS" (liquid 1,4-glycidylcyclohexane) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "HP-4032", "HP-4032D", and "HP-4032SS" (naphthalene type epoxy resin) manufactured by DIC Corporation; and "jER828US", "jER828EL" (bisphenol A type epoxy resin), "jER806", "jER807" (bisphenol F type epoxy resin), and "jER152" ( Examples of epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, jER630, jER630LSD, and EP3980S (aminophenol epoxy resin), YX7400 (high impact resilience epoxy resin), Nippon Steel Chemical & Material Co., Ltd.'s ZX1059 (a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin), Nagase ChemteX Corporation's EX-721 (glycidyl ester epoxy resin), Yokkaichi Synthetic Co., Ltd.'s Epoxy Resin (polytetramethylene glycol diglycidyl ether), and Daicel Corporation's Celloxide 2021P (alicyclic epoxy resin).

[0036] Specific examples of solid epoxy resins include "HP-4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), "N-690" (cresol novolac type epoxy resin), "N-695" (cresol novolac type epoxy resin), "HP-7200", "HP-7200L", "HP-7200HH", "HP-7200H", and "HP-7200HH" manufactured by DIC Corporation. H" (dicyclopentadiene type epoxy resin), "EXA7311", "EXA7311-G3", "EXA7311-G4", "EXA7311-G4S", "HP6000" (naphthylene ether type epoxy resin), "EPPN-502H" (trisphenol type epoxy resin), "NC-7000-L" (naphthol novolac type epoxy resin), "NC-3000-H", "NC-3000", "NC-3000" manufactured by Nippon Kayaku Co., Ltd. -L," "NC-3100" (biphenyl type epoxy resin), "ESN475V" (naphthol type epoxy resin), "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd., "YX4000H," "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bixylenol type epoxy resin), "YL7760" (bisphenol AF type epoxy resin), "YX Examples of epoxy resins that can be used include "8800" (anthracene-type epoxy resin), "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd., "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation, and "jER1010" (solid bisphenol A-type epoxy resin), "jER1031S" (tetraphenylethane-type epoxy resin), and "jER157S70" (bisphenol novolac-type epoxy resin) manufactured by Mitsubishi Chemical Corporation.

[0037] The epoxy equivalent of the epoxy resin (A) is not particularly limited, but is preferably, for example, 30 to 800 g / eq, more preferably 40 to 600 g / eq, and even more preferably 50 to 500 g / eq.

[0038] The content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. It is also preferably 60% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. That is, the content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is preferably 5 to 60% by mass, more preferably 10 to 50% by mass, more preferably 15 to 40% by mass, even more preferably 20 to 35% by mass, and particularly preferably 20 to 30% by mass. By having the epoxy resin (A) content within the above range, the thermal expansion of the cured product tends to be reduced and the toughness tends to be improved.

[0039] Curing accelerator (B) The curing accelerator (B) has the property of accelerating the curing of the epoxy resin. The curing accelerator is not particularly limited, but examples thereof include imidazole-based curing accelerators, tertiary amine-based curing accelerators, and phosphorus-based curing accelerators. Among these, imidazole-based curing accelerators are preferred from the viewpoint of reliability. The curing accelerator (B) can be used alone or in combination of two or more.

[0040] Examples of the imidazole curing accelerator include imidazole compounds such as 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-s-triazine isocyanuric acid adduct, epoxy-imidazole adduct compounds, acrylate-imidazole adduct compounds, and 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine. Commercially available products include 2-ethyl-4-methylimidazole (product name "2E4MZ"), 2-phenyl-4-methylimidazole (product name "2P4MZ"), 2-phenyl-4-methyl-5-hydroxymethylimidazole (product name "2P4MHZ-PW"), 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine (product name "2MZA-PW"), "2MZ-OK", "2MA-OK", and "2PHZ", all manufactured by Shikoku Chemical Industry Co., Ltd. In addition, encapsulated imidazole, also known as microencapsulated imidazole or epoxy adduct imidazole, may also be used. Commercially available products include "HX3941HP", "HXA3942HP", "HXA3922HP", "HXA3792", "HX3748", "HX3721", "HX3722", "HX3088", "HX3741", "HX3742", and "HX3613" (all manufactured by Asahi Kasei Corporation), "PN-23J", "PN-40J", and "PN-50" (manufactured by Ajinomoto Fine-Techno Co., Ltd.), and "FXR-1121" (manufactured by Fuji Chemical Industry Co., Ltd.). Among imidazole-based curing accelerators, acrylate-imidazole adduct compounds are preferred from the viewpoint of pot life.

[0041] Examples of tertiary amine curing accelerators include benzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, tetramethylguanidine, triethanolamine, N,N'-dimethylpiperazine, triethylenediamine, 1,8-diazabicyclo[5.4.0]undecene, 1,5-diazabicyclo[4.3.0]nonene, and salts thereof. Examples of the salts include the formate, octylate, p-toluenesulfonate, o-phthalate, phenol salt, and phenol novolac resin salt of 1,8-diazabicyclo[5.4.0]undecene, and the formate, octylate, p-toluenesulfonate, o-phthalate, phenol salt, and phenol novolac resin salt of 1,5-diazabicyclo[4.3.0]nonene.

[0042] Examples of phosphorus-based curing accelerators include phosphorus compounds such as triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium tetraphenylborate, triphenylphosphine triphenylborane, and 1,2-bis-(diphenylphosphino)ethane.

[0043] The content of the curing accelerator (B) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.4% by mass or more, and particularly preferably 0.6% by mass or more. Furthermore, the content is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 2% by mass or less, and particularly preferably 1% by mass or less. That is, the content of the curing accelerator (B) relative to the epoxy resin composition (100% by mass) is preferably 0.01 to 5% by mass, more preferably 0.1 to 3% by mass, more preferably 0.2 to 2% by mass, even more preferably 0.4 to 1% by mass, and particularly preferably 0.6 to 1% by mass. Having the curing accelerator (B) content within the above range tends to improve curability and facilitate molding. Furthermore, the occurrence of voids tends to be reduced.

[0044] The content of the curing accelerator (B) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is not particularly limited, but is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1% by mass or more, and particularly preferably 2% by mass or more. Furthermore, the content is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 15% by mass or less, even more preferably 10% by mass or less, and particularly preferably 6% by mass or less. That is, the content of the curing accelerator (B) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, more preferably 1 to 15% by mass, even more preferably 2 to 10% by mass, and particularly preferably 2 to 6% by mass. Having the curing accelerator (B) content within the above range tends to improve curability and facilitate molding. Furthermore, the occurrence of voids tends to be reduced.

[0045] Inorganic Filler (C) The inorganic filler (C) is not particularly limited, but is preferably (1) a filler having the property of suppressing volumetric shrinkage (cure shrinkage) resulting from the curing reaction of the epoxy resin composition, (2) a filler having the property of suppressing volumetric change (thermal shrinkage) due to heating of the cured product, i.e., a filler having the effect of lowering the thermal expansion coefficient when added, or (3) a filler having both of these properties.

[0046] The epoxy resin composition may contain, as the inorganic filler (C), an inorganic filler (C1) that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms. The epoxy resin composition may also contain an inorganic filler other than the inorganic filler (C1).

[0047] Examples of inorganic fillers other than the inorganic filler (C1) include inorganic fillers surface-treated with a compound other than the silane coupling agent (S1), such as inorganic filler (C2) surface-treated with a silane coupling agent (S2) having a hydrocarbon group having 3 or less carbon atoms, and inorganic filler (C3) surface-treated with a compound other than the silane coupling agent, and inorganic filler (C4) that has not been surface-treated.

[0048] Examples of the inorganic filler (C) include inorganic particles such as silica (silicon dioxide), silicon carbide, silicon nitride, alumina (aluminum oxide), aluminum nitride, aluminum hydroxide, aluminum silicate, magnesium silicate, calcium silicate, calcium carbonate, barium sulfate, barium carbonate, titanium oxide, lime sulfate, potassium titanate, magnesium carbonate, zinc oxide, boron nitride, and zirconia (zirconium oxide), as well as surface-treated particles thereof. Among these, silica is preferred from the viewpoint of achieving a high loading.

[0049] The shape of the inorganic filler (C) is not particularly limited, and examples thereof include spherical (e.g., spherical, nearly spherical), polyhedral, rod-like (e.g., cylindrical, prismatic), plate-like, flaky, and irregular shapes. Among these, spherical shapes are preferred from the viewpoint of achieving a high loading amount.

[0050] The average particle size of the inorganic filler (C) is not particularly limited, but is preferably 1 nm to 5 μm, more preferably 0.1 to 3 μm, and even more preferably 0.3 to 1 μm. Having the average particle size of the inorganic filler (C) within the above range tends to reduce the occurrence of voids. Two or more inorganic fillers with different average particle sizes may be used in combination to adjust the viscosity of the epoxy resin composition. In this specification, the average particle size of the inorganic filler (C) refers to the volume-average particle size D50 (the particle size at 50% of the cumulative size from the smallest diameter in the volume-based particle size distribution) measured using a laser diffraction / scattering particle size distribution analyzer (product name: LS 13 320, manufactured by Beckman Coulter, Inc.).

[0051] The content of the inorganic filler (C) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably, for example, 40% by mass or more, more preferably 50% by mass or more, and even more preferably 60% by mass or more. It is also preferably, for example, 95% by mass or less, more preferably 90% by mass or less, and even more preferably 88% by mass or less. That is, the content of the inorganic filler (C) relative to the epoxy resin composition (100% by mass) is, for example, preferably 40 to 95% by mass, more preferably 50 to 90% by mass, and even more preferably 60 to 88% by mass. Having the inorganic filler (C) content within the above ranges tends to improve the filling properties and workability of the epoxy resin composition.

[0052] The content of the inorganic filler (C) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is not particularly limited, but is preferably 100% by mass or more, more preferably 160% by mass or more, even more preferably 200% by mass or more, and particularly preferably 220% by mass or more. Furthermore, it is preferably 1000% by mass or less, more preferably 800% by mass or less, even more preferably 700% by mass or less, and particularly preferably 600% by mass or less. That is, the content of the inorganic filler (C) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is preferably 100 to 1000% by mass, more preferably 160 to 800% by mass, even more preferably 200 to 700% by mass, and particularly preferably 220 to 600% by mass. Having the inorganic filler (C) content within the above ranges tends to improve the filling properties and workability of the epoxy resin composition.

[0053] Inorganic filler (C1) The inorganic filler (C1) is an inorganic filler that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms. By including the inorganic filler that has been surface-treated with the silane coupling agent (S1), the epoxy resin composition tends to further reduce the generation of voids.

[0054] The inorganic filler (C1) having a long-chain hydrocarbon group on its surface has high compatibility with the epoxy resin (A), and therefore the epoxy resin composition containing the inorganic filler (C1) tends to have a low viscosity at room temperature (25°C) and to reduce the occurrence of voids.

[0055] The silane coupling agent (S1) is a silane coupling agent having a hydrocarbon group having 4 to 15 carbon atoms. The silane coupling agent is a silane compound having a substituent reactive with inorganic particles, and examples of the substituent include an alkylsilane group and an alkoxysilane group. The number of carbon atoms in the hydrocarbon group is not particularly limited as long as it is 4 to 15, but 5 to 10 is preferred, and 6 to 8 is more preferred. The hydrocarbon group may be a saturated hydrocarbon group or an unsaturated hydrocarbon group, but a saturated hydrocarbon group is preferred. The hydrocarbon group may be a linear hydrocarbon group, a branched hydrocarbon group, or a cyclic hydrocarbon group, but a linear hydrocarbon group is preferred from the viewpoint of compatibility. From the viewpoint of compatibility with the epoxy resin (A), it is preferable that the silane coupling agent (S1) has a reactive functional group. Examples of the reactive functional group include a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. From the viewpoint of being able to maintain a low viscosity from an ordinary temperature range to a high temperature range, an epoxy group, a (meth)acryloyloxy group, and a phenylamino group are preferred.

[0056] The molecular weight of the silane coupling agent (S1) is not particularly limited, but is preferably 250 to 500, more preferably 260 to 450, even more preferably 270 to 400, and particularly preferably 280 to 350. When the molecular weight of the silane coupling agent (S1) is within the above range, the compatibility with the inorganic filler (C1) is further improved, and the occurrence of voids tends to be reduced.

[0057] From the viewpoint of reducing the occurrence of voids, the silane coupling agent (S1) is preferably a compound represented by the following formula (I):

[0058] In formula (I), n is an integer of 4 to 15. n is preferably 5 to 10, and more preferably 6 to 8. R １ ~R ３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. ４ is a group containing a reactive functional group. ４ may be a group consisting only of the reactive functional groups described above as possessed by the silane coupling agent (S1), or may be a group having the above-mentioned reactive functional group as a part thereof. The reactive functional group is not particularly limited, but examples thereof include a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. From the viewpoint of further improving compatibility, an epoxy group, a (meth)acryloyloxy group, and a phenylamino group are preferred. Examples of groups having the above-mentioned reactive functional group as a part thereof include monovalent organic groups having the above-mentioned reactive functional group, such as a glycidoxy group, at their terminals.

[0059] Specific examples of the silane coupling agent (S1) include silane coupling agents having an epoxy group such as (9,10-epoxydecyl)trimethoxysilane, (9,10-epoxydecyl)triethoxysilane, and (11,12-epoxydodecyl)trimethoxysilane; silane coupling agents having a glycidoxy group such as 8-glycidoxyoctyltrimethoxysilane, 8-glycidoxyoctyltriethoxysilane, and 11-glycidoxyundecyltrimethoxysilane; 8-acryloxyoctyltrimethoxysilane, 8-acryloxyoctyltriethoxysilane, 8-methacryloxyoctyltrimethoxysilane, and 8-methacryloxyoctyltriethoxysilane; Examples of suitable silane coupling agents include silane coupling agents having a (meth)acryloyloxy group, such as 11-methacryloxyundecyltrimethoxysilane and 11-methacryloxyundecyltrimethoxysilane; silane coupling agents having an amino group, such as 8-aminooctyltrimethoxysilane, 11-aminoundecyltrimethoxysilane and 8-aminooctyltriethoxysilane; silane coupling agents having a phenylamino group, such as 8-phenylaminooctyltrimethoxysilane; and silane coupling agents having a 2-aminoethylamino group, such as N-(2-aminoethyl)-8-aminooctyltrimethoxysilane and N-(2-aminoethyl)-8-aminooctyltriethoxysilane. Among these, from the viewpoint of improving compatibility, 8-methacryloxyoctyltrimethoxysilane and 8-phenylaminooctyltrimethoxysilane are preferred as the silane coupling agent (S1).

[0060] The surface treatment amount of the silane coupling agent (S1) in the inorganic filler (C1) is not particularly limited, but from the viewpoint of compatibility, it is, for example, preferably 0.3 to 4.0 mass%, more preferably 0.5 to 2.5 mass%, and even more preferably 0.8 to 2.0 mass% relative to the inorganic filler (100 mass%). By having the surface treatment amount within the above range, compatibility tends to be improved, probably because all or most of the surface of the inorganic filler is treated with the silane coupling agent (S1). In this specification, the surface treatment amount is the amount (used amount) of the silane coupling agent used when surface treating the inorganic particles.

[0061] In addition, the method of surface treatment of inorganic filler with silane coupling agent is not particularly limited, and can be carried out by known and commonly used methods.Surface treatment can be exemplified by the mode that the alkoxy group etc. of silane coupling agent is hydrolyzed to become hydroxyl group, and this hydroxyl group reacts with the surface of inorganic filler or the substituent (for example, hydroxyl group) present on the surface, and inorganic filler and silane coupling agent are covalently bonded.However, the surface treatment described above is not necessarily determined only by the presence or absence of covalent bond between inorganic filler and silane coupling agent, but also includes the mode that inorganic filler and silane coupling agent are bonded by weak attractive force such as intermolecular force.

[0062] In the inorganic filler (C1), the inorganic particles to be surface-treated with the silane coupling agent (S1) can be the inorganic particles exemplified in the inorganic filler (C), and are not particularly limited, but silica (silicon dioxide) is preferred. The shape of the inorganic filler (C1) may be any of the shapes exemplified in the inorganic filler (C), and is not particularly limited, but is preferably spherical.

[0063] The average particle size of the inorganic filler (C1) is not particularly limited, but is, for example, preferably 0.01 to 5 μm, more preferably 0.05 to 3 μm, and even more preferably 0.1 to 1 μm. When the epoxy resin composition contains an inorganic filler (C2), the average particle size of the inorganic filler (C1) is preferably 0.5 to 3 μm, and even more preferably 0.5 to 1 μm.

[0064] The content of the inorganic filler (C1) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably, for example, 40% by mass or more, more preferably 50% by mass or more, and even more preferably 60% by mass or more. It is also preferably, for example, 95% by mass or less, more preferably 90% by mass or less, and even more preferably 88% by mass or less. That is, the content of the inorganic filler (C1) relative to the epoxy resin composition (100% by mass) is, for example, preferably 40 to 95% by mass, more preferably 50 to 90% by mass, and even more preferably 60 to 88% by mass. Having the inorganic filler (C1) content within the above ranges tends to improve the filling properties and workability of the epoxy resin composition and reduce the occurrence of voids.

[0065] The content of the inorganic filler (C1) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is not particularly limited, but is preferably 100% by mass or more, more preferably 160% by mass or more, even more preferably 200% by mass or more, and particularly preferably 220% by mass or more. Furthermore, it is preferably 1000% by mass or less, more preferably 800% by mass or less, even more preferably 700% by mass or less, and particularly preferably 600% by mass or less. That is, the content of the inorganic filler (C1) relative to the epoxy resin (A) (100% by mass) in the epoxy resin composition is not particularly limited, but is preferably 100 to 1000% by mass, more preferably 160 to 800% by mass, even more preferably 200 to 700% by mass, and particularly preferably 220 to 600% by mass. Having the inorganic filler (C1) content within the above ranges tends to improve the filling properties and workability of the epoxy resin composition and reduce the occurrence of voids.

[0066] The content of the inorganic filler (C1) relative to the inorganic filler (C) (100% by mass) in the epoxy resin composition is not particularly limited, but is, for example, preferably 60% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0067] Inorganic Filler (C2) The inorganic filler (C2) is an inorganic filler surface-treated with a silane coupling agent (S2) having a hydrocarbon group with 3 or less carbon atoms (1 to 3 carbon atoms). The silane coupling agent (S2) is a silane coupling agent containing a hydrocarbon group with 3 or less carbon atoms (1 to 3 carbon atoms). The number of carbon atoms in the hydrocarbon group is not particularly limited as long as it is 1 to 3, but 3 is preferred. The hydrocarbon group may be a saturated hydrocarbon group or an unsaturated hydrocarbon group, but a saturated hydrocarbon group is preferred. The silane coupling agent (S2) may have a reactive functional group from the viewpoint of compatibility with the epoxy resin (A). The reactive functional group is not particularly limited, but examples include a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. From the viewpoint of further improving compatibility, an epoxy group, a (meth)acryloyloxy group, and a phenylamino group are preferred.

[0068] The silane coupling agent (S2) is preferably a compound represented by the following formula (II):

[0069] In formula (II), m is an integer of 1 to 3, and is preferably 3. １１ ~R １３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. １４ is a group containing a reactive functional group. １４ may be a group consisting only of the reactive functional groups described above as possessed by the silane coupling agent (S2), or may be a group having the above-mentioned reactive functional group as a part thereof. The reactive functional group is not particularly limited, but examples thereof include a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. From the viewpoint of further improving compatibility, an epoxy group, a (meth)acryloyloxy group, and a phenylamino group are preferred. Examples of groups having the above-mentioned reactive functional group as a part thereof include monovalent organic groups having the above-mentioned reactive functional group, such as a glycidoxy group, at their terminals.

[0070] Specific examples of the silane coupling agent (S2) include 3-glycidyloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and N-phenyl-3-aminopropyltrimethoxysilane.

[0071] The amount of the silane coupling agent (S2) used for surface treatment of the inorganic filler (C2) is not particularly limited, but is preferably 0.3 to 4.0 mass%, and more preferably 0.5 to 2.5 mass%, relative to the inorganic filler (100 mass%).

[0072] In the inorganic filler (C2), the inorganic particles to be surface-treated with the silane coupling agent (S2) can be the inorganic particles exemplified in the inorganic filler (C), and are not particularly limited, but silica (silicon dioxide) is preferred. The shape of the inorganic filler (C2) may be any of the shapes exemplified in the inorganic filler (C), and is not particularly limited, but is preferably spherical.

[0073] The average particle size of the inorganic filler (C2) is not particularly limited, but is, for example, preferably 0.01 to 5 μm, more preferably 0.05 to 3 μm, and even more preferably 0.1 to 1 μm. When the epoxy resin composition contains the inorganic filler (C1), the average particle size of the inorganic filler (C2) is preferably 0.01 to 0.4 μm, and more preferably 0.1 to 0.35 μm.

[0074] Inorganic filler (C3) The inorganic filler (C3) is an inorganic filler that has been surface-treated with a compound other than a silane coupling agent. The compound other than the silane coupling agent is not particularly limited, but is preferably a titanium coupling agent that may have a reactive functional group such as an epoxy group, a (meth)acryloyl group, a (meth)acryloyloxy group, or an amino group (particularly a phenylamino group or a 2-aminoethylamino group).

[0075] In the inorganic filler (C3), the inorganic particles to be surface-treated with a compound other than a silane coupling agent can be the inorganic particles exemplified in the inorganic filler (C), and are not particularly limited, but silica (silicon dioxide) is preferred. The shape of the inorganic filler (C3) may be any of the shapes exemplified in the inorganic filler (C), and are not particularly limited, but are preferably spherical.

[0076] The average particle size of the inorganic filler (C3) is not particularly limited and is, for example, 0.01 to 5 μm. The content of the inorganic filler (C3) relative to the epoxy resin composition (100% by mass) is not particularly limited.

[0077] Inorganic filler (C4) Examples of the inorganic filler (C4) include the inorganic particles described in the inorganic filler (C), but silica (silicon dioxide) is preferred. The shape of the inorganic filler (C4) is not particularly limited as long as it is one of the shapes exemplified for the inorganic filler (C), but a spherical shape is preferred.

[0078] The average particle size of the inorganic filler (C4) is not particularly limited and is, for example, 0.01 to 5 μm. The content of the inorganic filler (C4) relative to the epoxy resin composition (100% by mass) is not particularly limited.

[0079] Coupling Agent (D) The coupling agent (D) is not particularly limited, and examples thereof include vinyl-based, glycidoxy-based, methacrylic-based, amino-based, mercapto-based, imidazole-based, etc. Coupling agents (D) may be used singly or in combination of two or more.

[0080] Examples of the silane coupling agent include silane coupling agents having a hydrocarbon group, such as those described as silane coupling agent (S1) and silane coupling agent (S2). Examples include 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 8-glycidoxyoctyltrimethoxysilane, 8-methacryloxyoctyltrimethoxysilane, and 8-phenylaminooctyltrimethoxysilane.

[0081] The content of the coupling agent (D) relative to the epoxy resin composition (100% by mass) is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, even more preferably 0.05% by mass or more, and particularly preferably 0.1% by mass or more. It is also preferably 3.0% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.0% by mass or less, and particularly preferably 0.5% by mass or less. That is, the content of the coupling agent (D) relative to the epoxy resin composition (100% by mass) is preferably 0.01 to 3.0% by mass, more preferably 0.03 to 1.5% by mass, even more preferably 0.05 to 1.0% by mass, and particularly preferably 0.1 to 0.5% by mass.

[0082] Other Components (E) The epoxy resin composition may or may not contain components other than the epoxy resin (A), the curing accelerator (B), the inorganic filler (C), and the coupling agent (D) (hereinafter referred to as "other components (E)"). Examples of other components (E) include curable compounds other than the epoxy resin (A), thermoplastic resins such as polyethylene resins, polyester resins, polyurethane resins, and polyamide resins, thermal radical polymerization initiators such as organic peroxides, thermal cationic polymerization initiators such as acid generators, photopolymerization initiators such as photoradical polymerization initiators and photocationic polymerization initiators, conductive particles, coupling agents, elastomers, curing agents, surfactants, ion trapping agents, leveling agents, antioxidants, antifoaming agents, flame retardants, colorants such as carbon black, reactive diluents, alcohol compounds, solvents, etc. The other components (E) may be used alone or in combination of two or more.

[0083] The content of the solvent relative to the epoxy resin composition (100% by mass) is, for example, 3% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or less, and, for example, 0.01% by mass or more, 0.1% by mass or more, or 1% by mass or more.

[0084] The content of the other component (E) relative to the epoxy resin composition (100% by mass) is not particularly limited as long as it does not impair the effects of the present invention, but is, for example, preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, and particularly preferably 1% by mass or less. Also, for example, it is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 1% by mass or more.

[0085] (Physical Properties and Production Method of Epoxy Resin Composition) The viscosity of the epoxy resin composition at 25°C is not particularly limited, but is, for example, preferably 1 Pa·s or more, more preferably 5 Pa·s or more, even more preferably 10 Pa·s or more, even more preferably 15 Pa·s or more, still more preferably 20 Pa·s or more, and particularly preferably 25 Pa·s or more. Also, for example, the viscosity is preferably 1500 Pa·s or less, more preferably 1000 Pa·s or less, even more preferably 500 Pa·s or less, still more preferably 300 Pa·s or less, still more preferably 200 Pa·s or less, and particularly preferably 150 Pa·s or less. That is, the viscosity of the epoxy resin composition at 25°C is, for example, preferably 1 to 1500 Pa·s, more preferably 5 to 1000 Pa·s, even more preferably 10 to 500 Pa·s, even more preferably 15 to 300 Pa·s, even more preferably 20 to 200 Pa·s, and particularly preferably 25 to 150 Pa·s. Having a viscosity within the above range tends to further reduce the occurrence of voids. As described in the Examples below, the viscosity can be measured using a Brookfield viscometer (model number: HBDV-1, manufactured by Brookfield) at a liquid temperature of 25°C, rotating at 50 rpm for 1 minute.

[0086] The viscosity of the epoxy resin composition at 150°C is not particularly limited, but is, for example, preferably 0.01 Pa·s or more, more preferably 0.05 Pa·s or more, even more preferably 0.1 Pa·s or more, and particularly preferably 0.2 Pa·s or more. Furthermore, for example, it is preferably 5 Pa·s or less, more preferably 3 Pa·s or less, even more preferably 2 Pa·s or less, even more preferably 1 Pa·s or less, and particularly preferably 0.7 Pa·s or less. That is, the viscosity of the epoxy resin composition at 150°C is, for example, preferably 0.01 to 5 Pa·s, more preferably 0.05 to 3 Pa·s, even more preferably 0.1 to 2 Pa·s, even more preferably 0.2 to 1 Pa·s, and particularly preferably 0.2 to 0.7 Pa·s. Having a viscosity within the above range tends to facilitate gap filling. The viscosity can be measured at a liquid temperature of 150° C. using a HAAKE MARS60 (viscosity / viscoelasticity measuring device, manufactured by HAAKE Co., Ltd.) as described in the Examples below.

[0087] The epoxy resin composition can be prepared by a known, conventional method. For example, the epoxy resin (A), the curing accelerator (B), the inorganic filler (C), and, optionally, at least one selected from the group consisting of the coupling agent (D) and other components (E) can be simultaneously or separately introduced into an appropriate mixer and, if necessary, heated to melt and stir / mix. If the epoxy resin (A) is solid, it is preferably liquefied or fluidized by heating before mixing. If it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin composition, the epoxy resin (A) and the inorganic filler (C) can be heated and mixed to uniformly disperse the inorganic filler (C) in the epoxy resin (A), followed by cooling as necessary, and then further mixing with components such as the inorganic filler (C). This allows the epoxy resin composition to be prepared.

[0088] The mixer is not particularly limited, and examples thereof include a roll mill equipped with a stirrer and a heater, a Raikai mixer, a Henschel mixer, a tumbler, a planetary mixer, etc. The mixing ratio of each component is appropriately set depending on the content of each component in the epoxy resin composition.

[0089] The epoxy resin composition can be preferably used as a material for encapsulating semiconductor elements, wiring, solder (solder bumps), and other materials mounted on a support in a semiconductor device (an epoxy resin composition for semiconductor encapsulation). The use of the epoxy resin composition as an epoxy resin composition for semiconductor encapsulation allows for the production of highly reliable encapsulated bodies. The epoxy resin composition can be used as a liquid encapsulant at 25°C. The epoxy resin composition can also be preferably used as a material for encapsulating semiconductor elements, such as those mounted on a support in a flip-chip semiconductor device (an epoxy resin composition for flip-chip semiconductor encapsulation). Specifically, the epoxy resin composition can be filled into the gap between the semiconductor element and the support and cured to encapsulate the bumps present in the gap while also fixing the semiconductor element and the support together as an encapsulated body, thereby improving thermal cycle resistance.

[0090] The epoxy resin composition is used, for example, as an underfill such as a capillary underfill, a liquid mold underfill, a secondary underfill, or a pre-applied underfill; a grab-top material; or a liquid compression molding material. Among these, when the epoxy resin composition is used as a liquid compression molding material, it is preferred because the characteristic of suppressing the generation of voids is fully exhibited. Furthermore, the epoxy resin composition is not limited to the use as the epoxy resin composition for semiconductor encapsulation described above, and can be used, for example, as an adhesive for fixing, joining, or protecting components constituting electronic components.

[0091] <Cured Product of Epoxy Resin Composition> A cured product is formed by curing the epoxy resin composition. The curing method is not particularly limited, but for example, the curing can be carried out by subjecting the epoxy resin composition to a heat treatment. The temperature of the heat treatment is not particularly limited, but for example, 60 to 200°C is preferred, and 80 to 180°C is more preferred. The time of the heat treatment is not particularly limited, but for example, 0.1 to 5 hours is preferred, and 0.5 to 3 hours is more preferred.

[0092] The glass transition temperature Tg of the cured product is not particularly limited, but is preferably 90°C or higher, more preferably 95°C or higher, even more preferably 100°C or higher, and particularly preferably 105°C or higher. Furthermore, it is not particularly limited, but is preferably 145°C or lower, more preferably 140°C or lower, even more preferably 135°C or lower, and particularly preferably 130°C or lower. That is, the glass transition temperature Tg of the cured product is preferably 90 to 145°C, more preferably 95 to 140°C, even more preferably 100 to 135°C, and particularly preferably 105 to 130°C. Having a glass transition temperature within the above range tends to result in excellent crack resistance of the resulting cured product. The glass transition temperature (Tg) can be measured using a cured product obtained by heat-curing the epoxy resin composition at 165°C for 120 minutes, and more specifically, can be measured by the method described in the Examples below.

[0093] <Semiconductor device and manufacturing method thereof> The semiconductor device of the present invention comprises a support, a semiconductor element mounted on the support, and a cured product of the epoxy resin composition that encapsulates the semiconductor element. The semiconductor device is preferably a flip-chip type semiconductor device. A flip-chip type semiconductor device has a structure in which an electrode portion on the support is connected to the semiconductor element via a bump electrode. In addition, in the semiconductor device, the gap between the semiconductor element and the support is encapsulated with a cured product (encapsulant) of the epoxy resin composition.

[0094] The method for manufacturing a semiconductor device of the present invention is characterized by comprising: a step of supplying the epoxy resin composition onto a laminate including a support and a semiconductor element mounted on the support (hereinafter referred to as the "composition supplying step"); and a step of filling the gap between the support and the semiconductor element with the epoxy resin composition to form a molded body, curing the molded body to encapsulate the semiconductor element, and obtaining an encapsulated body (hereinafter referred to as the "molding and encapsulating step").

[0095] The method for manufacturing a semiconductor device of the present invention may further include a step of polishing the sealing body (hereinafter referred to as a "grinding step"). Also, it may include at least one step selected from the group consisting of a stack preparation step and a singulation step, which will be described later.

[0096] (Laminate preparation process) The laminate preparation process is a process of mounting a semiconductor element on a support to prepare a laminate including a support and a semiconductor element mounted on the support. In the laminate, the support and the semiconductor element may be connected via solder, or may be connected using an adhesive film or adhesive sheet such as a die attach film (DAF). The support is not particularly limited, but examples thereof include silicon wafers, silicon carbide wafers, sapphire wafers, compound semiconductor wafers (gallium phosphide, gallium arsenide, indium phosphide, gallium nitride), glass epoxy substrates, organic substrates (FR4 substrates), etc. The shape of the support in a planar view is not particularly limited, but is, for example, circular or rectangular.

[0097] (Composition Supplying Step) The composition supplying step is a step of supplying the epoxy resin composition onto a laminate including a support and a semiconductor element mounted on the support.

[0098] This step may include a step of attaching a mold to the laminate, which is used to form a molded article in the molding and sealing step. That is, the composition supplying step may be a step of supplying an epoxy resin composition onto a laminate including a support and a semiconductor element mounted on the support, and then attaching a mold to the laminate.

[0099] This step may also be a step of supplying an epoxy resin composition to a mold used to form a molded article in the molding and sealing step, and then mounting a laminate comprising a support and a semiconductor element mounted on the support on the mold. By performing such a step, the epoxy resin composition can be supplied onto the laminate comprising a support and a semiconductor element mounted on the support.

[0100] (Molding and Encapsulating Step) The molding and encapsulating step is a step of filling the gap between the support and the semiconductor element with the epoxy resin composition to form a molded body, and curing the molded body to encapsulate the semiconductor element, thereby obtaining an encapsulated body. This step may include two steps: a step of filling the gap between the support and the semiconductor element with the epoxy resin composition to form a molded body (molding step), and a step of curing the molded body obtained by the molding step to encapsulate the semiconductor element, thereby obtaining an encapsulated body (encapsulating step).

[0101] The method for forming the molded body is not particularly limited, but examples include a method in which a mold attached to a laminate is pressed toward the laminate (support), and if necessary, the inside of the mold is depressurized to fill the gap between the support and the semiconductor element with the epoxy resin composition, thereby forming a compression molded body containing the laminate and the epoxy resin composition.In this step, instead of pressing the mold toward the laminate (support), the laminate (support) may be pressed toward the mold, or the mold and the laminate (support) may be sandwiched between each other.

[0102] As a method for forming the molded article, for example, an epoxy resin composition, which has been heated to a low viscosity as necessary, is decompressed using a molding device, and a laminate is sealed with the epoxy resin composition.

[0103] When the molded body is cured to encapsulate the semiconductor element, the epoxy resin composition may be cured by heating. The curing temperature is not particularly limited, but is preferably, for example, 110 to 200°C, and more preferably 120 to 150°C. The curing time is not particularly limited, but is, for example, preferably 30 minutes to 7 hours, more preferably 1 to 6 hours, even more preferably 1 to 4 hours, and particularly preferably 1 to 2 hours.

[0104] (Grinding Process) The grinding process is a process of polishing the encapsulated body obtained by the molding and encapsulating process, and more specifically, is a process of grinding the surface of the encapsulated body on the semiconductor element side in order to flatten and thin the encapsulated body, and to expose a part of the semiconductor element as needed. The grinding method is not particularly limited, and commercially available grinding wheels and grinding devices can be used.

[0105] (Singulation Process) The singulation process is a process for singulating the sealed body obtained in the molding and sealing process or the sealed body ground in the grinding process. The singulation process may be a process for singulating the sealed body after removing it from the mold. In the singulation process, gaps between the plurality of semiconductor elements mounted on the support and sealed with the cured product of the epoxy resin composition are cut using a means such as a dicing blade or a laser to obtain a semiconductor device. The method of singulation is not particularly limited, and a commercially available singulation device can be used.

[0106] Hereinafter, an embodiment of a method for manufacturing a semiconductor device will be described with reference to FIGS. 1 and 2, but the present invention is not limited to this.

[0107] FIG. 1 shows one embodiment of the semiconductor device manufacturing method of the present invention. This embodiment will be described below with reference to FIG. A semiconductor element 1 having solder bumps 2 on one side is mounted on a support 3, and a laminate 4 containing the semiconductor element 1, solder bumps 2, and support 3 in this order is prepared (laminate preparation step (a)). An epoxy resin composition 5 is supplied onto the semiconductor element 1 of the laminate 4 using a syringe 6, and then a mold 7 is attached (composition supply steps (b) and (c)). In this step, a release film may be provided on the surface of the mold 7 facing the laminate 4. The release film is positioned to prevent contact between the mold 7 and the epoxy resin composition 5 and also to facilitate removal of the encapsulant 9 from the mold 7 in step (f) described below. Note that the release film is not shown. The attached mold 7 is then pressed toward the support 3, and the pressure inside the mold 7 is reduced as necessary to form a compression-molded product 8 containing the laminate 4 and the epoxy resin composition 5 (molding step (d)). In this step, instead of pressing the mold 7 toward the support 3, the support 3 may be pressed toward the mold 7, or the mold 7 and the support 3 may be narrowed relative to each other. In this step, the epoxy resin composition 5 is filled into the gap between the support 3 and the semiconductor element 1 to form a compression-molded body 8. The compression-molded body 8 is thermally cured to seal the semiconductor element 1, thereby forming a sealed body 9 (sealing step (e)). After removing the mold 7, the sealed body 9 including the semiconductor element 1 is divided into individual pieces (singulation steps (f) and (g)).

[0108] FIG. 2 shows another embodiment of the semiconductor device manufacturing method of the present invention. This embodiment will be described below with reference to FIG. A semiconductor element 11 having solder bumps 12 on one side is mounted on a support 13, and a laminate 14 including the semiconductor element 11, solder bumps 12, and support 13 in this order is prepared (laminate preparation step (a)). An epoxy resin composition 15 is supplied to a mold 17 using a syringe 16, and the laminate 14 is then attached to the mold (composition supply steps (b) and (c)). In this step, a release film may be provided on the surface of the mold 17 onto which the epoxy resin composition 15 is supplied. That is, in this step, (1) the epoxy resin composition 15 may be supplied to the surface of the mold 17 that is provided with the release film, or (2) the epoxy resin composition 15 may be supplied onto the release film, and the release film may then be placed on the mold 17. The release film is arranged to prevent contact between the mold 17 and the epoxy resin composition 15, and also to facilitate removal of the encapsulated body 19 from the mold 17 in the step (f) described below. The release film is not shown. Next, the pressure inside the mold 17 is reduced, and a compression-molded body 18 containing the laminate 14 and the epoxy resin composition 15 is formed (molding step (d)). In this step, the epoxy resin composition 15 fills the gap between the support 13 and the semiconductor element 11, forming the compression-molded body 18. The compression-molded body 18 is thermally cured to encapsulate the semiconductor element 11, thereby forming the encapsulated body 19 (encapsulating step (e)). After the mold 17 is removed, the encapsulated body 19 containing the semiconductor element is singulated (singulation steps (f) and (g)).

[0109] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples.

[0110] Epoxy resin compositions of Examples and Comparative Examples were prepared by mixing the components in the proportions shown in Table 1. The numerical values ​​for each component in Table 1 indicate parts by mass.

[0111] Each component in Table 1 will be explained below. Epoxy resin (A) YDF-8170 (product name): bisphenol F type epoxy resin, epoxy equivalent 160 g / eq, liquid at 25°C, manufactured by Nippon Steel Chemical & Material Co., Ltd. jER630 (product name): aminophenol type epoxy resin, epoxy equivalent 98 g / eq, liquid at 25°C, manufactured by Mitsubishi Chemical Corporation Epogosey PT (product name): polytetramethylene glycol diglycidyl ether (general grade), epoxy equivalent 440 g / eq, liquid at 25°C, manufactured by Yokkaichi Chemical Co., Ltd. Curing accelerator (B) 2MZA (product name): 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, imidazole-based curing accelerator, manufactured by Shikoku Chemical Industry Co., Ltd. 2P4MZ (product name): 2-phenyl-4-methylimidazole, imidazole-based curing accelerator, manufactured by Shikoku Chemical Industry Co., Ltd. 2P4MHZ (product name): 2-phenyl-4-methyl-5-hydroxymethylimidazole, imidazole-based curing accelerator, manufactured by Shikoku Chemical Industry Co., Ltd., inorganic filler (C1) Filler 1: Silica surface-treated with KBM-5803 (product name) (8-methacryloxyoctyltrimethoxysilane, long-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 1.4 mass%, weight average molecular weight of the silane coupling agent 318.5 Filler 2: Silica surface-treated with KBM-4803 (product name) (8-glycidoxyoctyltrimethoxysilane, long-chain epoxy silane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 1.3 mass%, weight average molecular weight of the silane coupling agent 306.5 Filler 3: Silica surface-treated with a long-chain phenylaminosilane coupling agent (8-phenylaminooctyltrimethoxysilane), average particle size 0.6 μm, surface treatment amount 1.4 mass%, weight average molecular weight of the silane coupling agent 325.5. Filler 4: Silica surface-treated with KBM-5803 (product name) (8-methacryloxyoctyltrimethoxysilane, long-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 2.0 mass%, weight average molecular weight of the silane coupling agent 318.5.Filler 5: Silica surface-treated with KBM-5803 (product name) (8-methacryloxyoctyltrimethoxysilane, long-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 0.7 mass%, weight average molecular weight of the silane coupling agent 318.5 Filler 6: Silica surface-treated with KBM-5803 (product name) (8-methacryloxyoctyltrimethoxysilane, long-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 1.1 mass%, weight average molecular weight of the silane coupling agent 318.5 Filler 7: Silica surface-treated with KBM-5803 (product name) (8-methacryloxyoctyltrimethoxysilane, long-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.3 μm, surface treatment amount 2.0 mass%, weight average molecular weight of the silane coupling agent 318.5. Inorganic filler (C2) Filler 8: Silica surface-treated with KBM-503 (product name) (3-methacryloxypropyltrimethoxysilane, short-chain methacrylsilane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 1.1 mass%, weight average molecular weight of the silane coupling agent 248.4 Filler 9: Silica surface-treated with KBM-403 (product name) (3-glycidyloxypropyltrimethoxysilane, short-chain epoxy silane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.6 μm, surface treatment amount 1.0 mass%, weight average molecular weight of the silane coupling agent 236.3. Inorganic filler (C4) SE2300 (product name): silica with untreated surface, average particle size 0.6 μm, manufactured by Admatechs Co., Ltd. Coupling agent (D) KBE-9007 (product name): 3-isocyanatepropyltriethoxysilane, short-chain isocyanate silane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd. KBM-5803 (product name): 8-methacryloxyoctyltrimethoxysilane, long-chain methacryl silane coupling agent, manufactured by Shin-Etsu Chemical Co., Ltd.

[0112] (Evaluation 1: Measurement of viscosity at 25°C) The viscosity (Pa s) of the epoxy resin compositions of the Examples and Comparative Examples at 25°C was measured using a Brookfield HB-DV viscometer (model number: HB-DV1) when the epoxy resin compositions were rotated at 10 rpm for 1 minute at a liquid temperature of 25°C. The results are shown in Table 1 under "Viscosity at 25°C (Pa s)". In this measurement, the epoxy resin compositions were used immediately after preparation. Note that the viscosity of the epoxy resin compositions at 25°C showed almost no change within 8 hours after preparation.

[0113] (Evaluation 2: Measurement of Viscosity at 150°C) The viscosity (Pa s) of the epoxy resin compositions of the Examples and Comparative Examples at 150°C was measured using a HAAKE MARS III (viscosity / viscoelasticity measuring device, manufactured by HAAKE Corporation). The measurement was performed in oscillation strain control mode. The evaluation method was as follows: 0.3 ml ± 0.1 ml of the epoxy resin composition was dropped onto a plate heated to 150°C, and the measurement was started on the device within 30 seconds. 30 seconds after the measurement operation, the upper stage was lowered and the actual measurement began. Measurement was started with a measurement frequency of 10 Hz, a strain amount of 0.5, a gap of 0.5 mm, and a measurement frequency of 1 second, and the viscosity was measured 40 seconds after the start of the actual measurement. The results are shown in Table 1 under "Viscosity at 150°C (Pa s)." Furthermore, the following formula (V) was calculated from the viscosities obtained in Evaluations 1 and 2, and the results are shown in Table 1 under "Value of Formula (V)." Formula (V) = Viscosity (1) (Viscosity (Pa s) at 25°C obtained by Evaluation 1) × Viscosity (2) (Viscosity (Pa s) at 150°C obtained by Evaluation 2) In this measurement, the epoxy resin composition was used immediately after preparation.

[0114] (Evaluation 3: Glass Transition Temperature, Tg) Using a dynamic viscoelasticity apparatus, the storage modulus (E') and loss modulus (E'') of the cured products of the epoxy resin compositions of the Examples and Comparative Examples were measured, and the peak value of tan δ, which is the ratio of these values, was determined as the glass transition temperature (Tg). The measurement was performed in accordance with Japanese Industrial Standard JIS C6481. First, spacers (layered with heat-resistant tape) were placed in two positions on a 3 mm thick glass plate with a release agent so that the film thickness of the cured product would be 2000 μm ± 100 μm. Next, the epoxy resin composition was applied between the spacers to a width of 40 mm, length of 70 mm, and thickness of 2 mm. The plate was sandwiched between other glass plates with a release agent, taking care not to trap air bubbles, and cured at 150°C for 120 minutes to obtain a cured product. This cured product was peeled from the glass plate with the release agent and then cut into predetermined dimensions (width: 10 mm ± 0.5 mm, length: 50 mm ± 1 mm) using a cutter to obtain a test specimen. The glass transition temperature (Tg) of this test specimen was measured using a dynamic thermomechanical analyzer (DMA) (product name: DMS6100, manufactured by SII Corporation) in the range of -60°C to 260°C, at a frequency of 1 Hz, at a heating rate of 3°C / min, using a double-support bending method. The results are shown in Table 1 under "Tg (°C)."

[0115] (Evaluation 4: Measurement of coefficient of thermal expansion, CTE) The epoxy resin compositions of the examples and comparative examples were heat-cured at 150°C for 120 minutes to prepare test specimens. The coefficient of thermal expansion of these test specimens was measured at 0 to 40°C and 170 to 200°C by thermomechanical analysis (TMA) using a TMA4000SA series from Bruker ASX. The results are shown in Table 1 as "CTE (ppm / °C)".

[0116] (Evaluation 5: Void Measurement) "Evaluation 5: Void Measurement" will be explained using Figure 3. A component was prepared in which four silicon chips 30 (length: 18 µm, width: 18 µm, height: 300 µm) were arranged on the upper surface of a silicon wafer 20 (diameter 12 inches, thickness 760 µm). The silicon chips 30 were arranged circumferentially at equal intervals (every 90 degrees) along the periphery of the silicon wafer 20. Furthermore, a total of nine spacers 40 (spacer height: 20 µm) were arranged between the silicon wafer 20 and the silicon chips 30, equally spaced in an X-shape relative to the planar direction of the silicon chips 30, as shown in Figure 3(B) . Next, the epoxy resin compositions of the examples and comparative examples were filled into a mold, and the component to be resin-encapsulated was placed therein. Compression molding was performed by clamping the mold while heating. The curing conditions were a curing temperature of 150°C and a curing time of 300 seconds. This resulted in a molded article having a 500 μm-thick sealing layer 50 (a cured layer of the epoxy resin composition) that resin-encapsulated the silicon chip 30 placed on the silicon wafer 20. Next, after compression molding, the molded article was removed from the mold and a region including the silicon chip 30 and its vicinity was cut to obtain cut pieces. The cut pieces were observed using a scanning acoustic tomography (SAT) device (product name: Fine SAT FS300III) using a reflection method. Ten observations were performed. A rating of "A" (Figure 4) was given for cases where no void shadows were observed in any of the images. A rating of "B" (Figure 5) was given for cases where voids with diameters of 0 to 5 mm were observed in the area with the largest void diameter. A rating of "C" was given for cases where voids exceeding 5 mm were observed (Figure 6). The results are listed in the "Void Evaluation" section of Table 1.

[0117]

[0118] In Comparative Example 4, the viscosity at 25°C was 3000 Pa s, which is the upper limit of the measurement value of the apparatus, and therefore it can be predicted that it will exceed 3000 Pa s. Furthermore, the viscosity at 150°C was unmeasurable and predicted to exceed at least 1 Pa s. Therefore, it can be said that the value of formula (V) exceeds at least 500.

[0119] From the viewpoint of reducing warpage after molding, it is expected that the same effect as in Example 1 will be achieved even when 0.1 to 5 mass % of the following alcohol compound is blended with the epoxy resin composition of Example 1 (100 mass %). Alcohol NT2006 / product name is PEPCD NT2006, a polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -84°C, manufactured by Mitsubishi Chemical Corporation NT2002 / product name is PEPCD NT2002, a polycarbonate diol compound having a tetramethylene glycol structure as an alkylene glycol structure, liquid (transparent) at 25°C, number average molecular weight 2000, glass transition temperature -71°C, manufactured by Mitsubishi Chemical Corporation PTMG 2000 (product name) / polytetramethylene ether glycol, number average molecular weight: 2000, manufactured by Mitsubishi Chemical Corporation PTMG 3000 (product name) / polytetramethylene ether glycol, number average molecular weight: 3000, manufactured by Mitsubishi Chemical Corporation

[0120] Variations of the present invention are described below. [Appendix 1] An epoxy resin composition comprising an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C), which satisfies the following formula (V): Viscosity (1) × Viscosity (2) ≦ 500 (V) Viscosity (1): Viscosity (Pa s) of the epoxy resin composition at 25°C Viscosity (2): Viscosity (Pa s) of the epoxy resin composition at 150°C [Appendix 2] The epoxy resin composition according to Appendix 1, wherein, in the formula (V), the value of viscosity (1) × viscosity (2) is 480 or less, 450 or less, 400 or less, 300 or less, or 200 or less; 30 or more; and / or 30 to 500, 30 to 480, 30 to 450, 30 to 400, 30 to 300, or 30 to 200. [Appendix 3] The epoxy resin composition according to Appendices 1 or 2, comprising, as the epoxy resin (A), at least one selected from the group consisting of bisphenol-type epoxy resins such as bisphenol F-type epoxy resins, aminophenol-type epoxy resins, and aliphatic epoxy resins such as polyalkylene glycol diglycidyl ethers. [Appendix 4] The epoxy resin composition according to any one of Appendices 1 to 3, wherein the content of the epoxy resin (A) relative to the epoxy resin composition (100% by mass) is 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more; 60% by mass or less, 50% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less; and / or 5 to 60% by mass, 10 to 50% by mass, 15 to 40% by mass, 20 to 35% by mass, or 20 to 30% by mass. [Appendix 5] The epoxy resin composition according to any one of Appendices 1 to 4, wherein the curing accelerator (B) comprises at least one selected from the group consisting of imidazole curing accelerators, tertiary amine curing accelerators, and phosphorus curing accelerators.[Appendix 6] The epoxy resin composition according to any one of Appendices 1 to 5, wherein the content of the curing accelerator (B) relative to the epoxy resin composition (100% by mass) is 0.01% by mass or more, 0.1% by mass or more, 0.2% by mass or more, 0.4% by mass or more, or 0.6% by mass or more; 5% by mass or less, 3% by mass or less, 2% by mass or less, or 1% by mass or less; and / or 0.01 to 5% by mass, 0.1 to 3% by mass, 0.2 to 2% by mass, 0.4 to 1% by mass, or 0.6 to 1% by mass. [Appendix 7] The epoxy resin composition according to any one of Appendices 1 to 6, wherein the content of the curing accelerator (B) relative to the epoxy resin (A) (100 mass%) is 0.1 mass% or more, 0.5 mass% or more, 1 mass% or more, or 2 mass% or more; 30 mass% or less, 20 mass% or less, 15 mass% or less, 10 mass% or less, or 6 mass% or less; and / or 0.1 to 30 mass%, 0.5 to 20 mass%, 1 to 15 mass%, 2 to 10 mass%, or 2 to 6 mass%. [Appendix 8] The epoxy resin composition according to any one of Appendices 1 to 7, wherein the content of the inorganic filler (C) relative to the epoxy resin composition (100 mass%) is 40 mass% or more, 50 mass% or more, or 60 mass% or more; 95 mass% or less, 90 mass% or less, or 88 mass% or less; and / or 40 to 95 mass%, 50 to 90 mass%, or 60 to 88 mass%. [Appendix 9] The epoxy resin composition according to any one of Appendices 1 to 8, wherein the content of the inorganic filler (C) relative to the epoxy resin (A) (100 mass%) is 100 mass% or more, 160 mass% or more, 200 mass% or more, or 220 mass% or more; 1000 mass% or less, 800 mass% or less, 700 mass% or less, or 600 mass% or less; and / or 100 to 1000 mass%, 160 to 800 mass%, 200 to 700 mass%, or 220 to 600 mass%. [Appendix 10] The epoxy resin composition according to any one of Appendices 1 to 9, comprising, as the inorganic filler (C), an inorganic filler (C1) that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms. [Appendix 11] The epoxy resin composition according to Appendix 10, wherein the hydrocarbon group in the silane coupling agent (S1) has 5 to 10 carbon atoms, or 6 to 8 carbon atoms.[Appendix 12] The epoxy resin composition according to Appendices 10 or 11, wherein the hydrocarbon group in the silane coupling agent (S1) is a saturated hydrocarbon group or an unsaturated hydrocarbon group, and the hydrocarbon group is a linear hydrocarbon group, a branched hydrocarbon group, or a cyclic hydrocarbon group. [Appendix 13] The epoxy resin composition according to any one of Appendices 10 to 12, wherein the silane coupling agent (S1) has a reactive functional group. [Appendix 14] The epoxy resin composition according to Appendices 13, wherein the silane coupling agent (S1) contains, as the reactive functional group, at least one selected from the group consisting of a hydroxy group, an amino group (particularly a phenylamino group and a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. [Appendix 15] The epoxy resin composition according to any one of Appendices 10 to 14, wherein the molecular weight of the silane coupling agent (S1) is 250 to 500, 260 to 450, 270 to 400, or 280 to 350. [Appendix 16] The silane coupling agent (S1) is represented by the following formula (I): [In formula (I), n is an integer of 4 to 15, 5 to 10, or 6 to 8. R １ ~R ３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. ４is a group containing a reactive functional group (for example, a reactive functional group, or a group having the reactive functional group as a part thereof).] [Appendix 17] The epoxy resin composition according to any one of Appendices 10 to 15, wherein the group containing a reactive functional group in formula (I) is a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, or a glycidoxy group. [Appendix 18] The silane coupling agent (S1) may be a silane coupling agent having an epoxy group such as (9,10-epoxydecyl)trimethoxysilane, (9,10-epoxydecyl)triethoxysilane, or (11,12-epoxydodecyl)trimethoxysilane; a silane coupling agent having a glycidoxy group such as 8-glycidoxyoctyltrimethoxysilane, 8-glycidoxyoctyltriethoxysilane, or 11-glycidoxyundecyltrimethoxysilane; 8-acryloxyoctyltrimethoxysilane, 8-acryloxyoctyltriethoxysilane, 8-methacryloxyoctyltrimethoxysilane, 8-methacryloxyoctyltriethoxysilane, or 11-methacryloxyoctyltriethoxysilane. the epoxy resin composition according to any one of Appendix 10 to Appendix 17, which is a silane coupling agent having a (meth)acryloyloxy group, such as hydroxyundecyltrimethoxysilane; a silane coupling agent having an amino group, such as 8-aminooctyltrimethoxysilane, 11-aminoundecyltrimethoxysilane, or 8-aminooctyltriethoxysilane; a silane coupling agent having a phenylamino group, such as 8-phenylaminooctyltrimethoxysilane; or a silane coupling agent having a 2-aminoethylamino group, such as N-(2-aminoethyl)-8-aminooctyltrimethoxysilane or N-(2-aminoethyl)-8-aminooctyltriethoxysilane. [Appendix 19] The epoxy resin composition according to any one of Appendices 10 to 18, wherein the amount of the silane coupling agent (S1) used for surface treatment in the inorganic filler (C1) is 0.3 to 4.0 mass%, 0.5 to 2.5 mass%, or 0.8 to 2.0 mass%, relative to the inorganic filler (100 mass%).[Appendix 20] The epoxy resin composition according to any one of Appendices 10 to 19, wherein the inorganic filler (C1) has an average particle size of 0.01 to 5 μm, 0.05 to 3 μm, or 0.1 to 1 μm, and when the epoxy resin composition contains an inorganic filler (C2), the inorganic filler (C1) has an average particle size of 0.5 to 3 μm, or 0.5 to 1 μm. [Appendix 21] The epoxy resin composition according to any one of Appendices 10 to 20, wherein the content of the inorganic filler (C1), relative to the epoxy resin composition (100 mass%), is 40 mass% or more, 50 mass% or more, or 60 mass% or more; 95 mass% or less, 90 mass% or less, or 88 mass% or less; and / or 40 to 95 mass%, 50 to 90 mass%, or 60 to 88 mass%. [Appendix 22] The epoxy resin composition according to any one of Appendices 10 to 21, wherein the content of the inorganic filler (C1) relative to the epoxy resin (A) (100% by mass) is 100% by mass or more, 160% by mass or more, 200% by mass or more, or 220% by mass or more; 1000% by mass or less, 800% by mass or less, 700% by mass or less, or 600% by mass or less; and / or 100 to 1000% by mass, 160 to 800% by mass, 200 to 700% by mass, or 220 to 600% by mass. [Appendix 23] The epoxy resin composition according to any one of Appendices 10 to 22, wherein the content of the inorganic filler (C1) relative to the inorganic filler (C) (100% by mass) is 60% by mass or more, 70% by mass or more, 80% by mass or more, or 90% by mass or more. [Appendix 24] The epoxy resin composition according to any one of Appendices 1 to 23, further comprising, as the inorganic filler (C), an inorganic filler (C2) that has been surface-treated with a silane coupling agent (S2) having a hydrocarbon group having 3 or less carbon atoms (particularly 3 carbon atoms). [Appendix 25] The epoxy resin composition according to Appendices 24, wherein the hydrocarbon group in the silane coupling agent (S2) is a saturated hydrocarbon group or an unsaturated hydrocarbon group. [Appendix 26] The epoxy resin composition according to Appendices 24 or 25, wherein the silane coupling agent (S2) has a reactive functional group.[Appendix 27] The epoxy resin composition according to Appendix 26, wherein the silane coupling agent (S2) contains, as the reactive functional group, at least one selected from the group consisting of a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. [Appendix 28] The silane coupling agent (S2) is represented by the following formula (II): [In formula (II), m is an integer of 1 to 3 (particularly, 3). R １１ ~R １３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. １４is a group containing a reactive functional group (for example, a reactive functional group, or a group having the reactive functional group as a part thereof).] [Appendix 29] The epoxy resin composition according to any one of Appendices 24 to 27, wherein the group containing a reactive functional group in formula (II) is a hydroxy group, an amino group (particularly a phenylamino group or a 2-aminoethylamino group), an epoxy group, a carboxyl group, a (meth)acryloyl group, a (meth)acryloyloxy group, or a glycidoxy group. [Appendix 30] The epoxy resin composition according to any one of Appendices 24 to 29, wherein the silane coupling agent (S2) is 3-glycidyloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, or N-phenyl-3-aminopropyltrimethoxysilane. [Appendix 31] The epoxy resin composition according to any one of Appendices 24 to 30, wherein the amount of the silane coupling agent (S2) used for surface treatment in the inorganic filler (C2) is 0.3 to 4.0 mass% or 0.5 to 2.5 mass% relative to the inorganic filler (100 mass%). [Appendix 32] The epoxy resin composition according to any one of Appendices 24 to 31, wherein the average particle size of the inorganic filler (C2) is 0.01 to 5 μm, 0.05 to 3 μm, or 0.1 to 1 μm, and when the epoxy resin composition contains an inorganic filler (C1), the average particle size of the inorganic filler (C2) is 0.01 to 0.4 μm or 0.1 to 0.35 μm. [Appendix 33] The epoxy resin composition according to any one of Appendices 1 to 32, further comprising a coupling agent (D). [Appendix 34] The epoxy resin composition according to Appendix 33, containing, as the coupling agent (D), a silane coupling agent such as a vinyl-based, glycidoxy-based, methacryl-based, amino-based, mercapto-based, or imidazole-based silane coupling agent.[Appendix 35] The epoxy resin composition according to Appendix 34, wherein the silane coupling agent comprises at least one selected from the group consisting of 3-glycidoxypropyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 8-glycidoxyoctyltrimethoxysilane, 8-methacryloxyoctyltrimethoxysilane, and 8-phenylaminooctyltrimethoxysilane. [Appendix 36] The epoxy resin composition according to any one of Appendices 33 to 35, wherein the content of the coupling agent (D), relative to the epoxy resin composition (100 mass%), is 0.01 mass% or more, 0.03 mass% or more, 0.05 mass% or more, or 0.1 mass% or more; 3.0 mass% or less, 1.5 mass% or less, 1.0 mass% or less, or 0.5 mass% or less; and / or 0.01 to 3.0 mass%, 0.03 to 1.5 mass%, 0.05 to 1.0 mass%, or 0.1 to 0.5 mass%. [Appendix 37] The epoxy resin composition according to any one of Appendices 1 to 36, wherein the content of components other than the epoxy resin (A), the curing accelerator (B), the inorganic filler (C), and the coupling agent (D), i.e., other component (E), relative to the epoxy resin composition (100% by mass) is 10% by mass or less, 5% by mass or less, 3% by mass or less, or 1% by mass or less; and / or 0.001% by mass or more, 0.01% by mass or more, or 0.1% by mass or more. [Appendix 38] The epoxy resin composition according to any one of Appendices 1 to 37, wherein the content of solvent relative to the epoxy resin composition (100% by mass) is 3% by mass or less, 1% by mass or less, 0.1% by mass or less, or 0.01% by mass or more, or 0.01% by mass or more, 0.1% by mass or more, or 1% by mass or more.[Appendix 39] The epoxy resin composition according to any one of Appendices 1 to 38, wherein the viscosity of the epoxy resin composition at 25°C is 1 Pa·s or more, 5 Pa·s or more, 10 Pa·s or more, 15 Pa·s or more, 20 Pa·s or more, or 25 Pa·s or more; 1500 Pa·s or less, 1000 Pa·s or less, 500 Pa·s or less, 300 Pa·s or less, 200 Pa·s or less, or 150 Pa·s or less; and / or 1 to 1500 Pa·s, 5 to 1000 Pa·s, 10 to 500 Pa·s, 15 to 300 Pa·s, 20 to 200 Pa·s, or 25 to 150 Pa·s. [Appendix 40] The epoxy resin composition according to any one of Appendices 1 to 39, wherein the viscosity of the epoxy resin composition at 150°C is 0.01 Pa s or more, 0.05 Pa s or more, 0.1 Pa s or more, or 0.2 Pa s or more; 5 Pa s or less, 3 Pa s or less, 2 Pa s or less, 1 Pa s or less, or 0.7 Pa s or less; and / or 0.01 to 5 Pa s, 0.05 to 3 Pa s, 0.1 to 2 Pa s, 0.2 to 1 Pa s, or 0.2 to 0.7 Pa s. [Appendix 41] The epoxy resin composition according to any one of Appendices 1 to 40, wherein the glass transition temperature Tg of the cured product is 90°C or higher, 95°C or higher, 100°C or higher, or 105°C or higher; 145°C or lower, 140°C or lower, 135°C or lower, or 130°C or lower; and / or 90 to 145°C, 95 to 140°C, 100 to 135°C, or 105 to 130°C. [Appendix 42] The epoxy resin composition according to any one of Appendices 1 to 41, which is a liquid compression molding material. [Appendix 43] A cured product of the epoxy resin composition according to any one of Appendices 1 to 42. [Appendix 44] A semiconductor device comprising the cured product of Appendices 43. [Appendix 45] A semiconductor device comprising: a support; a semiconductor element mounted on the support; and the cured product of Appendices 43 that encapsulates the semiconductor element.[Appendix 46] A method for manufacturing a semiconductor device, comprising: a step of supplying the epoxy resin composition according to any one of Appendices 1 to 42 onto a laminate including a support and a semiconductor element mounted on the support; and a step of filling a gap between the support and the semiconductor element with the epoxy resin composition to form a molded body, and curing the molded body to encapsulate the semiconductor element, thereby obtaining an encapsulated body.

[0121] REFERENCE SIGNS LIST 1 semiconductor element 2 solder bump 3 support 4 laminate 5 epoxy resin composition 6 syringe 7 mold 8 compression molded body 9 sealing body 11 semiconductor element 12 solder bump 13 support 14 laminate 15 epoxy resin composition 16 syringe 17 mold 18 compression molded body 19 sealing body 20 silicon wafer 30 silicon chip 40 spacer 50 sealing layer

Claims

1. An epoxy resin composition comprising an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C), which satisfies the following formula (V): Viscosity (1) x Viscosity (2) ≦ 500 (V) Viscosity (1): Viscosity of the epoxy resin composition at 25°C (Pa s) Viscosity (2): Viscosity of the epoxy resin composition at 150°C (Pa s) 2. The epoxy resin composition according to claim 1, wherein the inorganic filler (C) is an inorganic filler (C1) that has been surface-treated with a silane coupling agent (S1) having a hydrocarbon group having 4 to 15 carbon atoms.

3. The epoxy resin composition according to claim 2, wherein the silane coupling agent (S1) has a reactive functional group.

4. The silane coupling agent (S1) is represented by the following formula (I): [In formula (I), n is an integer of 4 to 15. R １ ~R ３ are the same or different and are a methyl group, an ethyl group, a methoxy group, or an ethoxy group. ４ is a group containing a reactive functional group. ] The epoxy resin composition according to claim 2, 5. The epoxy resin composition according to claim 1 or 2, having a glass transition temperature Tg of 130°C or lower.

6. The epoxy resin composition according to claim 1 or 2, which has a viscosity of 10 to 1,000 Pa·s at 25°C and a viscosity of 0.1 to 0.7 Pa·s at 150°C.

7. The epoxy resin composition according to claim 2, wherein the content of the inorganic filler (C1) relative to the epoxy resin composition (100% by mass) is 65 to 90% by mass.

8. The epoxy resin composition according to claim 2, wherein the amount of the silane coupling agent (S1) used for surface treatment of the inorganic filler (C1) is 0.5 to 2.5 mass %.

9. The epoxy resin composition according to claim 1 or 2, which is a liquid compression molding material.

10. A cured product of the epoxy resin composition according to claim 1 or 2.

11. A semiconductor device comprising the cured product of claim 10.

12. A semiconductor device comprising: a support; a semiconductor element mounted on the support; and the cured product according to claim 10 that seals the semiconductor element.

13. A method for manufacturing a semiconductor device, comprising the steps of: supplying the epoxy resin composition according to claim 1 or 2 onto a laminate comprising a support and a semiconductor element mounted on the support; filling the gap between the support and the semiconductor element with the epoxy resin composition to form a molded body; and curing the molded body to encapsulate the semiconductor element, thereby obtaining an encapsulated body.

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