Method for manufacturing purging plate supporting supply of nitrogen gas into FOUP and computing device using same

Abstract

Disclosed are a method for manufacturing a purging plate supporting the supply of nitrogen gas into a FOUP, and a computing device using same, the method comprising the steps of: (a) providing a solid material to each of four regions on a predetermined plane and then generating a first adhesive solid material by using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source on the solid material to each of the four regions on the predetermined plane, so that four pipe-fitting coupling portions are generated as four first adhesive layers each having a first length, a first width, and a first height, wherein the four pipe-fitting coupling portions are generated by forming four 1-1 inner spaces in which each the four first adhesive layers are not generated to a 1-1 inner height of the first height, the 1-1 inner lengths and the 1-1 inner widths of the four 1-1 inner spaces being smaller than the first lengths and the first widths, and forming predetermined through-holes on at least some surfaces excluding an upper surface located at the upper portion corresponding to the first height; (b) after moving each of the four pipe-fitting coupling portions a distance corresponding to the first height in a direction away from the predetermined stimulation source, providing the solid material to the upper portions of the four pipe-fitting coupling portions corresponding to the first height, and then generating a second adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to each of the upper portions of the four pipe fitting-coupling portions corresponding to the first height, and laminating same, so that a second adhesive layer is generated to a second height, wherein the second adhesive layer is generated by forming, in portions continuous with the four 1-1 inner spaces of the four pipe-fitting coupling portions, four 1-2 inner spaces in which the second adhesive layer is not generated to a 1-2 inner height of the second height, the 1-2 inner lengths and the 1-2 inner widths of the four 1-2 inner spaces being smaller than the first lengths and the first widths, forming, in a direction away from each of the four pipe-fitting coupling portions from specific inner side surfaces among surfaces of the second adhesive layer surrounding the four 1-2 inner spaces, four gas pipes serving as four second inner spaces, each having a second inner length and a second inner width, and in which the second adhesive layer is not generated to a second inner height of the second height, the second inner height being smaller than the 1-2 inner height, and forming four first hollow portions defined from a central position spaced a predetermined distance apart from one of the two ends of each of the four gas pipes, the one end being distal to each of the four pipe fitting coupling portions; (c) after moving each of the four pipe-fitting coupling portions and the second adhesive layer a distance corresponding to the second height in a direction away from the predetermined stimulation source, providing the solid material to the upper portion of the second adhesive layer, and then generating a third adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to the upper portion of the second adhesive layer, and laminating same, so that a third adhesive layer is generated to a third height, wherein the third adhesive layer is generated by forming, to the third height, four FOUP coupling structures, each having four second hollow portion defined from the central position above the four first hollow portions.

Description

Method for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a furnace and a computing device using the same

[0001] The present invention relates to a method for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a furnace and a computing device using the same.

[0002] A Front Opening Unified POD (FOUP) is a container used to store and transport wafers, which are substrates used to manufacture semiconductor chips, and serves to prevent external air from directly contacting the wafers during the semiconductor manufacturing process.

[0003] However, there was a problem that the process gas used in the semiconductor manufacturing process using the process equipment could remain on the wafer and be loaded inside the FOUP, which could cause direct contamination of other wafers due to the fume generated by the process gas remaining on the wafer, and the fume could stick to the inner wall of the FOUP and contaminate the equipment during the process using the next process equipment, or if a new wafer is loaded inside the FOUP, the new wafer could be contaminated by the fume, thereby lowering the yield of the wafer. These problems have been highlighted more recently as the size of semiconductor devices has become smaller and the integration has improved.

[0004] In this regard, in the past, this problem was solved by performing purging to remove process gases remaining inside the hopper by injecting nitrogen gas into the hopper and to prevent contamination of the wafer by replacing the inside of the hopper with nitrogen gas.

[0005] For example, referring to FIG. 1, at least some of the first FOUPs (210) to the fourth FOUPs (240) may be mounted on the first load port (110) to the fourth load port (140) installed in the semiconductor process equipment (100). In addition, the first purging device (310) to the fourth purging device (340) may be additionally installed at the bottom of each of the first load port (110) to the fourth load port (140) so that nitrogen gas can be introduced into the interior of each of the first FOUPs (210) to the fourth FOUPs (240) from the semiconductor manufacturing line to perform purging.

[0006] That is, in a system configured as described above, when nitrogen gas supplied from a semiconductor manufacturing line through a nitrogen gas pipe is introduced into at least some of the first purging device (310) to the fourth purging device (340), and when it is detected that at least some of the first FOUP (210) to the fourth FOUP (240) are mounted on at least some of the first load port (110) to the fourth load port (140), purging is performed by causing nitrogen gas to be introduced into at least some of the first FOUP (110) to the fourth FOUP (140) by the corresponding operation of at least some of the first purging device (310) to the fourth purging device (340).

[0007] At this time, among the methods of connecting the first purging device (310) to the fourth purging device (340) and the first FOUP (210) to the fourth FOUP (240) respectively in performing purging, a method of inserting a purging plate into each of the first separation space (S1) between the mounting surface on the first load port (110) and the lower surface of the first FOUP (210) to the fourth separation space (S4) between the mounting surface on the fourth load port (140) and the lower surface of the fourth FOUP (240) respectively, connecting the first purging device (310) to the fourth purging device (340) and the purging plate respectively through a predetermined pipe, and performing purging on at least a part of the first FOUP (210) to the fourth FOUP (240) via each of the purging plates is being studied.

[0008] However, the height of each of the first to fourth separation spaces (S1) to which each of the purging plates is inserted is typically formed to be about 3 mm to 10 mm, and each of the purging plates must be formed with a plurality of gas pipes, which are passages for the movement of nitrogen gas introduced into at least a portion of the first FOUP (210) to the fourth FOUP (240) and exhaust gas exhausted from at least a portion of the first FOUP (210) to the fourth FOUP (240), within the height of each of the first to fourth separation spaces (S1) to the fourth FOUP (240), and a plurality of nozzles connected so as to be in direct contact with each of the first FOUP (210) and the fourth FOUP (240), adjacent to each of the plurality of gas pipes. However, there is a problem in that it is very difficult to manufacture a purging plate that satisfies this using conventional processing techniques such as a mold.

[0009] As another example, by modifying any one of the existing STB (Side Track Buffer), OHB (Over Head Buffer) and Stocker by additionally installing a specified purging device and purging plate, purging using nitrogen gas can be performed on any one of the STB, OHB and Stocker. However, as in the case of the load ports (110 to 140) described above, the height between the mounting surface of any one of the STB, OHB and Stocker and the lower surface of the FOUP will be about 3 to 10 mm, so there is a problem that it is very difficult to manufacture the purging plate using conventional processing techniques such as molds.

[0010] Therefore, there is a need for improvement measures to solve the above problems.

[0011] The purpose of the present invention is to solve all of the above-described problems.

[0012] In addition, the present invention has another purpose of manufacturing a purging plate so that the purging plate is inserted into a space formed between the mounting surface of any one of a load port, an STB, an OHB, and a Stocker and the lower surface of a hopper, and including a gas pipe as a passage through which nitrogen gas or exhaust gas can move and a gas nozzle connecting the gas pipe and the hopper.

[0013] In addition, the present invention provides a method for forming a first adhesive solid material by providing a solid material to each of four portions on a predetermined plane and then using a predetermined adhesive supplied from a predetermined stimulus source, or by providing a first adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material to each of four portions on a predetermined plane to form each of four first adhesive layers, and then moving each of the four first adhesive layers away from the predetermined stimulus source, and then providing a solid material on top of each of the four first adhesive layers and then using a predetermined adhesive supplied from a predetermined stimulus source to form a second adhesive solid material, or by providing a second adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material on top of each of the four first adhesive layers to form a second adhesive layer, and then moving each of the four first adhesive layers and the second adhesive layer away from the predetermined stimulus source, and then providing a solid material on top of the second adhesive layer and then using a predetermined adhesive supplied from a predetermined stimulus source to form a third adhesive solid material, or by providing a third adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material to form the second adhesive layer. Another object of the present invention is to provide a purging plate comprising four first adhesive layers each, one second adhesive layer each, and four third adhesive layers each, by providing a third adhesive layer on top.

[0014] In order to achieve the purpose of the present invention as described above and to realize the characteristic effects of the present invention described below, the characteristic configuration of the present invention is as follows.

[0015] According to one aspect of the present invention, a method for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a FOUP comprises: (a) providing a solid material to each of four portions on a predetermined plane, and then generating a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, so that four pipe fitting joints are generated as four first adhesive layers each having a first length and a first width, each of which is as much as a first height, but four 1_1 internal spaces in which each of the four first adhesive layers is not generated by the 1_1 internal height among the first heights, each of the 1_1 internal lengths and the 1_1 internal widths of each of the four 1_1 internal spaces being smaller than each of the first lengths and the first widths, respectively, and forming at least a portion of the upper surface excluding each of the upper surfaces located at an upper portion corresponding to the first height. A step of forming each of the four pipe fitting joints by forming a predetermined through hole in each of them;(b) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and laminated, thereby generating a second adhesive layer as much as the second height, but in a portion connected to each of the four 1_1 internal spaces of each of the four pipe fitting joints, four 1_2 internal spaces in which the second adhesive layer is not generated by the 1_2 internal height among the second heights are formed, each of which has a 1_2 internal length and a 1_2 internal width of each of the four 1_2 internal spaces smaller than each of the first lengths and each of the first widths, and A step of forming four gas pipes, each of which has a second internal length and a second internal width, and in a direction away from each of the four pipe fitting joints, each of which has a second internal height, wherein the second internal height is less than the 1_2 internal height, as four second internal spaces, each of which has a second internal length and a second internal width, and in which the second adhesive layer is not formed, and forming four first hollow portions, each of which is defined from a central position spaced a predetermined distance apart from each of the four pipe fitting joints, each of which is distal from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, so that the second adhesive layer is formed;And (c) a manufacturing method including a step of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to create a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby creating a third adhesive layer by a third height, while forming each of four pucker joint structures in which each of the four second hollow portions defined from each of the central positions is formed on each of the four first hollow portions by the third height, while creating the third adhesive layer.

[0016] As an example, in the step (a), (i) a process of providing the solid material to each of the four portions on the predetermined plane and then generating a first_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or providing the first_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, thereby generating four first_1 adhesive layers each having the first length and the first width and the first height as much as the first_1 height among the first heights; (ii) After moving each of the four 1_1 adhesive layers by a length corresponding to the 1_1 height in a direction away from the predetermined stimulus source, the solid material is provided on top of each of the four 1_1 adhesive layers, and then the 1_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 1_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source on the solid material is provided on top of each of the four 1_1 adhesive layers to be laminated, thereby generating four 1_2 adhesive layers by the 1_2 height among the first heights, and forming four first through holes in the width direction in the structure corresponding to each 1_1 width among the first widths of each of the four 1_2 adhesive layers, and forming four 1_1_a portion internal spaces among the four 1_1 internal spaces in the structure corresponding to each 1_2 width among the first widths, and forming the first width A process in which each of the four second through holes in the width direction is formed in the structure corresponding to each of the first and third widths, and each of the four first and second adhesive layers is created;And (iii) a process of moving each of the four 1_1 adhesive layers and each of the four 1_2 adhesive layers by a length corresponding to the 1_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of each of the four 1_2 adhesive layers and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 1_3 adhesive solid material, or providing the 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of each of the four 1_2 adhesive layers and stacking them, thereby generating each of the four 1_3 adhesive layers by the 1_3 height among the first heights, while forming each of the four 1_1_b portion internal spaces among the four 1_1 internal spaces in a structure corresponding to each of the 1_2 widths, is disclosed.;

[0017] As an example, in the step (b), (i) after moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then the 2_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source is provided to each upper portion of each of the four pipe fitting joints to laminate, thereby generating a 2_1 adhesive layer as much as the 2_1 height among the second heights, and forming each of the four 1_2_a portion internal spaces among the four 1_2 internal spaces in a structure corresponding to each of the 1_2 widths among the first widths at each upper portion corresponding to the first height of each of the four pipe fitting joints, and the 2_1 adhesive layer surrounds each of the four 1_2 internal spaces. A process for forming a second_1 adhesive layer having a second_1 length and a second_1 width, each of which is greater than each of the second internal lengths and each of the second internal widths, in a direction away from each of the four pipe fitting joints from each of the specific internal sides among the sides, such that each of the second_1 lengths and each of the second_1 widths is greater than each of the second internal lengths and each of the second internal widths, and such that each of the second_1 adhesive layers is formed as long as the second_1 height;(ii) After moving each of the four pipe fitting joints and the 2_1 adhesive layer by a length corresponding to the 2_1 height in a direction away from the predetermined stimulus source, the solid material is provided on the upper portion of the 2_1 adhesive layer, and then the 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper portion of the 2_1 adhesive layer to laminate, thereby generating the 2_2 adhesive layer as much as the 2_2 height among the 2_2 heights - the 2_2 height corresponds to the second internal height -, and in the structure corresponding to each of the 1_2 widths at the 2_1 height, each of the four 1_2_b portion internal spaces among the four 1_2 internal spaces is formed, and each of the four pipes is connected from each of the specific internal side surfaces of the 2_2 adhesive layer surrounding each of the four 1_2 internal spaces. A process for forming each of the four gas pipes, each of the four second internal spaces, in a direction away from each of the fitting joints, each of the four second internal spaces having each of the second internal lengths and each of the second internal widths, and forming each of the four first_1 hollow portions defined from each of the central positions spaced apart by a predetermined distance from each of the four pipe fitting joints at each of the two ends of each of the four gas pipes, while generating each of the second_2 adhesive layers having each of the second_2 lengths, each of the second_2 widths, and each of the second_2 heights;And (iii) a process of moving each of the four pipe fitting joints, the 2_1 adhesive layer and the 2_2 adhesive layer by a length corresponding to the 2_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 2_2 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to create a 2_3 adhesive solid material, or providing the 2_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 2_2 adhesive layer and laminating it, thereby creating a 2_3 adhesive layer as much as the 2_3 height among the 2 heights, while forming each of the four 1_2 hollow portions defined from each of the central positions spaced apart by the predetermined distance from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, and creating the 2_3 adhesive layer having each of the 2_3 lengths, each of the 2_3 widths and the 2_3 height; A manufacturing method characterized by the following is disclosed.;

[0018] As an example, in the step (c), (i) a process of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby generating a third_1 adhesive layer as much as the 3_1 height among the third heights, while forming each of four 1_1 pucker joint detail structures, each of which is formed from each of the four 2_1 hollow portions defined from the respective central positions on the upper side of each of the four first hollow portions, as much as the 3_1 height, while generating the 3_1 adhesive layer; And (ii) a process of moving each of the four pipe fitting joints, the second adhesive layer and the 3_1 adhesive layer by a length corresponding to the 3_1 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 3_1 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 3_2 adhesive solid material, or providing the 3_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 3_1 adhesive layer and laminating it, thereby generating the 3_2 adhesive layer as much as the 3_2 height among the 3 heights, while forming each of the four 1_2 pu joint detailed structures, each of which has four 2_2 hollow portions defined from each of the central positions on the upper side of each of the four 1_1 pu joint detailed structures, by the 3_2 height, while generating the 3_2 adhesive layer.

[0019] As an example, in the (i) process, the 3_1 adhesive layer is formed while forming the four 1_1 pu joint substructures having the 3_1 height, each having a 3_1 radius from each of the central positions on the upper side of the second adhesive layer, a part of each of the 3_1 radii corresponding to the outside of each of the four 2_1 hollow portions, and each of the four 1_1 pu joint substructures having the 3_1 height, each of the four 2_1 hollow portions defined from each of the central positions is formed on the upper side of each of the four 1_1 hollow portions, and in the (ii) process, the four 3_2 radii from each of the central positions on the upper side of the 3_1 adhesive layer, each of the 3_2 radii being smaller than each of the 3_1 radii, and a part of each of the 3_2 radii corresponding to the outside of each of the four 2_2 hollow portions, and each of the four 3_2 radii having the 3_2 height. A manufacturing method is disclosed, characterized in that the 3_2 adhesive layer is formed while forming each of the 1_2 puppled detailed structures - each of the four 1_2 puppled detailed structures has each of the four 2_2 hollow portions defined from each of the central positions formed on the upper side of each of the four 2_1 hollow portions.

[0020] As an example, in the step (c), a manufacturing method is disclosed, characterized in that the size of each of the four 2_1 hollow portions is formed to be smaller than the size of each of the four 1st hollow portions, the size of each of the four 2_1 hollow portions and the size of each of the four 2_2 hollow portions are formed to be the same, and each of the four gas nozzles, which are each of the four 1_1 FOOP joint detail structures and each of the four 1_2 FOOP joint detail structures, is formed as the third adhesive layer.

[0021] As an example, a manufacturing method is disclosed, which further comprises the steps of: (d) performing at least a part of a process of performing surface treatment by sanding each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, (ii) cleaning each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, which have been surface treated using a cleaning solution, and then blowing air to dry each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, and (iii) performing subsequent curing on each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer using at least a part of a predetermined curing agent, an additional light source, and hot air.

[0022] As an example, a manufacturing method is disclosed, characterized in that in step (b), three guide pin insertion portions are additionally formed in each of three portions where guide pins for fixing the hopper are inserted, each portion having a size identical to that of the guide pin and a length corresponding to the second height, while the second adhesive layer is generated.

[0023] As an example, a manufacturing method is disclosed, characterized in that, in step (b), a corresponding opening pattern matching a specific pattern formed on a mounting surface of any one of a load port, a side track buffer (STB), an overhead buffer (OHB), and a stocker is additionally formed to a length corresponding to the second height, while the second adhesive layer is formed.

[0024] As an example, a manufacturing method is disclosed, characterized in that, in the step (a), each of the predetermined through holes formed in each of the four pipe fitting joints is formed as a structure for connecting each of the external pipes for introducing nitrogen gas into the inside of the hopper or for exhausting exhaust gas from the hopper, while each of the four pipe fitting joints is formed.

[0025] According to another aspect of the present invention, a computing device for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a FOUP comprises: at least one memory for storing instructions; And at least one processor configured to execute the instructions, wherein the processor (I) provides a solid material to each of four portions on a predetermined plane and then generates a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or provides the first adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, so that four pipe fitting joints are generated as four first adhesive layers each having a first length each and a first width each and a first height each, and wherein four 1_1 internal spaces in which each of the four first adhesive layers is not generated by the 1_1 internal height of the first height, each of the 1_1 internal lengths and each of the 1_1 internal widths of each of the four 1_1 internal spaces being smaller than each of the first lengths each and each of the first widths each, and each of the predetermined through holes is formed on each of at least some surfaces except each of the upper surfaces located at an upper portion corresponding to the first height. A process for forming, wherein each of the four pipe fitting joints is created;(II) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the second adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and laminated, thereby generating a second adhesive layer as much as the second height, but in a portion connected to each of the four 1_1 internal spaces of each of the four pipe fitting joints, four 1_2 internal spaces in which the second adhesive layer is not generated by the 1_2 internal height among the second heights - each of the 1_2 internal lengths and each of the 1_2 internal widths of each of the four 1_2 internal spaces is smaller than each of the first lengths and each of the first widths - are formed, A process for forming four gas pipes, each of which has a second internal length and a second internal width, and in a direction away from each of the four pipe fitting joints, each of which has a second internal height, wherein the second internal height is less than the 1_2 internal height, as four second internal spaces, each of which has a second internal length and a second internal width, and in which the second adhesive layer is not formed, while forming four first hollow portions, each of which is defined from a central position spaced a predetermined distance apart from each of the four pipe fitting joints, each of which is distal from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, so that the second adhesive layer is formed;And (III) a computing device is disclosed that performs a process of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby generating a third adhesive layer by a third height, while forming each of four pucker joint structures in which each of the four second hollow portions defined from each of the central positions is formed on each of the four first hollow portions by the third height, thereby generating the third adhesive layer.

[0026] As an example, the processor, in the (I) process, (i) a sub-process of providing the solid material to each of the four portions on the predetermined plane and then generating a first_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or providing the first_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, thereby generating four first_1 adhesive layers each having the first length and the first width and the first height as much as the first_1 height among the first heights; (ii) After moving each of the four 1_1 adhesive layers by a length corresponding to the 1_1 height in a direction away from the predetermined stimulus source, the solid material is provided on top of each of the four 1_1 adhesive layers, and then the 1_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 1_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source on the solid material is provided on top of each of the four 1_1 adhesive layers to be laminated, thereby generating four 1_2 adhesive layers by the 1_2 height among the first heights, and forming four first through holes in the width direction in the structure corresponding to each 1_1 width among the first widths of each of the four 1_2 adhesive layers, and forming four 1_1_a portion internal spaces among the four 1_1 internal spaces in the structure corresponding to each 1_2 width among the first widths, and forming the first width A sub-process for forming four second through holes in the width direction in each structure corresponding to each of the first and third widths, while generating each of the four first and second adhesive layers;And (iii) moving each of the four 1_1 adhesive layers and each of the four 1_2 adhesive layers by a length corresponding to the 1_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of each of the four 1_2 adhesive layers and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 1_3 adhesive solid material, or providing the 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of each of the four 1_2 adhesive layers and stacking them, thereby generating each of the four 1_3 adhesive layers by the 1_3 height among the first heights, while forming each of the four 1_1_b portion internal spaces among the four 1_1 internal spaces in a structure corresponding to each of the 1_2 widths, a computing device is disclosed.;

[0027] As an example, the processor, in the (II) process, (i) moves each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, and then provides the solid material to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then generates a second_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or provides the second_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each upper portion of each of the four pipe fitting joints, and laminates the solid material, so that a second_1 adhesive layer is generated as much as the second_1 height among the second heights, and forms each of the four 1_2_a portion internal spaces among the four 1_2 internal spaces in a structure corresponding to each of the 1_2 widths among the first widths at each upper portion corresponding to the first height of each of the four pipe fitting joints, and surrounds each of the four 1_2 internal spaces. A sub-process for generating the 2_1 adhesive layer having a 2_1 length and a 2_1 width, each of which is greater than the 2_1 inner length and the 2_1 inner width, in a direction away from each of the four pipe fitting joints from each of the specific inner sides among the sides of the 2_1 adhesive layer, and having a 2_1 height;(ii) After moving each of the four pipe fitting joints and the 2_1 adhesive layer by a length corresponding to the 2_1 height in a direction away from the predetermined stimulus source, the solid material is provided on the upper portion of the 2_1 adhesive layer, and then the 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper portion of the 2_1 adhesive layer to laminate, thereby generating the 2_2 adhesive layer as much as the 2_2 height among the 2_2 heights - the 2_2 height corresponds to the second internal height -, and in the structure corresponding to each of the 1_2 widths at the 2_1 height, each of the four 1_2_b portion internal spaces among the four 1_2 internal spaces is formed, and each of the four pipes is connected from each of the specific internal side surfaces of the 2_2 adhesive layer surrounding each of the four 1_2 internal spaces. A sub-process for forming each of the four gas pipes, each of the four second internal spaces, in a direction away from each of the fitting joints, each of the second internal lengths and each of the second internal widths, and forming each of the four 1_1 hollow portions defined from each of the central positions spaced apart from each of the four pipe fitting joints at each of the two ends of each of the four gas pipes by a predetermined distance, while generating each of the 2_2 adhesive layers having each of the 2_2 lengths, each of the 2_2 widths, and each of the 2_2 heights;And (iii) a sub-process of moving each of the four pipe fitting joints, the second_1 adhesive layer and the second_2 adhesive layer by a length corresponding to the second_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second_2 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a second_3 adhesive solid material, or providing the second_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second_2 adhesive layer and laminating it, thereby generating a second_3 adhesive layer by the second_3 height among the second heights, while forming each of the four first_2 hollow portions defined from each of the central positions spaced apart by the predetermined distance from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, and generating the second_3 adhesive layer having each of the second_3 lengths, each of the second_3 widths and the second_3 height; A computing device characterized by performing:

[0028] As an example, the processor, in the (III) process, (i) a sub-process in which the processor moves each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then provides the solid material on top of the second adhesive layer and then generates a third_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or provides the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source on the solid material on top of the second adhesive layer and laminates it, thereby generating the third_1 adhesive layer as much as the 3_1 height among the third heights, while forming each of the four 1_1 pucker joint detail structures, each of which is formed from each of the four 2_1 hollow portions defined from the central positions on the upper side of each of the four first hollow portions, as much as the 3_1 height, while generating the 3_1 adhesive layer; And (ii) a sub-process of moving each of the four pipe fitting joints, the second adhesive layer and the 3_1 adhesive layer by a length corresponding to the 3_1 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 3_1 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 3_2 adhesive solid material, or providing the 3_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 3_1 adhesive layer and laminating it, thereby generating a 3_2 adhesive layer as much as the 3_2 height among the 3 heights, while forming each of the four 1_2 pu joint detailed structures, each of which has four 2_2 hollow portions defined from each of the central positions on the upper side of each of the four 1_1 pu joint detailed structures, as much as the 3_2 height, while generating the 3_2 adhesive layer;A computing device characterized by performing the following is disclosed.

[0029] As an example, the processor, in the (i) sub-process, forms the four 1_1 pu joint sub-structures having the 3_1 height, each of which has a 3_1 radius from each of the central positions on the upper side of the second adhesive layer, a portion of each of the 3_1 radii corresponding to the outside of each of the four 2_1 hollow portions, and each of which has the 3_1 height, and in the four 1_1 pu joint sub-structures, each of which has the 4 2_1 hollow portions defined from each of the central positions on the upper side of each of the four 1_1 hollow portions, the 3_1 adhesive layer is generated, and in the sub-(ii) process, forms the 3_2 radii from each of the central positions on the upper side of the 3_1 adhesive layer, each of which is smaller than each of the 3_1 radii, and a portion of each of the 3_2 radii corresponding to the outside of each of the four 2_2 hollow portions, and the 3_2 height. A computing device is disclosed, characterized in that the 3_2 adhesive layer is formed while forming each of the four 1_2 puppable joint detail structures - each of the four 1_2 puppable joint detail structures has each of the four 2_2 hollow portions defined from each of the central positions formed on the upper side of each of the four 2_1 hollow portions.

[0030] As an example, a computing device is disclosed, characterized in that the processor, in the (III) process, forms each of the four 2_1 hollow portions so that the size of each of the four 2_1 hollow portions is smaller than the size of each of the four 1_1 hollow portions, forms each of the four 2_2 hollow portions so that the size of each of the four 2_1 hollow portions and the size of each of the four 2_2 hollow portions are the same, and forms each of the four gas nozzles, each of the four 1_1 FOOP coupling detailed structures and each of the four 1_2 FOOP coupling detailed structures, as the third adhesive layer.

[0031] As an example, a computing device is disclosed, characterized in that the processor further performs (IV) a process of performing at least a part of the following sub-processes: (i) a sub-process of sanding the surface of each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, (ii) a sub-process of cleaning each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, which have been surface-treated using a cleaning solution, and then blowing air to dry each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, and (iii) a sub-process of performing subsequent curing on each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer using at least a part of a predetermined curing agent, an additional light source, and hot air.

[0032] As an example, a computing device is disclosed, characterized in that the processor, in the process (II), additionally forms three guide pin insertion portions each with a length corresponding to the second height and the same size as the guide pin, in each of the three portions where the guide pin for fixing the hole is inserted, while the second adhesive layer is generated.

[0033] As an example, a computing device is disclosed, characterized in that the processor, in the process (II), forms a corresponding opening pattern matching a specific pattern formed on a mounting surface of any one of a load port, a side track buffer (STB), an overhead buffer (OHB), and a stocker, with a length corresponding to the second height, while forming the second adhesive layer.

[0034] As an example, a computing device is disclosed, wherein the processor, in the process (I), forms each of the predetermined through holes formed in each of the four pipe fitting joints as a structure for connecting each of the external pipes for introducing nitrogen gas into the interior of the hopper or for exhausting exhaust gas from the hopper, and the four pipe fitting joints are formed.

[0035] The present invention has the effect of manufacturing a purging plate so that the purging plate is inserted into a space formed between the mounting surface of any one of a load port, an STB, an OHB and a Stocker and the lower surface of a hopper, and so that the purging plate includes a gas pipe as a passage through which nitrogen gas or exhaust gas can move and a gas nozzle connecting the gas pipe and the hopper.

[0036] In addition, the present invention provides a method for forming a first adhesive solid material by providing a solid material to each of four portions on a predetermined plane and then using a predetermined adhesive supplied from a predetermined stimulus source, or by providing a first adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material to each of four portions on a predetermined plane to form each of four first adhesive layers, and then moving each of the four first adhesive layers away from the predetermined stimulus source, and then providing a solid material on top of each of the four first adhesive layers and then using a predetermined adhesive supplied from a predetermined stimulus source to form a second adhesive solid material, or by providing a second adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material on top of each of the four first adhesive layers to form a second adhesive layer, and then moving each of the four first adhesive layers and the second adhesive layer away from the predetermined stimulus source, and then providing a solid material on top of the second adhesive layer and then using a predetermined adhesive supplied from a predetermined stimulus source to form a third adhesive solid material, or by providing a third adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material to form the second adhesive layer. By providing a third adhesive layer on top, there is an effect of producing a purging plate including each of four first adhesive layers, one second adhesive layer, and four third adhesive layers.

[0037] The drawings attached below for use in explaining embodiments of the present invention are only some of the embodiments of the present invention, and a person having ordinary knowledge in the technical field to which the present invention pertains (hereinafter “ordinary skilled worker”) can obtain other drawings based on these drawings without performing an inventive work.

[0038] Figure 1 schematically illustrates a conventional system configuration for purging the interior of a hopper mounted on a load port.

[0039] FIG. 2 schematically illustrates a computing device for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a poultry according to one embodiment of the present invention.

[0040] FIG. 3 schematically illustrates a process for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a poultry according to one embodiment of the present invention.

[0041] FIGS. 4A to 4D schematically illustrate a process for creating each of four pipe fitting joints as each of four first adhesive layers according to one embodiment of the present invention.

[0042] FIGS. 5A to 5D schematically illustrate a process for creating a second adhesive layer on top of each of four pipe fitting joints according to one embodiment of the present invention.

[0043] FIGS. 6A to 6C schematically illustrate a process for creating each of four pucker bonding structures on top of a second adhesive layer according to one embodiment of the present invention.

[0044] FIG. 7 illustrates an example of a completed purging plate in which each of four pipe fitting joints, one second adhesive layer, and four pucker joint structures is created according to one embodiment of the present invention.

[0045] The detailed description of the present invention, which follows, refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be implemented, to clearly illustrate the purposes, technical solutions, and advantages of the present invention. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention.

[0046] Furthermore, throughout the detailed description and claims of the present invention, the word "comprise" and its variations are not intended to exclude other technical features, additives, components, or steps. Other objects, advantages, and features of the present invention will become apparent to those skilled in the art, in part from this description and in part from practice of the invention. The examples and drawings below are provided for illustrative purposes and are not intended to limit the present invention.

[0047] Furthermore, the present invention encompasses all possible combinations of the embodiments set forth herein. It should be understood that the various embodiments of the present invention, while different, are not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in one embodiment without departing from the spirit and scope of the present invention. Furthermore, it should be understood that the positions or arrangements of individual components within each disclosed embodiment may be modified without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be limiting, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled, if properly described. Like reference numerals in the drawings designate the same or similar functions throughout the several aspects.

[0048] Hereinafter, in order to enable a person having ordinary skill in the art to easily practice the present invention, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0049] FIG. 2 schematically illustrates a computing device for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a hopper according to one embodiment of the present invention.

[0050] Referring to FIG. 2, a computing device (400) may include a memory (410) that stores instructions for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a hopper, and a processor (420) that performs an operation for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a hopper in response to the instructions stored in the memory (410). At this time, the computing device (400) may include various computing devices such as a server, a personal computer (PC), a laptop, a workstation, a tablet, a mobile computer, a PDA / EDA, a cell phone, a smart phone, an IOT device, etc.

[0051] Specifically, the computing device (400) may typically utilize a combination of computing devices (e.g., devices that may include computer processors, memory, storage, input devices and output devices, and other components of conventional computing devices; electronic communication devices such as routers, switches, etc.; electronic information storage systems such as network attached storage (NAS) and storage area networks (SAN)) and computer software (i.e., instructions that enable the computing device to perform in a particular manner) to achieve desired system performance.

[0052] Additionally, the processor of the computing device may include hardware components such as a Micro Processing Unit (MPU) or a Central Processing Unit (CPU), cache memory, and a data bus. Furthermore, the computing device may further include software components such as an operating system and applications that perform specific purposes.

[0053] However, this does not exclude the case where the computing device includes an integrated processor in which a medium processor and memory are integrated to implement the present invention.

[0054] Meanwhile, the computing device (400) may be installed in a manufacturing device for manufacturing a purging plate to support the manufacturing device to manufacture the purging plate, or may be implemented externally in the form of a server (or cloud server) for maintenance and convenience to support the manufacturing device to manufacture the purging plate, but is not limited thereto.

[0055] For reference, in a state where a purging device is installed to convert nitrogen gas supplied through an external gas pipe into one of 1in-1out, 3in-1out, and 2in-2out input / output forms based on the mounting surface (e.g., the upper surface) of any one of the load port, STB, OHB, and Stocker to allow nitrogen gas to be introduced into the inside of the FOUP, the purging plate to be manufactured in the present invention is mounted on the mounting surface of any one of the load port, STB, OHB, and Stocker, and each of four pipe fitting joints for allowing the external gas pipe to be connected in a direction from the purging device to at least some of the four first adhesive layers is formed on the lower side of the purging plate, and four gas nozzle structures for directly contacting the lower surface of the FOUP to allow nitrogen gas to be introduced into the inside of the FOUP through at least some of the four gas nozzles are formed on the upper side of the purging plate, and four gas nozzle structures are formed between at least some of the four pipe fitting joints and at least some of the four gas nozzles, which are internal spaces through which nitrogen gas or exhaust gas can move. Each pipe (so-called internal gas pipe, described herein as being formed within the second adhesive layer) is a structure formed. That is, in the following, for parts where a specific use is not described, it should be interpreted as a common configuration applicable to any of the load port, STB, OHB, and Stocker.

[0056] FIG. 3 schematically illustrates a process for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a hopper according to one embodiment of the present invention.

[0057] First, a solid material is provided to each of four portions on a predetermined plane, and then a first adhesive solid material is generated using a predetermined adhesive supplied from a predetermined stimulus source, or a first adhesive solid material generated using a predetermined adhesive supplied from a predetermined stimulus source is provided to each of four portions on the predetermined plane, so that four pipe fitting joints are generated as four first adhesive layers each having a first length and a first width, respectively, and as much as the first height, but four 1_1 internal spaces are formed in which four first adhesive layers are not generated as much as the 1_1 internal height among the first heights (each of the 1_1 internal lengths and each of the 1_1 internal widths of each of the four 1_1 internal spaces is smaller than each of the first lengths and the first widths), and each of the four pipe fitting joints is generated by forming each of a predetermined through hole on each of at least some surfaces except each of the upper surfaces located at the upper portion corresponding to the first height (S10).

[0058] For example, (i) by applying a solid material such as a metal, polymer, or ceramic in powder form to each of four portions on a predetermined plane within a manufacturing device, and then spraying ink liquefied through a predetermined stimulus as a predetermined adhesive through a nozzle onto the solid material applied to fit the shape of each of the four first adhesive layers so that the solid materials are bonded, the process of creating a first adhesive solid material is repeated up to a first height, or (ii) by coating a solid material made in the form of a film or sheet using various materials such as paper, glass fiber, synthetic resin, clay, or metal with an adhesive created through a predetermined stimulus, and then placing the first adhesive solid material on a predetermined plane within the manufacturing device and processing it using a knife or laser, etc. to fit each of the four portions, the process is repeated up to a first height, so that each of the four pipe fitting joints as each of the four first adhesive layers is created. At this time, the adhesive layer described in the present invention (including not only each of the four first adhesive layers but also the second adhesive layer and the third adhesive layer to be described later) is defined as a solid material layer bonded by a predetermined adhesive (i.e., including each of the predetermined adhesives for bonding solid materials to solid materials), and even if the above content is omitted below, it should be understood that it includes the same meaning.

[0059] In addition, the predetermined stimulus source may be an adhesive injection unit, (i) a solid material in powder form may be provided to each of four portions on a predetermined plane, and then a predetermined adhesive supplied from the predetermined stimulus source (e.g., an adhesive for bonding between powders, such as an ink-type binder) may be used to bond molecules corresponding to a predetermined area among the powder molecules to generate a first adhesive solid material (e.g., a state in which the powders are bonded), and (ii) a first adhesive solid material (e.g., a state in which a film or sheet is bonded) may be generated by using a predetermined adhesive supplied from the predetermined stimulus source to a sheet-type solid material, and then the first adhesive solid material may be provided to each of the four portions on the predetermined plane. Meanwhile, the second adhesive solid material and the third adhesive solid material will also be the same, and thus a detailed description thereof will be omitted.

[0060] Meanwhile, when creating each of the four pipe fitting joints, if a powder material is used as a solid material, some of the powder material that is not bonded by the adhesive can support the second adhesive layer in the S20 process to be described later, and if a film or sheet-shaped material is used as the solid material, processing can be performed so that a structure capable of supporting the second adhesive layer is formed during processing. Therefore, a separate first auxiliary adhesive layer for supporting the second adhesive layer may not be created while having the same height as each of the four first adhesive layers, but this is not limited thereto.

[0061] Next, after moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from a predetermined stimulus source, a solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then a second adhesive solid material is generated using a predetermined adhesive supplied from a predetermined stimulus source, or the second adhesive solid material generated by using a predetermined adhesive supplied from a predetermined stimulus source to the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and laminated, thereby generating a second adhesive layer as much as the second height, but in a portion connected to each of the four 1_1 internal spaces of each of the four pipe fitting joints, four 1_2 internal spaces (each 1_2 internal length and each 1_2 internal width of each of the four 1_2 internal spaces is smaller than each of the first length and each of the first width) are formed in which the second adhesive layer is not generated as much as the 1_2 internal height among the second heights, and a specific internal side surface of the surfaces of the second adhesive layer surrounding each of the four 1_2 internal spaces Each of the four gas pipes is formed as four second internal spaces, each having a second internal length and a second internal width, and each having a second internal height (the second internal height is smaller than the first_second internal height) of the second height, in a direction away from each of the four pipe fitting joints, and each of the four gas pipes is formed, and each of the four first hollow portions is defined from each of the central positions spaced a predetermined distance apart from each of the four pipe fitting joints at each of the two ends of each of the four gas pipes, so that the second adhesive layer is formed (S20).

[0062] That is, in order to generate a second adhesive layer on top of each of the four first adhesive layers in a state where each of the four first adhesive layers is generated, the computing device (400) first provides a solid material and then, in the case of generating an adhesive solid material using an adhesive, moves each of the four first adhesive layers away from the predetermined stimulus source by a length corresponding to the first height so that the distance from the predetermined stimulus source for supplying the adhesive to the provided adhesive solid material is constant, or in the case of providing an adhesive solid material generated using an adhesive on the solid material, moves each of the four first adhesive layers away from the predetermined stimulus source by a length corresponding to the first height so that the distance from the predetermined stimulus source for supplying the adhesive to the provided adhesive solid material is constant, and then provides a powder-type solid material by stacking it on top of each of the four first adhesive layers, and then supports spraying ink supplied from the predetermined stimulus source onto the powder-type solid material by a second height according to the shape of the second adhesive layer to generate the second adhesive solid material, thereby generating the second adhesive layer, or in the case of each of the four first adhesive layers generated previously, using a heating roller to make the adhesive coated on each of the four first adhesive solid materials into a molten state, and then using the adhesive supplied from the predetermined stimulus source on a solid material in the form of a film or sheet. A second adhesive solid material can be created through a coating process, laminated on top of each of the four first adhesive layers, and processed using a knife or laser, etc., to create a second adhesive layer.

[0063] Finally, by moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from a predetermined stimulus source, and then providing a solid material on top of the second adhesive layer, and then using a predetermined adhesive supplied from the predetermined stimulus source to generate a third adhesive solid material, or by providing a third adhesive solid material generated by using a predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and stacking them, a third adhesive layer is generated by forming a third height, and by forming four pucker joint structures, each of which is formed from a central position defined on each of the four first hollow portions, by the third height, on top of each of the four first hollow portions (S30).

[0064] That is, in order to create a third adhesive layer on top of the second adhesive layer in a state where the second adhesive layer is created, the computing device (400) first provides a solid material and then, when creating an adhesive solid material using an adhesive, moves each of the four first adhesive layers and the second adhesive layer in a direction away from the predetermined stimulus source by a length corresponding to the second height so that the distance from the predetermined stimulus source for supplying the adhesive to the solid material is constant, or when creating an adhesive solid material using an adhesive on the solid material, moves the third adhesive layer on top of the second adhesive layer in a manner identical / similar to the stacking method in the S20 process so that the purging plate is manufactured.

[0065] In the above, it has been described that the four pipe fitting joints, the second adhesive layer, and the four puffin joint structures are sequentially created by sequentially performing the S10 to S30 processes. However, those skilled in the art may apply this to manufacture the purging plate by performing the S30, S20, and S10 processes in reverse order, thereby sequentially creating the four puffin joint structures, one second adhesive layer, and the four pipe fitting joints. It should be construed that manufacturing in this reverse order is also included in the scope of the present invention. However, in the case of manufacturing in the reverse order, the first auxiliary adhesive layer may not be necessary, but after the formation of the third adhesive layer, a third auxiliary adhesive layer may be additionally necessary to support the second adhesive layer to be subsequently formed. However, for the same reason as described above in the S10 process, the third auxiliary adhesive layer may not be necessary.

[0066] The process of manufacturing a purging plate including each of four pipe fitting joints, one second adhesive layer, and four pudding joint structures will be described in more detail with reference to FIGS. 4a to 6c.

[0067] FIGS. 4A through 4D schematically illustrate a process for creating each of four pipe fitting joints as each of four first adhesive layers according to one embodiment of the present invention.

[0068] Referring to FIG. 4a, a state in which each of four pipe fitting joints (1100) is created as each of four first adhesive layers is illustrated, and each of the four pipe fitting joints (1100) is formed by providing a solid material to each of four portions on a predetermined plane with a first length (L1), a first width (W1), and a first height (H1), and then using an adhesive supplied from a predetermined stimulus source to create a first adhesive solid material, or by using an adhesive supplied from a predetermined stimulus source to the solid material, and then providing the first adhesive solid material to each of the four portions on the predetermined plane, and can be used as a structure for supplying nitrogen gas into the inside of the hopper through each of the predetermined through-holes (1121, 1123) formed in each of the four pipe fitting joints (1100) or for allowing exhaust gas exhausted from the hopper to be discharged to the outside through each of the predetermined through-holes (1121, 1123). The detailed manufacturing process of each of the four pipe fitting joints (1100) will be described with reference to FIGS. 4b to 4d.

[0069] First, referring to FIG. 4B, each of (a) to (c) of FIG. 4B supports the computing device (400) described in FIG. 2 to generate a first adhesive solid material by using an adhesive supplied from a predetermined stimulus source after providing a solid material to each of four portions on a predetermined plane within the manufacturing device, or to provide the first adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the solid material to each of four portions on a predetermined plane within the manufacturing device, so that each of the first length (L1) and each of the first width (W1) is a first height (H1) that is a part of the first height (H1) illustrated in FIG. 4A. 1_1) is illustrated in cross-section by creating each of the four 1_1 adhesive layers (1110) by stacking the first adhesive solid material. At this time, since each of the four 1_1 adhesive layers (1110) confirmed in (a) of FIG. 4b has the same shape, (b) of FIG. 4b and (c) of FIG. 4b are representative illustrations of one of the four 1_1 adhesive layers (1110) for convenience, and are illustrated in an enlarged manner while maintaining the ratio of the first length (L1) and the first width (W1) in (a) of FIG. 4b in order to clearly explain the detailed structure of each of the four 1_1 adhesive layers (1110). For reference, (a) of FIG. 4b illustrates a shape when each of the four 1_1 adhesive layers (1110) is viewed from above vertically, (b) of FIG. 4b illustrates a shape when viewed in the B direction from the AA' cross-section in (a) of FIG. 4b, and (c) of FIG. 4b illustrates a shape when viewed in the A' direction from the BB' cross-section in (a) of FIG. 4b.

[0070] Next, referring to FIG. 4c, each of (a) to (c) of FIG. 4c shows that, in a state where each of the four 1_1 adhesive layers (1110) is created, the computing device (400) moves away from a predetermined stimulus source at a 1_1 height (H) so that the conditions for stacking the adhesive solid material are constant. 1_1 ) is moved by a length corresponding to the first height (H1) of each of the four first_1 adhesive layers (1110), and then a solid material is provided on the upper portion of each of the four first_1 adhesive layers (1110), and then the first_2 adhesive solid material is generated using an adhesive supplied from a predetermined stimulus source, or the first_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source is provided on the upper portion of each of the four first_1 adhesive layers (1110), so that the first_2 height (H1), which is another part of the first height (H1) shown in FIG. 4a, is provided on the upper portion of each of the four first_1 adhesive layers (1110). 1_2) is illustrated in cross-section by forming each of the four 1_2 adhesive layers (1120) by laminating the 1_2 adhesive solid material. For example, if each of the four 1_1 adhesive layers (1110) is formed by laminating vertically upward, the computing device (400) forms each of the four 1_1 adhesive layers (1110) by laminating vertically downward at the 1_1 height (H 1_1 ) can be supported to move as much as that. At this time, since each of the four 1_2 adhesive layers (1120) confirmed in (a) of FIG. 4c has the same shape, (b) of FIG. 4c and (c) of FIG. 4c are representative illustrations of one of the four 1_2 adhesive layers (1120) for convenience, and are illustrated in an enlarged manner while maintaining the ratio of the first length (L1) and the first width (W1) in (a) of FIG. 4c in order to clearly explain the detailed structure of each of the four 1_2 adhesive layers (1120). For reference, (a) of FIG. 4c illustrates a shape when looking at each of the four 1st_2nd adhesive layers (1120) from vertically upward, (b) of FIG. 4c illustrates a shape when looking in the B direction from the AA' cross-section in (a) of FIG. 4c, and (c) of FIG. 4c illustrates a shape when looking in the A' direction from the BB' cross-section in (a) of FIG. 4c.

[0071] Specifically, the computing device (400) provides a solid material on top of each of the four 1_1 adhesive layers (1110) and then supports generating a 1_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides the 1_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of each of the four 1_1 adhesive layers (1110), thereby providing a 1_2 height (H 1_2 ) so that each of the four 1st_2 adhesive layers (1120) is created, the 1st width (W1) of each of the four 1st_2 adhesive layers (1120) is the 1st width (W 1_1) Each structure corresponding to each of the four first through holes (1121) in the width direction is formed, and among the first widths (W1), the first_2 width (W 1_2 ) Each of the structures corresponding to each of the four 1_1 internal spaces (spaces including each of the four 1_1_a partial internal spaces (1122) and each of the four 1_1_b partial internal spaces (1132) illustrated in FIG. 4d) forms each of the four 1_1_a partial internal spaces (1122), and each of the 1_3 widths (W1) among the first widths (W1) 1_3 ) can support the formation of four second through holes (1123) in the width direction, respectively. Therefore, it can be used as a structure that allows a pipe fitting to be coupled through at least a part of each of the four first through holes (1121) in the width direction and each of the second through holes (1123) in the width direction. For reference, in FIG. 4c, each of the four through holes in the width direction is illustrated as being created only on two surfaces of each of the four 1_2 adhesive layers (1120), but one or three or more may be formed, and in addition to the side surfaces, the 1_1 height (H) may be formed in a direction toward the ground through the lower surface. 1_1 ) may be formed to have a thickness of . However, in the case where each of the four through holes in the width direction is formed through the lower surface, the computing device (400) in FIG. 4b may support the formation of each of the four through holes in the width direction while performing the process of creating each of the four 1_1 adhesive layers (1110).

[0072] And, referring to FIG. 4d, each of (a) to (c) of FIG. 4d is a state in which each of four 1_1 adhesive layers (1110) and each of four 1_2 adhesive layers (1120) are created, and the computing device (400) is moved away from a predetermined stimulus source at a 1_2 height (H) so that the conditions for stacking the adhesive solid material are constant. 1_2) by moving each of the four 1_1 adhesive layers (1110) and each of the four 1_2 adhesive layers (1120) by a length corresponding to the first height (H1), and then providing a solid material on top of each of the four 1_2 adhesive layers (1120) and then supporting the generation of the 1_3 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or supporting the generation of the 1_3 adhesive solid material using an adhesive supplied from a predetermined stimulus source on the solid material on top of each of the four 1_2 adhesive layers (1120) so that another part of the first height (H1) is provided on top of each of the four 1_2 adhesive layers (1120) 1_3 ) is illustrated in cross-section by creating each of the four 1_3 adhesive layers (1130) by stacking the 1_3 adhesive solid material. For example, if each of the four 1_1 adhesive layers (1110) and each of the four 1_2 adhesive layers (1120) are formed by stacking vertically upward, the computing device (400) is formed by stacking each of the four 1_1 adhesive layers (1110) and each of the four 1_2 adhesive layers (1120) vertically downward at the 1_2 height (H 1_2) can be supported to move as much as that. At this time, since each of the four 1_3 adhesive layers (1130) confirmed in (a) of FIG. 4d has the same shape, (b) of FIG. 4d and (c) of FIG. 4d are representative illustrations of one of the four 1_3 adhesive layers (1130) for convenience, and are illustrated in an enlarged manner while maintaining the ratio of the first length (L1) and the first width (W1) in (a) of FIG. 4d in order to clearly explain the detailed structure of each of the four 1_3 adhesive layers (1130). For reference, (a) of FIG. 4d illustrates a shape when looking at each of the four 1_3 adhesive layers (1130) from vertically upward, (b) of FIG. 4d illustrates a shape when looking in the B direction from the AA' cross-section in (a) of FIG. 4d, and (c) of FIG. 4d illustrates a shape when looking in the A' direction from the BB' cross-section in (a) of FIG. 4c.

[0073] Specifically, the computing device (400) provides a solid material on top of each of the four first_2 adhesive layers (1120) and then generates a first_3 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides the first_3 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of each of the four first_2 adhesive layers (1120) to generate a first_3 height (H 1_3 ) so that each of the four 1_3 adhesive layers (1130) is created, the first width (W1) of each of the four 1_3 adhesive layers (1130) is the first width (W1) of each of the four 1_3 adhesive layers (1130) 1_2 ) Each corresponding structure can support forming each of the four 1_1_b part internal spaces (1132) among the four 1_1 internal spaces (1102).

[0074] So, when the four 1st_1 adhesive layers (1110) each, the four 1st_2 adhesive layers (1120) each, and the four 1st_3 adhesive layers (1130) each are sequentially laminated, each of the four pipe fitting joints (1100) is created as each of the four 1st adhesive layers including each of the four 1st adhesive layers (1110) each to each of the four 1st adhesive layers (1130), and the 1st internal height (H) among the first heights (H1) is formed inside each of the four pipe fitting joints (1100). 1_1_in ) each of the four first adhesive layers (1100) may not be formed, so that four 1_1_a internal spaces (1122) and four 1_1_b internal spaces (1132) having an open upper surface at the first height (H1) may be formed. At this time, each of the 1_1 internal lengths of each of the four 1_1 internal spaces (1102) may be smaller than each of the first lengths (L1) (i.e., the length excluding each of the outer wall thicknesses of each of the four pipe fitting joints (1100) among the first lengths (L1), and each of the 1_1 internal widths of each of the four 1_1 internal spaces (1102) may be smaller than each of the first widths (W1) (i.e., the 1_2 width (W 1_2 ) applies).

[0075] In this way, when each of the four pipe fitting joints (1100) is created, the computing device (400) may support the creation of a second adhesive solid material by providing a solid material to the upper portion of each of the four pipe fitting joints (1100) and then using an adhesive supplied from a predetermined stimulus source, or by providing the second adhesive solid material generated by using an adhesive supplied from a predetermined stimulus source to the solid material to the upper portion of each of the four pipe fitting joints (1100), thereby creating a second adhesive layer, as described with reference to FIGS. 5A to 5D.

[0076] FIGS. 5A through 5D schematically illustrate a process for creating a second adhesive layer on top of each of four first adhesive layers according to one embodiment of the present invention.

[0077] Referring to FIG. 5a, a state is illustrated in which a second adhesive layer (1200) is created by providing a solid material to a second height (H2) above the first height (H1) of each of four pipe fitting joints (1100) as each of four first adhesive layers, and then using an adhesive supplied from a predetermined stimulus source to create a second adhesive solid material, or by using an adhesive supplied from a predetermined stimulus source to the solid material to create a second adhesive solid material, and then providing a second height (H2) above the first height (H1) of each of four pipe fitting joints (1100). At this time, the second adhesive layer (1200) can be used as a structure that supports nitrogen gas introduced through at least a portion of each of the predetermined through-holes (1121, 1123) formed in each of the four pipe fitting joints (1100) to be introduced into the hopper through at least a portion of each of the four gas pipes (not shown), which are passages formed inside the second adhesive layer (1200), and at least a portion of the four first hollow portions (1203_1) formed at the second height (H2), or supports exhaust gas exhausted from the hopper to be introduced through at least a portion of each of the four first hollow portions (1203_1), pass through at least a portion of each of the four gas pipes (not shown), and be discharged to the outside (i.e., the purging devices (310 to 340) illustrated in FIG. 1) through at least a portion of each of the predetermined through-holes (1121) formed in each of the four pipe fitting joints (1100). The detailed manufacturing process of the second adhesive layer (1200) will be described with reference to FIGS. 5b to 5d.

[0078] First, referring to FIG. 5B, each of (a) to (c) of FIG. 5B supports the computing device (400) described in FIG. 2 to move each of the four pipe fitting joints (1100) (i.e., each of the four 1_1 adhesive layers (1110), each of the four 1_2 adhesive layers (1120), and each of the four 1_3 adhesive layers (1130)) by a length corresponding to the first height (H1) in a direction away from a predetermined stimulus source so that the conditions for stacking the adhesive solid material in a state where each of the four pipe fitting joints (1100) as each of the four first adhesive layers is constantly maintained, and then the solid material is provided on top of each of the four pipe fitting joints (1100) and then the second_1 adhesive solid material is generated using the adhesive supplied from the predetermined stimulus source, or the second_1 adhesive solid material generated using the adhesive supplied from the predetermined stimulus source is applied to each of the four pipe fitting joints (1100). To support providing the upper part, the 2nd_1 height (H) is stacked on the upper part corresponding to the first height (H1) of each of the four pipe fitting joints (1100). 2_1 ) is a cross-sectional view illustrating a state in which a second_1 adhesive layer (1210) is created by laminating the second_1 adhesive solid material.

[0079] At this time, the 2nd_1 adhesive layer (1210) confirmed in (a) of Fig. 5b is in the shape of a single plate, but as confirmed in (b) and (c) of Fig. 5b, respectively, the 2nd_1 length (L) is formed in the direction away from each of the 4 pipe fitting joints (1100) on top of each of the 4 pipe fitting joints (1100). 2_1 ) respectively and the 2nd_1 width (W 2_1 ) each having the second_1 height (H 2_1) can be considered to be connected in a single plate shape as a result of laminating the second_1 adhesive solid material, so (b) and (c) of FIG. 5b are representative illustrations of a part of the second_1 adhesive layer (1210) adjacent to one of the four pipe fitting joints (1100) for convenience, and the second_1 length (L) in (a) of FIG. 5b is illustrated to clearly explain the detailed structure of the second_1 adhesive layer (1210). 2_1 ) and the 2nd_1 width (W 2_1 ) is enlarged and illustrated while maintaining the ratio. For reference, (a) of FIG. 5b illustrates a shape when looking at the second_1 adhesive layer (1210) from vertically upwards, (b) of FIG. 5b illustrates a shape when looking in the B direction from the AA' cross-section in (a) of FIG. 5b, and (c) of FIG. 5b illustrates a shape when looking in the A' direction from the BB' cross-section in (a) of FIG. 5b.

[0080] Specifically, the computing device (400) provides a solid material to the upper portion corresponding to the first height (H1) of each of the four pipe fitting joints (1100) and then supports generating a second_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or supports generating a second_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source to the solid material to the upper portion of each of the four pipe fitting joints (1100) so as to generate a second_1 adhesive solid material corresponding to the first height (H1) of each of the four pipe fitting joints (1100). 2_1 ) so that each of the second_1 adhesive layers (1210) is created, the first width (W1) at each of the upper portions corresponding to the first height (H1) of each of the four pipe fitting joints (1100) is the first_2 width (W 1_2) Each of the structures corresponding to each of the four 1_2_a internal spaces (including each of the 1_2_a partial internal spaces (1212) and each of the 1_2_b partial internal spaces (1222) to be described later in FIG. 5c) forms each of the four 1_2_a partial internal spaces (1212), and from each of the specific internal side surfaces (1211) of the side surfaces of the 2_1 adhesive layer (1210) surrounding each of the four 1_2_a partial internal spaces (1212)), in a direction away from each of the four pipe fitting joints (1100), a 2_1 length (L) 2_1 ) respectively and the 2nd_1 width (W 2_1 ) each has a second_1 height (H 2_1 ) can be supported to generate the second_1 adhesive layer (1210). At this time, each of the four 1_2 internal spaces is spatially connected to each of the four 1_1 internal spaces (1102), and each space includes each of the four 1_2_a partial internal spaces (1212) and each of the four 1_2_b partial internal spaces (1222) to be described later in FIG. 5c, and the 2_1 length (L 2_1 ) respectively and the 2nd_1 width (W 2_1 ) may be larger than each of the second internal lengths and each of the second internal widths, which will be described later in FIG. 5c. Here, each of the second internal lengths and each of the second internal widths may mean the length and width of each of the gas pipes as each of the second internal spaces through which nitrogen gas or exhaust gas can pass. In addition, when considering a case where nitrogen gas is introduced from the outside into at least a portion of each of the four first through holes (1121) and each of the four second through holes (1123), the nitrogen gas sequentially passes through each of the four 1_1 internal spaces (1102) and each of the four 1_2_a partial internal spaces (1212) to move to each of the gas pipes, and therefore each of the second internal widths may be larger than each of the first_2 widths (W 1_2 ) are formed smaller than each other, and the 2nd_1 length (L2_1 ) if each is less than the second internal length, then the second_1 length (L 2_1 ) each and the second internal length, a predetermined opening is formed vertically downward on the second_1 adhesive layer (1210) so that nitrogen gas can leak out through the predetermined opening, and therefore, to prevent this, the second_1 length (L 2_1 ) may be such that each of them is greater than each of the second internal lengths.

[0081] Next, referring to FIG. 5c, each of (a) to (c) of FIG. 5c shows that, in a state where the 2_1 adhesive layer (1210) is created, the computing device (400) moves in a direction away from a predetermined stimulus source at a 2_1 height (H) so that the conditions for stacking the adhesive solid material are kept constant. 2_1 ) and the 2nd_1 adhesive layer (1210) are moved by a length corresponding to the 4 pipe fitting joints (1100), and then a solid material is provided on the upper side of the 2nd_1 adhesive layer (1210), and then the 2nd_2 adhesive solid material is generated using an adhesive supplied from a predetermined stimulus source, or the 2nd_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material is provided on the upper side of the 2nd_1 adhesive layer (1210), so that the 2nd_2 height (H) is provided on the upper side of the 2nd_1 adhesive layer (1210). 2_2 ) is a cross-sectional view illustrating a state in which a second_2 adhesive layer (1220) is created by stacking the second_2 adhesive solid material. For example, if each of the four pipe fitting joints (1100) and the second_1 adhesive layer (1210) are formed by stacking vertically upward, the computing device (400) is formed by stacking each of the four pipe fitting joints (1100) and the second_1 adhesive layer (1210) vertically downward at the second_1 height (H 2_1 ) can be supported to move as much as possible. For reference, in order to clearly explain the detailed structure of the second_2 adhesive layer (1220), the second_2 length (L) in (a) of Fig. 5c2_2 ), 2nd_2nd width (W 2_2 ), second internal length (L 2_in ) and the second inner width (W 2_in ) are enlarged and illustrated while maintaining each ratio, and (a) of FIG. 5c illustrates a shape when looking at the second_2 adhesive layer (1220) from vertically upwards, (b) of FIG. 5c illustrates a shape when looking at the B direction from the AA' cross-section in (a) of FIG. 5c, and (c) of FIG. 5c illustrates a shape when looking at the A' direction from the BB' cross-section in (a) of FIG. 5c.

[0082] Specifically, the computing device (400) provides a solid material on top of the second_1 adhesive layer (1210) and then supports generating a second_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides a second_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of the second_1 adhesive layer (1210), thereby providing a second_2 height (H 2_2 ) so that the second_2 adhesive layer (1220) is created, the second_1 height (H 2_1 ) in the first and second widths (W) 1_2 ) Each of the corresponding structures forms each of the four 1_2_b part internal spaces (1222) among the four 1_2 internal spaces (1202), and from each of the specific internal side surfaces (1221) of the side surfaces of the 2_2 adhesive layer (1220) surrounding each of the four 1_2 internal spaces (1202), in a direction away from each of the four pipe fitting joints (1100), a second internal length (L) 2_in ) respectively and the second inner width (W 2_in) each of which is a second internal space having four gas pipes (1223), and each of which is a first hollow portion (1223_1) defined from each of the central positions (X) spaced a predetermined distance from each of the four pipe fitting joints (1100) at each of the two ends of each of the four gas pipes (1223), while each of which is a second hollow portion (1223_1) defined from each of the central positions (X) spaced a predetermined distance from each of the four pipe fitting joints (1100) at each of the two ends of each of the four gas pipes (1223), and having a second length (L 2_2 ) respectively, the 2nd_2 width (W 2_2 ) respectively and the 2nd_2 height (H 2_2 ) can be formed to have a second_2 adhesive layer (1220). For reference, since (b) of Fig. 5c is a cross-sectional view, each of the four 1_1 hollow portions (1223_1) defined from each of the center positions (X) is not depicted in a hollow form. Therefore, for convenience, the area near each of the center positions (X) is separately enlarged and depicted. When the enlarged area is confirmed, the second internal length (L 2_in ) Each of the four pipe fitting joints (1100) has a semicircle between each of the central positions (X) spaced a predetermined distance from each of the ends corresponding to the circumference of each of the four pipe fitting joints (1100), so it can be seen that each of the four 1_1 hollow parts (1223_1) is hollow.

[0083] At this time, each of the four 1st_2 internal spaces (1202) means a space including each of the four 1st_2_a internal subspaces (1212) and each of the four 1st_2_b internal subspaces (1222), and each of the 1st_2 internal lengths and each of the 1st_2 internal widths of each of the four 1st_2 internal spaces (1202) may be smaller than each of the first lengths (L1) and each of the first widths (W1). For example, each of the 1st_2 internal lengths corresponds to a length excluding each of the outer wall thicknesses of each of the four pipe fitting joints (1100) among the first lengths (L1), and each of the 1st_2 internal widths corresponds to a length of the 1st_2 width (W1). 1_2 ) may correspond to the 1st_2nd internal height (H 1_2_in ) is the 2nd_1 height (H2_1 ) and the 2nd_2 height (H 2_2 ) may correspond to the sum of the two. In addition, each of the four gas pipes (1223) that support the movement of at least a portion of the nitrogen gas and exhaust gas as the second internal space that is empty because the second_2 adhesive solid material is not laminated among the second_2 adhesive layers (1220) has a second internal length (L 2_in ) respectively and the second inner width (W 2_in ) each has a second internal height (H 2_in ) is formed, and the second internal length (L) 2_in ) each has the second_1 length (L 2_1 ) may be equal to or less than each other, and the second internal width (W 2_in ) each has a width of 1_2 (W 1_2 ) is smaller than the second internal height (H 2_in ) is the 2nd_2 height (H 2_2 ) may correspond to the second internal length (L). However, 2_in ) Each may have a different length to fit each nozzle insertion position according to the specifications of the hose, but is not limited thereto.

[0084] In addition, so that each of the four gas pipes (1223) among the second_2 adhesive layers (1220) can be formed, the computing device (400) can support the formation of the second_2 adhesive solid material by using an adhesive supplied from a predetermined stimulus source after providing a solid material on the upper side of the second_1 adhesive layer (1210), or can support the formation of the second_2 adhesive solid material by using an adhesive supplied from a predetermined stimulus source on the solid material on the upper side of the second_1 adhesive layer (1210), so that each of the four gas pipes (1223) can be stacked as high as the second_2 height while having the second_2 length and the second_2 width on both sides. The second_2 length (L) 2_2 ) each has a second internal length (L 2_in ) may be equal to or longer than each other, and the 2nd_2 width (W 2_2 ) each has a 2_1 width (W2_1 ) of the second inner width (W) 2_in ) may also mean each half of the width portion excluding each other. For reference, in (a) of Fig. 5c, the second_2 length (L 2_2 ) each has a second internal length (L 2_in ) are shown longer than each other, which means that even if the 2nd_2 adhesive layer (1220) is one layer, if the 2nd_2 adhesive layer (1220) is divided into four parts based on the parts corresponding to each of the four pipe fitting joints (1100), the 2nd_2 length (L) 2_2 ) It can be seen that each corresponds to half of the outer line parallel to the AA' cross-section of the entire outer periphery of (a) of Fig. 5c, but it is not limited thereto, and it can be drawn by considering the outer wall to be formed on the outer periphery of each of the four 1_1 hollow portions (1223_1) defined from each of the central positions (X) as having a predetermined thickness.

[0085] And, referring to FIG. 5d, each of (a) to (c) of FIG. 5d shows that, in a state where up to the 2nd_2 adhesive layer (1220) is created, the computing device (400) moves away from a predetermined stimulus source at a 2nd_2 height (H) so that the conditions for stacking the adhesive solid material are maintained constant. 2_2 ) by moving each of the four pipe fitting joints (1100), the second_1 adhesive layer (1210) and the second_2 adhesive layer (1220) by a length corresponding to the second_2 adhesive layer (1220), and then providing a solid material on the upper side of the second_2 adhesive layer (1220) and then supporting the generation of the second_3 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or providing the second_3 adhesive solid material generated using the adhesive supplied from a predetermined stimulus source to the solid material on the upper side of the second_2 adhesive layer (1220) so that the second_3 height (H) is provided on the upper side of the second_2 adhesive layer (1220) 2_3) is illustrated in cross-section by forming the second_3 adhesive layer (1230) by laminating the second_3 adhesive solid material. For example, if each of the four pipe fitting joints (1100) is formed by laminating the second_1 adhesive layer (1210) and the second_2 adhesive layer (1220) vertically upward, the computing device (400) is formed by laminating the second_1 adhesive layer (1210) and the second_2 adhesive layer (1220) vertically downward by the second_2 height (H) of each of the four pipe fitting joints (1100) formed. 2_2 ) can be supported to move as much as possible. For reference, in order to clearly explain the detailed structure of the 2_3 adhesive layer (1230), the 2_3 length (L) in (a) of Fig. 5d 2_3 ) and the 2nd_3rd width (W 2_3 ) is enlarged and illustrated while maintaining the ratio, and (a) of FIG. 5d illustrates a shape when looking at the 2nd_3 adhesive layer (1230) from vertically upwards, (b) of FIG. 5d illustrates a shape when looking in the B direction from the AA' cross-section in (a) of FIG. 5c, and (c) of FIG. 5d illustrates a shape when looking in the A' direction from the BB' cross-section in (a) of FIG. 5d.

[0086] Specifically, the computing device (400) provides a solid material on top of the second_2 adhesive layer (1220) and then supports generating a second_3 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides a second_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of the second_2 adhesive layer (1220), thereby providing a second_3 height (H 2_3 ) so that the 2nd_3 adhesive layer (1230) is created, while forming each of the four 1st_2 hollow portions (1233_1) defined from each of the central positions (X) spaced a predetermined distance from each of the four pipe fitting joints (1100) distal from each of the two ends of each of the four gas pipes (1223), and the 2nd_3 length (L2_3 ) respectively, the 2nd_3rd width (W 2_3 ) respectively and the 2nd_3 height (H 2_3 ) can be supported to generate a second_3 adhesive layer (1230). That is, each of the four first_1 hollow portions (1223_1) and each of the four first_2 hollow portions (1233_1) may be formed such that each of the four first_1 hollow portions (1223_1) and each of the four first_2 hollow portions (1233_1) are defined from each of the same four center positions (X) and are connected to each other, and the sizes of each of the four first_1 hollow portions (1223_1) and each of the four first_2 hollow portions (1233_1) may be the same. This will be clearly understood by referring to a drawing that enlarges a nearby area including each of the center positions (X).

[0087] In this way, when the manufacturing of each of the four pipe fitting joints (1100) and the second adhesive layer (1200) is completed, nitrogen gas is introduced through at least a part of each of the predetermined through-holes (1121, 1123) of each of the four pipe fitting joints (1100) and moves to each of the four gas pipes (1223), which are the four second internal spaces, and is introduced into the hopper by passing through each of the four 1_1 hollow portions (1223_1) located at the ends of each of the four gas pipes (1223) and each of the four 1_2 hollow portions (1233_1) connected to each of the four 1_1 hollow portions (1223_1), or the exhaust gas exhausted from the hopper is introduced into each of the four 1_2 hollow portions (1233_1) and then into each of the four 1_1 hollow portions (1233_1) connected to each of the four 1_2 hollow portions (1233_1). It may also be possible to support the discharge to the outside by sequentially allowing at least a portion of each of the predetermined through-holes (1121, 1123) of each of the hollow portions (1223_1), each of the four gas pipes (1223), and each of the four pipe fitting joints (1100) to pass through. However, since it is difficult for each of the four 1st_2 hollow portions (1123_1) to be stably adhered to the lower surface of the hopper, it is necessary to additionally create a third adhesive layer including each of the four gas nozzles that adhere to the lower surface of the hopper, more precisely, on the upper portion of the 2nd_3 adhesive layer (1230), so as to support the nitrogen gas and exhaust gas from leaking. A specific process for creating the third adhesive layer will be described later with reference to FIGS. 6A to 6C.

[0088] Meanwhile, referring back to FIG. 5A, the computing device (400) may be formed so that three guide pin insertion portions (1204) are additionally formed in each of three portions where guide pins for mounting are inserted on the mounting surface of any one of the load port, STB, OHB, and Stocker, and each portion has the same size as the guide pin and a length corresponding to the second height (H2), thereby creating a second adhesive layer (1200).

[0089] In addition, the computing device (400) can support the formation of the second adhesive layer (1200) while additionally forming a corresponding opening pattern (1205) matching a specific pattern formed on the mounting surface of any one of the load port, STB, OHB, and Stocker, with a length corresponding to the second height (H2). That is, since the plurality of types of openings formed in the portion excluding each of the four first hollow portions (1203_1) and each of the three guide pin insertion portions (1204) formed on the upper portion of the second adhesive layer (1200) are formed differently according to the specifications of each of the load port, STB, OHB, and Stocker, the corresponding opening pattern (1205) can be formed on the second adhesive layer (1200) to match a specific pattern, thereby enabling easy mounting on the mounting surface of any one of the load port, STB, OHB, and Stocker.

[0090] FIGS. 6A to 6C schematically illustrate a process for creating a third adhesive layer on top of a second adhesive layer according to one embodiment of the present invention.

[0091] Referring to FIG. 6a, a state is illustrated in which a purging plate (1000) including four pipe fitting joints (1100), a second adhesive layer (1200), and four pudding joint structures (1300) are manufactured by creating each of four pudding joint structures (1300) as a third adhesive layer on top of the second adhesive layer (1200), and each of the four pudding joint structures (1300) is created by providing a solid material to the upper portion of each of the four first hollow portions (1203_1) described in FIG. 5a by a third height (H3) and then using an adhesive supplied from a predetermined stimulus source to create a third adhesive solid material, or by creating a third adhesive solid material using an adhesive supplied from a predetermined stimulus source on the solid material and then providing the third adhesive solid material to the upper portion of each of the four first hollow portions (1203_1) by a third height (H3), and the center position (i.e., the four first hollow portions (1203_1) Since each of the four second hollow portions (1301) based on the same central position as each other is formed, each of the four gas nozzles (1300) can be used as a structure for facilitating the movement of nitrogen gas and exhaust gas while being directly connected to the lower surface of the hood. The detailed manufacturing process of each of the four gas nozzles (1300) will be described with reference to FIGS. 6b and 6c.

[0092] First, referring to FIG. 6B, each of (a) to (c) of FIG. 6B supports the computing device (400) to move each of the four pipe fitting joints (1100) and the second adhesive layer (1200) by a length corresponding to the second height (H2) in a direction away from a predetermined stimulus source so that the conditions for stacking the adhesive solid material in a state where the second adhesive layer (1200) is formed are constantly maintained, and then the solid material is provided on top of the second adhesive layer (1200) and then the third_1 adhesive solid material is generated using the adhesive supplied from the predetermined stimulus source, or the third_1 adhesive solid material generated using the adhesive supplied from the predetermined stimulus source to the solid material is provided on top of the second adhesive layer (1200), so that the third_1 height (H) is provided on each of the upper portions corresponding to the second height (H2) of the second adhesive layer (1200). 3_1 ) is illustrated in cross-section, whereby each of the four 1st_1 pucker bonding detailed structures (1310) is created as a 3rd_1 adhesive layer by bonding the 3rd_1 adhesive solid material. For reference, in order to clearly explain the detailed structure of each of the four 1st_1 pucker bonding detailed structures (1310), the ratio of the length and width for the second adhesive layer (1200) illustrated in (b) and (c) of FIG. 5d above and the 3rd_1 radius (r) in (a) of FIG. 6b are illustrated. 3_1 ) is enlarged and illustrated while maintaining the ratio, and (a) of FIG. 6b illustrates the shape of each of the four 1_1 pu joint detailed structures (1310) viewed from the vertical upward direction, (b) of FIG. 6b illustrates the shape viewed in the B direction from the AA' cross-section in (a) of FIG. 6b, and (c) of FIG. 6b illustrates the shape viewed in the A' direction from the BB' cross-section in (a) of FIG. 6b.

[0093] Specifically, the computing device (400) provides a solid material on top of the second adhesive layer (1200) and then supports generating a third_1 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides a third_1 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of the second adhesive layer (1200), thereby providing a third_1 height (H 3_1 ) so that each of the four 1st_1 pucker bonding details (1310) as the 3rd_1 adhesive layer is created, each of the four 2nd_1 hollow parts (1311) defined from the center position (X) on the upper side of each of the four 1st hollow parts (1203_1) is formed at the 3rd_1 height (H 3_1 ) are formed, and the third_1 radius (r) from each of the central positions (X) 3_1 ) each (3rd_1 radius (r) 3_1 ) each part has a third_1 height (H) corresponding to the outside of each of the four second_1 hollow parts (1311) 3_1 ) can be formed. Accordingly, each of the four 1st_1 pucker joint detail structures (1310) can be formed such that each of the four 2nd_1 hollow portions (1311) defined from each of the center positions (X) is formed on the upper side of each of the four 1st hollow portions (1203_1). Therefore, in (c) of FIG. 6b, for convenience, the illustration of each of the four pipe fitting joint portions (1100) as each of the four first adhesive layers illustrated in (c) of each of FIGS. 4b to 4d and (c) of each of FIGS. 5b to 5d is omitted.

[0094] Next, referring to FIG. 6c, each of (a) to (c) of FIG. 6c is such that the conditions for stacking the adhesive solid material in a state where the computing device (400) is formed up to each of the four 1_1 pucker bonding detail structures (1310) as the 3_1 adhesive layer are maintained constant, so that the 3_1 height (H) in the direction away from the predetermined stimulus source 3_1) by moving each of the four pipe fitting joints (1100), the second adhesive layer (1200) and the four 1_1 pu joint detail structures (1310) by a length corresponding to the 3_1 height (H) of each of the four 1_1 pu joint detail structures (1310), and then providing a solid material on the upper portion of each of the four 1_1 pu joint detail structures (1310) and then supporting the generation of the 3_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or providing the 3_2 adhesive solid material generated using the adhesive supplied from a predetermined stimulus source to the solid material on the upper portion of each of the four 1_1 pu joint detail structures (1310) so that the 3_1 height (H) of each of the four 1_1 pu joint detail structures (1310) 3_1 ) for each of the upper 3_2 heights (H 3_2 ) is illustrated in cross-section, whereby each of the four 1st_2 bonding detailed structures (1320) as the 3rd_2 bonding layer is created by stacking the 3rd_2 bonding solid material. For reference, in order to clearly explain the detailed structure of each of the four 1st_2 bonding detailed structures (1320), the 3rd_1 radius (r) illustrated in (a) of FIG. 6b is illustrated. 3_1 ) and the third_2 radius (r) in (a) of Fig. 6c 3_2 ) is enlarged and illustrated while maintaining the ratio, and (a) of FIG. 6c is a cross-section looking down on each of the four 1st_2nd fulcrum joint detail structures (1320) from the vertical upward direction, (b) of FIG. 6c is a cross-section looking in the B direction from the AA' cross-section in (a) of FIG. 6c, and (c) of FIG. 6c is a cross-section looking in the A' direction from the BB' cross-section in (a) of FIG. 6c.

[0095] Specifically, the computing device (400) provides a solid material on top of each of the four 1_1 pudding detailed bonding structures (1310) and then supports generating a 3_2 adhesive solid material using an adhesive supplied from a predetermined stimulus source, or provides the 3_2 adhesive solid material generated using an adhesive supplied from a predetermined stimulus source to the solid material on top of each of the four 1_1 pudding detailed bonding structures (1310), thereby providing a 3_2 height (H 3_2 ) so that each of the four 1st_2 pudding bonding detailed structures (1320) as the 3rd_2 adhesive layer is created, each of the four 2nd_2 hollow portions (1321) defined from the center position (X) on the upper side of each of the four 1st_1 pudding bonding detailed structures (1310) is formed at the 3rd_2 height (H 3_2 ) are formed, and the 3_2 radius (r) from each of the central positions (X) 3_2 ) each (3rd_2nd radius (r) 3_1 ) each is the 3rd_1 radius (r 3_1 ) are smaller than each other, and the third_2 radius (r 3_2 ) each part has a third_2 height (H) corresponding to the outside of each of the four second_2 hollow parts (1321) 3_2 ) can be formed. Accordingly, in each of the four 1st_2 pucker joint detail structures (1320), four 2nd_2 hollow portions (1321) each defined from each of the center positions (X) can be formed on the upper side of each of the four 2nd_1 hollow portions (1311). At this time, the sizes of each of the four 2nd_2 hollow portions (1321) and each of the four 2nd_1 hollow portions (1311) can be formed to be the same. Therefore, as in FIG. 6b, in (c) of FIG. 6c, for convenience, the illustration of each of the four pipe fitting joints (1100) as each of the four first adhesive layers illustrated in (c) of each of FIGS. 4b to 4d and (c) of each of FIGS. 5b to 5d is omitted.

[0096] In this way, when each of the four 1st_2nd pu joint detailed structures (1320) as the 3rd_2 adhesive layer is created, each of the four 1st_1 pu joint detailed structures (1310) and each of the four 1st_2 pu joint detailed structures (1320) are combined, thereby creating each of the four pu joint structures (1300) in which each of the four second hollow portions (1301) defined from each of the central positions (X) on the upper side of each of the four first hollow portions (1203_1) is formed as much as the third height (H3), and each of the four pu joint structures (1300) can be used as each of the four gas nozzles (1300) described above in FIG. 6a. In addition, the center positions (X) of each of the four first hollow parts (1203_1) and each of the four second hollow parts (1301) are the same, and the size of each of the four second hollow parts (1301) can be formed to be smaller than the size of each of the four first hollow parts (1203_1).

[0097] Meanwhile, even if the purging plate (1000) is manufactured through the process of FIGS. 4a to 6c, if there is a portion where the adhesive solid material is laminated with low rigidity due to various variables and / or if an auxiliary adhesive layer is additionally formed due to a structural problem, it must be removed through a post-processing process.

[0098] Specifically, the post-treatment process may be performed through at least some of the following processes: (i) a process of sanding the surfaces of each of the four pipe fitting joints (1100), the second adhesive layer (1200), and each of the four pu joint structures (1300) as the third adhesive layer, (ii) a process of cleaning each of the four pipe fitting joints (1100), the second adhesive layer (1200), and each of the four pu joint structures (1300) that have been surface-treated using a cleaning solution and then blowing air to dry each of the four pipe fitting joints (1100), the second adhesive layer (1200), and each of the four pu joint structures (1300), and (iii) a process of performing subsequent curing on each of the four first pipe fitting joints (1100), the second adhesive layer (1200), and each of the four pu joint structures (1300) using at least some of a predetermined curing agent, an additional light source, and hot air. For reference, the post-processing process may be supported to be performed by the computing device (400) illustrated in FIG. 2, but it may also be a part that is performed manually by a worker.

[0099] An example of a purging plate (1000) completed in this manner will be described with reference to FIG. 7.

[0100] FIG. 7 illustrates an example of a completed purging plate in which each of four first pipe fitting joints, one second adhesive layer, and four pucker joint structures is created according to one embodiment of the present invention.

[0101] FIG. 7 (a) illustrates an example of the shape of the first purging plate (1000) as seen from above, and FIG. 7 (b) illustrates an example of the shape of the second purging plate (1000') as seen from above. Referring to FIG. 6a, it can be understood that in FIG. 7 (a), each of the four pipe fitting joints (1100) is not visible because it is covered by the second adhesive layer (1200), and in FIG. 7 (b), it can be confirmed that each of the four pipe fitting joints (1100) is formed at the lower end of the outer region of the second adhesive layer (1200), and each of the pipe fittings (2100) is connected to each of the four pipe fitting joints (1100). However, each of the pipe fittings (2100) is not formed by the manufacturing process of the present invention, but is manually joined by a worker after the first purging plate (1000) or the second purging plate (1000') is completed.

[0102] And, since each of the four pipe fitting joints (1100) is located outside of the mounting surface of one of the load port, STB, OHB, and Stocker when the purging plate (1000) is actually mounted on the mounting surface of one of the load port, STB, OHB, and Stocker, each of the four pipe fitting joints (1100) may be created at various locations other than the P1 location shown in (a) of FIG. 7 or the P2 location shown in (b) of FIG. 7. For reference, since the second purging plate (1000') is an example in which the four pipe fitting joints (1100) are formed outside the boundary line of the second adhesive layer (1200), the P2 location may also be formed outside the boundary line of the second adhesive layer (1200) (not shown).

[0103] Additionally, at least some of the four gas nozzles (1300) may be manually attached by an operator to the lower surface of the hood, to prevent exposure to nitrogen gas or exhaust gas.

[0104] Meanwhile, it can be confirmed that in (a) of FIG. 7, a first corresponding pattern (1205_1) matching a first pattern on the mounting surface of one of the load port, STB, OHB, and Stocker to be mounted is formed, and in (b) of FIG. 7, a second corresponding pattern (1205_2) matching a second pattern on the mounting surface of one of the other load port, STB, OHB, and Stocker to be mounted is formed.

[0105] In addition, the embodiments of the present invention described above may be implemented in the form of program commands that can be executed through various computer components and recorded on a computer-readable recording medium. The computer-readable recording medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the computer-readable recording medium may be those specially designed and configured for the present invention or may be those known and available to those skilled in the art of computer software. Examples of the computer-readable recording medium include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical recording media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of the program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc. The hardware devices may be configured to operate as one or more software modules to perform the processing according to the present invention, and vice versa.

[0106] Although the present invention has been described above with specific details such as specific components and limited examples and drawings, these are provided only to help a more general understanding of the present invention, and the present invention is not limited to the above examples, and those with ordinary knowledge in the technical field to which the present invention pertains can make various modifications and variations from this description.

[0107] Therefore, the idea of ​​the present invention should not be limited to the embodiments described above, and all things that are modified equally or equivalently to the following claims as well as the claims are considered to fall within the scope of the idea of ​​the present invention.

Claims

1. A method for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a FOUP, (a) a step of providing a solid material to each of four portions on a predetermined plane and then generating a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of four portions on the predetermined plane, so that four pipe fitting joints are generated as four first adhesive layers each having a first length and a first width, respectively, and as much as a first height, but forming four 1_1 internal spaces in which each of the four first adhesive layers is not generated as much as the 1_1 internal height of the first height, wherein each of the 1_1 internal lengths and each of the 1_1 internal widths of each of the four 1_1 internal spaces is smaller than each of the first lengths and each of the first widths, and forming each of the predetermined through holes on each of at least some surfaces except each of the upper surfaces located at an upper portion corresponding to the first height, so that each of the four pipe fitting joints is generated; (b) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and laminated, thereby generating a second adhesive layer as much as the second height, but in a portion connected to each of the four 1_1 internal spaces of each of the four pipe fitting joints, four 1_2 internal spaces in which the second adhesive layer is not generated by the 1_2 internal height among the second heights are formed, each of which has a 1_2 internal length and a 1_2 internal width of each of the four 1_2 internal spaces smaller than each of the first lengths and each of the first widths, and A step of forming four gas pipes each as four second internal spaces, each having a second internal length and a second internal width, and each having a second internal height among the second heights, in a direction away from each of the four pipe fitting joints, each of the faces of the second adhesive layer surrounding each of the four first_2 internal spaces, and in which the second adhesive layer is not formed by a second internal height, the second internal height being smaller than the 1_2 internal height, while forming four first hollow portions each defined from a central position spaced a predetermined distance apart from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, thereby causing the second adhesive layer to be formed; and (c) a step of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to create a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby creating a third adhesive layer by a third height, while forming each of the four pucker joint structures in which each of the four second hollow portions defined from each of the central positions is formed on the upper side of each of the four first hollow portions by the third height, and thereby creating the third adhesive layer; A manufacturing method comprising:

2. In paragraph 1, In step (a) above, (i) a process of providing the solid material to each of the four portions on the predetermined plane and then generating a first_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or providing the first_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, thereby generating four first_1 adhesive layers each having the first length and the first width and the first height as much as the first_1 height among the first heights; (ii) After moving each of the four 1_1 adhesive layers by a length corresponding to the 1_1 height in a direction away from the predetermined stimulus source, the solid material is provided on top of each of the four 1_1 adhesive layers, and then the 1_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 1_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source on the solid material is provided on top of each of the four 1_1 adhesive layers to be laminated, thereby generating four 1_2 adhesive layers by the 1_2 height among the first heights, and forming four first through holes in the width direction in the structure corresponding to each 1_1 width among the first widths of each of the four 1_2 adhesive layers, and forming four 1_1_a portion internal spaces among the four 1_1 internal spaces in the structure corresponding to each 1_2 width among the first widths, and forming the first width A process in which each of the four second through holes in the width direction is formed in the structure corresponding to each of the first and third widths, and each of the four first and second adhesive layers is created;And (iii) a manufacturing method characterized in that it performs a process of moving each of the four 1_1 adhesive layers and each of the four 1_2 adhesive layers by a length corresponding to the 1_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of each of the four 1_2 adhesive layers and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 1_3 adhesive solid material, or providing the 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of each of the four 1_2 adhesive layers and stacking them, thereby generating each of the four 1_3 adhesive layers by the 1_3 height among the first heights, while forming each of the four 1_1_b portion internal spaces among the four 1_1 internal spaces in a structure corresponding to each of the 1_2 widths, thereby generating each of the four 1_3 adhesive layers.

3. In paragraph 1, In step (b) above, (i) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then the 2_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source is provided to each upper portion of each of the four pipe fitting joints to laminate, thereby generating a 2_1 adhesive layer as much as the 2_1 height among the second heights, and in the structure corresponding to each of the 1_2 widths among the first widths at each upper portion corresponding to the first height of each of the four pipe fitting joints, each of the four 1_2_a portion internal spaces among the four 1_2 internal spaces is formed, and from each of the specific internal side surfaces of the 2_1 adhesive layer surrounding each of the four 1_2 internal spaces, A process for forming a second_1 adhesive layer having a second_1 length and a second_1 width, each of which is greater than each of the second internal lengths and each of the second internal widths, in a direction away from each of the four pipe fitting joints, such that the second_1 adhesive layer is formed as large as the second_1 height;(ii) After moving each of the four pipe fitting joints and the 2_1 adhesive layer by a length corresponding to the 2_1 height in a direction away from the predetermined stimulus source, the solid material is provided on the upper portion of the 2_1 adhesive layer, and then the 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper portion of the 2_1 adhesive layer to laminate, thereby generating the 2_2 adhesive layer as much as the 2_2 height among the 2_2 heights - the 2_2 height corresponds to the second internal height -, and in the structure corresponding to each of the 1_2 widths at the 2_1 height, each of the four 1_2_b portion internal spaces among the four 1_2 internal spaces is formed, and each of the four pipes is connected from each of the specific internal side surfaces of the 2_2 adhesive layer surrounding each of the four 1_2 internal spaces. A process for forming each of the four gas pipes, each of the four second internal spaces, in a direction away from each of the fitting joints, each of the four second internal spaces having each of the second internal lengths and each of the second internal widths, and forming each of the four first_1 hollow portions defined from each of the central positions spaced apart by a predetermined distance from each of the four pipe fitting joints at each of the two ends of each of the four gas pipes, while generating each of the second_2 adhesive layers having each of the second_2 lengths, each of the second_2 widths, and each of the second_2 heights;And (iii) a process of moving each of the four pipe fitting joints, the 2_1 adhesive layer and the 2_2 adhesive layer by a length corresponding to the 2_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 2_2 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to create a 2_3 adhesive solid material, or providing the 2_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 2_2 adhesive layer and laminating it, thereby creating a 2_3 adhesive layer as much as the 2_3 height among the 2 heights, while forming each of the four 1_2 hollow portions defined from each of the central positions spaced apart by the predetermined distance from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, and creating the 2_3 adhesive layer having each of the 2_3 lengths, each of the 2_3 widths and the 2_3 height; A manufacturing method characterized by:

4. In paragraph 1, In step (c) above, (i) a process of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby generating a third_1 adhesive layer as much as the 3_1 height among the third heights, while forming each of four 1_1 pucker joint detail structures, each of which is formed from each of the four 2_1 hollow portions defined from the central positions on the upper side of each of the four first hollow portions, as much as the 3_1 height, while generating the 3_1 adhesive layer; And (ii) a process of moving each of the four pipe fitting joints, the second adhesive layer and the 3_1 adhesive layer by a length corresponding to the 3_1 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 3_1 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 3_2 adhesive solid material, or providing the 3_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 3_1 adhesive layer and laminating it, thereby generating the 3_2 adhesive layer by the 3_2 height among the 3 heights, while forming each of the four 1_2 pu joint detailed structures, each of which has four 2_2 hollow portions defined from each of the central positions on the upper side of each of the four 1_1 pu joint detailed structures, by the 3_2 height, while generating the 3_2 adhesive layer.

5. In paragraph 4, In the above (i) process, The 3_1 adhesive layer is formed while forming the 4 1_1 t-joint detailed structures having the 3_1 height, each having a 3_1 radius from each of the central positions on the upper side of the 2nd adhesive layer, a part of each of the 3_1 radii corresponding to the outside of each of the 4 2_1 hollow portions, and each of the 4 1_1 t-joint detailed structures having the 3_1 height, each of the 4 2_1 hollow portions defined from each of the central positions being formed on the upper side of each of the 4 1_1 hollow portions, In the above (ii) process, A manufacturing method characterized in that the 3_2 adhesive layer is formed while forming the four 1_2 pu joint detailed structures having the 3_2 height, each having a 3_2 radius from each of the central positions on the upper side of the 3_1 adhesive layer, each of the 3_2 radii being smaller than each of the 3_1 radii, and a portion of each of the 3_2 radii corresponding to the outside of each of the four 2_2 hollow portions, and each of the four 1_2 pu joint detailed structures having the 3_2 height, each of the four 2_2 hollow portions defined from each of the central positions being formed on the upper side of each of the four 2_1 hollow portions.

6. In paragraph 4, In step (c) above, A manufacturing method characterized in that the size of each of the four 2_1 hollow portions is formed to be smaller than the size of each of the four 1_1 hollow portions, the size of each of the four 2_1 hollow portions and the size of each of the four 2_2 hollow portions are formed to be the same, and each of the four gas nozzles, which are each of the four 1_1 puppet joint detailed structures and each of the four 1_2 puppet joint detailed structures, is formed as the third adhesive layer.

7. In paragraph 1, (d) a step of performing at least a part of a process of (i) surface-treating the surfaces of each of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer by sanding, (ii) cleaning each of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer that have been surface-treated using a cleaning solution and then blowing air to dry each of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer, and (iii) performing subsequent curing of each of the four pipe fitting joints, the second adhesive layer, and the third adhesive layer using at least a part of a predetermined curing agent, an additional light source, and hot air; A manufacturing method characterized by further including:

8. In paragraph 1, In step (b) above, A manufacturing method characterized in that the second adhesive layer is created by additionally forming three guide pin insertion portions each having the same size as the guide pin and a length corresponding to the second height in each of the three portions where the guide pin for fixing the hole is inserted.

9. In paragraph 1, In step (b) above, A manufacturing method characterized in that the second adhesive layer is formed while additionally forming a corresponding opening pattern matching a specific pattern formed on the mounting surface of any one of a load port, a side track buffer (STB), an overhead buffer (OHB), and a stocker, with a length corresponding to the second height.

10. In paragraph 1, In step (a) above, A manufacturing method characterized in that each of the four pipe fitting joints is formed as a structure for connecting each of the predetermined through holes formed in each of the four pipe fitting joints to each of the external pipes for introducing nitrogen gas into the interior of the hopper or for exhausting exhaust gas from the hopper, and each of the four pipe fitting joints is formed.

11. In a computing device for manufacturing a purging plate that supports supplying nitrogen gas into the interior of a FOUP, At least one memory for storing instructions; and At least one processor configured to execute the above instructions, A process in which the processor (I) provides a solid material to each of four portions on a predetermined plane and then generates a first adhesive solid material using a predetermined adhesive supplied from a predetermined stimulus source, or provides the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, so that four pipe fitting joints are generated as four first adhesive layers each having a first length and a first width, respectively, and as much as a first height, but each of the four first adhesive layers is not generated as much as the 1_1 internal height of the first height, and each of the four 1_1 internal spaces, each of the 1_1 internal lengths and each of the 1_1 internal widths of each of the four 1_1 internal spaces, is smaller than each of the first lengths and each of the first widths, and each of the four pipe fitting joints is generated while forming each of the predetermined through holes on each of at least some surfaces except each of the upper surfaces located at an upper portion corresponding to the first height;(II) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then a second adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the second adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and laminated, thereby generating a second adhesive layer as much as the second height, but in a portion connected to each of the four 1_1 internal spaces of each of the four pipe fitting joints, four 1_2 internal spaces in which the second adhesive layer is not generated by the 1_2 internal height among the second heights - each of the 1_2 internal lengths and each of the 1_2 internal widths of each of the four 1_2 internal spaces is smaller than each of the first lengths and each of the first widths - are formed, A process for forming four gas pipes, each of which has a second internal length and a second internal width, and in a direction away from each of the four pipe fitting joints, each of which has a second internal height, wherein the second internal height is less than the 1_2 internal height, as four second internal spaces, each of which has a second internal length and a second internal width, and in which the second adhesive layer is not formed, while forming four first hollow portions, each of which is defined from a central position spaced a predetermined distance apart from each of the four pipe fitting joints, each of which is distal from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, so that the second adhesive layer is formed;And (III) a computing device that performs a process of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to create a third adhesive solid material, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby creating a third adhesive layer by a third height, while forming each of four pucker joint structures in which each of the four second hollow portions defined from each of the central positions is formed on each of the four first hollow portions by the third height, while creating the third adhesive layer.

12. In paragraph 11, The above processor, In the above (I) process, (i) a sub-process of providing the solid material to each of the four portions on the predetermined plane and then generating a first_1 adhesive solid material using the predetermined adhesive supplied from the predetermined stimulus source, or providing the first_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material to each of the four portions on the predetermined plane, thereby generating four first_1 adhesive layers each having the first length and the first width and the first height as much as the first_1 height among the first heights; (ii) After moving each of the four 1_1 adhesive layers by a length corresponding to the 1_1 height in a direction away from the predetermined stimulus source, the solid material is provided on top of each of the four 1_1 adhesive layers, and then the 1_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 1_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source on the solid material is provided on top of each of the four 1_1 adhesive layers to be laminated, thereby generating four 1_2 adhesive layers by the 1_2 height among the first heights, and forming four first through holes in the width direction in the structure corresponding to each 1_1 width among the first widths of each of the four 1_2 adhesive layers, and forming four 1_1_a portion internal spaces among the four 1_1 internal spaces in the structure corresponding to each 1_2 width among the first widths, and forming the first width A sub-process for forming four second through holes in the width direction in each structure corresponding to each of the first and third widths, while generating each of the four first and second adhesive layers;And (iii) a computing device characterized in that it performs a sub-process of moving each of the four 1_1 adhesive layers and each of the four 1_2 adhesive layers by a length corresponding to the 1_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of each of the four 1_2 adhesive layers and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 1_3 adhesive solid material, or providing the 1_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source on the solid material on top of each of the four 1_2 adhesive layers and stacking them, thereby generating each of the four 1_3 adhesive layers by the 1_3 height among the first heights, while forming each of the four 1_1_b portion internal spaces among the four 1_1 internal spaces in a structure corresponding to each of the 1_2 widths, thereby generating each of the four 1_3 adhesive layers.

13. In paragraph 11, The above processor, In the above (II) process, (i) After moving each of the four pipe fitting joints by a length corresponding to the first height in a direction away from the predetermined stimulus source, the solid material is provided to each upper portion corresponding to the first height of each of the four pipe fitting joints, and then the 2_1 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_1 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source is provided to each upper portion of each of the four pipe fitting joints to laminate, thereby generating a 2_1 adhesive layer as much as the 2_1 height among the second heights, and in the structure corresponding to each of the 1_2 widths among the first widths at each upper portion corresponding to the first height of each of the four pipe fitting joints, each of the four 1_2_a portion internal spaces among the four 1_2 internal spaces is formed, and from each of the specific internal side surfaces of the 2_1 adhesive layer surrounding each of the four 1_2 internal spaces, A sub-process for forming the second_1 adhesive layer having a second_1 length and a second_1 width, each of which is greater than the second inner length and the second inner width, in a direction away from each of the four pipe fitting joints, such that the second_1 adhesive layer is formed as much as the second_1 height;(ii) After moving each of the four pipe fitting joints and the 2_1 adhesive layer by a length corresponding to the 2_1 height in a direction away from the predetermined stimulus source, the solid material is provided on the upper portion of the 2_1 adhesive layer, and then the 2_2 adhesive solid material is generated using the predetermined adhesive supplied from the predetermined stimulus source, or the 2_2 adhesive solid material generated using the predetermined adhesive supplied from the predetermined stimulus source to the solid material is provided on the upper portion of the 2_1 adhesive layer to laminate, thereby generating the 2_2 adhesive layer as much as the 2_2 height among the 2_2 heights - the 2_2 height corresponds to the second internal height -, and in the structure corresponding to each of the 1_2 widths at the 2_1 height, each of the four 1_2_b portion internal spaces among the four 1_2 internal spaces is formed, and each of the four pipes is connected from each of the specific internal side surfaces of the 2_2 adhesive layer surrounding each of the four 1_2 internal spaces. A sub-process for forming each of the four gas pipes, each of the four second internal spaces, in a direction away from each of the fitting joints, each of the second internal lengths and each of the second internal widths, and forming each of the four 1_1 hollow portions defined from each of the central positions spaced apart from each of the four pipe fitting joints at each of the two ends of each of the four gas pipes by a predetermined distance, while generating each of the 2_2 adhesive layers having each of the 2_2 lengths, each of the 2_2 widths, and each of the 2_2 heights;And (iii) a sub-process of moving each of the four pipe fitting joints, the second_1 adhesive layer and the second_2 adhesive layer by a length corresponding to the second_2 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second_2 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a second_3 adhesive solid material, or providing the second_3 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second_2 adhesive layer and laminating it, thereby generating a second_3 adhesive layer by the second_3 height among the second heights, while forming each of the four first_2 hollow portions defined from each of the central positions spaced apart by the predetermined distance from each of the four pipe fitting joints among each of the two ends of each of the four gas pipes, and generating the second_3 adhesive layer having each of the second_3 lengths, each of the second_3 widths and the second_3 height; A computing device characterized by performing; 14. In paragraph 11, The above processor, In the above (III) process, (i) a sub-process of moving each of the four pipe fitting joints and the second adhesive layer by a length corresponding to the second height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the second adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a third_1 adhesive solid material, or providing the third_1 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the second adhesive layer and laminating it, thereby generating a third_1 adhesive layer as much as the 3_1 height among the third heights, while forming each of four 1_1 pucker joint detail structures, each of which is formed from each of the four 2_1 hollow portions defined from the respective central positions on the upper side of each of the four first hollow portions, as much as the 3_1 height, while generating the 3_1 adhesive layer; And (ii) a computing device characterized in that it performs a sub-process of moving each of the four pipe fitting joints, the second adhesive layer and the 3_1 adhesive layer by a length corresponding to the 3_1 height in a direction away from the predetermined stimulus source, and then providing the solid material on top of the 3_1 adhesive layer and then using the predetermined adhesive supplied from the predetermined stimulus source to generate a 3_2 adhesive solid material, or providing the 3_2 adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source to the solid material on top of the 3_1 adhesive layer and laminating it, thereby generating the 3_2 adhesive layer as much as the 3_2 height among the 3 heights, while forming each of the four 1_2 pu joint detailed structures, each of which has four 2_2 hollow portions defined from each of the central positions on the upper side of each of the four 1_1 pu joint detailed structures, by the 3_2 height, while generating the 3_2 adhesive layer.

15. In paragraph 14, The above processor, In the above (i) sub-process, The 3_1 adhesive layer is formed while forming the 4 1_1 t-joint detailed structures having the 3_1 height, each having a 3_1 radius from each of the central positions on the upper side of the 2nd adhesive layer, a part of each of the 3_1 radii corresponding to the outside of each of the 4 2_1 hollow portions, and each of the 4 1_1 t-joint detailed structures having the 3_1 height, each of the 4 2_1 hollow portions defined from each of the central positions being formed on the upper side of each of the 4 1_1 hollow portions, In the above sub (ii) process, A computing device characterized in that the 3_2 adhesive layer is formed while forming the four 1_2 pucker joint substructures each having a 3_2 radius from each of the central positions on the upper side of the 3_1 adhesive layer, each of the 3_2 radii being smaller than each of the 3_1 radii, and a portion of each of the 3_2 radii corresponding to the outside of each of the four 2_2 hollow portions, and each of the four 1_2 pucker joint substructures having the 3_2 height, each of the four 2_2 hollow portions defined from each of the central positions being formed on the upper side of each of the four 2_1 hollow portions.

16. In paragraph 14, The above processor, In the above (III) process, A computing device characterized in that the size of each of the four 2_1 hollow portions is formed to be smaller than the size of each of the four 1_1 hollow portions, the size of each of the four 2_1 hollow portions and the size of each of the four 2_2 hollow portions are formed to be the same, and the third adhesive layer forms each of the four gas nozzles, which are each of the four 1_1 pupp coupling detailed structures and each of the four 1_2 pupp coupling detailed structures.

17. In paragraph 11, The above processor, (IV) A computing device characterized in that it further performs at least a part of the following processes: (i) a sub-process of sanding the surface of each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, (ii) a sub-process of cleaning each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, which have been surface-treated using a cleaning solution, and then blowing air to dry each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer, and (iii) a sub-process of performing subsequent curing on each of the four pipe fitting joints, each of the second adhesive layer, and each of the third adhesive layer using at least a part of a predetermined curing agent, an additional light source, and hot air.

18. In paragraph 11, The above processor, In the above (II) process, A computing device characterized in that the second adhesive layer is created by additionally forming three guide pin insertion portions each having the same size as the guide pin and a length corresponding to the second height in each of the three portions where the guide pin for fixing the hole is inserted.

19. In paragraph 11, The above processor, In the above (II) process, A computing device characterized in that the second adhesive layer is formed while additionally forming a corresponding opening pattern matching a specific pattern formed on a mounting surface of any one of a load port, a side track buffer (STB), an overhead buffer (OHB), and a stocker, with a length corresponding to the second height.

20. In paragraph 11, The above processor, In the above (I) process, A computing device characterized in that each of the four pipe fitting joints is formed as a structure for connecting each of the predetermined through holes formed in each of the four pipe fitting joints to each of the external pipes for introducing nitrogen gas into the interior of the hopper or for exhausting exhaust gas from the hopper, and each of the four pipe fitting joints is formed.

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