Method and system for automated object handling in a cryogenic system or infrastructure
The automated object handling method in cryogenic systems optimizes scheduling through AI-driven data transformation, addressing inefficiencies and enhancing reliability and accuracy in cryogenic testing.
Patent Information
- Application Number
- PCT/EP2025/073824
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-22
- Filing Date
- 2025-08-21
- Publication Date
- 2026-02-26
AI Technical Summary
Cryogenic systems face inefficiencies due to extensive manual configuration, leading to increased human error, resource consumption, and reduced productivity and accuracy in testing procedures.
A computer-implemented method for automated object handling in cryogenic systems, involving obtaining object information, generating adapted scheduling data based on basic handling data to optimize cooling and operational processes, and utilizing AI for flexible adaptation.
Enhances efficiency, reduces downtime, minimizes energy consumption, and decreases human error, thereby improving the reliability and accuracy of cryogenic testing.
Smart Images

Figure EP2025073824_26022026_PF_FP_ABST
Abstract
Description
METHOD AND SYSTEM FOR AUTOMATED OBJECT HANDLING IN A CRYOGENIC SYSTEM OR INFRASTRUCTUREFIELD
[0001] Embodiments of the present disclosure relate to a computer-implemented method for automated object handling in a cryogenic system or infrastructure, a computer program including instructions for carrying out the method, a computer-readable storage medium including instructions for carrying out the method, a data processing system for automated object handling in a cryogenic system or infrastructure, and a cryogenic system or infrastructure including the data processing system. More particularly, the present disclosure relates to cryostat scheduling.BACKGROUND
[0002] Cryogenic systems are crucial for assessing the performance and durability of various electronic devices at extremely low temperatures. However, the efficiency and effectiveness of cryogenic testing are often compromised by the necessity for extensive manual configuration of numerous steps and processes. This manual intervention not only heightens the potential for human error but also consumes significant time and resources, ultimately affecting the overall productivity and accuracy of testing procedures.SUMMARY
[0003] In light of the above, a computer-implemented method for automated object handling in a cryogenic system or infrastructure, a computer program including instructions for carrying out the method, a computer-readable storage medium including instructions for carrying out the method, a data processing system for automated object handling in a cryogenic system or infrastructure, and a cryogenic system or infrastructure including the data processing system are provided.
[0004] It is an object of the present disclosure to operate a cryogenic system or infrastructure more efficiently. It is another object of the present disclosure to operate a cryogenic system or infrastructure more reliable. It is another object of the invention to improve accuracy of testing procedures for a cryogenic system or infrastructure.
[0005] The objects are solved by the features of the independent claims. Preferred embodiments are defined in the dependent claims.
[0006] According to an independent aspect of the present disclosure, a computer- implemented method for automated object handling in a cryogenic system or infrastructure is provided. The method includes: a) obtaining object information data, including object identity information, on two or more objects; b) obtaining, based on the object identity information, basic handling data indicative of a plurality of processes to be performed on each object of the two or more objects, wherein the plurality of processes include:• at least one cooling process of cooling the object to at least one cryogenic temperature, and• at least one operational process of testing and / or operating the object at the at least one cryogenic temperature; and c) generating, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the two or more objects.
[0007] Generating adapted scheduling data based on the basic handling data may refer to transforming raw or “undeveloped” data into more refined, “intelligent” data.
[0008] According to some embodiments, which can be combined with other embodiments described herein, the object identity information includes a unique identifier of the object. The unique identifier can be a distinct code or number assigned to the object to distinguish it from other objects. However, the present disclosure is not limited thereto, and the object identity information may include other information which allows to identify the object, such as a name, a location identifier, a tray label and the like.
[0009] According to some embodiments, which can be combined with other embodiments described herein, the object identity information can be provided in the formof readable means, such as a barcode, NFC device, QR code, label, and the like. In some embodiments, the object identity information can be obtained (e.g., read) using computer vision or image recognition techniques.
[0010] According to some embodiments, which can be combined with other embodiments described herein, the basic handling data includes an object type (e.g., diode, chip, etc.). For example, the object identity information may be linked to the object type in a way recognizable by the system. An “object type” refers to the category or classification of an object based on its characteristics, function and / or usage. The object type may serve as an indication of how the object should be handled, including, but not limited to, the specific tests to be performed, handling procedures, and the like.
[0011] Additionally, or alternately, the basic handling data includes other information related to the handling of the object, such as characterization requirements, types of measurements to be performed, temperature specifications, expected performance, interface details, required precision, and similar parameters. It should be understood that, in some embodiments, this information may also be derived from the object type.
[0012] According to some embodiments, which can be combined with other embodiments described herein, the two or more objects are electronic devices.
[0013] According to some embodiments, which can be combined with other embodiments described herein, the object(s), particularly the electronic device(s), is / are selected from the group including, or consisting of, an integrated circuit, a quantum chip, a wafer, a semiconductor device, a component of an integrated circuit, and a component of quantum chip. However, the present disclosure is not limited thereto, and the object(s) can be any object suitable for testing and / or operating at low temperatures, such as any conductive, semiconductive, superconductive, quantum dot based, electromechanical and / or electrooptical circuit. In particular, the object(s) can be any sub-component of an integrated circuit, such as a transistor, transformer, and the like.
[0014] According to some embodiments, which can be combined with other embodiments described herein, the at least one cryogenic temperature is in a range between 5mK to 0.5K, preferably in a range between 5mK to IK, preferably in a range between5mK to 4K, preferably in a range between 5mK to 10K, and more preferably in a range between 5mK to 100K.
[0015] According to some embodiments, which can be combined with other embodiments described herein, the at least one cooling process is exactly one cooling process. For example, the at least one operational process of testing and / or operating the object can be performed at a selected cryogenic temperature achieved by the single cooling process (e.g., from room temperature to a particular cryogenic temperature).
[0016] According to some embodiments, which can be combined with other embodiments described herein, the at least one cooling process is two or more cooling processes. For example, two or more different cryogenic temperatures can be sequentially established, allowing for one or more operational processes of testing and / or operating the object to be performed at each cryogenic temperature of the two or more different cryogenic temperatures.
[0017] According to some embodiments, which can be combined with other embodiments described herein, a number of the at least one cooling process is one, two, three, four, five or more. For example, a number of the at least one cooling process is in a range between 1 (or 2) and 20, preferably in a range between 1 (or 2) and 10, and more preferably in a range between 1 (or 2) and 5.
[0018] According to some embodiments, which can be combined with other embodiments described herein, the at least one cooling process includes, or is, a temperature ramp from a first cryogenic temperature to a second (lower) cryogenic temperature. For example, the one or more operational processes of testing and / or operating the object can be carried out during this temperature ramp.
[0019] According to some embodiments, which can be combined with other embodiments described herein, the at least one operational process of testing and / or operating the object is exactly one operational process. For example, the single operational process of testing and / or operating the object can be performed at a particular cryogenic temperature achieved by cooling process.
[0020] According to some embodiments, which can be combined with other embodiments described herein, the at least one operational process of testing and / or operating the object is two or more operational processes. For example, the two or more operational processes can be performed at the same cryogenic temperature, or the two or more operational processes can be performed at two or more different cryogenic temperatures and / or during a temperature ramp.
[0021] According to some embodiments, which can be combined with other embodiments described herein, a number of the at least one operational process of testing and / or operating the object is one, two, three, four, five or more. For example, a number of the at least one operational process of testing and / or operating the object is in a range between 1 (or 2) and 20, preferably in a range between 1 (or 2) and 10, and more preferably in a range between 1 (or 2) and 5.
[0022] According to some embodiments, which can be combined with other embodiments described herein, the at least one operational process of testing and / or operating the object is selected from the group including, or consisting of, I-V (currentvoltage) measurements, electrical resistance measurements, phase transition measurements or analysis, reciprocity measurements, magnetic susceptibility measurements, and spectroscopy measurements.
[0023] According to some embodiments, which can be combined with other embodiments described herein, the at least one cooling process and the at least one operational process of testing and / or operating the object are performed at least partially simultaneously. For example, the at least one operational process of testing and / or operating the object can be performed while the temperature is lowered, i.e., during a temperature ramp.
[0024] According to some embodiments, which can be combined with other embodiments described herein, the plurality of processes further include at least one heating process of heating the object, for example from a first cryogenic temperature to a second (higher) cryogenic temperature or even a temperature above (e.g., room temperature).
[0025] According to some embodiments, which can be combined with other embodiments described herein, the at least one heating process and the at least one operational process of testing and / or operating the object are performed at least partially simultaneously. For example, the at least one operational process of testing and / or operating the object can be performed while the temperature is raised, i.e., during a temperature ramp.
[0026] According to some embodiments, which can be combined with other embodiments described herein, the adapted scheduling data are configured to manage a timing and / or sequence of the plurality of processes.
[0027] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes adjusting or configuring the at least one cooling process based on the object identity information. For example, a cryogenic temperature, a starting point and an end point of a temperature ramp, a speed of a temperature ramp and the like can be set.
[0028] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes adjusting or configuring the at least one cooling process based on the at least one operational process. For example, the at least one cooling process can be adjusted or configured based on a type of the at least one operational process. The “type” of an operational process refers to the specific category or nature of the operational process conducted.
[0029] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes adjusting or configuring the at least one operational process based on the object identity information. For example, a type of the at least one operational process, operational parameters of the at least one operational process and the like can be set.
[0030] According to some embodiments, which can be combined with other embodiments described herein, the adapted scheduling data include operational data defining or configuring the plurality of processes.
[0031] According to some embodiments, which can be combined with other embodiments described herein, the operational data pertain to at least one of temperature control, cooldown time, testing and / or operating specifics, object insertion (e.g., into the cryostat), object removal (e.g., out of the cryostat), object transfer (e.g., to and / or from the cryostat), cryostat selection (e.g., which cryostat of a plurality of cryostats should be used for a particular object), and / or a type of the object.
[0032] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes determining a process time for the plurality of processes. In particular, the process time for the plurality of processes can be a total or combined process time of all processes.
[0033] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes optimizing the process time for the plurality of processes. For example, optimization may focus on reducing idle time (e.g., per week, during nighttime, or when no script is running) and / or minimizing human interaction time (e.g., per week, during nighttime, etc.).
[0034] According to some embodiments, which can be combined with other embodiments described herein, the adapted scheduling data are further generated based on an availability of individual cryostats and / or an availability of personnel.
[0035] According to some embodiments, which can be combined with other embodiments described herein, the adapted scheduling data are further generated based on an operational status of individual cryostats (e.g., an availability of individual cryostats, in particular a downtime, etc.) and / or time characteristics (e.g., an availability of individual cryostats, in particular a heat up time and / or cool down time, and / or an availability of personnel based on, for example, digital calendar data and / or time tracking devices).
[0036] According to some embodiments, which can be combined with other embodiments described herein, the one or more objects are a plurality of objects, and the adapted scheduling data are generated to subsequently test and / or operate the plurality of objects.
[0037] According to some embodiments, which can be combined with other embodiments described herein, the step of generating the adapted scheduling data includes determining, based on the handling data of each object, objects of the two or more objects which can undergo at least one process of the plurality of processes simultaneously.
[0038] According to some embodiments, which can be combined with other embodiments described herein, determining the objects which can undergo at least one process of the plurality of processes simultaneously is based on at least one of temperatures or temperature ranges for testing and / or operating the objects; thermalization times; and history data.
[0039] According to some embodiments, which can be combined with other embodiments described herein, the method further includes analyzing a result and / or performance of the plurality of processes performed on each object of the two or more objects; and using the result to generate subsequent adapted scheduling data for operating the cryogenic system or infrastructure to perform further processes of testing and / or operating at least one further object.
[0040] According to some embodiments, which can be combined with other embodiments described herein, using the result to generate subsequent adapted scheduling data involves artificial intelligence. The term “artificial intelligence” as used throughout the present application may be understood in the sense of software components or software instances which are designed to correctly interpret data, to learn from such data, and to use those learnings to provide a medical support function through flexible adaptation.
[0041] According to some embodiments, which can be combined with other embodiments described herein, the cryogenic infrastructure includes multiple cryogenic systems.
[0042] According to some embodiments, which can be combined with other embodiments described herein, the multiple cryogenic systems can be the same cryogenic systems or different cryogenic systems. For example, the cryogenic systems can be distinguished by a size of an object space, sample environments (e.g., magnetic fields), control stacks and / or test levels (e.g., waver, dies, package / device etc.).
[0043] According to some embodiments, which can be combined with other embodiments described herein, a cryogenic system includes a vacuum chamber and a cooling arrangement.
[0044] A vacuum is generally understood as a space essentially devoid of matter. The term “vacuum” as used throughout the present application is in particular understood as a technical vacuum, i.e., a region with a gaseous pressure much less than atmospheric pressure. The vacuum inside the vacuum chamber can be high vacuum, ultra-high vacuum or extremely high vacuum (XHV). One or more vacuum generation sources, such as turbo pumps and / or cryo pumps and / or ion-getter pumps, can be connected to the vacuum chamber to generate the vacuum.
[0045] According to some embodiments, which can be combined with other embodiments described herein, the cooling arrangement includes, or is, a cryogen-free system, such as a cryogen-free closed cycle system.
[0046] According to some embodiments, which can be combined with other embodiments described herein, the cooling arrangement includes, or is, a pulse tube cryocooler and / or an adiabatic demagnetization refrigerator and / or a Gifford-McMahon cryocooler and / or a Peltier cooler.
[0047] According to some embodiments, which can be combined with other embodiments described herein, the cryogenic system includes an object stage in the vacuum chamber. The cooling arrangement can be configured to cool the object stage and / or objects (e.g., electronic devices) attached to the object stage.
[0048] According to some embodiments, which can be combined with other embodiments described herein, the cooling arrangement can be configured to cool the object stage and / or the objects to a temperature in range between ImK and 300K, particularly in a range between ImK and 4K.
[0049] According to some embodiments, which can be combined with other embodiments described herein, the cooling arrangement can be configured to control a temperature of the object stage and / or the objects (e.g., electronic devices) attached to the object stage within a predetermined temperature range. The predetermined temperaturerange may be 5mK to 0.5K, particularly 5mK to IK, particularly 5mK to 4K, particularly 5mK to 10K, particularly 5mK to 100K, and more particularly 5mK (or 50mK or lOOmK or 300mK) to 300K (e.g., room temperature).
[0050] According to another independent aspect of the present disclosure, a computer- implemented method for automated object handling in a cryogenic system or infrastructure is provided. The method includes obtaining object information data, including object identity information, on one or more objects; obtaining, based on the object identity information, basic handling data indicative of a plurality of processes to be performed on each object of the one or more objects, wherein the plurality of processes include at least one cooling process of cooling the object to at least one cryogenic temperature and at least one operational process of testing and / or operating the object at least one cryogenic temperature; and generating, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the one or more objects.
[0051] According to another independent aspect of the present disclosure, a computer- implemented method for automated object handling in a cryogenic system or infrastructure is provided. The method includes obtaining object information data on one (or two) or more objects; obtaining, based on the object identity information, basic handling data indicative of a plurality of processes to be performed on each object of the one (or two) or more objects; and generating, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the one (or two) or more objects.
[0052] According to another independent aspect of the present disclosure, a computer program is provided. The computer program has instructions which, when the program is executed by a computer, cause the computer to carry out the method for automated object handling in a cryogenic system or infrastructure according to the embodiments described in this document.
[0053] According to another independent aspect of the present disclosure, a computer- readable storage medium is provided. The computer-readable storage medium has instructions which, when the program is executed by a computer, cause the computer tocarry out the method for automated object handling in a cryogenic system or infrastructure according to the embodiments described in this document.
[0054] According to some embodiments, which can be combined with other embodiments described herein, the computer-readable storage medium is a non-transitory computer-readable storage (or memory) medium.
[0055] According to another independent aspect of the present disclosure, a data processing system for automated object handling in a cryogenic system or infrastructure is provided. The data processing system includes one or more processors configured to obtain object information data, including object identity information, on two or more objects; obtain, based on the object identity information, handling data indicative of a plurality of processes to be performed on each object of the two or more objects, wherein the plurality of processes include at least one cooling process of cooling the object to at least one cryogenic temperature and at least one operational process of testing and / or operating the object at the at least one cryogenic temperature; and generate, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the two or more objects.
[0056] According to some embodiments, which can be combined with other embodiments described herein, the one or more processors of the data processing system are configured to perform the computer-implemented method for automated object handling in a cryogenic system or infrastructure according to the embodiments described in this document.
[0057] According to some embodiments, which can be combined with other embodiments described herein, the data processing system is implemented by a server, a laptop computer, a desktop computer.
[0058] According to some embodiments, which can be combined with other embodiments described herein, the data processing system is cloud-based.
[0059] According to some embodiments, which can be combined with other embodiments described herein, data of objects pertaining to different users or clients arenot mutually accessible. For example, the data can be encrypted and / or accessed via an API (Application Programming Interface).
[0060] According to another independent aspect of the present disclosure, a cryogenic system or infrastructure is provided. The cryogenic system or infrastructure includes the data processing system for automated object handling in a cryogenic system or infrastructure according to the embodiments described in this document.
[0061] Embodiments are also directed at systems for carrying out the disclosed methods and include system aspects for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the invention are also directed at methods for operating the described system. It includes method aspects for carrying out every function of the system.BRIEF DESCRIPTION OF THE DRAWINGS
[0062] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:FIG. 1 shows a flow chart of a computer-implemented method for automated object handling in a cryogenic system or infrastructure according to embodiments described herein; andFIG. 2 illustrates an automated object handling in a cryogenic system or infrastructure according to embodiments described herein.DETAILED DESCRIPTION OF EMBODIMENTS
[0063] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to samecomponents. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.
[0064] This document includes references to “one embodiment” or “an embodiment”. The appearances of the phrases “in one embodiment” or “in an embodiment” do not necessarily refer to the same embodiment. Particular features, structures, or characteristics may be combined in any suitable manner consistent with this disclosure.
[0065] The terms “comprising” and “including” open-ended. As used in the appended claims, these terms do not foreclose additional structure or steps.
[0066] Various units, circuits, or other components may be described or claimed as “configured to” perform a task or tasks. In such contexts, “configured to” is used to connote structure by indicating that the units / circuits / components include structure (e.g., circuitry) that performs those task or tasks during operation. As such, the unit / circuit / component can be said to be configured to perform the task even when the specified unit / circuit / component is not currently operational (e.g., is not on). The units / circuits / components used with the “configured to” language include hardware, for example, circuits, memory storing program instructions executable to implement the operation, etc. Additionally, “configured to” can include generic structure (e.g., generic circuitry) that is manipulated by software and / or firmware (e.g., an FPGA or a general- purpose processor executing software) to operate in a manner that is capable of performing the task(s) at issue.
[0067] As used herein, the terms “first”, “second”, etc. are used as labels for nouns that they precede, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.).
[0068] As used herein, the term “based on” is used to describe one or more factors that affect a determination. This term does not foreclose additional factors that may affect a determination. That is, a determination may be solely based on those factors or based, atleast in part, on those factors. Consider the phrase “determine A based on B.” While in this case, B is a factor that affects the determination of A, such a phrase does not foreclose the determination of A from also being based on C. In other instances, A may be determined based solely on B.
[0069] FIG. 1 shows a flow chart of a computer-implemented method 100 for automated object handling in a cryogenic system or infrastructure according to embodiments described herein. The method 100 can be conducted by means of computer programs, software, computer software products and the interrelated controllers, which can have a CPU (and / or GPU), a memory, a user interface, and input and output means being in communication with the corresponding components of a system.
[0070] The method 100 includes: a) block 110: obtaining object information data, including object identity information, on two or more objects; b) block 120: obtaining, based on the object identity information, basic handling data indicative of a plurality of processes to be performed on each object of the two or more objects, wherein the plurality of processes include:• at least one cooling process of cooling the object to at least one cryogenic temperature, and• at least one operational process of testing and / or operating the object at the at least one cryogenic temperature; and c) block 130: generating, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the two or more objects.
[0071] Accordingly, adapted scheduling data are generated based on the basic handling data by transforming the raw or “undeveloped” basic handling data into more refined, “intelligent” adapted scheduling data. This transformation process involves processing the basic handling data to produce scheduling information that can be used to manage the cryogenic system or infrastructure more effectively.
[0072] By utilizing this adapted scheduling data, the cryogenic system or cryogenic infrastructure can be operated more efficiently, resulting in several benefits. Firstly, downtime can be significantly reduced, ensuring that the cryogenic system or cryogenic infrastructure remains operational for longer periods. This reduction in downtime directly contributes to enhanced throughput, allowing for more processes to be completed within the same timeframe.
[0073] Moreover, by minimizing downtime and optimizing operational schedules, energy consumption can be substantially decreased. Efficient scheduling ensures that the infrastructure is only active when necessary, reducing wasted energy and lowering overall operational costs.
[0074] Additionally, the automation reduces the need for human input or interaction. Automated systems can handle the scheduling and operational adjustments without constant human oversight, leading to increased precision, reliability, and reduced labor costs. This automation not only streamlines operations but also minimizes the potential for human error, further enhancing the efficiency of the cryogenic system or cryogenic infrastructure.
[0075] FIG. 2 illustrates an automated object handling in a cryogenic system or infrastructure according to embodiments described herein.
[0076] Block 210 indicates an object (or multiple objects) on which a plurality of processes are to be performed. The object (or each object of the multiple objects) can be an electronic device, such as an integrated circuit, a quantum chip, a wafer, a semiconductor device, a component of an integrated circuit, and a component of quantum chip. However, the present disclosure is not limited thereto, and the object can be any object suitable for testing and / or operating at low temperatures, such as any conductive, semiconductive, superconductive, quantum dot based, electromechanical and / or electrooptical circuit. In particular, the object can be any sub-component of an integrated circuit, such as a transistor, transformer, and the like.
[0077] Each object (or a group of objects) is provided or associate with object identity information, such as a unique identifier, to distinguish the object (or group of objects) fromother objects (or other group of objects). The object identity information can be provided in the form of readable means, such as a barcode, NFC device, QR code, label, and the like. In some embodiments, the object identity information can be obtained (e.g., read) using computer vision or image recognition techniques.
[0078] Basic handling data BHD indicative of the plurality of processes to be performed on the object(s), such as at least one cooling process of cooling the object(s) to a cryogenic temperature and at least one operational process of testing and / or operating the object(s) at the cryogenic temperature, is derived from the object identity information.
[0079] In some embodiments, the basic handling data BHD can indicate an object type (e.g., diode, chip, etc.). For example, the object type can be linked to, or encoded in, the object identity information. The object type can indicate the specific processes to be performed on that type of object. For example, a particular type of diode may require an I- V measurement at a specific cryogenic temperature, which is predefined in the system. However, the present disclosure is not limited to the object type, and that the basic handling data BHD can include other information related to the handling of the object, such as characterization requirements, types of measurements to be performed, temperature specifications, expected performance, interface details, required precision, and similar parameters.
[0080] The basic handling data BHD is then input into a scheduler (block 220). Based thereon, the scheduler generates adapted scheduling data ASD for operating a cryogenic infrastructure (block 230) to perform the processes on the object(s). The adapted scheduling data ASD are generated by transforming the raw or “undeveloped” basic handling data BHD into more refined, “intelligent” adapted scheduling data ASD. For example, the basic handling data (e.g., the object type) can be used to derive a qualification routine, line mapping (such as the locations of contacts on the chip, including V+ and V-), and other relevant details.
[0081] In some embodiments, the adapted scheduling data ASD can include user instructions UI. The user instructions UI may include, but are not limited to, loading instructions for loading the object(s) into the cryogenic infrastructure (block 240). The user may be a technician, but the present disclosure is not limited thereto.
[0082] The adapted scheduling data ASD can include operational instructions 01 defining the plurality of processes, particularly the at least one cooling process of cooling the object to at least one cryogenic temperature and at least one operational process of testing and / or operating the object at the at least one cryogenic temperature.
[0083] For example, the operational instructions OI can include first operational instructions Oil for operating the cryogenic infrastructure. The first operational instructions Oil may include, but are not limited to, parameters such as a ramp rate, a base temperature, and a maximum temperature of a temperature ramp.
[0084] The operational instructions OI can also include second operational instructions OI2 for operating the object within the cryogenic infrastructure and / or measurement equipment (block 250). For example, the second operational instructions (OI2) can be provided to a lock-in amplifier (measurement settings, excitation frequency, etc.), a quantum controller, and similar devices.
[0085] The at least one cooling process is performed according to the first operational instructions Oil, and temperature monitoring data TMD collected during the at least one cooling process can be sent back to the scheduler (block 260). Similarly, the at least one operational process of testing and / or operating the object at the at least one cryogenic temperature is performed according to the second operational instructions OI2, and object measurement data OMD collected during the at least one operational process of testing and / or operating the object at the at least one cryogenic temperature can be sent back to the scheduler (block 260).
[0086] The scheduler may provide process data, such as a measurement result MR, to a customer, technician, developer or quality controller (block 270).
[0087] Optionally, the process data or other data related to the at least one cooling process of cooling the object to at least one cryogenic temperature and at least one operational process of testing and / or operating the object at the at least one cryogenic temperature may be used as feedback FB to generate subsequent adapted scheduling data for operating the cryogenic system or infrastructure to perform further processes of testing and / or operating at least one further object.
[0088] The methods described herein may be implemented in software, hardware, or a combination thereof, in different embodiments. In addition, the order of the blocks of the methods may be changed, and various elements may be added, reordered, combined, omitted, modified, etc. Various modifications and changes may be made as would be obvious to a person skilled in the art having the benefit of this disclosure. The various embodiments described herein are meant to be illustrative and not limiting. Many variations, modifications, additions, and improvements are possible. Accordingly, plural instances may be provided for components described herein as a single instance. Boundaries between various components, operations and data stores are somewhat arbitrary, and particular operations are illustrated in the context of specific illustrative configurations. Other allocations of functionality are envisioned and may fall within the scope of claims that follow. Finally, structures and functionality presented as discrete components in the example configurations may be implemented as a combined structure or component. These and other variations, modifications, additions, and improvements may fall within the scope of embodiments as defined in the claims that follow.
Claims
CLAIMS1. A computer-implemented method for automated object handling in a cryogenic system or infrastructure, comprising: obtaining object information data, including object identity information, on two or more objects; obtaining, based on the object identity information, basic handling data indicative of a plurality of processes to be performed on each object of the two or more objects, wherein the plurality of processes include at least one cooling process of cooling the object to at least one cryogenic temperature and at least one operational process of testing and / or operating the object at the at least one cryogenic temperature; and generating, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the two or more objects.
2. Computer-implemented method of claim 1, wherein the adapted scheduling data are configured to manage a timing and / or sequence of the plurality of processes.
3. Computer-implemented method of claim 1 or 2, wherein the step of generating the adapted scheduling data includes: adjusting or configuring the at least one cooling process based on the object identity information; and / or adjusting or configuring the at least one cooling process based on the at least one operational process, particularly a type of the at least one operational process; and / or adjusting or configuring the at least one operational process based on the object identity information.
4. Computer-implemented method of any one of claims 1 to 3, wherein the adapted scheduling data include operational data defining the plurality of processes, wherein the operational data pertain to at least one of temperature control, cooldown time, testing and / or operating specifics, object insertion, object removal, object transfer, cryostat selection and / or a type of the object.
5. Computer-implemented method of any one of claims 1 to 4, wherein the step of generating the adapted scheduling data includes: determining a process time for the plurality of processes, particularly optimizing the process time for the plurality of processes.
6. Computer-implemented method of any one of claims 1 to 5, wherein: the adapted scheduling data are further generated based on an operational status of individual cryostats and / or time characteristics; and / or the adapted scheduling data are generated to subsequently test and / or operate the two or more objects.
7. Computer-implemented method of any one of claims 1 to 6, wherein the step of generating the adapted scheduling data includes: determining, based on the handling data of each object, objects of the two or more objects which can undergo at least one process of the plurality of processes simultaneously, in particular wherein determining the objects which can undergo at least one process of the plurality of processes simultaneously is based on at least one of: temperatures or temperature ranges for testing and / or operating the objects; thermalization times; history data.
8. Computer-implemented method of any one of claims 1 to 7, further including: analyzing a result and / or performance of the plurality of processes performed on each object of the two or more objects; and using the result to generate subsequent adapted scheduling data for operating the cryogenic system or infrastructure to perform further processes of testing and / or operating at least one further object.
9. Computer-implemented method of any one of claims 1 to 8, wherein the cryogenic infrastructure includes multiple cryogenic systems.
10. A computer program comprising instructions which, when the program is executed by a computer, cause the computer to carry out the method of any one of claims 1 to 9.
11. A computer-readable storage medium comprising instructions which, when the program is executed by a computer, cause the computer to carry out the method of any one of claims 1 to 9.
12. A data processing system for automated object handling in a cryogenic system or infrastructure, comprising one or more processors configured to: obtain object information data, including object identity information, on two or more objects; obtain, based on the object identity information, handling data indicative of a plurality of processes to be performed on each object of the two or more objects, wherein the plurality of processes include at least one cooling process of cooling the object to a cryogenic temperature and at least one operational process of testing and / or operating the object at the cryogenic temperature; and generate, based on the basic handling data, adapted scheduling data for operating the cryogenic system or infrastructure to perform the plurality of processes for each object of the two or more objects.
13. Cryogenic system or infrastructure, comprising the data processing system of claim 12.
Citation Information
Patent Citations
Cryostorage unit, cryopreservation device and method for operating the same
EP2148565B1
Stem cell manufacturing system, stem cell information management system, cell transport apparatus, and stem cell frozen storage apparatus
US20190313633A1
Using thermalizing material in an enclosure for cooling quantum computing devices
US20210076530A1
Cryogenic Wafer Testing System
US20230014966A1