Chip and temperature control method therefor, electronic device, and computer storage medium

Abstract

Embodiments of the present application relate to the technical field of cockpit domain controllers, and provide a chip and a temperature control method therefor, an electronic device, and a computer storage medium, wherein a system on chip (SOC) comprises a first processor domain for acquiring temperature data, at least one second processor domain for performing temperature control on the basis of the temperature data, and a memory space. Upon acquiring temperature data of a region to be measured in the SOC, the first processor domain can write the temperature data into the memory space. Once the at least one second processor domain acquires the temperature data from the memory space, the at least one second processor domain can perform temperature control on a target hardware unit of the SOC on the basis of the temperature data. In the embodiments of the present application, each domain can acquire temperature data; thus, the domains can perform independent temperature control without interfering with one another, and work together to achieve temperature control of the chip.

Description

A chip and its temperature control method, electronic device and computer storage medium

[0001] This application claims priority to Chinese Patent Application No. 202411216834.6, filed on September 2, 2024, entitled "A chip and its temperature control method, electronic device and computer storage medium", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of vehicle infotainment technology, and more specifically, to a chip and its temperature control method, electronic device and computer storage medium. Background Technology

[0003] Currently, vehicle smart cockpit chips contain multiple independent CPU (Central Processing Unit) domains and PVT (Pyramid Vision Transformer) modules that handle voltage and temperature. In the vehicle infotainment system, it is necessary to monitor temperature changes in real time. When the temperature exceeds a certain threshold, specific strategies must be implemented to ensure the chip's temperature is controlled within a certain range, thereby guaranteeing the stable and high-performance operation of the vehicle infotainment system.

[0004] Since the PVT module only supports temperature detection for one CPU domain and cannot support temperature detection for multiple independent CPU domains, how to achieve cross-domain temperature control together across multiple CPU domains is a major challenge we currently face. Summary of the Invention

[0005] The purpose of this application is to provide a chip and its temperature control method, electronic device, and computer storage medium. By sharing temperature data with multiple CPU domains through memory space, the chip temperature can be controlled by multiple CPU domains, thereby improving the reliability and stability of temperature control.

[0006] In a first aspect, this application discloses a cross-domain chip temperature control method applied to a system-on-a-chip (SOC). The SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space. The method includes:

[0007] The first processor domain acquires temperature data of the area to be detected in the SOC;

[0008] The first processor domain writes the temperature data into the memory space;

[0009] At least one second processor domain acquires temperature data from the memory space;

[0010] At least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data.

[0011] Based on the above technical content, the temperature data of the area to be detected in the SOC is written into the memory space through the first processor domain in the system-on-a-chip (SOC), and the temperature data is obtained from the memory space through at least one second processor domain in the SOC. The temperature of the target hardware unit of the SOC is then controlled according to the obtained temperature data, realizing cross-domain control of the temperature of the target hardware unit of the SOC by each processor domain, and improving the reliability of temperature control of the target hardware unit of the SOC.

[0012] Optionally, in one implementation, the SOC further includes a voltage-temperature (PVT) module, and a first processor domain is configured with a PVT driver corresponding to the PVT module; the first processor domain acquires temperature data of the region to be detected in the SOC, including:

[0013] The first processor domain acquires the temperature data of the area to be detected in the SOC from the PVT module via the PVT driver.

[0014] The PVT driver, configured in the first processor domain, obtains temperature data of the area to be detected from the PVT module, thereby improving the reliability of the temperature data acquisition.

[0015] Optionally, each second processor domain is configured with a virtual PVT driver; at least one second processor domain obtains temperature data from memory space, including:

[0016] At least one second processor domain acquires temperature data from memory space via a virtual PVT driver.

[0017] By acquiring temperature data from memory space through at least one second processor domain via a virtual PVT driver, it is possible to enable each processor domain to effectively acquire temperature data of the target hardware unit of the SOC.

[0018] Optionally, in one implementation, when at least one second processor domain is configured with a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework, the at least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data, including:

[0019] The second processor domain will report the temperature data obtained from the virtual PVT driver to the hwmon core, and then through thermal_core;

[0020] Temperature data is sent to the temperature control driver, and the second processor domain uses the temperature control driver to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0021] By using the temperature control driver set in the second processor domain, the temperature of the target hardware unit of the SOC is controlled, enabling each processor domain to independently control the temperature of the target hardware unit of the SOC.

[0022] Optionally / In one implementation, when any of the at least one second processor domain is configured with a temperature control management program, the at least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data, including:

[0023] The second processor domain sends temperature data to the temperature control management program through a virtual PVT driver. The second processor domain then uses the temperature control management program to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0024] By using a temperature control management program set in the second processor domain to control the temperature of the target hardware unit of the SOC, the temperature of the target hardware unit of the SOC can be independently controlled by each processor domain.

[0025] Optionally / in one implementation, the second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data via a temperature control driver, including:

[0026] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the second processor domain performs frequency reduction processing on the target hardware unit of the SOC through the temperature control driver.

[0027] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver.

[0028] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

[0029] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the target hardware unit of the SOC is frequency-reduced. When the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the preset core processing unit of the target hardware unit of the SOC is shut down. When the temperature data exceeds the third temperature threshold, the target hardware unit of the SOC is restarted. This improves the accuracy of temperature control of the target hardware unit of the SOC and further enhances the stability and operating performance of the target hardware unit of the SOC.

[0030] Optionally, in one implementation, the area to be detected includes: a graphics processor area, an application processor area, a security island area, and a top-level circuit area.

[0031] By performing real-time temperature monitoring of the graphics processor area, application processor area, security island area, and top-level circuit area through multiple processor domains, the overall operating performance of the chip is improved.

[0032] Optional / In one implementation, at least one second processor domain acquires temperature data from memory space, including:

[0033] After each preset time interval, at least one second processor domain retrieves temperature data from the memory space.

[0034] By setting corresponding preset time intervals according to actual needs, the second processor domain can read temperature data at regular intervals, thereby enhancing the temperature control of the target hardware unit of the SOC.

[0035] Optionally, in one implementation, when the second processor domain is an application processor domain, the application processor domain also includes a thermal mitigation framework layer, the thermal HAL, for retrieving and displaying temperature data from the hwmon core.

[0036] When the second processor domain is the application processor domain, temperature data is obtained from the hwmon core through the thermal mitigation framework layer in the application processor domain and displayed, thus realizing effective control of the target hardware unit temperature of the SOC by the second processor domain.

[0037] Optionally, in one implementation, when the second processor domain is a cluster processor, the cluster processor domain also includes a temperature management service program, thermal_manager, which retrieves temperature data from the hwmon core and displays the temperature data.

[0038] When the second processor domain is a cluster processor, the temperature management service program in the cluster processor obtains and displays temperature data from the hwmon core, thus realizing effective control of the target hardware unit temperature of the SOC by the second processor domain.

[0039] Secondly, this application discloses a system-on-a-chip (SoC), which includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space.

[0040] The first processor domain is used to acquire temperature data of the area to be detected in the SOC;

[0041] The first processor domain is also used to write temperature data into memory space;

[0042] At least one second processor domain is used to acquire temperature data from memory space;

[0043] At least one second processor domain is also used for temperature control of the target hardware unit of the SOC based on temperature data.

[0044] Based on the above technical content, the system-on-a-chip (SOC) includes a first processor domain, at least one second processor domain, and a memory space. The first processor domain is used to acquire temperature data of the area to be detected in the SOC and write the temperature data into the memory space. The at least one second processor domain is used to acquire temperature data from the memory space, thereby performing temperature control on the target hardware unit of the SOC. This realizes cross-domain temperature control of the system-on-a-chip (SOC) and improves the reliability of temperature control on the target hardware unit of the SOC.

[0045] Optionally, in one implementation, the SOC also includes a voltage-temperature (PVT) module, and the first processor domain is configured with a PVT driver corresponding to the PVT module;

[0046] The first processor domain is also used to acquire temperature data of the area to be detected in the SOC from the PVT module via the PVT driver.

[0047] The PVT driver, configured in the first processor domain, obtains temperature data of the area to be detected from the PVT module, thereby improving the reliability of the temperature data acquisition.

[0048] Optionally, in one implementation, each second processor domain is equipped with a virtual PVT driver;

[0049] At least one second processor domain is also used to acquire temperature data from memory space via a virtual PVT driver.

[0050] By acquiring temperature data from memory space through at least one second processor domain via a virtual PVT driver, it is possible to enable each processor domain to effectively acquire temperature data of the target hardware unit of the SOC.

[0051] Optional / In one implementation, when at least one second processor domain is configured with a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework, the second processor domain is also used for:

[0052] The temperature data obtained from the virtual PVT driver is reported to the hwmon core and then processed by thermal_core;

[0053] Temperature data is sent to the temperature control driver, and the second processor domain uses the temperature control driver to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0054] By using the temperature control driver set in the second processor domain, the temperature of the target hardware unit of the SOC is controlled, enabling each processor domain to independently control the temperature of the target hardware unit of the SOC.

[0055] Optionally / In one implementation, when any of the at least one second processor domains is configured with a temperature control manager, the second processor domain is further configured to:

[0056] Temperature data is sent to the temperature control management program via a virtual PVT driver. The second processor domain then uses the temperature control management program to control the temperature of the target hardware unit of the SOC based on the temperature data.

[0057] By using a temperature control management program set in the second processor domain to control the temperature of the target hardware unit of the SOC, the temperature of the target hardware unit of the SOC can be independently controlled by each processor domain.

[0058] Optionally, in one implementation, the second processor domain is also used for:

[0059] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the target hardware unit of the SOC is frequency-reduced through the temperature control driver.

[0060] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, it shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver.

[0061] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, it restarts the target hardware unit of the SOC through the temperature control driver.

[0062] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the target hardware unit of the SOC is frequency-reduced. When the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the preset core processing unit of the target hardware unit of the SOC is shut down. When the temperature data exceeds the third temperature threshold, the target hardware unit of the SOC is restarted. This improves the accuracy of temperature control of the target hardware unit of the SOC and further enhances the stability and operating performance of the target hardware unit of the SOC.

[0063] Optionally, in one implementation, the area to be detected includes: a graphics processor area, an application processor area, a security island area, and a top-level circuit area.

[0064] By performing real-time temperature monitoring of the graphics processor area, application processor area, security island area, and top-level circuit area through multiple processor domains, the overall operating performance of the chip is improved.

[0065] Optional / In one implementation, at least one second processor domain is further used for:

[0066] Temperature data is retrieved from memory after a preset time interval.

[0067] By setting corresponding preset time intervals according to actual needs, the second processor domain can read temperature data at regular intervals, thereby enhancing the temperature control of the target hardware unit of the SOC.

[0068] Optionally, in one implementation, when the second processor domain is an application processor domain, the application processor domain also includes a thermal mitigation framework layer, the thermal HAL, for retrieving and displaying temperature data from the hwmon core.

[0069] When the second processor domain is the application processor domain, temperature data is obtained from the hwmon core through the thermal mitigation framework layer in the application processor domain and displayed, thus realizing effective control of the target hardware unit temperature of the SOC by the second processor domain.

[0070] Optionally, in one implementation, when the second processor domain is a cluster processor, the cluster processor domain also includes a temperature management service program, thermal_manager, which retrieves temperature data from the hwmon core and displays the temperature data.

[0071] When the second processor domain is a cluster processor, the temperature management service program in the cluster processor obtains and displays temperature data from the hwmon core, thus realizing effective control of the target hardware unit temperature of the SOC by the second processor domain.

[0072] Thirdly, this application discloses an electronic device, including: a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, it implements the various steps of the above-described cross-domain chip temperature control method embodiments.

[0073] Fourthly, this application discloses a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the various steps of the above-described cross-domain chip temperature control method embodiments.

[0074] In conjunction with the above technical solutions, this application provides a chip and its temperature control method, electronic device, and computer storage medium. The system-on-a-chip (SOC) includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space. After acquiring the temperature data of the area to be detected in the SOC, the first processor domain can write the temperature data into the memory space. After at least one second processor domain acquires the temperature data from the memory space, it can perform temperature control on the target hardware unit of the SOC based on the temperature data. In this way, by sharing the temperature data with each CPU domain through the memory space, the problem of the PVT module only supporting the allocation of one CPU domain, which makes it difficult for other CPU domains to acquire temperature data, is solved. This enables each domain to acquire temperature data, thereby allowing each domain to perform independent temperature control without interference, and jointly complete the temperature control of the chip. Attached Figure Description

[0075] Figure 1 is a flowchart of the steps of an embodiment of a cross-domain chip temperature control method of this application;

[0076] Figure 2 is a schematic diagram of the SOC architecture of this application. Detailed Implementation

[0077] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0078] One of the core concepts of this application is that temperature data is shared with each CPU domain through memory space, which solves the problem that the PVT module can only support the allocation of one CPU domain, causing other CPU domains to be unable to obtain temperature data. This enables each domain to obtain temperature data, so that each domain can perform independent temperature control without interfering with each other, and jointly complete the temperature control of the chip.

[0079] Referring to Figure 1, a flowchart illustrating an embodiment of the cross-domain chip temperature control method of this application is shown. This method can be applied to a system-on-chip (SOC) in a vehicle's intelligent cockpit. As shown in Figure 2, the SOC may include a first processor domain, at least one second processor domain, LPDDR (Low Power Double Data Rate) memory space, and a voltage-temperature (PVT) module. The first processor domain may include an MP (Microcontroller Processors) domain, and the second processor domain may include an AP (Application Processors) domain, a CP (Cluster Processors) domain, and an RP (Real-time Processors) domain. The AP domain is used to run IVI (In-Vehicle Infotainment) services, the CP domain is used to run vehicle instrument cluster services, the RP domain is used to run real-time safety-related services, and the MP domain is used to manage power consumption and other related services.

[0080] Furthermore, the AP domain can run an Android OS (Operating System). Additionally, the AP domain can include a Native region and a Kemel kernel region. Kemel includes a virtual PVT driver, the hwmon core (a core program in the hwmon framework), the thermal_core (a core program in the thermal framework), and a cooling_device (a temperature control driver). The Native region includes the thermal HAL (thermal mitigation framework layer), which retrieves and displays temperature data from the hwmon core. The virtual PVT driver periodically retrieves temperature data from memory and reports it to the hwmon core via the hwmon interface. The hwmon core is a standard subsystem of the Linux operating system kernel. The thermal_core associates temperature control policies with temperature control devices for subsequent temperature control. The temperature control driver controls the temperature of target hardware units (not shown in the diagram) within the AP domain. These target hardware units include, but are not limited to, CPU units, GPU (graphics processing unit) units, and NPU (Neural Processing Unit) units.

[0081] The CP domain can run a Linux OS. The CP domain includes a runtime area (Runtime) and a kernel area (Kemel). Kemel includes the virtual PVT driver, the hwmon core (the core program in the hwmon framework), the thermal_core (the core program in the thermal framework), and the cooling_device (temperature control driver). The runtime includes the user-space temperature management service program thermal_manager, which retrieves and displays temperature data from the hwmon core. The virtual PVT driver periodically retrieves temperature data from memory and reports it to the hwmon core via the hwmon interface. The hwmon core is a standard Linux subsystem. thermal_core associates temperature control policies with temperature control devices for subsequent temperature control. The temperature control driver performs temperature control on target hardware units (not shown in the diagram) within the CP domain. These target hardware units include, but are not limited to, CPU units, GPU units, and NPU units.

[0082] The RP domain can run a Safety OS. The RP domain includes a virtual PVT driver and a thermal strategy management program, which is used to control the temperature of the RP domain.

[0083] The MP domain includes the PVT physical driver, used to read temperature data of the area to be detected obtained by the PVT module. The area to be detected includes, but is not limited to: GPU0 area (i.e., graphics processor area), AP0 area (i.e., application processor area), SAF (Safety Software Framework) area (i.e., safety island area), and Top logic area (i.e., top-level circuit area). The SAF area can be a hardware unit (or kernel unit) responsible for vehicle functional safety within the vehicle infotainment chip module. The Top logic area can be the top-level logic circuit within a chip unit or system-level chip, including the chip's internal top-level circuit (or integrated circuit), management unit (circuit or integrated circuit), and overall control logic unit (circuit or integrated circuit), etc.

[0084] Furthermore, the specific flow of temperature data in Figure 2 is as follows ("=>" indicates the data flow direction):

[0085] 2.pvt=>1.pvt driver=>8.LPDDR=>7.virtual pvt driver=>5.hwmon core=>6.thermal_core=>4.cooling_device and 5.hwmon core=>3.thermal HAL;

[0086] 2.pvt=>1.pvt driver=>8.LPDDR=>13.virtual pvt driver=>11.hwmon core=>12.thermal_core=>10.cooling_device and 11.hwmon core=>9.thermal_manager;

[0087] 2.pvt=>1.pvt driver=>8.LPDDR=>15.virtual pvt driver=>14.thermal strategy.

[0088] Based on this, the embodiments of this application may specifically include the following steps:

[0089] Step 101: The first processor domain acquires the temperature data of the area to be detected in the SOC.

[0090] As shown above, the areas to be detected in the SOC can be the GPU0 area, AP0 area, SAF area, and Top logic area. The first processor domain can acquire the temperature data of these areas.

[0091] In this embodiment, the SOC further includes a voltage-temperature (PVT) module, and a first processor domain is configured with a PVT driver corresponding to the PVT module; the first processor domain acquires temperature data of the area to be detected in the SOC, including:

[0092] The first processor domain acquires the temperature data of the area to be detected in the SOC from the PVT module via the PVT driver.

[0093] Specifically, after the PVT module acquires the temperature data collected by each temperature sensor, the first processor domain can read the temperature data of the area to be detected from the PVT module through the PVT driver. The PVT module supports four temperature sensors to collect temperature data of the area to be detected.

[0094] Furthermore, the PVT driver can read temperature data from the PVT module periodically, or obtain temperature data in real time, or obtain it through other means. In practical applications, adjustments can be made according to actual needs, and this application embodiment does not impose any limitations on this.

[0095] Step 102: The first processor domain writes the temperature data into the memory space.

[0096] After obtaining the temperature data, the PVT driver in the first processor domain can write the temperature data into the LPDDR memory space.

[0097] Step 103: At least one second processor domain acquires temperature data from the memory space.

[0098] After the temperature data is written to the memory space, each of the second processor domains can obtain the temperature data from the memory space, thus enabling other CPU domains to still obtain the temperature data even when the PVT module supports only one CPU domain.

[0099] In this embodiment, each second processor domain is equipped with a virtual PVT driver; at least one second processor domain acquires temperature data from memory space, including:

[0100] At least one second processor domain acquires temperature data from memory space via a virtual PVT driver.

[0101] Specifically, since the hwmon core or thermal strategy in the second processor domain cannot interact with the memory space, this application embodiment innovatively sets up a virtual PVT driver in each second processor domain. In this way, each second processor domain can simultaneously obtain temperature data from the memory space through the virtual PVT driver.

[0102] In this embodiment of the application, at least one second processor domain acquires temperature data from memory space, including:

[0103] After each preset time interval, at least one second processor domain retrieves temperature data from the memory space.

[0104] Specifically, the virtual PVT driver in each second processor domain can periodically read temperature data from the memory space, for example, every second or every minute. Of course, the virtual PVT driver in each second processor domain can also acquire temperature data in real time, or it can acquire it through other means. In practical applications, adjustments can be made according to actual needs, and this application embodiment does not impose any limitations on this.

[0105] Step 104: At least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data.

[0106] After each second processor domain obtains the temperature data, it can independently control the temperature of the target hardware unit in its respective domain based on the temperature data, without interfering with each other, thereby jointly completing the temperature control.

[0107] The principle of temperature control is as follows:

[0108] 1) Take appropriate measures on the target hardware unit (reduce frequency, shut down core, etc.) to reduce heat generation, thereby lowering the temperature of the area to be detected. In other words, the purpose of reducing frequency and shutting down core is to reduce power consumption, thereby reducing heat generation.

[0109] 2) Reduce heat generation to achieve a balance between heat generation and heat dissipation, and avoid damage to the target hardware unit caused by operation at high temperatures.

[0110] In this embodiment, when at least one second processor domain is configured with a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework, the at least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data, including:

[0111] The second processor domain will report the temperature data obtained from the virtual PVT driver to the hwmon core, and then through thermal_core;

[0112] Temperature data is sent to the temperature control driver, and the second processor domain uses the temperature control driver to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0113] Specifically, when the second processor domain is both the AP domain and the CP domain, both the AP domain and the CP domain can contain a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework. Then, the virtual PVT driver in the AP and CP domains can obtain temperature data from memory space. The virtual PVT driver then reports the temperature data to hwmon core, hwmon core reports the temperature data to thermal_core, thermal_core reports the temperature data to the temperature control driver, and the temperature control driver performs temperature control on the target hardware unit based on the temperature data.

[0114] In this embodiment, the second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data using a temperature control driver, including:

[0115] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the second processor domain performs frequency reduction processing on the target hardware unit of the SOC through the temperature control driver.

[0116] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver.

[0117] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

[0118] Specifically, when the second processor domain is an AP domain and a CP domain, the second processor domain also includes target hardware units, including but not limited to CPU units, GPU units, and NPU units. When the temperature control driver determines that the temperature data exceeds a first temperature threshold but does not exceed a second temperature threshold, the second processor domain can perform frequency reduction processing on the target hardware units through the temperature control driver. For example, when the temperature control driver determines that the temperature data exceeds 90°C but does not exceed 110°C, the second processor domain can perform frequency reduction processing on the CPU units, GPU units, and NPU units through the temperature control driver; when the temperature data does not exceed 90°C, the frequency of the CPU units, GPU units, and NPU units can be restored through the temperature control driver.

[0119] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the second processor domain can disable preset core processing units in the target hardware unit through the temperature control driver. For example, when the temperature control driver determines that the temperature data exceeds 110°C but does not exceed 125°C, the second processor domain can disable some core processing units of the CPU unit, GPU unit, and NPU unit through the temperature control driver; when the temperature control driver determines that the temperature data does not exceed 110°C, the second processor domain can restore the disabled core processing units in the CPU unit, GPU unit, and NPU unit through the temperature control driver.

[0120] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain can restart the CPU unit, GPU unit, and NPU unit through the temperature control driver.

[0121] It should be noted that the target hardware unit may include not only CPU unit, GPU unit and NPU unit, but also other processors. In practical applications, it can be set according to actual needs, and the embodiments of this application do not limit it in this regard.

[0122] In this embodiment of the application, when any of the at least one second processor domain is equipped with a temperature control management program, the at least one second processor domain performs temperature control on the target hardware unit of the SOC based on temperature data, including:

[0123] The second processor domain sends temperature data to the temperature control management program through a virtual PVT driver. The second processor domain then uses the temperature control management program to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0124] Specifically, when the second processor domain is the RP domain, a temperature control management program can be set up in the RP domain. Then, the virtual PVT driver in the RP domain can obtain temperature data from the memory space, and then the virtual PVT driver reports the temperature data to the temperature control management program, which performs temperature control on the target hardware unit based on the temperature data.

[0125] In this embodiment, the system-on-a-chip (SOC) includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and a memory space. After acquiring the temperature data of the area to be detected in the SOC, the first processor domain can write the temperature data into the memory space. After the at least one second processor domain acquires the temperature data from the memory space, the at least one second processor domain can perform temperature control on the target hardware unit of the SOC based on the temperature data. In this way, by sharing the temperature data with each CPU domain through the memory space, the problem of the PVT module only supporting the allocation of one CPU domain, which prevents other CPU domains from acquiring temperature data, is solved. This enables each domain to acquire temperature data, thereby allowing each domain to perform independent temperature control without interference, and jointly complete the temperature control of the chip.

[0126] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of this application are not limited to the described order of actions, because according to the embodiments of this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of this application.

[0127] This application discloses a system-on-a-chip (SoC) of this application, which includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space.

[0128] The first processor domain is used to acquire temperature data of the area to be detected in the SOC;

[0129] The first processor domain is also used to write temperature data into memory space;

[0130] At least one second processor domain is used to acquire temperature data from memory space;

[0131] At least one second processor domain is also used for temperature control of the target hardware unit of the SOC based on temperature data.

[0132] In this embodiment of the application, the SOC further includes a voltage-temperature (PVT) module, and the first processor domain is provided with a PVT driver corresponding to the PVT module;

[0133] The first processor domain is also used to acquire temperature data of the area to be detected in the SOC from the PVT module via the PVT driver.

[0134] In this embodiment of the application, each second processor domain is provided with a virtual PVT driver;

[0135] At least one second processor domain is also used to acquire temperature data from memory space via a virtual PVT driver.

[0136] In this embodiment of the application, when at least one second processor domain is configured with a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal framework, the second processor domain is further configured to:

[0137] The temperature data obtained from the virtual PVT driver is reported to the hwmon core and then processed by thermal_core;

[0138] Temperature data is sent to the temperature control driver, and the second processor domain uses the temperature control driver to perform temperature control on the target hardware unit of the SOC based on the temperature data.

[0139] In this embodiment of the application, when any of the at least one second processor domain is equipped with a temperature control management program, the second processor domain is further configured to:

[0140] Temperature data is sent to the temperature control management program via a virtual PVT driver. The second processor domain then uses the temperature control management program to control the temperature of the target hardware unit of the SOC based on the temperature data.

[0141] In this embodiment of the application, the second processor domain is further used for:

[0142] When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the target hardware unit of the SOC is frequency-reduced through the temperature control driver.

[0143] When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, it shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver.

[0144] When the temperature control driver determines that the temperature data exceeds the third temperature threshold, it restarts the target hardware unit of the SOC through the temperature control driver.

[0145] In this embodiment, the area to be detected includes: a graphics processor area, an application processor area, a security island area, and a top-level circuit area.

[0146] In this embodiment of the application, at least one second processor domain is further used for:

[0147] Temperature data is retrieved from memory after a preset time interval.

[0148] In this embodiment of the application, when the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer (thermal HAL) for obtaining temperature data from the hwmon core and displaying the temperature data.

[0149] In this embodiment of the application, when the second processor domain is a cluster processor, the cluster processor domain also includes a temperature management service program thermal_manager, which is used to obtain temperature data from the hwmon core and display the temperature data.

[0150] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0151] This application also provides an electronic device, including:

[0152] It includes a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described cross-domain chip temperature control method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0153] Alternatively, the processor can be connected to the transmitter via a bus to transmit relevant information through the transmitter.

[0154] This application also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described cross-domain chip temperature control method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0155] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0156] Those skilled in the art will understand that embodiments of this application can be provided as methods, apparatus, or computer program products. Therefore, embodiments of this application can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of this application can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0157] This application describes embodiments with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, create means for implementing the functions specified in one or more blocks of the flowchart illustrations and / or one or more blocks of the block diagrams.

[0158] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means that implement the functions specified in one or more flowcharts and / or one or more block diagrams.

[0159] These computer program instructions may also be loaded onto a computer or other programmable data processing terminal equipment to cause a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, such that the instructions, which execute on the computer or other programmable terminal equipment, provide steps for implementing the functions specified in one or more flowcharts and / or one or more block diagrams.

[0160] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0161] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0162] The present application provides a detailed description of a cross-domain chip temperature control method and a cross-domain chip temperature control device. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. A cross-domain chip temperature control method, characterized in that, The method is applied to a system-on-a-chip (SOC), the SOC including a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space; the method includes: The first processor domain acquires temperature data of the region to be detected in the SOC; The first processor domain writes the temperature data into the memory space; At least one of the second processor domains acquires the temperature data from the memory space; At least one of the second processor domains performs temperature control on the target hardware unit of the SOC based on the temperature data.

2. The chip temperature control method according to claim 1, characterized in that, The SOC further includes a voltage-temperature (PVT) module, and the first processor domain is configured with a PVT driver corresponding to the PVT module; the first processor domain acquires temperature data of the region to be detected in the SOC, including: The first processor domain acquires the temperature data of the area to be detected in the SOC from the PVT module through the PVT driver.

3. The chip temperature control method according to claim 1, characterized in that, Each of the second processor domains is configured with a virtual PVT driver; the at least one second processor domain obtains the temperature data from the memory space, including: At least one of the second processor domains acquires the temperature data from the memory space via the virtual PVT driver.

4. The chip temperature control method according to claim 2, characterized in that, When at least one of the second processor domains is configured with a temperature control driver, the core program hwmon core in the hardware monitoring framework hwmon, and the core program thermal_core in the thermal mitigation framework thermal, at least one of the second processor domains performs temperature control on the target hardware unit of the SOC based on the temperature data, including: The second processor domain reports the temperature data obtained from the virtual PVT driver to the hwmon core, and then through thermal_core; The temperature data is sent to the temperature control driver, and the second processor domain uses the temperature control driver to perform temperature control on the target hardware unit of the SOC based on the temperature data.

5. The chip temperature control method according to claim 2, characterized in that, When at least one of the second processor domains is equipped with a temperature control management program, at least one of the second processor domains performs temperature control on the target hardware unit of the SOC based on the temperature data, including: The second processor domain sends the temperature data to the temperature control management program through a virtual PVT driver, and the second processor domain uses the temperature control management program to perform temperature control on the target hardware unit of the SOC based on the temperature data.

6. The chip temperature control method according to claim 4, characterized in that, The second processor domain performs temperature control on the target hardware unit of the SOC based on the temperature data through the temperature control driver, including: When the temperature control driver determines that the temperature data exceeds the first temperature threshold but does not exceed the second temperature threshold, the second processor domain performs frequency reduction processing on the target hardware unit of the SOC through the temperature control driver. When the temperature control driver determines that the temperature data exceeds the second temperature threshold but does not exceed the third temperature threshold, the second processor domain shuts down the preset core processing unit of the target hardware unit of the SOC through the temperature control driver. When the temperature control driver determines that the temperature data exceeds the third temperature threshold, the second processor domain restarts the target hardware unit of the SOC through the temperature control driver.

7. The cross-domain chip temperature control method according to claim 1, characterized in that, The area to be detected includes: the graphics processor area, the application processor area, the security island area, and the top-level circuit area.

8. The cross-domain chip temperature control method according to claim 1, characterized in that, The at least one of the second processor domains obtains the temperature data from the memory space, including: After a preset time interval, at least one of the second processor domains retrieves the temperature data from the memory space.

9. The cross-domain chip temperature control method according to claim 4, characterized in that, When the second processor domain is an application processor domain, the application processor domain further includes a thermal mitigation framework layer (thermal HAL) for obtaining the temperature data from the hwmon core and displaying the temperature data.

10. The cross-domain chip temperature control method according to claim 4, characterized in that, When the second processor domain is a cluster processor, the cluster processor domain also includes a temperature management service program thermal_manager, which is used to obtain the temperature data from the hwmon core and display the temperature data.

11. A chip, characterized in that, The chip SOC includes a first processor domain for acquiring temperature data, at least one second processor domain for temperature control based on the temperature data, and memory space; the first processor domain is used to acquire temperature data of the area to be detected in the SOC; The first processor domain is also used to write the temperature data into the memory space; At least one of the second processor domains is configured to acquire the temperature data from the memory space; At least one of the second processor domains is further configured to perform temperature control on the target hardware unit of the SOC based on the temperature data.

12. An electronic device, characterized in that, include: A processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein the computer program, when executed by the processor, implements the steps of the cross-domain chip temperature control method as described in any one of claims 1 to 10.

13. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, which, when executed by a processor, implements the steps of the cross-domain chip temperature control method as described in any one of claims 1 to 10.

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