Electronic component and electronic device

Abstract

The present application relates to the technical field of electronic devices, and discloses an electronic component and an electronic device. The electronic component comprises a cavity, a potting hole, and a potting compound blocking sheet. The cavity is used for accommodating a potting compound. The potting hole is formed on a cavity wall of the cavity. The potting compound blocking sheet covers the potting hole. The potting compound blocking sheet comprises at least one valve. The at least one valve is used for closing the potting hole, and the valve can be elastically deformed. The at least one valve is used for forming an opening when deforming towards the interior of the cavity, and the opening and the potting hole together form a channel making the interior of the cavity communicated with the outside of the cavity. In this way, when a potting compound needs to be injected into the cavity, an acting force may be applied to the potting compound blocking sheet, so that the potting compound blocking sheet is deformed to form an opening, thereby facilitating potting; when potting is completed, the acting force applied to the potting compound blocking sheet may be removed, so that the potting compound blocking sheet returns to a natural state, thereby closing the potting hole and preventing the potting compound from overflowing.

Description

Electronic devices and electronic equipment

[0001] This application claims priority to Chinese Patent Application No. 202422125044.9, filed on August 29, 2024, entitled "Electronic Devices and Electronic Equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more particularly to an electronic device and an electronic equipment. Background Technology

[0003] Electronic devices include various electronic components used to achieve different functions, such as printed circuit board assemblies. To improve the performance of electronic devices, such as enhancing smoothness and avoiding frame drops due to frequency throttling, these components need excellent heat dissipation capabilities. Therefore, electronic components include cavities filled with potting compound, which dissipates the heat generated during operation, thereby improving the device's heat dissipation capacity.

[0004] To fill the cavity with potting compound, a potting hole can be made in the cavity wall, connecting the inside and outside of the cavity. The potting compound is then poured into the cavity through this hole. However, the potting compound inside the cavity can easily overflow to the outside through the potting hole.

[0005] Utility Model Content

[0006] To address the aforementioned technical problems, this application provides an electronic device and an electronic device. The following describes this application from multiple aspects, and the implementation methods and beneficial effects of these aspects can be referenced together.

[0007] In a first aspect, embodiments of this application provide an electronic device. The electronic device includes a cavity, a potting hole, and a baffle plate. The cavity is used to contain adhesive. The potting hole is formed on the cavity wall. The baffle plate covers the potting hole and includes at least one valve for closing the potting hole. The valve is elastically deformable, and when deformed towards the interior of the cavity, it forms an opening. The opening and the potting hole together form a channel connecting the interior and exterior of the cavity.

[0008] Thus, when it is necessary to fill the cavity with glue, a force can be applied to the glue baffle to deform it and form an opening for filling. After filling, the force applied to the glue baffle can be removed to allow it to return to its natural state, thereby sealing the filling hole and preventing glue from overflowing.

[0009] In one possible implementation of the first aspect, the baffle has etched lines that penetrate the solid portion of the baffle along its thickness direction, so as to divide the solid portion of the baffle into at least one valve.

[0010] In the above-mentioned scheme of forming a valve by making etched lines on the baffle, the baffle is a one-piece structure, which is simpler and easier to install.

[0011] In one possible implementation of the first aspect, the scribe line is in the shape of a cross, a star, or a U.

[0012] In one possible implementation of the first aspect, the baffle includes multiple valves, which are independently arranged and distributed around the center point of the baffle, with adjacent valves partially overlapping.

[0013] In one possible implementation of the first aspect, the shielding sheet is a Mylar sheet or a metal sheet.

[0014] In one possible implementation of the first aspect, the transparency of the shielding film is greater than or equal to 50%, for example, 50%, 60%, or 70%. This prevents the shielding film from obstructing other structures.

[0015] In one possible implementation of the first aspect, the electronic device is provided with a positioning ring located on the side of the cavity wall facing away from the cavity body and surrounding the periphery of the potting hole, and the positioning ring is not black.

[0016] According to the embodiments of this application, the positioning ring is not black, which makes it easier to identify in grayscale image recognition. Specifically, the surface color of electronic devices is mostly black. Therefore, in grayscale image recognition, the positioning ring is brighter than the surface of the electronic device. This difference in brightness creates a significant contrast, making the positioning ring identifiable. Thus, when filling the cavity with glue, the position of the positioning ring can be identified using grayscale image recognition. Based on the position of the positioning ring, the glue-filling hole can be positioned appropriately, allowing the glue to be accurately poured into the cavity through the glue-filling hole.

[0017] In one possible implementation of the first aspect, the positioning ring is a metal ring, an annular diaphragm, or an annular coating.

[0018] In one possible implementation of the first aspect, the geometric center of the positioning ring overlaps with the central axis of the dispensing hole. This allows the dispensing equipment to more accurately determine the position of the dispensing hole.

[0019] In one possible implementation of the first aspect, the positioning ring is located between the glue-filling hole and the glue-blocking plate.

[0020] In one possible implementation of the first aspect, the positioning ring is located on the surface of the adhesive baffle facing away from the dispensing hole.

[0021] In one possible implementation of the first aspect, the positioning ring is disposed around the outer periphery of the baffle.

[0022] In one possible implementation of the first aspect, the electronic device includes a radio frequency circuit board, an adapter board, and a main board. The adapter board is ring-shaped, and the radio frequency circuit board and the main board are respectively located on opposite sides of the adapter board to jointly form a cavity.

[0023] Secondly, embodiments of this application provide an electronic device, which includes a housing and an electronic component as described in the first aspect and any implementation thereof, the electronic component being disposed on the housing.

[0024] It should be understood that the beneficial effects of the second aspect can be referred to the beneficial effects of the first aspect mentioned above, and will not be elaborated here. Attached Figure Description

[0025] Figure 1A illustrates an exemplary structure of an electronic device in some technical solutions;

[0026] Figure 1B illustrates an exemplary structure of electronic devices in some technical solutions;

[0027] Figure 1C illustrates an exemplary structure of electronic devices in some technical solutions;

[0028] Figure 2 shows a schematic diagram of potting compound overflow in some technical solutions;

[0029] Figure 3A shows a top view of the electronic device in an embodiment of this application;

[0030] Figure 3B shows a cross-sectional view of the electronic device in an embodiment of this application, as shown in section AA of Figure 3A.

[0031] Figure 3C shows a second cross-sectional view of the electronic device in the embodiment of this application, with section AA in Figure 3A as the cross-section.

[0032] Figure 4A shows a schematic diagram of potting electronic devices according to an embodiment of this application, based on Figure 3A;

[0033] Figure 4B shows a schematic diagram of potting electronic devices according to an embodiment of this application, based on Figure 3A.

[0034] Figure 5A illustrates an exemplary structure of the baffle sheet in some other embodiments of this application;

[0035] Figure 5B illustrates an exemplary structure of the baffle sheet in some other embodiments of this application;

[0036] Figure 6 illustrates an exemplary structure of the baffle sheet in some other embodiments of this application;

[0037] Figure 7A shows a top view of a portion of the structure in the electronic device;

[0038] Figure 7B shows a cross-sectional view of a portion of the structure in the electronic device along section BB in Figure 7A;

[0039] Figure 8 illustrates exemplary configurations of the positioning ring in other embodiments of this application;

[0040] Figure 9 illustrates exemplary configurations of the positioning ring in other embodiments of this application. Detailed Implementation

[0041] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0042] This application provides an electronic device that can be used in electronic devices. The electronic device may be, for example, a multilayer or single-layer printed circuit board assembly (PCBA), a printed circuit board (PCB), or a chip, etc., and this application does not impose specific limitations on this. The electronic device may be, for example, a mobile phone, tablet computer, laptop computer, desktop computer, or wearable device, etc., and this application does not impose specific limitations on this.

[0043] For ease of description, the following example of an electronic device is a multilayer printed circuit board assembly.

[0044] Figures 1A to 1C illustrate exemplary structures of electronic device 1a in some technical solutions. Figure 1A does not show potting compound 16a, Figure 1B shows potting compound 16a, and Figure 1C is a top view of electronic device 1a. To facilitate observation of the internal structure of electronic device 1a, the radio frequency circuit board 11 and the frame board 12 are not shown in Figure 1C. Referring to Figures 1A and 1B, electronic device 1a includes a radio frequency (RF) circuit board 11, a frame board 12, a main board 13, and a system-on-chip (SOC) 14 arranged sequentially along the Z-direction. The Z-direction is the thickness direction of electronic device 1a.

[0045] The adapter board 12 has a frame-like structure and is located on the upper surface of the main board 13, where it is soldered and fixed. The four edges of the RF circuit board 11 overlap the side of the adapter board 12 facing away from the main board 13 and are soldered and fixed to it. Thus, the RF circuit board 11, the adapter board 12, and the main board 13 together form a cavity S1, with the lower surface of the RF circuit board 11 and the upper surface of the main board 13 spaced apart along the Z direction. Therefore, other electronic devices (e.g., device 15) can be placed on the lower surface of the RF circuit board 11 and the upper surface of the main board 13, effectively improving the utilization rate of the board surface.

[0046] The cavity S1 is filled with potting compound 16a, which conducts heat to the upper surface of the motherboard 13, thus achieving heat dissipation on the upper surface of the motherboard 13. The surface of the system-on-a-chip 14 facing away from the motherboard 13 is covered with thermally conductive adhesive 17, which conducts heat to the lower surface of the motherboard 13, thus achieving heat dissipation on the lower surface of the motherboard 13. In other words, bidirectional heat dissipation of the electronic device 1a can be achieved through potting compound 16a and thermally conductive adhesive 17.

[0047] To fill the cavity S1 with potting compound 16a, the RF circuit board 11 has a potting hole S2. The potting hole S2 extends through the RF circuit board 11 in the Z direction and connects the inside and outside of the cavity S1. A potting needle (not shown) can be inserted into the cavity S1 from the outside through the potting hole S2 to fill the cavity S1 with potting compound 16a.

[0048] It is worth noting that the above-mentioned potting solution has the problem of easy overflow of the potting compound 16a. For example, Figure 2 shows a schematic diagram of the overflow of potting compound 16a in some technical solutions. Referring to Figure 2, the potting compound 16a is an adhesive with low degree of curing and curing modulus (i.e., high fluidity). When the electronic device 1a shakes or changes its orientation (e.g., upside down), the potting compound 16a will overflow through the potting hole S2 into an uncontrollable area (e.g., the area P1 enclosed by the dashed line).

[0049] Therefore, in some other technical solutions, potting compound 16a is a curable adhesive. The potting process requires baking or static curing steps, and these steps are strictly controlled to ensure that potting compound 16a can fully cure.

[0050] However, this leads to more complex molding steps for electronic device 1a, and excessive control processes are not foolproof, easily causing equipment damage and reduced yield due to negligence or incorrect operation. Furthermore, the higher the curing degree and curing modulus of the potting compound 16a, the more likely it is to affect the rework yield of electronic device 1a. For example, the connection between the RF circuit board 11 and the adapter board 12 may fail. In this case, the solder joints between the RF circuit board 11 and the adapter board 12 need to be heated until the temperature reaches the melting point of the solder joints to melt them. Then, the RF circuit board 11 can be removed from the adapter board 12 for subsequent resoldering to complete the rework. However, if the curing degree and curing modulus of the potting compound 16a are high, it will increase the difficulty of separating the RF circuit board 11 and the potting compound 16a, making the RF circuit board 11 more prone to damage during disassembly, resulting in a lower rework yield.

[0051] In view of this, this application provides an electronic device in which a potting hole is covered with a baffle plate, the baffle plate including at least one elastically deformable valve. During the potting process, as the potting needle passes through the baffle plate and the potting hole into the cavity for potting, pressure is applied to the valve. Under pressure, the valve deforms and opens to form an opening for the potting needle to pass through. After the potting needle is removed from the baffle plate, the pressure applied to the valve is released, and the valve returns to its natural state, thus closing to seal the potting hole and preventing potting compound overflow. Compared to the above-mentioned potting schemes that use cured potting compounds, the potting scheme of this application does not require curing the potting compound, which simplifies the potting process and allows for greater selection of potting compound types. For example, the potting compound can be a low-curing-degree and low-curing-modulus adhesive to reduce the impact on rework yield. The following is a detailed description with reference to the accompanying drawings.

[0052] Figures 3A to 3C illustrate exemplary structures of electronic device 1 in embodiments of this application. Figure 3A shows a top view of a portion of the structure of electronic device 1, while Figures 3B and 3C show cross-sectional views of electronic device 1 along section AA in Figure 3A. For ease of observation, the area enclosed by the circular dashed line in Figure 3A shows the potting hole S2, which is blocked by the baffle 10. The potting compound 16 is not shown in Figure 3B, but it is shown in Figure 3C. Referring to Figures 3A to 3C, electronic device 1 includes a cavity S1, a potting hole S2, and a baffle 10.

[0053] The cavity S1 is used to contain potting compound 16 (as an example of adhesive). As described above, in this embodiment, the electronic device 1 may include an RF circuit board 11, an adapter board 12, and a main board 13. The RF circuit board 11, the adapter board 12, and the main board 13 are arranged sequentially along the Z direction to jointly form the cavity S1. The RF circuit board 11 forms the top cavity wall of the cavity S1, the adapter board 12 forms the four side cavity walls of the cavity S1, and the main board 13 forms the bottom cavity wall of the cavity S1. The positional structure of the RF circuit board 11, the adapter board 12, and the main board 13 can be referred to the description above and will not be repeated here. In other embodiments, the cavity S1 may also have other formation methods. For example, the cavity S1 may also be formed by other devices (e.g., other circuit boards or chips), and this application does not impose any restrictions on this.

[0054] The potting hole S2 is formed on the cavity wall of the cavity S1. For example, in this embodiment, the potting hole S2 can be formed on the top cavity wall of the cavity S1, that is, the potting hole S2 can be formed on the radio frequency circuit board 11. In other embodiments, the potting hole S2 can also be formed on other cavity walls of the cavity S1, such as the surrounding side cavity walls, the bottom cavity wall, etc., and this application does not impose any restrictions on this.

[0055] A baffle plate 10 covers the potting hole S2. The baffle plate 10 includes at least one elastically deformable valve. In the deformed state, the valve opens to form an opening, which, together with the potting hole S2, forms a channel connecting the interior and exterior of the cavity S1, allowing potting compound 16 to be poured into the cavity S1 through this channel. In the undeformed state, the valve closes, thereby sealing the potting hole S2 to prevent the potting compound 16 from overflowing.

[0056] For ease of description, the following description will use the example of the shielding film 10 including four valves.

[0057] Referring again to Figure 3A, in this embodiment, the baffle 10 is circular in shape. A cross-shaped etched line S3 is provided in the center of the circular baffle 10. The cross-shaped etched line S3 runs through the baffle 10 along its thickness direction (perpendicular to the paper surface in Figure 3A), thereby dividing the solid portion of the baffle 10 into a first valve 100, a second valve 200, a third valve 300, and a fourth valve 400. The first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 are each similar to a fan shape, and the centers of each fan shape overlap.

[0058] Figures 4A and 4B illustrate the encapsulation process of electronic device 1 according to an embodiment of this application, based on Figure 3A. For ease of observation, only a portion of the structure of electronic device 1 is shown in Figures 4A and 4B. As shown in Figure 4A, the encapsulation needle 2, while moving along the Z1 direction, can abut against the adhesive barrier 10, thereby applying pressure to the first valve 100 and the second valve 200. Under pressure, the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 deform towards the interior of the cavity S1. In the deformed state, the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 open, forming an opening (not shown). The end of the encapsulation needle 2 extends from the outside of the cavity S1 into the interior of the cavity S1 through this opening and the encapsulation hole S2, thereby injecting encapsulating adhesive (not shown) into the interior of the cavity S1. As shown in Figure 4B, after the glue filling is completed, the glue-blocking needle 2 can be pulled out along the Z2 direction to remove the pressure applied to the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400. The first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 recover to their natural state through their own elasticity. In their natural state, the first valve 100, the second valve 200, the third valve 300, and the fourth valve 400 are closed, thereby sealing the glue filling hole S2. The potting glue 16 has a certain viscosity and surface tension, so it is difficult for it to overflow through the closed first valve 100, the second valve 200, the third valve 300, and the fourth valve 400.

[0059] The aforementioned electronic device 1, by covering the potting hole S2 with a baffle plate 10 that acts as a one-way valve, can prevent the potting compound 16 from overflowing and will not affect the potting needle's injection of the potting compound 16 into the cavity S1; that is, the potting compound 16 only enters and does not exit. Compared to the potting scheme that cures the potting compound 16a as described above, this application eliminates the need for baking or static curing processes during potting, as well as various control measures, thereby effectively simplifying the potting steps. Secondly, the potting compound 16 provided in this application offers a wider range of selectable types to meet the needs of various application scenarios. For example, in some embodiments, the potting compound 16 can be an adhesive with a low degree of cure and a low curing modulus, thereby reducing the bonding tightness between the RF circuit board 11 and the potting compound 16. This makes it easier to disassemble the RF circuit board 11 for rework, thus reducing the probability of the RF circuit board 11 being scrapped, effectively improving the rework yield, and reducing costs.

[0060] It is understood that this application does not specifically limit the type of potting compound 16, as long as it meets the actual usage requirements. In some embodiments, the potting compound 16 can be a two-component adhesive (i.e., AB adhesive). In other alternative embodiments, the potting compound 16 can also be a one-component adhesive. Furthermore, it is understood that this application does not specifically limit the form of the potting compound 16; the potting compound 16 can be a pure liquid, a semi-solid, or a pure solid.

[0061] In some feasible solutions, the valve is formed by creating etched lines on the retaining film 10.

[0062] For example, in the embodiments shown in Figures 3A to 4B above, four valves are formed by creating cross-shaped scribe lines S3 on the baffle 10: the first valve 100 to the fourth valve 400, but this application is not limited to this. In other embodiments of this application, valves can also be formed by creating scribe lines of other shapes on the baffle 10, which will be described exemplarily below with reference to the accompanying drawings.

[0063] Figures 5A and 5B illustrate several exemplary structures of the baffle 10 in other embodiments of this application. Referring to Figure 5A, in some implementations, a star-shaped scribe line S4 can be formed on the baffle 10 to divide the solid portion of the baffle 10 into six valves: the fifth valve 500 to the twelfth valve 1200. Referring to Figure 5B, in other implementations, a U-shaped scribe line S4 can also be formed on the baffle 10 to divide the solid portion of the baffle 10 into one valve: the thirteenth valve 1300.

[0064] In the above-mentioned scheme of forming a valve by making etched lines on the baffle 10, the baffle 10 is a one-piece structure, which is simpler and easier to install.

[0065] In other feasible embodiments, the multiple valves can also be independently arranged blade-like structures, rather than formed by scribe lines on the baffle 10. For example, Figure 6 shows an exemplary structure of the baffle 10 in some other embodiments of this application. Referring to Figure 6, the baffle 10 includes eight valves: the fourteenth valve 1400 to the twenty-first valve 2100. The eight valves are distributed in a rotational manner around the center point O of the baffle 10, and adjacent valves partially overlap, for example, the fourteenth valve 1400 and the fifteenth valve 1500 partially overlap, thus jointly constituting the baffle 10. When the glue-dispensing needle (not shown) applies pressure to the baffle 10, adjacent valves can deform toward the cavity (not shown), thereby separating from each other, and the overlap between adjacent valves gradually decreases, eventually forming an opening between adjacent valves for the glue-dispensing needle to pass through.

[0066] In some embodiments of this application, the shape of the baffle 10 can be a regular shape such as a circle, rectangle, triangle, or ellipse. In other embodiments, the shape of the baffle 10 can also be an irregular shape, and this application does not impose any limitations on this.

[0067] In some embodiments of this application, the shielding sheet 10 can be a mylar sheet or a metal sheet.

[0068] In some of these implementations, when the shielding sheet 10 is a Mylar sheet, its material can be, for example, polyimide (PI) or polyethylene terephthalate (PET).

[0069] In some of these implementations, when the baffle 10 is a metal sheet, its material can be, for example, aluminum, copper, iron, or nickel.

[0070] In some embodiments of this application, the electronic device 1 may also be provided with a positioning ring 18. Figures 7A and 7B show exemplary structures of the positioning ring 18 in the electronic device 1 in embodiments of this application. Figure 7A shows a top view of a portion of the structure of the electronic device 1, and the baffle 10 is not shown. Figure 7B shows a cross-sectional view of a portion of the structure of the electronic device 1 in section BB of Figure 7A, and the baffle 10 is shown.

[0071] Referring to Figures 7A and 7B, the positioning ring 18 is located on the side of the cavity wall (e.g., the RF circuit board 11) facing away from the cavity S1, meaning that the positioning ring 18 can be observed from the outside of the electronic device 1. Furthermore, the positioning ring 18 surrounds the outer periphery of the potting hole S2. The positioning ring 18 is not black; for example, it may be yellow, red, or orange, to make it easily identifiable in grayscale image recognition. Specifically, the surface F1 of the electronic device 1 is mostly black; therefore, in grayscale image recognition, the positioning ring 18 is brighter than the surface F1 of the electronic device 1. This difference in brightness creates a clear contrast, allowing the positioning ring 18 to be identified. Thus, when the potting equipment fills the cavity S1 with potting compound (not shown), it can identify the position of the positioning ring 18 through grayscale image recognition. Based on the position of the positioning ring 18, the potting hole S2 can be positioned to allow for proper setting of the potting needle's insertion position, ensuring accurate insertion into the potting hole S2.

[0072] In some embodiments of this application, the positioning ring 18 can be a metal ring. Metal materials have high reflectivity, especially under illumination, and the surface of the metal ring will produce highlight areas. These areas will appear as brighter pixels in grayscale image recognition, thereby making the positioning ring 18 easier to identify.

[0073] In other embodiments of this application, the positioning ring 18 may also be a non-black annular diaphragm or an annular coating formed by spraying a non-black coating, and this application does not impose any specific limitations on this.

[0074] Referring again to FIG7A, in some embodiments of this application, the geometric center of the positioning ring 18 may overlap with the central axis of the dispensing hole S2, thereby enabling the dispensing equipment to more accurately determine the position of the dispensing hole S2.

[0075] It is understandable that the position of the geometric center of the positioning ring 18 varies depending on its shape. For example, when the positioning ring 18 is a circular ring structure as shown in the embodiment of Figure 7A, its geometric center can be the center of the circular ring structure. As another example, when the positioning ring 18 is a rectangular ring structure, its geometric center can be the intersection of the diagonals of the rectangular ring structure. Furthermore, when the positioning ring 18 is a regular polygonal ring structure, its geometric center can be the point in the regular polygonal ring structure that is equidistant from each side.

[0076] Referring again to FIG7B, in some embodiments of this application, the positioning ring 18 may be disposed between the potting hole S2 and the baffle 10. For example, the positioning ring 18 may be a metal ring fixed to the radio frequency circuit board 11. Alternatively, the positioning ring 18 may be a diaphragm attached to the radio frequency circuit board 11. Yet another example is that the positioning ring 18 may also be a ring-shaped coating formed by spraying a non-black coating onto the radio frequency circuit board 11.

[0077] In some implementations, to avoid the adhesive barrier 10 interfering with the glue dispensing equipment's recognition of the positioning ring 18, the transparency of the adhesive barrier 10 can be greater than or equal to 50%, for example, 50%, 60%, or 70%.

[0078] Figure 8 illustrates exemplary configurations of the positioning ring 18 in other embodiments of this application. Referring to Figure 8, in other embodiments of this application, the positioning ring 18 may also surround the outer periphery of the baffle 10 to prevent the baffle 10 from obstructing the positioning ring 18, thereby ensuring that the dispensing equipment can identify the position of the positioning ring 18. The positioning ring 18 may be a metal ring, an annular diaphragm, or an annular coating formed by spraying a non-black coating onto the outer periphery of the baffle 10, etc. Specific details can be found in the description of the embodiment shown in Figure 7B above, and will not be repeated here.

[0079] Figure 9 illustrates exemplary configurations of the positioning ring 18 in other embodiments of this application. Referring to Figure 9, in other embodiments of this application, the positioning ring 18 may also be disposed on the surface of the baffle 10 facing away from the dispensing hole S2 to prevent the baffle 10 from obstructing the positioning ring 18, thereby ensuring that the dispensing equipment can identify the position of the positioning ring 18. The positioning ring 18 may be a metal ring, an annular diaphragm, or an annular coating formed by spraying a non-black coating onto the surface of the baffle 10 facing away from the dispensing hole S2, etc. For details, please refer to the relevant descriptions in the embodiments shown in Figure 7B above, which will not be repeated here.

[0080] This application also provides an electronic device, which includes a housing and electronic components. The electronic components are disposed on the housing, and the structure of the electronic components can refer to any of the electronic components 1 in the above embodiments, which will not be described in detail here.

[0081] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0082] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0083] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0084] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, include: A cavity for containing adhesive; A glue-filling hole is provided on the cavity wall of the cavity; A baffle plate covers the glue-filling hole. The baffle plate includes at least one valve for sealing the glue-filling hole. The valve is elastically deformable and forms an opening when it deforms toward the interior of the cavity. The opening and the glue-filling hole together form a channel connecting the interior and exterior of the cavity.

2. The electronic device according to claim 1, characterized in that, The baffle sheet has etched lines that penetrate the solid portion of the baffle sheet along its thickness direction, thereby dividing the solid portion of the baffle sheet into at least one valve.

3. The electronic device according to claim 2, characterized in that, The etched lines are in the shape of a cross, a star, or a U.

4. The electronic device according to claim 1, characterized in that, The baffle includes multiple valves, which are independently arranged and distributed around the center point of the baffle, with some overlap between adjacent valves.

5. The electronic device according to claim 1, characterized in that, The insulating sheet is a Mylar sheet or a metal sheet.

6. The electronic device according to claim 1, characterized in that, The transparency of the shielding sheet is greater than or equal to 50%.

7. The electronic device according to claim 1, characterized in that, The electronic device is provided with a positioning ring, which is located on the side of the cavity wall facing away from the cavity body and surrounds the outer periphery of the potting hole. The positioning ring is not black.

8. The electronic device according to claim 7, characterized in that, The positioning ring is a metal ring, an annular diaphragm, or an annular coating.

9. The electronic device according to claim 7, characterized in that, The geometric center of the positioning ring overlaps with the central axis of the glue-filling hole.

10. The electronic device according to claim 7, characterized in that, The positioning ring is located between the glue-filling hole and the glue-blocking sheet.

11. The electronic device according to claim 7, characterized in that, The positioning ring is located on the surface of the adhesive baffle that faces away from the glue-filling hole.

12. The electronic device according to claim 7, characterized in that, The positioning ring is arranged around the outer periphery of the baffle sheet.

13. The electronic device according to claim 1, characterized in that, The electronic device includes a radio frequency circuit board, an adapter board, and a main board. The adapter board is ring-shaped, and the radio frequency circuit board and the main board are respectively located on opposite sides of the adapter board to jointly form the cavity.

14. An electronic device, characterized in that, It includes a housing and an electronic device as described in any one of claims 1 to 13, the electronic device being disposed on the housing.

Images