Cleaning method and cleaning apparatus

Abstract

A cleaning method and a cleaning apparatus. The cleaning method for cleaning a packaged structure (10) comprises the following steps: S1, providing the packaged structure (10) to be cleaned and placing same into a cleaning chamber (201); S2, adjusting the pressure in the cleaning chamber (201) to a predetermined pressure, the predetermined pressure being a negative pressure; S3, spraying a first fluid onto the packaged structure (10), so as to perform negative pressure cleaning on the packaged structure (10); and S4, injecting a high-pressure second fluid onto the packaged structure (10), so as to discharge residues from the packaged structure (10). The cleaning method uses the principle that the surface tension of the first fluid decreases under the negative pressure condition to facilitate flow of the first fluid through micro-gaps within the packaged structure (10) to dissolve contaminants in the packaged structure (10), and then injects the high-pressure second fluid onto the packaged structure (10), such that residues such as the first fluid and contaminants remaining in the packaged structure (10) are discharged from the packaged structure (10), thereby effectively improving the cleaning effect.

Description

Cleaning methods and cleaning equipment Technical Field

[0001] This application relates to the field of packaging structure cleaning, and in particular to a cleaning method and cleaning equipment. Background Technology

[0002] With the continuous development of advanced packaging technology, chiplet packaging has been increasingly promoted and applied. Chiplet packaging proposes to break down a large system into several smaller systems, fabricate each smaller system into a chiplet, and then reassemble these chips using packaging technology to achieve performance that is even better than that of a single large chip containing the large system.

[0003] In chip reassembly, multiple chips are typically integrated onto a large carrier using flip-chip bonding. Figures 1a and 1b illustrate a package structure formed using flip-chip bonding. As shown in Figures 1a and 1b, multiple chips 12 are connected to the carrier 11 via bumps 13. During flip-chip bonding, flux (e.g., rosin) is used to improve the reliability of the bonding between the chips 12 and the carrier 11. After bonding, the package structure 10 needs to be cleaned to remove residual flux, preventing it from adversely affecting subsequent packaging processes and thus product yield.

[0004] As packaging density and integration continue to increase, the size of bumps in the packaging structure continues to shrink, and the gaps between the chip and the carrier, as well as between chips, become smaller. This makes it more difficult for cleaning fluid to enter and exit these gaps, which will prevent residual flux and other contaminants in the packaging structure from being thoroughly cleaned.

[0005] Specifically, after the cleaning fluid enters the gap between the chip and the carrier, the gap becomes increasingly smaller, and the flux itself has a certain adhesive force, making it increasingly difficult for cleaning fluid and flux residues to be discharged from the gap. As shown in Figure 1a, residue 14 is attached to the edge of chip 12. Furthermore, some residue 14, after being discharged from the gap between the chip and the carrier, continues to adhere to the gap between the chips, making it difficult to completely remove from the packaging structure. This difficulty in removing residue 14 is particularly severe in region A near the center of carrier 11 (shown as a dashed circle in Figure 1a), significantly reducing product yield.

[0006] Therefore, improving the cleaning effect on the packaging structure and increasing product yield has become an urgent problem to be solved. Summary of the Invention

[0007] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a cleaning method and cleaning equipment to solve the problem of incomplete cleaning of contaminants such as residual flux in the packaging structure in the prior art.

[0008] To achieve the above and other related objectives, one aspect of this application provides a cleaning method comprising the following steps: S1, providing a package structure to be cleaned into a cleaning chamber; S2, adjusting the pressure in the cleaning chamber to a predetermined pressure, wherein the predetermined pressure is a negative pressure; S3, spraying a first fluid onto the package structure to perform negative pressure cleaning on the package structure; S4, spraying a high-pressure second fluid onto the package structure to remove residues from the package structure.

[0009] In some embodiments, before step S4, the method further includes step S40, adjusting the pressure inside the cleaning chamber to atmospheric pressure.

[0010] In some embodiments, S4 includes: providing a flushing nozzle located above the encapsulation structure, moving along a predetermined path, and spraying the high-pressure second fluid onto the encapsulation structure.

[0011] In some embodiments, the rinsing nozzle has multiple moving speeds along the predetermined path, and the moving speed of the rinsing nozzle gradually increases from the center to the edge of the encapsulation structure.

[0012] In some embodiments, the high-pressure second fluid injected by the flushing nozzle along the predetermined path has multiple predetermined injection pressures, and the predetermined injection pressures gradually decrease from the center to the edge of the encapsulation structure.

[0013] In some embodiments, the projection of the predetermined path onto the packaging structure includes the center and edge of the packaging structure.

[0014] In some embodiments, the high-pressure second fluid has a predetermined coverage area on the packaging structure, the predetermined coverage area including a central region of the packaging structure, the central region occupying less than 1 / 4 of the area of ​​the packaging structure; wherein the moving speed of the flushing nozzle above the central region is less than the moving speed of the flushing nozzle above the region outside the central region; and / or, the injection pressure of the high-pressure second fluid injected by the flushing nozzle above the central region is greater than the injection pressure of the high-pressure second fluid injected by the flushing nozzle above the region outside the central region.

[0015] In some embodiments, the step of moving the flushing nozzle along a predetermined path in S4 includes: the flushing nozzle reciprocating within at least a portion of the predetermined path.

[0016] In some embodiments, S4 further includes: rotating the packaging structure while simultaneously injecting a high-pressure second fluid into the packaging structure. Rotating the packaging structure includes:

[0017] In some embodiments, the step of rotating the packaging structure includes: rotating the packaging structure alternately along a first direction and a second direction, wherein the first direction and the second direction are opposite in direction.

[0018] In some embodiments, S4 includes: first spraying high-pressure liquid or high-pressure gas-liquid mixture into the packaging structure; and then spraying high-pressure gas into the packaging structure.

[0019] In some embodiments, S2 to S4 are executed repeatedly.

[0020] In some embodiments, the first fluid has a predetermined temperature.

[0021] In some embodiments, the predetermined negative pressure is higher than the vaporization pressure of the first fluid at the predetermined temperature.

[0022] In some embodiments, a drying step is further included after S4, the drying step including: S51, rotating the packaging structure; S52, supplying a drying medium to the rotating packaging structure to dry the packaging structure; wherein the drying step is performed in the cleaning chamber, or the drying step is performed in a drying chamber different from the cleaning chamber.

[0023] One aspect of this application provides a cleaning device for cleaning a packaged structure, comprising a cleaning apparatus including: a cleaning chamber; a first chuck placed within the cleaning chamber for holding the packaged structure to be cleaned; a first rotating device for driving the first chuck to rotate; a pressure regulating device for regulating the pressure within the cleaning chamber; a first fluid supply assembly for spraying a first fluid onto the packaged structure; a second fluid supply assembly for spraying a high-pressure second fluid onto the packaged structure; and a control device for controlling the pressure regulating device to adjust the pressure within the cleaning chamber to a predetermined pressure, wherein the predetermined pressure is a negative pressure, and controlling the first fluid supply assembly to spray the first fluid onto the packaged structure to perform negative pressure cleaning; and controlling the pressure regulating device to adjust the pressure within the cleaning chamber to atmospheric pressure, and controlling the second fluid supply assembly to spray the high-pressure second fluid onto the negative pressure cleaned packaged structure to remove residues from the packaged structure.

[0024] The control device is also used to control the pressure regulating device to adjust the pressure in the cleaning chamber to atmospheric pressure before controlling the second fluid supply assembly to spray the high-pressure second fluid into the encapsulation structure after negative pressure cleaning.

[0025] In some embodiments, the cleaning device further includes at least one swing arm; a first fluid supply assembly includes a cleaning nozzle, and a second fluid supply assembly includes a rinsing nozzle; wherein the cleaning nozzle and the rinsing nozzle are respectively disposed on different swing arms, or the cleaning nozzle and the rinsing nozzle are disposed on the same swing arm; the rinsing nozzle is located above the encapsulation structure, and the control device is further configured to control the rinsing nozzle to move along a predetermined path above the encapsulation structure and spray the high-pressure second fluid onto the encapsulation structure.

[0026] In some embodiments, the control device is further configured to control the rinsing nozzle to have multiple moving speeds along the predetermined path, and the moving speed of the rinsing nozzle gradually increases from the center to the edge of the encapsulation structure.

[0027] In some embodiments, the control device is further configured to control the high-pressure second fluid injected by the flushing nozzle along the predetermined path to have a plurality of predetermined injection pressures, wherein the predetermined injection pressures gradually decrease from the center to the edge of the encapsulation structure.

[0028] In some embodiments, the control device is further configured to control the projection of the predetermined path onto the packaging structure, including the center and edge of the packaging structure.

[0029] In some embodiments, the control device is further configured to control the high-pressure second fluid to have a predetermined coverage area on the packaging structure, the predetermined coverage area including a central region of the packaging structure, the central region occupying less than 1 / 4 of the area of ​​the packaging structure; wherein, the control device is further configured to control the moving speed of the flushing nozzle above the central region to be less than the moving speed of the flushing nozzle above the region outside the central region; and / or, the control device is further configured to control the injection pressure of the high-pressure second fluid injected by the flushing nozzle above the central region to be greater than the injection pressure of the high-pressure second fluid injected by the flushing nozzle above the region outside the central region.

[0030] In some embodiments, the control device is also used to control the flushing nozzle to reciprocate within at least a portion of the predetermined path.

[0031] In some embodiments, the control device is further configured to control the second fluid supply assembly to spray a high-pressure second fluid into the encapsulation structure while causing the encapsulation structure to rotate alternately along a first direction and a second direction, wherein the first direction and the second direction are opposite in direction.

[0032] In some embodiments, a drying device is further included, the drying device comprising: a drying chamber; a second chuck placed within the drying chamber for holding the packaged structure to be dried; a second rotating device for driving the second chuck to rotate; and a third fluid supply assembly for supplying a drying medium to the packaged structure for drying the packaged structure.

[0033] As described above, this application provides a cleaning method and cleaning equipment for a packaging structure, which has at least the following beneficial effects:

[0034] (1) The packaging structure is cleaned by spraying the first fluid onto the rotating packaging structure under negative pressure. The principle of the decrease in surface tension of the first fluid under negative pressure is used to promote the flow of the first fluid in the tiny gaps of the packaging structure to dissolve the contaminants in the packaging structure. Then, a high-pressure second fluid is sprayed onto the packaging structure to perform high-pressure rinsing, so that the residual first fluid and contaminants in the packaging structure are discharged from the packaging structure, effectively improving the cleaning effect.

[0035] (2) By setting different moving speeds and / or spray pressures for the rinsing nozzles in different areas of the packaging structure, different degrees of high-pressure rinsing can be carried out according to the difficulty of cleaning different areas of the packaging structure, which can improve the cleaning effect and cleaning efficiency.

[0036] (3) During the high-pressure flushing process, while spraying the high-pressure second fluid into the packaging structure, the packaging structure is rotated alternately along the first direction and the second direction. The first direction and the second direction are opposite to each other, which can avoid the occurrence of flushing dead corners and enhance the high-pressure flushing effect of the high-pressure second fluid.

[0037] (4) The first fluid has a predetermined temperature, and the predetermined pressure during the negative pressure cleaning process of the encapsulation structure is higher than the vaporization pressure of the first fluid at the predetermined temperature, thereby preventing the first fluid from vaporizing before reaching the cleaning part of the encapsulation structure, so as to achieve a better cleaning effect.

[0038] Overview of the attached figures

[0039] The features and performance of this application are further described by the following embodiments and accompanying drawings.

[0040] Figure 1a is a top view of an exemplary packaging structure;

[0041] Figure 1b is a cross-sectional schematic diagram of an exemplary packaging structure;

[0042] Figure 2 is a schematic diagram of the structure of a cleaning apparatus of an exemplary embodiment of the present application;

[0043] Figure 3 is a partial structural schematic diagram of the cleaning device of a cleaning equipment according to an exemplary embodiment of this application;

[0044] Figure 4 is a schematic diagram of the structure of the drying device of a cleaning equipment according to an exemplary embodiment of this application;

[0045] Figure 5 is a schematic diagram of the layout of a cleaning device according to an exemplary embodiment of this application;

[0046] Figure 6 is a schematic flowchart of a cleaning method according to an exemplary embodiment of this application;

[0047] Figure 7 shows the curve of deionized water vaporization pressure as a function of temperature.

[0048] Figure 8 is a schematic diagram of a flushing nozzle flushing package structure of an exemplary embodiment of this application; and

[0049] Figure 9 is a schematic diagram of a predetermined path of a flushing nozzle according to an exemplary embodiment of this application.

[0050] Preferred embodiments of this application

[0051] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or adjusted based on different viewpoints and applications without departing from the spirit of this application.

[0052] It should be noted that the accompanying drawings are only schematic representations of the basic concept of this application. Although the drawings only show components related to this application and are not drawn according to the actual number, shape and size of the components, the shape, quantity and proportion of each component can be arbitrarily adjusted in actual implementation, and the layout of the components may also be more complex.

[0053] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0054] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0055] In the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0056] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another.

[0057] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., which may be used to indicate the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] Referring first to Figures 1a and 1b, which illustrate an exemplary package structure 10, the package structure 10 includes a carrier 11 and at least one chip 12, which is flip-chip bonded to the carrier 11 via bumps 13. As mentioned earlier, when the chip 12 is flip-chip bonded to the carrier 11, some flux and other contaminants may remain in the gaps between the chip 12 and the carrier 11, as well as in the gaps between the chips 12 on the carrier 11. To avoid these contaminants affecting subsequent packaging processes, the residual contaminants need to be cleaned.

[0059] Existing solutions typically suffer from two main problems. First, the cleaning solution struggles to penetrate the gap between the chip 12 and the carrier 11. This makes it difficult for the cleaning solution to effectively remove contaminants such as flux located in this gap. Second, even if the cleaning solution penetrates the gap between the chip 12 and the carrier 11 and effectively dissolves the flux in the gap, the cleaning solution and the dissolved flux are difficult to completely drain from the package structure 10. This significantly impacts the cleaning effect, leading to a decrease in product yield.

[0060] To address at least some or all of the aforementioned problems, one aspect of this application discloses a cleaning apparatus for cleaning packaged structures. Referring now to FIG2, FIG2 shows a schematic structural diagram of a cleaning device according to an exemplary embodiment of this application. As shown in FIG2, the cleaning apparatus 20 includes a cleaning chamber 201, a first chuck 202, a first rotating device 203, a pressure regulating device 204, a first fluid supply assembly 205, a second fluid supply assembly 206, and a control device 207.

[0061] The cleaning chamber 201 provides a sealable accommodating space. A first chuck 202 is placed within the cleaning chamber 201 to hold the package structure 10 to be cleaned. A first rotating device 203 drives the first chuck 202 to rotate. A pressure regulating device 204 regulates the pressure within the cleaning chamber 201. A first fluid supply assembly 205 sprays a first fluid onto the package structure 10. A second fluid supply assembly 206 sprays a high-pressure second fluid onto the package structure 10. A control device 207 controls the pressure regulating device 204 to adjust the pressure within the cleaning chamber 201 to a predetermined pressure, which is a negative pressure, and controls the first fluid supply assembly 205 to spray the first fluid onto the package structure 10 for negative pressure cleaning; and controls the second fluid supply assembly 206 to spray a high-pressure second fluid onto the negative pressure cleaned package structure 10 to remove residues from the package structure 10.

[0062] Exemplarily, the control device 207 may be a computing device, such as a computer, having a processor for executing instructions and a memory for storing instructions. Preferably, in some embodiments, the control device 207 is further configured to control the pressure regulating device 204 to adjust the pressure in the cleaning chamber 201 to atmospheric pressure before controlling the second fluid supply assembly 206 to spray the high-pressure second fluid into the encapsulation structure 10 after negative pressure cleaning. Compared to a negative pressure atmosphere, fluids flow better at atmospheric pressure. Therefore, restoring the pressure in the cleaning chamber 201 to atmospheric pressure before high-pressure rinsing results in better flow of the high-pressure second fluid and improves the rinsing effect.

[0063] For example, in some embodiments, the first chuck 202 is horizontally positioned above a rotating shaft 2021, and a first rotating device 203 (e.g., a motor) is connected to the rotating shaft 2021 via a transmission connection. A control device 207 is used to control the first rotating device 203 to drive the rotating shaft 2021 to rotate, thereby causing the first chuck 202 to rotate. While the first chuck 202 is rotating, the encapsulation structure 10 held on the first chuck 202 can also be rotated.

[0064] The pressure regulating device 204 is used to regulate the pressure within the cleaning chamber 201. For example, in some embodiments, the pressure regulating device 204 is equipped with a pressure reducing line L1, which is connected to the cleaning chamber 201, and a vacuum pump 2041 is mounted on the pressure reducing line L1. The control device 207 is used to activate the vacuum pump 2041 of the pressure regulating device 204 to evacuate the cleaning chamber 201, thereby regulating the pressure within the cleaning chamber 201 to a predetermined pressure, providing conditions for negative pressure cleaning. Preferably, the predetermined pressure is 25 torr to 150 torr. Furthermore, the pressure regulating device 204 is also equipped with a vacuum breaking line L2, which is connected to the cleaning chamber 201, and a vacuum breaking valve 2042 is mounted on the vacuum breaking line L2. The control device 207 is used to open the vacuum breaking valve 2042 of the pressure regulating device 204, allowing gas to be drawn into the cleaning chamber 201, breaking the vacuum in the cleaning chamber 201, and restoring the cleaning chamber 201 to normal pressure, so as to facilitate subsequent processes after negative pressure cleaning. In some embodiments, the pressure regulating device 204 is also provided with a normal pressure line L3, which is connected to the cleaning chamber 201, and an exhaust valve 2043 is provided on the normal pressure line L3. The control device 207 is used to open the exhaust valve 2043 of the pressure regulating device 204, allowing the gas in the cleaning chamber 201 to be discharged to the outside, so that the pressure in the cleaning chamber 201 is maintained at normal pressure. Negative pressure cleaning and subsequent processes after negative pressure cleaning will be described in detail below.

[0065] The first fluid supply assembly 205 is used to spray a first fluid onto the encapsulation structure 10. Exemplarily, the first fluid supply assembly 205 includes a first supply source 2051, a first supply line 2052, and a cleaning nozzle 2053. The first supply source 2051 is used to store the first fluid. The cleaning nozzle 2053 is disposed in the cleaning chamber 201 and connected to the first supply source 2051 via the first supply line 2052, for spraying the first fluid onto the encapsulation structure 10. The first fluid is a cleaning liquid, and exemplaryly includes at least one of deionized water and a liquid containing a saponifying agent. The liquid containing the saponifying agent is, for example, an aqueous solution of a saponifying agent with a mass fraction of 5% to 10%, and the main component of the saponifying agent includes, for example, 2-amino-2-methyl-1-propanol.

[0066] Preferably, in some embodiments, the first fluid supply assembly 205 further includes a first temperature regulating device 2054 for regulating the temperature of the first fluid to a predetermined temperature. The control device 207 is also used to control the first temperature regulating device 2054 to heat the first fluid before it is supplied to the cleaning nozzle 2053, so that the first fluid sprayed by the cleaning nozzle 2053 onto the encapsulation structure 10 has a predetermined temperature. Exemplarily, the predetermined temperature can be set between 40°C and 60°C, preferably at 60°C. As shown in FIG2, in some embodiments, the first temperature regulating device 2054 includes temperature control components such as a heater 20541 and a temperature sensor 20542 disposed on the first supply line 2052. In some embodiments, the first temperature regulating device 2054 may also be disposed in the first supply source 2051.

[0067] Preferably, in some embodiments, the first fluid supply assembly 205 further includes a spray pressure regulating device 2055 for regulating the spray pressure of the first fluid sprayed onto the encapsulation structure 10 to a predetermined spray pressure. The control device 207 is also used to control the spray pressure regulating device 2055 to regulate the spray pressure of the first fluid so that the first fluid sprayed by the cleaning nozzle 2053 onto the encapsulation structure 10 has a predetermined spray pressure. Exemplarily, the predetermined spray pressure of the first fluid is set between 10 psi and 70 psi. As shown in FIG2, in some embodiments, the spray pressure regulating device 2055 includes pressure regulating components such as a first booster pump 20551, a first pressure regulating valve 20552, and a first pressure sensor 20553 disposed on the first supply line 2052. The opening degree of the first pressure regulating valve 20552 and the output power of the first booster pump 20551 can be adjusted according to the pressure of the first fluid in the first supply line 2052 to make the spray pressure of the first fluid reach the predetermined spray pressure. The pressure of the first fluid in the first supply line 2052 is detected by the first pressure sensor 20553. It should be understood that the predetermined spraying pressure of the first fluid is adjusted by the spraying pressure regulating device 2055 installed on the first supply line 2052. Therefore, the pressure of the first fluid in the first supply line 2052 detected by the first pressure sensor 20553 can be regarded as the predetermined spraying pressure of the first fluid.

[0068] The second fluid supply assembly 206 is used to inject a high-pressure second fluid into the encapsulation structure 10. Exemplarily, the second fluid supply assembly 206 includes a second fluid supply source 2061, a second supply line 2062, a rinsing nozzle 2063, and a spray pressure regulating device 2065. The second fluid supply source 2061 stores the second fluid. The rinsing nozzle 2063 is disposed in the cleaning chamber 201 and connected to the second fluid supply source 2061 via the second supply line 2062, for injecting the high-pressure second fluid into the encapsulation structure 10. The control device 207 controls the spray pressure regulating device 2065 to adjust the spray pressure of the high-pressure second fluid injected into the encapsulation structure 10 to a predetermined spray pressure. Preferably, the predetermined spray pressure is set above 100 psi. In some embodiments, the predetermined spray pressure is set between 100 psi and 2000 psi.

[0069] As shown in Figure 2, in some embodiments, the injection pressure regulating device 2065 includes pressure regulating components such as a second booster pump 20651, a second pressure regulating valve 20652, and a second pressure sensor 20653 disposed on the second supply pipeline 2062. The opening degree of the second pressure regulating valve 20652 and the output power of the second booster pump 20651 can be adjusted according to the pressure of the second fluid in the second supply pipeline 2062 to make the injection pressure of the second fluid reach a predetermined injection pressure, thus becoming a high-pressure second fluid. The pressure of the second fluid in the second supply pipeline 2062 is detected by the second pressure sensor 20653. It should be understood that the predetermined injection pressure of the second fluid is obtained by the injection pressure regulating device 2065 disposed on the second supply pipeline 2062; therefore, the pressure of the second fluid in the second supply pipeline 2062 detected by the second pressure sensor 20653 can be regarded as the predetermined injection pressure of the second fluid.

[0070] The high-pressure second fluid includes one or more of high-pressure liquid, high-pressure gas, and high-pressure gas-liquid mixture. In some embodiments, high pressure means that the pressure of the second fluid is 100 psi or higher. In some embodiments, the second fluid may be the same as the first fluid, and when the second fluid is the same as the first fluid, the second supply line 2062 is connected to the first supply source 2051, and the second supply source 2061 may not be required. It should be understood that when the high-pressure second fluid includes multiple of high-pressure liquid, high-pressure gas, and high-pressure gas-liquid mixture, such as high-pressure liquid and high-pressure gas, the high-pressure liquid and high-pressure gas should each be provided with a separate second supply line 2062.

[0071] Preferably, as shown in FIG2, in some embodiments, the second fluid supply assembly 206 further includes a carbon dioxide mixing device 2066 for mixing carbon dioxide into the high-pressure second fluid injected into the encapsulation structure 10. The predetermined injection pressure of the high-pressure second fluid is relatively high. When the high-pressure second fluid contains liquid, it is easy to generate static electricity within the encapsulation structure 10 after being injected, which can damage the encapsulation structure 10. By providing the carbon dioxide mixing device 2066 to mix carbon dioxide into the high-pressure second fluid, the generation of static electricity can be avoided.

[0072] Furthermore, in some embodiments, the second fluid supply assembly 206 further includes a second temperature regulating device 2064 for regulating the temperature of the high-pressure second fluid to a predetermined temperature. The control device 207 is also used to control the second temperature regulating device 2064 to heat the second fluid before it is supplied to the flushing nozzle 2063, so that the high-pressure second fluid sprayed by the flushing nozzle 2063 into the encapsulation structure 10 has a predetermined temperature. Exemplarily, when the high-pressure second fluid is a high-pressure gas, such as nitrogen or an inert gas, the predetermined temperature of the high-pressure second fluid can be set between 50°C and 200°C. When the high-pressure second fluid is a high-pressure liquid, such as deionized water, the predetermined temperature of the high-pressure second fluid can be set between 40°C and 80°C. As shown in FIG2, in some embodiments, the second temperature regulating device 2064 includes temperature control components such as a heater 20641 and a temperature sensor 20642 disposed on the second supply line 2062. In some embodiments, the second temperature regulating device 2064 may also be disposed on the second supply source 2061.

[0073] Referring to FIG3, FIG3 shows a partial structural schematic diagram of a cleaning device of an exemplary embodiment of the present application. In some embodiments, the cleaning device 20 further includes at least one swing arm 208, a first fluid supply component 205 includes a cleaning nozzle 2053, and a second fluid supply component 206 includes a rinsing nozzle 2063, wherein the cleaning nozzle 2053 and the rinsing nozzle 2063 are respectively disposed on different swing arms 208. Specifically, in the example shown in FIG3, the cleaning device 20 includes two swing arms 208, labeled as a first swing arm 2081 and a second swing arm 2082, respectively. The cleaning nozzle 2053 is disposed on the first swing arm 2081, and the rinsing nozzle 2063 is disposed on the second swing arm 2082. In other embodiments, the cleaning nozzle 2053 and the rinsing nozzle 2063 may also be disposed on the same swing arm 208. It should be understood that in the example shown in FIG3, a plurality of cleaning nozzles 2053 are disposed on the first swing arm 2081, and the plurality of cleaning nozzles 2053 are arranged along the extending direction of the first swing arm 2081. Multiple cleaning nozzles 2053 are provided, allowing for the simultaneous spraying of more cleaning fluid with a wider coverage area, thus enabling the cleaning fluid to more efficiently cover the encapsulation structure 10. A rinsing nozzle 2063 is provided on the second swing arm 2082, located at its end. The single rinsing nozzle 2063 allows for more concentrated pressure, enhancing the rinsing effect. In other embodiments, the cleaning nozzle 2053 may be a single nozzle, and the rinsing nozzle 2063 may be multiple. This application does not impose limitations on this, and those skilled in the art can reasonably configure it according to actual conditions.

[0074] It should be noted that, in some embodiments, the high-pressure second fluid includes high-pressure gas (e.g., high-pressure nitrogen) and high-pressure liquid (e.g., high-pressure deionized water). Therefore, the flushing nozzle 2063 includes a liquid nozzle for spraying high-pressure liquid and a gas nozzle for spraying high-pressure gas, and both types of nozzles can be disposed on the same second swing arm 2082.

[0075] For example, as shown in FIG3, the flushing nozzle 2063 is located above the encapsulation structure 10, and the control device 207 is also used to control the flushing nozzle 2063 to move along a predetermined path above the encapsulation structure 10 and to spray a high-pressure second fluid into the encapsulation structure 10. The predetermined path will be described in detail below.

[0076] In some embodiments, the angles of the cleaning nozzle 2053 and the rinsing nozzle 2063 are configured to be adjustable, thereby enabling more flexible cleaning and rinsing of the encapsulation structure 10 and avoiding dead zones in cleaning or rinsing.

[0077] After cleaning the encapsulation structure 10, it is usually necessary to dry it; that is, a drying process is required after cleaning. Preferably, in some embodiments, during the high-pressure rinsing stage, the high-pressure second fluid may include at least a high-temperature, high-pressure gas, such as high-pressure nitrogen at 50°C to 200°C. This allows for simultaneous high-pressure rinsing and drying of the encapsulation structure 10, eliminating the need for subsequent drying processes and improving work efficiency.

[0078] In some embodiments, the drying process can be implemented in other ways within the cleaning chamber 201. For example, a drying medium is sprayed onto the package structure 10 to be dried via a cleaning nozzle 2053 to dry the package structure 10. The drying medium can be a liquid drying medium such as isopropanol (IPA) or a gaseous drying medium such as nitrogen. Accordingly, the first fluid supply assembly 205 is configured with a drying medium supply source and a drying medium supply pipeline. It should be understood that while the drying medium is sprayed onto the package structure 10 to be dried, the first rotating device 203 drives the first chuck 202 to rotate, causing the package structure 10 to rotate, thereby achieving effective drying of the package structure 10.

[0079] In other embodiments, the cleaning apparatus further includes a separate drying device. Referring to FIG4, FIG4 shows a schematic structural diagram of the drying device of a cleaning apparatus according to an exemplary embodiment of the present application. As an example, the drying device 40 includes a drying chamber 401, a second chuck 402, a second rotating device 403, and a third fluid supply assembly 404. The second chuck 402 is placed in the drying chamber 401 for holding the packaged structure 10 to be dried. The second rotating device 403 is used to drive the second chuck 402 to rotate. The third fluid supply assembly 404 is used to supply a drying medium to the packaged structure 10 for drying the packaged structure 10. Exemplarily, the third fluid supply assembly 404 includes a third fluid supply source 4041, a third fluid supply line 4042, and a drying nozzle 4043. The third fluid supply source 4041 is used to store the drying medium. The drying nozzle 4043 is disposed in the drying chamber 401 and connected to the third fluid supply source 4041 through the third fluid supply line 4042 for spraying the drying medium onto the packaged structure 10.

[0080] In some embodiments, the third fluid supply assembly 404 may further include a third temperature regulating device for regulating the temperature of the drying medium sprayed onto the encapsulation structure 10. For example, in one specific example, the third temperature regulating device includes temperature control components such as a heater and a temperature sensor for heating the nitrogen in the third fluid supply line 4042. Using hot nitrogen to purge the encapsulation structure 10 can improve drying efficiency compared to using room temperature nitrogen.

[0081] In some embodiments, the drying apparatus 40 further includes a second pressure regulating device 405 for regulating the pressure of the drying chamber 401. In this example, the second pressure regulating device 405 is used to regulate and maintain the pressure of the drying chamber 401 at atmospheric pressure to facilitate the drying process of the packaging structure 10. Exemplarily, the second pressure regulating device 405 is provided with an atmospheric pressure line P1, which communicates with the drying chamber 401, and an exhaust valve 4051 is provided on the atmospheric pressure line P1. By opening the exhaust valve 4051, the gas in the drying chamber 401 is discharged, and the pressure of the drying chamber 401 is maintained at atmospheric pressure.

[0082] It should be understood that the above is merely an example implementation and does not impose any limitations on the implementation of the drying process in this application. Any other suitable implementation is also possible.

[0083] Referring now to FIG5, FIG5 shows a schematic layout of a cleaning device according to an exemplary embodiment of the present application. As shown in FIG5, the cleaning device 50 includes a front-end module 51, a transmission module 52, a control module 53, at least one cleaning device 20, and at least one drying device 40. The number of cleaning devices 20 is greater than the number of drying devices 40. In this example, there are 5 cleaning devices 20 and 1 drying device 40. As shown in FIG5, the cleaning devices 20 and the drying device 40 are disposed on the rear side of the front-end module 51 and on both sides of the transmission module 52, wherein the drying device 40 is disposed away from the front-end module 51. The front-end module 51 is configured with 2 loading ports 511 for loading the packaging structure 10. The loading ports 511 are used to load the packaging structure 10 to be cleaned and to unload the packaging structure 10 after cleaning and drying.

[0084] The transmission module 52 is equipped with a robotic arm 520, which is used to transfer the encapsulation structure 10 between the front-end module 51, the cleaning device 20 and the drying device 40.

[0085] The control module 53 may be a computing device, such as a computer, with a processor for executing instructions and a memory for storing instructions, etc., used to control the operation of each component in the cleaning device 20 and the drying device 40 so that the cleaning device 20 and the drying device 40 perform corresponding processes, and to control the transmission module 52 to transmit the packaging structure 10 between the equipment front-end module 51, the cleaning device 20, and the drying device 40. For example, the control module 53 controls the robot arm 520 to transmit the packaging structure 10 along the following path: loading port 511 → cleaning device 20 → drying device 40 → loading port 511. It should be understood that, in this example, the control device 207 in the cleaning device 20 is integrated into the control module 53.

[0086] Another aspect of this application discloses a cleaning method for cleaning a packaged structure. Referring to Figures 6 to 9 and in conjunction with Figures 2 to 4, Figure 6 shows a schematic flowchart of a cleaning method according to an exemplary embodiment of this application. Taking the cleaning apparatus 50 shown in Figure 5 as an application example, the cleaning method of this application is described in detail. The cleaning method includes the following steps:

[0087] S1, the package structure 10 to be cleaned is provided into a cleaning chamber 201. Specifically, the package structure 10 is transferred into the cleaning chamber 201 by a transfer mechanism, such as a robot arm 520, and the package structure 10 is placed on a first chuck 202 and held by the first chuck 202.

[0088] S2, adjust the pressure inside the cleaning chamber 201 to a predetermined pressure, which is a negative pressure. Specifically, the control device 207 controls the vacuum pump 2041 of the pressure regulating device 204 to start, evacuate the cleaning chamber 201, and then adjust the pressure inside the cleaning chamber 201 to the predetermined pressure. Preferably, the predetermined pressure is 25 torr to 150 torr.

[0089] S3, a first fluid is sprayed onto the packaging structure 10 to perform negative pressure cleaning on the packaging structure 10. Specifically, the control device 207 controls the cleaning nozzle 2053 to spray the first fluid, for example, a cleaning solution containing a saponifying agent, onto the packaging structure 10, so that the first fluid covers the entire packaging structure 10. Preferably, while the cleaning nozzle 2053 is spraying the cleaning solution onto the packaging structure 10, the packaging structure 10 is rotated by the first rotating device 203, and under the action of centrifugal force, the cleaning solution covers the entire packaging structure 10.

[0090] Setting the cleaning atmosphere of the packaging structure 10 under negative pressure can reduce the surface tension of the cleaning fluid supplied to the packaging structure 10, improve the diffusion ability of the cleaning fluid, and enable the cleaning fluid to enter the gap of the packaging structure 10 more smoothly (refer to the gap between the chip 12 and the carrier 11 in Figure 1b). It can also diffuse evenly in the gap, thereby more fully dissolving contaminants such as flux located in the gap and achieving a better cleaning effect.

[0091] To prevent the cleaning fluid from vaporizing before entering the gaps of the encapsulation structure 10, during negative pressure cleaning, the predetermined pressure of the cleaning chamber 201 should be higher than the vaporization pressure of the cleaning fluid sprayed onto the encapsulation structure 10 at a predetermined temperature. This ensures that the cleaning fluid remains in a liquid state at the predetermined pressure, which is beneficial for achieving better cleaning results. Figure 7 shows the curve of deionized water vaporization pressure versus temperature. In a specific example, 60°C deionized water is used as the cleaning fluid for negative pressure cleaning of the encapsulation structure 10. Since the vaporization pressure of deionized water at 60°C is approximately 150 torr, in order to clean the encapsulation structure 10 with deionized water in liquid form, the predetermined pressure of the cleaning chamber 201 should be higher than 150 torr. For example, the predetermined pressure of the cleaning chamber 201 can be set to 200 torr.

[0092] In some embodiments, the cleaning nozzle 2053 can spray cleaning fluid onto the packaging structure 10 in an oscillating, translating, or stationary manner. Furthermore, in some embodiments, deionized water or a saponifying liquid is used as the cleaning fluid to clean the packaging structure 10; in other embodiments, a saponifying liquid and deionized water are used sequentially as the cleaning fluid to clean the packaging structure 10; in still other embodiments, a saponifying liquid and deionized water are used alternately as the cleaning fluid to clean the packaging structure 10, wherein the predetermined temperature of both the saponifying liquid and the deionized water can be set between 40°C and 60°C, preferably at 60°C. Moreover, the cleaning time for different types of cleaning fluids on the packaging structure 10 can be reasonably optimized according to the actual process conditions.

[0093] In some embodiments, S2 is executed first, followed by S3. In other embodiments, S3 may be executed first, followed by S2. That is, cleaning fluid is first sprayed onto the packaging structure 10, and after the cleaning fluid covers the entire packaging structure 10, the pressure in the cleaning chamber 201 is adjusted to a predetermined negative pressure so that the cleaning fluid enters the gaps in the packaging structure 10.

[0094] S4, a high-pressure second fluid is sprayed onto the packaging structure 10 to remove residues from the packaging structure 10. Specifically, a rinsing nozzle 2063 is provided, located above the packaging structure 10. The control device 207 controls the rinsing nozzle 2063 to move along a predetermined path above the packaging structure 10 and spray a high-pressure second fluid, such as deionized water mixed with carbon dioxide, onto the packaging structure 10. High-pressure rinsing of the packaging structure 10 with the high-pressure second fluid causes residues such as flux and cleaning fluid remaining in the gaps of the packaging structure 10 to flow out and be discharged from the packaging structure 10, thereby effectively improving the cleaning effect. The high-pressure second fluid includes one or more of high-pressure liquid, high-pressure gas, and high-pressure gas-liquid mixture. The high-pressure second fluid has a predetermined spray pressure, which is set at 100 psi or higher. In some embodiments, the predetermined spray pressure is set between 100 psi and 2000 psi. In some embodiments, a high-pressure liquid or a high-pressure gas-liquid mixture may be sprayed onto the packaging structure 10 first, followed by a high-pressure gas spray, to enhance the rinsing effect.

[0095] In some embodiments, before S4, the process further includes S40, adjusting the pressure of the cleaning chamber 201 to atmospheric pressure. Specifically, the control device 207 controls the vacuum breaking valve 2042 to open, breaking the vacuum in the cleaning chamber 201 and restoring the pressure of the cleaning chamber 201 to atmospheric pressure. Compared to a negative pressure atmosphere, fluids flow better at atmospheric pressure. Therefore, restoring the pressure of the cleaning chamber 201 to atmospheric pressure before high-pressure rinsing results in better flow of the high-pressure second fluid, thus improving the rinsing effect.

[0096] Referring to Figures 8 and 9, Figure 8 shows a schematic diagram of a rinsing nozzle rinsing package structure 10 according to an exemplary embodiment of this application, and Figure 9 shows a schematic diagram of a predetermined path of a rinsing nozzle according to an exemplary embodiment of this application. Exemplarily, the rinsing nozzle 2063 is disposed on a rocker arm 208, and the rocker arm 208 is configured to rotate about a rocker arm axis 2080 to drive the rinsing nozzle 2063 to move.

[0097] In some embodiments, the high-pressure second fluid 20630 is sprayed onto the packaging structure 10 while the packaging structure 10 is rotated. The control device 207 controls the projection of a predetermined path of the flushing nozzle 2063 onto the packaging structure 10, including the center and edge of the packaging structure 10. Referring to FIG9, point O indicates the center of the packaging structure 10, and point E indicates a point on the edge of the packaging structure 10. In some embodiments, the predetermined path of the flushing nozzle 2063 is an arc between points O and E. Exemplarily, the control device 207 controls the flushing nozzle 2063 to swing about the swing arm axis 2080 between the center and edge of the packaging structure 10, while simultaneously controlling the first rotating device 203 to drive the packaging structure 10 to rotate, thereby enabling the high-pressure second fluid to flush the entire area of ​​the packaging structure 10.

[0098] Preferably, in some embodiments, as shown in FIG8, the control device 207 controls the rinsing nozzle 2063 to spray the high-pressure second fluid 20630 into the encapsulation structure 10 while simultaneously causing the encapsulation structure 10 to rotate alternately along a first direction and a second direction, wherein the first direction and the second direction are opposite. For example, the control device 207 controls the first rotating device 203 to drive the first chuck 202 to rotate alternately in a clockwise and counterclockwise direction, thereby causing the encapsulation structure 10 held on the first chuck 202 to rotate alternately in a clockwise and counterclockwise direction. This avoids the formation of rinsing dead zones, thereby enhancing the high-pressure rinsing effect of the high-pressure second fluid 20630.

[0099] In some embodiments, the control device 207 controls the rinsing nozzle 2063 to reciprocate within at least a portion of a predetermined path. For example, as shown in FIG9, the rinsing nozzle 2063 reciprocates between points OE. Optionally, the rinsing nozzle 2063 may also reciprocate within a portion of the path between points OE. For example, it may reciprocate within region a, and then move to region b for reciprocating motion, etc.

[0100] Preferably, in some embodiments, the control device 207 controls the rinsing nozzle 2063 to have multiple moving speeds along a predetermined path, and the moving speed of the rinsing nozzle 2063 gradually increases from the center to the edge of the encapsulation structure 10. In a specific example, the encapsulation structure 10 is a circular substrate with a diameter of 200 mm, and the rinsing nozzle 2063 has four moving speeds along the predetermined path, corresponding to four regions of the encapsulation structure 10 from the center to the edge. As shown in Figure 9, the encapsulation structure 10 includes four regions from the center to the edge, labeled a, b, c, and d respectively. Regions a to d correspond to the areas covered by positions at 0-20 mm, 20-40 mm, 40-60 mm, and 60-100 mm radius of the encapsulation structure 10, respectively.

[0101] Table 1:

[0102] As shown in Figure 9 and Table 1, the moving speed of the flushing nozzle 2063 gradually increases from region a to region d, at 50 rpm, 100 rpm, 150 rpm, and 200 rpm respectively. It should be noted that in this example, the flushing nozzle 2063 is mounted on a swing arm 208, which is configured to rotate about a swing arm axis 2080 to move the flushing nozzle 2063. Therefore, the moving speed of the flushing nozzle 2063 is illustrated using the rotational speed of the swing arm 208 (in rpm).

[0103] Different moving speeds are set for the rinsing nozzle 2063 in different areas of the packaging structure 10. This allows for different levels of high-pressure rinsing based on the difficulty of cleaning different areas of the packaging structure 10, improving both the cleaning effect and efficiency. Taking the packaging structure 10 shown in Figure 9 as an example, after negative pressure cleaning, residual cleaning fluid and flux in the gaps of the packaging structure 10 are difficult to effectively drain. The closer to the center of the packaging structure 10, the more difficult it is to drain the residual cleaning fluid and flux, resulting in more residue. Conversely, the areas near the edges of the packaging structure 10 have relatively few or no residue. In this example, the rinsing nozzle 2063 moves at different speeds along the path from the center to the edge of the packaging structure 10. The closer to the center, the slower the speed; the closer to the edge, the faster the speed. This allows for longer high-pressure rinsing of the area near the center of the packaging structure 10, ensuring effective drainage of residue in that area, while faster high-pressure rinsing is performed on the areas near the edges, reducing the overall cleaning time and improving overall cleaning efficiency.

[0104] It should be understood that the moving speeds shown in Table 1 are merely examples. In this example, the moving speed increases in a stepwise manner from the center to the edge of the encapsulation structure 10. In other embodiments, it may also increase continuously. Furthermore, Table 1 provides examples of four moving speeds. In other embodiments, considering factors such as the area of ​​the encapsulation structure 10 and the actual residue situation, the moving speed may be set to more or less than four, but at least two moving speeds will be provided. Accordingly, each moving speed corresponds to one area on the encapsulation structure 10.

[0105] Preferably, in some embodiments, the control device 207 controls the rinsing nozzle 2063 to spray a high-pressure second fluid along a predetermined path with multiple predetermined spray pressures, and the predetermined spray pressures gradually decrease from the center to the edge of the encapsulation structure 10. As mentioned above, after negative pressure cleaning, the closer to the center of the encapsulation structure 10, the more difficult it is to remove residues such as cleaning fluid and flux, resulting in more residues. Therefore, multiple predetermined spray pressures are set on the rinsing nozzle 2063 along a predetermined path, gradually decreasing from the center to the edge of the encapsulation structure 10. The encapsulation structure 10 shown in Figure 9 is used as an example below. In a specific example, four predetermined spray pressures can be set, corresponding sequentially to regions a to d, with predetermined spray pressures set to 1500 psi, 1200 psi, 1000 psi, and 500 psi respectively. This allows for effective high-pressure rinsing based on the actual residue levels in different regions. It should be understood that in other embodiments, the different predetermined spray pressures can also continuously decrease from the center to the edge of the encapsulation structure 10. In addition, in other embodiments, taking into account factors such as the area of ​​the encapsulation structure 10 and the actual residue situation, the predetermined injection pressure can be set to more or less than 4, but at least 2 predetermined injection pressures are set. Accordingly, each predetermined injection pressure corresponds to one area on the encapsulation structure 10.

[0106] Furthermore, the inventors of this application have discovered that in some encapsulation structures, after negative pressure cleaning, the residue within the gaps of the encapsulation structure 10 concentrates in a region near the center of the encapsulation structure 10. More specifically, it is mainly concentrated in the region within 1 / 4 of the center of the encapsulation structure 10, i.e., this region occupies less than 1 / 4 of the total area of ​​the encapsulation structure. In some embodiments, the control device 207 controls the high-pressure second fluid to have a predetermined coverage area on the encapsulation structure 10, the predetermined coverage area including the central region of the encapsulation structure 10, which occupies less than 1 / 4 of the area of ​​the encapsulation structure. Taking FIG. 9 as an example, the encapsulation structure 10 is a circular substrate with a diameter of 200 mm, then the central region of the encapsulation structure 10 in this example is the area covered within a radius of 50 mm on the encapsulation structure 10. Preferably, in some embodiments, the control device 207 controls the moving speed of the rinsing nozzle 2063 above the central region to be less than the moving speed of the rinsing nozzle 2063 above the region outside the central region, thereby improving the high-pressure rinsing effect on the central region of the encapsulation structure 10. Furthermore, in some embodiments, the control device 207 controls the high-pressure second fluid sprayed by the rinsing nozzle 2063 above the central region to have a higher spray pressure than the high-pressure second fluid sprayed by the rinsing nozzle 2063 above the region outside the central region, thereby improving the high-pressure rinsing effect on the central region of the encapsulation structure 10.

[0107] Preferably, in some embodiments, during the cleaning process of the packaging structure 10, S2 to S4 can be executed multiple times to improve the overall cleaning effect. Taking the execution of S2 to S4 three times as an example, after executing S1 to S4 once, return to S2, then execute S2 to S4 again, then return to S2 again, and then execute S2 to S4 again. The specific number of times S2 to S4 is executed can be reasonably set by those skilled in the art according to the actual situation. For example, it can be executed two or three times or more.

[0108] In some embodiments, a drying step is further included after S4. The drying step can be performed in the cleaning chamber 201, including: S51, rotating the packaging structure 10; S52, supplying a drying medium to the rotating packaging structure 10 to dry the packaging structure 10. It should be understood that, as described above, in some embodiments, the drying step can be performed in the cleaning chamber 201. In other embodiments, the drying step can also be performed in a drying chamber 401, which is different from the cleaning chamber 201. In these embodiments, before S51, the following step is included: S50, conveying the packaging structure 10 to the drying chamber 401. Specifically, referring to FIG. 5, the packaging structure 10 to be dried is removed from the cleaning chamber 201 and transferred to the drying chamber 401 by a robot arm 520. The specific implementation process of the drying step can be referred to the relevant description above, and will not be repeated here.

[0109] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A cleaning method for cleaning a packaged structure, characterized in that, Includes the following steps: S1, providing the package structure to be cleaned into a cleaning chamber; S2, Adjust the pressure in the cleaning chamber to a predetermined pressure, wherein the predetermined pressure is a negative pressure; S3, spray the first fluid onto the packaging structure to perform negative pressure cleaning on the packaging structure; S4, a high-pressure second fluid is injected into the packaging structure to remove residues from the packaging structure.

2. The cleaning method according to claim 1, characterized in that, The following are included before S4: S40, adjust the pressure in the cleaning chamber to normal pressure.

3. The cleaning method according to claim 1, characterized in that, S4 includes: A flushing nozzle is provided, which is located above the encapsulation structure, moves along a predetermined path, and sprays the high-pressure second fluid into the encapsulation structure.

4. The cleaning method according to claim 3, characterized in that, The rinsing nozzle has multiple moving speeds along the predetermined path, and the moving speed of the rinsing nozzle gradually increases from the center to the edge of the encapsulation structure.

5. The cleaning method according to claim 3, characterized in that, The high-pressure second fluid injected by the flushing nozzle along the predetermined path has multiple predetermined injection pressures, and the predetermined injection pressures gradually decrease from the center to the edge of the encapsulation structure.

6. The cleaning method according to claim 3, characterized in that, The projection of the predetermined path onto the packaging structure includes the center and edge of the packaging structure.

7. The cleaning method according to claim 3, characterized in that, The high-pressure second fluid has a predetermined coverage area on the packaging structure, the predetermined coverage area including the central region of the packaging structure, the central region occupying less than 1 / 4 of the area of ​​the packaging structure; Wherein, the moving speed of the flushing nozzle above the central region is less than the moving speed of the flushing nozzle above the region outside the central region; and / or, The injection pressure of the high-pressure second fluid injected by the flushing nozzle above the central region is greater than the injection pressure of the high-pressure second fluid injected by the flushing nozzle above the region outside the central region.

8. The cleaning method according to claim 3, characterized in that, The step of moving the flushing nozzle along a predetermined path in S4 includes: The flushing nozzle reciprocates within at least a portion of the predetermined path.

9. The cleaning method according to claim 1, characterized in that, S4 further includes: While injecting a high-pressure second fluid into the packaging structure, the packaging structure is rotated.

10. The cleaning method according to claim 9, characterized in that, The step of rotating the packaging structure includes: The encapsulation structure is rotated alternately along a first direction and a second direction, wherein the first direction and the second direction are opposite.

11. The cleaning method according to claim 1, characterized in that, The high-pressure second fluid includes one or more of the following: high-pressure liquid, high-pressure gas, and high-pressure gas-liquid mixture.

12. The cleaning method according to claim 11, characterized in that, S4 includes: First, spray high-pressure liquid or high-pressure gas-liquid mixture into the encapsulation structure; High-pressure gas is then injected into the encapsulation structure.

13. The cleaning method according to claim 1, characterized in that, The high-pressure second fluid has a predetermined injection pressure, which is above 100 psi.

14. The cleaning method according to any one of claims 1-13, characterized in that, The process of S2 to S4 is repeated multiple times.

15. The cleaning method according to claim 1, characterized in that, The first fluid has a predetermined temperature.

16. The cleaning method according to claim 15, characterized in that, The predetermined pressure is higher than the vaporization pressure of the first fluid at the predetermined temperature.

17. The cleaning method according to claim 1, characterized in that, The first fluid also has a predetermined spray pressure, which is 10 psi to 70 psi.

18. The cleaning method according to claim 1, characterized in that, Following step S4 is a drying process, which includes: S51, rotate the packaging structure; S52, a drying medium is supplied to the rotating packaging structure to dry the packaging structure; The drying process is performed in the cleaning chamber, or the drying process is performed in a drying chamber different from the cleaning chamber.

19. A cleaning device for cleaning encapsulated structures, characterized in that, Includes a cleaning device, the cleaning device comprising: Cleaning chamber; The first chuck is placed inside the cleaning chamber to hold the packaged structure to be cleaned. A first rotating device is used to drive the first chuck to rotate; A pressure regulating device is used to regulate the pressure inside the cleaning chamber; A first fluid supply component is used to spray a first fluid onto the encapsulation structure; A second fluid supply assembly is used to inject a high-pressure second fluid into the encapsulation structure; A control device is configured to control the pressure regulating device to adjust the pressure in the cleaning chamber to a predetermined pressure, wherein the predetermined pressure is a negative pressure, and to control the first fluid supply component to spray the first fluid onto the packaging structure to perform negative pressure cleaning on the packaging structure; and to control the second fluid supply component to spray the high-pressure second fluid onto the packaging structure after negative pressure cleaning to remove residues from the packaging structure.

20. The cleaning equipment according to claim 19, characterized in that, The control device is also used to control the pressure regulating device to adjust the pressure in the cleaning chamber to atmospheric pressure before controlling the second fluid supply assembly to spray the high-pressure second fluid into the encapsulation structure after negative pressure cleaning.

21. The cleaning equipment according to claim 19, characterized in that, The cleaning device also includes at least one swing arm; The first fluid supply assembly includes a cleaning nozzle, and the second fluid supply assembly includes a flushing nozzle; The cleaning nozzle and the rinsing nozzle are respectively disposed on different swing arms, or the cleaning nozzle and the rinsing nozzle are disposed on the same swing arm; The flushing nozzle is located above the encapsulation structure, and the control device is also used to control the flushing nozzle to move along a predetermined path above the encapsulation structure and to spray the high-pressure second fluid onto the encapsulation structure.

22. The cleaning equipment according to claim 19, characterized in that, It also includes a drying device, which comprises: Drying chamber; The second chuck is placed inside the drying chamber to maintain the packaged structure to be dried; The second rotating device is used to drive the second chuck to rotate; A third fluid supply assembly is used to supply a drying medium to the packaging structure for drying the packaging structure.

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