Molding device

Abstract

Provided is a molding device capable of facilitating maintenance work of an application unit for applying an adhesive to an upper surface of a plate material. The molding device 1 comprises: a lower mold 9 and an upper mold 7; and an application unit 13 that applies an adhesive G to an upper surface of a plate material W in a punching scheduled range. The application unit 13 comprises: a lower member 15 that is disposed on the lower mold 9 side; an upper member 17 that is disposed above the lower member 15 separately from the upper mold 7 and descends together with the upper mold 7 by being directly or indirectly pressed by the upper mold 7; a coil spring 23 that supports the upper member 17 while biasing the upper member upward with respect to the lower member 15 and allows the upper member 17 to descend; and a nozzle 19 that is provided to the upper member 17 and descends together with the upper member 17 to apply the adhesive G.

Description

Mold Equipment

[0001] The present invention relates to a die device used when laminating core pieces of a rotating electrical machine with an adhesive.

[0002] A conventional mold device includes a lower mold, an upper mold that can be lowered and raised relative to the lower mold, and an adhesive supply device as an application unit, as described in Patent Document 1. The adhesive supply device includes a female mold, which is a lower member provided on the lower mold, and a male mold, which is an upper member provided on the upper mold.

[0003] In this mold device, when the upper mold is lowered, the male nozzle of the adhesive supply device fixed to the upper mold comes into contact with the plate material, allowing adhesive to be applied to the upper surface of the area to be punched.

[0004] The predetermined area where the adhesive has been applied is fed to a punch by the sheet material feeder, and is punched out as a core piece by the punch. The punched core piece is then laminated on top of the previously punched core piece via the adhesive.

[0005] In the mold device of Patent Document 1, adhesive can be applied to the upper surface of the plate material, so there is no need for a structure to allow the adhesive to escape to a lower mold or the like.

[0006] However, in such a mold device, the male mold of the adhesive supply device is fixed to the upper mold, so the upper mold must be removed when performing maintenance on the adhesive supply device, making maintenance work on the adhesive supply device complicated.

[0007] Japanese Patent Application Laid-Open No. 2002-151339

[0008] The problem to be solved is that the maintenance work for the application unit that applies adhesive to the upper surface of the plate material is complicated.

[0009] The present invention provides a mold device comprising a lower mold, an upper mold that can be raised and lowered relative to the lower mold, and an application unit that applies adhesive to the upper surface of the area to be punched out of the plate material, the application unit comprising a lower member arranged on the lower mold side, an upper member that is arranged above the lower member and separate from the upper mold and that descends together with the upper mold by being pressed directly or indirectly against the upper mold, a biasing member that biases the upper member upward relative to the lower member and allows the upper member to descend, and an adhesive application section that is provided on the upper member and descends together with the upper member to apply the adhesive.

[0010] According to the present invention, maintenance work for the application unit that applies adhesive to the upper surface of the plate material can be easily performed.

[0011] FIG. 1 is a schematic cross-sectional view showing a coating stage and a punching stage of a mold apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a modified example of the coating stage of the mold apparatus of FIG. 1. FIG. 3 is a schematic cross-sectional view showing another modified example of the coating stage of the mold apparatus of FIG. 1. FIG. 4 is a schematic cross-sectional view showing a coating stage of a mold apparatus according to a second embodiment of the present invention. FIG. 5 is an enlarged view of the coating stage of portion V of FIG. 4 in an on-state. FIG. 6 is an enlarged view of the coating stage of portion V of FIG. 4 in an off-state. FIG. 7 is a schematic cross-sectional view showing a coating stage of a mold apparatus according to a modified embodiment of the second embodiment. FIG. 8 is an enlarged view of portion VIII of the coating stage of FIG. 7. FIGS. 9(A) and 9(B) are enlarged views of portion IX of the coating stage of FIG. 8, where FIG. 9(A) shows the on-state and FIG. 9(B) shows the off-state. FIG. 10 is a plan view showing a switch member of portion IX of the coating stage of FIG. 8. FIG. 11 is a schematic cross-sectional view showing a coating stage of a mold apparatus according to a third embodiment of the present invention. FIG. 12 is a plan view of the stripper of FIG. 11.

[0012] The mold device 1 of one embodiment includes a lower mold 9, an upper mold 7 that can rise and fall relative to the lower mold 9, and an application unit 13 that can apply adhesive G to the upper surface of the area to be punched of the plate material W. The application unit 13 includes a lower member 15, an upper member 17, a biasing member 23, and an adhesive application section 19.

[0013] The lower member 15 is disposed on the lower die 9 side. The upper member 17 is disposed above the lower member 15 and separated from the upper die 7, and is pressed directly or indirectly against the upper die 7, thereby descending together with the upper die 7. The biasing member 23 biases the upper member 17 upward relative to the lower member 15 and allows the upper member 17 to descend. The adhesive applicator 19 is provided on the upper member 17 and descends together with the upper member 17 to apply the adhesive G.

[0014] Any appropriate method can be used to arrange the lower member 15 on the lower mold 9 side. In one embodiment, the lower member 15 may be arranged on the lower mold 9 side so that it can be detached by moving it from the lateral direction. In this case, the lower member 15 may be arranged so that it can be detached from the die set or bolster that serves as the lower mold 9 side.

[0015] The mold device 1 may include a buffer member 43 between the upper mold 7 and the upper member 17 to buffer the pressing force of the upper mold 7 on the upper member 17 .

[0016] The adhesive application unit 19 may be supported so as to be movable in the vertical direction relative to the upper member 17. In this case, a buffer member 44 may be provided between the adhesive application unit 19 and the upper member 17 to buffer the relative movement.

[0017] A switch 47 may be provided between the upper mold 7 and the upper member 17 or between the upper member 17 and the lower member 15, which controls the application of adhesive G by the adhesive application unit 19 on / off by pressing and releasing the upper member 17 by the upper mold 7.

[0018] The switch 47 can have any suitable structure, but in one embodiment, it may include abutting bodies 43a, 49a and switch members 45, 49b. The abutting bodies 43a, 49a are provided on one of the upper mold 7 and the upper member 17, and the switch members 45, 49b are provided on the other of the upper mold 7 and the upper member 17. The switch members 45, 49b include receiving portions 45a, 50a that receive the abutting bodies 43a, 49a and avoiding portions 45b, 50b that avoid the abutting bodies 43a, 49a, which can be switched by displacement.

[0019] The coating stage 3 may include a stripper 51 that is elastically supported by the upper member 17 and elastically contacts the plate material W prior to the adhesive coating section 19 .

[0020] [Molding Device] Fig. 1 is a schematic cross-sectional view showing the coating stage and punching stage of the molding device according to Example 1. Note that Fig. 1 shows part of the configuration as a side view rather than a cross section. The same applies to Figs. 2 to 4, 7, 8, and 11.

[0021] 1, the mold apparatus 1 of this embodiment includes a lower mold 9 and an upper mold 7 that can be raised and lowered relative to the lower mold 9. The upper mold 7 is attached to a press ram (not shown), and the lower mold 9 is a die set attached to a bolster 11. The bolster 11 is a plate member that serves as a base for fixing the lower mold 9. The press ram is a drive mechanism for the upper mold 9, and a well-known configuration can be used.

[0022] A coating stage 3 and a punching stage 5 are arranged between the upper mold 7 and the lower mold 9 along the feeding direction (left and right direction in FIG. 1 ) of the sheet material W, which is a strip-shaped electromagnetic steel sheet. The coating stage 3 is located upstream of the punching stage 5 in the feeding direction. An idle stage may be located between the coating stage 3 and the punching stage 5.

[0023] In this mold device 1, while the plate material W is being fed, adhesive G is applied to the intended punching locations of the plate material W in the application stage 3, and the intended punching locations to which adhesive G has been applied are punched out as core pieces P in the punching stage 5. The punched core pieces P are stacked on top of previously punched core pieces P via adhesive G. The stacked core pieces P form the core or block of a rotating electrical machine. The core is a stator core or rotor core. The block is formed by stacking multiple pieces together to form the core.

[0024] The coating stage 3 is equipped with a coating unit 13 that coats adhesive G on the upper surface of the planned punching area of ​​the plate material W. The coating unit 13 includes a lower member 15, an upper member 17, a coil spring 23 as a biasing member, and a nozzle 19.

[0025] The lower member 15 is disposed on the side of the lower die 9. In this embodiment, the lower member 15 is disposed on the bolster 11. However, the lower member 15 can also be disposed on the lower die 9.

[0026] In this embodiment, the lower member 15 is formed in a rectangular block shape. The lower member 15 is disposed in a mounting portion 21, which is a recess defined by the bolster 11 and the lower mold 9. When the lower member 15 is disposed on the lower mold 9, the lower mold 9 may be provided with a mounting portion formed as a recess.

[0027] The lower member 15 is disposed on the lower mold 9 side so as to be detachable by movement in the lateral direction. The lateral direction is a direction intersecting the feed direction in a plan view of the workpiece W. In this embodiment, the lateral direction is a width direction perpendicular to the feed direction, but it may also be a direction oblique to the feed direction.

[0028] By moving the lower member 15, the entire coating unit 13 can be pulled out laterally and removed from the lower mold 9. The lower member 15 is preferably fixed by, for example, a fastener (not shown).

[0029] The mounting portion 21 extends in the width direction and has an upper opening 21b and an opening 21a on at least one side in the width direction to enable the lower member 15 to be pulled out. In this embodiment, the mounting portion 21 is formed with an abutment portion (not shown) on the rear side of the opening 21a in the width direction for positioning the lower member 15. Note that the abutment portion may be omitted and an opening may be used.

[0030] The upper member 17 is disposed above the lower member 15 and separate from the upper die 7, and is pressed directly or indirectly against the upper die 9, thereby descending together with the upper die 9. Specifically, the upper member 17 is in the shape of a rectangular block, and is disposed at an initial position with a vertical gap from both the lower member 15 and the upper die 9. When the upper die 9 descends and the gap between the upper die 9 and the upper member 17 disappears, the upper die 9 comes into contact with the upper member 17. Therefore, the upper member 17 in this embodiment is configured to be pressed directly against the upper die 9.

[0031] The upper member 17 may be disposed so as to abut against the upper mold 9 at the initial position. Therefore, the separation of the upper member 17 from the upper mold 9 means that the upper mold 17 and the upper member 17 are separated so as not to be constrained by each other in the moving direction (lateral direction) of the lower member 15.

[0032] The upper member 17 is supported by a coil spring 23, which is a biasing member, on the lower member 15. The biasing member is not limited to the coil spring 23, and other springs or elastic bodies may also be used.

[0033] The coil spring 23 biases the upper member 17 upward relative to the lower member 15 and allows the upper member 17 to descend. In this embodiment, the coil spring 23 is disposed on the outer periphery of a guide post 25 provided between the upper member 17 and the lower member 15, and the upper and lower ends of the coil spring 23 abut against the upper member 17 and the lower member 15.

[0034] The guide post 25 is attached to the upper member 17, for example, and is adapted to enter a guide hole or the like in the lower member 15 as the upper member 17 descends. The guide post 25 also serves to prevent the upper member 17 from coming off upward, and supports the upper member 17 relative to the lower member 15. Note that a configuration may also be adopted in which the coil spring 23 is attached to the upper member 17 and the lower member 15, so that the coil spring 23 supports the upper member 17.

[0035] When the upper member 17 abuts against the upper die 9 in the initial position, the upper member 17 may be brought into abutment against the upper die 9 by the biasing force of the coil spring 23 .

[0036] The nozzle 19 is an adhesive applicator in this embodiment that is provided on the upper member 17 and descends together with the upper member 17 to apply adhesive G to the upper surface of the area to be punched in the plate material W. The adhesive applicator may be any member other than the nozzle 19 as long as it is capable of applying adhesive G. For example, the adhesive applicator may be a sponge or other porous body, a block with adhesive application holes, an adhesive spraying mechanism, or the like.

[0037] The nozzle 19 has a plurality of discharge ports 19a arranged at regular intervals, for example, circumferentially. The adhesive G stored in a tank (not shown) is fed to the nozzle 19 via a hose or the like at a predetermined pressure and timing. This allows the adhesive G to be applied from the discharge ports 19a.

[0038] The nozzle 19 can apply the adhesive G by transfer or spray. Figure 1 shows a transfer-type nozzle 19. As shown in Figure 1, the nozzle 19 swells and holds the adhesive G from a discharge port 19a, and then transfers the swelled adhesive G by lowering it into contact with the upper surface of the plate material W. In the case of a spray-type nozzle, the adhesive G is sprayed from the discharge port onto the upper surface of the plate material W when the nozzle is lowered to a predetermined distance between the upper surface of the plate material W and the discharge port.

[0039] The area to be punched, on which the adhesive G has been applied in the application stage 3, is sent to the punching stage 5 by feeding the plate material W.

[0040] The punching stage 5 punches out a predetermined punching range of the plate material W as a core piece P, and then layers the core piece P on the previously punched core piece P via an adhesive G. The punching stage 5 is equipped with a punch 27 and a die 29.

[0041] The punch 27 is provided on the upper die 7 and moves down together with the upper die 7. The punch 27 has a recess 27a at its tip to avoid the adhesive G on the intended punching area.

[0042] The lower mold 9 is provided with a die 29 corresponding to the punch 27. The die 29 applies lateral pressure to the core piece P punched out by the punch 27 to hold it in place, thereby enabling a plurality of core pieces P to be stacked together.

[0043] A lifter 33 is disposed between the application stage 3 and the punching stage 5. Since the adhesive G is applied to the upper surface of the plate material W in the area to be punched, a structure for avoiding the adhesive G, such as a punch 27, is not required on or around the lifter 33.

[0044] The lifter 33 lifts the workpiece W relative to the lower die 9, thereby smoothing the feeding of the workpiece W. The lifter 33 in this embodiment is supported by a coil spring 37 in a recess 35 of the lower die 9, and protrudes from the upper surface of the lower die 9 by the biasing force.

[0045] In the mold device 1 of this embodiment, a stripper 41 is elastically supported on the upper mold 7 from the coating stage 3 to the punching stage 5. Specifically, the stripper 41 is supported on the upper mold 7 via a coil spring 39, which is a biasing member. The stripper 41 descends together with the upper mold 7 and elastically contacts the sheet material W, pressing the sheet material W onto the lower mold 9.

[0046] [Operation] In the mold device 1, the plate material W is intermittently fed to the coating stage 3 and the punching stage 5. In other words, the plate material W is repeatedly fed and stopped, and when stopped, the adhesive G is applied in the coating stage 3 and the core piece P is punched out in the punching stage 5. When the plate material W is fed, the lifter 33 protrudes from the lower die 9 by the biasing force and lifts the plate material W. This enables the plate material W to be fed smoothly.

[0047] When the plate material W stops, the upper die 7 descends. When the upper die 7 descends, the stripper 41 elastically contacts the plate material W ahead of the plate material W on the coating stage 3 and the punching stage 5. As a result, the stripper 41 presses the plate material W against the lower die 9.

[0048] When the plate material W is pressed against the lower die 9, the lifter 33 is pressed by the plate material W and moves down into the recess 35 of the lower die 9 against the biasing force of the coil spring 37. In response, the plate material W moves down onto the lower die 9. When the upper die 9 moves down further in this state, the coating unit 13 functions on the coating stage 3, and the punch 27 functions on the punching stage 5.

[0049] That is, in the coating unit 13 of the coating stage 3, when the upper die 7 descends relative to the stripper 41 while the plate material W is being held down, the lower surface of the upper die 7 abuts against the upper surface of the upper member 17. As a result, in the coating unit 13, the upper member 17 is pressed downward by the upper die 7 and descends together with the upper die 7.

[0050] When the upper member 17 descends, the nozzle 19 descends accordingly. This descent of the nozzle 19 causes the adhesive G held in a bulging state by the nozzle 19 to come into contact with and be transferred (applied) to the intended punching area on the upper surface of the plate material W. At this time, the coil spring 23 corrects the position of the upper member 17 relative to the plate material W, so that the adhesive G can be applied appropriately.

[0051] On the other hand, when the upper die 3 descends while holding down the plate material W, the punch 27 of the punching stage 5 descends together with the upper die 7 relative to the stripper 41. In response to this descent, the punch 27 punches out the planned punching range of the plate material W. At this time, the adhesive G enters the recess 27a of the punch 27, so that punching by the punch 27 can be performed reliably while avoiding the adhesive G on the top surface of the plate material W.

[0052] In this way, the core piece P is punched out from the plate material W. The punched core piece P is held in the die 29 and is stacked and bonded onto the preceding core piece P.

[0053] When the upper die 7 rises after applying the adhesive G and punching out the core piece P, the punch 27 rises along with the upper die 7 in the punching stage 5, and in the application stage 3, the upper member 17 rises due to the biasing force of the coil spring 23 as the upper die 7 rises, and returns to its initial position.

[0054] Maintenance work can be easily performed in this mold apparatus 1. That is, maintenance work for the application unit 13 can be performed without removing the upper mold 7 because the upper member 17 is separated from the upper mold 7.

[0055] In this embodiment, in the initial state in which the upper mold 7 is raised, the lower member 15 is slid in the width direction relative to the mounting portion 21. If the lower member 15 is fastened to the mounting portion 21, the fastening is released beforehand. By sliding the lower member 15, the coating unit 13 can be slid entirely relative to the mounting portion 21. This sliding can be performed more easily because there is a gap between the upper mold 7 and the upper member 17.

[0056] The application unit 13 is removed for maintenance by being detached from the mounting portion 21 via a slide. In some cases, it is also possible to perform maintenance without detaching the application unit 13 from the mounting portion 21.

[0057] After maintenance of the coating unit 13 is completed, the entire coating unit 13 can be slid into the mounting portion 21 and the lower member 15 of the coating unit 13 can be repositioned on the lower mold 9 by abutting it against the abutment portion on the rear side in the width direction.

[0058] As described above, in the mold device 1 of this embodiment, the upper member 17 of the application unit 13 is separated from the upper mold 7, so that maintenance work on the application unit 13 can be easily performed without removing the upper mold 7.

[0059] In this embodiment, the lower member 15 is disposed on the lower mold 9 side so as to be detachable by moving it laterally, so that maintenance work can be performed more easily.

[0060] [Modification] Fig. 2 is a schematic cross-sectional view showing a modification of the coating stage of the mold apparatus of Fig. 1. Fig. 3 is a schematic cross-sectional view showing another modification of the coating stage of the mold apparatus of Fig. 1.

[0061] 2 includes a buffer member 43 between the upper die 7 and the upper member 17. The buffer member 43 buffers the pressure of the upper die 7 against the upper member 17. The buffer member 43 of this modification is composed of a contact body 43a and an elastic body 43b.

[0062] The buffer member 43 is provided on one of the upper die 7 and the upper member 17, in this embodiment on the upper die 7. Specifically, it is attached to a recess 7a provided on the upper die 7. The recess 7a has a downward opening 7b formed to be relatively narrow.

[0063] The contact body 43a is columnar, and its relatively narrow tip is inserted into the opening 7b of the recess 7a so as to be able to move up and down. The base of the contact body 43a engages with the edge of the opening 7b of the recess 7a. The material of the contact body 43a is not particularly limited and can be selected from appropriate materials such as metal and resin.

[0064] The elastic body 43b is made of a rubber solid or a coil spring, and is interposed in the recess 7a between the contact body 43a and the upper mold 7 in the vertical direction. The elastic body 43b keeps the base of the contact body 43a engaged with the edge of the opening 7b and the tip of the contact body 43a protruding outside the opening 7b.

[0065] When the upper mold 7 descends, the contact body 43a of the buffer member 43 comes into contact with the upper surface of the upper member 17. The impact caused by this contact (pressure) is absorbed and alleviated by the deflection of the elastic body 43b as the contact portion 43a retreats into the recess 7a. In this way, in this modified example, the impact caused by the contact (pressure) of the upper surface of the upper member 17 as the upper mold 7 descends can be suppressed.

[0066] In this modified example, the upper mold 7 indirectly presses the upper member 17 via the abutment 43a while suppressing such impact. Thereafter, the abutment 43a retreats into the upper mold 7 in response to the deflection of the elastic body 43b, and the upper mold 7 directly presses the upper member 17. Note that the abutment 43a may not retreat completely into the upper mold 7 even when the elastic body 43b deflects, but may remain in a protruding state. In this case, the upper mold 7 only indirectly presses the upper member 17 via the abutment 43a.

[0067] When the buffer member 43 is provided on the upper member 17, a recess may be provided in the upper member 17 and the buffer member 43 may be attached to the recess, as described above. The buffer member 43 may also be provided on both the upper member 17 and the upper mold 7. The buffer member 43 may also be formed of only an elastic body. In this case, the elastic body may be integrally provided with a portion corresponding to the abutment portion. Furthermore, the upper mold 7 may abut against the upper member 17 via the buffer member 43 in the initial state.

[0068] In the modification shown in FIG. 3, a buffer member 44 is provided between the nozzle 19 and the upper member 17, and supports the nozzle 19 so that it can move up and down relative to the upper member 17.

[0069] 2, and the buffer member 44, which is made up of a support body 44a and an elastic body 44b, is attached to the recess 17a of the upper member 17. The tip of the support body 44a is connected to the nozzle 19 by screwing or the like outside the recess 17a.

[0070] In this modified example, when the upper die 7 descends, the upper die 7 presses the upper member 17 to lower the upper member 17. Then, the nozzle 19 comes into contact with the workpiece W as the upper member 17 descends.

[0071] The impact caused by this contact is absorbed and alleviated by the retraction of the contact portion 44a of the buffer member 44 into the recess 17a, which causes the elastic body 44b to bend. Furthermore, the coil spring 23 cooperates with the elastic body 44b of the buffer member 44, thereby more reliably alleviating the impact when the nozzle 19 contacts the plate material W.

[0072] Therefore, in this modified example, the impact of the nozzle 19 coming into contact with the upper surface of the plate material W can be suppressed.

[0073] In a modified example, when the buffer member 44 is provided on the nozzle 19, a recess may be provided on the nozzle 19 and the buffer member 44 may be attached inside the recess. The buffer member 44 may also be made of only an elastic body.

[0074] Fig. 4 is a schematic cross-sectional view showing a coating stage of a mold apparatus according to Example 2 of the present invention. Fig. 5 is an enlarged view of the coating stage in the V portion of Fig. 4 in an on-state, and Fig. 6 is an enlarged view of the same in an off-state. Note that Example 2 has a basic configuration in common with Example 1, and components corresponding to those in Example 1 are designated by the same reference numerals, and redundant explanations will be omitted.

[0075] 4 to 6 , Example 2 includes a switch 47 that controls the application of adhesive G on and off. This switch 47 is provided between the upper mold 7 and the upper member 17, and controls the application of adhesive G on and off by pressing the upper member 17 by the upper mold 7 and releasing this pressing. Pressing the upper member 17 means that the upper mold 7 can lower the upper member 17 to an extent that allows adhesive G to be applied. In other words, pressing the upper member 17 here does not include pressing that does not allow the upper member 17 to be lowered to an extent that allows adhesive G to be applied, and releasing this pressing does not include pressing.

[0076] A buffer member 43 is attached to the upper mold 7 in the same manner as in the modified example of the first embodiment shown in Fig. 2. On the other hand, the upper member 17 has a recess 17b formed on the upper surface thereof corresponding to the buffer member 43, for example, and a switch member 45 is disposed in the recess 17b.

[0077] The switch member 45 has a stepped receiving portion 45a and an avoiding portion 45b with different thicknesses in the vertical direction. The switch member 45 can be switched by displacement between an ON position where the receiving portion 45a faces the buffer member 43 and an OFF position where the avoiding portion 45b faces the buffer member 43. In plan view, the switch member 45 slides in a radial direction around the abutting body 43a. The buffer member 43 may be composed of only the abutting body 43a.

[0078] 5, when the receiving portion 45a of the switch member 45 faces the buffer member 43, the abutting body 43a of the buffer member 43 facing the receiving portion 45a comes into contact with and is received when the upper mold 7 descends. In this state, the upper mold 7 descends to press the upper member 17, and the elastic body 43b of the buffer member 43 contracts, lowering the upper member 17, and the adhesive G is applied to the plate material W by the nozzle 19.

[0079] 6, when the avoiding portion 45b of the switch member 45 faces the buffer member 43, the abutting body 43a of the buffer member 43 that faces the avoiding portion 45b is not received when the upper mold 7 descends and instead enters the recess 17b. This entry reduces or zeroes out the downward stroke of the upper member 17. In other words, the upper mold 7 releases the pressure on the upper member 17. Therefore, the adhesive G from the nozzle 19 does not come into contact with the plate material W, and the adhesive G is not applied to the plate material W.

[0080] In this way, in this embodiment, it is possible to control the application of the adhesive G on and off. In addition, in the second embodiment, the same effects as in the first embodiment can be achieved.

[0081] [Modification] Fig. 7 is a schematic cross-sectional view showing a coating stage of a mold device according to a modification of Example 2. Fig. 8 is an enlarged view showing part VIII of the coating stage in Fig. 7. Fig. 9 is an enlarged view showing part IX of the coating stage in Fig. 8, Fig. 9(A) showing the ON state and Fig. 9(B) showing the OFF state. Fig. 10 is a plan view showing a switch member of part IX of the coating stage in Fig. 8.

[0082] In the modified example of FIGS. 7 to 10, a switch 47 for controlling the application of adhesive G on and off is provided between the upper member 17 and the lower member 15.

[0083] The contact body 49a of the switch 47 is configured in an annular shape as shown in Fig. 10, with recessed portions 48a and protruding portions 48b arranged alternately in the circumferential direction. Note that Fig. 10 shows the switch member 49b, and only the reference number of the contact body 49a is shown in parentheses. The switch member 49b is also configured in an annular shape, with protruding portions 50a serving as receiving portions and recessed portions 50b serving as avoidance portions arranged alternately in the circumferential direction.

[0084] The abutment body 49a is supported on the upper member 17 via an elastic body 49c. That is, the upper member 17 has a recess 17c, and the base of the abutment body 49a, which is formed relatively wide, is disposed within the recess 17c. The opening 17b of the recess 17c is formed relatively narrow, and the abutment body 49a passes through it. The base of the abutment body 49a engages with the edge of the opening 17b in the vertical direction. An elastic body 49c is disposed between the abutment body 49a and the upper member 17 in the vertical direction.

[0085] The switch member 49b is supported rotatably in the circumferential direction, and can be switched by displacement between an OFF position in which the convex portion 50a faces the convex portion 48b of the abutment body 49a and an ON position in which the convex portion 50a faces the concave portion 48b of the abutment body 49a.

[0086] The contact body 49a and the switch member 49b may be reversed upside down. Also, the contact body 49a and the switch member 49b do not need to be annular, and may be of a sliding type similar to the second embodiment shown in Figures 4 to 6.

[0087] 9A, when the recess 50b, which is the avoidance portion of the switch member 49b, faces the protrusion 48a of the contact body 49a, the protrusion 48a of the contact body 49a enters the recess 50b of the switch member 49b when the upper die 7 descends. This ensures the downward stroke of the upper member 17. Therefore, when the upper member 17 is pressed against the upper die 7, the adhesive G from the nozzle 19 comes into contact with the plate material W, and the adhesive G is applied.

[0088] 9(B), when the convex portion 50a serving as the receiving portion of the switch member 49b faces the convex portion 48a of the abutting body 49a, the convex portion 48a of the abutting body 49a comes into contact with the convex portion 50a of the switch member 49b when the upper die 7 descends, thereby inhibiting the descent of the upper member 17. Therefore, the upper member 17 pressed by the upper die 7 enters a released state in which it cannot descend enough to apply the adhesive G. In other words, the adhesive G from the nozzle 19 does not come into contact with the plate material W, and the adhesive G is not applied to the plate material W.

[0089] In this state, the elastic body 49c contracts and lowers the upper member 17, thereby absorbing variations in the bottom dead center position of the upper die 7. Allowing the upper die 7 to lower can be achieved by the configuration of a modified example of the first embodiment (FIG. 2), etc. Therefore, application of adhesive G in the application stage 3 is stopped, but punching of the core piece P in the punching stage 5 can continue.

[0090] In this way, in this modified example, application of adhesive G can be controlled to be turned on and off, and the same effects as those in the second embodiment can be achieved.

[0091] Fig. 11 is a schematic cross-sectional view showing a coating stage of a mold device according to Example 3 of the present invention. Fig. 12 is a plan view of the nozzle and coating stripper of Fig. 11. Note that Example 3 has a basic configuration in common with Example 1, and components corresponding to those in Example 1 are designated by the same reference numerals, and redundant explanations will be omitted.

[0092] As shown in FIGS. 11 and 12, the mold apparatus 1 of the third embodiment includes a stripper 51 in the coating unit 13.

[0093] The stripper 51 is formed in a ring shape so as to surround the nozzle 19. The planar shape of the stripper 51 is not limited to a ring shape, and may be configured by arranging a plurality of arc-shaped or linear stripper pieces in an annular shape.

[0094] The stripper 51 is supported on the lower surface of the upper member 17 by a biasing member, for example, a coil spring 53. In FIG. 11, the upper die 7 is in its initial position, with the stripper 51 slightly spaced apart from the workpiece W.

[0095] When the upper member 17 moves down from the initial position together with the upper die 7, the stripper 51 moves down together with the nozzle 19. Then, the stripper 51 elastically contacts the workpiece W ahead of the nozzle 19.

[0096] This elastic contact causes the stripper 51 to press the plate material W in a circumferential direction against the nozzle 19. In other words, the stripper 51 can reliably press the vicinity of the portion where the adhesive G is to be applied, thereby ensuring reliable application of the adhesive G. In addition, the third embodiment can also achieve the same effects as the first embodiment.

[0097] REFERENCE SIGNS LIST 1 mold device 7 upper mold 9 lower mold 11 bolster 13 application unit 15 lower member 17 upper member 19 nozzle (adhesive application portion) 23 coil spring (urging member) 41 stripper 43 buffer member 43a, 49a contact body 45, 49b slide member 45a receiving portion 45b avoidance portion 47 switch W plate material

Claims

1. A mold device comprising a lower mold and an upper mold capable of rising and falling relative to the lower mold, and an application unit that applies adhesive to the upper surface of the area to be punched out of a plate material, the application unit comprising: a lower member arranged on the lower mold side; an upper member arranged above the lower member and separated from the upper mold, which is pressed directly or indirectly against the upper mold and thereby descends together with the upper mold; a biasing member that biases the upper member upward relative to the lower member and allows the upper member to descend; and an adhesive application section that is provided on the upper member and descends together with the upper member to apply the adhesive.

2. A mold device according to claim 1, wherein the lower member is arranged on the lower mold side so as to be detachable by movement from the lateral direction.

3. A mold device according to claim 1 or 2, further comprising a buffer member between said upper mold and said upper member for buffering the pressing force of said upper mold against said upper member.

4. A mold device according to claim 1 or 2, wherein the adhesive application section is supported so as to be movable relative to the upper member in the vertical direction, and a buffer member is provided between the adhesive application section and the upper member to buffer the relative movement.

5. A mold device according to claim 1 or 2, comprising a switch between the upper mold and the upper member or between the upper member and the lower member, which can control the application of the adhesive by the adhesive application unit to be turned on and off by pressing the upper member by the upper mold and releasing the pressing.

6. A mold device according to claim 5, wherein the switch comprises a contact body provided on one of the upper mold and the upper member, and a switch member provided on the other of the upper mold and the upper member, the switch member having a receiving section for receiving the contact body and an avoiding section for avoiding the contact body, which can be switched by displacement.

7. A mold device according to claim 1 or 2, wherein the application stage is provided with a stripper that is elastically supported by the upper member and elastically contacts the plate material ahead of the adhesive application section.

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