Non-contact type data receiving / transmitting body label, label sheet, and method for manufacturing non-contact type data receiving / transmitting body label

Abstract

This IC label comprises: an inlet sheet; a communication unit; detection wiring; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer 5 that attaches the intervening sheet to the release sheet. The intervening sheet is provided in a partial region of the inlet sheet in a plan view, the partial region overlapping at least a part of the detection wiring.

Description

Non-contact data receiver-transmitter label, label sheet, and method for manufacturing the non-contact data receiver-transmitter label

[0001] The present invention relates to a contactless data transmitter / receiver label, a label sheet, and a method for manufacturing a contactless data transmitter / receiver label. This application claims priority to Japanese Patent Application No. 2024-150690, filed on September 2, 2024, the contents of which are incorporated herein by reference.

[0002] For example, IC labels are used for the purpose of efficiently managing distribution, history, and goods. An IC label has, for example, an IC chip and an antenna provided on a substrate (see, for example, Patent Document 1). The IC label can be attached to an object to be installed by, for example, an adhesive layer.

[0003] In the label described in Patent Document 1, a transponder is provided on a sheet-like substrate, and this label can be attached to an object by folding the substrate back to form a flap.

[0004] Japanese Patent No. 4728336

[0005] However, since the label requires folding back the base material to form a flap, the work of placing the label on an object can be time-consuming.

[0006] An object of one aspect of the present invention is to provide a non-contact data transmitter / receiver label that can be easily attached to an object, a label sheet, and a method for manufacturing the non-contact data transmitter / receiver label.

[0007] One aspect of the present invention provides a contactless data transmitter / receiver label comprising: an inlet sheet; a communication unit provided on the inlet sheet and having an IC chip and an antenna connected to the IC chip; a detection wiring provided on the inlet sheet and connected to the IC chip; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer that attaches the intervening sheet to the release sheet, wherein the intervening sheet is provided in a partial region of the inlet sheet in a planar view that overlaps at least a portion of the detection wiring.

[0008] The non-contact data receiver-transmitter label preferably further comprises a cover sheet that covers the inlet sheet, and the cover sheet preferably has end regions that extend in the length direction from the inlet sheet in a plan view.

[0009] One aspect of the present invention is a label sheet in which multiple non-contact data transmitter / receiver labels are connected together, and the multiple non-contact data transmitter / receiver labels are connected together longitudinally with each detection wiring facing one end of the label sheet.

[0010] One aspect of the present invention provides a method for manufacturing a contactless data transmitter / receiver label, comprising: a first step of adhering an intervening sheet to one side of a release sheet using a pseudo-adhesive layer; and a second step of adhering an inlet sheet having an IC chip, an antenna connected to the IC chip, and a detection wiring connected to the IC chip to the intervening sheet and the release sheet using an adhesive layer, wherein in the second step, at least a portion of the detection wiring is positioned in a partial area where the inlet sheet and the intervening sheet overlap in a planar view.

[0011] According to one aspect of the present invention, it is possible to provide a non-contact data transmitter / receiver label that can be easily attached to an object, a label sheet, and a method for manufacturing the non-contact data transmitter / receiver label.

[0012] 1 is a plan view of an IC label according to an embodiment; FIG. 2 is a cross-sectional view of an IC label according to an embodiment; FIG. 3 is a plan view of a label sheet according to an embodiment; FIG. 4 is a schematic view showing an example of a method of using a label sheet according to an embodiment; FIG. 5 is a cross-sectional view showing an example of a method of using an IC label according to an embodiment; FIG. 6 is a schematic view showing an example of a method of using an IC label according to an embodiment; FIG. 7 is a schematic view showing an example of a usage form of an IC label according to an embodiment; FIG. 8 is a schematic view showing an example of a usage form of an IC label according to an embodiment; FIG. 9 is a process diagram showing a method of manufacturing an IC label according to an embodiment; FIG. 10 is a process diagram showing a method of manufacturing an IC label according to an embodiment; FIG. 11 is a process diagram showing a method of manufacturing an IC label according to an embodiment;

[0013] Hereinafter, a non-contact data transmitter / receiver label, a label sheet, and a method for manufacturing a non-contact data transmitter / receiver label according to an embodiment will be specifically described with reference to the drawings.

[0014] [Contactless Data Transmitter / Receiver Label (IC Label)] Fig. 1 is a plan view showing a contactless data transmitter / receiver label 10 according to an embodiment. The contactless data transmitter / receiver label can be abbreviated as "IC label." Fig. 2 is a cross-sectional view of the IC label 10. Fig. 2 is a cross-sectional view taken along line II of Fig. 1.

[0015] As shown in Figure 2, the IC label 10 includes an inlet sheet 1, a communication unit 2, a detection wiring 9 (see Figure 1), an adhesive layer 3, an intervening sheet 4, a pseudo-adhesive layer 5, a release sheet 6, a cover sheet 7, and an adhesive layer 8.

[0016] The inlet sheet 1, the communication unit 2, the adhesive layer 3, the detection wiring 9 (see FIG. 1 ), the interposing sheet 4, the pseudo-adhesive layer 5, the cover sheet 7, and the adhesive layer 8 can be collectively referred to as the “laminate L.” The IC label 10 can be said to have a structure in which the laminate L is attached to the release sheet 6.

[0017] The longitudinal direction of the inlet sheet 1 (left-right direction in FIG. 2) is the X direction. One side of the X direction (the right side in FIG. 2) is the +X side. The direction opposite to the +X side is the -X side. The lateral direction of the inlet sheet 1 (the up-down direction in FIG. 1) is the Y direction. The Y direction is perpendicular to the X direction. One side of the Y direction (the upper side in FIG. 1) is the +Y side. The direction opposite to the +Y side is the -Y side. The Z direction is perpendicular to the X and Y directions. Viewing from the Z direction is called a plan view. In this embodiment, the vertical positional relationship is provisionally defined according to FIG. 2. The upper side (+Z side) in FIG. 2 is the upper side. The lower side (-Z side) in FIG. 2 is the lower side.

[0018] As shown in FIG. 1 , the inlet sheet 1 includes a first portion 13 and a second portion 14. The first portion 13 is rectangular in plan view. For example, the first portion 13 has a long side along the X direction and a short side along the Y direction. The second portion 14 extends from an end 13c of the first portion 13 on the -X side toward the -X side. The second portion 14 is rectangular in plan view. For example, the second portion 14 has a long side along the X direction and a short side along the Y direction. The width (dimension in the Y direction) of the second portion 14 is smaller than the width (dimension in the Y direction) of the first portion 13.

[0019] The end portion on the −X side of the inlet sheet 1 (the end portion on the −X side of the second portion 14) is the first end portion 1c. The end portion on the +X side of the inlet sheet 1 (the end portion on the +X side of the first portion 13) is the second end portion 1d.

[0020] As shown in Figure 2, the inlet sheet 1 may be, for example, a paper substrate or a resin substrate. Examples of materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET). The surface on the -Z side of the inlet sheet 1 is the lower surface 1a (first main surface). The surface of the inlet sheet 1 opposite the lower surface 1a is the upper surface 1b (second main surface).

[0021] As shown in Fig. 1, the communication unit 2 has an IC chip 11 and an antenna 12. The communication unit 2 is provided on the lower surface 1a of the inlet sheet 1 (first portion 13) (see Fig. 2). The IC chip 11 can write and read information in a contactless manner via the antenna 12.

[0022] The antenna 12 is electrically connected to the IC chip 11. In this embodiment, the antenna 12 is formed in a rectangular annular loop shape in a plan view. For example, the antenna 12 is rectangular with long sides along the Y direction. Specifically, the antenna 12 has two first wire portions 12a, two second wire portions 12b, and a third wire portion 12c. The base ends of the two first wire portions 12a are electrically connected to the IC chip 11. The two first wire portions 12a extend from the IC chip 11 as a starting point in the Y direction, away from each other. The two second wire portions 12b extend from the tips of the first wire portions 12a toward the +X side. The third wire portion 12c is formed along the Y direction and connects the tips of the two second wire portions 12b.

[0023] The detection wiring 9 is formed on the lower surface 1a of the inlet sheet 1 (see FIG. 2). The detection wiring 9 includes a first wiring 9a, a second wiring 9b, and a connection wiring 9c. The first wiring 9a and the second wiring 9b are referred to as "wirings 9a, 9b." One end (the end on the +X side) of the wirings 9a, 9b is electrically connected to the IC chip 11. The wirings 9a, 9b extend from the IC chip 11 to the -X side. The wirings 9a, 9b are formed from the first portion 13 to the second portion 14. The wirings 9a, 9b are arranged in parallel. The first wiring 9a and the second wiring 9b are formed with a gap in the Y direction. The wirings 9a, 9b formed in the second portion 14 extend along the length of the second portion 14. In a plan view, the wirings 9a, 9b reach a position close to the first end 1c of the inlet sheet 1.

[0024] The connection wiring 9c electrically connects the −X side end of the first wiring 9a and the −X side end of the second wiring 9b. The detection wiring 9 has wirings 9a and 9b and a connection wiring 9c that connects them, and is therefore formed in a loop shape as a whole.

[0025] When the detection wiring 9 is damaged (e.g., broken), it enters a low conductivity state (e.g., a non-conductive state). The "low conductivity state" is a state in which the conductivity is lower than when the detection wiring 9 is not damaged. When the detection wiring 9 enters a low conductivity state, the electrical resistance of the detection wiring 9 increases. When the electrical resistance of the detection wiring 9 increases, the IC chip 11 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 12. For example, the IC chip 11 can transmit flag information based on the comparison result between the electrical resistance of the detection wiring 9 and a threshold value.

[0026] The antenna 12 and the detection wiring 9 are formed, for example, from conductive ink, a metal thin film, a metal foil, etc. Examples of conductive ink include known polymer-type conductive inks, silver ink compositions, etc. The metal thin film is formed by electroplating, electrostatic plating, metal vapor deposition, etc.

[0027] It is desirable that the antenna 12 and the detection wiring 9 have a property (brittleness) that makes them easily breakable when force is applied to them. The antenna 12 and the detection wiring 9 can be made brittle by forming them from conductive ink, metal thin film, metal foil, or the like.

[0028] The position of the -X side end (connection wiring 9c) of the detection wiring 9 in the inlet sheet 1 in the X direction is closer to the first end 1c than to the second end 1d. That is, the connection wiring 9c is formed at a position where the distance from the first end 1c is shorter than the distance from the second end 1d. The position of the connection wiring 9c is, for example, a position closer to the first end 1c than the center in the longitudinal direction (X direction) of the inlet sheet 1 (a position to the left of the center in FIG. 1).

[0029] The position of the communication unit 2 in the X direction on the inlet sheet 1 is closer to the second end 1d than to the first end 1c. That is, the communication unit 2 is formed at a position where the distance from the second end 1d to the inlet sheet 1 is smaller than the distance from the first end 1c to the second end 1d. The position of the communication unit 2 is, for example, a position closer to the second end 1d than the center of the inlet sheet 1 in the longitudinal direction (X direction) (a position to the right of the center in FIG. 1 ).

[0030] As shown in Fig. 2, the adhesive layer 3 (first adhesive layer) is formed on the entire lower surface 1a of the inlet sheet 1. A known adhesive generally used for labels can be used as the adhesive constituting the adhesive layer 3. The adhesive layer 3 bonds the inlet sheet 1 to the upper surface 4b of the interposer sheet 4 and the upper surface 6b of the release sheet 6.

[0031] The interposing sheet 4 is provided between the adhesive layer 3 and the release sheet 6. The interposing sheet 4 may be, for example, a paper substrate or a resin substrate. Examples of materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET). The surface on the -Z side of the interposing sheet 4 is the lower surface 4a (first main surface). The surface of the interposing sheet 4 opposite the lower surface 4a is the upper surface 4b (second main surface).

[0032] As shown in FIG. 1 , the intervening sheet 4 overlaps at least a portion of the inlet sheet 1 in a plan view. Hereinafter, the region of the laminate L (or the inlet sheet 1) that overlaps with the intervening sheet 4 in a plan view will be referred to as the partial region L1. In particular, in the example of FIG. 1 , the intervening sheet 4 overlaps with the intervening sheet 4 in the middle portion in the longitudinal direction of the second portion 14 of the inlet sheet 1 in a plan view. In this way, the intervening sheet 4 overlaps with the middle region 15 (partial region L1), which is a part of the length of the second portion 14 of the inlet sheet 1 in the longitudinal direction, in a plan view. The intervening sheet 4 has a rectangular shape in a plan view. The length (dimension in the X direction) of the intervening sheet 4 is smaller than the length (dimension in the X direction) of the second portion 14 of the inlet sheet 1. The width (dimension in the Y direction) of the intervening sheet 4 is approximately the same as the width (dimension in the Y direction) of the second portion 14.

[0033] In a plan view, the interposer sheet 4 encompasses the longitudinally intermediate portion of the detection wiring 9. More specifically, the interposer sheet 4 encompasses the longitudinally intermediate portions of the wirings 9a and 9b. The first end 4c (the end on the −X side) of the interposer sheet 4 is located on the +X side of the tip (connection wiring 9c) of the detection wiring 9. Therefore, in a plan view, the portion including the tip (connection wiring 9c) of the detection wiring 9 protrudes on the −X side from the first end 4c of the interposer sheet 4. In a plan view, the second end 4d (the end on the +X side) of the interposer sheet 4 is located close to the base end (the end on the +X side) of the second portion 14. In a plan view, the second end 4d may be located on the −X side of the base end of the second portion 14.

[0034] The region of the laminate L where the interposing sheet 4 is formed is referred to as a "partial region L1." The partial region L1 is a middle portion of the laminate L in the length direction.

[0035] The intervening sheet 4 is provided in a region overlapping with a portion (a middle portion in the longitudinal direction) of the detection wiring 9 in a plan view, but the intervening sheet 4 may encompass the entire length of the detection wiring 9. In other words, it is sufficient that the intervening sheet 4 is provided in a region overlapping with at least a portion of the detection wiring 9.

[0036] As shown in Figure 2, the pseudo-adhesive layer 5 is formed over the entire area of ​​the lower surface 4a of the interposer sheet 4. The pseudo-adhesive layer 5 adheres the interposer sheet 4 to the upper surface 6b of the release sheet 6. When the pseudo-adhesive layer 5 is peeled off after being attached to an object (release sheet 6), its adhesive strength becomes lower than the adhesive strength at the time of attachment (when first attached to the object). Therefore, once peeled off, the pseudo-adhesive layer 5 is unlikely to re-adhere to the object.

[0037] The adhesive strength of the pseudo-adhesive layer 5 can be measured, for example, in accordance with JIS K 6854. The adhesive strength can be measured, for example, using a peel tester (Shimadzu Corporation's "Autograph AGSH"), by measuring the resistance value when the substrate is peeled from the object at a speed of 300 mm / min and a peel angle of 90° (i.e., T-peel).

[0038] The adhesive that constitutes the pseudo-adhesive layer 5 may be an ultraviolet-curable varnish, etc. A known pressure-sensitive adhesive may also be used as the adhesive.

[0039] In the illustrated example, the intervening sheet 4 is positioned so as to overlap the intermediate region 15 of the inlet sheet 1. Therefore, the inlet sheet 1 has, from the -X side to the +X side, a first end region 1A, an intermediate region 15, and a second end region 1B, in this order. The region including the first end 1c of the inlet sheet 1 (first end region 1A) extends from the first end 4c of the intervening sheet 4 to the -X side in a plan view. The region including the second end 1d of the inlet sheet 1 (second end region 1B) extends from the second end 4d of the intervening sheet 4 to the +X side in a plan view (see FIG. 1).

[0040] The release sheet 6 is sized in a plan view to encompass the entire inlet sheet 1. In this embodiment, the area of ​​the release sheet 6 is larger than the area of ​​the inlet sheet 1. The release sheet 6 is formed of, for example, paper, a resin sheet, or the like.

[0041] The cover sheet 7 covers the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6. The cover sheet 7 may be made of, for example, a paper substrate, a resin substrate, or the like. The cover sheet 7 is formed, for example, to be longer than the inlet sheet 1. A first end 7c (the end on the -X side) of the cover sheet 7 is positioned so as to overlap the first end 1c of the inlet sheet 1 in a plan view. A region including the first end 7c of the cover sheet 7 (first end region 7A) overlaps the first end region 1A of the inlet sheet 1.

[0042] In plan view, the second end 7d (the end on the +X side) of the cover sheet 7 is located on the +X side relative to the second end 1d of the inlet sheet 1. In plan view, the region including the second end 7d of the cover sheet 7 (second end region 7B) extends from the second end 1d of the inlet sheet 1 to the +X side.

[0043] The adhesive layer 8 (second adhesive layer) is formed on the entire area of ​​the lower surface 7a of the cover sheet 7. The adhesive constituting the adhesive layer 8 can be a known adhesive commonly used for labels. The adhesive layer 8 attaches the cover sheet 7 to the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6. In the description of this specification, the term "adhesive layer" may include the first adhesive layer 3 and / or the second adhesive layer 8. When the adhesive layer may include both the first adhesive layer 3 and the second adhesive layer 8, it may be referred to as "adhesive layers 3, 8." The adhesive layers 3, 8 are formed on the lower surface 1a and / or the upper surface 1b of the inlet sheet 1, and at least a portion thereof is in contact with the release sheet 6.

[0044] [Label Sheet] Fig. 3 is a plan view of the label sheet 20 according to the embodiment. Fig. 4 is a schematic diagram showing an example of how to use the label sheet 20. Fig. 5 is a cross-sectional view showing an example of how to use the label sheet 20. Fig. 6 is a plan view showing an example of how to use the IC label 10. Fig. 7 is a cross-sectional view showing an example of how to use the IC label 10. Figs. 8 to 11 are schematic diagrams showing examples of how the IC label 10 is used.

[0045] As shown in Figure 3, the label sheet 20 is composed of multiple IC labels 10 (see Figure 1) connected in the longitudinal direction (X direction). Adjacent IC labels 10 are connected at the longitudinal ends of the release sheet 6. The label sheet 20 includes a long release sheet 6 and multiple laminates L. The multiple laminates L are arranged side by side in the longitudinal direction of the release sheet 6. Adjacent laminates L may be spaced apart in the longitudinal direction of the release sheet 6.

[0046] The IC labels 10 are connected together with the tips of the detection wires 9 (connection wires 9c) facing the −X side (one end) of the label sheet 20.

[0047] [Method of Using IC Label and Label Sheet] As shown in Figure 4, the label sheet 20 can be wound into a roll (label roll 21). When using the IC label 10, the release sheet 6 of the label sheet 20 is taken up by a take-up roller 23 via a direction changing roller 22, as necessary.

[0048] As shown in Figure 5, the region including the end on the -X side of the laminate L is peeled off from the release sheet 6 using the direction-changing roller 22. As a result, at least a portion of the partial region L1 (the region where the interposing sheet 4 is formed) is peeled off from the release sheet 6. The adhesive strength of the pseudo-adhesive layer 5 decreases when it is peeled off from the release sheet 6. Because the region including the end on the +X side of the laminate L is attached to the release sheet 6 by the adhesive layers 3 and 8, the laminate L is stably held on the release sheet 6 with the portion including the partial region L1 protruding.

[0049] For example, a user can pinch the partial region L1 with their fingers in the thickness direction and peel off the laminate L from the release sheet 6. At this time, the pseudo-adhesive layer 5 has a reduced adhesive strength and therefore does not stick to the fingers, making it easy to peel off the laminate L.

[0050] 6 and 7 , the peeled laminate L has the adhesive layer 3 exposed in the first end region 1A and the second end region 1B. In the second end region 7B (end region) of the laminate L, the adhesive layer 8 is exposed.

[0051] 8, in this embodiment, the object 30 on which the laminate L is placed is, for example, the handle portion of a bag. The laminate L is formed into a loop so that the object 30 can be inserted therethrough. The first end region 1A and the second end region 1B face each other.

[0052] 9, the adhesive layer 3 in the first end region 1A and the adhesive layer 3 in the second end region 1B are attached to each other. This causes the laminate L to have a ring shape that surrounds the object 30. Because the pseudo-adhesive layer 5 is formed around the entire inner periphery of the annular laminate L, the laminate L is less likely to adhere to the object 30.

[0053] As shown in FIG. 10 , the second end region 7B is folded back at a midpoint in the longitudinal direction (X direction). The second end region 7B is folded back with the adhesive layer 8 facing inward. As shown in FIG. 11 , a portion of the second end region 7B including the second end 7d is attached to the outer surface of the first end region 7A by the adhesive layer 8. This results in the laminate L being in a state where the adhesive layer 8 is not exposed to the outer surface. The first end 1c is then positioned inside the folded second end region 7B. Also, as shown in FIG. 11 , the end face of the end 7d may be accommodated in a recess formed by the absence of the intervening sheet 4 at the end 7c. This makes it more difficult to remove the laminate L from the object 30.

[0054] [Operation of IC Label] The operation of the laminate L when an attempt is made to remove the laminate L attached to the object 30 (see FIG. 9 ) will be described. Assume that, in order to break the laminate L, a force is applied to the location where the first end region 1A and the second end region 1B are attached in a direction that causes them to peel apart. When the first end region 1A and the second end region 1B peel apart, the detection wiring 9 is damaged (e.g., disconnected). As a result, the detection wiring 9 enters a low conductivity state (e.g., a non-conductive state) and its electrical resistance increases.

[0055] When the electrical resistance of the detection wiring 9 increases, the IC chip 11 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 12. For example, the IC chip 11 can transmit flag information based on the result of comparing the electrical resistance of the detection wiring 9 with a threshold value. This makes it possible to detect damage to the laminate L.

[0056] [Method of Manufacturing IC Label] An example of a method of manufacturing the IC label 10 (see FIG. 1) will be described with reference to Figures 12 to 14. Figures 12 to 14 are process diagrams showing the method of manufacturing the IC label 10.

[0057] 12, the interposing sheet 4 is attached to the upper surface 6b of the release sheet 6 by the pseudo-adhesive layer 5. Therefore, the interposing sheet 4 can be stably held on the release sheet 6.

[0058] 13 , the inlet sheet 1 provided with the communication unit 2 and the detection wiring 9 is attached to the upper surface 4 b of the interposer sheet 4 and the upper surface 6 b of the release sheet 6 by the adhesive layer 3. In this step, the inlet sheet 1 is attached so that the interposer sheet 4 is positioned in an area overlapping at least a portion of the detection wiring 9 (see FIG. 1 ).

[0059] 14, the cover sheet 7 is attached to the upper surface 1b of the inlet sheet 1 and the upper surface 6b of the release sheet 6 by means of the adhesive layer 8. In this way, the IC label 10 shown in FIG.

[0060] [Effects of IC Label and Label Sheet According to the Embodiment] The IC label 10 according to the embodiment includes an inlet sheet 1, a communication unit 2 provided on the inlet sheet 1 and having an IC chip 11 and an antenna 12 connected to the IC chip 11, a detection wiring 9 provided on the inlet sheet 1 and connected to the IC chip 11, adhesive layers 3 and 8 formed on the inlet sheet 1, a release sheet 6 attached to the adhesive layers 3 and 8, an intervening sheet 4 provided between the release sheet 6 and the adhesive layers 3 and 8, and a pseudo-adhesive layer 5 for adhering the intervening sheet 4 to the release sheet 6. The intervening sheet 4 is provided in a partial region L1 of the inlet sheet 1 in a plan view, which overlaps at least a portion of the detection wiring 9. That is, the intervening sheet 4 is provided in a region overlapping at least a portion of the detection wiring 9 (see FIG. 1 ). The pseudo-adhesive layer 5 is provided on the lower surface 4a of the intervening sheet 4. Therefore, the laminate L is less likely to adhere to an object 30 (see FIG. 1 ) even without folding the sheet over or the like (see FIG. 1 ). Therefore, the IC label 10 can be easily attached to an object.

[0061] In the IC label 10, the interposing sheet 4 covers a portion of the detection wiring 9, thereby protecting the detection wiring 9. Therefore, for example, unintentional damage to the detection wiring 9 due to contact with the target object 30 is less likely to occur.

[0062] The IC label 10 has a cover sheet 7 that covers the inlet sheet 1. The cover sheet 7 has an end region 7B that extends in the length direction from the inlet sheet 1 in a plan view. The cover sheet 7 has a second end region 7B that can be folded back and attached, making it difficult to remove the laminate L.

[0063] In the label sheet 20 according to this embodiment, multiple IC labels 10 are connected together with their detection wires 9 facing the -X side (one end of the label sheet 20) (see FIG. 3). Therefore, the stack L can be stably held on the release sheet 6 with the partial region L1 peeled off from the release sheet 6 (see FIG. 5). Therefore, the stack L can be peeled off from the release sheet 6 by grasping the partial region L1. This makes it easy to place the stack L on an object.

[0064] [Advantages of the IC Label Manufacturing Method According to the Embodiment] The manufacturing method for the IC label 10 includes a first step of adhering the interposer sheet 4 to one side of the release sheet 6 with the pseudo-adhesive layer 5, and a second step of adhering the inlet sheet 1, which includes the IC chip 11, the antenna 12 connected to the IC chip 11, and the detection wiring 9 connected to the IC chip 11, to the interposer sheet 4 and the release sheet 6 with the adhesive layers 3 and 8. In the second step, at least a portion of the detection wiring 9 is disposed in the partial region L1 where the inlet sheet 1 and the interposer sheet 4 overlap in a plan view. According to the manufacturing method for the IC label 10 described above, when the inlet sheet 1 is installed, the interposer sheet 4 is disposed in an area overlapping at least a portion of the detection wiring 9. This allows the interposer sheet 4 to be positioned in a predetermined position with a simple operation. This allows the IC label 10 to be easily manufactured.

[0065] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configurations are possible within the scope that does not deviate from the spirit of the present invention.

[0066] The IC label 10 shown in Figure 2 is provided with a cover sheet 7, but if the second end region 1B including the second end 1d of the inlet sheet 1 is sufficiently long, this portion can be folded back and used in place of the second end region 7B (see Figure 11).

[0067] For example, in the IC label 10 shown in Fig. 1, the antenna 12 has a rectangular ring shape, but the shape of the antenna is not particularly limited. The antenna may have a circular ring shape, an elliptical ring shape, a polygonal ring shape, or the like.

[0068] The object on which the laminate is to be installed may be any item requiring information management. Examples of objects on which the laminate is to be installed include bags, as well as apparel products such as clothing and linen products. The object may also be shoes, accessories, etc. The object on which the laminate is to be installed is not particularly limited, and may be, for example, jewelry, watches, furniture, toys, clothing, electronic devices, etc.

[0069] 1...inlet sheet, 2...communication section, 3...adhesive layer, 4...intervening sheet, 5...pseudo-adhesive layer, 6...release sheet, 7...cover sheet, 7B...second end region (end region), 9...detection wiring, 10...IC label (non-contact data transmitter / receiver label), 11...IC chip, 12...antenna, 20...label sheet

Claims

1. A contactless data transmitter / receiver label comprising: an inlet sheet; a communication unit provided on the inlet sheet and having an IC chip and an antenna connected to the IC chip; a detection wiring provided on the inlet sheet and connected to the IC chip; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer that attaches the intervening sheet to the release sheet, wherein the intervening sheet is provided in a partial area of ​​the inlet sheet in a planar view that overlaps at least a portion of the detection wiring.

2. The contactless data receiver-transmitter label according to claim 1, further comprising a cover sheet covering said inlet sheet, said cover sheet having end regions extending in the length direction from said inlet sheet in a plan view.

3. A label sheet comprising a plurality of non-contact data transmitter / receiver labels as described in claim 1 connected together, wherein the plurality of non-contact data transmitter / receiver labels are connected together in the longitudinal direction with the detection wiring facing one end of the label sheet.

4. A method for manufacturing a contactless data transmitter / receiver label, comprising: a first step of adhering an intervening sheet to one side of a release sheet with a pseudo-adhesive layer; and a second step of adhering an inlet sheet, which has an IC chip, an antenna connected to the IC chip, and a detection wiring connected to the IC chip, to the intervening sheet and the release sheet with an adhesive layer, wherein in the second step, at least a portion of the detection wiring is positioned in a partial area where the inlet sheet and the intervening sheet overlap in a plan view.

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