Non-contact type data receiving / transmitting body label, label sheet, and method for manufacturing non-contact type data receiving / transmitting body label

Abstract

This IC label comprises: an inlet sheet; a communication unit; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer that attaches the intervening sheet to the release sheet. The communication unit has an IC chip and an antenna connected to the IC chip. The intervening sheet is provided in a region that is a part of the inlet sheet in a plan view and includes the communication unit.

Description

Non-contact data receiver-transmitter label, label sheet, and method for manufacturing the non-contact data receiver-transmitter label

[0001] The present invention relates to a contactless data transmitter / receiver label, a label sheet, and a method for manufacturing a contactless data transmitter / receiver label. This application claims priority to Japanese Patent Application No. 2024-150684, filed on September 2, 2024, the contents of which are incorporated herein by reference.

[0002] For example, IC labels are used for the purpose of efficiently managing distribution, history, and goods. An IC label has, for example, an IC chip and an antenna provided on a substrate (see, for example, Patent Document 1). The IC label can be attached to an object to be installed by, for example, an adhesive layer.

[0003] In the label described in Patent Document 1, a transponder is provided on a sheet-like substrate. In this label, the substrate can be folded back to form a flap. By forming the flap, the transponder can be positioned away from the object to which it is to be installed. Therefore, even if the object to which it is to be installed contains metal, it is easy to ensure the communication performance of the transponder.

[0004] Japanese Patent No. 4728336

[0005] However, since the label requires folding back the base material to form a flap, the work of placing the label on an object can be time-consuming.

[0006] An object of one aspect of the present invention is to provide a non-contact data transmitter / receiver label that can be easily attached to an object, a label sheet, and a method for manufacturing the non-contact data transmitter / receiver label.

[0007] One aspect of the present invention provides a contactless data transmitter / receiver label comprising: an inlet sheet; a communication unit provided on the inlet sheet and having an IC chip and an antenna connected to the IC chip; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer that attaches the intervening sheet to the release sheet, wherein the intervening sheet is part of the inlet sheet in a planar view and is provided in an area that includes the communication unit.

[0008] In the non-contact data transmitter / receiver label, it is preferable that a radiation part electrically connected to the communication part is formed on the inlet sheet.

[0009] One aspect of the present invention provides a label sheet in which a plurality of non-contact data transmitter / receiver labels are connected together, and the plurality of non-contact data transmitter / receiver labels are connected together longitudinally with the communication section facing one end of the label sheet.

[0010] One aspect of the present invention provides a method for manufacturing a contactless data receiver-transmitter label, comprising: a first step of adhering an intervening sheet to one side of a release sheet using a pseudo-adhesive layer; and a second step of adhering an inlet sheet having a communication section including an IC chip and an antenna connected to the IC chip to the intervening sheet and the release sheet using an adhesive layer, wherein in the second step, the inlet sheet is positioned so that the area including the communication section overlaps with the intervening sheet in a planar view.

[0011] According to one aspect of the present invention, it is possible to provide a non-contact data transmitter / receiver label that can be easily attached to an object, a label sheet, and a method for manufacturing the non-contact data transmitter / receiver label.

[0012] FIG. 1 is a plan view of an IC label according to a first embodiment. FIG. 2 is a cross-sectional view of the IC label according to the first embodiment. FIG. 3 is a plan view of a label sheet according to an embodiment. FIG. 4 is a schematic view showing an example of a method of using the label sheet according to an embodiment. FIG. 5 is a schematic view showing an example of a method of using the label sheet according to an embodiment. FIG. 6 is a schematic view showing an example of a usage form of the IC label according to the first embodiment. FIG. 7 is a process diagram showing a manufacturing method of the IC label according to an embodiment. FIG. 8 is a process diagram showing a manufacturing method of the IC label according to an embodiment. FIG. 9 is a plan view of an IC label according to a second embodiment. FIG. 10 is a cross-sectional view of the IC label according to the second embodiment.

[0013] Hereinafter, a non-contact data transmitter / receiver label, a label sheet, and a method for manufacturing a non-contact data transmitter / receiver label according to an embodiment will be specifically described with reference to the drawings.

[0014] [Non-contact data transmitter / receiver label (IC label)] (First embodiment) Fig. 1 is a plan view showing a non-contact data transmitter / receiver label 10 according to the first embodiment. The non-contact data transmitter / receiver label can be abbreviated as "IC label." In Fig. 1, the inlet sheet 1, adhesive layer 3, cover sheet 7, and adhesive layer 8 are omitted from illustration. Fig. 2 is a cross-sectional view of the IC label 10. Fig. 2 is a cross-sectional view taken along line II of Fig. 1.

[0015] As shown in Figure 2, the IC label 10 includes an inlet sheet 1, a communication section 2, an adhesive layer 3, an intervening sheet 4, a pseudo-adhesive layer 5, a release sheet 6, a cover sheet 7, and an adhesive layer 8.

[0016] The inlet sheet 1, the communication section 2, the adhesive layer 3, the interposing sheet 4, the pseudo-adhesive layer 5, the cover sheet 7, and the adhesive layer 8 can be collectively referred to as a "laminate 9." The IC label 10 can be said to have a structure in which the laminate 9 is attached to the release sheet 6.

[0017] The longitudinal direction of the inlet sheet 1 (left-right direction in FIG. 2) is the X direction. One side of the X direction (the right side in FIG. 2) is the +X side. The direction opposite to the +X side is the -X side. The lateral direction of the inlet sheet 1 (the up-down direction in FIG. 1) is the Y direction. The Y direction is perpendicular to the X direction. One side of the Y direction (the upper side in FIG. 1) is the +Y side. The direction opposite to the +Y side is the -Y side. The Z direction is perpendicular to the X and Y directions. Viewing from the Z direction is called a plan view. In this embodiment, the vertical positional relationship is provisionally defined according to FIG. 2. The upper side (+Z side) in FIG. 2 is the upper side. The lower side (-Z side) in FIG. 2 is the lower side.

[0018] The inlet sheet 1 is formed in a rectangular shape in a plan view. The inlet sheet 1 has a rectangular shape in a plan view. The length (dimension in the X direction) of the inlet sheet 1 is greater than the width (dimension in the Y direction). The end of the inlet sheet 1 on the -X side is a first end 1c. The end of the inlet sheet 1 on the +X side is a second end 1d.

[0019] The inlet sheet 1 may be, for example, a paper substrate or a resin substrate. Examples of materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET). The surface on the -Z side of the inlet sheet 1 is the lower surface 1a (first main surface). The surface of the inlet sheet 1 opposite the lower surface 1a is the upper surface 1b (second main surface).

[0020] 1, the communication unit 2 has an IC chip 11 and an antenna 12. The communication unit 2 is provided on the lower surface 1a of the inlet sheet 1. The IC chip 11 can write and read information via the antenna 12 in a contactless manner.

[0021] The antenna 12 is electrically connected to the IC chip 11. In this embodiment, the antenna 12 is formed in a rectangular annular loop shape in a plan view. For example, the antenna 12 is rectangular with long sides along the Y direction. Specifically, the antenna 12 has two first wire portions 12a, two second wire portions 12b, and a third wire portion 12c. The base ends of the two first wire portions 12a are electrically connected to the IC chip 11. The two first wire portions 12a extend from the IC chip 11 as a starting point in the X direction, away from each other. The two second wire portions 12b extend from the tips of the first wire portions 12a toward the +Y side. The third wire portion 12c is formed along the X direction and connects the tips of the two second wire portions 12b.

[0022] The antenna 12 is formed, for example, from a conductive ink, a metal thin film, a metal foil, a metal plate, etc. Examples of conductive ink include known polymer-type conductive inks, silver ink compositions, etc. The metal thin film is formed by electroplating, electrostatic plating, metal vapor deposition, etc.

[0023] 2, the position of the communication unit 2 in the X direction on the inlet sheet 1 is closer to the first end 1c than to the second end 1d. That is, the communication unit 2 is formed at a position where the distance from the first end 1c is shorter than the distance from the second end 1d. The position of the communication unit 2 is, for example, a position closer to the first end 1c than the center in the longitudinal direction (X direction) of the inlet sheet 1 (a position to the left of the center in FIG. 2).

[0024] The adhesive layer 3 (first adhesive layer) is formed on the entire area of ​​the lower surface 1a of the inlet sheet 1. A known adhesive generally used for labels can be used as the adhesive constituting the adhesive layer 3. The adhesive layer 3 bonds the inlet sheet 1 to the upper surface 4b of the interposer sheet 4 and the upper surface 6b of the release sheet 6.

[0025] The interposing sheet 4 is provided between the adhesive layer 3 and the release sheet 6. The interposing sheet 4 is rectangular in plan view. The dimension of the interposing sheet 4 in the X direction is smaller than the length (dimension in the X direction) of the inlet sheet 1. The dimension of the interposing sheet 4 in the Y direction is approximately the same as the width (dimension in the Y direction) of the inlet sheet 1.

[0026] The intervening sheet 4 is provided in a part of the inlet sheet 1 in a plan view. The intervening sheet 4 is provided in an area including the communication unit 2. For example, the intervening sheet 4 is overlapped with an area including the first end 1c of the inlet sheet 1 (see FIG. 1 etc.). The intervening sheet 4 is not limited to the example shown in FIG. 1 etc., and it is sufficient that the intervening sheet 4 is provided in an area that includes at least the communication unit 2.

[0027] The interposing sheet 4 may be, for example, a paper substrate or a resin substrate. Examples of materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET). The surface on the -Z side of the interposing sheet 4 is the lower surface 4a (first main surface). The surface of the interposing sheet 4 opposite the lower surface 4a is the upper surface 4b (second main surface).

[0028] The pseudo-adhesive layer 5 is formed over the entire area of ​​the lower surface 4a of the interposer sheet 4. The pseudo-adhesive layer 5 adheres the interposer sheet 4 to the upper surface 6b of the release sheet 6. When the pseudo-adhesive layer 5 is peeled off after being attached to an object (release sheet 6), its adhesive strength becomes lower than the adhesive strength at the time of attachment (when first attached to the object). Therefore, once peeled off, the pseudo-adhesive layer 5 is unlikely to re-adhere to the object.

[0029] The adhesive strength of the pseudo-adhesive layer 5 can be measured, for example, in accordance with JIS K 6854. The adhesive strength can be measured, for example, using a peel tester (Shimadzu Corporation's "Autograph AGSH"), by measuring the resistance value when the substrate is peeled from the object at a speed of 300 mm / min and a peel angle of 90° (i.e., T-peel).

[0030] The adhesive that constitutes the pseudo-adhesive layer 5 may be an ultraviolet-curable varnish, etc. A known pressure-sensitive adhesive may also be used as the adhesive.

[0031] The release sheet 6 is sized in a plan view to encompass the entire inlet sheet 1. In this embodiment, the area of ​​the release sheet 6 is larger than the area of ​​the inlet sheet 1. The release sheet 6 is formed of, for example, paper, a resin sheet, or the like.

[0032] The cover sheet 7 covers the upper surface 1b of the inlet sheet 1. The cover sheet 7 may be made of, for example, a paper base material, a resin base material, etc. The cover sheet 7 may have the same shape as the inlet sheet 1, for example.

[0033] The adhesive layer 8 (second adhesive layer) is formed on the entire lower surface 7a of the cover sheet 7. A known adhesive commonly used for labels can be used as the adhesive constituting the adhesive layer 8. The adhesive layer 8 attaches the cover sheet 7 to the upper surface 1b of the inlet sheet 1.

[0034] [Label Sheet] Fig. 3 is a plan view of the label sheet 20 according to the embodiment. Figs. 4 and 5 are schematic diagrams showing examples of how to use the label sheet 20. Fig. 6 is a schematic diagram showing an example of how the IC label 10 is used.

[0035] As shown in Figure 3, the label sheet 20 is composed of multiple IC labels 10 (see Figure 1) connected in the longitudinal direction (X direction). Adjacent IC labels 10 are connected at the longitudinal ends of the release sheet 6. The label sheet 20 includes a long release sheet 6 and multiple laminates 9. The multiple laminates 9 are arranged side by side in the longitudinal direction of the release sheet 6. Adjacent laminates 9 may be spaced apart in the longitudinal direction of the release sheet 6.

[0036] The IC labels 10 are connected together with the communication units 2 facing the −X side (one end) of the label sheet 20 .

[0037] [Method of Using IC Label and Label Sheet] As shown in Figure 4, the label sheet 20 can be wound into a roll (label roll 21). When using the IC label, the release sheet 6 of the label sheet 20 is taken up by a take-up roller 23 via a direction changing roller 22, as needed.

[0038] As shown in Figure 5, at least a portion of the partial region 9A (including the end on the -X side) of the laminate 9 where the interposing sheet 4 is formed is peeled off from the release sheet 6 using a direction-changing roller 22. The adhesive strength of the pseudo-adhesive layer 5 decreases when it is peeled off from the release sheet 6. Because the other portions of the laminate 9 are attached to the release sheet 6 by the adhesive layer 3, the laminate 9 is stably held on the release sheet 6 with the partial region 9A protruding.

[0039] For example, a user can pinch and grasp the partial region 9A with their fingers in the thickness direction and peel off the laminate 9 from the release sheet 6. At this time, the pseudo-adhesive layer 5 has a reduced adhesive strength and therefore does not stick to the fingers, making it easy to peel off the laminate 9.

[0040] As shown in FIG. 6 , the peeled laminate 9 can be attached to the upper surface 30a of the installation target 30 by the adhesive layer 3. The laminate 9 may have a configuration in which a partial region 9A protrudes from the installation target 30 (a configuration in which the partial region 9A does not overlap the installation target 30). The partial region 9A may be, for example, a region that includes the interposing sheet 4 in a plan view, or a region that includes the communication unit 2. In such a usage configuration, the communication unit 2 is not positioned to overlap the installation target 30, so that performance degradation of the communication unit 2 can be suppressed even if the installation target 30 includes metal. If the installation target 30 includes metal, the installation target 30 functions as a radiating unit, thereby improving the communication performance of the communication unit 2.

[0041] Even when the entire area of ​​the laminate 9 is placed over the installation object 30, the communication unit 2 is separated from the installation object 30 by the intervening sheet 4, so that degradation in the performance of the communication unit 2 can be suppressed.

[0042] [Method of Manufacturing IC Label] An example of a method of manufacturing the IC label 10 (see FIG. 1) will be described with reference to Figures 7 to 9. Figures 7 to 9 are process diagrams showing a method of manufacturing the IC label 10.

[0043] (First step: attaching the interposing sheet) As shown in Fig. 7 , the interposing sheet 4 is attached to the upper surface 6b of the release sheet 6 by the pseudo-adhesive layer 5. Therefore, the interposing sheet 4 can be stably held on the release sheet 6.

[0044] 8, the inlet sheet 1 provided with the communication unit 2 is attached to the upper surface 4b of the interposer sheet 4 and the upper surface 6b of the release sheet 6 by the adhesive layer 3. In this step, the inlet sheet 1 is attached so that the area including the communication unit 2 is positioned so as to overlap with the interposer sheet 4 in a plan view.

[0045] (Third Step: Attaching the Cover Sheet) As shown in Fig. 9, the cover sheet 7 is attached to the upper surface 1b of the inlet sheet 1 by means of the adhesive layer 8. In this way, the IC label 10 shown in Fig. 1 is obtained.

[0046] [Effects of the IC Label and Label Sheet According to the Embodiment] The IC label 10 according to the present embodiment includes an inlet sheet 1, a communication unit 2 provided on the inlet sheet 1 and having an IC chip 11 and an antenna 12 connected to the IC chip 11, an adhesive layer 3 formed on the inlet sheet 1, a release sheet 6 attached to the adhesive layer 3, an intervening sheet 4 provided between the release sheet 6 and the adhesive layer 3, and a pseudo-adhesive layer 5 for attaching the intervening sheet 4 to the release sheet 6. The intervening sheet 4 is a part of the inlet sheet 1 in a plan view and is provided in an area that includes the communication unit 2. Therefore, when installing the IC label 10 on an object, the communication unit 2 can be positioned away from the object without having to fold the sheet over, thereby preventing performance degradation of the communication unit 2. This allows the IC label 10 to be easily installed on an object.

[0047] The IC label 10 can be made smaller because the area of ​​the laminate 9 can be made smaller than when the sheet needs to be folded back, etc. The IC label 10 can be made smaller, which is advantageous in terms of manufacturing costs.

[0048] In the label sheet 20 according to this embodiment, multiple IC labels 10 are connected together with their communication units 2 facing the -X side (one end of the label sheet 20) (see FIG. 3). Therefore, the stack 9 can be stably held on the release sheet 6 with the partial region 9A peeled off from the release sheet 6 (see FIG. 5). Therefore, the stack 9 can be peeled off from the release sheet 6 by grasping the partial region 9A. This makes it easy to place the stack 9 on an object.

[0049] [Effects of the Manufacturing Method of IC Label According to the Embodiment] The manufacturing method of the IC label 10 includes a first step of attaching the interposer sheet 4 to one side of the release sheet 6 with the pseudo-adhesive layer 5, and a second step of attaching the inlet sheet 1, which is provided with the communication unit 2 having the IC chip 11 and the antenna 12 connected to the IC chip 11, to the interposer sheet 4 and the release sheet 6 with the adhesive layer 3. In the second step, the inlet sheet 1 is positioned so that the area including the communication unit 2 overlaps with the interposer sheet 4 in a plan view. According to the manufacturing method of the IC label 10 described above, when installing the inlet sheet 1, the interposer sheet 4 is positioned in the area including the communication unit 2. Therefore, the interposer sheet 4 can be positioned in a predetermined position with a simple operation. This makes it possible to easily manufacture the IC label 10.

[0050] [IC Label] (Second Embodiment) Fig. 10 is a plan view showing an IC label 110 according to a second embodiment. In Fig. 10, the inlet sheet 1, adhesive layer 3, cover sheet 7, and adhesive layer 8 are omitted from the illustration. Fig. 11 is a cross-sectional view of the IC label 110. Fig. 11 is a cross-sectional view taken along II-II in Fig. 10.

[0051] 11 , the IC label 110 includes an inlet sheet 1, a communication section 2, a radiation section 13, an adhesive layer 3, an intervening sheet 4, a pseudo-adhesive layer 5, a release sheet 6, a cover sheet 7, and an adhesive layer 8. The IC label 110 differs from the IC label 10 according to the first embodiment (see FIG. 1 ) in that it includes the radiation section 13. The inlet sheet 1, the communication section 2, the radiation section 13, the adhesive layer 3, the intervening sheet 4, the pseudo-adhesive layer 5, the cover sheet 7, and the adhesive layer 8 can be collectively referred to as a "laminate 109."

[0052] The radiating portion 13 is provided on the lower surface 1a of the inlet sheet 1. The radiating portion 13 is formed at a position on the +X side of the intervening sheet 4 in a plan view. The radiating portion 13 has a rectangular shape with a pair of sides along the X direction and a pair of sides along the Y direction in a plan view. For example, the radiating portion 13 has a rectangular shape with a long side along the X direction. The width (dimension in the Y direction) of the radiating portion 13 may be approximately the same as the width of the antenna 12.

[0053] The radiating portion 13 is electrically connected to the antenna 12 via the bridge 14. The bridge 14 connects the center of the second line portion 12b (12b1) on the +X side to the end of the radiating portion 13 on the -X side. The radiating portion 13 and the bridge 14 are conductive. The radiating portion 13 and the bridge 14 are formed of, for example, conductive ink, a thin metal film, a metal foil, a metal plate, or the like.

[0054] [Advantages of IC Label According to the Embodiment] The IC label 110 according to the embodiment is provided with the interposing sheet 4 in the area including the communication unit 2. Therefore, similar to the IC label 10 according to the first embodiment, it can be easily attached to an object.

[0055] The IC label 110 can be made smaller in size because the area of ​​the laminate 109 can be made smaller than when the sheet needs to be folded back, etc. The IC label 110 can be made smaller in size, which is advantageous in terms of manufacturing costs.

[0056] As described above, in the IC label 110 of this embodiment, the radiation section 13 electrically connected to the communication section 2 is formed on the inlet sheet 1. The IC label 110 has the radiation section 13, which can improve the communication performance of the antenna 12. The IC label 110 can ensure sufficient communication performance even if the object (the installation object 30) does not contain metal.

[0057] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention.

[0058] For example, in the IC label 10 shown in Fig. 1, the antenna 12 is rectangular and annular, but the shape of the antenna is not particularly limited. The antenna may be circular, elliptical, polygonal, or the like. In the IC label 110 shown in Fig. 10, the radiating portion 13 is rectangular, but the shape of the radiating portion is not particularly limited. The radiating portion may be circular, elliptical, polygonal, or the like.

[0059] The object to which the laminate is to be installed may be any item requiring information management, and examples thereof include jewelry, watches, furniture, toys, and electronic devices.

[0060] 1...inlet sheet, 2...communication section, 3...adhesive layer, 4...intervening sheet, 5...pseudo-adhesive layer, 6...release sheet, 10, 110...IC label (non-contact data transmitter / receiver label), 11...IC chip, 12...antenna, 13...radiation section, 20...label sheet

Claims

1. A contactless data transmitter / receiver label comprising: an inlet sheet; a communication unit provided on the inlet sheet and having an IC chip and an antenna connected to the IC chip; an adhesive layer formed on the inlet sheet; a release sheet attached to the adhesive layer; an intervening sheet provided between the release sheet and the adhesive layer; and a pseudo-adhesive layer that attaches the intervening sheet to the release sheet, wherein the intervening sheet is part of the inlet sheet in a planar view and is provided in an area that includes the communication unit.

2. The non-contact data transmitter / receiver label according to claim 1, wherein the inlet sheet is formed with a radiation section electrically connected to the communication section.

3. A label sheet comprising a plurality of non-contact data transmitter / receiver labels as described in claim 1 connected together, wherein the plurality of non-contact data transmitter / receiver labels are connected together in the longitudinal direction with the communication section of each label facing one end of the label sheet.

4. A method for manufacturing a contactless data transmitter / receiver label, comprising: a first step of adhering an intervening sheet to one side of a release sheet with a pseudo-adhesive layer; and a second step of adhering an inlet sheet, which has a communication unit having an IC chip and an antenna connected to the IC chip, to the intervening sheet and the release sheet with an adhesive layer, wherein in the second step, the inlet sheet is positioned so that the area including the communication unit overlaps with the intervening sheet in a plan view.

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