Data storage system and data storage method

Abstract

The present disclosure addresses the problem of storing measurement data in a format capable of smoothly verifying trouble. A data storage system according to one aspect of the present disclosure comprises: an acquisition unit that acquires first waveform data, which is waveform data of a physical quantity measured during cutting processing including a plurality of processing steps, in a machine tool having a cutting tool; an extraction unit that extracts, from the first waveform data, second waveform data divided for each processed product and for each processing step; and a storage unit that stores the second waveform data in a storage device in association with each processed product and each processing step.

Description

Data storage system and data storage method

[0001] The present disclosure relates to a data storage system that stores waveform data of physical quantities measured during cutting in a storage device.

[0002] Systems are known that measure physical quantities (such as vibration modes) during cutting and detect abnormalities based on these physical quantities. One such system is disclosed in Patent Document 1, in which a detector attached to a cutting tool measures the physical quantities and outputs the measured physical quantities to an external processing device via wireless communication.

[0003] International Publication No. 2021 / 152831

[0004] A data storage system according to one aspect of the present disclosure includes an acquisition unit that acquires first waveform data, which is waveform data of physical quantities measured during cutting processing including multiple processing steps in a machine tool having a cutting tool; an extraction unit that extracts second waveform data from the first waveform data, which is divided into second waveform data for each processed product and each processing step; and a storage unit that stores the second waveform data in a memory device, in association with each processed product and each processing step.

[0005] A data storage method according to one aspect of the present disclosure includes the steps of: acquiring first waveform data, which is waveform data of physical quantities measured during cutting processing including a plurality of processing steps, in a machine tool having a cutting tool; extracting second waveform data from the first waveform data, which is divided into second waveform data for each processed product and each processing step; and storing the second waveform data in a storage device in association with each processed product and each processing step.

[0006] 1 is a block diagram showing a configuration of a main part of a machine tool system according to a first embodiment of the present disclosure; FIG. 2 is a schematic diagram showing a turret to which a cutting tool is attached; FIG. 3 is a perspective view of a first cutting tool; FIG. 4 is an example of first waveform data when a workpiece is cut to produce one machined product; FIG. 5 is an example of first waveform data when a plurality of machined products are produced; FIG. 6 is a diagram showing the first waveform data shown in FIG. 5 divided by machined product; FIG. 7 is a diagram showing first waveform data divided by machining process by a second dividing unit; FIG. 8 is a diagram showing an example of a data structure stored in a storage unit by a storage device; FIG. 9 is a flowchart showing an example of processing of a data storage method in the machine tool system; FIG. 10 is a waveform showing an example of first data and second data measured in a machining process with a large cutting amount and a machining process with a small cutting amount; FIG. 11 is a block diagram showing a configuration of a main part of a machine tool system according to a second embodiment of the present disclosure; FIG. 12 is a diagram showing an example of first waveform data; FIG. 13 is a block diagram showing a configuration of a main part of a machine tool system according to a third embodiment of the present disclosure; FIG. 14 is a diagram showing first waveform data for a period including a period between a first machining process and a second machining process;

[0007] Typically, cutting processes for forming one workpiece are performed using a plurality of processes, and by repeatedly performing cutting processes based on a series of processes, a plurality of workpieces are produced in sequence.

[0008] In the system of Patent Document 1, the measured physical quantities are simply stored in chronological order, so when investigating a problem, it is extremely cumbersome to identify which of the multiple manufactured products was manufactured and in which machining process the problem occurred.

[0009] Therefore, there is a demand for a system that stores measurement data in a format that allows for smooth troubleshooting.

[0010] According to one aspect of the present disclosure, measurement data can be stored in a format that allows for smooth trouble detection.

[0011] [Embodiment 1] An embodiment of the present disclosure will be described in detail below. Fig. 1 is a block diagram showing the configuration of a main part of a machine tool system 100A in this embodiment. As shown in Fig. 1, the machine tool system 100A includes a machine tool 10, a processing device 50A, and a storage device 90. The storage device 90 may be, for example, a server external to the processing device 50A.

[0012] Fig. 2 is a schematic diagram showing a turret 11 to which cutting tools are attached. As shown in Figs. 1 and 2, machine tool 10 includes turret 11, workpiece drive unit 12, first detection unit 13, first cutting tool 21, second cutting tool 22, third cutting tool 23, fourth cutting tool 24, and fifth cutting tool 25. Turret 11 is one of the members constituting the main body of machine tool 10 in one embodiment. Machine tool 10 is not limited to a machine having turret 11 and called a lathe, but may also be a machine called a milling machine or a grinding machine.

[0013] The turret 11 is a tool post on which multiple tools can be attached radially. In this embodiment, the turret 11 has a circular top surface, but the turret 11 of the present disclosure is not limited to this shape. In this embodiment, as shown in FIG. 2 , a case will be described in which a first cutting tool 21, a second cutting tool 22, a third cutting tool 23, a fourth cutting tool 24, and a fifth cutting tool 25 are attached to the turret 11. The number of cutting tools attached to the turret 11 is not limited to five, and may be two, three, four, six, or more.

[0014] By rotating, the turret 11 can switch the cutting tool located in a position where it can cut the workpiece W between the first cutting tool 21, the second cutting tool 22, the third cutting tool 23, the fourth cutting tool 24, and the fifth cutting tool 25.

[0015] The workpiece driving unit 12 is a mechanism that drives the workpiece W (see FIG. 3 ) relative to a cutting tool that is positioned on the turret 11 at a position where the workpiece W can be cut. Specifically, the workpiece driving unit 12 rotates the workpiece W about a rotation axis, and translates the cutting tool (turret 11) in a direction parallel to the direction of the rotation axis. The current used by the workpiece driving unit 12 to drive the workpiece W may be supplied from a power distribution panel provided in the machine tool 10.

[0016] The first detection unit 13 is attached to the machine tool 10, measures physical quantities during cutting processing, and is capable of outputting data representing the measurement results (hereinafter referred to as first data) via a wired connection. In this embodiment, the first detection unit 13 measures the current supplied from the switchboard to the workpiece drive unit 12 as the physical quantity. In other words, the first detection unit 13 measures the current with which the machine tool 10 drives the workpiece W. The first detection unit 13 may also measure the current supplied to the turret drive unit that rotates the turret 11 when rotating the turret 11. The first detection unit 13 outputs the measured current data to the processing device 50A via a wired connection. The first detection unit 13 may be attached to the turret 11, a jig, or the workpiece W.

[0017] Here, the current supplied from the distribution board to the workpiece driving unit 12 changes depending on the resistance of the cutting tool to the workpiece W during cutting, as the workpiece driving unit 12 rotates the workpiece W around the rotation axis. Specifically, as the resistance of the cutting tool to the workpiece W during cutting increases, the required power increases, and the current supplied to the workpiece driving unit 12 increases. On the other hand, when the resistance of the cutting tool to the workpiece W is large, the vibration generated in the cutting tool cutting the workpiece W increases. For these reasons, the magnitude of the current supplied from the distribution board to the workpiece driving unit 12 corresponds to the magnitude of the vibration generated in the cutting tool.

[0018] The first detection unit 13 may measure not only the current supplied to the workpiece driving unit 12 to rotate the workpiece W around the rotation axis, but also another physical quantity. For example, the first detection unit 13 may also measure the current supplied to translate the workpiece driving unit 12. The first detection unit 13 may also measure the current supplied to rotate the turret 11.

[0019] 3 is a perspective view of the first cutting tool 21. As shown in FIG. 3, the first cutting tool 21 includes a tip 31, a holder 32 that holds the tip 31, and a second detection unit 33.

[0020] The tip 31 is a member that cuts the workpiece W by coming into contact with the workpiece W rotated by the workpiece driving unit 12. The tip 31 is made of a hard material, such as an alloy obtained by sintering and bonding tungsten carbide and an iron-based metal. The shape of the tip 31 is not particularly limited, but may be, for example, a triangular prism shape, as shown in FIG. 3 .

[0021] The second detection unit 33 measures physical quantities during cutting and can output data representing the measurement results (hereinafter referred to as second data) via wireless connection. In this embodiment, the second detection unit 33 includes an acceleration sensor 33A and a communication unit 33B for wireless connection. Examples of physical quantities that can be measured by the second detection unit 33 include vibration, strain, temperature, and angular velocity.

[0022] Acceleration sensor 33A measures vibrations generated in first cutting tool 21 as the physical quantity. Acceleration sensor 33A may be attached inside holder 32. Here, vibrations generated by cutting workpiece W with second cutting tool 22, third cutting tool 23, fourth cutting tool 24, or fifth cutting tool 25 are transmitted to first cutting tool 21 via turret 11. Therefore, acceleration sensor 33A can measure the vibrations of the cutting tool that is performing cutting, among second cutting tool 22, third cutting tool 23, fourth cutting tool 24, or fifth cutting tool 25, during the period when workpiece W is being cut by second cutting tool 22, third cutting tool 23, fourth cutting tool 24, or fifth cutting tool 25.

[0023] Therefore, even when acceleration sensor 33A is provided only on first cutting tool 21, it is possible to measure vibrations occurring in second cutting tool 22, third cutting tool 23, fourth cutting tool 24, and fifth cutting tool 25. From the viewpoint of measuring vibrations occurring in first cutting tool 21, second cutting tool 22, third cutting tool 23, fourth cutting tool 24, and fifth cutting tool 25, acceleration sensor 33A may be attached away from these cutting tools. When acceleration sensor 33A is provided on first cutting tool 21, it is possible to measure vibrations occurring in first cutting tool 21 with the highest accuracy.

[0024] The communication unit 33B wirelessly outputs second data, which is the measurement result of the acceleration sensor 33A measuring the vibration generated in the first cutting tool 21, to the processing device 50A. The wireless connection may be based on a known technology such as Wi-Fi (registered trademark).

[0025] Power may be supplied to second detection unit 33 from the main body of machine tool 10, or as shown in Fig. 3, from a battery 91 provided external to machine tool 10 via a cable 92. In the latter case, second detection unit 33 is powered not from machine tool 10 but from external battery 91, which makes it easy to attach and detach first cutting tool 21 to and from machine tool 10. Also, machine tool 10 does not need to be provided with a member for supplying power to second detection unit 33. Power may be supplied to second detection unit 33 from the switchboard.

[0026] With regard to battery 91, "provided outside the machine tool" means that power is not supplied to second detection unit 33 from machine tool 10. Therefore, battery 91 may be housed in a main body (housing) that constitutes machine tool 10, for example.

[0027] The second cutting tool 22, the third cutting tool 23, the fourth cutting tool 24, and the fifth cutting tool 25 may have the same configuration as the first cutting tool 21, except that the type of attached chip 31 is different from that of the first cutting tool 21 and that they do not have the second detection unit 33.

[0028] Generally, cutting involves multiple steps, such as rough machining, which requires a large amount of cutting, and finish machining, which requires a small amount of cutting. Therefore, a cutting tool appropriate for the amount of cutting may be used for each step. In the machine tool 10, by rotating the turret 11, a cutting tool appropriate for the amount of cutting for each step can be selected from the first cutting tool 21, the second cutting tool 22, the third cutting tool 23, the fourth cutting tool 24, and the fifth cutting tool 25 to cut the workpiece W. In this embodiment, an example in which a workpiece W is cut through five machining steps to produce a machined product will be described below.

[0029] The processing device 50A acquires the first data or the second data output from the first detection unit 13 and the second detection unit 33, respectively, as first waveform data, and stores second waveform data classified by workpiece and by machining process from the first waveform data in a storage device. The processing device 50A is provided outside the machine tool 10. As shown in FIG. 1 , the processing device 50A includes a first communication unit 51, a second communication unit 52, an input unit 53 that accepts input operations to the processing device 50A, a display unit 54 that displays various information, a storage unit 55 that serves as a storage device and stores various data used by the processing device 50A, and a control unit 60A.

[0030] The first communication unit 51 communicates with the first detection unit 13 via the wired connection. The second communication unit 52 communicates with the second detection unit 33 via the wireless connection.

[0031] The control unit 60A controls each unit of the processing device 50A. The control unit 60A includes a first acquisition unit 61 and a second acquisition unit 62 as acquisition units, an extraction unit 63A, and a storage unit 64.

[0032] The first acquisition unit 61 acquires the first data output from the first detection unit 13 via the first communication unit 51. The first acquisition unit 61 may store the acquired first data in the storage unit 55. The second acquisition unit 62 acquires the second data output from the second detection unit 33 via the second communication unit 52. The second acquisition unit 62 may store the acquired second data in the storage unit 55. In the following description, the first data acquired by the first acquisition unit 61 and the second data acquired by the second acquisition unit 62 may be referred to as first waveform data.

[0033] FIG. 4 is an example of first waveform data when one processed product is produced by cutting the workpiece W. The first waveform data shown in FIG. 4 is waveform data of the second data acquired by the second acquisition unit 62. In this embodiment, as shown in FIG. 4, the processed product is produced by a first machining process T1, a second machining process T2, a third machining process T3, a fourth machining process T4, and a fifth machining process T5. FIG. 5 is an example of first waveform data when multiple processed products are produced. The first waveform data, which is the measurement result measured by the first detection unit 13 and the second detection unit 33, is waveform data when multiple processed products are produced, as shown in FIG. 5.

[0034] Here, when a problem occurs in the production of a workpiece using a machine tool, the problem may be verified using data that is the measurement results of physical quantities measured during cutting. In order to verify the problem, data classified for each workpiece and each machining step is extracted so that it is possible to identify which of the multiple manufactured workpieces was produced and in which machining process the problem occurred, and if the data is stored in association with each workpiece and each machining step, verification can proceed smoothly.

[0035] In machine tool system 100A of this embodiment, extraction unit 63A extracts data categorized from measurement results for each workpiece and each machining process, and the data is stored in association with each workpiece and each machining process by storage unit 64. The following describes, as an example, a case in which second data output from second detection unit 33 is stored in association with each workpiece and each machining process.

[0036] The extraction unit 63A extracts second waveform data, which is divided for each processed product and each processing step, from the first waveform data. The extraction unit 63A includes a first division unit 71 and a second division unit 72.

[0037] The first division unit 71 divides the first waveform data for each processed product. Specifically, the first division unit 71 first performs waveform matching between model waveform data obtained when one processed product is manufactured, as shown in FIG. 4, and the first waveform data, and divides the first waveform data into sections t1, t2, t3, and t4 for each processed product, as shown in FIG. 6. The model waveform data may be created based on multiple pieces of actual data obtained when processed products were manufactured in the past. The model waveform data is stored in the storage unit 55 in advance. A conventionally known method may be used for waveform matching.

[0038] The second division unit 72 divides the first waveform data, which has been divided for each workpiece by the first division unit 71, for each machining process. In the machine tool system 100A in this embodiment, model waveform data for each machining process, which is set by dividing the model waveform data for each machining process, is stored in the storage unit 55. In this embodiment, model waveform data is stored in the storage unit 55 for each of the first machining process T1, the second machining process T2, the third machining process T3, the fourth machining process T4, and the fifth machining process T5. The division for each machining process may be performed by the user specifying the start point and end point of each machining process.

[0039] The second division unit 72 performs waveform matching between the model waveform data read from the storage unit 55 and the first waveform data divided for each processed product by the first division unit 71, and extracts waveform data for each processing step from the first waveform data for a period in which the waveforms match to a predetermined degree or more. A conventionally known method may be used for waveform matching. Hereinafter, the waveform data extracted by the second division unit 72 will be referred to as second waveform data.

[0040] Fig. 7 is a diagram showing the first waveform data divided for each processing step by the second dividing unit 72. As shown in Fig. 7, the second dividing unit 72 divides each of the sections t1, t2, t3, and t4 into sections corresponding to the first processing step T1, the second processing step T2, the third processing step T3, the fourth processing step T4, and the fifth processing step T5. For example, the second dividing unit 72 divides the section t1 into sections t11 to t515 corresponding to the first processing step T1, the second processing step T2, the third processing step T3, the fourth processing step T4, and the fifth processing step T5, respectively.

[0041] As described above, the extraction unit 63A includes the first division unit 71 that divides the first waveform data for each processed product, and the second division unit 72 that divides the first waveform data divided for each processed product by the first division unit 71 for each processing step. This allows the extraction unit 63A to extract second waveform data divided for each processed product and for each processing step from the first waveform data.

[0042] The storage unit 64 stores the second waveform data extracted by the extraction unit 63A in the storage device 90, in association with each processed product and each processing step. Fig. 8 is a diagram showing an example of a data structure stored in the storage device 90 by the storage unit 64. As shown in Fig. 8, the storage unit 64 stores the second waveform data extracted by the extraction unit 63A in the storage device 90, in association with each processed product (i.e., each of sections t1 to t4) and each processing step (i.e., each of the first processing step T1, the second processing step T2, the third processing step T3, the fourth processing step T4, and the fifth processing step T5).

[0043] Next, a data storage method in machine tool system 100A will be described with reference to Fig. 9. Fig. 9 is a flowchart showing an example of processing of the data storage method in machine tool system 100A. As shown in Fig. 9, in this example of the data storage method in machine tool system 100A, first, second acquisition unit 62 acquires the second data (first waveform data) output from second detection unit 33 as the first waveform data (step S1).

[0044] Next, the first division unit 71 performs waveform matching between the model waveform data and the first waveform data, and divides the first waveform data for each processed product (step S2).

[0045] Next, the second division unit 72 performs waveform matching between the model waveform data set for each processing step and the first waveform data divided for each processed product by the first division unit 71, and divides the first waveform data divided for each processed product by the first division unit 71 into processing steps (step S3). In steps S2 and S3, second waveform data divided for each processed product and each processing step is extracted from the first waveform data.

[0046] Next, the storage unit 64 stores the second waveform data extracted by the extraction unit 63A in the storage device 90 in association with each processed product and each processing step (step S4).

[0047] As described above, the processing device 50A in this embodiment functions as a data storage system including the first acquisition unit 61 and the second acquisition unit 62 as acquisition units that acquire first waveform data, the extraction unit 63A that extracts second waveform data classified by processed product and processing step from the first waveform data, and the storage unit 64 that associates the second waveform data with each processed product and processing step and stores them in the storage device 90. With the above configuration, the first waveform data can be classified and stored for each processed product and processing step. Therefore, if a problem occurs in a specific processing step, the waveform data for that processing step can be identified, making it possible to efficiently extract physical quantities required for verification while avoiding the extraction of physical quantities measured in processing steps other than the processing step. This allows for smooth trouble verification.

[0048] The extraction unit 63A in this embodiment matches the waveforms of the first waveform data with model waveform data preset for each processing step, and extracts the second waveform data from the first waveform data for a period in which the first waveform data match to a predetermined extent or more. This eliminates the need for the user to manually classify the processing steps for each processed product, thereby reducing the burden on the user.

[0049] In the present embodiment, the processing device 50A includes an acquisition unit that acquires first waveform data, an extraction unit that extracts second waveform data classified for each processed product and each processing step, and a storage unit that associates the second waveform data with each processed product and each processing step and stores them in the storage device 90. However, in a data storage system according to one aspect of the present disclosure, the processing device 50A does not need to have all of the functions. For example, the extraction unit and the storage unit may be provided in an information processing device separate from the processing device 50A.

[0050] In the data storage system of the present embodiment, the storage unit 64 is configured to store the second waveform data in the memory device 90, but the data storage system of the present disclosure is not limited to this. In a data storage system of one aspect of the present disclosure, the storage unit 64 may be configured to store the second waveform data in the memory unit 55 included in the processing device 50A.

[0051] Here, the characteristics of the first data, which are the measurement results measured by the first detection unit 13, and the characteristics of the second data, which are the measurement results measured by the second detection unit 33, will be described with reference to FIG. 10. FIG. 10 shows waveforms illustrating examples of the first data and the second data measured in a machining process with a large cutting amount and a machining process with a small cutting amount, respectively. As shown by the dotted line in FIG. 10, the output value increases as the machining time increases in both machining processes. This is because the tip 31 wears more as the machining time increases, resulting in increased vibrations in the cutting tool.

[0052] However, in a machining process in which the cutting amount is small, the resistance of the cutting tool to the workpiece W is small, and therefore, as shown by the solid line for the first data, it is difficult to confirm significant displacement in the first data indicating the magnitude of the current supplied to the workpiece driver 12. On the other hand, as shown by the solid line for the second data, significant displacement can be confirmed in the second data measured by the acceleration sensor 33A attached to the cutting tool.

[0053] In the data storage system of this embodiment, first data indicating vibrations occurring in the first cutting tool 21, measured by the second detector 33 attached to the first cutting tool 21, is used as first waveform data, and second waveform data is extracted. This configuration makes it possible to store second waveform data that can detect minute changes in vibration during a machining process in which the amount of cutting is small. In this embodiment, the second detector 33 is attached to the first cutting tool 21 that performs the finishing process, so that vibrations during the machining process in which vibrations are small can be more easily detected.

[0054] However, in a data storage system according to one embodiment of the present disclosure, the first data, which is the measurement result measured by the first detection unit 13, may be used as the first waveform data. As described above, the magnitude of the current supplied from the switchboard to the workpiece drive unit 12, which is the first data, corresponds to the magnitude of vibrations occurring in the cutting tool. Since the first detection unit 13 is attached to the machine tool 10, the current with which the machine tool 10 drives the workpiece W can be measured with high accuracy. This current data can then be used to approximately measure the vibrations occurring in the cutting tool. Furthermore, because the first acquisition unit 61 acquires the first data (first waveform data) from the first detection unit 13 via a wired connection, the possibility of time lags or missing data occurring in the first waveform data can be reduced.

[0055] Here, if the processing device 50A were to acquire data that is the measurement result measured by an acceleration sensor attached to the cutting tool via a wired connection, it would be necessary to make physical modifications (such as adding wiring) to the machine tool 10 in order to extract the data, which could easily become a barrier to introducing such a mechanism. In contrast, in the present embodiment, the second acquisition unit 62 is configured to acquire the first data (first waveform data) from the second detection unit 33 via a wireless connection. This eliminates the need for such modifications to the machine tool 10, and allows the second acquisition unit 62 to acquire the vibrations occurring in the cutting tool.

[0056] [Embodiment 2] Another embodiment of the present disclosure will be described below. For convenience of explanation, the same reference numerals will be used to designate components having the same functions as those described in the above embodiment, and the description thereof will not be repeated.

[0057] Fig. 11 is a block diagram showing the configuration of the main parts of a machine tool system 100B according to the present embodiment. As shown in Fig. 11, the machine tool system 100B includes a processing device 50B instead of the processing device 50A in the first embodiment. The processing device 50B includes a control device 60B instead of the control device 60A in the first embodiment. The control device 60B includes an extraction unit 63B instead of the extraction unit 63A in the first embodiment. The extraction unit 63B includes a second division unit 73 instead of the second division unit 72 in the first embodiment.

[0058] The second division unit 73 divides the first waveform data, which has been divided by the first division unit 71 for each processed product, into sections for each processing step using a method different from that used by the second division unit 72 in embodiment 1. Specifically, the second division unit 73 first calculates the average value of the physical quantity for a continuous predetermined period of time for the acquired first waveform data. Next, if the calculated average value is within a range of the average values ​​of the physical quantities preset for each processing step, the second division unit 73 extracts the first waveform data for the predetermined period as second waveform data for the corresponding processing step.

[0059] A specific example will be described with reference to FIG. 12 . FIG. 12 is an example of first waveform data. As shown in the example of FIG. 12 , the first waveform data has a different average value for each machining process. Therefore, if the average value of the physical quantity for a continuous predetermined period falls within a range of the average value of the physical quantity that is preset for each machining process, the second division unit 73 can identify the waveform data as relating to the corresponding machining process. This allows the second division unit 73 to divide the first waveform data, which has been divided for each processed product by the first division unit 71, into data for each machining process.

[0060] The range of the average value of the physical quantity set in advance for each processing step may be set to include a predicted abnormal value of the physical quantity, thereby making it possible to classify the first waveform data for each processing step even when the first waveform data includes an abnormal value.

[0061] Third Embodiment Another embodiment of the present disclosure will be described below. Fig. 13 is a block diagram showing the configuration of the main parts of a machine tool system 100C according to this embodiment. As shown in Fig. 13, the machine tool system 100C includes a processing device 50C instead of the processing device 50A in the first embodiment. The processing device 50C includes a control device 60C instead of the control device 60A in the first embodiment. The control device 60C includes an extraction unit 63C instead of the extraction unit 63A in the first embodiment. The extraction unit 63C includes a second division unit 74 instead of the second division unit 72 in the first embodiment.

[0062] The second division unit 74 matches the waveform of the first waveform data with preset replacement waveform data when replacing a cutting tool between machining processes, classifies the first waveform data by a period in which the waveforms match to a predetermined degree or more, and extracts the second waveform data. Figure 14 is a diagram showing the first waveform data for a period including the period between the first machining process T1 and the second machining process T2. As shown in Figure 14, a unique vibration observed when replacing a cutting tool between machining processes occurs between the first machining process T1 and the second machining process T2. The second division unit 74 matches the waveform of the replacement waveform data indicating such unique vibration with the waveform of the first waveform data, classifies the first waveform data by a period in which the waveforms match to a predetermined degree or more, and extracts the second waveform data. This allows for accurate classification of each of the multiple machined products.

[0063] Fourth Embodiment Another embodiment of the present disclosure will be described below. Fig. 15 is a block diagram showing the configuration of the main parts of a machine tool system 100D according to this embodiment. As shown in Fig. 15, the machine tool system 100D includes a processing device 50D instead of the processing device 50A in the first embodiment. The processing device 50D includes a control device 60D instead of the control device 60A in the first embodiment. The control device 60D includes an extraction unit 63D instead of the extraction unit 63A in the first embodiment. The extraction unit 63D includes a second division unit 75 instead of the second division unit 72 in the first embodiment.

[0064] The second classification unit 75 acquires fluctuations in the current value when the turret 11 changes the cutting tool between machining processes from the first detection unit 13 via the first communication unit 51, and classifies the first waveform data based on the timing at which the fluctuations in the current value are acquired to extract the second waveform data. With this configuration, the first waveform data is classified based on the fluctuations in the current value when the turret 11 changes the cutting tool between machining processes, thereby enabling accurate classification of each of the multiple manufactured workpieces. Because the current value for rotating the turret 11 is the same between all of the processes, the second classification unit 75 may identify which of the processes corresponds to the change in the cutting tool between the processes at which the fluctuations in the current value are acquired, based on other information such as the number of times the current for rotating the turret 11 has been detected since the start of the first machining process.

[0065] The invention according to the present disclosure has been described above based on the drawings and examples. However, the invention according to the present disclosure is not limited to the above-described embodiments. In other words, the invention according to the present disclosure can be modified in various ways within the scope of the present disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention according to the present disclosure. In other words, it should be noted that a person skilled in the art can easily make various modifications or corrections based on the present disclosure. It should also be noted that these modifications or corrections are included in the scope of the present disclosure.

[0066] (Summary) A data storage system according to aspect 1 of the present disclosure includes an acquisition unit that acquires first waveform data, which is waveform data of physical quantities measured during cutting processing including multiple processing steps in a machine tool having a cutting tool; an extraction unit that extracts second waveform data from the first waveform data, which is divided into second waveform data for each processed product and each processing step; and a storage unit that stores the second waveform data in a memory device, in association with each processed product and each processing step.

[0067] A data storage system according to aspect 2 of the present disclosure may be configured such that, in the above-described aspect 2, the extraction unit matches the waveform of the first waveform data with model waveform data preset for each processing step, and extracts the second waveform data from the first waveform data for a period in which the waveforms match to a predetermined degree or more.

[0068] A data storage system according to aspect 3 of the present disclosure may be configured such that, in aspect 1 above, the extraction unit has a range of average values ​​of physical quantities set in advance for each processing step, and if the average value of the physical quantities for a consecutive predetermined period calculated from the first waveform data is within the range, the extraction unit extracts the first waveform data for the predetermined period as the second waveform data.

[0069] A data storage system according to a fourth aspect of the present disclosure is the data storage system of the third aspect, wherein the range of the average value of the physical quantity may be set to include expected abnormal values ​​of the physical quantity.

[0070] A data storage system according to aspect 5 of the present disclosure may be configured in the above-mentioned aspect 1, wherein the extraction unit matches the waveform of the first waveform data with predetermined replacement waveform data when replacing a cutting tool between machining processes, divides the first waveform data into periods where the data match to a predetermined degree or more, and extracts the second waveform data.

[0071] A data storage system according to aspect 6 of the present disclosure may be configured in the above-mentioned aspect 1, wherein the extraction unit acquires fluctuations in current value when a turret to which a plurality of the cutting tools are attached replaces the cutting tools between machining processes, divides the first waveform data at the timing when the fluctuations in current value are acquired, and extracts the second waveform data.

[0072] A data storage system according to aspect 7 of the present disclosure may be configured such that, in any of aspects 1 to 6 above, the first waveform data indicates vibrations occurring in the cutting tool, measured by a second detection unit attached to the cutting tool.

[0073] A data storage system according to an eighth aspect of the present disclosure may be configured in the seventh aspect above, wherein the acquisition unit acquires the first waveform data from the second detection unit via a wireless connection.

[0074] A data storage system according to aspect 9 of the present disclosure may be configured such that, in any of aspects 1 to 6 above, the first waveform data indicates the current with which the machine tool drives the workpiece, measured by a first detection unit attached to the machine tool.

[0075] A data storage system according to aspect 10 of the present disclosure may be configured in the above-mentioned aspect 9 such that the acquisition unit acquires the first waveform data from the first detection unit via a wired connection.

[0076] A data storage method according to aspect 11 of the present disclosure includes the steps of: acquiring first waveform data, which is waveform data of physical quantities measured during cutting processing including a plurality of processing steps, in a machine tool having a cutting tool; extracting second waveform data divided for each processed product and each processing step from the first waveform data; and storing the second waveform data in a storage device in association with each processed product and each processing step.

[0077] REFERENCE SIGNS LIST 10 Machine tool 11 Turret 13 First detection unit 21 First cutting tool 22 Second cutting tool 23 Third cutting tool 24 Fourth cutting tool 33 Second detection unit 61 First acquisition unit 62 Second acquisition unit 63A, 63B, 63C, 63D Extraction unit 64 Storage unit 90 Storage device 100A to 100D Machine tool system

Claims

1. A data storage system having: an acquisition unit that acquires first waveform data, which is waveform data of physical quantities measured during cutting processing including multiple processing steps in a machine tool having a cutting tool; an extraction unit that extracts second waveform data classified for each processed product and each processing step from the first waveform data; and a storage unit that stores the second waveform data in a storage device, in association with each processed product and each processing step.

2. The data storage system according to claim 1, wherein the extraction unit matches the waveform of the first waveform data with model waveform data set in advance for each processing step, and extracts the second waveform data from the first waveform data for a period in which the first waveform data matches to a predetermined degree or more.

3. The data storage system according to claim 1, wherein the extraction unit preliminarily sets a range of the average value of the physical quantity for each processing step, and when the average value of the physical quantity for a predetermined consecutive period calculated from the first waveform data is within the range, extracts the first waveform data for the predetermined period as the second waveform data.

4. The data storage system according to claim 3, wherein the range of the average value of the physical quantity is set to include expected abnormal values ​​of the physical quantity.

5. The data storage system according to claim 1, wherein the extraction unit matches the waveform of the first waveform data with preset waveform data at the time of replacement when a cutting tool is replaced between machining processes, classifies the first waveform data into periods where the data match to a predetermined degree or more, and extracts the second waveform data.

6. The data storage system according to claim 1, wherein the extraction unit acquires fluctuations in current value when a turret having a plurality of the cutting tools attached thereto changes the cutting tools between machining processes, and classifies the first waveform data at the timing when the fluctuations in current value are acquired, and extracts the second waveform data.

7. A data storage system according to any one of claims 1 to 6, wherein the first waveform data indicates vibrations occurring in the cutting tool, measured by a second detection unit attached to the cutting tool.

8. The data storage system according to claim 7, wherein the acquisition unit acquires the first waveform data from the second detection unit via a wireless connection.

9. A data storage system according to any one of claims 1 to 6, wherein the first waveform data indicates a current with which the machine tool drives a workpiece, measured by a first detector attached to the machine tool.

10. The data storage system according to claim 9, wherein the acquisition unit acquires the first waveform data from the first detection unit via a wired connection.

11. A data storage method comprising the steps of: acquiring first waveform data, which is waveform data of physical quantities measured during cutting processing including multiple processing steps, in a machine tool having a cutting tool; extracting second waveform data classified for each processed product and each processing step from the first waveform data; and storing the second waveform data in a storage device in association with each processed product and each processing step.

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